JP7119733B2 - Molded body manufacturing method and molded body manufacturing apparatus - Google Patents

Description

The present invention relates to a method for manufacturing a molded article and an apparatus for manufacturing a molded article.

Photolithography and thermal imprinting, for example, are known as methods of manufacturing a molded article in which a fine pattern is formed on a resin substrate or a resin film.
In the thermal imprint method, in order to obtain moldability suitable for imprint molding, first, a resin is heated to a temperature equal to or higher than the glass transition temperature (Tg) to soften it, and then the softened resin is placed in a mold. The resin is pressed against a transfer surface having a fine structure and pressure-molded, the resin is cooled to Tg or less in this state, and then the resin is released from the mold, and the fine structure of the transfer surface of the mold is transferred to the resin surface. It is a method in which unevenness is formed by The use of the thermal imprint method has the advantage of being able to significantly shorten the process compared to the use of the photolithography method.

For example, in Patent Document 1, a mold is pressed against a dry film in a semi-cured state by a thermal imprinting method in a heated state, and cooled after pressing, so that the uneven shape of the mold is reversed. A method of forming a transferred Fresnel lens is disclosed.
In addition, Patent Document 2 discloses a method of forming a membrane carrier having a concave fine structure used in a liquid sample test kit by thermal imprinting.

WO2012/043573 WO2016/098740

However, in the molded product obtained by the conventional thermal imprinting method, there is a possibility that the fine structure transferred to the material to be transferred is distorted with respect to the uneven fine structure of the mold.

The present invention has been made in view of the above circumstances, and provides a method for manufacturing a compact having a fine structure transferred thereon, capable of precisely transferring the fine structure on the transfer surface of a mold without distortion. An object of the present invention is to provide an apparatus for manufacturing a molded body.

As a result of intensive studies to solve the above problems, the present inventors have found that the transfer material pressed against the transfer surface of the heated mold is placed on the opposite side of the transfer material that is not in contact with the mold. It has been found that when cooled from a mold, the material to be transferred can be separated from the mold without applying external force, and the fine structure of the transfer surface of the mold can be precisely transferred to the material to be transferred without distortion. .

In order to solve the above problems, the present invention employs the following configuration.
[1] A step of pressing the surface of a material to be transferred against a transfer surface having a microstructure of a heated mold, and placing the material to be transferred on the opposite side of the material to be transferred that is not in contact with the mold. a step of cooling the material to be transferred from the mold, and separating the material to be transferred from the mold.
[2] The method for producing a molded article according to [1] above, comprising the step of cooling the transfer material by blowing cold air onto the transfer material and separating the transfer material from the mold.
[3] The method according to [2] above, wherein the step of cooling the transfer material by blowing cold air from one end of the transfer material to the other end to separate the transfer material from the mold. A method for producing the described molded body.
[4] The method for producing a molded article according to any one of [1] to [3], wherein the material to be transferred is a resin film.
[5] The method for producing a molded article according to [4], wherein the material to be transferred is a polycycloolefin resin film.
[6] In the step of peeling, the peeling temperature T (° C.) of the mold and the glass transition temperature Tg (° C.) of the material to be transferred satisfy the relationship of the following formula (1), ] or the method for producing a molded article according to [5].
Tg-50°C≤T≤Tg+30°C (1)
[7] The method for producing a molded article according to any one of [1] to [6], wherein the transfer surface of the mold is Ni electroformed.
[8] means for pressing the surface of a transfer material against a transfer surface having a microstructure of a heated mold; and means for blowing cold air.

By using the molded article manufacturing method and the molded article manufacturing apparatus of the present invention, the fine structure of the transfer surface of the mold can be precisely transferred without distortion, and the molded article with the fine structure transferred can be manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows typically an example of the manufacturing apparatus of the molded object of this invention. 2(a) is a top view of a transfer surface 10a of the mold 10, and FIG. -A longitudinal sectional view. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows typically an example of the manufacturing method of the molded object of this invention. Fig. 3(c), Fig. 3(d), and Fig. 3(e) are top views showing the relationship between the transfer material 20 and the air nozzle 42; FIG. 2 is a schematic cross-sectional view schematically showing an example of how the material to be transferred is cooled from the opposite side not in contact with the mold in the method for manufacturing a molded article of the present invention. FIG. 10 is a schematic cross-sectional view schematically showing an example of how a material to be transferred 20 is peeled off from a mold 10 in a method for manufacturing a molded body of a comparative example;

Hereinafter, a method for manufacturing a molded article and an apparatus for manufacturing a molded article, which are embodiments to which the present invention is applied, will be described in detail. In addition, in the drawings used in the following explanation, in order to make the features easier to understand, the characteristic portions may be enlarged for convenience, and the dimensional ratios of each component may not necessarily be the same as the actual ones. do not have.

