JP7220672B2 - Mounting device, control device and setting method - Google Patents

Description

This specification discloses a mounting device, a control device, and a setting method.

Conventionally, as a mounting device, a processing unit that sets a processing area that includes a part of the parts included in the image data obtained by imaging, performs super-resolution processing on the processing area, and a super-resolution processing unit that partially performs super-resolution processing A technique for recognizing the position and angle of a part based on processed image data has been proposed (see, for example, Patent Document 1). This mounting apparatus can improve the accuracy of assembly control for various parts.

International Publication No. 2015/049723 Pamphlet

By the way, in recent years, there is a trend toward miniaturization of electronic components, and there are, for example, large-sized components having a large number of fine electrodes. Since the electrodes themselves are very small in such a large-sized component, it is required to perform super-resolution processing as in the above-mentioned Patent Document 1 for the detection thereof. When the area to be subjected to super-resolution processing increases, the image processing takes time, and the number of component mounting points per hour may decrease. In this way, there has been a demand for more efficient image processing of captured images of components in mounting apparatuses.

The invention disclosed in this specification has been made in view of such problems, and its main purpose is to provide a mounting device, a control device, and a setting method that can perform image processing more efficiently. .

The present disclosure has taken the following means to achieve the above-mentioned main objectives.

A mounting apparatus for executing a mounting process for arranging components on a board,
a mounting head that collects and moves a plurality of components;
an imaging unit that captures an image of the component picked up by the mounting head;
In the image processing of the imaged part, a first process in which the image of the part is divided into a plurality of parts and two or more are in charge of parallel processing, and a second process in which one is in charge of each image of the part and performs parallel processing and a plurality of control units that execute at least one of the processes.

In this mounting apparatus, a first process in which an image of a component is divided into a plurality of parts and two or more control units are in charge of parallel processing, and a second process in which one control unit is in charge of each component image and performs parallel processing is performed. performs image processing of the captured image of the component. In this mounting device, image processing can be executed more efficiently by executing parallel processing of the first processing and the second processing.

In the mounting device of the present disclosure, the plurality of control units perform the first processing and/or the second processing in super-resolution processing for generating an image of higher quality than the captured images using a plurality of captured images. It may be executed. With this mounting device, image processing can be performed more efficiently with respect to super-resolution processing, which takes a long time. Here, "image quality" refers to an index of image quality that enables correct recognition of an object to be imaged (a part or part of a part). For example, "high-quality images" refer to images from which the correct position and shape can be obtained with a higher probability, such as images with less noise, higher resolution images, and higher magnification images. shall be

1 is a schematic explanatory diagram showing an example of a mounting system 10; FIG. FIG. 2 is an explanatory diagram of a mounting unit 13 and an imaging unit 18; 4 is a flowchart showing an example of a parallel processing condition setting routine; Explanatory drawing which shows an example regarding target time and process allocation. 4 is a flowchart showing an example of an implementation processing routine; Explanatory drawing of the 1st image 51, the 2nd image 52, and the 3rd image 53. FIG. 4 is a flowchart showing an example of an image processing routine; Explanatory drawing which shows an example of a super-resolution process. FIG. 4 is an explanatory diagram showing an example of dividing a processing area into four; 4 is a flowchart showing an example of another image processing routine; FIG. 4 is an explanatory diagram showing an example in which the processing area is not divided; 4 is a flowchart showing an example of another image processing routine;

This embodiment will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of a mounting system 10 that is an example of the present disclosure. FIG. 2 is an explanatory diagram showing an example of the mounting unit 13 and the imaging unit 18. As shown in FIG. The mounting system 10 is a system that executes a process of mounting a component P on a substrate S, for example. This mounting system 10 includes a mounting device 11 and a host computer (PC) 30 . The mounting system 10 is configured as a mounting line in which a plurality of mounting apparatuses 11 that perform a mounting process of mounting a component P on a board S are arranged from upstream to downstream. In FIG. 1, only one mounting device 11 is shown for convenience of explanation. In this embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. Parts P1, P2, P3 (see FIG. 2) and the like are collectively referred to as parts P.

The mounting apparatus 11 includes a substrate processing section 12, a mounting section 13, a component supply section 17, an imaging section 18, and a control section 20, as shown in FIG. The substrate processing unit 12 is a unit that carries in the substrate S, transports it, fixes it at the mounting position, and carries it out. The substrate processing section 12 has a pair of conveyor belts that are spaced apart from each other in the front and rear of FIG. The substrate S is conveyed by this conveyor belt.

