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JP7186443B2 - Impact dismantling device - Google Patents
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JP7186443B2 - Impact dismantling device - Google Patents

Impact dismantling device Download PDF

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JP7186443B2
JP7186443B2 JP2019111233A JP2019111233A JP7186443B2 JP 7186443 B2 JP7186443 B2 JP 7186443B2 JP 2019111233 A JP2019111233 A JP 2019111233A JP 2019111233 A JP2019111233 A JP 2019111233A JP 7186443 B2 JP7186443 B2 JP 7186443B2
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electronic device
impact
cut
dismantling
striking
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JP2020203239A (en
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高生 上田
茂樹 古屋仲
達也 大木
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National Institute of Advanced Industrial Science and Technology AIST
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
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Description

本発明は、携帯電話等の電子機器を廃棄処分する際に利用される衝撃解体装置に関するものである。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an impact dismantling device used when disposing of electronic equipment such as mobile phones.

廃棄物として処理されるスマートフォン、携帯電話に代表される電子機器は年々増大しており、産業廃棄物の低減、資源の有効利用の観点から、前段階として、電子基板、バッテリ、筐体などに効率よく解体して大別し、個別に廃棄処分、リサイクル処理を行うことが強く求められている。 The number of electronic devices such as smartphones and mobile phones that are disposed of as waste is increasing year by year. There is a strong demand for efficient dismantling, roughly dividing, and individual disposal and recycling.

特許文献1には、刃物により携帯機器の側面を切断して筐体の一部を分離することが示されている。特許文献2には、加熱して筐体の接合強度を低下させた後、ヘラ等の工具により解体することが示されている。 Japanese Patent Laid-Open No. 2002-200001 discloses that a part of a housing is separated by cutting a side surface of a portable device with a knife. Patent Literature 2 discloses that the housing is dismantled with a tool such as a spatula after the bonding strength of the housing is lowered by heating.

特願2018-133798号公報Japanese Patent Application No. 2018-133798 特願2016-094251号公報Japanese Patent Application No. 2016-094251

こうした解体装置には、処理時間を1台当たり1秒以下までに短縮することが処理効率の目標とされている一方、電子基板を過破砕するとリサイクルが困難になる。さらには、電子機器に内蔵されているバッテリに過度な衝撃を加えると発火の危険性が高まり、処理の中断を余儀なくされる。
特許文献1や特許文献2に示されている技術では、このように相反する課題を一挙に解決することは困難であった。
For such dismantling devices, the processing efficiency is targeted to shorten the processing time to less than 1 second per unit. Furthermore, if an excessive shock is applied to the battery built in the electronic device, the danger of ignition increases, and processing is forced to be interrupted.
With the techniques disclosed in Patent Documents 1 and 2, it was difficult to solve such conflicting problems at once.

そこで、本発明の目的は、一部切断処理された携帯電話等の電子機器に対して、複数箇所に同時に、最適化された衝撃を与えることにより、過破砕や過度な衝撃を与えることなく、電子基板、バッテリ、筐体などの高速分離を実現することにある。 Therefore, an object of the present invention is to simultaneously apply optimized impacts to a plurality of locations on a partially cut electronic device such as a mobile phone, thereby preventing excessive crushing and excessive impacts. The object is to achieve high-speed separation of electronic substrates, batteries, housings, and the like.

この課題を解決するため、本発明の衝撃解体装置は、投入された電子機器を保管して搬送装置に排出する排出口を備えた保管機構と、搬送装置上の電子機器を予め定められた姿勢となるよう位置決めする位置決め機構と、位置決めされた状態で搬送される電子機器の両端辺に沿って予め定められた幅で切断する切断機構と、両端辺切断後に搬送装置から排出される電子機器に対し、切断された端辺の両端部を打撃するよう配置された、少なくとも2個の打撃装置を備えるようにした。 In order to solve this problem, the impact dismantling apparatus of the present invention includes a storage mechanism provided with an ejection opening for storing electronic devices that have been put in and ejecting them to a conveying device, and a predetermined posture for the electronic devices on the conveying device. , a cutting mechanism that cuts a predetermined width along both edges of the electronic device that is conveyed in the positioned state, and an electronic device that is discharged from the conveying device after both edges are cut. In contrast, there are at least two striking devices arranged to strike opposite ends of the severed edge.

