JP7166464B2 - Chip component, chip component manufacturing method, and electronic device manufacturing method - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to a chip component, a method of manufacturing a chip component, and a method of manufacturing an electronic device.

Electronic devices are required to be smaller and have higher functionality. Along with this, there is a demand for miniaturization of electronic components that are soldered and mounted on printed wiring boards in electronic equipment. Miniaturized electronic components are relatively densely mounted.

In Japanese Utility Model Laid-Open No. 62-058030, as a method of mounting miniaturized electronic components on a printed wiring board, each electrode portion of the electronic component is preliminarily soldered to form a soldered portion, and a printed wiring board is provided. Disclosed is a method of disposing each soldering portion on each electrode portion of the and melting each soldering portion in a far-infrared furnace.

Japanese Utility Model Laid-Open No. 62-058030

However, when a miniaturized electronic component is mounted on a printed wiring board by the conventional mounting method described above, it is difficult to suppress the occurrence of defective solder joints between the electronic component and the printed wiring board.

Specifically, in the conventional mounting method described above, each soldered portion is formed by soldering to each electrode portion, so that the shape of each soldered portion formed on one electronic component can be made uniform. Have difficulty. Therefore, when each soldered portion is arranged on each electrode portion of the printed wiring board, the contact state between each soldered portion and each electrode portion of the printed wiring board becomes uneven, and the timing of each soldered portion melting. is also uneven. In this case, at the solder joints between the electronic component and the printed wiring board, misalignment of the electronic component with respect to the printed wiring board and joint failure such as so-called chip stand-up are likely to occur.

A main object of the present disclosure is to provide a chip component and a method of manufacturing the same that can suppress the occurrence of defective joints between an electronic component and a printed wiring board compared to chip components used in conventional mounting methods. be.

Another object of the present disclosure is to provide a method of manufacturing an electric device that can suppress the occurrence of defective solder joints between an electronic component and a printed wiring board as compared with conventional mounting methods.

A chip component according to the present disclosure includes an electronic component including a first electrode, a second electrode spaced apart from the first electrode in the first direction, and a first joint joined to the first electrode. , and a second joint joined to the second electrode. The material forming the first joint and the second joint includes solder. The first joint has a first protruding portion that protrudes with respect to the first electrode in a second direction that intersects with the first direction. The second joint has a second protruding portion that protrudes with respect to the second electrode in the second direction.

Advantageous Effects of Invention According to the present disclosure, it is possible to provide a chip component and a method of manufacturing the same that can suppress the occurrence of defective joints between an electronic component and a printed wiring board compared to chip components used in conventional mounting methods. Also, it is possible to provide a method of manufacturing an electric device that can suppress the occurrence of defective joints between an electronic component and a printed wiring board, as compared with the conventional mounting method.

1 is a perspective view showing a chip component according to Embodiment 1; FIG. FIG. 2 is a cross-sectional view of the chip component shown in FIG. 1; FIG. 2 is a cross-sectional view showing one step of a method of manufacturing the chip component shown in FIG. 1; 4 is a cross-sectional view showing a step after the step shown in FIG. 3 in the method of manufacturing the chip component shown in FIG. 1; FIG. 5 is a cross-sectional view showing a step after the step shown in FIG. 4 in the method of manufacturing the chip component shown in FIG. 1; FIG. 6 is a cross-sectional view showing a step after the step shown in FIG. 5 in the method of manufacturing the chip component shown in FIG. 1; FIG. 7 is a cross-sectional view showing a step after the step shown in FIG. 6 in the method of manufacturing the chip component shown in FIG. 1; FIG. 1 is a cross-sectional view showing an electronic device according to Embodiment 1; FIG. FIG. 9 is a cross-sectional view showing one step of a method of manufacturing the electronic device shown in FIG. 8; 9. It is sectional drawing which shows one process after the process shown by FIG. 9 of the manufacturing method of the electronic device shown by FIG. 11 is a cross-sectional view showing a step after the step shown in FIG. 10 in the method of manufacturing the electronic device shown in FIG. 8; FIG. FIG. 8 is a cross-sectional view showing a chip component according to Embodiment 2; FIG. 13 is a cross-sectional view showing one step of a method of manufacturing the chip component shown in FIG. 12; 14 is a cross-sectional view showing a step after the step shown in FIG. 13 in the method of manufacturing the chip component shown in FIG. 12; FIG. 15 is a cross-sectional view showing a step after the step shown in FIG. 14 in the method of manufacturing the chip component shown in FIG. 12; FIG. 13 is a cross-sectional view showing a modification of the manufacturing method of the chip component shown in FIG. 12; FIG. FIG. 11 is a cross-sectional view showing a chip component according to Embodiment 3; FIG. 18 is a cross-sectional view showing one step of a method of manufacturing the chip component shown in FIG. 17; FIG. 20 is a cross-sectional view showing a step after the step shown in FIG. 19 in the method of manufacturing the chip component shown in FIG. 17; 21 is a cross-sectional view showing a step after the step shown in FIG. 20 in the method of manufacturing the chip component shown in FIG. 18; FIG. FIG. 11 is a cross-sectional view showing a chip component according to Embodiment 4; FIG. 4 is a cross-sectional view showing a modification of the chip component according to Embodiment 1; FIG. 8 is a cross-sectional view showing another modification of the chip component according to the first embodiment; FIG. 11 is a cross-sectional view showing a chip component according to Embodiment 5; 25 is a top view of the chip part shown in FIG. 24; FIG. FIG. 25 is a cross-sectional view showing one step of a method for manufacturing the electronic device shown in FIG. 24; FIG. 27 is a cross-sectional view showing a step after the step shown in FIG. 26 in the method of manufacturing the chip component shown in FIG. 24; FIG. 28 is a cross-sectional view showing a step after the step shown in FIG. 27 in the method of manufacturing the chip component shown in FIG. 24; FIG. 12 is a cross-sectional view showing an electronic device according to Embodiment 5; FIG. 11 is a cross-sectional view showing a comparative example of an electronic device according to Embodiment 5; FIG. 12 is a cross-sectional view showing another comparative example of the electronic device according to the fifth embodiment;

Embodiments of the present disclosure will be described below with reference to the drawings. In the drawings below, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated.

Embodiment 1.
<Configuration of chip parts>
As shown in FIGS. 1 and 2, the chip component 1 according to the first embodiment includes an electronic component 10, and a first joint portion 21 and a second joint portion 22, which are integrally configured. is.

Electronic component 10 includes first electrode 11 , second electrode 12 , and non-electrode portion 13 . The first electrode 11 and the second electrode 12 are spaced apart from each other in the first direction A. As shown in FIG. The first electrode 11 and the second electrode 12 form both ends of the electronic component 10 in the first direction A, for example. A material forming the first electrode 11 and the second electrode 12 is a conductive material, and includes copper (Cu), for example. The material forming the non-electrode portion 13 is, for example, a material having lower conductivity than the material forming the first electrode 11 and the second electrode 12 .

The first electrode 11 faces the second direction B, faces the first surface 11A extending along the first direction A and the third direction C, and faces the first direction A, faces the second direction B and and a second surface 11B extending along the third direction C. A second direction B is a direction crossing the first direction A, and a third direction C is a direction crossing the first direction A and the second direction B. As shown in FIG. The first direction A, the second direction B, and the third direction C are orthogonal to each other, for example. The second direction B is, for example, the vertical direction.

The second electrode 12 faces the second direction B and faces the third surface 12A extending along the first direction A and the third direction C. The second electrode 12 faces the first direction A and faces the second direction B and and a fourth surface 12B extending along the third direction C. 12 A of 3rd surfaces are arrange|positioned on the same plane as 11 A of 1st surfaces, for example. The fourth surface 12B faces in the first direction A opposite to the second surface 11B.

The electronic component 10 may have any configuration as long as it is a surface-mounted electronic component having the above configuration. For example, the electronic component 10 is a ceramic capacitor. In this case, the material constituting the non-electrode portion 13 is a ceramic dielectric, such as barium titanate (BaTiO ₃ ), calcium titanate (CaTiO ₃ ), strontium titanate (SrTiO ₃ ), and calcium zirconate (CaZrO 3 ). ₃ ) includes at least one of Note that the electronic component 10 may be configured as a resistor.

The first joint portion 21 is joined to the first electrode 11 . The first joint portion 21 is joined to at least a portion of the first surface 11A and the second surface 11B. The first joint portion 21 is joined to, for example, the entire first surface 11A and part of the second surface 11B. The material forming the first joint portion 21 includes solder.

The first joint portion 21 has a first protruding portion 21A that protrudes in the second direction B with respect to the first surface 11A of the first electrode 11 . The first protruding portion 21A is arranged in a first portion 21C arranged in a region overlapping the first electrode 11 in the second direction B and in a region not overlapping the first electrode 11 in the second direction B, and and a second portion 21D protruding in the first direction A with respect to the second surface 11B of the first electrode 11 . The first portion 21C and the second portion 21D are connected to each other and integrally configured.

