JP7119202B2 - Lids, packages, electronic devices and electronic modules - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to lids, packages, electronic devices, and electronic modules with filter functions.

2. Description of the Related Art Conventionally, in an electronic device in which a sensor element is mounted in a package, various information about the external environment is acquired by the sensor element, and the user can obtain various information about the environment. Examples of the electronic device include a gas sensor (see JP-A-2006-337187).

A lid body of the present disclosure includes a substrate having a first surface and a second surface located opposite to the first surface, and having a plurality of through holes extending from the first surface to the second surface; and a porous body located opposite to the substrate at a position overlapping at least one of the plurality of through holes.

A package of the present disclosure includes a base body having a cavity, and the lid body described above, in which the substrate and the porous body are arranged in the depth direction of the cavity to close the cavity.

The electronic device of the present disclosure comprises electronic components in the cavity in the package described above.

An electronic module of the present disclosure includes a module substrate and the electronic device described above connected to the module substrate.

(a) is a perspective plan view of the lid of the present disclosure as seen from above, and (b) is a cross-sectional view taken along line X1-X1 of (a). (a) is a top perspective view showing a modification of the lid body of the present disclosure, and (b) is a cross-sectional view taken along line X2-X2 of (a). (a) is a top perspective view showing a modification of the lid body of the present disclosure, and (b) is a cross-sectional view taken along line X3-X3 of (a). (a) is a top perspective view showing a modification of the lid of the present disclosure, and (b) is a cross-sectional view taken along line X4-X4 of (a). (a) is a top perspective view showing a modification of the lid of the present disclosure, and (b) is a cross-sectional view taken along line X5-X5 of (a). FIG. 4 is a cross-sectional view showing the lid, package, electronic device, and module substrate of the present disclosure; FIG. 4 is a cross-sectional view showing a modification of the lid, package, electronic device, and module substrate of the present disclosure;

A lid, a package, an electronic device, an electronic module, etc. of the present disclosure will be described with reference to the accompanying drawings. 1 to 7, the same reference numerals are given to the same parts. Lid 100 includes substrate 101 , porous body 102 and support 107 . The substrate 101 is a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a mullite sintered body. consists of A plurality of through holes 108 are positioned so as to penetrate the first surface 103 and the second surface 104 in the thickness direction of the substrate 101 .

In order to manufacture the substrate 101, if the material is an aluminum oxide sintered body, first, an appropriate organic solvent and a binder are added to raw material powders such as aluminum oxide and silicon oxide, and the mixture is formed into a sheet shape to form a ceramic. Make a green sheet. Next, punching is performed on the central portion of the substrate region that will be the individual substrate 101 to form a ceramic green sheet in which a plurality of through holes are positioned in each of the plurality of substrate regions. By sintering the ceramic green sheet after locating the dividing grooves, it is possible to manufacture a mother substrate (not shown) in which substrates 101 having a plurality of through-holes positioned in each of a plurality of substrate regions are arranged. A plurality of substrates 101 can be manufactured by applying stress along the division grooves of the mother substrate and dividing the mother substrate. Note that the method of manufacturing the substrate 101 is not limited to the above, and the substrate 101 may be divided into individual pieces by slicing, or by dividing the mother substrate in which the division grooves are located in the mother substrate after baking. Furthermore, individual substrates 101 may be manufactured by granulating ceramic powder and pressing.

In addition, the porous body 102 is a ceramic such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a mullite sintered body. It is composed of a sintered body. The porous body 102 has a porous structure and has air permeability in the thickness direction and horizontal direction of the porous body 102 . In other words, like a sponge, it has air permeability not only in the thickness direction but also in the horizontal direction.

In order to manufacture the porous body 102, if the material is an aluminum oxide sintered body, for example, a molded body obtained by adding a new binder to granules obtained by granulating aluminum oxide powder and molding is produced. The porous body 102 can be manufactured by firing to obtain a sintered body. Note that the method for manufacturing the porous body 102 is not limited to the above. For example, raw material powders such as aluminum oxide and silicon oxide having an appropriate particle size distribution are added with an excessive amount of an appropriate organic solvent and a binder to prepare a ceramic green sheet having a low green density. Other manufacturing methods may be used to obtain the desired porous structure and openings in the porous structure, such as firing to obtain a porous ceramic sintered body with low porcelain density.

