JP7165573B2 - Dust collector and dust collection method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a dust collector and a dust collection method for capturing PCB vapor, fumes, and spatter generated when PCB deposits are fused.

PCB deposits with attached PCB (polychlorinated biphenyl) can be detoxified at a detoxification facility if the concentration of the attached PCB is 5000 ppm or less. The size must satisfy the acceptance conditions. Therefore, it is necessary to cut PCB deposits into a size that can be stored in a leak-proof metal container (approximately 2 m square) for collection and transportation.

In the work of cutting PCB deposits, it is necessary to prevent the diffusion of PCB vapor, fume (dust) and spatter generated at the time of cutting. Therefore, for example, in Patent Document 1, a plurality of pedestals are arranged on the floor surface at intervals and on which works to be fused are mounted, and fused slag is installed between the pedestals and scattered downward by the combustion flame of gas fusion cutting. A plurality of water tanks that receive and cool, a suction duct with a suction port provided on the upper side of each water tank, fused cut by gas fusion Suction equipment that sucks smoke into the suction duct from the suction port, and fused cutting sucked into the suction duct A smoke collector is disclosed that includes a dust collector that captures airborne particles from smoke.

JP 2011-224616 A

However, in the case of the smoke collecting device described in Patent Document 1, since the opening area of the suction port is constant, the suction wind speed (force) is always constant, and the suction wind speed (force) is maximized according to the fusion size of the work. It is not possible to increase the trapping power by Therefore, there is a possibility that the melted slag may diffuse into the atmosphere.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a dust collecting apparatus and a dust collecting method capable of realizing a maximum collecting force corresponding to the size of PCB deposits fused.

In order to achieve the above object, a first invention is a dust collector for capturing PCB vapor, fume and spatter generated when PCB deposits are fused, comprising:
A dust collection container for taking in the PCB vapor, fume, and spatter through an opening provided on the top surface, and a suction facility for sucking the PCB vapor, fume, and spatter into the dust collection container,
A louver that opens and closes the opening is installed in the opening, and each of the plurality of louver plates that constitute the louver is independently rotatable ,
It is characterized in that receiving stands on which the PCB deposits are placed are arranged on both sides of the dust container .

In the present invention, since the plurality of louver plates constituting the louver installed at the opening of the dust collection container can be rotated independently, the louver plate is opened only directly under and near the PCB deposits. By minimizing the opening area of the opening as , the suction wind speed (force) at the opening can be maximized to enhance the collection power.

In addition, in the dust collector according to the first aspect of the invention, the wire mesh for catching the spatter taken into the dust collection container is arranged in the dust collection container, and the spatter is scattered downward without being caught by the wire mesh. It is preferable that cooling water for cooling the spatter is stretched on the bottom of the dust collection container.

According to this configuration, the spatter can be reliably caught by the wire mesh arranged in the dust collection container and the cooling water stretched on the bottom of the dust collection container, so that the filter installed in the suction equipment may be burnt out by the spatter. It never clogs.

Further, in the dust collector according to the first aspect of the invention, the load receiving stands on which the PCB deposits are placed are arranged on both sides of the dust collection container .

The PCB adhering matter is placed on the receiving stands arranged on both sides of the dust collecting container, and the PCB adhering matter is melted and cut on the opening of the dust collecting container. PCB vapor, fumes, and spatter generated during fusing are taken into the dust collection container through the opening.

Moreover, it is preferable that the dust collector according to the first aspect of the invention includes an openable/closable hood capable of covering the dust container and the load receiving tray.

By covering the dust collection container and the load receiving table with the opening/closing hood, it is possible to prevent the disturbance from hindering the airflow that draws in the PCB vapor, fumes, and spatter.

A second invention is a method for capturing PCB vapor, fume, and spatter generated when PCB deposits are fused and cut, using the dust collector according to the first invention, comprising the following steps: is characterized by
(1) After placing the PCB adhering matter on the receiving table, the dust collection container and the receiving tray are covered with the opening/closing hood. (2) The louver plate is opened only under and near the PCB adhering matter. step (3) operating the suction equipment to suck the PCB vapor, fume, and spatter into the dust collection container, and blowing off the PCB deposits with a fusing device;

In the present invention, since the plurality of louver plates constituting the louver installed at the opening of the dust collection container can be rotated independently, the opening area of the opening can be adjusted according to the melted size of the PCB deposits. By adjusting to the minimum required, the suction air velocity at the opening can be maximized. In other words, it is possible to achieve the maximum collection force according to the melted size of the PCB deposits. As a result, PCB vapors, fumes, and spatter are not likely to spread into the atmosphere.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view of the dust collector which concerns on one embodiment of this invention. It is a sectional side view of the same dust collector. FIG. 4 is a schematic diagram showing an opening/closing mechanism of the louver plate; It is a top view of the same dust collector at the time of PCB adhesion|attachment fusion cutting. It is a sectional side view of the same dust collector at the time of PCB adhesion|attachment melt|disconnection.

