JP7097988B2 - Anti-board work machine - Google Patents

Description

This specification discloses a technique relating to a substrate working machine.

The substrate fixing mechanism described in Patent Document 1 includes a vacuum pump and a backup pin. The backup pin is arranged below the substrate arranged at the mounting position, and sucks and holds the lower surface of the substrate by the suction force of the vacuum pump. Further, the board-to-board work system described in Patent Document 2 includes a system base and a board-to-board work device. The anti-board work equipment is arranged on the system base in a state of being aligned along the substrate transport direction, and performs predetermined anti-circuit board work on the circuit board. Further, the negative pressure supply path described in Patent Document 2 is connected via a joint that can be connected or separated with one touch on the back side of the substrate working system.

Japanese Unexamined Patent Publication No. 8-18293 Japanese Unexamined Patent Publication No. 2004-104075

However, Patent Document 1 does not disclose an anti-board working machine including a base and a work module provided on the base so as to be retractable. Further, Patent Document 2 does not disclose a specific configuration of a negative pressure supply path. In a board-to-board work machine provided with a base and a work module provided on the base so that the work module can be pulled out from the inside of the base when the negative pressure is supplied to the work module. , The length of the pipe that supplies negative pressure tends to be long. In addition, it is difficult to increase the cross-sectional area of the flow path of the pipe due to the contents accommodated in the base. As a result, the resistance in the piping may increase, and the amount of negative pressure supplied to the supply object inside the work module may decrease.

In view of these circumstances, the present specification can suppress a decrease in the supply amount of negative pressure supplied to the supply object inside the work module provided on the base so as to be retractable during production of the substrate product. Disclose the anti-board working machine.

The present specification includes a base, a work module provided on the base so as to be retractable, an external negative pressure supply device, an internal negative pressure supply device, a pipe attachment / detachment portion, and a negative pressure changing device . Disclose the work equipment. The external negative pressure supply device is provided outside the base and supplies negative pressure to the supply object inside the work module without passing through the inside of the base. The internal negative pressure supply device supplies negative pressure to the supply object via an internal pipe which is a pipe provided inside the base and provided inside the work module. The pipe attachment / detachment portion is provided on the back surface of the work module, and the external pipe, which is a pipe provided outside the work module, and the internal pipe are detachably connected to each other. The negative pressure changing device is used when the work module is pulled out with respect to the base and the external pipe and the internal pipe are separated from each other at the pipe attachment / detachment portion, or when the possibility of disconnection occurs. Of the external negative pressure, which is the negative pressure supplied from the external negative pressure supply device to the supply object, and the internal negative pressure, which is the negative pressure supplied from the internal negative pressure supply device to the supply object. At least the supply of the external negative pressure is switched to the supply of the internal negative pressure.

According to the above-mentioned anti-board working machine, an external negative pressure supply device provided outside the base is provided. Further, the external negative pressure supply device supplies the negative pressure to the supply target inside the work module without going through the inside of the base. As a result, the above-mentioned anti-board working machine can easily shorten the pipe length of the pipe that supplies the negative pressure as compared with the case where the negative pressure is supplied to the work module from the inside of the base, and the flow path of the pipe. It is easy to increase the cross-sectional area. As a result, the above-mentioned anti-board working machine can suppress a decrease in the supply amount of the negative pressure supplied to the supply object inside the work module during the production of the board product. Further, according to the above-mentioned anti-board working machine, a negative pressure changing device is provided. As a result, it is easy for the board-to-board working machine to minimize the piping length of the external piping.

It is a block diagram which shows the structural example of the board work line WML. It is a perspective view which shows the structural example of the component mounting machine WM3. It is a schematic diagram which shows an example of the negative pressure supply method of 1st Embodiment. It is a schematic diagram which shows the arrangement example of the external pipe 41 and the pipe in base 51. It is a schematic diagram which shows an example of the negative pressure supply method of 2nd Embodiment. It is a side view which shows an example of the state of the external piping 41 when the withdrawal amount with respect to the base 10 of a work module 20 is the maximum withdrawal amount WA0 at the time of maintenance of a work module 20. It is a schematic diagram which shows the arrangement example of the external pipe 41.

