JP7122822B2 - Laser processing equipment - Google Patents

Description

The present invention relates to a laser processing apparatus and a laser processing method.

A main surface of a substrate such as a semiconductor wafer is partitioned by a plurality of streets formed in a grid pattern, and elements, circuits, terminals, etc. are formed in advance in each partitioned region. Chips are obtained by dividing the substrate along a plurality of streets formed in a grid pattern. For example, a laser processing device or the like is used to divide the substrate.

The laser processing apparatus of Patent Document 1 has a beam splitter that splits the laser beams oscillated by the laser oscillator in order to simultaneously perform laser processing on two substrates using one laser oscillator. Compared to using two laser oscillators, which are more expensive than the beam splitter, the manufacturing cost of the laser processing apparatus can be reduced.

Japanese Unexamined Patent Application Publication No. 2008-110383

Various purposes may be used to modify the path of the laser beam formed during operation of the laser oscillator. In this case, if the laser oscillator is to be moved, it is difficult to move at high speed because the laser oscillator is heavy and has a large inertia.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and when changing the path of a laser beam formed during the operation of a laser oscillator, it is possible to speed up the operation for the change and to suppress the occurrence of vibration. The main purpose is to provide a laser processing device that can

In order to solve the above problems, according to one aspect of the present invention,
a plurality of moving units each including a substrate holding part for holding a substrate, a driving part for moving the substrate holding part in a direction parallel to the substrate holding surface of the substrate holding part, and a base part for supporting the driving part;
A laser oscillator that oscillates a laser beam, a laser oscillator support frame that fixes the laser oscillator, a condensing irradiation unit that condenses and irradiates the laser beam onto the substrate held by the substrate holding unit, and the substrate of the substrate holding unit. an optical system driving unit for moving the condensing irradiation unit in the Y direction, which is a horizontal direction parallel to the holding surface;
The optical system driving unit includes a Z-axis guide extending in the Z direction, which is a vertical direction, and a Z-axis slider that moves along the Z-axis guide,
The condensed light irradiation unit is fixed to the Z-axis slider ,
A laser processing apparatus is provided in which a plurality of the moving units are spaced apart .

According to one aspect of the present invention, there is provided a laser processing apparatus capable of speeding up the operation for changing and suppressing the occurrence of vibration when changing the path of a laser beam formed during operation of a laser oscillator. provided.

FIG. 1 is a perspective view showing a substrate before processing by a substrate processing system according to one embodiment. FIG. 2 is a plan view of a substrate processing system according to one embodiment. FIG. 3 is a flowchart of a substrate processing method according to one embodiment. FIG. 4 is a plan view showing a laser processing part according to one embodiment. FIG. 5 is a front view showing a laser processing section according to one embodiment. FIG. 6 is a rear view showing a laser processing section according to one embodiment. FIG. 7 is a diagram showing functional blocks of components of a control unit according to an embodiment. FIG. 8 is a time chart for explaining the laser processing method according to one embodiment. FIG. 9 is a diagram illustrating an anti-vibration unit according to one embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In each drawing, the same or corresponding configurations are denoted by the same or corresponding reference numerals, and description thereof is omitted. In the following description, the X, Y, and Z directions are directions perpendicular to each other, the X and Y directions are horizontal directions, and the Z direction is vertical direction. The direction of rotation about the vertical axis is also called the θ direction. As used herein, downward means vertically downward, and upward means vertically upward.

FIG. 1 is a perspective view showing a substrate before processing by a substrate processing system according to one embodiment. The substrate 10 is, for example, a semiconductor substrate, a sapphire substrate, or the like. The first main surface 11 of the substrate 10 is partitioned by a plurality of streets formed in a grid pattern, and elements, circuits, terminals, etc. are formed in advance in each of the partitioned regions. Chips are obtained by dividing the substrate 10 along a plurality of grid-shaped streets. The planned dividing line 13 is set on the street.

A protective tape (not shown) is attached to the first main surface 11 of the substrate 10 . The protective tape protects the first main surface 11 of the substrate 10 during processing such as laser processing and thinning, and protects the elements, circuits, terminals, etc. previously formed on the first main surface 11 . The masking tape covers the entire first major surface 11 of the substrate 10 .

The protective tape is composed of a sheet base material and an adhesive applied to the surface of the sheet base material. The adhesive may be one that cures when irradiated with ultraviolet rays to reduce adhesive strength. After the adhesive strength is lowered, the protective tape can be easily peeled off from the substrate 10 by a peeling operation.

The protective tape may be attached to the frame so as to cover the opening of the ring-shaped frame, and bonded to the substrate 10 at the opening of the frame. In this case, the substrate 10 can be transported while holding the frame, and the handleability of the substrate 10 can be improved.