Next, an embodiment embodying the present invention will be described with reference to the attached drawings for understanding of the present invention.

A dust collector 10 according to an embodiment of the present invention is shown in FIGS. 1 and 2. FIG.
The dust collector 10 according to the present embodiment includes a dust collection container 11 that takes in the PCB vapor, fume, and spatter generated when PCB deposits are melted and cut, and sucks these generated substances into the dust collection container 11. a suction device 17 for cleaning, a receiving table 24 on which PCB deposits are placed, and an opening/closing hood 25 covering the dust collecting container 11 and the receiving table 24 .

The dust collection container 11 has a substantially rectangular parallelepiped shape, and a strip-shaped opening 12 extending from one end to the other end in the long side direction of the dust collection container 11 is formed in the center of the upper surface of the dust collection container 11 in the short side direction. . PCB vapors, fumes, and spatter are drawn into the dust container 11 through the opening 12 .

A louver 13 for opening and closing the opening 12 is installed at the opening 12 of the dust collection container 11 . The louver 13 has a configuration in which a plurality of louver plates 14 made of rectangular plate materials are continuously arranged in the long side direction of the dust collection container 11 . Each louver plate 14 can be rotated independently to partially open and close the opening 12 . That is, when the louver plate 14 is horizontal, the opening 12 is partially closed by the louver plate 14, and when the louver plate 14 is vertical, the opening 12 is partially open by the louver plate 14. . Therefore, by opening some louver plates 14 and closing other louver plates 14, the opening area of the opening 12 can be changed.

FIG. 3 is a schematic diagram showing the opening/closing mechanism of the louver plate 14. As shown in FIG.
Each louver plate 14 rotates in a vertical plane with a rotating shaft 26 arranged in the short side direction of the dust container 11 as a fulcrum. One end of an operation rod 15 arranged in the short side direction of the dust container 11 is connected to the rotating tip of each louver plate 14 . The other end of the operating rod 15 protrudes outward from an arc-shaped groove 28 formed in one long side wall 29 of the dust collection container 11. A gripping handle 16 is attached.

The operating rod 15 can be moved in the vertical plane along the arcuate groove 28 . When the operating rod 15 is positioned at the upper end of the groove 28, the louver plate 14 is horizontal and the opening 12 is partially closed. Also, when the operating rod 15 is positioned at the lower end of the groove 28, the louver plate 14 is vertical and the opening 12 is partially opened. A latch 27 for holding the operating rod 15 positioned at the upper end of the groove 28 is attached near the upper end of the groove 28 .
In order to prevent the PCB vapor, fume, and spatter taken into the dust collection container 11 from leaking into the atmosphere from the groove 28, a silicone seal having a notch through which the operation rod 15 penetrates is formed in the center in the width direction. A member 30 is mounted inside the groove 28 .

Inside the dust collecting container 11, wire meshes 22 for catching spatter taken into the dust collecting container 11 are arranged in the short side direction of the dust collecting container 11 at intervals in the long side direction of the dust collecting container 11. there is Cooling water 23 is applied to the bottom of the dust collecting container 11 to cool down spatter that is not captured by the wire mesh 22 and scatters downward.

The suction equipment 17 includes a blower 21 for sucking PCB vapor, fumes, and spatter, a connection hose 18 connecting the dust collection container 11 and the blower 21, and installed in the middle of the connection hose 18 to remove PCB particles and PCB particles in the PCB vapor. It comprises a filter 20 for trapping fumes and an exhaust hose 19 connected to a blower 21 for releasing into the atmosphere exhaust air from which PCB particles and fumes have been removed by the filter 20 .

