JP7092997B2 - Heat pump system - Google Patents

Description

Heat pump system with refrigerant circuit with economizer

Conventionally, there is a heat pump system equipped with a refrigerant circuit having an economizer. This refrigerant circuit is decompressed in a compressor that compresses the refrigerant, a radiator that cools the refrigerant compressed in the compressor by the fluid to be heated, an expansion mechanism that decompresses the refrigerant cooled in the radiator, and an expansion mechanism. It is configured by connecting with an evaporator that evaporates the refrigerant. Further, the refrigerant circuit is provided with an economizer that further cools the refrigerant cooled in the radiator by the refrigerant flowing through the refrigerant circuit. Then, in this heat pump system, as shown in Patent Document 1 (European Patent Application Publication No. 2952832), there is a system in which an economizer constitutes an integrated heat exchanger integrated with a radiator.

However, in the above-mentioned conventional integrated heat exchanger, the refrigerant flowing through the radiator is cooled by the refrigerant flowing through the economizer by heat conduction through the joint between the economizer and the radiator, whereby the fluid to be heated in the radiator is cooled. May reduce the ability to heat.

The heat pump system according to the first aspect includes a compressor that compresses the refrigerant, a radiator that cools the refrigerant compressed in the compressor by the heated fluid, and an expansion mechanism that decompresses the refrigerant cooled in the radiator. It has a refrigerant circuit configured by connecting an evaporator that evaporates the decompressed refrigerant in the expansion mechanism. Further, the refrigerant circuit is provided with an economizer that further cools the refrigerant cooled in the radiator by the refrigerant flowing through the refrigerant circuit. And here, the economizer constitutes an integrated heat exchanger integrated with the radiator. Moreover, here, the integrated heat exchanger has a heat insulating portion between the economizer and the radiator.

Here, the heat insulating portion can suppress heat conduction between the economizer and the radiator. This makes it difficult for the refrigerant flowing through the radiator to be cooled by the refrigerant flowing through the economizer, and it is possible to suppress a decrease in the ability of the radiator to heat the fluid to be heated.

The heat pump system according to the second aspect is a material having a lower thermal conductivity than the material constituting the part in which the heat insulating portion flows the refrigerant and the fluid to be heated in the integrated heat exchanger in the heat pump system according to the first aspect. It is composed of.

Here, for example, the heat insulating portion can be easily configured by a resin, rubber, or ceramic material having a lower thermal conductivity than the material (metal material) constituting the portion through which the refrigerant and the fluid to be heated flow. can.

In the heat pump system according to the third aspect, in the heat pump system according to the first aspect, the heat insulating portion is composed of a gap provided between the radiator and the economizer so as not to allow the refrigerant and the fluid to be heated to flow.

Here, the heat insulating portion can be easily formed by the gap.

In the heat pump system according to the fourth aspect, the gap is in a vacuum state in the heat pump system according to the third aspect.

Here, it is possible to improve the heat insulating performance of the heat insulating portion formed by the gap.

In the heat pump system according to the fifth aspect, in the heat pump system according to the fourth aspect, an integrated heat exchanger is formed by vacuum brazing or diffusion bonding.

Here, for example, when an integrated heat exchanger is formed by laminating plate materials and joining them by vacuum brazing or diffusion bonding, a refrigerant and a heated plate are placed between the plates arranged between the radiator and the economizer. By forming a gap that does not allow fluid to flow, the gap between the plate materials can be easily created in a vacuum state.

The heat pump system according to the sixth aspect is the heat pump system according to any one of the first to fifth aspects, in which the integrated heat exchanger is a microchannel heat exchanger.

Here, the integrated heat exchanger can be made compact.

The heat pump system according to the seventh aspect is a user-side device that heats the room with a heated fluid heated by heat exchange with a refrigerant in a radiator in the heat pump system according to any one of the first to sixth aspects. I have more.

Here, since the decrease in the ability to heat the fluid to be heated in the radiator is suppressed, the decrease in the heating capacity in the user-side device can be suppressed.

It is a schematic block diagram of the heat pump system which concerns on one Embodiment of this disclosure. It is a perspective view which shows the appearance of the integrated heat exchanger in which a radiator and an economizer are integrated. It is a figure which looked at the 1st flow path of a radiator from the front direction. It is a figure which looked at the 2nd flow path of a radiator from the front direction. It is the figure which looked at the 1st flow path of an economizer from the front direction. It is the figure which looked at the 2nd flow path of an economizer from the front direction. It is the figure which looked at the inside of the heat insulation part from the front direction. It is an exploded perspective view which shows the inside of an integrated heat exchanger. It is a figure which shows the integrated heat exchanger in the modification A, and is the figure which corresponds to FIG. It is a figure which shows the integrated heat exchanger in the modification A, and is the figure which corresponds to FIG. It is a figure which shows the integrated heat exchanger in the modification A, and is the figure which corresponds to FIG. It is a figure which shows the integrated heat exchanger in the modification A, and is the figure which corresponds to FIG. 7. It is a figure which shows the integrated heat exchanger in the modification A, and is the figure which looked at the communication part from the front direction. It is a figure which shows the integrated heat exchanger in the modification A, and is the figure which corresponds to FIG. It is a schematic block diagram of the heat pump system in the modification B. It is a figure which shows the integrated heat exchanger in the modification B, and is the figure which corresponds to FIG. It is a figure which shows the integrated heat exchanger in the modification B, and is the figure which corresponds to FIG. It is a figure which shows the integrated heat exchanger in the modification C, and is the figure which corresponds to FIG. It is a figure which shows the integrated heat exchanger in the modification C, and is the figure which corresponds to FIG. It is a perspective view which shows the appearance of the integrated heat exchanger in the modification D. FIG. 20 is a cross-sectional view taken along the line AA of FIG. FIG. 20 is a cross-sectional view taken along the line BB of FIG. It is a figure which shows the integrated heat exchanger in the modification E, and is the figure which corresponds to FIG. FIG. 23 is a sectional view taken along the line BB of FIG. 23. It is a figure which shows the integrated heat exchanger in the modification F, and is the figure which corresponds to FIG. FIG. 25 is a cross-sectional view taken along the line BB of FIG. It is a figure which shows the integrated heat exchanger in the modification G, and is the figure which corresponds to FIG. 22. It is a figure which shows the integrated heat exchanger in the modification G, and is the figure which corresponds to FIG. 22.

Hereinafter, the heat pump system will be described with reference to the drawings.

(1) Heat pump system <configuration>
FIG. 1 is a schematic configuration diagram of a heat pump system 1 according to an embodiment of the present disclosure. The heat pump system 1 mainly includes a refrigerant circuit 10 in which a refrigerant as a heat exchange medium circulates and a water circuit 30 in which water as a fluid to be heated circulates, and the refrigerant compression type heat pump in the refrigerant circuit 10 includes. It is a device that heats water using a cycle and heats the room with the heated water.

The refrigerant circuit 10 mainly includes a compressor 11, a radiator 12, an expansion mechanism 13, an evaporator 14, an injection pipe 21, and an economizer 22. The refrigerant circuit 10 is filled with an HFC-based refrigerant, an HFO-based refrigerant, and a natural refrigerant as the refrigerant.

The compressor 11 is a device that compresses the refrigerant. The compressor 11 is, for example, a compressor that drives a refrigerant compression element such as a rotary type or a scroll type by a drive mechanism such as a motor.

The radiator 12 is a device that cools the refrigerant compressed in the compressor 11 by the water circulating in the water circuit 30. The details of the radiator 12 will be described later. Further, the discharge port 11b of the compressor 11 and the inlet (second inlet 12a) on the refrigerant side of the radiator 12 are connected by a discharge refrigerant pipe 16.

The expansion mechanism 13 is a device that reduces the pressure of the refrigerant cooled in the radiator 12 (here, the refrigerant further cooled in the economizer 22). The expansion mechanism 13 is, for example, an expansion valve or a capillary tube. Further, the outlet (second outlet 12b) on the refrigerant side of the radiator 12 and the expansion mechanism 13 are connected by a high temperature refrigerant pipe 17.

The evaporator 14 is a device that evaporates the decompressed refrigerant in the expansion mechanism 13. The evaporator 14 is, for example, a fin-and-tube heat exchanger that heats a refrigerant with air. And here, the blower fan 15 is provided in order to obtain the flow of the air which becomes the heating source of the refrigerant. The blower fan 15 is a fan that drives a blower element such as a propeller type by a drive mechanism such as a motor. Further, the expansion mechanism 13 and the refrigerant inlet 14a of the evaporator 14 are connected by a low temperature refrigerant pipe 18, and the refrigerant outlet 14b of the evaporator 14 and the suction port 11a of the compressor 11 are connected to the suction refrigerant pipe 19. Connected by.