FIG. 2 is a plan view of a substrate processing system according to one embodiment. In FIG. 2 , the loading cassette 35 and the unloading cassette 45 are broken to show the inside of the loading cassette 35 and the unloading cassette 45 .

The substrate processing system 1 performs various types of processing such as laser processing of the substrate 10 and thinning of the substrate 10 . The substrate processing system 1 includes a control section 20, a loading section 30, a carrying out section 40, a transport path 50, a transport section 58, and various processing sections. Although the processing section is not particularly limited, for example, a laser processing section 100 and a thinning section 200 are provided.

The control unit 20 is configured by, for example, a computer, and includes a CPU (Central Processing Unit) 21, a storage medium 22 such as a memory, an input interface 23, and an output interface 24, as shown in FIG. The control unit 20 performs various controls by causing the CPU 21 to execute programs stored in the storage medium 22 . The control unit 20 also receives signals from the outside through the input interface 23 and transmits signals outside through the output interface 24 .

A program for the control unit 20 is stored in an information storage medium and installed from the information storage medium. Examples of information storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards. Note that the program may be downloaded from a server via the Internet and installed.

The carry-in section 30 receives a carry-in cassette 35 from the outside. The carry-in section 30 includes a mounting plate 31 on which a carry-in cassette 35 is placed. A plurality of mounting plates 31 are provided in a row in the Y direction. The number of mounting plates 31 is not limited to that illustrated. The carry-in cassette 35 accommodates a plurality of substrates 10 before processing at intervals in the Z direction.

In order to suppress deformation such as curling of the protective tape, the carry-in cassette 35 may store the substrate 10 horizontally with the protective tape facing upward. The substrate 10 taken out from the carry-in cassette 35 is turned upside down and then transported to a processing section such as the laser processing section 100 .

The unloading section 40 is for unloading the unloading cassette 45 to the outside. The unloading section 40 includes a mounting plate 41 on which the unloading cassette 45 is mounted. A plurality of mounting plates 41 are provided in a row in the Y direction. The number of mounting plates 41 is not limited to that illustrated. The unloading cassette 45 accommodates a plurality of substrates 10 after processing at intervals in the Z direction.

The transport path 50 is a path through which the transport section 58 transports the substrate 10 to the loading section 30, the unloading section 40, and a plurality of processing sections, and extends in the Y direction, for example. A Y-axis guide 51 extending in the Y direction is provided in the transport path 50 , and a Y-axis slider 52 is movable along the Y-axis guide 51 .

The transport unit 58 holds the substrate 10 and moves along the transport path 50 to transport the substrate 10 . The transport section 58 may hold the substrate 10 via a frame. The transport unit 58 vacuum-sucks the substrate 10, but may also hold the substrate 10 electrostatically. The transport unit 58 includes a Y-axis slider 52 as a transport base and moves along the Y direction. The transport unit 58 is movable not only in the Y direction, but also in the X direction, Z direction and θ direction.

The transport section 58 may have a plurality of holding sections that hold the substrate 10 . The plurality of holding parts are arranged side by side at intervals in the Z direction. A plurality of holders may be used properly according to the processing stage of the substrate 10 .

The carrying-in section 30, the carrying-out section 40, and the plurality of processing sections are provided adjacent to the transport path 50 when viewed in the vertical direction. For example, the longitudinal direction of the transport path 50 is the Y direction. A carry-in section 30 and a carry-out section 40 are provided adjacently on one side of the transport path 50 in the X direction (the left side in FIG. 2, hereinafter also referred to as the “front side”). On the other side of the transport path 50 in the X direction (on the right side in FIG. 2, hereinafter also referred to as "rear side"), the laser processing section 100 and the thinning section 200 are provided adjacently.

The arrangement and number of processing units are not limited to the arrangement and number shown in FIG. 2, and can be arbitrarily selected. Moreover, a plurality of processing units may be distributed or integrated in arbitrary units. Each processing unit will be described below.

The laser processing unit 100 performs laser processing on the substrate 10 . For example, the laser processing unit 100 performs laser processing (so-called laser dicing) for dividing the substrate 10 into a plurality of chips. In this laser processing, the substrate 10 may be divided, or the starting point of the division may be formed in the substrate 10 .

The laser processing unit 100 performs laser processing on the substrate 10 by irradiating a laser beam to one point on the planned division line 13 (see FIG. 1) and moving the irradiation point on the planned division line 13 . In the laser processing of the substrate 10 , a modified layer that serves as a fracture starting point may be formed inside the substrate 10 , or a laser-processed groove may be formed in the laser-irradiated surface of the substrate 10 . The laser-processed groove may or may not penetrate the substrate 10 in the plate thickness direction.