1. 1. First Embodiment 1-1. Configuration Example of Counter-Board Work Line WML In the counter-board work line WML, a predetermined counter-board work is performed on the substrate 90. The type and number of anti-board work machines WM constituting the anti-board work line WML are not limited. As shown in FIG. 1, the board-to-board work line WML of this embodiment is a plurality (five) board-to-board work of a printing machine WM1, a printing inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and an appearance inspection machine WM5. It is equipped with a machine WM. The plurality (five) anti-board working machines WM are arranged in the order of the printing machine WM1, the printing inspection machine WM2, the component mounting machine WM3, the reflow furnace WM4, and the appearance inspection machine WM5 from the upstream side. The substrate 90 is carried into the printing machine WM1 located at the head of the substrate work line WML. Then, the substrate 90 is conveyed to the downstream side by the substrate transfer device (not shown) of the substrate work line WML, and is carried out from the visual inspection machine WM5 located at the end of the substrate work line WML.

The printing machine WM1 prints solder on the substrate 90 at the mounting positions of the plurality of components. The solder printed on the substrate 90 is in the form of a paste and has a predetermined viscosity. The solder functions as a joining material for joining the substrate 90 and a plurality of components mounted on the substrate 90. The printing inspection machine WM2 inspects the printing state of the solder printed by the printing machine WM1. The component mounting machine WM3 mounts a plurality of components on the solder printed by the printing machine WM1. The component mounting machine WM3 may be one or a plurality. When a plurality of component mounting machines WM3 are provided, the plurality of component mounting machines WM3 can share and mount a plurality of parts.

The reflow furnace WM4 heats the substrate 90 on which a plurality of parts are mounted by the component mounting machine WM3, melts the solder, and performs soldering. The visual inspection machine WM5 inspects the mounting state of a plurality of parts mounted by the component mounting machine WM3. Specifically, the visual inspection machine WM5 recognizes the suitability of each of the plurality of parts mounted on the substrate 90, the mounting state of each of the plurality of parts (X-axis coordinates, Y-axis coordinates, and mounting angle), and the like. Send to the management device WMC. In this way, the board-to-board work line WML uses a plurality of (five) board-to-board work machines WM to sequentially convey the boards 90 and execute a production process including an inspection process to produce the board product 900. Can be done.

The board-to-board work line WML may include, for example, a functional inspection machine that is a board-to-board work machine WM. The function inspection machine inspects the function of the soldered substrate 90 by the reflow furnace WM4. Further, for the substrate work line WML, for example, the configuration of the substrate work line WML can be appropriately added according to the type of the substrate product 900 to be produced, and the configuration can be appropriately changed. The anti-board work line WML may also include, for example, an anti-board work machine WM such as a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device.

The plurality (five) anti-board work machines WM and the management device WMC constituting the anti-board work line WML are electrically connected by the communication unit LC. The communication unit LC may be wired or wireless. Further, the communication method may be various methods. In the present embodiment, a local area network (LAN) is configured by a plurality of (five) anti-board work machines WM and management device WMC. As a result, the plurality (five) anti-board working machines WM can communicate with each other via the communication unit LC. Further, the plurality (five) anti-board working machines WM can communicate with the management device WMC via the communication unit LC.

The management device WMC controls a plurality (five) anti-board work machines WM constituting the anti-board work line WML, and monitors the operating status of the anti-board work line WML. The management device WMC stores various control data for controlling a plurality (five) anti-board working machines WM. The management device WMC transmits control data to each of the plurality (five) anti-board working machines WM. Further, each of the plurality (five) anti-board working machines WM transmits the operation status and the production status to the management device WMC.

The management device WMC may be provided with various data servers such as an image storage server and a production information server (all of which are not shown). The image storage server can store various image data captured by the anti-board working machine WM. The production information server can store various production information regarding the production of the substrate 90. For example, the component data included in the production information includes information on the shape of each type of component, information on electrical characteristics, information on how to handle the component, and the like. Further, the inspection results by inspection machines such as the printing inspection machine WM2 and the appearance inspection machine WM5 are included in the production information.

1-2. Configuration example of the component mounting machine WM3 The component mounting machine WM3 mounts a plurality of components on the substrate 90. As shown in FIG. 2, the component mounting machine WM3 includes a base 10 and at least one work module 20 (two in the figure) that can be pulled out on the base 10. A guide rail (not shown) is provided on the upper surface of the base 10 along the pull-out direction (arrow Y direction) of the work module 20, and the lower portion of the work module 20 rolls along the guide rail of the base 10. Movable wheels (not shown) are provided. As a result, when the work module 20 is pulled out by the worker, the work module 20 is pulled out in the pull-out direction (arrow Y direction) with respect to the base 10.

