JP7205685B2 - Coating composition containing cycloaliphatic epoxy compound - Google Patents
Coating composition containing cycloaliphatic epoxy compound Download PDFInfo
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- JP7205685B2 JP7205685B2 JP2018182153A JP2018182153A JP7205685B2 JP 7205685 B2 JP7205685 B2 JP 7205685B2 JP 2018182153 A JP2018182153 A JP 2018182153A JP 2018182153 A JP2018182153 A JP 2018182153A JP 7205685 B2 JP7205685 B2 JP 7205685B2
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- 150000001875 compounds Chemical class 0.000 title claims description 72
- 239000008199 coating composition Substances 0.000 title claims description 59
- 239000004593 Epoxy Substances 0.000 title claims description 56
- -1 acryloxy groups Chemical group 0.000 claims description 206
- 239000002245 particle Substances 0.000 claims description 164
- 239000002131 composite material Substances 0.000 claims description 87
- 229910044991 metal oxide Inorganic materials 0.000 claims description 61
- 150000004706 metal oxides Chemical class 0.000 claims description 61
- 229910052710 silicon Inorganic materials 0.000 claims description 52
- 125000002723 alicyclic group Chemical group 0.000 claims description 42
- 229910052719 titanium Inorganic materials 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 claims description 28
- 239000011248 coating agent Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 25
- 239000002253 acid Substances 0.000 claims description 22
- 229910000077 silane Inorganic materials 0.000 claims description 19
- 229910052726 zirconium Inorganic materials 0.000 claims description 19
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910052727 yttrium Inorganic materials 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 229910052787 antimony Inorganic materials 0.000 claims description 12
- 229910052750 molybdenum Inorganic materials 0.000 claims description 12
- 229910052758 niobium Inorganic materials 0.000 claims description 12
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 125000002947 alkylene group Chemical group 0.000 claims description 11
- 229910052738 indium Inorganic materials 0.000 claims description 11
- 229910052725 zinc Inorganic materials 0.000 claims description 11
- 239000011247 coating layer Substances 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000000962 organic group Chemical group 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 125000004429 atom Chemical group 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 239000011164 primary particle Substances 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 5
- 229910018540 Si C Inorganic materials 0.000 claims description 4
- 125000004423 acyloxy group Chemical group 0.000 claims description 4
- 125000000732 arylene group Chemical group 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 claims description 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 108
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 68
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 51
- 239000010408 film Substances 0.000 description 45
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 37
- 239000010703 silicon Substances 0.000 description 37
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 34
- 239000010936 titanium Substances 0.000 description 30
- 238000002296 dynamic light scattering Methods 0.000 description 28
- 239000006185 dispersion Substances 0.000 description 26
- 239000000243 solution Substances 0.000 description 26
- 229910006404 SnO 2 Inorganic materials 0.000 description 25
- 229910001928 zirconium oxide Inorganic materials 0.000 description 24
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 23
- 238000002360 preparation method Methods 0.000 description 23
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 19
- 239000000126 substance Substances 0.000 description 19
- 238000011156 evaluation Methods 0.000 description 18
- 238000003860 storage Methods 0.000 description 17
- 125000005375 organosiloxane group Chemical group 0.000 description 16
- 239000002904 solvent Substances 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 15
- 150000003961 organosilicon compounds Chemical class 0.000 description 15
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 14
- 229910004298 SiO 2 Inorganic materials 0.000 description 14
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 14
- 238000003756 stirring Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 230000007062 hydrolysis Effects 0.000 description 12
- 238000006460 hydrolysis reaction Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 229910010413 TiO 2 Inorganic materials 0.000 description 8
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 150000004756 silanes Chemical class 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000006641 stabilisation Effects 0.000 description 7
- 238000011105 stabilization Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000010538 cationic polymerization reaction Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 229920001429 chelating resin Polymers 0.000 description 5
- 239000007771 core particle Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 150000003377 silicon compounds Chemical class 0.000 description 5
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- OJGMBLNIHDZDGS-UHFFFAOYSA-N N-Ethylaniline Chemical compound CCNC1=CC=CC=C1 OJGMBLNIHDZDGS-UHFFFAOYSA-N 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- 150000004714 phosphonium salts Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 4
- 238000000108 ultra-filtration Methods 0.000 description 4
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- PAPNRQCYSFBWDI-UHFFFAOYSA-N DMP Natural products CC1=CC=C(C)N1 PAPNRQCYSFBWDI-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000012662 bulk polymerization Methods 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003729 cation exchange resin Substances 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 239000002612 dispersion medium Substances 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 150000003608 titanium Chemical class 0.000 description 3
- OXHNLMTVIGZXSG-UHFFFAOYSA-N 1-Methylpyrrole Chemical compound CN1C=CC=C1 OXHNLMTVIGZXSG-UHFFFAOYSA-N 0.000 description 2
- HPYNZHMRTTWQTB-UHFFFAOYSA-N 2,3-dimethylpyridine Chemical compound CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- FZXRXKLUIMKDEL-UHFFFAOYSA-N 2-Methylpropyl propanoate Chemical compound CCC(=O)OCC(C)C FZXRXKLUIMKDEL-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 2
- JJYPMNFTHPTTDI-UHFFFAOYSA-N 3-methylaniline Chemical compound CC1=CC=CC(N)=C1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- AFBPFSWMIHJQDM-UHFFFAOYSA-N N-methylaniline Chemical compound CNC1=CC=CC=C1 AFBPFSWMIHJQDM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 239000004147 Sorbitan trioleate Substances 0.000 description 2
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- HOPRXXXSABQWAV-UHFFFAOYSA-N anhydrous collidine Natural products CC1=CC=NC(C)=C1C HOPRXXXSABQWAV-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Inorganic materials O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000006165 cyclic alkyl group Chemical group 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- AUYOHNUMSAGWQZ-UHFFFAOYSA-L dihydroxy(oxo)tin Chemical compound O[Sn](O)=O AUYOHNUMSAGWQZ-UHFFFAOYSA-L 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 2
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 2
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 2
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- AOGQPLXWSUTHQB-UHFFFAOYSA-N hexyl acetate Chemical compound CCCCCCOC(C)=O AOGQPLXWSUTHQB-UHFFFAOYSA-N 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 238000010335 hydrothermal treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052809 inorganic oxide Inorganic materials 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- RGFNRWTWDWVHDD-UHFFFAOYSA-N isobutyl butyrate Chemical compound CCCC(=O)OCC(C)C RGFNRWTWDWVHDD-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- YSGBMDFJWFIEDF-UHFFFAOYSA-N methyl 2-hydroxy-3-methylbutanoate Chemical compound COC(=O)C(O)C(C)C YSGBMDFJWFIEDF-UHFFFAOYSA-N 0.000 description 2
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 2
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 2
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- CMSYDJVRTHCWFP-UHFFFAOYSA-N triphenylphosphane;hydrobromide Chemical compound Br.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 CMSYDJVRTHCWFP-UHFFFAOYSA-N 0.000 description 1
- AVCVDUDESCZFHJ-UHFFFAOYSA-N triphenylphosphane;hydrochloride Chemical compound [Cl-].C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 AVCVDUDESCZFHJ-UHFFFAOYSA-N 0.000 description 1
- VMJFYMAHEGJHFH-UHFFFAOYSA-M triphenylsulfanium;bromide Chemical compound [Br-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 VMJFYMAHEGJHFH-UHFFFAOYSA-M 0.000 description 1
- ZFEAYIKULRXTAR-UHFFFAOYSA-M triphenylsulfanium;chloride Chemical compound [Cl-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ZFEAYIKULRXTAR-UHFFFAOYSA-M 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- WUKMCKCDYKBLBG-UHFFFAOYSA-N tris(4-methoxyphenyl)sulfanium Chemical compound C1=CC(OC)=CC=C1[S+](C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 WUKMCKCDYKBLBG-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
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Description
熱硬化や光硬化が可能な有機無機複合成分を用いたコーティング組成物及びそれを光学部材に関する。 The present invention relates to a coating composition using an organic-inorganic composite component that can be heat-cured or photo-cured, and to an optical member using the same.
コーティング組成物が被覆された基材は例えば光学部材、機械部品材料、電子部品材料、建築材料、成形材料等の種々の分野に適用される。適用される用途によっては、それら被覆された基材が屈折率、硬度、密着性、透明性、耐光性が要求される。また被覆するためのコート液は保存安定性が要求される。 Substrates coated with the coating composition are applied to various fields such as optical members, mechanical component materials, electronic component materials, building materials, and molding materials. Refractive index, hardness, adhesion, transparency, and light resistance are required for the coated substrate depending on the application. Also, the coating liquid for coating is required to have storage stability.
例えば、有機樹脂成分と無機微粒子とを含む有機無機複合樹脂組成物であって、無機微粒子成分が溶液中に分散させたときの25℃におけるpHが酸性域からアルカリ域までとなる無機微粒子を含む有機無機複合樹脂組成物が開示されている(特許文献1参照)。 For example, an organic-inorganic composite resin composition containing an organic resin component and inorganic fine particles, which contains inorganic fine particles whose pH at 25° C. ranges from an acidic range to an alkaline range when the inorganic fine particle component is dispersed in a solution. An organic-inorganic composite resin composition has been disclosed (see Patent Document 1).
脂環式エポキシ基を側鎖に有する環状シロキサンと、平均粒子径1~500nmの無機酸化物微粒子と、溶解可能な光酸発生剤を含有する硬質保護被膜形成用光硬化性コーティング剤が開示されている(特許文献2参照)。 A photocurable coating agent for forming a hard protective film is disclosed which contains a cyclic siloxane having an alicyclic epoxy group in its side chain, inorganic oxide fine particles having an average particle size of 1 to 500 nm, and a soluble photoacid generator. (see Patent Document 2).
本発明は熱硬化や光硬化が可能であり、屈折率、硬度、密着性、透明性、耐光性が要求される被覆基材を形成するために保存安定性が向上したコーティング組成物を提供する。 The present invention provides a coating composition that can be heat-cured or photo-cured and has improved storage stability for forming coated substrates that require refractive index, hardness, adhesion, transparency, and light resistance. .
本願発明は第1観点として、2nm~100nmの平均粒子径を有し、且つ式(1a)及び/又は式(1b)の加水分解性シランを含む加水分解性シランで表面被覆した金属酸化物粒子(A)と、式(2)の脂環式エポキシ化合物(B)とを含むコーティング組成物であって、式(1a)及び/又は式(1b)の加水分解性シランが:
~3の整数を示し、dは0~3の整数を示し、eは0又は1の整数を示す。)であり、式(2)の脂環式エポキシ化合物が:
第2観点として、式(2)中、R3のエポキシシクロアルキル基が、エポキシシクロヘキシル基である第1観点に記載のコーティング組成物、
第3観点として、金属酸化物粒子(A)が、2~100nmの平均粒子径を有し、且つTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属の酸化物又は複合酸化物(a1)である第1観点又は第2観点に記載のコーティング組成物、
第4観点として、金属酸化物粒子(A)が、2~100nmの平均粒子径を有し、且つTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属の酸化物又は複合酸化物(a1)を核として、その表面を1~40nmの平均一次粒子径を有し、且つTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属の酸化物又は複合酸化物(a2)から成る少なくとも1層で被覆した金属酸化物粒子(A)であって、(a1)からなる粒子と(a2)からなる層は金属成分が異なるか又は複合酸化物として異なり、最外層に被覆された(a2)は金属成分としてSiを含んでいるものである第1観点乃至第3観点の何れか一つに記載のコーティング組成物、
第5観点として、金属酸化物粒子(A)が、(a1)からなる粒子に、(a2)からなる被覆層が形成されたものである第4観点に記載のコーティング組成物、
第6観点として、金属酸化物粒子(A)が、(a1)からなる粒子に、(a2)からなる中間層と、(a2)からなる被覆層が形成されたものである第4観点に記載のコーティング組成物、
第7観点として、更に式(3)の非脂環式エポキシ化合物(C):
第8観点として、更に熱酸発生剤及び/又は光酸発生剤を含む第1観点乃至第7観点の何
れか一つに記載のコーティング組成物、
第9観点として、更にクエンチャーとしてアミン化合物を含有する第1観点乃至第8観点の何れか一つに記載のコーティング組成物、
第10観点として、更に界面活性剤を含む第1観点乃至第9観点の何れか一つに記載のコーティング組成物、
第11観点として、基板上に第1観点乃至第10観点のいずれか一つに記載のコーティング組成物で被覆する被覆基板の製造方法、及び
第12観点として、第1観点乃至第10観点のいずれか一つに記載のコーティング組成物で被覆された基材である。
As a first aspect of the present invention, metal oxide particles having an average particle diameter of 2 nm to 100 nm and surface-coated with a hydrolyzable silane containing a hydrolyzable silane of formula (1a) and/or formula (1b) A coating composition comprising (A) and a cycloaliphatic epoxy compound (B) of formula (2), wherein the hydrolyzable silane of formula (1a) and/or formula (1b) is:
represents an integer of ˜3, d represents an integer of 0 to 3, and e represents an integer of 0 or 1. ) and the cycloaliphatic epoxy compound of formula (2) is:
As a second aspect, the coating composition according to the first aspect, wherein in formula (2), the epoxycycloalkyl group of R 3 is an epoxycyclohexyl group;
As a third aspect, the metal oxide particles (A) have an average particle diameter of 2 to 100 nm and are Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo, The coating according to the first aspect or the second aspect, which is an oxide or composite oxide (a1) of at least one metal selected from the group consisting of In, Ta, Pb, Bi, Hf, Ge, Ce and W. Composition,
As a fourth aspect, the metal oxide particles (A) have an average particle diameter of 2 to 100 nm, and Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo, With an oxide or composite oxide (a1) of at least one metal selected from the group consisting of In, Ta, Pb, Bi, Hf, Ge, Ce and W as a nucleus, the surface thereof has an average primary thickness of 1 to 40 nm. from the group consisting of Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo, In, Ta, Pb, Bi, Hf, Ge, Ce, W Metal oxide particles (A) coated with at least one layer of at least one selected metal oxide or composite oxide (a2), wherein the particles consist of (a1) and the layer consists of (a2) The coating according to any one of the first to third aspects, wherein the metal component is different or different as a composite oxide, and (a2) coated on the outermost layer contains Si as a metal component Composition,
As a fifth aspect, the coating composition according to the fourth aspect, wherein the metal oxide particles (A) are particles of (a1) on which a coating layer of (a2) is formed;
As a sixth aspect, described in the fourth aspect, wherein the metal oxide particles (A) are particles of (a1) on which an intermediate layer of (a2) and a coating layer of (a2) are formed. a coating composition of
As a seventh aspect, further non-alicyclic epoxy compound (C) of formula (3):
As an eighth aspect, the coating composition according to any one of the first to seventh aspects, further comprising a thermal acid generator and/or a photoacid generator;
As a ninth aspect, the coating composition according to any one of the first aspect to the eighth aspect, further containing an amine compound as a quencher;
As a tenth aspect, the coating composition according to any one of the first to ninth aspects, further comprising a surfactant;
As an eleventh aspect, a method for producing a coated substrate in which a substrate is coated with the coating composition according to any one of the first to tenth aspects, and as a twelfth aspect, any one of the first to tenth aspects A substrate coated with a coating composition according to any one.
本発明は式(1a)及び/又は式(1b)の加水分解性シラン化合物を含む加水分解性シランで表面被覆した金属酸化物粒子(A)と、式(2)の脂環式エポキシ化合物(B)とを含むコーティング組成物である。 The present invention provides metal oxide particles (A) surface-coated with a hydrolyzable silane containing a hydrolyzable silane compound of formula (1a) and/or formula (1b), and an alicyclic epoxy compound of formula (2) ( B).
金属酸化物粒子(A)は屈折率調整の為に屈折率に応じて種々の金属成分からなる酸化物又は複合酸化物とするが、金属酸化物によっては一様に溶剤への分散が困難な場合がある。溶剤への分散性を向上させるため金属酸化物粒子表面を溶剤の親疎水に合わせて有機官能基を導入する事で分散性を向上させる事ができる。有機官能基の導入は加水分解性シラン化合物、例えばシランカップリング剤を用いることで達成する事ができる。加水分解性シランは加水分解性基が加水分解によって生じたシラノール基を金属粒子表面のヒドロキシル基との間で、M-O-Si結合を形成し(Mは金属)、金属酸化物粒子を被覆する事ができる。例えば3個の加水分解性基を有するシランカップリング剤では、少なくとも1個の加水分解によって生じたシラノール基が、金属粒子表面でヒドロキシル基と反応するものである。シランカップリング剤の3個の加水分解性基の全てが加水分解によって金属表面のヒドロキシル基と結合する事も、金属粒子表面のヒドロキシル基と反応しない状態で存在する事もある。 The metal oxide particles (A) are oxides or composite oxides composed of various metal components depending on the refractive index in order to adjust the refractive index. Sometimes. In order to improve the dispersibility in the solvent, it is possible to improve the dispersibility by introducing an organic functional group to the surface of the metal oxide particles in accordance with the hydrophilicity/hydrophobicity of the solvent. Introduction of organic functional groups can be achieved by using a hydrolyzable silane compound, such as a silane coupling agent. The hydrolyzable silane forms a MO-Si bond (M is a metal) between the silanol group generated by hydrolysis of the hydrolyzable group and the hydroxyl group on the surface of the metal particle, and coats the metal oxide particle. can do For example, in a silane coupling agent having three hydrolyzable groups, at least one hydrolyzed silanol group reacts with a hydroxyl group on the metal particle surface. All three hydrolyzable groups of the silane coupling agent may be bonded to the hydroxyl groups on the surface of the metal by hydrolysis, or may exist without reacting with the hydroxyl groups on the surface of the metal particles.
式(2)の脂環式エポキシ化合物は環状シロキサン構造を有する脂環式エポキシ化合物である。環状シロキサン構造を有する事で耐熱性が高く、金属酸化物粒子との相溶性が高い。また、脂環式エポキシ構造を有する事で低粘度で取り扱い性が高く、硬化物に透明性と耐熱性を与える事ができる。また、カチオン硬化性も高い。 The alicyclic epoxy compound of formula (2) is an alicyclic epoxy compound having a cyclic siloxane structure. Having a cyclic siloxane structure provides high heat resistance and high compatibility with metal oxide particles. In addition, since it has an alicyclic epoxy structure, it has low viscosity and high handleability, and can impart transparency and heat resistance to the cured product. It also has high cationic curability.
式(1a)及び/又は式(1b)の加水分解性シラン化合物で表面被覆した金属酸化物粒子(A)と、式(2)の脂環式エポキシ化合物(B)とを含むコーティング組成物は、安定性が高くコーティング剤に適するものである。 A coating composition comprising metal oxide particles (A) surface-coated with a hydrolyzable silane compound of formula (1a) and/or formula (1b) and an alicyclic epoxy compound (B) of formula (2) , is highly stable and suitable for coating agents.
