JP7175679B2 - ultrasonic probe - Google Patents

Description

Embodiments of the present invention relate to ultrasound probes .

As an ultrasonic probe, a 2D array probe (two dimensional array probe) having a plurality of transducer elements and a large scale integrated circuit (LSI (Large Scale Integration)) is used to create an ultrasonic image that visualizes the internal state of the subject. There are ultrasound machines that generate Large scale integrated circuits are provided with various electronic circuits.

Japanese Patent Application Laid-Open No. 2006-110140

A problem to be solved by the present invention is to provide an ultrasonic probe capable of securing a circuit area for an electronic circuit.

An ultrasound probe according to an embodiment includes a plurality of transducer elements, a first circuit, and a second circuit. The plurality of transducer elements transmit and/or receive ultrasonic waves. The first circuit is arranged behind the plurality of vibrating elements. The first circuit is provided with an electronic circuit corresponding to each vibration element forming a first group among the plurality of vibration elements, and corresponding to each vibration element forming a second group among the plurality of vibration elements. A through silicon via is provided for A second circuit is arranged behind the first circuit. The second circuit is provided with through-silicon vias corresponding to the vibrating elements forming the first group, and electronic circuits corresponding to the vibrating elements forming the second group.

FIG. 1 is a diagram for explaining an example of the configuration of an ultrasonic diagnostic apparatus according to the first embodiment. FIG. 2 is a diagram showing an example of the configuration of the ultrasonic probe according to the first embodiment. FIG. 3 is a diagram for explaining an example of a control circuit according to the first embodiment; FIG. 4 is a diagram for explaining an example of a transmission/reception circuit according to the first embodiment; FIG. 5 is a diagram for explaining an example of a transmission/reception circuit according to the first embodiment; FIG. 6 is a diagram for explaining an example of two large scale integrated circuits according to the first embodiment. FIG. 7 is a diagram showing part of the method for manufacturing the ultrasonic probe according to the first embodiment. FIG. 8A is a diagram for explaining an example of a stacked structure of three large-scale integrated circuits according to the first embodiment; FIG. 8B is a diagram clearly showing the connection relationship in the example of FIG. 8A. FIG. 9 is a diagram showing an example in which a transmission/reception circuit and a control circuit are provided in each region of a large scale integrated circuit. FIG. 10 is a diagram showing an example of a case where a transmission/reception circuit and a control circuit are provided in each region of a large scale integrated circuit. FIG. 11 is a diagram for explaining an example of an ultrasonic probe according to a first modification of the first embodiment; 12A and 12B are diagrams showing an example of part of a method for manufacturing an ultrasonic probe according to a second modification of the first embodiment. FIG. 13A is a diagram for explaining an example of an ultrasonic probe according to a second embodiment; FIG. 13B is a diagram for explaining an example of an ultrasonic probe according to the second embodiment; FIG. 14A is a diagram for explaining an example of an ultrasonic probe according to a third embodiment; 14B is a diagram for explaining an example of an ultrasonic probe according to the third embodiment; FIG. FIG. 14C is a diagram for explaining another example of the ultrasonic probe according to the third embodiment; FIG. 14D is a diagram for explaining another example of the ultrasonic probe according to the third embodiment;

Hereinafter, each embodiment and each modification of an ultrasonic probe and a method for manufacturing an ultrasonic probe will be described in detail with reference to the accompanying drawings. In addition, each embodiment and each modification may be appropriately combined.

(First embodiment)
First, an example configuration of an ultrasonic diagnostic apparatus to which the ultrasonic probe according to the first embodiment is applied will be described. FIG. 1 is a diagram for explaining an example of the configuration of an ultrasonic diagnostic apparatus 100 according to the first embodiment. As shown in FIG. 1, an ultrasonic diagnostic apparatus 100 according to the first embodiment has an ultrasonic probe 1, a monitor 2, an input device 3, and an apparatus main body 10. As shown in FIG.

The ultrasonic probe 1 is detachably connected to the device body 10 . When ultrasonic waves are transmitted from the ultrasonic probe 1 to the subject P, the transmitted ultrasonic waves are reflected by discontinuous surfaces of acoustic impedance in the body tissue of the subject P one after another. The reflected ultrasonic waves are received by the ultrasonic probe 1 as echoes (reflected waves). For example, in the case of a 2D array probe, the ultrasonic probe 1 also has a large-scale integrated circuit, which together with the apparatus main body 10 controls and arithmetically processes transmission waves and reception waves, thereby converting them into echo signals. The amplitude of the echo signal depends on the difference in acoustic impedance at the discontinuity from which the ultrasonic waves are reflected. When the transmitted ultrasonic pulse is reflected by the moving blood flow or the surface of the heart wall, the echo signal depends on the velocity component of the moving object in the ultrasonic transmission direction due to the Doppler effect. , undergoes a frequency shift.

The monitor 2 displays a GUI (Graphical User Interface) for the user of the ultrasonic diagnostic apparatus 100 to input various setting requests using the input device 3, and displays ultrasonic images and the like generated in the apparatus main body 10. or

The input device 3 is implemented by a trackball, switch, dial, touch command screen, footswitch, joystick, or the like. The input device 3 receives various setting requests from the user of the ultrasonic diagnostic apparatus 100 and transfers the received various setting requests to the apparatus main body 10 . For example, the input device 3 receives various setting requests for controlling the ultrasonic probe 1 and transfers them to the control circuit 16 .

The device main body 10 is a device that controls transmission and reception of ultrasonic waves by the ultrasonic probe 1 and generates an ultrasonic image based on echo signals based on echoes received by the ultrasonic probe 1 . The apparatus body 10 has a transmission/reception circuit 11, a B-mode processing circuit 12, a Doppler processing circuit 13, an image generation circuit 14, a storage circuit 15, and a control circuit 16, as shown in FIG.

The transmission/reception circuit 11 is controlled by the control circuit 16 to transmit/receive various data between the ultrasonic probe 1 and the device body 10 . For example, the transceiver circuit 11 has an A/D converter and a receive beamformer. When the transmitting/receiving circuit 11 receives the echo signal for each subarray output from the ultrasonic probe 1, the A/D converter first converts the echo signal into digital data. The receive beamformer performs phasing addition processing on the digital data for each subarray to generate echo data, and transmits the generated echo data to the B-mode processing circuit 12 and the Doppler processing circuit 13 .

Further, the transmission/reception circuit 11 transmits the amplitude value of the drive signal to the ultrasonic probe 1 . Specifically, the transmitting/receiving circuit 11 transmits to each control circuit 31, which will be described later, the value of the amplitude of the drive signal output by each of the transmitting/receiving circuits 22b and 23b, which will be described later.

Further, the transmission/reception circuit 11 transmits to the ultrasonic probe 1 the delay amount for the driving signal, aperture control information, transmission/reception operation mode and timing, and the delay amount of the echo signal received by the ultrasonic probe 1 .

The B-mode processing circuit 12 receives echo data output from the transmission/reception circuit 11 . Then, the B-mode processing circuit 12 performs logarithmic amplification, envelope detection processing, and the like on the received echo data to generate data (B-mode data) in which the signal strength is represented by brightness. The B-mode processing circuit 12 is implemented by, for example, a processor.

The Doppler processing circuit 13 receives echo data output from the transmission/reception circuit 11 . Then, the Doppler processing circuit 13 frequency-analyzes velocity information from the received echo data, extracts blood flow, tissue, and contrast agent echo components due to the Doppler effect, and converts moving body information such as average velocity, variance, power, etc. into multiple points. Generate extracted data (Doppler data) for The Doppler processing circuit 13 is realized by, for example, a processor.

The image generation circuit 14 generates an ultrasound image from the data generated by the B-mode processing circuit 12 and the Doppler processing circuit 13 . That is, the image generation circuit 14 generates a B-mode image representing the intensity of the echo in luminance from the B-mode data generated by the B-mode processing circuit 12 . Further, the image generating circuit 14 generates an average velocity image, a variance image, a power image, or a color Doppler image as a combination of these images representing moving body information from the Doppler data generated by the Doppler processing circuit 13 . The image generation circuit 14 is implemented by, for example, a processor.