The support 107 functions as a bonding material for positioning the porous body 102 on the substrate 101. For example, lead silicate glass (PbO-- _SiO.sub.2 system, PbO-- _{B.sub.2 O.sub.3} -- _SiO.sub.2 system, etc.), Borate glass (B ₂ O ₃ system, Li ₂ O--B ₂ O ₃ system, Na ₂ O--B ₂ O ₃ system, etc.), phosphate glass (Na ₂ O--P ₂ O ₅ system, B ₂ O ₃ --P ₂ O ₅ system, etc.) and tin zinc phosphate glass (P ₂ O ₅ --SnO--ZnO system). Considering the global environment, borate glass, phosphate glass, tin-zinc phosphate glass, etc., which are lead-free glasses, may be used. In the case of lead silicate glass, the baking temperature is about 350 to 450° C., so bonding can be performed at a relatively low temperature, and the heat effect on the electronic component 202 accommodated in the package can be reduced. The support 107 described above contains a filler component. The filler component can be, for example, the same ceramic material as the insulating substrate to be joined. Therefore, it is possible to match the coefficient of linear expansion of the support 107 to that of the substrate 101 . Note that the support 107 is not limited to glass, and may be made of metal brazing material such as solder, resin, or the like.

The lid 100 of the present disclosure has a first surface 103 and a second surface 104 opposite the first surface 103, and a substrate 101 having a plurality of through holes 108 extending from the first surface 103 to the second surface 104. , and a porous body 102 positioned to face the substrate 101 at a position overlapping at least one of the plurality of through holes 108 when viewed through the plane.

With the above configuration, even if the cover body 100 becomes smaller due to the miniaturization of the electronic device 200, the lack of strength of the porous body 102 can be compensated for by the substrate 101, and the reliability is excellent and the lid body 100 is resistant to dust, high humidity, and the like. It is possible to provide the lid 100 that is highly environmentally friendly and has a good filter function. In other words, when only the porous body 102 having a porous structure is used as the lid body 100, the strength may be insufficient. Thus, it is possible to provide the lid body 100 which is excellent in reliability after bonding, has high environmental resistance against dust, high humidity, etc., and has a good filter function. An example of the lid 100 is shown in FIGS. 1(a) and 1(b).

A plurality of through holes 108 are located through the first surface 103 and the second surface 104 of the substrate 101 . In FIG. 1A, a total of nine through-holes 108 of 3 rows and 3 columns are positioned in the central portion of the substrate 101 in plan view. The substrate 101 is larger than the porous body 102, and the porous body 102 is supported on the second surface 104 side of the substrate 101 by a frame-shaped support 107 along the outer edge of the porous body 102. positioned. In addition, as shown in FIG. 1B, the plurality of through holes 108 of the substrate 101 are positioned inside the support 107 in a plan view, and the plurality of first openings on the side of the first surface 103 of the substrate 101 From 108a to the lower surface of the porous body 102, a lid body 100 having air permeability is constructed.

If the substrate 101 is, for example, an aluminum oxide sintered body, the porous body 102 is composed of an aluminum oxide sintered body, and the support 107 that joins the substrate 101 and the porous body 102 is made of an aluminum oxide sintered body. A material having a coefficient of linear expansion similar to that of the body can be used. Therefore, in the external environment where the electronic device 200 is used, the stress acting on the substrate 101 and the porous body 102 due to temperature changes can be relaxed, and problems such as peeling of the porous body 102 from the substrate 101 are less likely to occur. Further, the substrate 101, the porous body 102, and the support 107 are made of inorganic materials, which are hardly affected by the external environment such as heat and ultraviolet rays, and have excellent environmental resistance.

Also, in the lid 100 of the present disclosure, the porous body 102 covers the plurality of openings on the side of the substrate 101 where the porous body 102 is located. With the above configuration, through the porous body 102 and the plurality of through holes 108 having a plurality of openings located from the first surface 103 to the second surface 104 of the substrate 101, the air permeability in the thickness direction can be improved. In other words, the plurality of through-holes 108 located in the substrate 101 makes it possible to take in more gas from the external environment, and the porous body 102 is also breathable not only in the thickness direction but also in the horizontal direction. The porous body 102 having a allows the intake of gas from the external environment into the cavity 112 .

The lid 100 includes, for example, a substrate 101 having a thickness of about 0.1 to 0.5 μm and a porous body 102 having a thickness of about 0.1 to 0.5 μm. is joined. Air permeability is provided between the plurality of first openings 108a on the first surface 103 side of the substrate 101 and the surface of the porous body 102 on the cavity 112 side. Therefore, it is possible to provide the lid body 100 having an excellent filter function.

