JP7112591B2 - LAMINATE, METHOD FOR MANUFACTURING SUBSTRATE WITH PLATING LAYER, METHOD FOR MANUFACTURING CONDUCTIVE FILM - Google Patents

Description

TECHNICAL FIELD The present invention relates to a laminate, a method for producing a substrate with a layer to be plated, and a method for producing a conductive film.

A conductive film (substrate with a metal layer) having a metal layer (preferably a patterned metal layer) disposed on a substrate is used in various applications. For example, in recent years, with the increase in the mounting rate of touch panels on mobile phones, mobile game devices, etc., the demand for conductive films for capacitive touch panel sensors capable of multi-point detection is rapidly increasing.

For example, in Patent Document 1, a patterned plating layer (layer to be plated arranged in a pattern) containing a functional group that interacts with a plating catalyst or its precursor is formed on a substrate, and then the substrate is deformed and then plated to form a patterned metal layer to obtain a conductive film.

JP 2016-213435 A

In recent years, there has been a demand for further thinning of the patterned metal layer in the conductive film. The inventors of the present invention have studied the technique of Patent Document 1, and found that when a patterned plating layer is formed by irradiating the precursor layer of the plating layer, halation occurs. We have found that it is difficult to thin the plating layer.
Moreover, in order to obtain a conductive film having a predetermined three-dimensional shape, it is also desired that cracks and peeling of the patterned plating layer do not occur during thermal deformation.

In view of the above circumstances, the present invention enables thinning of a patterned plating layer formed from a plating layer precursor layer, and can suppress cracking and peeling during thermal deformation of the patterned plating layer. An object of the present invention is to provide a laminate having a to-be-plated layer precursor layer.
Moreover, this invention also makes it a subject to provide the manufacturing method of a board|substrate with a to-be-plated layer, and the manufacturing method of a conductive film.

As a result of earnestly studying the above problem, the inventors of the present invention have found that the above problem can be solved by the following configuration.

(1) a transparent substrate;
A plated layer precursor layer containing a photopolymerization initiator disposed on one surface side of a transparent substrate;
an antihalation layer detachably arranged on the other surface side of the transparent substrate;
A laminated body in which the to-be-plated layer precursor layer has a functional group capable of interacting with a plating catalyst or its precursor, and a polymerizable group.
(2) The antihalation layer has an absorbance of 0.50 or more at λ _max , where λ _max is the maximum absorption wavelength of the photopolymerization initiator in the wavelength range of 310 to 450 nm. laminate.
(3) The laminate according to (2), wherein the absorbance at λ _max of the plated layer precursor layer is 0.06 to 0.40.
(4) The laminate according to any one of (1) to (3), wherein the antihalation layer has a haze value of 20% or less.
(5) the wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the antihalation layer is greater than the wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the precursor layer for the plating layer; (4) The laminate according to any one of the items.
(6) whether or not the transparent substrate contains an ultraviolet absorber;
The laminate according to any one of (1) to (5), wherein when the transparent substrate contains an ultraviolet absorber, the content of the ultraviolet absorber is 0.01% by mass or less with respect to the total weight of the transparent substrate. .
(7) Step 1 of subjecting the precursor layer of the layer to be plated of the laminate according to any one of (1) to (6) to exposure treatment and development treatment to form a patterned layer to be plated;
Step 2 of removing the antihalation layer from the laminate obtained in step 1 to obtain a layer-containing laminate having a transparent substrate and a patterned layer to be plated;
A method for producing a substrate with a layer to be plated, comprising a step 3 of thermally deforming the laminate containing the layer to be plated to obtain a substrate with the layer to be plated having a three-dimensional shape.
(8) Step 4 of applying a plating catalyst or a precursor thereof to the patterned layer to be plated of the substrate with a layer to be plated manufactured by the manufacturing method according to (7);
A method for producing a conductive film, comprising a step 5 of plating a patterned plating layer to which a plating catalyst or a precursor thereof is applied to form a plating layer.

According to the present invention, a patterned plating layer formed from a plating layer precursor layer can be thinned, and cracking and peeling of the patterned plating layer during thermal deformation can be suppressed. A laminate having a precursor layer can be provided.
Moreover, according to this invention, the manufacturing method of a board|substrate with a to-be-plated layer and the manufacturing method of a conductive film can be provided.

FIG. 2 is a schematic diagram for explaining problems of the conventional technology; FIG. 2 is a schematic diagram for explaining problems of the conventional technology; 1 is a cross-sectional view of one embodiment of a laminate; FIG. It is a top view showing one mode of a pattern-like to-be-plated layer.

The present invention will be described in detail below.
In this specification, the numerical range represented by "-" means a range including the numerical values before and after "-" as lower and upper limits.

A feature of the laminate of the present invention is that an antihalation layer is provided on the surface side of the transparent substrate so as to be peelable.
The inventors of the present invention have investigated the problems of the prior art, and as a result, as shown in FIG. When exposure is performed from the precursor layer 104 side (white arrow), on the surface (surface 102A) of the transparent substrate 102 opposite to the plated layer precursor layer 104 side, halation (black arrow) in which transmitted light is reflected. is known to occur. When this halation occurs, the light is again incident on the side of the layer-to-be-plated precursor layer 104, and the resolution of the formed pattern is lowered.
As a means of suppressing the above problem, there is a method of arranging the antihalation layer 106 on the surface 102A side of the transparent substrate 102, as shown in FIG. However, after forming a patterned plating layer from the plating layer precursor layer 104 using the laminate 110 provided with the antihalation layer 106, if thermal deformation is performed, the presence of the antihalation layer 106 may cause the patterned coating to be deformed. It is known that the plating layer cracks and peels off. It is presumed that this is due to the difference in thermal expansion coefficient among the antihalation layer 106, the transparent substrate 102, and the patterned plating layer.
Therefore, in the present invention, the above problem is solved by using an antihalation layer arranged so as to be peelable. That is, when forming a patterned plating layer, an antihalation layer is used, and after forming the patterned plating layer, the antihalation layer is peeled off before thermal deformation, so that the above plating is performed. It is possible to suppress the occurrence of layer cracking and peeling.