The mounting section 13 is a unit that picks up the component P from the component supply section 17 and places it on the substrate S fixed to the substrate processing section 12 . The mounting section 13 includes a head moving section 14 , a mounting head 15 and a suction nozzle 16 . The head moving unit 14 includes a slider that is guided by guide rails and moves in the XY directions, and a motor that drives the slider. The mounting head 15 picks up a plurality of components and moves them in the XY directions by the head moving unit 14 . The mounting head 15 is detachably attached to the slider. One or more suction nozzles 16 are detachably attached to the lower surface of the mounting head 15 . The mounting head 15 has a plurality of suction nozzles 16 (four in FIG. 2) for picking up the component P arranged on the circumference. The suction nozzle 16 is a picking member that picks up components using negative pressure, and is detachably attached to the mounting head 15 . The picking member may be the suction nozzle 16, or a mechanical chuck that mechanically holds the component P, or the like.

The component supply unit 17 is a unit that supplies components P to the mounting unit 13 . A plurality of feeders having tapes holding the components P are attached to the component supply unit 17 . This feeder feeds the parts P held on the tape to a picking position. The component supply section 17 may include a tray unit having a tray on which a plurality of components P are arranged and placed. The components P used in the mounting apparatus 11 include components P1 to P3, etc., as shown in FIG. The parts P1 to P3 are large-sized parts having a relatively large size, and have a plate-like body portion 40 and bumps 42, which are fine parts. A large number of bumps 42 are electrodes arranged on the lower portion of the main body portion 40 . These parts P1 to P3 require inspection of the shape and presence of the bumps 42 during the mounting process.

The imaging unit 18 is a device that captures an image, and is a parts camera that captures an image of one or more components P picked and held by the mounting head 15 . The imaging section 18 is arranged between the component supply section 17 and the substrate processing section 12 . The imaging range of the imaging unit 18 is above the imaging unit 18 . The imaging unit 18 captures one or more images when the mounting head 15 holding the component P passes above the imaging unit 18 and outputs captured image data to the control unit 20 .

As shown in FIG. 1, the control unit 20 is configured as a microprocessor centering on a plurality of CPUs, and includes a first CPU 21, a second CPU 22, a third CPU 23, a fourth CPU 24, a storage unit 25 for storing various data, and the like. I have. The control unit 20 outputs control signals to the substrate processing unit 12 , the mounting unit 13 , the component supply unit 17 and the imaging unit 18 and inputs signals from the mounting unit 13 , the component supply unit 17 and the imaging unit 18 . In the control unit 20, the first CPU 21 to the fourth CPU 24 share and execute any one of mounting control processing, image processing, communication processing, data management processing, and the like. Mounting condition information 26 is stored in the storage unit 25 . The mounting condition information 26 includes the order of placement of the components P, identification information (ID) of the components P, component information such as component shapes and component sizes, information on the suction nozzles to be used, and placement positions on the board S. In addition to information on (coordinates), information on whether or not super-resolution processing is required is also included. Note that super-resolution processing refers to processing (multi-frame super-resolution processing) for generating an image of higher image quality from a plurality of captured images. The mounting apparatus 11 acquires the mounting condition information 35 generated by the host PC 30 from the host PC 30 before the mounting process, and stores it in the storage unit 25 .

The host PC 30 is a computer that manages information on each device of the mounting system 10 . The host PC 30 includes a control device 31, a storage section 33, a display section 38, and an input device 39, as shown in FIG. The control device 31 is configured as a microprocessor centered around a CPU 32 . The storage unit 33 is a device such as an HDD that stores various data such as processing programs. The display unit 38 is a liquid crystal screen that displays various information. The input device 39 includes a keyboard, a mouse, and the like for the operator to input various commands. Mounting condition information 35 is stored in the storage unit 33 . The mounting condition information 35 is created by the host PC 30, stored in the storage unit 33, and transmitted to the mounting apparatus 11 as required. This mounting condition information 35 includes information similar to the mounting condition information 26 .

Next, the operation of the mounting system 10 of the present embodiment configured in this way, first, setting processing for distributing processing of image data obtained by imaging the component P to a plurality of CPUs will be described. FIG. 3 is a flow chart showing an example of a parallel processing condition setting routine executed by the CPU 32 of the host PC 30. As shown in FIG. This routine is stored in the storage unit 33 and executed based on the operator's setting start input. When this routine is started, the CPU 32 first reads and acquires the mounting condition information 35 used by the mounting apparatus 11 that executes parallel processing from the storage unit 33 (S100). The mounting condition information 35 includes, for example, the information of the parts P, the arrangement order, the arrangement position, the presence or absence of the part inspection of the parts P, the necessity of the super-resolution processing, and other information that can determine the processing allocation. It may be one that is in the process of being created (temporary setting).

