JP7202231B2 - Cleaning head, center brush, peripheral brush, substrate cleaning device and substrate cleaning method - Google Patents

Description

The present invention relates to a cleaning head, a center brush, a peripheral brush, a substrate cleaning apparatus, and a substrate cleaning method for cleaning a substrate.

2. Description of the Related Art In a lithography process in manufacturing semiconductor devices and the like, a resist film is formed by supplying a resist liquid onto a substrate. After the resist film is exposed, it is developed to form a predetermined pattern on the resist film. A substrate cleaning apparatus performs a cleaning process on the substrate before the resist film is exposed to light.

For example, a substrate cleaning apparatus described in Patent Document 1 has a cleaning head composed of a central portion, an annular portion, and a pedestal. The central portion has a cylindrical external shape and is attached to the center of the pedestal. The annular portion has an annular external shape and is attached to the pedestal so as to surround the central portion. The central portion and annular portion are used for cleaning the back surface and bevel portion of the substrate, respectively.

Japanese Patent Application Laid-Open No. 2012-23209

In order to properly clean the substrate, it is necessary to use an appropriate cleaning head corresponding to the shape of the substrate or the type of cleaning. However, preparing a plurality of cleaning heads corresponding to the shape of the substrate or the type of cleaning increases the cost of the cleaning process. Also, the cleaning head is a consumable item, and is replaced with a new one when worn out. However, frequent replacement of the cleaning head increases the cost of the cleaning process.

SUMMARY OF THE INVENTION An object of the present invention is to provide a cleaning head, a center brush, a peripheral brush, a substrate cleaning apparatus, and a substrate cleaning method capable of appropriately cleaning a substrate while suppressing an increase in cost.

(1) A cleaning head according to a first aspect of the present invention is a cleaning head used for cleaning a substrate, and is a cleaning head including a first base and a first cleaning section attached to the first base. A peripheral brush including a brush, a second base, and a second cleaning unit attached to the second base and disposed so as to surround the center brush, the first base comprising: The center brush is connected to a first elevating section for elevating the center brush, the second base is connected to a second elevating section for elevating the outer peripheral brush, and the center brush and the outer peripheral brush are connected to the first elevating section and the second elevating section. 2 elevating parts are configured to be movable in one direction independently of each other, and one of the center brush and the outer peripheral brush is configured to be removable from the other of the center brush and the outer peripheral brush by being moved in one direction. .

In this cleaning head, the peripheral brush is arranged to surround the center brush. Since the first base of the center brush and the second base of the peripheral brush are separate members, the center brush and the peripheral brush can be attached to and detached from each other. Therefore, when only one of the first cleaning portion of the center brush and the second cleaning portion of the outer peripheral brush wears out, it is not necessary to replace the entire cleaning head, and only the worn brush can be replaced. .

Further, by configuring the cleaning head by changing the combination of the center brush and the outer peripheral brush according to the shape of the substrate to be cleaned or the type of cleaning, the substrate can be appropriately cleaned using the cleaning head. . In this case, it is not necessary to prepare many kinds of cleaning heads with a fixed combination of the center brush and the peripheral brush. As a result, it is possible to appropriately clean the substrate while suppressing an increase in cost.

Also, the center brush and the peripheral brush are configured to be movable in one direction independently of each other. In this case, the substrate can be cleaned appropriately by using an appropriate brush according to the portion of the substrate to be cleaned. Also, by setting the timing of cleaning by the center brush and the timing of cleaning by the peripheral brush to be different, it is possible to prevent contaminants generated by one brush from adhering to the other brush. Thereby, it is possible to make the cleaning head less likely to be worn out.

( 2 ) The center brush and the peripheral brush may be integrally rotatable around an axis parallel to one direction. In this case, the center brush and the peripheral brush can be rotated with a simple structure. Further, the substrate can be efficiently cleaned by rotating the center brush and the outer peripheral brush.

( 3 ) A cleaning head according to a second aspect of the present invention is a cleaning head used for cleaning a substrate, and is a cleaning head including a first base and a first cleaning section attached to the first base. A peripheral brush including a brush, a second base, and a second cleaning section attached to the second base and arranged to surround the center brush, wherein the center brush and the peripheral brush are , the center brush and the peripheral brush are configured to be detachable from each other, the center brush and the peripheral brush are configured to be movable in one direction independently of each other, and the center brush and the peripheral brush integrally rotate around an axis parallel to the one direction. The first base has a non-circular cross-section orthogonal to one direction, the second base has an opening in which the center brush is accommodated, and the opening is a center brush. It has a non-circular cross-section corresponding to the non-circular cross- section of the brush. In this case, the center brush and the outer peripheral brush can be easily configured to be integrally rotatable.

( 4 ) The center brush and the peripheral brush may be rotatable independently of each other around an axis parallel to one direction. In this case, it is possible to independently rotate the center brush and the peripheral brush according to the portion of the substrate to be cleaned or the type of cleaning. Thereby, the substrate can be cleaned more efficiently.

( 5 ) The first cleaning section may be made of a material containing an abrasive. In this case, it becomes possible to polish the substrate with the center brush. As a result, foreign matter firmly adhering to the substrate can be removed.

( 6 ) The first cleaning portion of the center brush may have a first cleaning surface capable of contacting the substrate, and the first cleaning surface may be formed with grooves. According to this configuration, when cleaning the substrate by ejecting the cleaning liquid onto the substrate, it becomes easy to supply the cleaning liquid to the entire first cleaning surface through the groove. This allows the substrate to be cleaned more thoroughly.

( 7 ) The second cleaning section may be made of a soft material. According to this configuration, when the second cleaning section comes into contact with the substrate, the second cleaning section deforms. Therefore, even a non-flat portion such as a bevel portion of the substrate can be properly cleaned by the peripheral brush. Further, even when the second cleaning part and the substrate come into contact with each other, the contact between the first cleaning part and the substrate is less likely to be hindered because the second cleaning part is deformed. Therefore, the first and second cleaning units can be brought into sufficient contact with the substrate at the same time. This makes it possible to clean the substrate more appropriately.

( 8 ) The second cleaning portion of the outer peripheral brush has a second cleaning surface that can contact the substrate, and the second cleaning surface includes a flat surface and a tapered surface that is inclined with respect to the flat surface. It's okay. According to this configuration, when the second cleaning part contacts the substrate, the second cleaning part is more easily deformed. As a result, the substrate can be cleaned more appropriately by bringing the first and second cleaning units into contact with the substrate at the same time and more sufficiently. Also, the flat portion of the substrate can be properly cleaned by the flat portion. Furthermore, the tapered portion can appropriately clean the non-flat portion such as the bevel portion of the substrate.

( 9 ) A gap is formed between the center brush and the peripheral brush so as to communicate between the first base and the second base and between the first cleaning section and the second cleaning section. may In this case, since the center brush and the peripheral brush do not come into close contact with each other due to the gap, the center brush and the peripheral brush can be easily attached and detached. Further, it becomes possible to supply cleaning water to the substrate through the gap. Furthermore, it is possible to suck cleaning water or contaminants from the substrate through the gap.

( 10 ) A center brush according to a third aspect of the present invention is a center brush provided on an outer peripheral brush and used for cleaning a substrate, comprising a first base and a first base attached to the first base. a cleaning unit, wherein the first base is connected to a first elevating unit that elevates the center brush; the outer peripheral brush is connected to a second elevating unit that elevates the outer peripheral brush; The brush is configured to be independently movable in one direction by a first elevating section and a second elevating section. configured to be removable from the

The center brush is detachably arranged so as to be surrounded by the peripheral brush. Therefore, when the first cleaning portion of the center brush wears out, it is not necessary to replace the entire cleaning head, and only the center brush can be replaced. Further, by configuring the cleaning head by changing the center brush combined with the outer peripheral brush according to the shape of the substrate to be cleaned or the type of cleaning, the substrate can be appropriately cleaned using the cleaning head. In this case, it is not necessary to prepare many kinds of cleaning heads with a fixed combination of the center brush and the peripheral brush. As a result, it is possible to appropriately clean the substrate while suppressing an increase in cost.

( 11 ) A peripheral brush according to a fourth aspect of the present invention is a peripheral brush provided on a center brush and used for cleaning a substrate, comprising a second base and a second base attached to the second base. and a cleaning unit, which is detachably arranged so as to surround the center brush.