Embodiments of the laminate of the present invention are described below. FIG. 3 is a cross-sectional view of one embodiment of the laminate of the present invention.
The laminate 10 includes a transparent substrate 12, a plating layer precursor layer 14 arranged on one surface side of the transparent substrate 12, and an antihalation layer 16 arranged on the other surface side of the transparent substrate 12 so as to be peelable. and
In FIG. 1, the transparent substrate 12 and the to-be-plated layer precursor layer 14 are arranged so as to be in contact with each other. (eg, a primer layer) may be disposed. That is, the to-be-plated layer precursor layer 14 may be arranged so as to be in direct contact with one surface of the transparent substrate 12, or may be arranged via another layer.
Each member constituting the laminate will be described in detail below.

<Transparent substrate>
The transparent substrate may be any member as long as it supports each member. A transparent substrate typically has two opposing surfaces (principal surfaces).
The transparent substrate means a substrate having a transmittance of 60% or more for visible light (wavelength of 400 to 700 nm), preferably 80% or more, more preferably 90% or more. Although the upper limit is not particularly limited, it is often less than 100%.

Examples of transparent substrates include known transparent substrates (eg, resin substrates, glass substrates, ceramic substrates, etc.), and substrates having flexibility are preferred, and resin substrates are more preferred.
Materials for the resin substrate include, for example, polycarbonate resins, polyacrylic resins, polymethacrylic resins, polyethersulfone resins, polyurethane resins, polyester resins, polysulfone resins, polyamide resins, polyarylate resins, Examples include polyolefin resins, cellulose resins, polyvinyl chloride resins, and cycloolefin resins.
The thickness of the transparent substrate is not particularly limited, and is preferably 0.05 to 2 mm, more preferably 0.1 to 1 mm, from the viewpoint of the balance between handleability and thinness.

The transparent substrate may or may not contain an ultraviolet absorber.
Among them, in terms of suppressing bleeding out of the ultraviolet absorber during thermal deformation, the transparent substrate does not contain an ultraviolet absorber, or when the transparent substrate contains an ultraviolet absorber, the content of the ultraviolet absorber is It is preferably 0.01% by mass or less with respect to the total mass of the transparent substrate. When the transparent substrate contains an ultraviolet absorber, the lower limit of the content of the ultraviolet absorber is not particularly limited, but is often 0.001% by mass or more.

When the maximum absorption wavelength in the wavelength range of 310 to 450 nm of the photopolymerization initiator contained in the to-be-plated layer precursor layer described later is λ _{max, the absorbance at λ max of} the transparent substrate is not particularly limited. It is preferably less than 0.06, more preferably 0.04 or less, from the viewpoint of better transparency as a flexible film. Although the lower limit is not particularly limited, it is more than 0 in many cases.

<Plating layer precursor layer>
The to-be-plated layer precursor layer is a layer arranged on one surface side of the transparent substrate, and is a layer for forming the to-be-plated layer described later. That is, the to-be-plated layer precursor layer is a layer in an uncured state before being subjected to a curing treatment.
The to-be-plated layer precursor layer is a photosensitive layer and contains a photopolymerization initiator.
A well-known photoinitiator is mentioned as a photoinitiator. Examples of the photopolymerization initiator include radical photopolymerization initiators and cationic photopolymerization initiators, and radical photopolymerization initiators are preferred.
Photopolymerization initiators include benzophenones, acetophenones, α-aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzyl ketals, oxum esters, antholone, tetramethylthiuram monosulfides. , bisacylphosphine oxides, acylphosphine oxides, anthraquinones, and azos.

The content of the photopolymerization initiator in the plated layer precursor layer is not particularly limited. 0.1 to 15% by mass is preferable, and 0.5 to 10% by mass is more preferable.

Although the position of the wavelength of the absorption edge of the ultraviolet-visible absorption spectrum of the photopolymerization initiator is not particularly limited, the ultraviolet-visible absorption spectrum of the antihalation layer can be made even thinner in that the patterned plating layer can be further thinned. It is preferably smaller than the wavelength of the absorption edge on the long wavelength side.
For the absorption edge of the ultraviolet-visible absorption spectrum of the photopolymerization initiator, prepare a solution with a photopolymerization initiator concentration of 0.01% by mass (as the solvent, use a solvent in which the polymerization initiator dissolves, such as acetonitrile). However, when measured with V-670 (Jasco Co., Ltd.), the wavelength on the longest wavelength side at which the absorbance is 0.01 or less is intended.
The definition of the wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the antihalation layer will be detailed later.

When the maximum absorption wavelength of the photopolymerization initiator in the wavelength range of 310 to 450 nm is λ _max , the absorbance at λ _max of the precursor layer to be plated is not particularly limited, and is 0.01 to 0.60. 0.06 to 0.40 is preferable in that the patterned plating layer can be further thinned.
Since light with a wavelength of less than 310 nm is often absorbed by the transparent substrate, it hardly affects halation. Further, since a photopolymerization initiator having λ _max at a wavelength of more than 450 nm is slightly inferior in handleability, it is preferable to use a photopolymerization initiator having λ _max in the above range.

The to-be-plated layer precursor layer has a functional group capable of interacting with a plating catalyst or its precursor (hereinafter also referred to as "interacting group") and a polymerizable group.
Details of the interactive group and the polymerizable group will be described later.

The to-be-plated layer precursor layer may contain components other than the photopolymerization initiator.
The to-be-plated layer precursor layer preferably contains the following compound X or composition Y.
Compound X: a compound having an interactive group and a polymerizable group Composition Y: a compound having an interactive group and a composition containing a compound having a polymerizable group

