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JP7149249B2 - Transfer module, cutting device, and method for manufacturing cut product - Google Patents
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JP7149249B2 - Transfer module, cutting device, and method for manufacturing cut product - Google Patents

Transfer module, cutting device, and method for manufacturing cut product Download PDF

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JP7149249B2
JP7149249B2 JP2019199321A JP2019199321A JP7149249B2 JP 7149249 B2 JP7149249 B2 JP 7149249B2 JP 2019199321 A JP2019199321 A JP 2019199321A JP 2019199321 A JP2019199321 A JP 2019199321A JP 7149249 B2 JP7149249 B2 JP 7149249B2
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cutting
cut
moving body
cut product
transfer
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JP2021072396A (en
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和志 宮田
善夏 黄
幹司 石橋
慎也 森下
将馬 大西
京太郎 堀本
貴俊 尾関
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Towa Corp
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Towa Corp
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Priority to KR1020200135156A priority patent/KR102498114B1/en
Priority to CN202011136270.7A priority patent/CN112750740B/en
Priority to TW109137409A priority patent/TWI750873B/en
Publication of JP2021072396A publication Critical patent/JP2021072396A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00Cutting or separating of wafers, substrates or parts of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0428Apparatus for mechanical treatment or grinding or cutting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202Mechanical details, e.g. rollers or belts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218Conveying cassettes, containers or carriers

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  • Dicing (AREA)
  • Air Transport Of Granular Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

本発明は、搬送モジュール、搬送モジュールを備えた切断装置及び切断品の製造方法に関する。 TECHNICAL FIELD The present invention relates to a transfer module, a cutting apparatus equipped with the transfer module, and a method for manufacturing a cut product.

チップが搭載されたリードフレームや基板等は、一般的に樹脂封止することにより電子部品として用いられる。従来、複数のチップを搭載して配線した基板を一括して樹脂封止してパッケージ基板を製造した後、このパッケージ基板を切断(個片化)して複数の切断品(電子部品)を製造する切断装置が知られている(例えば、特許文献1~2参照)。 Lead frames, substrates, and the like on which chips are mounted are generally used as electronic components by being resin-sealed. Conventionally, after manufacturing a package substrate by collectively encapsulating a board on which multiple chips are mounted and wired, the package substrate is cut (individualized) to manufacture multiple cut products (electronic components). Cutting devices for cutting are known (see, for example, Patent Documents 1 and 2).

特許文献1に記載の切断装置は、パッケージ基板を保持テープにて吸着保持する保持テーブルと、保持テーブル上のパッケージ基板を複数の切断品に切断する切削ブレードと、保持テーブル上の複数の切断品を吸引して搬送する吸引回収手段と、を備えている。この吸引回収手段では、管状部材に供給された圧縮空気により複数の切断品を吸引して保持テープから引き剥がし、管状部材出口側に配置されたサイクロン容器の内壁面に沿って切断品を螺旋状に落下させながら収容ボックスに回収する。 The cutting device described in Patent Document 1 includes a holding table that sucks and holds a package substrate with a holding tape, a cutting blade that cuts the package substrate on the holding table into a plurality of pieces to be cut, and a plurality of pieces to be cut on the holding table. and suction recovery means for sucking and conveying the . In this suction collecting means, the compressed air supplied to the tubular member sucks the plurality of cut articles, peels them off from the holding tape, and spirals the cut articles along the inner wall surface of the cyclone vessel arranged on the outlet side of the tubular member. Collect it in the storage box while dropping it.

特許文献2に記載の切断装置は、パッケージ基板を保持テーブルの下方から吸引するための吸引源と、保持テーブル上のパッケージ基板を複数の切断品に切断する切削ブレードと、保持テーブル上の複数の切断品を上方に配置された吸引ヘッドで吸引して搬送する吸引ユニットと、を備えている。吸引源の負圧を遮断した上で、吸引ユニットの吸引ヘッドに負圧を作用させて複数の切断品を吸引し、気体又は液体の流れに乗せて切断品を搬送する。 The cutting device described in Patent Document 2 includes a suction source for sucking the package substrate from below the holding table, a cutting blade for cutting the package substrate on the holding table into a plurality of pieces, and a plurality of pieces on the holding table. a suction unit that sucks and conveys the cut product with a suction head arranged above. After shutting off the negative pressure of the suction source, a negative pressure is applied to the suction head of the suction unit to suck a plurality of cut products, and the cut products are transported on the flow of gas or liquid.

特開2014-220459号公報JP 2014-220459 A 特開2017-152442号公報JP 2017-152442 A

従来の切断装置では、切断品のサイズが例えば2mm角未満と小さくなると搬送が困難となる。特許文献1に記載の切断装置のように、吸引力により複数の切断品を保持テープから引き剥がす場合、吸引力が弱すぎると搬送できない切断品が残存し、吸引力が強すぎると切断品が破損するおそれがある。また、特許文献2に記載の切断装置においても、吸引ヘッドで吸引する場合、吸引力が弱すぎると搬送できない切断品が残存し、吸引力が強すぎると切断品が破損するおそれがある。 In the conventional cutting apparatus, it becomes difficult to convey a cut product having a size of less than 2 mm square, for example. As in the cutting device described in Patent Document 1, when a plurality of cut products are separated from a holding tape by a suction force, if the suction force is too weak, the cut products will remain unconveyable, and if the suction force is too strong, the cut products will be removed. There is a risk of damage. Also, in the cutting device described in Patent Document 2, when the suction head is used for suction, if the suction force is too weak, cut products that cannot be conveyed remain, and if the suction force is too strong, the cut products may be damaged.

そこで、複数の切断品を確実に搬送できる搬送モジュール、切断装置及び切断品の製造方法が望まれている。 Therefore, there is a demand for a transfer module, a cutting apparatus, and a method for manufacturing a cut product that can reliably transfer a plurality of cut products.

本発明に係る搬送モジュールの特徴構成は、切断テーブル上に配置され、パッケージ基板が切断されて形成された複数の切断品と接触しながら移動可能な移動体と、前記移動体を駆動させる駆動機構と、複数の前記切断品を移送する移送機構と、を備え、前記移動体と接触した前記切断品を前記移動体の回転により前記切断テーブルから引き離して移送する点にある。 A transfer module according to the present invention is characterized by a moving body arranged on a cutting table and movable while being in contact with a plurality of cut products formed by cutting package substrates, and a driving mechanism for driving the moving body. and a transfer mechanism for transferring a plurality of the cut articles, wherein the cut articles in contact with the moving body are moved away from the cutting table by the rotation of the moving body.

本発明に係る切断装置の特徴構成は、前記搬送モジュールと、前記切断品を切断する切断機構と、前記移送機構により移送された前記切断品を洗浄する洗浄機構と、を備えた点にある。 A feature of the cutting apparatus according to the present invention is that it includes the transfer module, a cutting mechanism for cutting the cut product, and a cleaning mechanism for cleaning the cut product transferred by the transfer mechanism.

本発明に係る切断品の製造方法の特徴は、前記切断装置を用いて前記切断品を製造する点にある。 A feature of the method for manufacturing a cut product according to the present invention is that the cut product is manufactured using the cutting device.

本発明によれば、複数の切断品を確実に搬送できる搬送モジュール、切断装置及び切断品の製造方法を提供する。 ADVANTAGE OF THE INVENTION According to this invention, the conveyance module which can convey a several cut article reliably, a cutting apparatus, and the manufacturing method of a cut article are provided.

切断装置を示す模式図である。It is a schematic diagram which shows a cutting device. 搬送モジュールを示す概略図である。Fig. 3 is a schematic diagram showing a transport module; 洗浄モジュールを示す概略斜視図である。Fig. 2 is a schematic perspective view showing a cleaning module; 図3のIV-IV線断面図である。FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3; 可動ブロックを搬送開始位置まで移動する状態を示す概略図である。It is a schematic diagram showing a state where the movable block is moved to the transport start position. 切断品を移送している状態を示す概略図である。It is the schematic which shows the state which is transferring the cutting|disconnection goods. 可動ブロックを搬送終了位置まで移動した状態を示す概略図である。It is a schematic diagram showing a state where the movable block has been moved to the transfer end position. 洗浄モジュールの容器を移動させる状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state in which a container of the cleaning module is moved; 洗浄モジュールの容器を移動させる状態を示す平面図である。FIG. 4 is a plan view showing a state in which the container of the cleaning module is moved; 洗浄モジュールの反転機構を示す概略斜視図である。FIG. 4 is a schematic perspective view showing an inversion mechanism of the cleaning module; 別実施形態1に係る搬送モジュールを示す概略図である。FIG. 11 is a schematic diagram showing a transfer module according to another embodiment 1; 別実施形態1に係る切断品搬送状態を示す概略図である。FIG. 11 is a schematic diagram showing a state of conveying a cut product according to another embodiment 1; 別実施形態2に係る搬送モジュールを示す概略図である。FIG. 11 is a schematic diagram showing a transfer module according to another embodiment 2; 別実施形態2に係る液流原理の説明図である。FIG. 10 is an explanatory diagram of a liquid flow principle according to another embodiment 2; 別実施形態2に係る切断品搬送状態を示す概略図である。FIG. 11 is a schematic diagram showing a state of conveying a cut product according to another embodiment 2;

以下に、本発明に係る搬送モジュール、切断装置及び切断品の製造方法の実施形態について、図面に基づいて説明する。ただし、以下の実施形態に限定されることなく、その要旨を逸脱しない範囲内で種々の変形が可能である。 BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a transfer module, a cutting device, and a method for manufacturing a cut product according to the present invention will be described below with reference to the drawings. However, without being limited to the following embodiments, various modifications are possible without departing from the scope of the invention.

[装置構成]
チップが搭載されたリードフレームや基板等の成形対象物は樹脂封止することにより電子部品として用いられる。成形対象物を樹脂封止する技術として、コンプレッション方式やトランスファ方式が挙げられる。コンプレッション方式は、例えば、離型フィルム上に液状又は粉粒体状の樹脂を供給した後、成形型のキャビティにその離型フィルムを載置し、離型フィルム上の樹脂に成形対象物を浸し入れて樹脂成形する方式である。トランスファ方式は、例えば、成形対象物を成形型のキャビティに収容し、成形型のポットに樹脂タブレットを供給して加熱、溶融した後、溶融樹脂をキャビティに供給して樹脂成形する方式である。
[Device configuration]
Molding objects such as lead frames and substrates on which chips are mounted are used as electronic components by resin sealing. Techniques for resin-sealing molding objects include a compression method and a transfer method. In the compression method, for example, after supplying a liquid or granular resin onto the release film, the release film is placed in the cavity of the mold, and the molding object is immersed in the resin on the release film. It is a method of inserting and resin-molding. In the transfer method, for example, an object to be molded is placed in a mold cavity, a resin tablet is supplied to the pot of the mold, heated and melted, and then the molten resin is supplied to the cavity to perform resin molding.