This peripheral brush is detachably arranged so as to surround the center brush. Therefore, when the second cleaning portion of the outer peripheral brush wears out, it is not necessary to replace the entire cleaning head, and only the outer peripheral brush can be replaced. Further, by configuring the cleaning head by changing the peripheral brush combined with the center brush according to the shape of the substrate to be cleaned or the type of cleaning, the substrate can be appropriately cleaned using the cleaning head. In this case, it is not necessary to prepare many kinds of cleaning heads with a fixed combination of the center brush and the peripheral brush. As a result, it is possible to appropriately clean the substrate while suppressing an increase in cost.

( 12 ) A substrate cleaning apparatus according to a fifth aspect of the present invention comprises a substrate holding portion for holding a substrate, and a cleaning head according to the first aspect of the present invention provided to clean the substrate held by the substrate holding portion. .

In this substrate cleaning apparatus, the substrate held by the substrate holding portion is cleaned by the cleaning head. In the cleaning head, since the first base of the center brush and the second base of the peripheral brush are separate members, the center brush and the peripheral brush are detachable from each other. Therefore, when only one of the first cleaning portion of the center brush and the second cleaning portion of the outer peripheral brush wears out, it is not necessary to replace the entire cleaning head, and only the worn brush can be replaced. .

Further, by configuring the cleaning head by changing the combination of the center brush and the outer peripheral brush according to the shape of the substrate to be cleaned or the type of cleaning, the substrate can be appropriately cleaned using the cleaning head. . In this case, it is not necessary to prepare many kinds of cleaning heads with a fixed combination of the center brush and the peripheral brush. As a result, it is possible to appropriately clean the substrate while suppressing an increase in cost.

( 13 ) The substrate cleaning apparatus includes a first driving device capable of moving the center brush of the cleaning head toward the substrate, and a second driving device capable of moving the peripheral brush of the cleaning head toward the substrate. may be further provided.

In this case, the substrate can be appropriately cleaned with the center brush or the peripheral brush by operating the first or second driving device according to the portion of the substrate to be cleaned. Also, by setting the timing of cleaning by the center brush and the timing of cleaning by the peripheral brush to be different, it is possible to prevent contaminants generated by one brush from adhering to the other brush. Thereby, it is possible to make the cleaning head less likely to be worn out.

( 14 ) A substrate cleaning method according to a sixth aspect of the present invention comprises the steps of: holding a substrate by a substrate holding portion; and cleaning the substrate held by the substrate holding portion with a cleaning head according to the first or second aspect of the invention. including. According to this method, when only one of the first cleaning portion of the center brush and the second cleaning portion of the outer peripheral brush is consumed, it is not necessary to replace the entire cleaning head, and only the worn brush is replaced. can do.

Further, by configuring the cleaning head by changing the combination of the center brush and the outer peripheral brush according to the shape of the substrate to be cleaned or the type of cleaning, the substrate can be appropriately cleaned using the cleaning head. . In this case, it is not necessary to prepare many kinds of cleaning heads with a fixed combination of the center brush and the peripheral brush. As a result, it is possible to appropriately clean the substrate while suppressing an increase in cost.

ADVANTAGE OF THE INVENTION According to this invention, a board|substrate can be suitably wash|cleaned, suppressing the increase in cost.

1 is an external perspective view of a cleaning head according to a first embodiment of the present invention; FIG. FIG. 2 is a diagram for explaining the configuration of a center brush in FIG. 1; FIG. 2 is a diagram for explaining the configuration of a center brush in FIG. 1; FIG. 2 is a diagram for explaining the configuration of an outer peripheral brush in FIG. 1; FIG. 2 is a diagram for explaining the configuration of an outer peripheral brush in FIG. 1; Fig. 2 is a bottom view of the cleaning head; FIG. 3 is a plan view of the cleaning head; FIG. 4 is a plan view showing a cleaning head according to a first modified example; FIG. 11 is a perspective view showing a cleaning head according to a second modified example; Figure 10 is a plan view of the cleaning head of Figure 9; 1 is a diagram showing a schematic configuration of a substrate cleaning apparatus including a cleaning head; FIG. It is a figure for demonstrating the 1st operation example of a substrate cleaning apparatus. It is a figure for demonstrating the 1st operation example of a substrate cleaning apparatus. It is a figure for demonstrating the 2nd operation example of a substrate cleaning apparatus. It is a figure for demonstrating the 2nd operation example of a substrate cleaning apparatus. It is a figure which shows the 1st modification of a washing|cleaning part. It is a figure which shows the 2nd modification of a washing|cleaning part. It is a figure which shows the modification of a suction part. It is a bottom view of a cleaning head according to a second embodiment of the present invention. 20 is a diagram showing a schematic configuration of a substrate cleaning apparatus including the cleaning head of FIG. 19; FIG. It is a figure which shows the structure of the substrate cleaning apparatus which concerns on 3rd Embodiment. FIG. 10 is a diagram for explaining a substrate holding operation by a spin chuck; FIG. 10 is a diagram for explaining a substrate holding operation by a spin chuck; FIG. 10 is a diagram for explaining a substrate holding operation by a spin chuck; FIG. 10 is a diagram for explaining a substrate holding operation by a spin chuck; FIG. 4 is a diagram for explaining cleaning of a substrate by a cleaning head; FIG. 4 is a diagram for explaining cleaning of a substrate by a cleaning head; FIG. 4 is a diagram for explaining cleaning of a substrate by a cleaning head; It is a figure which shows the structure of the substrate cleaning apparatus which concerns on 4th Embodiment.

Hereinafter, a cleaning head, a center brush, an outer peripheral brush, a substrate cleaning apparatus, and a substrate cleaning method according to embodiments of the present invention will be described with reference to the drawings. In the following description, the substrate means a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, A photomask substrate, a ceramic substrate, a solar cell substrate, or the like.

[1] First Embodiment (1) Configuration of Cleaning Head FIG. 1 is an external perspective view of a cleaning head according to a first embodiment of the present invention. As shown in FIG. 1, the cleaning head 100 is used for cleaning substrates and is composed of a center brush 200 and an outer peripheral brush 300 . Peripheral brush 300 is arranged to surround center brush 200 . The center brush 200 and the peripheral brush 300 are detachable from each other.

Center brush 200 includes base 210 and cleaning unit 220 . The base 210 is made of PVC (polyvinyl chloride) resin, for example. In this embodiment, the base 210 is attached with a shaft 112 for rotating the cleaning head 100 . The cleaning part 220 is formed of, for example, a PVA (polyvinyl alcohol) sponge in which an abrasive material such as abrasive grains is dispersed. The cleaning unit 220 is attached to the base 210 .

Peripheral brush 300 includes base 310 and cleaning section 320 . The base 310 is made of, for example, PP (polypropylene) resin. The cleaning part 320 is made of, for example, porous fluororesin. In this example, the cleaning part 320 is made of PTFE (polytetrafluoroethylene), but the invention is not limited to this. The cleaning part 320 may be made of other soft materials such as PVA sponge that does not contain abrasives. The cleaning unit 320 is attached to the base 310 .

In the following description, in the cleaning head 100, the direction in which the cleaning units 220 and 320 are arranged is called upward, and the opposite direction is called downward (see the arrow in FIG. 1). A plane perpendicular to the vertical direction is called a horizontal plane. In the horizontal plane, the direction toward the center of rotation of the cleaning head 100 (the center of the shaft 112 in the horizontal plane) is called inward, and the opposite direction is called outward.

2 and 3 are diagrams for explaining the configuration of the center brush 200 of FIG. 1. FIG. As shown in FIG. 2, the base 210 of the center brush 200 has a substantially cylindrical shape extending vertically. A hole 211 extending upward is formed in the lower surface of the base 210 . In this example, the hole 211 is a bottomed hole having a square shape in the horizontal plane. The shape of the hole 211 is not limited to the example in FIG. Hole 211 may have a shape other than a square in the horizontal plane. Moreover, the hole portion 211 may be a through hole that vertically penetrates the base 210 .

Two flat portions 212 and 213 are formed on the side surface of the base 210 . Thereby, the base 210 has a non-circular cross section in the horizontal plane. The shape of the base 210 is not limited to the example in FIG. Base 210 may have other shapes, so long as the cross-section has a non-circular shape. For example, a flat portion may be formed only at one location on the side surface of the base 210 so that the cross section is D-shaped. Alternatively, the base 210 may have an elliptical cylinder shape or a polygonal cylinder shape so that the cross section has an elliptical shape or a polygonal shape.

Cleaning portion 220 of center brush 200 has a disc shape. A groove portion 221 is formed on the upper surface of the cleaning portion 220 . In this example, the groove 221 has a cross shape. As indicated by arrows in FIG. 2, the lower surface of the cleaning unit 220 is bonded to the upper surface of the base 210 with an adhesive or the like. Thereby, as shown in FIG. 3, the center brush 200 is completed.

