JP7185671B2 - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - Google Patents

Description

The present application relates to a substrate processing apparatus and a substrate processing method.

In order to improve the throughput of substrate processing, a technique has been proposed in which a plurality of substrates are grouped together and transported between apparatuses. For example, a plurality of substrates are collectively transported to a sequential processing apparatus (which will be described in detail later). The substrates are processed while being transported one by one in the sequential processing apparatus. A plurality of processed substrates are collectively transported to a simultaneous processing apparatus (which will be described in detail later).

For example, in Patent Document 1 below, the transfer and processing of each of a plurality of substrates in a sequential processing apparatus is controlled based on individual substrate data, and the transfer and processing of a plurality of substrates in a simultaneous processing apparatus is controlled based on overall substrate data. Disclosed is a technique to be implemented. Both the individual board data and the whole board data contain recipe information. The recipe information defines the contents of processing to be performed on the substrate. The recipe information of a plurality of substrates that are grouped together is common.

JP 2020-17604 A

When recipe information is common to a group of a plurality of substrates (hereinafter also referred to as a "group"), it is desirable to manage substrate transport and processing for each group. For example, it is desirable to manage to which group a substrate transferred from a sequential processing apparatus to a simultaneous processing apparatus belongs. Such management is desirable even if, for example, any of the substrates belonging to a group are removed in a sequential processing system.

A substrate processing apparatus and a substrate processing method disclosed in the present application aim to manage substrate transport and processing for each group.

A substrate processing apparatus disclosed in the present application includes a sequential processing section, a simultaneous processing section, and a control section. The sequential processing unit processes the substrates while sequentially transporting the substrates based on sequential processing substrate data set for each substrate divided into a plurality of groups. The simultaneous processing section simultaneously processes the substrates for each group based on simultaneous processing substrate data set for each group. The control unit controls the transport and the processing of the substrate in the sequential processing unit based on the sequential processing substrate data, and controls the processing of the substrate in the simultaneous processing unit based on the simultaneous processing substrate data. .

The simultaneously processed substrate data includes group identification information for identifying the group, a substrate number for distinguishing the substrates belonging to the group, and position information indicating the transfer position, which is the position of the substrate in the group in the transfer direction. , and recipe information for prescribing processing contents commonly performed on the substrates belonging to the group.

The sequentially processed substrate data includes the position information, the group identification information, and the recipe information for the substrates corresponding to the sequentially processed substrate data.

The control section generates the sequentially processed substrate data from the simultaneously processed substrate data, and generates the simultaneously processed substrate data from the sequentially processed substrate data.

The substrate processing method disclosed herein comprises sequential processing and simultaneous processing. The sequential processing is performed on the substrates while sequentially transporting the substrates based on sequential processing substrate data set for each substrate divided into a plurality of groups. In the simultaneous processing, the substrates are simultaneously processed for each group based on simultaneously processed substrate data set for each group.

The simultaneously processed substrate data includes group identification information for identifying the group, a substrate number for distinguishing the substrates belonging to the group, and position information indicating the transfer position, which is the position of the substrate in the group in the transfer direction. , and recipe information for prescribing processing contents commonly performed on the substrates belonging to the group.

The sequentially processed substrate data includes the position information, the group identification information, and the recipe information for the substrates corresponding to the sequentially processed substrate data.

The sequentially processed substrate data is generated from the simultaneously processed substrate data, and the simultaneously processed substrate data is generated from the sequentially processed substrate data.

A substrate processing apparatus and a substrate processing method disclosed in the present application manage substrate transport and processing for each group.

Objects, features, aspects, and advantages of the technology disclosed herein will become more apparent from the detailed description and accompanying drawings set forth below.

It is a top view which shows roughly an example of a structure of a substrate processing apparatus. It is a side view which shows roughly an example of a structure of a sequential processing apparatus. It is a top view which shows roughly an example of a structure of a simultaneous processing apparatus. 3 is a functional block diagram schematically showing an example of the configuration of a control section; FIG. FIG. 4 is a diagram schematically showing an example of simultaneous processing substrate data; FIG. 4 is a diagram schematically showing a mode in which a plurality of substrates are accommodated in a cassette; FIG. 4 is a diagram schematically showing a mode in which a plurality of substrates are accommodated in a cassette; FIG. 4 is a diagram schematically showing an example of simultaneous processing substrate data; FIG. 4 is a diagram schematically showing an example of simultaneous processing substrate data; FIG. 4 is a plan view schematically showing an example of substrate transfer in a simultaneous processing apparatus; FIG. 4 is a diagram schematically showing an example of sequentially processed substrate data; FIG. 4 is a diagram schematically showing an example of sequentially processed substrate data; FIG. 4 is a side view schematically showing an example of substrate transfer in a sequential processing apparatus; FIG. 4 is a side view schematically showing an example of substrate transfer in a sequential processing apparatus; FIG. 4 is a diagram schematically showing an example of sequentially processed substrate data; FIG. 4 is a side view schematically showing an example of substrate transfer in a sequential processing apparatus; FIG. 4 is a side view schematically showing an example of substrate transfer in a sequential processing apparatus; FIG. 4 is a side view schematically showing an example of substrate transfer in a sequential processing apparatus; FIG. 4 is a side view schematically showing an example of substrate transfer in a sequential processing apparatus; 4 is a flow chart illustrating the flow of operations in a simultaneous processor and a sequential processor; It is a flowchart which illustrates the detail of step S3. It is a flowchart which illustrates the detail of step S5. FIG. 11 is a flowchart illustrating details of step S509; FIG.

Embodiments will be described below with reference to the attached drawings. It should be noted that the drawings are shown schematically, and for the convenience of explanation, the configurations are omitted and simplified as appropriate. Also, the interrelationships between the sizes and positions of the components shown in the drawings are not necessarily described accurately and may be changed as appropriate.

In addition, in the description given below, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, a detailed description thereof may be omitted to avoid duplication.

Also, even if ordinal numbers such as “first” or “second” are used in the description below, these terms are used to facilitate understanding of the content of the embodiments. are used for convenience, and are not limited to the order or the like that can occur with these ordinal numbers.

Expressions indicating relative or absolute positional relationships (e.g., "in one direction", "along one direction", "parallel", "perpendicular", "center", "concentric", "coaxial", etc.) are used unless otherwise specified. Not only the positional relationship is strictly expressed, but also the relatively displaced state in terms of angle or distance within the range of tolerance or equivalent function. Expressions indicating equality (e.g., "same", "equal", "homogeneous", etc.), unless otherwise specified, not only express quantitatively strictly equality, but also tolerances or equivalent functions can be obtained It shall also represent the state in which there is a difference. Expressions indicating shapes (e.g., "square shape" or "cylindrical shape"), unless otherwise specified, not only represent the shape strictly geometrically, but also to the extent that the same effect can be obtained, such as Shapes having unevenness, chamfering, etc. are also represented. The terms "comprise", "comprise", "comprise", "include" or "have" an element are not exclusive expressions that exclude the presence of other elements. The phrase "at least one of A, B and C" includes only A, only B, only C, any two of A, B and C, and all of A, B and C.

<1. Overall Configuration/Overall Operation of Substrate Processing Apparatus>
FIG. 1 is a diagram schematically showing an example of the configuration of a substrate processing apparatus 1. As shown in FIG. In the example of FIG. 1, the substrate processing apparatus 1 is a coater/developer, and mainly includes cleaning apparatus 12, dehydration baking apparatus 13, coating-related apparatus 14, pre-baking apparatus 15, developing apparatus 17, and post-baking apparatus 18. Prepare. Also, on one side of the substrate processing apparatus 1, an indexer section 11 for loading and unloading substrates into and out of the substrate processing apparatus 1 is arranged. Further, an exposure device 16 is arranged on the other side of the substrate processing apparatus 1 via an interface section (not shown).

A cleaning device 12, a dehydration baking device 13, a coating-related device 14, and a pre-baking device 15 are arranged in this order on a line from the indexer section 11 to the exposure device 16. FIG. A developing device 17 and a post-baking device 18 are arranged in this order on the return line from the exposure device 16 to the indexer section 11 .

A plurality of cassettes (not shown) storing a plurality of substrates are placed on the indexer section 11 . The substrate is, for example, a rectangular glass substrate used in a liquid crystal display device. An indexer robot (not shown) is arranged in the indexer section 11 as a transport section. The indexer robot picks up a substrate from the cassette and transports the substrate to cleaning device 12 . In the cleaning device 12, the substrate is cleaned. The substrate that has undergone the cleaning process is transported to the dehydration baking device 13 . In the dehydration baking device 13, dehydration treatment (dehydration baking treatment) is performed by heating. After the dehydration baking process, the substrate is transported to the coating-related apparatus 14 and various processes including resist coating process are performed. The substrate subjected to this treatment is transported to the pre-baking device 15 and subjected to heat treatment. The substrate that has undergone the heat treatment is transported to the exposure device 16 and subjected to exposure processing.

The substrate on which these processes have been performed is transported to the developing device 17 and is subjected to development processing. The developed substrate is transported to the post-baking device 18 and heat-treated. After that, the substrate is accommodated in a cassette placed on the indexer section 11 by the indexer robot. A series of these processes form a resist pattern on the surface of the substrate.

Below, when the first process precedes the second process, the device performing the first process is said to be "upstream" from the device performing the second process, and the device performing the second process is described as being "upstream" from the device performing the second process. It is described as being "downstream" of the device that performs the first processing. The indexer section 11 is upstream with respect to the cleaning apparatus 12 and downstream with respect to the post bake apparatus 18 . The terms "upstream" and "downstream" are used not only to describe the device and the elements that make up the device, but also to describe the positional relationship of substrates being transported.

<2. Type of processing equipment>
In this substrate processing apparatus 1, the following two types of processing apparatuses are mixed as types of processing apparatuses. That is, a sequential processing apparatus (parallel flow processing apparatus) that processes the substrates one by one while sequentially transporting the substrates in one direction, and a batch processing apparatus for N (an integer equal to or greater than 2) substrates. Simultaneous processing devices that can process simultaneously coexist. It should be noted that the processing periods of the N substrates by the simultaneous processing apparatus do not need to be completely the same as long as at least a part of each processing period overlaps. In short, the term "at the same time" is used here in contrast to the state in which the respective processing periods do not overlap at all. Examples of sequential processing devices include cleaning device 12 and developing device 17, and examples of simultaneous processing devices include dehydration baking device 13, coating-related device 14, pre-baking device 15, and post-baking device 18. FIG.

The sequential processing apparatus can be viewed as a sequential processing section that is part of the substrate processing apparatus 1 . The simultaneous processing apparatus can be regarded as a simultaneous processing section that is part of the substrate processing apparatus 1 .

<2-1. Sequential processing device>
FIG. 2 is a side view schematically showing an example of the configuration of the sequential processing device 30. As shown in FIG. The sequential processing apparatus 30 includes a processing apparatus main body 32 and a substrate lead-out section 33 , and a substrate introducing section (receiving section) 31 is provided just before the sequential processing apparatus 30 . The substrate introduction part 31 collectively receives a plurality of (N) substrates W transported from an upstream apparatus. The processing apparatus main body 32 sequentially receives a plurality of substrates W conveyed from the substrate introduction portion 31 one by one, and conveys the substrates W along one direction (conveyance direction: direction from left to right in FIG. 2). Various processes are performed on the substrate W while the wafer W is being heated. The substrate W after processing is transported from the processing apparatus main body 32 to the substrate lead-out section 33 . The substrate lead-out part 33 sequentially receives a plurality of substrates W transported from the processing apparatus main body 32 . The substrate lead-out part 33 can hold a plurality (N) of substrates W sequentially received. A plurality of substrates W are collectively taken out from the substrate lead-out part 33 and transported to a downstream device. Note that the substrate introduction part 31 may be regarded as being included in the sequential processing apparatus 30 . The substrate introduction section 31 can function as an inlet section of the sequential processing apparatus 30 , and the substrate outlet section 33 can function as an outlet section of the sequential processing apparatus 30 . The case of N=2 is exemplified below.