The first joint portion 21 includes, for example, a portion that does not protrude with respect to the first electrode 11 in the second direction B, in other words, a third portion 21B that is arranged so as to overlap the first electrode 11 in the first direction A. have more. The third portion 21B protrudes in the first direction A with respect to the second surface 11B of the first electrode 11 . The first protruding portion 21A and the third portion 21B are connected to each other and integrally configured. The third portion 21B is joined to a region positioned closer to the first surface 11A than the center of the second surface 11B in the second direction B, for example.

A top portion 21T of the first joint portion 21, which is the longest from the first surface 11A in the second direction B, is included in the first projecting portion 21A. For example, the top portion 21T is included in the first portion 21C of the first projecting portion 21A.

When viewed from the third direction C, the outermost peripheral surface of the first projecting portion 21A is a curved surface. When the first protruding portion 21A is arranged on a plane extending along the first direction A and the third direction C, the top portion 21T of the first protruding portion 21A is formed in line contact with the plane. The first projecting portion 21A is in line contact with the plane. The first protruding portion 21A is configured as part of a cylindrical body extending along the third direction C. As shown in FIG.

The second joint portion 22 is joined to the second electrode 12 . The second joint portion 22 is joined to at least part of the third surface 12A and the fourth surface 12B. The second joint portion 22 is joined to, for example, the entire third surface 12A and part of the fourth surface 12B. The material forming the second joint portion 22 includes solder.

The second joint portion 22 has a second protruding portion 22A that protrudes in the second direction B with respect to the third surface 12A of the second electrode 12 . The second protruding portion 22A is arranged in a fourth portion 22C arranged in a region overlapping the second electrode 12 in the second direction B and in a region not overlapping the second electrode 12 in the second direction B, and and a fifth portion 22D protruding in the first direction A with respect to the fourth surface 12B of the second electrode 12 . The fourth portion 22C and the fifth portion 22D are connected to each other and integrally configured.

The second joint portion 22 includes, for example, a portion that does not protrude with respect to the second electrode 12 in the second direction B, in other words, a sixth portion 22B that is arranged so as to overlap the second electrode 12 in the first direction A. have more. The sixth portion 22B protrudes in the first direction A with respect to the fourth surface 12B of the second electrode 12 . The second protruding portion 22A and the sixth portion 22B are connected to each other and integrally constructed. The sixth portion 22B is joined to a region located closer to the third surface 12A than the center of the fourth surface 12B in the second direction B, for example.

A top portion 22T of the second joint portion 22 that is the longest from the third surface 12A in the second direction B is included in the second projecting portion 22A. For example, the top portion 22T is included in the fourth portion 22C of the second projecting portion 22A.

When viewed from the third direction C, the outermost peripheral surface of the second projecting portion 22A is a curved surface. When the second protruding portion 22A is arranged on a plane extending along the first direction A and the third direction C, the top portion 22T of the second protruding portion 22A is formed in line contact with the plane. 22 A of 2nd protrusion parts are comprised as some cylinders extended along the 3rd direction C. As shown in FIG.

As shown in FIG. 2, when viewed from the third direction C, the height h1 in the second direction B of the first projecting portion 21A with respect to the first surface 11A of the first electrode 11 is equal to the third surface of the second electrode 12. It is equal to the height h2 in the second direction B of the second projecting portion 22A with respect to 12A.

As shown in FIG. 2, the distance L1 in the first direction A between the top portion 21T of the first projecting portion 21A and the top portion 22T of the second projecting portion 22A is the distance between the first electrode 11 and the second electrode 12. In other words, the width of the non-electrode portion 13 in the first direction A is equal to or greater than the shortest distance L2 in the first direction A. The distance L1 is the longest distance L3 in the first direction A between the first electrode 11 and the second electrode 12, in other words, the distance between the second surface 11B of the first electrode 11 and the fourth surface 12B of the second electrode 12. The shortest distance in the first direction A between: From a different point of view, the top portion 21T overlaps the first surface 11A of the first electrode 11 in the second direction B, and the top portion 22T overlaps the third surface 12A of the second electrode 12 in the second direction B.

As shown in FIG. 2, when viewed from the third direction C, the first joint 21 and the second joint 22 pass through the center between the first electrode 11 and the second electrode 12 in the first direction A. It is formed symmetrically with respect to the center line CL extending along the second direction B. When viewed from the third direction C, outlines of the first joint portion 21 and the second joint portion 22 are formed, for example, in a substantially arc shape.

The cross-sectional shape of the chip component 1 perpendicular to the third direction C is constant regardless of the position of the cross section in the third direction C, for example.

The material forming the first joint portion 21 and the second joint portion 22 is, for example, lead-free solder. Materials forming the first joint portion 21 and the second joint portion 22 include, for example, tin (Sn), silver (Ag), and copper (Cu), and the alloy composition thereof is, for example, Sn-3.0% Ag- 0.5% Cu. Any solder material may be used as a material for forming the first joint portion 21 and the second joint portion 22. For example, Ag, Cu, bismuth (Bi), indium (In), antimony (Sb), and lead A solder material in which at least one of (Pb) is added to Sn may be used. The first joint portion 21 and the second joint portion 22 are formed by, for example, melting a mixture of the solder material and the flux and then cooling the mixture (details will be described later).

The size of the electronic component 10 is not particularly limited. (the length in the first direction A is 0.2 mm and the length in the third direction C is 0.1 mm), 1005 (the length in the first direction A is 1.0 mm and the length in the third direction C is 0.1 mm). 5 mm), or 1608 (the length in the first direction A is 1.6 mm and the length in the third direction C is 0.8 mm).

<Manufacturing method of chip parts>
The chip component 1 shown in FIGS. 1 and 2 is manufactured by the chip component manufacturing method shown in FIGS. 3 to 7, the first joint portion 21 and the second joint portion 22 are formed by screen printing using a mold 101 and a mask 102. As shown in FIGS. In this manufacturing method, the second direction B of the electronic component 10 is the vertical direction, and the first direction A and the third direction C of the electronic component 10 are directions that intersect the vertical direction.

First, a mold 101 and a mask 102 shown in FIG. 3 are prepared (first step). The mold 101 has an upper surface 101A. The upper surface 101A is a plane extending along a direction intersecting the vertical direction. In the following, the structure of the mold 101 will also be described. , and the third direction C will be described.

The mold 101 is formed with a first concave portion 201 and a second concave portion 202 that are concave with respect to the upper surface 101A. The first concave portion 201 and the second concave portion 202 of the mold 101 are for forming a bonding material, which will be described later, on the first bonding portion 21 and the second bonding portion 22 of the chip component 1 . The first recess 201 and the second recess 202 are spaced apart from each other in the first direction A. As shown in FIG. The depth of the first concave portion 201 is equal to the height h1 of the first joint portion 21 of the chip component 1 . The depth of the second concave portion 202 is equal to the height h2 of the second joint portion 22 of the chip component 1 . The lengths of the first recess 201 and the second recess 202 in the third direction C are equal to the lengths of the first electrode 11 and the second electrode 12 in the third direction C, for example. The depth of the first recess 201 is equal to the depth of the second recess 202 . The first recess 201 and the second recess 202 are formed symmetrically with respect to a center line CL2 extending along the second direction B passing through the center between the first recess 201 and the second recess 202 in the first direction A. ing. The length in the first direction A between the center of the first recess 201 and the center of the second recess 202 in the first direction A is equal to the distance L1 in the chip component 1 .

The mask 102 has a lower surface 102A in contact with the upper surface 101A of the mold 101 and an upper surface 102B located on the opposite side of the lower surface 102A. The lower surface 102A and the upper surface 102B are planes extending along the first direction A and the third direction C, respectively. The mask 102 is formed with a first through hole 203 and a second through hole 204 extending from the lower surface 102A to the upper surface 102B. The first through hole 203 is formed so as to be continuous with the first concave portion 201 in the second direction B. As shown in FIG. The second through hole 204 is formed so as to be continuous with the second concave portion 202 in the second direction B. As shown in FIG. In the first direction A, the width of the first through hole 203 is equal to the width of the first recess 201, for example. In the first direction A, the width of the second through hole 204 is equal to the width of the second recess 202, for example. The width of the first through hole 203 and the second through hole 204 in the third direction C is equal to the length of the first electrode 11 and the second electrode 12 in the third direction C, for example. The first through hole 203 and the second through hole 204 are formed symmetrically with respect to the centerline CL2.

A material forming the mask 102 includes, for example, stainless steel (SUS). In other words, the mask 102 is, for example, a metal mask. The thickness of the mask 102, in other words, the length in the second direction B of each of the first through holes 203 and the second through holes 204 is 100 μm, for example.

Next, as shown in FIG. 4, a bonding material 23 (first bonding material) to be the first bonding portion 21 is supplied to the inside of the first recess 201 and the first through hole 203 by screen printing. Further, a bonding material 24 (second bonding material) to be the second bonding portion 22 is supplied to the inside of the second recess 202 and the second through hole 204 by screen printing (second step). The bonding material 23 fills the interiors of the first recesses 201 and the first through holes 203 without gaps. The bonding material 24 fills the insides of the second recesses 202 and the second through holes 204 without gaps. Each upper surface of the bonding materials 23 and 24 is flush with the upper surface 102B of the mask 102, for example.