コンプレッション方式やトランスファ方式の樹脂成形装置は、製造効率化の観点から、複数のチップを搭載して配線した基板を一括して樹脂封止するMAP(molded array packaging)等のパッケージ基板を製造する装置が用いられることがある。この装置にてパッケージ基板を製造した後、切断装置にて切断され(個片化され)、形成された切断品が品質検査を経た上で電子部品として用いられる。切断装置では、パッケージ基板が切断されて形成された複数の切断品を搬送、洗浄、乾燥するが、切断品のサイズが例えば2mm角未満と小さくなると搬送が困難となる。そこで、本実施形態では、複数の切断品を確実に搬送できる搬送モジュール、切断装置及び切断品の製造方法を提供する。以下において、複数の半導体チップが搭載されたパッケージ基板を切断対象物の一例として説明し、重力方向を下、重力方向とは反対方向を上として説明することがある。 Compression-type and transfer-type resin molding machines are equipment for manufacturing package substrates such as MAP (molded array packaging), which collectively resin-seal substrates on which multiple chips are mounted and wired, from the viewpoint of manufacturing efficiency. is sometimes used. After the package substrate is manufactured by this apparatus, it is cut (individualized) by a cutting apparatus, and the formed cut product is used as an electronic component after undergoing a quality inspection. The cutting apparatus transports, cleans, and dries a plurality of cut products formed by cutting the package substrate. Therefore, the present embodiment provides a transfer module, a cutting device, and a method for manufacturing a cut product that can reliably transfer a plurality of cut products. In the following description, a package substrate on which a plurality of semiconductor chips are mounted is described as an example of an object to be cut, and the direction of gravity is sometimes described as the bottom, and the direction opposite to the direction of gravity is described as the top.

図1には、切断装置Dの模式図が示されている。本実施形態における切断装置Dは、樹脂成形装置Eと別体で構成されており、樹脂成形装置Eにて樹脂封止されたパッケージ基板Sを受け入れ、このパッケージ基板Sを切断、洗浄、乾燥して、複数の切断品Saを製造する。この製造された切断品Saは、所定の品質検査を経た上で電子部品として用いられる。 A schematic diagram of the cutting device D is shown in FIG. The cutting device D in the present embodiment is configured separately from the resin molding device E, receives the package substrate S that has been resin-sealed by the resin molding device E, and cuts, cleans, and dries the package substrate S. to manufacture a plurality of cut products Sa. The manufactured cut product Sa is used as an electronic component after undergoing a predetermined quality inspection.

切断装置Dは、切断モジュール1と洗浄モジュール2と制御部3とを有している。切断モジュール1と洗浄モジュール2とは、独立して装着又は取り外しすることができる。また、切断装置Dは、切断モジュール1と洗浄モジュール2とに亘って搬送モジュール4を有している。制御部3は、切断装置Dの動作を制御するソフトウェアとして、HDDやメモリ等のハードウェアに記憶されたプログラムで構成されており、コンピュータのCPUにより実行される。つまり、制御部3は、切断モジュール1、洗浄モジュール2及び搬送モジュール4の動作を制御する。 The cutting device D has a cutting module 1 , a cleaning module 2 and a controller 3 . The cutting module 1 and the cleaning module 2 can be installed or removed independently. The cutting device D also has a transfer module 4 between the cutting module 1 and the cleaning module 2 . The control unit 3 is composed of a program stored in hardware such as an HDD or a memory as software for controlling the operation of the cutting device D, and is executed by the CPU of the computer. In other words, the controller 3 controls the operations of the cutting module 1 , the cleaning module 2 and the transfer module 4 .

切断モジュール1は、受入部11と切断機構12とを有している。なお、受入部11や切断機構12の個数は、1つ又は2つ以上設けても良く、特に限定されない。 The cutting module 1 has a receiving part 11 and a cutting mechanism 12 . The number of receiving units 11 and cutting mechanisms 12 may be one or two or more, and is not particularly limited.

受入部11は、樹脂成形装置Eから、切断対象物として平面視矩形状のパッケージ基板Sを受け入れる。受け入れられたパッケージ基板Sはプレステージ11a上に載置される。切断機構12は、パッケージ基板Sを移送する2つの切断用移送機構12aと、切断用移送機構12a上に配置された2つの切断テーブル12bと、2つの切断部12cと、を含んでいる。切断用移送機構12aは、パッケージ基板Sが切断テーブル12b上に固定された状態で、Y方向に移動可能、且つ、θ方向に回転可能に構成されている。切断用移送機構12a及び切断部12cの駆動源は、特に限定されないが、例えば、サーボモータ等の電動モータを用いることができる。 The receiving unit 11 receives a package substrate S having a rectangular shape in plan view as an object to be cut from the resin molding apparatus E. As shown in FIG. The received package substrate S is placed on the prestage 11a. The cutting mechanism 12 includes two cutting transport mechanisms 12a for transporting the package substrate S, two cutting tables 12b arranged on the cutting transport mechanisms 12a, and two cutting sections 12c. The transfer mechanism 12a for cutting is configured to be movable in the Y direction and rotatable in the θ direction while the package substrate S is fixed on the cutting table 12b. Although the drive source for the cutting transfer mechanism 12a and the cutting portion 12c is not particularly limited, for example, an electric motor such as a servomotor can be used.

切断テーブル12bでは、受入部11から受け取ったパッケージ基板Sが、樹脂封止された側を下面として、エア吸着等で固定されている。切断部12cは、スピンドル部12c1と回転ブレード12c2とを含んでおり、回転ブレード12c2により切断テーブル12bに固定されたパッケージ基板Sを切断する。また、切断テーブル12bの上面、すなわちパッケージ基板Sが固定される固定面には、回転ブレード12c2が進入可能なように溝が形成されている。回転ブレード12c2は、スピンドル部12c1の回転軸に固定されており、X方向及びZ方向に移動可能、且つ、高速回転可能に構成されている。切断用移送機構12aがY方向及びθ方向に移動及び回転し、回転ブレード12c2がX方向及びZ方向に移動することにより、回転ブレード12c2とパッケージ基板Sとの相対位置が調整される。この相対位置の調整を繰り返しながら、回転ブレード12c2により、パッケージ基板Sが、上面から下面に向かって貫通するように切断され、平面視矩形状の複数の切断品Saが形成される。このとき、回転ブレード12c2とパッケージ基板Sとの接触部位に切削水を供給しながら、切断しても良い。なお、切断用移送機構12a又は回転ブレード12c2の何れかを移動させて相対位置の調整を行っても良い。また、2つの切断部12cは、スピンドル部12c1が直線状で回転ブレード12c2が互いに対向するように位置することができ、2つの回転ブレード12c2の間隔の距離が可変で、X方向において2つの切断テーブル12bのいずれの上部にも移動可能である。 On the cutting table 12b, the package substrate S received from the receiving section 11 is fixed by air suction or the like with the resin-sealed side facing downward. The cutting section 12c includes a spindle section 12c1 and a rotating blade 12c2, and cuts the package substrate S fixed to the cutting table 12b by the rotating blade 12c2. A groove is formed in the upper surface of the cutting table 12b, that is, the fixed surface to which the package substrate S is fixed so that the rotating blade 12c2 can enter. The rotating blade 12c2 is fixed to the rotating shaft of the spindle portion 12c1, is movable in the X direction and the Z direction, and is rotatable at high speed. The cutting transfer mechanism 12a moves and rotates in the Y and θ directions, and the rotating blade 12c2 moves in the X and Z directions, thereby adjusting the relative position between the rotating blade 12c2 and the package substrate S. While repeating this relative position adjustment, the rotary blade 12c2 cuts the package substrate S so as to penetrate from the upper surface to the lower surface, thereby forming a plurality of cut products Sa that are rectangular in plan view. At this time, cutting may be performed while supplying cutting water to the contact portion between the rotary blade 12c2 and the package substrate S. The relative position may be adjusted by moving either the cutting transfer mechanism 12a or the rotary blade 12c2. In addition, the two cutting parts 12c can be positioned so that the spindle part 12c1 is linear and the rotating blades 12c2 are opposed to each other, and the distance between the two rotating blades 12c2 is variable, so that the two cutting parts 12c can be cut in the X direction. It can be moved to any upper part of the table 12b.

洗浄モジュール2は、洗浄機構2Aと流体給排機構2Bと平面視矩形状の回収ボックス2Cとを有している。洗浄機構2Aは、複数の切断品Saを水等の洗浄液と共に容器21内に収容して、この容器21を回転させることで液流を発生させて複数の切断品Saを洗浄する。流体給排機構2Bは、洗浄機構2Aの容器21内に圧縮空気を供給する、又は、後述する可撓管47a内の空気を吸引して排出する気体給排ポンプ(不図示)を含んでいる。また、流体給排機構2Bは、給水源(例えば上水道、工場内の純水供給パイプ)から容器21内に洗浄液を供給することが可能である。洗浄モジュール2の詳細は後述する。 The cleaning module 2 has a cleaning mechanism 2A, a fluid supply/discharge mechanism 2B, and a recovery box 2C that is rectangular in plan view. The cleaning mechanism 2A contains a plurality of cut articles Sa together with a cleaning liquid such as water in a container 21, and rotates the container 21 to generate a liquid flow to clean the plurality of cut articles Sa. The fluid supply/discharge mechanism 2B includes a gas supply/discharge pump (not shown) that supplies compressed air into the container 21 of the cleaning mechanism 2A or sucks and discharges air in a flexible tube 47a, which will be described later. . Further, the fluid supply/drainage mechanism 2B can supply the cleaning liquid into the container 21 from a water supply source (for example, water supply, pure water supply pipe in the factory). Details of the cleaning module 2 will be described later.

図2に示すように、搬送モジュール4は、切断機構12の切断テーブル12b上に配置され、パッケージ基板Sが切断されて形成された複数の切断品Saと接触しながら移動可能な移動体44と、移動体44を支持する可動ボックスBと、移動体44を駆動させる駆動機構46と、複数の切断品Saを移送する移送機構47とを有している。 As shown in FIG. 2, the transfer module 4 is arranged on the cutting table 12b of the cutting mechanism 12, and includes a moving body 44 that can move while being in contact with a plurality of cut products Sa formed by cutting the package substrate S. , a movable box B for supporting the moving body 44, a driving mechanism 46 for driving the moving body 44, and a transfer mechanism 47 for transferring a plurality of cut products Sa.

移動体44は、回転軸44a1と、回転軸44a1に固定された回転本体44aと、回転本体44aの周囲から径方向外側に突出した複数の突出部44bと、を含んでいる。複数の突出部44bは、切断品Saと接触して切断テーブル12bから引き離す際に変形し難く、切断品Saを傷つけないナイロン、PBT(ポリブチレンテレフタレート)等の樹脂材料で構成されている。移動体44としては、例えば直径が0.10mm~0.13mmの樹脂製の突出部44bを複数配置したブラシ状の構成とすることができる。 The moving body 44 includes a rotating shaft 44a1, a rotating body 44a fixed to the rotating shaft 44a1, and a plurality of protrusions 44b protruding radially outward from the periphery of the rotating body 44a. The plurality of protruding portions 44b are made of a resin material such as nylon or PBT (polybutylene terephthalate) that does not easily deform when coming into contact with the cut product Sa and separates it from the cutting table 12b, and does not damage the cut product Sa. The moving body 44 may have a brush-like configuration in which a plurality of resin projections 44b having a diameter of 0.10 mm to 0.13 mm are arranged.

可動ボックスBは、ベアリング(不図示)等を介して、回転軸44a1を支持する筺体であり、後述する移送機構47の可撓管47aが上部に固定されている。可動ボックスBは、後述するスライド駆動機構46bにより、X方向及びZ方向にスライド移動可能に構成されている。 The movable box B is a housing that supports the rotating shaft 44a1 via bearings (not shown) or the like, and a flexible tube 47a of a transfer mechanism 47, which will be described later, is fixed to the top. The movable box B is configured to be slidable in the X and Z directions by a slide drive mechanism 46b, which will be described later.

