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JP7203651B2 - connection terminal, electronic device - Google Patents
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JP7203651B2 - connection terminal, electronic device - Google Patents

connection terminal, electronic device Download PDF

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JP7203651B2
JP7203651B2 JP2019052172A JP2019052172A JP7203651B2 JP 7203651 B2 JP7203651 B2 JP 7203651B2 JP 2019052172 A JP2019052172 A JP 2019052172A JP 2019052172 A JP2019052172 A JP 2019052172A JP 7203651 B2 JP7203651 B2 JP 7203651B2
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diameter
connection terminal
connection
mounting type
insertion mounting
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JP2020155566A (en
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健太 後藤
哲 笹木
聖和 坂口
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日本電産モビリティ株式会社
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

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  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

本発明は、所定の間隔で対向する回路基板同士を電気的に接続する接続端子と、当該接続端子および回路基板を備えた電子装置に関する。 The present invention relates to a connection terminal for electrically connecting circuit boards facing each other at a predetermined interval, and an electronic device including the connection terminal and the circuit board.

複数の回路基板を備えた電子装置では、回路基板同士を所定の間隔で対向させた状態で電気的に接続するために、接続端子が用いられている。接続端子の各端部には、回路基板に対してはんだにより電気的に接続される接続部が設けられている。その接続部には、挿入実装型接続部と表面実装型接続部とがある。 2. Description of the Related Art In an electronic device having a plurality of circuit boards, connection terminals are used to electrically connect the circuit boards facing each other at a predetermined interval. Each end of the connection terminal is provided with a connection portion that is electrically connected to the circuit board by soldering. The connection portion includes an insertion mount type connection portion and a surface mount type connection portion.

たとえば特許文献1では、接続端子の上端部に挿入実装型接続部が設けられ、下端部に表面実装型接続部が設けられている。また、特許文献2および特許文献3では、接続端子の上下の各端部に、挿入実装型接続部が設けられている。 For example, in Japanese Unexamined Patent Application Publication No. 2002-100001, an insertion mounting type connecting portion is provided at the upper end portion of the connecting terminal, and a surface mounting type connecting portion is provided at the lower end portion. Further, in Patent Documents 2 and 3, insertion mounting type connection portions are provided at the upper and lower ends of the connection terminals.

表面実装型接続部は、回路基板の表面に設けられたパッド上に載置された状態で、該パッドに対してはんだにより接続される。挿入実装型接続部は、回路基板に設けられた貫通孔に挿入された状態で、該貫通孔を囲むように回路基板に設けられたランドに対してはんだにより接続される。 The surface-mounted connection part is mounted on pads provided on the surface of the circuit board and connected to the pads by soldering. The insertion mounting type connection part is connected by soldering to a land provided on the circuit board so as to surround the through hole while being inserted into the through hole provided on the circuit board.

回路基板に設けられた小径の貫通孔に挿入し易くするのため、挿入実装型接続部が、接続端子の一方の端から所定長さに渡って、他の部分より小さい径で形成されることがある(特許文献1)。 In order to facilitate insertion into a small-diameter through-hole provided in a circuit board, the insertion mounting type connecting portion is formed over a predetermined length from one end of the connecting terminal with a smaller diameter than the other portions. There is (Patent Document 1).

温度変化や振動などの外力により、接続端子と回路基板との接続部分に応力がかかることがある。その応力を吸収するため、接続端子の中央部に湾曲部が設けられることがある(特許文献1~3)。 Due to external forces such as temperature changes and vibrations, stress may be applied to the connection portions between the connection terminals and the circuit board. In order to absorb the stress, a curved portion is sometimes provided in the central portion of the connection terminal (Patent Documents 1 to 3).

特開2007-242473号公報JP-A-2007-242473 実開昭52-142646号公報Japanese Utility Model Laid-Open No. 52-142646 特開平8-236178号公報JP-A-8-236178

図6は、従来の接続端子50と回路基板60との接続部分の断面図である。回路基板60には、貫通孔であるスルーホール61が設けられている。また、回路基板60の表面や裏面のスルーホール61の周囲には、ランド62が設けられている。接続端子50の一方の端から所定長さに渡って、他の部分より小さい径で挿入実装型接続部51が形成されている。挿入実装型接続部51は、回路基板60のスルーホール61に挿入された状態で、スルーホール61やランド62に対してはんだ70により接続されている。挿入実装型接続部51から回路基板60の表面や裏面のランド62の外周縁にかけては、はんだ70のフィレットが形成されている。 FIG. 6 is a cross-sectional view of a connection portion between a conventional connection terminal 50 and a circuit board 60. As shown in FIG. The circuit board 60 is provided with a through hole 61 that is a through hole. Lands 62 are provided around the through holes 61 on the front and back surfaces of the circuit board 60 . An insertion mounting type connection portion 51 is formed over a predetermined length from one end of the connection terminal 50 and has a smaller diameter than the other portions. The insertion mounting type connecting portion 51 is connected to the through hole 61 and the land 62 by solder 70 while being inserted into the through hole 61 of the circuit board 60 . A fillet of solder 70 is formed from the insertion mounting type connection portion 51 to the outer peripheral edge of the land 62 on the front surface and the rear surface of the circuit board 60 .

回路基板60のスルーホール61などに接続端子50の挿入実装型接続部51を接続する作業は、自動機または手作業で行われる。その際、はんだ70の量がばらつくことがある。そして、はんだ70の量が多くなった場合、回路基板60からのはんだ70のフィレットの高さが高くなって、接続端子50の挿入実装型接続部51より径が大きい部分52と回路基板60との間に、急峻に起伏するV字状のくびれ80が生じてしまう。この状態で、温度変化や振動などの外力が回路基板60にかかると、該外力によって生じるせん断応力τが、くびれ80の最も径が小さい箇所に相当する接続端子50の一断面Xに集中して、該一断面Xで接続端子50が破断するおそれがある。 The operation of connecting the insertion mounting type connection portion 51 of the connection terminal 50 to the through hole 61 of the circuit board 60 or the like is performed by an automatic machine or manually. At that time, the amount of solder 70 may vary. When the amount of solder 70 increases, the fillet height of the solder 70 from the circuit board 60 increases, and the portion 52 of the connection terminal 50 having a larger diameter than the insertion mounting type connection portion 51 and the circuit board 60 are separated from each other. A sharply undulating V-shaped constriction 80 is formed between them. In this state, when an external force such as a temperature change or vibration is applied to the circuit board 60, the shear stress τ generated by the external force is concentrated on one section X of the connection terminal 50 corresponding to the portion where the constriction 80 has the smallest diameter. , the connection terminal 50 may be broken at the cross section X.

