JP7225565B2 - Capacitor and power converter with the same - Google Patents

Description

The present invention relates to a capacitor and a power converter having the same.

Patent Literature 1 discloses a capacitor device that constitutes a part of a power conversion device such as an inverter mounted on an electric vehicle, a hybrid vehicle, or the like. The capacitor device described in Patent Document 1 has a capacitor element and a capacitor case that houses the capacitor element. The capacitor element is sealed with a potting material inside the capacitor case. The capacitor case is provided with an opening on one surface, and the potting surface of the potting material is exposed from this opening.

JP 2014-64407 A

However, the capacitor described in Patent Document 1 does not have a suitable part for gripping. Therefore, for example, when assembling the capacitor to a device such as a power conversion device in which the capacitor is arranged, it is difficult for a worker or the like to hold the capacitor, and it is difficult to improve workability.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and it is an object of the present invention to provide a capacitor that is easy to hold.

One aspect of the present invention is
a capacitor element (11);
a capacitor case (2) housing the capacitor element therein;
a sealing resin (3) that fills the inside of the capacitor case and seals the capacitor element,
The capacitor case has a bottom wall (21) and a side wall (22) erected from the bottom wall, and has a resin surface (31) of the sealing resin on one surface opposite to the bottom wall. having an exposing opening (220);
A projecting portion (23) projecting from the opening toward the side (X1) where the capacitor case opens is formed on the side wall,
said protrusion is provided adjacent to a thickened portion (20) of said sidewall,
The capacitor (1), wherein the capacitor case has a rib (26) formed on the outer surface of the side wall on the side opposite to the sealing resin, the rib (26) extending from the surrounding portion of the thick portion to the thick portion.

In the capacitor of this aspect, the side wall is formed with a protrusion that protrudes from the opening toward the opening of the capacitor case. Therefore, an operator's finger or the like can be hooked on the projecting portion to easily grip the capacitor. Therefore, when assembling the capacitor to a device in which the capacitor is arranged, or when moving the capacitor, it is easy for a worker or the like to hold the capacitor, and workability can be easily improved.

As described above, according to the aspect, it is possible to provide a capacitor that is easy to hold.
It should be noted that the symbols in parentheses described in the claims and the means for solving the problems indicate the corresponding relationship with the specific means described in the embodiments described later, and limit the technical scope of the present invention. not a thing

2 is a plan view of a capacitor in Reference Embodiment 1. FIG. FIG. 2 is a front view of a capacitor in reference form 1; FIG. 1 is a cross-sectional view taken along line III-III. FIG. 2 is a side view of a capacitor case in Reference Embodiment 1; FIG. 2 is a plan view of the power conversion device with the cover removed according to the reference form 1; A cross-sectional view taken along the line VI-VI in FIG. FIG. 10 is a plan view of a capacitor in reference form 2; The front view of the capacitor|condenser in the reference form 2. FIG. FIG. 7 is a cross-sectional view taken along line IX-IX. FIG. 10 is an enlarged view of the vicinity of the projecting portion in FIG. 9; FIG. 11 is a side view of a capacitor case in Reference Embodiment 2; 2 is a plan view of a capacitor in Embodiment 1. FIG. A cross-sectional view taken along line XIII-XIII in FIG. FIG. 12 is an enlarged view of the vicinity of the projecting portion of the cross section of the capacitor parallel to the X direction and the Z direction in Reference Embodiment 3 ;

( Reference form 1)
A form of a capacitor and a power conversion device having the capacitor will be described with reference to FIGS. 1 to 6. FIG. First, the capacitor of this embodiment will be described with reference to FIGS. 1 to 4. FIG.

A capacitor 1 of this embodiment has a capacitor element 11, a capacitor case 2, and a sealing resin 3, as shown in FIG. Capacitor case 2 accommodates capacitor element 11 therein. The sealing resin 3 fills the inside of the capacitor case 2 and seals the capacitor element 11 . Capacitor case 2 has bottom wall 21 and side walls 22 erected from bottom wall 21 . The capacitor case 2 has an opening 220 that exposes the resin surface 31 of the sealing resin 3 on one surface opposite to the bottom wall 21 . As shown in FIGS. 1, 3 and 4, the side wall 22 is formed with a protruding portion 23 protruding from the opening 220 toward the opening of the capacitor case 2 . Hereinafter, this embodiment will be described in detail.