<2-1-1. Substrate introducing portion 31>
The substrate introduction section 31 has a plurality of rollers 311 and 313 as a transport mechanism, and sensors 314 and 315 . The cross sections of the rollers 311 and 313 are circular, and the central axes of the rollers 311 and 313 are arranged substantially perpendicular to the direction in which the substrate W is conveyed and substantially horizontal. The transport direction here is the transport direction of the substrate W in the sequential processing apparatus 30 . A plurality of rollers 311 are arranged side by side at intervals along the transport direction. Each roller 311 can rotate around its own central axis. Both ends of the central axis of each roller 311 are rotatably fixed to support plates (not shown). The pair of support plates are plate-shaped members extending along the transport direction, and are fixed to a predetermined base 312 provided on the floor surface. A plurality of rollers 313 are arranged side by side at intervals along the transport direction. The roller 313 is positioned downstream of the roller 311 and is provided at the same height as the roller 311 . Each roller 313 can rotate around its own central axis. Both ends of the central axis of each roller 313 are rotatably fixed to support plates.

The plurality of rollers 311 are driven by a drive unit (not shown) to rotate (synchronously rotate) in the same predetermined direction at approximately the same rotational speed. The drive has a motor. A substrate W is placed on the plurality of rollers 311 . The substrate W is placed so that the normal direction of its main surface is along the vertical direction (the vertical direction in FIG. 2). In this state, the plurality of rollers 311 rotate synchronously in the same direction, so that the substrate W moves on the rollers 311 along the transport direction to the processing apparatus main body 32 . A plurality of rollers 313 are also driven by a drive unit (not shown) to rotate synchronously. Since the rollers 311 and 313 are driven by different drive units, they are controlled independently of each other.

The substrates W are placed one by one on the rollers 311 and 313 . For example, two substrates W may be placed on the rollers 311 and 313 from the indexer section 11 . Only the roller 313 rotates synchronously in this state, so that the substrate W on the roller 313 can be transported to the processing apparatus main body 32 . Next, both the rollers 311 and 313 rotate synchronously, so that the substrate W on the roller 313 can be transported to the processing apparatus main body 32 .

A sensor 314 detects whether or not the substrate W is present at the stop position on the roller 311 . A sensor 315 detects whether or not the substrate W is present at the stop position on the roller 313 . The sensors 314 and 315 are optical sensors, for example, and detect the substrate W when the reflected light from the substrate W is received. The detection results of sensors 314 and 315 are output to control section 60 .

In the following, one of the two substrates W is also called substrate W1, and the other is also called substrate W2. Here, it is assumed that the substrate W1 is located upstream of the substrate W2.

<2-1-2. Substrate lead-out portion 33>
The substrate lead-out part 33 can hold a plurality of (N) substrates W sequentially transported from the processing apparatus main body 32 . The number of substrates W that can be held by the substrate lead-out part 33 is the same as the number of substrates W that can be processed by the next simultaneous processing device 40 (for example, if the sequential processing device 30 is the cleaning device 12, the dehydration baking device 13). be. Here, as an example, it is assumed that the substrate lead-out section 33 holds two substrates W, and the simultaneous processing apparatus 40 processes the two substrates W at the same time.

The substrate lead-out section 33 includes a plurality of rollers 331 and 332 as a transport mechanism, and sensors 334 and 335 . The cross section of rollers 331 and 332 has a circular shape. The rollers 331 are arranged at intervals along the transport direction so that their central axes are perpendicular to the transport direction of the substrate W and horizontal. The roller 332 is arranged downstream of the roller 331 . The rollers 332 are arranged in the same posture as the rollers 331 at intervals along the transport direction. Both ends of the central axis of each roller 331, 332 are rotatably fixed to support plates (not shown). The plurality of rollers 331 are synchronously rotated by a drive section (not shown), and the plurality of rollers 332 are synchronously rotated by a drive section (not shown). Since the rollers 331 and 332 are driven by different drives, they can be controlled independently of each other. Each drive has, for example, a motor.

The rollers 331 and 332 are provided at the same height as each other. The substrate W is transported from the processing apparatus main body 32 to the rollers 331 and transported from the rollers 331 to the rollers 332 as appropriate. As will be described later, one substrate W is stopped on the rollers 331 and one substrate W is stopped on the rollers 332 . Thereby, the substrate lead-out portion 33 can hold two substrates W. As shown in FIG.

A sensor 334 detects whether or not the substrate W is present at the stop position on the roller 331 . A sensor 335 detects whether or not the substrate W is present at the stop position on the roller 332 . The sensors 334 and 335 are optical sensors, for example, and detect the substrate W when the reflected light from the substrate W is received. The detection results of the sensors 334 and 335 are output to the control section 60 .

The substrate lead-out part 33 can sequentially receive two substrates W from the processing apparatus main body 32 and hold them. First, for the sake of simplicity, the case where two substrates W are processed together will be described below. A case where N substrates W are processed without being batched will be described in detail later.

First, the first substrate W is conveyed to a stop position above the roller 332 by the synchronous rotation of the rollers 331 and 332 . Specifically, when neither of the sensors 334 , 335 detects the substrate W, the rollers 331 , 332 are synchronously rotated to convey the substrate W from the processing apparatus main body 32 to the substrate lead-out section 33 . Then, when the sensor 335 detects the substrate W, the synchronous rotation of the rollers 332 is stopped. As a result, the first substrate W (substrate W2 on the downstream side) is stopped and supported on the rollers 332 . With respect to the second substrate W (upstream substrate W1), the substrate W is transported to the stop position of the roller 331 by rotating the roller 331 synchronously without rotating the roller 332 . Specifically, when the sensor 334 detects the substrate W, the synchronous rotation of the roller 331 is stopped. That is, when both the sensors 334 and 335 are detecting the substrate W, the synchronous rotation of the roller 331 is stopped. Thereby, the second substrate W is stopped and supported on the rollers 331 . Thus, the substrate lead-out portion 33 can hold two substrates W. As shown in FIG.

<2-1-3. Processing device body 32>
The processing apparatus main body 32 has a plurality of rollers 321 as a transport mechanism. The plurality of rollers 321 have the same shape as the rollers 311 and are arranged in the same posture as the rollers 311 . Both ends of the central axis of the roller 321 are rotatably fixed to support plates (not shown). A plurality of rollers 321 are arranged at intervals along the transport direction. A plurality of rollers 321 are provided at the same height as the rollers 311 of the substrate introduction portion 31, and the substrate W can be moved from the rollers 311 to the rollers 332 via the rollers 313, 321, and 331 in this order.

The processing apparatus main body 32 appropriately processes the substrate W flowing on the rollers 321 at each position in the transport direction. Here, the cleaning device 12 will be described as an example of the sequential processing device 30 . For example, the processing apparatus main body 32 has a chemical solution section 34 , a water washing section 35 and a draining section 36 . The chemical solution section 34, the water washing section 35 and the draining section 36 are provided in series in this order from upstream to downstream. Also, a plurality of rollers 321 are provided over the chemical liquid portion 34 , the washing portion 35 and the draining portion 36 . The plurality of rollers 321 are driven by a drive unit (not shown) to rotate synchronously. Thereby, the substrate W can be transported along the transport direction and passed through the chemical solution section 34, the water washing section 35, and the draining section 36 in this order.

The chemical liquid unit 34 is a device that supplies a chemical liquid to the substrate W on the roller 321 to clean the substrate W. As shown in FIG. The chemical solution unit 34 includes a plurality of nozzles 341 that eject the chemical solution, a chemical tank 342 that stores the chemical solution, a supply pipe 343 that connects the chemical solution tank 342 and the nozzle 341, and supplies the chemical solution to the nozzle 341 via the supply pipe 343. A pump 344 is provided. The nozzles 341 are provided on both sides of the substrate W in the vertical direction, and supply the chemical solution to both sides of the substrate W. As shown in FIG. A flow rate sensor 345 is provided in the supply pipe 343 and contributes to control of the amount of chemical solution to be supplied. The chemical solution section 34 may have a brush (not shown) for brushing the substrate W, or the like. By performing the brushing while supplying the chemical solution to the substrate W, the cleaning effect can be enhanced. The chemical liquid supplied to the substrate W falls mainly from the peripheral edge of the substrate W and is collected in the chemical liquid tank 342 .

The water washing unit 35 is a device for washing away the chemical liquid remaining on the substrate W by supplying washing water to the substrate W. FIG. The water washing unit 35 has a first water tank 355 and a second water tank 356 that store washing water. The water washing section 35 has a low-pressure water supply section 351, a high-pressure water supply section 352, an ultrasonic cleaning water supply section 353, and a pure water supply section 354 arranged in this order from upstream to downstream. Each of the units 351 to 354 includes a nozzle that discharges the liquid onto the substrate W, a supply pipe connected to the nozzle, and a pump that supplies the liquid to the nozzle via the supply pipe, similarly to the chemical solution unit 34. ing.

The pump 35t of the low-pressure water supply unit 351 is a low-pressure pump that pumps up wash water from the first water tank 355 at low pressure and supplies it to the nozzles. Thereby, the low-pressure water supply unit 351 can supply the cleaning water to the substrate W at a low pressure. A slit nozzle (also called a liquid knife) 35a is provided in the low-pressure water supply unit 351, and cleaning water is supplied to the substrate W also from the liquid knife 35a. The pressure of the cleaning water supplied to the low-pressure water supply section 351 is measured by a pressure sensor 357 .

The pump 35r of the high-pressure water supply unit 352 is a high-pressure pump, which pumps up the washing water from the first water tank 355 at high pressure and supplies it to the nozzles. Thereby, the high-pressure water supply unit 352 can supply the cleaning water to the substrate W at high pressure. A pressure sensor 358 measures the pressure of the cleaning water supplied to the high-pressure water supply section 352 . The cleaning water supplied by the low-pressure water supply section 351 and the high-pressure water supply section 352 mainly drops from the peripheral edge of the substrate W and is collected in the first water tank 355 .

The nozzle 35 b of the ultrasonic cleaning water supply unit 353 is provided with an ultrasonic vibrator that applies ultrasonic vibrations to the cleaning water from the second water tank 356 . Nozzle 35b functions as a liquid knife. The pump 35s of the ultrasonic cleaning water supply unit 353 pumps up cleaning water from the second water tank 356 and supplies it to the nozzle 35b. By vibrating the ultrasonic vibrator of the nozzle 35b, the ultrasonic cleaning water supply unit 353 supplies cleaning water in a vibrating state to the substrate W from the nozzle 35b. The cleaning water supplied by the ultrasonic cleaning water supply section 353 is mainly recovered to the second water tank 356 . A flow rate sensor 359 measures the flow rate of the cleaning water supplied to the nozzle 35b.

The nozzle of the pure water supply unit 354 supplies the substrate W with pure water supplied from the pure water supply source 365 . A pure water supply source 365 is provided, for example, as a factory facility (utility). This pure water is mainly recovered to the second water tank 356 .

The drainer 36 is a device for blowing off water from the substrate W by causing a high-pressure airflow to flow toward the substrate W. As shown in FIG. The draining section 36 has an injection section (dry air knife) 361 that injects gas onto the substrate W, a gas supply source 362 that supplies the gas, and a conduit 363 that connects the injection section 361 and the gas supply source 362 . ing. A flow rate sensor 364 for measuring the flow rate of the gas is provided in the pipeline 363 . The gas supply source 362 is a gas source provided as a factory facility (utility).

As described above, the substrate W is transported in the transport direction in the processing apparatus main body 32, and various processes are performed at each position. The substrate W that has been completely processed by the processing apparatus main body 32 is transported to the substrate lead-out section 33 .

<3. Simultaneous processing device 40>
FIG. 3 is a diagram schematically showing an example of the configuration of the simultaneous processing device 40. As shown in FIG. Here, the dehydration and baking device 13 will be described as an example of the simultaneous processing device 40 . FIG. 3 is a schematic plan view showing an example of the configuration of the dehydration baking device 13 as viewed vertically downward.

<3-1. Dehydration baking device 13>
The dehydration baking device 13 includes a heating section 82 and a cooling section 83 . The dehydration baking apparatus 13 receives from the transport robot (transport unit) 81 the substrates W that have been cleaned by the cleaning apparatus 12 (which is the sequential processing apparatus 30), and processes the received substrates W at the same time. The dehydration baking device 13 can process a plurality of (N) substrates W at the same time. First, for the sake of simplicity, the case where two substrates W are processed together will be described below. A case where N substrates W are processed without being batched will be described in detail later.