The injection pipe 21 is a refrigerant pipe that branches a part of the refrigerant flowing through the high temperature refrigerant pipe 17 and returns it to the compressor 11. One end of the injection pipe 21 is connected to the high temperature refrigerant pipe 17, and the other end of the injection pipe 21 is connected to the intermediate portion 11c of the compression stroke of the compressor 11. The other end of the injection pipe 21 may be connected to the suction port 11a of the compressor 11 or the suction refrigerant pipe 19 instead of the intermediate portion 11c of the compression stroke of the compressor 11. The injection tube 21 is provided with an injection expansion mechanism 23. The injection expansion mechanism 23 is, for example, an expansion valve.

The economizer 22 is a device that further cools the refrigerant cooled in the radiator 12 by the refrigerant flowing through the refrigerant circuit 10. Here, the economizer 22 uses the refrigerant flowing through the high-temperature refrigerant pipe 17 cooled in the radiator 12 as the refrigerant. It is cooled by a refrigerant flowing through the injection pipe 21 as a refrigerant flowing through the refrigerant circuit 10 (more specifically, a refrigerant decompressed by the injection expansion mechanism 23). Therefore, the economizer 22 is provided in the high temperature refrigerant pipe 17 and the injection pipe 21. The inlet (fourth inlet 22a) on the high temperature refrigerant pipe 17 side of the economizer 22 is connected to the high temperature refrigerant pipe 17a, and the outlet (fourth outlet 22b) on the high temperature refrigerant pipe 17 side of the economizer 22 is the high temperature refrigerant pipe 17. It is connected to the portion 17b near the expansion mechanism 13. The inlet (third inlet 22c) on the injection pipe 21 side of the economizer 22 is connected to the second portion 21b of the injection pipe 21, and the outlet (third inlet 22d) on the injection pipe 21 side of the economizer 22 is an injection pipe. It is connected to the third portion 21c of 21. Here, the injection pipe 21 includes a first portion 21a that connects the portion 17a of the high-temperature refrigerant pipe 17 near the radiator 12 and the injection expansion mechanism 23, and the injection expansion mechanism 23 and the third inlet 22c of the economizer 22. It has a second portion 21b connecting between and a third portion 21c connecting between the third outlet 22d of the economizer 22 and the compressor 11. The details of the economizer 22 will be described later.

The water circuit 30 mainly includes a radiator 12, a pump 31, and a user-side device 32. Water is sealed in the water circuit 30.

As described above, the radiator 12 is a device that cools the refrigerant compressed in the compressor 11 by the water circulating in the water circuit 30. In other words, the radiator 12 is a device that heats water by a refrigerant circulating in the refrigerant circuit 10. The details of the radiator 12 will be described later.

The pump 31 is a device that boosts water. The pump 31 is, for example, a pump that drives a centrifugal type or positive displacement type pump element by a drive mechanism such as a motor. Here, the water-side outlet (first outlet 12d) of the radiator 12 and the suction port 31a of the pump 31 are connected by an outlet water pipe 33.

The user-side device 32 is a device that heats the room with water heated by the radiator 12. The user-side device 32 is, for example, a radiator or a floor heater. Further, the discharge port 31b of the pump 31 and the water inlet 32a of the user-side device 32 are connected by a discharge water pipe 34, and the water outlet 32b of the user-side device 32 and the water-side inlet of the radiator 12 (the first). It is connected to 1 inlet 12c) by an inlet water pipe 35.

The components of the heat pump system 1 described above are controlled by the control device 2. The control device 2 is composed of a control board or the like on which a microcomputer, a memory, or the like is mounted.

<Operation>
Next, the operation of the heat pump system 1 will be described with reference to FIG. As described above, the heat pump system 1 can heat water by using the refrigerant compression type heat pump cycle in the refrigerant circuit 10 and heat the room with the heated water (heating operation). The heating operation is performed by the control device 2.

In the refrigerant circuit 10, the refrigerant compressed and discharged by the compressor 11 is sent to the radiator 12. The refrigerant (high temperature refrigerant) sent to the radiator 12 exchanges heat with the water circulating in the water circuit 30 to be cooled and condensed. The refrigerant dissipated in the radiator 12 is sent to the economizer 22. The refrigerant (high temperature refrigerant) sent to the economizer 22 exchanges heat with the refrigerant (low temperature refrigerant) branched from the high temperature refrigerant pipe 17 to the injection pipe 21 to be further cooled. At this time, the refrigerant flowing through the injection pipe 21 is heated by the economizer 22 and returned to the compressor 11. The refrigerant cooled in the economizer 22 is decompressed by the expansion mechanism 13 and then sent to the evaporator 14. The refrigerant sent to the evaporator 14 evaporates by being heated by exchanging heat with the air passing through the evaporator 14 by the blower fan 15. The refrigerant evaporated in the evaporator 14 is sucked into the compressor 11, and is compressed and discharged again in the compressor 11.

On the other hand, in the water circuit 30, water is heated by the heat radiation of the refrigerant in the radiator 12. The water heated in the radiator 12 is boosted by the pump 31 and discharged. The water discharged from the pump 31 is sent to the user-side device 32. The water sent to the user-side device 32 is cooled by heating the room. The water cooled in the user-side device 32 is sent to the radiator 12 and heated again in the radiator 12.

(2) Details of radiator and economizer Next, details of radiator 12 and economizer 22 will be described with reference to FIGS. 1 to 8. Here, FIG. 2 is a perspective view showing the appearance of the integrated heat exchanger 20 in which the radiator 12 and the economizer 22 are integrated. FIG. 3 is a view of the first flow path 51 of the radiator 12 as viewed from the front. FIG. 4 is a view of the second flow path 61 of the radiator 12 as viewed from the front. FIG. 5 is a view of the first flow path 71 of the economizer 22 as viewed from the front. FIG. 6 is a view of the second flow path 81 of the economizer 22 as viewed from the front. FIG. 7 is a view of the inside of the heat insulating portion 44 as viewed from the front. FIG. 8 is an exploded perspective view showing the inside of the integrated heat exchanger 20. Further, in the following description, expressions such as "upper", "lower", "left", "right", "front", and "rear" may be used to explain the direction and the positional relationship. Unless otherwise specified, the direction indicated by the expression shall follow the direction of the arrow shown in the drawing.

Here, the integrated heat exchanger 20 in which the radiator 12 and the economizer 22 are integrated is configured. That is, the integrated heat exchanger 20 has a radiator 12 and an economizer 22.

The integrated heat exchanger 20 mainly includes a radiator-side heat exchange unit 41 constituting the radiator 12, an economizer-side heat exchange unit 42 constituting the economizer 22, and a radiator-side heat exchange unit 41 and an economizer-side heat exchange unit. It has a casing 43 in which the portion 42 is provided. The heat exchanger side heat exchange unit 41 is a portion that cools the refrigerant (high temperature refrigerant) compressed in the compressor 11 by the fluid to be heated (water). The economizer side heat exchange unit 42 is a portion that further cools the refrigerant cooled in the radiator 12 (heat exchanger side heat exchange unit 41) by the refrigerant (low temperature refrigerant) flowing through the refrigerant circuit 10. Here, the economizer side heat exchange unit 42 is arranged on the rear side of the radiator side heat exchange unit 41, but the front-rear relationship may be reversed.

Moreover, here, the integrated heat exchanger 22 has a heat insulating portion between the economizer 22 (economizer side heat exchange unit 42) and the radiator 12 (radiator side heat exchange unit 41) (here, between the front and rear directions). It also has 44. That is, the heat insulating portion 44 is provided in the casing 43 in a state of being arranged between the heat exchanger side heat exchange portion 41 and the economizer side heat exchange portion 42. Here, the heat insulating portion 44 is a portion that suppresses heat conduction between the economizer 22 (economizer side heat exchange unit 42) and the radiator 12 (heat exchanger side heat exchange unit 41).

In the heat exchanger side heat exchange unit 41 (radiator 12), a first layer 50 in which a plurality of rows of first flow paths 51 through which water flows and a second row of second flow paths 61 in which high-temperature refrigerant flows are formed in a plurality of rows. The two layers 60 are laminated. Here, the direction in which the first layer 50 and the second layer 60 are laminated (here, the front-rear direction of FIGS. 2 and 8) is defined as the stacking direction. Further, the direction in which the first flow paths 51 are lined up (here, the left-right direction) is the arrangement direction of the first flow path 51, and the direction in which the second flow paths 61 are lined up (here, the vertical direction) is the direction of the second flow path 61. Arrangement direction. The first and second flow paths 51 and 61 are micro flow paths (flow paths having an equivalent diameter of 1.5 mm or less) having a very small cross-sectional area. That is, the radiator 12 is called a microchannel heat exchanger. Then, when the first layer 50 is viewed along the stacking direction (front-back direction) of the first and second layers 50 and 60, the first flow path 51 is arranged in the arrangement direction (left-right direction) of the first flow path 51. It extends from the vicinity of the lower end portion to the vicinity of the upper end portion of the first layer 50 along the direction intersecting with (here, the vertical direction). Moreover, here, the first flow path 51 has a shape meandering in the arrangement direction (left-right direction) of the first flow path 51 when the first layer 50 is viewed along the stacking direction (front-back direction). By doing so, heat transfer is promoted. Further, the second flow path 61 is arranged in the arrangement direction (vertical direction) of the second flow path 61 when the second layer 60 is viewed along the stacking direction (front-back direction) of the first and second layers 50 and 60. It extends from the vicinity of the left end portion of the second layer 60 to the vicinity of the right end portion along the direction intersecting with (here, the left-right direction). Moreover, here, the second flow path 61 is divided into a plurality of (here, four) flow path groups arranged in the vertical direction, from the flow path group located at the lower left end to the flow located at the upper left end. It extends so as to fold back to the left and right toward the road group. As described above, here, the first flow path 51 and the second flow path 61 are arranged so as to form an orthogonal countercurrent.

