JP7110776B2 - Vapor deposition mask, method for manufacturing vapor deposition mask, and method for manufacturing organic EL display device - Google Patents

Description

The present embodiment relates to a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing an organic EL display device.

Along with the increase in size of products using organic EL elements or the increase in substrate size, there is an increasing demand for larger size vapor deposition masks. Also, the size of the metal plate used to manufacture the vapor deposition mask made of metal is increasing. However, with the current metal processing technology, it is difficult to form slits in a large metal plate with high accuracy, and it is not possible to meet high-definition slits. In addition, if the vapor deposition mask is made of only metal, the mass increases as the size increases, and the total mass including the frame also increases, resulting in difficulty in handling.

Under such circumstances, in Patent Document 1, a metal layer provided with slits and a resin mask in which a plurality of rows of openings corresponding to the pattern to be formed by vapor deposition are positioned on the surface of the metal layer are laminated. is proposed.

Japanese Patent No. 5994952

By the way, a vapor deposition mask in which a metal layer and a resin mask are laminated is produced by forming square openings in the resin mask by laser processing. On the other hand, vapor deposition masks are periodically cleaned by ultrasonic cleaning during use, but there is a risk that cracks will form around the openings during this cleaning. In particular, such a phenomenon becomes conspicuous when the aperture ratio of the resin mask is increased and the intervals between the apertures are narrowed.

The present disclosure provides a vapor deposition mask capable of increasing the strength of a resin mask, a method for manufacturing the vapor deposition mask, and a method for manufacturing an organic EL display device.

The vapor deposition mask according to this embodiment includes a metal layer provided with a first opening, and a resin mask laminated on the metal layer and provided with a plurality of second openings corresponding to a pattern to be produced by vapor deposition. The shape of each second opening is a polygonal shape with rounded corners.

In the vapor deposition mask according to this embodiment, the corner portion of each second opening may have a radius of curvature of 1 μm or more and 6 μm or less.

In the vapor deposition mask according to this embodiment, the narrowest interval between the second openings adjacent to each other may be 3 μm or more and 27 μm or less.

In the vapor deposition mask according to this embodiment, each second opening may have a rectangular shape with rounded corners.

In the vapor deposition mask according to the present embodiment, each second opening may have an octagonal shape with rounded corners.

The vapor deposition mask according to this embodiment may further include a support laminated on the metal layer.

A method for manufacturing a vapor deposition mask according to the present embodiment includes steps of preparing a metal layer provided with a first opening and a resin layer laminated on the metal layer, and irradiating the resin layer with a laser. and forming a second opening corresponding to a pattern formed by vapor deposition in the resin layer, and in the step of forming the second opening, each second opening has rounded corners. It is formed in a polygonal shape.

In the method for manufacturing a vapor deposition mask according to the present embodiment, the corner portion of each second opening may have a radius of curvature of 1 μm or more and 6 μm or less.

In the method for manufacturing a vapor deposition mask according to this embodiment, the narrowest interval between the second openings adjacent to each other may be 3 μm or more and 27 μm or less.

In the method for manufacturing a vapor deposition mask according to the present embodiment, each second opening may have a rectangular shape with rounded corners.

In the method for manufacturing a vapor deposition mask according to the present embodiment, the shape of each second opening may be an octagonal shape with rounded corners.

The method for manufacturing a vapor deposition mask according to this embodiment may further include a step of fixing a support to the metal layer.

A method for manufacturing an organic EL display device according to the present embodiment is a method for manufacturing an organic EL display device, and includes a step of forming a vapor deposition pattern on a vapor deposition target using the vapor deposition mask.

According to this embodiment, the strength of the resin mask can be increased.

FIG. 1 is a plan view showing a vapor deposition mask according to the first embodiment. FIG. 2 is a cross-sectional view (cross-sectional view taken along the line II--II in FIG. 1) showing the vapor deposition mask according to the first embodiment. FIG. 3 is a partially enlarged plan view showing the vapor deposition mask according to the first embodiment. FIG. 4 is a partially enlarged plan view showing a modification of the second opening of the resin mask. 5(a) to 5(g) are cross-sectional views showing the manufacturing method of the vapor deposition mask according to the first embodiment. FIG. 6 is a schematic diagram showing a vapor deposition apparatus. FIG. 7 is a schematic diagram showing an organic EL display device manufactured using a vapor deposition mask. 8A to 8C are schematic diagrams showing a method of manufacturing an organic EL display device using a vapor deposition mask. FIG. 9 is a cross-sectional view showing a vapor deposition mask according to the second embodiment. 10(a) to 10(h) are cross-sectional views showing the manufacturing method of the vapor deposition mask according to the second embodiment. 11A to 11H are cross-sectional views showing a method of manufacturing a vapor deposition mask according to a modified example (modified example 1) of the second embodiment. 12A to 12H are cross-sectional views showing a method of manufacturing a vapor deposition mask according to a modified example (modified example 2) of the second embodiment. 13A to 13H are cross-sectional views showing a method of manufacturing a vapor deposition mask according to a modified example (modified example 3) of the second embodiment.

Each embodiment will be described below with reference to the drawings. Each figure shown below is shown typically. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. In addition, it is possible to modify and implement as appropriate without departing from the technical idea. In addition, in each figure shown below, the same code|symbol is attached|subjected to the same part and detailed description may be partially abbreviate|omitted. In addition, numerical values such as dimensions and material names of each member described in this specification are examples as an embodiment, and are not limited to these, and can be appropriately selected and used. In this specification, terms specifying shapes and geometrical conditions, such as parallel, orthogonal, and perpendicular terms, not only have strict meanings but also include substantially the same states.

(First embodiment)
First, a first embodiment will be described with reference to FIGS. 1 to 8. FIG. 1 to 8 are diagrams showing the first embodiment.

