JP7217604B2 - Foreign matter removing device, die bonder, and foreign matter removing method - Google Patents

Description

The present invention relates to a foreign matter removing device, a die bonder, and a foreign matter removing method.

A die bonder is used in the manufacture of semiconductor devices. A die bonder bonds a die (a chip on a silicon substrate) to a substrate or a lead frame via an adhesive. At that time, if foreign matter such as dust adheres to the substrate or the like, the adhesive strength is lowered, so it is desirable to remove the foreign matter before bonding the die to the substrate.

Therefore, as a device for removing foreign matter from a substrate, there is a device such as that disclosed in Japanese Patent Application Laid-Open No. 2002-200010. The foreign matter removing device of Patent Document 1 has a nozzle having an air outlet and an air suction port. The foreign matter removing method of Patent Document 1 is carried out by blowing air from an air outlet onto a substrate to blow away foreign matter on the substrate and sucking the foreign matter into an air suction port.

JP 2016-40850 A

Cleaning is generally performed by dividing the substrate into a plurality of areas and sequentially cleaning each area. That is, one area of the substrate is cleaned, and after that area has been cleaned, another area of the substrate is cleaned. In the method of blowing air onto the substrate, such as the method described in Japanese Patent Application Laid-Open No. 2002-200030, the foreign matter on the substrate diffuses to the outside of the foreign matter removing apparatus. In this case, foreign matter may diffuse into an area that has already been cleaned. Further, when the air pressure/flow rate is increased to remove sticky foreign matter, turbulent flow occurs at the interface, reducing the suction effect, and the foreign matter may not be sufficiently removed.

If the gap between the nozzle of the foreign matter removing device and the substrate is set as small as about 1 mm in order to prevent these problems, the nozzle may interfere with the substrate and damage the substrate.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a foreign matter removing apparatus, a die bonder, and a foreign matter removing method capable of preventing foreign matter from diffusing to the outside of the cleaning area.

A foreign matter removing apparatus according to the present invention is a foreign matter removing apparatus for removing foreign matter on a work. It is provided with vibrating means for floating foreign matter above the workpiece and removing means for removing the floating foreign matter.

According to the foreign matter removing apparatus of the present invention, by applying vibration to the stage while the work is fixed to the stage, the vibration is transmitted to the work and the foreign matter on the work can be lifted off the work. It can be made to jump above the work. Then, the foreign matter that floated up from the work is removed.

In the above configuration, the fixing means may be an adsorption mechanism that adsorbs the workpiece to the stage. Further, the fixing means may be a pressing mechanism that presses the workpiece against the stage.

In the above configuration, the vibrating means may apply vibration from the back surface of the work, or may apply vibration from the upper surface of the work. In this case, the vibrating means can be either an ultrasonic oscillation mechanism or an impact mechanism.

In the above configuration, the excluding means may be a suction mechanism for sucking foreign matter, and the excluding means may further include an air blow mechanism in addition to the suction mechanism. That is, when foreign matter is removed by the two mechanisms of the suction mechanism and the air blow mechanism, even if the air blow mechanism is provided, the diffusion of the foreign matter can be reduced compared to the conventional case of cleaning with the air blow alone. , cleaning ability is improved. The excluding means may include a main body portion having a suction port for sucking the foreign matter, and the main body portion may move on the workpiece.

A die bonder of the present invention includes the foreign matter removing device of the present invention.

The foreign matter removing method of the present invention is a foreign matter removing method for removing foreign matter on a work, in which the work is fixed to a stage, and in a state where the work is fixed to the stage, vibration is applied to the stage to remove the foreign matter on the work. is lifted from the substrate, and the lifted foreign matter is removed.

The foreign matter removing apparatus, the die bonder, and the foreign matter removing method of the present invention are intended to remove foreign matter that has risen from the work, so that the foreign matter can be prevented from diffusing to the outside of the cleaning area.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a simplified cross-sectional view of the foreign matter removing apparatus according to the first embodiment of the present invention, where (a) is before foreign matter removal, (b) is during foreign matter removal, and (c) is after foreign matter removal. 1 is a simplified plan view of a foreign matter removing device according to a first embodiment of the present invention; FIG. FIG. 2 is a flow chart diagram showing a foreign matter removing method according to the first embodiment of the present invention; FIG. 5 is a simplified cross-sectional view of a foreign matter removing device according to a second embodiment of the present invention; It is a simplified cross-sectional view of the foreign matter removing device of the third embodiment of the present invention, (a) is before fixing the substrate, (b) is after fixing the substrate. FIG. 10 is a simplified cross-sectional view of a foreign matter removing device according to a fourth embodiment of the present invention; FIG. 11 shows a foreign matter removing device according to a fifth embodiment of the present invention, where (a) is a simplified cross-sectional view and (b) is a simplified plan view.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS.