Here, the radiator-side heat exchange portion 41 having a laminated structure of the first layer 50 and the second layer 60 includes a first plate material 52 having a groove forming the first flow path 51 formed on one surface and a second plate material 52. The second plate material 62 in which the grooves forming the flow path 61 are formed on one side is alternately laminated. The first and second plate members 52 and 62 are made of a metal material. The grooves forming the first flow path 51 and the second flow path 61 are formed, for example, by subjecting the first and second plate members 52 and 62 to machining or etching. Then, after laminating a predetermined number of the first and second plate materials 52 and 62 having such groove processing, the first and second plate materials 52 and 62 are joined by vacuum brazing or diffusion joining. As a result, a radiator-side heat exchange unit 41 having a laminated structure of the first layer 50 and the second layer 60 is obtained. Here, the grooves forming the flow paths 51 and 61 are formed on one side of both the first and second plate materials 52 and 62, but the present invention is not limited to this, and the first and second plate materials 52 are not limited thereto. , 62 may have grooves forming the flow paths 51 and 61 on both sides thereof, or grooves forming the flow paths 51 and 61 may be formed on both sides of the first and second plate members 52 and 62. It may have been done.

Further, here, notch portions 53 and 54 are formed at the lower end portion and the upper end portion of the first plate material 52, and the notch portions 53 and 54 are the lower end portions (water inlets) of the first flow path 51, respectively. It communicates with the upper part (part) and the upper end (water outlet part). Notch portions 63, 64 are also formed at the lower end portion and the upper end portion of the second plate member 62 so as to overlap the notch portions 53, 54. Then, by joining the first and second plate members 52 and 62, the cutout portions 53 and 63 form the first inlet header 13c, which is a space in which the notch portions 53 and 63 communicate with the lower end portion of the first flow path 51, and cut. The notches 54 and 64 form a first exit header 13d, which is a space communicating with the upper end of the first flow path 51. Further, notches 65 and 66 are formed in the upper left end portion and the left lower end portion of the second plate material 62, and the notch portions 65 and 66 are each in the upper left end portion (inlet of the high temperature refrigerant) of the second flow path 61. It communicates with the lower left part (part) and the lower left part (outlet part of the high temperature refrigerant). Notches 55 and 56 are also formed at the upper left end portion and the left lower end portion of the first plate member 52 so as to overlap the notches 65 and 66. Then, by joining the first and second plate members 52 and 62, the notch portions 55 and 65 form a second entrance header 13a which is a space in which the notch portions 55 and 65 communicate with the upper left end portion of the second flow path 61. The cutout portions 56 and 66 form a second exit header 13b, which is a space in which the cutout portions 56 and 66 communicate with the left lower end portion of the second flow path 61.

The economizer side heat exchange unit 42 (economizer 22) has a third layer 70 in which a plurality of rows of third flow paths 71 through which low-temperature refrigerant flows are formed, and a fourth layer 70 in which a plurality of rows of fourth flow paths 81 through which high-temperature refrigerant flows are formed. The layer 80 and the layer 80 are laminated. Here, the direction in which the third layer 70 and the fourth layer 80 are laminated (here, the front-rear direction of FIGS. 2 and 8) is defined as the stacking direction. Further, the direction in which the third flow path 71 is lined up (here, the left-right direction) is the arrangement direction of the third flow path 71, and the direction in which the fourth flow path 81 is lined up (here, the vertical direction) is the direction of the fourth flow path 81. Arrangement direction. The third and fourth flow paths 71 and 81 are micro flow paths (flow paths having an equivalent diameter of 1.5 mm or less) having a very small cross-sectional area. That is, the economizer 22 is called a microchannel heat exchanger. Then, when the third layer 70 is viewed along the stacking direction (front-back direction) of the third and fourth layers 70 and 80, the third flow path 71 is arranged in the arrangement direction (left-right direction) of the third flow path 71. It extends from the vicinity of the lower end portion to the vicinity of the upper end portion of the third layer 70 along the direction intersecting with (here, the vertical direction). Moreover, here, the third flow path 71 has a shape meandering in the arrangement direction (left-right direction) of the third flow path 71 when the third layer 70 is viewed along the stacking direction (front-back direction). By doing so, heat transfer is promoted. Further, the fourth flow path 81 is arranged in the arrangement direction (vertical direction) of the fourth flow path 81 when the fourth layer 80 is viewed along the stacking direction (front-back direction) of the third and fourth layers 70 and 80. It extends from the vicinity of the left end portion of the fourth layer 80 to the vicinity of the right end portion along the direction intersecting with (here, the left-right direction). Moreover, here, the fourth flow path 81 is divided into a plurality of (here, four) flow path groups arranged in the vertical direction, from the flow path group located at the lower left end to the flow located at the upper left end. It extends so as to fold back to the left and right toward the road group. As described above, here, the third flow path 71 and the fourth flow path 81 are arranged so as to form an orthogonal countercurrent.

Here, the economizer-side heat exchange section 42 having a laminated structure of the third layer 70 and the fourth layer 80 has a third plate material 72 in which a groove forming the third flow path 71 is formed on one side and a fourth flow. The fourth plate material 82 in which the grooves forming the road 81 are formed on one side is alternately laminated. The third and fourth plate members 72 and 82 are made of a metal material. The grooves forming the third flow path 71 and the fourth flow path 81 are formed, for example, by subjecting the third and fourth plate materials 72 and 82 to machining or etching. Then, after laminating a predetermined number of the third and fourth plate materials 72 and 82 having such groove processing, the third and fourth plate materials 72 and 82 are joined by vacuum brazing or diffusion joining. The economizer-side heat exchange section 42 having a laminated structure of the third layer 70 and the fourth layer 80 is obtained. Here, the grooves forming the flow paths 71 and 81 are formed on one side of both the third and fourth plate materials 72 and 82, but the present invention is not limited to this, and the third and fourth plate materials 72 are not limited thereto. , 82 may have grooves forming the flow paths 71 and 81 on both sides thereof, or grooves forming the flow paths 71 and 81 may be formed on both sides of the third and fourth plate materials 72 and 82. It may have been done.

Further, here, cutout portions 73 and 74 are formed at the lower end portion and the upper end portion of the third plate material 72, and the cutout portions 73 and 74 are the lower end portions (low temperature refrigerant) of the third flow path 71, respectively. It communicates with the inlet part) and the upper end part (outlet part of the low temperature refrigerant). Notches 83 and 84 are also formed at the lower end and the upper end of the fourth plate member 82 so as to overlap the notches 73 and 74. Then, by joining the third and fourth plate members 72 and 82, a third inlet header 23c, which is a space in which the notch portions 73 and 83 communicate with the lower end portion of the third flow path 71, is formed and cut. The notches 74 and 84 form a third exit header 23d, which is a space communicating with the upper end of the third flow path 71. Further, notches 85 and 86 are formed in the upper left end portion and the left lower end portion of the fourth plate material 82, and the notch portions 85 and 86 are each in the upper left end portion (inlet of the high temperature refrigerant) of the fourth flow path 81. It communicates with the lower left part (part) and the lower left part (outlet part of the high temperature refrigerant). Notches 75 and 76 are also formed in the upper left end portion and the left lower end portion of the third plate member 72 so as to overlap the notch portions 85 and 86. Then, by joining the third and fourth plate members 72 and 82, the fourth entrance header 23a, which is a space in which the cutout portions 75 and 85 communicate with the upper left end portion of the fourth flow path 81, is formed. The cutout portions 76 and 86 form a fourth exit header 23b, which is a space in which the cutout portions 76 and 86 communicate with the left lower end portion of the fourth flow path 81.