Further, the lid body 100 of the present disclosure has a space 110 between at least one of the plurality of through-holes 108 and the porous body 102 that overlap each other when viewed through the plane. With the above configuration, the gas taken in through the plurality of through-holes 108 of the substrate 101 can be permeated through the space 110 and the porous body 102 while ensuring dustproofness and waterproofness on the first surface 103 side of the substrate 101. Even if the gas taken from the external environment has a non-uniform concentration, the gas can be taken into the cavity 112 through the porous body 102 at a nearly uniform concentration. In other words, the gas taken in from the external environment stays in the space 110 appropriately, and when passing through the porous body 102, the gas of non-uniform concentration is mixed, so that the gas concentration is almost uniform in the cavity. Since it is taken into 112, the gas detection sensitivity can be improved.

The plurality of openings (through-holes 108) located in the substrate 101 may be configured with a size of approximately φ80 μm to 150 μm, for example. With the above configuration, relatively large dust, water droplets, etc. can be prevented from entering the interior of the package. In FIG. 1(a), the shape of the through-holes 108 is circular in a plan view, and a plurality of through-holes 108 arranged in 3 vertical×3 horizontal positions are shown. Other shapes of through-holes 108 and other numbers of lids 100 may be used. Furthermore, the porous body 102 has a porous structure and has air permeability in the thickness direction and the horizontal direction of the porous body 102 . The opening of the porous body 102 is configured, for example, about 0.1 to 1.0 μm, and it is possible to suppress even small dust such as PM2.5 (fine particulate matter) contained in the atmosphere from entering the package. , it is possible to provide the lid body 100 having an even better filter function.

Lid 100 of the present disclosure also has support 107 between substrate 101 and porous body 102, and space 110 is surrounded by substrate 101, porous body 102, and support 107. . With the above configuration, through the porous body 102 and the plurality of through holes 108 having a plurality of openings located from the first surface 103 to the second surface 104 of the substrate 101, the air permeability in the thickness direction can be improved. In other words, as shown in FIGS. 1A and 1B, the plurality of through-holes 108 located in the substrate 101 makes it possible to take in more gas from the external environment, and the porous body 102 In this case, the porous body 102 having gas permeability not only in the thickness direction but also in the horizontal direction enables the gas from the external environment to be taken into the cavity 112 .

The lid 100 includes, for example, a substrate 101 having a thickness of about 0.1 to 0.5 μm and a porous body 102 having a thickness of about 0.1 to 0.5 μm. are connected seamlessly. Then, the gas taken in from the plurality of first openings 108a on the first surface 103 side of the substrate 101 passes through the plurality of second openings 108b on the second surface 104 side and the surface of the porous body 102 on the cavity 112 side. It is configured to allow air to pass through between them and permeate through the porous body 102 in the above case. That is, the substrate 101 (excluding the through-holes 108) and the support 107 have no air permeability, and the space 110 is surrounded by the substrate 101, the porous body 102 and the support 107, so the first surface of the substrate 101 Gas entering from the 103 side permeates the porous body 102 and is taken into the cavity 112 . Therefore, it is possible to provide the lid body 100 having a better filter function. In FIG. 1A, the shape of the support 107 is positioned as a frame when viewed through a plan view. It may be positioned in shape.

Further, the lid body 100 of the present disclosure has a barrier portion 109 between the openings of the plurality of through holes 108 at positions overlapping the space 110 when seen from above. With the above configuration, even if water 116 enters the through-hole 108 of the substrate 101, the water 116 spreads from the portion below the through-hole 108 to the portion below the adjacent through-hole 108 in the porous body 102. can be suppressed, and entry of water 116 into the interior of the package can be further suppressed to ensure air permeability.

In other words, barrier portion 109 partially covering porous body 102 does not allow water 116 to permeate. It is easy to enter and stay in the part of. Furthermore, below the substrate 101 where the through-holes 108 are not located, the porous body 102 is less likely to be affected by the water 116, so air permeability is easily ensured.

The barrier part 109 has a thickness of about 5 to 20 μm, and the upper surface of the barrier part 109 is positioned higher than the main surface of the porous body 102. Therefore, the barrier part 109 functions as a dam, and the porous body 102 is: Water 116 that has entered the lower portion of through-hole 108 is suppressed from spreading beyond barrier portion 109 to the lower portion of adjacent through-hole 108 . Therefore, barrier portion 109 partially covering porous body 102 can prevent water 116 from entering porous body 102 and can prevent water 116 from spreading in the planar direction of porous body 102 . As in the example shown in FIG. 7, which will be described later, when the porous body 102 is located on the opposite side of the package cavity 112 on the substrate 101, the barrier section 109 prevents water 116 from entering the package. can do.

Further, in the lid body 100 of the present disclosure, the barrier portion 109 is positioned so as to surround each opening of the plurality of openings when viewed through the plane. With the above configuration, even if water 116 enters the through-hole 108 of the substrate 101, the water 116 spreads from the portion below the through-hole 108 to the portion below the adjacent through-hole 108 in the porous body 102. can be further suppressed, and water 116 can be further suppressed from entering the interior of the package to ensure air permeability.

