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JP7219944B2 - ultra proximity switch - Google Patents
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JP7219944B2 - ultra proximity switch - Google Patents

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JP7219944B2
JP7219944B2 JP2018050775A JP2018050775A JP7219944B2 JP 7219944 B2 JP7219944 B2 JP 7219944B2 JP 2018050775 A JP2018050775 A JP 2018050775A JP 2018050775 A JP2018050775 A JP 2018050775A JP 7219944 B2 JP7219944 B2 JP 7219944B2
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JP2019164205A (en
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パナート カチョーンルンルアン
恵友 鈴木
カウィー シンソムブーン
智輝 井上
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Kyushu Institute of Technology NUC
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Description

特許法第30条第2項適用 平成29年12月2日に開催された平成29年度公益社団法人精密工学会九州支部第18回学生研究発表会にて発表。Application of Article 30, Paragraph 2 of the Patent Act Presented at the 2017 18th Student Research Presentation Meeting of the Kyushu Branch of the Japan Society for Precision Engineering held on December 2, 2017.

本発明は、基準位置から所定距離の範囲内に検出対象物が配されているか否かを検出する超近接スイッチに関する。 The present invention relates to a super-proximity switch for detecting whether or not an object to be detected is arranged within a range of a predetermined distance from a reference position.

近年の精密微細加工の先端技術は、高精度なマシニングセンターの利用により、加工精度が高まっている。これに伴って、ツールセッタには、工具長や工具切れ刃の先端位置等をサブミクロン(1μmの10分の1)オーダの精度で検出することが求められる。
ツールセッタは、例えば、検出方法の違いから、接触式(例えば、非特許文献1)と非接触式(例えば、非特許文献2)に大別できる。接触式は工具切れ刃をツールセッタに接触させる必要があることから、工具切れ刃が破損したり欠損したりするおそれがある。近年では接触力の低減化が図られたツールセッタが存在するが、回転中の工具をツールセッタに接触させることはできず切れ刃の位置の検出ができない。これに対し、非接触式は、工具を接触させる必要がないため、工具切れ刃の破損等を防止することができ、回転中の工具の切れ刃位置の検出が可能である。
The advanced technology of precision microfabrication in recent years has increased the processing accuracy through the use of high-precision machining centers. Along with this, the tool setter is required to detect the tool length, the tip position of the cutting edge of the tool, and the like with an accuracy of the order of submicron (one tenth of 1 μm).
Tool setters can be broadly classified into contact type (for example, Non-Patent Document 1) and non-contact type (for example, Non-Patent Document 2) based on the difference in detection method, for example. Since the contact type requires the cutting edge of the tool to come into contact with the tool setter, the cutting edge of the tool may be damaged or chipped. In recent years, there are tool setters designed to reduce the contact force, but it is not possible to bring the rotating tool into contact with the tool setter, making it impossible to detect the position of the cutting edge. On the other hand, the non-contact type does not require contact with the tool, so it is possible to prevent breakage of the cutting edge of the tool and detect the position of the cutting edge of the tool during rotation.

株式会社メトロール、工作機械用ツールセッタ/タッチプローブ、総合カタログ、No.C5-1、2-25(2015)Metrol Co., Ltd., tool setter/touch probe for machine tools, general catalog, No. C5-1, 2-25 (2015) 中井敦生、機上計測用ソフト「フォームコントロール」と極小工具計測用レーザ、機械技術、2006年、第54巻、第7号、p.47-50Atsuo Nakai, On-machine measurement software "Form Control" and micro tool measurement laser, Mechanical Engineering, 2006, Vol. 54, No. 7, p. 47-50

しかしながら、非接触式は高精度(例えば、サブミクロンオーダの精度)な検出ができないという課題があった。また、非接触式による高精度な検出は、ツールセッタに対してだけでなく、超近接スイッチに想定される広範囲の用途(例えば、光ディスクの読み書きを行うヘッドの位置検出や、半導体製品の製造工程における製品の位置検出)に対しても有効である。
本発明はかかる事情に鑑みてなされたもので、検出精度が高い超近接スイッチを提供することを目的とする。
However, the non-contact type has a problem that it cannot detect with high accuracy (for example, accuracy of submicron order). In addition, non-contact high-precision detection can be used not only for tool setters, but also for a wide range of other possible applications for ultra-proximity switches (e.g., head position detection for reading and writing optical disks, manufacturing processes for semiconductor products, etc.). It is also effective for product position detection in
SUMMARY OF THE INVENTION It is an object of the present invention to provide a super-proximity switch with high detection accuracy.