Each of the plurality (two) work modules 20 includes a board transfer device 21, a component supply device 22, a component transfer device 23, a component camera 24, and a control device 25, which are assembled to the base 26. There is. The substrate transfer device 21 is composed of, for example, a belt conveyor or the like, and conveys the substrate 90 in the transfer direction (arrow X direction). The substrate 90 is a circuit board, and at least one of an electronic circuit and an electric circuit is formed. The board transfer device 21 carries the board 90 into the machine of the component mounting machine WM3, and positions the board 90 at a predetermined position in the machine. The board transfer device 21 carries out the board 90 to the outside of the component mounting machine WM3 after the mounting process of a plurality of components by the component mounting machine WM3 is completed.

The component supply device 22 supplies a plurality of components to be mounted on the substrate 90. The component supply device 22 includes a plurality of feeders 22a provided along the transport direction (arrow X direction) of the substrate 90. Each of the plurality of feeders 22a feeds a carrier tape (not shown) containing the plurality of parts at a pitch so that the parts can be collected at the supply position 22b located on the tip end side of the feeder 22a. Further, the component supply device 22 can supply an electronic component (for example, a lead component) having a relatively large size as compared with a chip component or the like in a state of being arranged on a tray.

The component transfer device 23 includes a head drive device 23a. The head drive device 23a includes a linear motion mechanism, and can move the moving table in the transport direction (arrow X direction) of the substrate 90 and the pull-out direction (arrow Y direction) of the work module 20. The mounting head 23b is detachably (replaceable) provided on the moving table by a clamp member (not shown). The mounting head 23b uses at least one holding member to collect and hold the parts supplied by the parts supply device 22, and mounts the parts on the board 90 positioned by the board transfer device 21. As the holding member, for example, a suction nozzle, a chuck, or the like can be used.

As the component camera 24, for example, a digital image pickup device having an image pickup element can be used. As the image pickup device, for example, an image sensor such as a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) can be used. The component camera 24 performs imaging based on a control signal transmitted from the control device 25. The image data captured by the component camera 24 is transmitted to the control device 25.

The component camera 24 is fixed to the base 26 of the component mounting machine WM3 so that the optical axis faces upward (vertically upward) in the Z-axis direction. The component camera 24 can take an image of the component held by the holding member from below. The work module 20 may also include a board camera. As the substrate camera, an image pickup device similar to that of the component camera 24 can be used. However, the substrate camera is provided on the moving table of the component transfer device 23 so that the optical axis faces downward (vertically downward) in the Z-axis direction. The board camera can take an image of the board 90 from above.

The control device 25 includes a known central processing unit and a storage device, and constitutes a control circuit (both are not shown). The central processing unit (CPU: Central Processing Unit) can perform various arithmetic processes. The storage device includes a first storage device and a second storage device. The first storage device is a volatile storage device (RAM: Random Access Memory), and the second storage device is a non-volatile storage device (ROM: Read Only Memory). Information, image data, and the like output from various sensors provided in the component mounting machine WM3 are input to the control device 25. The control device 25 sends a control signal to each device based on a control program, predetermined mounting conditions set in advance, and the like.

For example, the control device 25 causes the holding member to collect and hold the parts supplied by the parts supply device 22, and causes the parts camera 24 to take an image of the parts held by the holding member. The control device 25 processes the image captured by the component camera 24 to recognize the holding posture of the component. The control device 25 can recognize, for example, a portion characteristic of the appearance of the component by image processing and recognize the holding posture of the component.

The control device 25 moves the holding member toward the upper side of the planned mounting position preset by a control program or the like. Further, the control device 25 corrects the planned mounting position based on the positioning state of the substrate 90, the holding posture of the component, and the like, and sets the mounting position where the component is actually mounted. The planned mounting position and the mounting position include the rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate). The control device 25 corrects the target position (X-axis coordinate and Y-axis coordinate) and the rotation angle of the holding member according to the mounting position. The control device 25 lowers the holding member at the corrected rotation angle at the corrected target position, and mounts the component on the substrate 90. The control device 25 executes a mounting process for mounting a plurality of components on the substrate 90 by repeating the above pick-and-place cycle.