Next, the CPU 32 sets a component group to be held by the mounting head 15 at once in the same process (S110), and selects a target component from the component group (S120). The CPU 32 sets a component group in the order of arrangement included in the obtained mounting condition information 35, and selects target components for which parallel processing is to be set. Next, the CPU 32 acquires the processing details of the target part (S130), and calculates the target time until the part is arranged at the arrangement position after the imaging by the imaging section 18 (S140). This target time is set based on mounting conditions including, for example, one or more of the number of components simultaneously held by the mounting head 15, component placement coordinates, component placement coordinate intervals, component shape, and component size. may be For example, the CPU 32 calculates the target time of the target component on the basis of the interval (arrangement coordinate interval) between the placement positions of the components P held by the mounting head 15 on the substrate S and the movement speed. Subsequently, the CPU 32 determines whether or not the target part requires parallel processing by a plurality of CPUs (S150). This parallel processing means dividing an image processing area and simultaneously processing the divided areas by a plurality of CPUs. The CPU 32 estimates the required processing time required for image processing of the target part based on, for example, the shape and size of the target part, information on whether or not super-resolution processing is required, and determines whether the required processing time exceeds the target time. Whether or not parallel processing is required is determined based on whether or not parallel processing is required. When the CPU 32 determines that parallel processing is required, the CPU 32 allocates image processing areas based on the resources of the CPU (S160). In addition, in the control device 31, the image of the part P is divided into a plurality of parts, and two or more CPUs (first CPU 21 to fourth CPU 24) are in charge of the first process in which parallel processing is performed, and one process is performed for each image of the part P. At least one of the second processes to be executed in parallel by the CPU is set as a process condition at the time of implementation. Further, the control device 31 performs the first process and the second process in one or more image processing out of the position recognition of the part P, the shape recognition of the part P, the part recognition of the part P, and the part inspection of the part P. Set the processing conditions during implementation. Furthermore, the control device 31 sets processing conditions at the time of mounting so that the first processing and the second processing are executed in the super-resolution processing.

4A and 4B are explanatory diagrams showing an example of target time and processing allocation. FIG. 4A is a diagram showing the relationship between the target time and the processing time required by each component, and FIG. 4B is an explanatory diagram of division of the processing area. Here, as shown in FIG. 2, a component P3, a component P2, and two components P1 are sampled, and the parts (bumps 42) of the component P are recognized and inspected using images subjected to super-resolution processing. As an example, a case of arranging them in the order in which they are collected will be described. After imaging the mounting head 15 with the imaging unit 18, the CPU 32 sequentially moves to the placement position of each component and obtains the placement time. The CPU 32 calculates the target time ta (FIG. 4A) for the part Pa (FIG. 4B). Next, the CPU 32 calculates the necessary processing time Ta for the part Pa. The CPU 32 similarly calculates target times tb, tc, and td and required processing times Tb, Tc, and Td for the parts Pb, Pc, and Pd, respectively. Subsequently, since the required processing times Ta and Tb do not exceed the target times ta and tb, respectively, the CPU 32 does not divide the image processing area and sets the first CPU 21 to process the processing areas A and B. do. On the other hand, since the required processing time Tc exceeds the target time tc, the CPU 32 divides the image processing region within a range that does not exceed the target time tc. Here, the CPU 32 divides the processing regions and sets the processing charge so that the first CPU 21 is in charge of the processing region C1 and the second CPU 22 is in charge of the processing region C2. For this division, for example, one or more of corresponding division for dividing the image into the number of images corresponding to the number of CPUs, line area division for dividing the image into line-based areas, and equal division for equally dividing the image may be performed. good. In addition, in this area division, it is preferable that the image processing area is divided by areas in which, for example, the parts of the component P to be subjected to image processing (for example, the bumps 42) are not divided. Such division can be performed based on part shape data. Then, since the required processing time Td exceeds the target time td, the CPU 32 divides the image processing region within a range that does not exceed the target time td. Here, the CPU 32 divides the processing areas by line area division and equal division so that the first CPU 21 is in charge of the processing area D1, the second CPU 22 is in charge of the processing area D2, the third CPU 23 is in charge of the processing area D3, and the fourth CPU 24 is in charge of the processing area D4. and set the person in charge of processing. If the required processing time Td exceeds the target time td even after the processing area D4 is divided, the CPU 32 may divide the areas that can be further divided in previous image processing. Here, for example, the processing area C may be divided into four. In this manner, the CPU 32 sets parallel processing by one or more CPUs so as not to cause layout waiting time due to image processing.