前記目的に沿う本発明に係る超近接スイッチは、透光体を具備し、該透光体の所定の面Fの表側近傍に検出対象物が配されていることを検知する超近接スイッチであって、第1の光を照射して、近接場光E1が存在する層L1を、前記面Fの表側に発生させ、前記第1の光と波長が異なる第2の光を照射して、近接場光E2が存在する、前記層L1より厚い層L2を、該層L1及び該層L2が重複する領域を有する状態で、前記面Fの表側に発生させる照射手段と、前記近接場光E1が前記検出対象物に反射されて生じる第1の散乱光、及び、前記近接場光E2が前記検出対象物に反射されて生じる第2の散乱光の検出に基づいて、前記層L2外、該層L2内かつ前記層L1外の領域、又は、該層L1内のいずれに前記検出対象物が配されているかを検知する検出手段と、外部に信号S1、S2を出力する信号発信手段とを備え、前記第1、第2の光の前記照射手段から前記面Fまでの光路は一致し、前記照射手段は、前記第1、第2の光を同時に照射し、前記信号発信手段は、前記層L2外に前記検出対象物が配されている状態で前記信号S1を出力し、前記層L2内かつ前記層L1外の領域への前記検出対象物の進入の前記検出手段による検出によって、前記信号S2を出力し、前記層L1内への前記検出対象物の進入の前記検出手段による検出によって、前記信号S1を出力し、前記検出手段は、1つであって、前記第2の散乱光と同波長の光の強度の計測値の前記検出対象物が前記層L2内に不在時の値に対する増加から前記層L2内かつ前記層L1外の領域に前記検出対象物が進入したのを検出し、前記第1の散乱光と同波長の光の強度の計測値の前記検出対象物が前記層L2内に不在時の値に対する増加から前記層L1内に前記検出対象物が進入したのを検出し、前記透光体は、該透光体を通って該透光体から出る前記第1、第2の散乱光を該検出手段に向けて屈折させる円弧状面を有し、前記検出対象物は、工具の先端部である。 A super-proximity switch according to the present invention that meets the above object is a super-proximity switch that includes a light-transmitting body and detects that an object to be detected is arranged near the front side of a predetermined surface F of the light-transmitting body. irradiates a first light to generate a layer L1 in which the near-field light E1 exists on the front side of the surface F, irradiates a second light having a wavelength different from that of the first light, and irradiates the near field light E1. irradiating means for generating a layer L2 thicker than the layer L1, in which the field light E2 exists, on the front side of the surface F in a state where the layer L1 and the layer L2 overlap, and the near-field light E1 Outside the layer L2, the layer detection means for detecting whether the detection object is placed in the area within L2 and outside the layer L1 or within the layer L1 ; and signal transmission means for outputting signals S1 and S2 to the outside. , the optical paths of the first and second lights from the irradiation means to the surface F coincide, the irradiation means simultaneously irradiates the first and second lights, and the signal transmission means The signal S1 is output in a state where the detection object is arranged outside L2, and the signal S2 is output, and the signal S1 is output by detection by the detection means of the entry of the detection object into the layer L1, and the detection means is one, and the second scattered light and the Detecting the entry of the detection target into a region within the layer L2 and outside the layer L1 from the increase in the measured value of the intensity of light of the same wavelength compared to the value when the detection target is not present in the layer L2. Detecting that the detection target has entered the layer L1 from the increase in the measured value of the intensity of light having the same wavelength as the first scattered light compared to the value when the detection target is not present in the layer L2. and the light transmitting body has an arc-shaped surface that refracts the first and second scattered lights emitted from the light transmitting body through the light transmitting body toward the detection means, and the object to be detected is the tip of the tool .

本発明に係る超近接スイッチは、波長が異なる第1、第2の光を照射して、近接場光E1が存在する層L1と、近接場光E2が存在する、層L1より厚い層L2とを、透光体の面Fの表側に発生させ、近接場光E1が検出対象物に反射されて生じる第1の散乱光、及び、近接場光E2が検出対象物に反射されて生じる第2の散乱光の検出に基づいて、層L2外、層L2内かつ層L1外の領域、又は、層L1内のいずれに検出対象物が配されているかを検知するので、層L1、L2の厚みレベル(例えば、サブミクロンオーダ)の精度で検出対象物の配置を検出可能である。 The super proximity switch according to the present invention irradiates first and second lights with different wavelengths to form a layer L1 in which the near-field light E1 exists and a layer L2 in which the near-field light E2 exists and is thicker than the layer L1. are generated on the front side of the surface F of the transparent body, and the first scattered light generated when the near-field light E1 is reflected by the detection target, and the second scattered light generated when the near-field light E2 is reflected by the detection target Based on the detection of the scattered light, it is detected whether the detection target is arranged outside the layer L2, within the layer L2 and outside the layer L1, or within the layer L1. Therefore, the thickness of the layers L1 and L2 It is possible to detect the arrangement of the object to be detected with a level of accuracy (for example, submicron order).