<3-1-1. Transport robot 81>
The transport robot 81 has a hand H<b>1 , a moving mechanism 51 , an elevating mechanism 52 and a rotating mechanism 53 . The moving mechanism 51 can move the hand H1 within the horizontal plane. For example, the moving mechanism 51 has a pair of arms (not shown). Each arm has a plurality of elongate connecting members, and the ends of the connecting members are rotatably connected. One end of each arm is connected to the hand H<b>1 and the other end is connected to the lifting mechanism 52 . By controlling the connection angle of the connection member, the hand H1 can be moved within the horizontal plane. The elevating mechanism 52 raises and lowers the hand H1 by raising and lowering the arm along the vertical direction. The lifting mechanism 52 has, for example, a ball screw mechanism. The rotating mechanism 53 can rotate the lifting mechanism 52 around a vertical rotating shaft. Thereby, the hand H1 rotates along the circumferential direction. By this rotation, the orientation of the hand H1 can be changed. The rotating mechanism 53 has, for example, a motor.

Two substrates W are placed on the hand H1 so as to be aligned in one horizontal direction (horizontal direction in FIG. 3). The hand H1 has, for example, a plurality of finger-like members F1 and a proximal end member P1 connecting the proximal ends of the finger-like members F1. One end of the arm described above is connected to the base end member P1. The finger-like member F1 has an elongated shape, and the substrate W is placed on its upper surface. The two substrates W are placed side by side along the longitudinal direction of the finger member F1 (horizontal direction in FIG. 3). Therefore, the length of the finger member F1 in the longitudinal direction is set according to the length of the two substrates W and the distance between the substrates W. As shown in FIG.

By appropriately moving and rotating the hand H1, the transport robot 81 moves the hand H1 to the heating section 82, the cooling section 83, the substrate lead-out section 33 of the cleaning device 12, and the next-process coating-related device 14 (not shown in FIG. 3). can be moved to each of the The transport robot 81 collectively takes out two substrates W from the substrate lead-out portion 33, the heating portion 82, and the cooling portion 83, or collectively takes out the two substrates W from the heating portion 82, the cooling portion 83, and the cooling portion 83. It can be delivered to each of the application-related devices 14 .

For example, the transport robot 81 collectively takes out two substrates W from the substrate lead-out portion 33 as follows. That is, the transport robot 81 moves the hand H1 to the substrate lead-out portion 33 so as to position the hand H1 below the two substrates W held by the substrate lead-out portion 33 .

The rollers 331 and 332 are configured to avoid collision with the hand H1 of the transfer robot 81. FIG. Then, the transport robot 81 can lift the N substrates W with the hand H1 by raising the hand H1 vertically upward. As a result, the two substrates W are separated from the rollers 331 and 332, respectively. The two substrates W are placed side by side on the hand H1 with a space therebetween along the longitudinal direction. The two substrates W are placed on the hand H1 in such a posture that the normal direction of their main surfaces is along the vertical direction.

The two substrates W may be placed side by side on the hand H1 with an interval along the horizontal direction (transverse direction). Such placement is realized, for example, by providing a turntable and rotating the substrate W by 90 degrees.

Next, the transport robot 81 moves the hand H1 away from the substrate lead-out portion 33 to take out the two substrates W from the substrate lead-out portion 33 at once.

A plurality of suction ports may be formed on the upper surface of the finger-like member F1 (the surface on which the substrate W is placed). The suction port is provided at a position facing the two substrates W, and the substrate W is sucked by drawing air from the suction port. Thereby, the holding force for holding the substrate W can be improved.

The transfer robot 81 collectively takes out two substrates W from each of the heating section 82 and the cooling section 83 by the same operation as the above operation. On the other hand, the transfer robot 81 transfers the two substrates W collectively to each of the heating section 82, the cooling section 83, and the coating-related device 14 (hereinafter referred to as each section) in a procedure opposite to the above operation. That is, the transport robot 81 moves the hand H1 on which two substrates W are placed to the inside of each part, lowers the hand H1, and collectively places the two substrates W on the upper surface of the substrate holding part of each part. Place. In addition, the substrate holding part of each part is configured so as not to collide with the hand H1 when the two substrates W are carried in and out. Then, the transport robot 81 moves the hand H1 from the inside to the outside of each part. As a result, two substrates W are collectively transferred to each section.

As described above, the transport robot 81 arranges and holds N (two) substrates W out of the plurality of substrates W processed by the cleaning device 12, which is a sequential processing device, in one horizontal direction. A number of (two) substrates W can be collectively transported to the dehydration baking device 13, which is a simultaneous processing device. By collectively transporting a plurality of substrates W, the throughput of the transport operation can be improved compared to the case where the substrates W are transported one by one.

<3-1-2. heating unit 82>
Two substrates W are collectively transferred from the transfer robot 81 to the heating unit 82 . The heating unit 82 includes a substrate holding unit 91 that holds the two substrates W side by side in the horizontal direction, and a heating means 92 that simultaneously heats the two substrates W collectively. . In other words, the heating unit 82 heats the two substrates W at the same time.

The substrate holding part 91 has a member that supports the lower surfaces of the two substrates W. As shown in FIG. Two substrates W are held by being placed on this member. The two substrates W are placed in such a posture that the normal direction of the main surface thereof is along the vertical direction. For example, the substrate holder 91 has a plurality of lift pins (not shown). The plurality of lift pins move up and down between an upper position where the tips thereof protrude from the upper surface of the substrate holding portion 91 and a lower position where they are retracted below the upper surface. The transport robot 81 retreats from the heating unit 82 after passing the two substrates W to a plurality of lift pins protruding upward. The plurality of lift pins descend while supporting the two substrates W, and place the two substrates W on the upper surface of the substrate holder 91 .

The heating means 92 is, for example, a heater, and heats the two substrates W held by the substrate holding part 91 collectively and simultaneously. By this heat treatment, for example, pure water remaining on the substrate W can be evaporated (dehydration treatment). By performing the heat treatment on a plurality of substrates W at the same time, the throughput of the heat treatment can be improved as compared with the case where the substrates W are subjected to the heat treatment one by one.

<3-1-3. cooling unit 83>
Two substrates W heated by the heating unit 82 are collectively transferred from the transport robot 81 to the cooling unit 83 . In other words, the transport robot 81 holds two substrates W, which have been processed by the cleaning device 12 as a processing device and then by the heating unit 82, side by side in one horizontal direction, while holding the two substrates W. It conveys to the cooling part 83 collectively. The cooling section 83 includes a substrate holding section 93 that holds the two substrates W side by side in the horizontal direction, and a cooling means 94 that cools the two substrates W collectively. In other words, the cooling unit 83 cools the two substrates W at the same time.

The substrate holding part 93 has a member (not shown) that supports the lower surfaces of the two substrates W. As shown in FIG. Two substrates W are held by being placed on this member. The two substrates W are placed in such a posture that the normal direction of the main surface thereof is along the vertical direction. The structure of the substrate holding portion 93 is similar to that of the substrate holding portion 91 .

The cooling means 94 is, for example, a cooling plate that causes cold water to flow through liquid paths formed inside the metal plate, and collectively cools the two substrates W held by the substrate holding portion 93 . The cooling means 94 is controlled by the controller 60 . By this cooling process, the two substrates W are cooled, and the temperatures of the two substrates W can be adjusted to temperatures suitable for downstream processing equipment (coating-related equipment 14). By simultaneously performing the cooling process on two substrates W, the throughput of the cooling process can be improved as compared with the case where the cooling process is performed on the wafers W one by one.

The cooling unit 83 may cool the two substrates W by natural cooling. Natural cooling is to cool the heated substrate W by leaving it to stand without cooling the substrate W using power (electric power). In this case, the cooling means 94 such as a cooling plate is unnecessary.

<3-1-4. A series of processes of the dehydration baking device>
Next, a series of processes by the dehydration baking device 13 will be briefly described. The transport robot 81 collectively takes out the two substrates W from the substrate lead-out section 33 of the cleaning device 12 on the upstream side, and transfers the two substrates W collectively to the heating section 82 . The heating unit 82 also holds the two substrates W side by side in the horizontal direction. The heating unit 82 heats the two substrates W collectively. The two substrates W after the heat treatment are collectively taken out by the transport robot 81 and delivered collectively to the cooling section 83 . The cooling unit 83 also holds the two substrates W side by side in the horizontal direction. The cooling unit 83 cools the two substrates W collectively. The two substrates W that have undergone the cooling process are collectively taken out by the transport robot 81 and transported collectively to the coating-related apparatus 14 .

<4. Control section>
As illustrated in FIG. 1, the substrate processing apparatus 1 has a control unit 60 that controls processing in each processing apparatus and substrate transfer. FIG. 4 is a functional block diagram schematically showing an example of the configuration of the control section 60. As shown in FIG.

The control unit 60 is a control circuit, and as shown in FIG. It is composed of common computers interconnected via a bus line 65 . A ROM 62 stores basic programs and the like, and a RAM 63 serves as a work area when the CPU 61 performs predetermined processing. The storage device 64 is composed of a flash memory or a non-volatile storage device such as a hard disk device.

In addition, in the control section 60 , an input section 66 , a display section 67 and a communication section 68 are also connected to the bus line 65 . The input unit 66 is composed of various switches, a touch panel, or the like, and receives various input setting instructions such as processing recipes from the operator. The display unit 67 is composed of a liquid crystal display device, a lamp, etc., and displays various information under the control of the CPU 61 . The communication unit 68 has a data communication function via a LAN (Local Area Network) or the like.

In addition, each robot (such as a transport robot such as an indexer robot) and each of the above-described processing devices are connected to the control unit 60 as objects to be controlled. That is, the controller 60 can function as a transport controller that controls transport of the substrate W. FIG.

A storage device 64 of the control unit 60 stores a processing program P for controlling each device constituting the substrate processing apparatus 1 . By executing the processing program P by the CPU 61 of the control unit 60, the substrate transport operation and processing operation are controlled. Also, the processing program P may be stored in a recording medium. By using this recording medium, the processing program P can be installed in the control unit 60 (computer). Some or all of the functions executed by the control unit 60 do not necessarily have to be realized by software, and may be realized by hardware such as a dedicated logic circuit.

The control unit 60 may have a multi-hierarchical structure. For example, the controller 60 may include a main controller and multiple terminal controllers. The end control section is provided in each processing device, for example, the indexer section 11, the cleaning device 12, the dehydration baking device 13, the coating related device 14, the prebaking device 15, the exposure device 16, the developing device 17, and the postbaking device 18. A main controller is provided in the substrate processing apparatus 1 and communicates with a plurality of terminal controllers. The main controller manages the overall operation of the substrate processing apparatus 1, and the terminal controller controls the operations of the corresponding devices.

Multiple end controllers can communicate with each other. For example, data relating to substrates W is transmitted and received between end controllers. The data about the substrate W indicates, for example, the data of the substrate W in group units, and information indicating the content of the processing of the substrate W is included in the data. The terminal control unit controls the corresponding device and processes the substrate W based on the data of the substrate W received from the terminal control unit on the upstream side. For example, the terminal control unit of the cleaning apparatus 12 receives data of the substrates W from the terminal control unit of the indexer unit 11, and the substrates W are loaded into the cleaning apparatus 12 in groups. The terminal controller of the cleaning device 12 controls the cleaning device 12 based on the received substrate data to perform cleaning processing on the loaded substrate W. FIG. After the processing of the substrates W is completed, the wafers W are conveyed to the dehydration bake apparatus 13 in group units, and the data of the substrates W are transmitted from the terminal controller of the cleaning apparatus 12 to the terminal apparatus of the dehydration bake apparatus 13 . Thereafter, processing is performed in the same manner.

<5. Simultaneous processing substrate data>
The control unit 60 can handle substrate data corresponding to each substrate W. FIG. The control unit 60 controls the processing of the substrate W in the simultaneous processing apparatus 40 based on the simultaneously processed substrate data D0(k).

FIG. 5 is a diagram schematically showing an example of simultaneously processed substrate data D0(k) (k is a positive integer). Simultaneously processed substrate data D0(k) includes data corresponding to N substrates W (two substrates in this case) belonging to the k-th group. Substrates W belonging to the same group are collectively transported when transported between the simultaneous processing apparatus and the sequential processing apparatus.