(Structure of vapor deposition mask)
The structure of the vapor deposition mask according to this embodiment will be described with reference to FIGS. 1 to 3. FIG. Note that the vapor deposition mask described here is not limited to the form described below, and corresponds to a pattern formed by vapor deposition at a position where the metal layer in which the first opening is formed overlaps the first opening. Any form may be used as long as it satisfies the condition that the resin mask in which the second opening is formed is laminated. For example, the first opening formed in the metal layer may be striped (not shown). Also, the first opening of the metal layer may be provided at a position that does not overlap the entire screen. This vapor deposition mask may be manufactured by a method for manufacturing a vapor deposition mask to be described later, or may be manufactured by another method.

As shown in FIGS. 1 and 2, the vapor deposition mask 10 according to the present embodiment is a vapor deposition mask for simultaneously forming vapor deposition patterns for a plurality of screens. This vapor deposition mask 10 comprises a metal layer (metal mask) 20 provided with first openings 21 and a resin layer laminated on the metal layer 20 and provided with a plurality of second openings 31 corresponding to the pattern to be vapor deposited. A mask 30 is provided. A support 40 is fixed to the metal layer 20 .

This vapor deposition mask 10 is used to simultaneously form vapor deposition patterns for a plurality of screens, and a single vapor deposition mask 10 can simultaneously form vapor deposition patterns corresponding to a plurality of products. Here, the "second opening" means a pattern to be produced using the vapor deposition mask 10. For example, when the vapor deposition mask is used to form an organic layer in an organic EL display, the second opening The shape of 31 is the shape of the organic layer. In addition, "one screen" is composed of a set of second openings 31 corresponding to one product. An aggregate of the necessary organic layers, that is, an aggregate of the second openings 31 that form the organic layers constitutes "one screen". Note that an area corresponding to one screen is also called an “effective portion”. In order to simultaneously form vapor deposition patterns for a plurality of screens of the vapor deposition mask 10, the "one screen" is arranged at predetermined intervals on the resin mask 30 for a plurality of screens. That is, the resin mask 30 is provided with the second openings 31 necessary for forming a plurality of screens.

The metal layer 20 is provided on one surface (the surface on the negative side in the Z direction) of the resin mask 30 . The metal layer 20 has a rectangular shape with each side extending in the X direction and the Y direction. A plurality of first openings 21 extending in the X direction and/or the Y direction are formed in the metal layer 20 . Note that the first opening 21 may be formed in an elongated slit shape. Also, the first opening 21 is provided at a position overlapping the resin mask 30 . In this case, a plurality of second openings 31 are arranged inside one first opening 21 in plan view. The arrangement of the first openings 21 is not particularly limited. A plurality of rows of the first openings 21 extending in the horizontal direction may be arranged in a plurality of rows in the vertical direction. Also, they may be arranged in only one row in the vertical direction or in the horizontal direction.

Each first opening 21 has a rectangular shape with sides extending in the X direction and the Y direction. Each first opening 21 is provided at a position overlapping at least one entire screen. The side length L1 of each first opening 21 may be, for example, equal to or longer than the side length of the effective portion of the mask (the area corresponding to one screen) and equal to or less than the side length of the effective portion plus 40 mm. The interval P1 between adjacent first openings 21 may be, for example, 1 mm or more and 50 mm or less.

The material of the metal layer 20 is not particularly limited, and conventionally known materials in the field of vapor deposition masks can be appropriately selected and used. Examples thereof include metal materials such as stainless steel, iron-nickel alloys, and aluminum alloys. . Among them, the Invar material, which is an iron-nickel alloy, can be suitably used because it is less deformed by heat.

The thickness T1 of the metal layer 20 is also not particularly limited, but in order to more effectively prevent the occurrence of shadows, it is preferably 100 μm or less, more preferably 50 μm or less, and 35 μm or less. is particularly preferred. By setting the thickness T1 of the metal layer 20 to be greater than 5 μm, the risk of breakage or deformation of the metal layer 20 can be reduced and handleability can be ensured. In addition, the shadow means that part of the vapor deposition material emitted from the vapor deposition source collides with the inner wall surface of the first opening 21 of the metal layer 20 and does not reach the vapor deposition object, resulting in the desired vapor deposition film thickness. This is a phenomenon in which an undeposited portion with a thinner film thickness is generated. In particular, as the shape of the second opening 31 becomes finer, the influence of the shadow becomes greater.

The resin mask 30 is provided on the other surface of the metal layer 20 (the surface on the positive side in the Z direction). The resin mask 30 has a rectangular shape with each side extending in the X direction and the Y direction. In this case, the resin mask 30 has the same outer shape as the metal layer 20, but the resin mask 30 and the metal layer 20 may have different outer shapes.

The resin mask 30 is provided with a second opening 31 necessary for forming a plurality of screens. The plurality of second openings 31 are provided at positions overlapping the first openings 21 of the metal layer 20 when the metal layer 20 and the resin mask 30 are laminated. Each second opening 31 has a rectangular shape, and more specifically, has a rectangular shape with rounded corners 32 and each side extending in the X direction and the Y direction. Details of the shape of the second opening 31 will be described later.

For the resin mask 30, a conventionally known resin material can be appropriately selected and used, and the material is not particularly limited. It is preferable to use a light-weight material with a small dimensional change rate and moisture absorption rate. Examples of such materials include polyimide resins, polyamide resins, polyamideimide resins, polyester resins, polyethylene resins, polyvinyl alcohol resins, polypropylene resins, polycarbonate resins, polystyrene resins, polyacrylonitrile resins, ethylene-vinyl acetate copolymer resins, ethylene- Examples include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, ionomer resin and the like. Among the materials exemplified above, a resin material having a coefficient of thermal expansion of 16 ppm/° C. or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material satisfying both conditions is particularly preferable. . By using a resin mask using this resin material, the dimensional accuracy of the second opening 31 can be improved, and the dimensional change rate and moisture absorption rate due to heat and time can be reduced.