本発明は2nm~100nmの平均粒子径を有し、且つ式(1a)及び/又は式(1b)の加水分解性シランを含む加水分解性シランで表面被覆した金属酸化物粒子(A)と、式(2)の脂環式エポキシ化合物(B)とを含むコーティング組成物である。 The present invention provides metal oxide particles (A) having an average particle size of 2 nm to 100 nm and surface-coated with a hydrolyzable silane containing a hydrolyzable silane of formula (1a) and/or formula (1b); A coating composition comprising an alicyclic epoxy compound (B) of formula (2).
本発明のコーティング組成物は上記成分以外に溶剤を含み、そして任意成分として熱酸発生剤、光酸発生剤、クエンチャー、界面活性剤等を含むことができる。 The coating composition of the present invention contains a solvent in addition to the above components, and may optionally contain thermal acid generators, photoacid generators, quenchers, surfactants and the like.
本発明のコーティング組成物は固形分として0.1~60質量%、又は1~50質量%、10~45質量%である。ここで固形分とはコーティング組成物の全成分から溶剤成分を除いたものである。 The coating composition of the present invention has a solids content of 0.1 to 60% by weight, or 1 to 50% by weight, or 10 to 45% by weight. Here, the solid content is the total components of the coating composition excluding the solvent component.
式(1a)及び/又は式(1b)の加水分解性シラン化合物は、R1及びR11はアク
リロキシ基、メタクリロキシ基、アリール基、アルキル基、グリシドキシ基、ウレイド基又はそれら官能基を含む炭素原子数1~10のアルキレン基を含み、Si原子にSi-C結合で結合しているものであり、R2及びR12はアルコキシ基、アシルオキシ基、又はハロゲン基からなる加水分解基であり少なくとも1つのR2の加水分解基は金属酸化物粒子表面でM-O-Siの結合を形成し、MはTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属を示し、Yはアルキレン基、アリーレン基、NH基、又は酸素原子を示す。aは1~3の整数を示し、dは0~3の整数を示し、eは0又は1の整数を示す。
In the hydrolyzable silane compound of formula (1a) and/or formula (1b), R 1 and R 11 are acryloxy groups, methacryloxy groups, aryl groups, alkyl groups, glycidoxy groups, ureido groups, or carbon atoms containing these functional groups. It contains 1 to 10 alkylene groups and is bonded to the Si atom via a Si — C bond; The hydrolyzable groups of two R2 form MO-Si bonds on the metal oxide particle surface, where M is Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo , In, Ta, Pb, Bi, Hf, Ge, Ce, and W, and Y represents an alkylene group, an arylene group, an NH group, or an oxygen atom. a represents an integer of 1 to 3, d represents an integer of 0 to 3, and e represents an integer of 0 or 1.
金属酸化物粒子(A)の表面被覆に用いられる加水分解性シランは、式(1a)の加水分解性シラン及び/又は式(1b)の加水分解性シランを含むことができる。式(1a)の加水分解性シラン、式(1b)の加水分解性シランは、更に他の加水分解性シランを併用する事が可能であり、式(1a)の加水分解性シラン及び/又は式(1b)の加水分解性シラン:他の加水分解性シランの重量比は、1:0.1~1.0、又は1:0.5~1.0の範囲で用いる事ができる。 The hydrolyzable silanes used for surface coating the metal oxide particles (A) can comprise hydrolyzable silanes of formula (1a) and/or hydrolyzable silanes of formula (1b). The hydrolyzable silane of the formula (1a) and the hydrolyzable silane of the formula (1b) can be used in combination with other hydrolyzable silanes. The weight ratio of hydrolyzable silane (1b) to other hydrolyzable silanes can be in the range of 1:0.1 to 1.0, or 1:0.5 to 1.0.
金属酸化物粒子(A)の表面被覆量は、金属酸化物粒子表面に被覆されるシラン化合物の数として0.1個/nm2~3.0個/nm2、又は0.3個/nm2~1.5個/nm2、の範囲で用いる事ができる。 The surface coating amount of the metal oxide particles (A) is 0.1/nm 2 to 3.0/nm 2 or 0.3/nm as the number of silane compounds coated on the surface of the metal oxide particles. It can be used in the range of 2 to 1.5/nm 2 .
上記アルキル基は炭素原子数1~10のアルキル基であり、例えばメチル基、エチル基、n-プロピル基、i-プロピル基、シクロプロピル基、n-ブチル基、i-ブチル基、s-ブチル基、t-ブチル基、シクロブチル基、1-メチル-シクロプロピル基、2-メチル-シクロプロピル基、n-ペンチル基、1-メチル-n-ブチル基、2-メチル-n-ブチル基、3-メチル-n-ブチル基、1,1-ジメチル-n-プロピル基、1,2-ジメチル-n-プロピル基、2,2-ジメチル-n-プロピル基、1-エチル-n-プロピル基、シクロペンチル基、1-メチル-シクロブチル基、2-メチル-シクロブチル基、3-メチル-シクロブチル基、1,2-ジメチル-シクロプロピル基、2,3-ジメチル-シクロプロピル基、1-エチル-シクロプロピル基、2-エチル-シクロプロピル基、n-ヘキシル基、1-メチル-n-ペンチル基、2-メチル-n-ペンチル基、3-メチル-n-ペンチル基、4-メチル-n-ペンチル基、1,1-ジメチル-n-ブチル基、1,2-ジメチル-n-ブチル基、1,3-ジメチル-n-ブチル基、2,2-ジメチル-n-ブチル基、2,3-ジメチル-n-ブチル基、3,3-ジメチル-n-ブチル基、1-エチル-n-ブチル基、2-エチル-n-ブチル基、1,1,2-トリメチル-n-プロピル基、1,2,2-トリメチル-n-プロピル基、1-エチル-1-メチル-n-プロピル基、1-エチル-2-メチル-n-プロピル基、シクロヘキシル基、1-メチル-シクロペンチル基、2-メチル-シクロペンチル基、3-メチル-シクロペンチル基、1-エチル-シクロブチル基、2-エチル-シクロブチル基、3-エチル-シクロブチル基、1,2-ジメチル-シクロブチル基、1,3-ジメチル-シクロブチル基、2,2-ジメチル-シクロブチル基、2,3-ジメチル-シクロブチル基、2,4-ジメチル-シクロブチル基、3,3-ジメチル-シクロブチル基、1-n-プロピル-シクロプロピル基、2-n-プロピル-シクロプロピル基、1-i-プロピル-シクロプロピル基、2-i-プロピル-シクロプロピル基、1,2,2-トリメチル-シクロプロピル基、1,2,3-トリメチル-シクロプロピル基、2,2,3-トリメチル-シクロプロピル基、1-エチル-2-メチル-シクロプロピル基、2-エチル-1-メチル-シクロプロピル基、2-エチル-2-メチル-シクロプロピル基及び2-エチル-3-メチル-シクロプロピル基等が挙げられる。 The above alkyl group is an alkyl group having 1 to 10 carbon atoms, such as methyl group, ethyl group, n-propyl group, i-propyl group, cyclopropyl group, n-butyl group, i-butyl group, s-butyl group. group, t-butyl group, cyclobutyl group, 1-methyl-cyclopropyl group, 2-methyl-cyclopropyl group, n-pentyl group, 1-methyl-n-butyl group, 2-methyl-n-butyl group, 3 -methyl-n-butyl group, 1,1-dimethyl-n-propyl group, 1,2-dimethyl-n-propyl group, 2,2-dimethyl-n-propyl group, 1-ethyl-n-propyl group, cyclopentyl group, 1-methyl-cyclobutyl group, 2-methyl-cyclobutyl group, 3-methyl-cyclobutyl group, 1,2-dimethyl-cyclopropyl group, 2,3-dimethyl-cyclopropyl group, 1-ethyl-cyclopropyl group, 2-ethyl-cyclopropyl group, n-hexyl group, 1-methyl-n-pentyl group, 2-methyl-n-pentyl group, 3-methyl-n-pentyl group, 4-methyl-n-pentyl group , 1,1-dimethyl-n-butyl group, 1,2-dimethyl-n-butyl group, 1,3-dimethyl-n-butyl group, 2,2-dimethyl-n-butyl group, 2,3-dimethyl -n-butyl group, 3,3-dimethyl-n-butyl group, 1-ethyl-n-butyl group, 2-ethyl-n-butyl group, 1,1,2-trimethyl-n-propyl group, 1, 2,2-trimethyl-n-propyl group, 1-ethyl-1-methyl-n-propyl group, 1-ethyl-2-methyl-n-propyl group, cyclohexyl group, 1-methyl-cyclopentyl group, 2-methyl -cyclopentyl group, 3-methyl-cyclopentyl group, 1-ethyl-cyclobutyl group, 2-ethyl-cyclobutyl group, 3-ethyl-cyclobutyl group, 1,2-dimethyl-cyclobutyl group, 1,3-dimethyl-cyclobutyl group, 2,2-dimethyl-cyclobutyl group, 2,3-dimethyl-cyclobutyl group, 2,4-dimethyl-cyclobutyl group, 3,3-dimethyl-cyclobutyl group, 1-n-propyl-cyclopropyl group, 2-n- propyl-cyclopropyl group, 1-i-propyl-cyclopropyl group, 2-i-propyl-cyclopropyl group, 1,2,2-trimethyl-cyclopropyl group, 1,2,3-trimethyl-cyclopropyl group, 2,2,3-trimethyl-cyclopropyl group, 1-ethyl-2-methyl-cyclopropyl group, 2-ethyl-1-methyl-cyclopropyl group , 2-ethyl-2-methyl-cyclopropyl group and 2-ethyl-3-methyl-cyclopropyl group.
また、アルキレン基は上述のアルキル基から誘導されるアルキレン基を上げる事ができる。 Further, examples of the alkylene group include alkylene groups derived from the above alkyl groups.
アリール基は例えばフェニル基、ナフチル基、アントリル基等が挙げられ、アリーレン基は上記アリール基から誘導される基であり、フェニレン基、ナフチレン基、アントリレン基等が挙げられる。 The aryl group includes, for example, a phenyl group, a naphthyl group, an anthryl group, and the like, and the arylene group is a group derived from the above aryl group, and includes a phenylene group, a naphthylene group, an anthrylene group, and the like.
上記アルコキシ基は炭素原子数1~10のアルコキシ基が挙げられ、例えばメトキシ基、エトキシ基、n-プロポキシ基、i-プロポキシ基、n-ブトキシ基、i-ブトキシ基、s-ブトキシ基、t-ブトキシ基、n-ペンチロキシ基、1-メチル-n-ブトキシ基、2-メチル-n-ブトキシ基、3-メチル-n-ブトキシ基、1,1-ジメチル-n-プロポキシ基、1,2-ジメチル-n-プロポキシ基、2,2-ジメチル-n-プロポキシ基、1-エチル-n-プロポキシ基、n-ヘキシロキシ基、1-メチル-n-ペンチロキシ基、2-メチル-n-ペンチロキシ基、3-メチル-n-ペンチロキシ基、4-メチル-n-ペンチロキシ基、1,1-ジメチル-n-ブトキシ基、1,2-ジメチル-n-ブトキシ基、1,3-ジメチル-n-ブトキシ基、2,2-ジメチル-n-ブトキシ基、2,3-ジメチル-n-ブトキシ基、3,3-ジメチル-n-ブトキシ基、1-エチル-n-ブトキシ基、2-エチル-n-ブトキシ基、1,1,2-トリメチル-n-プロポキシ基、1,2,2-トリメチル-n-プロポキシ基、1-エチル-1-メチル-n-プロポキシ基及び1-エチル-2-メチル-n-プロポキシ基等が、また環状のアルコキシ基としてはシクロプロポキシ基、シクロブトキシ基、1-メチル-シクロプロポキシ基、2-メチル-シクロプロポキシ基、シクロペンチロキシ基、1-メチル-シクロブトキシ基、2-メチル-シクロブトキシ基、3-メチル-シクロブトキシ基、1,2-ジメチル-シクロプロポキシ基、2,3-ジメチル-シクロプロポキシ基、1-エチル-シクロプロポキシ基、2-エチル-シクロプロポキシ基、シクロヘキシロキシ基、1-メチル-シクロペンチロキシ基、2-メチル-シクロペンチロキシ基、3-メチル-シクロペンチロキシ基、1-エチル-シクロブトキシ基、2-エチル-シクロブトキシ基、3-エチル-シクロブトキシ基、1,2-ジメチル-シクロブトキシ基、1,3-ジメチル-シクロブトキシ基、2,2-ジメチル-シクロブトキシ基、2,3-ジメチル-シクロブトキシ基、2,4-ジメチル-シクロブトキシ基、3,3-ジメチル-シクロブトキシ基、1-n-プロピル-シクロプロポキシ基、2-n-プロピル-シクロプロポキシ基、1-i-プロピル-シクロプロポキシ基、2-i-プロピル-シクロプロポキシ基、1,2,2-トリメチル-シクロプロポキシ基、1,2,3-トリメチル-シクロプロポキシ基、2,2,3-トリメチル-シクロプロポキシ基、1-エチル-2-メチル-シクロプロポキシ基、2-エチル-1-メチル-シクロプロポキシ基、2-エチル-2-メチル-シクロプロポキシ基及び2-エチル-3-メチル-シクロプロポキシ基等が挙げられる。 Examples of the alkoxy group include alkoxy groups having 1 to 10 carbon atoms, such as methoxy, ethoxy, n-propoxy, i-propoxy, n-butoxy, i-butoxy, s-butoxy, t -butoxy group, n-pentyloxy group, 1-methyl-n-butoxy group, 2-methyl-n-butoxy group, 3-methyl-n-butoxy group, 1,1-dimethyl-n-propoxy group, 1,2 -dimethyl-n-propoxy group, 2,2-dimethyl-n-propoxy group, 1-ethyl-n-propoxy group, n-hexyloxy group, 1-methyl-n-pentyloxy group, 2-methyl-n-pentyloxy group , 3-methyl-n-pentyloxy group, 4-methyl-n-pentyloxy group, 1,1-dimethyl-n-butoxy group, 1,2-dimethyl-n-butoxy group, 1,3-dimethyl-n-butoxy group group, 2,2-dimethyl-n-butoxy group, 2,3-dimethyl-n-butoxy group, 3,3-dimethyl-n-butoxy group, 1-ethyl-n-butoxy group, 2-ethyl-n- butoxy group, 1,1,2-trimethyl-n-propoxy group, 1,2,2-trimethyl-n-propoxy group, 1-ethyl-1-methyl-n-propoxy group and 1-ethyl-2-methyl- cyclopropoxy, cyclobutoxy, 1-methyl-cyclopropoxy, 2-methyl-cyclopropoxy, cyclopentyloxy and 1-methyl-cyclobutoxy as cyclic alkoxy groups; , 2-methyl-cyclobutoxy group, 3-methyl-cyclobutoxy group, 1,2-dimethyl-cyclopropoxy group, 2,3-dimethyl-cyclopropoxy group, 1-ethyl-cyclopropoxy group, 2-ethyl-cyclo propoxy group, cyclohexyloxy group, 1-methyl-cyclopentyloxy group, 2-methyl-cyclopentyloxy group, 3-methyl-cyclopentyloxy group, 1-ethyl-cyclobutoxy group, 2-ethyl-cyclobutoxy group, 3-ethyl-cyclobutoxy group, 1,2-dimethyl-cyclobutoxy group, 1,3-dimethyl-cyclobutoxy group, 2,2-dimethyl-cyclobutoxy group, 2,3-dimethyl-cyclobutoxy group, 2, 4-dimethyl-cyclobutoxy group, 3,3-dimethyl-cyclobutoxy group, 1-n-propyl-cyclopropoxy group, 2-n-propyl-cyclopropoxy group, 1-i-propyl-cyclopropoxy group, 2- i-propyl-cyclopropoxy group, 1,2,2-trimethyl Chill-cyclopropoxy group, 1,2,3-trimethyl-cyclopropoxy group, 2,2,3-trimethyl-cyclopropoxy group, 1-ethyl-2-methyl-cyclopropoxy group, 2-ethyl-1-methyl- Cyclopropoxy group, 2-ethyl-2-methyl-cyclopropoxy group, 2-ethyl-3-methyl-cyclopropoxy group and the like.
上記アシルオキシ基は炭素原子数1~10のアシルオキシ基は、例えばメチルカルボニルオキシ基、エチルカルボニルオキシ基、n-プロピルカルボニルオキシ基、i-プロピルカルボニルオキシ基、n-ブチルカルボニルオキシ基、i-ブチルカルボニルオキシ基、s-ブチルカルボニルオキシ基、t-ブチルカルボニルオキシ基、n-ペンチルカルボニルオキシ基、1-メチル-n-ブチルカルボニルオキシ基、2-メチル-n-ブチルカルボニルオキシ基、3-メチル-n-ブチルカルボニルオキシ基、1,1-ジメチル-n-プロピルカルボニルオキシ基、1,2-ジメチル-n-プロピルカルボニルオキシ基、2,2-ジメチル-n-プロピルカルボニルオキシ基、1-エチル-n-プロピルカルボニルオキシ基、n-ヘキシルカルボニルオキシ基、1-メチル-n-ペンチルカルボニルオキシ基、2-メチル-n-ペンチルカルボニルオキシ基、3-メチル-n-ペンチルカルボニルオキシ基、4-メチル-n-ペンチルカルボニルオキシ基、1,1-ジメチル-n-ブチルカルボニルオキシ基、1,2-ジメチル-n-ブチルカルボニルオキシ基、1,3-ジメチル-n-ブチルカルボニルオキシ基、2,2-ジメチル-n-ブチルカルボニルオキシ基、2,3-ジメチル-n-ブチルカルボニルオキシ基、3,3-ジメチル-n-ブチルカルボニルオキシ基、1-エチル-n-ブチルカルボニルオキシ基、2-エチル-n-
ブチルカルボニルオキシ基、1,1,2-トリメチル-n-プロピルカルボニルオキシ基、1,2,2-トリメチル-n-プロピルカルボニルオキシ基、1-エチル-1-メチル-n-プロピルカルボニルオキシ基、1-エチル-2-メチル-n-プロピルカルボニルオキシ基、フェニルカルボニルオキシ基、及びトシルカルボニルオキシ基等が挙げられる。
The acyloxy group having 1 to 10 carbon atoms is, for example, a methylcarbonyloxy group, an ethylcarbonyloxy group, an n-propylcarbonyloxy group, an i-propylcarbonyloxy group, an n-butylcarbonyloxy group, i-butyl carbonyloxy group, s-butylcarbonyloxy group, t-butylcarbonyloxy group, n-pentylcarbonyloxy group, 1-methyl-n-butylcarbonyloxy group, 2-methyl-n-butylcarbonyloxy group, 3-methyl -n-butylcarbonyloxy group, 1,1-dimethyl-n-propylcarbonyloxy group, 1,2-dimethyl-n-propylcarbonyloxy group, 2,2-dimethyl-n-propylcarbonyloxy group, 1-ethyl -n-propylcarbonyloxy group, n-hexylcarbonyloxy group, 1-methyl-n-pentylcarbonyloxy group, 2-methyl-n-pentylcarbonyloxy group, 3-methyl-n-pentylcarbonyloxy group, 4- methyl-n-pentylcarbonyloxy group, 1,1-dimethyl-n-butylcarbonyloxy group, 1,2-dimethyl-n-butylcarbonyloxy group, 1,3-dimethyl-n-butylcarbonyloxy group, 2, 2-dimethyl-n-butylcarbonyloxy group, 2,3-dimethyl-n-butylcarbonyloxy group, 3,3-dimethyl-n-butylcarbonyloxy group, 1-ethyl-n-butylcarbonyloxy group, 2- ethyl-n-
butylcarbonyloxy group, 1,1,2-trimethyl-n-propylcarbonyloxy group, 1,2,2-trimethyl-n-propylcarbonyloxy group, 1-ethyl-1-methyl-n-propylcarbonyloxy group, 1-ethyl-2-methyl-n-propylcarbonyloxy group, phenylcarbonyloxy group, tosylcarbonyloxy group and the like.
