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JP7156935B2 - Silica porous material for vacuum chuck - Google Patents
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JP7156935B2 - Silica porous material for vacuum chuck - Google Patents

Silica porous material for vacuum chuck Download PDF

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JP7156935B2
JP7156935B2 JP2018242913A JP2018242913A JP7156935B2 JP 7156935 B2 JP7156935 B2 JP 7156935B2 JP 2018242913 A JP2018242913 A JP 2018242913A JP 2018242913 A JP2018242913 A JP 2018242913A JP 7156935 B2 JP7156935 B2 JP 7156935B2
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裕 橋本
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Coorstek KK
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Description

本発明は、対象物を吸引により吸着して支持する真空着チャックに用いるシリカ多孔体に関する。 TECHNICAL FIELD The present invention relates to a porous silica material used for a vacuum attachment chuck that adsorbs and supports an object by suction.

従来より、対象物を空気の吸引により吸着面に吸着させ、裏面より光を当てることで対象物の影ができ、その影から対象物の輪郭を確認し、寸法及び不良品の検査を行ったり、加工したりする真空チャックが知られている。このような真空チャックでは、吸着面に、光透過性と流体透過性を有する部材が用いられている。例えば、本出願人は、このような光透過性と流体透過性を有する部材として、特許文献1において、シリカ粒子の焼結体からなる真空チャック用シリカ多孔体を提案している。 Conventionally, an object is attracted to the absorption surface by air suction, and a shadow of the object is created by illuminating the object from the back side. Vacuum chucks for machining, machining, etc. are known. In such a vacuum chuck, a member having optical transparency and fluid permeability is used for the adsorption surface. For example, the applicant of the present application has proposed a silica porous body for a vacuum chuck made of a sintered body of silica particles in Patent Document 1 as a member having such light and fluid permeability.

この真空チャック用シリカ多孔体は、シリカ多孔体が容易には光を透過させないことを利用したものであり、平均粒子径が5μm~300μm、かつ、粒子分布幅が平均粒子径の±50%以内にあるシリカ粒子の焼結体から形成されている。また、このシリカ多孔体は、気孔径が1μm~100μm、気孔率が5%~45%、見掛け密度が2.1g/cm以上であり、断面における気孔の平均径が、該断面におけるシリカ粒子の平均粒子径の1/12以上3/4以下に構成され、波長350nm~750nmの光の反射率が80%以上に形成されている。 This porous silica material for a vacuum chuck utilizes the fact that the porous silica material does not easily transmit light, and has an average particle diameter of 5 μm to 300 μm and a particle distribution width within ±50% of the average particle diameter. It is formed from a sintered body of silica particles in. Further, this silica porous material has a pore diameter of 1 μm to 100 μm, a porosity of 5% to 45%, and an apparent density of 2.1 g/cm 3 or more, and the average diameter of the pores in the cross section is equal to that of the silica particles in the cross section. 1/12 or more and 3/4 or less of the average particle diameter of .

特開2013-121888号公報JP 2013-121888 A

シリカ多孔体では、一般的に光透過率を高めるには、粒径を大きくする必要があるが、その一方で、粒径を大きくすると強度が低下してしまい、加工時に表面の粒子脱落が起きやすくなり、平面度が悪くなってしまうという問題があった。また逆に、必要な強度を得るために粒径を小さくすると、光透過性が低下し、十分な特性を得ることができないという問題があった。 In porous silica, it is generally necessary to increase the particle size in order to increase the light transmittance. However, there is a problem that the flatness is deteriorated. Conversely, if the particle size is made small in order to obtain the necessary strength, there is a problem that the light transmittance is lowered and sufficient properties cannot be obtained.

本発明は、このような問題に基づきなされたものであり、高い光透過性を得ることができ、かつ、吸着面の平面度を高くすることができる真空チャック用シリカ多孔体を提供することを目的とする。 SUMMARY OF THE INVENTION The present invention has been made on the basis of such problems, and aims to provide a silica porous body for a vacuum chuck that can obtain high light transmittance and increase the flatness of the adsorption surface. aim.