<<Manufacturing method>>
The method for producing a molded article having a microstructure transferred to the surface of the material to be transferred according to the present invention is a step of pressing the surface of the material to be transferred against the transfer surface having the microstructure of a heated mold (hereinafter referred to as "step ( i)”), and a step of cooling the transfer material from the opposite side of the transfer material that is not in contact with the mold to separate the transfer material from the mold (hereinafter (referred to as “step (ii)”).

<First embodiment>
In the manufacturing method of the present embodiment, a molded body having a fine structure transferred to the surface of the material to be transferred is manufactured by performing the steps (i) and (ii) using a specific manufacturing apparatus. .

(Molded body manufacturing equipment)
FIG. 1 is a schematic cross-sectional view schematically showing an example of the apparatus for producing a molded article of the present invention. In the method for manufacturing a molded article according to the present embodiment, the molded article manufacturing apparatus 1 shown in FIG. 1 is used. A molded article manufacturing apparatus 1 is an apparatus for manufacturing a molded article in which a microstructure is transferred to the surface of a material to be transferred. and means 40 for blowing cold air onto the material to be transferred from the opposite side of the material to be transferred that is not in contact with the mold after the press is released. The pressing means 30 consists of a pressing device comprising an upper press plate 31 and a lower press plate 32, the lower press plate 32 being capable of automatically controlling the temperature. The means 40 for blowing cool air consists of a cooling device having an air nozzle 42 , an air compression mechanism (not shown) for supplying cold air to the air nozzle 42 , and a nozzle moving mechanism 43 for scanning the air nozzle 42 .

(Mold)
The mold 10 has a transfer surface 10a having a microstructure. FIG. 2(a) is a top view showing the transfer surface 10a of the mold 10 used in this embodiment, and FIG. 2(b) is a vertical cross-sectional view of the mold 10 taken along line AA. The fine structure of the mold 10 has a large number of projections, each projection has a columnar shape, and the transfer surface of the mold is Ni electroformed.

(Receiving material)
In this embodiment, a resin film is used as the transfer material 20 . Specifically, a polycycloolefin resin film having a glass transition temperature (Tg) of 136° C. is used.

In FIG. 1, the material to be transferred 20 is placed on a press upper plate 31 with a silicon wafer 33 interposed therebetween, and the die 10 is placed on a press lower plate 32 with a silicon wafer 34 interposed therebetween. The surface 20a of the material to be transferred 20 faces the transfer surface 10a of the mold 10 .

The thickness of the transferred material is preferably 0.01 mm or more and 10 mm or less, more preferably 0.02 mm or more and 5 mm or less, and particularly preferably 0.04 mm or more and 2 mm or less. By setting the thickness of the material to be transferred to the above lower limit or more, it is possible to suppress the occurrence of wrinkles in the material to be transferred. Thermal conductivity can be improved when the material is cooled from the opposite side that is not in contact with the mold, and the material to be transferred can be peeled off from the mold in a short period of time.

[Step (i)]
Step (i) is a step of pressing the surface of the material to be transferred against the transfer surface having the fine structure of the heated mold.

FIG. 3 is a cross-sectional view schematically showing an example of the method for producing a molded article of the present invention. In the drawings after FIG. 3, the same components as those shown in already explained figures are given the same reference numerals as in the already explained figures, and detailed explanations thereof will be omitted.

The mold 10 is heated H to a predetermined temperature. Then, the surface 20a of the transferred material 20 is opposed to the transfer surface 10a having the fine structure of the heated mold 10 (FIG. 3(a)).

Next, the surface 20a of the material to be transferred 20 is pressed against the transfer surface 10a having the fine structure of the heated mold 10 (FIG. 3(b)). The heat of the heated mold 10 is transmitted to the transfer material 20, and the surface 20a of the transfer material 20 is softened, so that the surface of the transfer material 20 has a reverse shape of the fine structure of the transfer surface 10a of the mold 10. 20a is plastically deformed, and the fine structure of the transfer surface 10a of the mold 10 is transferred to the surface 20a of the material 20 to be transferred.

