JP7168163B2 - Electronic component, its manufacturing method, and electronic component mounting method - Google Patents

Description

The present invention relates to an electronic component, a method for manufacturing the same, and a method for mounting the electronic component. In particular, the present invention relates to an electronic component with a protective film that closes the opening, a manufacturing method thereof, and a mounting method of the electronic component, in an electronic component having an opening exposed to the outside in a state in which a chip component such as a sensor element is packaged. be.

In recent years, there has been an increase in demand for various types of sensors due to the mounting in communication devices such as smartphones and tablet terminals, the mounting in healthcare devices such as pedometers and activity meters, and the increase in sensors for vehicles and industrial equipment. An ever increasing variety of sensors are being developed. For example, in humidity sensors, in addition to conventional resistance sensors, capacitive sensors that can be used in a wide range of atmospheric temperatures have been developed. In the pressure sensor, a semiconductor strain gauge is formed on the surface of the diaphragm, and a resistance type that depends on the change in electrical resistance due to the piezoresistive effect that occurs when the diaphragm is deformed by pressure, or a sensor that uses a fixed electrode and a movable electrode facing each other A capacitive sensor has been developed in which an arranged capacitor is formed to measure the change in capacitance caused by deformation of the movable electrode due to pressure.

Such a humidity sensor, pressure sensor, or the like has a sensor element placed in a package made of ceramic, resin, or the like, and has an opening that exposes or communicates with the outside at least a part of a detection unit that measures a physical quantity. A package structure is adopted (for example, Patent Document 1).

Various problems arise when an electronic component having such an opening is mounted on a mounting board. For example, when an electronic component is mounted on a mounting board, solder is generally used, and high-temperature processing is required to melt the solder. At that time, volatile components are released as outgassing from the flux used together with the solder, and the entire electronic component is exposed to the outgassing. Then, there is a problem that the outgassing adheres to the sensor element exposed in the opening of the electronic component, degrading the performance of the sensor.

Therefore, for example, a method of closing the opening by attaching a protective film to the opening of the electronic component has been adopted. Specifically, as shown in FIG. 11, a structure is adopted in which outgas does not enter the electronic component 30 by covering the opening 16 of the electronic component 30 with a heat-resistant protective film 15 such as a polyimide film. .

JP 2010-203857 A

By the way, in the electronic component 30 with a protective film as shown in FIG. 11, the protective film 15 needs to be peeled off after being mounted on the mounting board. At that time, a part of the protective film was made longer than the electronic component 30 in order to make the protective film 15 easier to grip. Therefore, when housing the electronic component 30 having such a structure in a container such as a carrier tape, it is necessary to prepare a container having a special shape that matches the protective film 15 protruding from the electronic component 30, which increases the production cost. caused the increase.

In addition, the protective film 15 having the structure shown in FIG. 11 needs to be attached to each electronic component, which causes deterioration in productivity.

Therefore, the present invention provides an electronic component having an opening, which can be easily attached with a protective film so as to block the opening, and can be used in a general-purpose storage container, and has excellent productivity. The object is to provide a manufacturing method. Another object of the present invention is to provide an electronic component mounting method that allows the protective film to be easily peeled off during mounting.

In order to achieve the above object, the electronic component according to claim 1 of the present application is an electronic component having a protective film attached to the surface thereof, in which a chip component mounted inside the electronic component and at least a part of the chip component are externally mounted. A package portion having an opening that is exposed or communicates with the package portion; and a first gap opened to the side surface of the electronic component surrounded by the inner wall of the projection exposed from the cut portion of at least one of the projections.

The electronic component according to claim 2 of the present application is the electronic component according to claim 1, wherein an opening is provided on a side surface of the electronic component surrounded by a stepped portion formed on a part of the surface of the package portion and the protective film. It is characterized by having a second gap.

A method of manufacturing an electronic component according to claim 3 of the present application is provided with a package portion having an opening through which at least a part of a chip component mounted inside is exposed or communicates with the outside, and a plurality of protrusions are provided so as to block the opening. A method for manufacturing an electronic component in which a protective film having a portion is attached to the surface of the package portion, wherein the package portion and at least one convex portion of the protective film are cut for separation into individual electronic components. The method is characterized by forming a first gap surrounded by the surface of the package portion and the inner wall of the projection exposed by cutting the projection for each component.