After S160 or after determining in S150 that parallel processing is not required, the CPU 32 determines whether parallel processing has been determined for all parts groups (S170), and determines all parts groups. If not, the process after S120 is executed. That is, the next component group is set, target components are selected, and image processing is distributed as necessary. On the other hand, when all of the component groups are determined in S170, the content of the above setting is included in the mounting condition information 35 as a parallel processing setting and stored in the storage unit 33 (S190), and this routine ends. The mounting condition information 35 is then transmitted to the mounting apparatus 11 and stored in the storage unit 25 as the mounting condition information 26 .

Next, processing for mounting the component P on the board S by the mounting apparatus 11 using the set mounting condition information 26 will be described. FIG. 5 is a flow chart showing an example of a mounting processing routine executed by the control unit 20. As shown in FIG. This routine is stored in the storage unit 25 and executed in response to the worker's mounting start input. When this routine is started, the control unit 20 first reads and acquires the mounting condition information 26 (S200), and causes the substrate processing unit 12 to carry out and fix the substrate S (S210). Next, the control unit 20 sets the components P held by the mounting head 15 in the same process based on the arrangement order of the mounting condition information 26 (S220). Next, the control unit 20 attaches or changes the suction nozzle 16 as necessary, and causes the mounting unit 13 to pick up and move the component P (S230). At this time, the control unit 20 moves the mounting head 15 so as to pass over the imaging unit 18 . Next, the control unit 20 causes the imaging unit 18 to perform imaging processing of the component P held by the mounting head 15 (S240). At this time, when the component P requiring super-resolution processing is held by the mounting head 15, a plurality of images obtained by changing the position of the mounting head 15 are captured. When the image capturing unit 18 captures an image, the control unit 20 performs moving processing and placement processing while performing image processing and inspection processing (S250).

Here, FIG. 4 is used as an example to describe the process of S250. FIG. 6 is an explanatory diagram of the first image 51, the second image 52 and the third image 53. FIG. FIG. 7 is a flow chart showing an example of an image processing routine that the control unit 20 performs parallel processing using the first to fourth CPUs. FIG. 8 is an explanatory diagram showing an example of super-resolution processing, FIG. 8A is a diagram of a low-quality image, FIG. 8B is an explanatory diagram of a high-quality image in super-resolution processing, and FIG. 8C is a pixel of a low-quality image. Coordinate diagram. FIG. 8D is a diagram of pixel coordinates of a high-quality image of super-resolution processing, FIG. 8E is a diagram of picked-up images 51A to 53A of bumps, and FIG. 8F is an explanatory diagram of a super-resolution image 54A. For example, in the example of FIG. 4, the control unit 20 moves the mounting head 15 to the placement position of the component Pa, performs super-resolution processing on the processing area A, and performs the image of the bumps 42 formed on the main unit 40. is analyzed, and the presence or absence of shape and lack thereof is inspected, and the part P3 is arranged. Similarly, the control unit 20 moves the mounting head 15 to the placement positions of the components Pb, Pc, and Pd, and performs image processing during the movement. When an error inspection result is obtained, the control unit 20 causes the part P to be disposed of at a predetermined disposal site.

This super-resolution processing uses a plurality of captured images, obtains an accurate amount of movement between the captured images 51A to 53A, etc., generates a provisional high-quality image, performs blur estimation processing on this provisional image, and reproduces it. A composition process is performed to generate an image of higher quality than the captured image. As shown in FIG. 8B, when the low-quality images are superimposed by shifting the pixel pitch range other than an integer (for example, 0.5 pixels, 1.5 pixels, etc.), the information between pixels is increased. be able to. In addition, since an actually captured image is used, a high-quality image with high reliability can be generated as compared with simply estimating and interpolating information between pixels. This super-resolution processing simply requires a large amount of processing, and thus takes a long time. In the control unit 20, as shown in FIG. 7, four CPUs perform image processing in parallel.