Although the thickness T2 of the resin mask 30 is not particularly limited, it is preferably 3 μm or more and 25 μm or less. By setting the thickness T2 of the resin mask 30 within this range, it is possible to reduce the risk of defects such as pinholes and deformation, and to effectively prevent the occurrence of shadows. In particular, by setting the thickness T2 of the resin mask 30 to 3 μm or more and 10 μm or less, more preferably 4 μm or more and 8 μm or less, it is possible to more effectively prevent the influence of shadows when forming a high-definition pattern exceeding 400 ppi. can. Moreover, the resin mask 30 and the metal layer 20 may be joined directly or may be joined via an adhesive layer. When the resin mask 30 and the metal layer 20 are bonded via the adhesive layer, the total thickness of the resin mask 30 and the adhesive layer is preferably within the preferred thickness range described above.

A support (frame) 40 is provided on one surface of the metal layer 20 (the surface on the negative side in the Z direction). This support 40 supports the resin mask 30 and the metal layer 20 . The support 40 supports the resin mask 30 and the metal layer 20 while being pulled in the plane direction so that the resin mask 30 and the metal layer 20 are not bent. The support 40 is a substantially rectangular frame member and has a through hole 41 for exposing the second opening 31 provided in the resin mask 30 to the vapor deposition source side. That is, the plurality of second openings 31 are located inside the through holes 41 in plan view. The outer circumference of the support 40 is larger than the outer circumferences of the resin mask 30 and the metal layer 20 . The material of the support 40 is not particularly limited, but a highly rigid metal material such as SUS, Invar, or ceramic material can be used. Among them, the metal support 40 is preferable because it can be easily welded to the metal layer 20 and is less affected by deformation or the like.

The thickness T3 of the support 40 is also not particularly limited, but is preferably about 10 mm or more and 30 mm or less from the viewpoint of rigidity and the like. The width W1 between the outer peripheral end surface of the through hole 41 of the support 40 and the outer peripheral end surface of the support 40 is not particularly limited as long as it is a width that allows the support 40 and the metal layer 20 to be fixed. A width of about 10 mm or more and 250 mm or less can be exemplified.

It is optional whether or not the support 40 is provided, and the support 40 does not necessarily have to be provided. In the present embodiment, the deposition mask 10 may include the support 40 (deposition mask with support) or may not include the support 40 .

Next, the configuration of the second opening 31 of the resin mask 30 will be described with reference to FIG.

As shown in FIG. 3 , a plurality of second openings 31 are arranged in the resin mask 30 . Each second opening 31 has a rectangular shape with rounded corners 32 in plan view. That is, each second opening 31 has a pair of long sides (sides parallel to the Y direction) 33a that are parallel to each other, a pair of short sides (sides that are parallel to the X direction) 33b that are parallel to each other, and each long side 33a. and four corners 32 connecting each short side 33b.

In this case, each corner portion 32 is formed in a substantially arc shape in a plan view, and has a radius of curvature R1 of 1 μm or more and 6 μm or less. By setting the curvature radius R1 to 1 μm or more, as described later, the strength of the resin mask 30 is increased, and when the vapor deposition mask 10 is ultrasonically cleaned, cracks are prevented from occurring around the second opening 31. be able to. Further, by setting the radius of curvature R1 to 6 μm or less, it is possible to secure the area of the second opening 31 and suppress the decrease in the opening ratio of the resin mask 30 .

The length (length in the Y direction) L2 of each second opening 31 in the direction of the long side 33a may be, for example, 10 μm or more and 120 μm or less. Specifically, the length L2 may be, for example, 100 μm or more and 120 μm or less for low resolution (200 ppi), and may be, for example, 10 μm or more and 18 μm or less for high resolution (1200 ppi). The length (length in the X direction) L3 of each second opening 31 in the direction of the short side 33b may be, for example, 7 μm or more and 64 μm or less. Specifically, the length L3 may be, for example, 42 μm or more and 64 μm or less for low resolution (200 ppi), and may be, for example, 7 μm or more and 11 μm or less for high resolution (1200 ppi). Also, the pitch (distance between the centers of the second openings 31 in the Y direction) P4 in the direction of the long side 33a of each of the second openings 31 may be, for example, 21 μm or more and 127 μm or less. Specifically, the pitch P4 may be, for example, 127 μm for low resolution (200 ppi), and may be, for example, 21 μm for high resolution (1200 ppi). A pitch (distance between the centers of the second openings 31 in the X direction) P2 in the direction of the short side 33b of each second opening 31 may be, for example, 21 μm or more and 127 μm or less. Specifically, the pitch P2 may be, for example, 127 μm for low resolution (200 ppi), and may be, for example, 21 μm for high resolution (1200 ppi).

The multiple second openings 31 are aligned in the X direction and the Y direction and have the same shape. A first rib 34 and a second rib 35 are formed between adjacent second openings 31 . Of these, the first ribs 34 are formed between the second openings 31 adjacent in the X direction and extend parallel to the Y direction. The second ribs 35 are formed between the second openings 31 adjacent in the Y direction and extend parallel to the X direction. The distance between adjacent second openings 31 is longer in the Y direction than in the X direction, that is, the width W2 of the first rib 34 is wider than the width W3 of the second rib 35. The width W2 of the first rib 34 is 11 μm or more and 85 μm or less. Specifically, the width W2 may be, for example, 64 μm or more and 85 μm or less for low resolution (200 ppi), and may be, for example, 11 μm or more and 14 μm or less for high resolution (1200 ppi). The width W3 of the second rib 35 is 3 μm or more and 27 μm or less. Specifically, the width W3 may be, for example, 7 μm or more and 27 μm or less for low resolution (200 ppi), and may be, for example, 3 μm or more and 11 μm or less for high resolution (1200 ppi). The width W2 of the first rib 34 and the width W3 of the second rib 35 correspond to the narrowest distance between the adjacent second openings 31, respectively. By setting the width W2 of the first rib 34 to 11 μm or more, another organic layer (for example, an organic layer of another color) can be arranged in the region corresponding to the first rib 34 . By setting the width W2 of the first rib 34 to 85 μm or less, it is possible to suppress a decrease in the aperture ratio of the resin mask 30 . In addition, by setting the width W3 of the second rib 35 to 3 μm or more, the strength of the resin mask 30 is increased, as will be described later. It is possible to suppress the phenomenon of entering. Further, by setting the width W3 of the second rib 35 to 27 μm or less, it is possible to suppress a decrease in the aperture ratio of the resin mask 30 .