上記ハロゲン基としてはフッ素、塩素、臭素、ヨウ素等が挙げられる。 Examples of the halogen group include fluorine, chlorine, bromine and iodine.
上記加水分解性シランは例えば以下の化合物を例示する事ができる。
上記式中R2はアルコキシ基、アシルオキシ基、又はハロゲン基からなる加水分解性基を示す。これらは信越化学工業(株)のシランカップリング剤として入手することができる。 In the above formula, R2 represents a hydrolyzable group consisting of an alkoxy group, an acyloxy group, or a halogen group. These are available as silane coupling agents from Shin-Etsu Chemical Co., Ltd.
式(1b)の化合物にはトリメチルシリル化剤を含むものであり、ヘキサメチルジシラン、ヘキサメチルジシロキサン、ヘキサメチルジシラザン等が挙げられる。これらのシリル化剤は東京化成工業(株)から入手する事ができる。 The compound of formula (1b) contains a trimethylsilylating agent and includes hexamethyldisilane, hexamethyldisiloxane, hexamethyldisilazane and the like. These silylating agents are available from Tokyo Chemical Industry Co., Ltd.
式(2)の脂環式エポキシ化合物はR3はエポキシシクロアルキル基を含む炭素原子数1~10のアルキレン基であり、R4基は水素原子又はメチル基を示し、R3基とR4基はそれぞれ同一のSi原子にSi-C結合又はSi-H結合で結合しているものであり、nは3~5の整数を示す。nは3、4、5の整数が挙げられるが、特に4が好ましい。 In the alicyclic epoxy compound of formula (2), R 3 is an alkylene group having 1 to 10 carbon atoms including an epoxycycloalkyl group, R 4 is a hydrogen atom or a methyl group, and R 3 and R 4 are are bonded to the same Si atom via Si--C bonds or Si--H bonds, and n is an integer of 3-5. Examples of n include integers of 3, 4 and 5, with 4 being particularly preferred.
R3のエポキシシクロアルキル基が、エポキシ環を有する環状アルキル基である。環状アルキル基は単環、多環の環状構造を有する事ができる。例えば、シクロペンチル、シクロヘキシル、ノルボルナン、アダマンタン等が挙げられるが、シクロヘキシル構造が好ましく、R3のエポキシシクロアルキル基がエポキシシクロヘキシル基を用いる事ができる。 The epoxycycloalkyl group of R3 is a cyclic alkyl group having an epoxy ring. Cyclic alkyl groups can have monocyclic and polycyclic ring structures. Examples thereof include cyclopentyl, cyclohexyl, norbornane, adamantane, etc., but a cyclohexyl structure is preferred , and an epoxycyclohexyl group can be used as the epoxycycloalkyl group of R3.
金属酸化物粒子(A)は、2~100nm、又は3~50nmの平均粒子径を有し、且つTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属の酸化物又は複合酸化物(a1)が挙げられる。金属酸化物、又は複合金属酸化物の平均粒子径の値は、動的光散乱法(DLS法)により測定された粒子径が挙げられる。 The metal oxide particles (A) have an average particle diameter of 2 to 100 nm, or 3 to 50 nm, and are composed of Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo, At least one metal oxide or composite oxide (a1) selected from the group consisting of In, Ta, Pb, Bi, Hf, Ge, Ce and W can be used. The value of the average particle size of the metal oxide or composite metal oxide includes the particle size measured by the dynamic light scattering method (DLS method).
例えば、TiO2、SnO2、ZrO2、SiO2、Al2O3、Sb2O5、Fe2O3、CuO、ZnO2、Y2O3、Nb2O5、MoO3、Ta2O5、PbO、Bi2O3、HfO2、In2O3、GeO2、CeO2、WO3、WO3-Sb2O5、WO3-SnO2、SnO2-ZrO2、TiO2-SnO2、SnO2-SiO2、TiO2-ZrO2-SnO2、TiO2-CeO2-SnO2、WO3-SnO2-SiO2等が挙げられる。また、Al2O3、Sb2O5、Fe2O3、CuO、ZnO2、Y2O3、Nb2O5、MoO3、Ta2O5、PbO、Bi2O3、HfO2は不純物として含有することができる。 For example, TiO2 , SnO2 , ZrO2 , SiO2 , Al2O3 , Sb2O5 , Fe2O3 , CuO , ZnO2 , Y2O3 , Nb2O5 , MoO3 , Ta2O 5 , PbO, Bi2O3, HfO2, In2O3, GeO2 , CeO2 , WO3 , WO3 - Sb2O5 , WO3 - SnO2 , SnO2 - ZrO2 , TiO2 - SnO 2 , SnO 2 -SiO 2 , TiO 2 -ZrO 2 -SnO 2 , TiO 2 -CeO 2 -SnO 2 , WO 3 -SnO 2 -SiO 2 and the like. Al 2 O 3 , Sb 2 O 5 , Fe 2 O 3 , CuO, ZnO 2 , Y 2 O 3 , Nb 2 O 5 , MoO 3 , Ta 2 O 5 , PbO, Bi 2 O 3 and HfO 2 It can be contained as an impurity.
金属酸化物粒子(A)が、2~100nm、又は3~50nmの平均粒子径を有し、且つTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属の酸化物又は複合酸化物(a1)を核として、その表面を1~40nm、又は1~20nmの平均一次粒子径を有し、且つTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属の酸化物又は複合酸化物(a2)から成る少なくとも1層で被覆した金属酸化物粒子(A)であって、(a1)からなる粒子と(a2)からなる層は金属成分が異なるか又は複合酸化物として異なり、最外層に被覆された(a2)は金属成分としてSiを含んでいるものを用いる事ができる。また、(a2)は金属成分の不純物として、Al、Fe、Cu、Y、Nb、Mo、Ta、Pb、Bi、Hfを含むことができる。 The metal oxide particles (A) have an average particle diameter of 2 to 100 nm, or 3 to 50 nm, and are Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo, With at least one metal oxide or composite oxide (a1) selected from the group consisting of In, Ta, Pb, Bi, Hf, Ge, Ce, W as a nucleus, the surface thereof has a thickness of 1 to 40 nm, or 1 Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo, In, Ta, Pb, Bi, Hf, Ge, Ce, Metal oxide particles (A) coated with at least one layer of at least one metal oxide or composite oxide (a2) selected from the group consisting of W, the particles consisting of (a1) and ( The layer composed of a2) has different metal components or different composite oxides, and (a2) coated on the outermost layer may contain Si as a metal component. In addition, (a2) can contain Al, Fe, Cu, Y, Nb, Mo, Ta, Pb, Bi, and Hf as impurities of metal components.
金属酸化物粒子(A)は、(a1)からなる粒子に、(a2)からなる被覆層が形成された構造を用いる事ができる。被覆物である金属の酸化物又は複合酸化物(a2)の平均一次粒子径の値は、透過型電子顕微鏡による観察で測定された粒子径が挙げられる。 Metal oxide particles (A) may have a structure in which a coating layer of (a2) is formed on particles of (a1). The value of the average primary particle size of the metal oxide or composite oxide (a2) that is the coating includes the particle size measured by observation with a transmission electron microscope.
また、金属酸化物粒子(A)は、(a1)からなる粒子に、(a2)からなる中間層と、(a2)からなる被覆層が形成された構造を用いる事ができる。金属酸化物コロイド粒子(A)の表面を、(a1)からなる粒子に(a2)からなる粒子で被覆する際、粒子同士の界面の反応によって、得られる変性金属酸化物コロイド粒子(A)の粒子径の値は変化し得る。そのため、変性金属酸化物コロイド粒子(A)の粒子径を透過型電子顕微鏡による観察により測定した平均粒子径で評価した場合には、この値が、金属酸化物コロイド粒子(A)と無機酸化物コロイド粒子(B)の一次粒子径の和に必ずしも一致しないことがある。 The metal oxide particles (A) may have a structure in which an intermediate layer of (a2) and a coating layer of (a2) are formed on particles of (a1). When the surface of the metal oxide colloidal particles (A) is coated with the particles of (a2) on the particles of (a1), the reaction at the interface between the particles causes the modified metal oxide colloidal particles (A) to be obtained. Particle size values can vary. Therefore, when the particle diameter of the modified metal oxide colloidal particles (A) is evaluated by the average particle diameter measured by observation with a transmission electron microscope, this value is the same as that of the metal oxide colloidal particles (A) and the inorganic oxide It may not necessarily match the sum of the primary particle sizes of the colloidal particles (B).
これらの被覆構造を有する複合金属酸化物粒子は、核粒子として、SnO2-ZrO2、TiO2-ZrO2-SnO2を用いて、被覆粒子としてSiO2、SnO2-SiO
2、WO3-SnO2-SiO2等用いる事ができる。
Composite metal oxide particles having these coating structures use SnO 2 —ZrO 2 and TiO 2 —ZrO 2 —SnO 2 as core particles, and SiO 2 and SnO 2 —SiO as coating particles.
2 , WO 3 --SnO 2 --SiO 2 and the like can be used.
核粒子と被覆層からなる粒子の場合、核粒子(a1)と被覆層の粒子(a2)は重量比で、1:0.01~1、または1:0.1~0.5の範囲で用いる事ができる。 In the case of a particle consisting of a core particle and a coating layer, the weight ratio of the core particle (a1) to the coating layer particle (a2) is in the range of 1:0.01 to 1, or 1:0.1 to 0.5. can be used.
また核粒子と中間層と被覆層からなる粒子の場合、核粒子(a1)と中間層の粒子(a2)と被覆層の粒子(a2)は重量比で、1:0.01~1:0.01~1、
又は1:0.1~0.5:0.1~0.5の範囲で用いる事が出来る。
In the case of particles comprising a core particle, an intermediate layer, and a coating layer, the weight ratio of the core particle (a1), the intermediate layer particle (a2), and the coating layer particle (a2) is 1:0.01 to 1:0. .01 to 1,
Alternatively, it can be used in the range of 1:0.1-0.5:0.1-0.5.
金属酸化物粒子(A)は、金属酸化物粒子のコロイド溶液として用いる事ができる。金属酸化物粒子のコロイド溶液(ゾル)は、水性ゾルとして製造されたものを、有機溶剤に溶媒置換して有機溶剤ゾルとして用いることができる。有機溶剤としてはメタノール、エタノール、プロパノール、メチルエチルケトン、プロピレングリコールモノメチルエーテル等の溶剤を用いる事ができる。 The metal oxide particles (A) can be used as a colloidal solution of metal oxide particles. A colloidal solution (sol) of metal oxide particles can be used as an organic solvent sol by substituting an organic solvent for a solution produced as an aqueous sol. Solvents such as methanol, ethanol, propanol, methyl ethyl ketone, and propylene glycol monomethyl ether can be used as the organic solvent.
金属酸化物粒子(A)のシラン化合物による表面処理は、例えば金属酸化物粒子(A)のメタノールゾルに式(1a)及び/又は式(1b)の加水分解性シランを含む加水分解性シランを添加して加水分解と表面被覆を行う事ができる。 The surface treatment of the metal oxide particles (A) with a silane compound is performed, for example, by adding a hydrolyzable silane containing a hydrolyzable silane of formula (1a) and/or formula (1b) to a methanol sol of the metal oxide particles (A). Can be added for hydrolysis and surface coating.
アルコキシシリル基、アシロキシシリル基、又はハロゲン化シリル基の加水分解には、加水分解性基の1モル当たり、0.5~100モル、好ましくは1~10モルの水を用いる。 For hydrolysis of an alkoxysilyl group, acyloxysilyl group or silyl halide group, 0.5 to 100 mol, preferably 1 to 10 mol of water is used per 1 mol of hydrolyzable group.
また、加水分解性基の1モル当たり0.001~10モル、好ましくは0.001~1モルの加水分解触媒を用いることができる。 In addition, 0.001 to 10 mol, preferably 0.001 to 1 mol of hydrolysis catalyst can be used per 1 mol of hydrolyzable group.
加水分解と縮合を行う際の反応温度は、通常20~80℃である。 The reaction temperature for hydrolysis and condensation is usually 20 to 80°C.
加水分解は完全に加水分解を行うことも、部分加水分解することでも良い。即ち、加水分解縮合物中に加水分解物やモノマーが残存していても良い。 The hydrolysis may be a complete hydrolysis or a partial hydrolysis. That is, the hydrolyzate and the monomer may remain in the hydrolyzed condensate.
加水分解し縮合させる際に触媒を用いることができる。加水分解触媒としてはキレート化合物、有機酸、無機酸、有機塩基、又は無機塩基を併用する事ができる。例えば、塩酸水溶液、酢酸、アンモニア水溶液等を用いる事ができる。 A catalyst can be used during the hydrolysis and condensation. A chelate compound, an organic acid, an inorganic acid, an organic base, or an inorganic base can be used in combination as the hydrolysis catalyst. For example, hydrochloric acid aqueous solution, acetic acid, ammonia aqueous solution, etc. can be used.
金属酸化物粒子(A)の含有量は、脂環式エポキシ化合物(B)又は脂環式エポキシ化合物(B)と非脂環式エポキシ化合物(C)の合計量100質量部に対して、10~1000質量部、又は50~500質量部、又は50~300質量部の割合で含有する事ができる。 The content of the metal oxide particles (A) is 10 parts per 100 parts by mass of the total amount of the alicyclic epoxy compound (B) or the alicyclic epoxy compound (B) and the non-alicyclic epoxy compound (C). It can be contained in a ratio of up to 1000 parts by mass, or 50 to 500 parts by mass, or 50 to 300 parts by mass.
式(2)の脂環式エポキシ化合物は以下に例示する事ができる。
これらは信越化学工業(株)製のシラン化合物として入手する事ができる。式(2-1)の化合物は信越化学工業(株)製の商品名KR-470として入手できる。 These are available as silane compounds manufactured by Shin-Etsu Chemical Co., Ltd. The compound of formula (2-1) is available from Shin-Etsu Chemical Co., Ltd. under the trade name KR-470.
本発明では更に式(3)の非脂環式エポキシ化合物(C)を併用する事ができる。非脂環式エポキシ化合物(C)は多官能タイプを用いる事が好ましく、例えば2官能エポキシ化合物、3官能エポキシ化合物を用いる事ができる。 In the present invention, a non-alicyclic epoxy compound (C) of formula (3) can be used in combination. It is preferable to use a polyfunctional type non-alicyclic epoxy compound (C), and for example, a bifunctional epoxy compound and a trifunctional epoxy compound can be used.
式(3)中、Tはm価の炭素原子数1~40の有機基であって、該有機基は飽和又は不飽和であり且つ鎖式、環式、又は縮合環式の炭化水素基であり、mは1~10の整数を示す。 In formula (3), T is an m-valent organic group having 1 to 40 carbon atoms, the organic group being a saturated or unsaturated chain, cyclic, or condensed cyclic hydrocarbon group; Yes, m is an integer from 1 to 10.
非脂環式エポキシ化合物(C)は以下に例示する事ができる。
これらのエポキシ樹脂はナガセケムテックス(株)製のエポキシ化合物として入手する事ができる。式(3-1)の化合物はナガセケムテックス(株)製の商品名EX-321L、式(3-2)の化合物はナガセケムテックス(株)製の商品名EX-212L、式(3-3)の化合物はナガセケムテックス(株)製の商品名EX-212Pとして入手する事ができる。
また、ジャパンエポキシレジン(株)製のエポキシ化合物として入手することができる。式(3-4)の化合物はジャパンエポキシレジン(株)製の商品名エピコート828、式(3-5)の化合物はジャパンエポキシレジン(株)製の商品名YX8000、式(3-6)の化合物はジャパンエポキシレジン(株)製の商品名DME100として入手する事ができる。 Moreover, it can be obtained as an epoxy compound manufactured by Japan Epoxy Resin Co., Ltd. The compound of formula (3-4) is Epicoat 828 (trade name) manufactured by Japan Epoxy Resin Co., Ltd. The compound of formula (3-5) is YX8000 (trade name) of Japan Epoxy Resin Co., Ltd., and the compound of formula (3-6) is The compound is available from Japan Epoxy Resin Co., Ltd. under the trade name of DME100.
エポキシ化合物としては脂環式エポキシ化合物(B)を単独で用いることもできるが、脂環式エポキシ化合物(B)と非脂環式エポキシ化合物(C)を併用する事ができる。 As the epoxy compound, the alicyclic epoxy compound (B) can be used alone, but the alicyclic epoxy compound (B) and the non-alicyclic epoxy compound (C) can be used together.
脂環式エポキシ化合物(B)と非脂環式エポキシ化合物(C)からなるエポキシ化合物中で、脂環式エポキシ化合物(B)が10~75質量%、非脂環式エポキシ化合物(C)が25~90質量%の割合で使用する事ができる。 In the epoxy compound consisting of the alicyclic epoxy compound (B) and the non-alicyclic epoxy compound (C), the alicyclic epoxy compound (B) is 10 to 75% by mass, and the non-alicyclic epoxy compound (C) is It can be used at a rate of 25 to 90% by mass.
本発明では酸発生剤を用いることができる。酸発生剤は光酸発生剤又は熱酸発生剤を用いることができる。 An acid generator can be used in the present invention. A photoacid generator or a thermal acid generator can be used as the acid generator.
光酸発生剤又は熱酸発生剤は、光照射又は加熱により直接又は間接的に酸を発生するものであれば特に限定されない。 The photoacid generator or thermal acid generator is not particularly limited as long as it directly or indirectly generates an acid by light irradiation or heating.
光酸発生剤の具体例としては、トリアジン系化合物、アセトフェノン誘導体化合物、ジスルホン系化合物、ジアゾメタン系化合物、スルホン酸誘導体化合物、ヨードニウム塩、スルホニウム塩、ホスホニウム塩、セレニウム塩等のオニウム塩、メタロセン錯体、鉄アレーン錯体などを用いることができる。 Specific examples of photoacid generators include triazine-based compounds, acetophenone derivative compounds, disulfone-based compounds, diazomethane-based compounds, sulfonic acid derivative compounds, onium salts such as iodonium salts, sulfonium salts, phosphonium salts, and selenium salts, metallocene complexes, An iron arene complex or the like can be used.
