JP7218664B2 - Surface conductivity measuring device - Google Patents

Description

The present invention relates to a surface conductivity measuring device.

For example, various measurement methods have been devised for measuring the dielectric constant and dielectric loss tangent of dielectric materials in high-frequency regions such as millimeter waves and microwaves. There are resonator methods and the like.
Various methods have also been proposed for measuring the conductivity and resistance of conductors in the high frequency range.

JP 2015-227850 A JP 2003-227855 A

By the way, in order to measure the electrical properties such as the dielectric constant and dielectric loss tangent of the dielectric material as described above, and the electrical conductivity and resistance of the conductor, for example, JIS R 1627 Test method for dielectric properties of fine ceramics for microwave use. may be used.
However, when using this as a surface conductivity measuring device for measuring the surface conductivity of a conductor to be measured, if the surface conductivity of a conductor having unevenness on the surface is measured, the unevenness will collapse and the measurement accuracy will decrease. It turned out to be

SUMMARY OF THE INVENTION An object of the present invention is to prevent the unevenness of the surface of a conductor to be measured from collapsing and to improve the measurement accuracy of the surface conductivity.

In one aspect, the surface conductivity measuring device is such that the first surface to be measured of the first conductor to be measured and the second surface to be measured of the second conductor to be measured are parallel to each other . a first supporting member and a second supporting member for fixing the two conductors respectively ; It has a dielectric cylinder positioned at the center of the first surface to be measured and the second surface to be measured so as to be parallel, and a plurality of rod-shaped portions fixed to a plurality of points on the side surface of the dielectric cylinder . and the top surface of the dielectric cylinder, and between the second conductor and the bottom surface of the dielectric cylinder, a fixing member for fixing the dielectric cylinder with a gap , respectively ; a cylinder sandwiched between the first conductor and the second conductor having a height equal to the distance between the first conductor and the second conductor, the cylinder provided around the dielectric cylinder so that the dielectric cylinder is positioned at the center of the cylinder; and an excitation member that is inserted through an opening provided on the side surface of the and functions as an excitation line.

As one aspect, it has the effect of preventing the unevenness of the surface of the conductor to be measured from collapsing and improving the measurement accuracy of the surface conductivity.

It is a sectional view showing composition of a surface conductivity measuring device concerning this embodiment. 1 is a schematic diagram showing a configuration example of a measuring device that is a premise of a surface conductivity measuring device according to the present embodiment; FIG. 1 is a schematic diagram showing a configuration example of a measuring device that is a premise of a surface conductivity measuring device according to the present embodiment; FIG. 1 is a cross-sectional view showing a configuration example of a measuring device that is a premise of a surface conductivity measuring device according to the present embodiment; FIG. 1 is a cross-sectional view showing a configuration example of a measuring device that is a premise of a surface conductivity measuring device according to the present embodiment; FIG. 1 is a cross-sectional view showing a configuration example of a measuring device that is a premise of a surface conductivity measuring device according to the present embodiment; FIG. 1 is a cross-sectional view showing a configuration example of a measuring device that is a premise of a surface conductivity measuring device according to the present embodiment; FIG. FIG. 4 is a diagram showing a resonance waveform obtained by a measuring device that is a premise of the surface conductivity measuring device according to the present embodiment; It is a cross-sectional view showing the configuration of a conventional surface conductivity measuring device. 1A and 1B are a cross-sectional view and a plan view showing a specific configuration example of a surface conductivity measuring device according to an embodiment; FIG. 2 is a plan view showing the configuration of a supporting member (fixing member) included in a specific configuration example of the surface conductivity measuring device according to the present embodiment; It is a top view which shows the surface state of the copper foil in the conventional surface-conductivity measuring apparatus. It is a top view which shows the surface state of copper foil in the surface-conductivity measuring apparatus of this embodiment. It is a figure which shows the relationship between the specific conductivity measured by this embodiment and the conventional surface-conductivity measuring apparatus, and the number of times of measurement. It is a sectional view showing a modification of a concrete example of composition of a surface conductivity measuring device concerning this embodiment. It is a sectional view showing a modification of a concrete example of composition of a surface conductivity measuring device concerning this embodiment. It is a figure which shows the relationship between a space|gap and Q value (Qu). FIG. 4 shows the configuration used to determine the relationship between air gap and Q value (Qu); FIG. 4 is a diagram showing the dielectric columnar support structure of the present embodiment used for simulation of surface specific conductivity; FIG. 10 is a diagram showing a dielectric columnar support structure of a comparative example used for simulation of surface specific conductivity; FIG. 5 is a diagram showing simulation results of surface specific conductivities in dielectric cylindrical support structures of the present embodiment and comparative examples. It is a sectional view showing composition of a modification of a surface conductivity measuring device concerning this embodiment. It is a top view which shows the structure of the modification of the surface-conductivity measuring apparatus concerning this embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface conductivity measuring device according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 23. FIG.
The surface conductivity measuring device according to this embodiment is a surface conductivity measuring device that measures the surface conductivity of a conductor (conductor material) in a high frequency region.
Here, the surface conductivity measuring device is, for example, a surface specific conductivity measuring device for measuring the surface specific conductivity of a conductor in a high frequency range of, for example, about 1 GHz or higher, particularly, for example, about 1 GHz to about 20 GHz.