The foreign matter removing apparatus of the present invention is installed in a die bonder that bonds a die (a silicon substrate chip with an electronic circuit, hereinafter referred to as a chip) to a lead frame, substrate, or the like via an adhesive. As shown in FIG. 1, the foreign matter removing apparatus according to the first embodiment of the present invention includes a stage 2 on which a substrate 1 is placed, fixing means 3 for fixing the substrate 1 to the stage 2, and vibration of the stage 2. Vibrating means 4 and removing means 5 for removing foreign matter 50 are provided. In FIG. 1, the workpiece is the substrate 1 before the chip is mounted thereon, but the substrate 1 may have the chip mounted thereon.

The stage 2 is a stage on which the substrate 1 is placed for preforming in this embodiment. Since it is desirable to perform cleaning immediately before bonding the chip, cleaning can be performed immediately before bonding the chip by performing the cleaning at the preform stage, which is a standby position during bonding.

The stage 2 is provided with suction holes 6 and is connected to a vacuum source such as a vacuum pump (not shown). A suction mechanism composed of these suction holes 6 and a vacuum source serves as fixing means 3 for fixing the substrate 1 to the stage 2 . That is, when the vacuum source is driven with the substrate 1 placed on the stage 2 , the substrate 1 is sucked through the suction holes 6 and the substrate 1 is sucked (fixed) to the stage 2 over the entire surface.

The vibrating means 4 is an ultrasonic oscillation mechanism arranged below the stage 2, and a known and public one can be adopted. For example, the ultrasonic oscillation mechanism includes a housing and an ultrasonic transducer (not shown) held by the housing and made of a piezoelectric element or the like. The vibrating means 4 applies ultrasonic vibration from the lower side to the upper side of the stage 2 as indicated by the arrow A in FIG. 1(b), and can adjust the transmission frequency and amplitude. . As a result, when vibration is applied to the stage 2 while the substrate 1 is fixed to the stage 2, the vibration is transmitted to the substrate 1, and upward vibration is applied to the substrate 1 from the back surface, as shown in FIG. 1(b). As shown, the foreign matter 50 on the substrate floats from the substrate 1 (that is, the foreign matter 50 is spaced upward from the substrate 1).

The removing means 5 is composed of a suction mechanism that removes the foreign matter 50 by suction. The suction mechanism includes a block-shaped main body 8 arranged above the substrate 1, a suction hole 9 opening on the lower surface of the main body 8, and a vacuum source such as a vacuum pump (not shown) connected to the main body 8. Consists of That is, when the vacuum source is driven, the foreign matter 50 floating from the substrate 1 can be sucked through the suction hole 9 and removed from above the substrate 1 as indicated by the arrow B in FIG. 1(b).

As shown in FIG. 2, the main body 8 has a width substantially equal to that of the substrate 1, and moves in a direction orthogonal to the width direction of the substrate 1 as indicated by the arrow in FIG. It is a thing. As a result, after the substrate area A in FIG. 2 has been cleaned, the body portion 8 moves above the substrate area B to clean the substrate area B, and further moves the body portion 8 above the substrate area C. It moves and cleans the substrate area C, and so on in succession. That is, by dividing the substrate into a plurality of areas and sequentially performing cleaning for each area, all areas or an arbitrary area of the substrate 1 can be cleaned.

A foreign matter removing method for removing foreign matter on a workpiece (in this embodiment, the substrate 1 before chip bonding) using the foreign matter removing apparatus of the first embodiment will be described with reference to the flow chart of FIG.

First, the substrate 1 is placed on the stage 2 (step S1). In this embodiment, the stage 2 is a preform stage, which is cleaned immediately before chip bonding.

