JP7118286B2 - Processing head and laser processing equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a processing head and a laser processing apparatus equipped with a detaching device that utilizes a suction function.

2. Description of the Related Art A laser processing apparatus is known that includes a processing head and a drive mechanism, and performs cutting or the like by relatively moving the processing head and a work to be processed by the drive mechanism along a preset trajectory. In such a laser processing device, the shock caused by the processing head colliding with the warped work during processing, or the shock caused by the processing head colliding with the work due to erroneous operation of the laser processing device by the operator or failure of the laser processing device. In some cases, the processing head may be damaged.

Therefore, as a detaching device using a suction function, a breakage prevention device is used that suppresses the impact force applied to the processing head at the time of collision to a certain value or less to prevent damage to the processing head. A breakage prevention device described in Patent Document 1 includes a plate fixed to a drive mechanism, and a holder that fixes a processing head and is connected to the plate. Further, the breakage prevention device described in Patent Document 1 includes a magnet embedded in one of a connection surface where the plate is connected to the holder and a connection surface where the holder is connected to the plate and attracts the other connection surface. As a result, the two components, the plate and the holder, are attracted by the magnet. When a force exceeding the attracting force of the magnet is applied to the machining head, the machining head separates from the plate. In other words, by releasing the impact force applied to the machining head, damage to the machining head is avoided.

Japanese Utility Model Laid-Open No. 4-104271

However, during normal processing, many magnets are required to attract the holder and the plate so that the holder does not fall off, which increases the weight of the breakage prevention device. Therefore, when the breakage prevention device described in Patent Document 1 is used as a detachable device that adsorbs and detachably connects two component members in the processing head of the processing device, the two component members can be easily detached. I had a problem that I couldn't. Therefore, there has been a demand for a processing head having a detaching device capable of reducing the weight of the structure in which the two structural members are connected while fixing the two structural members by suction.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and can reduce the weight of a structure in which two structural members are connected while fixing two structural members by adsorption. The object is to obtain a machining head.

In order to solve the above-described problems and achieve the object, a processing head according to the present invention includes an arm, a rotating mechanism for rotating the arm, condensing laser light propagated through the arm and the rotating mechanism, and a condensing part that emits light to the outside. The arm has a first component, a second component, and an attachment/detachment device that detachably couples the first component and the second component by suction. The attachment/detachment device includes a first component fixed to the first component, a second component fixed to the second component, and a gap between the first facing surface of the first component and the second facing surface of the second component. and a connecting member that connects the The connecting member is an annular magnetic circuit component that is a combination of a magnet and a yoke and is arranged on the second facing surface of the second component so as to surround the center of the second facing surface of the second component.

ADVANTAGE OF THE INVENTION According to this invention, it is effective in the weight of the structure which connected two components being fixed by adsorption|suction as compared with the former being able to be lightened.

1 is an exploded perspective view showing an example of the configuration of the attachment/detachment device according to Embodiment 1. FIG. 1 is a perspective view schematically showing an example of a connecting member of the detaching device according to Embodiment 1; FIG. 1 is a partially enlarged perspective view showing an example of a connecting member of a detaching device according to Embodiment 1; FIG. 4 is a partial cross-sectional view for explaining magnetic flux distribution in the desorption device according to Embodiment 1. FIG. Partial cross-sectional view for explaining magnetic flux distribution in a conventional desorption device 1 is a perspective view showing an example of a processing head of a laser processing apparatus according to Embodiment 1; FIG. FIG. 4 is an exploded perspective view showing another configuration example of the attachment/detachment device according to Embodiment 1; 4 is a perspective view showing another configuration example of the connecting member according to the first embodiment; FIG. Sectional view showing another configuration example of the connecting member according to Embodiment 1 FIG. 11 is an exploded perspective view showing an example of the configuration of the attachment/detachment device according to Embodiment 2; A diagram showing an example of the configuration of a pressure reducer used in the desorption device according to the second embodiment. FIG. 11 is an exploded perspective view showing another configuration example of the attachment/detachment device according to the second embodiment; FIG. 11 is a perspective view schematically showing an example of a connecting member of a detaching device according to Embodiment 3; Partially enlarged cross-sectional view showing an example of a connecting member of a detaching device according to Embodiment 3 FIG. 11 is an exploded perspective view showing another configuration example of the connection member of the attachment/detachment device according to Embodiment 3; FIG. 11 is a partially enlarged perspective view showing another configuration example of the connection member of the attachment/detachment device according to Embodiment 3; FIG. 11 is a top view showing an example of the configuration of the detaching device according to Embodiment 4; FIG. 18 is a cross-sectional view showing an example of the configuration of the attachment/detachment device according to Embodiment 4, taken along line XVIII-XVIII in FIG. 17; A diagram showing an example of a configuration of a laser processing apparatus according to Embodiment 5

A processing head and a laser processing apparatus according to embodiments of the present invention will be described in detail below with reference to the drawings. In addition, this invention is not limited by these embodiments.

Embodiment 1.
FIG. 1 is an exploded perspective view showing an example of the configuration of the attachment/detachment device according to Embodiment 1. FIG. Here, a laser processing device and a detaching device 10 used in a processing head of the laser processing device will be described as an example. The attachment/detachment device 10 is provided in a part of the optical system of the processing head. In other words, the detaching device 10 is provided between the driving mechanism and the condensing section. The attachment/detachment device 10 includes a disk-shaped first component 11 , a disk-shaped second component 12 , and an annular connecting member 13 .

In one example, the first component 11 is a component that is fixed to a component on the drive mechanism side of the laser processing apparatus among the components of the processing head. The first part 11 has a perfect circular contour, and has a first surface 111 and a second surface 112 arranged to face each other, and a side surface 113 provided along the outer periphery of the first surface 111 and the second surface 112. and have The first component 11 has an optical path hole 114 opened in a direction orthogonal to the first surface 111 and the second surface 112 at the center of the first surface 111 and the second surface 112 . The optical path hole 114 is a through hole for the laser light L to pass through. The first component 11 is fixed to a component on the drive mechanism side by a fixing member. The fixing member is, for example, a screw. A screw hole (not shown) is provided at a predetermined position on the first surface 111, and the first part 11 is fastened with a component of the drive mechanism by screws. The second surface 112 corresponds to the first facing surface.