1-3. Negative pressure supply method FIG. 3 is a schematic view of the work module 20 provided on the base 10 as viewed from the transport direction (arrow X direction) of the substrate 90. As shown by the curve of the broken line, when the negative pressure is supplied to the work module 20 from the inside of the base 10, the pipe for supplying the negative pressure (the first described later) so that the work module 20 can be drawn out from the base 10. (Ii) The pipe length of the internal pipe 42b and the base pipe 51) tends to be long. Further, it is difficult to increase the flow path cross-sectional area of the pipe (corresponding to the pipe 51 in the base) due to the contained object (for example, the drive power source of the work module 20) accommodated in the base 10. As a result, the resistance in the piping increases, and the supply amount of the negative pressure supplied to the supply target VS0 inside the work module 20 may decrease during the production of the substrate product 900.

Therefore, in the present embodiment, the component mounting machine WM3, which is the anti-board working machine WM, is provided with an external negative pressure supply device 30. The external negative pressure supply device 30 is provided outside the base 10, and supplies a negative pressure to the supply object VS0 inside the work module 20 without going through the inside of the base 10. Specifically, the negative pressure supplied from the external negative pressure supply device 30 shown in FIG. 3 (hereinafter referred to as “external negative pressure”) is directly supplied to the supply target VS0 via the pipe 40. For the pipe 40, for example, a known air hose can be used. In this specification, for convenience of explanation, the pipe 40 provided outside the work module 20 is referred to as an external pipe 41, and the pipe 40 provided inside the work module 20 is referred to as an internal pipe 42.

As a result, the component mounting machine WM3 of the present embodiment has a pipe for supplying negative pressure (first internal pipe 42a and third inside, which will be described later), as compared with the case where negative pressure is supplied to the work module 20 from the inside of the base 10. It is easy to shorten the pipe length (corresponding to the pipe 42c), and it is easy to increase the flow path cross-sectional area of the pipe (for example, the external pipe 41). As a result, the component mounting machine WM3 of the present embodiment can suppress a decrease in the supply amount of the negative pressure supplied to the supply target VS0 inside the work module 20 at the time of production of the substrate product 900.

Further, as described above, the work module 20 is provided on the base 10 so as to be retractable. The work module 20 shown by the broken line in FIG. 3 schematically shows that the work module 20 can be pulled out with respect to the base 10. If there is not enough pipe length in the external pipe 41, it is difficult to pull out the work module 20. On the contrary, if the pipe length of the external pipe 41 has a margin, the pipe length of the external pipe 41 becomes long and the resistance in the pipe increases. Further, when the work module 20 is pulled out with respect to the base 10 (for example, during maintenance), the amount of negative pressure supplied to the supply target VS0 can be smaller than that during the production of the substrate product 900. There are many. Therefore, it is preferable that the component mounting machine WM3, which is a board working machine WM, further includes an internal negative pressure supply device 50, a pipe attachment / detachment portion 61, and a negative pressure changing device 70.

The internal negative pressure supply device 50 is provided inside the base 10, and supplies a negative pressure to the supply target VS0 via the internal pipe 42. Specifically, the negative pressure supplied from the internal negative pressure supply device 50 (hereinafter referred to as “internal negative pressure”) enters the inside of the work module 20 via the in-base pipe 51 provided inside the base 10. Be supplied. The internal negative pressure supplied to the inside of the work module 20 is supplied to the supply target VS0 via the internal pipe 42 (corresponding to the second internal pipe 42b and the third internal pipe 42c described later).

The pipe attachment / detachment portion 61 is provided on the back surface 60 of the work module 20, and the external pipe 41 and the internal pipe 42 are detachably connected to each other. The back surface 60 refers to a portion on the base end side in the pull-out direction (arrow Y direction) when the work module 20 is pulled out with respect to the base 10. The pipe attachment / detachment portion 61 may take various forms as long as the external pipe 41 and the internal pipe 42 can be detachably connected, but the pipe attachment / detachment portion 61 is preferably an air coupler. Further, the air coupler is preferably a one-touch type joint that is easier to attach / detach than a screw type, for example. Further, it is preferable that the air coupler is provided with a check valve. It is preferable that the check valve is provided on the side connected to the external pipe 41 and at least the side connected to the external pipe 41 among the sides connected to the internal pipe 42. The air coupler provided with the check valve can easily regulate the outflow of air when the external pipe 41 and the internal pipe 42 are separated from each other.