Compound X is a compound having an interactive group and a polymerizable group.
The interactive group is intended to be a functional group capable of interacting with the plating catalyst or its precursor applied to the patterned plating layer, for example, a functional group capable of forming an electrostatic interaction with the plating catalyst or its precursor. groups, and nitrogen-containing functional groups, sulfur-containing functional groups, and oxygen-containing functional groups that can coordinate with a plating catalyst or precursor thereof.
Examples of interactive groups include amino group, amide group, imide group, urea group, tertiary amino group, ammonium group, amidino group, triazine group, triazole group, benzotriazole group, imidazole group, benzimidazole group, quinoline group, pyridine group, pyrimidine group, pyrazine group, quinazoline group, quinoxaline group, purine group, triazine group, piperidine group, piperazine group, pyrrolidine group, pyrazole group, aniline group, group containing alkylamine structure, containing isocyanuric structure Nitrogen-containing functional groups such as groups, nitro groups, nitroso groups, azo groups, diazo groups, azide groups, cyano groups, and cyanate groups; ether groups, hydroxyl groups, phenolic hydroxyl groups, carboxylic acid groups, carbonate groups, carbonyl groups, Oxygen-containing functional groups such as an ester group, a group containing an N-oxide structure, a group containing an S-oxide structure, and a group containing an N-hydroxy structure; thiophene group, thiol group, thiourea group, thiocyanuric acid group, benzthiazole group, mercaptotriazine group, thioether group, thioxy group, sulfoxide group, sulfone group, sulfite group, group containing sulfoxyimine structure, group containing sulfoxynium salt structure, sulfonic acid group, and group containing sulfonic acid ester structure sulfur-containing functional groups such as; phosphate groups, phosphoramide groups, phosphine groups, and phosphorus-containing functional groups such as groups containing phosphoric acid ester structures; chlorine atoms and groups containing halogen atoms such as bromine atoms and salts thereof can also be used for functional groups capable of forming a salt structure.
Among them, ionic polar groups such as carboxylic acid groups, sulfonic acid groups, phosphoric acid groups, and boronic acid groups, or cyano A group is preferred, and a carboxylic acid group or a cyano group is more preferred.
Compound X may have two or more interactive groups.

A polymerizable group is a functional group capable of forming a chemical bond upon application of energy, and examples thereof include a radically polymerizable group and a cationic polymerizable group. Among them, a radically polymerizable group is preferable in terms of better reactivity. Examples of radically polymerizable groups include alkenyl groups (e.g., -C=C-), acrylic acid ester groups (acryloyloxy groups), methacrylic acid ester groups (methacryloyloxy groups), itaconic acid ester groups, and crotonic acid ester groups. , isocrotonic acid ester groups, maleic acid ester groups, styryl groups, vinyl groups, acrylamide groups, and methacrylamide groups. Among them, an alkenyl group, a methacryloyloxy group, an acryloyloxy group, a vinyl group, a styryl group, an acrylamide group, or a methacrylamide group is preferred, and a methacryloyloxy group, an acryloyloxy group, or a styryl group is more preferred.
The compound X may have two or more polymerizable groups. Moreover, the number of polymerizable groups possessed by the compound X is not particularly limited, and may be one or two or more.

The compound X may be a low-molecular-weight compound or a high-molecular-weight compound. Low-molecular-weight compounds are intended to be compounds having a molecular weight of less than 1000, and high-molecular-weight compounds are intended to be compounds having a molecular weight of 1000 or more.

When the compound X is a polymer, the weight average molecular weight of the polymer is not particularly limited, and is preferably 1,000 to 700,000, more preferably 2,000 to 200,000 from the viewpoint of better handling properties such as solubility.
The method for synthesizing a polymer having such a polymerizable group and an interactive group is not particularly limited, and a known synthesis method (see paragraphs [0097] to [0125] of JP-A-2009-280905) is used. .

Composition Y is a composition containing a compound having an interactive group and a compound having a polymerizable group. That is, composition Y contains two types of compounds, a compound having an interactive group and a compound having a polymerizable group. The definitions of interactive groups and polymerizable groups are as described above.
A compound having an interactive group may be a low-molecular-weight compound or a high-molecular-weight compound. In addition, the compound having an interactive group may contain a polymerizable group.
Preferred forms of compounds having interactive groups include polymers (eg, polyacrylic acid) containing repeating units having interactive groups.
A preferred form of the repeating unit having an interactive group is the repeating unit represented by formula (A).

In formula (A), R ¹ represents a hydrogen atom or an alkyl group (eg, methyl group, ethyl group, etc.).
L ¹ represents a single bond or a divalent linking group. The type of the divalent linking group is not particularly limited. For example, it may be a divalent hydrocarbon group (either a divalent saturated hydrocarbon group or a divalent aromatic hydrocarbon group. The saturated hydrocarbon group of may be linear, branched or cyclic, and preferably has 1 to 20 carbon atoms, such as an alkylene group.In addition, the divalent aromatic hydrocarbon group is preferably has 5 to 20 carbon atoms, such as a phenylene group.Alkenylene groups and alkynylene groups may also be used.), divalent heterocyclic groups, -O-, -S-, - SO ₂ -, -NR-, -CO-(-C(=O)-), -COO-(-C(=O)O-), -CO-NR-, -SO ₃ -, -SO ₂ NR -, and groups in which two or more of these are combined. Here, R represents a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
Z represents an interactive group. The definition of the interactive group is given above.

Other preferred forms of repeat units having interactive groups include repeat units derived from unsaturated carboxylic acids or derivatives thereof.
An unsaturated carboxylic acid is an unsaturated compound having a carboxylic acid group (--COOH group). Derivatives of unsaturated carboxylic acids include, for example, anhydrides of unsaturated carboxylic acids, salts of unsaturated carboxylic acids, and monoesters of unsaturated carboxylic acids.
Unsaturated carboxylic acids include, for example, acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, itaconic acid, and citraconic acid.

The content of the repeating unit having an interactive group in the polymer containing the repeating unit having an interactive group is not particularly limited, and from the viewpoint of the balance of plating deposition, it is 1 to 100 mol with respect to all repeating units. %, more preferably 10 to 100 mol %.

Preferred forms of polymers containing repeating units having interactive groups include repeating units derived from conjugated diene compounds and non Examples include polymer X having repeating units derived from saturated carboxylic acid or derivatives thereof.
The repeating units derived from unsaturated carboxylic acids or derivatives thereof are described above.

The conjugated diene compound is not particularly limited as long as it is a compound having a molecular structure with two carbon-carbon double bonds separated by one single bond.
Examples of conjugated diene compounds include isoprene, 1,3-butadiene, 1,3-pentadiene, 2,4-hexadiene, 1,3-hexadiene, 1,3-heptadiene, 2,4-heptadiene, 1,3- octadiene, 2,4-octadiene, 3,5-octadiene, 1,3-nonadiene, 2,4-nonadiene, 3,5-nonadiene, 1,3-decadiene, 2,4-decadiene, 3,5-decadiene, 2,3-dimethyl-butadiene, 2-methyl-1,3-pentadiene, 3-methyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 2-phenyl-1,3-butadiene, 2- phenyl-1,3-pentadiene, 3-phenyl-1,3-pentadiene, 2,3-dimethyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 2-hexyl-1,3-butadiene, 3-methyl-1,3-hexadiene, 2-benzyl-1,3-butadiene, and 2-p-tolyl-1,3-butadiene.