The bonding material 23 is, for example, a mixture of solder balls 25 and flux 26 . The bonding material 24 is, for example, a mixture of solder balls 27 and flux 28 . The material forming the solder balls 25 and 27 is, for example, lead-free solder. The material forming the solder balls 25, 27 includes, for example, Sn, Ag, and Cu, and their alloy composition is, for example, Sn-3.0% Ag-0.5% Cu. The outer diameter of each solder ball 25, 27 is, for example, 30 μm. The sum of the volumes of the solder balls 25 is greater than the volume of the first recesses 201 . The sum of the volumes of the solder balls 27 is greater than the volume of the second recesses 202 . The material forming the fluxes 26, 28 contains rosin. Fluxes 36 and 28 fill the gaps between solder balls 25 and 27 .

The mask 102 is then pulled away from the mold 101, as shown in FIG. The bonding materials 23 , 24 protrude in the second direction B with respect to the mold 101 . The height of the bonding material 23 in the second direction B with respect to the mold 101 is equal to the height of the bonding material 24 in the second direction B with respect to the mold 101 .

Next, as shown in FIG. 6, electronic component 10 is prepared (third step). Next, as shown in FIG. 6, electronic component 10 is placed on upper surface 101A of mold 101 (fourth step). Electronic component 10 is positioned with respect to mold 101 and bonding materials 23 and 24 such that center line CL of electronic component 10 overlaps center line CL2 of mold 101 when viewed from third direction C. FIG.

The first electrode 11 of the electronic component 10 is arranged on a portion of the first recess 201 located on the second recess 202 side in the first direction A. As shown in FIG. In other words, in the state shown in FIG. 6, the bonding material 23 is arranged inside the electronic component 10 in the first direction A relative to the second surface 11B, and overlaps the first electrode 11 in the second direction B. and a portion arranged outside the second surface 11B of the electronic component 10 in the first direction A and arranged so as not to overlap the first electrode 11 in the second direction B. is doing.

The second electrode 12 of the electronic component 10 is arranged on part of the second recess 202 located on the first recess 201 side in the first direction A. As shown in FIG. In other words, in the state shown in FIG. 6, the bonding material 24 is arranged inside the electronic component 10 relative to the fourth surface 12B in the first direction A, and overlaps the second electrode 12 in the second direction B. and a portion arranged outside the fourth surface 12B of the electronic component 10 in the first direction A and arranged so as not to overlap the second electrode 12 in the second direction B. is doing.

The first surface 11A of the first electrode 11 contacts the upper surface of the portion of the bonding material 23 located on the bonding material 24 side in the first direction A. As shown in FIG. At the same time, the third surface 12A of the second electrode 12 contacts the upper surface of the part of the bonding material 24 located on the bonding material 23 side in the first direction A. The lower surface of non-electrode portion 13 of electronic component 10 , that is, the surface connecting first surface 11 A of first electrode 11 and third surface 12 A of second electrode 12 contacts upper surface 102 B of mask 102 . The non-electrode portion 13 of the electronic component 10 is arranged between the bonding material 23 and the bonding material 24 in the first direction A, and is spaced apart from the upper surface 101A of the mold 101 in the second direction B.

Next, the first joint portion 21 and the second joint portion 22 are formed from the joint materials 23 and 24 (fifth step). First, the joining materials 23, 24 are heated and melted. The heating can be performed by any method. be done. The heating temperature is higher than the melting point of the materials forming the bonding materials 23 and 24 and is a temperature that the electronic component 10 can withstand, such as 250°C. The above heating melts the solder balls 25, 27 and the fluxes 26, 28 entirely. As a result, the electronic component 10 descends under the action of gravity until the non-electrode portion 13 contacts the upper surface 101A of the mold 101 . A portion of the melted bonding material 23 wets and spreads over the second surface 11B of the first electrode 11 . A portion of the melted bonding material 24 wets and spreads on the fourth surface 12B of the second electrode 12 .

Here, the portion where the bonding material 23 before melting is arranged inside the electronic component 10 relative to the second surface 11B in the first direction A and is arranged so as to overlap the first electrode 11 in the second direction B. and a portion that is arranged outside the second surface 11B of the electronic component 10 in the first direction A and is arranged so as not to overlap the first electrode 11 in the second direction B, The melted bonding material 23 tends to wet and spread on the second surface 11</b>B of the first electrode 11 . Similarly, the portion where the bonding material 24 before melting is arranged inside the electronic component 10 relative to the fourth surface 12B in the first direction A and overlaps the second electrode 12 in the second direction B and a portion arranged outside the electronic component 10 in the first direction A relative to the fourth surface 12B and arranged so as not to overlap the second electrode 12 in the second direction B, The melted bonding material 24 tends to wet and spread on the fourth surface 12B of the second electrode 12 .

The joining materials 23, 24 are cooled after being melted. Although the cooling can be performed by any method, for example, the mold 101, the electronic component 10, and the joining materials 23 and 24 are all removed from the reflow furnace. As a result, as shown in FIG. 7, the chip component 1 including the electronic component 10, the first joint portion 21 formed from the joint material 23, and the second joint portion 22 formed from the joint material 24 is manufactured. be done. After the fifth step, chip component 1 is removed from mold 101 .

<Configuration of electronic device>
Electronic device 3 according to the first embodiment is manufactured by mounting chip component 1 according to the first embodiment on printed wiring board 2 . As shown in FIG. 8 , electronic device 3 includes electronic component 10 , printed wiring board 2 , third joint 41 and fourth joint 42 .

The printed wiring board 2 includes a dielectric substrate and wiring patterns formed on and inside the dielectric substrate. The dielectric substrate has an upper surface 2A. The upper surface 2A is a plane extending along the first direction A and the third direction C. As shown in FIG. The printed wiring board 2 is formed on the upper surface 2A and includes a third electrode 31 and a fourth electrode 32 that form part of the wiring pattern. The third electrode 31 and the fourth electrode 32 are spaced apart from each other in the first direction A. As shown in FIG. A material forming the third electrode 31 and the fourth electrode 32 is a conductive material, and includes Cu, for example. The third electrode 31 has a surface in contact with the upper surface 2A and a ninth surface 31A located on the opposite side of the surface. The fourth electrode 32 has a surface in contact with the top surface 2A and a tenth surface 32A located on the opposite side of the surface. The height of the third electrode 31 in the second direction B with respect to the upper surface 2A is, for example, equal to the height of the fourth electrode 32 in the second direction B with respect to the upper surface 2A.

The first electrode 11 of the electronic component 10 is arranged so as to overlap the third electrode 31 in the second direction B. As shown in FIG. The second electrode 12 of the electronic component 10 is arranged so as to overlap the fourth electrode 32 in the second direction B. As shown in FIG. When viewed from the third direction C, the electronic component 10 has a center line CL3 extending along the second direction B and passing through the center between the third electrode 31 and the fourth electrode 32 in the first direction A. are arranged so as to overlap the

The third joint portion 41 is joined to the first electrode 11 and the third electrode 31 . The third joint portion 41 is joined to, for example, the entire first surface 11A, the entire second surface 11B, and the entire ninth surface 31A. The fourth joint portion 42 is joined to the second electrode 12 and the fourth electrode 32 . The fourth joint portion 42 is joined to, for example, the entire third surface 12A, the entire fourth surface 12B, and the entire tenth surface 32A. When viewed from the third direction C, the third joint portion 41 and the fourth joint portion 42 are formed symmetrically with respect to the center line CL3.

The material forming the third joint portion 41 and the fourth joint portion 42 includes solder. The third joint portion 41 is formed from the first joint portion 21 of the chip component 1 and the flux 33 which will be described later. The fourth joint portion 42 is formed from the second joint portion 22 of the chip component 1 and the flux 34 to be described later.
<Method for manufacturing electronic equipment>
The electronic device 3 shown in FIG. 8 is manufactured by the method for manufacturing the electronic device 3 shown in FIGS.

First, a chip component 1 and a printed wiring board 2 shown in FIG. 9 are prepared (seventh step). A third electrode 31 and a fourth electrode 32 are formed on the printed wiring board 2 .

Next, flux 33 is formed on the third electrode 31 of the printed wiring board 2, and flux 34 is formed on the fourth electrode 32, as shown in FIG. The flux 33 is formed to cover the third electrode 31, for example. The flux 34 is formed to cover the fourth electrode 32, for example.

Next, as shown in FIG. 11, chip component 1 is arranged on printed wiring board 2 shown in FIG. 10 (eighth step). The chip component 1 is positioned with respect to the printed wiring board 2 so that the center line CL overlaps the center line CL3 when viewed from the third direction C. As shown in FIG. The first joint portion 21 is arranged on the third electrode 31 and the flux 33 . At the same time, the second joint 22 is placed on the fourth electrode 32 and flux 34 .

Next, the third joint portion 41 is formed from the first joint portion 21, and the fourth joint portion 42 is formed from the second joint portion 22 (ninth step). First, as shown in FIG. 11, the first joint portion 21, the second joint portion 22, the flux 33, and the flux 34 are heated and melted. The heating can be performed by any method, but for example, as shown in FIG. , is carried out. The nozzle 300 is arranged, for example, on the side opposite to the printed wiring board 2 with respect to the electronic component 10 . The heating temperature is a temperature that is higher than the melting points of the materials forming the first joint portion 21, the second joint portion 22, the flux 33, and the flux 34 and that the electronic component 10 can withstand, such as 250°C. The heating melts the first joint portion 21, the second joint portion 22, the flux 33, and the flux 34 as a whole. As a result, part of the melted first joint portion 21 spreads over the second surface 11B of the first electrode 11 . A portion of the melted second joint portion 22 wets and spreads over the fourth surface 12B of the second electrode 12 .