本発明によれば、少なくとも2個の打撃装置が切断された端辺の両端部を確実に打撃するので、電子機器1個あたり1秒以内で、過破砕、バッテリ発火等が発生することのない、最適な破砕を実現することができる。 According to the present invention, since at least two striking devices reliably strike both ends of the cut edge, excessive crushing, battery ignition, etc. do not occur within one second per electronic device. , optimum crushing can be achieved.

図1は、打撃装置としてチェーンを用い、その回転速度を変化させた際の携帯電話端部切断態様毎の破砕評価点を示す表である。FIG. 1 is a table showing the crushing evaluation points for each mode of cutting the end of a mobile phone when a chain is used as a striking device and the rotational speed of the chain is changed. 図2は、両端打撃、一端打撃毎に評価点が2以上の破砕状態となったケースの発生確率を示す表である。FIG. 2 is a table showing the probability of occurrence of a crushed state with an evaluation point of 2 or higher for each of both-end impact and single-end impact. 図3は、本発明の実施例を示す全体図である。FIG. 3 is an overall view showing an embodiment of the invention.

発明者らは、上記のように相反する課題を同時に解決するため、破砕容器内でチェーンを回転させ、投入された被破砕物を打撃粉砕する、いわゆるクロスフローシュレッダーを用いて様々な実験を行った。
この実験では、SUS製でリンク径8mm、6リンク、長さ208mm(6リンク)、幅28mm、重量248g(6リンク)のチェーンを使用し、そのリンクひとつ分の質量m(41.3g)と先端速度vにより定まる運動エネルギーE(E=m・v/2)を様々に変化させ、運動エネルギー毎の破砕、粉砕状態を分析した。
In order to simultaneously solve the conflicting problems as described above, the inventors conducted various experiments using a so-called cross-flow shredder that rotates the chain in the crushing vessel and strikes and crushes the material to be crushed. rice field.
In this experiment, a SUS chain with a link diameter of 8 mm, 6 links, length of 208 mm (6 links), width of 28 mm, and weight of 248 g (6 links) was used. The kinetic energy E (E=m·v 2 /2) determined by the tip speed v was variously changed, and the state of crushing and pulverization for each kinetic energy was analyzed.

さらに、破砕品のサンプルとして、携帯電話の廃棄物を使用し、端部を切断しないケース(M0)、長辺の端部(端辺)を切断幅3mmで2辺を切断したケース(M2)、長辺の端部を切断幅3mm及び短辺の端部を切断幅5mmで4辺切断するケース(M4)に区分して実験を行った。
ここで、IC等の電子部品が最も多く搭載された基板を「メイン基板」と呼称し、評価点3を、メイン基板が筐体から分離し、かつバッテリが基板から分離した、最も望ましい破砕状態、評価点2を、メイン基板の1面が露出し、かつバッテリが基板から分離した状態、評価点1を、メイン基板が露出しておらず、あるいは(かつ)バッテリが基板から分離していない状態、評価点0は、メイン基板が破砕又は粉砕した状態と規定した。
なお、評価点2以上であれば、バッテリを傷つけることなく基板から電子部品を剥離させる次工程を実施できるため、工業的に解体成功だと判断できる。
Furthermore, as samples of crushed products, mobile phone waste was used, the case where the ends were not cut (M0), and the case where the long sides (edges) were cut at a width of 3 mm and two sides were cut (M2). , and a case (M4) in which four sides are cut with a cutting width of 3 mm at the ends of the long sides and with a cutting width of 5 mm at the ends of the short sides.
Here, the board on which the most electronic parts such as ICs are mounted is called the "main board", and the evaluation point 3 is the most desirable crushed state in which the main board is separated from the housing and the battery is separated from the board. , Evaluation point 2 is the state where one surface of the main board is exposed and the battery is separated from the board, Evaluation point 1 is the state where the main board is not exposed or (and) the battery is not separated from the board A state of evaluation point 0 was defined as a state in which the main substrate was crushed or pulverized.
If the evaluation score is 2 or more, the next step of peeling the electronic parts from the substrate can be performed without damaging the battery, so it can be judged that the disassembly has been successful from an industrial point of view.