As illustrated in FIG. 5, the simultaneously processed substrate data D0(k) includes substrate number, group identification information Da1, position information Db1, and recipe information Dc1.

The substrate number is information for identifying substrates W belonging to the same group. In the example shown in FIG. 5, the substrate number of one substrate W is (substrate) W1, and the substrate number of the other substrate W is (substrate) W2.

The group identification information Da1 indicates to which group the concurrently processed substrate data D0(k) corresponds. In the example shown in FIG. 5, since a pair of substrates belong to one group, the pair number k is adopted as the group identification information Da1. For example, the pair number 1 is adopted as the group identification information Da1 in the simultaneously processed substrate data D0(1) for the first group. Similarly, the pair number 2 is employed as the group identification information Da1 in the simultaneously processed substrate data D0(2) for the second group.

FIG. 6 is a diagram schematically showing how a plurality of substrates are housed in groups in the cassette 10. As shown in FIG. A plurality of substrates are accommodated in different accommodation positions (slots) in each group in the cassette 10 . Therefore, information (slot number) indicating the accommodation position of the group in the cassette 10 may be employed as the group identification information Da1.

The manner in which the substrates W are accommodated in the cassette 10 is common between the case where the substrates W are transferred from the indexer section 11 to the cleaning device 12 and the case where the substrates are transferred from the post-bake device 18 to the indexer section 11 .

Different slots in FIG. 6 are located above and below the figure. FIG. 6 illustrates a case where two substrates W1(k) and W2(k) are stored in any k-th group.

In the cassette 10, substrates W1(k) and W2(k) belonging to the k-th group (k=1 to 7 in FIG. 6) are stored in the horizontal direction in the figure. Substrate W1(k) can be considered as an example of substrate W1 described above, and substrate W2(k) as an example of substrate W2 described above.

The positional information Db1 indicates the positional relationship of N (here, two) substrates W in the transport direction. In the example shown in FIG. 5, the substrate W1(k) corresponding to the substrate number W1 in the k-th group is positioned upstream with respect to the substrate W2(k) corresponding to the substrate number W2. Position information Db1 for W1 and W2 indicates "upstream" and "downstream", respectively. The position information Db1 is mainly used for transport control in the sequential processing device 30 . Specifically, the sequential processing apparatus 30 first transports the substrate W2(k) to which the “downstream” position information Db1 is assigned, and then transports the substrate W1(k) to which the “upstream” position information Db1 is assigned. to convey.

In the following description, the larger the value indicated by the group identification information Da1, the further upstream the substrate belonging to the group corresponding to the group identification information Da1 is transported. For example, when the substrates stored in the slots shown at the top in FIG. , substrate W2(3) is transported upstream of substrate W1(2), substrate W1(2) is transported upstream of substrate W2(2), and substrate W2(2) is transported upstream of substrate W1(1). are transported upstream, and substrate W1(1) is transported upstream of substrate W2(1).

The recipe information Dc1 is information indicating a process (for example, recipe number) and information on processing conditions in the processing.

As processing conditions, for example, in the case of cleaning processing, conditions such as the type of chemical solution used, the flow rate of the chemical solution, and the processing time (that is, the transport speed) can be employed. For example, in the case of dehydration baking treatment, conditions such as heating temperature, heating time, cooling temperature and cooling time can be adopted as the treatment conditions.

Since the recipe information Dc1 is information common to the substrates W1(k) and W2(k), the recipe information Dc1 is common to the substrate numbers W1 and W2 and corresponds to the group identification information Da1.

FIG. 7 is a diagram schematically showing another mode in which a plurality of substrates W are accommodated in groups in the cassette 10. As shown in FIG. In FIG. 7, only the substrate W1(2) is stored without storing the substrate W2(2) in the second group, and only the substrate W2(5) is stored without storing the substrate W1(5) in the fifth group. A case of storage is exemplified.

FIG. 8 is a diagram schematically showing an example of simultaneously processed substrate data D0(k) when there is no downstream substrate W2(k) in the kth group. FIG. 9 is a diagram schematically showing an example of simultaneously processed substrate data D0(k) when there is no substrate W1(k) on the upstream side in the kth group. 7, FIG. 5 corresponds to k=1, 3, 4, 6, 7, FIG. 8 corresponds to k=2, and FIG. 9 corresponds to k=5. Equivalent to.

In FIGS. 5, 8, 9, 11, 12, and 15, columns marked with a symbol "x" indicate that the value corresponding to the column has no particular meaning. Here, "having no meaning" includes not only the absence of a substrate but also the presence of some object that is not subject to evaluation.

Similar to FIG. 3, FIG. 10 is a schematic plan view showing the simultaneous processing device 40 (for example, the dehydration baking device 13) viewed vertically downward. FIG. 10 schematically shows an example of substrate transfer in the simultaneous processing apparatus 40. As shown in FIG. FIG. 3 illustrates a case where substrates W are processed as a pair. FIG. 10 illustrates a case where substrates W are processed in groups. However, the substrate W2(1) does not exist in the first group, but the substrate W1(1) exists, and the substrate W1(2) does not exist in the second group, but the substrate W2(2) exists. , and the third group includes both substrates W1(3) and W2(3). The positions of virtual substrates W2(1) and W1(2), if present, are indicated by dashed-dotted lines.

10, FIG. 5 corresponds to the case of k=3, FIG. 8 corresponds to the case of k=1, and FIG. 9 corresponds to the case of k=2.

It can be said that the simultaneous processing apparatus 40 simultaneously processes the substrates W1(k) and W2(k) for each group based on the simultaneous processing substrate data D0(k) set for each group. From this point of view, the indexer section 11 can also be regarded as an example of the simultaneous processing device 40 .

<6. Substrate data for sequential processing>
Processing substrate data J1(k) and J2(k) are sequentially set for each substrate W1(k) and W2(k) belonging to the k-th group. The sequentially processed substrate data J1(k) includes group identification information Da1, position information Db1, and recipe information Dc1 for the corresponding substrate W1(k). The sequentially processed substrate data J2(k) includes position information Db1 and recipe information Dc1 for the corresponding substrate W2(k).

In the following description, sequentially processed substrate data J1(k) includes substrate number W1, and sequentially processed substrate data J2(k) includes substrate number W2. However, since the sequentially processed substrate data J1(k) is set for the substrate W1(k), it is not necessary to include the substrate number W1. Since the sequentially processed substrate data J2(k) is set for the substrate W2(k), there is no need to include the substrate number W2.

The sequentially processed substrate data J1(k) and J2(k) are generated by the controller 60 from the simultaneously processed substrate data D0(k). Based on the sequentially processed substrate data J1(k) and J2(k), the controller 60 controls the sequential processing apparatus 30 (for example, the cleaning apparatus 12 located downstream of the indexer section 11 and upstream of the dehydration baking apparatus 13). It controls transport and processing for substrates W1(k) and W2(k).

The sequential processing apparatus 30 sequentially transports the substrates W1(k) and W2(k) divided into a plurality of groups, and processes the substrates W1(k) based on the sequential processing substrate data J1(k) and J2(k). k) and W2(k) are processed.

<6-1. If there is no lack of substrates in the group>
In this section, the case where substrates W1(k) and W2(k) are present in all of the k-th group (k=1, 2, 3) will be described. FIG. 5 corresponds to the simultaneously processed substrate data D0(k) in this case. FIG. 11 schematically shows an example of the sequentially processed substrate data J1(k) in this case. FIG. 12 schematically shows an example of the sequentially processed substrate data J2(k) in this case.

The group identification information Da1 included in the simultaneously processed substrate data D0(k) is adopted as the group identification information Da1 for both the sequentially processed substrate data J1(k) and J2(k). Accordingly, the grouping of the substrates W is maintained in the sequential processing apparatus 30, and the transport and processing of the substrates W are managed for each group.

The position information Db1 (“upstream”) corresponding to the substrate number W1 in the simultaneously processed substrate data D0(k) is adopted as the position information Db1 of the sequentially processed substrate data J1(k). The position information Db1 (“downstream”) corresponding to the substrate number W2 in the simultaneously processed substrate data D0(k) is adopted as the position information Db1 of the sequentially processed substrate data J2(k). In both the simultaneous processing apparatus 40 and the sequential processing apparatus 30, the transport position relationship of the substrates W is maintained, and the transport and processing of the substrates W are managed for each group.

The recipe information Dc1 included in the simultaneously processed substrate data D0(k) is employed for both the sequentially processed substrate data J1(k) and J2(k). This is because the recipe information Dc1 is information indicating processing to be performed in common for both substrates W1(k) and W2(k) and processing conditions for the processing.

Both of the sequentially processed substrate data J1(k) and J2(k) include the final information Dd1. The final information Dd1 indicates that the substrate Wn(k) is the last in the transport direction in the k-th group to which the substrate Wn(k) corresponding to the substrate number Wn (n is an integer from 1 to N) belongs. indicates whether or not Here, the number of substrates W belonging to the k-th group is N=2, both substrates W1(k) and W2(k) exist, and the transfer position of substrate W1(k) is substrate W2(k). upstream from the transport position of Therefore, the final information Dd1 in the sequentially processed substrate data J1(k) indicates that the substrate W1(k) corresponding to the sequentially processed substrate data J1(k) is the last in the k-th group (this is also the most upstream). ) is adopted. No particular value is adopted for the final information Dd1 in the sequentially processed substrate data J1(k).

Note that there is a case where none of the sequentially processed substrate data J1(k) and J2(k) need include the final information Dd1. This case will be explained later in <6-2-2> and <6-2-3>.

FIG. 13 is a side view schematically showing an example of substrate transfer in the sequential processing apparatus 30. As shown in FIG. In FIG. 13, illustration of a configuration for supplying liquid and gas and a configuration for recovering liquid from the configuration of the sequential processing apparatus 30 shown in FIG. 2 is omitted.

In the state shown in FIG. 13, substrates W1(3) and W2(3) are positioned in substrate introduction portion 31. In the state shown in FIG. A sensor 314 detects that the substrate W1(3) is placed on the roller 311 . A sensor 315 detects that the substrate W2(3) is placed on the roller 313 .

The substrate W1(2) is positioned in the chemical liquid section 34 downstream of the substrates W1(3) and W2(3). The substrate W2(2) is positioned in the washing section 35 downstream of the substrate W1(2).

The substrates W1(1) and W2(1) are positioned in the substrate lead-out portion 33 downstream of the substrate W2(2). A sensor 334 detects that the substrate W<b>1 ( 1 ) is placed on the roller 331 . A sensor 335 detects that the substrate W2(1) is placed on the roller 332 .

Prior to this state, the substrates W1(1) and W2(1) are positioned in the substrate introduction portion 31, and then the substrates W1(1) and W2(1) are transported to the main body 32 of the processing apparatus. The control unit 60 sequentially generates processing substrate data J1(1) and J2(1) in response to detection of the presence of the substrates W1(1) and W2(1) by the sensors 314 and 315, for example. After that, substrates W1(2) and W2(2) are positioned in the substrate introduction section 31 in the same manner, substrate data to be processed J1(2) and J2(2) are sequentially generated, and substrates W1(3) and W2(3) are generated. ) are positioned in the substrate introduction portion 31, and the processed substrate data J1(3) and J2(3) are generated sequentially.

After the state shown in FIG. 13, the substrates W1(1) and W2(1) are discharged from the substrate lead-out section 33 to the downstream simultaneous processing device 40 (for example, the dehydration bake device 13).

The control unit 60 generates simultaneously processed substrate data D0(k) from the sequentially processed substrate data J1(k) and J2(k). For example, when the sensor 334 detects the substrate W1(k) corresponding to the sequentially processed substrate data J1(k) in which "END" is adopted as the final information Dd1, the simultaneously processed substrate data D0(k) is generated. be done.

Simultaneously processed substrate data D0(1) is generated from the sequentially processed substrate data J1(1) and J2(1) as follows.

The group identification information Da1 common to the sequentially processed substrate data J1(1) and J2(1) is adopted as the group identification information Da1 in the simultaneously processed substrate data D0(1). As a result, the grouping of the substrates W is maintained in the downstream simultaneous processing apparatus 40 as well, and the transport and processing of the substrates W are managed for each group.