The storage circuit 15 is implemented by, for example, a RAM (Random Access Memory), a semiconductor memory device such as a flash memory, a hard disk, an optical disk, or the like. For example, the storage circuit 15 stores ultrasound images generated by the image generation circuit 14 . The storage circuit 15 may also store data generated by the B-mode processing circuit 12 and the Doppler processing circuit 13 .

The storage circuit 15 stores control programs for transmitting and receiving ultrasonic waves, image processing, and display processing, diagnostic information (for example, patient ID, doctor's findings, etc.), various data such as diagnostic protocols and various body marks. Remember.

The control circuit 16 controls the entire processing of the ultrasonic diagnostic apparatus 100 . For example, the control circuit 16 controls the large-scale integrated circuit in the ultrasonic probe 1 based on various setting requests input by the operator via the input device 3, and various control programs and various data read from the storage circuit 15. , the transmission/reception circuit 11 , the B-mode processing circuit 12 , the Doppler processing circuit 13 and the image generation circuit 14 . Further, the control circuit 16 stores an ultrasound image stored in the storage circuit 15, various images stored in the storage circuit 15, a GUI for performing processing by the image generation circuit 14, processing results of the image generation circuit 14, and the like. It is controlled to display on the monitor 2.

For example, the control circuit 16 controls the transmission/reception circuit 11 so as to transmit the amplitude value of the driving signal to the ultrasonic probe 1 . Specifically, the control circuit 16 controls the transmission/reception circuit 11 so as to output the amplitude value of the drive signal to each control circuit 31 described later.

Further, the control circuit 16 controls the transmission/reception circuit 11 so as to transmit the delay amount for the drive signal and the delay amount for the echo signal to the ultrasonic probe 1 . The control circuit 16 is implemented by, for example, a processor.

In addition, the term "processor" used in the above description includes, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an application specific integrated circuit (ASIC), a programmable logic device ( For example, it means circuits such as Simple Programmable Logic Device (SPLD), Complex Programmable Logic Device (CPLD), and Field Programmable Gate Array (FPGA). The processor reads a program stored in the storage circuit 15 and executes the read program to realize its function. Instead of storing the program in the memory circuit 15, the program may be directly incorporated into the circuit of the processor. In this case, the processor reads the program embedded in the circuit and executes the read program to realize the function. Note that each processor of the present embodiment is not limited to being configured as a single circuit for each processor, and may be configured as one processor by combining a plurality of independent circuits to realize its function. good.

An example of the configuration of the ultrasonic diagnostic apparatus 100 according to the first embodiment has been described above. As will be described below, the ultrasonic probe 1 according to the first embodiment is configured such that the area (circuit area) of the electronic circuit incorporated in the ultrasonic probe 1 is sufficiently secured.

FIG. 2 is a diagram showing an example of the configuration of the ultrasonic probe 1 according to the first embodiment. As shown in FIG. 2, the ultrasonic probe 1 has a plurality of transducer elements (acoustic elements) 20, three large-scale integrated circuits 21 to 23, and a relay board 24. FIG.

The plurality of transducer elements 20 transmit ultrasonic waves and receive ultrasonic echoes.

The plurality of vibration elements 20 are two-dimensionally arranged. For example, the multiple vibration elements 20 are arranged along the X-axis and the Y-axis orthogonal to the X-axis. Here, the X-axis direction corresponds to the lateral direction, and the Y-axis direction corresponds to the elevation direction. That is, the plurality of vibration elements 20 are arranged in the lateral direction and the elevation direction.

The vibration element 20 generates ultrasonic waves based on the supplied drive signal. The transducer element 20 receives echoes from the subject P and converts the received echoes into echo signals (reflected wave signals) that are electrical signals.

For example, a plurality of vibration elements 20 shown in FIG. 2 constitute a main array 20a. FIG. 2 shows a case where 16 vibration elements 20 constitute the main array 20a, but the number of vibration elements 20 constituting the main array 20a is not limited to this. The main array 20a is divided into a plurality of sub-arrays 20b in the X-axis direction and the Y-axis direction. Note that the sub-array 20b refers to, for example, the arrangement of the vibration elements 20 belonging to each group when the plurality of vibration elements 20 are divided into groups each having a predetermined number of vibration elements 20 . One subarray 20b is composed of a predetermined number of vibration elements 20 two-dimensionally arranged in the X-axis direction and the Y-axis direction. For example, the number of vibration elements 20 constituting the plurality of sub-arrays 20b is 4 (2×2).

In the first embodiment, the plurality of vibrating elements 20 are divided into vibrating elements 20 forming a first group and vibrating elements 20 forming a second group. The vibration elements 20 forming the first group and the vibration elements 20 forming the second group will be described later.

As shown in FIG. 2, three large-scale integrated circuits 21 to 23 are arranged in the order of large-scale integrated circuit 23, large-scale integrated circuit 22, and large-scale integrated circuit 21 from the vibrating element 20 side. That is, the large-scale integrated circuit 23 is arranged behind the plurality of vibration elements 20 . Also, the large scale integrated circuit 22 is arranged behind the large scale integrated circuit 23 . Also, the large-scale integrated circuit 21 is arranged behind the large-scale integrated circuit 22 . The large scale integrated circuit 23 is an example of the first circuit. Also, the large scale integrated circuit 22 is an example of a second circuit.

In the large-scale integrated circuit 21, each region 21a delimited by broken lines corresponds to one vibrating element 20 directly above. Similarly, in the large-scale integrated circuits 22 and 23, regions 22a and 23a delimited by dashed lines also correspond to one vibrating element 20 directly above.

For example, a region 21a_1 shown in FIG. 2 is a region corresponding to the directly above vibration element 20_1. Here, in FIG. 2, the area 21a_1 is the third area from the left side in the X-axis direction and the first area from the front side in the Y-axis direction among the 16 (4×4) areas 21a. Further, the vibration element 20_1 is the third vibration element from the left side in the Y-axis direction and the first vibration element from the front side in the Y-axis direction among the 16 (4×4) vibration elements 20 .

A region 21a_2 shown in FIG. 2 is a region corresponding to the vibration element 20_2 immediately above. Here, in FIG. 2, the region 21a_2 is the fourth region from the left side in the X-axis direction and the first region from the front side in the Y-axis direction among the 16 regions 21a. Further, the vibration element 20_2 is the fourth vibration element from the left side in the X-axis direction and the first vibration element from the front side in the Y-axis direction among the 16 vibration elements 20 .

Similarly, a region 22a_1 shown in FIG. 2 is a region corresponding to the directly above vibration element 20_1. Here, in FIG. 2, the area 22a_1 is the third area from the left side in the X-axis direction and the first area from the front side in the Y-axis direction among the 16 (4×4) areas 22a.

A region 22a_2 shown in FIG. 2 is a region corresponding to the vibration element 20_2 immediately above. Here, in FIG. 2, the region 22a_2 is the fourth region from the left side in the X-axis direction and the first region from the front side in the Y-axis direction among the 16 regions 22a.

A region 23a_1 shown in FIG. 2 is a region corresponding to the vibration element 20_1 immediately above. Here, in FIG. 2, the area 23a_1 is the third area from the left side in the X-axis direction and the first area from the front side in the Y-axis direction among the 16 (4×4) areas 23a.

A region 23a_2 shown in FIG. 2 is a region corresponding to the vibration element 20_2 directly above. Here, in FIG. 2, the region 23a_2 is the fourth region from the left side in the X-axis direction and the first region from the front side in the Y-axis direction among the 16 regions 23a.

The large scale integrated circuit 21 will be explained. Each region 21a of the large-scale integrated circuit 21 is provided with a control circuit. FIG. 3 is a diagram for explaining an example of the control circuit 31 according to the first embodiment. As shown in FIG. 3, for example, the region 21a_1 is provided with a control circuit 31 that controls a transmission/reception circuit 23b_1, which will be described later. A control circuit 31 for controlling a transmission/reception circuit 22b_1, which will be described later, is provided in the area 21a_2.

Note that the control circuit 31 provided in the region 21a_1 is referred to as "control circuit 31a". Also, the control circuit 31 provided in the region 21a_2 is referred to as "control circuit 31b".

Similarly, in the other areas 21a (the other 14 areas 21a), a control circuit 31 is provided for controlling a transmission/reception circuit 22b or a transmission/reception circuit 23b, which will be described later.