本発明は、外力による接続端子の破断を防止することを課題とする。 An object of the present invention is to prevent a connection terminal from being broken by an external force.

本発明の接続端子は、所定の間隔で対向する回路基板同士を電気的に接続する端子であって、挿入実装型接続部と大径部と小径連続部とを備えている。挿入実装型接続部は、当該接続端子の端部から所定長さに渡って径が小さく形成され、回路基板に設けられた貫通孔に挿入された状態で、回路基板に対してはんだにより接続される。大径部は、挿入実装型接続部より径が大きくなっている。小径連続部は、挿入実装型接続部と大径部との間に、挿入実装型接続部と同一径で、当該挿入実装型接続部と連続するように形成されている。挿入実装型接続部は、回路基板の貫通孔に埋没する埋没部分と、貫通孔に対して大径部と反対側に突出する先端側突出部分と、貫通孔に対して大径部側に突出する根元側突出部分とから構成される。小径連続部は、根元側突出部分から所定長連続している。挿入実装型接続部は、回路基板表面の貫通孔の周囲に設けられたランドに対してはんだにより接続される。貫通孔からの挿入実装型接続部の根元側突出部分の突出長さと、小径連続部の長さとは、それぞれ挿入実装型接続部からランドの外周縁までの径以上である。 A connection terminal of the present invention is a terminal for electrically connecting circuit boards facing each other at a predetermined interval, and includes an insertion mounting type connection portion, a large diameter portion, and a small diameter continuous portion . The insertion mounting type connection part is formed with a small diameter over a predetermined length from the end of the connection terminal, and is connected to the circuit board by soldering while being inserted into a through hole provided in the circuit board. be. The large diameter portion has a larger diameter than the insertion mount connection portion. The small-diameter continuous portion is formed between the insertion mounting type connecting portion and the large diameter portion so as to have the same diameter as the insertion mounting type connecting portion and to be continuous with the insertion mounting type connecting portion. The insertion mounting type connection part has a buried part buried in the through hole of the circuit board, a front end side projecting part projecting on the opposite side of the through hole from the large diameter part, and a projecting part on the large diameter side of the through hole. It is composed of a root side protruding part that The small-diameter continuous portion continues for a predetermined length from the root-side projecting portion. The insertion mounting type connecting portion is connected by soldering to a land provided around the through-hole on the surface of the circuit board. The protruding length of the base-side protruding portion of the insertion mounting type connection portion from the through hole and the length of the small diameter continuous portion are each equal to or greater than the diameter from the insertion mounting type connection portion to the outer peripheral edge of the land.

本発明の電子装置は、上記接続端子と、所定の間隔で対向して、上記接続端子により電気的に接続される複数の回路基板とを備える。 An electronic device of the present invention includes the connection terminal and a plurality of circuit boards facing each other at a predetermined interval and electrically connected by the connection terminal.

上記の構成によると、接続端子の大径部と挿入実装型接続部との間に、挿入実装型接続部と同一径の小径連続部が、挿入実装型接続部と連続するように形成されている。これにより、回路基板の貫通孔に挿入された挿入実装型接続部におけるはんだの量が多くても、このはんだは、挿入実装型接続部および小径連続部の範囲内にとどまって、大径部に到達しなくなる。その結果、接続端子の大径部と回路基板との間に、急峻に起伏するV字状のくびれが生じなくなる。このため、温度変化や振動などの外力が電子装置の回路基板にかかっても、これらの外力によって生じるせん断応力が、大径部とはんだとの間の接続端子の一断面に集中しなくなる。そして、当該応力が接続端子の小径連続部で分散されるので、外力による接続端子の破断を防止することができる。 According to the above configuration, the small-diameter continuous portion having the same diameter as the insertion mounting type connecting portion is formed between the large diameter portion of the connection terminal and the insertion mounting type connecting portion so as to be continuous with the insertion mounting type connecting portion. there is As a result, even if a large amount of solder is applied to the insertion mounting connection inserted into the through-hole of the circuit board, the solder remains within the range of the insertion mounting connection and the small-diameter continuous portion, and is not applied to the large-diameter portion. will not reach. As a result, sharply undulating V-shaped constrictions do not occur between the large-diameter portions of the connection terminals and the circuit board. Therefore, even if external forces such as temperature changes and vibrations are applied to the circuit board of the electronic device, the shear stress caused by these external forces will not concentrate on one section of the connection terminal between the large diameter portion and the solder. Since the stress is dispersed in the small-diameter continuous portion of the connection terminal, it is possible to prevent the connection terminal from breaking due to an external force.

また、本発明において、接続端子の大径部から小径連続部にかけて、径が徐々に小さくなるように形成されたテーパー部をさらに備えていてもよい。小径連続部の周面に対するテーパー部の角度は、135°以上であることが好ましい。 Moreover, in the present invention, a tapered portion formed such that the diameter gradually decreases from the large-diameter portion to the small-diameter continuous portion of the connection terminal may be further provided. The angle of the tapered portion with respect to the peripheral surface of the small-diameter continuous portion is preferably 135° or more.

また、本発明において、接続端子の大径部は、S字状に湾曲する湾曲部を有していてもよい。 Further, in the present invention, the large-diameter portion of the connection terminal may have a curved portion curved in an S-shape.