A modification of the second opening of the resin mask 30 will be described with reference to FIG. FIG. 4 shows a modification of the second opening of the resin mask 30. As shown in FIG.

As shown in FIG. 4, the resin mask 30 has a plurality of second openings 31A arranged therein. Each second opening 31A has an octagonal shape with rounded corners 32A. In this case, the sides of the octagon forming each of the second openings 31A have three different lengths. Each second opening 31A has two first sides 33Ac, two second sides 33Ad, four third sides 33Ae, and eight corners 32A. Of these, the first side 33Ac and the second side 33Ad are arranged obliquely with respect to the X direction and the Y direction, respectively, and the third side 33Ae is arranged parallel to the X direction or the Y direction, respectively. The first side 33Ac is longer than the second side 33Ad, and the second side 33Ad is longer than the third side 33Ae. Further, each corner 32A is rounded and formed in a substantially arc shape, and the radius of curvature R2 is 1 μm or more and 6 μm or less. By setting the radius of curvature R2 to 1 μm or more, the strength of the resin mask 30 can be increased, and the phenomenon that cracks occur around the second opening 31A when the vapor deposition mask 10 is ultrasonically cleaned can be suppressed. Also, by setting the radius of curvature R2 to 6 μm or less, it is possible to suppress a decrease in the aperture ratio of the resin mask 30 . The width (maximum length of the second opening 31A in the X direction or the Y direction) W4 of each second opening 31A may be, for example, 21 μm or more and 127 μm or less. Also, the pitch (the distance between the centers of the second openings 31A in the X direction or the Y direction) P3 of the second openings 31A may be, for example, 21 μm or more and 127 μm or less.

In FIG. 4, the plurality of second openings 31A are arranged in a square grid pattern in the X and Y directions and have the same shape. A first rib 34A and a second rib 35A are formed between adjacent second openings 31A. Among these, the first rib 34A is formed between the second openings 31A adjacent in the X direction. The second ribs 35A are formed between the second openings 31A adjacent in the Y direction. The width W5 of the first ribs 34A is substantially the same as the width W6 of the second ribs 35A, specifically, 7 μm or more and 12 μm or less. In this case, the width W5 of the first rib 34A and the width W6 of the second rib 35A correspond to the narrowest distance between the adjacent second openings 31A. Since the corners 32A of the octagonal second opening 31A are rounded in this way, it is possible to suppress the phenomenon that cracks are formed around the second opening 31A when the vapor deposition mask 10 is ultrasonically cleaned. can be done. Therefore, the width W5 of the first rib 34A and the width W6 of the second rib 35A can be shortened, and the second openings 31A can be made closer to each other. Thereby, the aperture ratio of the resin mask 30 can be improved.

(Manufacturing method of vapor deposition mask)
Next, a method for manufacturing a vapor deposition mask according to this embodiment will be described with reference to FIGS. 5(a) to 5(g). FIGS. 5(a) to 5(g) are process diagrams for explaining the manufacturing method of the vapor deposition mask according to the present embodiment.

First, as shown in FIG. 5A, a metal plate 20A is prepared. 20 A of metal plates are for producing the metal layer 20 of the vapor deposition mask 10 mentioned above. The metal plate 20A may be, for example, a strip-shaped metal material with a width of 250 mm or more and 1000 mm or less. As the material of the metal plate 20A, for example, an invar material, which is an iron-nickel alloy, can be suitably used. The metal plate 20A is appropriately cleaned and surface-treated.

Next, as shown in FIG. 5B, a resin layer 30A is formed on one surface of the metal plate 20A. 30 A of this resin layer is for producing the resin mask 30 of the vapor deposition mask 10 mentioned above. Specifically, a resin solution such as polyimide varnish is applied to substantially the entire surface of the metal plate 20A, and the resin layer 30A is obtained by heating and drying the solution. The thickness of the coating of the resin solution may be, for example, 4 μm or more and 8 μm or less.

Subsequently, as shown in FIG. 5C, the other surface of the metal plate 20A (the surface on which the resin layer 30A is not provided) is coated with a masking member such as a resist material, and a predetermined portion is exposed. , to form a resist pattern 51 that leaves a position where the first opening 21 will be formed. As a resist material used as a masking member, a material having good processability and desired resolution is preferable.

Next, as shown in FIG. 5D, the metal plate 20A is etched by an etching method using the resist pattern 51 as an anti-etching mask. Thereby, a metal layer 20 provided with a plurality of first openings 21 extending in the vertical direction and/or the horizontal direction is obtained.

Next, as shown in FIG. 5E, the resist pattern 51 is removed by washing. After removing the resist pattern 51, the resin layer 30A and the metal layer 20 may be cut to a size corresponding to the support 40. FIG.

Thus, a laminate (intermediate body) 50 having the metal layer 20 provided with the first openings 21 and the resin layer 30A laminated on the metal layer 20 is obtained. The steps shown in FIGS. 5A to 5E are steps of preparing a laminate 50 having a metal layer 20 provided with a first opening 21 and a resin layer 30A laminated on the metal layer 20. .

In the above description, a case where a resist material is used as a masking member has been described as an example, but instead of coating a resist material, a dry film resist may be laminated and similar patterning may be performed. It should be noted that the metal layer 20 of the laminate 50 is not limited to those formed by the method exemplified above, and commercially available products can also be used. Also, instead of forming the first opening 21 by etching, the first opening 21 can be formed by irradiating laser light.

