Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP7207349B2 - Grinding device and method - Google Patents
[go: Go Back, main page]

JP7207349B2 - Grinding device and method - Google Patents

Grinding device and method Download PDF

Info

Publication number
JP7207349B2
JP7207349B2 JP2020032541A JP2020032541A JP7207349B2 JP 7207349 B2 JP7207349 B2 JP 7207349B2 JP 2020032541 A JP2020032541 A JP 2020032541A JP 2020032541 A JP2020032541 A JP 2020032541A JP 7207349 B2 JP7207349 B2 JP 7207349B2
Authority
JP
Japan
Prior art keywords
grinding
grinding wheel
image
wheel
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020032541A
Other languages
Japanese (ja)
Other versions
JP2021133468A (en
Inventor
匡平 石田
成人 佐々木
健太 枡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
JFE Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JFE Steel Corp filed Critical JFE Steel Corp
Priority to JP2020032541A priority Critical patent/JP7207349B2/en
Publication of JP2021133468A publication Critical patent/JP2021133468A/en
Application granted granted Critical
Publication of JP7207349B2 publication Critical patent/JP7207349B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Description

本発明は、研削砥石を用いて鋼材等の被研削材を研削する研削装置及び方法に関するものである。 The present invention relates to a grinding apparatus and method for grinding a material to be ground such as steel using a grinding wheel.

鋼板等の表面を滑らかな状態に整えるために研削加工が行われており、この研削加工においては原理的に研削砥石が摩耗しながら被研削材の表面の微小突起を削り取っていく。従来、鋼板等の研削は、作業者が小型の研削機器を手で押し付け、もしくは体重をかけて行われていた。研削砥石は研削作業が進むにつれて摩耗していくため、研削深さの調整は作業者の経験と勘に頼っているとともに、重筋作業になっていた。また、研削中に研削深さを測定することはできないため、研削後に研削面を変位計で研削深さを測定する、もしくは超音波厚さ計を用いて鋼材の厚さを測定することが行われていた。 Grinding is performed to smoothen the surface of a steel plate or the like. In this grinding process, in principle, the grinding wheel wears away fine projections on the surface of the material to be ground. Conventionally, the grinding of a steel plate or the like has been performed by a worker manually pressing a small grinding device or putting his or her weight on it. Since the grinding wheel wears out as the grinding work progresses, the adjustment of the grinding depth relies on the experience and intuition of the operator, and is a heavy-duty task. In addition, since it is not possible to measure the grinding depth during grinding, it is possible to measure the grinding depth of the ground surface with a displacement gauge after grinding, or to measure the thickness of the steel material using an ultrasonic thickness gauge. It was

一方、研削深さを測定しながら研削作業を自動で行う研削機が提案されている(例えば特許文献1参照)。特許文献1には、研削中に研削火花をカメラで検出し、研削火花の発生量から研削量(研削深さ)を推定して、研削火花の発生量が設定範囲内になるように研削ベルトの押し付け量を制御する方法が開示されている。 On the other hand, there has been proposed a grinder that automatically performs a grinding operation while measuring the grinding depth (see, for example, Patent Document 1). In Patent Document 1, grinding sparks are detected by a camera during grinding, the grinding amount (grinding depth) is estimated from the amount of grinding sparks generated, and the grinding belt is adjusted so that the amount of grinding sparks generated is within a set range. A method for controlling the amount of pressing of the is disclosed.

特開平7-164318号公報JP-A-7-164318

しかしながら、特許文献1のように研削火花に基づき研削の制御を行った場合、研削火花の発生量は、砥粒の種類、被研削材の種類もしくは研削条件等によって異なるため、正確に研削状況を把握することができず、精密な研削作業の制御を行うことができない。 However, when grinding is controlled based on grinding sparks as in Patent Document 1, the amount of grinding sparks generated varies depending on the type of abrasive grains, the type of material to be ground, the grinding conditions, etc., so the grinding situation can be accurately determined. It is not possible to grasp and control the precise grinding operation.

本発明は、上記のような事情に鑑みてなされたものであり、精密な被研削材の研削を行うことができる研削装置及び方法を提供することを目的とする。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a grinding apparatus and method capable of performing precise grinding of a material to be ground.