When forming the modified layer inside the substrate 10, a laser beam having transparency to the substrate 10 is used. The modified layer is formed, for example, by locally melting and solidifying the inside of the substrate 10 . On the other hand, when forming laser-processed grooves on the laser-irradiated surface of the substrate 10, a laser beam having an absorptive property to the substrate 10 is used.

The thinning unit 200 thins the substrate 10 by processing the second main surface 12 opposite to the first main surface 11 protected by the protective tape of the laser-processed substrate 10 . When the starting point of division is formed by the laser processing part 100, the processing stress acts on the substrate 10 at the thinning part 200, so that a crack develops in the plate thickness direction from the starting point of division, and the substrate 10 is divided into a plurality of chips. be done. Further, when a modified layer is formed inside the substrate 10 by the laser processing unit 100 , the modified layer is removed by thinning the substrate 10 by the thinning unit 200 .

Next, a substrate processing method using the substrate processing system 1 configured as described above will be described. FIG. 3 is a flowchart of a substrate processing method according to one embodiment.

As shown in FIG. 3, the substrate processing method includes a loading step S101, a laser processing step S102, a thinning step S103, and a carrying out step S104. These steps are performed under the control of the control unit 20 . The order of these steps is not limited to the order shown in FIG. For example, the laser processing step S102 may be performed after the thinning step S103.

In the loading step S<b>101 , the transport unit 58 takes out the substrate 10 from the loading cassette 35 placed in the loading unit 30 and transports the substrate 10 taken out to the laser processing unit 100 .

In the laser processing step S<b>102 , the laser processing section 100 performs laser processing of the substrate 10 . The first major surface 11 of the substrate 10 is protected with a protective tape while the substrate 10 is laser processed. The substrate 10 laser-processed in the laser processing unit 100 is transported to the thinning unit 200 by the transport unit 58 .

In the thinning step S<b>103 , the thinning unit 200 thins the substrate 10 by processing the second main surface 12 of the substrate 10 . The first main surface 11 of the substrate 10 is protected with a protective tape while the substrate 10 is being thinned.

In the unloading step S<b>104 , the transport unit 58 transports the substrate 10 from the thinning unit 200 to the unloading unit 40 , and stores the substrate 10 inside the unloading cassette 45 in the unloading unit 40 . The unloading cassette 45 is unloaded from the unloading section 40 to the outside. The substrate 10 carried outside together with the carry-out cassette 45 is picked up chip by chip. A chip is thus manufactured.

FIG. 4 is a plan view showing a laser processing part according to one embodiment. In FIG. 4, "101" is the movable area of the substrate holding part 111. As shown in FIG. FIG. 5 is a front view showing a laser processing section according to one embodiment. FIG. 6 is a rear view showing a laser processing section according to one embodiment. In this embodiment, the laser processing unit 100 corresponds to the laser processing apparatus described in the claims. The laser processing unit 100 is installed on the floor 2 (see FIGS. 5 and 6) of a building such as a factory.

The laser processing unit 100 has a plurality of moving units 110 spaced apart. A plurality of moving units 110 are provided at intervals in the Y direction, for example. Each moving unit 110 includes a substrate holding portion 111 , a driving portion 113 and a base portion 119 .

The substrate holding part 111 holds the substrate 10 . For example, the substrate holder 111 horizontally holds the substrate 10 with the second main surface 12 (see FIG. 1) of the substrate 10 facing upward. For example, a vacuum chuck is used as the substrate holding unit 111, but an electrostatic chuck or the like may be used.

The driving section 113 moves the substrate holding section 111 with respect to the floor 2 in a direction parallel to the substrate holding surface of the substrate holding section 111 . For example, the driving section 113 moves the substrate holding section 111 in the X direction and the θ direction. Note that the driving unit 113 may also move the substrate holding unit 111 in the Y direction and the Z direction. For example, a servomotor or the like is used as a drive source for moving the substrate holder 111 . The rotary motion of the servomotor may be converted into linear motion of the substrate holder 111 by a ball screw or the like.

The drive unit 113 has an X-axis guide 114 extending in the X-direction and an X-axis slider 115 that moves along the X-axis guide 114 . Further, the drive unit 113 has a rotary plate 118 that is moved in the θ direction.

The base portion 119 supports the drive portion 113 . For example, the X-axis guide 114 is fixed to the base portion 119 . A rotary plate 118 is rotatably provided on the X-axis slider 115 that moves along the X-axis guide 114 . The substrate holder 111 is fixed to the rotating plate 118 .

In addition to the moving unit 110, the laser processing section 100 has a laser oscillator support frame 130, a laser oscillator 140, a condensing irradiation section 141, an optical system driving section 150, an alignment section 160, and the like.