Also, the control unit 20 executes the image processing shown in FIG. After executing this image processing, the first CPU 21 executes image processing (for example, super-resolution processing) of the processing area A (S301), determines the position of the part in the processing area A, and executes the part inspection process ( S305), the image processing of the processing area B is executed (S311), the position of the component in the processing area B is determined, and the part inspection processing is executed (S315). Subsequently, the first CPU 21 executes image processing of the processing area C1 (S321), and in parallel with this, the second CPU 22 executes image processing of the processing area C2 (S322), and determines the position of the part in the processing area C. Then, the part inspection process is executed (S325). In S325, depending on the state of image division, if each CPU can share the task, it will share the task. When each CPU cannot share, one or more of the CPUs executes the process of combining images, the position determination process, and the inspection process. Then, the first CPU 21 executes image processing of the processing area D1 (S331), parallel to this, the second CPU 22 executes image processing of the processing area D2 (S332), the third CPU 23 executes image processing of the processing area D3 (S333), The 4 CPU 24 executes image processing of the processing area D4 (S334), determines the position of the component in the processing area D, and executes the inspection processing of the part (S335). The mounting apparatus 11 performs image processing for each component P in time for the target time t by performing parallel processing.

Returning to the description of the mounting process routine, after S250, the control unit 20 determines whether or not the mounting process for the current board has been completed (S260), and if not completed, executes the processes from S220 onwards. That is, the control unit 20 sets the component P to be collected next, replaces the suction nozzle 16 as necessary, picks up an image of the component P, and places the component P on the board S while performing image processing in parallel. On the other hand, when the mounting process of the current board is completed in S260, the control section 20 causes the board processing section 12 to discharge the board S that has been mounted (S270), and determines whether or not the production is completed (S280). If the production has not been completed, the control unit 20 executes the processes from S210 onward, and if the production has been completed, the routine ends.

Here, correspondence relationships between the components of the present embodiment and the components of the present disclosure will be clarified. The mounting head 15 of this embodiment corresponds to the mounting head, the imaging section 18 corresponds to the imaging section, the first CPU 21 to the fourth CPU 24 correspond to a plurality of control sections, and the CPU 32 corresponds to the setting section. Also, the control device 31 corresponds to the control device, and the mounting device 11 corresponds to the mounting device. In addition, in this embodiment, an example of the setting method of the present disclosure is also clarified by explaining the operation of the host PC 30 .

The mounting apparatus 11 of the embodiment described above divides the image of the component P into a plurality of parts, and performs first processing in which two or more control units (the first CPU 21 to the fourth CPU 24) are in charge of parallel processing, and Image processing of the picked-up image of the component P is performed by the second process in which one control unit is in charge and performs parallel processing. The mounting apparatus 11 can execute image processing more efficiently by executing parallel processing of the first processing and the second processing. Also, the plurality of control units perform first processing and/or second processing in super-resolution processing that uses a plurality of captured images to generate an image of higher quality than the captured images. The mounting apparatus 11 can more efficiently perform super-resolution processing, which takes a long time for image processing. Further, the plurality of control units perform the first processing or the second processing on the image of each component P based on the target time set for each component P among the plurality of components P picked up by the mounting head 15. I do. Since the mounting apparatus 11 performs the first process and the second process suitable for the target time, image processing can be performed more efficiently. Furthermore, the mounting apparatus 11 sets the target time based on mounting conditions including one or more of the number of components simultaneously held by the mounting head, component placement coordinates, component placement coordinate intervals, component shape, and component size. do. In this mounting apparatus 11, the time required for the mounting process can be further shortened by performing the process suitable for the mounting conditions for each component P. FIG.

In addition, the plurality of control units perform the first process and/or the second process in one or more image processing out of position recognition of the part P, shape recognition of the part P, part recognition of the part P, and part inspection of the part P. do. In this mounting apparatus 11, image processing can be performed more efficiently in recognizing and inspecting the component P or part of the component P. FIG. Further, the plurality of control units divides into one or more of corresponding division for dividing the image into the number of images corresponding to the number of the control units, line area division for dividing the image into areas in units of lines, and equal division for equally dividing the image. A first process is performed using the image. For example, in correspondence division, image processing is assigned to each control unit, so image processing can be performed more efficiently. In addition, in the line area division, it is more efficient to process each line of pixels in the image data, so image processing can be executed more efficiently. Further, in the equal division, the processing can be equally divided, so that the image processing can be executed more efficiently.

Furthermore, the control device 31 divides the image of the component P into a plurality of parts and performs parallel processing by two or more CPUs (control units) for image processing of the imaged component P; At least one of the second processes to be performed in parallel by one control unit is set for each P image. This control device 31 can execute image processing more efficiently by executing parallel processing of the first processing and the second processing in the same manner as the mounting device 11 described above.