[1] 被研削材を研削する研削砥石と、前記研削砥石を回転させる回転駆動部と、前記研削砥石を保持し前記研削砥石を前記被研削材に押し付ける押し付け量調整部とを備える研削ユニットと、
前記鋼材を研削している前記研削砥石を撮像して研削画像を取得する撮像装置と、
前記撮像装置により取得された前記研削画像から前記研削砥石の摩耗量を検出する画像処理装置と、
検出した前記研削砥石の摩耗量に基づいて、前記研削ユニットの動作を制御する動作制御装置と、
を有する研削装置。
[2] 前記動作制御装置は、前記研削砥石の摩耗量に基づいて前記研削ユニットの前記押し付け量調整部を制御し、前記被研削材に対する前記研削砥石の前記押し付け量を調整する[1]に記載の研削装置。
[3] 前記撮像装置は、研削中の前記研削砥石全体を撮像した前記研削画像を取得するものであり、
前記画像処理装置は、研削前の前記研削砥石の基準直径の情報を有しており、前記研削画像から研削中の前記研削砥石の周縁を抽出し、抽出した前記研削砥石の周縁から前記研削砥石の直径を検出し、検出した前記研削砥石の直径と前記基準直径との差分を用いて摩耗量を検出する[1]または[2]に記載の研削装置。
[4] 前記撮像装置は、研削中の前記研削砥石の周縁の一部を撮像した前記研削画像を取得するものであり、
前記画像処理装置は、研削前の前記研削砥石の基準研削画像を有しており、前記研削画像から研削中の前記研削砥石の周縁の一部を抽出し、抽出した前記研削砥石の周縁と前記基準研削画像との差分を用いて摩耗量を検出する[1]または[2]に記載の研削装置。
[5] 被研削材を研削する研削砥石と、前記研削砥石を回転させる回転駆動部と、前記研削砥石を保持しており、前記研削砥石を前記被研削材に押し付ける押し付け量調整部とを備える研削ユニットを用いて被研削材を研削する研削方法であって、
前記被研削材研削している前記研削砥石を撮像装置により撮像して研削画像を取得する取得工程と、
取得した前記研削画像から前記研削砥石の摩耗量を検出する検出工程と、
検出した前記研削砥石の摩耗量に基づいて、前記研削ユニットの動作を制御する制御工程と、を有する研削方法。
[6] 前記制御工程は、研削砥石の摩耗量に基づいて前記研削ユニットの前記押し付け量調整部を制御し、前記被研削材に対する前記研削砥石の前記押し付け量を調整する[5]に記載の研削方法。
[7] 前記研削画像は、研削中の前記研削砥石全体を撮像し取得されたものであり、
摩耗量を検出する際、前記研削画像から研削中の前記研削砥石の周縁を抽出し、抽出した前記研削砥石の周縁から前記研削砥石の直径を検出し、検出した前記研削砥石の直径と研削前の前記研削砥石の基準直径との差分を用いて摩耗量を検出する[5]または[6]に記載の研削方法。
[8] 前記研削画像は、研削中の前記研削砥石の周縁の一部を撮像し取得されたものであり、
摩耗量を検出する際、前記研削画像から研削中の前記研削砥石の周縁の一部を抽出し、抽出した前記研削砥石の周縁の一部と研削前の前記研削砥石の基準研削画像との差分を用いて摩耗量を検出する[5]または[6]に記載の研削方法。
[1] A grinding unit comprising a grinding wheel for grinding a material to be ground, a rotation driving section for rotating the grinding wheel, and a pressing amount adjusting section for holding the grinding wheel and pressing the grinding wheel against the material to be ground. ,
an imaging device that captures an image of the grinding wheel grinding the steel material to obtain a grinding image;
an image processing device that detects the wear amount of the grinding wheel from the grinding image acquired by the imaging device;
an operation control device that controls the operation of the grinding unit based on the detected amount of wear of the grinding wheel;
Grinding device with
[2] In [1], the operation control device controls the pressing amount adjusting section of the grinding unit based on the amount of wear of the grinding wheel, and adjusts the pressing amount of the grinding wheel against the material to be ground. Grinding equipment as described.
[3] The imaging device acquires the grinding image of the entire grinding wheel being ground,
The image processing device has information on the reference diameter of the grinding wheel before grinding, extracts the periphery of the grinding wheel during grinding from the grinding image, and extracts the grinding wheel from the extracted periphery of the grinding wheel. is detected, and the wear amount is detected using the difference between the detected diameter of the grinding wheel and the reference diameter.
[4] The imaging device acquires the grinding image by imaging a part of the periphery of the grinding wheel being ground,
The image processing device has a reference grinding image of the grinding wheel before grinding, extracts a part of the periphery of the grinding wheel during grinding from the grinding image, and extracts the periphery of the grinding wheel and the The grinding device according to [1] or [2], wherein the wear amount is detected using a difference from the reference grinding image.
[5] A grinding wheel that grinds a material to be ground, a rotation drive part that rotates the grinding wheel, and a pressing amount adjusting part that holds the grinding wheel and presses the grinding wheel against the material to be ground. A grinding method for grinding a material to be ground using a grinding unit,
an acquisition step of acquiring a grinding image by imaging the grinding wheel grinding the material to be ground with an imaging device;
a detection step of detecting the wear amount of the grinding wheel from the acquired grinding image;
and a control step of controlling the operation of the grinding unit based on the detected wear amount of the grinding wheel.
[6] The control step according to [5], wherein the control step controls the pressing amount adjusting section of the grinding unit based on the amount of wear of the grinding wheel, and adjusts the pressing amount of the grinding wheel against the material to be ground. grinding method.
[7] The grinding image is acquired by imaging the entire grinding wheel during grinding,
When detecting the amount of wear, the periphery of the grinding wheel during grinding is extracted from the grinding image, the diameter of the grinding wheel is detected from the extracted periphery of the grinding wheel, and the detected diameter of the grinding wheel and the diameter before grinding are measured. The grinding method according to [5] or [6], wherein the amount of wear is detected using the difference between the reference diameter of the grinding wheel and the grinding wheel.
[8] The grinding image is acquired by imaging a part of the periphery of the grinding wheel being ground,
When detecting the wear amount, a part of the periphery of the grinding wheel being ground is extracted from the grinding image, and a difference between the extracted part of the periphery of the grinding wheel and a reference grinding image of the grinding wheel before grinding. The grinding method according to [5] or [6], wherein the amount of wear is detected using

本発明によれば、撮像装置により取得された研削画像から研削砥石の摩耗量を精度よく検出し、この摩耗量に基づいて研削ユニットの動作を制御するため、精密な被研削材の研削を行うことができる。 According to the present invention, the wear amount of the grinding wheel is accurately detected from the grinding image acquired by the imaging device, and the operation of the grinding unit is controlled based on the wear amount, so that the material to be ground is precisely ground. be able to.