また、本発明において、挿入実装型接続部は、接続端子の上端部に形成され、小径連続部は、挿入実装型接続部の下方に連続するように形成されていてもよい。 Further, in the present invention, the insertion mounting type connection portion may be formed at the upper end portion of the connection terminal, and the small-diameter continuous portion may be formed so as to continue below the insertion mounting type connection portion.

さらに、本発明において接続端子の一方の端部に、一方の回路基板の表面に設けられたランドに対してはんだにより接続される挿入実装型接続部が形成され、接続端子の他方の端部に、他方の回路基板の表面に設けられたパッドに対してはんだにより接続される表面実装型接続部が形成されていてもよい。 Furthermore, in the present invention, an insertion mounting type connecting portion connected by soldering to a land provided on the surface of one of the circuit boards is formed at one end of the connecting terminal, and the other end of the connecting terminal Alternatively, a surface-mounted connection portion may be formed to be connected by soldering to a pad provided on the surface of the other circuit board.

本発明によれば、外力による接続端子の破断を防止することができる。 According to the present invention, it is possible to prevent breakage of the connection terminal due to external force.

本発明の実施形態による電子装置の要部の斜視図である。1 is a perspective view of essential parts of an electronic device according to an embodiment of the present invention; FIG. 図1の接続端子の斜視図である。2 is a perspective view of the connection terminal of FIG. 1; FIG. 図1の接続端子と各回路基板の側面図である。2 is a side view of connection terminals and circuit boards in FIG. 1; FIG. 図1の接続端子と一方の回路基板との接続状態の一例を示した断面図である。2 is a cross-sectional view showing an example of a connection state between the connection terminal of FIG. 1 and one circuit board; FIG. 図1の接続端子と一方の回路基板との接続状態の他例を示した断面図である。FIG. 4 is a cross-sectional view showing another example of a connection state between the connection terminal of FIG. 1 and one circuit board; 従来の接続端子と回路基板との接続部分の断面図である。FIG. 3 is a cross-sectional view of a connection portion between a conventional connection terminal and a circuit board;

以下、本発明の実施形態につき、図面を参照しながら説明する。各図において、同一の部分または対応する部分には、同一符号を付してある。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, the same reference numerals are given to the same or corresponding parts.

図1は、実施形態の電子装置10の要部の斜視図である。 FIG. 1 is a perspective view of a main part of an electronic device 10 according to an embodiment.

電子装置10は、たとえば車載用のDC-DCコンバータから成る。電子装置10は、車両のエンジンなどの走行駆動源の近傍に設置される。電子装置10には、回路基板1、2と接続端子3などが備わっている。各回路基板1、2は、プリント基板から成る。各回路基板1、2には、DC-DCコンバータを構成する電子部品が実装され、電気回路が形成されている(図示省略)。 The electronic device 10 is composed of, for example, a vehicle-mounted DC-DC converter. The electronic device 10 is installed near a travel drive source such as a vehicle engine. The electronic device 10 includes circuit boards 1 and 2, connection terminals 3, and the like. Each circuit board 1, 2 consists of a printed circuit board. Electronic parts constituting a DC-DC converter are mounted on each of the circuit boards 1 and 2 to form an electric circuit (not shown).

回路基板1の複数の角部1kと、回路基板2の複数の角部2kとの間には、スペーサ4が設けられている。回路基板1は、各スペーサ4の上面にねじ5により固定されている。回路基板2は、各スペーサ4の下面にねじ(図示省略)により固定されている。これにより、回路基板1と回路基板2は、所定の間隔で対向するように配置されている。 Spacers 4 are provided between the corners 1 k of the circuit board 1 and the corners 2 k of the circuit board 2 . The circuit board 1 is fixed to the upper surface of each spacer 4 with screws 5 . The circuit board 2 is fixed to the lower surface of each spacer 4 with screws (not shown). Thereby, the circuit board 1 and the circuit board 2 are arranged so as to face each other at a predetermined interval.

接続端子3は、導体から成る。接続端子3は、回路基板1、2同士を電気的に接続している。図1では、回路基板1、2が2つの接続端子3により電気的に接続されているが、接続端子3の数は、1つでもよいし、3つ以上でもよい。 The connection terminal 3 is made of a conductor. The connection terminals 3 electrically connect the circuit boards 1 and 2 together. Although the circuit boards 1 and 2 are electrically connected by two connection terminals 3 in FIG. 1, the number of connection terminals 3 may be one or three or more.

図2は、接続端子3の斜視図である。図3は、接続端子3と各回路基板1、2の側面図である。図4は、接続端子3と一方の回路基板1との接続状態の一例を示した断面図である。図5は、接続端子3と一方の回路基板1との接続状態の他例を示した断面図である。 FIG. 2 is a perspective view of the connection terminal 3. FIG. FIG. 3 is a side view of the connection terminals 3 and the circuit boards 1 and 2. As shown in FIG. FIG. 4 is a cross-sectional view showing an example of a connection state between the connection terminal 3 and one circuit board 1. As shown in FIG. FIG. 5 is a cross-sectional view showing another example of the connection state between the connection terminal 3 and one circuit board 1. As shown in FIG.

図2に示すように、接続端子3は、導電性を有する板金を打ち抜いた後、折り曲げ加工することにより形成されている。 As shown in FIG. 2, the connection terminal 3 is formed by punching out a conductive sheet metal and then bending the punched sheet.

接続端子3の上端部には、挿入実装型接続部3aが形成されている。詳しくは、挿入実装型接続部3aは、接続端子3の上端から所定長さに渡って形成されている。 An insertion mounting type connection portion 3a is formed at the upper end portion of the connection terminal 3. As shown in FIG. Specifically, the insertion mounting type connection portion 3 a is formed over a predetermined length from the upper end of the connection terminal 3 .

接続端子3の中央から下端にわたる大径部3dの径より、挿入実装型接続部3aの径は小さくなっている。詳しくは、接続端子3の板厚は、接続端子3の全長に渡って同一であるため、図3~図5に示すように、挿入実装型接続部3aの幅が、大径部3dの幅より小さくなっている。 The diameter of the insertion mounting type connecting portion 3 a is smaller than the diameter of the large diameter portion 3 d extending from the center to the lower end of the connecting terminal 3 . Specifically, since the plate thickness of the connection terminal 3 is the same over the entire length of the connection terminal 3, as shown in FIGS. is getting smaller.