In other words, as shown in FIGS. 2A and 2B, the barrier portion 109 partially covering the porous body 102 does not permeate the water 116. Therefore, even if the water 116 enters the through-hole 108 of the substrate 101, Since the barrier part 109 is positioned so as to surround each opening, the water 116 easily enters and stays in the narrow region of the porous body 102 below each of the plurality of through-holes 108 . Furthermore, below substrate 101 where through-holes 108 are not located, porous body 102 is less susceptible to water 116, so air permeability is ensured in a wider range of porous body 102. FIG.

Since the upper surface of barrier part 109 is positioned higher than the main surface of porous body 102, barrier part 109 functions as a dam and is positioned below through-hole 108 in porous body 102. The water 116 that has entered the portion is suppressed from spreading beyond the barrier portion 109 to the portion located below the adjacent through-hole 108 . Therefore, each of the plurality of openings and the barrier section 109 positioned so as to surround the plurality of openings suppress the entry of the water 116 into the porous body 102 and prevent the water 116 from flowing in the planar direction of the porous body 102. spread can be more effectively suppressed. As in the example shown in FIG. 7, which will be described later, when the porous body 102 is located on the opposite side of the package cavity 112 on the substrate 101, the barrier section 109 further prevents water 116 from entering the interior of the package. can be suppressed.

Also, in the lid body 100 of the present disclosure, the barrier part 109 is positioned on the porous body 102 . With the above configuration, even if water 116 enters through-hole 108 of substrate 101, water 116 spreads from porous body 102 below through-hole 108 to porous body 102 below adjacent through-hole 108. can be suppressed, and the strength of the porous body 102 can be improved. In other words, even if the lid body 100 is made smaller due to the miniaturization of the electronic device 200, the barrier part 109 can compensate for the lack of strength of the porous body 102, so that the lid body 109 is waterproof, highly reliable, and has excellent environmental resistance. It is possible to provide the lid body 100 which is high and has a filter function.

As shown in FIGS. 2A and 2B, if the barrier portion 109 partially covering the porous body 102 is positioned above the porous body 102, the barrier portion 109 does not allow water 116 to pass through. , even if water 116 enters the through-holes 108 of the substrate 101, the water 116 tends to stay in narrow regions of the porous body 102 below each of the plurality of through-holes 108. FIG. Furthermore, below the substrate 101 where the through-holes 108 are not located, the porous body 102 is less likely to be affected by the water 116, so air permeability is easily ensured in a wider range of the porous body 102. FIG.

Furthermore, the lack of strength of the porous body 102 can be more effectively compensated for by the substrate 101 having a large strength, and the barrier section 109 located on the porous body 102 prevents the strength of the porous body 102 from being insufficient. can be compensated for. The barrier section 109 functions as a film that suppresses the entry of water 116 into the porous body 102, and can be made of, for example, various types of glass, metal, resin, etc. similar to the support 107 described above. As in the example shown in FIG. 7, which will be described later, when the porous body 102 is located on the opposite side of the package cavity 112 on the substrate 101, the barrier section 109 located on the porous body 102 prevents the water 116 from can be effectively retained in the porous body 102, and water 116 can be suppressed from entering the interior of the package.

Also, in the lid body 100 of the present disclosure, the barrier section 109 is positioned on the substrate 101 . With the above configuration, water 116 that has entered through-hole 108 of substrate 101 can be guided to a narrow range of porous body 102 below through-hole 108, so that water 116 flows into adjacent through-holes in porous body 102. Spreading to the lower portion of 108 is suppressed, the influence of water 116 is reduced, and breathability can be ensured.

In other words, as shown in FIGS. 3A and 3B, since water 116 does not pass through the barrier section 109 located on the substrate 101, even if the water 116 enters the through hole 108 of the substrate 101, Barrier portion 109 functions as a path for water 116, and water 116 easily enters and stays in narrow regions of porous body 102 below each of through-holes 108. FIG. Furthermore, below the substrate 101 where the through-holes 108 are not located, the porous body 102 is less likely to be affected by the water 116, so that the porous body 102 tends to ensure air permeability over a wide area. Therefore, the barrier part 109 located on the substrate 101 suppresses the entry of the water 116 into the porous body 102 in the region excluding the porous body 102 below the through-hole 108, thereby preventing the porous body 102 from Spreading of the water 116 in the direction can be effectively suppressed. 7, which will be described later, when the porous body 102 is located on the opposite side of the package cavity 112 on the substrate 101, even if the water 116 enters the space 110, Water 116 can be prevented from entering the interior of the package by the barrier portion 109 positioned at the bottom.