本発明の真空チャック用シリカ多孔体は、対象物を吸着して支持する真空チャックのチャックプレートに用いられるものであって、粒径が30μm以上100μm以下のシリカ粒子の多孔質焼結体よりなり、平均気孔径が10μm以上15μm以下である支持体部と、この支持体部に対して対象物を吸着する側に接合され、粒径が1μm以上40μm以下のシリカ粒子の多孔質焼結体よりなり、平均気孔径が3μm以上7μm以下である表面層部とを備え、支持体部のシリカ粒子の平均粒子径は、表面層部のシリカ粒子の平均粒子径よりも10μm以上大きいものである。 The porous silica material for a vacuum chuck of the present invention is used for a chuck plate of a vacuum chuck that adsorbs and supports an object, and is made of a porous sintered body of silica particles having a particle size of 30 μm or more and 100 μm or less. , a support having an average pore diameter of 10 μm or more and 15 μm or less, and a porous sintered body of silica particles having a particle size of 1 μm or more and 40 μm or less joined to the side of the support that adsorbs an object, and a surface layer portion having an average pore size of 3 μm or more and 7 μm or less, and the average particle size of the silica particles in the support portion is 10 μm or more larger than the average particle size of the silica particles in the surface layer portion.

本発明の真空チャック用シリカ多孔体によれば、粒径が30μm以上100μm以下のシリカ粒子の多孔質焼結体よりなる支持体部を備えるようにしたので、高い光透過性を維持しつつチャックプレートとしての強度を得ることができる。また、支持体部の対象物を吸着する側に、粒径が1μm以上40μm以下のシリカ粒子の多孔質焼結体よりなる表面層部を接合するようにしたので、対象物を吸着する吸着面の強度を高くすることができ、平面度を向上させることができる。よって、高い光透過性を有し、かつ、吸着面の平面度が高いチャックプレートを形成することができる。 According to the porous silica material for a vacuum chuck of the present invention, since it is provided with a support portion made of a porous sintered body of silica particles having a particle size of 30 μm or more and 100 μm or less, chucking is performed while maintaining high light transmittance. Strength as a plate can be obtained. In addition, since the surface layer portion made of a porous sintered body of silica particles having a particle size of 1 μm or more and 40 μm or less is joined to the side of the support portion that adsorbs the object, the adsorption surface that adsorbs the object can be increased in strength and the flatness can be improved. Therefore, it is possible to form a chuck plate having high light transmittance and high flatness of the chucking surface.

更に、支持体部の厚みを3mm以上5mm以下、表面層部の厚みを0.5mm以上1mm以下とすれば、又は、支持体部のシリカ粒子の粒子分布幅を20μm以下、表面層部のシリカ粒子の粒子分布幅を30μm以下とすれば、より高い効果を得ることができる。 Furthermore, if the thickness of the support is 3 mm or more and 5 mm or less, and the thickness of the surface layer is 0.5 mm or more and 1 mm or less, or the particle distribution width of the silica particles in the support is 20 μm or less, and the silica in the surface layer is A higher effect can be obtained by setting the particle distribution width of the particles to 30 μm or less.

本発明の一実施の形態に係る真空チャック用シリカ多孔体の構成を表す図である。1 is a diagram showing the configuration of a silica porous body for a vacuum chuck according to an embodiment of the present invention; FIG. シリカ多孔体の気孔径の違いによる光透過率の差を表す特性図である。FIG. 4 is a characteristic diagram showing the difference in light transmittance due to the difference in pore diameter of porous silica.

以下、本発明の実施の形態について、図面を参照して詳細に説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図1は、本実施の形態に係る真空チャック用シリカ多孔体10の構成を表すものである。この真空チャック用シリカ多孔体10は、平板状部材等の対象物を吸引により吸着して支持する真空チャックのチャックプレートに用いられるものであり、支持体部11と、この支持体部11に対して対象物を吸着する側に配設された表面層部12とを備えている。表面層部12は支持体部11に直接接触していることが好ましく、接合されていればより好ましい。表面層部12の表面、すなわち支持体部11と反対側の表面は、対象物を吸着する平らな吸着面となっている。支持体部11及び表面層部12は、例えば、円盤状等の板状であり、通気性及び透光性を有し、粒径の異なるシリカ粒子の多孔質焼結体によりそれぞれ構成されている。 FIG. 1 shows the configuration of a silica porous body 10 for vacuum chuck according to this embodiment. This porous silica material 10 for vacuum chuck is used for a chuck plate of a vacuum chuck that sucks and supports an object such as a flat member by suction. and a surface layer portion 12 disposed on the side for attracting an object. The surface layer portion 12 is preferably in direct contact with the support portion 11, and more preferably joined. The surface of the surface layer portion 12, that is, the surface opposite to the support portion 11, is a flat attracting surface that attracts an object. The support body part 11 and the surface layer part 12 are plate-shaped, for example, disc-shaped, have air permeability and translucency, and are each composed of a porous sintered body of silica particles having different particle diameters. .

