JP7195051B2 - Peeling device - Google Patents

Description

The present invention relates to a peeling device.

Patent Literature 1 discloses a chip peeling device for peeling off a plurality of semiconductor chips stuck on a sheet.

Japanese Patent No. 3187638

In the peeling apparatus as described above, positional information regarding the position of electronic components such as semiconductor chips on the sheet is acquired, and based on the positional information, a needle or the like is pressed from the back side of the sheet to adsorb from the front side of the sheet. By doing so, the electronic components are peeled off one by one.

In order to accurately acquire positional information of minute electronic components, it is necessary to use a high-resolution camera to capture an image of the electronic component while the camera is positioned close to the sheet. In this case, since the area that can be imaged by the camera is limited, in order to image the electronic components on the entire sheet, it is necessary to perform the imaging operation multiple times while moving the support that supports the sheet with respect to the camera. need to do.

Here, for example, when acquiring the position information of the electronic component in order to peel off the electronic component on the sheet in which part of the electronic component has already been peeled off by the peeling device, an area where the electronic component does not exist is imaged. Therefore, the supporting member for supporting the sheet must be moved with respect to the camera. Since the supporting member for supporting the sheet is moved to capture an image of an area where no electronic component exists, an extra operation is performed, which is unnecessary for acquiring the position information of the electronic component existing on the sheet. It will take time.

The present invention has been made in view of such circumstances, and an object of the present invention is to shorten the time required to acquire the position information of electronic components.

The invention disclosed in the present application for solving the above problems has various aspects, and the outlines of typical aspects are as follows.

(1) A first imaging means capable of imaging an area of a first size on a sheet on which a plurality of electronic components are attached, and either the sheet or the first imaging means a moving mechanism for moving one or the other relative to the other; and a peeling mechanism for peeling off the electronic component based on the positional information of the electronic component acquired by being imaged by the first imaging means. The peeling device includes second imaging means capable of imaging an area of a second width larger than the area of the first width on the sheet, and the moving mechanism moves the second one of the sheet and the first imaging means to the other based on the presence information regarding the presence or absence of the electronic component on the sheet acquired by imaging by the imaging means of A stripping device that moves relative to the stripping device.

(2) In (1), a sheet support for supporting the sheet is provided, and the sheet support is 90 degrees centered on an axis extending in a direction perpendicular to a surface of the sheet to which the plurality of electronic components are attached. A stripping device that is rotatable in degrees.

(3) In (1) or (2), a storage unit is provided for pre-storing characteristic information of each of the plurality of electronic components attached on the sheet, and the peeling mechanism is attached on the sheet. a peeling device for peeling the plurality of electronic components so as to be classified according to the characteristic information.

(4) In any one of (1) to (3), the peeling device, wherein the second imaging means is a scanning imaging device that captures an image of the area of the second size by scanning the sheet. .

ADVANTAGE OF THE INVENTION According to this invention, the time required to acquire the positional information on an electronic component can be shortened.

1 is a block diagram showing an outline of a physical configuration of a peeling system according to this embodiment; FIG. It is a perspective view which shows the peeling apparatus which concerns on this embodiment. 3 is a perspective view showing a state in which a sheet is supported by a sheet support of the peeling device shown in FIG. 2; FIG. It is the top view which looked at the sheet|seat to which the semiconductor chip was stuck from the front side. It is a top view which shows the peeling apparatus which concerns on this embodiment. It is a top view which shows the peeling apparatus which concerns on this embodiment. It is a top view which shows the peeling apparatus which concerns on this embodiment. FIG. 3 is a plan view of a sheet partially without semiconductor chips as viewed from the front side; It is a top view which shows the peeling apparatus which concerns on this embodiment. FIG. 4 is a side view showing the sheet and the peeling mechanism in the peeling position; FIG. 4 is a side view showing the sheet and the peeling mechanism in the peeling position; FIG. 4 is a side view showing the sheet and the peeling mechanism in the peeling position; 4 is a flow chart for explaining the operation of a control unit according to the embodiment; FIG. 9 is a plan view showing a state in which the seat shown in FIG. 8 is rotated 90 degrees in the θ direction;

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail below with reference to the drawings.