駆動機構46は、回転軸44a1周りに移動体44を回転させる回転駆動機構46aと、可動ボックスBをX方向及びZ方向にスライド移動させるスライド駆動機構46bとを有している。回転駆動機構46aは、移動体44の前方を、進行方向(+X方向)に対して上向きに交差する回転方向R(図2においては反時計方向)で回転させる。つまり、移動体44は、回転状態で切断テーブル12bに最も近接した位置における回転接線方向が移動方向と同一である。この駆動機構46の駆動源は、サーボモータ等の電動モータやエアシリンダ等で構成されている。 The drive mechanism 46 has a rotation drive mechanism 46a that rotates the moving body 44 around the rotation shaft 44a1, and a slide drive mechanism 46b that slides the movable box B in the X and Z directions. The rotation drive mechanism 46a rotates the front of the moving body 44 in a rotation direction R (counterclockwise in FIG. 2) that crosses upward with respect to the traveling direction (+X direction). That is, the moving body 44 has the same rotation tangential direction at the position closest to the cutting table 12b in the rotating state as the moving direction. A drive source of the drive mechanism 46 is composed of an electric motor such as a servomotor, an air cylinder, or the like.

移送機構47は、気体及び液体が切断品Saと共に流通する可撓管47a(吸引路の一例)と、流体給排機構2Bに含まれる気体給排ポンプの駆動力により切断テーブル12b上の複数の切断品Saを吸引するバキューム機構29と、水等の液体を可撓管47aに供給する液体供給機構43と、を有している。可撓管47aの一端47bは、水等の液体を供給する液体供給機構43が接続されており、可撓管47aの他端47cは、容器21の内部と連通している。バキューム機構29は、流体給排機構2Bに設けられた気体給排ポンプと、排気可能に一端が気体給排ポンプに接続され、他端が後述する外筒28a及び中間筒Tの底壁に接続されたバキューム管29aと、で構成されている。バキューム機構29のバキューム管29aには、電磁弁等で構成される開閉バルブVfが設けられている。移動体44の突出部44bに接触して切断テーブル12bから引き離された複数の切断品Saは、バキューム機構29により可撓管47aに作用する負圧を受けて可撓管47aに流入し、液体供給機構43からの液流により、容器21まで移送される。 The transfer mechanism 47 includes a flexible tube 47a (an example of a suction path) through which the gas and liquid flow together with the workpiece Sa, and a plurality of electrodes on the cutting table 12b by the driving force of the gas supply/discharge pump included in the fluid supply/discharge mechanism 2B. It has a vacuum mechanism 29 for sucking the cut product Sa and a liquid supply mechanism 43 for supplying a liquid such as water to the flexible tube 47a. One end 47b of the flexible tube 47a is connected to the liquid supply mechanism 43 for supplying a liquid such as water, and the other end 47c of the flexible tube 47a communicates with the inside of the container 21 . One end of the vacuum mechanism 29 is connected to the gas supply/discharge pump provided in the fluid supply/discharge mechanism 2B and the gas supply/discharge pump so as to be able to exhaust air, and the other end is connected to the bottom walls of the outer cylinder 28a and the intermediate cylinder T, which will be described later. and a vacuum tube 29a. A vacuum pipe 29a of the vacuum mechanism 29 is provided with an opening/closing valve Vf composed of an electromagnetic valve or the like. A plurality of cut products Sa that have come into contact with the projecting portion 44b of the moving body 44 and are separated from the cutting table 12b are subjected to negative pressure acting on the flexible tube 47a by the vacuum mechanism 29, and flow into the flexible tube 47a, where the liquid is It is transferred to the container 21 by the liquid flow from the supply mechanism 43 .

以下、図3~図4を用いて、洗浄モジュール2の洗浄機構2Aについて詳述する。 The cleaning mechanism 2A of the cleaning module 2 will be described in detail below with reference to FIGS. 3 and 4. FIG.

洗浄モジュール2の洗浄機構2Aは、パッケージ基板Sが切断されて形成された複数の切断品Saを収容する容器21と、容器21を回転させる回転機構22と、容器21内に洗浄液を供給する給液機構23と、容器21内の洗浄液を排出する排液機構24と、容器21内に圧縮空気を供給する給気機構25と、容器21内の空気を排出する排気機構26と、容器21を回動及び反転させる回動反転機構27とを有している。また、洗浄機構2Aは、容器21内が所定の水位を超過したときに後述する中間筒Tを乗り越えた切屑等の微小ゴミを含む洗浄液を排水するドレン機構28を有していても良い。 The cleaning mechanism 2A of the cleaning module 2 includes a container 21 that houses a plurality of cut products Sa formed by cutting the package substrate S, a rotation mechanism 22 that rotates the container 21, and a supply that supplies cleaning liquid into the container 21. A liquid mechanism 23, a liquid drainage mechanism 24 for discharging the cleaning liquid in the container 21, an air supply mechanism 25 for supplying compressed air into the container 21, an exhaust mechanism 26 for discharging the air in the container 21, and the container 21. It has a rotation reversing mechanism 27 for rotating and reversing. Further, the cleaning mechanism 2A may have a drain mechanism 28 for draining the cleaning liquid containing fine dust such as chips that has climbed over the intermediate tube T described later when the water level in the container 21 exceeds a predetermined level.

容器21は、重力方向に対して所定角度傾いて配置されている。この所定角度は、5°~50°であり、好ましくは10°~40°であり、より好ましくは20°~30°の範囲内で設定されている。容器21は、底壁が円錐形状で形成された有底筒状の内筒21bと、内筒21bの外周側に配置された外筒28aと、を有しており、内筒21b及び外筒28aは一体回転可能に構成されている。内筒21bの底壁の内面には、中央(回転機構22の回転軸22b)に近付くほど重力方向に向かって傾斜した傾斜面21b1が形成されている。 The container 21 is arranged at a predetermined angle with respect to the direction of gravity. This predetermined angle is set within the range of 5° to 50°, preferably 10° to 40°, more preferably 20° to 30°. The container 21 has a bottomed cylindrical inner cylinder 21b having a conical bottom wall and an outer cylinder 28a arranged on the outer peripheral side of the inner cylinder 21b. 28a is configured to be integrally rotatable. An inner surface of the bottom wall of the inner cylinder 21b is formed with an inclined surface 21b1 that is inclined toward the direction of gravity as it approaches the center (rotating shaft 22b of the rotating mechanism 22).

内筒21bと外筒28aとの間には、中間筒Tが回転不能に固定されている。内筒21bのうち、側壁における中間筒Tの上端面より少し高い位置(所定の水位)から底壁まで、切屑等の微小ゴミは通過するが、切断品Saが通過しない大きさの多数の微細孔21cが形成されている。つまり、内筒21bは、中間筒Tの上端面付近の側壁から底壁にかけてメッシュ構造を有している。また、内筒21bには、径方向外側に環状に延出した環状フランジ21dが形成されており、この環状フランジ21dの下面には、回転方向視で傾斜面を有する複数の傾斜突起21d1が形成されている(図3の拡大図参照)。中間筒Tの底壁は、排液機構24の排液管24aが固定された円錐台形状で構成されている。外筒28aは、容器21内が所定の水位を超過したときに内筒21bの微細孔21cを介して中間筒Tの上端面(頂部)を乗り越えた切屑等の微小ゴミを含む洗浄液を排水するドレン機構28として構成されている。外筒28aの底壁は、排水先(例えば下水道、工場内の排水パイプ)に洗浄液を排出するドレン管28bに対して相対回転可能に内挿された内挿管28a1が突出した円錐台形状で構成されている(図4参照)。また、外筒28aの上端外表面には、内筒21bの傾斜突起21d1の傾斜面に対して、回転方向で当接する傾斜面を有する複数の傾斜突起28a2が突出形成されている(図3の拡大図参照)。 An intermediate tube T is non-rotatably fixed between the inner tube 21b and the outer tube 28a. In the inner cylinder 21b, from a position (predetermined water level) on the side wall slightly higher than the upper end surface of the intermediate cylinder T to the bottom wall, fine dust such as chips can pass, but a large number of fine particles having a size that does not allow the cut product Sa to pass. A hole 21c is formed. That is, the inner tube 21b has a mesh structure from the side wall near the upper end surface of the intermediate tube T to the bottom wall. The inner cylinder 21b is formed with an annular flange 21d extending radially outward in an annular shape, and a plurality of inclined projections 21d1 having inclined surfaces as viewed in the rotation direction are formed on the lower surface of the annular flange 21d. (See enlarged view in FIG. 3). The bottom wall of the intermediate tube T is formed in a truncated cone shape to which the drain pipe 24a of the drain mechanism 24 is fixed. The outer cylinder 28a drains the cleaning liquid containing fine dust such as chips that has climbed over the upper end surface (top) of the intermediate cylinder T through the fine holes 21c of the inner cylinder 21b when the water level inside the container 21 exceeds a predetermined level. It is configured as a drain mechanism 28 . The bottom wall of the outer cylinder 28a has a truncated cone shape in which an inner tube 28a1 protrudes and is rotatably inserted relative to a drain tube 28b that discharges the cleaning liquid to a drainage destination (for example, a sewage system or a drainage pipe in a factory). (See FIG. 4). In addition, a plurality of inclined projections 28a2 having inclined surfaces that come into contact with the inclined surfaces of the inclined projections 21d1 of the inner cylinder 21b in the rotational direction protrude from the outer surface of the upper end of the outer cylinder 28a (see FIG. 3). (See enlarged view).

また、洗浄モジュール2には、内筒21bの上部開口を閉塞する蓋30が設けられており、この蓋30を上下移動させるエアシリンダ等で構成される蓋移動機構31が設けられている。蓋30には、搬送モジュール4の可撓管47a、給液機構23の給液管23a及び給気機構25の給気管25aが固定されている。蓋30を内筒21bに密着させた状態で、内筒21b内に可撓管47aから複数の切断品Saが液流により供給され、内筒21b内に給液管23aから洗浄液が供給される。このとき、内筒21bには多数の微細孔21cが形成されているため、内筒21b内の洗浄液は中間筒T内に流出するが、切断品Saは微細孔21cを通過しない。本実施形態では、複数の切断品Saを液流により内筒21b内に供給しているため、切断品Saが可撓管47aの管内に付着して残存するといった不都合を防止できる。 The cleaning module 2 is provided with a lid 30 for closing the upper opening of the inner cylinder 21b, and is provided with a lid moving mechanism 31 configured by an air cylinder or the like for moving the lid 30 up and down. A flexible tube 47 a of the transfer module 4 , a liquid supply tube 23 a of the liquid supply mechanism 23 , and an air supply tube 25 a of the air supply mechanism 25 are fixed to the lid 30 . With the lid 30 in close contact with the inner cylinder 21b, a plurality of cut products Sa are supplied by liquid flow from the flexible tube 47a into the inner cylinder 21b, and cleaning liquid is supplied from the liquid supply pipe 23a into the inner cylinder 21b. . At this time, since a large number of fine holes 21c are formed in the inner cylinder 21b, the cleaning liquid in the inner cylinder 21b flows out into the intermediate cylinder T, but the cut product Sa does not pass through the fine holes 21c. In this embodiment, since a plurality of cut products Sa are supplied into the inner cylinder 21b by the liquid flow, it is possible to prevent the problem that the cut products Sa adhere and remain inside the flexible tube 47a.