In step (i) the mold is heated to a predetermined temperature. The pressing temperature _T0 of the mold is not limited as long as it softens the surface 20a of the transfer material 20 and transfers the fine structure of the transfer surface 10a of the mold 10 to the surface 20a of the transfer material 20. . The pressing temperature _T0 of the mold can be appropriately selected depending on the material used as the material to be transferred. For example, if a thermoplastic resin is used as the material to be transferred, the temperature T ₀ (° C.) during pressing of the mold and the glass transition temperature Tg (° C.) of the material to be transferred are expressed by the formula “Tg+5° C.≦T ₀ ≤ Tg + 60°C”, more preferably satisfies the relationship of the formula “Tg + 10°C ≤ T ₀ ≤ Tg + 50°C”, and satisfies the relationship of the formula “Tg + 15°C ≤ T ₀ ≤ Tg + 40°C”. is particularly preferred.

[Step (ii)]
Step (ii) is a step of cooling the material to be transferred from the opposite side of the material to be transferred that is not in contact with the mold to separate the material to be transferred from the mold.

The material to be transferred 20 is cooled C from the opposite side 20 b of the material to be transferred 20 not in contact with the mold 10 to separate the material to be transferred 20 from the mold 10 . In the conventional thermal imprinting method, when the material to be transferred is peeled off from the mold, there is a possibility that the fine structure of the surface of the molded product may be distorted by applying an external force to the material to be transferred. In the manufacturing method of the molded article of the present embodiment, the material to be transferred 20 is cooled C from the opposite side 20b of the material to be transferred 20 which is not in contact with the mold 10, so that the material to be transferred can be cooled without applying an external force. The transfer material 20 can be separated from the mold 10 at a constant speed without bending. Then, it is possible to obtain a molded body 22 in which the fine structure of the transfer surface of the mold is precisely transferred to the surface 20a of the transferred material 20 without distortion.

In this embodiment, the transfer material 20 is cooled C by blowing cold air from the opposite side 20 b of the transfer material 20 that is not in contact with the mold 10 . By powerfully blowing cold air onto the entire transfer material 20, the transfer material 20 can be separated from the mold 10 in a short period of time. As a result, the material to be transferred can be separated from the mold without applying an external force under the condition that the separation temperature T of the mold is relatively high, and the fine structure of the transfer surface of the mold can be precisely transferred without distortion. can be done.

The temperature of the cold air is not limited as long as it can suitably cool the heated mold, and may be room temperature. As used herein, normal temperature means a temperature that is not particularly cooled or heated, that is, a normal temperature.

When the cold air is strongly blown to the entire transfer material 20, it is necessary to blow the cold air from one end of the transfer material 20 to the other end, that is, from one end of the transfer material 20 (FIG. 3(c)) to the central part. It is preferable to cool the transferred material 20 by blowing cold air to the other end (FIG. 3(e)) via (FIG. 3(d)). As a result, the material to be transferred 20 can be gradually peeled off from the mold 10 from one end of the material to be transferred 20 to the other end via the central portion, and the entire material to be transferred 20 can be easily peeled off. , the fine structure of the transfer surface of the mold can be precisely transferred without distortion.

When blowing cold air from one end of the transfer material 20 to the other end, one end of the transfer material 20 is blown as shown in FIGS. By scanning the air nozzle 42 from one end of the transfer material 20 to the other end (FIG. 3(c)), the other end (FIG. 3( In e)), cold air can be blown gradually to cool the transfer material 20 .

FIG. 4 is a top view showing the positional relationship between the transfer material 20 and the air nozzle 42 in FIGS. 3(c), 3(d), and 3(e). It shows how the air nozzle 42 is scanned from one end to the other end.

The speed at which the air nozzle 42 is scanned so that the material 20 to be transferred from the mold 10 is gradually peeled off at a constant speed from one end of the material 20 to the other through the center part to the other end. It is preferably approximately constant. As a result, the fine structure of the transfer surface of the mold can be accurately transferred onto the entire transferred material 20 without distortion, and then peeled off.