Among them, the repeating unit derived from the conjugated diene compound is a repeating unit derived from a compound having a butadiene skeleton represented by the formula (2) in that the synthesis of the polymer X is easy and the properties of the layer to be plated are more excellent. is preferred.

In formula (2), each R ² independently represents a hydrogen atom, a halogen atom or a hydrocarbon group. The hydrocarbon group includes an aliphatic hydrocarbon group (eg, an alkyl group, an alkenyl group, etc., preferably having 1 to 12 carbon atoms) and an aromatic hydrocarbon group (eg, a phenyl group, a naphthyl group, etc.). mentioned. Multiple R ² may be the same or different.

Examples of the compound having a butadiene skeleton (monomer having a butadiene structure) represented by formula (3) include 1,3-butadiene, isoprene, 2-ethyl-1,3-butadiene, and 2-n-propyl. -1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 1-phenyl-1,3-butadiene, 1-α-naphthyl-1,3-butadiene, 1-β-naphthyl-1,3 -butadiene, 2-chloro-1,3-butadiene, 1-bromo-1,3-butadiene, 1-chlorobutadiene, 2-fluoro-1,3-butadiene, 2,3-dichloro-1,3-butadiene, 1,1,2-trichloro-1,3-butadiene and 2-cyano-1,3-butadiene.

The content of the repeating units derived from the conjugated diene compound in the polymer X is preferably 25 to 75 mol % of the total repeating units.
The content of repeating units derived from an unsaturated carboxylic acid or a derivative thereof in polymer X is preferably 25 to 75 mol % of all repeating units.

The compound having a polymerizable group is a so-called monomer, and a polyfunctional monomer having two or more polymerizable groups is preferable because the hardness of the patterned plating layer to be formed is more excellent. Specifically, the polyfunctional monomer is preferably a monomer having 2 to 6 polymerizable groups. The molecular weight of the polyfunctional monomer used is preferably from 150 to 1,000, more preferably from 200 to 800, in terms of molecular mobility during the cross-linking reaction, which affects reactivity.

As the polyfunctional monomer, an amide compound selected from the group consisting of polyfunctional acrylamide and polyfunctional methacrylamide is preferred.
Multifunctional acrylamides contain two or more acrylamide groups. The number of acrylamide groups in the polyfunctional acrylamide is not particularly limited, preferably 2 to 10, more preferably 2 to 5, and even more preferably 2.
Multifunctional methacrylamides contain two or more methacrylamide groups. The number of methacrylamide groups in the polyfunctional methacrylamide is not particularly limited, preferably 2 to 10, more preferably 2 to 5.
The acrylamide group and the methacrylamide group are groups represented by the following formulas (B) and (C), respectively. * represents a binding position.

R ³ represents a hydrogen atom or a substituent. The type of substituent is not particularly limited, and known substituents (e.g., aliphatic hydrocarbon groups optionally containing heteroatoms, aromatic hydrocarbon groups, etc. More specifically, alkyl groups, aryl groups, etc. ).

Polyfunctional acrylamide and polyfunctional methacrylamide preferably have a polyoxyalkylene group.
A polyoxyalkylene group is a group having an oxyalkylene group as a repeating unit. As the polyoxyalkylene group, a group represented by Formula (D) is preferable.
Formula (D)-(AO) _q-
A represents an alkylene group. The number of carbon atoms in the alkylene group is not particularly limited, preferably 1-4, more preferably 2-3. For example, when A is an alkylene group with 1 carbon atom, -(AO)- is an oxymethylene group (-CH ₂ O-), and when A is an alkylene group with 2 carbon atoms, -(AO) - is an oxyethylene group (-CH ₂ CH ₂ O-), and when A is an alkylene group having 3 carbon atoms, -(AO)- is an oxypropylene group (-CH ₂ CH(CH ₃ )O-, —CH(CH ₃ )CH ₂ O— or —CH ₂ CH ₂ CH ₂ O—). The alkylene group may be linear or branched.

q represents the number of repetitions of an oxyalkylene group and represents an integer of 2 or more. The number of repetitions is not particularly limited, and is preferably 2 to 10, more preferably 2 to 6.
The number of carbon atoms in the alkylene groups in the plurality of oxyalkylene groups may be the same or different.
In addition, when multiple types of oxyalkylene groups are included, the order of their bonding is not particularly limited, and may be random or block.

The content of the compound X (or the composition Y) in the plated layer precursor layer is not particularly limited, and is preferably 50% by mass or more, and preferably 80% by mass or more, based on the total mass of the plated layer precursor layer. more preferred. 100 mass % is mentioned as an upper limit.
When the to-be-plated layer precursor layer contains the composition Y, the content of the compound having an interactive group in the to-be-plated layer precursor layer is not particularly limited. 10 to 90% by mass is preferred, 25 to 75% by mass is more preferred, and 35 to 65% by mass is even more preferred.
The mass ratio of the compound having an interactive group and the compound having a polymerizable group (mass of the compound having an interactive group/mass of the compound having a polymerizable group) is not particularly limited, and the pattern formed It is preferably 0.1 to 10, more preferably 0.5 to 2, from the viewpoint of the balance between the strength of the plated layer and the suitability for plating.

The plated layer precursor layer may optionally contain other components (for example, sensitizers, curing agents, polymerization inhibitors, antioxidants, antistatic agents, fillers, flame retardants, lubricants, plasticizers, or plating catalyst or its precursor) may be included.

The method for forming the layer precursor layer to be plated is not particularly limited. Methods of forming layer precursor layers are included.
The method of contacting the composition with the transparent substrate is not particularly limited, and examples thereof include a method of coating the composition on the transparent substrate and a method of immersing the transparent substrate in the composition.
In addition, after the composition and the transparent substrate are brought into contact with each other, a drying treatment may be carried out as necessary in order to remove the solvent from the layer-to-be-plated precursor layer.

The composition may contain a solvent. The type of solvent is not particularly limited, and includes water and organic solvents. Examples of organic solvents include known organic solvents (eg, alcohol solvents, ester solvents, ketone solvents, halogen solvents, hydrocarbon solvents, etc.).