The recipe information Dc1 common to the sequentially processed substrate data J1(1) and J2(1) is adopted as the recipe information Dc1 in the simultaneously processed substrate data D0(1). This is because the recipe information Dc1 is information indicating processing to be performed in common for both substrates W1(1) and W2(1) and processing conditions for the processing.

The position information Db1 (“upstream”) in the sequentially processed substrate data J1(1) is adopted as the position information Db1 for the substrate number W1 in the simultaneously processed substrate data D0(1). The position information Db1 in the sequentially processed substrate data J2(1) is adopted as the position information Db1 for the substrate number W2 in the simultaneously processed substrate data D0(1) (“downstream”). The position information Db1 is not necessarily used in the simultaneous processing device 40, but is used in another sequential processing device 30 (for example, the developing device 17) further downstream than the simultaneous processing device 40 concerned. The use of the position information Db1 in the simultaneously processed substrate data D0(1) contributes to the generation of the sequentially processed substrate data J1(1) and J2(1) used in the other sequential processing apparatus 30. FIG.

The transport position of the substrate W has little relation to the processing in the simultaneous processing apparatus 40 . As will be described later, the final information Dd1 is information that varies depending on the lack of substrates in the sequential processing apparatuses 30, and does not need to be commonly adopted in the plurality of sequential processing apparatuses 30. FIG. Therefore, the need to hold the final information Dd1 in the simultaneously processed substrate data D0(k) is small and can be omitted.

After the substrates W1(1) and W2(1) are discharged from the substrate lead-out portion 33 , the processing in the processing apparatus 30 progresses sequentially and the substrates W1(2) and W2(2) are positioned in the substrate lead-out portion 33 . The simultaneously processed substrate data D0(2) is generated from the sequentially processed substrate data J1(2) and J2(2) in the same manner as the simultaneously processed substrate data D0(1). After that, the simultaneously processed substrate data D0(3) is generated from the processed substrate data J1(3) and J2(3) in the same manner.

Processing by the simultaneous processing apparatus 40 is performed based on simultaneously processed substrate data D0(k) corresponding to each group, grouping is maintained upstream and downstream of the sequential processing apparatus 30, and substrates W are transported and processed for each group. is managed.

<6-2. If the substrate is missing in the group>
In this section, the case where there is no substrate W1(k), W2(k) in any of the k-th group (k=1, 2, 3) is described.

<6-2-1. When the substrate on the upstream side is excluded in the sequential processing apparatus>
FIG. 5 corresponds to the simultaneously processed substrate data D0(k) in this case. FIG. 11 is a diagram schematically showing an example of sequentially processed substrate data J1(k) generated first in this case. FIG. 12 schematically shows an example of sequentially processed substrate data J2(k) generated first in this case. “First generated” means generated when the substrates W 1 ( k ) and W 2 ( k ) are positioned in the substrate introduction portion 31 .

FIG. 14 is a side view schematically showing an example of substrate transfer in the sequential processing apparatus 30. As shown in FIG. In FIG. 14 as well, drawing of the configuration for supplying liquid and gas and the configuration for recovering liquid from the configuration of the sequential processing apparatus 30 shown in FIG. 2 is omitted.

The state shown in FIG. 14 shows a state in which the substrate W1(1), which existed in the state shown in FIG. The position of substrate W1(1) before being rejected is virtually indicated by a dashed line.

Such removal is performed by the operator, for example, when the substrate W1(1) is damaged in the draining section 36 or when a processing failure including the substrate W(1) falling from the rollers 321 occurs.

The operator who performed such exclusion operates the control unit 60 to cause the control unit 60 to delete the processing substrate data J1(1) sequentially. When deleting the sequentially processed substrate data J1(1), the control unit 60 confirms the content of the final information Dd1. Although the final information Dd1 of the sequentially processed substrate data J1(1) is "END", the substrate W1(1) has been excluded. The sequentially processed substrate data J2(1) corresponding to the substrate W2(1) is generated again. The re-generation referred to here also includes transmitting "END" as the final information Dd1 to the sequentially processed substrate data J2(1). Specifically, the group identification information Da1, the position information Db1, and the recipe information Dc1 of the sequentially processed substrate data J2(1) are maintained, and "END" is adopted as the final information Dd1. Such re-generation of the sequentially processed substrate data J2(1) can be said to be updating of the sequentially processed substrate data J2(1).

Before the sequentially processed substrate data J1(1) is deleted, the sequentially processed substrate data J1(1) corresponds to the case of k=1 in FIG. The sequentially processed substrate data J2(1) before being updated corresponds to the case of k=1 in FIG. FIG. 15 shows the sequentially processed substrate data J2(k) after being updated. The updated sequentially processed substrate data J2(1) corresponds to the case of k=1 in FIG. 15, and "END" is adopted as the final information Dd1. The configuration shown in FIG. 15 differs from the configuration shown in FIG. 12 only in that "END" is adopted as the final information Dd1.

Simultaneously processed substrate data D0(1) is generated when the sensor 335 detects substrate W2(1) corresponding to sequentially processed substrate data J2(1) in which "END" is adopted as final information Dd1. be. The substrate W<b>2 ( 1 ) is delivered from the substrate lead-out portion 33 .

The simultaneously processed substrate data D0(1) is generated using the sequentially processed substrate data J2(1) without using the deleted sequentially processed substrate data J1(1).

The group identification information Da1 in the sequentially processed substrate data J2(1) is adopted as the group identification information Da1 in the simultaneously processed substrate data D0(1). As a result, the grouping of the substrates W is maintained in the downstream simultaneous processing apparatus 40 as well, and the transport and processing of the substrates W are managed for each group.

The recipe information Dc1 in the sequentially processed substrate data J2(1) is adopted as the recipe information Dc1 in the simultaneously processed substrate data D0(1). This is because the recipe information Dc1 is information indicating the processing to be performed on the substrate W2(1) and the processing conditions for the processing regardless of the presence or absence of the substrate W1(1).

The substrate number W1 and the position information Db1 for the substrate number W1 are not adopted in the simultaneous processing substrate data D0(1). The position information Db1 in the sequentially processed substrate data J2(1) is adopted as the position information Db1 for the substrate number W2 in the simultaneously processed substrate data D0(1). The final information Dd1 is unnecessary in the simultaneously processed substrate data D0(k).

In this way, the processing by the simultaneous processing apparatus 40 is performed based on the simultaneously processed substrate data D0(k) corresponding to each group, and even if the substrate W is removed, the groups are sequentially processed upstream and downstream of the processing apparatus 30. Separation is maintained and transport and processing of substrates W is managed in groups.

For example, the sequentially processed substrate data J2(1) updated by adopting "END" as the final information Dd1 is obtained, and when the substrate W2(1) is detected by the sensor 335, an alarm is generated, for example, on the display unit. 67. Such an alarm indicates that the substrate W has been removed and the number of substrates forming the group is not normal, and contributes to alerting the operator of the substrate processing apparatus 1 .

<6-2-2. When the presence or absence of substrates on the upstream side is confirmed in the sequential processing apparatus>
In the method described in this section, the value of the final information Dd1 is irrelevant, and none of the sequentially processed substrate data J1(k) and J2(k) need include the final information Dd1.

As a first example in which the presence or absence of the substrate on the upstream side is confirmed in the sequential processing apparatus, the substrate W1(1) is transported in the sequential processing apparatus 30 as described in <6-2-1>, There is a case where the operator removes it while it is being processed. As a second example, when the substrate W is transported to the substrate loading section 31, the substrate W1(k) on the upstream side already does not exist, and the substrate number W1 also exists in the simultaneously processed substrate data D0(k). There are cases where it was not. In the following description, both the first example and the second example exemplify the case where the substrate W1(1) does not exist and the substrate W2(1) exists.

FIG. 16 is a side view schematically showing an example of substrate transfer in the sequential processing apparatus 30. As shown in FIG. In FIG. 16 as well, drawing of the configuration for supplying liquid and gas and the configuration for recovering liquid from the configuration of the sequential processing apparatus 30 shown in FIG. 2 is omitted.

In the first example, as described in <6-2-1>, the control unit 60 sequentially deletes the processing substrate data J1(1). The sequentially processed substrate data J2(1) may maintain the structure with k=1 in FIG. 12, or may be updated to the structure with k=1 in FIG.

In the second example, when the simultaneously processed substrate data D0(1) has a structure where k=1 in FIG. Generate board data J2(1). The sequentially processed substrate data J2(1) may have a structure with k=1 in FIG. 15 or a structure with k=1 in FIG. The sequentially processed substrate data J2(1) may not include the final information Dd1.

In neither the first example nor the second example, the sequentially processed substrate data J1(1) does not exist, the substrate W1(1) is not detected by the sensor 334, and the substrate W1(1) is not detected. Absence is confirmed. Triggered by this confirmation and the detection of the substrate W2(1) by the sensor 335, the simultaneously processed substrate data D0(1) is generated using the sequentially processed substrate data J2(1). The substrate W<b>2 ( 1 ) is delivered from the substrate lead-out portion 33 .

For example, when the sensor 335 detects the substrate W2, the control unit 60 sets the group identification information Da1 of the sequentially processed substrate data of the substrate W2 and the group of the sequentially processed substrate data of the substrate W one upstream side of the substrate W2. It is compared with the identification information Da1. Arranging the sequentially processed substrate data in the order of transport makes it easy for the controller 60 to specify the sequentially processed substrate data for two substrates W transported adjacently. If these two group identification information Da1 are different from each other, the substrate W1 belonging to the same group as the substrate W2 is missing. In this case, the control unit 60 generates the simultaneously processed substrate data D0(1) using the sequentially processed substrate data J2(1) in the above example. Without waiting for the detection of the substrate W by the sensor 334 , the substrate W<b>2 ( 1 ) is discharged from the substrate lead-out portion 33 .

Simultaneously processed substrate data D0(1) is generated using sequentially processed substrate data J2(1) without using (deleted or not generated) sequentially processed substrate data J1(1).

The group identification information Da1 in the sequentially processed substrate data J2(1) is adopted as the group identification information Da1 in the simultaneously processed substrate data D0(1). As a result, the grouping of the substrates W is maintained in the downstream simultaneous processing apparatus 40 as well, and the transport and processing of the substrates W are managed for each group.

The recipe information Dc1 in the sequentially processed substrate data J2(1) is adopted as the recipe information Dc1 in the simultaneously processed substrate data D0(1).

The substrate number W1 and the position information Db1 for the substrate number W1 are not adopted in the simultaneous processing substrate data D0(1). The position information Db1 in the sequentially processed substrate data J2(1) is adopted as the position information Db1 for the substrate number W2 in the simultaneously processed substrate data D0(1). The final information Dd1 is unnecessary in the simultaneously processed substrate data D0(k).

In this way, the processing by the simultaneous processing apparatus 40 is performed based on the simultaneously processed substrate data D0(k) corresponding to each group, and even if the substrate W is removed, the groups are sequentially processed upstream and downstream of the processing apparatus 30. Separation is maintained and transport and processing of substrates W is managed in groups.

For example, when there is no sequentially processed substrate data J1(1), the sensor 334 does not detect the substrate W1(1), and the sensor 335 detects the substrate W2(1), an alarm is generated, for example, on the display unit. 67. Such an alarm indicates that the substrate W has been removed and the number of substrates forming the group is not normal, and contributes to alerting the operator of the substrate processing apparatus 1 .

<6-2-3. When the substrate on the downstream side is missing in the sequential processing apparatus>
In the method described in this section, the value of the final information Dd1 is irrelevant, and none of the sequentially processed substrate data J1(k) and J2(k) need include the final information Dd1.

As a first example in which the presence or absence of a downstream substrate is confirmed in the sequential processing apparatus, the substrate W2(k) is transported in the sequential processing apparatus 30 and removed by the operator while being processed. There are cases. As a second example, when the substrate W is transported to the substrate loading section 31, the substrate W2(k) on the downstream side already does not exist, and the substrate number W2 also exists in the simultaneously processed substrate data D0(k). There are cases where it was not done. In the following description, both the first example and the second example exemplify the case where the substrate W2(1) does not exist and the substrate W1(1) exists.

FIG. 17 is a side view schematically showing an example of substrate transfer in the sequential processing apparatus 30. FIG. In FIG. 17 as well, the drawing of the configuration for supplying liquid and gas and the configuration for collecting liquid from the configuration of the sequential processing apparatus 30 shown in FIG. 2 is omitted.