The negative pressure changing device 70 of the present embodiment is internal from the supply of external negative pressure when the work module 20 is pulled out with respect to the base 10 and the external pipe 41 and the internal pipe 42 are separated from each other in the pipe attachment / detachment portion 61. Switch to negative pressure supply. The negative pressure changing device 70 may take various forms as long as it can switch the supply state of the negative pressure, but it is preferable that the negative pressure changing device 70 includes a valve device 71.

The valve device 71 switches the selective supply to any one of the external negative pressure and the internal negative pressure VS0. The valve device 71 shown in FIG. 3 shows a pilot type solenoid valve (solenoid valve) having three ports and two positions. The first port 71a of the valve device 71 is connected to one end side of the first internal pipe 42a, and the other end side of the first internal pipe 42a is connected to the pipe attachment / detachment portion 61. Thereby, when the first internal pipe 42a and the external pipe 41 are connected in the pipe attachment / detachment portion 61, the external negative pressure can be supplied to the first internal pipe 42a. Further, the second port 71b of the valve device 71 is connected to one end side of the second internal pipe 42b, and the other end side of the second internal pipe 42b is connected to the base inner pipe 51. As a result, the internal negative pressure can be supplied to the second internal pipe 42b.

The third port 71c of the valve device 71 is connected to one end side of the third internal pipe 42c, and the other end side of the third internal pipe 42c is connected to the supply target VS0. In the valve device 71 shown in the figure, when the solenoid coil is not excited, the first port 71a and the third port 71c communicate with each other, and the second port 71b is sealed. In this case, the first internal pipe 42a and the third internal pipe 42c are communicated with each other so that the external negative pressure can be supplied to the supply target VS0, and the supply of the internal negative pressure is restricted. Further, in the valve device 71, when the solenoid coil is excited, the first port 71a is sealed and the second port 71b and the third port 71c communicate with each other. In this case, the second internal pipe 42b and the third internal pipe 42c are communicated with each other so that the internal negative pressure can be supplied to the supply target VS0, and the supply of the external negative pressure is restricted. As described above, since the negative pressure changing device 70 of the present embodiment includes the valve device 71, one of the external negative pressure and the internal negative pressure is supplied depending on the presence or absence of excitation of the solenoid coil. It can be selectively supplied to VS0, and switching control can be simplified.

The negative pressure changing device 70 is provided with, for example, a proximity sensor or the like on the upper surface of the base 10 facing the work module 20, and whether or not the work module 20 is pulled out with respect to the base 10 based on the detection result of the proximity sensor. (Presence / absence of connection between the external pipe 41 and the internal pipe 42) can be recognized. The negative pressure changing device 70 stops the excitation of the solenoid coil of the valve device 71 while recognizing that the external pipe 41 and the internal pipe 42 are connected. On the contrary, the negative pressure changing device 70 excites the solenoid coil of the valve device 71 while recognizing that the external pipe 41 and the internal pipe 42 are separated.

When the excitation state of the solenoid coil is switched after the work module 20 is pulled out from the base 10 (the external pipe 41 and the internal pipe 42 are separated), a negative pressure is supplied to the supply target VS0. There may be no period. Therefore, it is preferable that the negative pressure changing device 70 allows the work module 20 to be pulled out after the internal negative pressure can be supplied. The negative pressure changing device 70 monitors, for example, the presence or absence of operation of a maintenance button (not shown) provided on the work module 20 by an operator. When the maintenance button is operated by the operator, the negative pressure changing device 70 recognizes the possibility that the work module 20 is pulled out with respect to the base 10 and the external pipe 41 and the internal pipe 42 are separated from each other in the pipe attachment / detachment portion 61. do. At this time, the negative pressure changing device 70 drives the internal negative pressure supply device 50 so that the internal negative pressure can be supplied, and permits the work module 20 to be pulled out.

Further, the negative pressure changing device 70 supplies an external negative pressure when the work module 20 is pulled out with respect to the base 10 and the external pipe 41 and the internal pipe 42 may be separated from each other in the pipe attachment / detachment portion 61. It is also possible to switch from to the supply of internal negative pressure. Also in this case, the negative pressure changing device 70 can recognize the possibility that the external pipe 41 and the internal pipe 42 are separated depending on, for example, whether or not the maintenance button is operated by the operator. In the embodiment shown in FIG. 3, when the negative pressure changing device 70 recognizes the possibility that the external pipe 41 and the internal pipe 42 are separated, the negative pressure changing device 70 drives the internal negative pressure supply device 50 so that the internal negative pressure can be supplied. After that, the solenoid coil of the valve device 71 is excited. Then, the negative pressure changing device 70 can allow the work module 20 to be pulled out after switching from the supply of the external negative pressure to the supply of the internal negative pressure.