上記光酸発生剤として用いるオニウム塩は、ヨードニウム塩として例えばジフェニルヨードニウムクロライド、ジフェニルヨードニウムトリフルオロメタンスルホネート、ジフェニルヨードニウムメシレート、ジフェニルヨードニウムトシレート、ジフェニルヨードニウムブロミド、ジフェニルヨードニウムテトラフルオロボレート、ジフェニルヨードニウムヘキサフルオロアンチモネート、ジフェニルヨードニウムヘキサフルオロアルセネート、ビス(p-tert-ブチルフェニル)ヨードニウムヘキサフルオロホスフェート、ビス(p-tert-ブチルフェニル)ヨードニウムメシレート、ビス(p-tert-ブチルフェニル)ヨードニウムトシレート、ビス(p-tert-ブチルフェニル)ヨードニウムトリフルオロメタンスルホネート、ビス(p-tert-ブチルフェニル)ヨードニウムテトラフルオロボレート、ビス(p-tert-ブチルフェニル)ヨードニウムクロリド、ビス(p-クロロフェニル)ヨードニウムクロライド、ビス(p-クロロフェニル)ヨードニウムテトラフルオロボレート、更にビス(4-t-ブチルフェニル)ヨードニウムヘキサフルオロホスフェートなどのビス(アルキルフェニル)ヨードニウム塩、アルコキシカルボニルアルコキシ-トリアルキルアリールヨードニウム塩(例えば、4-[(1-エトキシカルボニル-エトキシ)フェニル]-(2,4,6-トリメチルフェニル)-ヨードニウムヘキサフルオロホスフェートなど)、ビス(アルコキシアリール)ヨードニウム塩(例えば、(4-メトキシフェニル)フェニルヨードニウムヘキサフルオロアンチモネートなどのビス(アルコキシフェニル)ヨードニウム塩)が挙げられる。 Onium salts used as photoacid generators include iodonium salts such as diphenyliodonium chloride, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium mesylate, diphenyliodonium tosylate, diphenyliodonium bromide, diphenyliodonium tetrafluoroborate, diphenyliodonium hexafluoroantimonate. diphenyliodonium hexafluoroarsenate, bis(p-tert-butylphenyl)iodonium hexafluorophosphate, bis(p-tert-butylphenyl)iodonium mesylate, bis(p-tert-butylphenyl)iodonium tosylate, bis (p-tert-butylphenyl)iodonium trifluoromethanesulfonate, bis(p-tert-butylphenyl)iodonium tetrafluoroborate, bis(p-tert-butylphenyl)iodonium chloride, bis(p-chlorophenyl)iodonium chloride, bis( p-chlorophenyl)iodonium tetrafluoroborate, further bis(alkylphenyl)iodonium salts such as bis(4-t-butylphenyl)iodonium hexafluorophosphate, alkoxycarbonylalkoxy-trialkylaryliodonium salts (e.g. 4-[(1 -ethoxycarbonyl-ethoxy)phenyl]-(2,4,6-trimethylphenyl)-iodonium hexafluorophosphate, etc.), bis(alkoxyaryl)iodonium salts (e.g., (4-methoxyphenyl)phenyliodonium hexafluoroantimonate, etc.) bis (alkoxyphenyl) iodonium salts).
スルホニウム塩としてトリフェニルスルホニウムクロリド、トリフェニルスルホニウムブロミド、トリ(p-メトキシフェニル)スルホニウムテトラフルオロボレート、トリ(p-メトキシフェニル)スルホニウムヘキサフルオロホスホネート、トリ(p-エトキシフェニル)スルホニウムテトラフルオロボレート、トリフェニルスルホニウムトリフレート、トリフェニルスルホニウムヘキサフルオロアンチモネート、トリフェニルスルホニウムヘキサフルオロホスフェート等のトリフェニルスルホニウム塩や、(4-フェニルチオフェニル) ジフェニルスルホニウムヘキサフルオロアンチモネート、( 4 - フェニルチオフェニル) ジフェニルスルホニウムヘキサフルオロホスフェート、ビス[4-(ジフェニルスルホニオ)フェニル]スルフィド-ビス-ヘキサフルオロアンチモネート、ビス[4-(ジフェニルスルホニオ)フェニル]スルフィド-ビス-ヘキサフルオロホスフェート、(4-メトキシフェニル)ジフェニルスルホニウムヘキサフルオロアンチモネート)等のスルホニウム塩が挙げられる。 Sulfonium salts such as triphenylsulfonium chloride, triphenylsulfonium bromide, tri(p-methoxyphenyl)sulfonium tetrafluoroborate, tri(p-methoxyphenyl)sulfonium hexafluorophosphonate, tri(p-ethoxyphenyl)sulfonium tetrafluoroborate, tri Triphenylsulfonium salts such as phenylsulfonium triflate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium hexafluorophosphate, (4-phenylthiophenyl) diphenylsulfonium hexafluoroantimonate, (4-phenylthiophenyl) diphenylsulfonium Hexafluorophosphate, bis[4-(diphenylsulfonio)phenyl]sulfide-bis-hexafluoroantimonate, bis[4-(diphenylsulfonio)phenyl]sulfide-bis-hexafluorophosphate, (4-methoxyphenyl)diphenyl sulfonium salts such as sulfonium hexafluoroantimonate).
ホスホニウム塩としてトリフェニルホスホニウムクロリド、トリフェニルホスホニウムブロミド、トリ(p-メトキシフェニル)ホスホニウムテトラフルオロボレート、トリ(
p-メトキシフェニル)ホスホニウムヘキサフルオロホスホネート、トリ(p-エトキシフェニル)ホスホニウムテトラフルオロボレート、4-クロロベンゼンジアゾニウムヘキサフルオロホスフェート、ベンジルトリフェニルホスホニウムヘキサフルオロアンチモネート等のホスホニウム塩が挙げられる。
Phosphonium salts such as triphenylphosphonium chloride, triphenylphosphonium bromide, tri(p-methoxyphenyl)phosphonium tetrafluoroborate, tri(
Phosphonium salts such as p-methoxyphenyl)phosphonium hexafluorophosphonate, tri(p-ethoxyphenyl)phosphonium tetrafluoroborate, 4-chlorobenzenediazonium hexafluorophosphate, and benzyltriphenylphosphonium hexafluoroantimonate.
トリフェニルセレニウムヘキサフルオロホスフェートなどのセレニウム塩、(η5又はη6-イソプロピルベンゼン)(η5-シクロペンタジエニル)鉄(II)ヘキサフルオロホスフェートなどのメタロセン錯体が挙げられる。 Selenium salts such as triphenylselenium hexafluorophosphate, metallocene complexes such as (η5 or η6-isopropylbenzene)(η5-cyclopentadienyl)iron(II) hexafluorophosphate.
また、光酸発生剤としては以下の化合物も用いることができる。
光酸発生剤としてはスルホニウム塩化合物、ヨードニウム塩化合物が好ましい。それらのアニオン種としてはCF3SO3 -、C4F9SO3 -、C8F17SO3 -、カンファースルホン酸アニオン、トシル酸アニオン、BF4 -、PF6 -、AsF6 -及びSbF6 -などが挙げられる。特に強酸性を示す六フッ化リン及び六フッ化アンチモン等のアニオン種が好ましい。 A sulfonium salt compound and an iodonium salt compound are preferable as the photoacid generator. Their anionic species include CF 3 SO 3 − , C 4 F 9 SO 3 − , C 8 F 17 SO 3 − , camphorsulfonate anion, tosylate anion, BF 4 − , PF 6 − , AsF 6 − and SbF 6- and the like. Anion species such as phosphorus hexafluoride and antimony hexafluoride, which are particularly strongly acidic, are preferred.
熱酸発生剤としてはスルホニウム塩、ホスホニウム塩が挙げられるが、スルホニウム塩が好ましく用いられる。例えば以下の化合物を例示することができる。
Rは炭素数1~12のアルキル基、炭素数6~20アリール基が挙げられ、特に炭素数1~12のアルキル基が好ましい。 R includes an alkyl group having 1 to 12 carbon atoms and an aryl group having 6 to 20 carbon atoms, and an alkyl group having 1 to 12 carbon atoms is particularly preferable.
更に、下記熱酸発生剤を用いる事ができる。
熱酸発生剤及び/又は光酸発生剤の含有量は、脂環式エポキシ化合物(B)又は脂環式エポキシ化合物(B)と非脂環式エポキシ化合物(C)の合計量100質量部に対して、0.01質量部~10質量部、又は0.1質量部~5質量部の範囲で用いる事ができる。 The content of the thermal acid generator and/or the photoacid generator is 100 parts by mass of the total amount of the alicyclic epoxy compound (B) or the alicyclic epoxy compound (B) and the non-alicyclic epoxy compound (C). On the other hand, it can be used in the range of 0.01 to 10 parts by mass, or 0.1 to 5 parts by mass.
熱酸発生剤と光酸発生剤は、熱や光により酸を発生するものであり、熱酸発生剤は光酸発生剤として利用することができ、また光酸発生剤は熱酸発生剤として使用する事もできる。 Thermal acid generators and photoacid generators generate acid by heat or light. Thermal acid generators can be used as photoacid generators, and photoacid generators can be used as thermal acid generators. You can also use it.
本発明のコーティング組成物には、塩基性化合物(クエンチャー)として含窒素有機化合物(アミン化合物)を1種又は2種以上配合することができる。 The coating composition of the present invention may contain one or more nitrogen-containing organic compounds (amine compounds) as basic compounds (quenchers).
含窒素有機化合物としては、酸発生剤より発生する酸が膜中に拡散する際の拡散速度を抑制することができる化合物が適している。含窒素有機化合物の配合により、膜中での酸の拡散速度が抑制されて解像度が向上し、露光後の感度変化を抑制したり、基板や環境依存性を少なくし、露光余裕度やパターンを向上することができる。また、コーティング組成物の保存安定性を向上する事ができる。 As the nitrogen-containing organic compound, a compound capable of suppressing the diffusion speed when the acid generated by the acid generator diffuses into the film is suitable. By blending nitrogen-containing organic compounds, the diffusion rate of acid in the film is suppressed, improving resolution, suppressing changes in sensitivity after exposure, reducing dependence on substrates and environments, and improving exposure latitude and patterns. can be improved. Moreover, the storage stability of the coating composition can be improved.
このような含窒素有機化合物(クエンチャー)としては、第一級、第二級、第三級の脂肪族アミン類、混成アミン類、芳香族アミン類、複素環アミン類、カルボキシ基を有する含窒素化合物、スルホニル基を有する含窒素化合物、水酸基を有する含窒素化合物、ヒドロキシフェニル基を有する含窒素化合物、アルコール性含窒素化合物、アミド類、イミド類、カーバメート類、アンモニア、アンモニウム塩、スルホニウム塩等が挙げられる。 Examples of such nitrogen-containing organic compounds (quenchers) include primary, secondary, and tertiary aliphatic amines, mixed amines, aromatic amines, heterocyclic amines, and compounds containing carboxyl groups. Nitrogen compounds, nitrogen-containing compounds having a sulfonyl group, nitrogen-containing compounds having a hydroxyl group, nitrogen-containing compounds having a hydroxyphenyl group, alcoholic nitrogen-containing compounds, amides, imides, carbamates, ammonia, ammonium salts, sulfonium salts, etc. are mentioned.
第一級の脂肪族アミン類として、メチルアミン、エチルアミン、n-プロピルアミン、第二級の脂肪族アミン類として、ジメチルアミン、ジエチルアミン、ジ-n-プロピルアミン、第三級の脂肪族アミン類として、トリメチルアミン、トリエチルアミン、トリ-n-プロピルアミン、芳香族アミン類及び複素環アミン類の具体例としては、アニリン誘導体(例えばアニリン、N-メチルアニリン、N-エチルアニリン、N-プロピルアニリン、N,N-ジメチルアニリン、2-メチルアニリン、3-メチルアニリン、4-メチルアニリン、エチルアニリン、プロピルアニリン、トリメチルアニリン、2-ニトロアニリン、3-ニトロアニリン、4-ニトロアニリン、2,4-ジニトロアニリン、2,6-ジニ
トロアニリン、3,5-ジニトロアニリン、N,N-ジメチルトルイジン等)、ジフェニル(p-トリル)アミン、メチルジフェニルアミン、トリフェニルアミン、フェニレンジアミン、ナフチルアミン、ジアミノナフタレン、ピロール誘導体(例えばピロール、2H-ピロール、1-メチルピロール、2,4-ジメチルピロール、2,5-ジメチルピロール、N-メチルピロール等)、オキサゾール誘導体(例えばオキサゾール、イソオキサゾール等)、チアゾール誘導体(例えばチアゾール、イソチアゾール等)、イミダゾール誘導体(例えばイミダゾール、4-メチルイミダゾール、4-メチル-2-フェニルイミダゾール等)、ピラゾール誘導体、フラザン誘導体、ピロリン誘導体(例えばピロリン、2-メチル-1-ピロリン等)、ピロリジン誘導体(例えばピロリジン、N-メチルピロリジン、ピロリジノン、N-メチルピロリドン等)、イミダゾリン誘導体、イミダゾリジン誘導体、ピリジン誘導体(例えばピリジン、メチルピリジン、エチルピリジン、プロピルピリジン、ブチルピリジン、4-(1-ブチルペンチル)ピリジン、ジメチルピリジン、トリメチルピリジン、トリエチルピリジン、フェニルピリジン、3-メチル-2-フェニルピリジン、4-tert-ブチルピリジン、ジフェニルピリジン、ベンジルピリジン、メトキシピリジン、ブトキシピリジン、ジメトキシピリジン、4-ピロリジノピリジン、2-(1-エチルプロピル)ピリジン、アミノピリジン、ジメチルアミノピリジン等)、ピリダジン誘導体、ピリミジン誘導体、ピラジン誘導体、ピラゾリン誘導体、ピラゾリジン誘導体、ピペリジン誘導体、ピペラジン誘導体、モルホリン誘導体、インドール誘導体、イソインドール誘導体、1H-インダゾール誘導体、インドリン誘導体、キノリン誘導体(例えばキノリン、3-キノリンカルボニトリル等)、イソキノリン誘導体、シンノリン誘導体、キナゾリン誘導体、キノキサリン誘導体、フタラジン誘導体、プリン誘導体、プテリジン誘導体、カルバゾール誘導体、フェナントリジン誘導体、アクリジン誘導体、フェナジン誘導体、1,10-フェナントロリン誘導体、アデニン誘導体、アデノシン誘導体、グアニン誘導体、グアノシン誘導体、ウラシル誘導体、ウリジン誘導体等が例示される。
Methylamine, ethylamine, n-propylamine as primary aliphatic amines, dimethylamine, diethylamine, di-n-propylamine as secondary aliphatic amines, tertiary aliphatic amines Specific examples of trimethylamine, triethylamine, tri-n-propylamine, aromatic amines and heterocyclic amines include aniline derivatives (eg, aniline, N-methylaniline, N-ethylaniline, N-propylaniline, N , N-dimethylaniline, 2-methylaniline, 3-methylaniline, 4-methylaniline, ethylaniline, propylaniline, trimethylaniline, 2-nitroaniline, 3-nitroaniline, 4-nitroaniline, 2,4-dinitro aniline, 2,6-dinitroaniline, 3,5-dinitroaniline, N,N-dimethyltoluidine, etc.), diphenyl(p-tolyl)amine, methyldiphenylamine, triphenylamine, phenylenediamine, naphthylamine, diaminonaphthalene, pyrrole derivatives (e.g. pyrrole, 2H-pyrrole, 1-methylpyrrole, 2,4-dimethylpyrrole, 2,5-dimethylpyrrole, N-methylpyrrole etc.), oxazole derivatives (e.g. oxazole, isoxazole etc.), thiazole derivatives (e.g. thiazole , isothiazole etc.), imidazole derivatives (eg imidazole, 4-methylimidazole, 4-methyl-2-phenylimidazole etc.), pyrazole derivatives, furazane derivatives, pyrroline derivatives (eg pyrroline, 2-methyl-1-pyrroline etc.), pyrrolidine derivatives (eg pyrrolidine, N-methylpyrrolidine, pyrrolidinone, N-methylpyrrolidone, etc.), imidazoline derivatives, imidazolidine derivatives, pyridine derivatives (eg pyridine, methylpyridine, ethylpyridine, propylpyridine, butylpyridine, 4-(1- Butylpentyl)pyridine, dimethylpyridine, trimethylpyridine, triethylpyridine, phenylpyridine, 3-methyl-2-phenylpyridine, 4-tert-butylpyridine, diphenylpyridine, benzylpyridine, methoxypyridine, butoxypyridine, dimethoxypyridine, 4- pyrrolidinopyridine, 2-(1-ethylpropyl)pyridine, aminopyridine, dimethylaminopyridine, etc.), pyridazine derivatives, pyrimidine derivatives, pyrazine derivatives, pyrazoline derivatives, pyrazolidine derivatives, piperidine derivatives, piperazine derivatives, morpholine derivatives, indole derivatives, isoindole derivatives, 1H-indazole derivatives, indoline derivatives, quinoline derivatives (eg quinoline, 3-quinolinecarbonitrile, etc.), isoquinoline derivatives, cinnoline derivatives, quinazoline derivatives, quinoxaline derivatives, phthalazine derivatives, purine derivatives, pteridine derivatives, carbazole derivatives, phenanthridine derivatives, acridine derivatives, phenazine derivatives, 1,10-phenanthroline derivatives, adenine derivatives, adenosine derivatives, guanine derivatives, guanosine derivatives, uracil derivatives, uridine derivatives, etc. are exemplified.
クエンチャーとしてアミン化合物の含有量は、脂環式エポキシ化合物(B)又は脂環式エポキシ化合物(B)と非脂環式エポキシ化合物(C)の合計量100質量部に対して、0.001質量部~1質量部、又は0.01質量部~0.5質量部の範囲で用いる事ができる。 The content of the amine compound as a quencher is 0.001 with respect to 100 parts by mass of the total amount of the alicyclic epoxy compound (B) or the alicyclic epoxy compound (B) and the non-alicyclic epoxy compound (C). It can be used in the range of 1 part by mass to 1 part by mass, or 0.01 part by mass to 0.5 part by mass.