The first part 11 may be made of any material as long as the portion in contact with the connecting member 13 is made of a magnetic material and the other portion has necessary physical properties such as strength. For example, the portion that does not contact the connecting member 13 is made of metal, ceramics, or resin. Hard magnetic materials and soft magnetic materials are examples of magnetic materials. A soft magnetic material is a material that is not magnetic by itself but is easily magnetized by an external magnetic field. The magnetic material forming the first component 11 used in Embodiment 1 is desirably a soft magnetic material having a magnetic permeability of 1×10 ⁻³ [H/m] or more. Examples of soft magnetic materials are soft iron, permalloy, silicon steel plate, and electromagnetic stainless steel. A hard magnetic material is a material that can retain magnetism by itself, and is also called a permanent magnet. Examples of hard magnetic materials are iron, nickel and cobalt.

In one example, the second component 12 is a component that is fixed to a component on the condensing unit side of the laser processing apparatus among the components of the processing head. The second part 12 has a perfect circular outline, a third surface 121 and a fourth surface 122 arranged to face each other, and a side surface 123 provided along the outer periphery of the third surface 121 and the fourth surface 122. and have The second component 12 has an optical path hole 124 opened in a direction orthogonal to the third surface 121 and the fourth surface 122 at the center of the third surface 121 and the fourth surface 122 . The optical path hole 124 is a through hole for the laser light L to pass through. The second component 12 is fixed to the component on the light condensing section side by a fixing member. The fixing member is, for example, a screw. A screw hole is provided at a predetermined position on the fourth surface 122, and the second part 12 is fastened with a component on the light-condensing part side with a screw. The second part 12 may be made of any material as long as it has the required physical properties such as strength. The second component 12 is made of metal, ceramics, or resin, for example. In one example, the second part 12 is composed of the metal iron. The third surface 121 corresponds to the second facing surface.

The connecting member 13 is a member that connects the first component 11 and the second component 12 by suction. The connecting member 13 is fixed on the third surface 121 of the second component 12 so as to surround the optical path hole 124 . The connecting member 13 is fixed to the second part 12 by a method such as fastening with screws, adhesion, or fusion.

2 is a perspective view schematically showing an example of a connecting member of the detaching device according to the first embodiment, and FIG. 3 is a partially enlarged perspective view showing an example of the connecting member of the detaching device according to the first embodiment. be. FIG. 3 is an enlarged view of region R1 in FIG. The connecting member 13 of Embodiment 1 is a magnetic circuit component 13A. The magnetic circuit component 13A has an annular magnet 131 and two annular yokes 132a and 132b arranged in contact with the outer peripheral surface and the inner peripheral surface perpendicular to the radial direction of the annular magnet 131. . That is, the magnetic circuit component 13A has a structure in which an annular magnet 131 is sandwiched between two yokes 132a and 132b from the outside and the inside. Also, in the example shown in FIG. 3, the positions of the surfaces of the yokes 132a and 132b facing the first component 11 are closer to the first component 11 than the positions of the surfaces of the magnet 131 facing the first component 11. Protruding. One example of magnet 131 is a neodymium magnet. The yokes 132a, 132b are soft magnetic material. Here, the yokes 132a and 132b are desirably made of a soft magnetic material having a magnetic permeability of 1×10 ⁻³ [H/m] or more. Examples of the yokes 132a and 132b are soft iron, permalloy, silicon steel plate, and electromagnetic stainless steel.

In FIGS. 2 and 3, it is assumed that the outer circumference of the magnet 131 is the N pole and the inner circumference is the S pole. As shown in FIG. 3, the magnetic flux 133 from the north pole of the magnet 131 extends into space from the attracting surface 133a of the outer yoke 132a, and the magnetic flux 133 extending into the space passes through the attracting surface 133b of the inner yoke 132b. A magnetic circuit is formed that leads back to the magnet 131 . In addition, below, the connection member 13 shall be 13 A of magnetic circuit components.

Returning to FIG. 1, the third surface 121 of the second component 12 and the second surface 112 of the first component 11 are opposed to each other, and the third surface 121 and the second surface 112 are parallel to each other. The first part 11 is brought into contact with the magnetic circuit constituent member 13A so that the position of the optical path hole 114 of the part 11 and the position of the optical path hole 124 of the second part 12 overlap. When the magnetic circuit component 13A comes into contact with the first part 11, the magnetic circuit component 13A causes the magnetic flux 133 to exit the magnetic circuit component 13A, pass through the first component 11, and pass through the magnetic circuit component 13A, as described above. A magnetic circuit is formed that returns to By forming a magnetic circuit, it is possible to suppress the occurrence of leakage magnetic flux and control the magnetic flux density. Therefore, as compared with the case where a single magnet is used, the attracting force of the magnetic circuit component 13A combining the magnet 131 and the yokes 132a and 132b as in the first embodiment can be increased. It is known that the attracting force of the magnetic circuit component 13A combining the magnet 131 and the yokes 132a and 132b is more than three times that of the single magnet.

FIG. 4 is a partial cross-sectional view for explaining the magnetic flux distribution in the detaching device according to Embodiment 1. FIG. In FIG. 4, for the sake of explanation, the magnetic flux 133 emitted from the ring-shaped magnet 131 is represented by three lines of magnetic force 1331 . The attachment/detachment device 10 of Embodiment 1 has a configuration in which the magnetic circuit component 13A is fixed on the second component 12 as described above. As shown in FIG. 4, in the attachment/detachment device 10 according to the first embodiment, the magnet 131 of the magnetic circuit component 13A passes through the yoke 132a and enters the first component 11 via the attraction surface 133a. A line of magnetic force 1331 is drawn that enters the yoke 132b via the attracting surface 133b and returns to the magnet 131. FIG. In FIG. 4, all the magnetic lines of force 1331 forming the magnetic flux 133 pass through the attracting surfaces 133a and 133b of the yokes 132a and 132b.

FIG. 5 is a partial cross-sectional view for explaining magnetic flux distribution in a conventional detaching device. In the attachment/detachment device 100 of FIG. 5, the same components as in FIG. 1 are denoted by the same reference numerals, and descriptions thereof are omitted. The attachment/detachment device 100 shown in FIG. 5, the magnetic circuit component 13A is embedded in the second component 12. In the conventional detaching device 100 shown in FIG. The first part 11 and the second part 12 are in surface contact. 5 also shows the magnetic flux 133 emitted from the magnet 131 by three lines of magnetic force 1332 and 1333 for the sake of explanation.