The capacitor 1 constitutes a part of the power converter (see reference numeral 10 in FIGS. 5 and 6). The power conversion device can be an in-vehicle power conversion device mounted in a vehicle such as an electric vehicle or a hybrid vehicle. The power conversion device is arranged between a DC power supply (not shown) and a three-phase AC motor. The capacitor 1 smoothes the DC voltage applied from the DC power supply side and outputs the smoothed DC voltage to the power conversion circuit side. A power conversion circuit converts the DC voltage into an AC voltage. The power converter applies the AC voltage thus obtained to the three-phase AC motor.

The capacitor case 2 is made of resin such as PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), PC (polycarbonate), EP (epoxy), and nylon (registered trademark). As shown in FIGS. 2 and 3, the capacitor case 2 has a rectangular box shape with one side open. As shown in FIG. 2, the capacitor case 2 has a rectangular shape elongated in one direction when viewed from the opening direction of the capacitor case 2 . Hereinafter, the opening direction of the capacitor case 2 will be referred to as the X direction. The longitudinal direction of the capacitor case 2 when viewed from the X direction is called the Y direction. A direction orthogonal to both the X direction and the Y direction is called the Z direction.

The bottom wall 21 of the capacitor case 2 has a rectangular plate shape that is long in the Y direction and short in the Z direction. The bottom wall 21 has a thickness in the X direction.

As shown in FIGS. 1 to 4, the side wall 22 is erected on one side in the X direction (hereinafter referred to as the X1 side, and the side opposite to the X1 side is referred to as the X2 side) from the entire periphery of the bottom wall 21. It has a rectangular tubular shape. Hereinafter, the pair of wall portions of the side walls 22 facing each other in the Z direction will be referred to as long side walls 221 , and the pair of wall portions facing each other in the Y direction will be referred to as short side walls 222 . The long side wall 221 is elongated in the longitudinal direction of the capacitor case 2, that is, in the Y direction.

As shown in FIGS. 2 and 3, an opening 220 is formed at the end of side wall 22 opposite bottom wall 21 . As shown in FIG. 2, the opening 220 has a rectangular shape elongated in the Y direction when viewed from the X direction.

As shown in FIGS. 1 to 4, the protruding portion 23 is formed on the wall portion forming the long side of the opening 220 in the side wall 22 . That is, the projecting portion 23 extends from the long side wall 221 of the side wall 22 toward the X1 side. In this embodiment , the protrusion 23 is formed on one of the pair of long side walls 221 . Hereinafter, the wall portion of the side wall 22 on which the projecting portion 23 is formed will be referred to as a specific side wall 221a. That is, in this embodiment , one of the pair of long side walls 221 is the specific side wall 221a. Further, in the Z direction, the side on which the projecting portion 23 of the capacitor case 2 is formed is called the Z1 side, and the opposite side is called the Z2 side.

As shown in FIGS. 1 and 2, the projecting portion 23 is formed in the center of the specific side wall 221a in the Y direction. The projection 23 is elongated in the longitudinal direction of the opening 220, that is, in the Y direction. As shown in FIGS. 3 and 4, in this embodiment , the thickness of the projecting portion 23 is the same as the thickness of the specific side wall 221a.

As shown in FIG. 3, the inside of the capacitor case 2 is filled with a sealing resin 3 that seals the capacitor element 11 . The sealing resin 3 has a resin surface 31 exposed from the opening 220 of the capacitor case 2 . The resin surface 31 is a surface perpendicular to the X direction and faces the X1 side. The resin surface 31 is formed at a position slightly recessed toward the X2 side from the opening 220 of the capacitor case 2 . The sealing resin 3 is formed by potting. A thermosetting resin such as an epoxy resin can be used for the sealing resin 3, for example.

A plurality of capacitor elements 11 are embedded in the sealing resin 3 filled in the capacitor case 2 . Although illustration is omitted, the plurality of capacitor elements 11 are arranged in the Y direction. Each capacitor element 11 is a film capacitor formed by winding a metallized film. The plurality of capacitor elements 11 are arranged in a posture such that the winding axis direction of the metallized film is the Z direction.