Also, in the lid body 100 of the present disclosure, the barrier part 109 is positioned on the porous body 102 and on the substrate 101 . With the above configuration, water 116 that has entered through-holes 108 of substrate 101 can be guided to a narrower range of porous body 102 below through-holes 108, so that adjacent through-holes 108 in porous body 102 It is possible to suppress the spread of water 116 in the lower portion, reduce the influence of water 116, and ensure breathability.

That is, as shown in FIGS. 4A and 4B, the barrier section 109 located on the porous body 102 and the substrate 101 does not allow the water 116 to pass therethrough. Even if 116 enters, the barrier part 109 functions as a path for the water 116, and the water 116 enters narrower regions of the porous body 102 below each of the plurality of through-holes 108 and tends to stay there. Furthermore, below the substrate 101 where the through-holes 108 are not located, the barrier portion 109 is located on the porous body 102, and the porous body 102 is not easily affected by the water 116. Ventilation is ensured over a wider range. Therefore, the barrier part 109 located on the substrate 101 suppresses the entry of the water 116 into the porous body 102 in the region excluding the porous body 102 below the through-hole 108, thereby preventing the porous body 102 from Spreading of the water 116 in the direction can be more effectively suppressed. As in the example shown in FIG. 7, which will be described later, when the porous body 102 is located on the opposite side of the package cavity 112 on the substrate 101, the water 116 is effectively transferred to the porous body 102 by the barrier section 109. Even if the water 116 enters the space 110, the barrier portion 109 can prevent the water 116 from entering the inside of the package.

Barrier portion 109 located on porous body 102 and substrate 101 may be separated in the thickness direction of lid 100, and porous body 102 and substrate 101 may be separated in the thickness direction of lid 100. It may be located continuously between

Further, the lid body 100 of the present disclosure has a partition portion 111 so that the barrier portion 109 partitions each of a plurality of adjacent openings. With the above configuration, even if water 116 enters the through hole 108 of the substrate 101, the entering water 116 is suppressed from spreading beyond the partition part 111. Therefore, the first opening on the first surface 103 side of the substrate 101 Ventilation can be ensured from 108a to the lower surface of the porous body 102 (on the cavity 112 side). That is, as shown in FIGS. 5(a) and (b), the partition portion 111 of the barrier portion 109 partitions each of the plurality of adjacent openings, and the support member 107, the barrier portion 109, the support member 107, And since water 116 does not pass through partition 111 , even if water 116 enters through-hole 108 of substrate 101 , water 116 is positioned below through-hole 108 and surrounded by substrate 101 , support 107 and partition 111 . It easily enters and stays in the closed porous body 102 . Furthermore, the porous body 102 surrounded by the substrate 101, the support 107, and the partition portion 111, which is located below the substrate 101 where the through-holes 108 are not located, is not easily affected by the water 116, so air permeability is ensured. be done.

If the barrier portion 109 has a thickness of about 5 to 20 μm, the upper surface of the barrier portion 109 is positioned higher than the main surface of the porous body 102, so the barrier portion 109 functions as a dam, and the porous body 102 , the water 116 entering the portion surrounded by the support 107 and the partition 111 from the through-hole 108 is suppressed from spreading beyond the barrier 109 to the adjacent portion surrounded by the partition 111 . Therefore, the barrier section 109 partially covering the porous body 102 suppresses the entry of the water 116 into the porous body 102, and the partition section 111 also restricts the spreading of the water 116 to the porous body 102. , the spreading of the water 116 in the plane direction of the porous body 102 can be effectively suppressed.

As shown in FIG. 5B, if the barrier part 109 is separated from the second surface 104 of the substrate 101 in a cross-sectional view, that is, it is located on the second surface 104 of the substrate 101 and the upper surface of the porous body 102. If a space 110 is provided between the barrier portion 109 and the porous body 102, the portion of the porous body 102 surrounded by the support 107 located below the plurality of through-holes 108 and the partition portion 111 is covered with water 116. Even if the through-hole 108 is not located below the substrate 101, the gas in the planar direction between the substrate 101, the support 107, and the porous body 102 surrounded by the partition 111 is not allowed to pass through the space 110. Therefore, it is possible to realize the lid body 100 that is dustproof, waterproof, and has good air permeability. As in the example shown in FIG. 7, which will be described later, when the porous body 102 is located on the opposite side of the package cavity 112 on the substrate 101, the barrier section 109 located on the porous body 102 prevents the water 116 from is easily retained in the porous body 102, and water 116 can be suppressed from entering the interior of the package.