The surface conductivity measuring device is also called a surface specific conductivity measuring device or a high frequency surface conductivity measuring device.
For example, the surface specific conductivity measuring device is, for example, a test device in JIS R 1627 Microwave fine ceramic dielectric property test method, provided with a cylinder and a fixing member described later, and fixed the dielectric cylinder at multiple points on the side surface. It can be configured by

Here, for example, the device (testing device; measuring device) in JIS R 1627 Microwave fine ceramic dielectric property testing method is a device using a dielectric resonator method (dielectric cylindrical resonator method), It is configured as follows.
In other words, as shown in FIG. 2, this apparatus measures two disc-shaped conductor plates (conductor discs) and dielectric cylinders (dielectric cylinder sample) as conductor discs, dielectric cylinders, and conductor discs. It has a three-layer structure resonator (dielectric resonator) stacked in order.

FIG. 2 shows a state in which the upper and lower conductor discs and the dielectric cylinder are in contact with each other. The dielectric cylinder 5 is fixed at a plurality of points on its side surface with a gap between it and the conductor disc.
In addition, in FIG. 2, the dielectric cylinder sample is used, but in the present embodiment, as described later, the measurement samples are upper and lower conductor discs (corresponding to the first conductor 1 and the second conductor 3 described later). be.

Also, between the upper and lower conductor discs constituting this three-layer structure resonator, there is a pair of two coupling excitation cables (excitation lines; excitation member) is inserted.
Note that the coupling loop is also called a loop antenna, a minute loop antenna, or a loop-like minimal antenna.

Also, these two coupled excitation cables are supported by a support base (corresponding to a second support member 4 described later) and fixed with cable fixing screws.
Also, the lower conductor disk (corresponding to the second conductor 3 described later) is placed on and supported by a support base. The upper conductor disk (corresponding to a first conductor 1 described later) is supported by a support plate (corresponding to a first support member 2 described later).

The connectors of the two coupled excitation cables are connected to a measuring device (resonance measuring device; measuring section) 12 such as a network analyzer by coaxial cables 10 and 11 (see FIG. 3, for example). A reference level measurement cable is connected when measuring the total transmission level.
If necessary, such as when it is necessary to prevent movement during measurement, for example, as shown in FIGS. As shown in FIGS. 6 and 7, a pressing member may be provided on the upper side of the support plate so that the support plate and the upper conductor disk supported by the support plate are pressed downward.

Similarly, in order to fix the upper and lower conductor discs (eg, copper foil, etc.) as necessary, as shown in FIG. As shown in 7, these may be fixed to a support plate or a support base by suction, adhesion, or the like.
By using such an apparatus, a resonance waveform and a resonance peak wavelength as shown in FIG. 8 can be obtained.

The sharpness of the resonance peak, which is also called the Q value or sharpness, is determined by the structure of the measurement system, the loss of electromagnetic field energy in the dielectric cylinder, the loss of electromagnetic field energy in the conductor disc, etc. By calculating together with the measurement result of , the loss of the dielectric cylinder and the loss of the conductor disc can be separately calculated.
Thereby, the conductivity of the conductor surface at the corresponding frequency (specific frequency), that is, the surface specific conductivity of the conductor can be obtained. That is, the surface specific conductivity of the conductor can be calculated from the high frequency resonance waveform of the resonator of the device as described above.