本発明では界面活性剤を用いる事ができる。界面活性剤としては、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンセチルエーテル、ポリオキシエチレンオレイルエーテル等のポリオキシエチレンアルキルエーテル類、ポリオキシエチレンオクチルフエノールエーテル、ポリオキシエチレンノニルフエノールエーテル等のポリオキシエチレンアルキルアリルエーテル類、ポリオキシエチレン・ポリオキシプロピレンブロツクコポリマー類、ソルビタンモノラウレート、ソルビタンモノパルミテート、ソルビタンモノステアレート、ソルビタンモノオレエート、ソルビタントリオレエート、ソルビタントリステアレート等のソルビタン脂肪酸エステル類、ポリオキシエチレンソルビタンモノラウレート、ポリオキシエチレンソルビタンモノパルミテート、ポリオキシエチレンソルビタンモノステアレート、ポリオキシエチレンソルビタントリオレエート、ポリオキシエチレンソルビタントリステアレート等のポリオキシエチレンソルビタン脂肪酸エステル類等のノニオン系界面活性剤、商品名エフトップEF301、EF303、EF352((株)トーケムプロダクツ製)、商品名メガファックF171、F173、R-08、R-30、R-30N、R-40LM(DIC(株)製)、フロラードFC430、FC431(住友スリーエム(株)製)、商品名アサヒガードAG710,サーフロンS-382、SC101、SC102、SC103、SC104、SC105、SC106(旭硝子(株)製)等のフッ素系界面活性剤、及びオルガノシロキサンポリマ-KP341(信越化学工業(株)製)、ポリエーテル変性シリコーンオイル(東レ・ダウコーニング(株)製 L-7001)等を挙げることができる。これらの界
面活性剤は脂環式エポキシ化合物(B)又は脂環式エポキシ化合物(B)と非脂環式エポキシ化合物(C)の合計量100質量部に対して、0.002~3質量%、又は0.02~2質量%の割合で添加する事ができる。
A surfactant can be used in the present invention. Surfactants include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenol ether, polyoxyethylene nonylphenol. Polyoxyethylene alkylallyl ethers such as ethers, polyoxyethylene/polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan tristearate sorbitan fatty acid esters such as polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate Nonionic surfactants such as sorbitan fatty acid esters, trade names Ftop EF301, EF303, EF352 (manufactured by Tochem Products Co., Ltd.), trade names Megafac F171, F173, R-08, R-30, R-30N , R-40LM (manufactured by DIC Corporation), Florard FC430, FC431 (manufactured by Sumitomo 3M Co., Ltd.), trade names Asahiguard AG710, Surflon S-382, SC101, SC102, SC103, SC104, SC105, SC106 (Asahi Glass ( Co., Ltd.), organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), polyether-modified silicone oil (L-7001, manufactured by Dow Corning Toray Co., Ltd.), etc. can be done. These surfactants are 0.002 to 3% by mass with respect to 100 parts by mass of the total amount of the alicyclic epoxy compound (B) or the alicyclic epoxy compound (B) and the non-alicyclic epoxy compound (C). , or can be added at a rate of 0.02 to 2% by mass.
本願発明のコーティング組成物に使用される溶剤としては、前記の固形分を溶解できる溶剤であれば、特に制限なく使用することができる。そのような溶剤としては、例えば、メチルセロソルブアセテート、エチルセロソルブアセテート、プロピレングリコール、プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、メチルイソブチルカルビノール、プロピレングリコールモノブチルエーテル、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエテルエーテルアセテート、プロピレングリコールモノプロピルエーテルアセテート、プロピレングリコールモノブチルエーテルアセテート、トルエン、キシレン、メチルエチルケトン、シクロペンタノン、シクロヘキサノン、2-ヒドロキシプロピオン酸エチル、2-ヒドロキシ-2-メチルプロピオン酸エチル、エトキシ酢酸エチル、ヒドロキシ酢酸エチル、2-ヒドロキシ-3-メチルブタン酸メチル、3-メトキシプロピオン酸メチル、3-メトキシプロピオン酸エチル、3-エトキシプロピオン酸エチル、3-エトキシプロピオン酸メチル、ピルビン酸メチル、ピルビン酸エチル、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノプロピルエーテル、エチレングリコールモノブチルエーテル、エチレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテルアセテート、エチレングリコールモノプロピルエーテルアセテート、エチレングリコールモノブチルエーテルアセテート、ジエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールジプロピルエーテル、ジエチレングリコールジブチルエーテルプロピレングリコールモノメチルエーテル、プロピレングリコールジメチルエーテル、プロピレングリコールジエチルエーテル、プロピレングリコールジプロピルエーテル、プロピレングリコールジブチルエーテル、乳酸エチル、乳酸プロピル、乳酸イソプロピル、乳酸ブチル、乳酸イソブチル、ギ酸メチル、ギ酸エチル、ギ酸プロピル、ギ酸イソプロピル、ギ酸ブチル、ギ酸イソブチル、ギ酸アミル、ギ酸イソアミル、酢酸メチル、酢酸エチル、酢酸アミル、酢酸イソアミル、酢酸ヘキシル、プロピオン酸メチル、プロピオン酸エチル、プロピオン酸プロピル、プロピオン酸イソプロピル、プロピオン酸ブチル、プロピオン酸イソブチル、酪酸メチル、酪酸エチル、酪酸プロピル、酪酸イソプロピル、酪酸ブチル、酪酸イソブチル、ヒドロキシ酢酸エチル、2-ヒドロキシ-2-メチルプロピオン酸エチル、3-メトキシ-2-メチルプロピオン酸メチル、2-ヒドロキシ-3-メチル酪酸メチル、メトキシ酢酸エチル、エトキシ酢酸エチル、3-メトキシプロピオン酸メチル、3-エトキシプロピオン酸エチル、3-メトキシプロピオン酸エチル、3-メトキシブチルアセテート、3-メトキシプロピルアセテート、3-メチル-3-メトキシブチルアセテート、3-メチル-3-メトキシブチルプロピオネート、3-メチル-3-メトキシブチルブチレート、アセト酢酸メチル、トルエン、キシレン、メチルエチルケトン、メチルプロピルケトン、メチルブチルケトン、2-ヘプタノン、3-ヘプタノン、4-ヘプタノン、シクロヘキサノン、N、N-ジメチルホルムアミド、N-メチルアセトアミド、N,N-ジメチルアセトアミド、N-メチルピロリドン、4-メチル-2-ペンタノール、及びγ-ブチロラクトン等を挙げることができる。これらの溶剤は単独で、または二種以上の組み合わせで使用することができる。 As the solvent used in the coating composition of the present invention, any solvent capable of dissolving the solid content can be used without particular limitation. Examples of such solvents include methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, methyl isobutyl carbinol, propylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, propylene glycol mono Ether ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, toluene, xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyacetate , ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, methyl pyruvate, ethyl pyruvate , ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol Dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol dipropyl ether, propylene glycol dibutyl ether, ethyl lactate, propyl lactate, isopropyl lactate, butyl lactate , isobutyl lactate, methyl formate, ethyl formate, propyl formate, isopropyl formate, butyl formate, isobutyl formate, amyl formate, isoamyl formate, methyl acetate, ethyl acetate, amyl acetate, isoamyl acetate, hexyl acetate, methyl propionate, ethyl propionate , Propyl Propionate, Isopropyl Propionate, Butyl Propionate, Isobutyl Propionate, Methyl Butyrate, Ethyl Butyrate, Propyl Butyrate, Isopropyl Butyrate, Butyrate Butyl acid, isobutyl butyrate, ethyl hydroxyacetate, ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxy-2-methylpropionate, methyl 2-hydroxy-3-methylbutyrate, ethyl methoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 3-methoxypropionate, 3-methoxybutyl acetate, 3-methoxypropyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxy butyl propionate, 3-methyl-3-methoxybutyl butyrate, methyl acetoacetate, toluene, xylene, methyl ethyl ketone, methyl propyl ketone, methyl butyl ketone, 2-heptanone, 3-heptanone, 4-heptanone, cyclohexanone, N, Examples include N-dimethylformamide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, 4-methyl-2-pentanol, and γ-butyrolactone. These solvents can be used alone or in combination of two or more.
コーティング組成物の製造方法として、撹拌機付きの容器に、溶剤、金属酸化物粒子(A)のコロイド溶液、脂環式エポキシ化合物(B)、非脂環式エポキシ化合物(C)、必要に応じて熱酸発生剤及び/又は光酸発生剤、クエンチャーとしてアミン化合物、界面活性剤を加えて攪拌する事で製造することができる。熱酸発生剤、光酸発生剤、クエンチャーとしてアミン化合物は上記溶剤の一部に予め溶解させて加える事ができる。 As a method for producing the coating composition, a container equipped with a stirrer is charged with a solvent, a colloidal solution of metal oxide particles (A), an alicyclic epoxy compound (B), a non-alicyclic epoxy compound (C), and if necessary It can be produced by adding a thermal acid generator and/or a photoacid generator, an amine compound as a quencher, and a surfactant, and stirring them. An amine compound as a thermal acid generator, a photoacid generator, or a quencher can be dissolved in advance in a part of the solvent and then added.
以下、本発明のコーティング組成物の使用について説明する。 The use of the coating composition of the present invention is described below.
基板(例えば、フィルムシート、シリコンウエハー基板、シリコン/二酸化シリコン被覆基板、シリコンナイトライド基板、ガラス基板、ITO基板、ポリイミド基板、及び低誘電率材料(low-k材料)被覆基板等)の上に、スピナー、コーター等の適当な塗布方法により本発明のコーティング組成物が塗布され、その後、加熱することにより熱硬化によるコーティング膜が形成される。加熱する条件としては、加熱温度20℃~250℃、又は20℃~130℃、加熱時間0.3~120分間の中から適宜、選択される。ここで、形成されるコーティング膜の膜厚としては、例えば、0.01~10μmであり、または0.02~8μmであり、または0.05~6μmであり、または0.1~5μmである。 on substrates (such as film sheets, silicon wafer substrates, silicon/silicon dioxide coated substrates, silicon nitride substrates, glass substrates, ITO substrates, polyimide substrates, and low-k material coated substrates) The coating composition of the present invention is applied by a suitable coating method such as a spinner, a coater, etc., and then heated to form a thermally cured coating film. The heating conditions are appropriately selected from a heating temperature of 20° C. to 250° C. or 20° C. to 130° C. and a heating time of 0.3 to 120 minutes. Here, the film thickness of the coating film to be formed is, for example, 0.01 to 10 μm, 0.02 to 8 μm, 0.05 to 6 μm, or 0.1 to 5 μm. .
被覆されたコーティング膜が光硬化させる場合には、溶剤の除去のために20~80℃で、加熱時間0.3~60分間で乾燥を行い、その後、波長190~500nmの紫外線を用いて、露光量1乃至20000mJ/cm2、または10乃至15000mJ/cm2、または20乃至10000mJ/cm2によって光硬化によるコーティング膜を形成した。形成されるコーティング膜の膜厚としては、例えば、0.01~10μmであり、または0.02~8μmであり、または0.05~6μmであり、または0.1~5μmである。 When the coated coating film is photocured, it is dried at 20 to 80 ° C. for a heating time of 0.3 to 60 minutes to remove the solvent. A coating film was formed by photocuring with an exposure amount of 1 to 20,000 mJ/cm 2 , 10 to 15,000 mJ/cm 2 , or 20 to 10,000 mJ/cm 2 . The film thickness of the coating film to be formed is, for example, 0.01 to 10 μm, 0.02 to 8 μm, 0.05 to 6 μm, or 0.1 to 5 μm.
以下、本発明について、製造例、実施例及び比較例に基づきさらに詳述するが、本発明はこれらの実施例により何ら限定されるものではない。
分散液の諸物性は、以下の測定方法により求めた。
〔粘度〕オストワルド粘度計にて求めた(25℃)。
〔水分〕カールフィッシャー滴定法にて求めた。
〔動的光散乱による平均粒子径(動的光散乱法粒子径)〕ゾルを分散溶媒で希釈し、溶媒のパラメーターを用いて、動的光散乱法測定装置:Malvern Instruments Ltd製ゼータ-サイザーで測定した。
〔透過型電子顕微鏡による平均一次粒子径〕ゾルを銅メッシュ上に滴下し乾燥させ、透過型電子顕微鏡(日本電子社製 JEM-1020)を用いて加速電圧100kVにて観察し、100個の粒子を測定し平均化した値を一次粒子径として求めた。
また実施例および比較例で得られた硬化膜を有する光学部材について、以下に示す測定方法により諸物性を測定し評価した。
The present invention will be described in more detail below based on Production Examples, Examples and Comparative Examples, but the present invention is not limited to these Examples.
Various physical properties of the dispersion liquid were obtained by the following measurement methods.
[Viscosity] Determined with an Ostwald viscometer (25°C).
[Moisture] Moisture content was determined by Karl Fischer titration.
[Average particle diameter by dynamic light scattering (dynamic light scattering particle diameter)] The sol was diluted with a dispersion solvent, and the parameters of the solvent were used to measure the dynamic light scattering measurement device: Zeta-Sizer manufactured by Malvern Instruments Ltd. It was measured.
[Average primary particle diameter measured by transmission electron microscope] The sol was dropped onto a copper mesh, dried, and observed at an acceleration voltage of 100 kV using a transmission electron microscope (JEM-1020 manufactured by JEOL Ltd.) to obtain 100 particles. was measured and averaged to determine the primary particle size.
Further, the physical properties of the optical members having cured films obtained in Examples and Comparative Examples were measured and evaluated by the following measuring methods.
(1)屈折率
反射率測定機(オリンパス(株)製 USPM-RU)を用いて、ガラス基板上に形成した硬化膜の反射率を測定した。測定した反射率から、光学シミュレーションを用いて、硬化膜の屈折率を算出した。
(1) Refractive Index The reflectance of a cured film formed on a glass substrate was measured using a reflectance measuring instrument (USPM-RU manufactured by Olympus Corporation). From the measured reflectance, the refractive index of the cured film was calculated using optical simulation.
(2)硬度試験
ダイナミック超微小硬度計((株)島津製作所製 DUH-211)を用いて、ガラス基板上に形成した硬化膜の硬度HMs[N/mm2]を測定した。判断基準は下記の通りである。
A:硬度が250以上である
B:硬度が150以上250未満である
C:硬度が150未満である
(2) Hardness Test Using a dynamic ultra-micro hardness tester (DUH-211 manufactured by Shimadzu Corporation), hardness HMs [N/mm 2 ] of a cured film formed on a glass substrate was measured. Judgment criteria are as follows.
A: hardness is 250 or more B: hardness is 150 or more and less than 250 C: hardness is less than 150
(3)密着性試験
PETフィルム(東洋紡(株)製 商品名コスモシャインA4300)上に形成した硬
化膜に1mm間隔で100目クロスカットを施し、このクロスカットした部分に粘着テープ(ニチバン(株)製 セロハンテープ)を強く貼り付けた後、粘着テープを急速に剥がし、粘着テープを剥がした後の硬化膜の剥離の有無を調べた。評価基準は下記の通りである。
A:全く剥離が無いか、又は100目中5目未満の剥離が確認できる。
B:100目中5~30目の剥離が確認できる
C:100目中31~60目の剥離が確認できる
D:100目中61~90目の剥離が確認できる
E:100目中91目以上の剥離が確認できる
(3) Adhesion test A cured film formed on a PET film (manufactured by Toyobo Co., Ltd., trade name Cosmoshine A4300) was cross-cut 100 times at intervals of 1 mm, and an adhesive tape (Nichiban Co., Ltd.) (manufactured by cellophane tape) was strongly affixed, the adhesive tape was rapidly peeled off, and the presence or absence of peeling of the cured film after peeling off the adhesive tape was examined. Evaluation criteria are as follows.
A: No peeling at all, or peeling of less than 5 out of 100 stitches can be confirmed.
B: peeling of 5 to 30 out of 100 eyes can be confirmed C: peeling of 31 to 60 out of 100 eyes can be confirmed D: peeling of 61 to 90 out of 100 eyes can be confirmed E: 91 or more out of 100 eyes peeling can be confirmed
(4)透明性
ヘイズメーター(日本電色工業(株)製 NDH7000)を用いて、ガラス基板上に形成した硬化膜のヘイズ値を測定した。判断基準は次の通りである。
A:ヘイズ値が0.3未満である
B:ヘイズ値が0.3以上1.0未満である
C:ヘイズ値が1.0以上3.0未満である
D:ヘイズ値が3.0以上10.0未満である
E:ヘイズ値が10.0以上である
(4) Transparency The haze value of the cured film formed on the glass substrate was measured using a haze meter (NDH7000 manufactured by Nippon Denshoku Industries Co., Ltd.). Judgment criteria are as follows.
A: Haze value is less than 0.3 B: Haze value is 0.3 or more and less than 1.0 C: Haze value is 1.0 or more and less than 3.0 D: Haze value is 3.0 or more Less than 10.0 E: Haze value is 10.0 or more
(5)耐光性試験
分光光度計((株)島津製作所製 UV-3600)を用いて、得られた光学部材(ガラス基板上に硬化膜を形成したもの)の透過率を測定し、JIS7373に基づいてYI値を算出した。その後、QUV促進耐候試験機(UVAランプ 照射強度890mW/m2)を用いて、120時間露光を行った光学部材のYI値を算出した。紫外線照射前後の光学部材の△YIを算出した。判断基準は次の通りである。
A:△YIが1.0未満である
B:△YIが1.0以上2.0未満である
C:△YIが2.0以上である
(5) Light resistance test Using a spectrophotometer (UV-3600 manufactured by Shimadzu Corporation), the transmittance of the obtained optical member (a cured film formed on a glass substrate) was measured, and the transmittance was measured according to JIS7373. Based on the YI value was calculated. After that, using a QUV accelerated weathering tester (UVA lamp irradiation intensity 890 mW/m 2 ), the YI value of the optical member exposed for 120 hours was calculated. ΔYI of the optical member before and after the ultraviolet irradiation was calculated. Judgment criteria are as follows.
A: ΔYI is less than 1.0 B: ΔYI is 1.0 or more and less than 2.0 C: ΔYI is 2.0 or more
(6)保存安定性試験
5℃に設定された冷蔵庫内で1か月保管したコート剤を用いて、(2)硬度試験と同様の試験を行った。判断基準は下記の通りである。
A:保管前に比べ、硬度変化が±10%以内
B:保管前に比べ、10~30%の硬度低下
C:保管前に比べ、30%以上の硬度低下
(6) Storage stability test A test similar to (2) Hardness test was performed using a coating agent stored for one month in a refrigerator set at 5°C. Judgment criteria are as follows.
A: hardness change within ±10% compared to before storage B: hardness decreased by 10 to 30% compared to before storage C: hardness decreased by 30% or more compared to before storage
参考例1:核となる酸化チタン-酸化第二スズ複合酸化物コロイド粒子(A1)の調製
25質量%水酸化テトラメチルアンモニウム水溶液319.5gを純水947.1gに溶解し、次いでメタスズ酸14.8g(SnO2換算で12.5g含有)、チタンテトライソプロポキシド236.6g(TiO2換算で66.6g含有)、及びシュウ酸二水和物82.0g(シュウ酸換算で58.5g)を撹拌下で添加した。該混合溶液を80℃で2時間保持し、更に580Torrまで減圧して2時間保持し、混合溶液を調製した。ガラスライニングされたオートクレーブ容器に、上記混合溶液を投入し、140℃で5時間水熱処理を行い、室温に冷却後、取り出した。得られたゾルは酸性の酸化チタン-酸化第二スズ複合酸化物コロイド粒子(A1)の水分散ゾルであり、pH3.9、全金属酸化物濃度(TiO2、及びSnO2)5.0質量%、動的光散乱法による平均粒子径(動的光散乱法粒子径)16nmであった。得られたゾルを110℃で乾燥させた粉末のX線回折分析を行い、ルチル型結晶であることが確認された。
Reference Example 1: Preparation of Colloidal Particles (A1) of Titanium Oxide-Stannic Oxide Composite Oxide as Cores 319.5 g of a 25% by mass tetramethylammonium hydroxide aqueous solution was dissolved in 947.1 g of pure water, and then metastannic acid 14 was dissolved. .8 g (contains 12.5 g as SnO2), 236.6 g titanium tetraisopropoxide (contains 66.6 g as TiO2 ), and 82.0 g oxalic acid dihydrate (58.5 g as oxalic acid) ) was added under stirring. The mixed solution was held at 80° C. for 2 hours, and further reduced to 580 Torr and held for 2 hours to prepare a mixed solution. The mixed solution was put into a glass-lined autoclave container, subjected to hydrothermal treatment at 140° C. for 5 hours, cooled to room temperature, and taken out. The obtained sol was a water-dispersed sol of acidic titanium oxide-stannic oxide composite oxide colloidal particles (A1), and had a pH of 3.9 and a total metal oxide concentration (TiO2 and SnO2) of 5.0% by mass. The average particle size (dynamic light scattering particle size) determined by dynamic light scattering method was 16 nm. The powder obtained by drying the obtained sol at 110° C. was subjected to X-ray diffraction analysis, and it was confirmed to be rutile type crystals.
