JP7205143B2 - Imaging device - Google Patents

Description

The present invention relates to an imaging device.

A omnidirectional imaging apparatus has a plurality of imaging optical systems each including a wide-angle lens and an imaging sensor that captures an image of the wide-angle lens. The omnidirectional imaging apparatus obtains an image within a solid angle of 4.pi.

However, in the omnidirectional imaging apparatus of Patent Document 1, no consideration is given to a configuration for dissipating heat from a heat source such as an imaging sensor.

JP 2013-25255 A

An imaging device disclosed in the present application includes a housing having an intake port and an exhaust port; and a second imaging element arranged between the first imaging element and the second imaging element in the housing based on electrical signals from the first imaging element and the second imaging element an image processing unit that executes image processing and generates a larger amount of heat than the first imaging element and the second imaging element; and one of the first imaging element or the second imaging element and the image processing unit. a cooling fan disposed between the intake port and exhausting air from the exhaust port , wherein the cooling fan draws air from the first imaging device, the second imaging device, and the image processing unit; It is arranged at a position in the housing near the mouth, and sucks air from the intake port and exhausts it from the exhaust port .
An imaging device disclosed in the present application includes a housing having an intake port and an exhaust port, a first imaging device arranged in the housing, a second imaging device arranged in the housing, and is arranged between the first imaging element and the second imaging element of the image processing based on the electrical signals from the first imaging element and the second imaging element, and the first imaging element and the an image processing unit having a heat value larger than that of a second image pickup device; and an image processing unit arranged between one of the first image pickup device and the second image pickup device and the image processing unit, and sucking air from the air inlet and exhausting the air. a cooling fan that exhausts air from an opening, wherein the housing has a structure in which an air flow path from the intake opening to the exhaust opening is provided inside the housing, and the cooling fan is provided with the second imaging element and the air passing through the first image pickup device from the intake port along the flow path is sucked from each of the second image pickup device and the image processing unit and exhausted from the exhaust port. do.
An imaging device disclosed in the present application includes a housing having an intake port and an exhaust port, a first imaging device arranged in the housing, a second imaging device arranged in the housing, and is arranged between the first imaging element and the second imaging element of the image processing based on the electrical signals from the first imaging element and the second imaging element, and the first imaging element and the an image processing unit having a heat value larger than that of a second image pickup device; and an image processing unit arranged between one of the first image pickup device and the second image pickup device and the image processing unit, and sucking air from the air inlet and exhausting the air. a cooling fan that exhausts air from an opening, wherein the housing has a structure in which an air flow path from the intake opening to the exhaust opening is provided inside, and the cooling fan is arranged opposite to the image processing unit. Air passing through the first imaging element, the second imaging element, and the image processing section in this order from the intake port along the flow path is sucked from the image processing section and exhausted from the exhaust port.

An imaging device disclosed in the present application is an imaging device having a flow path through which air flows from an intake port to an exhaust port, comprising a first imaging element, a second imaging element, the first imaging element, and An image processing unit that performs signal processing on an output signal of the second imaging device, a first heat transfer member that conducts heat generated by the first imaging device, and a second heat transfer member that conducts heat generated by the second imaging device. a heat transfer member; and a third heat transfer member that conducts heat generated in the image processing section, and at least a part of the first heat transfer member and the second heat transfer member is the third heat transfer member. The thermal member contacts the air in the flow path at a location different from the section from the location where the heat member contacts the air in the flow path to the exhaust port.

An imaging device disclosed in the present application is an imaging device having a flow path through which air flows from an intake port to an exhaust port, comprising a first imaging element, a second imaging element, the first imaging element, and An image processing unit that performs signal processing on an output signal of the second imaging device, a first heat transfer member that conducts heat generated by the first imaging device, and a second heat transfer member that conducts heat generated by the second imaging device. a heat transfer member; and a third heat transfer member that conducts heat generated in the image processing unit. The flow path is branched into a second flow path different from the flow path, and at least one of the first heat transfer member and the second heat transfer member extends from the point where the flow path branches to the exhaust port including the first flow path. The third heat transfer member contacts the air in the flow path from the branch point of the flow path to the exhaust port including the second flow path.