First, with reference to FIG. 1, an overview of the overall configuration of a peeling system 100 according to this embodiment will be described. FIG. 1 is a block diagram showing an overview of the physical configuration of the peeling system according to this embodiment.

As shown in FIG. 1 , the peeling system 100 is a system including a peeling device 1 , a control section 10 , a storage section 15 and an image processing device 90 . The peeling device 1 includes a sheet support 2, a support moving mechanism 21, a peeling mechanism 3, a line scan camera 70 as second imaging means, and an area camera 80 as first imaging means. The operation of each mechanism, camera, etc. included in the peeling device 1 is controlled by the control unit 10 . The control unit 10 may be included in, for example, a general computer including a CPU (Central Processing Unit) or a controller such as a PLC (Programmable Logic Controller). Note that the control unit 10 and the storage unit 15 may be included in a part of the peeling device 1 .

The peeling mechanism 1 includes a suction collet 31 , a collet advance/retreat mechanism 32 , a needle 33 , and a needle advance/retreat mechanism 34 . The image processing device 90 also includes a first image information acquisition section 91 and a second image information acquisition section 92 .

Next, with reference to FIGS. 2 to 4, the configuration of the peeling device will be specifically described. FIG. 2 is a perspective view showing the peeling device according to this embodiment. 3 is a perspective view showing a state in which a sheet is supported by a sheet support member of the peeling device shown in FIG. 2. FIG. 2 and 3, illustration of the line scan camera 70 and the area camera 80 is omitted.

The sheet support 2 is formed in an annular shape and is configured to be capable of supporting a sheet S to which a plurality of diced semiconductor chips W are attached. The sheet S is, for example, an elastic adhesive sheet made of a resin material, and the semiconductor chip W is, for example, a light emitting element such as an LED. In the following description, when the sheet S is supported by the sheet support 2, the side of the sheet S to which the semiconductor chip W is attached is referred to as the front side, and the side to which the semiconductor chip W is not attached is referred to as the back side. Also, as shown in FIGS. 2 and 3, the direction from the back side to the front side (the normal direction of the sheet surface) is the Y-axis direction, the vertical direction is the Z-axis direction, and the direction orthogonal to the Y-axis direction and the Z-axis direction is Define the X-axis direction. Also, the direction of rotation about the Y-axis direction is defined as the θ direction.

FIG. 4 is a plan view of the sheet to which the semiconductor chips are attached, viewed from the front side. As shown in FIG. 4, a plurality of diced semiconductor chips W are attached to the front surface of the sheet S. As shown in FIG. As shown in FIG. 4, the semiconductor chips W are arranged side by side in the X-axis direction and the Z-axis direction. However, the sheet S shown in FIG. 4 is only an example, and the outer shape of the sheet S and the arrangement of the semiconductor chips W are not limited to this. In FIG. 4, in order to avoid complication of the drawing, only one semiconductor chip is denoted by W, and the other semiconductor chips are shown without the reference numerals. The same applies to FIGS. 8 and 14 described later.

The seat support 2 is moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the .theta. ). FIG. 3 shows a state in which the sheet support 2 is at a position where the semiconductor chip W attached to the sheet S is peeled off by the peeling mechanism 3 (hereinafter referred to as the peeling position). When the sheet supporter 2 is in the peeling position, a suction collet 31 that suctions and holds the semiconductor chip W is provided on the front side of the sheet supporter 2, and a collet advance/retreat mechanism that supports the suction collet 31 and advances and retreats with respect to the sheet S. 32 are placed.

The adsorption collet 31 is made of an elastic material such as rubber. The suction collet 31 is configured to be able to move forward and backward with respect to the sheet S by a collet forward/backward mechanism 32 . The suction collet 31 is attached to an arm 35 rotated by a motor 36, and rotates between a position facing the sheet S supported by the sheet support 2 and a position facing the chip transfer stage 7, which will be described later. do. In addition, the collet advance/retreat mechanism 3 includes a pump (not shown) that imparts a suction force to the suction collet 31 .