The receiving trays 24 are installed on both sides in the short side direction of the dust container 11 with the dust container 11 interposed therebetween. The length of each receiving tray 24 is the same as the length of the dust container 11 in the longitudinal direction. The height of the receiving table 24 is set so that the plasma arc does not reach the louvers 13 when the PCB deposits are fused.

The opening/closing hood 25 is of a bellows type that can extend and contract in the longitudinal direction of the dust container 11 . By fixing one end of the opening/closing hood 25 and extending the other end, the dust collecting container 11 and the receiving table 24 are covered.

Next, a method of capturing PCB vapor, fume, and spatter generated when the PCB deposit 31 is melted and cut by the dust collector 10 will be described with reference to FIGS. 4 and 5. FIG. Note that the oblique line (x mark) described in the opening 12 in FIG. 4 indicates that the corresponding portion is open.
[STEP-1]
The opening/closing hood 25 is contracted to expose the dust collection container 11 and the receiving table 24, and a crane (not shown) is used to place the PCB deposit 31 on the receiving table 24 (see FIG. 4). At that time, the fusion cutting position is positioned directly above the opening 12 of the dust container 11 . Then, the opening/closing hood 25 is extended to cover the dust collecting container 11 and the receiving table 24 with the opening/closing hood 25 .

[STEP-2]
By manipulating the operating rod 15 to open the louver plate 14 only directly under and in the vicinity of the PCB deposits 31, the suction wind speed (force) at the opening 12 is maximized to enhance the collection power (Fig. 4). Specifically, the set positions of all the louver plates 14 may be left open, and the operating rod 15 may be operated so that the louver plates 14 other than those directly below and near the PCB deposits 31 are closed. Alternatively, the set positions of all the louver plates 14 may be closed, and the operating rod 15 may be operated so that only the louver plates 14 directly under and near the PCB deposits 31 are opened.

[STEP-3]
While the blower 21 is operated to suck PCB vapor, fume and spatter into the dust collection container 11 through the opening 12, the PCB adhesion is melted by the melter (see FIG. 5).
The fusing device that fuses the fused portion uses a plasma cutting machine composed of a torch 32 and a plasma generator (not shown), but is not limited to this, and other devices such as a laser cutting machine and a gas cutting machine are used. A fusing device may be used.

Although one embodiment of the present invention has been described above, the present invention is not limited to the configuration described in the above-described embodiment. Other possible embodiments and modifications are also included. For example, in the above embodiment, the louver plate is opened and closed by moving the operating rod attached to the tip of the louver plate and extending laterally in an arc. Other mechanisms such as rotating a rotating shaft that supports the proximal end of the plate may be used.

10: dust collector, 11: dust collection container, 12: opening, 13: louver, 14: louver plate, 15: operation rod, 16: handle, 17: suction equipment, 18: connection hose, 19: exhaust hose, 20: Filter, 21: Blower, 22: Wire mesh, 23: Cooling water, 24: Load receiving base, 25: Open/close hood, 26: Rotating shaft, 27: Latch, 28: Groove, 29: Long side wall, 30: Seal member, 31: PCB deposit, 32: torch

Claims (4)

A dust collector that captures PCB vapor, fume, and spatter generated when PCB deposits are fused,
A dust collection container for taking in the PCB vapor, fume, and spatter through an opening provided on the top surface, and a suction facility for sucking the PCB vapor, fume, and spatter into the dust collection container,
A louver that opens and closes the opening is installed in the opening, and each of the plurality of louver plates that constitute the louver is independently rotatable ,
A dust collecting apparatus , wherein receiving trays on which said PCB deposits are placed are arranged on both sides of said dust collecting container . 2. The dust collector according to claim 1, wherein a wire mesh for catching spatters taken into said dust collecting container is disposed in said dust collecting container, and said spatters scattered downward without being caught by said wire mesh are cooled. A dust collecting device characterized in that cooling water for cooling is spread over the bottom of the dust collecting container. 3. A dust collector according to claim 1 , further comprising an opening/closing hood capable of covering said dust container and said receiving tray. A method for capturing PCB vapor, fume, and spatter generated when PCB deposits are melted and cut using the dust collector according to claim 3 ,
a step of covering the dust collection container and the load-receiving table with the opening/closing hood after placing the PCB deposit on the load-receiving table;
a step of opening the louver plate only under and in the vicinity of the PCB deposit;
a step of operating the suction equipment to suck the PCB vapor, fume, and spatter into the dust collection container, while blowing off the PCB deposits with a blower.

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