接続端子3の大径部3dと挿入実装型接続部3aとの間には、小径連続部3bおよびテーパー部3cが形成されている。小径連続部3bは、挿入実装型接続部3aと同一径(同一幅)で、当該接続部3aと連続して形成されている。テーパー部3cは、大径部3dから小径連続部3bにかけて、径(幅)が徐々に小さくなるように形成されている。 A small-diameter continuous portion 3b and a tapered portion 3c are formed between the large-diameter portion 3d of the connection terminal 3 and the insertion mounting type connection portion 3a. The small-diameter continuous portion 3b has the same diameter (same width) as that of the insertion mounting type connection portion 3a, and is formed continuously with the connection portion 3a. The tapered portion 3c is formed such that the diameter (width) gradually decreases from the large diameter portion 3d to the small diameter continuous portion 3b.

図2に示すように、接続端子3の大径部3dには、S字状に湾曲するように形成された湾曲部3eが設けられている。接続端子3の下端部には、表面実装型接続部3fが形成されている。詳しくは、接続端子3の下端から所定長さに渡る部分を水平に折り曲げることにより、表面実装型接続部3fは形成されている。表面実装型接続部3fは、湾曲部3eの一部を構成している。 As shown in FIG. 2, the large-diameter portion 3d of the connection terminal 3 is provided with a curved portion 3e that is curved in an S shape. A surface mount type connection portion 3f is formed at the lower end portion of the connection terminal 3. As shown in FIG. Specifically, the surface-mounted connection portion 3f is formed by horizontally bending a portion extending from the lower end of the connection terminal 3 to a predetermined length. The surface-mounted connection portion 3f constitutes a part of the curved portion 3e.

表面実装型接続部3fは、図1および図3に示すように、回路基板2の上面(表面)に設けられたパッド2p上に載置された状態で、パッド2pに対してはんだ6により接続されている。この表面実装型接続部3fの載置と接続の各工程は、自動機または手作業で行われる。パッド2pは、回路基板2に形成された電気回路に対して電気的に接続されている(図示省略)。 As shown in FIGS. 1 and 3, the surface-mounted connection portion 3f is placed on the pad 2p provided on the upper surface (front surface) of the circuit board 2, and is connected to the pad 2p with solder 6. It is Each step of placing and connecting the surface-mounted connection portion 3f is performed by an automatic machine or manually. The pads 2p are electrically connected to an electric circuit formed on the circuit board 2 (not shown).

表面実装型接続部3fとはんだ6との接合面積を増大させるため、表面実装型接続部3fには、図2に示すように、貫通孔3gが形成されている。はんだ6はこの貫通孔3gに入り込む。 In order to increase the bonding area between the surface mount type connection portion 3f and the solder 6, a through hole 3g is formed in the surface mount type connection portion 3f as shown in FIG. The solder 6 enters this through hole 3g.

図4および図5に示すように、回路基板1には、スルーホール1hが設けられている。スルーホール1hは、回路基板1に形成された孔(符号省略)と、該孔の内周面および開口端に設けられた導体(符号省略)とから構成されている。回路基板1の上面(表面)および下面(回路基板2と対向する裏面)のスルーホール1hの周囲には、ランド1rが設けられている。スルーホール1hは、本発明における「貫通孔」の一例である。 As shown in FIGS. 4 and 5, the circuit board 1 is provided with through holes 1h. The through hole 1h is composed of a hole (reference numeral omitted) formed in the circuit board 1 and a conductor (reference numeral omitted) provided on the inner peripheral surface of the hole and the open end. Lands 1r are provided around the through holes 1h on the upper surface (front surface) and the lower surface (back surface facing the circuit board 2) of the circuit board 1. As shown in FIG. The through hole 1h is an example of a "through hole" in the present invention.

接続端子3の挿入実装型接続部3aは、回路基板1に設けられたスルーホール1hに挿入された状態で、スルーホール1hやスルーホール1hの周囲に設けられたランド1rに対して、はんだ7により電気的に接続されている。この挿入実装型接続部3aの挿入と接続の各工程は、自動機または手作業で行われる。スルーホール1hやランド1rは、回路基板1に形成された電気回路に対して電気的に接続されている(図示省略)。 The insertion mounting type connection portion 3a of the connection terminal 3 is inserted into the through hole 1h provided in the circuit board 1, and the solder 7 is applied to the through hole 1h and the land 1r provided around the through hole 1h. are electrically connected by Each step of inserting and connecting the insertion mounting type connecting portion 3a is performed by an automatic machine or manually. The through holes 1h and lands 1r are electrically connected to an electric circuit formed on the circuit board 1 (not shown).

挿入実装型接続部3aは、スルーホール1hに埋没する埋没部分3aと、スルーホール1hに対して大径部3dと反対側に突出する先端側突出部分3aと、スルーホール1hに対して大径部3d側に突出する根元側突出部分3aとから構成されている。 The insertion mounting type connection portion 3a includes a buried portion 3a2 buried in the through hole 1h , a tip side projecting portion 3a1 projecting on the opposite side of the through hole 1h from the large diameter portion 3d, and a It is composed of a root side projecting portion 3a3 projecting toward the large diameter portion 3d.

回路基板1の上面と下面には、挿入実装型接続部3aの突出部分3a、3aからランド1rの外周縁にかけて、はんだ7のフィレットが形成されている。はんだ7の重力により、回路基板1の下面に形成されるはんだ7のフィレットの高さは、回路基板1の上面に形成されるはんだ7のフィレットの高さより高くなる。 Fillets of solder 7 are formed on the upper and lower surfaces of the circuit board 1 from the protruding portions 3a 1 and 3a 3 of the insertion mounting type connection portion 3a to the outer peripheral edge of the land 1r. Due to the gravity of the solder 7 , the fillet of the solder 7 formed on the lower surface of the circuit board 1 is higher than the fillet of the solder 7 formed on the upper surface of the circuit board 1 .