In step (ii), the mold is preferably controlled at a predetermined temperature. The release temperature T of the mold is obtained by cooling the material to be transferred from the opposite side of the material to be transferred, which is not in contact with the mold. The temperature is not particularly limited as long as the material to be transferred can be separated from the mold and the fine structure of the transfer surface of the mold can be precisely transferred without distortion. It is preferable that the release temperature T (° C.) of the mold and the glass transition temperature Tg (° C.) of the transferred material satisfy the relationship of the following formula (1).
Tg-50°C≤T≤Tg+30°C (1)

In addition to the glass transition temperature Tg of the material to be transferred, the peeling temperature T of the mold is preferably adjusted according to the size of the pitch of the fine structure of the transfer surface of the mold. If the pitch of the mold is small, it is preferable to adjust the peeling temperature T of the mold to a lower value. It is more preferable that the release temperature T (° C.) of the mold and the glass transition temperature Tg (° C.) of the transfer material satisfy the relationship of the formula "Tg-40 ° C. ≤ T ≤ Tg + 20 ° C." It is particularly preferable to satisfy the relationship "Tg-30°C ≤ T ≤ Tg+10°C". By setting the peeling temperature T of the mold to a temperature equal to or higher than the lower limit, the fine structure of the transfer surface of the mold can be easily transferred precisely without distortion, and the peeling temperature T of the mold is set to the upper limit or lower. By setting the temperature to , the material to be transferred can be efficiently separated from the mold in a short period of time.

In the manufacturing method of the first embodiment described above, when the material to be transferred pressed against the transfer surface of the heated mold is cooled from the opposite side of the material to be transferred which is not in contact with the mold, Since the material to be transferred shrinks and becomes smaller, the material to be transferred does not bend without applying an external force, and the material to be transferred can be peeled off from the mold at a constant speed. It is possible to precisely transfer the fine structure of the transfer surface of the mold without distortion.

(Molded body)
The inverted shape of the fine structure of the transfer surface 10a of the mold 10 is precisely transferred without distortion on the surface of the molded product manufactured by the manufacturing method of the first embodiment. In addition, release unevenness on the surface of the molded article is suppressed, and, for example, when a transparent resin film is used as the material to be transferred, a decrease in light transmittance is suppressed.

<Other embodiments>
In the manufacturing method of the first embodiment described above, polycycloolefin was adopted as the material of the material to be transferred. There is no limitation as long as the fine structure of the transfer surface of the mold can be transferred to the surface of the transfer material by pressing the surface of the transfer material. The material of the material to be transferred may be a thermosetting resin or a thermoplastic resin.

Examples of the thermoplastic resin used as the material to be transferred include polymethyl methacrylate, polycarbonate, polycycloolefin, polyethylene, polystyrene, polypropylene, acrylonitrile/styrene copolymer, acrylonitrile/butadiene/styrene copolymer, polynorbornene, and polyethylene terephthalate. etc. can be used, and it is particularly preferable to use an amorphous resin. Amorphous materials have a wide molding temperature range, so they have good moldability and excellent dimensional stability. Examples of amorphous resins include polymethyl methacrylate, polycarbonate, polycycloolefin, polystyrene, acrylonitrile/styrene copolymer, and acrylonitrile/butadiene/styrene copolymer.

The shape of the material to be transferred is not limited as long as it can be cooled from the side of the material to be transferred that is not in contact with the mold and peeled off from the mold. A film-like or sheet-like shape is preferred.

From the viewpoint of the material and the shape of the material to be transferred, the material to be transferred is preferably a resin film. Further, the material to be transferred is more preferably a polycycloolefin resin film because the heat shrinkage of the resin film is large and the releasability is good.

In the above-described first embodiment, as shown in FIGS. 3(c) to 3(e), from the opposite side 20b of the transfer material 20 that is not in contact with the mold 10, the surface of the transfer material 20 is Although cold air is blown in the vertical direction, it is not limited to this. As shown in FIG. 5, the cold air may be blown backward at an angle to the traveling direction of the air nozzle 42 . Further, by using a flat-type air nozzle as the air nozzle 42 and keeping the scanning speed of the air nozzle 42 constant, the material 20 to be transferred from the mold 10 is transferred from one end of the material 20 to Through the central part, it can be gradually peeled off at a constant speed toward the other end, without causing mold release unevenness, without distortion of the fine structure of the transfer surface of the mold, and more precisely. 20 surface.

<<Molding body manufacturing equipment>>
The molded article manufacturing apparatus of the present invention will be described in more detail using the drawing of the molded article manufacturing apparatus 1 of FIG.
A molded article manufacturing apparatus 1 is an apparatus for manufacturing a molded article in which a fine structure is transferred to the surface of a material to be transferred. It has means 30 for pressing the surface of the material, and means 40 for blowing cold air onto the material to be transferred from the opposite side of the material to be transferred that is not in contact with the mold.