A chip transfer stage 7 for transferring the semiconductor chip W transferred from the suction collet 31 is arranged on the front side of the sheet support 2 . The chip transfer stage 7 is formed in a disc shape and has a plurality of chip transfer parts 71 arranged at regular intervals along the periphery. The chip transfer stage 7 rotates intermittently to sequentially bring the plurality of chip transfer parts 71 closer to the suction collet 31 and receive the semiconductor chips W from the suction collet 31 .

A holder 51 for holding the needle 33 and a needle advancing/retreating mechanism 34 for advancing/retreating the needle 33 with respect to the sheet S are arranged on the back side of the sheet supporting member 2 when the sheet supporting member 2 is in the peeling position. there is The holder 51 has a passage hole in the center of the facing surface facing the sheet S supported by the sheet support 2 at the peeling position, and the needle 41 is arranged in the passage hole. Further, on the back side of the seat support 2, a mechanism support stage 6 is arranged to support the needle advance/retreat mechanism 34 so as to be able to advance and retreat with respect to the seat support 2. As shown in FIG.

The area camera 80 shown in FIG. 1 is an imaging device capable of imaging a first area on the sheet S supported by the sheet support 2 . Also, the area camera 80 is configured to be movable relative to the sheet S supported by the sheet support 2 . In this embodiment, the area camera 80 is moved relative to the sheet S in the X-axis direction and the Z-axis direction by moving the sheet support 2 by the support moving mechanism 21 .

The line scan camera 70 shown in FIG. 1 is an imaging device capable of imaging a second area on the sheet S supported by the sheet support 2 . The second sized area is wider than the first sized area. The line scan camera 70 may be a scanning imaging device capable of capturing an image of the entire area of the sheet S collectively by scanning the sheet S and acquiring image information of the semiconductor chip W in the entire area of the sheet S. . However, the line scan camera 70 is not limited to this.

Also, as the area camera 80, a camera with a higher image quality than the line scan camera 70 is preferably used. That is, the area camera 80 preferably has a higher resolution than the line scan camera 70 . In this embodiment, about 20,000 semiconductor chips W attached to a sheet S having a diameter of 20-odd centimeters are to be imaged, and an area camera 80 with a resolution of about 470,000 pixels and a line sensor with a resolution of about 8,000 pixels are used. A scan camera 70 was used.

The image of the semiconductor chip W captured by the area camera 80 and the line scan camera 70 is processed by the image processing device 90 and displayed on the display of the computer including the control unit 10 by the user. It should be displayed in a visible manner.

As described above, the image processing device 90 includes the first image information acquisition section 91 and the second image information acquisition section 92 . The second image information acquisition unit 92 acquires second image information regarding the semiconductor chip W on the sheet S imaged by the line scan camera 70 . The second image information includes presence information regarding the presence or absence of the semiconductor chip W on the sheet S. FIG. The first image information acquisition unit 91 acquires first image information regarding the semiconductor chip W on the sheet S imaged by the area camera 80 . The first image information includes positional information regarding the position of the semiconductor chip W on the sheet S. As shown in FIG.

The presence information acquired by the second image information acquisition unit 92 does not need to indicate the details of the positional information of the semiconductor chip W. Anything that indicates whether or not On the other hand, the position information acquired by the first image information acquisition unit 91 indicates details of the positions (coordinates) of the plurality of semiconductor chips W on the sheet. Since the area camera 80 is a high-resolution camera as described above, detailed positional information of the semiconductor chip W can be obtained.