In the first embodiment, one channel is assigned to one vibration element 20, and one control circuit 31 and one transmission/reception circuit 22b or transmission/reception circuit 23b, which will be described later, are provided for each channel. . In the first embodiment, a plurality of (four in FIG. 2) corresponding control circuits 31 are connected to one sub-array 20b described above.

For example, the control circuit 31 has a register. When the control circuit 31 receives the amplitude value of the drive signal output from the transmission/reception circuit 11, it stores the received amplitude value in the register. Further, when the control circuit 31 receives the delay amount for the drive signal output from the transmission/reception circuit 11, the control circuit 31 stores the received delay amount for the drive signal in the register. When the control circuit 31 receives the delay amount for the echo signal output from the transmission/reception circuit 11, the control circuit 31 stores the received delay amount for the echo signal in the register.

Then, the control circuit 31 reads the amplitude value, the delay amount for the drive signal, and the delay amount for the echo signal from the register. Then, the control circuit 31 outputs a control signal indicating the read amplitude value, the amount of delay with respect to the driving signal, and the amount of delay with respect to the echo signal to the transmitting/receiving circuit 22b or the transmitting/receiving circuit 23b.

Here, one control circuit 31 among the plurality of control circuits 31 corresponding to one subarray 20b has an adder (reception beamformer). Note that the control circuit 31 having such an adder is also called a representative control circuit 31 .

The adder collects a plurality of echo signals output from a plurality of transmitting/receiving circuits 22b and 23b (to be described later) corresponding to one subarray 20b. A plurality of echo signals collected by the adder are echo signals that have undergone delay processing. The adder then performs addition processing to add the multiple echo signals. Then, the adder outputs the echo signal on which the addition processing has been performed to the device main body 10 . The addition processing using the echo signal emphasizes the reflection component from the direction corresponding to the reception directivity of the echo signal. This function in ultrasound probe 1 is sometimes referred to as a subarray beamformer because it operates on channels in subarray 20b.

In FIGS. 2 and 3, white circles in each region 21a schematically show conductors connecting the control circuit 31 provided in each region 21a and the large-scale integrated circuit 22, for example. is. In the first embodiment, for example, terminals or the like are used as such conductors. In this case, the control circuit 31 provided in each region 21a is connected to the large-scale integrated circuit 22 via terminals or the like.

In the large-scale integrated circuit 22, transmission/reception circuits are provided across a predetermined number of regions 22a. FIG. 4 is a diagram for explaining an example of the transmission/reception circuit 22b according to the first embodiment. As shown in FIG. 4, for example, a transmission/reception circuit 22b is provided across two regions 22a_1 and 22a_2 adjacent in the X-axis direction. The transmitting/receiving circuit 22b provided across the regions 22a_1 and 22a_2 is referred to as "transmitting/receiving circuit 22b_1". The transmission/reception circuit 22b_1 drives the transducer 20_2 and receives echo signals from the transducer 20_2. The transmitting/receiving circuit 22b is an example of an electronic circuit.

Similarly, in the large-scale integrated circuit 22, the transmission/reception circuits 22b are provided across two regions 22a adjacent to each other in the X-axis direction in the other regions 22a. This transmitting/receiving circuit 22b drives one transducer 20 and receives an echo signal from this transducer 20 . In the large-scale integrated circuit 22 shown in FIGS. 2 and 4, eight transmission/reception circuits 22b corresponding to eight vibration elements 20 among the sixteen vibration elements 20 are provided.

The transmitting/receiving circuit 22b includes analog circuits such as a pulser circuit, a delay circuit and an amplifier. The pulsar circuit repeatedly generates rate pulses for forming transmitted ultrasonic waves at a predetermined rate frequency (PRF: Pulse Repetition Frequency). The pulsar circuit then outputs the generated rate pulse as a drive signal for driving the vibrating element 20 . Here, the magnitude of the amplitude of the drive signal output from the pulser circuit is indicated by the control signal output from the control circuit 31 .

The delay circuit has a function of performing predetermined delay processing on the drive signal output from the pulser circuit and outputting the drive signal subjected to the predetermined delay processing to the vibration element 20 . For example, the delay circuit is controlled by the control circuit 31 to focus the ultrasonic waves generated from the transducers 20 into a beam and determine the transmission directivity for each transducer 20. A delay process is applied to the drive signal supplied from the pulsar circuit. Here, the delay amount given to the drive signal is indicated by the control signal output from the control circuit 31 .

The pulsar circuit and the delay circuit are circuits that drive at least one vibrating element 20 . A pulser circuit and a delay circuit are examples of a drive circuit.

The amplifier is, for example, an amplifier. The amplifier has a function of, upon receiving an echo signal from the transducer element 20, amplifying the received echo signal with a preset gain and outputting the amplified echo signal to the delay circuit.

Here, in addition to the functions described above, the delay circuit, when receiving the echo signal output from the amplifier, performs delay processing to give the received echo signal a delay amount necessary to determine the reception directivity. It has a function of outputting to the control circuit 31 an echo signal on which delay processing has been executed. Here, the delay amount given to the echo signal is the delay amount indicated by the control signal output from the control circuit 31 .

An amplifier and delay circuit processes echo signals generated by at least one transducer element 20 . Amplifiers and delay circuits are examples of signal processing circuits. That is, the delay circuit is an example of the driving circuit and also an example of the signal processing circuit.

In the large-scale integrated circuit 23, eight transmitting/receiving circuits corresponding to the remaining eight vibrating elements 20 (the vibrating elements 20 not connected to the transmitting/receiving circuit 22b) are provided. In the large-scale integrated circuit 23, transmission/reception circuits are provided across a predetermined number of regions 23a. FIG. 5 is a diagram for explaining an example of the transmission/reception circuit 23b according to the first embodiment. As shown in FIG. 5, for example, a transmission/reception circuit 23b is provided across two regions 23a_1 and 23a_2 that are adjacent in the X-axis direction. The transmitting/receiving circuit 23b is an example of an electronic circuit.

The transmitting/receiving circuit 23b provided across the regions 23a_1 and 23a_2 is referred to as "transmitting/receiving circuit 23b_1". The transmission/reception circuit 23b_1 drives the transducer 20_1 and receives an echo signal from the transducer 20_1.

The transmitting/receiving circuit 23b includes analog circuits similar to those of the transmitting/receiving circuit 22b described above, such as a pulser circuit, a delay circuit, and an amplifier.

Similarly, in the large-scale integrated circuit 23, the transmission/reception circuit 23b is provided across two adjacent regions 23a in the X-axis direction in the other region 23a. The transmitting/receiving circuit 23b drives one transducer 20 and receives an echo signal from the transducer 20. FIG.

2 and 4, white circles in each region 22a schematically show conductors connecting the large scale integrated circuit 21 and the large scale integrated circuit 23, for example. In the first embodiment, for example, terminals, TSVs (Through Silicon Via), and the like are used as such conductors. In this case, the large-scale integrated circuit 21 and the large-scale integrated circuit 23 are connected via terminals, TSVs, and the like in a region 22a marked with a white circle. For example, in a region 22a marked with a white circle, a region 21a immediately below and a region 23a directly above are connected via terminals, TSVs, and the like.

In addition, in FIGS. 2 and 4, the black circles described in each area 22a indicate, for example, the transmitting/receiving circuit 22b provided in each area 22a described with the black circle, the control circuit 31 immediately below, and the area 23a directly above. The conductors to be connected are shown schematically. In the first embodiment, for example, terminals and TSVs are used as such conductors. In this case, in the area 22a marked with a black circle, the transmitting/receiving circuit 22b is connected to the control circuit 31 directly below via TSV and the like, and is connected to the area 23a directly above via terminals and the like.

In addition, in FIGS. 2 and 5, white circles in each region 23a schematically show conductors connecting the large-scale integrated circuit 22 and the vibration element 20, for example. In the first embodiment, for example, terminals and TSVs are used as such conductors. In this case, in the region 23a marked with a white circle, the region 22a directly below and the vibration element 20 directly above are connected via terminals, TSVs, and the like. Specifically, in the region 23a marked with a white circle, the region 22a directly below and the vibration element 20 directly above are connected via the relay board 24 in addition to the terminals, TSVs, and the like.