回転機構22は、回転軸22b周りに内筒21b及び外筒28aを回転させる電動モータ22aと、上述した内筒21bの傾斜突起21d1及び外筒28aの傾斜突起28a2とを含んでいる。電動モータ22aの駆動力により外筒28aが回転することで、外筒28aの傾斜突起28a2が内筒21bの傾斜突起21d1に当接して、内筒21bも一体回転する。回転機構22により内筒21b及び外筒28aが回転してメッシュ構造の内筒21bの内部に液流が発生し、内筒21b内で洗浄液に浸漬された複数の切断品Saが旋回する洗浄液により洗浄される。 The rotating mechanism 22 includes an electric motor 22a that rotates the inner cylinder 21b and the outer cylinder 28a around a rotating shaft 22b, and the above-described inclined projections 21d1 of the inner cylinder 21b and the inclined projections 28a2 of the outer cylinder 28a. When the outer cylinder 28a is rotated by the driving force of the electric motor 22a, the inclined projections 28a2 of the outer cylinder 28a come into contact with the inclined projections 21d1 of the inner cylinder 21b, and the inner cylinder 21b also rotates integrally. The rotating mechanism 22 rotates the inner cylinder 21b and the outer cylinder 28a to generate a liquid flow inside the mesh-structured inner cylinder 21b. washed.

給液機構23は一端が上水道又は工場内の純水供給パイプに接続され他端が蓋30に接続された給液管23aを含んでいる。排液機構24は、一端が下水道又は工場内の排水パイプに接続され他端が中間筒Tの底壁に接続された排液管24aを含んでいる。給液機構23の給液管23a及び排液機構24の排液管24aには、夫々電磁弁等で構成される開閉バルブVa及び開閉バルブVbが設けられている。 The liquid supply mechanism 23 includes a liquid supply pipe 23a having one end connected to a water supply or a pure water supply pipe in the factory and the other end connected to the lid 30 . The drainage mechanism 24 includes a drainage pipe 24a having one end connected to a sewage system or a drainage pipe in the factory and the other end connected to the bottom wall of the intermediate cylinder T. As shown in FIG. The liquid supply pipe 23a of the liquid supply mechanism 23 and the liquid drain pipe 24a of the liquid drain mechanism 24 are provided with an open/close valve Va and an open/close valve Vb, respectively, which are electromagnetic valves or the like.

給気機構25は、流体給排機構2Bに設けられた気体給排ポンプと、圧縮空気等を導入可能に一端が気体給排ポンプ接続され他端が蓋30に接続された給気管25aと、を含んでいる。排気機構26は、一端が外気に接続され他端が分岐部20aを介して中間筒T及び外筒28aの底壁に接続された排気管26aを含んでいる。給気機構25の給気管25a及び排気機構26の排気管26aには、夫々電磁弁等で構成される開閉バルブVc及び開閉バルブVdが設けられている。なお、給気機構25は、気体給排ポンプを含む必要はなく、給気管25aに圧縮空気等が導入可能な構成であればよく、例えば工場内の圧縮空気供給用の配管パイプが給気管25aの一端に電磁弁を介して接続される構成としても良い。 The air supply mechanism 25 includes a gas supply/discharge pump provided in the fluid supply/discharge mechanism 2B; contains. The exhaust mechanism 26 includes an exhaust pipe 26a having one end connected to the outside air and the other end connected to the bottom walls of the intermediate tube T and the outer tube 28a via a branch portion 20a. The air supply pipe 25a of the air supply mechanism 25 and the exhaust pipe 26a of the exhaust mechanism 26 are provided with an opening/closing valve Vc and an opening/closing valve Vd, which are constituted by electromagnetic valves or the like, respectively. It should be noted that the air supply mechanism 25 does not need to include a gas supply/exhaust pump, and may be configured so that compressed air or the like can be introduced into the air supply pipe 25a. may be connected to one end of the through a solenoid valve.

回動反転機構27は、内筒21bを挟持するクランプ部材27a1を作動させるチャック機構27aと、クランプ部材27a1で挟持された内筒21bを上下させる内筒上下機構27dと、回動軸27b1周りに内筒21bを回動させる回動機構27bと、内筒21bを反転軸27c1周りに回転させて上下反転させる内筒反転機構27cとを含んでいる。回動反転機構27の駆動源は、電動モータやエアシリンダ等で構成されている。 The rotation reversing mechanism 27 includes a chuck mechanism 27a that operates a clamp member 27a1 that clamps the inner cylinder 21b, an inner cylinder vertical mechanism 27d that vertically moves the inner cylinder 21b clamped by the clamp member 27a1, and a rotation shaft 27b1. It includes a rotating mechanism 27b for rotating the inner cylinder 21b and an inner cylinder reversing mechanism 27c for rotating the inner cylinder 21b around a reversing shaft 27c1 to turn it upside down. A drive source for the rotation reversing mechanism 27 is composed of an electric motor, an air cylinder, or the like.

ドレン機構28は、外筒28aと、一端が下水道又は工場内の排水パイプに接続され他端が外筒28aの底壁に接続されたドレン管28bと、を含んでいる。バキューム機構29は、流体給排機構2Bに設けられた気体給排ポンプと、排気可能に一端が気体給排ポンプに接続され他端が分岐部20aを介して中間筒T及び外筒28aの底壁に接続されたバキューム管29aと、を含んでいる。ドレン機構28のドレン管28b及びバキューム機構29のバキューム管29aには、夫々電磁弁等で構成される開閉バルブVe及び開閉バルブVfが設けられている。上述したドレン管28bは分岐部20aで排液管24aと合流して下方に延在しており、排気管26a及びバキューム管29aは分岐部20aでドレン管28bと合流して上方に延在している。この構成により、液体は排液管24a及びドレン管28b内を流下し、気体は排気管26a及びバキューム管29a内を流通する。本実施形態における分岐部20aは、中間筒Tの上端面(中間筒Tの上端面を乗り越える最高水位20b)よりも上方に位置しており、切断品Saの洗浄、乾燥時に中間筒Tの上端面を乗り越えた洗浄液は、分岐部20aと容器21内の最高水位20bとの水頭差により排気管26a及びバキューム管29aに流入することがない。また、切断品Saの洗浄中において排液機構24の開閉バルブVbが閉弁状態にあるとき、排液管24aに滞留する洗浄液は、分岐部20aと容器21内の最高水位20bとの水頭差により排気管26a及びバキューム管29aに流入することがない。万が一、排液管24aに滞留する洗浄液が分岐部20aの水位に達した場合でも、分岐部20aと接続されたドレン管28bから排水される。なお、バキューム機構29は、外筒28a内を負圧にさせないのであれば、気体給排ポンプを含む必要はなく、分岐部20aを介してバキューム管29aから排気可能な構成であれば良く、例えば工場内の排気ダクトがバキューム管29aの一端に接続される構成としても良い。 The drain mechanism 28 includes an outer cylinder 28a and a drain pipe 28b having one end connected to a sewer or factory drain pipe and the other end connected to the bottom wall of the outer cylinder 28a. One end of the vacuum mechanism 29 is connected to the gas supply/discharge pump provided in the fluid supply/discharge mechanism 2B and the gas supply/discharge pump so that the vacuum mechanism 29 can exhaust air. and a vacuum tube 29a connected to the wall. The drain pipe 28b of the drain mechanism 28 and the vacuum pipe 29a of the vacuum mechanism 29 are provided with an opening/closing valve Ve and an opening/closing valve Vf, respectively, which are electromagnetic valves or the like. The drain pipe 28b described above joins the drain pipe 24a at the branch portion 20a and extends downward, and the exhaust pipe 26a and the vacuum pipe 29a join the drain pipe 28b at the branch portion 20a and extend upward. ing. With this configuration, the liquid flows down through the drain pipe 24a and the drain pipe 28b, and the gas flows through the exhaust pipe 26a and the vacuum pipe 29a. The branching portion 20a in this embodiment is positioned above the upper end surface of the intermediate cylinder T (the highest water level 20b above the upper end surface of the intermediate cylinder T). The cleaning liquid that has crossed over the end face does not flow into the exhaust pipe 26a and the vacuum pipe 29a due to the head difference between the branch portion 20a and the highest water level 20b in the container 21 . In addition, when the open/close valve Vb of the drainage mechanism 24 is in the closed state during cleaning of the cut product Sa, the cleaning liquid remaining in the drainage pipe 24a has a water head difference between the branch portion 20a and the maximum water level 20b in the container 21. Therefore, it does not flow into the exhaust pipe 26a and the vacuum pipe 29a. Even if the cleaning liquid remaining in the drain pipe 24a reaches the water level of the branch portion 20a, it is drained from the drain pipe 28b connected to the branch portion 20a. It should be noted that the vacuum mechanism 29 does not need to include a gas supply/exhaust pump as long as the inside of the outer cylinder 28a is not made to have a negative pressure. An exhaust duct in the factory may be connected to one end of the vacuum pipe 29a.

[切断品の製造方法]
図1~図11を用いて切断品Saの製造方法について説明する。
[Manufacturing method of cut product]
A method for manufacturing the cut product Sa will be described with reference to FIGS. 1 to 11. FIG.

図1に示すように、樹脂成形装置Eで樹脂成形されたパッケージ基板Sが受入部11に搬送され、このパッケージ基板Sがプレステージ11a上に載置される。次いで、切断用移送機構12aは、受入部11から受け取った切断対象物としてのパッケージ基板Sを、樹脂封止された側を下面として切断テーブル12bに固定し、切断部12cまで移送する。そして、切断用移送機構12a及び切断部12cにより、パッケージ基板Sと回転ブレード12c2との相対位置が調整され、回転ブレード12c2により、パッケージ基板Sが、上面から下面に向かって貫通するように切断され、平面視矩形状の複数の切断品Saが形成される(切断工程)。 As shown in FIG. 1, the package substrate S resin-molded by the resin molding apparatus E is transported to the receiving section 11, and the package substrate S is placed on the pre-stage 11a. Next, the transfer mechanism 12a for cutting fixes the package substrate S as the object to be cut received from the receiving section 11 to the cutting table 12b with the resin-sealed side facing downward, and transfers it to the cutting section 12c. Then, the relative position between the package substrate S and the rotary blade 12c2 is adjusted by the cutting transfer mechanism 12a and the cutting portion 12c, and the package substrate S is cut by the rotary blade 12c2 so as to penetrate from the upper surface to the lower surface. , a plurality of cut products Sa each having a rectangular shape in plan view are formed (cutting step).