本発明の研削装置の好ましい実施形態を示す模式図である。It is a schematic diagram showing a preferred embodiment of the grinding apparatus of the present invention. 図1における研削ユニットの一例を示す模式図である。FIG. 2 is a schematic diagram showing an example of a grinding unit in FIG. 1; 撮像装置により撮像された研削画像の一例を示す模式図である。It is a schematic diagram which shows an example of the grinding image imaged by the imaging device. 研削画像Pの別の一例を示す模式図である。8 is a schematic diagram showing another example of the grinding image P; FIG.

以下、図面を参照して本発明の実施形態について説明する。図1は本発明の研削装置の好ましい実施形態を示す模式図である。図1の研削装置1は、被研削材Sとして厚鋼材を研削するものであって、被研削材Sを研削する研削ユニット10と、研削中の研削状態を撮像して研削画像Pを取得する撮像装置20と、研削画像Pから摩耗量を検出する画像処理装置30と、摩耗量ΔDWに基づいて研削ユニット10を制御する動作制御装置40とを備える。被研削材Sは、図示しないテーブル上において、研削ユニット10に対し水平方向(矢印X方向及び矢印Y方向)に移動可能に載置されている。なお、被研削材Sと研削ユニット10とは相対的に移動すればよく、研削ユニット10側が被研削材Sに対し水平方向に移動するようにしてもよい。 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing a preferred embodiment of the grinding apparatus of the present invention. The grinding apparatus 1 of FIG. 1 grinds a thick steel material as the material S to be ground, and acquires a grinding image P by imaging a grinding unit 10 for grinding the material S to be ground and a grinding state during grinding. An imaging device 20, an image processing device 30 for detecting the wear amount from the grinding image P, and an operation control device 40 for controlling the grinding unit 10 based on the wear amount ΔDW are provided. The material S to be ground is placed on a table (not shown) so as to be movable in the horizontal direction (arrow X direction and arrow Y direction) with respect to the grinding unit 10 . The material S to be ground and the grinding unit 10 may move relatively, and the grinding unit 10 may move horizontally with respect to the material S to be ground.

図2は図1における研削ユニット10の一例を示す模式図である。図1及び図2の研削ユニット10は、被研削材Sを研削する研削砥石11と、研削砥石11を回転させる回転駆動部13と、被研削材Sに対する研削砥石11の押し付け量Hdを調整する押し付け量調整部14とを備える。研削砥石11は、例えば円盤状に形成されており、中心に軸12が固定されている。なお、研削砥石11の形状は、円盤状の他、カップ形状等の公知の技術を適用することができる。軸12はモータ等からなる回転駆動部13に接続されており、回転駆動部13は軸12を介して研削砥石11を回転させる。そして、研削砥石11の外側周側面が被研削材Sに回転しながら押し付けられることにより、被研削材Sが研削されていく。この回転駆動部13の動作は動作制御装置40により制御される。 FIG. 2 is a schematic diagram showing an example of the grinding unit 10 in FIG. The grinding unit 10 shown in FIGS. 1 and 2 includes a grinding wheel 11 for grinding a material S to be ground, a rotation drive unit 13 for rotating the grinding wheel 11, and a pressing amount Hd of the grinding wheel 11 against the material S to be ground. A pressing amount adjusting unit 14 is provided. The grinding wheel 11 is, for example, disc-shaped and has a shaft 12 fixed at its center. As for the shape of the grinding wheel 11, a well-known technology such as a cup shape can be applied in addition to the disk shape. The shaft 12 is connected to a rotation drive unit 13 such as a motor, and the rotation drive unit 13 rotates the grinding wheel 11 via the shaft 12 . Then, the outer peripheral side surface of the grinding wheel 11 is pressed against the material S to be ground while rotating, whereby the material S to be ground is ground. The operation of the rotation driving section 13 is controlled by an operation control device 40 .

押し付け量調整部14は、例えば直動シリンダからなり、研削砥石11及び回転駆動部13を上下方向(矢印Z方向)に移動可能に保持している。そして、押し付け量調整部14のストローク量が調整されることにより、被研削材Sに対する研削砥石11の押し付け量Hdが調整される。つまり、押し付け量Hdが研削深さになるため、押し付け量が調整されることで研削深さが調整されることになる。押し付け量調整部14の動作は動作制御装置40により制御されている。なお、押し付け量調整部14は、研削砥石11と被研削材Sとの距離を調整できるものであれば直動シリンダに限定されず、公知の技術を適用することができる。また、図1及び図2において、押し付け量調整部14は研削砥石11側を移動させる場合について例示しているが、被研削材S側を移動させるようにしてもよい。 The pressing amount adjustment unit 14 is composed of, for example, a direct-acting cylinder, and holds the grinding wheel 11 and the rotation driving unit 13 so as to be movable in the vertical direction (direction of arrow Z). By adjusting the stroke amount of the pressing amount adjusting unit 14, the pressing amount Hd of the grinding wheel 11 against the material S to be ground is adjusted. That is, since the pressing amount Hd becomes the grinding depth, the grinding depth is adjusted by adjusting the pressing amount. The operation of the pressing amount adjustment unit 14 is controlled by the operation control device 40 . Note that the pressing amount adjustment unit 14 is not limited to a direct-acting cylinder as long as it can adjust the distance between the grinding wheel 11 and the material S to be ground, and a known technique can be applied. 1 and 2 exemplify the case where the pressing amount adjusting unit 14 moves the grinding wheel 11 side, but it is also possible to move the material S side to be ground.