Also, the method of forming the metal layer 20 and the resin layer 30A that constitute the laminate 50 is not particularly limited. The resin layer 30A may be formed by a coating method or the like as described above, or may be prepared in advance. In the latter case, for example, a film-like resin layer 30A may be attached to the metal plate 20A. The resin layer 30A is a concept including a resin film and a resin sheet. Also, the hardness of the resin layer 30A is not limited, and it may be a hard plate or a soft plate. Moreover, the metal layer 20 and the resin layer 30A may be bonded together using various adhesives, or the resin layer 30A having self-adhesiveness may be used. The size of the metal layer 20 and the resin layer 30A may be the same, or the size of the resin layer 30A may be smaller than that of the metal layer 20. FIG.

Next, as shown in FIG. 5( f ), the support 40 is prepared and the metal layer 20 of the laminate 50 is fixed to the support 40 . At this time, the metal layer 20 of the laminate 50 may be welded to the support 40 in a stretched state. In the present embodiment, this step is an optional step, but when the deposition mask 10 is used in a normal deposition apparatus, the support 40 is often fixed, so this step is performed at this timing. It is preferable to use On the other hand, although not shown, a fixing process may be performed to fix the metal plate 20A in the previous stage to be the laminate 50 to the support 40, and then the resin layer 30A may be provided on the metal plate 20A. The method of fixing the metal layer 20 to the support 40 is not particularly limited. For example, when the support 40 contains metal, a conventionally known process method such as spot welding may be appropriately adopted.

Next, as shown in FIG. 5(g), the resin layer 30A of the laminate 50 is irradiated with a laser (see the arrow in FIG. 5(g)) from the metal layer 20 side to vapor-deposit the resin layer 30A. A second opening 31 corresponding to the pattern is formed. As this laser, for example, a KrF excimer laser with a wavelength of 248 nm or a YAG laser with a wavelength of 355 nm can be used. During this time, a protective film is attached to the surface of the resin layer 30</b>A opposite to the metal layer 20 , and in this state, a laser is irradiated from the metal layer 20 side to form the second opening 31 . In this case, a laser mask (not shown) corresponding to the pattern to be vapor-deposited is used, a condenser lens is placed between this laser mask and the laminate 50, and laser processing is performed using a so-called reduction projection optical system. A second opening 31 may be formed.

When forming the second openings 31 in the resin layer 30A in this way, each second opening 31 is formed in a polygonal shape with rounded corners 32 . That is, by making the shape of the opening of the laser mask through which the laser passes correspond to the shape of the second opening 31 or by appropriately adjusting the intensity of the laser, the corners 32 of the second opening 31 are rounded. can be shaped like

Thus, the vapor deposition mask 10 shown in FIGS. 1 and 2 is obtained.

(Structure of Vapor Deposition Device)
Next, a vapor deposition apparatus for vapor-depositing a vapor deposition material on an object to be vapor-deposited using the above-described vapor deposition mask 10 will be described with reference to FIG.

As shown in FIG. 6, the vapor deposition device 80 has a vapor deposition source (for example, a crucible 81), a heater 82, and a vapor deposition mask 10 arranged therein. The vapor deposition device 80 further has exhaust means (not shown) for creating a vacuum atmosphere inside the vapor deposition device 80 . Crucible 81 contains deposition material 92, such as an organic light emitting material. A heater 82 heats the crucible 81 to evaporate the deposition material 92 under a vacuum atmosphere. The vapor deposition mask 10 is arranged so as to face the crucible 81 . That is, the vapor deposition mask 10 is arranged in the vapor deposition apparatus 80 so that the resin mask 30 faces the vapor deposition substrate (for example, an organic EL substrate) 91 which is the vapor deposition object to which the vapor deposition material 92 is to be deposited. In addition, the vapor deposition device 80 may have a magnet 83 arranged on the surface of the vapor-deposited substrate 91 opposite to the resin mask 30 . By providing this magnet 83 , the vapor deposition mask 10 can be attracted to the magnet 83 side by the magnetic force, and the vapor deposition mask 10 can be brought into close contact with the vapor-deposited substrate 91 .

FIG. 7 is a cross-sectional view showing an organic EL display device 90 manufactured using the deposition apparatus 80 shown in FIG. As shown in FIG. 7, an organic EL display device 90 includes a vapor-deposited substrate (for example, an organic EL substrate) 91 and pixels containing a vapor deposition material 92 provided in a pattern on the vapor-deposited substrate 91. .

When it is desired to perform color display using a plurality of colors, vapor deposition apparatuses 80 each having a vapor deposition mask 10 corresponding to each color are prepared, and the substrates 91 to be vapor-deposited are loaded into each vapor deposition apparatus 80 in order. As a result, for example, the organic light-emitting material for red, the organic light-emitting material for green, and the organic light-emitting material for blue can be sequentially deposited on the deposition target substrate 91 .

(Manufacturing method of organic EL display device)
Next, a method for manufacturing the organic EL display device according to this embodiment will be described with reference to FIGS. The manufacturing method of the organic EL display device according to the present embodiment forms a vapor deposition pattern by vapor-depositing the vapor-depositing material 92 on the vapor-deposited substrate 91, which is the object to be vapor-deposited, by the vapor deposition method using the vapor deposition mask 10 described above. .

First, as shown in FIG. 8A, a vapor deposition apparatus 80 including the vapor deposition mask 10 shown in FIGS. 1 and 2, the crucible 81 containing the vapor deposition material 92, and the heater 82 is prepared.

Next, as shown in FIG. 8B, a substrate 91 to be vapor-deposited is placed on the resin mask 30 of the vapor deposition mask 10 . At this time, for example, alignment marks (not shown) of the deposition target substrate 91 and alignment marks (not shown) of the deposition mask 10 are directly observed, and the deposition target substrate 91 is positioned so that the alignment marks overlap each other. 91 is placed on the vapor deposition mask 10 .