In addition, in FIGS. 2 and 5, the black circles described in each area 23a indicate, for example, the transmitting/receiving circuit 23b provided in each area 23a described with the black circle, the area 22a immediately below, and the vibration element 20 directly above. The conductors to be connected are shown schematically. In the first embodiment, for example, terminals and TSVs are used as such conductors. In this case, in the region 23a marked with a black circle, the transmitting/receiving circuit 23b is connected to the region 22a immediately below via a TSV or the like, and is also connected to the vibration element 20 directly above via a terminal or the like. Specifically, the transmitting/receiving circuit 23b is connected to the vibration element 20 directly above via the relay board 24 in addition to the terminals and the like.

The relay board 24 is a board that relays the connection between the terminals on the region 23 a and the vibration element 20 . A relay substrate 24 is arranged between the vibration element 20 and the large scale integrated circuit 23 . The relay board 24 connects the vibrating element 20 and the large-scale integrated circuit 20 via wiring in the relay board 24 . Here, by adjusting the pitch between the wirings in the relay board 24, the difference between the pitch (interval) between the transmitting/receiving circuits 22b and 23b in the XY plane and the pitch between the vibration elements 20 in the XY plane is absorbed. be able to. With such a relay board 24, the pitch between the vibration elements 20 can be narrower than the pitch between the transmission/reception circuits 22b and 23b. Therefore, the vibration elements 20 can be arranged on the relay board 24 at high density.

The relay substrate 24 is realized by, for example, a silicon substrate or a ceramics substrate. Instead of the relay board 24, FPCs (Flexible Printed Circuits) having similar functions may be used. Further, the vibration element 20 and the terminals on the area 23a may be connected without using the relay board 24. FIG.

FIG. 6 is a diagram for explaining an example of two large scale integrated circuits 22 and 23 according to the first embodiment. Here, in the first embodiment, the two large scale integrated circuits 22 and 23 are the same large scale integrated circuit. For example, the two large scale integrated circuits 22 and 23 are the large scale integrated circuits shown in FIG. Large scale integrated circuits 22, 23 have a center point 25 in the XY plane. When the large-scale integrated circuits 22 and 23 are rotated 180 degrees around the rotation axis that passes through the center point 25 and is orthogonal to the X-axis direction and the Y-axis direction, the positional relationship between the previously described black circles and white circles is , the relationship is as follows. For example, the positional relationship between the black circle and the white circle is such that, on the XY plane, the position of the black circle after rotation matches the position of the white circle before rotation, and the position of the white circle after rotation matches the position of the black circle before rotation. a matching relationship.

FIG. 7 is a diagram showing an example of part of the method for manufacturing the ultrasonic probe 1 according to the first embodiment. In the ultrasonic probe 1 according to the first embodiment, after arranging the two large-scale integrated circuits 22 and 23 in the same direction, as shown in the center of FIG. The large-scale integrated circuit 23 is rotated 180 degrees as indicated by an arrow 26 about a rotation axis 25a that passes through the center point 25 and is perpendicular to the X-axis direction and the Y-axis direction. Then, the large-scale integrated circuit 23 rotated by 180 degrees is arranged on the large-scale integrated circuit 22 .

That is, the large-scale integrated circuit 23 is arranged in a predetermined orientation on the back side of the plurality of vibration elements 20, and the large-scale integrated circuit 22 is arranged in an orientation different from the predetermined orientation on the back side of the large-scale integrated circuit 23. Deploy. Thus, the large-scale integrated circuit 22 and the large-scale integrated circuit 23 are the same large-scale integrated circuit, but are arranged in different directions. Therefore, according to the first embodiment, when manufacturing the large-scale integrated circuit 22 and the large-scale integrated circuit 23, it is sufficient to manufacture the same large-scale integrated circuit instead of multiple types of large-scale integrated circuits. , the manufacturing cost can be reduced. The predetermined orientation is an example of a first orientation, and the orientation different from the predetermined orientation is an example of a second orientation.

Reference numerals “41” to “48” shown in FIG. 7 refer to the above-described black circles described in the area 22a. Reference numerals "51" to "58" refer to the black circles described above in the area 23a.

In FIG. 7, the hatched areas 22a_1 and 22a_2 correspond to the hatched areas 23a_3 and 23a_4.

"NM", which is shown on the right side of FIG. In the shown large-scale integrated circuit, the region 22a or 23a indicated by the black circle indicated by the symbol "M" is provided with the conductor indicated by the black circle indicated by the symbol "M". For example, if "N" is "1" then "N" indicates large scale integrated circuit 22 and if "N" is "2" then "N" indicates large scale integrated circuit 23. show. For example, "2-51" indicates that a conductor such as a TSV connected to the transmitting/receiving circuit 23b is provided in the region 23a indicated by the black circle indicated by the code "51" in the large-scale integrated circuit 23. . "1-47" indicates that in the large-scale integrated circuit 22, a conductor such as a TSV connected to the transmitting/receiving circuit 22b is provided in the area 22a indicated by the black circle indicated by the code "47".

In the first embodiment, as shown on the right side of FIG. 7, the regions (eight regions 22a and eight regions 23a) corresponding to all the transducer elements 20 are connected to the transmission/reception circuits 22b or 23b. conductors are provided. That is, each of all the vibration elements 20 is connected to the transmission/reception circuit 22b or the transmission/reception circuit 23b. Note that not all the transducer elements 20 need to be connected to the transmission/reception circuit 22b or the transmission/reception circuit 23b. For example, the transmitting/receiving circuit 22b may be connected to at least one of the multiple transducers 20 . Similarly, the transmitting/receiving circuit 23b may be connected to at least one of the multiple transducers 20 .

Here, in the first embodiment, the vibration elements 20 forming the first group described above are connected to the transmission/reception circuit 23b, and are supplied with drive signals from the transmission/reception circuit 23b. Further, the vibration elements 20 constituting the second group described above are connected to the transmission/reception circuit 22b, and are supplied with drive signals from the transmission/reception circuit 22b. That is, the vibration elements 20 forming the first group correspond to the transmission/reception circuit 23b, and the vibration elements 20 forming the second group correspond to the transmission/reception circuit 22b.

FIG. 8A is a diagram for explaining an example of a laminated structure of three large scale integrated circuits 21 to 23 according to the first embodiment. Note that FIG. 8A is a cross-sectional view of a portion corresponding to the regions 21a_1, 21a_2, 22a_1, 22a_2, 23a_1, and 23a_2 described above.

As shown in the example of FIG. 8A, the large scale integrated circuit 21 has a transistor layer 61, a metal multilayer wiring layer 62 and a rewiring layer 63. In FIG. The transistor layer 61, the metal multilayer wiring layer 62 and the rewiring layer 63 are laminated in this order. The example of FIG. 8A is an example of one cross section, and in fact, the transistor layer 61, the metal multilayer wiring layer 62 and the rewiring layer 63 are also present in the depth direction, and circuits and wirings required for operation are formed.

A transistor layer 61 is formed on the surface of a silicon substrate 60 . Transistors 61 a to 61 d are formed in the transistor layer 61 . The transistor 61a and the transistor 61b are elements forming the control circuit 31a described above. The transistor 61c and the transistor 61d are elements forming the control circuit 31b described above.

The metal multilayer wiring layer 62 is formed with a laminated structure of a plurality of insulating layers and a plurality of wirings (metals). In the following description, a plurality of laminated wirings will be simply referred to as "wirings". Wirings 62 a to 62 d are formed in the metal multilayer wiring layer 62 . The wiring 62a is connected to the transistors 61a and 61b. The wiring 62b is connected to the transistors 61c and 61d.

The wiring 62c is connected to the transistor 61b, and the wiring 62d is connected to the transistor 61d. Although not shown in FIG. 8A, in the metal multilayer wiring layer 62, the wiring 62c and the wiring 62d are connected. Therefore, echo signals can be transmitted and received between the control circuit 31a and the control circuit 31b. For example, when the control circuit 31a is the representative control circuit described above, the control circuit 31a can receive an echo signal to be added from the control circuit 31b.

Wirings 63 a and 63 b are formed in the rewiring layer 63 . The wiring 63a is connected to the wiring 62a. The wiring 63b is connected to the wiring 62b.