支持体部11は、粒径が30μm以上100μm以下のシリカ粒子の多孔質焼結体よりなり、平均気孔径は10μm以上15μm以下である。表面層部12は、粒径が1μm以上40μm以下のシリカ粒子の多孔質焼結体よりなり、平均気孔径が3μm以上7μm以下である。支持体部11のシリカ粒子の平均粒子径は、表面層部12のシリカ粒子の平均粒子径よりも10μm以上大きくなるように構成されている。なお、粒径及び平均粒子径は、レーザ回折・散乱法によって導出される値である。平均気孔径は、水銀圧入法により導出される値である。 The support portion 11 is made of a porous sintered body of silica particles having a particle size of 30 μm to 100 μm, and an average pore diameter of 10 μm to 15 μm. The surface layer portion 12 is made of a porous sintered body of silica particles having a particle diameter of 1 μm or more and 40 μm or less, and has an average pore diameter of 3 μm or more and 7 μm or less. The average particle size of the silica particles of the support portion 11 is configured to be larger than the average particle size of the silica particles of the surface layer portion 12 by 10 μm or more. The particle size and average particle size are values derived by a laser diffraction/scattering method. The average pore diameter is a value derived by mercury porosimetry.

このように構成することで、粒径の大きい支持体部11により、高い光透過性を維持しつつチャックプレートとしての強度を得ることができ、かつ、粒径の小さい表面層部12により、対象物を吸着する吸着面の強度を高くして平面度を向上させ、チャックプレートとして要求される約5μmの平面度を得ることができるようになっている。 By configuring in this way, the support portion 11 having a large grain size can provide strength as a chuck plate while maintaining high light transmittance, and the surface layer portion 12 having a small grain size can achieve the target The flatness of the chuck plate is improved by increasing the strength of the chucking surface that chucks the object, and the flatness of about 5 μm required for the chuck plate can be obtained.

支持体部11の作製に用いられるシリカ粒子の粒径は、30μm以上100μm以下とする。30μmよりも小さいと十分に光透過率を高くすることができず、100μmよりも大きいと強度が大きく低下し、形状を維持出来ないからである。表面層部12の作製に用いられるシリカ粒子の粒径は、1μm以上40μm以下とする。1μmよりも小さいと焼結時にクラックが生じやすく、40μmよりも大きいと十分な平面度を得ることが難しいからである。 The particle diameter of the silica particles used for producing the support body portion 11 is set to 30 μm or more and 100 μm or less. This is because if the thickness is smaller than 30 μm, the light transmittance cannot be sufficiently increased, and if the thickness is larger than 100 μm, the strength is greatly reduced and the shape cannot be maintained. The particle size of the silica particles used for producing the surface layer portion 12 is set to 1 μm or more and 40 μm or less. If it is smaller than 1 μm, cracks are likely to occur during sintering, and if it is larger than 40 μm, it is difficult to obtain sufficient flatness.

また、支持体部11の作製に用いられるシリカ粒子の粒子分布幅は30μm以下とすることが好ましく、表面層部12の作製に用いられるシリカ粒子の粒子分布幅は20μm以下とすることが好ましい。分級して粒子分布幅を狭くすることにより、焼結時の割れを防ぐことができるからである。例えば、支持体部11の作製に用いられるシリカ粒子の粒径は70μm以上100μm以下とすることが好ましく、表面層部12の作製に用いられるシリカ粒子の粒径は20μm以上40μm以下とすることが好ましい。 Further, the particle distribution width of the silica particles used for producing the support body portion 11 is preferably 30 μm or less, and the particle distribution width of the silica particles used for producing the surface layer portion 12 is preferably 20 μm or less. This is because cracking during sintering can be prevented by classifying to narrow the particle distribution width. For example, the particle size of the silica particles used for producing the support body portion 11 is preferably 70 μm or more and 100 μm or less, and the particle size of the silica particles used for producing the surface layer portion 12 is preferably 20 μm or more and 40 μm or less. preferable.