In the conventional detaching device 100 shown in FIG. 5, one magnetic line of force 1332 traces a path via the attracting surfaces 133a and 133b of the yokes 132a and 132b as before. However, the remaining two magnetic lines of force 1333 radially pass through the yoke 132a from the magnet 131, enter the second part 12, pass through the first part 11, enter the second part 12 again, and then enter the yoke 132a. 132b radially back to magnet 131. That is, the magnetic lines of force 1333 do not pass through the attracting surfaces 133a and 133b of the yokes 132a and 132b. In terms of availability, price, and strength, when a material containing iron as the main component is used for the second part 12, such a tendency is likely to appear because iron is a good magnetic substance.

The attracting force due to the magnetic force increases as the density of the magnetic flux increases on the attracting surfaces 133a and 133b. Therefore, when the same magnetic circuit constituent member 13A is used, a larger attracting force can be obtained in FIG. 4 according to the first embodiment than in FIG. 5 of the prior art. That is, in order to achieve the same adsorption force, the detaching device 10 according to the first embodiment shown in FIG. 4 requires a smaller magnetic circuit component 13A than the conventional detaching device 100 of FIG. become. As a result, the weight of the magnetic circuit component 13A and the attachment/detachment device 10 including the magnetic circuit component 13A can be reduced.

As a result, when laser light L emitted from a laser oscillator (not shown) is propagated from the driving mechanism to the condensing part of the processing head, the attachment/detachment device 10 arranged between the driving mechanism and the condensing part is operated. can pass. At least the portion of the first part 11 that contacts the magnetic circuit component 13A is made of a magnetic material, so that when the position of the magnetic circuit component 13A matches the position of the magnetic material, the attractive force is increased. become the strongest. As a result, it is possible to easily align the first part 11 and the second part 12 via the magnetic circuit component 13A.

Next, a processing head of a laser processing apparatus having such a detaching device 10 will be described. 6 is a perspective view showing an example of the processing head of the laser processing apparatus according to Embodiment 1. FIG. Here, the direction in which the laser light L is incident on the processing head 200 is defined as the Z direction, and two directions that are orthogonal to each other within a plane parallel to the Z direction are defined as the X direction and the Y direction.

The processing head 200 includes a first arm 210 , a second arm 220 , rotating mechanisms 230 and 240 , a condensing section 250 , and the detaching device 10 . The first arm 210 has a first portion 211 extending in a direction parallel to the XY plane and a second portion 212 inclined with respect to the XY plane. The second arm 220 has a third portion 221 extending in the Z direction and a fourth portion 222 inclined at an angle that is not perpendicular to the XY plane. In one example, the tilt angle in the first arm 210 and the second arm 220 is 45°. That is, the second portion 212 and the fourth portion 222 are inclined portions that are not horizontal with respect to the vertical direction. The material forming the first arm 210 and the second arm 220 may be made of any material as long as it has necessary physical properties such as strength as an arm. In one example, first arm 210 and second arm 220 are made of metal, ceramics, or resin.

Rotation mechanisms 230 and 240 rotate first arm 210 or second arm 220 . In one example, the rotation mechanism 230 is provided between the first arm 210 and a drive mechanism (not shown), and the rotation mechanism 240 is provided between the first arm 210 and the second arm 220 . An example of the rotating mechanism 230, 240 is a motor. Also, the first arm 210 is fixed to the drive mechanism via the rotation mechanism 230 .

The condensing part 250 is provided at one end of the second arm 220 . The condensing unit 250 has a condensing optical system 251 that condenses the laser light L, and a nozzle 252 that emits the condensed laser light L.

The second arm 220 is split into two at a fourth portion 222 . That is, the second arm 220 is divided into two so as to be perpendicular to the extending direction of the optical path hole 201 in the fourth portion 222 . As a result, the processing head 200 is divided into a condensing section side member 225 which is a constituent member arranged on the condensing section 250 side and a driving mechanism side member 226 which is a constituent member arranged on the driving mechanism side. be. The attachment/detachment device 10 described above connects the condensing section side member 225 and the drive mechanism side member 226 .

The first arm 210, the second arm 220, the rotating mechanisms 230 and 240, the condensing section 250, and the attachment/detachment device 10 have an optical path hole 201 through which the laser beam L passes. That is, the optical path hole 201 is a through hole penetrating through the insides of the first arm 210 , the second arm 220 , the rotating mechanisms 230 and 240 , the condensing section 250 , and the detaching device 10 . An optical component (not shown) for reflecting the laser light L along the optical path hole 201 is provided at the bent portion of the optical path hole 201 inside the first arm 210 and the second arm 220 . The processing head 200 is assembled so that the positions of the optical path holes 201 in the connection portions of the first arm 210, the second arm 220, the rotation mechanisms 230 and 240, the light collecting portion 250, and the attachment/detachment device 10 are aligned.

The operation of the processing head 200 shown in FIG. 6 will be described. The laser light L reaching the processing head 200 from the driving mechanism side propagates through the rotating mechanism 230 , the first arm 210 , the rotating mechanism 240 , the second arm 220 and the optical path hole 201 provided inside the detaching device 10 . At this time, the laser light L is reflected along the shape of the optical path hole 201 by the optical component provided in the optical path hole 201 , propagates within the optical path hole 201 , and reaches the condensing section 250 . After being condensed by the condensing optical system 251 of the condensing unit 250, the laser light L is emitted together with the assist gas from the nozzle 252 toward a workpiece (not shown) to be processed.

In the processing head 200 shown in FIG. 6 , the first arm 210 is rotated around the a-axis by the rotation mechanism 230 and the second arm 220 is rotated around the b-axis by the rotation mechanism 240 . That is, since the processing head 200 rotates about two axes, the laser beam L can be applied perpendicularly to the surface of the three-dimensional workpiece. By irradiating the laser beam L in this manner, the quality of the cut surface is ensured.

Further, when the condensing part 250 collides with the work, if the impact force on the condensing part 250 exceeds the attraction force of the magnetic circuit component member 13A that attracts the first part 11, the condensing part side member 225 position is displaced with respect to the drive mechanism side member 226 . As a result, the external force applied to the condensing section 250 is suppressed to a certain value or less, and damage to the condensing section 250 is suppressed.

In the breakage prevention device disclosed in Patent Document 1, as described above, a magnet is used to attract the holder holding the processing head to the plate. , many magnets are required. As a result, the weight of the processing head including the anti-breakage device becomes heavy.

When the first arm 210 or the second arm 220 rotates, a centrifugal force proportional to the square of the speed is applied to the processing head 200 . Especially when a workpiece is to be processed at high speed, a large centrifugal force is applied to the processing head 200 . In the processing head 200, the rotation mechanism 230, 240 repeats the “rotation→stop” operation. Therefore, when the damage prevention device described in Patent Document 1 is applied to the processing head 200 of FIG. 6, the weight of the processing head 200 becomes heavy. of motors will be used. In this way, the operation of the processing head 200 becomes slow due to the weight of the motor itself, in addition to the weight of the processing head 200 including the breakage prevention device. becomes difficult.