The first joint portion 21 and the second joint portion 22 are cooled after being melted. Although the cooling can be performed by any method, it is performed, for example, by stopping the heating by the nozzle 300 . As a result, as shown in FIG. 8, the electronic component 10, the printed wiring board 2, the first joint 21 and the third joint 41 formed from the flux 33, the second joint 22 and the flux 34 form The electronic device 3 including the formed fourth joint portion 42 is manufactured.

<Effect>
The effect of the chip component 1 will be described below in comparison with a comparative example. First, as a comparative example, consider the above-described conventional chip component. In the comparative example, each soldering portion to be joined to each electrode of the printed wiring board is joined by soldering to each electrode of the electronic component. Therefore, each soldering portion of the comparative example does not protrude toward the printed wiring board side with respect to each electrode of the electronic component, and the shape of the soldering portion joined to the first electrode and the solder joined to the second electrode It is difficult to improve the uniformity with the shape of the attached portion. Therefore, in the comparative example, the state of contact between each soldered portion and each electrode of the printed wiring board is likely to vary. However, the soldered portion joined to the second electrode may not be in contact with the fourth electrode of the printed wiring board. If the soldered parts are heated in such a state, the timing at which each soldered part melts varies, causing the electronic components to shift from their intended positions, or the electronic components to stand up and one electrode to be printed. Problems such as failure to bond to the wiring board (poor bonding) may occur. Such joint failure is likely to occur particularly in miniaturized electronic components. This is because in a miniaturized electronic component, even if the degree of variation is slight, the bonding failure is likely to occur. In addition, the above-mentioned poor connection becomes a problem especially in miniaturized electronic components. In addition, repair work for defective joints is usually performed by so-called manual soldering using a soldering iron, but it is difficult to properly apply the soldering iron to miniaturized electronic components.

On the other hand, the chip component 1 includes an electronic component 10 and a first joint portion 21 and a second joint portion 22 . The material forming the first joint portion 21 and the second joint portion 22 includes solder. The first joint portion 21 has a first protruding portion 21A that protrudes with respect to the first electrode 11 in a second direction B that intersects with the first direction A. As shown in FIG. The second joint portion 22 has a second protruding portion 22A protruding in the second direction B with respect to the second electrode 12 . Therefore, the first joint portion 21 and the second joint portion 22 of the chip component 1 can contact the third electrode 31 and the fourth electrode 32 more reliably than the soldered portion of the comparative example. For example, even when the printed wiring board 2 is warped, the first joint portion 21 and the second joint portion 22 of the chip component 1 can contact the third electrode 31 and the fourth electrode 32 . Therefore, when the first joint portion 21 and the second joint portion 22 are melted in the manufacturing method of the electronic device 3, the variation in the timing at which the first joint portion 21 and the second joint portion 22 are melted is that of the comparative example. more suppressed than In other words, according to the chip component 1, it is possible to suppress the occurrence of bonding defects such as misalignment of the electronic component 10 in the electronic device 3 and rise of the electronic component.

Furthermore, the first joint 21 including the first protruding portion 21A and the second joint 22 including the second protruding portion 22A can be easily manufactured using the mold 101 . Therefore, the chip component 1 can be manufactured relatively easily. Further, the uniformity of the shape of the first joint portion 21 and the shape of the second joint portion 22 is higher than the uniformity of each soldered portion in the comparative example, which is formed by soldering without using the mold 101. It is Further, the uniformity of the shape of each of the first joints 21 and the second joints 22 among the plurality of chip components 1 manufactured using the same mold 101 is the same as that of each soldering among the plurality of comparative examples. Enhanced than part uniformity.

In the chip component 1, when viewed from the third direction C, the height h1 of the first projecting portion 21A with respect to the first electrode 11 in the second direction B is the height h1 of the second projecting portion 22A with respect to the second electrode 12 in the second direction B. equal to height h2.

Such first joint portion 21 and second joint portion 22 are evenly in contact with one plane. Therefore, the chip component 1 is suitable as a chip component to be bonded to the printed wiring board 2 in which the upper surfaces of the third electrode 31 and the fourth electrode 32 are arranged on the same plane.

In the chip component 1, when viewed from the third direction C, the first joint portion 21 and the second joint portion 22 pass through the center between the first electrode 11 and the second electrode 12 in the first direction A and extend in the second direction. It is formed symmetrically with respect to the center line CL extending along B.

The third joint portion 41 and the fourth joint portion 42 of the electronic device 3 manufactured using such a chip component 1 can be formed symmetrically with respect to the centerline CL. Therefore, the joint reliability of the third joint portion 41 and the fourth joint portion 42 in the electronic device 3 is enhanced as compared with that of the conventional electronic device manufactured using the comparative example.

In the chip component 1, the outermost peripheral surfaces of the first projecting portion 21A and the second projecting portion 22A viewed from the third direction C are curved surfaces. More specifically, when each of the first protruding portion 21A and the second protruding portion 22A is arranged on a plane extending along the first direction A and the third direction C, the first protruding portion 21A and the second protruding portion Each of the portions 22A is formed in point contact or line contact with the plane.

If each of the first protruding portion 21A and the second protruding portion 22A is in surface contact with the plane, the planar region of the first protruding portion 21A that contacts the plane and the plane of the second protruding portion 22A The uniformity can be enhanced if the planar region in contact with is on the same plane. On the other hand, when each of the first protruding portion 21A and the second protruding portion 22A is in line contact with the plane, the linear region in contact with the plane in the first protruding portion 21A and the plane in the second protruding portion 22A If the contacting linear regions are parallel, the uniformity is enhanced.

When each of the first protruding portion 21A and the second protruding portion 22A is in point contact with the plane, the point-like region in the first protruding portion 21A that contacts the plane and the second protruding portion 22A in contact with the plane The uniformity is enhanced without any particular restriction on the relative positional relationship with the contacting point-like regions.

In the chip component 1, the top portion 21T of the first projecting portion 21A in the second direction B is arranged so as to overlap the first electrode 11 in the second direction B. As shown in FIG. Further, the top portion 22T of the second projecting portion 22A in the second direction B is arranged so as to overlap the second electrode 12 in the second direction B. As shown in FIG. In other words, when viewed from the third direction C, the top portion 21T is arranged inside the electronic component 10 relative to the second surface 11B, and the top portion 22T is arranged inside the electronic component 10 relative to the fourth surface 12B. there is

In the method of manufacturing electronic device 3 , the surface tension of each of melted first joint portion 21 and second joint portion 22 acts on electronic component 10 . When the first joint portion 21 and the second joint portion 22 are formed symmetrically with respect to the center line CL when viewed from the third direction C, and the timing at which the first joint portion 21 melts and the second joint If the melting timing of the portion 22 can be perfectly matched, the surface tension of the melted first joint portion 21 cancels the surface tension of the melted second joint portion 22 . However, even when the first joint portion 21 and the second joint portion 22 are formed symmetrically with respect to the center line CL when viewed from the third direction C, the timing at which the first joint portion 21 melts and the first joint portion 21 are melted. It is difficult to completely synchronize the timing of melting of the two joints 22, and the respective timings are usually slightly different. If the first joint portion 21 melts earlier than the second joint portion 22 , the surface tension of the melted first joint portion 21 acts on the electronic component 10 . In addition, the surface tension (hereinafter referred to as second surface tension) acting on the bonding material that wets and spreads on the second surface 11</b>B of the melted first bonding portion 21 is applied to the upper surface 2</b>A of the printed wiring board 2 . It acts to reduce the angle formed by the second surface 11B of the . That is, the second surface tension acts to cause so-called standing chips. On the other hand, the surface tension (hereinafter referred to as first surface tension) acting on the bonding material wetted and spread on the first surface 11A of the melted first bonding portion 21 acts to suppress the chip standing.

That is, even if the timing at which the first joint portion 21 melts and the timing at which the second joint portion 22 melts do not completely match and the second surface tension is greater than the first surface tension, the second The tip standing is suppressed when the difference between the surface tension and the first surface tension is less than the force required to cause the tip standing. In order to realize such a configuration, in the chip component 1, the top portion 21T of the first protruding portion 21A in the second direction B is arranged so as to overlap the first electrode 11 in the second direction B, and the second The top portion 22T of the second projecting portion 22A in the direction B is arranged so as to overlap the second electrode 12 in the second direction B. As shown in FIG.

When the top portion 21T is arranged inside the electronic component 10 relative to the second surface 11B, compared to the case where the top portion 21T is arranged outside the electronic component 10 relative to the second surface 11B, the first surface Since the amount of the bonding material that wets and spreads on 11A increases, the first surface tension increases. Therefore, the difference between the second surface tension and the first surface tension in the former case is smaller than the difference between the second surface tension and the first surface tension in the latter case. As a result, according to the chip component 1, occurrence of rising of the electronic component 10 in the electronic device 3 can be suppressed. Even when the top portion 22T is arranged so as to overlap the second electrode 12 in the second direction B, the same effect as described above can be obtained.