本発明の一実施の形態に係る超近接スイッチの説明図である。1 is an explanatory diagram of a super proximity switch according to one embodiment of the present invention; FIG. (A)、(B)、(C)は検出対象物の位置と第1、第2の散乱光の発生の関係を示す説明図である。(A), (B), and (C) are explanatory diagrams showing the relationship between the position of the object to be detected and the generation of the first and second scattered lights. 検出手段の接続を示すブロック図である。It is a block diagram which shows the connection of a detection means. 工具先端の位置と光の強度の計測値の関係を示すグラフである。4 is a graph showing the relationship between the position of the tip of the tool and the measured value of light intensity.

続いて、添付した図面を参照しつつ、本発明を具体化した実施の形態につき説明し、本発明の理解に供する。
図1~図3に示すように、本発明の一実施の形態に係る超近接スイッチ10は、透光体11と、光P1(第1の光)及び光P2(第2の光)を照射する照射手段12と、光の強度の計測から検出対象物Wの配置を検出する検出手段13とを備えて、透光体11の所定の面14(面F)の表面側の近接位置に検出対象物Wが配されていることを検知する。以下、詳細に説明する。
Next, specific embodiments of the present invention will be described with reference to the attached drawings for better understanding of the present invention.
As shown in FIGS. 1 to 3, a super proximity switch 10 according to one embodiment of the present invention includes a transparent body 11 and light P1 (first light) and light P2 (second light). and detection means 13 for detecting the arrangement of the detection object W from the measurement of the light intensity. It is detected that the object W is arranged. A detailed description will be given below.

超近接スイッチ10は、図1に示すように、照射手段12及び検出手段13を内包した筺体16を有し、透光体11は筺体16に置かれた状態で固定されている。本実施の形態では、シリアガラスを素材とする透光体11を採用しており、透光体11は、筺体16から距離を有して水平配置された面14、平行配置された半円形状の側面17、18及び一部が筺体16に接触し面14及び側面17、18に連接する円弧状面19を有している。 As shown in FIG. 1, the super-proximity switch 10 has a housing 16 containing an irradiating means 12 and a detecting means 13, and the translucent body 11 is placed and fixed in the housing 16. As shown in FIG. In this embodiment, a translucent body 11 made of syria glass is used, and the translucent body 11 has a surface 14 horizontally arranged with a distance from a housing 16, and a semicircular shape arranged in parallel. has an arcuate surface 19 that contacts the housing 16 and connects the surface 14 and the side surfaces 17, 18.

照射手段12から照射される光P1、P2は光P1の波長が光P2の波長より短く(即ち、光P1、P2は波長が異なる)、本実施の形態では、照射手段12に光P1、P2を同時に照射する光ファイバを用いているが、照射手段12はこれに限定されない。照射手段12は、照射した光P1、P2がそれぞれ、図1、図2(A)に示すように、透光体11の円弧状面19から透光体11内に進入して、面14に裏側から到達し、面14で全反射され、透光体11の円弧状面19から透光体11外に出る向きに配置されている。 The wavelength of the light P1 and the light P2 emitted from the irradiation means 12 is shorter than the wavelength of the light P2 (that is, the light P1 and P2 have different wavelengths). are used, but the irradiation means 12 is not limited to this. The irradiating means 12 emits light P1 and P2, as shown in FIGS. Arriving from the back side, being totally reflected by the surface 14 , the light is arranged in the direction of coming out of the transparent body 11 from the arcuate surface 19 of the transparent body 11 .

光P1、P2が透光体11の面14で全反射される際、面14の表側には、光P1が染み出した近接場光(エバネセント光)E1及び光P2が染み出した近接場光(エバネセント光)E2がそれぞれ生じる。従って、照射手段12は、光P1、P2を照射して、透光体11の面14の表側に、近接場光E1が存在(局在)する層L1及び近接場光E2が存在(局在)する層L2を発生させる。層L1及び層L2は、図2(A)に示すように、それぞれ透光体11の面14から連続して(面14との間に隙間を挟まないように)設けられており、層L2は層L1より厚く、層L1と層L2は重複する領域を有している。本実施の形態では、層L1、L2の厚みがそれぞれ220nm、300nmであり、層L1全体が層L2の一部と重なり合っている。 When the lights P1 and P2 are totally reflected by the surface 14 of the transparent body 11, near-field light (evanescent light) E1 through which the light P1 seeps out and near-field light E1 through which the light P2 seeps out are formed on the front side of the surface 14. (Evanescent light) E2 is generated respectively. Therefore, the irradiation means 12 irradiates the light P1 and P2, and the layer L1 where the near-field light E1 exists (localizes) and the near-field light E2 exists (localizes) on the front side of the surface 14 of the transparent body 11. ) to generate a layer L2. As shown in FIG. 2A, the layers L1 and L2 are provided continuously from the surface 14 of the translucent body 11 (so as not to have a gap with the surface 14). is thicker than layer L1, and layers L1 and L2 have overlapping regions. In this embodiment, the layers L1 and L2 have thicknesses of 220 nm and 300 nm, respectively, and the entire layer L1 partially overlaps the layer L2.