参考例2:被覆物となる二酸化珪素-酸化第二スズ複合酸化物コロイド粒子(B1)の
調製
JIS3号珪酸ナトリウム(SiO2換算で29.8質量%含有)77.2gを純水668.8gに溶解し、次いでスズ酸ナトリウムNaSnO3・H2O(SnO2換算で55.1質量%含有)20.9gを溶解した。得られた水溶液を水素型陽イオン交換樹脂(アンバーライト(登録商標)IR-120B)を充填したカラムに通液した。次いで得られた水分散ゾルにジイソプロピルアミンを7.2g添加した。得られたゾルはアルカリ性の二酸化珪素-酸化第二スズ複合酸化物コロイド粒子(B1)の水分散ゾルであり、pH8.0、全金属酸化物濃度(SnO2、及びSnO2)1.7質量%、透過型電子顕微鏡による観察で一次粒子径は1~4nmであった。
Reference Example 2: Preparation of Colloidal Particles (B1) of Silicon Dioxide-Stannic Oxide Composite Oxide for Coating 77.2 g of JIS No. 3 sodium silicate (containing 29.8% by mass in terms of SiO 2 ) was added to 668.8 g of pure water. and then 20.9 g of sodium stannate NaSnO 3 .H 2 O (containing 55.1% by mass in terms of SnO 2 ) was dissolved. The resulting aqueous solution was passed through a column packed with a hydrogen-type cation exchange resin (Amberlite (registered trademark) IR-120B). Then, 7.2 g of diisopropylamine was added to the obtained water-dispersed sol. The obtained sol was a water-dispersed sol of alkaline silicon dioxide-tin oxide composite oxide colloidal particles (B1), pH 8.0, total metal oxide concentration (SnO 2 and SnO 2 ) 1.7 mass. %, and the primary particle size was 1 to 4 nm as observed by a transmission electron microscope.
参考例3:二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C1)の調製
オキシ塩化ジルコニウム(ZrO2換算で21.2質量%含有)82.7gを純水501.1gで希釈して、オキシ塩化ジルコニウム水溶液583.8g(ZrO2換算で3.0質量%含有)を調製し、参考例1で調製した酸化チタン-酸化第二スズ複合酸化物コロイド粒子(A1)の水分散ゾル1516.2gを撹拌下で添加した。次いで95℃に加熱することにより加水分解を行って、表面に酸化ジルコニウムの薄膜層が形成された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子の水分散ゾルを得た。得られた水分散ゾル2041.2gを参考例2で調製したアルカリ性の二酸化珪素-酸化第二スズ複合酸化物コロイド粒子(B1)の水分散ゾル1763.3gに撹拌下で添加し、陰イオン交換樹脂(アンバーライト(登録商標)IRA-410、オルガノ(株)製)500ミリリットルを詰めたカラムに通液した。次いで通液後の水分散ゾルを95℃で3時間加熱した後、限外濾過膜法で濃縮した。
Reference Example 3: Preparation of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C1) modified with silicon dioxide-stannic oxide composite oxide Zirconium oxychloride ( 21.2 mass in terms of ZrO2 % content) was diluted with 501.1 g of pure water to prepare 583.8 g of an aqueous zirconium oxychloride solution (containing 3.0% by mass in terms of ZrO 2 ). 1516.2 g of water-dispersed sol of stannic composite oxide colloidal particles (A1) was added with stirring. Then, hydrolysis was performed by heating to 95° C. to obtain a water-dispersed sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles having a thin film layer of zirconium oxide formed on the surface. 2041.2 g of the obtained water-dispersed sol was added to 1763.3 g of the water-dispersed sol of the alkaline silicon dioxide-stannic oxide composite oxide colloidal particles (B1) prepared in Reference Example 2 with stirring, and anion exchange was performed. The solution was passed through a column packed with 500 ml of resin (Amberlite (registered trademark) IRA-410, manufactured by Organo Corporation). Then, the water-dispersed sol after passing the liquid was heated at 95° C. for 3 hours and then concentrated by an ultrafiltration membrane method.
次いで、得られた水分散ゾルの分散媒をロータリーエバポレーターを用いてメタノールに置換して、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C1)のメタノール分散ゾルを得た。このメタノール分散ゾルは、pH5.2、全金属酸化物(TiO2、ZrO2、SnO2、及びSiO2)濃度30.5質量%、粘度1.8mPa・s、動的光散乱法(DLS)による平均粒子径(動的光散乱法粒子径)20nmであった。 Next, the dispersion medium of the obtained water-dispersed sol is replaced with methanol using a rotary evaporator, and the titanium oxide-stannic oxide-zirconium oxide composite oxide modified with the silicon dioxide-stannic oxide composite oxide is obtained. A methanol-dispersed sol of colloidal particles (C1) was obtained. This methanol-dispersed sol has a pH of 5.2, a total metal oxide (TiO 2 , ZrO 2 , SnO 2 , and SiO 2 ) concentration of 30.5% by mass, a viscosity of 1.8 mPa·s, and a dynamic light scattering method (DLS). The average particle size (dynamic light scattering method particle size) was 20 nm.
参考例4:核となる酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(A2)の調製
炭酸水素テトラメチルアンモニウム(水酸化テトラメチルアンモニウム換算で42.4質量%含有)水溶液293.7gを、純水111.5gで希釈し、この水溶液を攪拌しながら、オキシ炭酸ジルコニウム粉末(ZrO2換算で40.1質量%含有)168.4gを徐々に添加した。添加終了後、85℃に加温し、メタスズ酸9.6g(SnO2として86.0質量%含)を徐々に添加し、105℃にて5時間加温熟成を行い、更に145℃にて5時間の水熱処理を行った。次いでこのゾルを限外ろ過装置にて純水を添加しながら、ゾルを洗浄、濃縮した。得られたゾルはアルカリ性の酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(A2)の水分散ゾルであり、pH9.4、全金属酸化物濃度(ZrO2、及びSnO2の合計)5.0質量%、動的光散乱法による平均粒子径(動的光散乱法粒子径)15nmであった。
Reference Example 4: Preparation of core zirconium oxide-tin oxide composite oxide colloidal particles (A2) The solution was diluted with 111.5 g of pure water, and 168.4 g of zirconium oxycarbonate powder (containing 40.1% by mass in terms of ZrO 2 ) was gradually added while stirring the aqueous solution. After completion of the addition, the mixture was heated to 85°C, 9.6 g of metastannic acid (containing 86.0% by mass of SnO 2 ) was gradually added, heat-aged at 105°C for 5 hours, and further heated at 145°C. A hydrothermal treatment was performed for 5 hours. Next, the sol was washed and concentrated by an ultrafiltration device while adding pure water. The resulting sol was a water-dispersed sol of alkaline zirconium oxide-stannic oxide composite oxide colloidal particles (A2), pH 9.4, total metal oxide concentration (total of ZrO 2 and SnO 2 ) of 5.5. It was 0% by mass and the average particle size (dynamic light scattering particle size) was 15 nm as determined by the dynamic light scattering method.
参考例5:二酸化珪素-酸化第二スズ複合酸化物で変性された酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(C2)の調製
参考例4で得られたアルカリ性の酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(A2)の水分散ゾル1411.7gに、参考例2で調製したアルカリ性の二酸化珪素-酸化第二スズ複合酸化物コロイド粒子(B1)の水分散ゾル830.4gを攪拌下で添加した。次いで95℃に加熱して2時間保持した後、水素型陽イオン交換樹脂(アンバ
ーライト(登録商標)IR-120B)を充填したカラムに通液した後、通液後の水分散ゾルを限外濾過膜法で濃縮した。
Reference Example 5: Preparation of colloidal particles (C2) of zirconium oxide-stannic oxide composite oxide modified with silicon dioxide-stannic oxide composite oxide Alkaline zirconium oxide-stannic oxide obtained in Reference Example 4 830.4 g of the aqueous dispersion of the alkaline silicon dioxide-stannic oxide colloidal particles (B1) prepared in Reference Example 2 was stirred into 1411.7 g of the aqueous dispersion of the colloidal particles of tin composite oxide (A2). added below. Then, after heating to 95 ° C. and holding for 2 hours, the solution was passed through a column packed with a hydrogen-type cation exchange resin (Amberlite (registered trademark) IR-120B), and the water-dispersed sol after passing was subjected to ultrafiltration. Concentrated by filtration membrane method.
次いで、得られた水分散ゾルの分散媒をロータリーエバポレーターを用いてメタノールに置換して、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(C2)のメタノール分散ゾルを得た。このメタノール分散ゾルは、pH5.0、全金属酸化物(ZrO2、SnO2、及びSiO2)濃度38.5質量%、粘度3.3mPa・s、動的光散乱法(DLS)による平均粒子径(動的光散乱法粒子径)20nmであった。 Next, the dispersion medium of the obtained water-dispersed sol is replaced with methanol using a rotary evaporator, and the zirconium oxide-stannic oxide composite oxide colloidal particles modified with silicon dioxide-stannic oxide composite oxide ( A methanol-dispersed sol of C2) was obtained. This methanol-dispersed sol has a pH of 5.0, a total metal oxide (ZrO 2 , SnO 2 , and SiO 2 ) concentration of 38.5% by mass, a viscosity of 3.3 mPa s, and an average particle size determined by a dynamic light scattering method (DLS). The diameter (dynamic light scattering particle diameter) was 20 nm.
参考例6:核となる酸化第二スズコロイド粒子(A3)の調製
シュウ酸二水和物64.0g(シュウ酸換算で45.7g)を純水723.3gに溶解し、攪拌しながら70℃まで加温した後、35%過酸化水素水290.3gと金属スズ粉末(SnO2換算で99.7%含有)128.1gを添加した。過酸化水素水と金属スズの添加は交互に10回分割で行った。始めに35%過酸化水素水29.0gを、次いで金属スズ12.8gを添加した。反応が終了するのを待って(10~15分)この操作を繰り返した。 添加に要した時間は2時間で添加終了後、液温を90℃に保ちながら2時間加熱し反応を終了させた。次いで、35%過酸化水素水394.5gを添加し、90℃で5時間保持した。次いで、イソプロピルアミン5.1gを添加し、50℃で3時間保持した後、陰イオン交換樹脂(アンバーライト(登録商標)IRA-410)500ミリリットルを詰めたカラムに通液した。得られたゾルはアルカリ性の酸化第二スズ複合酸化物コロイド粒子(A3)の水分散ゾルであり、pH11.0、SnO2濃度4.0質量%、動的光散乱法による平均粒子径(動的光散乱法粒子径)20nmであった。
Reference Example 6: Preparation of core stannic oxide colloidal particles (A3) 64.0 g of oxalic acid dihydrate (45.7 g in terms of oxalic acid) was dissolved in 723.3 g of pure water and heated to 70°C with stirring. 290.3 g of 35% hydrogen peroxide solution and 128.1 g of metal tin powder (contains 99.7% in terms of SnO 2 ) were added. The hydrogen peroxide solution and metallic tin were alternately added in 10 divisions. First, 29.0 g of 35% hydrogen peroxide solution and then 12.8 g of metallic tin were added. After waiting for the reaction to finish (10-15 minutes), this operation was repeated. The time required for the addition was 2 hours, and after the completion of the addition, the reaction was completed by heating for 2 hours while maintaining the liquid temperature at 90°C. Then, 394.5 g of 35% hydrogen peroxide water was added and the mixture was kept at 90° C. for 5 hours. Next, 5.1 g of isopropylamine was added, and after holding at 50° C. for 3 hours, the solution was passed through a column packed with 500 ml of an anion exchange resin (Amberlite® IRA-410). The resulting sol was a water-dispersed sol of alkaline stannic oxide composite oxide colloidal particles (A3), pH 11.0, SnO 2 concentration 4.0% by mass, average particle diameter (dynamic It was 20 nm in terms of the particle size (measured by the light scattering method).
参考例7:二酸化珪素-酸化第二スズ複合酸化物で変性された酸化第二スズコロイド粒子(C3)の調製
参考例6で得られた酸化第二スズコロイド粒子(A3)の水分散ゾル1458.8gに、参考例2で調製したアルカリ性の二酸化珪素-酸化第二スズ複合酸化物コロイド粒子(B1)の水分散ゾル514.9gを攪拌下で添加した。次いで95℃に加熱して2時間保持した後、水素型陽イオン交換樹脂(アンバーライト(登録商標)IR-120B)を充填したカラムに通液した。次いで通液後の水分散ゾルを限外濾過膜法で濃縮した。
次いで、得られた水分散ゾルの分散媒をロータリーエバポレーターを用いてメタノールに置換して、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化第二スズコロイド粒子(C3)のメタノール分散ゾルを得た。このメタノール分散ゾルは、全金属酸化物(SnO2、及びSiO2)濃度30.5質量%、粘度1.3mPa・s、動的光散乱法(DLS)による平均粒子径(動的光散乱法粒子径)18nmであった。
Reference Example 7: Preparation of stannic oxide colloidal particles (C3) modified with silicon dioxide-stannic oxide composite oxide 1458.8 g of water-dispersed sol of stannic oxide colloidal particles (A3) obtained in Reference Example 6 514.9 g of the aqueous dispersion sol of the alkaline silicon dioxide-stannic oxide composite oxide colloidal particles (B1) prepared in Reference Example 2 was added to the mixture while stirring. After heating to 95° C. and holding for 2 hours, the solution was passed through a column filled with a hydrogen-type cation exchange resin (Amberlite (registered trademark) IR-120B). Then, the water-dispersed sol after passing the liquid was concentrated by an ultrafiltration membrane method.
Next, the dispersion medium of the resulting water-dispersed sol was replaced with methanol using a rotary evaporator to obtain a methanol-dispersed sol of stannic oxide colloidal particles (C3) modified with a silicon dioxide-stannic oxide composite oxide. Obtained. This methanol-dispersed sol has a total metal oxide (SnO 2 and SiO 2 ) concentration of 30.5% by mass, a viscosity of 1.3 mPa s, and an average particle size determined by dynamic light scattering (DLS) (dynamic light scattering method particle diameter) was 18 nm.
製造例1:表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C4)の調製
参考例3で得られた、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C1)のメタノール分散ゾル200gに、フェニルトリメトキシシラン(信越化学工業(株)製 商品名KBM103)3.9gを撹拌下で添加し、70℃で還流加熱を5時間行った。次いで、エバポレータを用いて180Torrでメチルエチルケトンを添加しながらメタノールを留去することによりメタノールをメチルエチルケトンに置換して、表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C4)のメチルエチルケトン分散ゾルを得た。このメチルエチルケトン分散ゾルは全金属酸化物(TiO2、ZrO2、SnO2、及びSiO2)濃度30.5質量%、粘度0.9mPa・s、動的光散乱
法(DLS)による平均粒子径(動的光散乱法粒子径)は19nmであった。
Production Example 1: Titanium oxide-stannic oxide-zirconium oxide composite oxide colloid particles (C4 ) To 200 g of the methanol-dispersed sol of the silicon dioxide-stannic oxide-modified titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C1) obtained in Reference Example 3, 3.9 g of phenyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM103) was added with stirring, and heated under reflux at 70° C. for 5 hours. Next, by using an evaporator to distill off methanol while adding methyl ethyl ketone at 180 Torr, the methanol is replaced with methyl ethyl ketone, and a silicon dioxide-stannic oxide formed by bonding an organosilicon compound having a phenyl group on the surface. A methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C4) modified with a composite oxide was obtained. This methyl ethyl ketone dispersion sol has a total metal oxide (TiO 2 , ZrO 2 , SnO 2 , and SiO 2 ) concentration of 30.5% by mass, a viscosity of 0.9 mPa s, and an average particle size ( Dynamic light scattering method particle size) was 19 nm.
製造例2:表面にメタクリル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C5)の調製
参考例3で得られた、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C3)のメタノール分散ゾル200gに、3-メタクリロキシプロピルトリメトキシシラン(信越化学工業(株)製 商品名KBM503)4.9gを撹拌下で添加し、70℃で還流加熱を5時間行った。次いで、エバポレータを用いて180Torrでメチルエチルケトンを添加しながらメタノールを留去することによりメタノールをメチルエチルケトンに置換して、表面にメタクリル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C5)のメチルエチルケトン分散ゾルを得た。このメチルエチルケトン分散ゾルは全金属酸化物(TiO2、ZrO2、SnO2、及びSiO2)濃度30.5質量%、粘度1.2mPa・s、動的光散乱法(DLS)による平均粒子径(動的光散乱法粒子径)は17nmであった。
Production Example 2: Titanium oxide-stannic oxide-zirconium oxide composite oxide colloid particles (C5 ) To 200 g of the methanol-dispersed sol of the silicon dioxide-stannic oxide-modified titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C3) obtained in Reference Example 3, 4.9 g of 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM503) was added with stirring, and heated under reflux at 70° C. for 5 hours. Next, by using an evaporator to distill off methanol while adding methyl ethyl ketone at 180 Torr, the methanol is replaced with methyl ethyl ketone, and a silicon dioxide-stannic oxide in which an organosilicon compound having a methacrylic group on the surface is bonded. A methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C5) modified with the composite oxide was obtained. This methyl ethyl ketone dispersion sol has a total metal oxide (TiO 2 , ZrO 2 , SnO 2 , and SiO 2 ) concentration of 30.5% by mass, a viscosity of 1.2 mPa s, and an average particle size ( The dynamic light scattering method particle diameter) was 17 nm.