図1の撮像装置20は、例えば1000フレーム/秒で撮影可能なハイスピードカメラからなり、研削中の研削砥石11をオンラインで撮像して順次研削画像Pを取得していく。ここで、撮像装置20は、研削画像P内に研削中の研削砥石11の周縁が含まれるように研削砥石11を撮像する。図3は撮像装置20により撮像された研削画像Pの一例を示す模式図である。図3の研削画像Pは、撮像装置20が例えば研削砥石11の真横に設置され、研削砥石11全体を撮像したときに取得されたものである。 The imaging device 20 in FIG. 1 is composed of, for example, a high-speed camera capable of imaging at 1000 frames/second, and images the grinding wheel 11 during grinding on-line to acquire grinding images P sequentially. Here, the imaging device 20 images the grinding wheel 11 so that the grinding image P includes the periphery of the grinding wheel 11 during grinding. FIG. 3 is a schematic diagram showing an example of the grinding image P captured by the imaging device 20. As shown in FIG. The grinding image P in FIG. 3 is obtained when the imaging device 20 is installed, for example, right beside the grinding wheel 11 and captures an image of the entire grinding wheel 11 .

図1の画像処理装置30は、例えばコンピュータからなっており、研削画像Pに基づいて画像処理により研削砥石11の摩耗量ΔDWを検出する。画像処理装置30には研削前の研削砥石11の基準直径DW0が記憶されている(図3中の点線部分)。そして、研削中に研削画像Pが取得されたとき、画像処理装置30は、研削画像Pから研削砥石11の周縁(エッジ)を抽出し、抽出した周縁部分を用いて研削砥石11の直径DWを検出する。その後、画像処理装置30は、基準直径DW0と直径DWとの差分に基づいて摩耗量ΔDW(=(DW0-DW)/2)を検出する。また、画像処理装置30は、撮像装置20において研削画像Pが取得される度に直径DWを検出していく。 The image processing device 30 in FIG. 1 is composed of, for example, a computer, and detects the wear amount ΔDW of the grinding wheel 11 by image processing based on the grinding image P. As shown in FIG. The image processing device 30 stores the reference diameter DW0 of the grinding wheel 11 before grinding (dotted line portion in FIG. 3). Then, when the grinding image P is acquired during grinding, the image processing device 30 extracts the edge of the grinding wheel 11 from the grinding image P, and uses the extracted peripheral edge portion to determine the diameter DW of the grinding wheel 11. To detect. After that, the image processing device 30 detects the wear amount ΔDW (=(DW0−DW)/2) based on the difference between the reference diameter DW0 and the diameter DW. Further, the image processing device 30 detects the diameter DW each time the grinding image P is acquired by the imaging device 20 .

なお、画像処理装置30は直径DWを検出した後に摩耗量ΔDWを検出する場合について例示しているが、摩耗量ΔDWを検出できるものであればその手法は問わない。図4は研削画像Pの別の一例を示す模式図である。図4の研削画像Pは、研削砥石11の周縁の一部を撮像したものである。画像処理装置30には、研削前の研削砥石11の周縁の一部を撮像した基準研削画像が記憶されており(図4中の点線部分)、基準研削画像と研削中の研削画像Pの差分に基づいて摩耗量ΔDWを直接検出するようにしてもよい。 Although the image processing device 30 detects the wear amount ΔDW after detecting the diameter DW, any method can be used as long as the wear amount ΔDW can be detected. FIG. 4 is a schematic diagram showing another example of the grinding image P. As shown in FIG. A grinding image P in FIG. 4 is an image of part of the peripheral edge of the grinding wheel 11 . The image processing device 30 stores a reference grinding image obtained by imaging a part of the periphery of the grinding wheel 11 before grinding (dotted line portion in FIG. 4), and the difference between the reference grinding image and the grinding image P during grinding. The amount of wear ΔDW may be directly detected based on.

図1の動作制御装置40は、画像処理装置30において検出された摩耗量ΔDWに基づいて研削ユニット10の動作を制御する。なお、画像処理装置30と動作制御装置40とは、別々のコンピュータで構成されていてもよいし、同一のコンピュータで構成されていてもよい。特に、動作制御装置40は、画像処理装置30において検出された摩耗量ΔDWに基づいて、被研削材Sに対する研削砥石11の押し付け量Hdを制御する機能を有する。 The operation control device 40 of FIG. 1 controls the operation of the grinding unit 10 based on the wear amount ΔDW detected by the image processing device 30 . The image processing device 30 and the operation control device 40 may be configured by separate computers, or may be configured by the same computer. In particular, the motion control device 40 has a function of controlling the pressing amount Hd of the grinding wheel 11 against the material S to be ground based on the wear amount ΔDW detected by the image processing device 30 .