Next, a deposition material 92 is deposited on the deposition target substrate 91 placed on the resin mask 30 of the deposition mask 10 . At this time, for example, as shown in FIG. By providing the magnet 83 in this manner, the vapor deposition mask 10 can be drawn toward the magnet 83 by the magnetic force, and the resin mask 30 can be brought into close contact with the vapor deposition target substrate 91 . Next, heater 82 heats crucible 81 to evaporate deposition material 92 . Vapor deposition material 92 evaporated from crucible 81 and reaches deposition mask 10 passes through first opening 21 of metal layer 20 and second opening 31 of resin mask 30 and adheres to substrate 91 to be vapor-deposited.

In this manner, the deposition material 92 is deposited on the deposition target substrate 91 in a desired pattern corresponding to the positions of the second openings 31 of the resin mask 30 . That is, the deposition material 92 is formed in a shape corresponding to the plurality of second openings 31 of the resin mask 30, specifically, in a plurality of polygonal patterns with rounded corners. In this manner, an organic EL display device 90 including a substrate to be vapor-deposited (organic EL substrate) 91 and pixels containing the vapor deposition material 92 provided in a pattern is obtained (see FIG. 7).

By the way, when the organic EL display device 90 is repeatedly manufactured by using the vapor deposition mask 10 in this manner, the vapor deposition mask 10 is adhered with an organic substance or the like. In order to remove such organic matter and the like, the vapor deposition mask 10 is immersed in a cleaning liquid after use and cleaned by ultrasonic cleaning. On the other hand, when the vapor deposition mask 10 is cleaned by ultrasonic cleaning, there is a risk that a crack will form around the second opening 31 of the resin mask 30 . That is, since the first rib 34 and the second rib 35 (see FIG. 3) located around the second opening 31 of the resin mask 30 vibrate due to the ultrasonic cleaning, the first rib 34 and the second rib 35 (see FIG. 3) vibrate. It is conceivable that the corner of the second opening 31 where the two ribs 35 intersect will be cracked. Such a phenomenon becomes conspicuous particularly when the opening ratio of the resin mask 30 is increased and the interval between the second openings 31 is narrowed.

In contrast, according to the present embodiment, each second opening 31 of the resin mask 30 has a polygonal shape with rounded corners 32 . As a result, stress concentration on the corners 32 of the second opening 31 can be alleviated during ultrasonic cleaning, and cracks can be prevented from occurring in the corners 32 of the second opening 31 . In particular, by setting the radius of curvature of the corners 32 of the second opening 31 to 1 μm or more and 6 μm, it is possible to increase the strength of the resin mask 30 while suppressing a decrease in the aperture ratio of the resin mask 30 .

Further, according to the present embodiment, the narrowest interval between the second openings 31 adjacent to each other is 3 μm or more and 27 μm or less, so that the strength of the resin mask 30 is increased and the opening ratio of the resin mask 30 is increased. It can be compatible with raising.

(Example)
Next, a specific example of this embodiment will be described.

(Example 1)
A deposition mask 10 (Example 1) including a polyimide resin mask 30 having the shape shown in FIG. 3 was produced. In this case, the length (length in the Y direction) L2 in the long side 33a direction of the second opening 31 of the resin mask 30 is set to 57 μm, and the length in the short side 33b direction (length in the X direction) of the second opening 31 is 57 μm. ) L3 was set to 30 μm. Also, the radius of curvature R1 of each corner 32 of the second opening 31 was set to 2 μm. Furthermore, the width W2 of the first rib 34 was set to 35 μm, and the width W5 of the second rib 35 was set to 7 μm. Note that the thickness T2 of the resin mask 30 was set to 5 μm.

(Example 2)
A deposition mask 10 (Example 2) was produced in the same manner as in Example 1 above, except that the radius of curvature R1 of each corner 32 of the second opening 31 was set to 4 μm.

(Example 3)
A deposition mask 10 (Example 3) was produced in the same manner as in Example 1 above, except that the curvature radius R1 of each corner 32 of the second opening 31 was set to 6 μm.

(Comparative example 1)
A deposition mask (Comparative Example 1) was produced in the same manner as in Example 1 above, except that the corners 32 of the second opening 31 were not rounded.

Next, 10 vapor deposition masks for each of Examples 1 to 3 and Comparative Example 1 were prepared. Next, the vapor deposition masks of Examples 1-3 and Comparative Example 1 were each subjected to ultrasonic cleaning. After 5 minutes and 10 minutes from the start of cleaning, the number of vapor deposition masks in which cracks occurred in the corners 32 of the second openings 31 of the resin masks 30 was measured. The results are shown below.

As the ultrasonic cleaning device, an oscillator W-118TUS manufactured by Honda Electronics Co., Ltd. was used, and the output was 600 W and the frequency was 45 kHz. N-methyl-2-pyrrolidone (NMP) was used as a cleaning liquid for ultrasonic cleaning.

As is clear from the above results, the vapor deposition mask 10 of Example 1-3 suppresses the phenomenon of cracking at the corner 32 of the second opening 31 of the resin mask 30 as compared with the vapor deposition mask of Comparative Example 1. I was able to

(Second embodiment)
Next, a second embodiment will be described with reference to FIGS. 9 to 13. FIG. 9 to 13 are diagrams showing the second embodiment. The second embodiment shown in FIGS. 9 to 13 differs from the above-described first embodiment in that the metal layer 20 is formed by electroplating. In FIGS. 9 to 13, the same reference numerals are assigned to the same parts as those in FIGS. 1 to 8, and detailed description thereof will be omitted. Note that the following description will focus mainly on the differences from the first embodiment.

(Structure of vapor deposition mask)
The configuration of the vapor deposition mask according to this embodiment will be described with reference to FIG.

As shown in FIG. 9, a vapor deposition mask 10A according to the present embodiment includes a metal layer (metal mask) 20B provided with a plurality of first openings 21B, and a metal layer 20B laminated on the metal layer 20B to correspond to a pattern to be manufactured by vapor deposition. and a resin mask 30 having a plurality of second openings 31 formed thereon. A support (open mask) 40A is fixed to the metal layer 20B.