An imaging device disclosed in the present application is an imaging device having a flow path through which air flows from an intake port to an exhaust port, comprising a first imaging element, a second imaging element, the first imaging element, and An image processing unit that performs signal processing on an output signal of the second imaging device, a first heat transfer member that conducts heat generated by the first imaging device, and a second heat transfer member that conducts heat generated by the second imaging device. and a third heat transfer member that conducts heat generated in the image processing section, wherein at least one of the first heat transfer member and the second heat transfer member has a first intake port. to the exhaust port including the first flow path, and the third heat transfer member is in contact with the air in the flow path from the second intake port to the exhaust port including the second flow path different from the first flow path. In contact with the air in the flow path.

An imaging device disclosed in the present application includes a housing having an intake port and an exhaust port, a first imaging device arranged in the housing, a second imaging device arranged in the housing, and and an image processing unit that processes the output signals of the first imaging device and the second imaging device, wherein each of the first imaging device, the second imaging device, and the image processing unit The generated heat is transferred to the air flowing through the flow path from the intake port toward the exhaust port and is radiated. The heat generated in the processing section is transferred to the air in a section different from the section through which the air flows.

1 is a perspective view of an imaging device according to a first embodiment; FIG. FIG. 2 is a bottom view of the imaging device according to the first embodiment; FIG. 3 is a side cross-sectional view of the imaging device according to the first embodiment; FIG. 4A is a side cross-sectional view illustrating an example of air flow within the imaging apparatus according to the first embodiment; 4B is a side cross-sectional view showing another example of air flow in the imaging device according to the first embodiment; FIG. FIG. 5 is a side cross-sectional view of an imaging device according to a second embodiment. FIG. 6 is an explanatory diagram of air flow in the imaging apparatus according to the second embodiment.

<Appearance of imaging device>
FIG. 1 is a perspective view of the imaging device according to the first embodiment, and FIG. 2 is a bottom view of the imaging device according to the first embodiment. In FIG. 1, (A) is a front perspective view, and (B) is a rear perspective view. The imaging device 100 has a housing 101 . A front plate portion 101A of the housing 101 is provided with a wide-angle lens 102A and an air intake port 103 .

A wide-angle lens 102B is provided on the rear plate portion 101B of the housing 101 . An exhaust port 200 is provided in the bottom plate portion 101C of the housing 101 . Slits are formed in the intake port 103 and the exhaust port 200, and air passes through the slits. In addition, the code|symbol 101D is an upper surface board part.

Wide-angle lens 102A is provided in housing 101 so as to be exposed from housing 101 . The wide-angle lens 102A receives light from outside the housing 101 and emits the light to the imaging device. Wide-angle lens 102B is provided in housing 101 so as to be exposed from housing 101 in a direction opposite to the direction in which wide-angle lens 102A is exposed. The wide-angle lens 102B receives light from outside the housing 101 and outputs the light to the imaging device.

At least one of wide-angle lenses 102A and 102B has an angle of view of 180 degrees or more. The imaging apparatus 100 has two imaging elements arranged in opposite directions, and a wide-angle lens 102A and a wide-angle lens 102B are arranged in front of each imaging element, thereby imaging an object at a solid angle of 4π steradian.

By synthesizing the image data obtained by the two imaging elements, the image data of the omnidirectional image (the image within the solid angle of 4π steradian) is generated. Both of the wide-angle lenses 102A and 102B may have an angle of view of less than 180 when the range for capturing an image of the object does not require a solid angle of 4π steradian.

<Side Section of Imaging Device 100>
FIG. 3 is a side sectional view of the imaging device 100 according to the first embodiment. The imaging apparatus 100 includes a housing 101 including a cooling fan 300, imaging elements 301A and 301B, heat transfer pads 302A and 302B, heat dissipation sheets 303A and 303B, heat sinks 304A and 304B, a circuit board 305, and circuits. It has a group 306 , a heat transfer pad 307 , a heat sink 308 , a rechargeable battery 309 and a battery case 310 . The imaging elements 301A and 301B and the circuit group 306 are heat sources. X is an optical axis common to wide-angle lenses 102A and 102B. The direction from the rear plate portion 101B to the front plate portion 101A is +X, and the direction from the front plate portion 101A to the rear plate portion 101B is -X.