検出対象物Wは工具Tの先端部であり、工具Tは、図1に示すように、透光体11の上方で、図示しない位置調整部材によって支持されている。位置調整部材は工具Tを昇降させることができ、工具Tは、図2(B)、(C)に示すように、位置調整手段によって降下されて、検出対象物Wが層L1、L2内に進入する。
検出対象物Wが、図2(A)に示すように、層L2の上方、即ち層L2外(層L1外かつ層L2外の領域)に配された状態では、近接場光E1、E2が検出対象物Wに当たらず散乱光は発生しない。
The object W to be detected is the tip of the tool T, and the tool T is supported above the translucent body 11 by a position adjusting member (not shown), as shown in FIG. The position adjusting member can raise and lower the tool T, and the tool T is lowered by the position adjusting means as shown in FIGS. enter in.
As shown in FIG. 2A, when the detection object W is arranged above the layer L2, that is, outside the layer L2 (area outside the layer L1 and outside the layer L2), the near-field lights E1 and E2 are It does not hit the object W to be detected and no scattered light is generated.

これに対し、検出対象物Wが、図2(B)に示すように、層L2内かつ層L1外の領域に配された状態では、近接場光E2が検出対象物Wに反射されて散乱光Q2(第2の散乱光)が生じ、検出対象物Wが、図2(C)に示すように、層L1内(層L1内かつ層L2内の領域)に配された状態では、近接場光E2が検出対象物Wに反射されて生じる散乱光Q2に加え、近接場光E1が検出対象物Wに反射されて散乱光Q1(第1の散乱光)が生じる。散乱光Q1、Q2の波長はそれぞれ光P1、P2の波長に実質的に等しい。 On the other hand, as shown in FIG. 2(B), when the detection object W is arranged in a region outside the layer L2 and the layer L1, the near-field light E2 is reflected by the detection object W and scattered. When the light Q2 (second scattered light) is generated and the object W to be detected is arranged in the layer L1 (the region within the layer L1 and within the layer L2) as shown in FIG. In addition to the scattered light Q2 generated by the reflection of the field light E2 from the detection target W, the near-field light E1 is reflected from the detection target W to generate the scattered light Q1 (first scattered light). The wavelengths of the scattered lights Q1, Q2 are substantially equal to the wavelengths of the lights P1, P2, respectively.

検出手段13は、図3に示すように、散乱光Q1と同じ(実質的に同じ)波長の光(以下、λ1の波長の光とする)の強度及び散乱光Q2と同じ(実質的に同じ)波長の光(以下、λ2の波長の光とする)の強度をそれぞれ計測可能なセンサ部20と、センサ部20の計測結果(計測値)を基に、検出対象物Wの配置を導出する位置検知部21を具備している。なお、筺体16は、照射手段12から透光体11に向かう光P1、P2及び透光体11を通過して検出手段13に向かう散乱光Q1、Q2が透過するように設計されている。 As shown in FIG. 3, the detection means 13 detects the intensity of light having the same (substantially the same) wavelength as the scattered light Q1 (hereinafter referred to as light having the wavelength λ1) and the same (substantially the same) intensity as the scattered light Q2. ) based on the sensor unit 20 capable of measuring the intensity of light with a wavelength (hereinafter referred to as light with a wavelength of λ2) and the measurement result (measurement value) of the sensor unit 20, the arrangement of the detection target W is derived. A position detector 21 is provided. The housing 16 is designed so that the light beams P1 and P2 directed from the irradiation means 12 toward the transparent body 11 and the scattered light beams Q1 and Q2 passing through the transparent body 11 and directed toward the detection means 13 are transmitted.

位置検知部21は、図2(A)に示すように、散乱光Q1、Q2が共に検出されていないと判定した際に検出対象物Wが層L2外に配されていると検知し、図2(B)に示すように、散乱光Q1が検出されず散乱光Q2が検出されていると判定した際に検出対象物Wが層L2内かつ層L1外の領域に配されていると検知し、図2(C)に示すように、散乱光Q1、Q2が共に検出されていると判定した際に検出対象物Wが層L1内に配されていると検知する。 As shown in FIG. 2(A), the position detection unit 21 detects that the object W to be detected is arranged outside the layer L2 when it is determined that both the scattered lights Q1 and Q2 are not detected. As shown in 2(B), when it is determined that the scattered light Q1 is not detected and the scattered light Q2 is detected, it is detected that the detection target W is arranged in the region outside the layer L2 and the layer L1. Then, as shown in FIG. 2C, when it is determined that both the scattered lights Q1 and Q2 are detected, it is detected that the detection target W is arranged in the layer L1.