A laser oscillator support frame 130 (see FIG. 6) secures a laser oscillator 140 to the floor 2 . The laser oscillator support frame 130 is, for example, a portal type, and has a plurality of support columns 132 installed on the floor 2 and support beams 133 spanning the plurality of support columns 132 . A laser oscillator 140 and the like are attached to the support beam 133 . In addition to the laser oscillator 140 , the condensing irradiation unit 141 , the optical system driving unit 150 , the alignment unit 160 and the like may be attached to the support beam 133 .

A laser oscillator 140 (see FIG. 6) oscillates a laser beam. A laser beam, for example, is emitted from a laser oscillator 140 and condensed onto one point on the intended dividing line 13 (see FIG. 1) of the substrate 10 held by the substrate holding portion 111 via the condensed irradiation portion 141 . An attenuator or the like for adjusting the intensity of the laser beam may be provided along the path of the laser beam.

When the substrate holder 111 is moved in the X direction with respect to the floor 2, the irradiation point of the laser beam on the substrate 10 moves in the X direction, forming a machining mark extending in the X direction. The Y-direction position of the condensing irradiation unit 141 and the θ-direction position of the substrate holding unit 111 are controlled in advance so that the trace of processing and the planned dividing line 13 match.

After that, the condensing irradiation unit 141 is moved by a predetermined distance in the Y direction with respect to the floor 2 and stopped at a predetermined position in the Y direction. By repeating this, a plurality of machining traces extending in the X direction are formed at intervals in the Y direction, and striped machining traces are formed on the substrate 10 .

Note that the machining marks extending in the X direction may be either dotted lines or straight lines. The dotted trace is formed by a pulsed laser beam. A linear trace is formed by continuous wave oscillation of a laser beam.

Thereafter, after rotating the substrate holding part 111 by 90° in the θ direction, a plurality of machining traces extending in the X direction are again formed at intervals in the Y direction. As a result, a grid-shaped trace of processing can be formed on the substrate 10 .

The condensed light irradiation unit 141 (see FIG. 6) condensedly irradiates the substrate 10 held by the substrate holding unit 111 with a laser beam. The focused light irradiation unit 141 may be attached to the laser oscillator support frame 130 so as to be movable in the Y direction.

The condensed light irradiation unit 141 is provided above the substrate holding unit 111 and condensedly irradiates the substrate 10 with a laser beam from above the substrate 10 . The condensing irradiation unit 141 is configured by, for example, a lens. The axial direction of the optical axis of the lens is the Z direction. The condensed light irradiation unit 141 may be attached to the laser oscillator support frame 130 so as to be movable in the Z direction in order to adjust the focal height.

The optical system driving section 150 (see FIG. 6) moves the condensing irradiation section 141 with respect to the floor 2 in a direction parallel to the substrate holding surface of the substrate holding section 111 . For example, the optical system driving section 150 moves the condensing irradiation section 141 in the Y direction. As the driving source 151 for moving the condensed irradiation unit 141, for example, a servo motor or the like is used. The rotary motion of the servomotor may be converted into the linear motion of the condensed irradiation unit 141 by a motion conversion mechanism 152 such as a ball screw. Note that the optical system drive unit 150 moves the focal point of the lens that constitutes the condensing irradiation unit 141 in the Z direction, so the condensing irradiation unit 141 may also be moved in the Z direction.

The optical system drive unit 150 has a Y-axis guide 153 (see FIG. 4) extending in the Y direction and a Y-axis slider 154 that moves along the Y-axis guide 153 . The optical system driving section 150 also has a Z-axis guide 155 extending in the Z-direction and a Z-axis slider 156 that moves along the Z-axis guide 155 .

A Y-axis guide 153 is fixed to the laser oscillator support frame 130 (specifically, the support beam 133, for example). A Z-axis guide 155 is fixed to the Y-axis slider 154 that moves along the Y-axis guide 153 . A condensing irradiation unit 141 is fixed to a Z-axis slider 156 that moves along a Z-axis guide 155 .

A reflecting mirror 157 may be attached to the Y-axis slider 154 in addition to the Z-axis guide 155 . The reflecting mirror 157 reflects the laser beam from the laser oscillator 140 toward the condensing irradiation section 141 . The reflecting mirror 157 and the condensing irradiation unit 141 move in the Y direction together with the Y-axis slider 154 .

According to this embodiment, when changing the path of the laser beam formed during the operation of the laser oscillator 140, the laser oscillator 140 is not moved with respect to the floor 2, and the converging irradiation unit 141 and the like are moved with respect to the floor 2. move. Compared to moving the laser oscillator 140 with respect to the floor 2, the inertia can be reduced, so the operation for changing the path can be speeded up, and the occurrence of vibration can be suppressed. The change of the path of the laser beam is performed for at least one purpose of, for example, (1) switching of the moving unit 110 used for laser processing and (2) formation of striped traces on the substrate 10 . (1) Switching of the moving unit 110 used for laser processing means switching of the moving unit 110 in which a laser beam path is formed to the substrate 10 held by the substrate holding part 111 among the plurality of moving units 110 . means

According to this embodiment, as shown in FIG. 4, the Y-axis guide 153 that guides the condensed irradiator 141 has a , are provided across a plurality of mobile units 110 . As a result, the above purpose (1) (switching of the moving unit 110 used for laser processing) can be achieved.