In this way, in the apparatus described above, the upper and lower conductor discs serve as measurement samples (objects to be measured; conductors to be measured), and the surface thereof serves as the surface to be measured (conductor surface to be measured). physical properties; electrical properties) can be measured.
By the way, for example, wiring boards used in electronic devices are formed from insulating materials and conductive materials, and there is a demand to obtain properties of these various insulating materials and conductive materials.

For example, various measurement methods have been devised for measuring the dielectric constant and dielectric loss tangent of dielectric materials at frequencies of about 1 GHz or more, particularly about 1 GHz to about 20 GHz. There are the instrument method, the dielectric resonator method, and the like.
In addition, for example, regarding the measurement of the electrical properties of a conductor (for example, the surface specific conductivity), if the dielectric constant and the dielectric loss tangent can be determined with high accuracy in the dielectric resonator method, for example, JIS R 1627 for microwave It can be derived by using a test method for dielectric properties of fine ceramics.

However, when using, for example, JIS R 1627, a method for testing dielectric properties of fine ceramics for microwaves, as a surface conductivity measuring device for measuring the surface conductivity of a conductor to be measured, the surface conductivity of a conductor having unevenness on the surface When measuring the rate, it was found that the unevenness was crushed and the measurement accuracy was lowered.
For example, when attempting to measure the surface specific conductivity of a metal foil (e.g., copper foil) by the method described above, as shown in FIG. Therefore, it has been found that the characteristics may change, and the problem that the original surface specific conductivity value cannot be obtained may occur.

Therefore, in this embodiment, the following configuration is adopted in order to prevent the unevenness of the surface of the conductor to be measured from collapsing and to improve the measurement accuracy of the surface conductivity.
That is, as shown in FIG. 1, the surface conductivity measuring apparatus of the present embodiment includes a first support member 2 that supports a first conductor 1 to be measured, a second conductor 3 to be measured, and a first support member 2 that supports a first conductor 1 to be measured. A second support member 4 parallel to the support member 2 , a dielectric column 5 , a fixed member 6 , a cylinder 7 and an excitation member 8 are provided.

Note that the first conductor 1 and the second conductor 3 are installed at the time of measurement.
In this case, the first conductor 1 supported by the first support member 2 and the second conductor 3 supported by the second support member 4 are parallel to each other, and the dielectric cylinder sandwiched between them with a gap therebetween. The upper surface and lower surface (bottom surface) of 5 are also parallel.
The dielectric cylinder 5 is located between the first conductor 1 and the second conductor 3 and located at the center of the first conductor 1 and the second conductor 3 .

The fixing member 6 fixes the dielectric cylinder 5 at a plurality of points (multiple points) on the side surface with a gap between the first conductor 1 and the second conductor 3 (for example, see FIGS. 10 and 11). ).
The cylinder 7 is sandwiched between the first conductor 1 and the second conductor 3 (that is, sandwiched between the first support member 2 and the second support member 4), and is provided so that the dielectric cylinder 5 is positioned at the center. .
This cylinder 7 is used to provide a gap (gap) between the top surface of the dielectric cylinder 5 and the first conductor 1 and between the bottom surface of the dielectric cylinder 5 and the second conductor 3. The height is higher than the height of the dielectric cylinder 5 .

That is, the distance between the first conductor 1 supported by the first support member 2 and the second conductor 3 supported by the second support member 4 is determined by the height of the cylinder 7. The first conductor 1 supported by the support member 2 and the second conductor 3 supported by the second support member 4 are positioned in the height direction.
The excitation member 8 is inserted through an opening provided in the cylinder 7 and functions as an excitation line.

In this embodiment, the fixed member 6 is supported by the cylinder 7 and is a third support member 9 having a plurality of (here, four) support portions that support the dielectric cylinder 5 at a plurality of points (multiple points) on the side surface. (See, for example, FIGS. 10 and 11).
Here, the third support member 9 is made of an insulator, for example, a support made of resin.
Moreover, in this embodiment, the first conductor 1 and the second conductor 3 are foils (metal foils) having uneven surfaces. Here, the first conductor 1 and the second conductor 3 are copper foils. Specifically, it is an electrodeposited copper foil having a roughened surface and unevenness on one side for adhesion.

Here, a specific configuration example of the support structure for the dielectric cylinder 5 of this embodiment will be described with reference to FIGS. 10 and 11. FIG.
The first conductor 1 and the second conductor 3, which are objects to be measured, are foils of copper, aluminum, brass, etc. (here, copper foils), and have a size of about 10 cm×10 cm, for example.
Although not shown, the upper and lower foils are supported by adhesion or adsorption to the plane of a support plate as the first support member 2 or a support base as the second support member 4 . Note that the support plate and the support base are also called a support.