It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be implemented in various forms as long as they fall within the technical scope of the present disclosure.

For example, in the above-described embodiment, the image processing conditions are set by combining the first process and the second process, but the present invention is not limited to this. The same processing area may be divided for each product type. Alternatively, in the above-described embodiment, the processing area is divided based on the target time and the required processing time of the part P, but the present invention is not particularly limited to this, and processing can be performed regardless of the target time or the required processing time. It is also possible to divide the area. FIG. 9 is an explanatory diagram showing an example of dividing the processing area into four. FIG. 10 is a flow chart showing an example of another image processing routine when the processing area is divided into four. As shown in FIG. 9, when there are four control units, the processing area may be divided into four. Also, although the processing area is divided into line areas in FIG. 4, it may be equally divided vertically and horizontally as shown in FIG. The CPU 32 of the control device 31 sets the processing charge so that the first CPU 21 through the fourth CPU 24 take charge of the processing areas A1 through A4 of the part Pa to be laid out first. Next, the CPU 32 sets the processing charge so that the first CPU 21 through the fourth CPU 24 are in charge of the processing areas B1 through B4 of the part Pb to be placed second. Subsequently, the CPU 32 sets the processing charge so that the first CPU 21 through the fourth CPU 24 are in charge of the processing areas C1 through C4 of the component Pc to be placed third. Then, the CPU 32 sets the processing responsibility so that the first CPU 21 to fourth CPU 24 are in charge of the processing regions D1 to D4 of the component Pd to be placed fourth.

The control unit 20 of the mounting apparatus 11 uses this setting to execute the mounting processing routine and the image processing shown in FIG. 10 . After executing this image processing, the first CPU 21 executes image processing (for example, super-resolution processing) of the processing area A1 (S341). In parallel with this, the second CPU 22 to the fourth CPU 24 execute image processing of the processing areas A2 to A4, respectively (S342 to 344), determine the positions of the parts in the processing area A, and execute the part inspection processing (S345). ). S345 is performed by each CPU if it can be shared depending on the division state of the image. When each CPU cannot share, one or more of the CPUs executes the process of combining images, the position determination process, and the inspection process. Next, the first CPU 21 to the fourth CPU 24 execute image processing of the processing areas B1 to B4 in parallel (S351 to S354), determine the positions of the parts in the processing area B, and execute the part inspection processing (S355). . Subsequently, the first CPU 21 to the fourth CPU 24 execute the image processing of the processing areas C1 to C4 in parallel (S361 to S364), determine the positions of the parts in the processing area C, and execute the part inspection processing (S365). . Then, the first CPU 21 to the fourth CPU 24 execute the image processing of the processing areas D1 to D4 in parallel (S371 to S374), determine the position of the part in the processing area B, and execute the part inspection process (S375). This mounting apparatus 11 can perform image processing more efficiently by dividing an image into a plurality of pieces and processing them in parallel.

Further, in the above-described embodiment, the image processing conditions are set by combining the first processing and the second processing, but the present invention is not limited to this. may be parallel-processed only by the second process without dividing. Alternatively, in the above-described embodiment, the processing area is divided based on the target time and the required processing time of the part P, but it is not limited to this, and regardless of the target time or the required processing time, In addition, parallel processing may be performed only with the second processing without dividing the processing area. FIG. 11 is an explanatory diagram showing an example of not dividing the processing area. FIG. 12 is a flow chart showing an example of another image processing routine that performs parallel processing without dividing the processing area. As shown in FIG. 11, when four parts are sampled and there are four controllers, the processing may be performed in parallel. As shown in FIG. 11, the CPU 32 of the control device 31 sets the processing charge so that the first CPU 21 through the fourth CPU 24 take charge of the processing areas A through D of the parts Pa through Pd in parallel. Then, the control unit 20 of the mounting apparatus 11 uses this setting to execute the mounting processing routine and the image processing shown in FIG. 12 . When this image processing is executed, the first CPU 21 to fourth CPU 24 execute the image processing of the processing areas A to D in parallel (S381 to S384), determine the positions of the parts in the processing areas A to D, and inspect the parts. (S391-394). This mounting apparatus 11 can perform image processing more efficiently by performing parallel processing without dividing an image.

In the above-described embodiment, parallel processing is performed when performing super-resolution processing, but the present invention is not particularly limited to this, and parallel processing of image processing is performed when the processing time of image processing exceeds the target time. It can be a thing. Also in this mounting apparatus 11, image processing can be executed more efficiently by executing parallel processing.