Further, the negative pressure changing device 70 has both external negative pressure and internal negative pressure when the work module 20 is pulled out with respect to the base 10 and the external pipe 41 and the internal pipe 42 are separated from each other in the pipe attachment / detachment portion 61. It is also possible to switch from the supply of internal negative pressure to the supply of internal negative pressure. Further, the negative pressure changing device 70 provides external negative pressure and internal when the work module 20 is pulled out with respect to the base 10 and the external pipe 41 and the internal pipe 42 may be separated from each other in the pipe attachment / detachment portion 61. It is also possible to switch from both negative pressure supplies to internal negative pressure supplies. In these cases, the valve device 71 described above is unnecessary.

In this way, the negative pressure changing device 70 may be separated from the external pipe 41 and the internal pipe 42 at the pipe attachment / detachment portion 61 when the work module 20 is pulled out from the base 10. At that time, the supply of at least the external negative pressure of the external negative pressure and the internal negative pressure is switched to the supply of the internal negative pressure. As a result, the component mounting machine WM3, which is a board-to-board working machine WM, can easily minimize the pipe length of the external pipe 41.

When a plurality of work modules 20 are provided on one base 10, each of the plurality of work modules 20 includes an internal pipe 42, a pipe attachment / detachment portion 61, and a negative pressure changing device 70 including a valve device 71. Is suitable. Further, FIG. 4 is a schematic view seen from the back surface 60 side of the work module 20, and shows an example of arrangement of the external pipe 41 and the base pipe 51. As shown in the figure, the internal negative pressure supply device 50 is provided inside one base 10, and the branch pipe branched from the branch portion 51a provided in the base inner pipe 51 is the internal pipe 42 of each work module 20 ( It is preferable that they are connected to the second internal pipe 42b), respectively. Further, it is preferable that the branch pipe branched from the external pipe 41 connected to one external negative pressure supply device 30 is connected to the pipe attachment / detachment portion 61 of each work module 20. Further, when the pipe attachment / detachment portion 61 does not have a check valve on the side connected to the external pipe 41, it is preferable to provide a check valve in the branch pipe branched from the external pipe 41.

Further, the external negative pressure supply device 30 and the internal negative pressure supply device 50 may take various forms as long as they can supply negative pressure. As the external negative pressure supply device 30 and the internal negative pressure supply device 50, for example, a known vacuum pump can be used. Further, the internal negative pressure supplied when the work module 20 is pulled out with respect to the base 10 and the external pipe 41 and the internal pipe 42 are separated from each other in the pipe attachment / detachment portion 61 is higher than that at the time of production of the board product 900. In many cases, the supply amount (for example, flow rate) per unit time is small. Therefore, it is preferable that the internal negative pressure supply device 50 has a smaller supply amount of negative pressure per unit time than the external negative pressure supply device 30. As a result, the component mounting machine WM3, which is the board work machine WM, secures the minimum negative pressure supply amount (for example, flow rate) required for maintenance, for example, and has a large internal negative pressure supply device 50. It is possible to suppress the change. The same can be said for the internal negative pressure supplied when the external pipe 41 and the internal pipe 42 may be separated from each other.

2. 2. Second Embodiment The configuration example of the anti-board work line WML and the configuration example of the component mounting machine WM3 described in the first embodiment can be similarly applied to this embodiment. The component mounting machine WM3 of the present embodiment has a different negative pressure supply method as compared with the first embodiment.

FIG. 5 is a schematic view of the work module 20 provided on the base 10 as viewed from the transport direction (arrow X direction) of the substrate 90. As shown in the figure, also in the present embodiment, the component mounting machine WM3, which is a board working machine WM, includes an external negative pressure supply device 30. The external negative pressure supply device 30 is provided outside the base 10, and supplies a negative pressure to the supply object VS0 inside the work module 20 without going through the inside of the base 10. Specifically, the external negative pressure, which is the negative pressure supplied from the external negative pressure supply device 30, is directly supplied to the supply target VS0 via the pipe 40. For the pipe 40, for example, a known air hose can be used, and for the external negative pressure supply device 30, for example, a known vacuum pump can be used. As a result, the component mounting machine WM3 of the present embodiment can obtain the same effect as that described above in the first embodiment.