4 and 5 are diagrams for explaining the configuration of the outer peripheral brush 300 of FIG. 1. FIG. As shown in FIG. 4, the base 310 of the peripheral brush 300 has a substantially cylindrical shape. Accordingly, an opening 311 extending vertically is formed in the central portion of the base 310 . The opening 311 has a non-circular cross-sectional shape in the horizontal plane corresponding to the cross-sectional shape of the base 210 of the center brush 200 of FIG. Therefore, in this example, flat portions 312 and 313 corresponding to the flat portions 212 and 213 ( FIG. 2 ) of the base 210 are formed on the inner surface of the base 310 within the opening 311 .

Cleaning portion 320 of peripheral brush 300 has an annular shape. Therefore, for example, a circular opening 321 is formed in the central portion of the cleaning section 320 . In addition, a plurality of cutouts 322 are formed in the cleaning section 320 so as to extend from the outer periphery to the opening 321 . In this example, four notches 322 are arranged at intervals of 90 degrees. The upper surface of the cleaning section 320 has a tapered surface 323 that slopes obliquely upward from the inside to the outside, and a flat surface 324 that is horizontal at the outer peripheral portion.

As indicated by arrows in FIG. 4, the lower surface of the cleaning unit 320 is bonded to the upper surface of the base 310 with an adhesive or the like. Thereby, as shown in FIG. 5, the peripheral brush 300 is completed. In the outer peripheral brush 300, the opening 311 of the base 310 and the opening 321 of the cleaning section 320 vertically overlap.

FIG. 6 is a bottom view of the cleaning head 100. FIG. FIG. 7 is a plan view of the cleaning head 100. FIG. As shown in FIGS. 6 and 7 , the cleaning head 100 is completed by arranging the center brush 200 in the openings 311 and 321 of the outer peripheral brush 300 . At least a portion between the outer peripheral surface of the center brush 200 and the inner peripheral surface of the outer peripheral brush 300 does not contact each other. Thereby, a gap 101 is formed between the outer peripheral surface of the center brush 200 and the inner peripheral surface of the outer peripheral brush 300 .

Since the center brush 200 and the outer peripheral brush 300 do not adhere to each other due to the gap 101, the center brush 200 and the outer peripheral brush 300 can be easily attached and detached. Moreover, it is possible to supply cleaning water to the substrate to be cleaned through the gap 101 . Furthermore, it is possible to suck cleaning water or contaminants from the substrate through the gap 101 . Details will be described later.

As described above, opening 311 of base 310 has a cross-sectional shape corresponding to the cross-sectional shape of base 210 . Further, as shown in FIG. 6, the flat portions 212 and 213 of the base 210 and the flat portions 312 and 313 of the base 310 are in contact with each other. This restricts the center brush 200 and the outer peripheral brush 300 from rotating independently of each other.

On the other hand, the center brush 200 and the outer peripheral brush 300 are not fixed to each other. Therefore, the center brush 200 and the peripheral brush 300 can move vertically independently of each other. In the present embodiment, in the initial state, the upper surface of cleaning portion 320 of outer peripheral brush 300 is located above the upper surface of cleaning portion 220 of center brush 200 .

The shaft 112 has a cross-sectional shape (square in this example) corresponding to the shape of the hole 211 of the base 210 in the horizontal plane, and is inserted into the hole 211 of the base 210 . Since the center brush 200 and the outer peripheral brush 300 are restricted from rotating independently of each other, they rotate in synchronization with the rotation of the shaft 112 . Note that the cleaning head 100 does not have to be rotatable. In this case, shaft 112 may have a circular cross-sectional shape in the horizontal plane. Similarly, the hole 211 of the base 210 may have a circular cross-sectional shape in the horizontal plane.

In the present embodiment, as shown in FIG. 7, the center brush 200 and the outer peripheral brush 300 are configured so that the plurality of notches 322 of the cleaning section 320 and the grooves 221 of the cleaning section 220 are connected. is not limited to this. FIG. 8 is a plan view showing a cleaning head 100 according to a first modified example. As shown in FIG. 8, the center brush 200 and the peripheral brush 300 may be configured such that the plurality of cutouts 322 and the grooves 221 are not connected.

Moreover, although groove 221 has a cross shape in the present embodiment, the present invention is not limited to this. Grooves 221 may have other shapes. FIG. 9 is a perspective view showing a cleaning head 100 according to a second modified example. 10 is a plan view of the cleaning head 100 of FIG. 9. FIG. As shown in FIGS. 9 and 10, in the second modification, groove 221 has a windmill shape. Specifically, groove portion 221 has a shape extending outward from the center of cleaning portion 220 while curving in four directions. In this example, each notch 322 is connected to the groove 221 and formed to extend in the circumferential direction while curving.

(2) Schematic Configuration of Substrate Cleaning Apparatus FIG. 11 is a diagram showing a schematic configuration of a substrate cleaning apparatus including the cleaning head 100 . As shown in FIG. 11 , substrate cleaning apparatus 1 includes cleaning head 100 , rotating section 110 , lifting sections 120 and 130 , cleaning section 140 and suction section 150 . The substrate cleaning apparatus 1 also includes a substrate holder such as a spin chuck 410 in FIG. 21 or a spin chuck 460 in FIG. 29, which will be described later.

The rotating portion 110 includes a rotary drive device 111 and a shaft 112 . The rotary drive device 111 is, for example, an electric motor. The shaft 112 is inserted into the hole 211 of the base 210 of the center brush 200 and connected to the rotary drive device 111 . Rotation drive device 111 rotates shaft 112 to integrally rotate center brush 200 and outer peripheral brush 300 .

In this example, the center brush 200 and the outer peripheral brush 300 are configured to rotate integrally when the center brush 200 is provided with the rotational driving force from the rotating portion 110, but the present invention is not limited to this. . The center brush 200 and the outer peripheral brush 300 may be configured to rotate integrally by applying the rotational driving force from the rotating portion 110 to the outer peripheral brush 300 .

Elevating unit 120 includes an elevation driving device 121 and a connecting member 122 . Elevating unit 130 includes an elevation driving device 131 and a connecting member 132 . The elevation drive devices 121 and 131 are, for example, air cylinders. Note that the elevation drive devices 121 and 131 may be configured by, for example, electric motors and ball screws. The lifting drive device 121 is connected to the rotation drive device 111 by a connecting member 122 . The lifting drive device 131 is connected to the base 310 of the outer peripheral brush 300 by a connecting member 132 .

The center brush 200 moves up and down independently of the outer peripheral brush 300 by the elevation driving device 121 raising and lowering the connecting member 122 . The lift driving device 131 lifts and lowers the connecting member 132 , so that the outer peripheral brush 300 rises and lowers independently of the center brush 200 . The rotary drive device 111 and the elevation drive device 121 may be realized by a single rotary elevation drive device. In this case, the connecting member 122 is not provided between the rotation drive device 111 and the elevation drive device 121 .

Cleaning section 140 includes cleaning liquid supply device 141 and nozzle 142 . The cleaning liquid supply device 141 discharges the cleaning liquid above the cleaning head 100 (between the cleaning head 100 and the substrate) through a nozzle 142 . The cleaning liquid may be DIW (pure water), a surfactant, a solvent, or other chemical liquid. The suction unit 150 is, for example, a vacuum device, and is provided so as to be able to suck foreign matter generated by cleaning the substrate. The operation of the substrate cleaning apparatus 1 will be described below. 12 and 13 are diagrams for explaining a first operation example of the substrate cleaning apparatus 1. FIG.

In the example of FIG. 12, the surface to be cleaned (back surface in this example) of the substrate W held by the substrate holding part is cleaned. Specifically, as shown in FIG. 12, the center brush 200 and the peripheral brush 300 are raised toward the surface of the substrate W to be cleaned. In this case, the flat surface 324 of the cleaning section 320 contacts the surface of the substrate W to be cleaned. Here, since the upper surface of the cleaning part 320 is formed in a tapered shape, it is easily deformed so as to be crushed. Therefore, contact between the cleaning unit 220 and the substrate W is less likely to be hindered. As a result, the upper surface of the cleaning unit 220 rises to substantially the same height as the upper surface (flat surface 324) of the cleaning unit 320, and contacts the surface of the substrate W to be cleaned.

In this manner, the substrate W is rotated while the upper surface of the cleaning unit 220 and the upper surface of the cleaning unit 320 are simultaneously and sufficiently in contact with the surface of the substrate W to be cleaned, thereby cleaning the surface of the substrate W to be cleaned. Further, when the cleaning head 100 rotates, the surface to be cleaned of the substrate W is cleaned more efficiently. The direction of rotation of the substrate W and the direction of rotation of the cleaning head 100 may be the same, or may be opposite.