次いで、搬送モジュール4は、切断機構12で切断されて形成された複数の切断品Saを洗浄機構2Aの容器21に搬送する(搬送工程)。図5に示すように、スライド駆動機構46bにより可動ボックスBをX方向及びZ方向にスライド移動させ、移動体44の突出部44bが切断テーブル12bの一端(-X方向の端部)にある切断品Saに接触する位置に調整する。次いで、図6に示すように、複数の切断品Saを吸引するためのバキューム機構29と、水等の液体を可撓管47aに供給するための液体供給機構43とを駆動させると共に、回転駆動機構46aにより、移動体44の前方を進行方向(+X方向)に対して上向きに交差する回転方向R(図6においては反時計方向)で回転させる。その結果、複数の切断品Saは、移動体44の突出部44bと接触して切断テーブル12bから引き離され、バキューム機構29により可撓管47aに吸引され、液体供給機構43により供給された液体と共に移送される。次いで、移動体44の突出部44bが切断品Saに接触した状態でスライド駆動機構46bにより可動ボックスBを前進(+X方向に移動)させる。このとき、回転駆動機構46aにより回転させた移動体44の突出部44bが次の切断品Saに接触して切断テーブル12bから引き離す。切断テーブル12b上の切断品Saの引き離しとバキューム機構29による吸引が繰り返される。そして、図7に示すように、移動体44の突出部44bが切断テーブル12bの他端(+X方向の端部)まで前進し、最終的に全ての切断品Saが容器21に収容される。この搬送工程では、給液機構23,排液機構24,給気機構25,排気機構26及びドレン機構28の開閉バルブVa~Veを閉状態、回転機構22の非駆動状態としたまま、バキューム機構29の開閉バルブVfを開いている(図3参照)。なお、移動体44の突出部44bが切断テーブル12bの他端まで前進した後に、スライド駆動機構46bによる可動ボックスBのX方向へのスライド移動を停止し、可動ボックスBをZ方向に上昇させてから-X方向に移動させて図5に示す位置に戻し、上述の移動体44の回転と+X方向への移動とによる切断品Saの搬送動作を複数回繰り返しても良い。 Next, the transport module 4 transports the plurality of cut products Sa formed by being cut by the cutting mechanism 12 to the container 21 of the cleaning mechanism 2A (transporting step). As shown in FIG. 5, the slide driving mechanism 46b slides the movable box B in the X direction and the Z direction, and the projection 44b of the moving body 44 is positioned at one end (the end in the -X direction) of the cutting table 12b. Adjust to the position where it touches the product Sa. Next, as shown in FIG. 6, the vacuum mechanism 29 for sucking the plurality of cut products Sa and the liquid supply mechanism 43 for supplying a liquid such as water to the flexible tube 47a are driven and rotated. The mechanism 46a rotates the front of the moving body 44 in a rotation direction R (counterclockwise in FIG. 6) that crosses upward with respect to the direction of travel (+X direction). As a result, the plurality of cut products Sa come into contact with the projecting portion 44b of the moving body 44 and are pulled away from the cutting table 12b, sucked into the flexible tube 47a by the vacuum mechanism 29, and together with the liquid supplied by the liquid supply mechanism 43. be transported. Next, the movable box B is advanced (moved in the +X direction) by the slide drive mechanism 46b while the projecting portion 44b of the moving body 44 is in contact with the cut product Sa. At this time, the projecting portion 44b of the moving body 44 rotated by the rotation drive mechanism 46a comes into contact with the next workpiece Sa to be separated from the cutting table 12b. The separation of the cut product Sa from the cutting table 12b and the suction by the vacuum mechanism 29 are repeated. Then, as shown in FIG. 7, the protruding portion 44b of the moving body 44 advances to the other end (+X direction end) of the cutting table 12b, and finally all the cut products Sa are accommodated in the container 21. FIG. In this transfer process, the opening/closing valves Va to Ve of the liquid supply mechanism 23, the liquid discharge mechanism 24, the air supply mechanism 25, the exhaust mechanism 26, and the drain mechanism 28 are closed, and the rotation mechanism 22 is kept in the non-driving state. 29 is opened (see FIG. 3). After the projecting portion 44b of the moving body 44 advances to the other end of the cutting table 12b, the sliding movement of the movable box B in the X direction by the slide drive mechanism 46b is stopped, and the movable box B is raised in the Z direction. 5 to the position shown in FIG. 5, and the conveying operation of the cut product Sa by the above-described rotation of the moving body 44 and movement in the +X direction may be repeated a plurality of times.

このように、本実施形態では、移送機構47が切断品Saを移送するときに、切断品Saと接触しながら移動する移動体44により切断品Saを切断テーブル12bから引き離している。その結果、切断品Saのサイズが小さくなった場合でも、移動体44により引き離された切断品Saを移送機構47により移送すれば、搬送モジュール4を複雑に構成することなく、複数の切断品Saを確実に搬送することができる。つまり、本実施形態では、従来のように、負圧による切断テーブル12bからの切断品Saの引き剥がし不良や切断品Saの破損が発生し難い。 As described above, in this embodiment, when the transport mechanism 47 transports the cut product Sa, the moving body 44 that moves while being in contact with the cut product Sa separates the cut product Sa from the cutting table 12b. As a result, even if the size of the cut product Sa becomes small, if the cut product Sa separated by the moving body 44 is transferred by the transfer mechanism 47, a plurality of the cut products Sa can be produced without complicating the transfer module 4. can be reliably transported. That is, in the present embodiment, it is difficult for the negative pressure to degrade the cut product Sa from the cutting table 12b or damage the cut product Sa, as in the conventional art.

次いで、図4に示すように、洗浄機構2Aは、給液機構23により容器21(内筒21b)内に洗浄液を供給することで、複数の切断品Saが洗浄液と共に容器21(内筒21b)内に収容され、洗浄液が微細孔21cを通って中間筒Tの内側に存在することとなる。そして、回転機構22により容器21(内筒21b及び外筒28a)を回転させることで複数の切断品Saを洗浄する(洗浄工程)。このとき、排液機構24及び給気機構25の開閉バルブVb,Vcを閉状態としたまま、バキューム機構29の開閉バルブVfを閉め、回転機構22を駆動させると共に、給液機構23,排気機構26及びドレン機構28の開閉バルブVa,Vd,Veを開く(図3参照)。なお、内筒21bの微細孔21cを介して中間筒Tの上端面を乗り越えた切屑等の微小ゴミを含む洗浄液は、ドレン機構28により排水され、内筒21b内の空気は、排気機構26により排気される。 Next, as shown in FIG. 4, the cleaning mechanism 2A supplies the cleaning liquid into the container 21 (the inner cylinder 21b) by the liquid supply mechanism 23, so that the plurality of cut products Sa are separated from the container 21 (the inner cylinder 21b) together with the cleaning liquid. The cleaning liquid is contained inside the intermediate tube T and exists inside the intermediate tube T through the fine holes 21c. Then, the rotating mechanism 22 rotates the container 21 (the inner cylinder 21b and the outer cylinder 28a) to wash the plurality of cut products Sa (washing step). At this time, while the opening/closing valves Vb and Vc of the liquid discharge mechanism 24 and the air supply mechanism 25 are kept closed, the opening/closing valve Vf of the vacuum mechanism 29 is closed to drive the rotation mechanism 22, and the liquid supply mechanism 23 and the exhaust mechanism are closed. 26 and the opening/closing valves Va, Vd, and Ve of the drain mechanism 28 are opened (see FIG. 3). The cleaning liquid containing fine dust such as chips that has climbed over the upper end surface of the intermediate tube T through the fine holes 21c of the inner tube 21b is drained by the drain mechanism 28, and the air in the inner tube 21b is discharged by the exhaust mechanism 26. exhausted.

次いで、洗浄工程により複数の切断品Saを洗浄した後に排液機構24及びドレン機構28により切屑等の微小ゴミを含む洗浄液を排出し、給気機構25により容器21の内筒21b内に気体を供給すると共に回転機構22により容器21(内筒21b及び外筒28a)を回転させながら複数の切断品Saを乾燥させる(乾燥工程)。このとき、バキューム機構29の開閉バルブVfの閉状態、排気機構26及びドレン機構28の開閉バルブVd,Veの開状態を維持し、回転機構22の駆動を継続したまま、給液機構23の開閉バルブVaを閉め、排液機構24及び給気機構25の開閉バルブVb,Vcを開く(図3参照)。 Next, after the plurality of cut products Sa are washed by the washing process, the washing liquid containing fine dust such as chips is discharged by the liquid discharge mechanism 24 and the drain mechanism 28, and the gas is supplied to the inner cylinder 21b of the container 21 by the air supply mechanism 25. While supplying, the rotating mechanism 22 rotates the container 21 (the inner cylinder 21b and the outer cylinder 28a) to dry the plurality of cut products Sa (drying step). At this time, the open/close valve Vf of the vacuum mechanism 29 is kept closed, the open/close valves Vd and Ve of the exhaust mechanism 26 and the drain mechanism 28 are kept open, and the liquid supply mechanism 23 is opened/closed while the rotation mechanism 22 is being driven. The valve Va is closed, and the open/close valves Vb and Vc of the drainage mechanism 24 and the air supply mechanism 25 are opened (see FIG. 3).

次いで、排液機構24,給気機構25,排気機構26及びドレン機構28の開閉バルブVb~Veを閉じ、回転機構22の駆動を停止させた後、回動反転機構27により内筒21bを回動及び上下反転させて、複数の切断品Saを取り出す(取出工程)。この取出工程について、図8~図10を用いて説明する。 Next, the opening/closing valves Vb to Ve of the liquid discharge mechanism 24, the air supply mechanism 25, the exhaust mechanism 26, and the drain mechanism 28 are closed to stop the driving of the rotation mechanism 22. A plurality of cut products Sa are taken out by moving and upside down (taking-out step). This extraction process will be described with reference to FIGS. 8 to 10. FIG.

図8に示すように、蓋移動機構31により蓋30を上昇させると共に、チャック機構27aのクランプ部材27a1により内筒21bを挟持した状態で内筒上下機構27dにより内筒21bを上昇させて、内筒21bを中間筒Tから離脱させる。次いで、図9に示すように、回動機構27bにより、回動軸27b1周りに内筒21bを回動させて回収ボックス2Cの上方に移動させる。次いで、図10に示すように、内筒反転機構27cにより内筒21bを反転軸27c1周りに上下反転させ、内筒21b内に収容された複数の切断品Saを回収ボックス2Cに落下させて取り出す。そして、回収ボックス2Cに収納された洗浄、乾燥済みの切断品Saが回収される。このように、容器21の内筒21bを上下反転させて切断品Saを取り出しているため、確実に切断品Saを回収することができる。 As shown in FIG. 8, the lid 30 is lifted by the lid moving mechanism 31, and the inner cylinder 21b is lifted by the inner cylinder lifting mechanism 27d while the inner cylinder 21b is clamped by the clamp member 27a1 of the chuck mechanism 27a. The tube 21b is separated from the intermediate tube T. Next, as shown in FIG. 9, the rotation mechanism 27b rotates the inner cylinder 21b around the rotation shaft 27b1 to move it above the collection box 2C. Next, as shown in FIG. 10, the inner cylinder 21b is turned upside down around the turning shaft 27c1 by the inner cylinder reversing mechanism 27c, and the plurality of cut products Sa stored in the inner cylinder 21b are dropped into the collection box 2C and taken out. . Then, the washed and dried cut product Sa stored in the collection box 2C is collected. Since the cut product Sa is taken out with the inner cylinder 21b of the container 21 turned upside down in this manner, the cut product Sa can be reliably collected.

[別実施形態]
以下、上述した実施形態と同様の部材については、理解を容易にするため、同一の用語、符号を用いて説明する。
[Another embodiment]
Hereinafter, members similar to those of the above-described embodiment will be described using the same terms and symbols for easy understanding.

<1>図11~図12に示すように、移送機構47は、複数の切断品Saを収納する収納部45bを有し、複数の切断品Saが収納された収納部45bを容器21まで移動し、収納部45bから容器21に複数の切断品Saを移し替えても良い。より詳述すると、本実施形態における移送機構47は、切断機構12の切断テーブル12b上に配置され、パッケージ基板Sが切断されて形成された複数の切断品Saと接触しながら移動可能な移動体44と、移動体44を支持する可動ボックスBbと、複数の切断品Saを収納可能な収納部45と、移動体44を駆動させる駆動機構46とを有している。これら移動体44,収納部45b及び駆動機構46は、可動ボックスBb内に一体ユニットとして構成されている。 <1> As shown in FIGS. 11 and 12, the transfer mechanism 47 has a storage portion 45b that stores a plurality of cut products Sa, and moves the storage portion 45b that stores the plurality of cut products Sa to the container 21. Alternatively, a plurality of cut products Sa may be transferred from the storage portion 45b to the container 21 . More specifically, the transfer mechanism 47 in this embodiment is arranged on the cutting table 12b of the cutting mechanism 12, and is a moving body that can move while being in contact with a plurality of cut products Sa formed by cutting the package substrate S. 44 , a movable box Bb that supports the moving body 44 , a storage section 45 that can store a plurality of cut products Sa, and a drive mechanism 46 that drives the moving body 44 . The moving body 44, storage section 45b and drive mechanism 46 are configured as an integrated unit within the movable box Bb.