The metal layer 20B is provided on one surface (the surface on the negative side in the Z direction) of the resin mask 30 . A plurality of first openings 21B extending in the vertical direction and/or the horizontal direction are formed in the metal layer 20B. In the present embodiment, metal layer 20B is formed by electrolytic plating. The material of the metal layer 20B is not particularly limited, and examples thereof include metal materials such as nickel and nickel alloys. The thickness of the metal layer 20B is also not particularly limited, but may be 5 μm or more and 50 μm or less.

The resin mask 30 is provided on the other surface (surface on the positive side in the Z direction) of the metal layer 20B. The resin mask 30 is provided with a second opening 31 necessary for forming a plurality of screens. In this case, each of the first openings 21B of the metal layer 20B is provided with one of the second openings 31 overlapping each other in plan view. However, not limited to this, a plurality of second openings 31 may be provided so as to overlap each first opening 21B in plan view. In this case, each second opening 31 has a polygonal shape with rounded corners. Note that the shape of the second opening 31 is substantially the same as in the first embodiment, so detailed description is omitted here.

A support (open mask) 40A is provided on one surface (the surface on the negative side in the Z direction) of the metal layer 20B. A plurality of through holes 41A are formed in the support 40A, and each through hole 41A is formed to have a size corresponding to one screen. Also, in the through hole 41A, the plurality of first openings 21B and the plurality of second openings 31 are arranged so as to overlap each other in plan view.

The support 40A is bonded to and supports the metal layer 20B in a non-tensioned or tensioned state. The support 40A is a sheet-like member having a thickness of 50 μm or more and 300 μm or less, and may be made of a metal material such as Invar or an Invar alloy. Although not shown, a support (frame) 40 similar to that in the first embodiment may be further provided on one surface of the support 40A (surface on the negative side in the Z direction). As the support 40A, for example, a thick metal plate having a thickness of 1 mm or more may be shaved and used. For example, a metal plate having a thickness of about 10 mm may be partially cut to produce the support 40A having regions with different thicknesses in the plane.

(Manufacturing method of vapor deposition mask)
Next, a method for manufacturing a vapor deposition mask according to this embodiment will be described with reference to FIGS. 10A to 10H are process diagrams for explaining the method of manufacturing the vapor deposition mask according to this embodiment.

First, as shown in FIG. 10A, a glass substrate 55 is prepared. The thickness of the glass substrate 55 can be, for example, 0.1 mm or more and 2.8 mm or less.

Next, as shown in FIG. 10B, a resin layer 30A is formed on the glass substrate 55. Next, as shown in FIG. This resin layer 30A is for producing the resin mask 30 of the vapor deposition mask 10A mentioned above. Specifically, a resin solution such as polyimide varnish is applied to substantially the entire surface of the glass substrate 55, and the resin layer 30A is obtained by heating and drying it. The thickness of the coating of the resin solution can be, for example, 5 μm or more and 30 μm or less.

Subsequently, as shown in FIG. 10C, a seed layer (not shown) made of metal such as nickel is formed on the resin layer 30A, and then a photosensitive resist is applied on the seed layer and dried. Subsequently, the photosensitive resist is exposed through a photomask and developed to form a resist layer 56 having a pattern corresponding to the first opening 21B.

Next, as shown in FIG. 10(d), electrolytic plating is applied to the glass substrate 55 and the resin layer 30A. As a result, a metal such as nickel is deposited on the seed layer formed on the resin layer 30A where the resist layer 56 does not exist, thereby forming the metal layer 20B.

Subsequently, as shown in FIG. 10E, the resist layer 56 and the seed layer are sequentially removed to form the metal layer 20B provided with the first openings 21B on the resin layer 30A. In this manner, a laminate 50A having the metal layer 20B provided with the first openings 21B, the resin layer 30A laminated on the metal layer 20B, and the glass substrate 55 laminated on the resin layer 30A is obtained. be done.

Next, as shown in FIG. 10(f), the resin layer 30A of the laminated body 50A is irradiated with a laser from the metal layer 20B side (see the arrow in FIG. 10(f)) to correspond to the pattern to be vapor-deposited. A second opening 31 is formed. As a result, the resin mask 30 provided with the second openings 31 is obtained. At this time, each second opening 31 is formed in a polygonal shape with rounded corners.

Next, as shown in FIG. 10(g), the metal layer 20B of the laminate 50A is fixed to the support 40A. At this time, the metal layer 20B of the laminate 50A is welded to the support 40A without tension. A method for fixing the metal layer 20B to the support 40A is not particularly limited. For example, when the support 40A contains metal, a conventionally known process method such as spot welding may be appropriately adopted.

After that, as shown in FIG. 10(h), the glass substrate 55 is removed from the resin layer 30A. Specifically, a laser is irradiated from the glass substrate 55 side of the laminate 50A, thereby separating the glass substrate 55 from the resin layer 30A.

Thus, the vapor deposition mask 10A shown in FIG. 9 is obtained.

(Modification 1 of the manufacturing method of the vapor deposition mask)
Next, a modified example (modified example 1) of the manufacturing method of the vapor deposition mask according to the present embodiment will be described with reference to FIGS.

First, in the same manner as the steps shown in FIGS. 10A to 10E described above, the metal layer 20B provided with the first opening 21B, the resin layer 30A laminated on the metal layer 20B, and the resin layer 30A A laminated body 50A having a laminated glass substrate 55 is prepared (FIGS. 11(a) to 11(e)).

Next, as shown in FIG. 11(f), the metal layer 20B of the laminate 50A is fixed to the support 40A. At this time, the metal layer 20B of the laminate 50A is welded to the support 40A without tension.

Next, as shown in FIG. 11(g), the resin layer 30A of the laminated body 50A is irradiated with a laser from the metal layer 20B side (see the arrow in FIG. 11(g)) to correspond to the pattern to be deposited. A second opening 31 is formed. As a result, the resin mask 30 provided with the second openings 31 is obtained. At this time, each second opening 31 is formed in a polygonal shape with rounded corners.