However, the attachment/detachment device 10 according to Embodiment 1 includes the first part 11 fixed to the drive mechanism side member 226, the second part 12 fixed to the light collector side member 225, and the second part 12 fixed to the second part 12. and a magnetic circuit component 13A in which the magnet 131 and the yokes 132a and 132b are combined. Normally, the magnetic circuit component 13A has three times or more the attraction force as compared with the case of a single magnet. can be significantly reduced compared to the amount of magnets. That is, the attachment/detachment device 10 according to Embodiment 1 can be made smaller.

In addition, since the attachment/detachment device 10 can be downsized, the rotation mechanisms 230 and 240 for rotating the processing head 200 do not need to use large motors. Therefore, the centrifugal force applied to the processing head 200 during rotation of the first arm 210 or the second arm 220 is reduced compared to the case of using the damage prevention device disclosed in Patent Document 1. As a result, compared to the case of using the breakage prevention device described in Patent Document 1, it is possible to improve the accuracy of the irradiation position of the laser beam L on the work and increase the processing speed of the work.

Furthermore, since the attachment/detachment device 10 according to Embodiment 1 is smaller than the breakage prevention device described in Patent Document 1, it can be attached to any portion of the arm of the processing head 200 . Among others, it is preferable to attach the attachment/detachment device 10 to the inclined portion of the arm. This is because the attachment/detachment device 10 functions not only when the machining head 200 collides with the work from the direction perpendicular to the optical axis, but also when it collides head-on with the work along the Z direction. In the case of the processing head 200 having the configuration as shown in FIG. It is preferable to attach the This is because the detaching device 10 functions with a smaller impact force.

Also, the attaching/detaching device 10 is attached to the second arm 220 so that the optical path hole 201 of the attaching/detaching device 10 matches the optical path hole 201 of the second arm 220 . Therefore, when the processing head 200 collides with the work, the optical path hole 201 of the drive mechanism side member 226 of the second arm 220 and the optical path hole 201 of the light condensing section side member 225 are misaligned, and the laser beam L is projected onto the light condensing section. It will never reach 250. In other words, when the machining head 200 collides with the workpiece, the emission of the laser beam L for machining from the condensing part 250 can be stopped instantly.

As described above, the processing head 200 to which the light-weight detaching device 10 according to Embodiment 1 is attached does not need to use a large motor, and is lighter than the breakage prevention device described in Patent Document 1. A machining head 200 can be realized.

The attachment/detachment device 10 having the magnetic circuit component 13A shown in FIGS. 1 and 2 is merely an example, and may have other configurations. 7 is an exploded perspective view showing another configuration example of the attachment/detachment device according to Embodiment 1. FIG. In addition, the same code|symbol is attached|subjected to the component same as FIG. 1, and the description is abbreviate|omitted.

In FIG. 7 , the first component 11 has a cylindrical optical path forming portion 115 and two flanges 116 and 117 provided at both ends of the optical path forming portion 115 . The second component 12 also has a cylindrical optical path forming portion 125 and two flanges 126 and 127 provided at both ends of the optical path forming portion 125 . The optical path hole 114 of the first part 11 is perpendicular to the first surface 116a of the flange 116 and the second surface 117a of the flange 117, from the center of the first surface 116a through the optical path forming part 115 to the center of the second surface 117a. It is provided so as to penetrate. The optical path hole 124 of the second part 12 is perpendicular to the third surface 126a of the flange 126 and the fourth surface 127a of the flange 127, from the center of the third surface 126a through the optical path forming part 125 to the center of the fourth surface 127a. It is provided so as to penetrate. The optical path holes 114 and 124 are holes for passing the laser light L emitted from the laser oscillator.

The flange 116 of the first part 11 is fixed by a drive mechanism side member 226 of the processing head (not shown) and a fixing member. The flange 127 of the second part 12 is fixed by a not-shown condensing part side member 225 and a fixing member. In one example, the flange 116 of the first part 11 and the flange 127 of the second part 12 are formed with through holes (not shown). Then, the flange 116 of the first component 11 and the flange provided on the drive mechanism side member 226 are fastened with bolts and nuts. Similarly, the flange 127 of the second part 12 and the flange provided on the light collector side member 225 are fastened with bolts and nuts.

The flange 117 of the first part 11 is made of a magnetic material. Magnetic materials include soft magnetic materials and hard magnetic materials. In the case of a soft magnetic material, the flange 117 is desirably made of a magnetic material having a magnetic permeability of 1×10 ⁻³ [H/m] or more. Examples of soft magnetic materials are soft iron, permalloy, silicon steel plate, and electromagnetic stainless steel. Examples of hard magnetic materials are iron, nickel and cobalt. The portion of the first part 11 other than the flange 117 and the second part 12 may be made of any material as long as it has necessary physical properties such as strength. In one example, the portion of the first component 11 other than the flange 117 and the second component 12 are made of metal, ceramics, or resin.

In FIG. 7, the connecting member 13 is not composed of an annular magnetic circuit component 13A, but is composed of three disk-shaped magnetic circuit components 13B. The diameter of the disk-shaped magnetic circuit component 13B is smaller than the flange width, which is the distance between the outside of the optical path hole 124 and the outer circumference of the flange 126 on the diameter passing through the center of the third surface 126a of the flange 126. be done. Also, the three disk-shaped magnetic circuit constituent members 13B are arranged around the optical path hole 124 on the third surface 126a of the flange 126 at regular intervals.

8 is a perspective view showing another configuration example of the connecting member according to the first embodiment, and FIG. 9 is a cross-sectional view showing another configuration example of the connecting member according to the first embodiment. The magnetic circuit component 13B, which is the connecting member 13, includes a disk-shaped magnet 135 and a yoke 136 provided to cover the surface of the disk-shaped magnet 135 other than the attracting surface 135a. The yoke 136 has a hollow cylindrical shape with a bottom, and the magnet 135 is arranged in the hollow portion. In other words, the bottomed hollow cylindrical yoke 136 covers the magnet 135 except for the attracting surface 135a. Magnet 135 is, in one example, a samarium cobalt magnet. 8 and 9, the position of the surface of the magnet 135 facing the first component 11 and the position of the surface of the yoke 136 facing the first component 11 are at the same position.