The fixing means 3 fixes the substrate 1 to the stage 2 (step S2). That is, when the vacuum source is driven while the substrate 1 is placed on the stage 2, the substrate 1 is sucked through the suction holes 6, and the substrate 1 is entirely moved to the stage 2 as shown in FIG. 1(a). is adsorbed (fixed) to

The body portion 8 of the excluding means 5 is arranged above the position to be cleaned (for example, the substrate area A in FIG. 2) of the substrate 1 (step S3), and the vibrating means 4 moves the cleaning area indicated by the arrow A in FIG. 1(b). , upward ultrasonic vibration is applied to the stage 2 (step S4). As a result, vibration is transmitted to the substrate 1, and upward vibration is applied to the substrate 1 from the rear surface, so that the foreign matter 50 on the substrate floats off the substrate 1 as shown in FIG. 1(b). Then, the removing means 5 drives the vacuum source, sucks the foreign matter 50 floating from the substrate 1 through the suction hole 9, and removes it from above the substrate 1 as indicated by the arrow B in FIG. 1(b). (step S5).

If the location to be cleaned is only the substrate area A, the cleaning is terminated, and if there are other locations (for example, when cleaning the entire surface of the substrate 1), another location is cleaned (step S6). In this case, the process returns to step S3, the main body 8 of the excluding means 5 is placed above the position (substrate area B) of the substrate 1 to be cleaned, and the substrate area B is cleaned in steps S4 to S6. In this way, when there are portions to be cleaned on the substrate 1, steps S3 to S6 are repeated. If all the places to be cleaned are cleaned and no places to be cleaned remain, the process ends.

In the foreign matter removing apparatus, the die bonder having the foreign matter removing apparatus, and the foreign matter removing method of the first embodiment, the substrate 1 is fixed to the stage 2, and vibration is applied to the stage 2, whereby the vibration is transmitted to the substrate 1, and the substrate Since the foreign matter 50 on the substrate 1 can be floated from the substrate 1 , the foreign matter 50 can be bounced above the substrate 1 . Since the foreign matter 50 floating from the substrate 1 is removed, it is possible to prevent the foreign matter 50 from diffusing to the outside of the cleaning area. For example, when the cleaning area is the substrate area B, it is possible to prevent the foreign matter 50 from diffusing into the substrate area A, the substrate area C, or the like.

FIG. 4 shows a foreign matter removing device of a second embodiment. In this embodiment, the vibrating means 14 is a striking mechanism. That is, an example of the impact mechanism is a cylinder mechanism provided below the stage 2, and various types such as an air cylinder, an electric cylinder, and a hydraulic cylinder can be used. 15 and a rod 16. The stage 2 is fixed to the upper end portion of the rod 16 , and the rod 16 is advanced and retracted in the vertical direction by air pressure supplied to the cylinder body 15 . As a result, when the rod 16 moves upward, the stage 2 is vibrated upward.

The foreign matter removing device of the second embodiment also has the same effects as the foreign matter removing device of the first embodiment. In the foreign matter removing apparatus shown in FIG. 4, the same members as in FIG. 1 are assigned the same reference numerals as in FIG.

FIG. 5 shows the foreign matter removing device of the third embodiment. In this embodiment, the stage 20 is not provided with suction holes, and the fixing means 21 is a pressing mechanism that presses the substrate 1 against the stage 20 . That is, the pressing mechanism includes a pressing body 22 which is provided above the stage 20 and presses the substrate 1 against the stage 20 from above, a cylinder mechanism (not shown) which moves the pressing body 22 up and down, a linear guide mechanism, and the like. and a reciprocating mechanism. As a result, as shown in FIG. 5(a), the body portion 8 of the excluding means 5 is arranged above the position to be cleaned on the substrate 1, and the pressing body 22 is positioned as shown by the arrow in FIG. 5(a). is lowered to press the substrate 1 against the stage 2, the substrate 1 is fixed to the stage 2 as shown in FIG. 5(b). In this state, upward vibration is applied to the stage 20 .

The foreign matter removing device of the third embodiment also has the same effects as the foreign matter removing device of the first embodiment. In the foreign matter removing apparatus shown in FIG. 5, members similar to those in FIG. 1 are given the same reference numerals as those in FIG.

FIG. 6 shows a foreign matter removing device of a fourth embodiment. In this embodiment, the exclusion means 30 comprises a first exclusion means 30a and a second exclusion means 30b. The first excluding means 30a is a suction mechanism for sucking the foreign matter 50, and the second excluding means 30b is composed of an air blow mechanism. The suction mechanism is configured in the same manner as in the first to third embodiments. The air blow mechanism is provided on one end side above the table 2 and has a nozzle 31 having an air outlet for discharging air. As a result, as shown in FIG. 6, the foreign matter 50 floating from the substrate 1 is removed from the substrate 1 through the suction holes 9, and as shown by the arrow in FIG. are blown away from the substrate 1 and removed from the substrate 1 by an air blow directed toward the multi-end side.