The dielectric cylinder 5 usually has a height of about 3 mm to about 30 mm, a diameter of about 5 to about 30 mm, and a dielectric constant of about 10 to about 100. Here, for example, one having a height of about 4.7 mm, a diameter of about 10 mm, and a dielectric constant of about 38 is used.
As the material of the dielectric column 5, a ceramic sintered body, a metal oxide crystal (for example, Al ₂ O ₃ crystal: sapphire), or the like is used.

The measurement frequency is 1 to 20 GHz, and the measurement result of surface specific conductivity is obtained at 7 GHz, for example.
The height of the cylinder 7 is higher than that of the dielectric cylinder 5 by about 10 to about 300 μm. For example, for a dielectric cylinder 5 with a height of approximately 4.7 mm, the height of cylinder 7 is approximately 4.75 mm. Also, the diameter of the cylinder 7 is, for example, approximately 50 mm. Further, the material of the cylinder 7 is, for example, Cu or Al.

A third supporting member 9 (fixing member 6) that supports the dielectric cylinder 5 is made of, for example, a conductor such as Cu, PET resin, or an insulator such as methyl methacrylate. The third support member 9 includes, for example, four rod-shaped support portions 9A each having a length of approximately 10 mm and a cross-sectional dimension of approximately 1 mm×approximately 1 mm. support portion 9B.
By the way, as described above, in this embodiment, the cylinder 7 is provided around the dielectric cylinder 5 and is higher than the dielectric cylinder 5 .

For this reason, the cylinder 7 is sandwiched between the first conductor 1 supported by the first support member 2 and the second conductor 3 supported by the second support member 4 so that the first conductor 1 and the second conductor 3 will be determined.
With the third supporting member 9 as the fixing member 6 providing a gap between the top surface of the dielectric cylinder 5 and the first conductor 1 and between the bottom surface of the dielectric cylinder 5 and the second conductor 3, The dielectric cylinder 5 is supported and fixed at a plurality of points on the side surface.

In this way, the first conductor 1 and the second conductor 3 and the dielectric cylinder 5 are not in direct contact (that is, the first conductor 1 and the second conductor 3 are not in contact with the dielectric cylinder 5), the dielectric A cylinder 7 is provided around the cylinder 5 (that is, around the conductors 1 and 3), and the dielectric cylinder 5 is arranged with a gap between the dielectric cylinder 5 and the first conductor 1 and the second conductor 3. It is supported and fixed at multiple points on the side surface.

This solves the problem of changes in the uneven shape of the conductors 1 and 3 (here, the metal foil) in the surface specific conductivity measurement, and improves the measurement accuracy.
That is, if the first conductor 1 and second conductor 3 (here, metal foil) and the dielectric cylinder 5 are in direct contact as in the conventional art (see, for example, FIG. 9), for example, as shown in FIG. In addition, near the center (here, near the center of the metal foil), which greatly affects the measurement, the unevenness of the surface was crushed, flattened, and was in a scratched state.

Then, as indicated by triangular marks in FIG. 14, the value of the measured specific conductivity .sigma.r changes as the number of measurements increases, resulting in a problem that the original value cannot be obtained.
On the other hand, in the above-described embodiments, as shown in FIGS. 1, 10 and 11, the dielectric cylinder 5 is surrounded by the dielectric cylinder 5 so that the first conductor 1 and the second conductor 3 do not come into direct contact with the dielectric cylinder 5 . A cylinder 7 is provided in the dielectric cylinder 7, and the dielectric cylinder 5 is supported and fixed at a plurality of points on the side surface with a gap between the dielectric cylinder 5 and the first conductor 1 and the second conductor 3. As shown in FIG. In this case, the first conductor 1, the second conductor 3 and the cylinder 7 are in direct contact.

As a result, as shown in FIG. 13, during measurement, the unevenness of the surface is crushed, flattened, and scratched. can be moved to the surrounding area of the metal foil).
As a result, the influence of characteristic changes due to the flattening of the unevenness of the surface becomes minute, and as indicated by the square marks in FIG. 14, the measured specific conductivity σr does not change even if the number of measurements increases , and the measurement accuracy can be improved.