The heat insulating portion 44 forms a gap 90 in which the refrigerant and water do not flow between the heat exchanger side heat exchange unit 41 (radiator 12) and the economizer side heat exchange unit 42 (economizer 22). Here, the heat insulating portion 44 is arranged between the fifth plate material 91 on the radiator side heat exchange unit 41 side, the sixth plate material 92 on the economizer side heat exchange unit 42 side, and the fifth and sixth plate materials 91 and 92. It has a seventh plate material 93 and the like. The fifth to seventh plate materials 91 to 93 are made of a metal material. The seventh plate member 93 is formed with an opening 94 for forming a gap 90. Then, after the seventh plate material 93 is arranged between the fifth and sixth plate materials 91 and 92, that is, the fifth plate material 91, the seventh plate material 93, and the sixth plate material 92 are laminated in order from the front direction of FIGS. 2 and 8. By joining the plate materials 91, 93, and 92 by vacuum brazing or diffusion joining, a heat insulating portion 44 having a gap 90 formed inside is obtained. In the vacuum brazing or diffusion joining, the plates 91, 93, and 92 are joined in a vacuum atmosphere, so that the gap 90 obtained by this is also in a vacuum state.

The casing 43 is a member provided with a heat exchanger side heat exchange unit 41, an economizer side heat exchange unit 42, and a heat insulating unit 44. Here, the casing 43 has a substantially rectangular parallelepiped shape. A first inlet 12c, which serves as an inlet for water, is formed in the front portion of the lower surface portion of the casing 43, and communicates with the first inlet header 13c. An inlet water pipe 35 is connected to the first inlet 12c. A first outlet 12d, which is an outlet for water, is formed in a portion near the front of the upper surface portion of the casing 43, and communicates with the first outlet header 13d. An outlet water pipe 33 is connected to the first outlet 12d. A second inlet 12a, which serves as an inlet for the high-temperature refrigerant, is formed on the front upper portion of the left side surface portion of the casing 43, and communicates with the second inlet header 13a. A discharge refrigerant pipe 16 is connected to the second inlet 12a. A second outlet 12b, which is an outlet for the high-temperature refrigerant, is formed in the lower front portion of the left side surface portion of the casing 43, and communicates with the second outlet header 13b. A high temperature refrigerant pipe 17a is connected to the second outlet 12b. Further, a third inlet 22c, which is an inlet for the low-temperature refrigerant, is formed in the rear portion of the lower surface portion of the casing 43, and communicates with the third inlet header 23c. An injection pipe 21b is connected to the third inlet 22c. A third outlet 22d, which is an outlet for the low-temperature refrigerant, is formed in the rear portion of the upper surface portion of the casing 43, and communicates with the third outlet header 23d. An injection pipe 21b is connected to the third outlet 22d. A fourth inlet 22a, which serves as an inlet for the high-temperature refrigerant, is formed on the rear upper portion of the left side surface portion of the casing 43, and communicates with the fourth inlet header 23a. A high temperature refrigerant pipe 17a is connected to the fourth inlet 22a. A fourth outlet 22b, which serves as an outlet for the high-temperature refrigerant, is formed in the lower rear portion of the left side surface portion of the casing 43, and communicates with the fourth outlet header 23b. A high temperature refrigerant pipe 17b is connected to the fourth outlet 22b. Here, each surface portion of the casing 43 is made of a metal plate-shaped member.

Here, each surface portion of the casing 43 is arranged so as to cover the heat exchanger side heat exchange unit 41, the economizer side heat exchange unit 42, and the heat insulating unit 44, and the radiator side heat exchange unit 41 and the economizer side heat exchange unit. It is joined to the portion 42 and the heat insulating portion 44. Here, for joining the heat exchanger side heat exchange unit 41, the economizer side heat exchange unit 42, the heat insulating unit 44, and the casing 43, the first to seventh plate materials 52, 62, 72, 82, 91, 92, 93 are specified. By covering each surface of the casing 43 with a predetermined number of laminated layers in order and then performing vacuum brazing or diffusion bonding, the heat exchanger side heat exchange unit 41, the economizer side heat exchange unit 42, and the heat insulating unit 44 are performed. It is done with the formation of. However, it is not necessary to join the heat exchanger side heat exchange unit 41, the economizer side heat exchange unit 42, the heat insulating unit 44, and the casing 43 at the same time, and the radiator side heat exchange unit 41, the economizer side heat exchange unit 42, and the heat insulating unit are not required to be joined at the same time. Only 44 may be joined by vacuum brazing or diffusion joining, and then the heat exchanger side heat exchange section 41, the economizer side heat exchange section 42, and the heat insulating section 44 may be joined to the casing 43.

In the integrated heat exchanger 20 having such a configuration, during the operation of the heat pump system 1, in the radiator 12, water flows from the first inlet 12c to the first inlet header 13c, and from the first inlet header 13c to the first. It is branched into the inlet portion of the first flow path 51, flows from the bottom to the top in the first flow path 51, is heated by heat exchange with the high temperature refrigerant, and is heated from the outlet portion of the first flow path 51 to the first outlet header 13d. It merges at and flows out from the first exit 12d. Further, in the radiator 12, the high temperature refrigerant flows from the second inlet 12a into the second inlet header 13a, is branched from the second inlet header 13a to the inlet portion of the second flow path 61, and enters the second flow path 61. It flows from top to bottom while turning left and right, dissipates heat by heat exchange with water, joins at the second outlet header 13b from the outlet portion of the second flow path 61, and flows out from the second outlet 12b. Further, in the economizer 22, the low-temperature refrigerant flows from the third inlet 22c into the third inlet header 23c, is branched from the third inlet header 23c to the inlet portion of the third flow path 71, and goes down in the third flow path 71. It flows upward from the top and is heated by heat exchange with the high temperature refrigerant, joins at the third outlet header 23d from the outlet portion of the third flow path 71, and flows out from the third outlet 32d. Further, in the economizer 22, the high temperature refrigerant flows from the 4th inlet 22a into the 4th inlet header 23a, is branched from the 4th inlet header 23a to the inlet portion of the 4th flow path 81, and moves left and right in the 4th flow path 81. It flows from top to bottom while turning back to, dissipates heat by heat exchange with the low-temperature refrigerant, joins at the fourth outlet header 23b from the outlet portion of the fourth flow path 81, and flows out from the fourth outlet 22b.

(3) Features Next, the features of the heat pump system 1 will be described.

<A>
Here, as described above, in the heat pump system 1 provided with the refrigerant circuit 10 having the economizer 22, the economizer 22 constitutes an integrated heat exchanger 20 integrated with the radiator 12.

In the conventional integrated heat exchanger, the refrigerant flowing through the radiator is cooled by the refrigerant flowing through the economizer due to heat conduction through the joint between the economizer and the radiator, thereby causing the fluid to be heated in the radiator to be cooled. There was a risk that the heating capacity would decrease.

On the other hand, here, it is assumed that the integrated heat exchanger 20 has a heat insulating portion 44 between the economizer 22 and the radiator 12.

Therefore, here, the heat insulating portion 44 can suppress heat conduction between the economizer 22 and the radiator 12. As a result, here, the refrigerant (high temperature refrigerant) flowing through the radiator 12 is less likely to be cooled by the refrigerant (particularly the low temperature refrigerant) flowing through the economizer 22, and the heated fluid (here, water) is heated in the radiator 12. It is possible to suppress the decrease in ability. Further, by suppressing the decrease in the heating capacity, the radiator 12 can be made compact, and even if the heat insulating portion 44 is combined, the merit of the compactification by integrating the radiator 12 and the economizer 22 becomes large.

<B>
Further, here, as described above, the heat insulating portion 44 is configured by the gap 90 provided between the radiator 12 and the economizer 22 so as not to allow the refrigerant and the fluid to be heated to flow.

Thereby, here, the heat insulating portion 44 can be easily formed by the gap 90.

<C>
Further, here, as described above, the gap 90 is in a vacuum state.

Thereby, here, the heat insulating performance of the heat insulating portion 44 formed by the gap 90 can be improved.

<D>
Further, here, as described above, the integrated heat exchanger 20 is formed by vacuum brazing or diffusion bonding.

Here, when the integrated heat exchanger 20 is formed by laminating the plate members 52, 62, 72, 82, 91 to 93 and joining them by vacuum brazing or diffusion bonding as described above, the radiator 12 By forming a gap 90 between the plate members 91 to 93 arranged between the plate material and the economizer 22 so that the refrigerant and the fluid to be heated do not flow, the gap between the plate materials 91 to 93 can be easily evacuated. Can be done.

<E>
Further, here, as described above, the integrated heat exchanger 20 is a microchannel heat exchanger.

Here, the integrated heat exchanger 20 can be made compact.

<F>
Further, as described above, the radiator 12 further includes a user-side device 32 that heats the room with the fluid (water) to be heated by heat exchange with the refrigerant.

As a result, since the decrease in the ability to heat the fluid to be heated (water) in the radiator 12 is suppressed here, the decrease in the heating capacity in the user-side device 32 can be suppressed.