According to this embodiment, as shown in FIG. 4, the Y-axis guide 153 that guides the condensed irradiator 141 has a , is provided perpendicular to the X-axis guide 114 that guides the substrate holding portion 111 . In order to achieve the above purpose (2) (formation of striped traces on the substrate 10), the substrate holder 111 is moved without moving the condensed irradiation unit 141 with respect to the floor 2 in either the X direction or the Y direction. is moved with respect to the floor 2 in both the X direction and the Y direction, the movable area 101 (see FIG. 4) of the substrate holding part 111 can be significantly reduced (for example, about half), and the laser processing part 100 Installation area can be reduced.

In this embodiment, the Y-axis guide 153 that guides the condensing irradiation unit 141 is provided perpendicular to the X-axis guide 114 that guides the substrate holding unit 111 when viewed from the Z direction, but is provided obliquely. may be In the latter case as well, when the substrate holding unit 111 is moved with respect to the floor 2 in both the X direction and the Y direction without moving the condensed irradiation unit 141 with respect to the floor 2 in both the X direction and the Y direction. In comparison, the movable area 101 of the substrate holding part 111 can be significantly reduced, and the installation area of the laser processing part 100 can be reduced.

In order to reduce the installation area of the laser processing unit 100, the moving direction of the substrate holding unit 111 and the moving direction of the focused irradiation unit 141 are perpendicular to the substrate holding surface of the substrate holding unit 111 (for example, the Z direction). are the directions that intersect with each other when viewed from However, when viewed from the Z direction, the movement direction of the substrate holder 111 may include a direction intersecting the movement direction of the condensed irradiation unit 141, and further includes a direction parallel to the movement direction of the condensed irradiation unit 141. It's okay.

According to this embodiment, as shown in FIGS. 5 and 6, the laser oscillator support frame 130 and each moving unit 110 are spaced apart from each other and installed on the floor 2 . Vibration of the laser oscillator 140 together with a specific moving unit 110 can be suppressed, and the same degree of processing accuracy can be obtained regardless of which moving unit 110 is used to perform the laser processing of the substrate 10 .

The alignment unit 160 (see FIGS. 4 and 5) detects the intended dividing line 13 (see FIG. 1) of the substrate 10 held by the substrate holding unit 111. As shown in FIG. The planned division lines 13 of the substrate 10 are set on a plurality of streets pre-formed in a grid pattern on the first main surface 11 of the substrate 10 . The alignment unit 160 may be attached to the laser oscillator support frame 130 so as to be movable in the Y direction.

The alignment unit 160 is provided above the substrate holding unit 111, for example, and picks up an image of a street formed in advance on the lower surface (first main surface 11) of the substrate 10 from above the substrate 10 held by the substrate holding unit 111. . The alignment unit 160 is configured with, for example, a camera. As the camera, an infrared camera that captures an infrared image transmitted through the substrate 10 may be used. The axial direction of the optical axis of the objective lens of the camera may be the Z direction. The alignment section 160 may be mounted on the laser oscillator support frame 130 so as to be movable in the Z direction for focus height adjustment.

The alignment section 160 converts the captured image of the substrate 10 into an electrical signal and transmits the electrical signal to the control section 20 . The control unit 20 detects the position of the planned dividing line 13 of the substrate 10 by image processing the received image. As a detection method thereof, there is a method of matching a grid-like pattern of streets formed in advance on the first main surface 11 of the substrate 10 with a reference pattern, and the orientation of the substrate 10 are used. The orientation of the substrate 10 is detected from the position of a notch 19 (see FIG. 1) formed on the outer circumference of the substrate 10, or the like. Orientation flats may be used instead of notches 19 . Thereby, the control unit 20 can grasp the position of the planned dividing line 13 of the substrate 10 in the coordinate system fixed to the substrate holding unit 111 . Note that the image processing may be performed in parallel with the imaging of the image, or may be performed after the imaging of the image.

The alignment unit 160 may also serve as an inspection unit that detects the results of laser processing of the substrate 10 for cost reduction or the like. The result of laser processing is, for example, the presence or absence of abnormality in laser processing. The presence or absence of an abnormality in laser processing includes, for example, the presence or absence of a shift between the traces of processing on the substrate 10 due to the irradiation of the laser beam and the planned dividing line 13, the presence or absence of chipping, and the like. The inspection unit may be attached to the laser oscillator support frame 130 so as to be movable in the Y direction.