<Antihalation layer>
The antihalation layer is a layer that absorbs light that enters from the side of the precursor layer of the layer to be plated and passes through the transparent substrate. The presence of the antihalation layer can suppress halation, in which light is reflected on the surface of the transparent substrate opposite to the to-be-plated layer precursor layer and returned to the to-be-plated layer precursor layer again.
The antihalation layer is releasably disposed on the transparent substrate.
That is, when an external force for peeling the antihalation layer is applied to the laminate of the present invention, the laminate of the present invention does not separate between the to-be-plated layer precursor layer and the transparent substrate. It means the property of peeling between the layer and the transparent substrate. That is, in the laminate of the present invention, the peel strength between the layer-to-be-plated precursor layer and the transparent substrate is greater than the peel strength between the antihalation layer and the transparent substrate.

The antihalation layer preferably has a large absorption at the above λ _max so as to efficiently absorb the ultraviolet rays with which the photopolymerization initiator reacts.
More specifically, the absorbance of the antihalation layer at λ _max is not particularly limited, and is often 0.30 or more. 50 or more is preferred. Although the upper limit is not particularly limited, it is often 3.00 or less.

The haze value of the antihalation layer is not particularly limited, but is often 30% or less, and preferably 20% or less in terms of enabling further thinning of the patterned plating layer. Although the lower limit is not particularly limited, it is often 1% or more.
If the haze value of the antihalation layer is within the above range, the return of light to the plated layer precursor layer due to scattering in the antihalation layer is further suppressed.

The wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the antihalation layer is the long wavelength of the ultraviolet-visible absorption spectrum of the precursor layer of the plating layer, in that the patterned plating layer can be made even thinner. It is preferably larger than the wavelength of the absorption edge on the side.
The absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the antihalation layer means that the absorbance is 0.05 when the ultraviolet-visible absorption spectrum of the antihalation layer is measured with V-670 (JASCO Corporation). It is intended to be the longest wavelength of:
Further, the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the precursor layer to be plated is the ultraviolet-visible absorption spectrum of the precursor layer to be plated when measured with V-670 (JASCO Corporation). , is intended to be the longest wavelength at which the absorbance is 0.05 or less.

It is preferable that the antihalation layer can be easily peeled off from the transparent substrate. The peel strength is preferably 0.5 N/30 mm or less.
The lower limit is not particularly limited, but if peeling occurs in an unintended place, the transparent substrate and the antihalation layer rub against each other, resulting in scratches, and pattern resolution due to the formation of gaps between the transparent substrate and the antihalation layer. In order to avoid deterioration of the image width, it is preferably 0.05 N/30 mm or more.
The method for measuring the peel strength is as follows.
The laminate is cut into a piece of 30 mm width×100 mm length, part of the antihalation layer is peeled off and reinforced with Kapton tape. The peeled portion is chucked on a device, and the antihalation layer is pulled up at 90° at a speed of 50 mm/min to measure the peel strength. For the measurement, AUTOGRAPH "AGS-X" (manufactured by Shimadzu Corporation) is used.

The material of the antihalation layer is not particularly limited as long as it satisfies the above properties.
The antihalation layer is preferably a resin layer containing a resin in terms of handleability. Examples of resins include known resins such as polyolefin resins, polyacrylic resins, polymethacrylic resins, polyester resins, polyurethane resins, and polycarbonate resins.
Also, the antihalation layer preferably contains a light absorbing agent capable of absorbing light transmitted through the transparent substrate. As for the light absorber, an optimum material is appropriately selected according to the wavelength of the light absorbed, and examples thereof include ultraviolet absorbers and visible light absorbers. In particular, a light absorber having absorption at the wavelength of λ _max is preferred.
The antihalation layer may also contain colorants such as dyes and pigments.
The optimum absorption wavelength range of the colorant is selected depending on the type of photopolymerization initiator used and the exposure wavelength.

The antihalation layer may have a single layer structure or a multilayer structure.
When the antihalation layer has a multilayer structure, an embodiment having a support and an adhesive layer disposed on the support is exemplified. When the antihalation layer has a multi-layer structure, at least one of the support and the adhesive layer may contain the aforementioned light absorbers (eg, ultraviolet absorbers, visible light absorbers, colorants, etc.).

A method for forming the antihalation layer is not particularly limited, and known methods can be used. For example, there is a method of laminating an antihalation layer on one surface of a transparent substrate. Specifically, there is a method of laminating an antihalation layer to a transparent substrate using a laminator.

<Other layers>
The laminate of the present invention may contain layers other than the transparent substrate, the layer to be plated precursor layer, and the antihalation layer.
For example, a primer layer may be arranged between the transparent substrate and the to-be-plated layer precursor layer. A well-known primer layer is mentioned as a primer layer.
Also, a protective film may be arranged on the surface of the plated layer precursor layer opposite to the transparent substrate side. Examples of protective films include known resin films (eg, polypropylene films).

<Method for manufacturing substrate with layer to be plated>
A substrate with a layer to be plated having a three-dimensional shape can be manufactured using the laminate described above.
A method for manufacturing a substrate with a layer to be plated preferably includes the following steps.
Step 1: The precursor layer of the layer to be plated of the laminate of the present invention is exposed and developed to form a patterned layer to be plated. Step 2: The antihalation layer is peeled off from the laminate obtained in Step 1. Step 3: Thermally deform the layer-containing laminate to obtain a substrate with a layer to be plated having a three-dimensional shape. Steps Hereinafter, each step will be described in detail.

(Step 1)
Step 1 is a step of subjecting the to-be-plated layer precursor layer to exposure treatment and development treatment to form a patterned to-be-plated layer.
In the exposure process, the precursor layer for the plating layer is patternwise irradiated with light so as to obtain a desired patterned layer for plating. The type of light used is not particularly limited, and includes, for example, ultraviolet light and visible light. When light irradiation is performed in a pattern, it is preferable to perform light irradiation using a mask having openings of a predetermined shape.
In the exposed portion of the to-be-plated layer precursor layer, the polymerizable groups contained in the to-be-plated layer precursor layer are activated, cross-linking occurs between the compounds, and curing of the layer proceeds.

Next, the precursor layer for the plating layer that has undergone the hardening treatment in a pattern is subjected to a development treatment to remove the unexposed portions and form a patterned plating layer.
The method of development processing is not particularly limited, and optimum development processing is carried out according to the type of material used. Examples of the developer include organic solvents, pure water, and alkaline aqueous solutions.