小径連続部3bは、挿入実装型接続部3aの根元側突出部分3aから下方に所定長さで連続している。根元側突出部分3aのスルーホール1hからの突出長さL1は、挿入実装型接続部3aからランド1rの外周縁までの径D以上に設定されている(L1≧D)。小径連続部3bの長さL2も、挿入実装型接続部3aからランド1rの外周縁までの径D以上に設定されている(L2≧D)。 The small-diameter continuous portion 3b continues downward for a predetermined length from the root - side projecting portion 3a3 of the insertion mounting type connecting portion 3a. The protruding length L1 of the root side protruding portion 3a3 from the through hole 1h is set to be equal to or larger than the diameter D from the insertion mounting type connecting portion 3a to the outer peripheral edge of the land 1r (L1≧D). The length L2 of the small-diameter continuous portion 3b is also set to be equal to or larger than the diameter D from the insertion mounting type connection portion 3a to the outer peripheral edge of the land 1r (L2≧D).

前述したように、挿入実装型接続部3aがスルーホール1hとランド1rに対してはんだ7により接続される工程は、自動機または手作業により行われるため、はんだ7の量がばらつくことがある。 As described above, the process of connecting the insertion mounting type connection portion 3a to the through hole 1h and the land 1r with the solder 7 is performed by an automatic machine or by hand, so the amount of the solder 7 may vary.

はんだ7の量が少ない場合は、図4に示すように、回路基板1の下面に生じるはんだ7のフィレットが、挿入実装型接続部3aの根元側突出部分3aの範囲内に形成される。 When the amount of solder 7 is small, as shown in FIG. 4, a fillet of solder 7 formed on the bottom surface of circuit board 1 is formed within the range of base-side projecting portion 3a3 of insertion mounting type connection portion 3a.

一方、はんだ7の量が多い場合は、図5に示すように、回路基板1の下面に生じるはんだ7のフィレットが、根元側突出部分3aの範囲を超えて、小径連続部3bの範囲の一部まで延びるように形成される。 On the other hand, when the amount of solder 7 is large, as shown in FIG. It is formed so as to extend partially.

しかるに、はんだ7の量がばらついても、回路基板1の下面に生じるはんだ7のフィレットが、挿入実装型接続部3aや小径連続部3bより径が大きい、テーパー部3cや大径部3dに到達することはない。このため、接続端子3の大径部3dと回路基板1との間には、緩やかに起伏するくびれ8は生じるが、図6に示した従来のような急峻に起伏するV字状のくびれ80は生じなくなる。 However, even if the amount of the solder 7 varies, the fillet of the solder 7 generated on the lower surface of the circuit board 1 reaches the tapered portion 3c and the large diameter portion 3d, which are larger in diameter than the insertion mounting type connection portion 3a and the small diameter continuous portion 3b. never do. As a result, a gently undulating constriction 8 is formed between the large-diameter portion 3d of the connection terminal 3 and the circuit board 1, but a sharply undulating V-shaped constriction 80 as in the prior art shown in FIG. ceases to occur.

また、小径連続部3bの周面に対するテーパー部3cの角度θは、135°以上に設定されている(θ≧135°)。つまり、接続端子3の長手方向(図3~図5で上下方向)に対して垂直な断面(図3~図5で左右方向の断面)に対するテーパー部3cの角度は、45°以上である。これにより、接続端子3の径(幅)がテーパー部3cで緩やかに変化するので、大径部3dと回路基板1との間に生じるくびれ8の起伏が一層緩やかになる。 Moreover, the angle θ of the tapered portion 3c with respect to the peripheral surface of the small-diameter continuous portion 3b is set to 135° or more (θ≧135°). That is, the angle of the tapered portion 3c with respect to a cross section perpendicular to the longitudinal direction of the connection terminal 3 (vertical direction in FIGS. 3 to 5) (horizontal direction in FIGS. 3 to 5) is 45° or more. As a result, the diameter (width) of the connection terminal 3 gradually changes at the tapered portion 3c, so that the undulation of the constriction 8 between the large diameter portion 3d and the circuit board 1 becomes more gentle.

前述したように、電子装置10は車両の走行駆動源の近傍に設置されるため、走行駆動源で生じた大きな振動や衝撃が電子装置10に伝わる。また、周囲の温度変化による熱衝撃も電子装置10に伝わる。 As described above, since the electronic device 10 is installed in the vicinity of the drive source of the vehicle, the electronic device 10 receives large vibrations and impacts generated by the drive source. Thermal shock due to ambient temperature changes is also transmitted to the electronic device 10 .

それらの振動や衝撃などの外力が電子装置10の回路基板1、2にかかると、回路基板1、2が揺れ動いて、当該外力によって生じる応力が接続端子3にかかる。その応力のうち、図4および図5に示すように左右方向に生じるせん断応力τは、はんだ7で覆われていない接続端子3の小径連続部3bで分散される。また、図3に示すように上下方向に生じる応力σは、接続端子3の湾曲部3eで吸収される。このため、外力によって接続端子3自体が破断することや、接続端子3と回路基板1、2との接続部分(はんだ7)が損傷することが防止される。 When an external force such as vibration or impact is applied to the circuit boards 1 and 2 of the electronic device 10 , the circuit boards 1 and 2 sway, and stress generated by the external force is applied to the connection terminals 3 . Among the stresses, the shearing stress τ generated in the horizontal direction as shown in FIGS. Further, as shown in FIG. 3, the stress σ generated in the vertical direction is absorbed by the curved portion 3e of the connection terminal 3. As shown in FIG. Therefore, it is possible to prevent the connection terminal 3 itself from being broken by an external force, and the connection portions (solder 7) between the connection terminal 3 and the circuit boards 1 and 2 from being damaged.