The mold 10 has a transfer surface 10a having a fine structure. The transfer surface having a microstructure may be a striped uneven microstructure, or may be a microstructure having individual recesses or protrusions. A fine structure having individual recesses or protrusions is preferred because it can be precisely transferred and the effects of the present invention can be more pronounced.

The shapes of the individual convex portions and the concave portions are columnar, conical, hemispherical, chamfered corners of these shapes, connected shapes, or combined shapes. There may be. For example, when the shape of the convex portion is columnar, it may be columnar or quadrangular columnar.

The height of the projections on the transfer surface of the mold may be 0.01 to 3000 μm, 0.02 to 2000 μm, or 0.03 to 1000 μm. The pitch of the protrusions may be 0.02 to 6000 μm, 0.04 to 4000 μm, or 0.06 to 2000 μm.

Examples of the projections on the transfer surface of the mold having a columnar shape include those shown in FIG. The diameter d of the cylinder may be 0.1-3000 μm, 0.2-2000 μm, or 0.3-1000 μm. The height h of the cylinder may be 0.01-3000 μm, 0.02-2000 μm, or 0.03-1000 μm. The pitch p of the cylinders may be 0.02-6000 μm, 0.04-4000 μm, or 0.06-2000 μm.

The transfer surface having the fine structure of the mold can be manufactured by a known method for manufacturing a mold having a fine structure. The transfer surface of the mold is preferably Ni electroformed.

As the means 30 for pressing the surface of the material to be transferred against the transfer surface having the fine structure of the heated mold, a pressure device having an upper press plate 31 and a lower press plate 32 shown in FIG. 1 can be exemplified. The press lower plate 32 is designed so that the temperature can be automatically controlled, and the pressure between the press upper plate 31 and the press lower plate 32 is designed so that the pressing force can be automatically controlled. Also, the press upper plate 31 is made so that the temperature can be automatically controlled. The material to be transferred 20 and the press upper plate 31 are fixed via a silicon wafer 33 , and the mold 10 and the press lower plate 32 are fixed via a silicon wafer 34 . The mold 10 and the lower press plate 32 are fixed via a silicon wafer 34 .

The means 40 for blowing cold air onto the material to be transferred includes an air nozzle 42, an air compression mechanism (not shown) for supplying cold air to the air nozzle 42, and a nozzle moving mechanism 43 for scanning the air nozzle 42. Equipment can be mentioned. 3(c), 3(d), 3(e), and 4, the means 40 for blowing cold air onto the transfer material 20 is provided with the nozzle moving mechanism 43. The air nozzle 42 can be scanned from one end to the other end of the transfer material 20, and from one end to the other end of the transfer material 20, that is, one end of the transfer material 20 (FIG. 3(c)) 3(d)) to the other end (FIG. 3(e)) to cool the material 20 to be transferred.

As shown in FIG. 5, the means 40 for blowing cold air onto the material to be transferred is angled backward with respect to the direction in which the air nozzle 42 advances, so that the cold air can be blown to the material to be transferred 20. A nozzle moving mechanism 43 is preferably provided.

As the air nozzle 42, an air nozzle commercially available under the name of a slit air nozzle, a flat type air nozzle, a wide type air nozzle, or the like can be used.

The present invention will be described in more detail below with reference to specific examples. However, the present invention is by no means limited to the examples shown below.

The molds and transferred materials used in Examples, Reference Examples and Comparative Examples are described below.
・Mold (A)
The mold (A) is provided with a transfer surface having a Ni-electroformed microstructure. This fine structure is provided with cylindrical protrusions having a diameter (d) of 10 μm and a height (h) of 10 μm, as shown in FIG. 2, at a pitch (p) of 20 μm.

・Mold (B)
The mold (B) is provided with a transfer surface having a Ni-electroformed microstructure. This fine structure is provided with cylindrical protrusions having a diameter (d) of 10 μm and a height (h) of 10 μm, as shown in FIG. 2, at a pitch (p) of 15 μm.

Receiving material A polycycloolefin resin film (Zeonor film ZF-14 manufactured by Nippon Zeon Co., Ltd., thickness: 0.19 mm, Tg: 136°C) was used as a receiving material. Hereinafter, this receiving material is referred to as a COP film.