The patterned plating layer formed by the above procedure is a layer having a functional group that interacts with the plating catalyst or its precursor, and is arranged in a predetermined pattern.
The patterned layer to be plated usually contains the compound having the above-described interactive group. Polymers are preferred as compounds. In other words, the patterned plating layer preferably contains a polymer containing a repeating unit having an interactive group.
When the patterned plating layer contains a polymer containing a repeating unit having an interactive group, the content of the polymer is preferably 10% by mass or more, preferably 30% by mass or more, relative to the total mass of the patterned plating layer. is more preferred. The upper limit is not particularly limited, and may be 100% by mass.

The plating layer, which will be described later, is arranged along the pattern of the patterned layer to be plated. Therefore, by arranging the patterned layer to be plated on the substrate in accordance with the shape of the plated layer to be formed, the patterned layer to be plated having a desired shape is formed.
Although FIG. 4 shows a mode in which the patterned layer to be plated 18 is arranged in a mesh pattern on the transparent substrate 12, the present invention is not limited to this mode, and the patterned layer to be plated may have any other pattern. may be arranged in a shape (for example, in a stripe shape).

The thickness of the patterned layer to be plated is not particularly limited, and is preferably 0.05 to 2.0 μm, more preferably 0.1 to 1.0 μm, from the viewpoints of sufficiently supporting the plating catalyst or its precursor and preventing abnormal plating. 0 μm is more preferred.

When the patterned plating layer is in the form of a mesh, the line width W of the fine line portion forming the mesh is not particularly limited, and is preferably 30 μm or less, and 15 μm from the viewpoint of the balance between the conductive properties of the plating layer and the difficulty of visual recognition. The following is more preferable, 10 μm or less is more preferable, 5 μm or less is particularly preferable, 0.5 μm or more is preferable, and 1 μm or more is more preferable.

When the patterned layer to be plated has a mesh shape, it is preferable that the mesh opening (opening 20 in FIG. 4) has a substantially rhombic shape. However, other polygonal shapes (eg, triangles, squares, hexagons, and random polygons) are also possible. Also, the shape of one side may be linear, curved, or arcuate. In the case of an arc shape, for example, two opposing sides may be arcuately convex outward, and the other two opposing sides may be arcuately convex inward. Further, the shape of each side may be a wavy line shape in which an outwardly convex circular arc and an inwardly convex circular arc are continuous. Of course, the shape of each side may be a sine curve.

The length L of one side of the opening is not particularly limited, and is preferably 1500 μm or less, more preferably 1300 μm or less, even more preferably 1000 μm or less, preferably 5 μm or more, more preferably 30 μm or more, and even more preferably 80 μm or more. When the length of the side of the opening is within the above range, it is possible to maintain good transparency, and when the conductive film is attached to the front of the display device, the display can be viewed without discomfort. can be done.

In terms of transmittance, the region where the patterned plating layer is formed is preferably 50 area% or less, more preferably 40 area% or less, and further preferably 30 area% or less with respect to the total surface area of the transparent substrate. preferable.

(Step 2)
Step 2 is a step of peeling the antihalation layer from the laminate obtained in Step 1 to obtain a layer-containing laminate having a transparent substrate and a patterned layer to be plated. By performing this step, the antihalation layer is removed.
A method for removing the antihalation layer is not particularly limited, and known methods can be used. For example, there is a method in which the antihalation layer is peeled off by providing a trigger for peeling between the antihalation layer and the transparent substrate.

(Step 3)
Step 3 is a step of thermally deforming the laminate containing the layer to be plated. By carrying out this step, a substrate with a layer to be plated having a three-dimensional shape is obtained. A three-dimensional shape is preferably a shape having a curved surface. More specifically, the three-dimensional shape includes a semicylindrical shape, a corrugated shape, an uneven shape, a cylindrical shape, and the like.
The method of thermal deformation is not particularly limited, and includes known methods. Examples of heat deformation methods include known methods such as thermal vacuum forming, blow molding, free blow molding, pressure forming, vacuum-pressure forming, and heat press forming.

<Method for producing conductive film>
A conductive film can be produced using the substrate with the layer to be plated described above. The formed conductive film has a three-dimensional shape and can be applied to various uses.
The method for producing a conductive film preferably has the following steps.
Step 4: Applying a plating catalyst or its precursor to the patterned plating layer of the substrate with the plating layer Step 5: Plating the patterned plating layer to which the plating catalyst or its precursor is applied , Step of Forming Plating Layer Each step will be described in detail below.

(Step 4)
Step 4 is a step of applying a plating catalyst or a precursor thereof to the patterned layer to be plated of the substrate with the layer to be plated.
Since the patterned layer to be plated has the aforementioned interactive groups, the interactive groups adhere (adsorb) the provided plating catalyst or its precursor according to the function thereof.
The plating catalyst or its precursor functions as a plating process catalyst or electrode. Therefore, the type of plating catalyst or its precursor to be used is appropriately determined according to the type of plating treatment.

The plating catalyst or its precursor is preferably an electroless plating catalyst or its precursor.
The electroless plating catalyst is not particularly limited as long as it serves as an active nucleus during electroless plating. can be used). Specific examples include Pd, Ag, Cu, Pt, Au, and Co.
A metal colloid may be used as the electroless plating catalyst.
The electroless plating catalyst precursor is not particularly limited as long as it becomes an electroless plating catalyst through a chemical reaction.

As a method of applying the plating catalyst or its precursor to the patterned plating layer, for example, a solution is prepared by dispersing or dissolving the plating catalyst or its precursor in a solvent, and the solution is applied onto the patterned plating layer. A coating method or a method of immersing a substrate with a layer to be plated in the solution can be used.
Examples of the solvent include water and organic solvents.

(Step 5)
Step 5 is a step of forming a plating layer (corresponding to a metal layer) by plating the patterned plating layer to which the plating catalyst or its precursor has been applied.
The method of plating treatment is not particularly limited, and examples thereof include electroless plating treatment and electrolytic plating treatment (electroplating treatment). In this step, the electroless plating treatment may be performed alone, or the electrolytic plating treatment may be performed after the electroless plating treatment.
The type of plating treatment is not particularly limited, and examples thereof include copper plating treatment and silver plating treatment.