Cooling fan 300 is, for example, a blower fan, and cools the inside of housing 101 . The blower fan has a structure in which air is taken in from both sides perpendicular to the rotating shaft 300c and exhausted from one side in the rotating direction. The cooling fan 300 has a fan 300a and a storage case 300b.

The fan 300a is housed in a housing case 300b. The rotation axis 300c of the fan 300a housed in the housing case 300b is parallel to the optical axis X. As shown in FIG. The housing case 300b houses the fan 300a. The storage case 300b has openings 300cA and 300cB on the plane perpendicular to the optical axis X, and an opening 300cC on the side surface facing the exhaust port 200. As shown in FIG.

The opening 300 cC is connected to the air outlet 200 and allows the air inside the cooling fan 300 to pass through the air outlet 200 . The cooling fan 300 is connected to the circuit group 306 via the circuit board 305 by a flexible wiring board (not shown). The cooling fan 300 rotates the fan 300a by drive control of the circuit group 306, sucks the air in the housing 101 from the openings 300cA and 300cB, and exhausts it to the outside of the housing 101 from the opening 300cC through the exhaust port 200. .

The imaging element 301A is arranged near the intake port 103 . The imaging element 301A is arranged at a position closer to the intake port 103 than the imaging element 301B and the circuit group 306 are. The imaging device 301A is arranged inside the imaging device 100 relative to the wide-angle lens 102A, receives light condensed by the wide-angle lens 102A, and converts it into an electrical signal. The imaging element 301A is connected to the circuit group 306 through the circuit board 305 by a flexible wiring board (not shown).

The imaging device 301A is fixed to a heat dissipation sheet 303A via a heat transfer pad 302A. A heat sink 304A is provided around the heat dissipation sheet 303A. Therefore, the heat generated from the imaging element 301A is transferred to the air in the internal space of the housing 101 via the heat transfer pad 302A, the heat radiation sheet 303A, and the heat sink 304A. A heat transfer pad 302A, a heat dissipation sheet 303A, and a heat sink 304A that conduct heat generated from the imaging element 301A are referred to as first heat transfer members.

The imaging device 301B is arranged at a position inside the housing 101 that is further away from the intake port 103 than the imaging device 301A and at a predetermined distance from the imaging device 301A. The imaging device 301B is arranged inside the imaging device 100 relative to the wide-angle lens 102B, receives light condensed by the wide-angle lens 102B, and converts it into an electrical signal. The imaging element 301B is connected to the circuit group 306 through the circuit board 305 by a flexible wiring board (not shown).

The imaging device 301B is fixed to a heat dissipation sheet 303B via a heat transfer pad 302B. A heat sink 304B is provided around the heat dissipation sheet 303B. Therefore, the heat generated from the imaging element 301B is transferred to the air in the internal space of the housing 101 via the heat transfer pad 302B, the heat radiation sheet 303B, and the heat sink 304B. A heat transfer pad 302B, a heat dissipation sheet 303B, and a heat sink 304B that conduct heat generated from the imaging device 301B are referred to as second heat transfer members.

Note that the imaging devices 301A and 301B may be, for example, XY addressing solid-state imaging devices (for example, CMOS (Complementary Metal-Oxide Semiconductor) sensors) or sequential scanning solid-state imaging devices (for example, CCD (Charge It may be a Coupled Device)).

A plurality of light receiving elements (pixels) are arranged in a matrix on the light receiving surfaces of the imaging elements 301A and 301B. In pixels of the imaging elements 301A and 301B, a plurality of types of color filters that transmit light of different color components are arranged according to a predetermined color arrangement (for example, Bayer arrangement). Therefore, each pixel of the imaging elements 301A and 301B outputs an analog electric signal corresponding to each color component to the circuit group 306 by color separation by the color filter. Note that, in this embodiment, the imaging elements 301A and 301B that generate less heat than the circuit group 306 are employed. In addition, the amounts of heat generated by the imaging elements 301A and 301B may be different.

The imaging devices 301A and 301B each have an AFE (Analog Front End). The AFE is an analog front-end circuit that performs signal processing on analog electric signals from the imaging elements 301A and 301B. The AFE sequentially performs gain adjustment of electrical signals, analog signal processing (correlated double sampling, black level correction, etc.), A/D conversion processing, and digital signal processing (defective pixel correction, etc.) to generate RAW image data. , to the circuit group 306 .