製造例3:表面にメチル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C6)の調製
参考例3で得られた、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C3)のメタノール分散ゾル200gに、トリメチルメトキシシラン(東レダウコーニング(株)製 商品名Z6013)2.4gを撹拌下で添加し、70℃で還流加熱を5時間行った。次いで、エバポレータを用いて180Torrでメチルエチルケトンを添加しながらメタノールを留去することによりメタノールをメチルエチルケトンに置換して、表面にメチル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C6)のメチルエチルケトン分散ゾルを得た。このメチルエチルケトン分散ゾルは、全金属酸化物(TiO2、ZrO2、SnO2、及びSiO2)濃度30.5質量%、粘度8.0mPa・s、動的光散乱法(DLS)による平均粒子径(動的光散乱法粒子径)は45nmであった。
Production Example 3: Titanium oxide-stannic oxide-zirconium oxide composite oxide colloid particles (C6 ) To 200 g of the methanol-dispersed sol of the silicon dioxide-stannic oxide-modified titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C3) obtained in Reference Example 3, 2.4 g of trimethylmethoxysilane (manufactured by Dow Corning Toray Co., Ltd., product name: Z6013) was added with stirring, and heated under reflux at 70° C. for 5 hours. Next, by using an evaporator to distill off methanol while adding methyl ethyl ketone at 180 Torr, the methanol is replaced with methyl ethyl ketone, and an organic silicon compound having a methyl group on the surface is bonded to silicon dioxide-stannic oxide. A methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C6) modified with a composite oxide was obtained. This methyl ethyl ketone dispersion sol has a total metal oxide (TiO 2 , ZrO 2 , SnO 2 , and SiO 2 ) concentration of 30.5% by mass, a viscosity of 8.0 mPa s, and an average particle size determined by dynamic light scattering (DLS). (Dynamic light scattering method particle size) was 45 nm.
製造例4:表面にフェニル基とグリシジル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C7)の調製
参考例3で得られた、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C3)のメタノール分散ゾル200gに、フェニルトリメトキシシラン(信越化学工業(株)製 商品名KBM103)2.0g、及び3-グリシドキシプロピルトリメトキシシラン(Momentive製
商品名SILQUEST A-187T)2.3gを撹拌下で添加し、70℃で還流加熱を5時間行った。次いで、エバポレータを用いて80Torrでプロピレングリコールモノメチルエーテルを添加しながらメタノールを留去することによりメタノールをプロピレングリコールモノメチルエーテルに置換して、表面にフェニル基とグリシジル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C7)のプロピレングリコールモノメチルエーテル分散ゾルを得た。このプロピレングリコールモノメチルエーテル分散ゾルは全金属酸化物(TiO2、ZrO2、SnO2、及びSiO2)濃度30.5質量%、粘度3.4mPa・s、動的光散乱法(DLS)による平均粒子径(動的光散乱法粒子径)は11nmであった。
Production Example 4: Titanium oxide-stannic oxide-zirconium oxide composite oxide colloid modified with a silicon dioxide-stannic oxide composite oxide, comprising an organic silicon compound having a phenyl group and a glycidyl group bonded to the surface Preparation of particles (C7) Methanol-dispersed sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C3) modified with silicon dioxide-stannic oxide composite oxide obtained in Reference Example 3 To 200 g, 2.0 g of phenyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM103) and 2.3 g of 3-glycidoxypropyltrimethoxysilane (manufactured by Momentive, trade name SILQUEST A-187T) were added with stirring. was added and heated to reflux at 70° C. for 5 hours. Next, by using an evaporator to distill off methanol while adding propylene glycol monomethyl ether at 80 Torr, methanol is replaced with propylene glycol monomethyl ether, and an organosilicon compound having a phenyl group and a glycidyl group is bonded to the surface. Thus, a propylene glycol monomethyl ether dispersed sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C7) modified with silicon dioxide-stannic oxide composite oxide was obtained. This propylene glycol monomethyl ether dispersion sol has a total metal oxide (TiO 2 , ZrO 2 , SnO 2 , and SiO 2 ) concentration of 30.5% by mass, a viscosity of 3.4 mPa s, and an average The particle size (dynamic light scattering particle size) was 11 nm.
製造例5:表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(C8)の調製
参考例5で得られた、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(C2)のメタノール分散ゾル200gに、フェニルトリメトキシシラン(信越化学工業(株)製 商品名KBM103)4.7gを撹拌下で添加し、70℃で還流加熱を5時間行った。次いで、エバポレータを用いて180Torrでメチルエチルケトンを添加しながらメタノールを留去することによりメタノールをメチルエチルケトンに置換して、表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(C8)のメチルエチルケトン分散ゾルを得た。このメチルエチルケトン分散ゾルは全金属酸化物(ZrO2、SnO2、及びSiO2)濃度30.5質量%、粘度4.1mPa・s、動的光散乱法(DLS)による平均粒子径(動的光散乱法粒子径)は33nmであった。
Production Example 5: Preparation of zirconium oxide-stannic oxide composite oxide colloidal particles (C8) modified with silicon dioxide-stannic oxide composite oxide, in which an organosilicon compound having a phenyl group is bonded to the surface Phenyltrimethoxysilane (Shin-Etsu 4.7 g of KBM103 (trade name, manufactured by Kagaku Kogyo Co., Ltd.) was added with stirring, and heated under reflux at 70° C. for 5 hours. Next, by using an evaporator to distill off methanol while adding methyl ethyl ketone at 180 Torr, the methanol is replaced with methyl ethyl ketone, and a silicon dioxide-stannic oxide formed by bonding an organosilicon compound having a phenyl group on the surface. A methyl ethyl ketone dispersed sol of zirconium oxide-stannic oxide composite oxide colloidal particles (C8) modified with the composite oxide was obtained. This methyl ethyl ketone dispersion sol has a total metal oxide (ZrO 2 , SnO 2 , and SiO 2 ) concentration of 30.5% by mass, a viscosity of 4.1 mPa s, and an average particle size (dynamic light Scattering method particle size) was 33 nm.
製造例6:表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化第二スズ複合酸化物コロイド粒子(C9)の調製
参考例7で得られた、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化第二スズ複合酸化物コロイド粒子(C3)のメタノール分散ゾル200gに、フェニルトリメトキシシラン(信越化学工業(株)製 商品名KBM103)3.0gを撹拌下で添加し、70℃で還流加熱を5時間行った。次いで、エバポレータを用いて180Torrでメチルエチルケトンを添加しながらメタノールを留去することによりメタノールをメチルエチルケトンに置換して、表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化第二スズ複合酸化物コロイド粒子(C9)のメチルエチルケトン分散ゾルを得た。このメチルエチルケトン分散ゾルは全金属酸化物(SnO2、及びSiO2)濃度30.5質量%、粘度3.4mPa・s、動的光散乱法(DLS)による平均粒子径(動的光散乱法粒子径)は20nmであった。
Production Example 6: Preparation of Colloidal Particles (C9) of Silicon Dioxide-Stannic Oxide Composite Oxide Modified Stannic Oxide Composite Oxide, Comprising Organosilicon Compounds Having Phenyl Groups on Their Surfaces Reference Example 7 200 g of the methanol-dispersed sol of the colloidal particles (C3) of the silicon dioxide-stannic oxide-modified stannic oxide composite oxide obtained in , was added with phenyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd. 3.0 g of KBM103) (trade name) was added with stirring, and heated under reflux at 70° C. for 5 hours. Next, by using an evaporator to distill off methanol while adding methyl ethyl ketone at 180 Torr, the methanol is replaced with methyl ethyl ketone, and a silicon dioxide-stannic oxide formed by bonding an organosilicon compound having a phenyl group on the surface. A methyl ethyl ketone dispersion sol of stannic oxide composite oxide colloidal particles (C9) modified with the composite oxide was obtained. This methyl ethyl ketone dispersion sol has a total metal oxide (SnO 2 and SiO 2 ) concentration of 30.5% by mass, a viscosity of 3.4 mPa s, and an average particle size determined by dynamic light scattering (DLS) (dynamic light scattering particles diameter) was 20 nm.
実施例1
(コーティング組成物の作製)
マグネチックスターラーを備えたガラス製の容器に、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)12.0質量部、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)3.0質量部、プロピレングリコールモノメチルエーテル30.7質量部を加え、撹拌しながら製造例1で得た、表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C4)のメチルエチルケトン分散ゾル49.2質量部を加え、0.5時間撹拌を行った。次いで、カチオン重合開始剤(三新化学工業(株)製 商品名サンエイドSI-100)のプロピレングリコールモノメチルエーテル溶液(サンエイドSI-100 5.0質量%)3.0質量部、保存安定化助剤(三新化学工業(株)製 商品名SI助剤)のN-メチル-2-ピロリドン溶液(SI助剤 5.0質量%)0.15質量部、ポリエーテル変性シリコーンオイル(東レ・ダウコーニング(株)製 商品名L-7001)のプロピレングリコールモノメチルエーテル溶液(L-7001 10.0質量%)2.0質量部を加え、0.5時間撹拌を行いコーティング液(コーティング組成物)を作製した。
Example 1
(Preparation of coating composition)
In a glass container equipped with a magnetic stirrer, 12.0 parts by mass of epoxy-modified organosiloxane (trade name KR470 manufactured by Shin-Etsu Chemical Co., Ltd.) and trimethylolpropane polyglycidyl ether (trade name manufactured by Nagase ChemteX Corporation) EX-321L) 3.0 parts by mass and 30.7 parts by mass of propylene glycol monomethyl ether were added, and the silicon dioxide- 49.2 parts by mass of methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C4) modified with stannic oxide composite oxide was added and stirred for 0.5 hour. Then, a propylene glycol monomethyl ether solution of a cationic polymerization initiator (manufactured by Sanshin Chemical Industry Co., Ltd., trade name San-Aid SI-100) (San-Aid SI-100 5.0% by mass) 3.0 parts by mass, storage stabilization aid N-methyl-2-pyrrolidone solution (SI auxiliary agent 5.0% by weight) of (Sanshin Chemical Industry Co., Ltd. trade name SI auxiliary agent), 0.15 parts by weight of polyether-modified silicone oil (Toray Dow Corning Add 2.0 parts by mass of a propylene glycol monomethyl ether solution (L-7001 10.0% by mass) (trade name L-7001 manufactured by Co., Ltd.) and stir for 0.5 hours to prepare a coating liquid (coating composition). bottom.
(硬化膜の形成及び評価)
ガラス基板とPETフィルム(東洋紡(株)製 商品名コスモシャインA4300)を
用意し、これらにスピンコート法でコーティング液(コーティング組成物)を塗布(膜厚3μm)し、80℃で2分間溶媒を揮発させた後100℃で0.5時間加熱処理し、更に120℃で2時間加熱処理して塗膜を硬化させ、硬化膜を有する光学部材を形成した。 上記(1)~(6)に示す試験を実施した。評価結果を表1、及び表2に示す。
(Formation and evaluation of cured film)
A glass substrate and a PET film (trade name Cosmoshine A4300 manufactured by Toyobo Co., Ltd.) were prepared, a coating liquid (coating composition) was applied to them by a spin coating method (thickness: 3 μm), and the solvent was removed at 80° C. for 2 minutes. After volatilization, heat treatment was performed at 100° C. for 0.5 hour, and further heat treatment was performed at 120° C. for 2 hours to cure the coating film, thereby forming an optical member having a cured film. The tests shown in (1) to (6) above were carried out. Evaluation results are shown in Tables 1 and 2.
実施例2
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を10.5質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を4.5質量部にそれぞれ変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 2
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was added to 10.5 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) was changed to 4.5 parts by mass, a coating composition was prepared and a cured film was formed and evaluated in the same manner as in Example 1.
実施例3
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を9.0質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を6.0質量部にそれぞれ変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 3
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 9.0 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) was changed to 6.0 parts by mass, a coating composition was prepared and a cured film was formed and evaluated in the same manner as in Example 1.
実施例4
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を7.5質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を7.5質量部にそれぞれ変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 4
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 7.5 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) was changed to 7.5 parts by mass, a coating composition was prepared and a cured film was formed and evaluated in the same manner as in Example 1.
実施例5
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を6.0質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を9.0質量部にそれぞれ変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 5
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 6.0 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) was changed to 9.0 parts by mass, a coating composition was prepared and a cured film was formed and evaluated in the same manner as in Example 1.
実施例6
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を15.0質量部に変更し、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)を添加しない以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 6
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 15.0 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name Except for not adding EX-321L), preparation of the coating composition and formation and evaluation of the cured film were carried out in the same manner as in Example 1.
実施例7
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を4.5質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を10.5質量部にそれぞれ変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 7
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 4.5 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) was changed to 10.5 parts by mass, the coating composition was prepared and the cured film was formed and evaluated in the same manner as in Example 1.
実施例8
実施例2において、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を3.0質量部に変更し、エポキシ変性イソシアヌレート(日産化学(株) 商品名TEPIC-VL)1.5質量部を加えた以外
は、実施例2と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 8
In Example 2, the amount of trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX-321L) was changed to 3.0 parts by mass, and epoxy-modified isocyanurate (Nissan Chemical Co., Ltd. trade name Preparation of a coating composition and formation and evaluation of a cured film were carried out in the same manner as in Example 2, except that 1.5 parts by mass of TEPIC-VL) was added.
実施例9
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を14.0質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を6.0質量部に、プロピレングリコールモノメチルエーテルの添加量を29.6質量部に、製造例1で得た、表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C4)のメチルエチルケトン分散ゾルの添加量を32.8質量部に、カチオン重合開始剤(三新化学工業(株)製 商品名サンエイドSI-100)のプロピレングリコールモノメチルエーテル溶液(サンエイドSI-100 5.0質量%)の添加量を4.0質量部に、保存安定化助剤(三新化学工業(株)製 商品名SI助剤)のN-メチル-2-ピロリドン溶液(SI助剤 5.0質量%)の添加量を0.20質量部にそれぞれ変更し、メチルエチルケトン11.4質量部を加えた以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 9
In Example 1, the added amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was 14.0 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) to 6.0 parts by mass, the amount of propylene glycol monomethyl ether to be added to 29.6 parts by mass, and the organosilicon compound having a phenyl group on the surface obtained in Production Example 1. The addition amount of the methyl ethyl ketone dispersion sol of the titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C4) modified with silicon dioxide-stannic oxide composite oxide was changed to 32.8 parts by mass, and the cationic polymerization was started. Addition amount of propylene glycol monomethyl ether solution (San-Aid SI-100 5.0% by mass) of agent (manufactured by Sanshin Chemical Industry Co., Ltd., trade name San-Aid SI-100) to 4.0 parts by mass, storage stabilization aid The amount of N-methyl-2-pyrrolidone solution (SI aid 5.0% by mass) of (Sanshin Chemical Industry Co., Ltd. trade name SI aid) was changed to 0.20 parts by mass, and methyl ethyl ketone 11 Preparation of a coating composition and formation and evaluation of a cured film were carried out in the same manner as in Example 1, except that 4 parts by mass was added.
実施例10
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を8.4質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を3.6質量部に、プロピレングリコールモノメチルエーテルの添加量を24.5質量部に、製造例1で得た、表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C4)のメチルエチルケトン分散ゾルの添加量を59.0質量部に、カチオン重合開始剤(三新化学工業(株)製 商品名サンエイドSI-100)のプロピレングリコールモノメチルエーテル溶液(サンエイドSI-100 5.0質量%)の添加量を2.4質量部に、保存安定化助剤(三新化学工業(株)製 商品名SI助剤)のN-メチル-2-ピロリドン溶液(SI助剤 5.0質量%)の添加量を0.12質量部にそれぞれ変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 10
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 8.4 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) to 3.6 parts by mass, the amount of propylene glycol monomethyl ether to be added to 24.5 parts by mass, and the organosilicon compound having a phenyl group on the surface obtained in Production Example 1. The addition amount of the methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C4) modified with silicon dioxide-stannic oxide composite oxide was changed to 59.0 parts by mass, and cationic polymerization was started. Addition amount of propylene glycol monomethyl ether solution (San-Aid SI-100 5.0% by mass) of agent (manufactured by Sanshin Chemical Industry Co., Ltd., trade name San-Aid SI-100) to 2.4 parts by mass, storage stabilization aid Except for changing the amount of N-methyl-2-pyrrolidone solution (SI Auxiliary 5.0% by mass) of (Sanshin Chemical Industry Co., Ltd. trade name SI Auxiliary) to 0.12 parts by mass, Preparation of the coating composition and formation and evaluation of the cured film were carried out in the same manner as in Example 1.
実施例11
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を7.0質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を3.0質量部に、プロピレングリコールモノメチルエーテルの添加量を20.3質量部に、製造例1で得た、表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C4)のメチルエチルケトン分散ゾルの添加量を65.6質量部に、カチオン重合開始剤(三新化学工業(株)製 商品名サンエイドSI-100)のプロピレングリコールモノメチルエーテル溶液(サンエイドSI-100 5.0質量%)の添加量を2.0質量部に、保存安定化助剤(三新化学工業(株)製 商品名SI助剤)のN-メチル-2-ピロリドン溶液(SI助剤 5.0質量%)の添加量を0.10質量部にそれぞれ変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 11
In Example 1, the added amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 7.0 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) to 3.0 parts by mass, the amount of propylene glycol monomethyl ether to be added to 20.3 parts by mass, and the organosilicon compound having a phenyl group on the surface obtained in Production Example 1. The addition amount of the methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C4) modified with silicon dioxide-stannic oxide composite oxide was changed to 65.6 parts by mass, and cationic polymerization was started. Addition amount of propylene glycol monomethyl ether solution (San-Aid SI-100 5.0% by mass) of agent (manufactured by Sanshin Chemical Industry Co., Ltd., trade name San-Aid SI-100) to 2.0 parts by mass, storage stabilization aid Except for changing the amount of N-methyl-2-pyrrolidone solution (SI Auxiliary 5.0% by mass) added to 0.10 parts by mass (manufactured by Sanshin Chemical Industry Co., Ltd. under the trade name of SI Auxiliary), Preparation of the coating composition and formation and evaluation of the cured film were carried out in the same manner as in Example 1.
実施例12
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を6.0質量部に、トリメチロールプロパンポリグリシジルエーテ
ル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を2.6質量部に、プロピレングリコールモノメチルエーテルの添加量を17.4質量部に、製造例1で得た、表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C4)のメチルエチルケトン分散ゾルの添加量を70.3質量部に、カチオン重合開始剤(三新化学工業(株)製 商品名サンエイドSI-100)のプロピレングリコールモノメチルエーテル溶液(サンエイドSI-100 5.0質量%)の添加量を1.7質量部に、保存安定化助剤(三新化学工業(株)製 商品名SI助剤)のN-メチル-2-ピロリドン溶液(SI助剤 5.0質量%)の添加量を0.09質量部にそれぞれ変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 12
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 6.0 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) to 2.6 parts by mass, the amount of propylene glycol monomethyl ether to be added to 17.4 parts by mass, and the organosilicon compound having a phenyl group on the surface obtained in Production Example 1. The addition amount of the methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C4) modified with silicon dioxide-stannic oxide composite oxide was changed to 70.3 parts by mass, and cationic polymerization was started. Addition amount of propylene glycol monomethyl ether solution (San-Aid SI-100 5.0% by mass) of agent (manufactured by Sanshin Chemical Industry Co., Ltd., trade name San-Aid SI-100) to 1.7 parts by mass, storage stabilization aid Except for changing the amount of N-methyl-2-pyrrolidone solution (SI Auxiliary 5.0% by mass) added to 0.09 parts by mass (manufactured by Sanshin Chemical Industry Co., Ltd. under the trade name of SI Auxiliary), Preparation of the coating composition and formation and evaluation of the cured film were carried out in the same manner as in Example 1.