In the method for manufacturing the chip component 1, by using the mold 101, the first bonding portion including the first protruding portion 21A is removed from the bonding materials 23 and 24 placed inside the first concave portion 201 and the second concave portion 202. 21 and the second joint 22 including the second projecting portion 22A is easily formed. In addition, variations in the shapes of the first joints 21 and the second joints 22 among the plurality of chip components 1 manufactured by the manufacturing method of the chip component 1 are caused by soldering using a soldering iron. It is reduced compared to that of the comparative example.

In the method of manufacturing the chip component 1, each of the bonding materials 23, 24 contains a mixture of solder balls and flux. In this way, even when a natural oxide film is formed on the surfaces of the first electrode 11 and the second electrode 12 of the electronic component 10, the first joint portion 21 is formed in a predetermined region of the first electrode 11. formed reliably.

In the method for manufacturing the electronic device 3, by using the chip component 1, the first projecting portion 21A of the first joint portion 21 is connected to the third electrode 31, and the second projecting portion 22A of the second joint portion 22 is connected to the third electrode 31. After being connected to the four electrodes 32, the first joint 21 and the second joint 22 are melted. Therefore, the variation in the timing at which the first joint portion 21 and the second joint portion 22 melt is suppressed compared to that in the comparative example, and the timing at which the first joint portion 21 melts is the same as the timing at which the second joint portion 22 melts. can be equated with timing. Therefore, in the method of manufacturing the electronic device 3, compared to the conventional method of manufacturing the electronic device using the above-described comparative example, the electronic component 10 may be displaced from the position where it should be originally arranged, or the electronic component may stand up and one electrode may be displaced. The occurrence of poor connection such as failure to connect to the printed wiring board is suppressed.

Embodiment 2.
As shown in FIG. 12, the chip component 4 according to the second embodiment has basically the same configuration as the chip component 1 according to the first embodiment, except that the first joint portion 21 and the second joint portion 22 It is different from the chip component 1 in that it has a first joint portion 51 and a second joint portion 52 instead of the .

The first joint portion 51 has basically the same configuration as the first joint portion 21 , but differs from the first joint portion 21 in that it is formed from solder balls 61 and flux 63 . The second joint portion 52 has basically the same configuration as the second joint portion 22 , but differs from the second joint portion 22 in that it is formed from solder balls 62 and flux 64 .

The chip component 4 is manufactured by the manufacturing method of the chip component 1 shown in FIGS. 13-15. 13 to 15, the first joint portion 51 and the second joint portion 52 are formed using the mold 101. In the method of manufacturing the chip component 4 shown in FIGS. In the manufacturing method of the chip component 4, the solder balls 61 and the flux 63 constitute the first bonding material, and the solder balls 62 and the flux 64 constitute the second bonding material.

First, a mold 101 shown in FIG. 13 is prepared (first step). The mold 101 has a configuration similar to that of the mold 101 shown in FIG. Next, the solder balls 61 are supplied inside the first recesses 201 of the mold 101, and the solder balls 62 are supplied inside the second recesses 202 of the mold 101 (second step). The outer diameter of each solder ball 61, 62 is equal to or greater than the width of the first electrode 11 and the second electrode 12 in the first direction A and equal to or less than the width of the first recess 201 and the second recess 202 in the first direction A. For example, 0.2 mm. The volume of each solder ball 61 is greater than the volume of first recess 201 . The volume of the solder balls 62 is larger than the volume of the second recesses 202 . The material forming the solder balls 61 and 62 is, for example, lead-free solder. Materials forming the solder balls 61 and 62 include, for example, Sn, Ag, and Cu, and their alloy composition is, for example, Sn-3.0% Ag-0.5% Cu.

A plurality of solder balls 61 and 62 may be supplied to each of first recess 201 and second recess 202 . In this case, the plurality of solder balls 61 are not arranged side by side in the first direction A, for example, but are arranged side by side only in the third direction C, for example. The plurality of solder balls 62 are not arranged side by side in the first direction A, for example, but are arranged side by side only in the third direction C, for example.

Next, electronic component 10 is prepared (third step). Next, flux 63 is applied to the first electrodes 11 of the electronic component 10, and flux 64 is applied to the second electrodes 12 of the electronic component 10 (sixth step). A region of the first electrode 11 to which the flux 63 is applied includes a region of the first electrode 11 of the chip component 4 that is bonded to the first bonding portion 51 . The area of the second electrode 12 to which the flux 64 is applied includes the area of the second electrode 12 of the chip component 4 that is bonded to the second bonding portion 52 . The region to which the flux 63 is applied includes, for example, the entire first surface 11A of the first electrode 11 and a part of the second surface 11B located on the first surface 11A side in the second direction B. The region to which the flux 64 is applied includes, for example, the entire third surface 12A of the second electrode 12 and a portion of the fourth surface 12B located on the third surface 12A side in the second direction B. Although the method of applying the fluxes 63 and 64 is not particularly limited, it is, for example, transfer using a transfer device. A portion of each of the fluxes 63 and 64 may be applied onto the non-electrode portion 13 . Thereby, the electronic component 10 shown in FIG. 14 is formed.

Next, as shown in FIG. 14, electronic component 10 subjected to the sixth step is placed on solder balls 61 and 62 (fourth step). By placing the electronic component 10 on the solder balls 61 and 62 , the flux 63 contacts the solder balls 61 and the flux 64 contacts the solder balls 62 .

Next, the solder balls 61, 62 and the fluxes 63, 64 form the first joints 21 and the second joints 22 (fifth step). First, solder balls 61, 62 and fluxes 63, 64 are heated and melted. The heating can be performed by any method, but for example, the mold 101, the electronic component 10, the solder balls 61, 62, and the fluxes 63, 64 shown in FIG. 14 are put into a reflow furnace and heated. will be implemented. The heating temperature is a temperature that is higher than the melting point of the material forming the solder balls 61 and 62 and that the electronic component 10 can withstand, such as 250.degree. The heating melts the solder balls 61 and 62 and the fluxes 63 and 64 entirely. Thereby, electronic component 10 descends until non-electrode portion 13 contacts upper surface 101 A of mold 101 . Some of the melted solder balls 61 and flux 63 wet and spread on the second surface 11B of the first electrode 11 . Part of the melted solder balls 62 and flux 64 wets and spreads on the fourth surface 12B of the second electrode 12 .

Solder balls 61, 62 and fluxes 63, 64 are cooled after being melted. Although the cooling can be performed by any method, for example, the mold 101, the electronic component 10, the solder balls 61, 62 and the fluxes 63, 64 are all removed from the reflow furnace. As a result, as shown in FIG. 15, the electronic component 10, the first joints 51 formed from the solder balls 61 and the flux 63, and the second joints 52 formed from the solder balls 62 and the flux 64 are formed. A chip component 4 is manufactured. After that, the chip component 4 is removed from the mold 101 .

In the manufacturing method of chip component 4 , fluxes 63 and 64 may be applied onto solder balls 61 and 62 arranged inside first recess 201 and second recess 202 of mold 101 . As shown in FIG. 16, the fluxes 63 and 64 may be applied to cover the entire surfaces of the solder balls 61 and 62 exposed from the mold 101, for example.

Since the chip component 4 has basically the same configuration as the chip component 1, the same effect as the chip component 1 can be obtained.

Further, in the method for manufacturing the chip component 4, in the sixth step performed after the second step and before the third step, the flux is applied to the first joint portion in the first electrode 11 and the second electrode 12. 21 and a second joint 22 are formed over the area where they are to be formed. Alternatively, flux is formed on the solder balls 61 and 62 in the sixth step. As a result, the method for manufacturing the chip component 4 does not require the mask 102 used in the method for manufacturing the chip component 1 .

Embodiment 3.
As shown in FIG. 17, the chip component 5 according to the third embodiment has basically the same configuration as the chip component 1 according to the first embodiment, except that the first joint portion 21 and the second joint portion 22 It is different from the chip component 1 in that it has a first joint portion 71 and a second joint portion 72 instead of the .

The first joint portion 71 has basically the same configuration as the first joint portion 21 , but differs from the first joint portion 21 in that it is formed from chip solder 81 and flux 83 . The second joint portion 72 has basically the same configuration as the second joint portion 22 , but is different from the second joint portion 22 in that it is formed from chip solder 82 and flux 84 .

The chip component 5 is manufactured by the manufacturing method of the chip component 5 shown in FIGS. 18-20. 18 to 20, the first joint portion 71 and the second joint portion 72 are formed using the mold 101. In the method of manufacturing the chip component 5 shown in FIGS. In the manufacturing method of the chip component 5, the chip solder 81 and the flux 83 constitute the first bonding material, and the chip solder 82 and the flux 84 constitute the second bonding material.