移動体44は、回転軸44a1周りに回転する回転本体44aと、回転本体44aの周囲から径方向外側に突出した複数の突出部44bと、回転軸44a1を支持し、回転本体44aのスライド移動を案内するガイド溝44cと、を含んでいる。複数の突出部44bは、切断品Saと接触して切断テーブル12bから引き離す際に変形し難く、切断品Saを傷つけないナイロン、PBT(ポリブチレンテレフタレート)等の樹脂材料で構成されている。後述するスライド駆動機構46bにより、移動体44がガイド溝44cに沿って切断テーブル12b上を前進又は後進移動可能に構成されている。 The moving body 44 supports a rotating body 44a that rotates around a rotating shaft 44a1, a plurality of protrusions 44b that protrude radially outward from the periphery of the rotating body 44a, and the rotating shaft 44a1, and allows the rotating body 44a to slide. and a guiding groove 44c. The plurality of protruding portions 44b are made of a resin material such as nylon or PBT (polybutylene terephthalate) that does not easily deform when coming into contact with the cut product Sa and separates it from the cutting table 12b, and does not damage the cut product Sa. A slide driving mechanism 46b, which will be described later, allows the moving body 44 to move forward or backward along the guide groove 44c on the cutting table 12b.

可動ボックスBbは、ベアリング(不図示)等を介して、回転軸44a1を支持する筺体であり、収納部45bが固定されている。可動ボックスBbは、後述するスライド駆動機構46bにより、X方向及びZ方向にスライド移動可能に構成されている。 The movable box Bb is a housing that supports the rotating shaft 44a1 via bearings (not shown) and the like, and the housing portion 45b is fixed. The movable box Bb is configured to be slidable in the X and Z directions by a slide drive mechanism 46b, which will be described later.

駆動機構46は、移動体44を回転駆動させる回転駆動機構46aと、可動ボックスBbをX方向及びZ方向にスライド移動させると共に移動体44を切断テーブル12bの表面に沿ってスライド移動させるスライド駆動機構46bと、を有している。回転駆動機構46aは、移動体44の前方を、進行方向(+X方向)に対して上向きに交差する回転方向R(図11においては反時計方向)で回転させる。スライド駆動機構46bは、移動体44(回転軸44a1)をガイド溝44cに沿ってスライド移動させる。この駆動機構46の駆動源は、サーボモータ等の電動モータ等で構成されている。 The drive mechanism 46 includes a rotation drive mechanism 46a that rotates the movable body 44, and a slide drive mechanism that slides the movable box Bb in the X and Z directions and slides the movable body 44 along the surface of the cutting table 12b. 46b and . The rotation drive mechanism 46a rotates the front of the moving body 44 in a rotation direction R (counterclockwise in FIG. 11) that crosses upward with respect to the traveling direction (+X direction). The slide drive mechanism 46b slides the moving body 44 (rotating shaft 44a1) along the guide groove 44c. A drive source of the drive mechanism 46 is composed of an electric motor such as a servomotor.

切断品Saの搬送方法として、図11に示すように、スライド駆動機構46bにより可動ボックスBbをX方向及びZ方向にスライド移動させ、移動体44の突出部44bが切断テーブル12bの一端(-X方向の端部)にある切断品Saに接触する位置に調整する。そして、パッケージ基板Sが切断されて形成された複数の切断品Saを、回転駆動機構46aにより回転させた移動体44の突出部44bと接触させて切断テーブル12bから引き離す。次いで、移動体44の突出部44bが切断品Saに接触した状態でスライド駆動機構46bにより前進させ、切断品Saを収納部45bに向けて押し出す。このとき、回転駆動機構46aにより回転させた移動体44の突出部44bが次の切断品Saに接触して切断テーブル12bから引き離す。切断テーブル12b上の切断品Saの引き離しと押し出しが繰り返されて、最終的に全ての切断品Saが収納部45bに収納される。なお、本実施形態においても、上述の移動体44の回転と+X方向への移動とによる切断品Saの搬送動作を複数回繰り返しても良い。 As a method for conveying the cut product Sa, as shown in FIG. 11, the movable box Bb is slid in the X direction and the Z direction by the slide drive mechanism 46b, and the projecting portion 44b of the moving body 44 is moved to one end (-X direction) of the cutting table 12b. direction end) is adjusted to a position where it contacts the cut product Sa. Then, a plurality of cut products Sa formed by cutting the package substrate S are brought into contact with the protruding portion 44b of the moving body 44 rotated by the rotation drive mechanism 46a and separated from the cutting table 12b. Next, the protruding portion 44b of the moving body 44 is moved forward by the slide driving mechanism 46b while being in contact with the cut product Sa, and the cut product Sa is pushed out toward the storage portion 45b. At this time, the projecting portion 44b of the moving body 44 rotated by the rotation drive mechanism 46a comes into contact with the next workpiece Sa to be separated from the cutting table 12b. Separation and pushing out of the cut product Sa on the cutting table 12b are repeated until all the cut products Sa are finally stored in the storage unit 45b. Also in this embodiment, the operation of conveying the cut product Sa by rotating the moving body 44 and moving it in the +X direction may be repeated a plurality of times.

次いで、図12に示すように、搬送モジュール4は、可動ボックスBb(複数の切断品Saが収納された収納部45b)を、容器21の開口が収納部45bの下方となるように、洗浄機構2Aの容器21の近傍まで移動させる。次いで、搬送モジュール4は、可動ボックスBbを傾動させると共に振動させ、複数の切断品Saを容器21内に落下させる。このように、容器21に移し替える前に収納部45bに切断品Saを収納すれば、複数の切断品Saが収納された収納部45bを移動するだけで良く、搬送効率を高めることができる。しかも、可動ボックスBbを傾動させて振動させれば、複数の切断品Saを一度に容器21に収容することが可能となるため、液流や吸引により切断品Saを搬送する場合に比べて、切断品Saの回収不良や損傷が発生し難い。なお、図11~図12に示す構成においては、上述した実施形態における切断後の切断品Saの搬送及び容器21への収容の説明と異なる。すなわち、複数の切断品Saを可撓管47aの他端47cから容器21の内部に収容するのではなく、複数の切断品Saを移送機構47の可動ボックスBbから直接容器21の内部に収容することになる。 Next, as shown in FIG. 12, the transfer module 4 moves the movable box Bb (storage section 45b in which a plurality of cut products Sa are stored) so that the opening of the container 21 is below the storage section 45b. It is moved to the vicinity of the container 21 of 2A. Next, the transport module 4 tilts and vibrates the movable box Bb to drop the plurality of cut products Sa into the container 21 . In this way, if the cut products Sa are stored in the storage part 45b before being transferred to the container 21, it is only necessary to move the storage part 45b in which the plurality of cut products Sa are stored, and the transport efficiency can be improved. Moreover, by tilting and vibrating the movable box Bb, it is possible to store a plurality of cut products Sa in the container 21 at once. Poor recovery and damage to the cut product Sa are less likely to occur. 11 and 12 differs from the description of the transport and storage of the cut product Sa after cutting in the above-described embodiment. That is, the plurality of cut products Sa are not accommodated inside the container 21 from the other end 47c of the flexible tube 47a, but the plurality of cut products Sa are accommodated directly inside the container 21 from the movable box Bb of the transfer mechanism 47. It will be.

<2>図13~図15に示すように、移送機構47は、水等の液体が流通する液流路48aを有し、切断品Saを液流路48a内で内筒21bまで移送しても良い。より詳述すると、本実施形態における移送機構47は、切断機構12の切断テーブル12b上に配置され、パッケージ基板Sが切断されて形成された複数の切断品Saと接触しながら移動可能な移動体44と、移動体44を支持する可動ボックスBaと、複数の切断品Saを収納可能な収納部45aと、移動体44を駆動させる駆動機構46と、可撓性のある管で構成され、内部に液体が流通することにより切断品Saを移送する液流路48aと、可動ボックスBa内に液体を供給する供給路48bと、液流路48a及び供給路48bに液体を供給する液体供給機構49と、を有している。これら移動体44,収納部45a,液流路48a,供給路48b及び駆動機構46は、可動ボックスBa内に一体ユニットとして構成されている。 <2> As shown in FIGS. 13 to 15, the transfer mechanism 47 has a liquid flow path 48a through which liquid such as water flows, and transfers the cut product Sa to the inner cylinder 21b in the liquid flow path 48a. Also good. More specifically, the transfer mechanism 47 in this embodiment is arranged on the cutting table 12b of the cutting mechanism 12, and is a moving body that can move while being in contact with a plurality of cut products Sa formed by cutting the package substrate S. 44, a movable box Ba that supports the moving body 44, a storage section 45a capable of storing a plurality of cut products Sa, a driving mechanism 46 that drives the moving body 44, and a flexible tube. A liquid flow path 48a for transferring the cut product Sa by circulating liquid in the liquid flow path 48a, a supply path 48b for supplying liquid to the inside of the movable box Ba, and a liquid supply mechanism 49 for supplying liquid to the liquid flow path 48a and the supply path 48b. and have The moving body 44, storage section 45a, liquid flow path 48a, supply path 48b, and drive mechanism 46 are configured as an integral unit within the movable box Ba.

移動体44は、回転軸44a1周りに回転する回転本体44aと、回転本体44aの周囲から径方向外側に突出した複数の突出部44bと、回転軸44a1を支持し、回転本体44aのスライド移動を案内するガイド溝44cと、を含んでいる。複数の突出部44bは、切断品Saと接触して切断テーブル12bから引き離す際に変形し難く、切断品Saを傷つけないナイロン、PBT(ポリブチレンテレフタレート)等の樹脂材料で構成されている。後述するスライド駆動機構46bにより、移動体44がガイド溝44cに沿って切断テーブル12b上を前進又は後進移動可能に構成されている。 The moving body 44 supports a rotating body 44a that rotates around a rotating shaft 44a1, a plurality of protrusions 44b that protrude radially outward from the periphery of the rotating body 44a, and the rotating shaft 44a1, and allows the rotating body 44a to slide. and a guiding groove 44c. The plurality of protruding portions 44b are made of a resin material such as nylon or PBT (polybutylene terephthalate) that does not easily deform when coming into contact with the cut product Sa and separates it from the cutting table 12b, and does not damage the cut product Sa. A slide driving mechanism 46b, which will be described later, allows the moving body 44 to move forward or backward along the guide groove 44c on the cutting table 12b.

可動ボックスBaは、ベアリング(不図示)等を介して、回転軸44a1を支持する筺体であり、収納部45aが固定されている。また、可動ボックスBaには、液流路48aが収納部45a内で閉塞状態と開放状態とに切替え可能に支持されている。可動ボックスBaは、後述するスライド駆動機構46bにより、X方向及びZ方向にスライド移動可能に構成されている。 The movable box Ba is a housing that supports the rotating shaft 44a1 via bearings (not shown) and the like, and the housing portion 45a is fixed. Further, the movable box Ba supports a liquid flow path 48a so as to be switchable between a closed state and an open state within the storage portion 45a. The movable box Ba is configured to be slidable in the X and Z directions by a slide drive mechanism 46b, which will be described later.