Hereinafter, cleaning by polishing the substrate W will be referred to as polishing cleaning, and cleaning by rubbing the substrate W will be referred to as scrub cleaning. In the example of FIG. 12 , the surface to be processed of the substrate W is polished and cleaned by the cleaning unit 220 , and the surface to be processed of the substrate W is scrub-cleaned by the cleaning unit 320 . By polishing and cleaning, foreign matter firmly adhering to the substrate W can be removed.

During cleaning of the substrate W, the cleaning liquid is discharged from the nozzle 142 above the cleaning head 100 . The discharged cleaning liquid is supplied to the entire upper surface of cleaning section 320 through notch 322 ( FIG. 5 ) of cleaning section 320 . Also, the cleaning liquid is supplied to the entire upper surface of the cleaning unit 220 through the grooves 221 of the cleaning unit 220 . Thereby, the substrate W can be cleaned more sufficiently.

9 and 10, when each notch 322 of the cleaning unit 320 has a curved shape, the cleaning liquid is supplied to the entire upper surface of the cleaning unit 320 more efficiently. Similarly, when the cleaning unit 220 has a windmill shape, the cleaning liquid is more efficiently supplied to the entire upper surface of the cleaning unit 220 . Therefore, the substrate W can be sufficiently cleaned while reducing the amount of cleaning liquid used.

As indicated by the dotted line in FIG. 12 , during cleaning of the substrate W, the atmosphere above the cleaning head 100 is sucked by the suction unit 150 through the gap 101 between the center brush 200 and the outer peripheral brush 300 . In this case, the cleaning liquid is efficiently taken into the entire upper surface of cleaning unit 320 and the entire upper surface of cleaning unit 220 . Therefore, the substrate W can be sufficiently cleaned while reducing the amount of cleaning liquid used.

Further, since the substrate W is attracted to the cleaning head 100, the substrate W can be cleaned while the cleaning head 100 is firmly pressed against it. The strength of the pressure of the cleaning head 100 against the substrate W is adjusted by controlling the suction pressure of the suction section 150 . Furthermore, the cleaning liquid after cleaning or the foreign matter generated by cleaning the substrate is discharged to the suction unit 150 without reattaching to the substrate. As a result of these, the substrate W can be cleaned more sufficiently.

In the example of FIG. 13, the bevel portion of the substrate W is further cleaned. Specifically, after the cleaning of FIG. 12, the cleaning head 100 is moved to the peripheral edge of the substrate W so that a part of the outer peripheral brush 300 is positioned outside the substrate W, as shown in FIG. . In this case, the shape of part of the cleaning part 320 returns to its original shape, and the tapered surface 323 comes into contact with the bevel part of the substrate W. FIG. As a result, mainly the bevel portion of the substrate W is scrub-cleaned by the cleaning section 320 . Further, the surface to be processed of the substrate W is polished and cleaned by the cleaning unit 220 .

In the first operation example of the substrate cleaning apparatus 1, the center brush 200 and the outer peripheral brush 300 move together vertically, but the present invention is not limited to this. 14 and 15 are diagrams for explaining a second operation example of the substrate cleaning apparatus 1. FIG. As shown in FIG. 14, when cleaning the surface to be processed of the substrate W, the center brush 200 is raised toward the surface to be cleaned of the substrate W without raising the outer peripheral brush 300 . In this case, the upper surface of the cleaning unit 220 contacts the surface of the substrate W to be cleaned without the cleaning unit 320 contacting the substrate W. FIG. Thereby, the surface to be processed of the substrate W is polished and cleaned by the cleaning unit 220 .

In the example of FIG. 14, the cleaning section 220 and the cleaning section 320 do not contact the substrate W at the same time. Therefore, foreign substances (including contaminants from the substrate W and abrasives dropped from the cleaning section 220 ) generated by polishing and cleaning by the cleaning section 220 are prevented from adhering to the cleaning section 320 . As a result, cleaning unit 320 can be made less likely to be contaminated. Thereafter, as shown in FIG. 15, the cleaning head 100 is moved to the peripheral portion of the substrate W so that a portion of the outer peripheral brush 300 is positioned outside the substrate W, and the outer peripheral brush 300 is raised. As a result, the bevel portion of the substrate W is scrub-cleaned by the cleaning section 320 .

In the substrate cleaning apparatus 1 of FIG. 11, the cleaning liquid supply device 141 supplies the cleaning liquid through the nozzle 142, but the present invention is not limited to this. The cleaning liquid supply device 141 may supply the cleaning liquid without using the nozzle 142 . FIG. 16 is a diagram showing a first modification of the cleaning section 140. As shown in FIG. As shown in FIG. 16 , in the first modification of the cleaning section 140 , the cleaning liquid supply device 141 is configured to supply the cleaning liquid above the substrate W through the gap 101 of the cleaning head 100 . In this example, the gap 101 is not used for suction of foreign matter by the suction portion 150 .

FIG. 17 is a diagram showing a second modification of the cleaning section 140. As shown in FIG. As shown in FIG. 17 , in a second modification of cleaning unit 140 , through hole 201 is formed in center brush 200 so as to vertically pass through base 210 and cleaning unit 220 . The cleaning liquid supply device 141 is configured to supply the cleaning liquid above the substrate W through the through holes 201 of the center brush 200 . In this example, the gap 101 can be used for suction of foreign matter by the suction portion 150 .

18A and 18B are diagrams showing a modification of the suction unit 150. FIG. As shown in FIG. 18, in a modified example of the suction portion 150, a through hole 201 is formed in the center brush 200 as in the example of FIG. The suction unit 150 sucks the atmosphere above the cleaning head 100 through the through holes 201 of the center brush 200 . In this example, similarly to the example of FIG. 16, the gap 101 of the cleaning head 100 can be used for supplying the cleaning liquid by the cleaning liquid supply device 141 .

In the present embodiment, the cleaning head 100 is configured by the center brush 200 for abrasive cleaning and the peripheral brush 300 for scrub cleaning, but the present invention is not limited to this. For example, the cleaning head 100 may be configured by a center brush 200 for scrub cleaning and an outer peripheral brush 300 for scrub cleaning. In this configuration, cleaning portion 220 of center brush 200 is made of a soft material such as PTFE or PVA sponge that does not contain abrasives. Such a cleaning head 100 can be used, for example, when cleaning a substrate W having a processed film such as a resist film formed on the surface to be cleaned.

(3) Effect In cleaning head 100 according to the present embodiment, peripheral brush 300 is arranged to surround center brush 200 . Since the base 210 of the center brush 200 and the base 310 of the outer peripheral brush 300 are separate bodies, the center brush 200 and the outer peripheral brush 300 are detachable from each other. Therefore, when only one of the cleaning part 220 of the center brush 200 and the cleaning part 320 of the outer peripheral brush 300 is worn out, it is not necessary to replace the entire cleaning head 100, and only the worn brush can be replaced.

Further, by configuring the cleaning head 100 by changing the combination of the center brush 200 and the peripheral brush 300 according to the shape of the substrate W to be cleaned or the type of cleaning, the substrate W can be properly cleaned using the cleaning head 100. can be washed. In this case, it is not necessary to prepare many kinds of cleaning heads with a fixed combination of the center brush and the peripheral brush. As a result, it is possible to appropriately clean the substrate W while suppressing an increase in cost.

In addition, the center brush 200 and the peripheral brush 300 are vertically movable independently of each other. Therefore, the substrate W can be cleaned appropriately by using an appropriate brush according to the portion of the substrate W to be cleaned. Furthermore, by making the timing of cleaning by the center brush 200 and the timing of cleaning by the peripheral brush 300 different, it is possible to prevent contaminants generated by one brush from adhering to the other brush. As a result, the cleaning head 100 can be made less likely to wear out.

Further, in the present embodiment, the center brush 200 and the outer peripheral brush 300 are integrally rotatable around an axis parallel to the vertical direction. Therefore, the center brush 200 and the outer peripheral brush 300 can be rotated with a simple configuration using the single rotating portion 110 . Further, the substrate W can be efficiently cleaned by rotating the center brush 200 and the outer peripheral brush 300 .

During cleaning of the substrate W, the cleaning liquid is discharged from the nozzle 142 above the cleaning head 100 . The discharged cleaning liquid is supplied to the entire upper surface of the cleaning section 320 through the notch 322 of the cleaning section 320 . Also, the cleaning liquid is supplied to the entire upper surface of the cleaning unit 220 through the grooves 221 of the cleaning unit 220 . Thereby, the substrate W can be cleaned more sufficiently.