After that, as shown in FIG. 11(h), the glass substrate 55 is removed from the resin layer 30A. Specifically, a laser is irradiated from the glass substrate 55 side of the laminate 50A, thereby separating the glass substrate 55 from the resin layer 30A.

Thus, the vapor deposition mask 10A shown in FIG. 9 is obtained.

(Modification 2 of the manufacturing method of the vapor deposition mask)
Next, a modified example (modified example 2) of the manufacturing method of the vapor deposition mask according to the present embodiment will be described with reference to FIGS.

First, in the same manner as the steps shown in FIGS. 10A to 10E described above, the metal layer 20B provided with the first opening 21B, the resin layer 30A laminated on the metal layer 20B, and the resin layer 30A 12A to 12E).

Next, as shown in FIG. 12(f), the metal layer 20B of the laminate 50A is fixed to the support 40A. At this time, the metal layer 20B of the laminate 50A is welded to the support 40A without tension. A method for fixing the metal layer 20B to the support 40A is not particularly limited. For example, when the support 40A contains metal, a conventionally known process method such as spot welding may be appropriately adopted.

Next, as shown in FIG. 12(g), the glass substrate 55 is removed from the resin layer 30A. Specifically, a laser is irradiated from the glass substrate 55 side of the laminated body 50A, whereby the glass substrate 55 is separated from the resin layer 30A.

After that, as shown in FIG. 12(h), the resin layer 30A of the laminated body 50A is irradiated with a laser from the metal layer 20B side (see the arrow in FIG. 12(h)) to correspond to the pattern to be vapor-deposited. A second opening 31 is formed. As a result, the resin mask 30 provided with the second openings 31 is obtained. At this time, each second opening 31 is formed in a polygonal shape with rounded corners.

Thus, the vapor deposition mask 10A shown in FIG. 9 is obtained.

(Modified Example 3 of Manufacturing Method of Deposition Mask)
Next, a modified example (modified example 3) of the manufacturing method of the vapor deposition mask according to the present embodiment will be described with reference to FIGS.

First, in the same manner as the steps shown in FIGS. 10A to 10E described above, the metal layer 20B provided with the first opening 21B, the resin layer 30A laminated on the metal layer 20B, and the resin layer 30A 13A to 13E).

Next, as shown in FIG. 13(f), the glass substrate 55 is removed from the resin layer 30A. Specifically, a laser is irradiated from the glass substrate 55 side of the laminated body 50A, whereby the glass substrate 55 is separated from the resin layer 30A.

Next, as shown in FIG. 13(g), the metal layer 20B is fixed to the support 40A. At this time, the metal layer 20B of the laminate 50A is welded to the support 40A in a stretched state. A method for fixing the metal layer 20B to the support 40A is not particularly limited. For example, when the support 40A contains metal, a conventionally known process method such as spot welding may be appropriately adopted.

After that, as shown in FIG. 13(h), the resin layer 30A of the laminated body 50A is irradiated with a laser from the metal layer 20B side (see the arrow in FIG. 13(h)) to correspond to the pattern to be vapor-deposited. A second opening 31 is formed. As a result, the resin mask 30 provided with the second openings 31 is obtained. At this time, each second opening 31 is formed in a polygonal shape with rounded corners.

Thus, the vapor deposition mask 10A shown in FIG. 9 is obtained.

According to the present embodiment, each second opening 31 of the resin mask 30 has a polygonal shape with rounded corners. Stress concentration at the corners of the second opening 31 can be alleviated, and cracks at the corners of the second opening 31 can be prevented.

It is also possible to appropriately combine a plurality of constituent elements disclosed in the above embodiments and modifications as necessary. Alternatively, some components may be deleted from all the components shown in the above embodiments and modifications.

REFERENCE SIGNS LIST 10 deposition mask 20 metal layer 21 first opening 30 resin mask 31 second opening 32 corner 33a long side 33b short side 34 first rib 35 second rib 40 support 41 through hole 50 laminate

Claims (11)

a metal layer provided with a first opening;
a resin mask laminated on the metal layer and provided with a plurality of second openings corresponding to a pattern to be deposited;
The shape of each second opening is a polygonal shape with rounded corners ,
The vapor deposition mask , wherein the corner portion of each second opening has a radius of curvature of 4 μm or more and 6 μm or less . 2. The vapor deposition mask according to claim 1 , wherein the narrowest distance between said second openings adjacent to each other is 3 [mu]m or more and 27 [mu]m or less. 3. The vapor deposition mask according to claim 1, wherein each second opening has a rectangular shape with rounded corners. 3. The vapor deposition mask according to claim 1, wherein each second opening has an octagonal shape with rounded corners. 5. The vapor deposition mask according to any one of claims 1 to 4 , further comprising a support laminated on said metal layer. preparing a metal layer provided with a first opening and a resin layer laminated on the metal layer;
A step of irradiating the resin layer with a laser to form a second opening corresponding to a pattern to be deposited on the resin layer,
In the step of forming the second openings, each second opening is formed in a polygonal shape with rounded corners ,
The method for manufacturing a vapor deposition mask , wherein the corner portion of each second opening has a radius of curvature of 4 μm or more and 6 μm or less . 7. The method of manufacturing a vapor deposition mask according to claim 6 , wherein the narrowest distance between said second openings adjacent to each other is 3 [mu]m or more and 27 [mu]m or less. 8. The method of manufacturing a vapor deposition mask according to claim 6 , wherein each second opening has a rectangular shape with rounded corners. 8. The method of manufacturing a vapor deposition mask according to claim 6 , wherein each second opening has an octagonal shape with rounded corners. 10. The method of manufacturing a vapor deposition mask according to any one of claims 6 to 9 , further comprising the step of fixing a support to said metal layer. A method for manufacturing an organic EL display device,
A method for manufacturing an organic EL display device, comprising the step of forming a vapor deposition pattern on a vapor deposition object using the vapor deposition mask according to any one of claims 1 to 5 .

Images