動作制御装置40には、研削前の摩耗していない研削砥石11を基準として設定された基準押し付け量Hd0が予め記憶されている。この基準押し付け量Hd0は、被研削材Sに対する研削深さ又は研削砥石11のサイズ等に応じて設定変更可能になっている。動作制御装置40は、研削中の押しつけ量Hdを摩耗量ΔDWを用いて次式(1)のように決定する。そして、動作制御装置40は、決定した目標押し付け量Hdだけ研削砥石11が被研削材Sに押し付けられるように、押し付け量調整部14の動作を制御する。 The motion control device 40 stores in advance a reference pressing amount Hd0 that is set with reference to the unworn grinding wheel 11 before grinding. The setting of the reference pressing amount Hd0 can be changed according to the grinding depth of the material S to be ground, the size of the grinding wheel 11, or the like. The motion control device 40 determines the pressing amount Hd during grinding using the wear amount ΔDW as shown in the following equation (1). Then, the operation control device 40 controls the operation of the pressing amount adjusting section 14 so that the grinding wheel 11 is pressed against the material S to be ground by the determined target pressing amount Hd.

Hd=Hd0+ΔDW ・・・(1) Hd=Hd0+ΔDW (1)

次に、図1から図4を参照して本発明の研削方法の好ましい実施形態について説明する。はじめに、動作制御装置40には基準押し付け量Hd0が設定され、画像処理装置30には研削前の基準直径DW0もしくは基準研削画像が記憶される。そして、回転駆動部13及び押し付け量調整部14が動作制御装置40の制御により作動し、被研削材Sに対する研削が開始される。被研削材Sが研削されている間、研削砥石11が撮像装置20により撮像され、例えば1000フレーム/秒で研削画像Pが取得されていく(取得工程、図3及び図4参照)。 Next, a preferred embodiment of the grinding method of the present invention will be described with reference to FIGS. 1 to 4. FIG. First, the reference pressing amount Hd0 is set in the operation control device 40, and the reference diameter DW0 before grinding or the reference grinding image is stored in the image processing device 30. FIG. Then, the rotation driving section 13 and the pressing amount adjusting section 14 are operated under the control of the operation control device 40, and the grinding of the material S to be ground is started. While the material S to be ground is being ground, the grinding wheel 11 is imaged by the imaging device 20, and the grinding image P is acquired at, for example, 1000 frames/second (acquisition step, see FIGS. 3 and 4).

画像処理装置30において、順次取得される研削画像Pからそれぞれ研削砥石11の摩耗量ΔDWが検出されていく(検出工程)。その後、動作制御装置40により、上記式(1)に基づき目標押し付け量Hdが算出され、算出された目標押し付け量Hdに基づいて押し付け量調整部14の動作が制御される(制御工程)。上述した目標押し付け量Hdの制御は、研削中に研削画像Pが取得するたびにリアルタイムに行われる。 In the image processing device 30, the wear amount ΔDW of the grinding wheel 11 is detected from the grinding images P that are sequentially acquired (detection step). After that, the target pressing amount Hd is calculated by the operation control device 40 based on the above equation (1), and the operation of the pressing amount adjusting section 14 is controlled based on the calculated target pressing amount Hd (control step). The control of the target pressing amount Hd described above is performed in real time each time the grinding image P is acquired during grinding.

上記実施形態によれば、撮像装置20において取得された研削画像Pから直接摩耗量ΔDWを検出し、動作制御装置40が摩耗量ΔDWに基づいて研削ユニット10の動作を制御する。これにより、摩耗量ΔDWを精度よく検出し、研削中に摩耗量ΔDWの変化に応じてリアルタイムに検索条件の調整を行うといった、精密な研削ユニット10の制御を行うことができ、精密な被研削材Sの研削を行うことができる。特に、画像処理装置30によって検出される研削砥石11の摩耗量ΔDWに基づいて研削砥石11の目標押し付け量Hdを制御することにより、研削深さの制御を精密に行うことができる。 According to the above embodiment, the wear amount ΔDW is directly detected from the grinding image P acquired by the imaging device 20, and the operation control device 40 controls the operation of the grinding unit 10 based on the wear amount ΔDW. As a result, the wear amount ΔDW can be accurately detected, and the search conditions can be adjusted in real time according to changes in the wear amount ΔDW during grinding. Material S can be ground. In particular, by controlling the target pressing amount Hd of the grinding wheel 11 based on the wear amount ΔDW of the grinding wheel 11 detected by the image processing device 30, the grinding depth can be precisely controlled.

すなわち、従来技術では、研削深さの測定は、研削後に研削面を何らかの変位計で測定するか、鋼材そのものを超音波厚さ計を用いた測定により行われるため、研削中に研削深さを測定することができない。よって、自動で研削を行う際にも、研削砥石11の押しつけ量は、摩耗量を考慮せずに所定の固定値に設定される。しかしながら、研削は摩耗によって研削砥石11の直径は小さくなっていくため、砥石径を固定すると、設定した研削深さにならない場合がある(切残し)。また、火花発生量から研削深さを検出する場合、正確に研削状況を把握することができず、精密な研削作業の制御を行うことができない。一方、図1及び図2の研削装置1によれば、撮像装置20において取得された研削画像Pから直接摩耗量ΔDWを正確に検出することができるため、精密な研削作業の制御を行うことができる。 That is, in the conventional technology, the grinding depth is measured by measuring the ground surface with some kind of displacement gauge after grinding, or by measuring the steel material itself using an ultrasonic thickness gauge. cannot be measured. Therefore, even when grinding is performed automatically, the pressing amount of the grinding wheel 11 is set to a predetermined fixed value without considering the amount of wear. However, since the diameter of the grinding wheel 11 decreases due to wear during grinding, if the grinding wheel diameter is fixed, the set grinding depth may not be obtained (uncut portion). In addition, when the grinding depth is detected from the amount of spark generation, the grinding state cannot be accurately grasped, and precise control of the grinding work cannot be performed. On the other hand, according to the grinding apparatus 1 of FIGS. 1 and 2, the wear amount ΔDW can be directly and accurately detected from the grinding image P acquired by the imaging device 20, so that precise control of the grinding operation can be performed. can.