In the above-described embodiment, the control device 31 of the host PC 30 sets the parallel processing in the image processing. good too. In this mounting apparatus 11, it is possible to set more appropriate processing contents for image processing of components. Also, the device for setting parallel processing is not particularly limited. A device or the like may set this parallel processing.

In the above-described embodiment, the present disclosure has been described as the mounting apparatus 11 and the host PC 30, but for example, the present disclosure may be a mounting method or a setting method, or may be a program for causing a computer to execute the above-described processes.

Here, in the mounting apparatus according to the present disclosure, the plurality of control units may control the image of each component based on the target time set for each component among the plurality of components picked up by the mounting head. The first process or the second process may be performed. Since this mounting apparatus performs the first process and the second process suitable for the target time, the image processing can be executed more efficiently. In this mounting apparatus, the target time is based on mounting conditions including one or more of the number of components simultaneously held by the mounting head, the arrangement coordinates of the components, the arrangement coordinate interval of each component, the shape of the components, and the size of the components. may be set as In this mounting apparatus, the time required for the mounting process can be further shortened by performing the process suitable for the mounting conditions for each component.

In the mounting apparatus of the present disclosure, the plurality of control units perform the first processing in one or more of the image processing of position recognition of the component, recognition of the shape of the component, recognition of the part of the part, and inspection of the part of the part. and/or may execute the second process. With this mounting apparatus, image processing can be performed more efficiently in recognizing and inspecting parts or parts of parts.

In the mounting device of the present disclosure, the plurality of control units are divided into corresponding divisions into the number of images corresponding to the number of the control units, line area divisions into which the image is divided into areas in units of lines, and even division of the image. The first process may be executed using one or more divided images among the equally divided images. For example, in correspondence division, image processing is assigned to each control unit, so image processing can be performed more efficiently. In addition, in the line area division, it is more efficient to process each line of pixels in the image data, so image processing can be executed more efficiently. Further, in the equal division, the processing can be equally divided, so that the image processing can be executed more efficiently.

In the mounting apparatus of the present disclosure, the control unit divides the image of the component into a plurality of parts and performs parallel processing in which two or more of the control units are in charge of the image processing of the imaged component. Also, at least one of the second processes that are performed in parallel by one of the control units may be set for each image of the component. In this mounting apparatus, it is possible to set more appropriate processing contents for image processing of components.

The control device of the present disclosure is
A mounting head that picks up and moves a component, an imaging unit that picks up an image of the component picked up by the mounting head, and a plurality of control units that process the images picked up by the imaging unit, and arranges the component on a board. A control device used in a mounting system including a mounting device that executes mounting processing to
For the image processing of the imaged part, a first process in which the image of the part is divided into a plurality of parts and two or more of the control units are in charge of parallel processing, and one control is performed for each image of the part. a setting unit that sets at least one of the second processes that the unit is in charge of and performs parallel processing;
is provided.

This control device can execute image processing more efficiently by executing parallel processing of the first processing and the second processing in the same manner as the mounting device described above. In addition, in this control device, various aspects of the mounting device described above may be adopted, and a configuration for realizing each function of the mounting device described above may be added.

The setting method of the present disclosure is
A mounting head that picks up and moves a component, an imaging unit that picks up an image of the component picked up by the mounting head, and a plurality of control units that process the images picked up by the imaging unit, and arranges the component on a board. A setting method used in a mounting system including a mounting apparatus that executes mounting processing to
For the image processing of the imaged part, a first process in which the image of the part is divided into a plurality of parts and two or more of the control units are in charge of parallel processing, and one control is performed for each image of the part. setting at least one of the second processes that the department is in charge of and performs parallel processing;
includes.

With this setting method, image processing can be executed more efficiently by setting parallel processing of the first process and the second process in the same manner as in the mounting apparatus described above. In this setting method, various aspects of the mounting apparatus described above may be adopted, and steps for realizing each function of the mounting apparatus described above may be added.

A mounting apparatus, a control apparatus, and a setting method disclosed in this specification can be used in an apparatus that performs a mounting process for arranging components on a board.