8 and 9, it is assumed that the attraction surface 135a side of the magnet 135 is the south pole, and the contact surface 135b side with the bottom of the yoke 136 is the north pole. As shown in FIG. 9, the magnetic flux 133 from the magnet 135 extends into space from the attraction surface 136a of the yoke 136 via the contact surface 135b with the yoke 136 and the yoke 136, and the magnetic flux 133 extending into the space is A magnetic circuit is formed back to magnet 135 .

Returning to FIG. 7, the third surface 126a of the flange 126 of the second component 12 and the second surface 117a of the flange 117 of the first component 11 are opposed to each other, and the third surface 126a and the second surface 117a are parallel to each other. The first part 11 is brought into contact with the magnetic circuit component member 13B so that the position of the optical path hole 114 of the first part 11 and the position of the optical path hole 124 of the second part 12 overlap. When the magnetic circuit constituent member 13B comes into contact with the first part 11, as described above, the magnetic circuit constituent member 13B causes the magnetic flux 133 to exit from the magnetic circuit constituent member 13B, pass through the first part 11, and reach the magnetic circuit constituent member 13B. A magnetic circuit is formed that returns to By forming a magnetic circuit, it is possible to suppress the occurrence of leakage magnetic flux and control the magnetic flux density. Therefore, as shown in FIGS. 8 and 9, the attracting force of the magnetic circuit component 13B combining the magnet 135 and the yoke 136 can be increased as compared with the case where the magnet is used alone.

In the example of FIG. 7, the connecting member 13 is composed of three magnetic circuit constituent members 13B, but the number of the magnetic circuit constituent members 13B can be changed according to the weight of the condensing section side member 225. can be done.

In Embodiment 1, the attachment/detachment device 10 includes a first part 11 fixed to the drive mechanism side member 226 of the laser processing apparatus, a second part 12 fixed to the light collector side member 225, and the second part 12 and a connection member 13 that is fixed to and sucks the first component 11 . The connecting member 13 is composed of magnetic circuit components 13A and 13B having magnets 131 and 135 and yokes 132a, 132b and 136, and the portion of the first part 11 in contact with the connecting member 13 is composed of a magnetic material. be. As a result, when the light collecting part 250 collides with the workpiece, the position of the second part 12 in the attachment/detachment device 10 moves so as to deviate from the position of the first part 11, and the impact force applied to the light collecting part 250 is constant. value below. In addition, the magnetic circuit components 13A, 13B, which combine the magnets 131, 135 and the yokes 132a, 132b, 136, can control the magnetic flux density. Therefore, the attracting force of the magnetic circuit constituent members 13A and 13B is greater than when a single magnet is used, and the weight of the magnetic circuit constituent members 13A and 13B required to obtain the same attracting force is reduced. Furthermore, since the weight of the magnetic circuit constituent members 13A and 13B is reduced, the weight of the processing head 200 when the attachment/detachment device 10 is used for the processing head 200 is also reduced, and a large motor is used when operating the processing head 200. no longer needed. As a result, when the machining head 200 collides with the work, there is an effect that the weight of the machining head 200 can be reduced as compared with the conventional one. In addition, since the processing head 200 can be made lighter, it is possible to ensure the accuracy of the position of the light collecting unit 250 with respect to the workpiece, and it is possible to shorten the time required to move the light collecting unit 250 to a desired position. .

Furthermore, in the breakage prevention device described in Patent Document 1, the contact surface between the holder and the plate, which are separated at the time of collision, is parallel to the optical path in the held processing head. In other words, in the technique described in Patent Literature 1, it is necessary to arrange the breakage prevention device outside the processing head away from the optical path. On the other hand, in Embodiment 1, the contact surface between the connecting member 13 and the first part 11 that are separated at the time of collision is perpendicular to the optical path in the held light collector side member 225 . In other words, in Embodiment 1, the attachment/detachment device 10 can be arranged on a member that constitutes the processing head 200, and there is no need to arrange a breakage prevention device outside the processing head 200 as in Patent Document 1. As a result, it is possible to realize a smaller attachment/detachment device 10 as compared with the case of Patent Document 1.

Embodiment 2.
FIG. 10 is an exploded perspective view showing an example of the configuration of the attachment/detachment device according to Embodiment 2. FIG. In the following description, the same reference numerals are assigned to the same components as those in the first embodiment, the description thereof is omitted, and the different parts are described.

In Embodiment 2, the connecting member 13 is configured by a decompressor. In FIG. 10 a pad 141 which is part of the pressure reducer is provided on the third surface 121 of the second part 12 . Pad 141 is circular in plan view in one example. The diameter of the circular pad 141 is smaller than the distance between the outside of the optical path hole 124 and the outer circumference of the second part 12 on the diameter passing through the center of the third surface 121 of the second part 12 . Also, four circular pads 141 are arranged at regular intervals around the optical path hole 124 on the third surface 121 of the second component 12 . By adopting such an arrangement, the size of the attachment/detachment device 10 can be minimized compared to the case where the breakage prevention device is arranged outside the processing head away from the optical path, as in Patent Document 1, for example. can be kept.

FIG. 11 is a diagram showing an example of the configuration of a decompressor used in the desorption device according to Embodiment 2. FIG. The pressure reducer 13</b>C includes a pad 141 , a vacuum pump 142 , and a pipe 143 connecting between the pad 141 and the vacuum pump 142 . The pad 141 has a funnel shape, the diameter of which decreases toward the pipe 143 from the adsorption surface 141 a that contacts the object to be adsorbed. At least the suction surface 141a of the pad 141 that contacts the object is partially made of a flexible material such as rubber or resin. In addition, the pad 141 has a base portion 141b connected to the pipe 143, which is made of resin. Although not shown, a through-hole penetrating through the second component 12 in the thickness direction is provided at a position where the pad 141 of the second component 12 is arranged. Pad 141 is inserted into this through hole. At this time, the pad 141 can be fixed to the second component 12 by bonding the root portion 141b of the pad 141 to the second component 12 with an adhesive.

The pipe 143 is made of an aluminum pipe, for example. One end of the pipe 143 is connected to the root portion 141 b of the pad 141 and the other end is connected to the vacuum pump 142 . The vacuum pump 142 may be provided for a decompressor, or may be a vacuum pump used in laser processing equipment. This completes the decompressor 13C having a decompression function. 11 shows only one pad 141, each pad 141 shown in FIG. 10 is connected to a vacuum pump 142 via a pipe 143. As shown in FIG.