実験結果は、図1の表に示すとおりである。
チェーン回転速度(4)(運動エネルギー6.4J)以上のケースで、サンプルに切断処理を加えたM2、M4のケースでは、評価点2以上となり、解体に成功した。一方で、サンプルに切断処理を加えないM0のケースでは、いかなるチェーン回転速度においても評価点が2未満となり、解体に成功しなかった。
このことから、得られる破砕状態は、チェーン回転速度、チェーン先端速度、運動エネルギーに大きく依存し、運動エネルギーEが6.4Jを超えればよいことが確認できた。しかし、運動エネルギーEを過度に大きくすると、前述のようにバッテリの破壊の原因となる。
The experimental results are as shown in the table of FIG.
In the case of chain rotation speed (4) (kinetic energy of 6.4 J) or more, in the cases of M2 and M4 in which cutting processing was applied to the sample, the evaluation score was 2 or more, and the dismantling was successful. On the other hand, in the case of M0 where no cutting treatment was applied to the sample, the evaluation score was less than 2 at any chain rotation speed, and dismantling was not successful.
From this, it was confirmed that the obtained crushing state depends greatly on the chain rotation speed, the chain tip speed, and the kinetic energy, and that the kinetic energy E should exceed 6.4J. However, if the kinetic energy E is excessively increased, it causes destruction of the battery as described above.

そこで、高い評価点が得られた実験例をさらに詳細に分析すると、長辺の端部を切断した(M2)の場合、その両端に、長辺に直交する方向(短辺に沿う方向)にチェーンが衝突した際、高い評価点が安定的に得られていることが明らかとなった。 Therefore, a more detailed analysis of the experimental example that gave a high evaluation score shows that in the case of cutting the ends of the long side (M2), at both ends, in the direction orthogonal to the long side (direction along the short side) When the chain collided, it became clear that high evaluation points were obtained stably.

これを検証するため、追加実験として、M2について、チェーン回転速度(3)、すなわち、回転速度が1715rpmでの破砕機内部での挙動をハイスピードカメラにより観測した。
その結果、衝撃の態様が長辺の両端に打撃が加えられるもの(両端打撃)と長辺の一端のみに打撃が加えられるもの(一端打撃)の2種類に大別された。
両端打撃、一端打撃ともに9ケース発生し、評価点が2以上になったケースの発生確率を図2の表に示す。
一端打撃では、評価点の平均が1.33であったのに対し、両端打撃では、2.44の評価点が得られ、両端打撃により、高い評価点が安定的に得られることが分かる。
In order to verify this, as an additional experiment, the behavior of M2 inside the crusher at a chain rotation speed (3), ie, a rotation speed of 1715 rpm, was observed with a high-speed camera.
As a result, the manner of impact was roughly divided into two types: impact applied to both ends of the long side (both ends impact) and impact applied to only one end of the long side (single impact impact).
The table in FIG. 2 shows the occurrence probabilities of cases in which 9 cases of double-end hitting and one-end hitting occurred, and the evaluation score was 2 or higher.
The average score for single-end hitting was 1.33, whereas the average score for double-end hitting was 2.44.

そこで、両端打撃が確実に発生するよう、本発明の実施例では、衝撃解体装置として、図3に示されるような技術的手段を採用した。
ホッパー等の保管機構1に投入された携帯電話等、廃棄対象の小型電子機器は、排出口1aを介して、一個ずつ第1コンベヤ2上に排出される。
ロボットアーム等の整列機構3は、小型電子機器の姿勢を画像解析し、小型電子機器の長辺が搬送方向に対し平行となり、第1コンベヤ2の幅方向中心に配置させるよう整列させる。
Therefore, in the embodiment of the present invention, a technical means as shown in FIG. 3 is adopted as an impact dismantling device in order to ensure that both-end impact occurs.
Small electronic devices to be discarded, such as mobile phones, put into a storage mechanism 1 such as a hopper are discharged one by one onto a first conveyor 2 through a discharge port 1a.
An alignment mechanism 3 such as a robot arm performs image analysis of the posture of the small electronic devices, and aligns the small electronic devices such that the long sides of the small electronic devices are parallel to the conveying direction and arranged at the center in the width direction of the first conveyor 2 .