駆動機構46は、移動体44を回転駆動させる回転駆動機構46aと、可動ボックスBaをX方向及びZ方向にスライド移動させると共に移動体44を切断テーブル12bの表面に沿ってスライド移動させるスライド駆動機構46bとを有している。回転駆動機構46aは、移動体44の前方を、進行方向(+X方向)に対して上向きに交差する回転方向R(図13においては反時計方向)で回転させる。スライド駆動機構46bは、移動体44(回転軸44a1)をガイド溝44cに沿ってスライド移動させる。また、駆動機構46は、液流路48aを閉塞状態と開放状態とに切替える切替機構46cを有している。この駆動機構46の駆動源は、サーボモータ等の電動モータ等で構成されている。 The drive mechanism 46 includes a rotation drive mechanism 46a that rotates the movable body 44, and a slide drive mechanism that slides the movable box Ba in the X and Z directions and slides the movable body 44 along the surface of the cutting table 12b. 46b. The rotation drive mechanism 46a rotates the front of the moving body 44 in a rotation direction R (counterclockwise in FIG. 13) that crosses upward with respect to the traveling direction (+X direction). The slide drive mechanism 46b slides the moving body 44 (rotating shaft 44a1) along the guide groove 44c. The driving mechanism 46 also has a switching mechanism 46c that switches the liquid flow path 48a between a closed state and an open state. A drive source of the drive mechanism 46 is composed of an electric motor such as a servomotor.

切断品Saの搬送方法として、図13に示すように、スライド駆動機構46bにより可動ボックスBaをX方向及びZ方向にスライド移動させ、移動体44の突出部44bが切断テーブル12bの一端(-X方向の端部)にある切断品Saに接触する位置に調整する。そして、図14に示すように、液体供給機構49により可動ボックスBa内に液体を供給すると共に、切替機構46cにより液流路48aを閉塞状態に切替えて、サイフォン効果により液流路48a内に液体を貯留する。次いで、図13~図14に示すように、切替機構46cにより液流路48aを開放状態に切替え、パッケージ基板Sが切断されて形成された複数の切断品Saを、回転駆動機構46aにより回転させた移動体44の突出部44bと接触させて切断テーブル12bから引き離す。次いで、図15に示すように、移動体44の突出部44bが切断品Saに接触した状態でスライド駆動機構46bにより前進させ、液体供給機構49による液流と共に切断品Saを収納部45に向けて押し出す。このとき、回転駆動機構46aにより回転させた移動体44の突出部44bが次の切断品Saに接触して切断テーブル12bから引き離す。収納部45に押し出された切断品Saは、液流路48a内の液流により容器21に移送される。そして、移動体44の突出部44bが切断テーブル12bの他端(+X方向の端部)まで前進し、最終的に全ての切断品Saが容器21に収容される。なお、本実施形態においても、上述の移動体44の回転と+X方向への移動とによる切断品Saの搬送動作を複数回繰り返しても良い。 As a method for transporting the cut product Sa, as shown in FIG. 13, the movable box Ba is slid in the X direction and the Z direction by the slide drive mechanism 46b, and the projecting portion 44b of the moving body 44 is moved to one end (-X direction) of the cutting table 12b. direction end) is adjusted to a position where it contacts the cut product Sa. Then, as shown in FIG. 14, the liquid supply mechanism 49 supplies the liquid into the movable box Ba, and the switching mechanism 46c switches the liquid flow path 48a to the closed state so that the liquid flows into the liquid flow path 48a due to the siphon effect. to store Next, as shown in FIGS. 13 and 14, the liquid flow path 48a is switched to the open state by the switching mechanism 46c, and the plurality of cut products Sa formed by cutting the package substrate S are rotated by the rotation driving mechanism 46a. It is brought into contact with the projecting portion 44b of the movable body 44 and separated from the cutting table 12b. Next, as shown in FIG. 15, the moving body 44 is advanced by the slide drive mechanism 46b while the projecting portion 44b is in contact with the cut product Sa, and the cut product Sa is directed toward the storage unit 45 along with the liquid flow from the liquid supply mechanism 49. push out. At this time, the projecting portion 44b of the moving body 44 rotated by the rotation drive mechanism 46a comes into contact with the next workpiece Sa to be separated from the cutting table 12b. The cut product Sa pushed out into the storage section 45 is transferred to the container 21 by the liquid flow in the liquid flow path 48a. Then, the protruding portion 44b of the moving body 44 advances to the other end (the end in the +X direction) of the cutting table 12b, and finally all the cut products Sa are accommodated in the container 21. FIG. Also in this embodiment, the operation of conveying the cut product Sa by rotating the moving body 44 and moving it in the +X direction may be repeated a plurality of times.

<3>上述した実施形態では、容器21内に中間筒Tを設けたが、中間筒Tを省略しても良い。この場合、排液機構24の排液管24aが内筒21bに接続されることとなる。また、中間筒T及び外筒28aを省略し、容器21を内筒21bのみで構成して、給液機構23や排液機構24により洗浄液の供給量を制御しても良い。 <3> In the embodiment described above, the intermediate tube T is provided inside the container 21, but the intermediate tube T may be omitted. In this case, the drain pipe 24a of the drain mechanism 24 is connected to the inner cylinder 21b. Alternatively, the intermediate cylinder T and the outer cylinder 28a may be omitted, the container 21 may be configured only by the inner cylinder 21b, and the supply amount of the cleaning liquid may be controlled by the liquid supply mechanism 23 and the liquid discharge mechanism 24. FIG.

<4>上述した実施形態では、回動反転機構27により容器21の内筒21bを回動及び反転させて複数の切断品Saを落下させたが、回動反転機構27を省略して、吸引等により容器21内の切断品Saを取り出しても良い。 <4> In the above-described embodiment, the inner cylinder 21b of the container 21 is rotated and reversed by the rotation reversing mechanism 27 to drop the plurality of cut products Sa. For example, the cut product Sa in the container 21 may be taken out.

<5>上述した実施形態における搬送モジュール4では、可撓管47aの一端47bに液体供給機構43を接続して、液流により複数の切断品Saを搬送したが、液体供給機構43を省略して、バキューム機構29による吸引のみで複数の切断品Saを搬送しても良い。 <5> In the transport module 4 in the above-described embodiment, the liquid supply mechanism 43 is connected to one end 47b of the flexible tube 47a to transport the plurality of cut products Sa by the liquid flow, but the liquid supply mechanism 43 is omitted. Alternatively, the plurality of cut products Sa may be conveyed only by suction by the vacuum mechanism 29 .

<6>上述した実施形態では、回転機構22により容器21の内筒21b及び外筒28aを回転させたが、容器21の内筒21bのみを回転させても良いし、容器21の内筒21b及び中間筒Tを回転させても良く、回転対象は特に限定されない。 <6> In the embodiment described above, the inner cylinder 21b and the outer cylinder 28a of the container 21 are rotated by the rotation mechanism 22, but only the inner cylinder 21b of the container 21 may be rotated, or the inner cylinder 21b of the container 21 may and the intermediate tube T may be rotated, and the rotation target is not particularly limited.

<7>上述した実施形態では、給液管23aの一端を上水道又は工場内の純水供給パイプに接続し、排液管24a及びドレン管28bの一端を下水道又は工場内の排水パイプに接続したが、流体給排機構2Bに洗浄液槽を設け、給液管23a、排液管24a及びドレン管28bの一端を洗浄液槽に接続して、洗浄液を循環させても良い。この場合、給液管23a、又は、排液管24a及びドレン管28bに洗浄液を濾過するための濾過機構を設けることが好ましい。 <7> In the above-described embodiment, one end of the liquid supply pipe 23a is connected to the water supply or the pure water supply pipe in the factory, and one end of the drain pipe 24a and the drain pipe 28b is connected to the sewage system or the drain pipe in the factory. Alternatively, a washing liquid tank may be provided in the fluid supply/discharge mechanism 2B, and one ends of the liquid supply pipe 23a, the drain pipe 24a and the drain pipe 28b may be connected to the washing liquid tank to circulate the washing liquid. In this case, it is preferable to provide the liquid supply pipe 23a or the liquid discharge pipe 24a and the drain pipe 28b with a filtering mechanism for filtering the washing liquid.

<8>容器21を重力方向に対して傾斜させずに、重力方向に沿う直立姿勢であっても良い。また、内筒21bの底壁は、傾斜面21b1を設けずにフラットに形成しても良い。 <8> The container 21 may be in an upright posture along the direction of gravity instead of being inclined with respect to the direction of gravity. Also, the bottom wall of the inner cylinder 21b may be formed flat without providing the inclined surface 21b1.

<9>移動体44に回転本体44aの周囲に突出した複数の突出部44bを設けたが、突出部44bを省略して回転本体44aの周囲に巻回されたゴム等の弾性材料を設けても良いし、移動体44を回転本体44aのみで構成しても良い。 <9> The moving body 44 is provided with a plurality of projecting portions 44b that project around the rotating body 44a. Alternatively, the moving body 44 may be composed only of the rotating body 44a.

[上記実施形態の概要]
以下、上述の実施形態において説明した搬送モジュール4、切断装置D及び切断品Saの製造方法の概要について説明する。
[Outline of the above embodiment]
An overview of the transfer module 4, the cutting device D, and the method for manufacturing the cut product Sa described in the above embodiment will be described below.

(1)搬送モジュール4の特徴構成は、切断テーブル12b上に配置され、パッケージ基板Sが切断されて形成された複数の切断品Saと接触しながら移動可能な移動体44と、移動体44を駆動させる駆動機構46と、複数の切断品Saを移送する移送機構47と、を備え、移送機構47は、移動体44と接触した切断品Saを移動体44により切断テーブル12bから引き離して移送する点にある。 (1) The characteristic configuration of the transfer module 4 includes a movable body 44 which is arranged on the cutting table 12b and which can move while being in contact with a plurality of cut products Sa formed by cutting the package substrate S, and the movable body 44. A drive mechanism 46 for driving and a transfer mechanism 47 for transferring a plurality of cut products Sa are provided. at the point.

本構成によると、移送機構47が切断品Saを移送するときに、切断品Saと接触しながら移動する移動体44の回転により切断品Saを切断テーブル12bから引き離している。その結果、切断品Saのサイズが小さくなった場合でも、移動体44により引き離された切断品Saを移送機構47により移送すれば、搬送モジュール4を複雑に構成することなく、複数の切断品Saを確実に搬送することができる。しかも、移動体44を回転させれば、切断品Saの切断テーブル12bからの引き離し制御が簡便である。 According to this configuration, when the transport mechanism 47 transports the workpiece Sa, the workpiece Sa is separated from the cutting table 12b by the rotation of the moving body 44 that moves while being in contact with the workpiece Sa. As a result, even if the size of the cut product Sa becomes small, if the cut product Sa separated by the moving body 44 is transferred by the transfer mechanism 47, a plurality of the cut products Sa can be produced without complicating the transfer module 4. can be reliably transported. Moreover, by rotating the moving body 44, it is easy to control the separation of the workpiece Sa from the cutting table 12b.

つまり、本構成では、従来のように、負圧による切断テーブル12bからの切断品Saの引き剥がし不良や、切断品Saの破損が発生し難い。このように、複数の切断品Saを確実に搬送できる搬送モジュール4を提供できた。 That is, in this configuration, it is difficult for the negative pressure to cause a failure in peeling off the cut product Sa from the cutting table 12b or damage to the cut product Sa, as in the conventional art. In this way, it is possible to provide the transport module 4 capable of reliably transporting a plurality of cut products Sa.