In the first example, the control unit 60 sequentially deletes the processing substrate data J2(1). In the second example, when the simultaneously processed substrate data D0(1) has a structure in which k=1 in FIG. Generate substrate data J1(1). A structure in which k=1 in FIG. 11 is adopted for the sequentially processed substrate data J1(1). However, the sequentially processed substrate data J1(1) may not include the final information Dd1.

In neither the first example nor the second example, the sequentially processed substrate data J2(1) does not exist and the sequentially processed substrate data J1(1) is generated. When the sensor 335 does not detect the substrate W2(1) and the sensor 334 detects the substrate W1(1), the simultaneously processed substrate data D0(1) is generated. The substrate W<b>1 ( 1 ) is delivered from the substrate lead-out portion 33 .

Simultaneously processed substrate data D0(1) is generated using sequentially processed substrate data J1(1) without using sequentially processed substrate data J2(1) (deleted or not generated).

The group identification information Da1 in the sequentially processed substrate data J1(1) is adopted as the group identification information Da1 in the simultaneously processed substrate data D0(1). As a result, the grouping of the substrates W is maintained in the downstream simultaneous processing apparatus 40 as well, and the transport and processing of the substrates W are managed for each group.

The recipe information Dc1 in the sequentially processed substrate data J1(1) is adopted as the recipe information Dc1 in the simultaneously processed substrate data D0(1).

The substrate number W2 and the position information Db1 for the substrate number W2 are not adopted in the simultaneous processing substrate data D0(1). The position information Db1 in the sequentially processed substrate data J1(1) is adopted as the position information Db1 for the substrate number W1 in the simultaneously processed substrate data D0(1). The final information Dd1 is unnecessary in the simultaneously processed substrate data D0(k).

In this way, the processing by the simultaneous processing apparatus 40 is performed based on the simultaneously processed substrate data D0(k) corresponding to each group, and even if the substrate W is removed, the groups are sequentially processed upstream and downstream of the processing apparatus 30. Separation is maintained and transport and processing of substrates W is managed in groups.

For example, when there is no sequentially processed substrate data J2(1), the sensor 335 does not detect the substrate W2(1), and the sensor 334 detects the substrate W1(1), an alarm is generated, for example, on the display unit. 67. Such an alarm indicates that the substrate W has been removed and the number of substrates forming the group is not normal, and contributes to alerting the operator of the substrate processing apparatus 1 .

<6-2-4. When lack of substrate does not appear in simultaneous processing substrate data>
When the substrate W1(k) on the upstream side does not exist at the time when the substrate W is transported to the substrate introduction section 31, the processing is performed in the same manner as in the second example in <6-2-2>. . The simultaneously processed substrate data D0(1) in the description has a structure with k=1 in FIG.

When the substrate W is transported to the substrate introduction part 31, the case where the substrate W2(k) on the downstream side does not exist is processed in the same manner as in the second example in <6-2-3>. . The simultaneously processed substrate data D0(1) in the description has a structure with k=1 in FIG.

In these second examples, a case was described in which the simultaneous processing substrate data D0(1) showed a missing substrate. An example of such a case is, for example, when the lack of substrates in the cassette 10 is known and the lack of substrates is detected by the transfer robot 81 .

However, it is also conceivable that the lack of substrates does not appear in the concurrently processed substrate data D0(k). For example, even though the simultaneous processing substrate data D0(k) has the configuration shown in FIG. A case (hereinafter referred to as a "third example") is assumed. Alternatively, for example, when the simultaneously processed substrate data D0(k) has the configuration shown in FIG. 5 and the substrate W1(k) is detected by the sensor 314 but the substrate W2(k) is not detected by the sensor 315 (hereinafter referred to as the "fourth example") is also envisioned.

18 and 19 are side views schematically showing examples of substrate transfer in the sequential processing apparatus 30. FIG. FIG. 18 shows a third example, and FIG. 19 shows a fourth example. In FIGS. 18 and 19 as well, the drawing of the configuration for supplying liquid and gas and the configuration for recovering liquid from the configuration of the sequential processing apparatus 30 shown in FIG. 2 is omitted.

In the third example, when the substrates W of the third group are transported to the substrate introduction part 31, the sensor 315 does not detect the substrate W1(3), and the sensor 315 detects the substrate W2(3). A case is illustrated in FIG.

In the third example, the concurrently processed substrate data D0(3) at this time has a configuration with k=3 in FIG. 5, and the lack of substrate W1(3) does not appear. Based on the operation results of the sensors 314 and 315, the control unit 60 does not generate the sequential substrate data J1(3), but sequentially generates the substrate data J2(3). The sequentially processed substrate data J2(3) has a structure with k=3 in FIG.

Alternatively, at this time, the control unit 60 once sequentially generates processing substrate data J1(3) and J2(3), and an alarm is issued by the display unit 67, for example. The operator who recognizes the alarm uses the input unit 66 to cause the control unit 60 to delete the sequentially processed substrate data J1(3) and maintain the sequentially processed substrate data J2(3).

In the fourth example, when the substrates W of the third group are transported to the substrate introduction part 31, the substrate W1(3) is detected by the sensor 314 without detecting the substrate W2(3) by the sensor 315. A case is illustrated in FIG.

In the fourth example, the concurrently processed substrate data D0(3) at this time has the configuration with k=3 in FIG. 5, and the absence of substrate W2(3) does not appear. Based on the operation results of the sensors 314 and 315, the controller 60 does not generate the sequential substrate data J2(3), but sequentially generates the substrate data J1(3). The sequentially processed substrate data J1(3) has a structure with k=3 in FIG.

Alternatively, at this time, the control unit 60 once sequentially generates processing substrate data J1(3) and J2(3), and an alarm is issued by the display unit 67, for example. The operator who recognizes the alarm uses the input unit 66 to cause the control unit 60 to delete the sequentially processed substrate data J2(3) and maintain the sequentially processed substrate data J1(3).

<7. Explanation of Overall Processing>
FIG. 20 is a flow chart illustrating the flow of operations in simultaneous processing device 40 and sequential processing device 30 in this embodiment. The flow chart focuses on the processing in the sequential processing device 30 .

In step S1, the sequential processing apparatus 30 (for example, the cleaning apparatus 12) transfers the substrate W transported from the simultaneous processing apparatus 40 (for example, the indexer section 11) on the upstream side thereof to the entrance section (for example, the substrate introduction section) of the sequential processing apparatus 30. 31).

The control unit 60 receives the concurrently processed substrate data D0(k) used in the concurrently processing apparatus 40 in step S2. Simultaneous processing substrate data D0(k) may be sent from the simultaneous processing device 40 or a further upstream device. For example, the simultaneous processing substrate data D0(k) is transmitted from the indexer section 11 or a device upstream of the indexer section 11 . Simultaneously processed substrate data D0(k) may be obtained, for example, when a substrate W is removed from the cassette 10 .

The simultaneous processing substrate data D0(k) does not necessarily have to be transmitted from the upstream device, and the operator may use the input unit 66 to input the simultaneous processing substrate data D0(k). The order in which steps S1 and S2 are performed may be interchanged. For example, the concurrently processed substrate data D0(k) may be obtained when the control for processing the substrates W without dividing them into groups is changed to the control for processing the substrates W by dividing them into groups.

In step S3, the control section 60 generates one or both of the sequentially processed substrate data J1(k) and the sequentially processed substrate data J2(k) based on the simultaneously processed substrate data D0(k). In the figures after FIG. 20, "and/or" means either one or both of the components before and after it.

For example, in the case described in <6-1>, both processed substrate data J1(k) and J2(k) are generated sequentially.

For example, in the case described in the first example of <6-2-1> and <6-2-2>, the sequentially processed substrate data J1(k) is deleted in step S4, but the sequentially processed substrate data J1(k) is deleted. Both substrate data J1(k) and J2(k) are generated once.

For example, in the case described in the first example of <6-2-3>, although the sequentially processed substrate data J2(k) is deleted in the subsequent step S4, the sequentially processed substrate data J1(k), J2 Both of (k) are generated once.

For example, in the case described in the second example of <6-2-2> and the third example of <6-2-4>, only sequentially processed substrate data J2(k) is generated. For example, in the case described in the second example of <6-2-3> and the fourth example of <6-2-4>, only sequentially processed substrate data J1(k) is generated.

In step S4, the sequential processing device 30 performs sequential processing using either the sequential processing substrate data J1(k) or the sequential processing substrate data J2(k). For example, in the case described in <6-1>, sequential processing is performed using both the sequential processing substrate data J1(k) and J2(k).

For example, in the case described in the first example of <6-2-1> and <6-2-2>, both the sequential processing substrate data J1(k) and J2(k) are used to perform sequential processing. is performed, sequential processing is performed using only the sequentially processed substrate data J2(k). Specifically, after step S3 is performed, the substrate W1(1) is eliminated and no longer exists, and the substrate W2(1) exists. Then, "END" is adopted as the final information Dd1 for the board number W2, leaving only sequentially processed board data J2(1) (see FIG. 15).

For example, in the case described in the first example of <6-2-3>, the sequential processing is performed using both the sequential processing substrate data J1(k) and J2(k), and then the sequential processing is performed. Only substrate data J1(k) is used to perform sequential processing. Specifically, after step S3 is performed, the substrate W2(1) is excluded and no longer exists, and the substrate W1(1) exists. Then, while "END" is adopted as the final information Dd1 for the substrate number W1, only sequentially processed substrate data J1(1) remains (see FIG. 11).

For example, in the case described in the second example of <6-2-2> and the third example of <6-2-4>, only the sequential processing substrate data J2(k) is used to perform sequential processing. will be

For example, in the case described in the second example of <6-2-3> and the fourth example of <6-2-4>, the sequential processing is performed using only the sequentially processed substrate data J1(k). will be

In step S5, the control section 60 generates simultaneously processed substrate data D0(k) based on one or both of the sequentially processed substrate data J1(k) and J2(k). For example, in the case described in <6-1>, simultaneously processed substrate data D0(k) is generated based on both sequentially processed substrate data J1(k) and J2(k).

For example, in the case described in the first and second examples of <6-2-1>, <6-2-2>, and the third example of <6-2-4>, the sequentially processed substrates Simultaneously processed substrate data D0(k) is generated based only on data J2(k).

For example, in the case described in the first and second examples of <6-2-3> and the fourth example of <6-2-4>, based only on the sequentially processed substrate data J1(k) Simultaneously processed substrate data D0(k) is generated.

The substrates W are delivered to the simultaneous processing device 40 at the exit portion (for example, the substrate lead-out portion 33) of the sequential processing device 30. As shown in FIG.

In step S6, simultaneous processing using the simultaneously processed substrate data D0(k) is performed in the simultaneous processing device 40 (for example, the dehydration baking device 13).

FIG. 21 is a flowchart illustrating details of step S3. Step S3 has steps S301 to S305.

In step S301, it is determined whether or not all of the substrate numbers W1 and W2 are present in the simultaneously processed substrate data D0(k). When the result of the determination is affirmative, the process proceeds to step S302, and when the result is negative, the process proceeds to step S305.

For example, <6-1>, <6-2-1>, <6-2-2> first example, <6-2-3> first example, <6-2-4> first example 3 and the fourth example, the result of determination in step S301 is affirmative, and the process proceeds to step S302. For example, in the case described in the second example of <6-2-2> and the second example of <6-2-3>, the result of determination in step S301 is negative, and the process proceeds to step Proceed to S305.

In step S302, it is determined whether or not all of the substrates W1(k) and W2(k) have been detected at the entrance. When the result of the determination is affirmative, the process proceeds to step S303, and when the result is negative, the process proceeds to step S304.

For example, in the case described in the first example of <6-1>, <6-2-1>, <6-2-2>, and the first example of <6-2-3>, step S302 The result of the determination in is affirmative, and the process proceeds to step S303. For example, in the cases described in the third and fourth examples of <6-2-4>, the determination result in step S302 is negative, and the process proceeds to step S304.

In step S303, the simultaneous processing substrate data D0(k) is separated. Here, "separation" refers to obtaining (separately) the group identification information Da1, the position information Db1, and the recipe information Dc1 for each of the substrate numbers W1 and W2. For example, by the processing in step S303, data having the same structure as the concurrently processed substrate data D0(k) having the structure shown in FIG. 8 and concurrently processed substrate data D0(k) having the structure shown in FIG. Data having the same structure is obtained from concurrently processed substrate data D0(k) having the structure shown in FIG.