即ち、位置検知部21は、センサ部20による散乱光Q1、Q2の検出(検出結果)に基づいて、層L2外、層L2内かつ層L1外の領域、又は、層L1内のいずれに検出対象物Wが配されているかを検知する。
ここで、検出手段13は、図1に示すように、光P1、P2を直接受光しない配置となっているが、検出対象物Wが散乱光Q1、Q2を生じさせない層L2外に配置されている状態で、センサ部20は波長がλ1の光及び波長がλ2の光を僅かに計測する(これは、外乱光や透光体11の面14で反射した光P1、P2の一部等と考えられる)。
That is, based on the detection (detection result) of the scattered lights Q1 and Q2 by the sensor unit 20, the position detection unit 21 detects the light outside the layer L2, the area inside the layer L2 and outside the layer L1, or the area inside the layer L1. It is detected whether the object W is arranged.
Here, as shown in FIG. 1, the detection means 13 is arranged so as not to directly receive the lights P1 and P2. In this state, the sensor unit 20 slightly measures light with a wavelength of λ1 and light with a wavelength of λ2 (this includes disturbance light, part of the light P1 and P2 reflected by the surface 14 of the transparent body 11, and the like). Conceivable).

従って、本実施の形態では、センサ部20が波長λ1の光を検出したことを散乱光Q1の検出とは扱えず、センサ部20が波長λ2の光を検出したことを散乱光Q2の検出とは扱えない。
そこで、検出対象物Wが層L2内に配されていない状態でセンサ部20が計測している、波長λ1の光の強度及び波長λ2の光の強度をそれぞれR1、R2として、位置検知部21は、センサ部20による波長λ1の光の強度の計測値がR1で、センサ部20による波長λ2の光の強度の計測値がR2のとき、検出対象物Wは層L2外に配されていることを検知する。
Therefore, in the present embodiment, detection of light with wavelength λ1 by the sensor unit 20 cannot be treated as detection of scattered light Q1, and detection of light with wavelength λ2 by the sensor unit 20 cannot be treated as detection of scattered light Q2. cannot handle.
Therefore, the intensity of the light with the wavelength λ1 and the intensity of the light with the wavelength λ2 measured by the sensor unit 20 when the detection target W is not placed in the layer L2 are defined as R1 and R2, respectively, and the position detection unit 21 When the measured value of the light intensity of wavelength λ1 by the sensor unit 20 is R1 and the measured value of the light intensity of wavelength λ2 by the sensor unit 20 is R2, the object W to be detected is arranged outside the layer L2. to detect.

位置検知部21は、センサ部20によって計測された、波長λ1の光の強度がR1で、波長λ2の光の強度がR2より大きい際に(即ち、波長λ2の光の強度の計測値の増加から)、層L2内かつ層L1外の領域に検出対象物Wが進入したのを検出し、センサ部20によって計測された、波長λ1の光の強度がR1より大きく、波長λ2の光の強度がR2より大きい際に(即ち、波長λ1の光の強度の計測値の増加から)、層L1内に検出対象物Wが進入したのを検出する。 When the intensity of light with wavelength λ1 is R1 and the intensity of light with wavelength λ2 is greater than R2 (that is, when the intensity of light with wavelength λ2 is measured by the sensor unit 20), the position detection unit 21 detects an increase in the measured value of the intensity of light with wavelength λ2. from), the entry of the detection object W into the area inside the layer L2 and outside the layer L1 is detected, and the intensity of the light with the wavelength λ1 is greater than R1 and the intensity of the light with the wavelength λ2 is measured by the sensor unit 20 is greater than R2 (that is, from an increase in the measured intensity of light of wavelength λ1), entry of detection object W into layer L1 is detected.

そして、検出対象物Wが層L2内かつ層L1外の領域に配されている状態では、検出対象物Wが透光体11の面14に接近するほど散乱光Q2の強度が上昇することから、センサ部20が計測する波長がλ2の光の強度に基づいて層L2内における検出対象物Wの位置を算出可能である。この点、センサ部20による波長λ1の光の強度の計測値及びセンサ部20による波長λ2の光の強度の計測値と、層L1内における検出対象物Wの位置との関係でも同様である。
本実施の形態では、位置検知部21が、センサ部20による散乱光Q2の強度から層L2内かつ層L1外の領域に配された検出対象物Wの当該領域内での位置を導出し、散乱光Q1の強度及び散乱光Q2の強度の一方又は両方から層L1内に配された検出対象物Wの層L1内での位置を計測する。
In a state in which the object W to be detected is arranged in a region outside the layer L2 and outside the layer L1, the intensity of the scattered light Q2 increases as the object W to be detected approaches the surface 14 of the translucent body 11. , the position of the detection object W in the layer L2 can be calculated based on the intensity of the light having the wavelength λ2 measured by the sensor unit 20 . In this respect, the same applies to the relationship between the measured value of the light intensity of wavelength λ1 by the sensor unit 20 and the measured value of the light intensity of wavelength λ2 by the sensor unit 20, and the position of the detection target W in the layer L1.
In the present embodiment, the position detection unit 21 derives the position of the detection target W placed in the region inside the layer L2 and outside the layer L1 from the intensity of the scattered light Q2 by the sensor unit 20, The position within the layer L1 of the detection object W placed within the layer L1 is measured from one or both of the intensity of the scattered light Q1 and the intensity of the scattered light Q2.