The peeling mechanism 3 described above sequentially peels the semiconductor chips W to be peeled based on the positional information. Specifically, based on the positional information acquired by the first image information acquisition unit 91 from the images taken by the area camera 80, the control unit 10 moves the semiconductor chip W to be peeled off in the X-axis direction and the Z-axis direction. The direction coordinates are obtained, and the support moving mechanism 21 moves the sheet support 2 so that the needle 33 and the suction collet 31 face each other at a position corresponding to the coordinates. Then, the needle 33 is abutted against the semiconductor chip W from the back side of the sheet S, and the semiconductor chip W is peeled off by suction from the front side of the sheet S with the suction collet 31 . Such an operation is sequentially performed for a plurality of semiconductor chips W to be peeled.

Note that the storage unit 15 stores in advance the arrangement pattern of the semiconductor chips W to be attached to the sheet S, and the control unit 10 uses the arrangement pattern stored in advance in the storage unit 15 and the first image information acquisition unit 91 to The peeling position of the sheet supporter 2 may be adjusted by comparing the obtained positional information. For example, when the control unit 10 compares the arrangement pattern stored in advance with the acquired position information and determines that the semiconductor chip W is attached to the sheet S in a tilted state, the sheet support 2 is moved in the .theta.

Further, for example, characteristic information relating to the characteristics of a plurality of semiconductor chips W attached on the sheet S may be stored in the storage unit 15 in advance, and the semiconductor chips W may be peeled off based on the information. good. Specifically, for example, based on the characteristic information of each of the plurality of semiconductor chips W, only the semiconductor chips W having characteristics of the same rank may be peeled off. Thereby, the semiconductor chips W can be classified according to their characteristics. Moreover, defective products (semiconductor chips of low rank) may not be peeled off. It should be noted that the characteristic information may be, for example, information relating to the voltage value, emission luminance, and the like. Further, the image of the semiconductor chip W may be displayed on the display of the computer in such a manner that each characteristic information stored in advance can be distinguished.

An imaging operation by the peeling system 100 according to the present embodiment will be described with reference to FIGS. 5 to 9. FIG.

FIG. 5 is a top view (view from the positive direction of the Z-axis) showing the peeling device according to the present embodiment, in which a line scan camera captures an image of a semiconductor chip attached to a sheet supported by a sheet support. It is a figure which shows a state. In FIG. 5, the layout and shape of each component of the peeling device 1 described above are schematically illustrated with some parts omitted, and the sheet S supported by the sheet support 2 is also illustrated. omitted. The same applies to FIGS. 6, 7, and 9, which will be described later. 5 indicates the imaging area of the line scan camera 70. As shown in FIG.

In FIG. 5, the sheet support 2 is at a position where the semiconductor chip W attached to the sheet S is imaged by the line scan camera 70 (hereinafter referred to as a second imaging position). With the sheet support 2 at the second imaging position, the line scan camera 70 collectively images the entire area of the sheet S. FIG. This is because, in the present embodiment, the area that can be imaged by the line scan camera 70 is wider than the entire area of the sheet S. By capturing an image of the semiconductor chip W on the sheet S using the line scan camera 70 in this manner, the image processing device 90 acquires presence information regarding the presence or absence of the semiconductor chip W on the entire sheet S. FIG.

6 and 7 are top views showing the peeling device according to the present embodiment, showing how the area camera captures an image of the semiconductor chip attached to the sheet supported by the sheet support. 6 and 7 indicate the imaging area of the area camera 80. As shown in FIG. 6 and 7, the sheet support 2 is at a position where the semiconductor chip W attached to the sheet S is imaged by the area camera 80 (hereinafter referred to as a first imaging position). Note that in FIG. 6, the broken line indicates the sheet support 2 at the second imaging position before moving to the first imaging position.

In this embodiment, as shown in FIGS. 6 and 7, a reflecting mirror 85 is arranged in an area that can be imaged by the area camera 80. is imaged. However, the configuration is not limited to this, and a configuration in which the image of the sheet S is directly captured without using the reflecting mirror 85 may be employed. In addition, in order to improve the image quality of the image acquired by the area camera 80, a white LED (Light Emitting Diode) is placed near the sheet support 2 located at the first imaging position so as to illuminate the semiconductor chip W to be imaged. An illumination device such as an emitting diode) may be provided.