The foreign matter removing device of the fourth embodiment also has the same effects as the foreign matter removing device of the first embodiment. Furthermore, since an air blow mechanism is provided in addition to the suction mechanism as the removing means, the foreign matter 50 is removed by the two mechanisms of the suction mechanism and the air blow mechanism. In this case, even if an air blow mechanism is provided, the diffusion of the foreign matter 50 can be reduced and the cleaning performance is improved as compared with the conventional case of cleaning by air blow alone. In the foreign matter removing apparatus shown in FIG. 6, members similar to those in FIG. 1 are given the same reference numerals as those in FIG. 1, and descriptions thereof are omitted.

FIG. 7 shows a foreign matter removing device of a fifth embodiment. In this embodiment, as shown in FIG. 7(a), the main body part 41 of the excluding means 40 has a dimension shorter than the width of the substrate 1, and the width of FIG. 7(a) and FIG. 7(b). As indicated by arrow A, it is movable in the width direction. That is, as shown by arrow A in FIG. 7B, main body 41 moves in the width direction of substrate 1, and as shown by arrow B, moves in two directions, i.e., in a direction orthogonal to the width direction of substrate 1. is possible.

The foreign matter removing device of the fifth embodiment also has the same effects as the foreign matter removing device of the first embodiment. Furthermore, since the main body 41 of the excluding means 40 can move in two directions, the size of the device can be reduced. In the foreign matter removing apparatus shown in FIG. 7, members similar to those in FIG. 1 are given the same reference numerals as those in FIG. 1, and descriptions thereof are omitted.

In the first to fifth embodiments, the vibrating means 4 and 14 apply vibration from below the stages 2 and 20. good.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible. Other stages may be used. Although the main body of the excluding means moves in the direction perpendicular to the width direction of the substrate, it may be of a size substantially equal to that of the substrate and may not move. The work can be various other than the substrate as long as it is fixed to the stage. The vacuum source of the workpiece fixing means and the vacuum source of the excluding means may be common.

1 substrates 2, 20 stages 3, 21 fixing means 4, 14 vibrating means 5, 30 excluding means 8, 41 main body 50 foreign matter

Claims (8)

In a foreign matter removing device that removes foreign matter on a workpiece,
a stage on which the workpiece is placed;
fixing means for fixing the workpiece to the stage;
vibrating means for floating foreign matter on the workpiece from the workpiece by applying vibration to the stage;
and an excluding means for excluding floating foreign matter , wherein the excluding means is composed of a suction mechanism having a block-shaped main body portion formed with a suction hole having a suction port that opens to the bottom surface. In addition, the fixing means is a pressing mechanism that presses the workpiece against the stage, and the pressing mechanism includes a pressing body that is disposed outside the main body of the suction mechanism and moves up and down. 1. A foreign matter removing apparatus , wherein the vibrating means applies vibration to the stage while the work is being held down, and the foreign matter floating from the work is sucked into a suction hole . 2. A foreign matter removing apparatus according to claim 1 , wherein said vibrating means applies vibration from the back surface of the work. 3. A foreign matter removing apparatus according to claim 1, wherein said vibrating means applies vibration from the upper surface of the work. 4. The foreign matter removing apparatus according to claim 1, wherein the vibrating means is either an ultrasonic oscillation mechanism or an impact mechanism. The foreign matter removing device according to any one of claims 1 to 4 , wherein the removing means further comprises an air blow mechanism. 6. The removing means according to any one of claims 1 to 5 , characterized in that it has a main body portion having a suction port for sucking the foreign matter, and the main body portion moves on the workpiece. foreign matter removal device. A die bonder comprising the foreign matter removing device according to any one of claims 1 to 6 . In a foreign matter removing method for removing foreign matter on a work,
fixing the workpiece to the stage by pressing it through a pressing body arranged above the workpiece;
By applying vibration to the stage while the work is fixed to the stage, foreign matter on the work is lifted off the substrate,
A block-shaped main body of a suction mechanism having a suction hole with a suction port opening on the bottom surface is disposed inside the pressing body, and removes floating foreign matter by sucking it into the suction hole through the suction port. A foreign matter removing method characterized by:

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