<Dynamic viscoelasticity measurement and measurement of glass transition temperature (Tg)>
The storage elastic modulus (G') and loss elastic modulus (G") of the COP film used as the material to be transferred were measured under the following conditions. , the glass transition temperature (Tg) was determined to be 136°C.

Measuring device: ARES-2KFRTN1-FCO-HR manufactured by TA Instruments
Sample size: Parallel plate φ25mm, gap 2mm
Measurement conditions: 100°C to 180°C, 5°C/min
Frequency: 1Hz

<Production of compact>
[Example 1]
The surface of the COP film is pressed against the transfer surface having the microstructure of the mold (A) heated to 155 ° C. at a pressure of 4 MPa for 2 minutes, and then, while being pressed at the same pressure, the mold (A) and The temperature of the COP film was cooled to 135°C in about 3 minutes and then maintained at 135°C.
While the pressure is released and the temperature of the mold (A) is maintained at 135° C., as shown in FIG. , and the other end (FIG. 3(e)), using a flat-type air nozzle, cold air at room temperature was blown to cool the entire COP film.
At this time, cold air of room temperature is blown to the COP film, and at the same time, from one end (Fig. 3(c)) to the other end (Fig. 3(e)) through the central part (Fig. 3(d)), The COP film was peeled off from the mold (A) at a constant speed without bending to obtain a molded article of Example 1.

The fine structure of the transfer surface of the mold (A) was transferred to the surface of the COP film to form cylindrical recesses. The pattern shape of the cylindrical concave portions was circular when viewed from above, and the ratio of major axis/minor axis was 1.00. By cooling from the opposite side of the transfer material that is not in contact with the mold, the release temperature T (°C) of the mold is set to be only 1°C lower than the glass transition temperature of the COP film, 136°C. The compact could be released from the mold while suppressing distortion of the pattern shape. In addition, the resulting molded article was transparent, maintaining the transparency of the COP film.

<Production of compact>
[Example 2]
The surface of the COP film is pressed against the transfer surface having the microstructure of the mold (B) heated to 155 ° C. at a pressure of 4 MPa for 2 minutes, and then, while being pressed at the same pressure, the mold (B) and The temperature of the COP film was cooled to 110°C in about 3 minutes and then maintained at 110°C.
While the pressure is released and the temperature of the mold (B) is maintained at 110° C., as shown in FIG. , and the other end (FIG. 3(e)), using a flat-type air nozzle, cold air at room temperature was blown to cool the entire COP film.
At this time, cold air of room temperature is blown to the COP film, and at the same time, from one end (Fig. 3(c)) to the other end (Fig. 3(e)) through the central part (Fig. 3(d)), The COP film was peeled off from the mold (B) at a constant speed without bending to obtain a molded article of Example 2.

The fine structure of the mold (B) was transferred to the surface of the COP film to form cylindrical recesses. The pattern shape of the cylindrical concave portions was circular when viewed from above, and the ratio of major axis/minor axis was 1.00. Since the mold (B) has a narrower pitch than the mold (A), it was necessary to set the peeling temperature T (°C) of the mold lower than that of the mold (A). By setting the glass transition temperature to be 26° C. lower than 136° C., it was possible to release the compact from the mold while suppressing distortion of the pattern shape. In addition, the resulting molded article was transparent, maintaining the transparency of the COP film.

<Production of compact>
[Reference example 1]
First, the surface of the COP film is pressed against the transfer surface having the microstructure of the mold (A) heated to 155° C. at a pressure of 4 MPa for 2 minutes, and then, while being pressed at the same pressure, the mold ( A) and the temperature of the COP film was cooled to 50° C. in about 3 minutes.
When the pressure was released, the COP film was naturally peeled from the mold (A).
The fine structure of the transfer surface of the mold (A) was transferred to the surface of the COP film, forming substantially cylindrical recesses, but the pattern shape of the substantially cylindrical recesses was distorted when the mold was released. It had an elliptical shape when viewed from above, and the ratio of major axis/minor axis was 1.36 times.