Barrier section 109 having partition section 111 may be positioned on porous body 102 and separated from substrate 101 in the thickness direction of lid 100. Barrier section 109 may be positioned on substrate 101 and be separated from lid 100. It may be separated from the porous body 102 in the thickness direction, may be located on the porous body 102 and the substrate 101, and may be separated in the thickness direction of the lid 100, or may be separated from the porous body 102 and the substrate. 101 and may be positioned continuously. Furthermore, in FIG. 5, in the substrate 101, two regions where the three through-holes 108 are located sandwich one region where the through-holes 108 are not located. However, another number of through-holes 108 may be positioned, or a configuration in which a plurality of through-holes 108 are positioned and a plurality of through-holes 108 are not positioned may be positioned in another number.

The package of the present disclosure has a base body 201 having a cavity 112, and any of the lid bodies 100 described above, in which the substrate 101 and the porous body 102 are arranged in the depth direction of the cavity 112 to close the cavity 112. . With the above configuration, it is possible to provide a package for electronic device 200 in which electronic component 202 mounted in cavity 112 is protected and filter function is added by lid 100 . That is, the electronic component 202 is surrounded by the base 201 and the lid 100 to protect the electronic component 202 from the external environment. The substrate 101 compensates for the lack of strength, and a package that becomes the electronic device 200 with high environmental performance against temperature and humidity and excellent reliability of the electronic component 202 can be provided.

The substrate 201 is, for example, a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a mullite sintered body. , a wiring conductor 203, and an external connection conductor (not shown), and the upper surface of the frame functions as a joint to which the lid 100 is joined.

The material of the substrate 201 is not limited to ceramic sintered bodies, and may be resin. A cavity 112 is positioned in a region surrounded by the base and the frame, and wiring conductors 203 on which electronic components 202 are mounted are positioned on the bottom surface of the cavity 112 (upper surface of the base). The wiring conductor 203 is led out to an external connection conductor (not shown) located on the lower surface of the base through an internal wiring (not shown).

The lid 100 bonded to the base 201 includes, for example, a substrate 101, a porous body 102, a support 107, and a barrier section 109, and the porous body 102 is supported on the lower surface side (second surface 104 side) of the substrate 101. Located by body 107 . A part of the porous body 102 is covered with the barrier section 109 . With the above configuration, the lid 100 is dustproof, waterproof, and has a filter function that ensures air permeability.

Also, in the package of the present disclosure, the porous body 102 is located inside the package. With the above configuration, it is possible to provide a package that serves as electronic device 200 in which electronic component 202 mounted in cavity 112 is protected while lid 100 adds a more effective filter function. In other words, electronic component 202 is surrounded by a package including base 201 and lid 100 to protect electronic component 202 from the external environment. An electronic device 200 in which the porous body 102 is isolated from the external environment, the substrate 101 compensates for the lack of strength of the porous body 102, the environmental performance against temperature and humidity is higher, and the reliability of the electronic component 202 is excellent. We can offer you a package. The above package is shown in FIG.

The cover 100 bonded to the base 201 includes a substrate 101, a porous body 102, a support 107, and a barrier section 109, as shown in cross-sectional see-through in FIG. The porous body 102 is positioned by the support 107 on the side). Therefore, the substrate 101 isolates the porous body 102 from the external environment. A part of the porous body 102 is covered with the barrier section 109 . With the above configuration, cracking, chipping, etc. of the porous body 102 are suppressed, and the lid 100 is provided with dustproof, waterproof, and air-permeable filter functions to prevent gas from the external environment. A package can be provided that can be captured within cavity 112 .

Also, in the package of the present disclosure, the porous body 102 is located on the opposite side of the substrate 101 from the cavity 112 . With the above configuration, the electronic component 202 mounted in the cavity 112 is protected, and the lid 100 adds a more effective filter function, so that a package that serves as the electronic device 200 can be provided. That is, the electronic component 202 is surrounded by a package including the base 201 and the lid 100 to protect the electronic component 202 from the external environment. By locating the porous body 102 on the exposed side, the uppermost surface of the lid 100 can prevent dust from entering the package, resulting in excellent dust resistance. The above package is shown in FIG.

The lid 100 bonded to the base 201 includes a substrate 101, a porous body 102, a support 107, and a barrier section 109, as shown in FIG. The porous body 102 is joined to the support 107 on the side). With the above configuration, the porous body 102 provides the lid 100 with a more effective dustproof property, adds a filter function that ensures air permeability, and allows gas from the external environment to be taken into the cavity 112. I can provide a package.