The circuit board 305 is provided between the rechargeable battery 309 and the cooling fan 300 so that its board surface is perpendicular to the optical axis X. As shown in FIG. A circuit group 306 is mounted on the circuit board 305 . The circuit group 306 includes, for example, processors, memories, and LSIs such as ASICs (Application Specific Integrated Circuits) and FPGAs (Field-Programmable Gate Arrays).

The processor centrally controls the imaging device 100 . A processor executes a program. The memory stores programs executed by the processor, data prepared in advance, and data obtained by execution processing of the processor and LSI.

The LSI performs specific processing such as image processing and compression/expansion processing using electrical signals from the imaging elements 301A and 301B. This particular process may be implemented by a processor executing a program stored in memory. An LSI that executes image processing by LSI or software and a processor that executes an image processing program are called an image processing unit. The image processing unit generates image data of an omnidirectional image (an image within a solid angle of 4π steradian) by synthesizing the image data obtained by the two image sensors 301A and 301B. Since the circuit group 306 performs various processes in this manner, the amount of heat generated by the circuit group 306 is greater than that of the imaging elements 301A and 301B.

Circuit group 306 is fixed to heat sink 308 via heat transfer pad 307 . The heat sink 308 has a substantially C shape, one end of which is connected to the heat transfer pad 307 and the other end of which is fixed to the battery case 310 . Therefore, the heat generated from the circuit group 306 is transferred to the air in the internal space of the housing 101 via the heat transfer pad 307 and the heat dissipation plate 308 . A heat transfer pad 307 and a heat sink 308 that conduct heat generated from the circuit group 306 are referred to as a third heat transfer member.

A rechargeable battery 309 is provided between the imaging element 301A and the circuit group 306 . The rechargeable battery 309 supplies power to the imaging elements 301A and 301B, the circuit group 306, and the cooling fan 300 via the circuit board 305 by a flexible wiring board (not shown).

Battery case 310 has a box portion 310a and a lid portion 310b. Box portion 310a accommodates rechargeable battery 309 . Lid portion 310b seals the opening of box portion 310a in which rechargeable battery 309 is accommodated. A wall plate 320 is provided at one edge of the lid portion 310b. The wall plate 320 extends in the X direction. One end side of the wall plate 320 contacts one end edge of the lid portion 310b. The other edge of the wall plate 320 does not contact the cooling fan 300 and forms a gap with the cooling fan 300 . The wall plate 320 may be a substantially L-shaped plate member integrally formed with the lid portion 310b.

In the imaging apparatus 100, the wide-angle lens 102A, the imaging device 301A, the rechargeable battery 309, the circuit group 306, the cooling fan 300, the imaging device 301B, and the wide-angle lens 102B are arranged on the X-axis in this order in the -X direction. ing. The imaging apparatus 100 in which the combination of the wide-angle lens 102A and the imaging device 301A and the combination of the wide-angle lens 102B and the imaging device 301B are arranged back-to-back in opposite directions captures an object at a solid angle of 4π steradian.

Therefore, when a new mechanism such as the cooling fan 300 is added inside the imaging apparatus 100, the housing 101 needs to be expanded to accommodate the new mechanism. For example, if the housing 101 is elongated in a direction orthogonal to the optical axis X (for example, toward the bottom plate portion 101C) without changing the thickness of the housing 101 in the direction of the optical axis X, the housing 101 is expanded. A partial image is reflected.

Therefore, the cooling fan 300, circuit group 306 and circuit board 305, and rechargeable battery 309 are preferably arranged on the optical axis X and between the imaging elements 301A and 301B. By arranging in this way, reflection of the image of the housing 101 can be suppressed.

In order to increase the cooling efficiency, the cooling fan 300 needs to be placed near a heat source. There is Since the cooling fan 300 is a double-sided intake type that takes in air from the openings 300cA and 300cB, when two heat sources are arranged near each of the openings 300cA and 300cB, the position of the remaining one heat source in the housing 101 is determined. becomes a problem.

Air flowing inside the housing 101 is taken in by the cooling fan 300 through the intake port 103 and exhausted through the exhaust port 200 . Therefore, for example, imaging elements 301A and 301B are arranged near openings 300cA and 300cB of cooling fan 300, respectively, and circuit group 306, which generates the largest amount of heat, is arranged upstream near inlet 103. FIG.