[2] Second Embodiment (1) Configuration of Cleaning Head Regarding the cleaning head 100 and the substrate cleaning apparatus 1 according to the second embodiment, the cleaning head 100 and the substrate cleaning apparatus 1 according to the first embodiment Explain the points that differ from FIG. 19 is a bottom view of the cleaning head 100 according to the second embodiment of the invention. As shown in FIG. 19, in the present embodiment, base 210 of center brush 200 has a cylindrical shape, and flat portions 212 and 213 shown in FIG. 2 are not formed on base 210 . Therefore, the base 210 has a circular cross section in the horizontal plane.

Base 310 of peripheral brush 300 has a cylindrical shape. Therefore, an opening 311 having a circular shape in the horizontal plane and extending in the vertical direction is formed in the central portion of the base 310 . Therefore, in the present embodiment, flat portions 312 and 313 shown in FIG. 4 are not formed on the inner surface of base 310 within opening 311 . The cleaning head 100 is completed by arranging the center brush 200 in the openings 311 and 321 of the outer peripheral brush 300 .

As in the first embodiment, the center brush 200 and the outer peripheral brush 300 are not fixed to each other. Therefore, the center brush 200 and the peripheral brush 300 can move vertically independently of each other. On the other hand, since the outer peripheral surface of base 210 and the inner peripheral surface of base 310 have a circular shape in the horizontal plane, independent rotation of center brush 200 and outer peripheral brush 300 is not restricted. That is, unlike the first embodiment, the center brush 200 and the outer peripheral brush 300 can rotate independently of each other.

Note that the base 210 of the center brush 200 has a circular cross section in the horizontal plane, and the opening 311 of the base 310 of the outer peripheral brush 300 has a circular shape in the horizontal plane, but the present invention is not limited to this. As long as the center brush 200 and the outer peripheral brush 300 are allowed to rotate independently, the base 210 may have a non-circular cross section in the horizontal plane, and the opening 311 of the base 310 may have a non-circular cross section in the horizontal plane. It may have a circular cross-section.

Specifically, the diameter of the circular trajectory drawn by the outer periphery of the base 210 when the base 210 is rotated is larger than the minimum diameter of the opening 311 of the base 310 (for example, the short diameter in the case of an ellipse). Small is fine. Accordingly, the base 210 may be formed with flat portions similar to the flat portions 212 and 213 of FIG. Further, the base 310 may be formed with an opening 311 having an elliptical column shape, a square column shape, or the like.

(2) Schematic Configuration of Substrate Cleaning Apparatus FIG. 20 is a diagram showing a schematic configuration of a substrate cleaning apparatus 1 including the cleaning head 100 of FIG. As shown in FIG. 20, the substrate cleaning apparatus 1 according to the present embodiment further includes a rotating portion 160 provided to rotate the outer peripheral brush 300 . In this example, the rotating portion 160 includes a rotary drive device 161 , a shaft 162 , a pulley 163 and a power transmission member 164 .

The rotary drive device 161 is, for example, an electric motor and has a rotating shaft. Shaft 162 has a cylindrical shape and is connected to the lower surface of base 310 of peripheral brush 300 . A pulley 163 is attached to the outer peripheral surface of the shaft 162 . The power transmission member 164 is, for example, a belt, and is stretched over the pulley 163 and the rotary shaft of the rotary drive device 161 .

Rotational drive force is applied to shaft 162 through power transmission member 164 and pulley 163 by rotating the rotary shaft of rotary drive device 161 . Thereby, the outer peripheral brush 300 rotates. According to this configuration, the center brush 200 and the outer peripheral brush 300 can be rotated independently by the rotating portions 110 and 160, respectively.

Also, the elevation drive device 131 is connected to the rotation drive device 161 by a connecting member 132 . The elevation drive device 131 raises and lowers the rotation drive device 161 , the shaft 162 , the pulley 163 and the power transmission member 164 integrally by raising and lowering the connecting member 132 . According to this configuration, the center brush 200 and the outer peripheral brush 300 can be raised and lowered independently by the raising and lowering portions 120 and 130, respectively. Note that the elevation driving device 131 and the rotation driving device 161 may be implemented by a single rotation driving device. In this case, the connecting member 132 is not provided between the rotation drive device 161 and the elevation drive device 131 .

(3) Effects As in the first embodiment, when only one of the cleaning portion 220 of the center brush 200 and the cleaning portion 320 of the outer peripheral brush 300 is worn out, there is no need to replace the entire cleaning head 100. , only worn brushes can be replaced. In addition, since the cleaning head 100 can be configured by arbitrarily changing the combination of the center brush 200 and the peripheral brush 300, it is necessary to prepare various types of cleaning heads in which the combination of the center brush and the peripheral brush is fixed. There is no As a result, it is possible to appropriately clean the substrate W while suppressing an increase in cost.

Furthermore, in the present embodiment, the center brush 200 and the outer peripheral brush 300 are rotatable independently of each other around axes parallel to the vertical direction. Therefore, the center brush 200 and the outer peripheral brush 300 can be independently rotated by the rotating parts 110 and 160 according to the part of the substrate W to be cleaned or the type of cleaning. Thereby, the substrate W can be cleaned more efficiently.

[3] Third Embodiment (1) Structure of Substrate Cleaning Apparatus Details of the substrate cleaning apparatus 1 including the cleaning head 100 according to the first embodiment as the substrate cleaning apparatus 1 according to the third embodiment. configuration. A substrate cleaning apparatus 1 according to the present embodiment is provided, for example, in a substrate processing apparatus. The substrate cleaning apparatus 1 according to the present embodiment may include the cleaning head 100 according to the second embodiment instead of the cleaning head 100 according to the first embodiment.

FIG. 21 is a diagram showing the configuration of a substrate cleaning apparatus 1 according to the third embodiment. As shown in FIG. 21 , the substrate cleaning apparatus 1 includes a cleaning head 100 , a rotating section 110 , elevating sections 120 and 130 , a cleaning section 140 and a suction section 150 , as well as a head driving section 170 and a rotation holding device 400 . In FIG. 21, illustration of the rotating portion 110 and the lifting portions 120 and 130 is omitted. When the substrate cleaning apparatus 1 includes the cleaning head 100 according to the second embodiment, it further includes a rotating section 160 .

Rotation holding device 400 includes spin chuck 410 , multiple chuck pins 420 , switching unit 430 , guard device 440 and multiple delivery devices 450 . The spin chuck 410 is configured to horizontally hold and rotate the substrate W, and includes a spin motor 411 , a rotating shaft 412 , a spin plate 413 and a plate support member 414 .

The spin motor 411 is provided above the substrate cleaning apparatus 1 and supported by a support member (not shown). A rotating shaft 412 is provided to extend downward from the spin motor 411 . A plate support member 414 is attached to the lower end of the rotating shaft 412 . The spin plate 413 has a disc shape and is horizontally supported by a plate support member 414 . As the rotation shaft 412 is rotated by the spin motor 411, the spin plate 413 rotates around the vertical axis.

A plurality of chuck pins 420 are provided on the peripheral edge of the spin plate 413 at equal angular intervals with respect to the rotating shaft 412 . In this example, eight chuck pins 420 are provided on the periphery of the spin plate 413 at intervals of 45 degrees with respect to the rotating shaft 412 . Each chuck pin 420 includes a shaft portion 421 , a pin support portion 422 , a holding portion 423 and a magnet 424 .

The shaft portion 421 is provided so as to penetrate the spin plate 413 in the vertical direction. The pin support portion 422 is provided so as to extend horizontally from the lower end portion of the shaft portion 421 . The holding portion 423 is provided so as to protrude downward from the tip portion of the pin support portion 422 . A magnet 424 is attached to the upper end portion of the shaft portion 421 on the upper surface side of the spin plate 413 .

Each chuck pin 420 is rotatable around a vertical axis centering on a shaft portion 421. A closed state in which the holding portion 423 abuts against the outer peripheral edge of the substrate W, and a closed state in which the holding portion 423 extends from the outer peripheral edge of the substrate W. It is possible to switch between an open state and a separated state. In this example, each chuck pin 420 is closed when the north pole of the magnet 424 is inside, and each chuck pin 420 is open when the south pole of the magnet 424 is inside. Moreover, the holding portion 423 abuts on the bevel portion of the substrate W in the closed state.