実施例13
実施例2において、製造例1で得たコロイド粒子(C4)の代わりに、製造例2で得た表面にメタクリル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C5)のメチルエチルケトン分散ゾル49.2質量部を加えた以外は、実施例2と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 13
In Example 2, instead of the colloidal particles (C4) obtained in Production Example 1, the silicon dioxide-stannic oxide composite oxide obtained in Production Example 2 was bonded to the organosilicon compound having a methacrylic group on the surface. A coating composition was prepared and prepared in the same manner as in Example 2, except that 49.2 parts by mass of a methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C5) modified with a substance was added. Formation and evaluation of the cured film were carried out.
実施例14
実施例2において、製造例1で得たコロイド粒子(C4)の代わりに、製造例3で得た表面にメチル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C6)のメチルエチルケトン分散ゾル49.2質量部を加えた以外は、実施例2と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 14
In Example 2, instead of the colloidal particles (C4) obtained in Production Example 1, the organic silicon compound having a methyl group on the surface obtained in Production Example 3 was bonded to the silicon dioxide-stannic oxide composite oxide. A coating composition was prepared and prepared in the same manner as in Example 2, except that 49.2 parts by mass of a methyl ethyl ketone dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C6) modified with a substance was added. Formation and evaluation of the cured film were carried out.
実施例15
実施例2において、プロピレングリコールモノメチルエーテルの代わりに、メチルエチルケトン30.7質量部を加え、製造例1で得たコロイド粒子(C4)の代わりに、製造例4で得た表面にフェニル基とグリシジル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化チタン-酸化第二スズ-酸化ジルコニウム複合酸化物コロイド粒子(C7)のプロピレングリコールモノメチルエーテル分散ゾル49.2質量部を加えた以外は、実施例2と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 15
In Example 2, instead of propylene glycol monomethyl ether, 30.7 parts by mass of methyl ethyl ketone was added, and instead of the colloidal particles (C4) obtained in Production Example 1, phenyl groups and glycidyl groups were added to the surface obtained in Production Example 4. Propylene glycol monomethyl ether dispersion sol of titanium oxide-stannic oxide-zirconium oxide composite oxide colloidal particles (C7) modified with silicon dioxide-stannic oxide composite oxide, in which an organosilicon compound having Preparation of a coating composition and formation and evaluation of a cured film were carried out in the same manner as in Example 2, except that 49.2 parts by mass was added.
実施例16
実施例2において、製造例1で得たコロイド粒子(C4)の代わりに、製造例5で得た表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化ジルコニウム-酸化第二スズ複合酸化物コロイド粒子(C8)のメチルエチルケトン分散ゾル49.2質量部を加えた以外は、実施例2と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 16
In Example 2, instead of the colloidal particles (C4) obtained in Production Example 1, the organic silicon compound having a phenyl group on the surface obtained in Production Example 5 was bonded to the silicon dioxide-stannic oxide composite oxide. Preparation of a coating composition and formation of a cured film were performed in the same manner as in Example 2, except that 49.2 parts by mass of a methyl ethyl ketone dispersion sol of zirconium oxide-stannic oxide composite oxide colloidal particles (C8) modified with a substance was added. Formulation and evaluation were carried out.
実施例17
(コーティング組成物の作製)
実施例14において、プロピレングリコールモノメチルエーテルの添加量を32.9質量部に変更し、カチオン重合開始剤(三新化学工業(株) 商品名サンエイドSI-100)のプロピレングリコールモノメチルエーテル溶液(サンエイドSI-100 5.0質量%)の代わりに、光カチオン重合開始剤(サンアプロ(株) 商品名CPI-101A)0.9質量部を加え、保存安定化助剤(三新化学工業(株) 商品名SI助剤)のN-メチル-2-ピロリドン溶液(SI助剤 5.0質量%)を使用しない以外は、実施例
14と同様にコーティング組成物を作製した。
Example 17
(Preparation of coating composition)
In Example 14, the amount of propylene glycol monomethyl ether added was changed to 32.9 parts by mass, and a propylene glycol monomethyl ether solution (San-Aid SI -100 5.0% by mass), 0.9 parts by mass of a photocationic polymerization initiator (San-Apro Co., Ltd. trade name CPI-101A) is added, and a storage stabilization aid (Sanshin Chemical Industry Co., Ltd. product A coating composition was prepared in the same manner as in Example 14 except that the N-methyl-2-pyrrolidone solution (SI auxiliary agent 5.0% by mass) was not used.
(硬化膜の形成及び評価)
ガラス基板とPETフィルム(東洋紡(株)製 商品名コスモシャインA4300)を用意し、これらにスピンコート法でコーティング液(コーティング組成物)を塗布(膜厚3μm)し、80℃で2分間溶媒を揮発させた後、照射強度28mW/cm2の高圧水銀ランプで5分間紫外線処理して塗膜を硬化させ、硬化膜を有する光学部材を形成した。 上記(1)~(6)に示す試験を実施した。評価結果を表1、及び表2に示す。
(Formation and evaluation of cured film)
A glass substrate and a PET film (trade name Cosmoshine A4300 manufactured by Toyobo Co., Ltd.) were prepared, a coating liquid (coating composition) was applied to them by a spin coating method (thickness: 3 μm), and the solvent was removed at 80° C. for 2 minutes. After volatilization, the coating film was cured by ultraviolet treatment for 5 minutes with a high-pressure mercury lamp with an irradiation intensity of 28 mW/cm 2 to form an optical member having a cured film. The tests shown in (1) to (6) above were carried out. Evaluation results are shown in Tables 1 and 2.
実施例18
実施例2において、製造例1で得たコロイド粒子(C4)の代わりに、製造例7で得た表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化第二スズ複合酸化物コロイド粒子(C9)のメチルエチルケトン分散ゾル49.2質量部を加えた以外は、実施例2と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 18
In Example 2, instead of the colloidal particles (C4) obtained in Production Example 1, the organic silicon compound having a phenyl group on the surface obtained in Production Example 7 was bonded to the silicon dioxide-stannic oxide composite oxide. A coating composition was prepared and a cured film was formed and evaluated in the same manner as in Example 2, except that 49.2 parts by mass of a methyl ethyl ketone dispersion sol of stannic oxide composite oxide colloidal particles (C9) modified with a substance was added. carried out.
実施例19
実施例15において、製造例5で得たコロイド粒子(C8)の代わりに、製造例7で得た表面にフェニル基を有する有機ケイ素化合物が結合してなる、二酸化珪素-酸化第二スズ複合酸化物で変性された酸化第二スズ複合酸化物コロイド粒子(C9)のメチルエチルケトン分散ゾル49.2質量部を加えた以外は、実施例15と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Example 19
In Example 15, instead of the colloidal particles (C8) obtained in Production Example 5, the silicon dioxide-stannic oxide composite oxide obtained in Production Example 7 was bonded to the organosilicon compound having a phenyl group on the surface. A coating composition was prepared and a cured film was formed and evaluated in the same manner as in Example 15, except that 49.2 parts by mass of a methyl ethyl ketone dispersion sol of stannic oxide composite oxide colloidal particles (C9) modified with a substance was added. carried out.
比較例1
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)を添加せず、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を15.0質量部に変更した以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Comparative example 1
In Example 1, no epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was added, and the added amount of trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX-321L) was Preparation of a coating composition and formation and evaluation of a cured film were carried out in the same manner as in Example 1, except that the content was changed to 15.0 parts by mass.
比較例2
実施例2において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の代わりに、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名X-40-2669)10.5質量部を添加した以外は、実施例2と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Comparative example 2
In Example 2, instead of the epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470), 10.5 parts by mass of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name X-40-2669) Preparation of the coating composition and formation and evaluation of the cured film were carried out in the same manner as in Example 2 except that the was added.
比較例3
実施例1において、エポキシ変性オルガノシロキサン(信越化学工業(株)製 商品名KR470)の添加量を16.8質量部に、トリメチロールプロパンポリグリシジルエーテル(ナガセケムテックス(株)製 商品名EX-321L)の添加量を7.2質量部に、プロピレングリコールモノメチルエーテルの添加量を31.9質量部に、カチオン重合開始剤(三新化学工業(株)製 商品名サンエイドSI-100)のプロピレングリコールモノメチルエーテル溶液(サンエイドSI-100 5.0質量%)の添加量を4.8質量部に、保存安定化助剤(三新化学工業(株)製 商品名SI助剤)のN-メチル-2-ピロリドン溶液(SI助剤 5.0質量%)の添加量を0.24質量部にそれぞれ変更し、製造例1で得た表面にフェニル基を有する有機ケイ素化合物を結合させた変性金属酸化物コロイド粒子(C2)は添加せず、代わりにメチルエチルケトン37.1質量部を加えた以外は、実施例1と同様にコーティング組成物の作製及び硬化膜の形成・評価を実施した。
Comparative example 3
In Example 1, the addition amount of epoxy-modified organosiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KR470) was changed to 16.8 parts by mass, and trimethylolpropane polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name EX- 321L) to 7.2 parts by mass, the amount of propylene glycol monomethyl ether to 31.9 parts by mass, and the cationic polymerization initiator (manufactured by Sanshin Chemical Industry Co., Ltd., trade name San-Aid SI-100) of propylene The amount of glycol monomethyl ether solution (San-Aid SI-100 5.0% by mass) was added to 4.8 parts by mass, and the storage stabilization aid (trade name SI aid manufactured by Sanshin Chemical Industry Co., Ltd.) N-methyl -Modified metal obtained in Production Example 1 by changing the amount of 2-pyrrolidone solution (5.0% by mass of SI auxiliary agent) added to 0.24 parts by mass, and bonding an organosilicon compound having a phenyl group to the surface obtained in Production Example 1 Preparation of a coating composition and formation and evaluation of a cured film were carried out in the same manner as in Example 1 except that 37.1 parts by mass of methyl ethyl ketone was added instead of colloidal oxide particles (C2).
表1において、信越化学工業(株)製 商品名KR470を(i)、ナガセケムテック
ス(株)製 商品名EX-321Lを(ii)、日産化学(株) 商品名TEPIC-VLを(iii)、信越化学工業(株)製 商品名X-40-2669を(iv)で示す。
In Table 1, Shin-Etsu Chemical Co., Ltd. product name KR470 (i), Nagase ChemteX Co., Ltd. product name EX-321L (ii), Nissan Chemical Co., Ltd. product name TEPIC-VL (iii) , trade name X-40-2669 manufactured by Shin-Etsu Chemical Co., Ltd. is indicated by (iv).
〔表1〕
表1
―――――――――――――――――――――――――――――――――
組成物固形分中の含有量 [質量部]
(i) (ii) (iii) (iv) 粒子 使用した粒子
実施例1 12.0 3.0 - - 15.0 C4
実施例2 10.5 4.5 - - 15.0 C4
実施例3 9.0 6.0 - - 15.0 C4
実施例4 7.5 7.5 - - 15.0 C4
実施例5 6.0 9.0 - - 15.0 C4
実施例6 15.0 - - - 15.0 C4
実施例7 4.5 10.5 - - 15.0 C4
実施例8 10.5 3.0 1.5 - 15.0 C4
実施例9 14.0 6.0 - - 10.0 C4
実施例10 8.4 3.6 - - 18.0 C4
実施例11 7.0 3.0 - - 20.0 C4
実施例12 6.0 2.6 - - 21.4 C4
実施例13 10.5 4.5 - - 15.0 C5
実施例14 10.5 4.5 - - 15.0 C6
実施例15 10.5 4.5 - - 15.0 C7
実施例16 10.5 4.5 - - 15.0 C8
実施例17 10.5 4.5 - - 15.0 C8
実施例18 10.5 4.5 - - 15.0 C9
実施例19 10.5 4.5 - - 15.0 C9
比較例1 - 15.0 - - 15.0 C4
比較例2 - 4.5 - 10.5 15.0 C4
比較例3 16.8 7.2 - - - -
―――――――――――――――――――――――――――――――――
[Table 1]
Table 1
―――――――――――――――――――――――――――――――――
Content in composition solid content [parts by mass]
(i) (ii) (iii) (iv) Particles Used Particle Example 1 12.0 3.0 - - 15.0 C4
Example 2 10.5 4.5 - - 15.0 C4
Example 3 9.0 6.0 - - 15.0 C4
Example 4 7.5 7.5 - - 15.0 C4
Example 5 6.0 9.0 - - 15.0 C4
Example 6 15.0 - - - 15.0 C4
Example 7 4.5 10.5 - - 15.0 C4
Example 8 10.5 3.0 1.5 - 15.0 C4
Example 9 14.0 6.0 - - 10.0 C4
Example 10 8.4 3.6 - - 18.0 C4
Example 11 7.0 3.0 - - 20.0 C4
Example 12 6.0 2.6 - - 21.4 C4
Example 13 10.5 4.5 - - 15.0 C5
Example 14 10.5 4.5 - - 15.0 C6
Example 15 10.5 4.5 - - 15.0 C7
Example 16 10.5 4.5 - - 15.0 C8
Example 17 10.5 4.5 - - 15.0 C8
Example 18 10.5 4.5 - - 15.0 C9
Example 19 10.5 4.5 - - 15.0 C9
Comparative Example 1 - 15.0 - - 15.0 C4
Comparative Example 2 - 4.5 - 10.5 15.0 C4
Comparative Example 3 16.8 7.2 - - - -
―――――――――――――――――――――――――――――――――
〔表2〕
表2
――――――――――――――――――――――――――――――――――
硬化方法 屈折率 硬度 密着性 透明性 耐光性 保存安定性
実施例1 熱 1.65 A A A A A
実施例2 熱 1.65 A A A A A
実施例3 熱 1.65 A A A A A
実施例4 熱 1.65 A A A A A
実施例5 熱 1.66 A A A A A
実施例6 熱 1.65 A A A A A
実施例7 熱 1.66 A A A A B
実施例8 熱 1.66 A A A A A
実施例9 熱 1.61 A A A A A
実施例10 熱 1.70 A A A A A
実施例11 熱 1.72 A A A A A
実施例12 熱 1.75 A A A A A
実施例13 熱 1.64 A A A A A
実施例14 熱 1.64 A A A A A
実施例15 熱 1.64 A A A A A
実施例16 熱 1.58 A A A A A
実施例17 光 1.58 A A A A A
実施例18 熱 1.58 A A A A A
実施例19 光 1.58 A A A A A
比較例1 熱 1.66 C A A A -
比較例2 熱 - B A D B C
比較例3 熱 1.51 C A A A A
―――――――――――――――――――――――――――――――――
[Table 2]
Table 2
――――――――――――――――――――――――――――――――――
Curing method Refractive index Hardness Adhesion Transparency Light resistance Storage stability Example 1 Heat 1.65 A A A A A
Example 2 Heat 1.65 A A A A A
Example 3 Heat 1.65 A A A A A
Example 4 Heat 1.65 A A A A A
Example 5 Heat 1.66 A A A A A
Example 6 Heat 1.65 A A A A A
Example 7 Heat 1.66 A A A A B
Example 8 Heat 1.66 A A A A A
Example 9 Thermal 1.61 A A A A A
Example 10 Heat 1.70 A A A A A
Example 11 Thermal 1.72 A A A A A
Example 12 Heat 1.75 A A A A A
Example 13 Thermal 1.64 A A A A A
Example 14 Thermal 1.64 A A A A A
Example 15 Thermal 1.64 A A A A A
Example 16 Heat 1.58 A A A A A
Example 17 Light 1.58 A A A A A
Example 18 Thermal 1.58 A A A A A
Example 19 Light 1.58 A A A A A
Comparative Example 1 Thermal 1.66 C A A A -
Comparative Example 2 Heat - B A D B C
Comparative Example 3 Heat 1.51 C A A A A
―――――――――――――――――――――――――――――――――
表1、及び表2に示すように、実施例1~19のいずれも、硬度、密着性、透明性、耐光性、及びコート材の保存安定性に優れるものであった。 As shown in Tables 1 and 2, all of Examples 1 to 19 were excellent in hardness, adhesion, transparency, light resistance, and storage stability of the coating material.
一方、比較例1~3は、硬度、密着性、透明性、耐光性、及びコート材の保存安定性において十分なものとは言えなかった。 On the other hand, Comparative Examples 1 to 3 were unsatisfactory in terms of hardness, adhesion, transparency, light resistance, and storage stability of the coating material.
本願発明のコーティング組成物が被覆された基材は、光学部材、機械部品材料、電子部品材料、建築材料、成形材料等の種々の分野に適用することができる。 Substrates coated with the coating composition of the present invention can be applied to various fields such as optical members, mechanical component materials, electronic component materials, building materials, and molding materials.
Claims (8)
原子にSi-C結合又はSi-H結合で結合しているものであり、nは3~5の整数を示す。)であり、
前記金属酸化物粒子(A)が、2~100nmの平均粒子径を有し、且つTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属の酸化物又は複合酸化物(a1)を核として、その表面を1~40nmの平均一次粒子径を有し、且つTi、Sn、Zr、Si、Al、Sb、Fe、Cu、Zn、Y、Nb、Mo、In、Ta、Pb、Bi、Hf、Ge、Ce、Wからなる群より選ばれた少なくとも1種の金属の酸化物又は複合酸化物(a2)の粒子から成る少なくとも1層で被覆した金属酸化物粒子(A)であって、(a1)からなる粒子と(a2)の粒子からなる層は金属成分が異なるか又は複合酸化物として異なり、最外層に被覆された(a2)は金属成分としてSiを含んでいるものであり、そして
金属酸化物粒子(A)は、
(a1)からなる粒子に、(a2)の粒子からなる被覆層が形成されたものであるか、
又は、
(a1)からなる粒子に、(a2)の粒子からなる中間層と、(a2)の粒子からなる被覆層が形成されたものである、
上記コーティング組成物。 Metal oxide particles (A) having an average particle diameter of 2 nm to 100 nm and surface-coated with a hydrolyzable silane containing a hydrolyzable silane of formula (1a) and / or formula (1b), and formula (2 and a cycloaliphatic epoxy compound (B) of formula (1a) and/or (1b), wherein the hydrolyzable silane of formula (1a) and/or formula (1b) is:
It is bonded to an atom with a Si—C bond or Si—H bond, and n is an integer of 3-5. ) and
The metal oxide particles (A) have an average particle diameter of 2 to 100 nm, and are Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo, In, Ta, Pb, Bi, Hf, Ge, Ce, and at least one metal oxide or composite oxide (a1) selected from the group consisting of W is used as a nucleus, and the surface thereof has an average primary particle size of 1 to 40 nm. and at least selected from the group consisting of Ti, Sn, Zr, Si, Al, Sb, Fe, Cu, Zn, Y, Nb, Mo, In, Ta, Pb, Bi, Hf, Ge, Ce, W Metal oxide particles (A) coated with at least one layer of particles of one kind of metal oxide or composite oxide (a2), the layer comprising particles of (a1) and particles of (a2) have different metal components or different composite oxides, and (a2) coated on the outermost layer contains Si as a metal component, and
The metal oxide particles (A) are
The particles (a1) are coated with the particles (a2), or
or
An intermediate layer made of the particles (a2) and a coating layer made of the particles (a2) are formed on the particles made of (a1).
The above coating composition.
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| JP2003292893A (en) | 2002-04-01 | 2003-10-15 | Shin Etsu Chem Co Ltd | Photocurable coating agent for forming hard protective film and article formed with the film |
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