In this case, when the cooling fan 300 draws air, the air warmed by the circuit group 306 comes into contact with the imaging elements 301A and 301B, so that the imaging elements 301A and 301B cannot be cooled. Therefore, it is necessary to arrange the imaging elements 301A and 301B and the circuit group 306 so that the air warmed by the heat generation amount larger than the heat generation amount thereof does not come into contact with the air.

Therefore, the imaging element 301A is arranged at a position closer to the intake port 103 than the circuit group 306 is. The circuit group 306 is arranged at a position closer to the opening 300cA of the cooling fan 300 than at least one of the imaging elements 301A and 301B. As a result, an arrangement structure in which the imaging device 301B is arranged near the opening 300cB is obtained.

In this manner, the circuit group 306 is arranged at a position closer to the cooling fan 300 than the image sensor 301A, which is one of the two image sensors 301A and 301B. As a result, the image sensor 301A can be cooled by the air sucked from the intake port 103, and the cooling efficiency of the image sensor 301A can be improved.

Also, the air taken in by the cooling fan 300 is warmed by the image sensor 301A, and the air warmed by the image sensor 301A hits the image sensor 301B and the circuit group 306. FIG. However, the image sensor 301B generates the same amount of heat as the image sensor 301A, and the circuit group 306 generates more heat than the image sensor 301A.

Therefore, even if the circuit group 306 and the image sensor 301B are exposed to the air warmed by the image sensor 301A, the circuit group 306 and the image sensor 301B are not warmed and can be sufficiently cooled. Further, by arranging such an arrangement on the X-axis, it is possible to reduce the thickness of the housing 101 in the Y-axis direction and the Z-axis direction where the wide-angle lenses 102A and 102B are not arranged. can be suppressed.

Note that the arrangement of the imaging elements 301A and 301B, the cooling fan 300, and the circuit group 306 is not limited to the arrangement described above. The circuit group 306 may be arranged at a position closer to the cooling fan 300 than at least one of the two imaging elements 301A and 301B.

FIG. 4A is a side cross-sectional view showing an example of air flow within the imaging apparatus 100 according to the first embodiment. In FIG. 4A , thick black arrows indicate the flow of air and the channels formed within the housing 101 . When cooling fan 300 is driven to rotate fan 300 a , air outside housing 101 is sucked into housing 101 through air inlet 103 .

The air sucked from the intake port 103 passes through the gap between the housing 101 and the heat sink 304A and the gap between the heat radiation sheet 303A and the battery case 310. FIG. Since heat from the imaging device 301A is transferred to the radiation sheet 303A and the heat sink 304A, the imaging device 301A is cooled.

The air sucked from the intake port 103 branches and (1) passes through a gap (flow path) formed by the housing 101 and the heat sink 304A. In addition, the air sucked from the intake port 103 passes through (2) the gap (flow path) formed by the wide-angle lens 102A and the heat sink 304A, and the gap (flow path) between the heat dissipation sheet 303A and the battery case 310. pass. Heat from the imaging element 301A is transferred to the heat radiation sheet 303A and the heat sink 304A. The air sucked from the intake port 103 flows through these gaps (flow paths), thereby contacting the heat radiation sheet 303A and the heat sink 304A and cooling the imaging device 301A.

The air that has passed through the gap between the housing 101 and the heat sink 304A branches and passes through (3) the gap (flow path) between the circuit board 305 and the radiator plate 308 . The air passing through the gap (flow path) between the circuit board 305 and the radiator plate 308 is guided to the cooling fan side 300 by the wall plate 320 . (4) The air passing through the gap between the housing 101 and the heat sink 304A passes through the gap formed between the radiator plate 308 and the housing 101, and (5) the gap between the radiator plate 308 and the cooling fan 300 ( flow path). Heat from the circuit group 306 is transferred to the circuit board 305 and the heat sink 308, and the circuit group 306 is cooled by the air.

Also, the air that has passed between the heat dissipation sheet 303A and the battery case 310 flows through the flow path formed by (6) the inner wall surface of the upper surface plate portion 101D, the battery case 310, and the wall plate 320. FIG. Then, this air branches, and one part passes through the gap between the wall plate 320 and the storage case 300 b and the gap (flow path) between the heat sink 308 and the cooling fan 300 .