次に、第1コンベヤ2と同一速度で移動する第1位置決め機構4が、小型電子機器の両長辺を同時に押圧し、整列された状態に位置決め固定し、内蔵する計測装置により、小型電子機器の短辺長さが計測される。
短辺長さの計測結果に基づき、プレス、グラインダ等の第1切断機構5による切断幅が自動的に調整され、第1位置決め機構4に固定された小型電子機器の長辺側端部を予め定められた幅で同時に切断する。
Next, the first positioning mechanism 4, which moves at the same speed as the first conveyor 2, presses both long sides of the small electronic device at the same time to position and fix the small electronic device in an aligned state. The short side length of is measured.
Based on the measurement result of the short side length, the cutting width by the first cutting mechanism 5 such as a press or a grinder is automatically adjusted, and the long side end of the small electronic device fixed to the first positioning mechanism 4 is adjusted in advance. Cut at the specified width at the same time.

両長辺が切断された小型電子機器は、押し出し機構6により、第1コンベヤ2の端部で第2コンベヤ7上に押し出され、第2コンベヤ7と同一速度で移動する第2位置決め機構8が、小型電子機器の両短辺を同時に押圧して位置決め固定し、内蔵する計測装置により、小型電子機器の長辺長さが計測される。
長辺長さの計測結果に基づき、プレス、グラインダ等の第2切断機構9による切断幅が自動的に調整され、第2位置決め機構8に固定された小型電子機器の短辺側端部を予め定められた幅で同時に切断する。
The small electronic device with both long sides cut off is pushed onto the second conveyor 7 at the end of the first conveyor 2 by the pushing mechanism 6, and the second positioning mechanism 8 moving at the same speed as the second conveyor 7 moves. Both short sides of the small electronic device are simultaneously pressed to position and fix, and the built-in measuring device measures the length of the long side of the small electronic device.
Based on the measurement result of the long side length, the cutting width by the second cutting mechanism 9 such as a press or a grinder is automatically adjusted, and the short side end of the small electronic device fixed to the second positioning mechanism 8 is cut in advance. Cut at the specified width at the same time.

このように、四辺を予め定められた幅で切断された小型電子機器は、第2位置決め機構8により姿勢が維持された状態で、回転駆動されるチェーン等を利用した打撃装置10に投入される。
打撃装置10は、複数のチェーンやハンマー等を回転させて打撃を与えるもので、第2位置決め機構8が計測した小型電子機器の長辺長さに基づいて、少なくとも小型電子機器の両長辺の端部内方において、短辺に沿って打撃を加えるよう、回転軸における位置を調整する調整機構を備えている。
In this way, the small electronic device whose four sides have been cut to a predetermined width is thrown into the striking device 10 using a chain or the like that is driven to rotate while maintaining its posture by the second positioning mechanism 8. .
The striking device 10 rotates a plurality of chains, hammers, or the like to apply an impact. Based on the length of the long side of the small electronic device measured by the second positioning mechanism 8, at least both long sides of the small electronic device are measured. An adjustment mechanism is provided inside the end portion to adjust the position on the rotation axis so as to apply a blow along the short side.

以上の構成により、打撃装置10による打撃は、小型電子機器当たり1秒以下の短時間で行われ、2.44以上の高い評点を得ることができた。
なお、上記の実施例では、四辺を切断する上記M4で行ったが、小型電子機器の形態によっては、押し出し機構6、第2コンベヤ7、第2位置決め機構8、第2切断機構9を省略し、両長辺あるいは両短辺が切断された小型電子機器を第1コンベヤ2の終端に設置した直接打撃装置10に投入しても高い評点を安定して得ることができる。
その他、破砕対象物に応じて、打撃機構、切断された両辺に対する打撃点、位置決め機構、切断機構など、市販の製品から好適なものを選定し種々変更することが可能である。
With the above configuration, the striking device 10 can strike a small electronic device in a short period of time of 1 second or less, and a high score of 2.44 or higher can be obtained.
In the above embodiment, M4 is used to cut the four sides. A high score can be stably obtained even if a small electronic device with both long sides or both short sides cut is thrown into the direct impact device 10 installed at the end of the first conveyor 2. - 特許庁
In addition, depending on the object to be crushed, it is possible to select suitable ones from commercially available products such as a striking mechanism, striking points on both sides of the cut, a positioning mechanism, and a cutting mechanism, and change them in various ways.