In addition, when the cylinder 7 and the fixing member 6 are provided as in this embodiment, it is not necessary to provide a spring or a pressing member (see, for example, FIGS. 4 to 7). or a pressing member (for example, see FIGS. 4 to 7) may be provided.
Similarly, in order to fix the first conductor 1 and the second conductor 3 (copper foil here) as necessary, for example, as shown in FIG. 2. The periphery of these may be sandwiched by a support stand as the support member 4. For example, as shown in FIG. It may be fixed by adhesion or the like.

By the way, as described above, the space (gap) provided by the cylinder 7 between the top surface of the dielectric cylinder 5 and the first conductor 1 and between the bottom surface of the dielectric cylinder 5 and the second conductor 3 is It is preferably about 1/10 or less of the height of the dielectric cylinder 5 .
Here, FIG. 17 shows the result of obtaining the relationship between the gap and the Q value in the configuration as shown in FIG. ing.

As shown in FIG. 17, when the gap is about 1/10 of the height of the dielectric cylinder 5, the error of the Q value (Qu) is also about 10%, and the larger the gap, the larger the error. It can be seen that the more the value, the greater the deviation from the original Q value.
For this reason, it is desirable that the size of the gap is up to about one tenth of the height of the dielectric cylinder 5 .

Therefore, according to the surface conductivity measuring device according to the present embodiment, it is possible to prevent the unevenness of the surface of the conductor to be measured (here, the first conductor 1 and the second conductor 3) from being crushed, and improve the measurement accuracy of the surface conductivity. can be improved.
Here, FIG. 21 shows the dielectric cylinder support structure of this embodiment as shown in FIG. When the surface specific conductivity is measured for the dielectric cylinder support structure of the comparative example as shown in FIG. It shows the result of simulating what happens to

In either case, the supporting member (supporting body) is made of resin and has a thickness of about 1 mm. The dielectric cylinder 5 is made of ceramic and has a diameter of about 1 cm. Further, in the dielectric cylindrical support structure of this embodiment as shown in FIG. 19, the plurality of (here, four) support portions are approximately 1 mm square.
As shown in FIG. 21, in the dielectric columnar support structure of this embodiment as shown in FIG. In the structure, a large error has occurred, and it can be seen that proper measurement cannot be performed.

For example, in the dielectric cylinder support structure of the comparative example shown in FIG. 20, a large error occurs. It can be seen that it is possible to keep it small within.
In this way, by adopting the dielectric cylinder support structure of the present embodiment described above, the surface shape of the conductor having unevenness on the surface near the dielectric cylinder affects the electromagnetic field distribution and greatly affects the measurement. It can be seen that the measurement accuracy of the surface specific conductivity (σr) can be improved with almost no effect on .

In the above-described embodiment, the fixed member 6 is supported by the cylinder 7, and the dielectric cylinder support structure is a third support member 9 having a plurality of support portions 9A that support the dielectric cylinder 5 at a plurality of points on the side surface. is used, but is not limited to this.
For example, as shown in FIGS. 22 and 23, as the excitation member (excitation line) 8, a first excitation member 8X and a second excitation member 8Y provided on both sides of the dielectric cylinder 5 are provided, and as the fixed member 6 , a first bonding member 13X for bonding the tip portion of the first excitation member 8X and the first point on the side surface of the dielectric cylinder 5, and the tip portion of the second excitation member 8Y and the second point on the side surface of the dielectric cylinder 5. may be used as the second bonding member 13Y that bonds the .

In this way, the end portions of the excitation lines as the first excitation member 8X and the second excitation member 8Y and the side surfaces of the dielectric cylinder 5 are bonded with the adhesive (the fixing member 6) as the first adhesion member 13X and the second adhesion member 13Y. By bonding and supporting the dielectric cylinder 5 with a gap between the first conductor 1 and the second conductor 3 (e.g., copper foil; measurement sample), a plurality of points (here, two points) on the side surface You can fix it with .

In this case, the excitation lines 8X and 8Y and the adhesives 13X and 13Y function as supporting members that support the dielectric cylinder 5 at a plurality of points on the side surface.
Here, the adhesives 13X and 13Y are preferably made of an insulating material. As materials for the adhesives 13X and 13Y, α-cyanoacrylate, epoxy resin adhesives, acrylic adhesives, and the like can be used.