As shown in FIG. 3, a pair of electrode surfaces 111 are formed on both end faces of the capacitor element 11 in the Z direction. Each electrode surface 111 is formed, for example, by spraying a metal such as aluminum onto both ends in the Z direction of the capacitor element 11 before forming the electrode surface 111 . A pair of positive and negative bus bars 4 are connected to the pair of electrode surfaces 111 of the capacitor element 11 . Hereinafter, of the pair of busbars 4, the positive busbar 4 may be called a positive busbar 4p, and the negative busbar 4 may be called a negative busbar 4n.

Each bus bar 4 has one end connected to the capacitor element 11 and the other end pulled out from the resin surface 31 to the outside of the sealing resin 3 and connected to the semiconductor module (see reference numeral 5 in FIGS. 5 and 6). . A portion of each busbar 4 exposed from the sealing resin 3 is referred to as a busbar exposed portion 41 . As shown in FIG. 3, each busbar exposed portion 41 protrudes from the resin surface 31 in the X direction. As shown in FIG. 1 , the busbar exposed portion 41 of each busbar 4 has a plate-like portion 411 , a power supply terminal 412 and a component connection terminal 413 .

As shown in FIGS. 1 and 2, each plate-like portion 411 has a thickness in the Z direction and is formed in a substantially rectangular plate shape elongated in the Y direction. The pair of plate-like portions 411 are opposed to each other in the Z direction. A sheet-like insulating member 12 is interposed between the pair of plate-like portions 411 for insulating them. When viewed from the Z direction, the insulating member 12 has a shape that is slightly larger than the plate-like portion 411 of the Z1-side bus bar 4 (positive bus bar 4p). In addition, illustration of the insulating member is omitted in FIG.

As shown in FIGS. 1 and 3, the projecting portion 23 faces the plate-like portion 411 in the Z direction. A power terminal 412 extends from one end of each plate-like portion 411 in the Y direction to the X1 side, and a component connection terminal 413 extends from the end opposite to the power terminal 412 in the Y direction to the X1 side. there is

A power terminal 412 is a terminal for connecting the capacitor 1 to a power supply. The positive bus bar 4p has one power terminal 412 connected to the positive pole of the power supply, and the negative bus bar 4n has one power terminal 412 connected to the negative pole of the power supply.

The component connection terminals 413 are terminals for connecting the capacitor 1 to the semiconductor module 5 . As shown in FIGS. 1 and 2 , the component connection terminal 413 of the positive bus bar 4 p includes a plurality of positive electrode connection portions 413 p connected to the plurality of positive terminals 51 of the plurality of semiconductor modules 5 . Further, the component connection terminal 413 of the negative bus bar 4n includes a plurality of negative connection portions 413n that are connected to the plurality of negative terminals 52 of the plurality of semiconductor modules 5 . The plurality of positive electrode connection portions 413p are formed in a line in the Y direction at regular intervals. The plurality of negative electrode connection portions 413n are arranged on the X1 side of the positive electrode connection portion 413p, and are formed in a row in the Y direction at regular intervals.

Next, a power conversion device 10 including the capacitor 1 of this embodiment will be described with reference to FIGS. 5 and 6. FIG.

A power conversion device 10 includes a capacitor 1, a semiconductor module 5, and a device case 6 that accommodates them. As shown in FIG. 6, semiconductor module 5 incorporates semiconductor element 501 connected to capacitor 1 . As shown in FIGS. 5 and 6, the semiconductor module 5 is arranged on the side of the capacitor case 2 where the protruding portion 23 of the capacitor case 2 protrudes. That is, the semiconductor module 5 is arranged on the X1 side of the capacitor case 2 . As shown in FIG. 6, the semiconductor module 5 faces the resin surface 31 in the X direction.

As shown in FIG. 5 , the power conversion device 10 includes multiple semiconductor modules 5 . As shown in FIGS. 5 and 6, the plurality of semiconductor modules 5 are formed on the X1 side of the resin surface 31 of the capacitor 1 . The plurality of semiconductor modules 5 are arranged at positions overlapping the resin surface 31 of the capacitor 1 in the X direction. As shown in FIG. 5, the plurality of semiconductor modules 5 are stacked in the Y direction in such a posture that their thickness direction is the Y direction. The plurality of semiconductor modules 5 are arranged in a line in the Y direction at regular intervals while being spaced apart from each other in the Y direction. The surfaces on the X2 side of the plurality of semiconductor modules 5 face the resin surface 31 in the X direction.