A method for manufacturing an electronic component according to claim 4 of the present application is the method for manufacturing an electronic component according to claim 3, wherein a concave portion is formed in the surface of the package portion, and the protective layer is formed on the surface of the package portion in which the concave portion is formed. A step of forming a second gap surrounded by a stepped portion and the protective film for each electronic component by applying a film and cutting the concave portion and the protective film for singulation. It is characterized by

According to claim 5 of the present application, there is provided a method of mounting an electronic component, comprising a package section having an opening through which at least a part of a chip component is exposed or communicated with the outside, and a plurality of chip components are provided so as to cover the opening on the surface of the package section. A mounting method for mounting an electronic component to which a protective film having convex portions is adhered on a mounting substrate, wherein after the electronic component is mounted on the mounting substrate, when the protective film is peeled off, the surface of the package portion and the protective film are separated from each other. A first cavity opening to the side surface of the electronic component surrounded by the inner wall of the protrusion exposed from the cut portion of at least one of the protrusions formed in the above, or a part of the surface of the package section including a step of peeling off the protective film by grasping and pulling up the protective film in a second gap exposed on the side surface of the electronic component surrounded by the formed stepped portion and the protective film. characterized by

In the electronic component of the present invention, since the opening of the electronic component is covered with a protective film, even if outgas is generated from flux or the like due to high-temperature processing when the electronic component is mounted on the mounting substrate, the sensor element or the like is exposed to the outgas. Therefore, the performance of the chip component is not degraded. In addition, since the size of the protective film attached to the electronic component of the present invention is approximately the same as the size of the electronic component, no special-shaped storage container is required and production costs do not increase.

Further, according to the method for manufacturing an electronic component of the present invention, a protective film can be applied collectively to the surface of an electronic component assembly composed of a plurality of electronic components, so that a highly productive manufacturing method can be realized. becomes.

Furthermore, even if a singulation method using a dicing saw, for example, is employed when singulating an assembly of electronic components, since the openings are covered with a protective film, cutting debris generated during singulation and It is possible to prevent water or the like from entering the inside of the electronic component through the opening, and it is possible to realize a manufacturing method that does not deteriorate the quality of the electronic component.

Furthermore, according to the mounting method of the electronic component of the present invention, since there is a gap opening to the side between the surface of the electronic component and the protective film attached to the surface of the electronic component, for example, the tip of the tweezers can reliably protect the electronic component. The protective film can be easily removed by gripping the film and pulling it up. As a result, there is no need to use a long protective film as in the conventional example, a general-purpose storage container can be used, and production costs do not increase.

It is a figure explaining the electronic component of the 1st Example of this invention. It is a figure explaining the manufacturing method of the electronic component of 1st Example of this invention. It is a figure explaining the manufacturing method of the electronic component of 1st Example of this invention. It is a figure explaining the manufacturing method of the electronic component of 1st Example of this invention. It is a figure explaining the electronic component of the 1st Example of this invention. It is a figure explaining the mounting method of the electronic component of the 1st Example of this invention. It is a figure explaining the electronic component of the 2nd Example of this invention. It is a figure explaining the manufacturing method of the electronic component of the 2nd Example of this invention. It is a figure explaining the manufacturing method of the electronic component of the 2nd Example of this invention. It is a figure explaining the electronic component of the 2nd Example of this invention. It is a figure explaining the conventional electronic component.

According to the present invention, when an electronic component having an opening is mounted on a mounting substrate, by covering the opening of the electronic component with a protective film, it is possible to reliably prevent the influence of outgassing emitted from flux or the like. Furthermore, by providing a gap between the protective film and the electronic component by means of the projections of the protective film, the protective film can be easily peeled off from the electronic component after the electronic component is mounted on the mounting substrate. Embodiments of the present invention will now be described in detail with respect to structures, manufacturing methods, and mounting methods, taking electronic components having sensor elements such as humidity sensors and pressure sensors as examples.

First, a first embodiment of the present invention will be described.
FIG. 1 shows a cross-sectional view of an electronic component 10 of a first embodiment. The electronic component 10 has a sensor chip 5 (chip component) mounted therein. Electrode pads are formed on the surface of the sensor chip 5 and connected to leads 3 by metal wires 6 . An opening 4 is provided so that a sensor portion (not shown) of the sensor chip 5 is exposed from the sealing resin 2 . Furthermore, the protective film 1 is attached to the surface of the package where the opening 4 is provided, and the opening 4 is closed. In addition, the protective film 1 of the present invention has a shape having a plurality of independent projections 7 .