(4) Modification example <A>
In the above embodiment, the radiator 12 and the economizer 22 are integrated to form an integrated heat exchanger 20 (see FIGS. 2 to 8), but in addition to these, both heat exchangers 12 and 22 are used. A part of the connecting refrigerant pipe may also be incorporated into the integrated heat exchanger 20.

Specifically, here, as shown in FIGS. 9, 3, 10, 5, and 11 to 14, the injection pipe 17a is a high-temperature refrigerant pipe 17a that sends the high-temperature refrigerant radiated by the radiator 12 to the economizer 22. Together with the branch portion to 21a, it is incorporated into the integrated heat exchanger 20.

The integrated heat exchanger 20 mainly has a heat exchanger side heat exchange unit 41 (radiator 12), an economizer side heat exchange unit 42 (economizer 22), a casing 43, and a heat insulating unit 44. .. Moreover, here, the integrated heat exchanger 20 further has a communication portion 45 between the heat insulating portion 44 and the economizer 22 (here, between the front and rear directions).

Similar to the above embodiment, the heat exchanger side heat exchange unit 41 (heat exchanger 12) has a first layer 50 in which a plurality of rows of first flow paths 51 through which water flows and a second flow path 61 through which high-temperature refrigerant flows. The second layer 60, which is formed in a plurality of rows, is formed by laminating the second layer 60. Here, since the configuration of the heat exchanger side heat exchange unit 41 is the same as that of the above embodiment, the description thereof is omitted here.

The economizer side heat exchange unit 42 (economizer 22) has a third layer 70 in which a plurality of rows of third flow paths 71 through which low-temperature refrigerant flows are formed, and a fourth layer 70 in which a plurality of rows of fourth flow paths 81 through which high-temperature refrigerant flows are formed. The layer 80 and the layer 80 are laminated. Here, since the configuration of the heat exchange unit 42 on the economizer side is the same as that of the above embodiment, the description thereof is omitted here.

Similar to the above embodiment, the heat insulating portion 44 forms a gap 90 in which the refrigerant and water do not flow between the heat exchanger side heat exchange unit 41 (radiator 12) and the economizer side heat exchange unit 42 (economizer 22). ing. However, here, unlike the above embodiment, the cutout portions 91a to 93a are provided at the left lower end portions of the fifth to seventh plate materials 91 to 93 constituting the heat insulating portion 44 so as to overlap the notch portions 56 and 66. It is formed, and these notched portions 91a to 93a also form a part of the second exit header 13b. Therefore, in the seventh plate material 93, an opening 94 for forming the gap 90 is formed so as to avoid the notch portion 93a.

The communication portion 45 forms a flow path 96 for communicating the second outlet header 13b of the heat exchanger side heat exchange unit 41 (radiator 12) and the fourth inlet header 23a of the economizer side heat exchange unit 42 (economizer 22). It is a part. Here, the communication portion 45 has an eighth plate material 95 on the heat insulating portion 44 side and a ninth plate material 97 on the economizer side heat exchange portion 42 side. The eighth and ninth plate members 95 and 97 are made of a metal material. The eighth plate material 95 is formed with cutout portions 95a and 95b and a flow path 96. The notch portion 95a is formed at the left lower end portion of the eighth plate material 95 so as to overlap the notch portions 56, 66, 91a to 93a, and constitutes a part of the second outlet header 13b. The cutout portion 95b is formed at the upper left end portion of the eighth plate material 95 so as to overlap the cutout portions 75 and 85, and constitutes a part of the fourth entrance header 23a. The flow path 96 is a flow path that allows the notch portion 95a (second outlet header 13b) and the notch portion 95b (fourth inlet header 23a) to communicate in the vertical direction, and here, the economizer side heat exchange section 42. A flow path having the same shape as the fourth flow path 81 is adopted. However, the shape of the flow path 96 is not limited to this, and may be any other shape as long as the notch portion 95a and the notch portion 95b communicate with each other in the vertical direction. A notch portion 97a is formed at the upper left end portion of the ninth plate member 97 so as to overlap the notch portions 75, 85, 95b, and constitutes a part of the fourth entrance header 23a.

The casing 43 is a member provided with a communication portion 45 together with a heat exchanger side heat exchange portion 41, an economizer side heat exchange portion 42, and a heat insulating portion 44. A first inlet 12c, which serves as an inlet for water, is formed in the front portion of the lower surface portion of the casing 43, and communicates with the first inlet header 13c. An inlet water pipe 35 is connected to the first inlet 12c. A first outlet 12d, which is an outlet for water, is formed in a portion near the front of the upper surface portion of the casing 43, and communicates with the first outlet header 13d. An outlet water pipe 33 is connected to the first outlet 12d. A second inlet 12a, which serves as an inlet for the high-temperature refrigerant, is formed on the front upper portion of the left side surface portion of the casing 43, and communicates with the second inlet header 13a. A discharge refrigerant pipe 16 is connected to the second inlet 12a. A second outlet 12b, which is an outlet for the high-temperature refrigerant, is formed in the lower front portion of the left side surface portion of the casing 43, and communicates with the second outlet header 13b. However, unlike the above embodiment, the injection pipe 21a is connected to the second outlet 12b instead of the high temperature refrigerant pipe 17a. Further, a third inlet 22c, which is an inlet for the low-temperature refrigerant, is formed in the rear portion of the lower surface portion of the casing 43, and communicates with the third inlet header 23c. An injection pipe 21b is connected to the third inlet 22c. A third outlet 22d, which is an outlet for the low-temperature refrigerant, is formed in the rear portion of the upper surface portion of the casing 43, and communicates with the third outlet header 23d. An injection pipe 21b is connected to the third outlet 22d. The fourth inlet 22a formed in the above embodiment is not formed on the rear upper portion of the left side surface portion of the casing 43.

Here, each surface portion of the casing 43 is arranged so as to cover the heat exchanger side heat exchange section 41, the economizer side heat exchange section 42, the heat insulating section 44, and the communication section 45, and the radiator side heat exchange section 41, It is joined to the heat exchange portion 42 on the economizer side, the heat insulating portion 44, and the communication portion 45. Here, the heat exchange section 41 on the radiator side, the heat exchange section 42 on the economizer side, and the heat insulating section 44 are joined to the casing 43 from the first to seventh plate materials 52, 62, 72, 82, 91, 92, 93, 95. , 97 are laminated in a predetermined order in a predetermined order and covered with each surface portion of the casing 43, and then vacuum brazing or diffusion bonding is performed to perform heat exchange section 41 on the radiator side and heat exchange section 42 on the economizer side. , With the formation of the heat insulating portion 44 and the communicating portion 45.

In the integrated heat exchanger 20 having such a configuration, during the operation of the heat pump system 1, in the radiator 12, water flows from the first inlet 12c to the first inlet header 13c, and from the first inlet header 13c to the first. It is branched into the inlet portion of the first flow path 51, flows from the bottom to the top in the first flow path 51, is heated by heat exchange with the high temperature refrigerant, and is heated from the outlet portion of the first flow path 51 to the first outlet header 13d. It merges at and flows out from the first exit 12d. Further, in the radiator 12, the high temperature refrigerant flows from the second inlet 12a into the second inlet header 13a, is branched from the second inlet header 13a to the inlet portion of the second flow path 61, and enters the second flow path 61. It flows from top to bottom while turning left and right, dissipates heat by heat exchange with water, and merges from the outlet portion of the second flow path 61 at the second outlet header 13b. Then, a part of this high temperature refrigerant flows out from the second outlet 12b and is sent to the injection pipe 21a, and the remaining high temperature refrigerant is the cutout portion 91a of the heat insulating portion 44 forming a part of the second outlet header 13b. It is sent to the notch portion 95a of the communication portion 45 through ~ 93a. The high-temperature refrigerant sent to the communication portion 45 flows from the bottom to the top in the flow path 96 and reaches the economizer 22 through the notches 95b and 97b of the communication portion 45 forming a part of the fourth inlet header 23a. Sent. Further, in the economizer 22, the low-temperature refrigerant flows from the third inlet 22c into the third inlet header 23c, is branched from the third inlet header 23c to the inlet portion of the third flow path 71, and enters the third flow path 71. It flows from the bottom to the top, is heated by heat exchange with the high temperature refrigerant, joins at the third outlet header 23d from the outlet portion of the third flow path 71, and flows out from the third outlet 32d. Further, in the economizer 22, the high-temperature refrigerant flows into the fourth inlet header 23a through the notches 95b and 97b of the communication portion 45, is branched from the fourth inlet header 23a to the inlet portion of the fourth flow path 81, and is fourth. It flows from top to bottom while folding back to the left and right in the flow path 81, dissipates heat by heat exchange with the low temperature refrigerant, joins from the outlet portion of the fourth flow path 81 at the fourth outlet header 23b, and joins from the fourth outlet 22b. leak.