As shown in FIG. 6, the semiconductor module 5 includes a module body 50 formed by resin-molding a semiconductor element 501, and a positive terminal 51, a negative terminal 52, and an output terminal 53 projecting from the module body 50 in the Z direction. The semiconductor element 501 is, for example, an IGBT (that is, an Insulated Gate Bipolar Transistor) that constitutes a power conversion circuit. The semiconductor module 5 is a so-called 2-in-1 type semiconductor module 5 containing two IGBTs. One IGBT of the semiconductor module 5 is electrically connected to the positive electrode side of the power supply, and the other IGBT is electrically connected to the negative electrode side of the power supply.

A positive terminal 51 is a terminal connected to the positive side of the power supply, and a negative terminal 52 is a terminal connected to the negative side of the power supply. The output terminal 53 is a terminal for connecting the semiconductor module 5 to a three-phase AC rotary electric machine. As shown in FIG. 5, the positive terminals 51 of the plurality of semiconductor modules 5, the negative terminals 52 of the plurality of semiconductor modules 5, and the output terminals 53 of the plurality of semiconductor modules 5 are arranged straight in the Y direction. . Each positive electrode terminal 51 is connected to the positive electrode connection portion 413p of the component connection terminal 413 of the positive bus bar 4p of the capacitor 1 in the Y direction. Further, each negative terminal 52 is connected to the negative electrode connection portion 413n of the component connection terminal 413 of the negative bus bar 4n of the capacitor 1 in the Y direction.

As shown in FIG. 6 , the device case 6 has a case body 61 having an opening 610 and a cover 62 covering the opening 610 of the case body 61 . The case main body 61 includes a main body bottom wall 611 that covers the components of the power converter 10 such as the capacitor 1 and the semiconductor module 5 from the Z2 side, and extends from the periphery of the main body bottom wall 611 to the Z1 side. 5 from the outer peripheral side. The Z1-side end of the main body peripheral wall 612 forms an open portion 610 that opens the space in the case main body 61 to the Z1 side.

As shown in FIG. 6, the cover 62 closes the opening 610 from the Z1 side. The cover 62 has a cover top wall 621 and a cover peripheral wall 622 . The cover ceiling wall 621 is formed in a rectangular plate shape having a thickness in the Z direction. The cover ceiling wall 621 covers the capacitor 1 and the semiconductor module 5 from the Z1 side. That is, the cover top wall 621 faces the capacitor 1 and the semiconductor module 5 in the Z direction. The cover peripheral wall 622 extends from the peripheral edge of the cover top wall 621 toward the Z2 side and has a cover peripheral wall 622 connected to the end of the main body peripheral wall 612 on the Z1 side.

As shown in FIG. 6, the projecting portion 23 of the capacitor case 2 is formed on the wall portion of the side wall 22 facing the cover 62 . The projecting portion 23 of the capacitor case 2 is formed on a wall portion of the side wall 22 on the side closer to the cover top wall 621 (specific side wall 221a described above). The projecting portion 23 faces the cover top wall 621 in the Z direction.

Next, the effects of this embodiment will be described.
In the capacitor 1 of this embodiment , the side wall 22 is formed with a protruding portion 23 that protrudes from the opening 220 toward the opening of the capacitor case 2 . Therefore, an operator's finger or the like can be hooked on the projecting portion 23 to easily grip the capacitor 1 . Therefore, when the capacitor 1 is installed in a device in which the capacitor 1 is arranged, or when the capacitor 1 is moved, a worker or the like can easily hold the capacitor 1, and workability can be easily improved. In this embodiment , an operator or the like can easily grip the capacitor 1 from the Z1 side of the capacitor 1 so as to sandwich the projection 23 and the bottom wall 21, for example.

In the power conversion device 10 of the present embodiment , the semiconductor module 5 is arranged on the side of the capacitor case 2 where the projecting portion 23 of the capacitor case 2 projects (that is, the X1 side). Therefore, it is possible to suppress the power converter 10 from increasing in size. That is, since the semiconductor module 5 is arranged on the X1 side of the capacitor case 2, the semiconductor module 5 and the bus bar 4 connected to the semiconductor module 5 are arranged. Therefore, it is difficult to arrange other components on the X1 side of the capacitor case 2, and a dead space is likely to occur. Therefore, by projecting the projecting portion 23 to the side where the projecting portion 23 tends to become a dead space, it is possible to prevent the entire power converter 10 from increasing in size due to the provision of the projecting portion 23 in the capacitor 1 .