Such a decompressor 13C can suck a component by utilizing the differential pressure between the inside of the pipe 143 and the atmospheric pressure. For example, by using a pad 141 with an area of 100 cm ² and a vacuum pump 142 with an ultimate pressure of 3 kPa, a weight of 33 kgf can be supported. If the number of pads 141 capable of holding the condensing part side member 225 fixed to the second part 12 of the processing head 200 by suction is provided, the magnetic circuit constituent members 13A, The condensing section side member 225 can be adsorbed without using 13B.

FIG. 12 is an exploded perspective view showing another configuration example of the attachment/detachment device according to the second embodiment. In the following, the same reference numerals are assigned to the same components as those in the first and second embodiments, the description thereof is omitted, and the different parts are described.

In FIG. 12, the connecting member 13 is composed of a magnet 145 and a pressure reducer. In FIG. 12, two circular pads 141 and four circular magnets 145 that are part of the pressure reducer are provided on the third surface 121 of the second part 12 . The two pads 141 and the four magnets 145 are arranged at equal intervals around the optical path hole 124 on the third surface 121 of the second component 12 . The pressure reducer 13C has a configuration similar to that shown in FIG. Also, the magnet 145 is a permanent magnet. By replacing part of the magnet 145 with the decompressor 13C, the weight of the detaching device 10 can be reduced.

Note that even when the processing head 200 using such a detaching device 10 collides with the work and receives a force greater than the adsorption force, as in the first embodiment, the position of the condensing section side member 225 is shifted to the position of the drive mechanism. offset relative to side member 226; As a result, the external force applied to the condensing section 250 is suppressed to a certain value or less, and damage to the condensing section 250 is suppressed.

In Embodiment 2, a decompressor 13C is used for the connecting member 13 . As a result, it is possible to reduce the weight of the machining head 200 as compared with the conventional one while suppressing damage to the machining head 200 when the machining head 200 collides with the workpiece. Further, when the magnet 145 is used for the connecting member 13, the weight of the attachment/detachment device 10 can be reduced by replacing part of the magnet 145 with the decompressor 13C.

Embodiment 3.
Embodiment 3 describes another example of the connecting member 13 in the attachment/detachment device 10 of Embodiment 1. FIG.

FIG. 13 is a perspective view schematically showing an example of a connecting member of a detaching device according to Embodiment 3, and FIG. 14 is a partially enlarged cross-sectional view showing an example of a connecting member of a detaching device according to Embodiment 3. be. FIG. 14 is an enlarged view of region R2 in FIG. The connecting member 13 of the third embodiment is a magnetic circuit constituent member 15A. The magnetic circuit component 15A has an annular magnet 151 and an annular yoke 152 arranged in contact with the bottom surface of the annular magnet 151 and having a U-shaped cross section perpendicular to the circumferential direction. The annular yoke 152 has an annular bottom surface 152a, a side surface 152b provided on the outer peripheral side of the annular bottom surface 152a, and a side surface 152c provided on the inner peripheral side of the annular bottom surface 152a. That is, the annular yoke 152 has a U-shaped groove 152t. The ring-shaped magnet 151 is provided in a U-shaped groove 152t provided in the ring-shaped yoke 152 so as to be in contact with the bottom surface 152a and not with the side surfaces 152b and 152c. In the example shown in FIGS. 13 and 14 , the positions of the surfaces of the side surfaces 152 b and 152 c of the yoke 152 facing the first component 11 are the same as the positions of the surfaces of the magnet 151 facing the first component 11 . One example of magnet 151 is a neodymium magnet. Yoke 152 is a soft magnetic material.

13 and 14, it is assumed that the side of the magnet 151 in contact with the first component 11 is the N pole, and the bottom side of the yoke 152 in contact with the bottom surface 152a is the S pole. In the magnetic circuit component 15A shown in FIG. 14, the magnetic flux 153 from the N pole of the magnet 151 extends into the space, passes through the attracting surface 152d of the yoke 152, and passes through the outer peripheral side surface 152b of the yoke 152 or the inner peripheral side surface. A magnetic circuit is formed that passes through the side surface 152 c and returns from the bottom surface 152 a to the bottom of the magnet 151 .

In FIG. 1, the third surface 121 of the second component 12 and the second surface 112 of the first component 11 are opposed to each other, and the third surface 121 and the second surface 112 are parallel to each other. The first part 11 is brought into contact with the magnetic circuit constituent member 15A so that the position of the optical path hole 114 of the second part 12 and the position of the optical path hole 124 of the second part 12 overlap. When the magnetic circuit component 15A contacts the first part 11, as described above, a magnetic circuit is formed in which the magnetic flux 153 exits the magnetic circuit component 15A, passes through the first component 11, and returns to the magnetic circuit component 15A. be. By forming a magnetic circuit, it is possible to suppress the occurrence of leakage magnetic flux and control the magnetic flux density. Therefore, as compared with the case where the magnet 151 is used alone, the attractive force of the magnetic circuit component 15A combining the magnet 151 and the yoke 152 as in the third embodiment can be increased.

15 is an exploded perspective view showing another configuration example of the connection member of the attachment/detachment device according to the third embodiment, and FIG. 16 is a part showing another configuration example of the connection member of the attachment/detachment device according to the third embodiment. It is an expansion perspective view. FIG. 16 is an enlarged view of region R3 in FIG. The connecting member 13 of Embodiment 3 is a magnetic circuit component 15B. The magnetic circuit component 15B has an annular shape in which a plurality of arc-shaped magnets 155 and a plurality of yokes 156 are alternately arranged. Specifically, a plurality of arc-shaped magnets 155 are arranged in an annular shape, and a plurality of yokes 156 are arranged between the adjacent arc-shaped magnets 155, thereby forming an annular magnetic circuit component 15B. be done. One example of magnet 155 is a neodymium magnet. An example of the yoke 156 is a silicon steel plate.

In the magnetic circuit component 15B of FIGS. 15 and 16, the magnets 155 are arranged so that the same magnetic poles face each other with the yoke 156 interposed therebetween. In FIG. 16, the yokes 156 at both ends are in contact with the N pole of the magnet 155, and the yoke 156 in the center is in contact with the S pole. That is, the yokes 156 at both ends are N poles, and the yoke 156 at the center is S poles. In such a magnetic circuit component 15B, the magnetic flux 157 passes from the N pole of the magnet 155 through the yoke 156, extends into space from the attraction surface 157a, passes through the yoke 156 serving as the central S pole from the attraction surface 157b, and passes through the magnet 155. A magnetic circuit is formed that returns to

As in the example described above, when the magnetic circuit component 15B provided in the second component 12 contacts the first component 11, the magnetic flux 157 is emitted from the magnetic circuit component 15B and the first component 11 is displaced as described above. Thus, a magnetic circuit returning to the magnetic circuit component 15B is formed. As with the magnetic circuit component 15A shown in FIGS. 13 and 14, the attractive force of the magnetic circuit component 15B combining the magnet 155 and the yoke 156 can be increased.