When manufacturing an electronic component having such a structure, first, as shown in FIG. 2, an electronic component assembly 11 is formed. 2(a) is a top view of the electronic component assembly 11, and FIG. 2(b) is a cross-sectional view of the electronic component assembly 11 taken along line AA' of FIG. 2(a). FIG. 2 shows an assembly of four electronic components. A sensor portion is formed on the surface of the sensor chip 5 and is exposed to the outside of the sealing resin 2 through the opening 4 . Such an opening 4 can be formed by resin sealing using a sealing mold having a convex portion corresponding to the opening.

Subsequently, as shown in FIG. 3, the protective film 1 is attached to the surface of the sealing resin 2 . The protective film 1 is a heat-resistant film made of polyimide resin or the like and has an uneven shape formed (embossed). In order to improve the adhesion between the electronic component and the protective film 1, an adhesive layer such as a silicone resin-based adhesive layer is formed on the adhesive surface of the protective film 1 in advance. However, as the adhesive layer, it is necessary to select one that does not generate outgassing during the mounting process, which will be described later. 3 shows a structure in which the protrusions 7 are not arranged above the openings 4, but if the uneven shape formed on the protective film 1 is a structure in which a plurality of independent protrusions 7 are arranged, the openings The opening 4 is closed by the protective film 1 even when the projection 7 is arranged on the opening 4 .

Next, FIG. 4 shows the step of singulating. The surface of the protective film 1 opposite to the surface in contact with the sealing resin 2 is attached to a protective tape 8 such as a dicing tape. The adhesiveness between the protective film 1 and the sealing resin 2 or the protective tape 8 can be adjusted by appropriately setting the adhesion area between the protective film 1 and the sealing resin 2 or the protective tape 8 .

Next, from the lead 3 side, a dicing saw 12 is used to cut off a part of the lead 3, the sealing resin 2 and the protective film 1, thereby singulating. In this singulation process, the openings 4 are covered with the protective film 1 and the protective tape 8, so water used for singulation, sealing resin, cutting waste generated from lead frames, etc. Intrusion into the opening 4 can be prevented. In addition to the method of using a dicing saw, a method of irradiating a laser beam or the like may be used for singulation.

FIG. 5 shows the electronic component after singulation. FIG. 5(a) shows a top view of the electronic component 10, and FIG. 5(b) shows a sectional view of the electronic component 10 taken along line BB' of FIG. 5(a). Note that illustration of the sensor chip 5 and the like is omitted.
In this embodiment, the protrusions 7 are cut in this singulation step. As a result, the cut surface of the convex portion 7 is arranged at the end portion of the electronic component 10 after singulation, and the inner wall of the convex portion 7 is exposed. A space surrounded by the inner wall of the convex portion 7 and the sealing resin 2 becomes a first gap portion 9 a that opens to the side surface of the electronic component 10 .

As shown in FIG. 5(b), the formation of the first gap 9a opening on the side surface of the electronic component 10 makes it easier to peel off the protective film 1, which will be described later. As described above, in the electronic component 10 of the present embodiment, the protective film 1 is attached to the electronic component aggregate 11, and the protective film 1 and the electronic component aggregate 11 are cut by the singulation process. The size is the same size as the electronic component 10 . For this reason, when storing in a container such as a carrier tape, for example, it is possible to use a storage container such as a carrier tape having a general shape.

Next, a mounting method for mounting the electronic component 10 with the protective film 1 attached to the surface thereof on a mounting board using solder paste or the like will be described. Solder paste is formed on the connection electrodes formed on the mounting board according to a normal manufacturing method for electronic components, and then the solder is melted using a reflow device to form a solder connection. Volatile components are released as outgas from the flux contained in the solder paste during this high temperature heat treatment. , it is possible to prevent deterioration of the performance of chip components.

Subsequently, the protective film 1 is peeled off from the electronic component 10 mounted on the mounting substrate. Since the electronic component 10 has a first gap 9a that is open on the side, the tip of, for example, tweezers 13 is inserted into the first gap 9a (FIG. 6), and the protective film 1 is gripped. The protective film 1 can be easily peeled off from the electronic component 10 by pulling it up from the electronic component 10 .