The terminals 64a, 64b are formed by metal pads, electrodes or bumps. The terminal 64a is connected to the wiring 63a. The terminal 64b is connected to the wiring 63b.

Therefore, the transistor 61a and the transistor 61b are connected to the terminal 64a through the wiring 63a and the wiring 62a. The transistors 61c and 61d are connected to a terminal 64b through wirings 63b and 62b. Therefore, the control circuit 31a is connected to the terminal 64a, and the control circuit 31b is connected to the terminal 64b.

The large-scale integrated circuit 21 has a similar configuration for the regions 21a other than the regions 21a_1 and 21a_2.

The large scale integrated circuit 22 has a transistor layer 66 , a metal multilayer wiring layer 67 and a rewiring layer 68 . The transistor layer 66, the metal multilayer wiring layer 67 and the rewiring layer 68 are laminated in this order.

A transistor layer 66 is formed on the surface of a silicon substrate 65 . Transistors 66 a and 66 b are formed in the transistor layer 66 . The transistor 66a and the transistor 66b are elements forming the transmission/reception circuit 22b_1 described above. The example of FIG. 8A is an example of one cross section, and in fact, the transistor layer 66, the metal multilayer wiring layer 67 and the rewiring layer 68 are also present in the depth direction, and circuits and wirings required for operation are formed.

Further, the silicon substrate 65 is formed with a TSV 70a penetrating through the silicon substrate 65 at a position corresponding to the terminal 64a. Further, the silicon substrate 65 is formed with a TSV 70b penetrating through the silicon substrate 65 at a position corresponding to the terminal 64b.

The TSV 70a is connected to the terminal 64a. TSV 70b is connected to terminal 64b.

The metal multilayer wiring layer 67 is formed with a laminated structure of a plurality of insulating layers and a plurality of wirings. Wirings 67 a to 67 d are formed in the metal multilayer wiring layer 67 . The wiring 67a is connected to the TSV 70a.

The wiring 67b is connected to the transistor 66a. The wiring 67c is connected to the transistors 66a and 66b. The wiring 67d is connected to the transistor 66b and the TSV 70b, and connected as a controllable configuration by the control circuit 31b in the large scale integrated circuit 21. FIG.

Wirings 68 a and 68 b are formed in the rewiring layer 68 . The wiring 68a is connected to the wiring 67a. The wiring 68b is connected to the wiring 67b.

Terminals 69a and 69b are formed by metal pads, electrodes or bumps. The terminal 69a is connected to the wiring 68a. The terminal 69b is connected to the wiring 68b.

Therefore, the terminal 69a is connected to the terminal 64a and to the control circuit 31a in the large scale integrated circuit 21 via the wiring 68a, the wiring 67a and the TSV 70a. Also, the terminal 69b is connected to the terminal 64b via the wiring 68b, the wiring 67b, the transistor 66a, the wiring 67c, the transistor 66b, the wiring 67d, and the TSV 70b. Therefore, the transmission/reception circuit 22b_1 is connected to the terminals 69b and 64b.

The large-scale integrated circuit 22 has a similar configuration for the regions 22a other than the regions 22a_1 and 22a_2.

The large scale integrated circuit 23 has a transistor layer 72 , a metal multilayer wiring layer 73 and a rewiring layer 74 . The transistor layer 72, the metal multilayer wiring layer 73 and the rewiring layer 74 are laminated in this order.

The transistor layer 72 is formed on the surface of the silicon substrate 71 . Transistors 72 a and 72 b are formed in the transistor layer 72 . The transistor 72a and the transistor 72b are elements that constitute the transmission/reception circuit 23b_1 described above. The example of FIG. 8A is an example of one cross section, and in fact the transistor layer 72, the metal multilayer wiring layer 73 and the rewiring layer 74 are also present in the depth direction, and circuits and wirings necessary for operation are formed.

Further, the silicon substrate 71 is formed with a TSV 76a penetrating through the silicon substrate 71 at a position corresponding to the terminal 69a. Further, the silicon substrate 71 is formed with a TSV 76b penetrating through the silicon substrate 71 at a position corresponding to the terminal 69b.

The TSV 76a is connected to the terminal 69a. TSV 76b is connected to terminal 69b.

The metal multilayer wiring layer 73 is formed with a laminated structure of a plurality of insulating layers and a plurality of wirings. Wirings 73 a to 73 d are formed in the metal multilayer wiring layer 73 .

The wiring 73a is connected to the transistor 72b. The wiring 73b is connected to the transistors 72a and 72b. The wiring 73c is connected to the transistor 72a and the TSV 76a so as to be controllable by the control circuit 31a in the large scale integrated circuit 21. FIG. The wiring 73d is connected to the TSV 76b.

Wirings 74 a and 74 b are formed in the rewiring layer 74 . The wiring 74a is connected to the wiring 73a. The wiring 74b is connected to the wiring 73d.

The terminals 75a and 75b are formed by metal pads, electrodes or bumps. The terminal 75a is connected to the wiring 74a. The terminal 75b is connected to the wiring 74b.

Therefore, the terminal 75a is connected to the terminal 69a via the wiring 74a, the wiring 73a, the transistor 72b, the wiring 73b, the transistor 72a, the wiring 73c and the TSV 76a. Therefore, the transmission/reception circuit 23b_1 is connected to the terminals 75a and 69a. Also, the terminal 75b is connected to the terminal 69b via the wiring 74a, the wiring 73d and the TSV 76b.

The terminal 75a is connected to the vibration element 20_1 through the relay board 24. As shown in FIG. In addition, the terminal 75b is connected to the vibration element 20_2 through the relay board 24. As shown in FIG.

The large-scale integrated circuit 23 has a similar configuration for the regions 23a other than the regions 23a_1 and 23a_2.

FIG. 8B is a diagram clearly showing the connection relationship in FIG. 8A. With the above configuration, the transmitting/receiving circuit 23b_1 and the vibration element 20_1 (see FIG. 2) are connected as indicated by a portion (first portion) hatched with oblique lines descending toward the right in FIG. 8B. For example, the transmission/reception circuit 23b_1 outputs a drive signal to the vibration element 20_1 via the wiring 73a, the wiring 74a, the terminal 75a, and the relay board 24 (see FIG. 2). Also, the vibration element 20_1 outputs an echo signal to the transmission/reception circuit 23b_1 via the relay substrate 24, the terminal 75a, the wiring 74a, and the wiring 73a.

Also, as shown in the first part, the control circuit 31a and the transmission/reception circuit 23b_1 are connected. For example, the control circuit 31a outputs a control signal to the transmission/reception circuit 23b_1 via the wiring 62a, the wiring 63a, the terminal 64a, the TSV 70a, the wiring 67a, the wiring 68a, the terminal 69a, the TSV 76a, and the wiring 73c. Further, the transmission/reception circuit 23b_1 outputs an echo signal to the control circuit 31a through the wiring 73c, the TSV 76a, the terminal 69a, the wiring 68a, the wiring 67a, the TSV 70a, the terminal 64a, the wiring 63a, and the wiring 62a.

Further, as indicated by a portion (second portion) hatched with oblique lines descending toward the left in FIG. 8B, the transmitting/receiving circuit 22b_1 and the vibration element 20_2 (see FIG. 2) are connected. For example, the transmission/reception circuit 22b_1 outputs a drive signal to the vibration element 20_2 via the wiring 67b, the wiring 68b, the terminal 69b, the TSV 76b, the wiring 73d, the wiring 74b, the terminal 75b, and the relay board 24. Also, the transducer 20_2 outputs an echo signal to the transmission/reception circuit 22b_1 via the relay board 24, the terminal 75b, the wiring 74b, the wiring 73d, the TSV 76b, the terminal 69b, the wiring 68b, and the wiring 67b.

Also, as shown in the second portion, the control circuit 31b and the transmission/reception circuit 22b_1 are connected. For example, the control circuit 31b outputs a control signal to the transmission/reception circuit 22b_1 via the wiring 62b, the wiring 63b, the terminal 64b, the TSV 70b, and the wiring 67d. Also, the transmission/reception circuit 22b_1 outputs an echo signal to the control circuit 31b via the wiring 67d, the TSV 70b, the terminal 64b, the wiring 63b, and the wiring 62b.