This air also cools the circuit group 306 . The other branched air also passes through the gaps between cooling fan 300 and heat sink 304B and heat dissipation sheet 303B. Heat from the imaging device 301B is transferred to the heat radiation sheet 303B and the heat sink 304B, thereby cooling the imaging device 301B.

The air warmed near the openings 300aC and 300bC of the cooling fan 300 is sucked into the storage case 300b through the openings 300bC and 300cC and is discharged out of the housing 101 through the exhaust port 200 through the opening 300cC. This improves the cooling efficiency of the circuit group 306 and the image sensor 301B. By improving the cooling efficiency in this way, it is possible to reduce the influence of noise on image data caused by heat generation.

FIG. 4B is a side cross-sectional view showing another example of air flow in the imaging device 100 according to the first embodiment. The imaging device 100 in FIG. 4B has a configuration in which a wall plate 330 and an air inlet 340 are added to the imaging device 100 in FIG. 4A. The same components as those in FIG. 4A are denoted by the same reference numerals, and descriptions thereof are omitted.

The wall plate 330 is provided so as to seal the space between the inner wall surface of the upper plate portion 101</b>D and the storage case 300 b of the cooling fan 300 . Specifically, for example, the wall plate 330, together with the storage case 300b of the cooling fan 300, divides the internal space of the housing 101 into a space on the +X direction side from the wall plate 330 and a space on the −X direction side from the wall plate 330. and As a result, the air from the space on the +X direction side of the wall plate 330 does not flow out to the space on the -X direction side of the wall plate 330 .

For example, air that has passed through heat dissipation sheet 303A and heat sink 304A and through the space between the inner wall surface of top plate portion 101D and battery case 310 and wall plate 320 is flows in from the gap with the storage case 300b. The inflowing air is sucked into cooling fan 300 through opening 300 aC of cooling fan 300 . Thereby, the imaging element 301A can be cooled.

The intake port 340 is provided in the upper plate portion 101D of the imaging device 100, and connects the outside of the imaging device 100 with the space on the −X direction side from the wall plate 330 inside the imaging device 100. Air is passed through the imaging device 100 . Air that has flowed in from intake port 340 passes through heat dissipation sheet 303B and heat sink 304B. Heat from the imaging device 301B is transferred to the heat radiation sheet 303B and the heat sink 304B, thereby cooling the imaging device 301B.

Thus, in FIGS. 4A and 4B, at least a portion of the first heat transfer member and the second heat transfer member correspond to the air in the flow path through which the third heat transfer member flows from the intake port toward the exhaust port. The air in the flow path is contacted at a location different from the section from the contact location to the exhaust port.

In FIGS. 4A and 4B, regarding the air flow path from the intake port 103 to the exhaust port 200, if the flow of air cools the image sensor 301A→the image sensor 301B and the circuit group 306 in this order, the intake port 103 , and the arrangement and number of exhaust ports 200 are not limited to those shown in FIGS. For example, it is sufficient if the circuit group 306 is closest to the cooling fan 300 when viewed from the air flow path.

4A and 4B, the rechargeable battery 309, the circuit board 305, the circuit group 306, and the cooling fan 300 are arranged between the imaging elements 301A and 301B. Battery 309, circuit board 305 and circuit group 306, and cooling fan 300 may be arranged such that their longitudinal directions extend along optical axis X. FIG.

Example 2 will be described. In the first embodiment, an example using a blower fan as a cooling fan has been described. In a second embodiment, an example using a sirocco fan as a cooling fan will be described. Note that, in the second embodiment, since the description will focus on the features of the second embodiment, the same reference numerals will be given to the same contents as in the first embodiment, and the description thereof will be omitted.

<Side Section of Imaging Device 100>
FIG. 5 is a side cross-sectional view of the imaging device 100 according to the second embodiment. The imaging apparatus 100 has a cooling fan 500 and a support member 501 in the housing 101 instead of the cooling fan 300 of the first embodiment. In the housing 101, the imaging device 301A, the cooling fan 300, the circuit group 306 and the circuit board 305, the rechargeable battery 309, and the imaging device 301B are arranged in this order in the -X direction.