According to the third embodiment, it is possible to obtain the same effect as the first embodiment.

Embodiment 4.
The attachment/detachment device 10 according to Embodiment 4 has a positioning component at a position where the first component 11 and the second component 12 face each other.

FIG. 17 is a top view showing an example of the configuration of the attachment/detachment device according to the fourth embodiment. 18 is a cross-sectional view showing an example of the configuration of the attachment/detachment device according to Embodiment 4, and is a cross-sectional view along line XVIII-XVIII in FIG. The configuration of the attachment/detachment device 10 is the same as that shown in FIGS. 1 to 3 of the first embodiment. omitted.

As mentioned above, the detachable device 10 includes the positioning component 160 . Positioning component 160 includes a first positioning member 161 and a second positioning member 171 . The first part 11 and the second part 12 have a first positioning member 161 and a second positioning member 171, respectively, at positions facing each other. The first positioning member 161 has a full thread 163 , a nut 164 and a support component 165 . The second positioning member 171 has a bolt 172 and a projecting part 173 .

In this example, the first positioning member 161 has a supporting part 165 having a conical concave portion 165a on the second part 12 side, and the second positioning member 171 has a protruding part 173 having a spherical shape on the first part 11 side. have The support component 165 supports a spherical projecting component 173 fixed to the second component 12 with a conical recess 165a. The protruding part 173 and the support part 165 are positioning parts 160 for making the shape of the attachment/detachment device 10 the same before and after attachment/detachment.

The first component 11 is provided with a through hole 118 for providing the first positioning member 161 , and the second component 12 is provided with a through hole 128 for providing the second positioning member 171 . The support part 165 is fixed to the second surface 112 of the first part 11 at the position of the through hole 118 using a full screw 163 and a nut 164 as fixing members. The projecting part 173 is fixed to the third surface 121 of the second part 12 at the position of the through hole 128 using a bolt 172 as a fixing member.

A method of assembling the attachment/detachment device 10 will be described. First, the full screw 163 is passed through the through hole 118 of the first part 11 , the supporting part 165 is fixed to one end of the full screw 163 , and the nut 164 is fastened to the other end to temporarily attach the supporting part 165 to the first part 11 . stop. Also, the bolt 172 is passed through the through hole 128 of the second component 12 to fix the projecting component 173 to the second component 12 . Next, the connecting member 13 is fixed to the second component 12 . After that, the second part 12 is placed on the table, and the first part 11 is placed on the second part 12 via the positioning part 160 . Here, while maintaining the state in which the attracting surfaces 133a and 133b of the magnetic circuit component 13A shown in FIG. 165 position is adjusted. At this time, the position of the support component 165 is adjusted so that the projecting component 173 and the support component 165 do not come into contact with each other. Here, the uneven contact means that the central axis of the spherical projecting part 173 passing through the bolt 172 and the central axis of the conical concave part 165a of the supporting part 165 are deviated from each other, and the projecting part 173 is in point contact with the conical concave portion 165a. When the central axis of the spherical projecting part 173 and the central axis of the conical recessed part 165a of the supporting part 165 are aligned, the contact portion between the projecting part 173 and the conical recessed part 165a of the supporting part 165 is circular. The position of the support component 165 is adjusted so as to form a ring. Then, the nut 164 of the first part 11 is tightened to fix the support part 165 to the first part 11 .

When the above adjustment is performed on the three positioning components 160, the contact state between the first component 11 and the second component 12 is uniquely determined. Although three positioning parts 160 are preferable, the number may be four or more.

Since the attachment/detachment device 10 of Embodiment 4 has the positioning component 160, the first component 11 and the second component 12 can be easily returned to their original states after attachment/detachment, thus eliminating the need for readjustment. becomes unnecessary. 17 and 18 show the case where the positioning component 160 is provided in the attachment/detachment device 10 shown in FIGS. It can also be provided in the desorption device 10 shown in Embodiments 1 to 3.

In the conventional detaching device, it is necessary to bring the third surface of the second part in which the magnet is embedded and the second surface of the first part into contact with each other. I had to put it together. As a result, it was difficult to ensure the quality of the conventional desorption device, and the manufacturing cost was high.

On the other hand, the attachment/detachment device 10 according to Embodiment 4 has a structure in which the second surface 112 of the first part 11 and the third surface 121 of the second part 12 do not contact each other, and the positioning part 160 is positioned between the second surface 112 and the third surface 121 of the second part 12 . It has a structure in which the distance to the surface 121 can be adjusted. For this reason, the connecting member 13 is not affected by dimensional errors of the components of the attachment/detachment device 10, and in a state in which the connection member 13 is in proper surface contact with the first part 11, the spherical projection part 173 and the conical projection part 173 are formed so as to obtain reproducibility. The first part 11 and the second part 12 can be connected together so that the supporting part 165 having the shaped concave portion 165a does not come into contact with each other.

An example in which such shape reproducibility is required for the detaching device 10 is a processing head 200 of a laser processing device as shown in FIG. If the shape is reproducible, the optical path of the laser does not change when the workpiece is attached or detached. The machining head 200 can be returned.

As described above, the detaching device 10 according to Embodiment 4 can ensure stable quality, has a wide tolerance for component dimensions, and is easy to assemble. can contribute.

Embodiment 5.
19 is a diagram showing an example of the configuration of a laser processing apparatus according to Embodiment 5. FIG. In FIG. 19, the same parts as in Embodiments 1 to 4 are denoted by the same reference numerals, and descriptions thereof are omitted. In FIG. 19, the two directions perpendicular to each other in the horizontal plane are the X direction and the Y direction, and the direction perpendicular to the X direction and the Y direction is the Z direction. That is, the Z direction is the vertical direction.

The laser processing device 300 includes a laser oscillator 310 , a processing machine main body 320 and a processing head 200 . A laser oscillator 310 oscillates a laser beam L to irradiate a work. In one example, the laser light L is oscillated in pulses. When cutting a sheet metal work, a CO ₂ laser oscillator or a fiber laser oscillator having high power is used. The processing machine body 320 has a drive mechanism and an optical system that guides the laser beam L from the laser oscillator 310 to the processing head 200 . The processing head 200 is fixed to the driving mechanism of the processing machine main body 320 . The processing head 200 has the configuration shown in FIG. 6, for example. Laser light L emitted from laser oscillator 310 is emitted through an optical system provided in processing machine body 320 and processing head 200 .