First, a mold 101 and chip solders 81 and 82 shown in FIG. 18 are prepared. The mold 101 has a configuration similar to that of the mold 101 shown in FIG. A chip solder 81 is placed on the first recess 201 of the mold 101 and a chip solder 82 is placed on the second recess 202 of the mold 101 . The volume of chip solder 81 is larger than the volume of first recess 201 . The volume of the chip solder 82 is larger than the volume of the second recess 202 . The chip solder 81 is arranged, for example, so as to close the first recess 201 . The width of the chip solder 81 in the first direction A is wider than the width of the first recess 201 in the first direction A, for example. The width of the chip solder 81 in the third direction C is wider than the width of the first recess 201 in the third direction C, for example. The chip solder 82 is arranged so as to close the second recess 202 . The width of the chip solder 82 in the first direction A is wider than the width of the second recess 202 in the first direction. The width of the chip solder 82 in the third direction C is wider than the width of the second recess 202 in the third direction.

The material forming the chip solders 81 and 82 is, for example, lead-free solder. Materials forming the solder balls 61 and 62 include, for example, Sn, Ag, and Cu, and their alloy composition is, for example, Sn-3.0% Ag-0.5% Cu.

At least one chip solder 81 may be placed on one first concave portion 201, but for example, a plurality of chip solders 81 may be placed. In this case, the plurality of chip solders 81 are arranged side by side in the third direction C, for example. Similarly, at least one chip solder 82 should be placed on one second recess 202, but for example, a plurality of chip solders 82 may be placed. In this case, the plurality of chip solders 82 are arranged side by side in the third direction C, for example.

Next, as shown in FIG. 19, electronic component 10 is prepared, and electronic component 10 is placed on chip solders 81 and 82 . The electronic component 10 has the same configuration as the electronic component 10 prepared in the manufacturing method of the chip component 4, for example. A flux 83 is applied to the first electrode 11 of the prepared electronic component 10 . Similarly, a flux 84 is applied to the second electrode 12 of the prepared electronic component 10 . By placing the electronic component 10 on the chip solders 81 and 82 , the flux 83 contacts the chip solder 81 and the flux 84 contacts the chip solder 82 .

The region of the prepared first electrode 11 of the electronic component 10 to which the flux 83 is applied includes the region of the first electrode 11 of the chip component 5 to be bonded to the first bonding portion 71 . The regions of the prepared second electrodes 12 of the electronic component 10 to which the flux 84 is applied include the regions of the second electrodes 12 of the chip component 5 to be bonded to the second bonding portions 72 .

The region coated with the flux 83 includes, for example, the entire first surface 11A of the first electrode 11 and a portion of the second surface 11B located on the first surface 11A side in the second direction B. The region coated with the flux 84 includes, for example, the entire third surface 12A of the second electrode 12 and a portion of the fourth surface 12B located on the third surface 12A side in the second direction B. Although the method of applying the fluxes 83 and 84 is not particularly limited, it is, for example, transfer using a transfer device. A portion of each of the fluxes 63 and 64 may be applied onto the non-electrode portion 13 .

Next, chip solders 81, 82 and fluxes 83, 84 are heated and melted. The heating can be performed by any method, but for example, the mold 101, the electronic component 10, the chip solders 81, 82, and the fluxes 83, 84 shown in FIG. 19 are put into a reflow furnace and heated. will be implemented. The heating temperature is a temperature that is higher than the melting point of the material forming the chip solders 81 and 82 and that the electronic component 10 can withstand, such as 250.degree. The heating melts the chip solders 81 and 82 and the fluxes 83 and 84 entirely. As a result, part of the molten solder 81 and flux 83 flows into and fills the first recess 201 , and the rest of the molten solder 81 and flux 83 flows into the first electrode 11 . It wets and spreads over the first surface 11A and the second surface 11B. Similarly, part of the molten solder 82 and flux 84 flows into and fills the second recess 202 , and the remainder of the molten solder 82 and flux 84 flows into the second electrode 12 . It spreads on the third surface 12A and the fourth surface 12B.

Electronic component 10 descends until non-electrode portion 13 contacts upper surface 101A of mold 101 . A portion of the melted chip solder 81 and flux 83 wets and spreads over the second surface 11B of the first electrode 11 . A portion of the melted chip solder 82 and flux 84 wets and spreads on the fourth surface 12B of the second electrode 12 .

Chip solders 81, 82 and fluxes 83, 84 are cooled after being melted. Although the cooling can be performed by any method, for example, the mold 101, the electronic component 10, the chip solders 81, 82, and the fluxes 83, 84 are all removed from the reflow furnace. As a result, as shown in FIG. 20, the electronic component 10, the first joint portion 71 formed from the chip solder 81 and the flux 83, and the second joint portion 72 formed from the chip solder 82 and the flux 84 are formed. A chip component 5 is manufactured. After that, the chip component 5 is removed from the mold 101 .

In the manufacturing method of chip component 5 , fluxes 83 and 84 may be applied onto chip solders 81 and 82 arranged on first recess 201 and second recess 202 of mold 101 .

Since the chip component 5 has basically the same configuration as the chip component 1, the same effect as the chip component 1 can be obtained.

Further, in the method for manufacturing the chip component 5, in the sixth step performed after the second step and before the third step, the flux is applied to the first joint portion in the first electrode 11 and the second electrode 12. 21 and a second joint 22 are formed over the area where they are to be formed. Alternatively, flux is formed on the chip solders 81 and 82 in the sixth step. As a result, the method for manufacturing the chip component 5 does not require the mask 102 used in the method for manufacturing the chip component 1 .

Embodiment 4.
As shown in FIG. 21, the chip component 6 according to the fourth embodiment has basically the same configuration as the chip component 1 according to the first embodiment, except that the first joint portion 21 and the second joint portion 22 It is different from the chip component 1 in that it has a first joint portion 91 and a second joint portion 92 instead of .

The first joint portion 91 differs from the first joint portion 21 in that it is not joined to the second surface 11B of the first electrode 11 . The first joint portion 91 is joined only to the first surface 11A, for example. The second joint portion 92 differs from the first joint portion 21 in that it is not joined to the fourth surface 12B of the second electrode 12 . The second joint portion 92 is joined only to the third surface 12A, for example.

In the method for manufacturing the chip component 6, the bonding between the first joint portion 91 and the first electrode 11 and the bonding between the second joint portion 92 and the second electrode 12 are performed by ultrasonic bonding. In other words, in the method of manufacturing the chip component 6, the bonding between the first joint portion 91 and the first electrode 11 and the bonding between the second joint portion 92 and the second electrode 12 are performed without using flux. In the manufacturing method of the chip component 6, only the solder balls constitute the first bonding material or the second bonding material.

For example, the electronic component 10 and solder balls 61 and 62 described above are prepared. Next, while pressing the first electrodes 11 and the solder balls 61 of the electronic component 10 in the second direction B, ultrasonic vibration is applied to them. Similarly, while pressing the second electrodes 12 of the electronic component 10 and the solder balls 62 in the second direction B, ultrasonic vibration is applied to them. Thus, the chip component 6 is manufactured without using flux.

Since the chip component 6 has basically the same configuration as the chip component 1, the same effect as the chip component 1 can be obtained.

Further, in the method of manufacturing the chip component 6, each of the first bonding material and the second bonding material is made of a solder ball, and in the fourth step, the solder ball is ultrasonically bonded to the first electrode 11 or the second electrode 12. be. Therefore, the method for manufacturing the chip component 6 does not require the flux used in the methods for manufacturing the chip components 1 , 4 and 5 .

<Modification>
In the chip components 1, 4 to 6, when the first projecting portion 21A is arranged on a plane extending along the first direction A and the third direction C, the first projecting portion 21A is in point contact with the plane. may be provided in Similarly, when the second protruding portion 22A is arranged on a plane extending along the first direction A and the third direction C, the second protruding portion 22A may be provided so as to make point contact with the plane. . In this case, the number of points in contact with the plane on the first protruding portion 21A and the number of points in contact with the plane on the second protruding portion 22A may be any number of 1 or more. In other words, the first projecting portion 21A and the second projecting portion 22A may have at least one spherical portion or at least one ellipsoidal portion. The first projecting portion 21A and the second projecting portion 22A are each part of a plurality of spherical bodies arranged side by side in the third direction C, or each one of a plurality of ellipsoids arranged side by side in the third direction C. You may have a part. The first concave portion 201 and the second concave portion 202 of the mold 101 are provided so that the first joint portion 21 and the second joint portion 22 including the first projecting portion 21A and the second projecting portion 22A as described above are formed. It is

As long as the chip components 1, 4 to 6 have the above-described configurations, the occurrence of poor joints between the electronic component and the printed wiring board is suppressed as compared with the chip components used in the conventional mounting method. can. Therefore, other configurations of the chip components 1, 4 to 6, such as the configuration of the chip components 1, 4 to 6 in the cross section perpendicular to the first direction A, are not particularly limited as long as they are compatible with the configurations described above.

The first electrode 11 shown in FIG. 1 faces the third direction C, and has a fifth surface 11C extending along the first direction A and the second direction B, and a fifth surface 11C extending along the third direction C. and a sixth surface 11D facing the opposite side. The second electrode 12 faces the third direction C, faces the seventh face 12C extending along the first direction A and the second direction B, and faces the opposite side of the seventh face 12C in the third direction C. It further has an eighth surface 12D which is in contact with. In the chip component 1 shown in FIG. 1, the first joint portion 21 and the second joint portion 22 are not formed on the fifth surface 11C, the sixth surface 11D, the seventh surface 12C, and the eighth surface 12D. It is not limited to this. The first joint portion 21 and the second joint portion 22 may be formed on the fifth surface 11C, the sixth surface 11D, the seventh surface 12C, and the eighth surface 12D.