Cooling fan 500 is, for example, a sirocco fan, and cools the inside of housing 101 . The sirocco fan has a structure in which air is taken in from one surface perpendicular to its rotation axis 500c and exhausted from one side surface in the direction of rotation. The cooling fan 500 has a fan 500a and a storage case 500b.

The fan 500a is housed in a housing case 500b. The fan 500a is arranged in the storage case 500b such that its rotating shaft 500c is parallel to the optical axis X. As shown in FIG. The housing case 500b houses the fan 500a. The storage case 500b has an opening 500cB on one plane substantially orthogonal to the optical axis X, and an opening 500cC on the side surface on the exhaust port 200 side. The opening 500 cB faces the heat sink 308 , and the opening 500 cC allows the air inside the cooling fan 500 to pass through the exhaust port 200 . The other plane substantially perpendicular to the optical axis X faces the supporting member 501 .

The cooling fan 500 is connected to the circuit group 306 through the circuit board 305 by a flexible wiring board (not shown). The cooling fan 500 rotates the fan 500a by drive control of the circuit group 306, sucks the air in the housing 101 from the opening 500cB, and exhausts it out of the housing 101 from the opening 500cC through the exhaust port 200.

The support member 501 is substantially L-shaped, and fixes and supports the heat sink 308 . Further, the support member 501 is fixed to the bottom plate portion 101C of the housing 101 in the vicinity of the exhaust port 200 and shields air from leaking from the intake port 103 to the exhaust port 200 . As a result, the support member 501 forms a part of the flow path of the air sucked from the intake port 103 together with the heat dissipation sheet 303A and the inner wall surface of the housing 101, and guides the air to the imaging device 301B.

FIG. 6 is an explanatory diagram showing the flow of air inside the imaging device 100 according to the second embodiment. In FIG. 6 , thick black arrows indicate the flow of air and the channels formed in the housing 101 . When the cooling fan 500 is driven to rotate the fan 500 a , the air outside the housing 101 is sucked into the housing 101 through the intake port 103 .

Air sucked from the intake port 103 passes through a gap (flow path) formed by the heat sink 304A and the wide-angle lens 102A, and passes through a gap between the heat dissipation sheet 303A and the support member 501. FIG. Since heat from the imaging device 301A is transferred to the radiation sheet 303A and the heat sink 304A, the imaging device 301A is cooled.

The air guided by the support member 501 and the inner wall surface of the upper plate portion 101D contacts the heat sink 304B, the gap between the heat dissipation sheet 303B and the battery case 310, the gap between the heat sink 304B and the battery case 310, and the gap between the battery case 310 and the battery case 310. It passes through the gap between the bottom plate portion 101C of the housing 101 and the inner wall surface. Heat from the imaging device 301B is transferred to the heat radiation sheet 303B and the heat sink 304B, thereby cooling the imaging device 301B. The air then cools the heat sink 308 , the circuit board 305 and the circuit group 306 .

The air that has cooled the circuit board 305 and the circuit group 306 is sucked into the storage case 500b through the opening 500cB and is discharged out of the housing 101 through the exhaust port 200 through the opening 500cC. As described above, the other imaging elements 301A (heat radiation sheet 303A) and 301B (heat radiation sheet 303B) do not exist while the air that has cooled the heat radiation plate 308, the circuit board 305, and the circuit group 306 flows to the exhaust port 200. . Such a configuration improves the cooling efficiency of the circuit group 306 and the imaging element 301B. By improving the cooling efficiency in this way, it is possible to reduce the influence of noise on image data caused by heat generation.

Regarding the flow path of air from the intake port 103 to the exhaust port 200, if the air flow cools in the order of the image sensor 301A→the image sensor 301B→the circuit group 306, the arrangement of the intake port 103 and the exhaust port 200 The numbers are not limited to those in FIGS.

Also, the rechargeable battery 309, the circuit board 305, the circuit group 306, and the cooling fan 500 are arranged between the imaging elements 301A and 301B. The circuitry 306 as well as the cooling fan 500 may be arranged such that their longitudinal directions extend along the optical axis-X.

Further, in the above-described embodiment, the configuration in which the cooling fans 300 and 500 are built in the imaging device 100 has been described, but the cooling fans 300 and 500 may not be built in. For example, an intake type external fan as described in the first and second embodiments may be attached near the exhaust port. In this way, when the attached external fan takes in air. Air is taken in from the intake port, and the heat source can be cooled as in the first and second embodiments.