It is also possible to combine the configuration of this modified example with the configuration of the above-described embodiment.
It should be noted that the present invention is not limited to the configurations described in the above-described embodiment and modifications, and can be variously modified without departing from the scope of the present invention.
Further remarks will be disclosed below with respect to the above-described embodiments and modifications.

(Appendix 1)
a first support member that supports the first conductor to be measured;
a second support member supporting a second conductor to be measured and parallel to the first support member;
a dielectric cylinder located between the first conductor and the second conductor and located at the center of the first conductor and the second conductor;
a fixing member that fixes the dielectric cylinder at a plurality of points on the side surface with a gap between the first conductor and the second conductor;
a cylinder sandwiched between the first conductor and the second conductor and provided so that the dielectric cylinder is positioned at the center;
and an excitation member that is inserted through an opening provided in the cylinder and functions as an excitation line.

(Appendix 2)
The surface conductivity measurement according to Supplementary Note 1, wherein the fixed member is a third support member that is supported by the cylinder and has a plurality of support portions that support the dielectric cylinder at a plurality of points on the side surface. Device.
(Appendix 3)
The excitation member is a first excitation member and a second excitation member provided on both sides of the dielectric cylinder,
The fixing member includes a first bonding member that bonds the tip portion of the first excitation member and a first point on the side surface of the dielectric cylinder, and a first bonding member that attaches the tip portion of the second excitation member and the side surface of the dielectric cylinder. 3. The surface conductivity measuring device according to appendix 1 or 2, characterized in that it is a second adhesive member that adheres the second point.

(Appendix 4)
The surface conductivity measuring device according to any one of Appendices 1 to 3, wherein the first conductor and the second conductor are foils having uneven surfaces.
(Appendix 5)
The surface conductivity measuring device according to any one of Appendices 1 to 4, wherein the first conductor and the second conductor are copper foils.

(Appendix 6)
The surface conductivity measuring device according to any one of Appendices 1 to 5, further comprising a measuring unit connected to the excitation member and measuring conductivity.

REFERENCE SIGNS LIST 1 first conductor 2 first support member 3 second conductor 4 second support member 5 dielectric cylinder 6 fixing member 7 cylinder 8 excitation member 8X first excitation member 8Y second excitation member 9 third support member 9A rod-like support 9B annular support 10, 11 coaxial cable 12 measuring device (resonance measuring device; measuring unit)
13X first adhesive member 13Y second adhesive member

Claims (5)

A first support member for fixing the first conductor and the second conductor such that the first surface to be measured of the first conductor to be measured and the second surface to be measured of the second conductor to be measured are parallel. and a second support member;
The first surface to be measured and the second surface to be measured are located between the first conductor and the second conductor, and the top surface and the bottom surface are parallel to the first surface to be measured and the second surface to be measured, respectively . a dielectric cylinder positioned at the center of the second surface to be measured ;
a plurality of rod-shaped portions fixed to a plurality of points on the side surface of the dielectric cylinder, between the first conductor and the top surface of the dielectric cylinder , and between the second conductor and the bottom surface of the dielectric cylinder; a fixing member for fixing the dielectric cylinder with a gap between them;
A cylinder sandwiched between the first conductor and the second conductor and having a height equal to the distance between the first conductor and the second conductor, wherein the dielectric cylinder is positioned at the center of the cylinder. the cylinder provided around the dielectric cylinder ;
A surface conductivity measuring device, comprising: an excitation member that is inserted through an opening provided in a side surface of the cylinder and functions as an excitation line. The fixing member has an annular portion whose outer edge is supported by the cylinder, and the plurality of rod-shaped portions each extend between the side surface of the dielectric cylinder and the inner edge of the annular portion.
The surface conductivity measuring device according to claim 1, characterized in that: The excitation member is a first excitation member and a second excitation member provided on both sides of the dielectric cylinder,
The fixing member includes a first bonding member that bonds the tip portion of the first excitation member and a first point on the side surface of the dielectric cylinder, and a first bonding member that attaches the tip portion of the second excitation member and the side surface of the dielectric cylinder. 3. The surface conductivity measuring device according to claim 1, further comprising a second adhesive member for adhering the second point. Any one of claims 1 to 3, wherein the first conductor and the second conductor are electrolytic copper foils having irregularities on the first surface to be measured and the second surface to be measured. The surface conductivity measuring device according to the item. The surface conductivity measuring device according to any one of claims 1 to 4, further comprising a measuring unit connected to the excitation member and measuring conductivity.

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