10 mounting system 11 mounting apparatus 12 substrate processing unit 13 mounting unit 14 head moving unit 15 mounting head 16 suction nozzle 17 component supply unit 18 imaging unit 20 control unit 21 to 24 first to second 4 CPU, 25 storage unit, 26 mounting condition information, 30 host PC, 31 control device, 32 CPU, 33 storage unit, 35 mounting condition information, 38 display unit, 39 input device, 40 main unit, 42 bump, 51, 51A 1 image, 52, 52A 2nd image, 53, 53A 3rd image, 54A Super-resolution image, A to D, A1 to A4, B1 to B4, C1 to C4, D1 to D4 Processing area, ta to td Target time , Ta to Td required processing time, P, P1 to P3, Pa to Pd component, S substrate.

Claims (8)

A mounting apparatus for executing a mounting process for arranging components on a board,
a mounting head that collects and moves a plurality of components;
an imaging unit that captures an image of the component picked up by the mounting head;
In the image processing of the imaged part, a first process in which the image of the part is divided into a plurality of parts and two or more are in charge of parallel processing, and a second process in which one is in charge of each image of the part and performs parallel processing A plurality of control units that perform at least one of the processes,
The plurality of control units perform the first processing on a component for which a necessary processing time required for image processing exceeds a target time, among a plurality of components collected by the mounting head and held at one time in the same process. , one of the plurality of control units performs image processing of the part for which the target time is not exceeded for the part for which the target time is not exceeded, and the plurality of control units perform the first processing. When there is a part whose required processing time exceeds the target time even if it is performed, the mounting apparatus divides a part that can be further divided in image processing prior to the part among the plurality of parts retroactively. 2. The method according to claim 1, wherein the plurality of control units perform the first processing and/or the second processing in super-resolution processing for generating an image having higher image quality than the captured images using a plurality of captured images. Mounting equipment as described. The target time is set based on mounting conditions including one or more of the number of components to be simultaneously held by the mounting head, the arrangement coordinates of the components, the arrangement coordinate interval of each component, the shape of the components, and the size of the components. 3. The mounting apparatus according to claim 1 or 2. The plurality of control units perform the first processing and/or the second processing in one or more of the image processing of position recognition of the component, shape recognition of the component, region recognition of the component, and region inspection of the component. The mounting apparatus according to any one of claims 1 to 3, which executes The plurality of control units may be one or more of corresponding division for dividing the image into the number of images corresponding to the number of the control units, line area division for dividing the image into line-based areas, and equal division for equally dividing the image. 5. The mounting apparatus according to any one of claims 1 to 4, wherein the first processing is performed using the divided images of . The control unit divides the image of the part into a plurality of parts and performs parallel processing in which two or more of the control parts are in charge of the image processing of the imaged part. 6. The mounting apparatus according to any one of claims 1 to 5, wherein at least one of the second processes to be processed in parallel by one of said control units is set. a mounting head that picks up a plurality of components and moves; an imaging section that picks up an image of the components picked up by the mounting head; and a plurality of control sections that process the images picked up by the imaging section. A control device used in a mounting system including a mounting device that executes mounting processing to be placed in a
For the image processing of the imaged part, a first process in which the image of the part is divided into a plurality of parts and two or more of the control units are in charge of parallel processing, and one control is performed for each image of the part. Set at least one of the second processes that the department is in charge of and performs parallel processing,
Among a plurality of components picked up by the mounting head and held at one time in the same process, the first processing is performed on components for which the required processing time required for image processing exceeds the target time, and the target time is exceeded. One control unit among the plurality of control units performs image processing for a component that does not exceed the target time for a component that does not exceed the target time, and the plurality of control units perform the image processing of the component that does not exceed the target time, and the plurality of control units perform the necessary A control device comprising: a setting unit that, when there is a component whose processing time exceeds the target time, traces back and divides a component that can be further divided in image processing prior to the component among the plurality of components. a mounting head that picks up a plurality of components and moves; an imaging section that picks up an image of the components picked up by the mounting head; and a plurality of control sections that process the images picked up by the imaging section. A setting method used in a mounting system including a mounting device that executes mounting processing to be placed in a
a step of determining whether or not there is a component whose necessary processing time required for image processing exceeds a target time, among a plurality of components picked up by the mounting head and held at one time in the same process;
For image processing of the part that exceeds the target time, a first process is set in which the image of the part is divided into a plurality of parts and two or more of the control units are in charge of parallel processing, and the target time is not exceeded. For a part, one of the plurality of controllers performs image processing for a part that does not exceed the target time, and the plurality of controllers perform the necessary processing even if the first processing is performed. if there is a part whose time exceeds the target time, setting to divide a part that can be further divided in image processing prior to the part among the plurality of parts retroactively;
configuration method, including

Images