As shown in FIG. 7, if the joint 113 to be joined to the substrate 201 is positioned along the outer edge of the first surface 103 side of the substrate 101, the strength of the porous body 102 is insufficient, and the strength is large. The structure can be supplemented by the substrate 101 provided.

Electronic device 200 of the present disclosure comprises electronic component 202 in cavity 112 in any of the packages described above. With the above configuration, the lid body 100 adds a filter function, high environmental performance against temperature and humidity, and electronic device 200 with excellent reliability of electronic component 202 can be provided. In other words, even if the cover body 100 becomes smaller due to the miniaturization of the electronic device 200, the lack of strength of the porous body 102 can be compensated for by the substrate 101, and the bonding reliability is excellent, the environmental resistance is high, and the filter function is provided. Electronic device 200 to which lid 100 is joined can be provided. An example implementation of the electronic device 200 is shown in FIGS.

The electronic component 202 mounted on the base 201 includes, for example, a gas sensor element, an atmospheric pressure sensor element, a microphone element, and the like. Various information of the external environment is acquired by the various sensor elements described above, and the user can obtain various information about the environment. The above sensor devices are used as gas sensors, air pressure sensors, microphones, and the like.

For example, if the electronic device 200 shown in FIGS. The gas to be sensed is circulated from the through hole 108 through the porous body 102 to the gas sensor element (electronic component 202), and what kind of gas component is contained in the environment is detected. Also, a water-repellent film (not shown) may be positioned on the first surface 103 of the substrate 101 of the lid 100 in order to prevent the water 116 from entering the interior of the package. In addition, for example, by positioning a plurality of recesses (not shown) on the upper and lower surfaces of the porous body 102 to increase the specific surface area of the porous body 102 as a filter, the pressure loss between the inside of the package and the external environment can be reduced. A lid body 100 that has a small air permeability and ensures good air permeability may be used. Furthermore, as shown in FIGS. 2 to 5, a barrier portion 109 and a partition portion 111 may be positioned between the substrate 101 and the porous body 102 in order to improve waterproofness.

The lid 100 is bonded to the top surface of the base 201 on which the electronic component 202 is mounted with a bonding material 117 made of resin, for example. The bonding material 117 is made of, for example, epoxy resin or polyimide resin. The bonding material 117 is positioned along the outer edge of the second surface 104 of the substrate 101 of the lid 100 and bonded to the upper surface of the base 201 . Specifically, after the bonding material 117 is applied to the upper surface of the base 201 in a frame shape, the second surface 104 of the substrate 101 of the lid body 100 faces the bonding material 117 applied to the base 201. Positioning is performed using an arrangement jig or the like. That is, the lid 100 is positioned above the base 201 to which the bonding material 117 is applied, and the bonding material 117 is placed between the upper surface of the base 201 and the second surface 104 of the substrate 101 of the lid 100 . is positioned. After the above, the bonding material 117 is cured by heating, and the lid 100 is bonded to the upper surface of the base 201 .

As shown in FIG. 6, porous body 102 is smaller than substrate 101 . Therefore, when the lid 100 is positioned on the upper surface of the base 201 to which the bonding material 117 is applied, the porous body 102 is smaller than the opening of the base 201. By inserting the body 102, positioning of the lid 100 on the base 201 is facilitated. Then, the package 201 and the lid body 100 are bonded with the bonding material 117 . If the temperature of the heat treatment when bonding the base 201 and the lid 100 with the bonding material 117 is lower than the temperature of the heat treatment when bonding the substrate 101 of the lid 100 and the porous body 102 with the support 107 , the support 107 is softened again and the bond between the substrate 101 and the porous body 102 is not destroyed.

In FIG. 6, the substrate 101 is positioned on the upper side (the side exposed to the external environment), the porous body 102 is positioned on the lower side (the base 201 side), and the bonding portion 113 on the second surface 104 side of the substrate 101 is positioned. Although an example in which the lid body 100 is bonded to the base body 201 is shown, as shown in FIG. The lid body 100 with the position may be joined to the base 201. In the above case, if the bonding portion 113 bonded to the substrate 201 is positioned along the outer edge of the substrate 101, the lack of strength of the porous body 102 can be compensated for by the substrate 101 having high strength. With the body 102 side facing the external environment, the electronic device 200 having a filter function with better dust resistance can be realized. In order to prevent water 116 from entering the inside of the package, a configuration in which a water-repellent film (not shown) is positioned on the main surface of the porous body 102 of the lid 100 may be employed.

In recent years, due to the demand for miniaturization of various sensor devices, the size of the substrate 201 on which the sensor element is mounted has become smaller. By using the functional lid body 100, it is possible to realize the electronic device 200 that is smaller and lower in height and that can be surface-mounted.