In addition, the present invention is not limited to the above contents, and may be arbitrarily combined. Other aspects conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

Reference Signs List 100 imaging device 101 housing 102A, 102B wide-angle lens 103 intake port 200 exhaust port 300,500 cooling fan 301A, 301B imaging element 306 circuit group

Claims (10)

a housing having an intake port and an exhaust port;
a first imaging element arranged in the housing;
a second imaging element arranged further away from the intake port than the first imaging element in the housing;
arranged between the first imaging element and the second imaging element in the housing, performing image processing based on electrical signals from the first imaging element and the second imaging element, and performing the first imaging an image processing unit that generates a larger amount of heat than the device and the second imaging device;
a cooling fan disposed between either one of the first imaging element or the second imaging element and the image processing unit, for inhaling air from the intake port and exhausting air from the exhaust port;
The cooling fan is arranged in the housing at a position closer to the exhaust port than the first imaging device, the second imaging device, and the image processing unit, and sucks air from the intake port and exhausts air from the exhaust port. , imaging device. The imaging device according to claim 1,
The image pickup device, wherein the second image pickup device is arranged at a position in the housing spaced apart from the first image pickup device by a predetermined distance. The imaging device according to claim 1 or 2,
The imaging device, wherein the cooling fan is arranged between the second imaging element and the image processing section, sucks air from each of the second imaging element and the image processing section, and exhausts the air from the exhaust port. The imaging device according to claim 1 or 2,
The imaging device, wherein the cooling fan is arranged to face the image processing unit, and sucks air from the image processing unit and exhausts the air from the exhaust port. a housing having an intake port and an exhaust port;
a first imaging element arranged in the housing;
a second imaging element arranged in the housing;
arranged between the first imaging element and the second imaging element in the housing, performing image processing based on electrical signals from the first imaging element and the second imaging element, and performing the first imaging an image processing unit that generates a larger amount of heat than the device and the second imaging device;
a cooling fan disposed between either one of the first imaging device or the second imaging device and the image processing unit, for sucking air from the intake port and exhausting the air from the exhaust port;
The housing has a structure having an air flow path from the intake port to the exhaust port inside,
The cooling fan is disposed between the second imaging device and the image processing unit, and is configured to direct air passing through the first imaging device from the intake port along the flow path to the second imaging device and the image processing unit. An image pickup apparatus that sucks air from each of the processing units and exhausts air from the exhaust port. a housing having an intake port and an exhaust port;
a first imaging element arranged in the housing;
a second imaging element arranged in the housing;
arranged between the first imaging element and the second imaging element in the housing, performing image processing based on electrical signals from the first imaging element and the second imaging element, and performing the first imaging an image processing unit that generates a larger amount of heat than the device and the second imaging device;
a cooling fan disposed between either one of the first imaging device or the second imaging device and the image processing unit, for sucking air from the intake port and exhausting the air from the exhaust port;
The housing has a structure having an air flow path from the intake port to the exhaust port inside,
The cooling fan is arranged to face the image processing section and directs the air passing through the air inlet from the air inlet to the first imaging element, the second imaging element, and the image processing section in this order along the flow path to the image processing section. An imaging device that takes in air from and exhausts air from the exhaust port. The imaging device according to any one of claims 1 to 6,
a first lens that is provided in the housing so as to be exposed from the housing and that receives light from outside the housing and emits the light to the first imaging element;
The second lens is provided in the housing so as to be exposed from the housing in a direction opposite to the direction in which the first lens is exposed, and receives light from outside the housing and emits it to the second imaging element. having a lens and
The first imaging element converts light from the first lens into an electrical signal,
The imaging device, wherein the second imaging element converts light from the second lens into an electrical signal. The imaging device according to claim 7,
An imaging device, wherein at least one of the first lens and the second lens has an angle of view of 180 degrees or more. The imaging device according to claim 8,
The imaging device, wherein the image processing unit generates image data of an omnidirectional image by combining images obtained from the first imaging element and the second imaging element. The imaging device according to claim 7 or 8,
The imaging device, wherein the cooling fan is arranged on the optical axis of the first lens and the second lens.

Images