Next, a second embodiment will be described. FIG. 7 shows an electronic component 20 of a second embodiment. In the first embodiment, the first gap 9a is formed only by cutting the protective film 1, but in the second embodiment, a part of the surface of the sealing resin 2 is notched to form the second gap. It is set as the structure which forms the part 9c. By forming the second gap 9c, the protective film 1 can be peeled off more easily, and an improvement in productivity is expected.

The electronic component 20 has the sensor chip 5 mounted therein. Electrode pads are formed on the surface of the sensor chip 5 and connected to leads 3 by metal wires 6 . An opening 4 is provided so that a sensor portion (not shown) of the sensor chip 5 is exposed from the sealing resin 2 . A second gap 9 c is provided between the protective film 1 and a portion of the sealing resin 2 at the end of the electronic component 20 . Furthermore, a protective film 1 is attached to the surface side of the sealing resin 2 where the opening 4 is provided, and the opening is closed. Although the size of the second gap 9c is not particularly limited, it may be of a size that does not hinder the work of peeling off the protective film 1 .

When manufacturing electronic components having such a structure, first, as shown in FIG. 8, an electronic component assembly 21 is formed. FIG. 8(a) shows a top view of the electronic component assembly 21, and FIG. 8(b) shows a cross-sectional view of the electronic component assembly 21 taken along line CC' of FIG. 8(a). FIG. 8 shows an assembly of four electronic components. A sensor portion is formed on the surface of the sensor chip 5 and is exposed to the outside of the sealing resin 2 through the opening 4 . In addition, on the surface of the sealing resin 2, a step portion 9b is formed by notching a part of the sealing resin 2 in a concave shape. Such opening 4 and stepped portion 9b can be formed by resin sealing using a sealing mold having projections corresponding to the opening and stepped portion, respectively.

Subsequently, as shown in FIG. 9, the protective film 1 is attached to the surface of the sealing resin 2 . The protective film 1 is a heat-resistant film made of polyimide resin or the like and has an uneven shape formed (embossed), and is attached to the surface of the sealing resin 2 having the opening 4 and the stepped portion 9b. 22 is an electronic component assembly. In order to improve the adhesion between the sealing resin 2 and the protective film 1, an adhesive layer such as a silicone resin-based adhesive layer is formed on the adhesive surface of the protective film 1 in advance. However, as the adhesive layer, it is necessary to select one that does not generate outgassing during the mounting process, which will be described later. 9 shows a structure in which the protrusions 7 are not arranged above the openings 4, but the uneven shape formed on the protective film 1 is a structure in which a plurality of independent protrusions 7 are arranged. Even if the protrusion 7 is arranged on the opening 4, the opening 4 is closed by the protective film 1. As shown in FIG. As a matter of course, the opening 4 and the stepped portion 9b are not communicated with each other through the convex portion 7 either.

Subsequently, the electronic components 22 are attached to the protective tape 8 (not shown) in order to separate them into individual pieces in the same manner as in the first embodiment. The adhesiveness between the protective film 1 and the sealing resin 2 or the protective tape 8 can be adjusted by appropriately setting the adhesion area between the protective film 1 and the sealing resin 2 or the protective tape 8 .

Next, from the lead 3 side, the lead 3, the sealing resin 2 and a part of the protective film 1 are cut away by using a dicing saw to separate them (corresponding to FIG. 4). Since the openings 4 are covered with the protective film 1 and the protective tape 8 in this singulation process, the openings 4 are protected from water, sealing resin, lead frames, etc. used when singulating with a dicing saw, for example. It is possible to prevent generated chips from entering the opening.

In this embodiment, the first gap 9a is formed by cutting the projection 7 as in the first embodiment. At the same time, by cutting the stepped portion 9b by this singulation, the cut surface of the stepped portion 9b is arranged at the end portion of the electronic component 20 and the inner wall of the stepped portion 9b is exposed. A space surrounded by the inner wall of the stepped portion 9b and the protective film 1 serves as a second gap portion 9c that opens to the side surface of the electronic component 20. As shown in FIG.

FIG. 10(a) is a top view of the electronic component 20, and it can be seen that the first gap 9a and the second gap 9c are formed. FIG. 10(b) shows a cross-sectional view of the electronic component 20 along the DD' plane of FIG. 10(a) in which the first gap 9a and the second gap 9c are formed. The formation of the first gap 9a and the second gap 9c makes it easier to peel off the protective film 1, which will be described later. Thus, also in the electronic component 20 of this embodiment, the size of the protective film 1 after singulation is the same as that of the electronic component. For this reason, when storing in a container such as a carrier tape, for example, it is possible to use a storage container such as a carrier tape having a general shape.