The processing machine main body 320 has a Z-axis operating section 321 that moves the machining head 200 in the Z direction, and an X-axis operating section 322 that moves the machining head 200 in the X direction. The Z-axis operating section 321 and the X-axis operating section 322 are attached to the gate 331 . The gate 331 is fixed to the installation surface of the laser processing apparatus 300 in one example.

The laser processing apparatus 300 further includes a work stage 332 on which a work is placed, and a Y-axis operating section 323 that moves the work stage 332 in the Y direction.

The Z-axis operating section 321 , the X-axis operating section 322 and the Y-axis operating section 323 constitute a driving mechanism of the laser processing apparatus 300 . That is, the driving mechanism of the laser processing apparatus 300 of FIG. work on the axis. As a result, the machining head 200 is capable of three-axis motion by the drive mechanism in addition to the two-axis motion of the a-axis and the b-axis shown in FIG.

The detaching device 10 shown in the first to fourth embodiments can be applied to this processing head 200 .

In Embodiment 5, a laser processing apparatus 300 includes a processing head 200 having the attachment/detachment device 10 shown in Embodiments 1-4. As a result, it is possible to reduce the weight of the structure in which the two structural members are connected by the detaching device 10 while the two structural members are fixed by suction, compared to the conventional structure. In addition, since the attachment/detachment device 10 is lightened, the inertial force during operation of the processing head 200 is reduced. As a result, in the laser processing apparatus 300 for processing sheet metal having a three-dimensional structure, the positional accuracy can be ensured and the movement time can be shortened as compared with the technique described in Patent Document 1. In other words, it is possible to provide the laser processing apparatus 300 for processing a sheet metal having a three-dimensional structure that achieves processing quality that meets market demands.

The configuration shown in the above embodiment shows an example of the content of the present invention, and it is possible to combine it with another known technology, and one configuration can be used without departing from the scope of the present invention. It is also possible to omit or change the part.

Reference Signs List 10, 100 detaching device 11 first part 12 second part 13 connecting member 13A, 13B, 15A, 15B magnetic circuit component 13C decompressor 111, 116a first surface 112, 117a second surface, 113, 123, 152b, 152c side surface 114, 124, 201 optical path hole 115, 125 optical path forming part 116, 117, 126, 127 flange 118, 128 through hole 121, 126a third surface 122, 127a third surface 4 surfaces, 131, 135, 145, 151, 155 magnet, 132a, 132b, 136, 152, 156 yoke, 133, 153, 157 magnetic flux, 133a, 133b, 135a, 136a, 141a, 152d, 157a, 157b attraction surface, 135b contact surface, 141 pad, 141b root portion, 142 vacuum pump, 143 pipe, 152a bottom surface, 152t groove, 160 positioning component, 161 first positioning member, 163 full thread, 164 nut, 165 support component, 165a concave portion, 171 second 2 positioning member 172 bolt 173 projecting part 200 processing head 210 first arm 220 second arm 225 condensing part side member 226 driving mechanism side member 230, 240 rotating mechanism 250 condensing part 251 Condensing optical system 252 Nozzle 300 Laser processing device 310 Laser oscillator 320 Processing machine body 321 Z-axis operating unit 322 X-axis operating unit 323 Y-axis operating unit 331 Gate 332 Work stage 1331, 1332 , 1333 magnetic field lines.

Claims (12)

A processing head comprising an arm, a rotating mechanism that rotates the arm, and a condensing unit that collects laser light propagating inside the arm and the rotating mechanism and emits it to the outside,
The arm has a first component, a second component, and a detachable device that detachably connects the first component and the second component by suction,
The attachment/detachment device includes a first component fixed to the first component, a second component fixed to the second component, a first opposing surface of the first component and a second component of the second component. A connecting member that connects between the opposing surfaces,
The connecting member is arranged on the second facing surface of the second component so as to surround the center of the second facing surface of the second component, and has an annular magnetic circuit combining a magnet and a yoke. A processing head, characterized in that it is a component. The connecting member is configured to connect the first facing surface of the first component and the second facing surface of the second component so that the first facing surface of the first component and the second facing surface of the second component do not contact each other. 2. The processing head according to claim 1, wherein the processing head is sandwiched between the second opposing surface. the yoke is annular and has a groove with a U-shaped cross section perpendicular to the circumferential direction;
3. The magnet is annular and arranged so as to be in contact with the bottom of the U-shaped groove of the yoke and out of contact with the sides of the U-shaped groove. 3. The processing head according to 2. 4. The machining head according to claim 3, wherein the position of the surface of the yoke facing the first part is the same as the position of the surface of the magnet facing the first part. 3. The magnetic circuit component according to claim 1, wherein a plurality of arc-shaped magnets are arranged in an annular shape, and a plurality of yokes are arranged between adjacent arc-shaped magnets. Machining head as described. 6. The machining head according to claim 5, wherein the magnets adjacent to each other with the yoke interposed therebetween are arranged so that their magnetic poles are the same with each other with the yoke interposed therebetween. 6. The position of the surface of the yoke facing the first component protrudes toward the first component compared to the position of the surface of the magnet facing the first component. 7. The processing head according to 6. The processing head according to any one of claims 1 to 7, wherein the attachment/detachment device further comprises a positioning component used for positioning between the first component and the second component. The positioning component is
a projecting component fixed to the second opposing surface side of the second component and having a spherical surface on the first component side;
a support component provided on the first opposing surface side of the first component and having a conical concave portion on the second component side;
a fixing member that fixes the support component to the first component;
9. The processing head of claim 8, comprising: The first component has a first optical path hole through which the laser beam propagates,
The second component has a second optical path hole through which the laser beam propagates and is provided corresponding to the first optical path hole,
3. The attachment/detachment device is provided on the arm so that the position of the first optical path hole of the first part and the position of the second optical path hole of the second part are aligned. 10. The processing head according to any one of 1 to 9. The arm has an inclined portion inclined with respect to the vertical direction,
The processing head according to any one of claims 1 to 10, wherein the attachment/detachment device is provided on an inclined portion of the arm. a laser oscillator that oscillates the laser light;
a processing head according to any one of claims 1 to 11;
a driving mechanism for driving the processing head;
with
A laser processing apparatus, wherein the laser beam oscillated from the laser oscillator is guided to the processing head and emitted from the condensing section.

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