支持体部11の平均気孔径を10μm以上とするのは、光透過率をより高くすることができるからであり、15μm以下とするのは、支持層として必要な強度を持たせるためである。表面層部12の平均気孔径を7μm以下とするのは、平面度を高くすることができるからである。図2にシリカ多孔体の気孔径の違いによる光透過率の差を示す。図2に示したように、平均気孔径が大きい方が光透過率が高くなることが分かる。また、平面度は平均気孔径が小さくなるほど高くなる傾向があり、平均気孔径が15μmの場合の平面度は約40μmであるのに対して、平均気孔径が7μmの場合には約5μmの平面度が得られる。 The reason why the average pore diameter of the support portion 11 is 10 μm or more is that the light transmittance can be further increased, and the reason that it is 15 μm or less is that the support layer has the necessary strength. The reason why the average pore diameter of the surface layer portion 12 is 7 μm or less is that the flatness can be increased. FIG. 2 shows the difference in light transmittance due to the difference in pore diameter of the silica porous material. As shown in FIG. 2, it can be seen that the larger the average pore diameter, the higher the light transmittance. In addition, the flatness tends to increase as the average pore diameter decreases, and the flatness is about 40 μm when the average pore diameter is 15 μm, whereas the flatness is about 5 μm when the average pore diameter is 7 μm. degree is obtained.

支持体部11の厚みは3mm以上5mm以下とすることが好ましく、表面層部12の厚みは0.5mm以上1mm以下とすることが好ましい。支持体部11の厚みが3mmよりも薄いと、チャックプレートとしての十分な強度を得ることが難しく、5mmよりも厚いと、光透過性が低下してしまうからである。表面層部12の厚みが0.5mmよりも薄いと、表面層を均一に作製できなくなり、1mmよりも厚いと光透過性が低下してしまうからである。 The thickness of the support portion 11 is preferably 3 mm or more and 5 mm or less, and the thickness of the surface layer portion 12 is preferably 0.5 mm or more and 1 mm or less. This is because if the thickness of the support portion 11 is less than 3 mm, it is difficult to obtain sufficient strength as a chuck plate, and if it is greater than 5 mm, the light transmittance is reduced. This is because if the thickness of the surface layer portion 12 is less than 0.5 mm, the surface layer cannot be uniformly formed, and if it is greater than 1 mm, the light transmittance is lowered.

この真空チャック用シリカ多孔体10は、例えば、次のようにして製造することができる。まず、例えば、支持体部11及び表面層部12を形成する球状シリカを上述した粒径及び平均粒径となるように分級し、結合剤と混合して鋳型に鋳込み、15℃~50℃程度の所定の温度で3時間~12時間程度放置することによりゲル化させる。次いで、例えば、このゲルを離型し、1300℃~1350℃程度の所定の温度で10時間~15時間程保持することにより焼成し、支持体部11及び表面層部12を形成する。 This silica porous body 10 for vacuum chuck can be manufactured, for example, as follows. First, for example, the spherical silica forming the support portion 11 and the surface layer portion 12 is classified so as to have the above-described particle size and average particle size, mixed with a binder and cast into a mold at about 15°C to 50°C. It is gelled by leaving it at a predetermined temperature for about 3 to 12 hours. Next, for example, the gel is released from the mold and baked by holding at a predetermined temperature of about 1300° C. to 1350° C. for about 10 to 15 hours to form the support portion 11 and the surface layer portion 12 .