Moreover, the projecting portion 23 is formed on a wall portion of the side wall 22 of the capacitor case 2 that faces the cover 62 . Therefore, even if the cover 62 is deformed by an external impact or the like, it is easy to prevent the projecting portion 23 of the capacitor case 2 from contacting the cover 62 and the deformed cover 62 from contacting the bus bar 4 .

As described above, according to this embodiment , it is possible to provide the capacitor 1 that is easy to hold.

( Reference form 2)
As shown in FIGS. 7 to 11, the present embodiment is a form in which the shape of the periphery of the projecting portion 23 of the capacitor case 2 is changed with respect to the first embodiment . In this embodiment , the portion of the side wall 22 adjacent to the protrusion 23 and the thick portion 20 comprising the protrusion 23 are thicker than the surroundings.

As shown in FIGS. 7 and 9 to 11, the end of the specific side wall 221a on the projecting portion 23 side is provided with a first portion 24 and a second portion 25 that constitute the thick portion 20. As shown in FIGS. The thickness of the first portion 24 increases toward the X1 side. As shown in FIGS. 9 to 11, the surface of the first portion 24 on the side opposite to the sealing resin 3 side, ie, on the Z1 side, is inclined toward the Z1 side toward the X1 side. On the other hand, the surfaces of the first portion 24 and the second portion 25 on the sealing resin 3 side, that is, on the Z2 side, are formed so as to be flush with the surroundings and perpendicular to the Z direction. The second portion 25 is formed straight from the X1 side of the first portion 24 in the X direction.

The projecting portion 23 is formed straight from the X1 side end of the second portion 25 toward the X1 side. The second portion 25 and the projecting portion 23 are formed continuously in the X direction. As shown in FIG. 10, each of the thickness T1 of the projecting portion 23, the thickness T2 of the second portion 25 adjacent to the projecting portion 23, and the thickness T3 of the first portion 24 is the thickness of the surrounding portions of the specific side wall 221a. Larger than T4.

As shown in FIG. 8, also in this embodiment , the opening 220 has a rectangular shape elongated in the Y direction when viewed from the X direction. The projecting portion 23 is formed on a wall portion (that is, a long side wall 221) that forms the long side of the opening 220 in the side wall 22. As shown in FIG. Furthermore, also in this embodiment , the projecting portion 23 is elongated in the longitudinal direction of the opening 220, that is, in the Y direction. Both end faces in the Y direction of the protruding portion 23, the second portion 25, and the first portion 24 are inclined toward the Z2 side toward the outer side in the Y direction.

Others are the same as those of the first embodiment .
It should be noted that, among the reference numerals used in Reference Embodiment 2 and subsequent embodiments, the same reference numerals as those used in the previously described embodiments represent the same components as those in the previously described embodiments , unless otherwise specified.

In this embodiment , the thick portion 20 is thicker than the periphery of the thick portion 20 in the side wall 22 . Therefore, the rigidity around the projecting portion 23 can be increased, and the projecting portion 23 can be prevented from breaking when an operator or the like grips the capacitor case 2 . Moreover, it is easy to prevent the capacitor case 2 from warping or the like due to curing shrinkage after the capacitor case 2 is molded.

The opening 220 has a rectangular shape elongated in the Y direction when viewed from the X direction. Therefore, the wall portion (long side wall 221 ) forming the long side of the opening 220 in the side wall 22 is likely to be warped as described above. Therefore, the projecting portion 23 is formed on the long side wall 221 forming the long side of the opening 220 . Thereby, warping of the long side wall 221, which is likely to warp, can be prevented.

Furthermore, the projecting portion 23 is elongated in the longitudinal direction of the opening 220 . Therefore, rigidity can be secured in a wide range of the long side wall 221 in the Y direction. Therefore, it is easier to prevent the long side wall 221 from warping after the capacitor case 2 is molded.
In addition, it has the same effects as those of the reference form 1.

(Embodiment 1 )
As shown in FIGS. 12 and 13, this embodiment is an embodiment in which ribs 26 are provided on the capacitor case 2 while the basic structure is the same as that of the first embodiment.