The switching unit 430 includes magnet plates 431 and 432 and magnet elevators 433 and 434 . The magnet plates 431 and 432 are arranged above the spin plate 413 along the circumferential direction about the rotating shaft 412 . The magnet plates 431 and 432 have south poles on the outside and north poles on the inside. The magnet lifting devices 433 and 434 lift and lower the magnet plates 431 and 432, respectively. As a result, the magnet plates 431 and 432 are independently movable between an upper position higher than the magnet 424 of the chuck pin 420 and a lower position substantially equal in height to the magnet 424 of the chuck pin 420 .

Each chuck pin 420 is switched between an open state and a closed state by raising and lowering the magnet plates 431 and 432 . Details of operations of the magnet plates 431 and 432 and the chuck pin 420 will be described later.

Guard device 440 includes guard 441 and guard lifting device 442 . The guard 441 has a rotationally symmetrical shape with respect to the rotation axis 412 of the spin chuck 410 and is provided outside the spin chuck 410 . The guard lifting device 442 lifts and lowers the guard 441 . The guard 441 receives the cleaning liquid that scatters from the substrate W. As shown in FIG. The cleaning liquid received by the guard 441 is drained or recovered by a drainage device or recovery device (not shown).

A plurality ( three in this example) of transfer devices 450 are arranged outside the guard 441 at equal angular intervals around the rotating shaft 412 of the spin chuck 410 . Each transfer device 450 includes an up-and-down rotation drive section 451 , a rotation shaft 452 , an arm 453 and a holding pin 454 .

The rotating shaft 452 is provided so as to extend upward from the elevation rotation driving section 451 . Arm 453 is provided to extend horizontally from the upper end of rotating shaft 452 . The holding pin 454 is provided at the tip of the arm 453 so as to be able to hold the outer peripheral edge of the substrate W. As shown in FIG. The rotation shaft 452 is moved up and down and rotated by the up-and-down rotation drive unit 451 . This causes the holding pin 454 to move horizontally and vertically.

The head driving section 170 includes a head moving device 171 and a head holding member 172 and is arranged below the substrate cleaning apparatus 1 . Cleaning head 100 , rotating section 110 ( FIG. 11 ), lifting sections 120 and 130 ( FIG. 11 ), and nozzles 142 are attached to head holding member 172 . The head moving device 171 moves the cleaning head 100 along the back surface of the substrate W held by the spin chuck 410 of the rotary holding device 400 by moving the head holding member 172 . Thereby, the back surface of the substrate W is cleaned.

(2) Operation of Substrate Cleaning Apparatus FIGS. 22 to 25 are diagrams for explaining the holding operation of the substrate W by the spin chuck 410. FIG. First, as shown in FIG. 22, the guard 441 moves to a position lower than the chuck pin 420 . Then, the holding pins 454 of the plurality of delivery devices 450 (FIG. 21) pass above the guard 441 and move below the spin plate 413 . A substrate W is loaded onto the plurality of holding pins 454 .

At this time, the magnet plates 431 and 432 are in the upper position. In this case, the magnetic lines of force B of the magnet plates 431 and 432 are directed from the inside to the outside at the height of the magnet 424 of the chuck pin 420 . As a result, the south pole of the magnet 424 of each chuck pin 420 is attracted inward. Therefore, each chuck pin 420 is in an open state. Next, as shown in FIG. 23, the plurality of holding pins 454 are lifted while holding the substrate W. Then, as shown in FIG. As a result, the substrate W moves between the holding portions 423 of the chuck pins 420 .

Subsequently, as shown in FIG. 24, the magnet plates 431, 432 are moved to the lower position. In this case, the north pole of the magnet 424 of each chuck pin 420 is attracted inside, and each chuck pin 420 is closed. Thereby, the bevel portion of the substrate W is held by the holding portion 423 of each chuck pin 420 . After that, the plurality of holding pins 454 move outward from the guard 441 . Next, as shown in FIG. 25, the guard 441 moves to a height surrounding the substrate W held by the chuck pins 420 . In this state, the back surface of the substrate W is cleaned.

26 to 28 are diagrams for explaining the cleaning of the substrate W by the cleaning head 100. FIG. As shown in FIG. 26, the substrate W is rotated while being held by the rotation holding device 400 . Further, the head moving device 171 moves the head holding member 172 so that the cleaning head 100 overlaps substantially the center of the substrate W, as indicated by the dashed line. Here, the upper surface of the cleaning head 100 comes into contact with the center of the back surface of the substrate W by the operation of the rotating section 110, the lifting sections 120 and 130, the cleaning section 140, and the suction section 150 shown in FIG. As a result, the vicinity of the center of the back surface of the substrate W is cleaned.

Thereafter, while the cleaning head 100 is in contact with the back surface of the substrate W, the head moving device 171 moves the cleaning head 100 toward the peripheral edge of the substrate W as indicated by the thick arrow in FIG. , the brush head holding member 172 is gradually rotated. As a result, the entire back surface of the substrate W is cleaned, and the bevel portion of the substrate W is also cleaned.

As shown in FIG. 27, when cleaning the bevel portion of the substrate W, the magnet plate 431 is arranged at the lower position and the magnet plate 432 is arranged at the upper position. In this case, as shown in FIG. 28, each chuck pin 420 is closed in the outer region R1 of the magnet plate 431, and each chuck pin 420 is opened in the outer region R2 of the magnet plate 432. FIG.

According to this configuration, the holding portion 423 of each chuck pin 420 is maintained in contact with the outer peripheral edge of the substrate W when passing through the outer region R1 of the magnet plate 431, and the outer region R1 of the magnet plate 432 is maintained. It separates from the outer peripheral edge of the substrate W when passing through R2. Thereby, the cleaning head 100 can efficiently and sufficiently clean the bevel portion of the substrate W without interfering with the chuck pins 420 .

In this example, at least seven chuck pins 420 out of eight chuck pins 420 are positioned in the outer region R1 of the magnet plate 431 . In this case, the substrate W is held by at least seven chuck pins 420 . Therefore, the stability of the substrate W is ensured.

After the substrate W has been cleaned, the head moving device 171 moves the head holding member 172 so that the cleaning head 100 is positioned outside the substrate W. FIG. Also, the magnet plates 431 and 432 are arranged at the lower position, and the substrate W is held by all the chuck pins 420 . In this state, the spin chuck 410 rotates the substrate W at high speed. As a result, the cleaning liquid adhering to the substrate W is shaken off, and the substrate W is dried. After the substrate W has dried, the rotation of the substrate W is stopped.

[4] Fourth Embodiment (1) Structure of Substrate Cleaning Apparatus A substrate cleaning apparatus 1 according to a fourth embodiment will be described with respect to differences from the substrate cleaning apparatus 1 according to the third embodiment. FIG. 29 is a diagram showing the configuration of a substrate cleaning apparatus 1 according to the fourth embodiment. As shown in FIG. 29 , the substrate cleaning apparatus 1 includes a plurality (three in this example) of cleaning heads 100 , head driving units 170 and 180 and a rotation holding device 400 . In the following description, when distinguishing between the three cleaning heads 100, the three cleaning heads 100 are called cleaning heads 100A, 100B, and 100C, respectively.

The substrate cleaning apparatus 1 also includes a rotating section 110, elevating sections 120 and 130, a cleaning section 140 and a suction section 150 corresponding to each of the cleaning heads 100A to 100C. In FIG. 29, illustration of the rotating portion 110, the lifting portions 120 and 130, the cleaning portion 140, and the suction portion 150 is omitted. If one of the cleaning heads 100A to 100C is the cleaning head 100 according to the second embodiment, the substrate cleaning apparatus 1 further includes a rotating section 160 corresponding to the cleaning head 100. FIG.

Rotating device 400 according to the present embodiment has the same configuration as rotating device 400 of FIG. 21 according to the third embodiment except for the following points. The rotation holding device 400 further includes a spin chuck 460 located below the spin chuck 410 . Rotation holding device 400 also includes delivery device 470 instead of delivery device 450 . Furthermore, the spin chuck 410 in this embodiment does not include the magnet plate 432 and the magnet lifting device 434 of FIG.

The spin chuck 460 includes a spin motor 461 and a suction holder 463 . The spin motor 461 is provided at the bottom of the substrate cleaning apparatus 1, for example. A rotating shaft 462 is provided in the spin motor 461 so as to extend upward. A suction holding portion 463 is provided at the upper end portion of the rotating shaft 462 . The suction holding part 463 is configured to be able to suck the central portion of the back surface of the substrate W. As shown in FIG. The substrate W is held by the suction holding portion 463 sucking the central portion of the back surface of the substrate W. As shown in FIG. Further, the spin motor 461 rotates the rotary shaft 462 to rotate the substrate W held by the suction holding portion 463 .