以上説明したように、本発明によれば、必要最小限の衝撃で過破砕やバッテリの発火を確実に防止しながら、電子機器1個あたり1秒以内で、効率的な破砕を実現することができるので、衝撃解体装置として広く採用されることが期待できる。 As described above, according to the present invention, it is possible to achieve efficient crushing within one second per electronic device while reliably preventing excessive crushing and battery ignition with the minimum necessary impact. Therefore, it can be expected to be widely adopted as an impact dismantling device.

1:保管機構 2:第1コンベヤ 3:整列機構
4:第1位置決め機構 5:第1切断機構 6:押し出し機構
7:第2コンベヤ 8:第2位置決め機構 9:第2切断機構
10:打撃装置
1: Storage Mechanism 2: First Conveyor 3: Alignment Mechanism 4: First Positioning Mechanism 5: First Cutting Mechanism 6: Pushing Mechanism 7: Second Conveyor 8: Second Positioning Mechanism 9: Second Cutting Mechanism 10: Impact Device

Claims (5)

投入された電子機器を保管して搬送装置に排出する排出口を備えた保管機構と、
前記搬送装置上の電子機器を予め定められた姿勢となるよう位置決めする位置決め機構と、
位置決めされた状態で搬送される電子機器の両端辺に沿って予め定められた幅で切断する切断機構と、
両端辺切断後に前記搬送装置から排出される電子機器に対し、切断された端辺の両端部に少なくとも2個の打撃部材により打撃を加えるように配置された打撃装置であって、該打撃部材の質量と先端速度により定まる運動エネルギーEの下限値を、破砕する電子機器の形態に合わせて選定した、該打撃装置と、を備えた衝撃解体装置。
a storage mechanism having a discharge port for storing the electronic device inserted and discharging it to the conveying device;
a positioning mechanism that positions the electronic device on the transport device so that it assumes a predetermined posture;
a cutting mechanism that cuts along both edges of the electronic device conveyed in a positioned state to a predetermined width;
A striking device arranged to strike both ends of a cut edge with at least two striking members , with respect to an electronic device discharged from the conveying device after both edges have been cut. an impact dismantling device , wherein the lower limit value of the kinetic energy E determined by the mass and tip speed is selected according to the form of the electronic device to be crushed.
切断する前記端辺を電子機器の長辺とし、前記打撃部材が電子機器の両短辺の両端部に打撃を加えるようにしたことを特徴とする請求項1に記載された衝撃解体装置。 2. The impact dismantling apparatus according to claim 1, wherein the edge to be cut is the long side of the electronic device, and the striking member strikes both short sides of the electronic device. 前記搬送装置、前記位置決め機構、前記切断機構を2系列配置し、電子機器の両長辺、両短辺を予め定められた幅で順次切断し、前記打撃装置に排出するようにしたことを特徴とする請求項1に記載された衝撃解体装置。 The conveying device, the positioning mechanism, and the cutting mechanism are arranged in two series, and both long sides and both short sides of the electronic device are sequentially cut into predetermined widths and discharged to the striking device. 2. The impact dismantling device according to claim 1. 前記位置決め機構が、電子機器を位置決めした際に電子機器の端辺間の長さを計測する計測装置を備え、その計測結果に基づいて、前記切断機構の切断幅を自動的に調整するようにしたことを特徴とする請求項1から3のいずれか1項に記載された衝撃解体装置。 The positioning mechanism includes a measuring device that measures the length between the edges of the electronic device when the electronic device is positioned, and the cutting width of the cutting mechanism is automatically adjusted based on the measurement result. 4. The impact dismantling device according to any one of claims 1 to 3, characterized in that: 破砕する電子機器が携帯電話の場合、前記運動エネルギーEの下限値を6.4Jとしたことを特徴とする請求項1から4のいずれか1項 に記載された衝撃解体装置。
5. The lower limit value of the kinetic energy E is set to 6.4 J when the electronic device to be crushed is a mobile phone. an impact demolition device as described in .
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