以上の実施形態によると、接続端子3の大径部3dと挿入実装型接続部3aとの間に、挿入実装型接続部3aと同一径の小径連続部3bが、当該接続部3aと連続するように形成されている。これにより、回路基板1のスルーホール1hに挿入された挿入実装型接続部3aをランド1rに接続するはんだ7の量が多くても、回路基板1の下面側のはんだ7は、挿入実装型接続部3aおよび小径連続部3bの範囲内にとどまって、テーパー部3cや大径部3dに到達しなくなる。また、はんだ7が重力によって回路基板1の上面側より下面側に多く溜まっても、はんだ7はテーパー部3cや大径部3dに到達しなくなる。その結果、接続端子3の大径部3dと回路基板1との間に、図6のような急峻に起伏するV字状のくびれが生じなくなる。このため、温度変化や振動などの外力が電子装置10の回路基板1、2にかかっても、これらの外力によって生じるせん断応力τが、大径部3dとはんだ7との間の接続端子3の一断面に集中しなくなる。そして、当該応力が接続端子3の小径連続部3bで分散されるので、外力による接続端子3の破断を防止することができる。 According to the above embodiment, between the large diameter portion 3d of the connection terminal 3 and the insertion mount type connection portion 3a, the small diameter continuous portion 3b having the same diameter as the insertion mount type connection portion 3a is continuous with the connection portion 3a. is formed as As a result, even if a large amount of solder 7 is used to connect the insertion mounting type connection portion 3a inserted into the through hole 1h of the circuit board 1 to the land 1r, the solder 7 on the lower surface side of the circuit board 1 is sufficient for the insertion mounting type connection. It remains within the range of the portion 3a and the small-diameter continuous portion 3b and does not reach the tapered portion 3c and the large-diameter portion 3d. Moreover, even if more solder 7 accumulates on the lower surface than on the upper surface of the circuit board 1 due to gravity, the solder 7 does not reach the tapered portion 3c or the large diameter portion 3d. As a result, a sharply undulating V-shaped constriction as shown in FIG. Therefore, even if external forces such as temperature changes and vibrations are applied to the circuit boards 1 and 2 of the electronic device 10, shear stress Don't focus on one section. Since the stress is dispersed at the small-diameter continuous portion 3b of the connection terminal 3, it is possible to prevent the connection terminal 3 from breaking due to an external force.

また、以上の実施形態では、接続端子3の小径連続部3bが、スルーホール1hより下方に突出する挿入実装型接続部3aの根元側突出部分3aから、所定長さで連続している。このため、回路基板1に対して挿入実装型接続部3aを接続するはんだ7が、挿入実装型接続部3aや小径連続部3bより径が大きい部分(テーパー部3cや大径部3d)に到達するのを確実に阻止できる。また、接続端子3の大径部3dと回路基板1との間に生じるくびれ8の起伏を、一層緩やかにすることができる。その結果、外力によって生じるせん断応力τを接続端子3の小径連続部3bでより分散させて、接続端子3の破断を一層効果的に防止することができる。 Further, in the above embodiment, the small-diameter continuous portion 3b of the connection terminal 3 continues for a predetermined length from the root-side projecting portion 3a3 of the insertion mounting type connection portion 3a projecting downward from the through hole 1h. Therefore, the solder 7 that connects the insertion mounting type connecting portion 3a to the circuit board 1 reaches the portion (the tapered portion 3c and the large diameter portion 3d) having a larger diameter than the insertion mounting type connecting portion 3a and the small diameter continuous portion 3b. You can definitely stop it from happening. Further, the undulation of the constriction 8 generated between the large-diameter portion 3d of the connection terminal 3 and the circuit board 1 can be further moderated. As a result, the shear stress τ caused by the external force can be more dispersed in the small-diameter continuous portion 3b of the connection terminal 3, and breakage of the connection terminal 3 can be prevented more effectively.

また、以上の実施形態では、スルーホール1hから突出する根元側突出部分3aの突出長さL1と、小径連続部3bの長さL2とが、それぞれ挿入実装型接続部3aからスルーホール1hの周囲のランド1rの外周縁までの径D以上になっている。このため、回路基板1の下面側のはんだ7のフィレットを、接続端子3の大径部3dからできるだけ離れるように形成して、接続端子3の大径部3dと回路基板1との間に生じるくびれ8の起伏を、一層緩やかにすることができる。 Further, in the above embodiment, the length L1 of projection of the root side projecting portion 3a3 projecting from the through hole 1h and the length L2 of the small-diameter continuous portion 3b are different from the insertion mounting type connecting portion 3a to the through hole 1h. It is equal to or larger than the diameter D to the outer peripheral edge of the surrounding land 1r. For this reason, the fillets of the solder 7 on the lower surface side of the circuit board 1 are formed so as to be separated from the large-diameter portions 3d of the connection terminals 3 as much as possible so that they are formed between the large-diameter portions 3d of the connection terminals 3 and the circuit board 1 . The undulations of the constriction 8 can be made more gentle.

また、以上の実施形態では、接続端子3の小径連続部3bの周面に対するテーパー部3cの角度θが、135°以上になっている。このため、接続端子3の大径部3dと回路基板1との間に生じるくびれ8の起伏を、一層緩やかにすることができる。 Further, in the above embodiment, the angle θ of the tapered portion 3c with respect to the peripheral surface of the small-diameter continuous portion 3b of the connection terminal 3 is 135° or more. Therefore, the undulation of the constriction 8 between the large-diameter portion 3d of the connection terminal 3 and the circuit board 1 can be further moderated.

そして、上記のようにくびれ8の起伏が緩やかになることで、くびれ8を左右に横切る接続端子3の一断面に、外力によって生じるせん断応力τが集中し難くなる。特に、小径連続部3bとテーパー部3cとの境界を通る一断面に、外力によって生じるせん断応力τが集中し難くなる。そのため、それらの断面部分において接続端子3が破断するのを防止することができる。 Since the undulations of the constriction 8 are moderated as described above, the shear stress τ generated by an external force is less likely to concentrate on one section of the connection terminal 3 crossing the constriction 8 from side to side. In particular, it becomes difficult for the shear stress τ generated by the external force to concentrate on one section passing through the boundary between the small-diameter continuous portion 3b and the tapered portion 3c. Therefore, it is possible to prevent the connection terminal 3 from breaking at those cross-sectional portions.