In order to acquire the positional information of the semiconductor chip W with high accuracy, it is necessary to image the semiconductor chip W while the area camera 80 is brought close to the sheet S. As shown in FIG. In this case, since the area that can be imaged by the area camera 80 is limited, in order to image the semiconductor chip W in the entire area of the sheet S, the sheet support 2 that supports the sheet S is moved, and the imaging operation is performed multiple times. There is a need to do.

Specifically, after the area camera 80 captures an image of a predetermined area on the sheet S supported by the sheet support 2 located at the first imaging position (see FIG. 6), the sheet support 2 is moved to the position of the support. It is moved by the mechanism 21, and another area on the sheet S is imaged at the first imaging position after movement (see FIG. 7). FIG. 6 shows how the semiconductor chip W existing in the area near the center O of the sheet S is imaged. FIG. 7 shows how the semiconductor chip W present in the area of the sheet S on the positive side of the X axis is imaged. In this manner, by capturing images on the sheet S multiple times using the area camera 80, the image processing device 90 can acquire the position information of all the semiconductor chips W attached on the sheet S. Become.

Here, the semiconductor chips W are not always evenly distributed on the sheet S in the X-axis direction and the Y-axis direction, and the semiconductor chips W are not always present evenly in the areas already peeled by the peeling device 1 or in the areas peeled off due to some problem. does not exist. FIG. 8 is a plan view of a sheet partially without semiconductor chips as viewed from the front side. FIG. 8 shows that when the coordinates of the center O of the sheet S are (X, Z)=(0, 0), the semiconductor chip W is almost absent in the positive regions of the X axis and the Z axis. and a state where some of the semiconductor chips W are peeled off in the negative region of the Z axis.

Here, broken-line circles r1 and r2 in FIG. 8 indicate areas of a size that can be imaged by the area camera 80 (areas of a first size). When the sheet S in the state shown in FIG. 8 is used, if an image of the entire area of the sheet S is to be captured by the area camera 80, the supporting member 2 that supports the sheet S is used to capture an image of the area where the semiconductor chip W does not exist. is moved with respect to the area camera 80 . Since the sheet support 2 that supports the sheet S is moved in order to pick up an image of the area where the semiconductor chip W does not exist, an extra operation is performed. It takes an unnecessary amount of time to acquire it. Specifically, even the area of circle r2 shown in FIG.

Therefore, in the present embodiment, based on the existence information about the presence or absence of the semiconductor chip W acquired by imaging with the line scan camera 70, when the area camera 80 images the area that can be imaged, the semiconductor chip The seat support 2 is moved by the support moving mechanism 21 so that W is at the position where the image is taken. In the example shown in FIG. 8, the control unit 10 acquires presence information regarding that the area surrounded by the broken line E in FIG. 8 is the area where the semiconductor chip W exists. Then, based on the existence information, the control unit 10 controls the operations of the area camera 80 and the support moving mechanism 21 so as to image only the area where the semiconductor chip W exists. A broken-line circle r1 in FIG. 8 indicates an area captured by the area camera 80 in this embodiment, and a broken-line circle r2 indicates an area not captured by the area camera 80 in this embodiment.

In this embodiment, since the sheet support 2 is moved by the support moving mechanism 21 so that only the area where the semiconductor chip W is present is captured by the area camera 80, the amount of movement of the sheet support 2 can be reduced. . As a result, the position information of the semiconductor chip W to be peeled can be obtained in a short time.

Further, the peeling operation by the peeling mechanism 3 will be described with reference to FIGS. 9 to 12. FIG. FIG. 9 is a top view showing the peeling device according to the present embodiment, showing how the semiconductor chips on the sheet are peeled off by the peeling mechanism. FIG. 10 is a side view showing the sheet and the peeling mechanism at the peeling position, showing a state in which the needle is housed in the holder. FIG. 11 is a side view showing the sheet and the peeling mechanism at the peeling position, showing a state in which the needle protrudes from the holder. FIG. 12 is a side view showing the sheet and the peeling mechanism at the peeling position, showing a state in which the suction collet holds the semiconductor element by suction, facing the chip transfer stage. 10 to 12, in order to avoid complication of the drawing, illustration of the seat support 2 is omitted and only one semiconductor chip W is shown.