続いて、得られた支持体部11及び表面層部12を必要により加工し、洗浄した後、接合する。例えば、オルトケイ酸テトラエチル(TEOS)と超純水と塩酸とプロピレングリコールとを混合し、アンモニアでpHを調整したゾルを支持体部11と表面層部12との間に塗布し、乾燥した後、ゲル化して焼成する。焼成温度は、例えば1200℃~1350℃とすることが好ましい。1200℃未満では接合が弱く、剥離してしまう場合があり、1350℃よりも高いとシリカガラスが失透してしまうからである。なお、接合の際には、ゲルの中にシリカ粒子を同量程度まで混合してもよい。 Subsequently, the obtained support portion 11 and surface layer portion 12 are processed, if necessary, washed, and then joined. For example, tetraethyl orthosilicate (TEOS), ultrapure water, hydrochloric acid, and propylene glycol are mixed, and a sol whose pH is adjusted with ammonia is applied between the support 11 and the surface layer 12, dried, Gel and bake. The firing temperature is preferably 1200° C. to 1350° C., for example. This is because if the temperature is lower than 1200° C., the bonding may be weak and peeling may occur, and if the temperature is higher than 1350° C., the silica glass will devitrify. In addition, silica particles may be mixed into the gel in the same amount at the time of joining.

このように本実施の形態によれば、粒径が30μm以上100μm以下のシリカ粒子の多孔質焼結体よりなる支持体部を備えるようにしたので、高い光透過性を維持しつつチャックプレートとしての強度を得ることができる。また、支持体部の対象物を吸着する側に、粒径が1μm以上40μm以下のシリカ粒子の多孔質焼結体よりなる表面層部を接合するようにしたので、対象物を吸着する吸着面の強度を高くすることができ、平面度を向上させることができる。よって、高い光透過性を有し、かつ、吸着面の平面度が高いチャックプレートを形成することができる。
なお、支持体部のシリカ粒子の平均粒子径は、表面層部のシリカ粒子の平均粒子径よりも10μm以上大きくなければならない。両者の平均粒子径差が10μm未満であったり、大小関係が逆転してしまうと、二層構造とする本発明の効果が得られなくなってしまう。
As described above, according to the present embodiment, since the support portion is made of a porous sintered body of silica particles having a particle size of 30 μm or more and 100 μm or less, it can be used as a chuck plate while maintaining high light transmittance. strength can be obtained. In addition, since the surface layer portion made of a porous sintered body of silica particles having a particle size of 1 μm or more and 40 μm or less is joined to the side of the support portion that adsorbs the object, the adsorption surface that adsorbs the object can be increased in strength and the flatness can be improved. Therefore, it is possible to form a chuck plate having high light transmittance and high flatness of the chucking surface.
The average particle size of the silica particles in the support must be 10 µm or more larger than the average particle size of the silica particles in the surface layer. If the difference in average particle size between the two is less than 10 μm, or if the size relationship is reversed, the effect of the present invention having a two-layer structure cannot be obtained.

更に、支持体部の厚みを3mm以上5mm以下、表面層部の厚みを0.5mm以上1mm以下とすれば、又は、支持体部のシリカ粒子の粒子分布幅を20μm以下、表面層部のシリカ粒子の粒子分布幅を30μm以下とすれば、より高い効果を得ることができる。 Furthermore, if the thickness of the support is 3 mm or more and 5 mm or less, and the thickness of the surface layer is 0.5 mm or more and 1 mm or less, or the particle distribution width of the silica particles in the support is 20 μm or less, and the silica in the surface layer is A higher effect can be obtained by setting the particle distribution width of the particles to 30 μm or less.

(実施例1)
まず、球状シリカを分級して粒径及び平均粒径を調整し、結合剤と混合して鋳型に鋳込み、25℃で12時間放置してゲル化した後、離型し、1350℃で12時間保持することにより焼成して円盤状の支持体部11及び表面層部12を形成した。支持体部11を形成する球状シリカの粒径は30μm以上100μm以下とし、平均粒径は約70μmとした。表面層部12を形成するシリカ粒子の粒径は20μm以上40μm以下とし、平均粒径は約30μmとした。得られた支持体部11の平均気孔径は約15μm、表面層部12の平均気孔径は約7μmであった。また、支持体部11の厚みは5mmとし、表面層部12の厚みは0.5mmとした。
(Example 1)
First, spherical silica is classified to adjust the particle size and average particle size, mixed with a binder, cast into a mold, allowed to stand at 25° C. for 12 hours to gel, then released from the mold, and heated at 1350° C. for 12 hours. By holding and sintering, a disk-shaped support body portion 11 and a surface layer portion 12 were formed. The particle size of the spherical silica forming the support portion 11 was set to 30 μm or more and 100 μm or less, and the average particle size was set to about 70 μm. The particle size of the silica particles forming the surface layer portion 12 was set to 20 μm or more and 40 μm or less, and the average particle size was set to about 30 μm. The average pore diameter of the obtained support portion 11 was about 15 μm, and the average pore diameter of the surface layer portion 12 was about 7 μm. The thickness of the support portion 11 was set to 5 mm, and the thickness of the surface layer portion 12 was set to 0.5 mm.