さらに、以上の実施形態では、接続端子3の大径部3dにS字状の湾曲部3eが形成されている。このため、外力によって接続端子3に生じる応力σを湾曲部3eで吸収することができる。そして、挿入実装型接続部3aの近傍で、接続端子3が外力によって破断することや、挿入実装型接続部3aと回路基板1との接続部分が損傷することを防止することができる。また、表面実装型接続部3fと回路基板2との接続部分が損傷することも防止することができる。 Furthermore, in the above embodiment, the large-diameter portion 3d of the connection terminal 3 is formed with the S-shaped curved portion 3e. Therefore, the stress σ generated in the connection terminal 3 by an external force can be absorbed by the curved portion 3e. Further, it is possible to prevent the connection terminal 3 from being broken by an external force in the vicinity of the insertion mounting type connection portion 3a and the connection portion between the insertion mounting type connection portion 3a and the circuit board 1 from being damaged. In addition, it is possible to prevent damage to the connecting portion between the surface mount type connecting portion 3f and the circuit board 2. FIG.

本発明は、上述した以外にも種々の実施形態を採用することができる。 The present invention can adopt various embodiments other than those described above.

たとえば、以上の実施形態では、接続端子3の一方の端部に挿入実装型接続部3aを設けた例を示したが、本発明はこれのみに限定するものではない。接続端子3の他方の端部にも、表面実装側接続部3fに代えて、挿入実装型接続部を設けてもよい。 For example, in the above embodiment, an example in which the insertion mounting type connection portion 3a is provided at one end of the connection terminal 3 has been shown, but the present invention is not limited to this. The other end of the connection terminal 3 may also be provided with an insertion mount type connection portion instead of the surface mount side connection portion 3f.

また、以上の実施形態では、接続端子3の小径連続部3bと大径部3dとの間に、テーパー部3cを設けた例を示したが、本発明はこれのみに限定するものではない。テーパー部3cに代えて、たとえば径が不連続に変化する段差部を、小径連続部3bと大径部3dとの間に設けてもよい。 Moreover, in the above-described embodiment, an example in which the tapered portion 3c is provided between the small-diameter continuous portion 3b and the large-diameter portion 3d of the connection terminal 3 is shown, but the present invention is not limited to this. Instead of the tapered portion 3c, for example, a stepped portion whose diameter changes discontinuously may be provided between the small-diameter continuous portion 3b and the large-diameter portion 3d.

また、以上の実施形態では、接続端子3の大径部3dにS字状の湾曲部3eを設けた例を示したが、本発明はこれのみに限定するものではない。これ以外に、たとえばU字状や螺旋状のような他の形状に湾曲した湾曲部を、接続端子3の大径部3dに設けてもよい。 Further, in the above embodiment, an example in which the large-diameter portion 3d of the connection terminal 3 is provided with the S-shaped curved portion 3e is shown, but the present invention is not limited to this. In addition to this, the large-diameter portion 3d of the connection terminal 3 may be provided with a curved portion curved in another shape such as a U-shape or a spiral shape.

また、以上の実施形態では、板金を加工して接続端子3を形成した例を示したが、本発明はこれのみに限定するものではない。これ以外に、たとえば金属製の線材を加工して、接続端子3を形成してもよい。 Further, in the above embodiment, an example in which the connection terminal 3 is formed by processing sheet metal has been shown, but the present invention is not limited to this. Alternatively, the connection terminal 3 may be formed by processing a metal wire, for example.

さらに、以上の実施形態では、車両の走行駆動源の近傍に設置される車載用のDC-DCコンバータから成る電子装置10と、該電子装置10に備わる接続端子3に対して本発明を適用した例を挙げたが、その他の車載用の電子装置や、車載用以外の電子装置や、それらに備わる接続端子に対しても、本発明を適用することは可能である。 Furthermore, in the above embodiments, the present invention is applied to the electronic device 10, which is an in-vehicle DC-DC converter installed near the driving source of the vehicle, and the connection terminals 3 provided in the electronic device 10. Although examples have been given, the present invention can also be applied to other in-vehicle electronic devices, non-vehicle electronic devices, and connection terminals provided therewith.

1、2 回路基板
1h スルーホール(貫通孔)
1r ランド
2 パッド
3 接続端子
3a 挿入実装型接続部
3a 先端側突出部分
3a 埋没部分
3a 根元側突出部分
3b 小径連続部
3c テーパー部
3d 大径部
3e 湾曲部
3f 表面実装型接続部
6、7 はんだ
10 電子装置
D 挿入実装型接続部からランドの外周縁までの径
L1 根元側突出部分の突出長さ
L2 小径連続部の長さ
θ テーパー部の角度
1, 2 circuit board 1h through hole (through hole)
1r land 2 pad 3 connection terminal 3a insertion mount type connection portion 3a 1 tip side projecting portion 3a 2 embedded portion 3a 3 root side projecting portion 3b small diameter continuous portion 3c tapered portion 3d large diameter portion 3e curved portion 3f surface mount type connection portion 6 , 7 Solder 10 Electronic device D Diameter from insertion mounting type connection part to outer peripheral edge of land L1 Projection length of root side projecting part L2 Length of small diameter continuous part θ Angle of taper part

Claims (6)