直径200mm、幅75mmの研削砥石11を使用し、60kg鋼を被研削材Sとして目標研削深さ150μmに設定して研削した。また、撮像装置20により1秒間に1000フレームで研削画像Pを取得した。また、画像処理装置30において研削砥石11の外周のエッジを抽出する処理によって、研削砥石11の直径DWを算出した後に摩耗量ΔDWを検出した。 A grinding wheel 11 having a diameter of 200 mm and a width of 75 mm was used, and a 60 kg steel was ground as a material S to be ground to a target grinding depth of 150 μm. Further, the grinding image P was acquired at 1000 frames per second by the imaging device 20 . Further, the wear amount ΔDW was detected after the diameter DW of the grinding wheel 11 was calculated by the process of extracting the edge of the outer periphery of the grinding wheel 11 in the image processing device 30 .

まず、従来のように、摩耗量ΔDWに基づく目標押し付け量Hdの調整を行わずに固定値にして研削を実施した場合、目標研削深さが150μmであるのに対して実際の研削深さは平均140μmとなった。これは、研削砥石11の押し付け量は被研削材Sの表面から150μmにセットしたまま固定(不変)にしたのに対し、研削砥石11の直径DWは20μm摩耗していたので、その半分の10μm分切削することができず切残しが生じたためである。 First, when grinding is performed with a fixed value without adjusting the target pressing amount Hd based on the wear amount ΔDW as in the conventional art, the target grinding depth is 150 μm, whereas the actual grinding depth is 150 μm. The average was 140 μm. This is because the amount of pressing of the grinding wheel 11 was set at 150 μm from the surface of the material S to be ground and was fixed (unchanged). This is because it was not possible to perform a minute cutting, resulting in an uncut portion.

一方、図1の研削装置1を用いて研削画像Pを用いて検出された摩耗量ΔDWに基づいて目標押し付け量Hdを変更する制御を行いながら研削を行った。その結果、研削深さは平均で目標研削深さの150μmとなった。なお、研削砥石11の最大押し付け量は160μmになっていた。このように、研削画像Pから検出された摩耗量ΔDWを正確に検出することができるため、精密な研削作業の制御を行うことができた。 On the other hand, grinding was performed while performing control to change the target pressing amount Hd based on the wear amount ΔDW detected using the grinding image P using the grinding apparatus 1 of FIG. 1 . As a result, the average grinding depth was 150 μm, which is the target grinding depth. The maximum pressing amount of the grinding wheel 11 was 160 μm. In this way, since the wear amount ΔDW detected from the grinding image P can be accurately detected, the grinding work can be precisely controlled.

本発明の実施形態は、上記実施形態に限定されず、種々の変更を加えることができる。例えば、上記実施形態において、被研削材Sとして厚鋼材である場合について例示しているが、これに限定されず、薄鋼材であってもよいし、アルミナやめっき鋼板等の金属材料であってもよい。また、図1において、いわゆる平面研削を行う場合について例示しているが、円筒研削、内面研削、ねじ研削、歯車研削等の公知の研削加工にも適用することができる。 Embodiments of the present invention are not limited to the above embodiments, and various modifications can be made. For example, in the above-described embodiment, the case where the material S to be ground is a thick steel material is exemplified. good too. In addition, FIG. 1 illustrates the case of performing so-called surface grinding, but it can also be applied to known grinding processes such as cylindrical grinding, inner surface grinding, thread grinding, and gear grinding.

さらに、上記実施形態において、摩耗量ΔDWに基づく研削ユニット10の動作制御の一例として、研削砥石11の目標押し付け量Hdを制御する場合について例示しているがこれに限定されず、摩耗量ΔDWに基づき研削ユニット10の動作制御するものであればよい。例えば、研削中において研削砥石11に偏摩耗が生じる場合もある。そこで、画像処理装置30は、研削画像Pに基づいて研削砥石11の真円度を検出し、検出した真円度が設定された許容範囲を超えている場合には研削ユニット10を停止するように制御し、形直し(ツルーイング)が必要である旨の警告を出力するようにしてもよい。 Furthermore, in the above-described embodiment, as an example of the operation control of the grinding unit 10 based on the wear amount ΔDW, the case of controlling the target pressing amount Hd of the grinding wheel 11 is illustrated, but the present invention is not limited to this. Any device that controls the operation of the grinding unit 10 may be used. For example, the grinding wheel 11 may be unevenly worn during grinding. Therefore, the image processing device 30 detects the roundness of the grinding wheel 11 based on the grinding image P, and stops the grinding unit 10 when the detected roundness exceeds the set allowable range. and output a warning to the effect that truing is necessary.

あるいは、画像処理装置30は、上述した摩耗量ΔDWとともに、研削砥石11の側面に付された砥粒の種類等の文字を識別子として、研削砥石11の砥石周速度を検出する機能を有していてもよい。そして、動作制御装置40が、検出した砥石周速度が設定砥石周速度になるように、回転駆動部13の動作を制御するようにしてもよい。 Alternatively, the image processing device 30 has a function of detecting the grinding wheel peripheral speed of the grinding wheel 11 using characters such as the type of abrasive grains attached to the side surface of the grinding wheel 11 as identifiers along with the above-described wear amount ΔDW. may Then, the operation control device 40 may control the operation of the rotation driving section 13 so that the detected grindstone peripheral speed becomes the set grindstone peripheral speed.