The plating layer is preferably arranged so as to cover the patterned layer to be plated.
As described above, the plating layer is arranged along the pattern of the patterned layer to be plated. For example, when the patterned layer to be plated is mesh-like, the formed plating layer is also mesh-like.

When the plated layer is in the form of a mesh, the line width of the fine lines forming the mesh is not particularly limited, and is preferably 30 µm or less, more preferably 15 µm or less, in terms of the balance between the conductive properties of the plated layer and the difficulty of visual recognition. , is more preferably 10 μm or less, particularly preferably 5 μm or less, preferably 0.5 μm or more, and more preferably 1 μm or more.

The thickness of the plating layer is not particularly limited, and is preferably 0.1 to 5.0 μm, more preferably 0.3 to 3.0 μm, in terms of lower resistance and better adhesion.

<Application>
The conductive film of the present invention can be used for various purposes. For example, it can be applied to various uses such as touch panel sensors, semiconductor chips, FPCs (Flexible printed circuits), COFs (Chip on Films), TABs (Tape Automated Bonding), antennas, multilayer wiring boards, and motherboards. Especially, it is preferable to use it for a touch-panel sensor (especially a capacitive touch-panel sensor). When the conductive film is applied to a touch panel sensor, the plated layer functions as a detection electrode or lead wiring in the touch panel sensor. Such a touch panel sensor can be suitably applied to a touch panel.
Also, the conductive film can be used as a heating element. For example, by applying an electric current to the plating layer, the temperature of the plating layer rises and the plating layer functions as a hot wire.

The present invention will be described in more detail below based on examples. The materials, amounts used, proportions, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the gist of the present invention. Therefore, the scope of the present invention should not be construed as being restricted by the examples shown below.

<Example 1>
(Preparation of composition for forming primer layer)
The following components were mixed to obtain a composition for forming a primer layer.
・Z913-3 (manufactured by Aica Kogyo Co., Ltd.): 33 parts by mass ・Isopropanol: 67 parts by mass

(Preparation of composition for forming precursor layer)
The components below were mixed to obtain a composition for forming a precursor layer. The maximum absorption wavelength λ _max of Irgacure OXE02 at wavelengths 310 to 450 nm was 340 nm.
Isopropanol 38 parts by mass Polybutadiene maleic acid (butadiene-maleic acid alternating copolymer, butadiene: maleic acid = 1:1 (molar ratio), manufactured by Polysciences) 4 parts by mass FAM-201 (manufactured by Fujifilm Corporation, hereinafter structural formula ) 1 part by mass Photopolymerization initiator (Irgacure OXE02 (manufactured by BASF)) 0.05 part by mass

FAM-201 (corresponding to a bifunctional acrylamide compound, see structural formula below)

(Preparation of conductive film)
The composition for forming a primer layer was applied onto a resin substrate (PC (polycarbonate) film manufactured by Teijin, Panlite PC, thickness 250 μm) to form a coating film. Next, the obtained coating film was irradiated with ultraviolet light to cure the coating film, thereby forming a primer layer having a thickness of 0.8 μm.
The transmittance of visible light (wavelength: 400 to 700 nm) of the resin substrate was 60% or more.
Next, the precursor layer-forming composition was applied onto the obtained primer layer and dried at 120° C. for 1 minute to form a 0.2 μm-thick layer-to-be-plated precursor layer. Next, a polypropylene film (thickness: 12 μm) was laminated on the to-be-plated layer precursor layer.
After that, using a laminator, E-Mask-R100 (manufactured by Nitto Denko Co., Ltd.) was laminated as an antihalation layer to the surface of the resin substrate opposite to the side of the precursor layer of the layer to be plated.

Next, the to-be-plated layer precursor layer was exposed (100 mJ/cm ² ) through a photomask having a predetermined opening pattern. At the time of exposure, a vacuum was drawn and the photomask was placed so that the photomask and the polypropylene film were in close contact with each other. A high-pressure mercury lamp was used for the exposure.
After the end of the exposure, the polypropylene film is peeled off, and the exposed precursor layer for the plating layer is developed with water at 40° C. to remove the uncured portion to obtain a patterned plating layer, and a predetermined laminate is obtained. manufactured.

(Evaluation: resolution width)
During exposure using the above photomask, exposure and development are performed using a photo film having a pattern in which the line width of the line portion is 50 μm and the width of the space portion between the line portions is varied in the range of 1 to 50 μm. The resolution of the resulting patterned plating layer was examined. The smaller the numerical value shown in Table 1, the more thin the line can be made.

(Evaluation: cracking and peeling during deformation)
After peeling off the antihalation layer from the laminate obtained above, the obtained laminate was vacuum formed into a hemispherical shape using a vacuum forming machine Formech 508FS (manufactured by Nippon Seiki Kogyo Co., Ltd.). The obtained hemispherical laminate was visually observed to confirm whether or not there was an abnormal portion such as a crack or peeling in the patterned plating layer. When there was no cracking or peeling, it was rated as "absent", and when there was cracking or peeling, it was rated as "yes".

(Peeling evaluation)
The resulting laminate was cut into a piece of 30 mm width×100 mm length, part of the antihalation layer was peeled off and reinforced with Kapton tape. The peeled portion was chucked in a device, and the antihalation layer was pulled up at 90° at a speed of 50 mm/min to measure the peel strength. A case where the peel strength was 0.5 N/30 mm or less was evaluated as "passable", and a case where the peel strength was over 0.5 N/30 mm was evaluated as "impossible". For the measurement, AUTOGRAPH "AGS-X" (manufactured by Shimadzu Corporation) was used.

<Examples 2 to 13, Comparative Examples 1 to 2>
A laminate was produced in the same manner as in Example 1, except that the type of antihalation layer was changed as shown in Table 1, and the laminate was evaluated.
In addition, in Examples 9 to 12, the content of the photopolymerization initiator was adjusted so as to obtain a predetermined λ _max absorbance.
Regarding Comparative Example 1, in the above evaluation (evaluation: cracking and peeling during deformation), the antihalation layer was not peeled, and the laminate including the antihalation layer was used for the evaluation.