<B>
In the above embodiment, as the economizer 22 that further cools the high-temperature refrigerant cooled in the radiator 12 by the refrigerant flowing through the refrigerant circuit 10, the one that cools the high-temperature refrigerant by the low-temperature refrigerant flowing through the injection pipe 21 is adopted (FIG. FIG. 1). However, the economizer 22 is not limited to this, and for example, one that cools the high-temperature refrigerant with the low-temperature refrigerant evaporated in the evaporator 14 may be adopted.

Specifically, as shown in FIG. 15, in the refrigerant circuit 10 of the above embodiment, the injection pipe 21 is omitted, and as the economizer 22, the refrigerant flowing through the high-temperature refrigerant pipe 17 cooled in the radiator 12 is used as the refrigerant. A refrigerant that is cooled by the refrigerant flowing through the suction refrigerant pipe 19 as the refrigerant flowing through the circuit 10 is adopted. That is, the economizer 22 is provided in the high temperature refrigerant pipe 17 and the suction refrigerant pipe 19. The inlet (fourth inlet 22a) on the high temperature refrigerant pipe 17 side of the economizer 22 is connected to the high temperature refrigerant pipe 17a, and the outlet (fourth outlet 22b) on the high temperature refrigerant pipe 17 side of the economizer 22 is the high temperature refrigerant pipe 17. It is connected to the portion 17b near the expansion mechanism 13. The inlet (third inlet 22c) on the suction refrigerant pipe 19 side of the economizer 22 is connected to the portion 19a of the suction refrigerant pipe 19 near the evaporator 14, and the outlet (third inlet) on the suction refrigerant pipe 19 side of the economizer 22. 22d) is connected to a portion 19b of the suction refrigerant pipe 19 near the compressor 11.

Also in this case, similarly to the integrated heat exchanger of the above embodiment (see FIGS. 2 to 8), the integrated heat exchanger 20 in which the radiator 12 and the economizer 22 are integrated can be configured.

Specifically, as shown in FIGS. 16, 3, 4, 17, and 6 to 8, the integrated heat exchanger 20 mainly includes the heat exchanger side heat exchanger 41 (heat exchanger 12). It has an economizer side heat exchange unit 42 (economizer 22), a casing 43, and a heat insulating unit 44.

Similar to the above embodiment, the heat exchanger side heat exchange unit 41 (heat exchanger 12) has a first layer 50 in which a plurality of rows of first flow paths 51 through which water flows and a second flow path 61 through which high-temperature refrigerant flows. The second layer 60, which is formed in a plurality of rows, is formed by laminating the second layer 60. Here, since the configuration of the heat exchanger side heat exchange unit 41 is the same as that of the above embodiment, the description thereof is omitted here.

The economizer side heat exchange unit 42 (economizer 22) has a third layer 70 in which a plurality of rows of third flow paths 71 through which low-temperature refrigerant flows are formed, and a fourth layer 70 in which a plurality of rows of fourth flow paths 81 through which high-temperature refrigerant flows are formed. The layer 80 and the layer 80 are laminated. Here, since the configuration of the heat exchange unit 42 on the economizer side is the same as that of the above embodiment, the description thereof is omitted here.

Similar to the above embodiment, the heat insulating portion 44 forms a gap 90 in which the refrigerant and water do not flow between the heat exchanger side heat exchange unit 41 (radiator 12) and the economizer side heat exchange unit 42 (economizer 22). ing. Here, since the configuration of the heat insulating portion 44 is the same as that of the above embodiment, the description thereof is omitted here.

The casing 43 is a member provided with the heat exchanger side heat exchange unit 41, the economizer side heat exchange unit 42, and the heat insulating unit 44, as in the above embodiment. However, here, as shown in FIGS. 16 and 17, the third inlet 22c communicating with the third inlet header 23c formed in the rear portion of the lower surface portion of the casing 43 is not the injection pipe 21a but the injection pipe 21a. The suction refrigerant pipe 19a is connected. Further, not the injection pipe 21b but the suction refrigerant pipe 19b is connected to the third outlet 22d communicating with the third outlet header 23d formed in the rear portion of the upper surface portion of the casing 43.

In the integrated heat exchanger 20 having such a configuration, when the heat pump system 1 is operated, water is heated by heat exchange with the high temperature refrigerant in the radiator 12 and the high temperature refrigerant dissipates heat in the radiator 12 as in the above embodiment. Further, in the economizer 22, the low-temperature refrigerant is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant dissipates heat. However, it differs from the above embodiment in that the low-temperature refrigerant is not a refrigerant flowing through the injection pipe 21 but a refrigerant flowing through the suction refrigerant pipe 19.

<C>
In the integrated heat exchanger 20 of the above modification B (the economizer 22 that cools the high temperature refrigerant by the low temperature refrigerant flowing through the suction refrigerant pipe 19 is integrated with the radiator 12), both are the same as in the above modification A. A part of the refrigerant pipe connecting the heat exchangers 12 and 22 may also be incorporated into the integrated heat exchanger 20.

Specifically, here, as shown in FIGS. 18, 3, 19, 17, and 11 to 14, the high-temperature refrigerant pipe 17a that sends the high-temperature refrigerant radiated by the radiator 12 to the economizer 22 is integrated. It is incorporated in the heat exchanger 20.

Similar to the modification A, the integrated heat exchanger 20 mainly includes a radiator side heat exchange unit 41 (radiator 12), an economizer side heat exchange unit 42 (economizer 22), a casing 43, and a heat insulating unit. It has 44 and a communication portion 45.

Similar to the modification A, the heat exchanger side heat exchange unit 41 (radiator 12) has a first layer 50 in which a plurality of rows of first flow paths 51 through which water flows and a second flow path through which high-temperature refrigerant flows. It is configured by laminating a second layer 60 in which a plurality of rows of 61 are formed. Here, since the configuration of the heat exchanger side heat exchange unit 41 is the same as that of the above modification A, the description thereof is omitted here.

The economizer side heat exchange unit 42 (economizer 22) has a third layer 70 in which a plurality of rows of third flow paths 71 through which low-temperature refrigerant flows are formed, and a fourth layer 70 in which a plurality of rows of fourth flow paths 81 through which high-temperature refrigerant flows are formed. The layer 80 and the layer 80 are laminated. Here, since the configuration of the economizer side heat exchange unit 42 is the same as that of the modification A, the description thereof is omitted here.

Similar to the modification A, the heat insulating portion 44 forms a gap 90 that does not allow the refrigerant and water to flow between the heat exchanger side heat exchange unit 41 (radiator 12) and the economizer side heat exchange unit 42 (economizer 22). is doing. Here, since the configuration of the heat insulating portion 44 is the same as that of the above-mentioned modification A, the description thereof is omitted here.

Similar to the modification A, the communication portion 45 has a second outlet header 13b of the heat exchanger side heat exchange unit 41 (radiator 12) and a fourth inlet header 23a of the economizer side heat exchange unit 42 (economizer 22). The flow path 96 to be communicated is formed. Here, since the configuration of the communication portion 45 is the same as that of the modification A, the description thereof is omitted here.

The casing 43 is a member provided with a communication portion 45 together with a heat exchanger side heat exchange portion 41, an economizer side heat exchange portion 42, and a heat insulating portion 44. A first inlet 12c, which serves as an inlet for water, is formed in the front portion of the lower surface portion of the casing 43, and communicates with the first inlet header 13c. An inlet water pipe 35 is connected to the first inlet 12c. A first outlet 12d, which is an outlet for water, is formed in a portion near the front of the upper surface portion of the casing 43, and communicates with the first outlet header 13d. An outlet water pipe 33 is connected to the first outlet 12d. A second inlet 12a, which serves as an inlet for the high-temperature refrigerant, is formed on the front upper portion of the left side surface portion of the casing 43, and communicates with the second inlet header 13a. A discharge refrigerant pipe 16 is connected to the second inlet 12a. The second outlet 12b formed in the above-mentioned modification A is not formed in the lower part of the front side of the left side surface portion of the casing 43. Further, a third inlet 22c, which is an inlet for the low-temperature refrigerant, is formed in the rear portion of the lower surface portion of the casing 43, and communicates with the third inlet header 23c. A suction refrigerant pipe 19a is connected to the third inlet 22c. A third outlet 22d, which is an outlet for the low-temperature refrigerant, is formed in the rear portion of the upper surface portion of the casing 43, and communicates with the third outlet header 23d. A suction refrigerant pipe 19b is connected to the third outlet 22d. Similar to the above modification A, the fourth inlet 22a is not formed on the rear upper portion of the left side surface portion of the casing 43.