The transfer device 470 includes an elevation drive unit 471 , a pin support member 472 and a plurality (three in this example) of elevation pins 473 , and is arranged in proximity to the spin chuck 460 . The elevation drive unit 471 supports the pin support member 472 so as to be vertically movable. A plurality of lifting pins 473 are attached to the pin support member 472 so as to surround the spin chuck 460 at regular intervals and extend in the vertical direction. The substrate W is supported in a horizontal posture by the upper ends of the plurality of lift pins 473 coming into contact with the area between the central portion of the back surface of the substrate W and the peripheral portion of the back surface.

By driving the lifting drive section 471, the upper ends of the plurality of lifting pins 473 move between the first height H1, the second height H2, and the third height H3. Here, as indicated by a chain double-dashed line in FIG. 29, the first height H1 is positioned below the upper end of the spin chuck 460 by a certain distance. A second height H2 is located between the upper end of spin chuck 460 and the lower end of each chuck pin 420 . The third height H3 is positioned slightly above the bottom end of each chuck pin 420 .

The head driving section 170 in this embodiment has the same configuration as the head driving section 170 in FIG. 21 in the third embodiment, and is arranged above the spin chuck 460 . The cleaning head 100A is attached to the head holding member 172 of the head drive unit 170 so that the surface of the substrate W held by the spin chuck 460 can be cleaned, with the upper surface of the cleaning head 100A facing downward. Further, the head holding member 172 is attached with a rotating portion 110 (FIG. 11), lifting portions 120 and 130 (FIG. 11), and a nozzle 142 (FIG. 11) corresponding to the cleaning head 100A.

The head driving section 180 includes a head moving device 181 and a head holding member 182 and is arranged below the substrate cleaning apparatus 1 . The head driving section 180 has the same configuration as the head driving section 170 except that the head moving device 181 can not only rotate the head holding member 182 but also move it vertically. The cleaning head 100B is attached to the head holding member 182 so that the back surface of the substrate W held by the spin chuck 410 can be cleaned, with the upper surface of the cleaning head 100B facing upward. Further, the head holding member 182 is attached with the rotating portion 110, the lifting portions 120 and 130, and the nozzles 142 corresponding to the cleaning head 100B.

Further, at the bottom of the substrate cleaning apparatus 1, a head mounting section 2 is provided so as to vertically overlap the outer peripheral edge and the outer peripheral end of the substrate W held by the spin chuck 460. As shown in FIG. The cleaning head 100C is placed on the head mounting portion 2 with the upper surface of the cleaning head 100C facing upward so that the bevel portion on the back side of the substrate W held by the spin chuck 460 can be cleaned. Further, on the head mounting section 2, a rotating section 110, lifting sections 120 and 130, and a nozzle 142 corresponding to the cleaning head 100C are mounted. As indicated by the dashed line in FIG. 29, the cleaning head 100C can be moved upward from the head mounting section 2 by the elevating sections 120 and 130. As shown in FIG.

(2) Operation of Substrate Cleaning Apparatus When the substrate W is carried into the substrate cleaning apparatus 1, the plurality of elevating pins 473 are moved upward, and the upper ends of the plurality of elevating pins 473 reach the second height H2. retained. In this state, the substrate W is placed on the plurality of lifting pins 473 . Next, the plurality of lifting pins 473 are moved downward, and the upper ends of the plurality of lifting pins 473 are held at the first height H1. As a result, the substrate W is passed from the plurality of lifting pins 473 onto the suction holding portion 463 . At this time, the center of the substrate W is positioned so as to coincide with the center of rotation of the suction holder 463 in the horizontal plane. After that, the central portion of the back surface of the substrate W is held by the spin chuck 460, and the substrate W is rotated.

Next, the head moving device 171 moves the head holding member 172 so that the cleaning head 100A overlaps substantially the center of the substrate W. As shown in FIG. Here, the upper surface of the cleaning head 100A contacts the vicinity of the center of the surface of the substrate W by the operation of the rotating section 110, the lifting sections 120 and 130, the cleaning section 140, and the suction section 150 corresponding to the cleaning head 100A. As a result, the vicinity of the center of the surface of the substrate W is cleaned.

Thereafter, while the cleaning head 100A is in contact with the surface of the substrate W, the head moving device 171 gradually rotates the brush head holding member 172 so that the cleaning head 100A faces the peripheral edge of the substrate W. FIG. As a result, the entire surface of the substrate W is cleaned, and the bevel portion on the front surface side of the substrate W is cleaned.

In the cleaning of the surface of the substrate W described above, when a treatment film such as a resist film is formed on the surface of the substrate W, the cleaning head 100A includes a center brush 200 for scrub cleaning and an outer peripheral brush 200 for scrub cleaning. and a brush 300 . On the other hand, when the substrate W has no treated film formed on its surface, that is, when the substrate W is a bare substrate, the cleaning head 100A uses the center brush 200 for polishing cleaning and the outer peripheral brush 300 for scrub cleaning. may be configured.

In parallel with the cleaning of the surface of the substrate W described above, the rotating portion 110, the elevating portions 120 and 130, the cleaning portion 140 and the suction portion 150 corresponding to the cleaning head 100C operate so that the upper surface of the cleaning head 100C is cleaned by the substrate W. contact the bevel on the back side of the As a result, the bevel portion on the back side of the substrate W is cleaned.

After cleaning the substrate W by the cleaning heads 100A and 100C, the head holding member 172 and the cleaning head 100C are returned to their initial positions, and the spin chuck 460 rotates the substrate W at high speed. As a result, the cleaning liquid adhering to the substrate W is shaken off, and the substrate W is dried. After the substrate W is dried, the rotation of the substrate W is stopped and the adsorption of the substrate W by the spin chuck 460 is stopped.

Next, by moving the plurality of lifting pins 473 upward, the substrate W is transferred from the suction holding portion 463 of the spin chuck 460 onto the plurality of lifting pins 473, and then the upper ends of the plurality of lifting pins 473 It is held at a third height H3. At this time, the substrate W is positioned between the holding portions 423 of the chuck pins 420 of the spin chuck 410 .

Subsequently, the magnet plate 431 of the switching portion 430 moves to the lower position. In this case, the north poles of the magnets 424 of the plurality of chuck pins 420 are attracted inside. As a result, each chuck pin 420 is closed, and each holding portion 423 abuts on the outer peripheral edge of the substrate W. As shown in FIG. As a result, the outer peripheral edge of the substrate W is held by the holding portions 423 of the plurality of chuck pins 420 . After that, the plurality of lifting pins 473 are moved downward so that the upper ends of the plurality of lifting pins 473 are held at the first height H1. Also, the guard 441 moves upward to surround the substrate W held by the spin chuck 410 . In this state, the substrate W is rotated.

Next, the head moving device 181 raises the head holding member 182 and moves the head holding member 182 so that the cleaning head 100B overlaps substantially the center of the substrate W. As shown in FIG. Here, the upper surface of the cleaning head 100B contacts the vicinity of the center of the back surface of the substrate W by operating the rotating section 110, the lifting sections 120 and 130, the cleaning section 140, and the suction section 150 corresponding to the cleaning head 100B. Thereafter, while the cleaning head 100B is in contact with the back surface of the substrate W, the head moving device 181 gradually rotates the brush head holding member 182 so that the cleaning head 100B moves toward the periphery of the substrate W. FIG. As a result, the entire back surface of the substrate W is cleaned.

After cleaning the substrate W by the cleaning head 100B, the head holding member 182 is returned to the initial position, and the spin chuck 410 rotates the substrate W at high speed. As a result, the cleaning liquid adhering to the substrate W is shaken off, and the substrate W is dried. After the substrate W has dried, the rotation of the substrate W is stopped.

The cleaning head 100B is not used for cleaning the bevel portion on the back side of the substrate W. As shown in FIG. Therefore, the upper surface of the outer peripheral brush 300 of the cleaning head 100B does not have to be tapered. Further, when only abrasive cleaning is performed, the cleaning head 100B may be composed of a center brush 200 for abrasive cleaning and an outer peripheral brush 300 for abrasive cleaning. Alternatively, the cleaning head 100B may be composed of a center brush 200 for scrub cleaning and an outer peripheral brush 300 for polishing cleaning.

As described above, the spin chuck 410 does not include the magnet plate 432 and the magnet lifting device 434, so all the chuck pins 420 are closed while the substrate W is being cleaned. Even in this case, since the cleaning head 100B is not used for cleaning the bevel portion on the back side of the substrate W, the cleaning head 100B efficiently and sufficiently cleans the entire back surface of the substrate W without interfering with the chuck pins 420. be able to.