また、超近接スイッチ10は、図3に示すように、位置検知部21に接続され、外部に信号S1、S2を出力する信号発信手段22を備えている。信号発信手段22は、層L2外に検出対象物Wが配されている状態で信号S1を外部に出力し、層L2内かつ層L1外の領域への検出対象物Wの進入の位置検知部21による検出によって、信号S2を外部に出力し、層L1内への検出対象物Wの進入の位置検知部21による検出によって、信号S1を外部に出力する。 Moreover, as shown in FIG. 3, the super-proximity switch 10 includes a signal transmission means 22 connected to the position detection section 21 and outputting signals S1 and S2 to the outside. The signal transmitting means 22 outputs the signal S1 to the outside in a state where the detection target W is arranged outside the layer L2, and detects the position of the detection target W entering the area inside the layer L2 and outside the layer L1. 21 outputs the signal S2 to the outside, and the detection by the position detection unit 21 of the entry of the detection target W into the layer L1 outputs the signal S1 to the outside.

本実施の形態では、信号S1、S2がそれぞれオフ信号及びオン信号であり、超近接スイッチ10を備える設備には、信号発信手段22から出力される信号を受信する図示しない情報処理装置が設けられている。情報処理装置は、信号発信手段22からオン信号を受信している際に、検出対象物Wが層L2内かつ層L1外の領域に検出対象物Wが配されているのを検出することができ、工具Tを昇降させる位置調整部材と連動して、検出対象物Wを層L2内かつ層L1外の領域(透光体11の面14からの距離が220nm以上300nm以下の範囲)に配した状態を維持することが可能である。 In this embodiment, the signals S1 and S2 are an off signal and an on signal, respectively, and the equipment provided with the super proximity switch 10 is provided with an information processing device (not shown) for receiving the signal output from the signal transmitting means 22. ing. When the information processing device receives the ON signal from the signal transmission means 22, the information processing device can detect that the detection target W is arranged in a region inside the layer L2 and outside the layer L1. In conjunction with a position adjusting member that raises and lowers the tool T, the object W to be detected is arranged in a region within the layer L2 and outside the layer L1 (within a range of 220 nm or more and 300 nm or less from the surface 14 of the transparent body 11). It is possible to maintain the

次に、本発明の作用効果を確認するために行った実験について説明する。
実験では、波長450nmの第1の光及び波長635nmの第2の光を照射して、透光体の所定の面Fの表側に近接場光E1、E2を発生させた状態にし、工具の先端部を透光体の面Fの上方から徐々に面Fに近づけながら、波長450nmの光の強度及び波長635nmの光の強度を計測し、各計測値の変化を記録した。
Next, experiments conducted to confirm the effects of the present invention will be described.
In the experiment, a first light with a wavelength of 450 nm and a second light with a wavelength of 635 nm were irradiated to generate near-field lights E1 and E2 on the front side of a predetermined surface F of the translucent body. The intensity of light with a wavelength of 450 nm and the intensity of light with a wavelength of 635 nm were measured while gradually approaching the surface F of the translucent body from above, and changes in each measured value were recorded.

計測結果は図4に示す通りとなった。図4のグラフにおいて、縦軸は各波長の光の強度の計測値を示し、横軸は工具先端部の基準位置からの変位(以下、単に「変位」とも言う)を示す。変位350nmで波長450nmの光の強度及び波長635nmの光の強度の各計測値が、工具先端部を表面に接触させて予め計測した光の強度と等しくなったため、変位350nmで工具先端部が面Fに接触したと考えられる。測定結果では変位が60~175nmの範囲で波長635nmの光の強度の計測値のみが増加し、変位が175~350nmの範囲で波長450nmの光の強度の計測値及び波長635nmの光の強度の計測値が増加した。 The measurement results were as shown in FIG. In the graph of FIG. 4, the vertical axis indicates the measured intensity of light of each wavelength, and the horizontal axis indicates the displacement of the tip of the tool from the reference position (hereinafter also simply referred to as "displacement"). Since the intensity of light with a wavelength of 450 nm and the intensity of light with a wavelength of 635 nm at a displacement of 350 nm were equal to the intensity of light measured in advance by bringing the tip of the tool into contact with the surface, the tip of the tool became flat at a displacement of 350 nm. It is believed that he contacted F. In the measurement results, only the measured value of the intensity of light with a wavelength of 635 nm increased in the displacement range of 60 to 175 nm, and the measured value of the intensity of light with a wavelength of 450 nm and the intensity of light with a wavelength of 635 nm increased in the displacement range of 175 to 350 nm. Measurement value increased.