In the integrated heat exchanger 20 having such a configuration, during the operation of the heat pump system 1, in the radiator 12, water flows from the first inlet 12c to the first inlet header 13c, and from the first inlet header 13c to the first. It is branched into the inlet portion of the first flow path 51, flows from the bottom to the top in the first flow path 51, is heated by heat exchange with the high temperature refrigerant, and is heated from the outlet portion of the first flow path 51 to the first outlet header 13d. It merges at and flows out from the first exit 12d. Further, in the radiator 12, the high temperature refrigerant flows from the second inlet 12a into the second inlet header 13a, is branched from the second inlet header 13a to the inlet portion of the second flow path 61, and enters the second flow path 61. It flows from top to bottom while turning left and right, dissipates heat by heat exchange with water, and merges from the outlet portion of the second flow path 61 at the second outlet header 13b. Then, all of this high-temperature refrigerant is sent to the notch portion 95a of the communication portion 45 through the notch portions 91a to 93a of the heat insulating portion 44 forming a part of the second outlet header 13b. The high-temperature refrigerant sent to the communication portion 45 flows from the bottom to the top in the flow path 96 and reaches the economizer 22 through the notches 95b and 97b of the communication portion 45 forming a part of the fourth inlet header 23a. Sent. Further, in the economizer 22, the low-temperature refrigerant flows from the third inlet 22c into the third inlet header 23c, is branched from the third inlet header 23c to the inlet portion of the third flow path 71, and enters the third flow path 71. It flows from the bottom to the top, is heated by heat exchange with the high temperature refrigerant, joins at the third outlet header 23d from the outlet portion of the third flow path 71, and flows out from the third outlet 32d. Further, in the economizer 22, the high-temperature refrigerant flows into the fourth inlet header 23a through the notches 95b and 97b of the communication portion 45, is branched from the fourth inlet header 23a to the inlet portion of the fourth flow path 81, and is fourth. It flows from top to bottom while folding back to the left and right in the flow path 81, dissipates heat by heat exchange with the low temperature refrigerant, joins from the outlet portion of the fourth flow path 81 at the fourth outlet header 23b, and joins from the fourth outlet 22b. leak.

<D>
In the above-described embodiment and modification, a case where a microchannel heat exchanger is adopted as an integrated heat exchanger 20 in which a radiator 12 and an economizer 22 are integrated will be described as an example (FIGS. 2 to 2). 14 and FIGS. 16-18). However, the integrated heat exchanger 20 in which the radiator 12 and the economizer 22 are integrated is not limited to the microchannel heat exchanger, and for example, the integrated heat exchange in which the radiator 12 and the economizer 22 are integrated is not limited. A plate heat exchanger may be adopted as the vessel 20.

Specifically, as shown in FIGS. 20 to 22, the integrated heat exchanger 20 has a plate heat exchanger configuration corresponding to the configurations of the above embodiment and the modified example B (micro flow path heat exchanger). Can be adopted. Here, the integrated heat exchanger 20 mainly comprises a plurality of first plate materials 110 constituting the radiator 12, a plurality of second plate materials 120 constituting the economizer 22, and a plurality of third plate materials constituting the casing 43. It has 130 and. Moreover, here, the integrated heat exchanger 22 further has a heat insulating portion 44 between the economizer 22 and the radiator 12 (here, in the front-rear direction). The heat insulating portion 44 is composed of a plurality of fourth plate members 140.

The first plate material 110 is laminated in the front-rear direction so that the first flow path 51 through which water flows and the second flow path 61 through which high-temperature refrigerant flows are alternately formed. The first plate material 110 is made of a metal material. The first plate material 110 is formed with a concavo-convex shape that becomes the first flow path 51 and the second flow path 61 by press working or the like. Further, openings 110c and 110d are formed in the lower left and upper left portions of the first plate material 110. The openings 110c and 110d communicate with the lower part (water inlet portion) and the upper part (water outlet portion) of the first flow path 51, respectively, and are spaces communicating with the lower part of the first flow path 51. The first outlet header 13d, which is a space communicating with the upper part of the first inlet header 13c and the first flow path 51, is formed. Further, openings 110a and 110b are formed in the upper right portion and the lower right portion of the first plate material 110. The openings 110a and 110b communicate with the upper part (inlet portion of the high temperature refrigerant) and the lower part (outlet part of the high temperature refrigerant) of the second flow path 61, respectively, and are spaces communicating with the upper part of the second flow path 61. The second outlet header 13b, which is a space communicating with the lower part of the second inlet header 13a and the second flow path 61, is formed. Here, the radiator 12 is obtained by laminating the first plate materials 110 and then joining the first plate materials 110 by vacuum brazing, welding, or a joining process of bolt fastening.

The second plate material 120 is laminated in the front-rear direction so that the third flow path 71 through which the low-temperature refrigerant flows and the fourth flow path 81 through which the high-temperature refrigerant flows are alternately formed. The second plate material 120 is made of a metal material. The second plate material 120 is formed with a concavo-convex shape that becomes the third flow path 71 and the fourth flow path 81 by press working or the like. Further, openings 120c and 120d are formed in the lower left and upper left portions of the second plate material 120. The openings 120c and 120d communicate with the lower part (inlet portion of the low temperature refrigerant) and the upper part (outlet part of the low temperature refrigerant) of the third flow path 71, respectively, in a space communicating with the lower part of the third flow path 71. A third outlet header 23d, which is a space communicating with the upper part of the third inlet header 23c and the third flow path 71, is formed. Further, openings 120a and 120b are formed in the upper right portion and the lower right portion of the second plate material 120. The openings 120a and 120b communicate with the upper part (inlet portion of the high temperature refrigerant) and the lower part (outlet part of the high temperature refrigerant) of the fourth flow path 81, respectively, and are spaces communicating with the upper part of the fourth flow path 81. The fourth outlet header 23b, which is a space communicating with the lower part of the fourth inlet header 23a and the fourth flow path 81, is formed. Here, the economizer 22 is obtained by laminating the second plate materials 120 and then joining the second plate materials 120 by vacuum brazing, welding, or a joining process of bolt fastening.

The fourth plate material 140 is laminated in the front-rear direction so as to form a gap 90 in which the refrigerant and water do not flow between the radiator 12 and the economizer 22. The fourth plate material 140 is made of a metal material. Here, the heat insulating portion 44 is obtained by laminating the fourth plate material 140 and then joining the fourth plate material 140 by vacuum brazing, welding, or a joining process of bolt fastening. In the vacuum brazing, the fourth plate members 140 are joined in a vacuum atmosphere, so that the gap 90 obtained by this is also in a vacuum state.

A first inlet 12c, which is an inlet for water, is formed in the lower left of the third plate material 130 on the radiator 12 side (here, the front side), and communicates with the first inlet header 13c. An inlet water pipe 35 is connected to the first inlet 12c. A first outlet 12d, which is an outlet for water, is formed in the upper left portion of the third plate material 130 on the radiator 12 side, and communicates with the first outlet header 13d. An outlet water pipe 33 is connected to the first outlet 12d. A second inlet 12a, which is an inlet for the high-temperature refrigerant, is formed in the upper right portion of the third plate material 130 on the radiator 12 side, and communicates with the second inlet header 13a. A discharge refrigerant pipe 16 is connected to the second inlet 12a. A second outlet 12b, which is an outlet for the high-temperature refrigerant, is formed in the lower right portion of the third plate material 130 on the radiator 12 side, and communicates with the second outlet header 13b. A high temperature refrigerant pipe 17a is connected to the second outlet 12b. Further, a third inlet 22c, which is an inlet for the low-temperature refrigerant, is formed in the lower left portion of the third plate material 130 on the economizer 22 side (here, the rearward side), and communicates with the third inlet header 23c. .. An injection pipe 21b or a suction refrigerant pipe 19a is connected to the third inlet 22c. A third outlet 22d, which is an outlet for the low-temperature refrigerant, is formed in the upper left portion of the third plate material 130 on the economizer 22 side, and communicates with the third outlet header 23d. An injection pipe 21b or a suction refrigerant pipe 19b is connected to the third outlet 22d. A fourth inlet 22a, which is an inlet for the high-temperature refrigerant, is formed in the upper right portion of the third plate 130 on the economizer 22 side, and communicates with the fourth inlet header 23a. A high temperature refrigerant pipe 17a is connected to the fourth inlet 22a. A fourth outlet 22b, which is an outlet for the high-temperature refrigerant, is formed in the lower right portion of the third plate material 130 on the economizer 22 side, and communicates with the fourth outlet header 23b. A high temperature refrigerant pipe 17b is connected to the fourth outlet 22b. Here, the third plate member 130 constituting the casing 43 is made of a metal material.

Here, the third plate member 130 of the casing 43 is arranged so as to sandwich the radiator 12, the economizer 22 and the heat insulating portion 44 in the front-rear direction, and is joined to the radiator 12, the economizer 22 and the heat insulating portion 44. .. For example, in the joining of the radiator 12, the economizer 22, the heat insulating portion 44, and the casing 43, a predetermined number of first to fourth plate members 110 to 140 are laminated in a predetermined order, and then vacuum brazing, welding, and bolt fastening are performed. This is performed together with the formation of the radiator 12, the economizer 22, and the heat insulating portion 44.