22 is a sectional view perpendicular to the first direction A of the modified example of the chip component 1, and is a sectional view passing through the first electrode 11 and the first portion 21C of the first projecting portion 21A of the first joint portion 21. FIG. . As shown in FIG. 22, the first joint portion 21 is joined to a portion of, for example, the fifth surface 11C and the sixth surface 11D in addition to the first surface 11A and the second surface 11B.

As shown in FIG. 22, the first projecting portion 21A is arranged in a region that does not overlap the first electrode 11 in the second direction B, and is located on the fifth surface 11C of the first electrode 11 in the third direction C. and a seventh portion 21E that protrudes from the sixth surface 11D of the first electrode 11 in the second direction B and is arranged in a region that does not overlap with the first electrode 11 in the second direction B and protrudes from the sixth surface 11D of the first electrode 11 in the third direction C. and an eighth portion 21F. The first joint portion 21 further has a ninth portion 21G arranged on the fifth surface 11C in the third direction C and a tenth portion 21H arranged on the sixth surface 11D in the third direction C. is doing. The first portion 21C, the seventh portion 21E, the eighth portion 21F, the ninth portion 21G, and the tenth portion 21H are configured integrally. The top portion 21T of the first joint portion 21 is formed only in a region overlapping the first electrode 11 in the second direction B, for example. Note that the top portion 21T of the first joint portion 21 may be formed so as to extend from the inner side to the outer side of the fifth surface 11C and the sixth surface 11D of the first electrode 11 in the third direction C.

Chip component 1 shown in FIG. 22 is manufactured using mold 101 shown in FIG. The length of the first concave portion 201 of the mold 101 in the third direction C is longer than the lengths of the first electrode 11 and the second electrode 12 in the third direction C, for example.

Since the chip component 1 shown in FIG. 22 has basically the same configuration as the chip component 1 shown in FIGS. 1 and 2, it has the same effect as the chip component 1 shown in FIGS. can play. Furthermore, according to the chip component 1 shown in FIG. 22, when the first joints 21 and the second joints 22 are melted in the manufacturing method of the electronic device 3, one of the melted first joints 21 is A part wets and spreads on the fifth surface 11C of the first electrode 11 and the other part wets and spreads on the sixth surface 11D of the first electrode 11 . Therefore, the bonding strength between the electronic component 10 of the electronic device 3 manufactured using the chip component 1 shown in FIG. 3, the bonding strength between the electronic component 10 and the printed wiring board 2 is higher.

In the chip component 1 shown in FIG. 22, when the first projecting portion 21A is arranged on a plane extending along the first direction A and the third direction C, the first projecting portion 21A is in line contact with the plane. is provided in 23 is a cross-sectional view perpendicular to the first direction A of another modification of the chip component 1, and is a cross-sectional view passing through the first electrode 11 and the first portion 21C of the first projecting portion 21A of the first joint portion 21. FIG. is. As shown in FIG. 23, in the chip component 1, when the first protruding portion 21A is arranged on a plane extending along the first direction A and the third direction C, the first protruding portion 21A is positioned on the plane and at a point. You may provide so that it may contact. In the chip component 1 shown in FIG. 23, the number of points in contact with the plane in the first projecting portion 21A is plural. The second joint portion 22 of the chip component 1 shown in FIGS. 22 and 23 has the same structure as the first joint portion 21, for example.

Embodiment 5.
As shown in FIG. 24, the chip component 7 according to the fifth embodiment has basically the same configuration as the chip component 1 according to the first embodiment, but the first bonding portion 21 is It is different from the chip component 1 in that it is joined to the area located on the first surface 11A side with respect to the center of the second surface 11B and the area located on the opposite side of the first surface 11A with respect to the center. . Similarly, the chip component 7 has a region in which the second bonding portion 22 is located on the first surface 11A side with respect to the center of the second surface 11B in the second direction B and a portion opposite to the first surface 11A with respect to the center. It is different from the chip component 1 in that it is joined to the region located on the side.

In other words, the first joint portion 21 has a portion arranged above the center of the second surface 11B of the first electrode 11 in the second direction B. As shown in FIG. The second joint portion 22 has a portion arranged above the center of the fourth surface 12B of the second electrode 12 in the second direction B. As shown in FIG.

Preferably, the first joint portion 21 is joined to the entire surface of the second surface 11B, and the second joint portion 22 is joined to the entire surface of the fourth surface 12B.

Furthermore, as shown in FIG. 25, the chip component 7 has the first joint portion 21 and the second joint portion 22 each arranged in the first direction A and the second direction B, and in the third direction C as well. It differs from the chip component 1 in that it protrudes from the electrode 11 or the second electrode 12 .

In other words, the first joint portion 21 has a portion protruding in the third direction C with respect to the first electrode 11 . The first projecting portion 21A has a portion projecting with respect to the first electrode 11 in the third direction C. As shown in FIG. A portion of the portion of the first joint portion 21 that is arranged above the center of the second surface 11B of the first electrode 11 in the second direction B protrudes from the first electrode 11 in the third direction C. ing.

The second joint portion 22 has a portion protruding in the third direction C with respect to the second electrode 12 . The second projecting portion 22A has a portion projecting with respect to the second electrode 12 in the third direction C. As shown in FIG. A portion of the portion of the second joint portion 22 that is arranged above the center of the fourth surface 12B of the second electrode 12 in the second direction B protrudes from the second electrode 12 in the third direction C. ing.

The first electrode 11 faces the third direction C, faces the fifth face 11C extending along the first direction A and the second direction B, and faces the opposite side of the fifth face 11C in the third direction C. It further has the 6th surface 11D which is connected. The second electrode 12 faces the third direction C, faces the seventh face 12C extending along the first direction A and the second direction B, and faces the opposite side of the seventh face 12C in the third direction C. It further has an eighth surface 12D which is in contact with. In the chip component 7, the first joint portion 21 and the second joint portion 22 are formed on the fifth surface 11C, the sixth surface 11D, the seventh surface 12C, and the eighth surface 12D. The top portion 21T of the first joint portion 21 is formed only in a region that does not overlap the first electrode 11 in the second direction B, for example. The top portion 22T of the second joint portion 22 is formed only in a region that does not overlap the second electrode 12 in the second direction B, for example.

The chip component 7 is manufactured by the manufacturing method of the chip component 7 shown in FIGS. 26-28. 26 to 28, the first joint portion 21 and the second joint portion 22 are formed using the mold 101. In the method of manufacturing the chip component 7 shown in FIGS. In the manufacturing method of the chip component 7, the bonding material 23 constitutes the first bonding material, and the bonding material 24 constitutes the second bonding material.

First, mold 101 and electronic component 10 shown in FIG. 26 are prepared. The mold 101 has basically the same configuration as the mold 101 shown in FIG.

Next, as shown in FIG. 27, the bonding material 23 is supplied to the first recess 201 and the bonding material 24 is supplied to the second recess 202 by the dispenser 400 . The bonding material 23 is also supplied in the second direction B above the center of the second surface 11B. The bonding material 24 is also supplied in the second direction B above the center of the fourth surface 12B.

Next, the bonding material 23 and the bonding material 24 are heated and melted. Although the heating can be performed by any method, for example, it is performed by being put into a reflow furnace and heated, as in the other embodiments. As a result, the bonding material 23 flows into and fills the inside of the first recess 201 , and the remainder of the bonding material 23 wets and spreads over the first surface 11 A and the second surface 11 B of the first electrode 11 . Similarly, a portion of the bonding material 24 flows into and fills the interior of the second recess 202, and the remainder of the bonding material 24 wets and spreads over the third surface 12A and the fourth surface 12B of the second electrode 12. .

Next, the bonding material 23 and the bonding material 24 are cooled after being melted. Although the cooling can be performed by any method, for example, it is performed by taking out from the inside of the reflow oven as in the other embodiments. As a result, as shown in FIG. 28, the chip component 7 including the electronic component 10, the first joint portion 21 formed from the joint material 23, and the second joint portion 22 formed from the joint material 24 is manufactured. be done. After that, the chip component 7 is removed from the mold 101 .

By mounting chip component 7 on printed wiring board 2 in the same manner as chip component 1, the electronic device according to the fifth embodiment shown in FIG. 29 is manufactured.

Since the chip component 7 has basically the same configuration as the chip component 1, the same effect as the chip component 1 can be obtained.

In addition, since a part of each of the second surface 11B and the fourth surface 12B of the chip component 1 is exposed without being wetted with solder, even if the storage environment of the chip component 1 is bad, oxidation of the exposed portions described above progresses. In this case, when the chip component 1 is mounted on the printed wiring board 2, the third joint portion 41 and the fourth joint portion 42 are positioned above the second surface 11B and the fourth surface 12B as shown in FIGS. There is a possibility that it will not get wet. In the electronic device shown in FIGS. 30 and 31, each of first joint portion 21 and second joint portion 22 protrudes outward from each side of electronic component 10 in first direction A and second direction B. , is manufactured from the chip component 1 that does not protrude outward from each side of the electronic component 10 in the third direction C. As shown in FIG.