[Reference example 2]
The surface of the COP film is pressed against the transfer surface having the microstructure of the mold (A) heated to 155 ° C. at a pressure of 4 MPa for 2 minutes, and then, while being pressed at the same pressure, the mold (A) and The temperature of the COP film was cooled to 110°C in about 3 minutes.
When the pressure was released, the COP film could be easily peeled manually from the mold (A).
The fine structure of the transfer surface of the mold (A) was transferred to the surface of the COP film, forming substantially cylindrical recesses, but the pattern shape of the substantially cylindrical recesses was distorted when the mold was released. It had an elliptical shape when viewed from above, and the ratio of major axis/minor axis was 1.22 times.

[Comparative Example 1]
The surface of the COP film is pressed against the transfer surface having the microstructure of the mold (A) heated to 155 ° C. at a pressure of 4 MPa for 2 minutes, and then, while being pressed at the same pressure, the mold (A) and The temperature of the COP film was cooled to 135°C in about 3 minutes.
The pressure was released, and on a hot plate heated to 135° C., the ends of the COP film were pinched by hand to release the mold. FIG. 6 is a schematic cross-sectional view schematically showing an example of how the transfer material 20 is separated from the mold 10. As shown in FIG. In the obtained compact, distortion was observed in the pattern shape of the substantially cylindrical recesses depending on the peeling direction. Transmitted light was scattered at locations where the pattern shape was distorted, and the transparency of the COP film was reduced. It is considered that the COP film was curved due to the external force applied during peeling, and the pattern shape transferred to the transferred material was distorted, resulting in a decrease in transparency.

[Comparative Example 2]
The surface of the COP film is pressed against the transfer surface having the microstructure of the mold (A) heated to 155 ° C. at a pressure of 4 MPa for 2 minutes, and then, while being pressed at the same pressure, the mold (A) and The temperature of the COP film was cooled to 135°C in about 3 minutes.
The pressure was released, and the mold (A) and the COP film before release were removed from the apparatus. Observation of the release of the COP film from the side of the silicon wafer 33 at room temperature revealed that the COP film was released from the edge, but was not released at a constant speed, and uneven release resulted in a line pattern. appeared. At the locations where uneven release occurred, the pattern shape of the substantially cylindrical concave portions was distorted, the transmitted light was scattered, and the transparency of the COP film was lowered. In order to precisely transfer the fine structure of the transfer surface of the mold without distortion, it is considered that the conditions for peeling at a constant speed are necessary.

INDUSTRIAL APPLICABILITY The present invention can be used to manufacture an optical waveguide having a Fresnel lens, to manufacture a membrane carrier having a concave fine structure used in a liquid sample test kit, and the like.

DESCRIPTION OF SYMBOLS 1... Manufacturing apparatus, 10... Mold, 10a... Transfer surface, 20... Transfer material, 20a... Surface, 20b... Opposite side of transfer material, 22... Formed body 30...Means for pressing 31...Upper plate of press 32...Lower plate of press 33...Silicon wafer 34...Silicon wafer 40...Means for blowing cold air , 42... air nozzle, 43... nozzle moving mechanism, H... heating, P... pressing, C... cooling, d... diameter, p... pitch, h... height

Claims (6)

a step of pressing the surface of a material to be transferred against a transfer surface having a microstructure of a heated mold;
Cold air is blown from one end of the transfer material to the other end using a slit air nozzle, flat type air nozzle or wide type air nozzle from the opposite side of the transfer material that is not in contact with the mold. a step of cooling the material to be transferred by spraying to separate the material to be transferred from the mold;
A method for producing a molded article having a fine structure transferred to the surface of a material to be transferred. 2. The method for producing a molded article according to claim 1 , wherein the material to be transferred is a resin film. 3. The method for producing a molded article according to claim 2 , wherein the material to be transferred is a polycycloolefin resin film. 4. The method according to claim 2 or 3 , wherein in the peeling step, a peeling temperature T (° C.) of the mold and a glass transition temperature Tg (° C.) of the material to be transferred satisfy the relationship of the following formula (1): A method for producing the described molded body.
Tg-50°C≤T≤Tg+30°C (1) The method for producing a compact according to any one of claims 1 to 4 , wherein the transfer surface of the mold is Ni electroformed. means for pressing the surface of the material to be transferred onto the microstructured transfer surface of the heated mold;
Cold air is blown from one end of the transfer material to the other end using a slit air nozzle, flat type air nozzle or wide type air nozzle from the opposite side of the transfer material that is not in contact with the mold. means for cooling the transfer material by spraying to separate the transfer material from the mold ;
An apparatus for manufacturing a molded body in which a fine structure is transferred to the surface of a transfer material.

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