Further, as described above, the work module 20 is provided on the base 10 so as to be retractable. Therefore, it is conceivable to expand and contract the pipe 40 according to the withdrawal of the work module 20. In this case, for the pipe 40, for example, a spiral hose formed in a spiral shape can be used. However, the spiral hose is difficult to increase the cross-sectional area of the flow path of the pipe 40. Therefore, as shown in FIG. 5, it is preferable that the component mounting machine WM3, which is the anti-board working machine WM, further includes a support member 80 installed in the middle of the external piping 41. The support member 80 makes the first external pipe 41a, which is a portion of the external pipe 41 on the side of the work module 20, rotatable about the horizontal axis 81 orthogonal to the pull-out direction (arrow Y direction) of the base 10. To support. As a result, the component mounting machine WM3 can continue to supply the external negative pressure to the supply target object VS0 when the work module 20 is pulled out with respect to the base 10. The horizontal axis 81 shown in FIG. 5 is an axis extending along a direction perpendicular to the paper surface.

The support member 80 may take various forms as long as it can rotatably support the first external pipe 41a about the horizontal axis 81, but the support member 80 is preferably a rotary joint. The rotary joint can easily support the first external pipe 41a so as to be rotatable as compared with, for example, a pulley device. The swivel joint is included in the rotary joint, and the same applies to the swivel joint as described above for the rotary joint.

Further, it is preferable that the component mounting machine WM3, which is a board-to-board working machine WM, further includes a pipe fixing portion 62. The pipe fixing portion 62 is provided on the back surface 60 of the work module 20 and fixes the internal pipe 42 and the external pipe 41. A known joint can be used for the pipe fixing portion 62. FIG. 6 shows an external pipe 41 (first external pipe) when the work module 20 (work module 20 on the front side of the paper) of one of the plurality (two) work modules 20 is pulled out with respect to the base 10. An example of the state of 41a) is shown. The figure is a side view seen from the transport direction (arrow X direction) of the substrate 90, and the withdrawal amount of the work module 20 with respect to the base 10 is the maximum withdrawal amount WA0 at the time of maintenance of the work module 20.

As shown in FIG. 6, the pipe length L11, the height H11, and the height H12 are the first external pipe 41a when the withdrawal amount of the work module 20 with respect to the base 10 is the maximum withdrawal amount WA0 at the time of maintenance of the work module 20. Is preferably set so as to be separated from the upper surface of the base 10 by a predetermined height H13 minutes. The pipe length L11 is the pipe length of the first external pipe 41a, and refers to the length of the air flow path in the first external pipe 41a. The height H11 is the height from the upper surface of the base 10 of the support member 80, and the height H12 is the height from the upper surface of the base 10 of the pipe fixing portion 62.

The predetermined height H13 may be set so that the first external pipe 41a is arranged in an arc shape (not linear) when the pull-out amount of the work module 20 with respect to the base 10 is the maximum pull-out amount WA0. As a result, the component mounting machine WM3 can suppress the generation of excessive tension in the first external pipe 41a when the work module 20 is pulled out. Further, since the first external pipe 41a is separated from the upper surface of the base 10 by a predetermined height H13 minutes, the component mounting machine WM3 is involved in the first external pipe 41a that occurs when the work module 20 is moved with respect to the base 10. Can be suppressed.

When a plurality of work modules 20 are provided on one base 10, it is preferable that each of the plurality of work modules 20 includes an internal pipe 42, a pipe fixing portion 62, and a support member 80. FIG. 7 is a schematic view seen from the back surface 60 side of the work module 20, and shows an example of arrangement of the external pipe 41. As shown in the figure, when the branch pipe branched from the external pipe 41 connected to one external negative pressure supply device 30 is connected to the pipe fixing portion 62 via the support member 80 of each work module 20. Suitable.

3. 3. Common matters The following matters can be applied to both the first embodiment and the second embodiment. It is preferable that the flow path cross-sectional area CS1 of the external pipe 41 is set larger than the flow path cross-sectional area CS2 of the internal pipe 42. As a result, the component mounting machine WM3, which is the board working machine WM, can reduce the resistance in the external pipe 41 and suppress the decrease in the supply amount of the negative pressure supplied to the supply target VS0. Further, the external pipe 41 may use a plurality of pipes. In this case, the flow path cross-sectional area CS1 of the external pipe 41 corresponds to the total value obtained by adding up the flow path cross-sectional areas of each of the plurality of pipes. In this specification, "negative pressure" means negative pressure air.