The peeling mechanism 3 sequentially peels the semiconductor chips W on the sheet S based on the position information obtained by imaging the semiconductor chips W on the sheet S with the area camera 80 . Specifically, the sheet support 2 is moved from the first imaging position to the peeling position so that the suction collet 31 and the needle 33 are arranged at positions facing the semiconductor chip W to be peeled (FIG. 10). etc.).

Thereafter, the needle advancing/retreating mechanism 34 causes the needle 33 to protrude with respect to the semiconductor chip W to be removed. As a result, the semiconductor chip W to be peeled moves toward the suction collet 31 (see FIG. 11). Then, in the state shown in FIG. 11 , the semiconductor chip W to be removed is sucked by the sucking collet 31 . Then, the suction collet 31 is retracted from the sheet S by the collet advancing/retreating mechanism 32 while the semiconductor chip W is held by the suction collet 31 . Then, the sucking collet 31 is rotated so that the sucked semiconductor chip W faces the chip transfer stage 6 shown in FIGS. 2 and 3 (see FIG. 12). After that, the chip transfer section 71 shown in FIGS. 2 and 3 receives the semiconductor chip W from the suction collet 31 .

Next, the operation of the control unit in this embodiment will be described with reference to FIG. 13 and the like. FIG. 13 is a flowchart for explaining the operation of the control section in this embodiment.

First, the control unit 10 controls the support moving mechanism 21 so that the sheet support 2 moves to the second imaging position (step S1). Then, the control unit 10 controls the line scan camera 70 so as to image the entire area of the sheet S (step S2, see FIG. 5). Then, the control unit 10 acquires presence information regarding the presence/absence of the semiconductor chip W from the second image information acquired by the second image information acquiring unit 92 of the image processing device 90 (step S3).

Thereafter, based on the presence information, the control unit 10 controls the support moving mechanism 21 so that the sheet support 2 moves to the first imaging position (step S4, see FIG. 6). Specifically, based on the presence information, the control unit 10 moves the semiconductor chip W to the first imaging position where the semiconductor chip W is imaged when the area camera 80 captures an image of the area of the first size on the sheet S. , controls the support moving mechanism 21 so that the seat support 2 moves.

Then, the control unit 10 controls the area camera 80 to capture an image of the first area on the sheet S (step S5). When the control unit 10 determines that imaging of all the regions to be imaged has not been completed based on the existence information (NO in step 6), the support moving mechanism 21 separates the sheet support 2. to the first imaging position (step S4, see FIG. 7). After that, a similar imaging operation is performed.

When the control unit 10 determines that the imaging of all the regions to be imaged has been completed based on the existence information (YES in step S6), the image acquired by the first image information acquisition unit 91 of the image processing device 90 Position information about the position of the semiconductor chip W is acquired from the first image information (step S7).

Thereafter, based on the position information, the control unit 10 causes the support moving mechanism 21 to move the sheet support 2 to the peeling position (step S8). Then, the control unit 10 drives the peeling mechanism 3 so as to peel off one semiconductor chip W to be peeled (step S9, see FIGS. 9 to 11). When the control unit 10 determines that the peeling of all the semiconductor chips W to be peeled has not been completed (NO in step S10), the support moving mechanism 21 further determines that the sheet support 2 is to be peeled off. The peeling mechanism 3 is driven so as to peel off the semiconductor chip W of . The control unit 10 repeats such a peeling operation until the peeling of all the semiconductor chips W to be peeled is completed.

As described above, the seat support 2 may be configured to be movable in the θ direction by the support moving mechanism 21 in addition to the X-axis, Y-axis, and Z-axis directions. The movement in the .theta. This may be done when making adjustments. In addition to such fine adjustment, the support 2 may be configured to be rotatable in units of 90 degrees by the support moving mechanism 21 . FIG. 14 is a plan view showing a state in which the seat shown in FIG. 8 is rotated 90 degrees in the θ direction.