Here, the terminal 64a, the wiring 63a and the wiring 62a, and the terminal 64b, the wiring 63b and the wiring 62b correspond to the white circles described in each area 21a in FIGS.

Also, the terminal 69a, the wiring 68a, the wiring 67a, and the TSV 70a correspond to the white circles described in the area 22a in FIGS. Also, the terminal 69b, the wiring 68b, the wiring 67b, the wiring 67d, and the TSV 70b correspond to the black circles described in the region 22a in FIGS.

Terminal 75a, wiring 74a, wiring 73a, wiring 73c, and TSV 76a correspond to the black circles described in region 23a in FIGS. Also, the terminal 75b, the wiring 74b, the wiring 73d, and the TSV 76b correspond to the white circles described in the area 23a in FIGS.

From the above, the large-scale integrated circuit 22 is provided with a TSV (TSV 70a in FIG. 8B) corresponding to each transducer element 20 constituting the first group described above, and each transducer element 20 constituting the second group is provided with a TSV (TSV 70a in FIG. 8B) A corresponding transmission/reception circuit 22b (transmission/reception circuit 22b_1 in FIG. 8B) is provided. The TSV corresponding to each transducer element 20 forming the first group is connected to each transmission/reception circuit 23 b provided in the large scale integrated circuit 23 . With such a configuration, as the circuit area of the transmission/reception circuit 22b provided in the large-scale integrated circuit 22, the area of two regions 22a can be secured. That is, as the circuit area of the transmitting/receiving circuit 22b per one vibration element 20, the area of two regions 22a can be secured.

In addition, the large-scale integrated circuit 23 is provided with a transmitting/receiving circuit 23b (a transmitting/receiving circuit 23b_1 in FIG. 8B) corresponding to each transducer element 20 constituting the first group, and corresponding to each transducer element 20 constituting the second group. A TSV (TSV 76b in FIG. 8B) is provided. The TSV corresponding to each transducer element 20 forming the second group is connected to each transmission/reception circuit 22 b provided in the large scale integrated circuit 22 . With such a configuration, as the circuit area of the transmitting/receiving circuit 23b provided in the large-scale integrated circuit 23, the area of two regions 23a can be secured. That is, as the circuit area of the transmitting/receiving circuit 23b per one vibration element 20, the area of two regions 23a can be secured.

The ultrasonic diagnostic apparatus 100 according to the first embodiment has been described above. Here, a case where a transmitting/receiving circuit and a control circuit are provided in each region of one large-scale integrated circuit will be described. FIGS. 9 and 10 are diagrams showing an example of a case where a transmission/reception circuit and a control circuit are provided in each region of a large-scale integrated circuit. A single large scale integrated circuit 200 is shown in FIGS. Each area 200a of the large-scale integrated circuit 200 is provided with a transmission/reception circuit 200b and a control circuit 200c, as shown in FIG.

The transmitting/receiving circuit 200b is connected to the vibration element 300 directly above via the relay board 240. As shown in FIG. In such a case, only the area of one region 200a corresponding to one vibration element 300 is secured as the circuit area of the transmission/reception circuit 200b. In addition, the transmit/receive circuit 200b shares one area 200a with the control circuit 200c. Therefore, in the cases of FIGS. 9 and 10, it is difficult to increase the size of the area secured as the circuit area of the transmitting/receiving circuit 200b. That is, it is difficult to secure the circuit area of the transmitting/receiving circuit 200b.

It should be noted that some manufacturing processes allow the size (circuit area) of various electronic circuits to be relatively small. Therefore, it is conceivable to use such a manufacturing process to manufacture the large-scale integrated circuit 200 provided with the transmitting/receiving circuit 200b having a relatively small size. However, for example, at the design stage, the characteristics and performance of the transmission/reception circuit 200b provided in the ultrasonic probe are determined in advance. In this case, it is difficult to reduce the size of the transmitting/receiving circuit 200b, which is dominated by analog circuits, for reasons explained below.

For example, the size of the transistor forming the transmission/reception circuit 200b is determined according to the characteristics and performance of the transmission/reception circuit 200b. Therefore, if the size of the transistor is reduced, the characteristics and performance determined at the design stage will change. As described above, although there is a manufacturing process for reducing the size of the transmitting/receiving circuit 200b, when the large scale integrated circuit 200 is manufactured using this manufacturing process, it is difficult to satisfy the specified characteristics and performance. That is, in FIGS. 9 and 10, it is difficult to secure the circuit area of the transmitting/receiving circuit 200b determined according to the determined performance and characteristics.

Therefore, in the ultrasonic probe 1 according to the first embodiment, as described above, the area of one transmission/reception circuit 22b, 23b is not one area 22a, 23a, but a plurality of (for example, two) areas 22a. , 23a. Therefore, according to the first embodiment, it is possible to secure a circuit area for one transmission/reception circuit 22b, 23b per one vibration element 20. FIG.

The plurality of transducer elements 20 according to the first embodiment may be divided into one group of transducer elements 20 that transmit ultrasonic waves and another group of transducer elements 20 that receive echoes. That is, the transducer element 20 may perform at least one of ultrasonic transmission and reception.

(First Modification of First Embodiment)
Next, an ultrasonic probe according to a first modified example of the first embodiment will be described. Configurations that are the same as the configuration of the ultrasonic probe 1 according to the first embodiment are denoted by the same reference numerals, and description thereof may be omitted.

FIG. 11 is a diagram for explaining an example of an ultrasonic probe according to a first modification of the first embodiment; The ultrasonic probe according to the first modification has large scale integrated circuits 22 and 23 shown in FIG. The large-scale integrated circuits 22 and 23 shown in FIG. 11 are provided with one marker 80a and two markers 80b and 80c at diagonal positions. As a result, when manufacturing an ultrasonic probe, a developer or the like can easily orient the large-scale integrated circuits 22 and 23 by checking the positions of one marker 80a and two markers 80b and 80c. can grasp. Therefore, according to the first modified example, a developer or the like can easily manufacture an ultrasonic probe.

Various members can be used as the markers 80a to 80c. For example, the wirings formed in the rewiring layers 68 and 74 may be exposed and the exposed wirings may be used as the markers 80a to 80c.

(Second Modification of First Embodiment)
In the first embodiment, the case where the ultrasonic probe 1 includes the two large scale integrated circuits 22 and 23 provided with the transmitting/receiving circuits 22b and 23b has been described. However, the ultrasonic probe may include K (K is an integer equal to or greater than 3) large-scale integrated circuits provided with transmission/reception circuits. Therefore, such a modified example will be described as a second modified example of the first embodiment. Configurations that are the same as those of the ultrasound probe 1 according to the first embodiment are denoted by the same reference numerals, and description thereof may be omitted. In the following, the case of K=4 will be described as an example.

12A and 12B are diagrams showing an example of part of a method for manufacturing an ultrasonic probe according to a second modification of the first embodiment. As shown in FIG. 12, in the second modification, the four large scale integrated circuits 81-84 are the same large scale integrated circuit.

Large scale integrated circuits 82-84 have center points 85a, 86a, 87a in the XY plane. Then, after arranging the four large-scale integrated circuits 81 to 84 in the same direction, rotate the large-scale integrated circuit 81 around a rotation axis 85b that passes through the center point 85a and is perpendicular to the X and Y directions. The large scale integrated circuit 82 is rotated 90 degrees as indicated by 85 . That is, the orientation of the large scale integrated circuit 82 mounted on the ultrasound probe is different from the direction of the large scale integrated circuit 81 by 90 degrees.

Also, the large scale integrated circuit 83 is rotated 180 degrees as indicated by arrows 85 and 86 about a rotation axis 86b that passes through the center point 86a and is perpendicular to the X and Y directions. That is, the orientation of the large scale integrated circuit 83 mounted on the ultrasonic probe is 180 degrees different from that of the large scale integrated circuit 81 .

Also, with respect to the large scale integrated circuit 81, the large scale integrated circuit 84 is rotated by 270 degrees around a rotation axis 87b passing through the center point 87a and orthogonal to the X and Y directions, as indicated by arrows 85-87. That is, the orientation of the large scale integrated circuit 84 mounted on the ultrasonic probe is 270 degrees different from that of the large scale integrated circuit 81 .