In the integrated heat exchanger 20 having such a configuration, as in the above embodiment and the modification B, in the radiator 12, the water is heated by heat exchange with the high temperature refrigerant and the high temperature refrigerant dissipates heat. Further, in the economizer 22, the low-temperature refrigerant is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant dissipates heat.

<E>
Also in the above modification D (when the economizer 22 that cools the high temperature refrigerant by the low temperature refrigerant flowing through the injection pipe 21 is adopted), the modification A (see FIGS. 9, 3, 10, 5, and 11 to 14). ), As shown in FIGS. 23, 21 and 24, the high-temperature refrigerant pipe 17a that sends the high-temperature refrigerant radiated in the radiator 12 to the economizer 22 is integrated with the branch portion to the injection pipe 21a. It may be incorporated into 20.

Here, among the fourth flow paths 81 constituting the economizer 22, the fourth flow path 81a adjacent to the rear side of the heat insulating portion 44 is made to function as the communication portion 45. Specifically, in order to prevent the space at the lower right of the second plate material 120 forming the fourth flow path 81a from communicating with the fourth outlet header 23b, the opening 120b is prevented from forming, and the heat insulating portion 44 is formed. (Here, the fourth plate material 140) is formed with an opening 141 that penetrates in the front-rear direction without communicating with the gap 90, and the fourth flow path 81a adjacent to the rear side of the heat insulating portion 44 is connected to the second outlet header 13b. I try to communicate with. As a result, of the fourth flow path 81 constituting the economizer 22, the fourth flow path 81a adjacent to the rear side of the heat insulating portion 44 becomes the second outlet header 13b of the radiator 12 and the fourth inlet header 23a of the economizer 22. (Corresponding to the flow path 96 of the modified example A) is formed. Along with this, the fourth inlet 22a formed in the above-mentioned modification D is not formed in the upper right portion of the third plate material 130 on the economizer 22 side (here, the rearward side).

In the integrated heat exchanger 20 having such a configuration, as in the modification A, in the radiator 12, the water is heated by heat exchange with the high temperature refrigerant, the high temperature refrigerant dissipates heat, and the economizer is used. In 22, the low-temperature refrigerant is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant dissipates heat.

<F>
Also in the above modification D (when the economizer 22 that cools the high temperature refrigerant by the low temperature refrigerant flowing through the suction refrigerant pipe 19 is adopted), the modification C (FIG. 18, FIG. 3, FIG. 19, FIG. 17 and FIGS. 11 to 14) Similarly to FIG. 25), as shown in FIGS. 25, 21 and 26, the high-temperature refrigerant pipe 17a that sends the high-temperature refrigerant radiated in the radiator 12 to the economizer 22 is integrated with the branch portion to the injection pipe 21a for integrated heat exchange. It may be incorporated in the vessel 20.

Here, among the fourth flow paths 81 constituting the economizer 22, the fourth flow path 81a adjacent to the rear side of the heat insulating portion 44 is made to function as the communication portion 45. Specifically, in order to prevent the space at the lower right of the second plate material 120 forming the fourth flow path 81a from communicating with the fourth outlet header 23b, the opening 120b is prevented from forming, and the heat insulating portion 44 is formed. (Here, the fourth plate material 140) is formed with an opening 141 that penetrates in the front-rear direction without communicating with the gap 90, and the fourth flow path 81a adjacent to the rear side of the heat insulating portion 44 is connected to the second outlet header 13b. I try to communicate with. As a result, of the fourth flow path 81 constituting the economizer 22, the fourth flow path 81a adjacent to the rear side of the heat insulating portion 44 becomes the second outlet header 13b of the radiator 12 and the fourth inlet header 23a of the economizer 22. (Corresponding to the flow path 96 of the modified example A) is formed. Along with this, the second outlet 12b formed in the above modification D is not formed in the lower right portion of the third plate material 130 on the radiator 12 side (here, the front direction side), and the economizer 22 side (here). Then, the fourth inlet 22a formed in the above-mentioned modification D is not formed in the upper right portion of the third plate material 130 (on the rear side).

In the integrated heat exchanger 20 having such a configuration, as in the modification C, in the radiator 12, the water is heated by heat exchange with the high temperature refrigerant, the high temperature refrigerant dissipates heat, and the economizer is used. In 22, the low-temperature refrigerant is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant dissipates heat.

<G>
In the above-described embodiment and modification, the heat insulating portion 44 is formed by a gap 90 in which a refrigerant or water does not flow, but the heat insulating portion 44 is not limited to this.

For example, as shown in FIG. 27, in the configuration of the modified example D, the material (here, the metal material) constituting the portions (here, the plate materials 110 and 120) through which the refrigerant and the fluid to be heated flow in the gap 90). A ceramic material 90a having a lower thermal conductivity than that of the material 90a may be provided.

Further, as shown in FIG. 28, the ceramic material 90a may be provided directly between the economizer 22 and the radiator 12 without providing a gap 90 between the economizer 22 and the radiator 12.

As the material 90a having a lower thermal conductivity than the material constituting the portion through which the refrigerant and the fluid to be heated flow, a material made of resin or rubber may be used. Further, the configuration having the heat insulating portion 44 made of such a material having low thermal conductivity is not limited to the configuration of the modified example D, and may be adopted in other embodiments and modified examples.

<H>
In the above-described embodiment and modification, water is used as the fluid to be heated by the refrigerant in the radiator 12, but the fluid is not limited to this and may be another fluid such as brine as the fluid to be heated. ..

<I>
In the above-described embodiments and modifications A to C, the first flow path 51 of the radiator 12 and the third flow path 71 of the first flow path 51 economizer 22 of the radiator 12 have a meandering shape. It is not limited to, and may have another shape such as a straight shape.

<J>
In the above-described embodiments and modifications A to C, the second flow path 61 of the radiator 12 and the fourth flow path 81 of the economizer 22 have a shape of being folded back at three points to the left and right, but the present invention is not limited to this. There may be two or four fold-back points, and the shape may have no fold-back point. Further, the second flow path 61 and the fourth flow path 81 may have a meandering shape like the first flow path.

<K>
The arrangement of the entrances / exits 12a to 12d and 22a to 22d of the radiator 12 and the economizer 22 is not limited to the above-described embodiment and modification, and may be appropriately arranged according to the flow path configuration and the like.

Although the embodiments of the present disclosure have been described above, it will be understood that various changes in the form and details are possible without departing from the spirit and scope of the present disclosure described in the claims. ..

The present disclosure is widely applicable to heat pump systems equipped with a refrigerant circuit having an economizer.

1 Heat pump system 10 Refrigerant circuit 11 Compressor 12 Heat sink 13 Expansion mechanism 14 Evaporator 20 Integrated heat exchanger 22 Economizer 32 User side equipment 44 Insulation part 90 Gap

European Patent Application Publication No. 2952832

Claims (7)

A compressor (11) that compresses the refrigerant, a radiator (12) that cools the refrigerant compressed in the compressor by the fluid to be heated, and an expansion mechanism (13) that decompresses the refrigerant cooled in the radiator. ), The refrigerant circuit (10) configured by connecting the evaporator (14) that evaporates the refrigerant depressurized in the expansion mechanism, and the refrigerant circuit (10).
An economizer (22) provided in the refrigerant circuit and further cooling the refrigerant cooled in the radiator by the refrigerant flowing through the refrigerant circuit.
Equipped with
The economizer constitutes an integrated heat exchanger (20) integrated with the radiator.
The integrated heat exchanger has a heat insulating portion (44) between the economizer and the radiator.
The heat insulating portion (44) is an opening forming plate material (91, 92) arranged between the plate material (92) on the economizer side, the plate material (91) on the radiator (12) side, and the plate materials (91, 92). 93) and
The heat pump is formed with a single opening (94) in the heat insulating portion (44) for forming a gap (90) in which the refrigerant and the fluid to be heated do not flow in the opening forming plate material (93). System (1). The heat insulating portion is made of a material having a lower thermal conductivity than the material constituting the portion through which the refrigerant and the fluid to be heated flow in the integrated heat exchanger.
The heat pump system according to claim 1. The opening (94) is formed in a region including a central portion of the opening forming plate material (93).
The heat pump system according to claim 1. The gap is in a vacuum state.
The heat pump system according to any one of claims 1 to 3 . The integrated heat exchanger is formed by vacuum brazing or diffusion bonding.
The heat pump system according to claim 4. The integrated heat exchanger is a microchannel heat exchanger.
The heat pump system according to any one of claims 1 to 5. The radiator further includes a user-side device (32) that heats the room with the heated fluid heated by heat exchange with the refrigerant.
The heat pump system according to any one of claims 1 to 6.

Images