The inspection unit captures an image of a trace of processing on the substrate 10 due to the irradiation of the laser beam. The inspection unit is composed of, for example, a camera. As the camera, when a modified layer is formed inside the substrate 10, an infrared camera that captures an infrared image transmitted through the substrate 10 may be used. The axial direction of the optical axis of the objective lens of the camera may be the Z direction. The inspection portion may be mounted on the laser oscillator support frame 130 so as to be movable in the Z direction for focus height adjustment.

The inspection unit converts the captured image of the board 10 into an electrical signal and transmits the electrical signal to the control unit 20 . The control unit 20 detects the result of the laser processing of the substrate 10 by image processing the received image. Note that the image processing may be performed in parallel with the imaging of the image, or may be performed after the imaging of the image.

Although the alignment unit 160 also serves as the inspection unit in this embodiment, it may not also serve as the inspection unit. That is, the alignment section 160 and the inspection section may be provided separately. In that case, the inspection section may be provided as part of the laser processing section 100 or may be provided outside the laser processing section 100 . Also, instead of the alignment section 160 , only the inspection section may be provided as part of the laser processing section 100 . In this case, the planned dividing line 13 is detected outside the laser processing unit 100 .

The laser processing unit 100 of this embodiment has a parallel guide 163 and a parallel slider 164 . The parallel guide 163 extends in a direction parallel to the substrate holding surface of the substrate holding part 111 (for example, Y direction). The parallel guide 163 is fixed relative to the laser oscillator support frame 130, for example. The parallel slider 164 holds the alignment section 160 and moves along the parallel guide 163 . The parallel slider 164 holds the alignment section 160 via, for example, a vertical guide 165 and a vertical slider 166 which will be described later. As the drive source 167 for moving the parallel slider 164, for example, a servomotor or the like is used. Rotational motion of the servomotor may be converted into linear motion of the parallel slider 164 by a motion conversion mechanism 168 such as a ball screw.

As shown in FIG. 4, the parallel guide 163 extends over a plurality of moving units 110 spaced apart from each other when viewed from a direction perpendicular to the substrate holding surface of the substrate holding part 111 (for example, the Z direction). provided. The direction in which the plurality of moving units 110 are arranged in a row may coincide with the direction in which the parallel guide 163 guides the parallel slider 164 .

According to this embodiment, the parallel guides 163 that guide the alignment section 160 are provided over the plurality of moving units 110 as viewed in the Z direction, so that the alignment section 160 is positioned at the alignment position preset above each moving unit 110 . 160 can be moved. Therefore, alignment processing of the substrates 10 held by each of the plurality of moving units 110 can be sequentially performed using one alignment unit 160, and the operating rate of the alignment unit 160 can be improved.

Similarly, according to the present embodiment, since the parallel guide 163 for guiding the inspection section is provided over the plurality of moving units 110 when viewed in the Z direction, the inspection position set in advance above each moving unit 110 is provided. The inspection section can be moved. Therefore, the substrates 10 held by the plurality of moving units 110 can be sequentially inspected using one inspection unit, and the operation rate of the inspection unit can be improved.

In this embodiment, the direction in which the plurality of moving units 110 are aligned and the direction in which the parallel guide 163 guides the parallel slider 164 are the Y direction, but may be the X direction.

The laser processing unit 100 of this embodiment has a vertical guide 165 and a vertical slider 166 . The vertical guide 165 extends in a direction (for example, Z direction) perpendicular to the substrate holding surface of the substrate holding part 111 . The vertical guide 165 is for example fixed relative to the parallel slider 164 and moves with the parallel slider 164 . A vertical slider 166 holds the alignment portion 160 and moves along the vertical guide 165 . Alignment portion 160 is fixed relative to vertical slider 166, for example. Although the alignment section 160 also serves as the inspection section in this embodiment, the alignment section 160 and the inspection section may be provided separately. In the latter case, vertical slider 166 may hold both alignment portion 160 and inspection portion.

According to this embodiment, the alignment section 160 can be moved along the vertical guide 165 and the focus of the alignment section 160 can be adjusted. Similarly, according to this embodiment, the inspection part can be moved along the vertical guide 165 and the focus of the inspection part can be adjusted.

A vertical guide 165 may be fixed to the laser oscillator support frame 130 instead of the parallel guide 163 . In this case, parallel guide 163 is fixed to vertical slider 166 that moves along vertical guide 165 . Alignment section 160 is fixed to parallel slider 164 that moves along parallel guide 163 .