Then, the large-scale integrated circuit 82 rotated by 90 degrees is arranged on the large-scale integrated circuit 81 . Then, the large-scale integrated circuit 83 rotated by 180 degrees is arranged on the large-scale integrated circuit 82 . Then, the large-scale integrated circuit 84 rotated by 270 degrees is arranged on the large-scale integrated circuit 83 .

In this case, the positional relationship between the previously described black circles and white circles is as follows. For example, the positional relationship between a black circle and a white circle is such that three white circles match the position of one black circle on the XY plane.

Reference numerals "91" to "94" shown in FIG. In FIG. 12, black circles indicated by reference numerals "91" to "94" respectively indicate conductors provided in the area 81a in which the black circles are described and schematically show conductors connected to the transmission/reception circuit.

In the large-scale integrated circuit 81, the transmitting/receiving circuit has an area 81a marked with a black circle, and an X-axis direction, a Y-axis direction, and an oblique direction different from the X-axis direction and the Y-axis direction in this area 81a. It is provided across three regions (three regions indicated by white circles) 81a that are adjacent in three directions. That is, in the large-scale integrated circuit 81, the transmitting/receiving circuit is provided across four regions 81a.

Reference numerals “101” to “104” refer to black circles written in the region 82a of the large scale integrated circuit 82. FIG. In FIG. 12, black circles indicated by reference numerals "101" to "104" respectively indicate conductors provided in the area 82a in which the black circles are described, and schematically show conductors connected to the transmission/reception circuit. In the large-scale integrated circuit 82, as in the large-scale integrated circuit 81, the transmitting/receiving circuits are provided across four regions 82a.

Reference numerals “111” to “114” refer to black circles written in the region 83a of the large scale integrated circuit 83. FIG. In FIG. 12, black circles indicated by reference numerals "111" to "114" respectively indicate conductors provided in the area 83a in which the black circles are described and schematically show conductors connected to the transmission/reception circuit. In the large-scale integrated circuit 83, similarly to the large-scale integrated circuit 81, the transmitting/receiving circuits are provided across four regions 83a.

Reference numerals “121” to “124” refer to black circles written in the region 84a of the large scale integrated circuit 84. FIG. In FIG. 12, black circles indicated by reference numerals "121" to "124" respectively indicate conductors provided in the region 84a in which the black circles are described and schematically show conductors connected to the transmission/reception circuit. In the large-scale integrated circuit 84, as in the large-scale integrated circuit 81, the transmitting/receiving circuits are provided across four regions 84a.

Also, the white circles written in the region 81a schematically indicate conductors provided in the region 81a in which the white circles are written and connecting the control circuit 31 directly below and the region 82a directly above. The white circles described in the area 82a schematically indicate conductors provided in the area 82a in which the white circles are described and connecting the area 81a directly below and the area 83a directly above. The white circles described in the area 83a schematically indicate conductors provided in the area 83a in which the white circles are described and connecting the area 82a directly below and the area 84a directly above. The white circles described in the region 84a are conductors provided in the region 84a described with the white circles, and schematically indicate conductors that connect with the region 83a directly below and connect the vibration element 20 directly above.

12, four hatched regions 81a of the large-scale integrated circuit 81, four hatched regions 82a of the large-scale integrated circuit 82, and four hatched regions 83a of the large-scale integrated circuit 83 are shown. , and four hatched areas 84a of the large scale integrated circuit 84 correspond.

"Q- "R" means that in a large-scale integrated circuit indicated by "Q", a conductor indicated by a black circle indicated by a symbol "R" is located in a region 81a, 82a, 83a, or 84a indicated by a black circle indicated by a symbol "R". indicates that it is provided. For example, if "Q" is "1", then "Q" indicates large scale integrated circuit 81; If "Q" is "2", then "Q" indicates large scale integrated circuit 82; If "Q" is "3", then "Q" indicates large scale integrated circuit 83; If "Q" is "4", then "Q" indicates large scale integrated circuit 84;

For example, "3-111" indicates that the large-scale integrated circuit 83 has a conductor such as a TSV connected to the transmitting/receiving circuit in the area 83a indicated by the white circle indicated by the symbol "111".

In the second modification, as shown on the right side of FIG. 12, regions corresponding to all the vibration elements 20 (four regions 81a, four regions 82a, four regions 83a and four regions 84a) is provided with a conductor such as a TSV connected to the transmitting/receiving circuit. That is, each of all the vibration elements 20 is connected to the transmission/reception circuit. Note that not all the transducer elements 20 need to be connected to the transmission/reception circuit. For example, the transmission/reception circuit may be connected to at least one of the multiple transducers 20 .

The ultrasonic probe according to the second modification has been described. The ultrasonic probe according to the second modification secures not one area but a plurality of areas as the area of one transmission/reception circuit. For example, in the second modified example, the above K areas are secured. Therefore, according to the second modification, it is possible to secure a circuit area for one transmission/reception circuit per one vibration element 20, as in the first embodiment.

(Second embodiment)
In the first embodiment, the case where the ultrasonic probe 1 includes a plurality of large-scale integrated circuits 22 and 23 provided with transmission/reception circuits 22b and 23b as electronic circuits having the same function has been described. However, electronic circuits with different functions may be provided for each large scale circuit. Therefore, such an embodiment will be described as a second embodiment. It should be noted that the same reference numerals may be assigned to the same configurations as those of the ultrasonic probe 1 according to the first embodiment, and the description thereof may be omitted.

13A and 13B are diagrams for explaining an example of an ultrasonic probe according to the second embodiment. FIG. 13A shows a large scale integrated circuit 130 according to the second embodiment. FIG. 13B shows a large scale integrated circuit 131 according to the second embodiment. For example, the ultrasonic probe according to the second embodiment includes a large-scale integrated circuit 130 instead of the large-scale integrated circuit 22, and a large-scale integrated circuit 131 instead of the large-scale integrated circuit 23. is different from the ultrasonic probe 1 according to the first embodiment.

Note that the control circuit 31 according to the second embodiment has the same configuration as the control circuit 31 according to the first embodiment, so description thereof will be omitted.

As shown in FIG. 13A, each region 130a of the large-scale integrated circuit 130 is provided with a transmission circuit 130b. Here, in the second embodiment, one transmission circuit 130b is provided in one region 130a. The transmission circuit 130b according to the second embodiment includes, for example, the pulser circuit described above and a circuit (transmission delay circuit) that performs delay processing on the drive signal among the delay circuits described above. That is, the transmission circuit 130b is a circuit related to transmission of ultrasonic waves. Note that the transmission circuit 130b provided in the region 130a_1 is referred to as "transmission circuit 130b_1". Also, the transmission circuit 130b provided in the region 130a_2 is referred to as "transmission circuit 130b_2".

Also, in FIG. 13A, the black circles described in each area 130a connect, for example, the transmission circuit 130b provided in each area 130a described with the black circle, the control circuit 31 immediately below, and the area 131a directly above, which will be described later. It is a schematic representation of a conductor that In the second embodiment, for example, terminals and TSVs are used as such conductors. In this case, in the region 130a marked with a black dot, the transmission circuit 130b is connected to the control circuit 31 directly below via the TSV or the like, and is connected via a terminal or the like to the region 131a (specifically, is connected to a transmission circuit 130b) immediately above, which will be described later.

As shown in FIG. 13B, each region 131a of the large-scale integrated circuit 131 is provided with a receiving circuit 131b. Here, in the second embodiment, one receiving circuit 131b is provided in one region 131a. The receiving circuit 131b according to the second embodiment includes, for example, the above-described amplifier and a circuit (receiving delay circuit) that performs delay processing on the echo signal among the above-described delay circuits. That is, the transmission circuit 130b is a circuit related to ultrasonic wave reception. Note that the receiving circuit 131b provided in the region 131a_1 is referred to as "receiving circuit 131b_1." Further, the receiving circuit 131b provided in the region 131a_2 is referred to as "receiving circuit 131b_2".

Further, in FIG. 13B, the black circles described in each area 131a are, for example, the reception circuit 131b provided in each area 131a described with the black circle, and the area 130a immediately below (specifically, the area 130a directly below It schematically shows a conductor connecting the provided transmission circuit 130b) and the vibration element 20b directly above. In a second embodiment, terminals and TSVs are used as such conductors. In this case, in a region 131a marked with a black circle, the receiving circuit 131b is connected to the transmitting circuit 130b directly below via a TSV or the like, and is connected to the vibrating element 20 directly above via a terminal or the like.