Thus, by rotating the sheet support 2 about the center O of the sheet S in the θ direction by 90 degrees, the orientation of the semiconductor chip W attached to the sheet S can be changed by 90 degrees. In other words, the semiconductor chips W attached so that the longitudinal direction is the Z-axis direction as shown in FIG. 8 can be changed to the state in which the X-axis direction is the longitudinal direction as shown in FIG. As a result, the direction of the semiconductor chip W can be changed in the process after the peeling process, such as when the semiconductor chip W is held by the suction collet 31 by suction. Accordingly, it is possible to easily obtain the semiconductor chips W oriented in a direction based on the user's request without performing a step of individually changing the orientation of each semiconductor chip W after the peeling step.

In the above-described embodiment, the configuration in which the position of the area camera 80 is fixed and the sheet support 2 that supports the sheet S is moved by the support moving mechanism 21 has been described. Any configuration may be employed as long as the camera 80 and the sheet S are relatively movable. That is, a configuration may be adopted in which the position of the seat support 2 is fixed and the area camera 80 is moved by a moving mechanism.

Further, in the present embodiment, an example has been described in which the area camera 80 as the first imaging means and the line scan camera 70 as the second imaging means are independent cameras. In this case, it may be configured to play both roles of the first imaging means and the second imaging means. For example, the area camera 80 may be provided with a zoom function that enables the entire area of the sheet S to be imaged when the shutter is released once. In this case, although the image quality of the image captured by the area camera 80 is degraded, an image with image quality equivalent to that of the line scan camera 70 can be obtained to the extent that the presence information described in the present embodiment can be obtained. It should be something that can be done. By adopting such a configuration, a first image capturing means capable of capturing an area of the first size with one area camera 80, and an area of a second size wider than the area of the first size. It becomes possible to play both roles of the second imaging means capable of imaging the area.

Although the embodiment according to the present invention has been described above, the specific configuration shown in this embodiment is shown as an example, and it is not intended to limit the technical scope of the present invention to this. Those skilled in the art may modify these disclosed embodiments as appropriate, and it should be understood that the technical scope of the invention disclosed herein includes such modifications.

1 peeling device 2 sheet support 3 peeling mechanism 31 suction collet 32 collet advance/retreat mechanism 33 needle 34 needle advance/retreat mechanism 35 arm 36 motor 6 mechanism support stage 7 chip transfer stage 71 chip transfer section , 10 control unit, 51 holder, 70 line scan camera, 80 area camera, 85 reflector, 90 image processing device, 91 first image information acquisition unit, 92 second image information acquisition unit, 100 peeling system, S sheet, W semiconductor chip.

Claims (4)

a first imaging means capable of imaging an area of a first size on the sheet to which the plurality of electronic components are attached;
a movement mechanism for moving either the sheet or the first imaging means relative to the other;
a peeling mechanism for peeling off the electronic component based on the position information of the electronic component acquired by being imaged by the first imaging means;
A peeling device comprising:
a second imaging means capable of imaging a second area on the sheet, which is wider than the first area ;
image information acquiring means for acquiring a contour of a group of electronic components existing on the sheet based on image information captured by the second imaging means;
has
The moving mechanism moves either the sheet or the first imaging means such that at least a part of the area of the first size overlaps an area inside the contour of the group of electronic components . move relative to the other,
peeling device. A seat support that supports the seat,
The sheet support is rotatable in units of 90 degrees around an axis extending in a direction perpendicular to a surface of the sheet to which the plurality of electronic components are attached.
The peeling device according to claim 1. A storage unit that stores in advance characteristic information of each of the plurality of electronic components attached on the sheet,
The peeling mechanism peels off the plurality of electronic components attached to the sheet so as to be classified according to the characteristic information.
The peeling device according to claim 1 or 2. The second imaging means is a scanning imaging device that captures an image of the area of the second size by scanning the sheet.
The peeling device according to any one of claims 1 to 3.

Images