In step S304, deletion of the board number and position information Db1 corresponding to the board not detected at the entrance is performed. For example, in the case described in the third example of <6-2-4>, the structure of the simultaneously processed substrate data D0(k) is changed from the structure shown in FIG. 5 to the structure shown in FIG. is changed to the structure shown in For example, in the case described in the fourth example of <6-2-4>, the structure of the simultaneously processed substrate data D0(k) is changed from the structure shown in FIG. 5 to the structure shown in FIG. is changed to the structure shown in

Even after step S303 or step S304 is executed, step S305 is executed in the same manner as when a negative result is obtained in the determination in step S301.

In step S305, one or both of the sequentially processed substrate data J1(k) and J2(k) are generated. Of the existing board numbers, "END" is adopted as the final information Dd1 for the most upstream (which is also the last) board number.

For example, in the case described in the first example of <6-1>, <6-2-1>, <6-2-2>, and the first example of <6-2-3>, step S303 is executed, both the substrate W1(k) and the substrate W2(k) exist, and "END" is adopted as the final information Dd1 for the substrate number W1, and the sequentially processed substrate data J1(k), Both J2(k) are generated (see FIGS. 11 and 12).

However, as described above, in the case described in the first example of <6-2-2> and the first example of <6-2-3>, the value of the final information Dd1 is irrelevant. , the addition of the final information Dd1 may be omitted.

For example, in the case described in the third example of <6-2-4>, the substrate number W1 does not exist in the simultaneously processed substrate data D0(3), but the substrate number W2 exists due to the execution of step S304. In step S305, "END" is adopted as the final information Dd1 for the board number W2, and only the sequentially processed board data J2(3) is generated (see FIG. 15).

For example, in the case described in the fourth example of <6-2-4>, the substrate number W2 does not exist in the simultaneously processed substrate data D0(3), but the substrate number W1 exists due to the execution of step S304. In step S305, while "END" is adopted as the final information Dd1 for the substrate number W1, only the sequentially processed substrate data J1(3) is generated (see FIG. 11).

For example, in the case described in the second example of <6-2-2>, the substrate number W1 does not exist in the simultaneous processing substrate data D0(1), but the substrate number W2 exists. In step S305, "END" is adopted as the final information Dd1 for the board number W2, and only the sequentially processed board data J2(3) is generated (see FIG. 15).

For example, in the case described in the second example of <6-2-3>, the substrate number W2 does not exist in the simultaneous processing substrate data D0(1), but the substrate number W1 exists. In step S305, "END" is adopted as the final information Dd1 for the board number W1, and only the sequentially processed board data J1(3) is generated (see FIG. 11).

FIG. 22 is a flowchart illustrating details of step S5. Step S5 has steps S501 to S509. FIG. 23 is a flowchart illustrating details of step S509.

In step S4, the sequential processing device 30 performs sequential processing using either the sequential processing substrate data J1(k) or the sequential processing substrate data J2(k), and then step S501 is executed.

In step S501, it is determined whether or not the substrate W2(k) has arrived at the exit of the sequential processing apparatus 30. FIG. If the determination result is affirmative, the process proceeds to step S502. If the determination result is negative, the process proceeds to step S509.

For example, the case described in the first and second examples of <6-1>, <6-2-1>, <6-2-2>, and the third example of <6-2-4> Otherwise, the result of determination in step S501 is affirmative, and the process proceeds to step S502. For example, in the case described in the first and second examples of <6-2-3> and the fourth example of <6-2-4>, the result of determination in step S501 is negative. Then, the process advances to step S509.

In step S502, it is determined whether or not there is "END" in the final information Dd1 of the sequentially processed substrate data J2(k) (whether or not "END" is adopted). If the result of the determination is affirmative, the process proceeds to step S507. If the determination result is negative, the process proceeds to step S503.

For example, <6-2-1>, the first example of <6-2-2>, and the second example of <6-2-2> (the sequentially processed substrate data J2(k) has the structure shown in FIG. 15). ), "END" is adopted as the final information Dd1 of the sequentially processed substrate data J2(k) by the execution of step S305, and the result of determination in step S502 becomes affirmative. Processing proceeds to step S507. For example, the second example of <6-1> and <6-2-2> (when the sequentially processed substrate data J2(k) has the structure shown in FIG. 12), the third example of <6-2-4> example, the result of determination in step S502 is negative, and the process proceeds to step S503.

In step S503, it is determined whether or not there is a substrate W1(k) (which belongs to the same k-th group as substrate W2(k)) upstream of substrate W2(k). If the determination result is affirmative, the process proceeds to step S504. If the determination result is negative, the process proceeds to step S507.

For example, in the case described in <6-1>, the result of determination in step S503 is affirmative, and the process proceeds to step S504. For example, the second example of <6-2-2> (when the sequentially processed substrate data J2(k) has the structure shown in FIG. 12) and the third example of <6-2-4> are explained. If so, the result of determination in step S503 is negative, and the process proceeds to step S507.

From the above process flow, in the case described in the second example of <6-2-2>, the sequentially processed substrate data J2(k) has the structure shown in FIG. 12 or is shown in FIG. step S507 is executed regardless of whether the

In step S504, it is determined whether the substrate W1(k) has arrived at the exit of the sequential processing apparatus 30 or not. If the result of the determination is negative, step S504 is repeatedly executed, and other processing is awaited. If the result of determination in step S504 is affirmative, the process proceeds to step S505.

Since the execution of step S504 is premised on the affirmative determination in step S503, the process does not stop at step S504.

In step S505, the sequentially processed substrate data J1(k) and J2(k) are combined to generate simultaneously processed substrate data D0(k). Here, "combining" means adopting the data included in the sequentially processed substrate data J1(k) as the data corresponding to the substrate number W1, and the sequentially processed substrate data J2(k) as the data corresponding to the substrate number W2. It means that the concurrently processed substrate data D0(k) is generated by adopting the data that has been stored.

As described above, group identification information Da1 and recipe information Dc1 are common in the same group. In the simultaneously processed substrate data D0(k), it is used as data common to the substrate numbers W1 and W2.

After step S505 is performed, step S506 is performed. At step S506, the substrates W1(k) and W2(k) are delivered to the simultaneous processing unit 40. FIG.

In step S507, the final information Dd1 is deleted from the sequentially processed substrate data J2(k). Simultaneously processed substrate data D0(k) is generated using the sequentially processed substrate data J2(k) from which the final information Dd1 has been deleted.

For example, the first example of <6-2-1> and <6-2-2>, the second example of <6-2-2> (sequential processing board data J2(k) has the structure shown in FIG. 15), "END" was adopted as the final information Dd1 of the sequentially processed substrate data J2(k) by executing step S305. Such final information Dd1 suggests that the substrate W1(k) does not exist, and the sequentially processed substrate data J1(k) is not used to generate the simultaneously processed substrate data D0(k).

For example, in the second example of <6-2-2> (when the sequentially processed substrate data J2(k) has the structure shown in FIG. 12), <6-2- 4>, the sequentially processed substrate data J1(k) was not generated in the case described in the third example. Also in these cases, the sequentially processed substrate data J1(k) is not used to generate the simultaneously processed substrate data D0(k).

After step S507 is performed, step S508 is performed. In step S508, only substrate W2(k) is delivered to simultaneous processing unit 40. FIG.

After steps S506 and S508 are executed, the process proceeds to step S6 (see FIG. 20).

Step S509 includes steps S511 to S513 (see FIG. 23). When the determination in step S501 is negative, step S511 is executed. In step D511, it is determined whether or not the substrate W1(k) has arrived at the exit portion (substrate lead-out portion 33) of the sequential processing apparatus 30. FIG. When the result of the determination is affirmative, the process proceeds to step S512.

When the result of the determination is negative, the process in step S5 ends (see FIG. 22), and the process proceeds to step S6 (see FIG. 20). However, when the determination in step S511 is negative, the substrate W2(k) has not arrived due to the determination in step S501. k) are absent. Therefore, when the determination in step S511 is negative, step S6 regarding the k-th group is not substantially executed.

In step S512, the control unit 60 deletes the final information Dd1 from the sequentially processed substrate data J1(k) without using the sequentially processed substrate data J2(k) to generate the simultaneously processed substrate data D0(k). For example, in the first example of <6-2-3>, the sequentially processed substrate data J2(k) is deleted in step S4. For example, in the second example of <6-2-3> and the fourth example of <6-2-4>, the sequentially processed substrate data J2(k) is not generated.

After the simultaneously processed substrate data D0(k) is generated in step S512, step S513 is executed. In step S513, only substrate W1(k) is delivered to simultaneous processing unit 40. FIG.

Step S509 is completed by having performed step S513, and a process progresses to step S6 (refer FIG. 20).

<8. General explanation>
Based on the discussion of the sections above, the following general discussion is provided.

(i) The substrate processing apparatus 1 includes a sequential processing apparatus 30 that processes the substrates W, a simultaneous processing apparatus 40 that simultaneously processes the substrates W, and a control unit 60 . For example, the substrate processing apparatus 1 includes the cleaning apparatus 12 as the sequential processing apparatus 30 . For example, the substrate processing apparatus 1 includes an indexer section 11 and a dehydration baking apparatus 13 as a simultaneous processing apparatus 40 .

The substrates W are divided into groups. Substrates W1(k), . . . WN(k) belong to the k-th group. The symbol N denotes a positive integer. For example, although N=2 has been described, N≧3 may be satisfied.

The sequential processing apparatus 30 processes the substrates W while sequentially transporting the substrates W based on the sequentially processed substrate data J1(k), . . . JN(k). Sequentially processed substrate data J1(k), . . . JN(k) are set for substrates W1(k), .

The simultaneous processing device 40 simultaneously processes substrates W1(k), . Simultaneously processed substrate data D0(k) is set corresponding to the kth group.

The controller 60 controls the sequential processing apparatus 30 based on sequentially processed substrate data J1(k), . . . JN(k) set for each substrate W1(k), . Controls transport and processing for substrates W1(k), . . . WN(k).

The control unit 60 controls substrate processing for the substrates W1(k), .

Simultaneously processed substrate data D0(k) includes group identification information Da1, substrate numbers W1 and W2, position information Db1, and recipe information Dc1. Group identification information Da1 identifies a group. Specifically, the group identification information Da1 indicates that the substrates W1(k), . . . WN(k) belong to the k-th group. The substrate numbers W1, . . . WN distinguish the substrates W belonging to the same group. The position information Db1 indicates the transport position of the substrate W in the same group. The recipe information Dc1 prescribes the processing contents commonly performed on the substrates W belonging to the same group.

The sequentially processed substrate data J1(k), . .

The control unit 60 sequentially generates processed substrate data J1(k), . The control unit 60 generates simultaneously processed substrate data D0(k) from the sequentially processed substrate data J1(k), . . . JN(k) (see step S5 in FIG. 20).

The group identification information Da1 included in the simultaneously processed substrate data D0(k) is adopted as the group identification information Da1 for any of the sequentially processed substrate data J1(k), . . . JN(k). Accordingly, the grouping of the substrates W is maintained in the sequential processing apparatus 30, and the transport and processing of the substrates W are managed for each group.

(ii) For example, the control unit 60 uses the substrate number W1 in the simultaneous processing substrate data D0(k), the position information Db1 corresponding to the substrate number W1, the recipe information Dc1, and the final information Dd1 to obtain the substrate number W1. sequentially processed substrate data J1(k) for the substrate W1(k) corresponding to (see FIG. 11). Using the substrate number Wm in the simultaneously processed substrate data D0(k), the position information Db1 corresponding to the substrate number Wm, the recipe information Dc1, and the final information Dd1, the substrate Wm(k) corresponding to the substrate number Wm is calculated. sequentially processed substrate data Jm(k) (m is an integer greater than or equal to 2 and less than or equal to N, see FIG. 12).