(2)移動体44は、回転軸44a1に固定された回転本体44aと、回転本体44aの周囲から径方向外側に突出した複数の突出部44bとを有していても良い。 (2) The moving body 44 may have a rotating body 44a fixed to the rotating shaft 44a1 and a plurality of protrusions 44b protruding radially outward from the periphery of the rotating body 44a.

本構成のように移動体44に複数の突出部44bを設ければ、複数の突出部44bを切断品Saと接触させて切断テーブル12bから確実に引き離すことができる。 By providing a plurality of protrusions 44b on the moving body 44 as in this configuration, the plurality of protrusions 44b can be brought into contact with the workpiece Sa to be reliably separated from the cutting table 12b.

(3)移動体44は、回転状態で切断テーブル12bに最も近接した位置における回転接線方向が移動方向と同一であっても良い。 (3) The rotating tangential direction of the moving body 44 at the position closest to the cutting table 12b in the rotating state may be the same as the moving direction.

本構成における移動体44は、回転状態で切断テーブル12bに最も近接した位置における回転接線方向が移動方向と同一である。つまり、移動体44の前方を進行方向に対して上向きに交差する回転方向Rで回転させることとなるので、移動体44を進行させながら、進行方向の前方に向かって切断品Saが引き離される。その結果、移動体44による切断品Saの引き離しと押出しとを同時に実現することができる。また、上述したように、パッケージ基板Sを固定する切断テーブル12bの固定面に、回転ブレード12c2が進入可能なように溝が形成されている。本構成では、移動体44を回転方向Rで回転させるので、移動体44が前方に進行しても、この溝に切断品Saが引っ掛かり難くなり、容易に切断品Saを引き離すことができる。 In the moving body 44 in this configuration, the rotation tangential direction at the position closest to the cutting table 12b in the rotating state is the same as the movement direction. In other words, since the front of the moving body 44 is rotated in the rotation direction R that crosses the moving direction upward, the cut product Sa is separated forward in the moving direction while the moving body 44 is moving. As a result, the moving body 44 can separate and push out the cut product Sa at the same time. Further, as described above, the fixed surface of the cutting table 12b for fixing the package substrate S is formed with grooves so that the rotary blade 12c2 can enter. In this configuration, since the moving body 44 is rotated in the rotation direction R, even if the moving body 44 advances forward, the cut product Sa is less likely to be caught in the groove, and the cut product Sa can be easily separated.

(4)移送機構47は、負圧が作用する可撓管47a(吸引路)を有し、移動体44と接触して切断テーブル12bから引き離された切断品Saを可撓管47a内で移送しても良い。 (4) The transfer mechanism 47 has a flexible tube 47a (suction path) to which a negative pressure acts, and transfers the cut product Sa that has come into contact with the moving body 44 and is separated from the cutting table 12b within the flexible tube 47a. You can

本構成のように、可撓管47a内で切断品Saを移送すれば、切断品Saの飛散を防止できる。 By transferring the cut product Sa within the flexible tube 47a as in this configuration, scattering of the cut product Sa can be prevented.

(5)移送機構47は、移動体44と接触して切断テーブル12bから引き離された切断品Saを収納する収納部45bを有し、切断品Saが収納された収納部45bを移送しても良い。 (5) The transfer mechanism 47 has a storage portion 45b that stores the cut product Sa that has come into contact with the moving body 44 and is separated from the cutting table 12b. good.

本構成のように切断品Saを収納した収納部45b自体を移送すれば、切断品Saの飛散を防止できる。 By transferring the storage portion 45b that stores the cut product Sa as in this configuration, the cut product Sa can be prevented from scattering.

(6)移送機構47は、液体が流通する液流路48aを有し、移動体44と接触して切断テーブル12bから引き離された切断品Saを液流路48a内で移送しても良い。 (6) The transfer mechanism 47 has a liquid flow path 48a through which liquid flows, and may transfer the cut product Sa, which has come into contact with the moving body 44 and is separated from the cutting table 12b, within the liquid flow path 48a.

本構成のように、液流路48a内で切断品Saを移送すれば、切断品Saの飛散を防止できると共に、液流が切断品Saどうしの緩衝機能となり、切断品Saの破損を防止できる。 If the cut product Sa is transferred within the liquid flow path 48a as in this configuration, the cut product Sa can be prevented from scattering, and the liquid flow acts as a buffer between the cut products Sa, thereby preventing damage to the cut product Sa. .

(7)切断装置Dの特徴構成は、上記(1)~(6)の何れかに記載の搬送モジュール4と、切断品Saを切断する切断機構12と、移送機構47により移送された切断品Saを洗浄する洗浄機構2Aと、を備えた点にある。 (7) The characteristic configuration of the cutting device D includes the transfer module 4 according to any one of the above (1) to (6), the cutting mechanism 12 for cutting the cut product Sa, and the cut product transferred by the transfer mechanism 47. and a cleaning mechanism 2A for cleaning Sa.

本構成では、複数の切断品Saを上述した移送機構47により洗浄機構2Aまで移送するため、複数の切断品Saを確実に搬送できる。 In this configuration, since the plurality of cut products Sa are transferred to the cleaning mechanism 2A by the transfer mechanism 47 described above, the plurality of cut products Sa can be reliably transferred.

(8)切断品Saの製造方法の特徴は、上記(7)に記載の切断装置Dを用いて切断品Saを製造する点にある。 (8) A feature of the method for manufacturing the cut product Sa is that the cut product Sa is manufactured using the cutting device D described in (7) above.

本方法では、複数の切断品Saを上述した切断装置Dにより製造するため、製造効率を高めることができる。 In this method, since a plurality of cut products Sa are manufactured by the above-described cutting device D, manufacturing efficiency can be improved.

なお、上述した実施形態(別実施形態を含む、以下同じ)で開示される構成は、矛盾が生じない限り、他の実施形態で開示される構成と組み合わせて適用することが可能である。また、本明細書において開示された実施形態は例示であって、本発明の実施形態はこれに限定されず、本発明の目的を逸脱しない範囲内で適宜改変することが可能である。 It should be noted that the configurations disclosed in the above-described embodiments (including other embodiments, the same shall apply hereinafter) can be applied in combination with configurations disclosed in other embodiments unless there is a contradiction. Moreover, the embodiments disclosed in this specification are merely examples, and the embodiments of the present invention are not limited thereto, and can be modified as appropriate without departing from the scope of the present invention.

本発明は、搬送モジュール、搬送モジュールを備えた切断装置及び切断品の製造方法に利用可能であり、特に切断品のサイズが2mm角未満と小さくなる場合に有効である。 INDUSTRIAL APPLICABILITY The present invention can be applied to a transfer module, a cutting apparatus equipped with the transfer module, and a method of manufacturing a cut product, and is particularly effective when the size of the cut product is less than 2 mm square.

1 :切断モジュール
2 :洗浄モジュール
2A :洗浄機構
3 :制御部
4 :搬送モジュール
12 :切断機構
12b :切断テーブル
21 :容器
22 :回転機構
23 :給液機構
24 :排液機構
25 :給気機構
26 :排気機構
27 :回動反転機構
28 :ドレン機構
29 :バキューム機構
43 :液体供給機構
44 :移動体
44a :回転本体
44a1 :回転軸
44b :突出部
45b :収納部
46 :駆動機構
47 :移送機構
47a :可撓管(吸引路)
48a :液流路
D :切断装置
E :樹脂成形装置
S :パッケージ基板
Sa :切断品
Reference Signs List 1: cutting module 2: cleaning module 2A: cleaning mechanism 3: control unit 4: transfer module 12: cutting mechanism 12b: cutting table 21: container 22: rotation mechanism 23: liquid supply mechanism 24: drainage mechanism 25: air supply mechanism 26 : Exhaust mechanism 27 : Rotating reversing mechanism 28 : Drain mechanism 29 : Vacuum mechanism 43 : Liquid supply mechanism 44 : Moving body 44a : Rotating body 44a1 : Rotating shaft 44b : Protruding part 45b : Storage part 46 : Driving mechanism 47 : Transfer Mechanism 47a: flexible tube (suction path)
48a: liquid flow path D: cutting device E: resin molding device S: package substrate Sa: cut product

Claims (8)

切断テーブル上に配置され、パッケージ基板が切断されて形成された複数の切断品と接触しながら移動可能な移動体と、
前記移動体を駆動させる駆動機構と、
複数の前記切断品を移送する移送機構と、を備え、
前記移送機構は、前記移動体と接触した前記切断品を前記移動体の回転により前記切断テーブルから引き離して移送する搬送モジュール。
a movable body arranged on a cutting table and movable while being in contact with a plurality of cut products formed by cutting the package substrate;
a driving mechanism for driving the moving body;
a transport mechanism for transporting the plurality of cut products,
The transfer mechanism is a transfer module that separates and transfers the cut product in contact with the moving body from the cutting table by rotation of the moving body.
前記移動体は、回転軸に固定された回転本体と、前記回転本体の周囲から径方向外側に突出した複数の突出部とを有している請求項1に記載の搬送モジュール。 2. The transport module according to claim 1, wherein the moving body has a rotating body fixed to a rotating shaft and a plurality of protrusions protruding radially outward from the periphery of the rotating body. 前記移動体は、回転状態で前記切断テーブルに最も近接した位置における回転接線方向が移動方向と同一である請求項1又は2に記載の搬送モジュール。 3. The transfer module according to claim 1, wherein the moving body has the same rotation tangential direction at a position closest to the cutting table in a rotating state as the moving direction. 前記移送機構は、負圧が作用する吸引路を有し、前記移動体と接触して前記切断テーブルから引き離された前記切断品を前記吸引路内で移送する請求項1~3の何れか一項に記載の搬送モジュール。 4. The transfer mechanism according to any one of claims 1 to 3, wherein the transfer mechanism has a suction path to which a negative pressure acts, and transfers the cut product separated from the cutting table in contact with the moving body within the suction path. 3. Transfer module as described above. 前記移送機構は、前記移動体と接触して前記切断テーブルから引き離された前記切断品を収納する収納部を有し、前記切断品が収納された前記収納部を移送する請求項1~3の何れか一項に記載の搬送モジュール。 4. The transfer mechanism according to any one of claims 1 to 3, wherein the transfer mechanism has a storage section for storing the cut product separated from the cutting table in contact with the moving body, and transports the storage section containing the cut product. A transport module according to any one of the preceding claims. 前記移送機構は、液体が流通する液流路を有し、前記移動体と接触して前記切断テーブルから引き離された前記切断品を前記液流路内で移送する請求項1~3の何れか一項に記載の搬送モジュール。 4. The transfer mechanism according to any one of claims 1 to 3, wherein the transfer mechanism has a liquid flow path through which liquid flows, and transfers the cut product separated from the cutting table in contact with the moving body within the liquid flow path. A transport module according to claim 1. 請求項1~6の何れか一項に記載の搬送モジュールと、
前記切断品を切断する切断機構と、
前記移送機構により移送された前記切断品を洗浄する洗浄機構と、を備えた切断装置。
a transfer module according to any one of claims 1 to 6;
a cutting mechanism for cutting the cut product;
and a cleaning mechanism for cleaning the cut article transferred by the transfer mechanism.
請求項7に記載の切断装置を用いて前記切断品を製造する切断品の製造方法。 A method for manufacturing a cut product using the cutting device according to claim 7 to manufacture the cut product.
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