For example, in FIGS. 13A and 13B, the transmission circuit 130b_1 generates a drive signal under the control of the control circuit 31a described above, and outputs the generated drive signal to the reception circuit 131b immediately above. Then, the receiving circuit 131b outputs the received drive signal to the vibration element 20_1 immediately above.

The receiving circuit 131b_1 receives the echo signal output from the transducer 20_1.

Then, the receiving circuit 131b_1 amplifies the received echo signal under the control of the control circuit 31a, performs delay processing on the amplified echo signal, and transmits the delayed echo signal to the transmitting circuit 130b_1. Output. Then, the transmission circuit 130b_1 outputs the received echo signal to the control circuit 31a immediately below.

Similar processing is performed for the transmission circuit 130b_2, the reception circuit 131b_2, and the control circuit 31b. Further, the other transmission circuit 130b, reception circuit 131b, and control circuit 31 perform similar processing.

Here, the transmission circuit 130b and the reception circuit 131b have different withstand voltages. For example, the transmitter circuit 130b is predominantly an analog circuit such as a pulse circuit that generates a drive signal. On the other hand, the receiving circuit 131b is predominantly a digital circuit that processes echo signals generated by the transducer element 20 . Therefore, for example, the withstand voltage of the transmission circuit 130b is higher than that of the reception circuit 131b. The receiving circuit 131b is an example of a first electronic circuit, and the transmitting circuit 130b is an example of a second electronic circuit.

For example, the type of manufacturing process used when manufacturing one large-scale integrated circuit provided with a plurality of electronic circuits with a large difference in withstand voltage is the type that can manufacture the electronic circuit with a greater withstand voltage. is limited to

Here, the ultrasonic probe according to the second embodiment includes a large-scale integrated circuit 130 provided with a transmitting circuit 130b having a relatively high withstand voltage and a large-scale receiving circuit 131b having a relatively low withstand voltage. integrated circuit 131 . Therefore, when manufacturing the large-scale integrated circuit 131, the type of manufacturing process cannot be narrowed down due to the withstand voltage of the receiving circuit 131b provided in the large-scale integrated circuit 131. FIG. Therefore, according to the ultrasonic probe according to the second embodiment, it is possible to prevent the type of manufacturing process from being limited.

Further, in the second embodiment, various circuits included in the transmission/reception circuits 22b and 23b are divided into a transmission circuit 130b and a reception circuit 131b. Each electronic circuit of the transmission circuit 130b and the reception circuit 131b is provided in one area 130a, 131a. Therefore, according to the second embodiment, the circuit area of the transmission circuit 130b and the reception circuit 131b can be secured as compared with the case where the transmission/reception circuits 22b and 23b are provided in one region 22a and 22b.

(Third embodiment)
In the first embodiment, the case where the ultrasonic probe 1 includes one large scale integrated circuit 22 and one large scale integrated circuit 23 has been described. However, when the number of transducer elements 20 is increased, the ultrasonic probe may include a plurality of large scale integrated circuits 22 and a plurality of large scale integrated circuits 23 according to the number of transducer elements 20. good too. Therefore, such an embodiment will be described as a third embodiment.

14A and 14B are diagrams for explaining an example of an ultrasonic probe according to the third embodiment. The ultrasound probe according to the third embodiment includes a large scale integrated circuit 141 shown in FIG. 14A and a large scale integrated circuit 142 shown in FIG. 14B.

The large-scale integrated circuit 141 is obtained by arranging three of the large-scale integrated circuits 22 described above in the X-axis direction according to the number of the vibration elements 20 . The large-scale integrated circuit 142 is formed by arranging three of the large-scale integrated circuits 23 described above in the X-axis direction according to the number of the vibration elements 20 .

In the third embodiment, the large-scale integrated circuit provided with a control circuit for controlling the transmitting/receiving circuit 22b provided in the large-scale integrated circuit 141 and the transmitting/receiving circuit 23b provided in the large-scale integrated circuit 142 is , is newly manufactured according to the number of vibration elements 20 .

14A and 14B, a part of the method for manufacturing the ultrasonic probe according to the third embodiment will be described. 142 are placed in a predetermined orientation. Then, a plurality of (three in FIG. 14A) large-scale integrated circuits 141 are arranged on the back side of the large-scale integrated circuit 142 in an orientation different from the predetermined orientation.

14C and 14D are diagrams for explaining another example of the ultrasonic probe according to the third embodiment. As shown in FIG. 14C, the large-scale integrated circuit 141 has a row of two large-scale integrated circuits 22 arranged in the X-axis direction according to the number of the vibration elements 20. , two arranged in the Y-axis direction. Also, as shown in FIG. 14D, the large scale integrated circuit 142 has a row of two large scale integrated circuits 23 arranged in the X-axis direction according to the number of the vibration elements 20. , two arranged in the Y-axis direction.

At this time, for example, when the number of vibration elements 20 is 36 (when six rows of vibration elements 20 arranged in the X-axis direction are arranged in six rows in the Y-axis direction), large-scale integration Of the 64 regions 23a in the circuit 142, the 36 regions 23a in the central portion may be connected to the 36 vibration elements 20, respectively. Also, of the 64 regions 22a in the large-scale integrated circuit 141, the 36 regions 22a in the central portion may be connected to the 36 regions 23a described above. Alternatively, each of the 36 regions 22 a in the central portion may be connected to each of the 36 control circuits 31 .

(Fourth embodiment)
In the first embodiment, after rotating the large-scale integrated circuit 23 with respect to the large-scale integrated circuit 22, the large-scale integrated circuit 23 is arranged in a predetermined orientation, and the large-scale integrated circuit 22 is placed in the previous direction. The case of arranging in an orientation different from the predetermined orientation has been described.

However, after moving (shifting) the other large-scale integrated circuit in at least one of the X-axis direction and the Y-axis direction with respect to the one large-scale integrated circuit, the one large-scale integrated circuit and the shifted large-scale integrated circuit Other large-scale integrated circuits may also be arranged.

According to the ultrasonic probe and the ultrasonic probe manufacturing method of at least one embodiment described above, the circuit area of the electronic circuit can be secured.

While several embodiments of the invention have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, as well as the scope of the invention described in the claims and equivalents thereof.

1 Ultrasonic Probe 20 Vibration Element 22, 23 Large Scale Integrated Circuit 22a, 23a Area 22b, 23b Transmission/Reception Circuit 70a, 70b, 76a, 76b TSV

Claims (7)

a plurality of transducer elements for transmitting and/or receiving ultrasonic waves;
An electronic circuit is provided on the back side of the plurality of vibration elements, corresponding to each vibration element that constitutes a first group among the plurality of vibration elements, and constitutes a second group among the plurality of vibration elements. a first circuit board provided with a through silicon electrode corresponding to each vibration element;
Through silicon vias arranged on the back side of the first circuit board and corresponding to the vibration elements forming the first group are provided, and electronic circuits corresponding to the vibration elements forming the second group are provided. a second circuit board ;
An ultrasound probe with a 2. The ultrasonic probe according to claim 1, wherein each electronic circuit provided on said first circuit board and said second circuit board includes an analog circuit. Each of the electronic circuits provided on the first circuit board and the second circuit board includes a drive circuit for driving at least one vibrating element and a signal processing circuit for processing an electrical signal generated by the at least one vibrating element. 3. The ultrasound probe of claim 1 or 2, including at least one of circuitry. 4. The ultrasonic probe according to any one of claims 1 to 3, wherein said first circuit board and said second circuit board are the same circuit and arranged in different directions. The ultrasonic probe according to any one of claims 1 to 4, wherein the first circuit board and the second circuit board are provided with orientation markers. Each through silicon electrode provided on the first circuit board is connected to each electronic circuit provided on the second circuit board ,
The ultrasonic probe according to any one of claims 1 to 5, wherein each electronic circuit provided on said first circuit board is connected to each through-silicon electrode provided on said second circuit board . . 7. The electronic circuit according to any one of claims 1 to 6, further comprising a control circuit disposed on the back side of said second circuit board and controlling each electronic circuit provided on said first circuit board and said second circuit board . The ultrasonic probe according to 1.

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