The final information Dd1 indicates whether or not the substrate W1(k) is the last (most upstream) in the transport direction in the k-th group to which the substrate W1(k) corresponding to the substrate number W1 belongs. For example, in the case described in <6-2-1>, the sequentially processed substrate data J1(k) having the configuration shown in FIG. 11 is once generated (see step S305 in FIG. 21). After that, the sequentially processed substrate data J1(k) is deleted, and the final information Dd1 of the sequentially processed substrate data J2(k), which is the last (uppermost) in the transport direction among the sequentially processed substrate data Jm(k), is replaced. It indicates that the substrate W2(k) is the last (most upstream) in the transport direction (see FIG. 15).

As a result, even in the sequential processing apparatus 30, the grouping of the substrates W is maintained without depending on the group identification information Da1, and the transportation and processing of the substrates W are managed for each group.

(iii) For example, the control unit 60 uses the substrate number Wn in the simultaneously processed substrate data D0(k), the position information Db1 corresponding to the substrate number Wn, the recipe information Dc1, and the group identification information Da1 to determine the substrate number. Generate sequentially processed substrate data Jn(k) for the substrate Wn(k) corresponding to Wn. As a result, even in the sequential processing apparatus 30, the grouping of the substrates W is maintained without depending on the final information Dd1, and the transportation and processing of the substrates W are managed for each group. In this case the grouping of substrates W may be maintained using the final information Dd1.

(iv) For example, the sequential processing apparatus 30 includes a substrate lead-out section 33 serving as an exit section for dispensing substrates W to the simultaneous processing apparatus 40 . Considering the cleaning device 12 as the sequential processing device 30 , the dehydration baking device 13 can be considered as the simultaneous processing device 40 .

The substrate lead-out portion 33 has sensors 334 and 335 that detect the presence or absence of the substrate W in the substrate lead-out portion 33 . The substrate Wm(k) is detected without detecting the substrate W1(k) by the sensor at the outlet (see the flow from step S503 to step S507 in FIG. 22), and the absence of the substrate W1(k) is confirmed. (see the flow from step S503 to step S507 in FIG. 22), the control unit 60 does not use the sequentially processed substrate data J1(k) for the substrate W1(k), but for the substrate Wm(k). Simultaneously processed substrate data D0(k) is generated using the sequentially processed substrate data Jm(k) (see step S507 in FIG. 22).

For example, substrates W1(k), . ) belong to the k-th group.

For example, when substrates Wm(k), . . . WN(k) are detected without detecting substrates W1(k), . k), . . . Js(k), but sequentially using the processed substrate data Jm(k), .

As a result, the simultaneously processed substrate data D0(k) corresponding to the substrates W to be actually delivered are subjected to simultaneous processing (see step S508 in FIG. 22).

For example, the substrates W1(k), . . . Ws(k) can be regarded as a first substrate, and the substrates Wm(k), . In this case, when the second substrate is detected without the first substrate being detected by the sensor at the outlet and the absence of the first substrate is confirmed, the control unit 60 detects the first substrate. Simultaneously processed substrate data D0(k) using sequentially processed substrate data Jm(k), . to generate

(v) For example, the sequential processing apparatus 30 includes a substrate lead-out section 33 serving as an exit section for dispensing substrates W to the simultaneous processing apparatus 40 . The substrate lead-out portion 33 has sensors 334 and 335 that detect the presence or absence of the substrate W in the substrate lead-out portion 33 . When the substrate W1(k) is detected by the sensor at the exit part without detecting the substrate Wm(k) (see the flow of processing from step S501 to step S512 in FIG. 23), the control unit 60 The simultaneously processed substrate data D0(k) is generated using the sequentially processed substrate data J1(k) for the substrate W1(k) without using the sequentially processed substrate data Jm(k) for the substrate Wm(k) ( (See step S512 in FIG. 23).

Both substrates W1(k) and Wm(k) belong to the kth group. These pieces of position information Db1 indicate that the substrate W1(k) is on the upstream side (rear side in terms of the transport direction) of the substrate Wm(k). For example, referring to FIG. 11, substrate W1(k) is shown to be upstream of the other substrates. For example, referring to FIG. 12, substrate W2(k) is shown to be upstream of the other substrates.

For example, when substrates W1(k), . . . Ws(k) are detected without detecting substrates Wm(k), . ), .

As a result, the simultaneously processed substrate data D0(k) corresponding to the substrates W to be actually delivered are subjected to simultaneous processing (see step S513 in FIG. 22).

For example, the substrates W1(k), . . . Ws(k) can be regarded as a first substrate, and the substrates Wm(k), . In this case, when the first substrate is detected by the sensor at the exit portion without detecting the second substrate, the control unit 60 outputs sequentially processed substrate data Jm(k), . Simultaneously processed substrate data D0(k) is generated using sequentially processed substrate data J1(k), . . . Js(k) for the first substrate without using JN(k).

(vi) For example, a plurality of sensors are provided at the exit portion, and the number of them matches the number of substrates W belonging to the group. For example, when N=2, the substrate lead-out portion 33 has sensors 334 and 335 that detect the presence or absence of the substrate W in the substrate lead-out portion 33 . Providing such a number of sensors contributes to accurate detection of the presence or absence of the substrate W in the group.

(vii) For example, the sequential processing apparatus 30 includes a substrate introduction section 31 as an entrance section for receiving substrates W from the simultaneous processing apparatus 40 . Considering the cleaning device 12 as the sequential processing device 30 , the indexer section 11 can be considered as the simultaneous processing device 40 . The substrate introduction section 31 has sensors 314 and 315 that detect the presence or absence of the substrate W in the substrate introduction section 31 .

When substrate W2(k) is detected without substrate W1(k) being detected by the sensor at the entrance (for example, in the case described in the third example of <6-2-4>), the control unit 60 sequentially generates processed substrate data J2(k) without generating sequentially processed substrate data J1(k) (see step S304 in FIG. 21).

When substrate W1(k) is detected without substrate W2(k) being detected by the sensor at the entrance (for example, in the case described in the fourth example of <6-2-4>), the control unit 60 sequentially generates processed substrate data J1(k) without generating sequentially processed substrate data J2(k) (see step S304 in FIG. 21).

For example, the substrates W1(k), . . . Ws(k) can be regarded as the third substrate, and the substrates Wm(k), . In this case, when the third substrate is detected by the sensor at the entrance portion without detecting the fourth substrate, the controller 60 detects the sequentially processed substrate data Jm(k) for the fourth substrate in step S305. ), .

When the fourth substrate is detected by the sensor in the inlet portion without detecting the third substrate, the control unit 60 outputs sequentially processed substrate data J1(k), . . . Instead of generating Js(k), sequentially processed substrate data Jm(k), . . . JN(k) for the fourth substrate are generated.

Further, it can be said that the above substrate processing apparatus realizes the following substrate processing method. The substrate processing method comprises sequential processing and simultaneous processing. In the sequential processing, substrates W1(k), . (k) is processed. In the simultaneous processing, substrates W1(k), .

Simultaneously processed substrate data D0(k) includes group identification information Da1, substrate numbers W1 and W2, position information Db1, and recipe information Dc1. Group identification information Da1 identifies a group. Specifically, the group identification information Da1 indicates that the substrates W1(k), . . . WN(k) belong to the k-th group. The substrate numbers W1, . . . WN distinguish the substrates W belonging to the same group. The position information Db1 indicates the transport position of the substrate W in the same group. The recipe information Dc1 prescribes the processing contents commonly performed on the substrates W belonging to the same group.

The sequentially processed substrate data J1(k), . .

Sequentially processed substrate data J1(k), . is generated.

As described above, the substrate processing apparatus and substrate processing method have been described in detail, but the above description is illustrative in all aspects, and the present disclosure is not limited thereto. Moreover, the various modifications described above can be applied in combination as long as they do not contradict each other. And it is understood that many variations not illustrated can be envisioned without departing from the scope of this disclosure.

31 substrate introduction part (entrance part)
33 board lead-out part (exit part)
314, 315, 334, 335: Sensor Da1 Group identification information Db1 Position information Dc1 Recipe information Dd1 Final information k Pair number J1(k), J2(k) Sequentially processed substrate data D0(k) Simultaneously processed substrate data W, W1, W2, W1(k), W2(k) Substrate

Claims (7)

a sequential processing unit that processes the substrates while sequentially transporting the substrates based on sequential processing substrate data set for each substrate divided into a plurality of groups;
a simultaneous processing unit for simultaneously processing the substrates for each group based on simultaneously processed substrate data set for each group;
a control unit for controlling the transport and the processing of the substrate in the sequential processing unit based on the sequential processing substrate data, and controlling the processing of the substrate in the simultaneous processing unit based on the simultaneous processing substrate data. ,
The simultaneously processed substrate data includes group identification information for identifying the group, a substrate number for distinguishing the substrates belonging to the group, and position information indicating the transfer position, which is the position of the substrate in the group in the transfer direction. , and recipe information for defining processing contents commonly performed on the substrates belonging to the group,
the sequentially processed substrate data includes the position information, the group identification information, and the recipe information for the substrate corresponding to the sequentially processed substrate data;
The substrate processing apparatus, wherein the control unit generates the sequentially processed substrate data from the simultaneously processed substrate data, and generates the simultaneously processed substrate data from the sequentially processed substrate data. The control section uses the one substrate number of the simultaneously processed substrate data, the position information corresponding to the one substrate number, the recipe information, and the final information to obtain the one substrate number. generating the sequentially processed substrate data for the substrate corresponding to
wherein the final information indicates whether or not the board corresponding to the one board number is the last in the transport direction in the group to which the board corresponding to the one board number belongs. The substrate processing apparatus according to item 1. The control unit uses the one substrate number of the simultaneously processed substrate data, the position information corresponding to the one substrate number, the group identification information, and the recipe information to control the one of the simultaneous processing substrate data. 2. The substrate processing apparatus of claim 1, wherein said sequentially processed substrate data for said substrate corresponding to a substrate number is generated. The sequential processing section includes an exit section for dispensing the substrates to the simultaneous processing section,
The exit section has a sensor that detects the presence or absence of the substrate in the exit section,
When the second substrate is detected without the first substrate being detected by the sensor, and the lack of the first substrate is confirmed, the controller controls the detection of the first substrate. generating the simultaneously processed substrate data using the sequentially processed substrate data for the second substrate without using the sequentially processed substrate data;
the first substrate and the second substrate belong to the same group;
3. The position information of the first substrate or the position information of the second substrate indicates that the first substrate is upstream of the second substrate. The substrate processing apparatus according to claim 3. The sequential processing section includes an exit section for dispensing the substrates to the simultaneous processing section,
The exit section has a sensor that detects the presence or absence of the substrate in the exit section,
When the first substrate is detected by the sensor without the second substrate being detected, the controller controls the substrate without using the sequentially processed substrate data for the second substrate. generating said concurrently processed substrate data using said sequentially processed substrate data for a first said substrate;
the first substrate and the second substrate belong to the same group;
4. The method according to claim 3, wherein said position information of said first substrate or said position information of said second substrate indicates that said first substrate is upstream of said second substrate. substrate processing equipment. the sequential processing section includes an inlet section that receives the substrate from the simultaneous processing section;
the entrance section has a sensor that detects the presence or absence of the substrate in the entrance section;
The controller generates the sequentially processed substrate data for the third substrate when the fourth substrate is detected without the third substrate being detected by the sensor at the entrance section. generating said sequentially processed substrate data for said fourth said substrate without
6. The substrate processing apparatus according to claim 1, wherein said third substrate and said fourth substrate belong to the same group. a sequential processing of performing processing on the substrates while sequentially transporting the substrates based on sequential processing substrate data set for each substrate divided into a plurality of groups;
Simultaneous processing of simultaneously processing the substrates for each group based on simultaneously processed substrate data set for each group, the substrate processing method comprising:
transporting and processing the substrate in the sequential processing based on the sequential processing substrate data;
processing of the substrate in the simultaneous processing is controlled based on the simultaneously processed substrate data;
The simultaneously processed substrate data includes group identification information for identifying the group, a substrate number for distinguishing the substrates belonging to the group, and position information indicating the transfer position, which is the position of the substrate in the group in the transfer direction. , and recipe information for defining processing contents commonly performed on the substrates belonging to the group,
the sequentially processed substrate data includes the position information, the group identification information, and the recipe information for the substrate corresponding to the sequentially processed substrate data;
The substrate processing method, wherein the sequentially processed substrate data is generated from the simultaneously processed substrate data, and the simultaneously processed substrate data is generated from the sequentially processed substrate data.

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