次いで、得られた表面層部12の表面について平面出し加工を行い、3次元測定により平面度を測定した。その結果、平面度は約5μmであった。続いて、得られた支持体部11及び表面層部12を洗浄したのち接合し、真空チャック用シリカ多孔体10を製造した。接合は、TEOSと超純水と0.1mol/lの塩酸とプロピレングリコールとをTEOS:超純水:塩酸:プロピレングリコール=11.7:9:1:3の重量比で混合し、アンモニアでpH4.5~5.0に調整したゾルを支持体部11と表面層部12との間に塗布し、乾燥した後、ゲル化し、1200℃で焼成することにより行った。 Next, the surface of the obtained surface layer portion 12 was subjected to planarization processing, and the flatness was measured by three-dimensional measurement. As a result, the flatness was about 5 μm. Subsequently, the support portion 11 and the surface layer portion 12 thus obtained were washed and joined to manufacture the silica porous body 10 for a vacuum chuck. The bonding was performed by mixing TEOS, ultrapure water, 0.1 mol/l hydrochloric acid, and propylene glycol in a weight ratio of TEOS: ultrapure water:hydrochloric acid:propylene glycol=11.7:9:1:3, followed by bonding with ammonia. A sol adjusted to pH 4.5 to 5.0 was applied between the support portion 11 and the surface layer portion 12, dried, gelled, and fired at 1200.degree.

得られた真空チャック用シリカ多孔体10について、積分球を用いて全透過率を測定したところ、400nmから750nmの光透過率は7%であった。 When the total transmittance of the obtained porous silica material 10 for vacuum chuck was measured using an integrating sphere, the transmittance of light from 400 nm to 750 nm was 7%.

(比較例1,2)
比較例1として、実施例1の支持体部11と同様にしてシリカ多孔体を作製した。厚みは5.5mmとした。比較例2として、実施例1の表面層体12と同様にしてシリカ多孔体を作製した。厚みは同じく5.5mmとした。比較例1,2についても、表面出し加工を行い、実施例1と同様にして平面度,光透過度を測定した。その結果、比較例1の平面度は約40μmであった。また、比較例2の光透過度は3%であった。すなわち、実施例1によれば、吸着面の平面度をチャックプレートとして要求される5μm以下とすることができ、かつ、光透過率を高くできることが分かった。
(Comparative Examples 1 and 2)
As Comparative Example 1, a silica porous body was produced in the same manner as the support portion 11 of Example 1. The thickness was set to 5.5 mm. As Comparative Example 2, a silica porous body was produced in the same manner as the surface layer body 12 of Example 1. The thickness was also 5.5 mm. Also for Comparative Examples 1 and 2, surface exposure processing was performed, and flatness and light transmittance were measured in the same manner as in Example 1. As a result, the flatness of Comparative Example 1 was about 40 μm. Moreover, the light transmittance of Comparative Example 2 was 3%. That is, according to Example 1, it was found that the flatness of the chucking surface could be 5 μm or less, which is required for a chuck plate, and the light transmittance could be increased.

実施例1は、支持体強度を重視し厚くしたために光透過率は図2に比べて、小さくなっているが、光源の強度との組み合わせで実用化できる範囲である。
支持体部11の厚みを3mm程度まで薄くすれば、光の透過率はさらに大きくなる。
In Example 1, since the strength of the support was emphasized and the thickness was increased, the light transmittance was smaller than that in FIG.
If the thickness of the support portion 11 is reduced to about 3 mm, the light transmittance is further increased.