FIG. 7 is a diagram showing functional blocks of components of a control unit according to an embodiment. Each functional block illustrated in FIG. 7 is conceptual and does not necessarily need to be physically configured as illustrated. All or part of each functional block can be functionally or physically distributed and integrated in arbitrary units. All or any part of each processing function performed by each functional block can be implemented by a program executed by a CPU, or by hardware using wired logic. Although the control unit 20 is provided separately from the laser processing unit 100 in FIG. 2 , it may be provided as a part of the laser processing unit 100 .

As shown in FIG. 7, the control unit 20 has a receiving processing unit 25, an alignment processing unit 26, a laser processing processing unit 27, an inspection processing unit 28, a carry-out processing unit 29, and the like. The receiving processing unit 25 controls the transport unit 58 and the like to perform a receiving process in which the substrate holding unit 111 receives and holds the substrate 10 transferred from the transport unit 58 . The alignment processing unit 26 controls the alignment unit 160 , the drive unit 113 , and the like, and performs alignment processing for detecting the planned dividing line 13 of the substrate 10 held by the substrate holding unit 111 . The laser processing unit 27 controls the laser oscillator 140, the optical system driving unit 150, the driving unit 113, etc., and laser-processes the substrate 10 along the dividing line 13 of the substrate 10 held by the substrate holding unit 111. Execute the laser machining process. The inspection processing unit 28 controls the inspection unit, the driving unit 113 and the like, and performs inspection processing for detecting the laser processing result of the substrate 10 held by the substrate holding unit 111 . The carry-out processing unit 29 controls the transport unit 58 and the like to perform a carry-out process of transferring the substrate 10 held by the substrate holding unit 111 to the transport unit 58 . At this time, the holding of the substrate 10 by the substrate holding portion 111 is released.

FIG. 8 is a time chart for explaining the laser processing method according to one embodiment. FIG. 8 shows the timing of processing the substrate 10 using one transfer unit 110 and processing the substrate 10 using another transfer unit 110 . The controller 20 uses each moving unit 110 to repeatedly perform a series of processes on the substrate 10 by exchanging the substrate 10 . A series of processing includes, for example, receiving processing, alignment processing, laser processing, inspection processing, and carrying-out processing.

As shown in FIG. 8, the control unit 20 performs preprocessing (for example, receiving processing) of the substrate 10 using another moving unit 110 during laser processing processing of the substrate 10 using one moving unit 110. , alignment processing, etc.) may be performed. In addition, the control unit 20 performs post-processing (for example, inspection processing and carry-out processing) of the substrate 10 using another moving unit 110 during laser processing processing of the substrate 10 using one moving unit 110. can be executed. The throughput of the laser processing section 100 can be improved by simultaneously performing different processes on a plurality of substrates 10 .

In FIG. 8, the timing of the laser processing of the substrate 10 using one moving unit 110 and the timing of the laser processing of the substrate 10 using another moving unit 110 do not overlap at all. They may overlap.

By the way, in the laser processing, the substrate 10 is repeatedly moved and stopped, and vibration is generated. Therefore, in the present embodiment, a plurality of moving units 110 are spaced apart to suppress the transmission of vibration. Further, in order to further suppress the transmission of vibration, a vibration isolator 170 (see FIGS. 5 and 6) is provided in the middle of the vibration transmission path of the plurality of moving units 110 .

The vibration isolator 170 absorbs vibration, for example, by converting vibration energy into heat energy. As a result, it is possible to suppress the transmission of vibrations between the plurality of moving units 110, and during the laser processing of the substrate 10 held by one moving unit 110, the substrate 10 held by another moving unit 110 can be suppressed. can be performed with high accuracy.

The vibration isolator 170 is provided, for example, between at least one mobile unit 110 and the floor 2 . The vibration isolator 170 may absorb only one of vibration from the moving unit 110 toward the floor 2 and vibration from the floor 2 toward the moving unit 110, or may absorb both vibrations. good too.

For example, as shown in FIG. 5, the vibration isolator 170 is provided between each mobile unit 110 and the mobile unit support frame 139, and the mobile unit support frame 139 is installed on the floor 2. As shown in FIG. Three or more anti-vibration units 170 may be used for each mobile unit 110 . Note that the moving unit support frame 139 may be omitted, and the vibration isolator 170 may be directly installed on the floor 2 .

FIG. 9 is a diagram illustrating an anti-vibration unit according to one embodiment. A vibration isolator 170 shown in FIG. 9 has a spring 171 provided in the middle of a vibration transmission path and a damper 172 that damps the vibration of the spring 171 . In this case, both the vibration from the moving unit 110 toward the floor 2 and the vibration from the floor 2 toward the moving unit 110 can be absorbed.

The spring 171 may be an air spring, and may be composed of, for example, an air cylinder. In this case, the air pressure of the air cylinder may be controlled so as to balance the load acting on the anti-vibration portion 170 from the base portion 119 . An oil damper, an air damper, or the like is used as the damper 172 .