On the other hand, the spin chuck 410 may include a magnet plate 432 and a magnet elevator 434 as in the third embodiment. In this case, the cleaning head 100B can further clean the bevel portion on the back side of the substrate W without interfering with the chuck pins 420 . Therefore, it is not necessary to clean the bevel portion on the back surface side of the substrate W while the substrate W is held by the spin chuck 460 . Therefore, the substrate cleaning apparatus 1 does not need to include the cleaning head 100C and the rotating section 110, the lifting sections 120 and 130, the cleaning section 140 and the suction section 150 corresponding thereto.

[5] Other Embodiments (1) In the above embodiments, the substrate W is rotated during cleaning of the substrate W, but the present invention is not limited to this. The substrate W does not have to be rotated while the substrate W is being cleaned.

(2) In the above embodiment, the cleaning head 100 is moved vertically with respect to the substrate W by the elevating units 120 and 130, but the present invention is not limited to this. The substrate W may be vertically moved with respect to the cleaning head 100 by a substrate holder such as the spin chucks 410 and 460 . In this case, the cleaning head 100 does not have to be moved vertically.

(3) In the above embodiment, the bevel portion of the substrate W is cleaned after the vicinity of the center of the surface to be cleaned of the substrate W is cleaned by the cleaning head 100, but the present invention is not limited to this. For example, only the vicinity of the center of the surface to be cleaned of the substrate W may be cleaned by the cleaning head 100, or only the bevel portion of the substrate W may be cleaned. Further, when the substrate is not rotated, the vicinity of the center of the surface to be cleaned of the substrate W may be cleaned after the bevel portion of the substrate W is cleaned by the cleaning head 100 . The surface to be cleaned may be the back surface of the substrate W, the front surface, or both the back surface and the front surface.

In the fourth embodiment, when the front surface of the substrate W is cleaned and the back surface of the substrate W is not cleaned, the substrate cleaning apparatus 1 may be provided with the cleaning heads 100A and 100C. , the cleaning head 100B and the corresponding rotary section 110, lifting sections 120 and 130, cleaning section 140 and suction section 150 may not be provided. Further, spin chuck 410 , chuck pins 420 and switching unit 430 used for cleaning the back surface of substrate W may not be included in rotation holding device 400 .

[6] Correspondence between each constituent element of the claims and each part of the embodiment In the above-described embodiment, the substrate W is an example of the substrate, the cleaning head 100 is an example of the cleaning head, and the base 210, 310 are examples of first and second bases, respectively. Cleaning units 220 and 320 are examples of first and second cleaning units, respectively, center brush 200 is an example of a center brush, outer peripheral brush 300 is an example of an outer peripheral brush, and opening 311 is an example of an opening. is.

The groove portion 221 is an example of a groove portion, the tapered surface 323 and the flat surface 324 are examples of a second cleaning surface, the flat surface 324 is an example of a flat surface, the tapered surface 323 is an example of a tapered surface, and the gap 101 is an example of the gap. The spin chucks 410 and 460 are examples of the substrate holding section, the elevating sections 120 and 130 are examples of the first and second driving devices, respectively, and the substrate cleaning apparatus 1 is an example of the substrate cleaning apparatus.

DESCRIPTION OF SYMBOLS 1... Substrate cleaning apparatus 2... Head mounting part 100, 100A to 100C... Cleaning head 101... Gap 110, 160... Rotating part 111, 161... Rotation driving device 112, 162... Shaft 120, 130 Lifting unit 121, 131 Lifting drive device 122, 132 Connecting member 140 Washing unit 141 Washing liquid supply device 142 Nozzle 150 Suction unit 163 Pulley 164 Power transmission member 170 , 180... Head driving unit 171, 181... Head moving device 172, 182... Head holding member 173... Central shaft 200... Center brush 201... Through hole 210, 310... Base 211... Hole, 212, 213, 312, 313 Flat portion 220, 320 Washing portion 300 Peripheral brush 311, 321 Opening 322 Notch 323 Tapered surface 324 Flat surface 400 Rotation holding device , 410, 460... Spin chuck, 411, 461... Spin motor, 412, 452, 462... Rotary shaft, 413, 463... Spin plate, 414... Plate support member, 420... Chuck pin, 421... Shaft part, 422... Pin Supporting portion 423 Holding portion 424 Magnet 430 Switching portion 431, 432 Magnet plate 433, 434 Magnet lifting device 440 Guard device 441 Guard 442 Guard lifting device 450, 470 Delivery device 451 Elevation rotary drive unit 453 Arm 454 Holding pin 471 Elevation drive unit 472 Pin support member 473 Elevation pin H1 First height H2 Second height Height, H3... Third height, R1, R2... Outer region, W... Substrate

Claims (14)

A cleaning head used for cleaning a substrate,
a center brush including a first base and a first cleaning unit attached to the first base;
an outer peripheral brush including a second base and a second cleaning unit attached to the second base and disposed so as to surround the center brush;
The first base is connected to a first elevating unit that elevates the center brush,
The second base is connected to a second elevating unit that elevates the peripheral brush,
The center brush and the outer peripheral brush are configured to be movable in one direction independently of each other by the first elevating section and the second elevating section ,
A cleaning head , wherein one of the center brush and the peripheral brush is detachable from the other of the center brush and the peripheral brush by being moved in the one direction . 2. The cleaning head according to claim 1 , wherein said center brush and said peripheral brush are integrally rotatable around an axis parallel to said one direction. A cleaning head used for cleaning a substrate,
a center brush including a first base and a first cleaning unit attached to the first base;
an outer peripheral brush including a second base and a second cleaning unit attached to the second base and disposed so as to surround the center brush;
The center brush and the outer peripheral brush are configured to be detachable from each other,
The center brush and the outer peripheral brush are configured to be movable in one direction independently of each other,
The center brush and the outer peripheral brush are configured to be integrally rotatable around an axis parallel to the one direction,
The first base has a non-circular cross section orthogonal to the one direction,
The second base has an opening in which the center brush is accommodated,
The cleaning head , wherein the opening has a non-circular cross-section corresponding to a non-circular cross-section of the center brush. 2. The cleaning head according to claim 1 , wherein said center brush and said peripheral brush are rotatable independently of each other around an axis parallel to said one direction. The cleaning head according to any one of claims 1 to 4 , wherein the first cleaning section is made of a material containing an abrasive. the first cleaning portion of the center brush has a first cleaning surface capable of contacting the substrate;
The cleaning head according to any one of claims 1 to 5 , wherein grooves are formed in the first cleaning surface. The cleaning head according to any one of claims 1 to 6 , wherein the second cleaning section is made of a soft material. the second cleaning portion of the outer peripheral brush has a second cleaning surface capable of contacting the substrate;
8. The cleaning head of claim 7 , wherein said second cleaning surface includes a flat surface and a tapered surface angled with respect to said flat surface. a gap between the center brush and the outer peripheral brush so as to communicate between the first base and the second base and between the first cleaning section and the second cleaning section; A cleaning head according to any one of the preceding claims, wherein a is formed. A center brush provided on an outer peripheral brush and used for cleaning a substrate,
a first base;
a first cleaning unit attached to the first base,
The first base is connected to a first elevating unit that elevates the center brush,
The peripheral brush is connected to a second elevating section that elevates the peripheral brush,
The center brush and the outer peripheral brush are configured to be movable in one direction independently of each other by the first elevating section and the second elevating section,
A center brush arranged so as to be surrounded by the outer peripheral brush and detachable from the outer peripheral brush by being moved in the one direction . A peripheral brush provided on a center brush and used for cleaning a substrate,
a second base;
a second cleaning unit attached to the second base,
The center brush is connected to a first elevating unit that elevates the center brush,
The second base is connected to a second elevating unit that elevates the peripheral brush,
The center brush and the outer peripheral brush are configured to be movable in one direction independently of each other by the first elevating section and the second elevating section,
A peripheral brush arranged to surround the center brush and configured to be detachable from the center brush by being moved in the one direction . a substrate holder that holds the substrate;
A substrate cleaning apparatus comprising the cleaning head according to any one of claims 1 to 9 , which is provided to clean the substrate held by the substrate holding part. a first driving device provided so as to be able to move the center brush of the cleaning head toward the substrate;
13. The substrate cleaning apparatus according to claim 12 , further comprising a second driving device capable of moving said peripheral brush of said cleaning head toward the substrate. holding the substrate by the substrate holding part;
and cleaning the substrate held by the substrate holding part with the cleaning head according to any one of claims 1 to 9 .

Images