従って、変位60nm付近で工具先端部が、近接場光E2が存在する層L2内に進入し、変位175nm付近で工具先端部が、近接場光E1が存在する層L1内に進入したものと考えられる。
よって、工具先端部が層L2外に配されている際に計測される、波長450nmの光の強度の計測値をV1、波長635nmの光の強度の計測値をV2とすると、波長450nmの光の強度の計測値がV1で波長635nmの光の強度の計測値がV2より大きければ、工具先端部が層L2内かつ層L1外の領域、即ち、幅が約115nm(=175-60nm)の領域に工具先端部が配されているとの判定ができ、波長450nmの光の強度の計測値がV1より大きく、波長635nmの光の強度の計測値がV2より大きければ、層L1内、即ち、約175nm(=350-175nm)の領域に工具先端部が配されているとの判定ができる。
Therefore, it is considered that the tip of the tool entered the layer L2 where the near-field light E2 exists at a displacement of around 60 nm, and entered the layer L1 where the near-field light E1 exists at a displacement of around 175 nm. be done.
Therefore, when the measured value of the intensity of light with a wavelength of 450 nm is V1 and the measured value of the intensity of light with a wavelength of 635 nm is V2, the light with a wavelength of 450 nm is measured when the tip of the tool is arranged outside the layer L2. If the measured value of the intensity of is V1 and the measured value of the intensity of light with a wavelength of 635 nm is larger than V2, the tool tip is in the region inside the layer L2 and outside the layer L1, that is, the width is about 115 nm (= 175-60 nm) If it can be determined that the tool tip is placed in the region, the measured value of the intensity of light with a wavelength of 450 nm is greater than V1, and the measured value of the intensity of light with a wavelength of 635 nm is greater than V2, then it is in the layer L1, that is, , about 175 nm (=350-175 nm).

また、波長450nmの光の強度の計測値及び波長635nmの光の強度の計測値は共に、工具先端部の変位に伴った増加が始まってから工具先端部が透光体の面Fに接触するまで、継続的に増加することから、光の強度の計測値と工具先端部の位置は一対一の関係となり、計測された光の強度を基に工具先端部の位置を導出できることが確認できた。 Moreover, both the measured value of the intensity of light with a wavelength of 450 nm and the measured value of the intensity of light with a wavelength of 635 nm began to increase with the displacement of the tool tip, and then the tool tip came into contact with the surface F of the translucent body. Since the measured value of the light intensity and the position of the tool tip have a one-to-one relationship, it was confirmed that the position of the tool tip can be derived based on the measured light intensity. .

以上、本発明の実施の形態を説明したが、本発明は、上記した形態に限定されるものでなく、要旨を逸脱しない条件の変更等は全て本発明の適用範囲である。
例えば、信号発信手段は無くてもよい。
また、第1、第2の散乱光の強度をそれぞれ計測する2つのセンサ部を有する検出手段を採用すること、及び、第1の光を照射する照射部及び第2の光を照射する照射部を有する照射手段を用いることが可能である。
そして、検出対象物Wが第1、第2の散乱光を生じさせない位置に配されている状態で、第1の散乱光と同じ波長の光及び第2の散乱光と同じ波長の光が検出手段によって検出されなければ、検出手段が第1の散乱光と同じ波長の光を検出したことを第1の散乱光の検出とみなし、検出手段が第2の散乱光と同じ波長の光を検出したことを第2の散乱光の検出とみなすことができる。
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all modifications of conditions that do not deviate from the gist of the present invention are within the scope of the present invention.
For example, the signal emitting means may be omitted.
In addition, adopting a detection means having two sensor units that respectively measure the intensity of the first and second scattered lights, and an irradiation unit that irradiates the first light and an irradiation unit that irradiates the second light. It is possible to use irradiation means having
Light having the same wavelength as the first scattered light and light having the same wavelength as the second scattered light are detected in a state where the detection target W is placed at a position where the first and second scattered lights are not generated. If not detected by the means, the detection of the light of the same wavelength as the first scattered light by the detection means is regarded as the detection of the first scattered light, and the detection means detects the light of the same wavelength as the second scattered light. This can be regarded as detection of the second scattered light.