The supply object VS0 may be provided inside the work module 20 and may take various forms as long as it is supplied with a negative pressure. For example, the mounting head 23b described above is included in the supply target VS0. Further, the supplied object VS0 is preferably a substrate holding device that attracts and holds the back surface of the positioned substrate 90. The substrate holding device is provided, for example, in the substrate transport device 21 shown in FIG. 2, and includes a flat backup plate provided with a plurality of suction ports on the upper surface. The substrate holding device supplies a negative pressure in a state where the substrate 90 is arranged on the upper surface of the backup plate, and sucks and holds the back surface of the substrate 90 on the backup plate. For example, if an abnormality occurs during the production of the board product 900, the work module 20 may be pulled out for maintenance. In this case, since the production of the substrate product 900 is temporarily stopped, it is necessary to maintain the holding state of the substrate 90. It is useful to apply the matters described herein in such cases.

4. Others The board work machine WM is not limited to the component mounting machine WM3. As described above, the board working machine WM may be a printing machine WM1, a printing inspection machine WM2, a reflow furnace WM4, an appearance inspection machine WM5, or the like. Further, the above-mentioned substrate holding device can be used for the substrate transporting device provided therein.

5. An example of the effect of the embodiment According to the board working machine WM, an external negative pressure supply device 30 provided outside the base 10 is provided. Further, the external negative pressure supply device 30 supplies the negative pressure to the supply target VS0 inside the work module 20 without going through the inside of the base 10. As a result, the substrate working machine WM can easily shorten the pipe length of the pipe that supplies the negative pressure, as compared with the case where the negative pressure is supplied to the work module 20 from the inside of the base 10. It is easy to increase the road cross-sectional area. As a result, the board working machine WM can suppress a decrease in the supply amount of the negative pressure supplied to the supply target VS0 inside the work module 20 at the time of production of the board product 900.

10: Base, 20: Work module, 30: External negative pressure supply device,
40: Piping, 41: External piping, 41a: First external piping, 42: Internal piping,
50: Internal negative pressure supply device,
60: Back, 61: Piping attachment / detachment part, 62: Piping fixing part,
70: Negative pressure changing device, 71: Valve device,
80: Support member, 81: Horizontal axis, 90: Substrate,
CS1, CS2: Channel cross-sectional area, L11: Piping length,
H11, H12: height, H13: predetermined height, WA0: maximum withdrawal amount,
VS0: Supply target, WM: Anti-board work machine,
Arrow Y direction: Withdrawal direction.

Claims (6)

With the base
A work module that can be pulled out on the base and
An external negative pressure supply device provided outside the base and supplying a negative pressure to the supply object inside the work module without passing through the inside of the base.
An internal negative pressure supply device that supplies a negative pressure to the object to be supplied via an internal pipe that is a pipe provided inside the base and inside the work module.
A pipe attachment / detachment portion provided on the back surface of the work module and to which an external pipe, which is a pipe provided outside the work module, and the internal pipe are detachably connected to each other.
The external negative pressure supply device when the work module is pulled out from the base and the external pipe and the internal pipe are separated from each other at the pipe attachment / detachment portion, or when the possibility of separation occurs. Of the external negative pressure, which is the negative pressure supplied to the supply object from the above, and the internal negative pressure, which is the negative pressure supplied from the internal negative pressure supply device to the supply object, at least the external negative pressure. A negative pressure changing device that switches from supply to the supply of the internal negative pressure,
With anti-board working machine. The anti-board working machine according to claim 1 , wherein the negative pressure changing device includes a valve device for switching a selective supply to the supply target of any one of the external negative pressure and the internal negative pressure. The anti-board working machine according to claim 1 or 2 , wherein the pipe attachment / detachment portion is an air coupler. The anti-board working machine according to any one of claims 1 to 3 , wherein the internal negative pressure supply device has a smaller supply amount of negative pressure per unit time than the external negative pressure supply device. Claim 1 that the flow path cross-sectional area of an external pipe, which is a pipe provided outside the work module, is set larger than the flow path cross-sectional area of an internal pipe, which is a pipe provided inside the work module. The anti-board working machine according to any one of claims 4 . The anti-board working machine according to any one of claims 1 to 5 , wherein the supplied object is a board holding device that sucks and holds the back surface of the positioned board.

Images