An electronic module 300 of the present disclosure has a module board 301 and the electronic device 200 described above connected to the module board 301 . With the configuration described above, by using the electronic device 200 in which the reliability of the electronic component 202 having the filter function by the lid 100 is improved, the electronic module 300 with excellent operational stability can be provided. In other words, even if the cover body 100 becomes smaller due to the miniaturization of the electronic device 200, the lack of strength of the porous body 102 can be compensated for by the substrate 101, and the bonding reliability is excellent, the environmental resistance is high, and the filter function is provided. Electronic device 200 to which lid 100 is joined can provide electronic module 300 with excellent operational stability of electronic component 202 . An example implementation of an electronic module 300 is shown in FIGS.

The electronic module 300 is installed in a mobile terminal such as a smart phone or a mobile phone. If the electronic component 202 mounted on the substrate 201 is, for example, a microphone element (not shown) made of silicon, the first surface 103 to the second surface of the substrate 101 included in the lid 100 installed on the outer surface of the substrate 201 is used. A user's voice or the like (acoustic signal) enters the cavity 112 of the package through the porous body 102 through a plurality of through holes 108 located across the surface 104, and the acoustic signal is applied to the vibrating membrane of the microphone element. When an acoustic signal is applied to the vibrating membrane, the vibrating membrane vibrates due to the acoustic signal, the capacitance of the vibrating membrane changes, and the microphone element detects the acoustic signal. Then, the change in capacitance of the vibrating membrane of the microphone element, that is, the acoustic signal detected by the microphone element is converted into an electric signal. The obtained electric signal is transmitted from the external connection conductor located on the lower surface of the substrate 201 to the module substrate 301 via the brazing material 303 and the connection pad 302 .

The external environment in which mobile terminals are used is becoming more severe year by year in consideration of outdoor and sports use, etc., and stable operation is required even in environments such as sand, dust, rain, and snow. . By using the electronic module 300 of the present disclosure, a filter function is added by the lid body 100, excellent dust resistance and water resistance against dust and moisture from the external environment, high environmental performance, and reliability of the electronic component 202. An excellent electronic device such as a portable terminal can be realized.

Note that the lid 100, the base 201, the package, the electronic device 200, the electronic module 300, and the like of the present disclosure are not limited to the examples of the above-described embodiments, and various modifications can be made without departing from the gist of the present disclosure. It doesn't matter if you change it. For example, in the example disclosed above, the shape of the lid body 100 in plan view is rectangular, but it may be square, circular, elliptical, or the like depending on the shape of the base 201 used. Further, the electronic component accommodated in the package may be an electronic component other than the sensor element, and a plurality of electronic components may be accommodated at the same time. Chamfered portions such as cutouts may be positioned at the four corners of the lid 100 in plan view. Furthermore, the through-hole 108 located in the substrate 101 of the lid 100 is not limited to a circular shape in plan view, and may be polygonal, elliptical, or other shapes. A combined configuration is also possible.

Claims (11)

a substrate having a first surface and a second surface opposite to the first surface and having a plurality of through holes extending from the first surface to the second surface;
a porous body located opposite to the substrate at a position overlapping at least one of the plurality of through-holes in planar see-through ,
A lid body having a space between at least one of the plurality of through-holes and the porous body that are superimposed when viewed through a plane . A support is provided between the substrate and the porous body,
the space is surrounded by the substrate, the porous body and the support;
The lid according to claim 1 . A barrier part is provided between openings of the plurality of through-holes at positions overlapping the space in planar see-through,
The lid according to claim 1 or 2 . In planar perspective, the barrier portion is positioned to surround each opening,
The lid according to claim 3 . The barrier section has a partition section so as to partition between the plurality of adjacent openings.
The lid according to claim 3 . a substrate having a cavity;
The lid according to any one of claims 1 to 5 , wherein the substrate and the porous body are arranged in the depth direction of the cavity to block the cavity;
A package with The porous body is located inside the package,
7. Package according to claim 6 . the porous body is located on the opposite side of the cavity from the substrate;
7. Package according to claim 6 . A package having a base having a cavity and a lid,
The lid includes a substrate having a first surface and a second surface located opposite to the first surface, and having a plurality of through holes extending from the first surface to the second surface; a porous body located opposite to the substrate at a position overlapping at least one of the through-holes;
the lid closes the cavity by arranging the substrate and the porous body in the depth direction of the cavity;
The package, wherein the porous body is located inside the package. An electronic component is provided in the cavity in the package according to any one of claims 6 to 9,
electronic device. a module substrate;
and the electronic device according to claim 10 connected to the module substrate,
electronic module.

Images