10:超近接スイッチ、11:透光体、12:照射手段、13:検出手段、14:面、16:筺体、17、18:側面、19:円弧状面、20:センサ部、21:位置検知部、22:信号発信手段、L1、L2:層、P1、P2:光、Q1、Q2:散乱光、T:工具、W:検出対象物 10: Super proximity switch, 11: Translucent body, 12: Irradiation means, 13: Detecting means, 14: Surface, 16: Housing, 17, 18: Side surface, 19: Arc surface, 20: Sensor unit, 21: Position Detection unit 22: signal transmission means L1, L2: layers P1, P2: light Q1, Q2: scattered light T: tool W: object to be detected

Claims (1)

透光体を具備し、該透光体の所定の面Fの表側近傍に検出対象物が配されていることを検知する超近接スイッチであって、
第1の光を照射して、近接場光E1が存在する層L1を、前記面Fの表側に発生させ、前記第1の光と波長が異なる第2の光を照射して、近接場光E2が存在する、前記層L1より厚い層L2を、該層L1及び該層L2が重複する領域を有する状態で、前記面Fの表側に発生させる照射手段と、
前記近接場光E1が前記検出対象物に反射されて生じる第1の散乱光、及び、前記近接場光E2が前記検出対象物に反射されて生じる第2の散乱光の検出に基づいて、前記層L2外、該層L2内かつ前記層L1外の領域、又は、該層L1内のいずれに前記検出対象物が配されているかを検知する検出手段と
外部に信号S1、S2を出力する信号発信手段とを備え、
前記第1、第2の光の前記照射手段から前記面Fまでの光路は一致し、
前記照射手段は、前記第1、第2の光を同時に照射し、
前記信号発信手段は、前記層L2外に前記検出対象物が配されている状態で前記信号S1を出力し、前記層L2内かつ前記層L1外の領域への前記検出対象物の進入の前記検出手段による検出によって、前記信号S2を出力し、前記層L1内への前記検出対象物の進入の前記検出手段による検出によって、前記信号S1を出力し、
前記検出手段は、1つであって、前記第2の散乱光と同波長の光の強度の計測値の前記検出対象物が前記層L2内に不在時の値に対する増加から前記層L2内かつ前記層L1外の領域に前記検出対象物が進入したのを検出し、前記第1の散乱光と同波長の光の強度の計測値の前記検出対象物が前記層L2内に不在時の値に対する増加から前記層L1内に前記検出対象物が進入したのを検出し、
前記透光体は、該透光体を通って該透光体から出る前記第1、第2の散乱光を該検出手段に向けて屈折させる円弧状面を有し、
前記検出対象物は、工具の先端部であることを特徴とする超近接スイッチ。
A super-proximity switch that includes a translucent body and detects that an object to be detected is arranged near the front side of a predetermined surface F of the translucent body,
By irradiating the first light, the layer L1 in which the near-field light E1 exists is generated on the front side of the surface F, and by irradiating the second light having a wavelength different from that of the first light, the near-field light irradiating means for generating a layer L2, in which E2 is present, which is thicker than the layer L1, on the front side of the surface F, with the layer L1 and the layer L2 having an overlapping region;
Based on the detection of the first scattered light generated by the reflection of the near-field light E1 from the detection object and the second scattered light generated by the reflection of the near-field light E2 from the detection object, the detection means for detecting whether the detection object is disposed outside the layer L2, within the layer L2 and outside the layer L1, or within the layer L1 ;
A signal transmission means for outputting signals S1 and S2 to the outside ,
optical paths of the first and second lights from the irradiating means to the surface F match;
The irradiation means simultaneously irradiates the first and second lights,
The signal transmitting means outputs the signal S1 in a state in which the detection target is arranged outside the layer L2, and detects the entry of the detection target into a region inside the layer L2 and outside the layer L1. detection by the detection means outputs the signal S2, detection by the detection means of the entry of the detection object into the layer L1 outputs the signal S1;
The detection means is one, and the measured value of the intensity of the light having the same wavelength as the second scattered light is increased from the value when the detection object is not in the layer L2 and Detecting the entry of the detection target into a region outside the layer L1, and the value of the measured intensity of the light having the same wavelength as the first scattered light when the detection target is absent in the layer L2 Detecting that the detection target has entered the layer L1 from the increase in
the translucent body has an arc-shaped surface that refracts the first and second scattered lights that pass through the translucent body and exit from the translucent body toward the detection means;
A super-proximity switch , wherein the object to be detected is a tip of a tool .
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164663A (en) 1998-11-30 2000-06-16 Ricoh Co Ltd Semiconductor evaluation equipment
JP2001194118A (en) 2000-01-13 2001-07-19 Minolta Co Ltd Method and apparatus for detecting interval, method for controlling interval, and optical recording device
JP2017161436A (en) 2016-03-11 2017-09-14 国立大学法人九州工業大学 Apparatus and method for identifying three-dimensional position of microparticle

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164663A (en) 1998-11-30 2000-06-16 Ricoh Co Ltd Semiconductor evaluation equipment
JP2001194118A (en) 2000-01-13 2001-07-19 Minolta Co Ltd Method and apparatus for detecting interval, method for controlling interval, and optical recording device
JP2017161436A (en) 2016-03-11 2017-09-14 国立大学法人九州工業大学 Apparatus and method for identifying three-dimensional position of microparticle

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