In Table 1, the "λ _max absorbance" column in the "Antihalation layer" column indicates the maximum absorption wavelength λ of the photopolymerization initiator in the wavelength range of 310 to 450 nm measured with V-670 (JASCO Corporation). The absorbance at the above λ _max of the antihalation layer is represented as _max .
In Table 1, the "absorption edge (nm)" column in the "antihalation layer" column indicates the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the antihalation layer measured with V-670 (JASCO Corporation). Represents wavelength and is defined as above.
In Table 1, the "λ _max absorbance" column in the "precursor layer to be plated layer" column is the maximum absorption in the wavelength range of 310 to 450 nm of the photopolymerization initiator measured with V-670 (JASCO Corporation). It represents the absorbance at λ _max of the precursor layer to be plated when the wavelength is λ _max . The λ _max value of the to-be-plated layer precursor layer is the value obtained by subtracting the λ _max value of the transparent substrate from the λ _max value of the laminate of the to-be-plated layer precursor layer and the transparent substrate.
In Table 1, the "absorption edge (nm)" column in the "precursor layer to be plated layer" column indicates the length of the ultraviolet-visible absorption spectrum of the precursor layer to be plated layer measured with V-670 (JASCO Corporation). It represents the wavelength of the absorption edge on the wavelength side, and the definition is as described above.
In addition, regarding Example 11 in Table 1, although the resolution width was small and excellent, it was confirmed that the wiring was blurred.
Moreover, in Table 1, ">2700" means that it was over 2700 nm. "<4" means it was less than 4 nm.
Also, in Table 1, "-" means that evaluation was not performed.

Types "1" to "9" of the antihalation layer in Table 1 represent the following. The antihalation layer used was a layer having absorption within a predetermined range, as shown in Table 1 below.
"1": E-Mask-R100 (manufactured by Nitto Denko Corporation)
"2": Laminate of Lumirror X30 (manufactured by Toray Industries, Inc.) and an adhesive layer.
"3": Colored polyethylene film "4": Colored polyethylene film "5": Laminate of polyethylene film and adhesive layer. The adhesive layer contains TINUVIN1600.
"6": A laminate of a polyethylene film and an adhesive layer. The adhesive layer contains TINUVIN360.
"7": colored polyethylene film "8": colored polyethylene film "9": laminate of polyethylene film and adhesive layer. The adhesive layer contains TINUVIN360.

As shown in Table 1, it was confirmed that the laminate of the present invention can provide desired effects.
Incidentally, from a comparison between Example 6 and Example 7, the wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the antihalation layer is the absorption on the long wavelength side of the ultraviolet-visible absorption spectrum of the precursor layer for the plating layer. It was confirmed that the effect is better when the wavelength is larger than the edge wavelength.
Moreover, it was confirmed from the comparison between Example 8 and other examples that the effect is more excellent when the haze value of the antihalation layer is 20% or less.
Further, from the comparison of Examples 9 to 12, it was confirmed that when the absorbance at λ _max of the layer to be plated precursor layer is 0.06 to 0.40, the effect is more excellent. In particular, as described above, in Example 11, although the resolution width was small and excellent, the wiring blur was confirmed.
Moreover, it was confirmed from the comparison between Example 13 and other examples that the effect is more excellent when the absorbance at λ _max of the antihalation layer is 0.50 or more.

<Method for producing conductive film>
The substrate with the layer to be plated having a three-dimensional shape obtained in each example after performing the above (evaluation: cracking and peeling during deformation) was treated with a Pd catalyst application liquid (Omnishield 1573 Activator, Rohm & Co., Ltd. (manufactured by Haas Electronic Materials Co., Ltd.) at 30° C. for 5 minutes, and then the substrate with the layer to be plated taken out was washed with pure water. Next, the obtained substrate with the layer to be plated was immersed in a reducing solution (Circuposit P13 Oxide Converter 60C, manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 30 ° C. for 5 minutes, and then the substrate with the layer to be plated was taken out. The substrate was washed with pure water. Next, the obtained substrate with the layer to be plated was immersed in an electroless plating solution (Circuposit 4500, manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 45 ° C. for 15 minutes, and then the substrate with the layer to be plated was taken out. was washed with pure water to obtain a substrate having a mesh-like copper plating layer (substrate with copper plating layer).

Reference Signs List 10, 100, 110 Laminate 12, 102 Transparent substrate 14, 104 Plated layer precursor layer 16, 106 Antihalation layer 18 Patterned plated layer 20 Opening

Claims (7)

a transparent substrate;
A plated layer precursor layer containing a photopolymerization initiator disposed on one surface side of the transparent substrate;
an antihalation layer detachably arranged on the other surface side of the transparent substrate;
The to-be-plated layer precursor layer has a functional group capable of interacting with a plating catalyst or its precursor, and a polymerizable group ,
A laminate in which the absorbance of the antihalation layer at λ _max is 0.50 or more, where λ _max is the maximum absorption wavelength of the photopolymerization initiator in a wavelength range of 310 to 450 nm . 2. The laminate according to claim 1 , wherein the absorbance at the λ _max of the to-be-plated layer precursor layer is 0.06 to 0.40. 3. The laminate according to claim 1, wherein the antihalation layer has a haze value of 20% or less. Claims 1 to 3 , wherein the wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the antihalation layer is greater than the wavelength of the absorption edge on the long wavelength side of the ultraviolet-visible absorption spectrum of the precursor layer for the plating layer. The laminate according to any one of the above. whether the transparent substrate does not contain an ultraviolet absorber;
5. The method according to any one of claims 1 to 4 , wherein when the transparent substrate contains an ultraviolet absorber, the content of the ultraviolet absorber is 0.01% by mass or less with respect to the total weight of the transparent substrate. laminate. A step 1 of subjecting the plated layer precursor layer of the laminate according to any one of claims 1 to 5 to exposure treatment and development treatment to form a patterned plated layer;
a step 2 of obtaining a layer-containing layer-to-be-plated layered body having the transparent substrate and the patterned layer to be plated by peeling the antihalation layer from the layered body obtained in the step 1;
A method for producing a substrate with a layer to be plated, comprising a step 3 of thermally deforming the laminate containing the layer to be plated to obtain a substrate with the layer to be plated having a three-dimensional shape. A step 4 of applying a plating catalyst or a precursor thereof to the patterned layer to be plated of the substrate with the layer to be plated manufactured by the manufacturing method according to claim 6 ;
A method for producing a conductive film, comprising a step 5 of plating the patterned layer to be plated with the plating catalyst or its precursor to form a plating layer.

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