1 研削装置
10 研削ユニット
11 研削砥石
12 軸
13 回転駆動部
14 押し付け量調整部
20 撮像装置
30 画像処理装置
40 動作制御装置
DW 直径
DW0 基準直径
Hd0 基準押し付け量
Hd 目標押し付け量
P 研削画像
S 被研削材
ΔDW 摩耗量
1 Grinding device 10 Grinding unit 11 Grinding wheel 12 Shaft 13 Rotational drive unit 14 Pressing amount adjustment unit 20 Imaging device 30 Image processing device 40 Operation control device DW Diameter DW0 Reference diameter Hd0 Reference pressing amount Hd Target pressing amount P Grinding image S Grinding object Material ΔDW Wear amount

Claims (8)

被研削材を研削する研削砥石と、前記研削砥石を回転させる回転駆動部と、前記研削砥石を保持し前記研削砥石を前記被研削材に押し付ける押し付け量調整部とを備える研削ユニットと、
前記被研削材を研削している前記研削砥石を撮像して研削画像を取得する撮像装置と、
前記撮像装置により取得された前記研削画像から前記研削砥石の摩耗量及び前記研削砥石の真円度を検出する画像処理装置と、
検出した前記研削砥石の摩耗量及び真円度に基づいて、前記研削ユニットの動作を制御する動作制御装置と、
を有する研削装置。
A grinding unit comprising: a grinding wheel for grinding a material to be ground; a rotation drive section for rotating the grinding wheel; and a pressing amount adjusting section for holding the grinding wheel and pressing the grinding wheel against the material to be ground;
an imaging device for capturing a grinding image by imaging the grinding wheel grinding the material to be ground;
an image processing device that detects the wear amount of the grinding wheel and the roundness of the grinding wheel from the grinding image acquired by the imaging device;
an operation control device that controls the operation of the grinding unit based on the detected wear amount and roundness of the grinding wheel;
Grinding device with
前記動作制御装置は、前記研削砥石の摩耗量に基づいて前記研削ユニットの前記押し付け量調整部を制御し、前記被研削材に対する前記研削砥石の押し付け量を調整する請求項1に記載の研削装置。 2. The grinding apparatus according to claim 1, wherein the operation control device controls the pressing amount adjusting section of the grinding unit based on the wear amount of the grinding wheel to adjust the pressing amount of the grinding wheel against the material to be ground. . 前記撮像装置は、研削中の前記研削砥石全体を撮像した前記研削画像を取得するものであり、
前記画像処理装置は、研削前の前記研削砥石の基準直径の情報を有しており、前記研削画像から研削中の前記研削砥石の周縁を抽出し、抽出した前記研削砥石の周縁から前記研削砥石の直径を検出し、検出した前記研削砥石の直径と前記基準直径との差分を用いて摩耗量を検出する請求項1または2に記載の研削装置。
The imaging device acquires the grinding image obtained by imaging the entire grinding wheel during grinding,
The image processing device has information on the reference diameter of the grinding wheel before grinding, extracts the periphery of the grinding wheel during grinding from the grinding image, and extracts the grinding wheel from the extracted periphery of the grinding wheel. 3. The grinding apparatus according to claim 1, wherein the diameter of the grinding wheel is detected, and the amount of wear is detected using the difference between the detected diameter of the grinding wheel and the reference diameter.
前記撮像装置は、研削中の前記研削砥石の周縁の一部を撮像した前記研削画像を取得するものであり、
前記画像処理装置は、研削前の前記研削砥石の基準研削画像を有しており、前記研削画像から研削中の前記研削砥石の周縁の一部を抽出し、抽出した前記研削砥石の周縁と前記基準研削画像との差分を用いて摩耗量を検出する請求項1または2に記載の研削装置。
The imaging device acquires the grinding image by imaging a part of the peripheral edge of the grinding wheel being ground,
The image processing device has a reference grinding image of the grinding wheel before grinding, extracts a part of the periphery of the grinding wheel during grinding from the grinding image, and extracts the periphery of the grinding wheel and the 3. The grinding apparatus according to claim 1, wherein the amount of wear is detected using a difference from the reference grinding image.
被研削材を研削する研削砥石と、前記研削砥石を回転させる回転駆動部と、前記研削砥石を保持しており、前記研削砥石を前記被研削材に押し付ける押し付け量調整部とを備える研削ユニットを用いて被研削材を研削する研削方法であって、
前記被研削材を研削している前記研削砥石を撮像装置により撮像して研削画像を取得する取得工程と、
取得した前記研削画像から前記研削砥石の摩耗量及び前記研削砥石の真円度を検出する検出工程と、
検出した前記研削砥石の摩耗量及び真円度に基づいて、前記研削ユニットの動作を制御する制御工程と、を有する研削方法。
A grinding unit comprising: a grinding wheel for grinding a material to be ground; a rotation drive section for rotating the grinding wheel; and a pressing amount adjusting section for holding the grinding wheel and for pressing the grinding wheel against the material to be ground. A grinding method for grinding a material to be ground using
an acquisition step of acquiring a grinding image by imaging the grinding wheel grinding the material to be ground with an imaging device;
a detection step of detecting the wear amount of the grinding wheel and the roundness of the grinding wheel from the acquired grinding image;
and a control step of controlling the operation of the grinding unit based on the detected wear amount and roundness of the grinding wheel.
前記制御工程は、研削砥石の摩耗量に基づいて前記研削ユニットの前記押し付け量調整部を制御し、前記被研削材に対する前記研削砥石の押し付け量を調整する請求項5に記載の研削方法。 6. The grinding method according to claim 5, wherein the control step controls the pressing amount adjusting section of the grinding unit based on the wear amount of the grinding wheel to adjust the pressing amount of the grinding wheel against the material to be ground. 前記研削画像は、研削中の前記研削砥石全体を撮像し取得されたものであり、
摩耗量を検出する際、前記研削画像から研削中の前記研削砥石の周縁を抽出し、抽出した前記研削砥石の周縁から前記研削砥石の直径を検出し、検出した前記研削砥石の直径と研削前の前記研削砥石の基準直径との差分を用いて摩耗量を検出する請求項5または6に記載の研削方法。
The grinding image is acquired by imaging the entire grinding wheel during grinding,
When detecting the amount of wear, the periphery of the grinding wheel during grinding is extracted from the grinding image, the diameter of the grinding wheel is detected from the extracted periphery of the grinding wheel, and the detected diameter of the grinding wheel and the diameter before grinding are measured. 7. The grinding method according to claim 5 or 6, wherein the amount of wear is detected by using the difference between the reference diameter of the grinding wheel and the diameter of the grinding wheel.
前記研削画像は、研削中の前記研削砥石の周縁の一部を撮像し取得されたものであり、
摩耗量を検出する際、前記研削画像から研削中の前記研削砥石の周縁の一部を抽出し、抽出した前記研削砥石の周縁の一部と研削前の前記研削砥石の基準研削画像との差分を用いて摩耗量を検出する請求項5または6に記載の研削方法。
The grinding image is acquired by imaging a part of the periphery of the grinding wheel being ground,
When detecting the wear amount, a part of the periphery of the grinding wheel being ground is extracted from the grinding image, and a difference between the extracted part of the periphery of the grinding wheel and a reference grinding image of the grinding wheel before grinding. The grinding method according to claim 5 or 6, wherein the amount of wear is detected using
JP2020032541A 2020-02-28 2020-02-28 Grinding device and method Active JP7207349B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020032541A JP7207349B2 (en) 2020-02-28 2020-02-28 Grinding device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020032541A JP7207349B2 (en) 2020-02-28 2020-02-28 Grinding device and method