所定の間隔で対向する回路基板同士を電気的に接続する接続端子であって、
当該接続端子の端部から所定長さに渡って径が小さく形成され、前記回路基板に設けられた貫通孔に挿入された状態で、前記回路基板に対してはんだにより接続される挿入実装型接続部と、
前記挿入実装型接続部より径が大きい大径部と
前記挿入実装型接続部と前記大径部との間に、前記挿入実装型接続部と同一径で、当該挿入実装型接続部と連続するように形成された小径連続部と、を備えた接続端子において
前記挿入実装型接続部は、前記貫通孔に埋没する埋没部分と、前記貫通孔に対して前記大径部と反対側に突出する先端側突出部分と、前記貫通孔に対して前記大径部側に突出する根元側突出部分と、から構成され、
前記小径連続部は、前記根元側突出部分から所定長連続しており、
前記挿入実装型接続部は、前記回路基板の表面の前記貫通孔の周囲に設けられたランドに対してはんだにより接続され、
前記貫通孔からの前記根元側突出部分の突出長さと、前記小径連続部の長さとは、それぞれ前記挿入実装型接続部から前記ランドの外周縁までの径以上である、ことを特徴とする接続端子。
A connection terminal for electrically connecting circuit boards facing each other at a predetermined interval,
An insertion mounting type connection in which the connection terminal is formed with a small diameter over a predetermined length from the end of the connection terminal, and is connected to the circuit board by soldering while being inserted into a through hole provided in the circuit board. Department and
a large-diameter portion having a diameter larger than that of the insertion mounting type connection portion ;
a small-diameter continuous portion having the same diameter as the insertion-mounting type connecting portion and formed so as to be continuous with the insertion-mounting type connecting portion between the insertion-mounting type connecting portion and the large-diameter portion. at the terminal ,
The insertion mounting type connecting portion includes a buried portion buried in the through-hole, a tip-side protruding portion protruding on the opposite side of the through-hole from the large-diameter portion, and the large-diameter portion with respect to the through-hole. and a root side protruding portion that protrudes to the side,
The small-diameter continuous portion continues for a predetermined length from the root-side projecting portion,
The insertion mounting type connecting portion is connected by soldering to a land provided around the through hole on the surface of the circuit board,
A connection characterized in that the projection length of the root-side projecting portion from the through hole and the length of the small-diameter continuous portion are equal to or greater than a diameter from the insertion mounting type connection portion to the outer peripheral edge of the land. terminal.
請求項1に記載の接続端子において、
前記大径部から前記小径連続部にかけて、径が徐々に小さくなるように形成されたテーパー部をさらに備え、
前記小径連続部の周面に対する前記テーパー部の角度は、135°以上である、ことを特徴とする接続端子。
In the connection terminal according to claim 1 ,
further comprising a tapered portion formed such that the diameter gradually decreases from the large diameter portion to the small diameter continuous portion;
The connecting terminal, wherein the angle of the tapered portion with respect to the peripheral surface of the small-diameter continuous portion is 135° or more.
請求項1または請求項2に記載の接続端子において、
前記大径部は、S字状に湾曲する湾曲部を有している、ことを特徴とする接続端子。
In the connection terminal according to claim 1 or claim 2 ,
The connecting terminal, wherein the large-diameter portion has a curved portion curved in an S-shape.
請求項1ないし請求項のいずれかに記載の接続端子において、
前記挿入実装型接続部は、当該接続端子の上端部に形成され、
前記小径連続部は、前記挿入実装型接続部の下方に連続するように形成されている、ことを特徴とする接続端子。
In the connection terminal according to any one of claims 1 to 3 ,
The insertion mounting type connection part is formed on the upper end of the connection terminal,
The connecting terminal, wherein the small-diameter continuous portion is formed so as to continue below the insertion mounting type connecting portion.
請求項1ないし請求項のいずれかに記載の接続端子において、
当該接続端子の一方の端部に、一方の前記回路基板の表面に設けられたランドに対してはんだにより接続される前記挿入実装型接続部が形成され、
当該接続端子の他方の端部に、他方の前記回路基板の表面に設けられたパッドに対してはんだにより接続される表面実装型接続部が形成されている、ことを特徴とする接続端子。
In the connection terminal according to any one of claims 1 to 4 ,
one end of the connection terminal is formed with the insertion mounting type connection portion connected by soldering to a land provided on the surface of one of the circuit boards;
A connection terminal characterized in that a surface-mounted connection part connected by soldering to a pad provided on the surface of the other circuit board is formed at the other end of the connection terminal.
請求項1ないし請求項のいずれかに記載の接続端子と、
所定の間隔で対向して、前記接続端子により電気的に接続される複数の回路基板とを備えた、ことを特徴とする電子装置。
a connection terminal according to any one of claims 1 to 5 ;
An electronic device comprising: a plurality of circuit boards facing each other at a predetermined interval and electrically connected by the connection terminals.
JP2019052172A 2019-03-20 2019-03-20 connection terminal, electronic device Active JP7203651B2 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005294481A (en) 2004-03-31 2005-10-20 Nissin Kogyo Co Ltd Printed circuit board connection structure
JP2006344458A (en) 2005-06-08 2006-12-21 Hirose Electric Co Ltd Surface mount type electrical connector
JP2007535120A (en) 2003-06-27 2007-11-29 ジョンソン コントロールズ オートモティブ エレクトロニクス Soldering method of electrical connection pins to support
JP2017118137A (en) 2014-09-11 2017-06-29 日本精工株式会社 Multipolar lead component and board connection device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057465A (en) * 1999-08-17 2001-02-27 Ricoh Co Ltd Connection structure between printed circuit boards
JP2007115846A (en) * 2005-10-19 2007-05-10 Nidec Shibaura Corp Spacer for supporting circuit board and circuit board unit using the same
JP5224067B2 (en) * 2009-11-11 2013-07-03 住友電装株式会社 Board terminal and board connector having the same
JP2017216079A (en) * 2016-05-30 2017-12-07 住友電装株式会社 Board terminal

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007535120A (en) 2003-06-27 2007-11-29 ジョンソン コントロールズ オートモティブ エレクトロニクス Soldering method of electrical connection pins to support
JP2005294481A (en) 2004-03-31 2005-10-20 Nissin Kogyo Co Ltd Printed circuit board connection structure
JP2006344458A (en) 2005-06-08 2006-12-21 Hirose Electric Co Ltd Surface mount type electrical connector
JP2017118137A (en) 2014-09-11 2017-06-29 日本精工株式会社 Multipolar lead component and board connection device

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