Note that the configuration of the vibration isolator 170 is not limited to the configuration shown in FIG. The vibration isolator 170 may have rubber instead of the spring 171, for example. Also, the vibration isolator 170 may be composed of only one of the spring 171, damper 172, or rubber.

Although the embodiments of the laser processing apparatus and the laser processing method have been described above, the present invention is not limited to the above embodiments and the like, and various modifications, Improvements are possible.

Each moving unit 110 has only one substrate holding part 111 in the above embodiment, but may have a plurality of substrate holding parts 111 . In this case, for example, by simultaneously moving the plurality of substrate holders 111 arranged in the X direction in the X direction with respect to the floor 2, processing traces extending in the X direction over the plurality of substrates 10 can be collectively formed. Alternatively, by simultaneously moving the plurality of substrate holders 111 aligned in the Y direction in the Y direction with respect to the floor 2, processing traces extending in the Y direction over the plurality of substrates 10 can be collectively formed. The number of substrate holders 111 may be the same or different between one moving unit 110 and another moving unit 110 .

The number of moving units 110 to be switched by the optical system driving section 150 is two in the above embodiment, but may be three or more. A Y-axis guide that guides the condensed irradiation unit 141 may be provided over three or more moving units 110 as viewed in the Z direction. Similarly, the parallel guides 163 that guide the alignment section 160 may be provided across three or more moving units 110 as viewed in the Z direction. Also, the parallel guide 163 that guides the inspection section may be provided over three or more moving units 110 as viewed in the Z direction.

2 Floor 10 Substrate 13 Planned division line 100 Laser processing unit (laser processing device)
110 Moving unit 111 Substrate holding unit 113 Driving unit 119 Base unit 130 Laser oscillator support frame 140 Laser oscillator 141 Converging irradiation unit 150 Optical system driving unit 160 Alignment unit (inspection unit)
170 anti-vibration part

Claims (9)

a plurality of moving units each including a substrate holding part for holding a substrate, a driving part for moving the substrate holding part in a direction parallel to the substrate holding surface of the substrate holding part, and a base part for supporting the driving part;
A laser oscillator that oscillates a laser beam, a laser oscillator support frame that fixes the laser oscillator, a condensing irradiation unit that condenses and irradiates the laser beam onto the substrate held by the substrate holding unit, and the substrate of the substrate holding unit. an optical system driving unit for moving the condensing irradiation unit in the Y direction, which is a horizontal direction parallel to the holding surface;
The optical system driving unit includes a Z-axis guide extending in the Z direction, which is a vertical direction, and a Z-axis slider that moves along the Z-axis guide,
The condensed light irradiation unit is fixed to the Z-axis slider ,
A laser processing apparatus, wherein a plurality of the moving units are installed with a space therebetween. 2. The laser processing apparatus according to claim 1 , wherein the Y-axis guide that guides the condensed irradiating unit is provided over a plurality of the moving units that are spaced apart from each other when viewed from the Z direction. an alignment unit that detects a planned dividing line of the substrate held by the substrate holding unit;
a parallel guide extending in a direction parallel to the substrate holding surface of the substrate holding part;
a parallel slider that holds the alignment portion and moves along the parallel guide;
3. The laser processing apparatus according to claim 1 , wherein said parallel guides are provided over a plurality of said moving units installed apart from each other when viewed from said Z direction. an inspection unit that detects a result of laser processing of the substrate held by the substrate holding unit;
a parallel guide extending in a direction parallel to the substrate holding surface of the substrate holding part;
a parallel slider that holds the inspection unit and moves along the parallel guide;
4. The laser processing apparatus according to any one of claims 1 to 3 , wherein the parallel guides are provided over a plurality of the moving units that are spaced apart from each other when viewed from the Z direction. 5. The laser processing according to any one of claims 1 to 4 , further comprising a vibration isolator that absorbs the vibration in the middle of the vibration transmission path between the plurality of moving units that are installed apart from each other. Device. 6. The laser processing apparatus according to any one of claims 1 to 5 , wherein said laser oscillator support frame and each of said moving units are spaced apart from each other. The optical system driving unit has a Y-axis guide extending in the Y-direction and a Y-axis slider moved along the Y-axis guide,
7. The laser processing apparatus according to claim 1, wherein said Z-axis guide is fixed to said Y-axis slider. 8. The laser processing apparatus according to claim 7 , wherein said Y-axis slider is provided with a reflecting mirror for reflecting said laser beam from said laser oscillator toward said condensing irradiation section. 9. The Y - axis guide for guiding the condensed irradiating unit is provided perpendicularly or obliquely to the guide for guiding the substrate holding unit when viewed from the Z direction. A laser processing apparatus as described.

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