Publications (2)

Publication Number Publication Date
JP2021133468A JP2021133468A (en) 2021-09-13
JP7207349B2 true JP7207349B2 (en) 2023-01-18

Family

ID=77659741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020032541A Active JP7207349B2 (en) 2020-02-28 2020-02-28 Grinding device and method

Country Status (1)

Country Link
JP (1) JP7207349B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009095909A (en) 2007-10-15 2009-05-07 Hitachi Plasma Display Ltd Polishing equipment of base material end face

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316955A (en) * 1986-07-07 1988-01-23 Japan Steel Works Ltd:The Sheet polishing method
JPH1128663A (en) * 1997-07-09 1999-02-02 Meidensha Corp Grinding wheel abrasion correcting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009095909A (en) 2007-10-15 2009-05-07 Hitachi Plasma Display Ltd Polishing equipment of base material end face

Also Published As

Publication number Publication date
JP2021133468A (en) 2021-09-13

Similar Documents

Publication Publication Date Title
EP2455191B1 (en) Grinding machine and measurement device
JP2017500216A (en) Roll grinding apparatus and method for grinding roll
KR101584265B1 (en) Lens spherical surface grinding method using dish-shaped grindstone
JP2006208347A (en) Rolling roll surface defect detection device, grinding device, surface defect detection method, surface defect detection program, and rolling roll grinding method
JP2020185626A (en) Measurement system for measuring abrasive grain distribution of grinding wheel surface and grinder provided with the same
CN116209543A (en) Polishing apparatus and method for determining replacement time of polishing pad
JP7682769B2 (en) Roll surface inspection device and roll grinding method
CN112775731A (en) Grinding system
KR101925009B1 (en) Method for trimming an ophthalmic lens
JP7207349B2 (en) Grinding device and method
JPH1177532A (en) Rolling roll grinding equipment
JPH0521705B2 (en)
JP2020525304A (en) Method for determining the dimension between the back and cutting edge of a vibrating blade mounted on a cutting tool
JPS6268269A (en) Precision machining method and device for work of rotation symmetry
JP4147387B2 (en) Super finishing device for ball bearing race
US4458660A (en) Apparatus and methods for preparing grinding wheels and performing grinding operations therewith
JP7103277B2 (en) Grinding method for silicon single crystal ingot
JP7168862B2 (en) Steel grinding method
JP7484381B2 (en) Chatter Detection System
JP7348037B2 (en) processing equipment
JPH07164318A (en) Belt grinding method
JP7383994B2 (en) Chatter evaluation system
JPH0716874B2 (en) Roll grinding control method and apparatus
JP2008093788A (en) Grinder
JP2020093355A (en) Grinding wheel surface state acquisition device and grinding wheel surface state acquisition method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210922

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220705

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220728

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220920

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221011

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221206

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221219

R150 Certificate of patent or registration of utility model

Ref document number: 7207349

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250