On the other hand, in the chip component 7, the first joint portion 21 has a portion arranged above the center of the second surface 11B in the second direction B, and the second joint portion 22 is located in the second direction B. It has a portion arranged above the center of the fourth surface 12B in the direction B. Therefore, in the electronic device shown in FIG. 29 in which the chip component 7 is mounted on the printed wiring board 2, compared with the electronic device 3 in which the chip component 1 is mounted on the printed wiring board 2, the third joint portion 41 and the fourth bonding portion 42 are reliably wetted and spread by the entire surface of each of the second surface 11B and the fourth surface 12B. Therefore, according to the chip component 7, oxidation of the second surface 11B and the fourth surface 12B is suppressed regardless of the storage environment. That is, the chip component 7 is excellent in storability.

Furthermore, each of the first joint portion 21 and the second joint portion 22 of the chip component 7 extends outward from each side of the electronic component 10 not only in the first direction A and the second direction B but also in the third direction C. It has protruding parts. Therefore, the volumes of the third joint portion 41 and the fourth joint portion 42 of the electronic device shown in FIG. 29 are equal to or larger than the volumes of the third joint portion 41 and the fourth joint portion 42 of the electronic device shown in FIGS. can be As a result, the shortest distance d1 between the end of the second electrode 12 of the chip component 7 and the third joint portion 41 shown in FIG. is longer than the shortest distance d2 between the end of .

Here, when an electronic device is exposed to temperature cycles in its operating environment, a mismatch occurs in the linear expansion coefficient between the chip component and the base material of the printed wiring board, causing strain in the solder joints and cracking. may occur. Such cracks grow as the number of temperature cycles increases, eventually leading to fracture of the solder joint. The time to failure is generally proportional to the shortest distance between the edge of the chip and the solder joint (fillet).

Therefore, since the shortest distance d1 in the electronic equipment shown in FIG. 29 is longer than the shortest distance d2 in the electronic equipment shown in FIGS. is longer than the time until the breakage occurs in the electronic devices shown in FIGS. As a result, the life of the solder joints in the electronic device shown in FIG. 29 is longer than that in the electronic devices shown in FIGS.

Although the embodiment of the present disclosure has been described as above, it is also possible to modify the above-described embodiment in various ways. Also, the scope of the present disclosure is not limited to the above-described embodiments. The scope of the present disclosure is indicated by the claims, and is intended to include all changes within the meaning and range of equivalents to the claims.

1, 4, 5, 6 chip component, 2 printed wiring board, 2A, 101A, 102B upper surface, 3 electronic device, 10 electronic component, 11 first electrode, 11A first surface, 11B second surface, 12 second electrode, 12A third surface, 12B fourth surface, 13 non-electrode portion, 21, 51, 71, 91 first joint portion, 21A first projecting portion, 21B third portion, 21C first portion, 21D second portion, 21E second 7 part, 21F 8th part, 21G 9th part, 21H 10th part, 21T, 22T top part, 22, 52, 72, 92 2nd joint part, 22A 2nd projecting part, 22B 6th part, 22C 4th part , 22D fifth portion, 23, 24 bonding material, 25, 27, 61, 62 ball, 26, 28, 33, 34, 36, 63, 64, 83, 84 flux, 31 third electrode, 31A ninth surface, 32 fourth electrode, 32A tenth surface, 41 third junction, 42 fourth junction, 81, 82 solder, 101 mold, 102 mask, 102A lower surface, 201 first recess, 202 second recess, 203 first Through hole, 204 Second through hole, 300 Nozzle.

Claims (18)

an electronic component including a first electrode and a second electrode spaced apart from the first electrode in a first direction;
a first joint joined to the first electrode;
a second joint joined to the second electrode;
a material forming the first joint and the second joint includes solder;
The first joint has a first protruding portion that protrudes with respect to the first electrode in a second direction that intersects with the first direction,
The second joint has a second projecting portion projecting with respect to the second electrode in the second direction ,
When viewed from a third direction intersecting the first direction and the second direction, outermost peripheral surfaces of the first projecting portion and the second projecting portion are curved surfaces,
The first protruding portion has a top portion that is the portion of the first joint portion that is the longest in the second direction from the first electrode,
The chip component , wherein the second protruding portion has a top portion that is the portion of the second joint portion that is the longest from the second electrode in the second direction . The first protruding portion has a portion protruding with respect to the first electrode in the first direction,
2. The chip component according to claim 1, wherein said second protruding portion has a portion protruding with respect to said second electrode in said first direction. When each of the first projecting portion and the second projecting portion is arranged on a plane extending along the first direction and the third direction, each of the first projecting portion and the second projecting portion: 3. The chip component according to claim 1, which is formed to be in point contact or line contact with said plane. 3. The height of said first projecting portion with respect to said first electrode in said second direction when viewed from said third direction is equal to the height of said second projecting portion with respect to said second electrode in said second direction. 4. The chip component according to any one of 1 to 3 . When viewed from the third direction, the first joint portion and the second joint portion extend along the second direction through a center between the first electrode and the second electrode in the first direction. 5. The chip component according to claim 4, which is formed symmetrically with respect to the center line. The first joint portion has a portion arranged above the center of the first electrode in the second direction and a portion protruding from the first electrode in the third direction. cage,
The second joint portion has a portion arranged above the center of the second electrode in the second direction and a portion protruding from the second electrode in the third direction. The chip component according to any one of claims 1 to 5 , wherein the top portion of the first protruding portion in the second direction is arranged to overlap the first electrode in the second direction;
7. The chip component according to claim 1, wherein said top portion of said second projecting portion in said second direction is arranged so as to overlap said second electrode in said second direction. 8. The chip component according to claim 1, wherein each of said first joint portion and said second joint portion is provided so as to cover an end portion of said chip component . the first electrode has a first surface facing the second direction;
The chip component according to any one of claims 1 to 8, wherein said first joint portion is joined to said entire first surface. 10. The chip component according to claim 1, wherein outlines of said first joint and said second joint are substantially arc-shaped when viewed from said third direction. a first step of preparing a mold having a top surface and having first and second recesses recessed with respect to the top surface;
a second step of placing a first bonding material inside the first recess and placing a second bonding material inside the second recess;
a third step of providing an electronic component including a first electrode and a second electrode spaced from the first electrode in a first direction;
After the second step and the third step, the electronic component is placed on the top surface to bring the first electrode into contact with the first bonding material and the second electrode into contact with the second bonding material. a fourth step;
After the fourth step, a first protruding portion that is joined to the first electrode and protrudes with respect to the first electrode in a second direction that intersects with the first direction is formed from the first joining material. from the second bonding material and having a second projecting portion bonded to the second electrode and projecting relative to the second electrode in the second direction; A method for manufacturing a chip component, comprising: a fifth step of forming a joint portion. In the fourth step, the first protruding portion has a portion protruding with respect to the first electrode in the first direction, and the second protruding portion protrudes from the second electrode in the first direction. 12. The method of manufacturing a chip component according to claim 11 , wherein the chip component has a portion protruding toward the each of the first bonding material and the second bonding material includes a mixture of solder balls and flux;
13. The method of manufacturing a chip component according to claim 11 , wherein said solder balls and said flux are melted in said fifth step. each of the first bonding material and the second bonding material includes a solder ball;
After the second step and before the third step, the first joint and the second joint should be formed on the solder ball and on the first electrode and the second electrode. Further comprising a sixth step of placing on at least one of the regions,
13. The method of manufacturing a chip component according to claim 11 , wherein said solder balls and said flux are melted in said fifth step. each of the first bonding material and the second bonding material includes chip solder;
After the second step and before the third step, the first joint and the second joint should be formed on the chip solder and on the first electrode and the second electrode. Further comprising a sixth step of placing on at least one of the regions,
13. The method of manufacturing a chip component according to claim 11 , wherein said chip solder and said flux are melted in said fifth step. each of the first bonding material and the second bonding material comprises a solder ball;
13. The method of manufacturing a chip component according to claim 11 , wherein in said fifth step, said solder ball is ultrasonically bonded to said first electrode or said second electrode. A chip component manufactured by the chip component manufacturing method according to any one of claims 11 to 16 , a third electrode, and a fourth electrode spaced apart from the third electrode in the first direction. a seventh step of preparing a printed wiring board including electrodes;
an eighth step of disposing the first protruding portion of the first joint on the third electrode and disposing the second protruding portion of the second joint on the fourth electrode;
After the eighth step, a third joint is formed in which the first joint is joined to the first electrode and the third electrode, and the second joint is joined to the second electrode and the fourth electrode. and a ninth step of forming a joined fourth joint,
In the ninth step, the method of manufacturing an electronic device, wherein the first joint portion and the second joint portion are melted by heating. each of the first electrode and the second electrode has a surface extending along the second direction;
18. The method of manufacturing an electronic device according to claim 17 , wherein in said ninth step, each of said first joint portion and said second joint portion melted by heating wets and spreads over a surface extending along said second direction.

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