Next, a mounting method for mounting the electronic component 20 on a mounting substrate using solder paste or the like will be described. Solder paste is formed on the lead 3 and the connection electrode portion formed on the mounting substrate according to a normal electronic component manufacturing method, and then the solder is melted using a reflow device to form a solder connection. During this high-temperature heat treatment, volatile components are released as outgas from the flux contained in the solder paste, but since the openings 4 of the electronic component 20 are covered with the protective film 1, the volatile components do not enter the openings. . Also, the volatile components entering through the second gap 9c do not cause deterioration of the sensor element, like the volatile components entering through the first gap 9a.

Subsequently, the protective film 1 is peeled off from the electronic component 20 mounted on the mounting board. Since the electronic component 20 has a first gap 9a or a second gap 9c at its end, the tip of, for example, tweezers 13 is inserted into the first gap 9a or the second gap 9c. Then, the protective film 1 can be easily peeled off from the electronic component 20 by gripping and pulling up the protective film 1 (corresponding to FIG. 6). It should be noted that the first gap 9a and the second gap 9c may be configured to open at the same location. Such a configuration also has the advantage that the height of the projection 7 can be reduced.

Although the embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to the above embodiments. For example, there are no particular restrictions on the size of the projections formed on the protective film or the arrangement of adjacent projections. The first gap 9a or the second gap 9c may be formed at one end, and the first gap 9a or the second gap 9c may be formed at a plurality of ends of the electronic component. The arrangement of the convex portions may be set as appropriate. Also, the arrangement of the convex portions may be in a grid pattern or in a zigzag pattern. Furthermore, it may be arranged irregularly.

In addition, although the case where the sensor chip is mounted inside the electronic component has been described, the present invention is not limited to this, and the electronic component has an opening formed so that the sensor chip mounted inside is exposed or communicates with it. It can be applied to parts.

1: protective film, 2: sealing resin, 3: lead, 4: opening, 5: sensor chip, 6: metal wire, 7: convex portion, 9a: first gap, 9b: stepped portion, 9c: Second gap 10: electronic component 11: electronic component assembly 12: dicing saw 20: electronic component 21: electronic component assembly 22: electronic component assembly

Claims (5)

In electronic parts with a protective film attached to the surface,
a chip component mounted inside the electronic component;
a package section having an opening through which at least part of the chip component is exposed or communicates with the outside;
The protective film that closes the opening and has a plurality of protrusions is attached to the surface of the package,
Having a first gap open to a side surface of the electronic component surrounded by the surface of the package portion and inner walls of the protrusions exposed from cut portions of the at least one protrusion formed in the protective film. An electronic component characterized by: 2. The electronic component according to claim 1, further comprising a second gap opened to a side surface of said electronic component surrounded by a stepped portion formed on a part of said package surface and said protective film. . A package section having an opening through which at least a part of the chip parts mounted inside are exposed or communicate with the outside,
A method for manufacturing an electronic component in which a protective film having a plurality of protrusions is attached to the surface of the package so as to close the opening,
By cutting the package portion and at least one convex portion of the protective film for individualization, the surface of the package portion and the inner wall of the convex portion exposed by cutting the convex portion are obtained for each electronic component. A method of manufacturing an electronic component, comprising a step of forming a first gap surrounded by . Each electronic component is formed by forming a concave portion on the surface of the package portion, attaching the protective film to the surface of the package portion on which the concave portion is formed, and cutting the concave portion and the protective film for singulation. 4. The method of manufacturing an electronic component according to claim 3, further comprising the step of forming a second gap surrounded by the stepped portion and the protective film. A package portion having an opening through which at least a portion of the chip component is exposed or communicates with the outside,
A mounting method for mounting, on a mounting substrate, an electronic component to which a protective film having a plurality of protrusions is attached so as to close the opening on the surface of the package, the method comprising:
After the electronic component is mounted on the mounting substrate, when the protective film is peeled off, the inner wall of the convex portion exposed from the cut portion of at least one of the convex portions formed on the protective film and the surface of the package portion A first gap that opens to the side of the enclosed electronic component, or a step that is formed on a part of the surface of the package section and the protective film to expose the side of the electronic component that is enclosed. 2. A mounting method for an electronic component, comprising a step of peeling off the protective film by gripping the protective film in the gap and then lifting the protective film.

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