以上、実施の形態及び実施例を挙げて本発明を説明したが、本発明は上記実施の形態及び実施例に限定されるものではなく、種々変形可能である。例えば、上記実施の形態では、各構成要素について具体的に説明したが変更してもよく、また、他の構成要素を備えていてもよい。 Although the present invention has been described above with reference to the embodiments and examples, the present invention is not limited to the above-described embodiments and examples, and various modifications are possible. For example, in the above embodiments, each component was specifically described, but it may be modified, and other components may be provided.

半導体ウエハ等の対象物を空気の吸引によって吸着して支持する真空チャックに用いることができる。 It can be used for a vacuum chuck that sucks and supports an object such as a semiconductor wafer by sucking air.

10…真空チャック用シリカ多孔体、11…支持体部、12…表面層部 DESCRIPTION OF SYMBOLS 10... Silica porous body for vacuum chucks, 11... Support body part, 12... Surface layer part

Claims (3)

対象物を吸着して支持する真空チャックのチャックプレートに用いられる真空チャック用シリカ多孔体であって、
粒径が30μm以上100μm以下のシリカ粒子の多孔質焼結体よりなり、平均気孔径が10μm以上15μm以下である支持体部と、
この支持体部に対して前記対象物を吸着する側に配設され、粒径が1μm以上40μm以下のシリカ粒子の多孔質焼結体よりなり、平均気孔径が3μm以上7μm以下である表面層部とを備え、
前記支持体部のシリカ粒子の平均粒子径は、前記表面層部のシリカ粒子の平均粒子径よりも10μm以上大きい
ことを特徴とする真空チャック用シリカ多孔体。
A silica porous material for a vacuum chuck, which is used for a chuck plate of a vacuum chuck that adsorbs and supports an object,
a support portion made of a porous sintered body of silica particles having a particle diameter of 30 μm or more and 100 μm or less and having an average pore diameter of 10 μm or more and 15 μm or less;
A surface layer disposed on the side of the support that adsorbs the object, made of a porous sintered body of silica particles having a particle diameter of 1 μm or more and 40 μm or less, and having an average pore diameter of 3 μm or more and 7 μm or less. and
A silica porous body for a vacuum chuck, wherein an average particle size of silica particles in the support portion is larger than an average particle size of silica particles in the surface layer portion by 10 μm or more.
前記支持体部の厚みは3mm以上5mm以下であり、前記表面層部の厚みは0.5mm以上1mm以下であることを特徴とする請求項1記載の真空チャック用シリカ多孔体。 2. The porous silica material for a vacuum chuck according to claim 1, wherein the thickness of said support portion is 3 mm or more and 5 mm or less, and the thickness of said surface layer portion is 0.5 mm or more and 1 mm or less. 前記支持体部のシリカ粒子の粒子分布幅は30μm以下であり、前記表面層部のシリカ粒子の粒子分布幅は20μm以下であることを特徴とする請求項1又は請求項2記載の真空チャック用シリカ多孔体。 3. The vacuum chuck according to claim 1, wherein the silica particles in the support portion have a particle distribution width of 30 μm or less, and the silica particles in the surface layer portion have a particle distribution width of 20 μm or less. Silica porous body.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006205187A (en) 2005-01-26 2006-08-10 Disco Abrasive Syst Ltd Laser processing equipment
JP2008060232A (en) 2006-08-30 2008-03-13 Bridgestone Corp Vacuum chuck
JP2013121888A (en) 2011-12-12 2013-06-20 Covalent Materials Corp Silica porous body for vacuum chuck
JP2017183535A (en) 2016-03-30 2017-10-05 日本碍子株式会社 Adsorption member and method of application therefor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05345685A (en) * 1992-06-15 1993-12-27 Toshiba Ceramics Co Ltd Production of siliceous porous material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006205187A (en) 2005-01-26 2006-08-10 Disco Abrasive Syst Ltd Laser processing equipment
JP2008060232A (en) 2006-08-30 2008-03-13 Bridgestone Corp Vacuum chuck
JP2013121888A (en) 2011-12-12 2013-06-20 Covalent Materials Corp Silica porous body for vacuum chuck
JP2017183535A (en) 2016-03-30 2017-10-05 日本碍子株式会社 Adsorption member and method of application therefor

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