Rib 26 is formed across side wall 22 and projecting portion 23 . The rib 26 protrudes from the Z1 side surface of the specific side wall 221a toward the Z1 side and is a ridge elongated in the X direction. As shown in FIG. 13, the rib 26 extends from the X2 side end of the projecting portion 23 toward the X2 side. The Z1 side surface of the rib 26 is formed flush with the Z1 side surface of the projecting portion 23 . The X2-side end of the Z1-side surface of the rib 26 is formed smoothly toward the Z2 side toward the X2 side. As shown in FIG. 12, a plurality of ribs 26 are formed at regular intervals in the Y direction. The ribs 26 arranged at both ends in the Y direction are connected to both ends of the projecting portion 23 in the Y direction.

Others are the same as those of the second embodiment .

In this embodiment, the rigidity around the projecting portion 23 can be increased, and the projecting portion 23 can be further prevented from breaking when the operator or the like grips the capacitor case 2 .
In addition, it has the same effects as those of the reference form 2.

( Reference form 3 )
As shown in FIG. 14, this embodiment has the same basic structure as the reference embodiment 1, but has a modified configuration around the projecting portion 23. As shown in FIG. In this embodiment , the projecting portion 23 is offset to the Z1 side with respect to the opening portion 220 . The capacitor case 2 has an extending portion 27 extending from the opening 220 toward the Z1 side, and the projecting portion 23 projects from the end of the extending portion 27 on the Z1 side toward the X1 side in the X direction. As a result, the projecting portion 23 is formed at a position away from the resin surface 31 toward the Z1 side. The offset amount of the projecting portion 23 with respect to the resin surface 31 in the Z direction is indicated by symbol A in FIG.
Others are the same as those of the first embodiment .

In this embodiment , the projecting portion 23 is arranged at a position offset from the opening 220 toward the Z1 side. Therefore, the projecting portion 23 is formed at a position away from the resin surface 31 toward the Z1 side. Therefore, for example, when an operator tries to hook the operator's fingers on the projecting portion 23 to grip the capacitor 1 , the operator's fingers can be prevented from contacting the resin surface 31 . As a result, it is possible to prevent dirt from the operator's hands, foreign substances, and the like from adhering to the resin surface 31 .
In addition, it has the same effects as those of the reference form 1.

The present invention is not limited to the above embodiments , and can be applied to various forms without departing from the scope of the invention. For example, in the power conversion device shown in Reference Embodiment 1, it is possible to change the configuration around the projecting portion of the capacitor to the configuration described in any of the other embodiments .

Moreover, in each of the above embodiments , the protrusion may be formed on both of the pair of long side walls of the side wall. It is also possible to form the protrusions only on the short sidewalls, or on both the short sidewalls and the long sidewalls.

Further, in the power conversion device shown in Reference Embodiment 1, for example, a cooler as shown in FIG. 1 of JP-A-2014-64407 may be provided. That is, it is possible to employ a configuration in which a cooler is provided in which cooling pipes elongated in the X direction are stacked in the Y direction, and semiconductor modules are arranged in gaps between the cooling pipes adjacent in the Y direction.

Reference Signs List 1 capacitor 11 capacitor element 2 capacitor case 21 bottom wall 22 side wall 220 opening 23 protrusion 3 sealing resin 31 resin surface

Claims (7)

a capacitor element (11);
a capacitor case (2) housing the capacitor element therein;
a sealing resin (3) that fills the inside of the capacitor case and seals the capacitor element,
The capacitor case has a bottom wall (21) and a side wall (22) erected from the bottom wall, and has a resin surface (31) of the sealing resin on one surface opposite to the bottom wall. having an exposing opening (220);
A projecting portion (23) projecting from the opening toward the side (X1) where the capacitor case opens is formed on the side wall,
said protrusion is provided adjacent to a thickened portion (20) of said sidewall,
The capacitor (1), wherein the capacitor case has a rib (26) formed on the outer surface of the side wall on the side opposite to the sealing resin, the rib (26) extending from the surrounding portion of the thick portion to the thick portion. 2. Capacitor according to claim 1, wherein the portion of the side wall adjacent to the protrusion and the thickened portion (20) comprising the protrusion is thicker than the circumference of the thickened portion of the side wall. The opening has a rectangular shape elongated in one direction (Y) when viewed from the opening direction (X) of the capacitor case, and the projecting portion is a long side of the opening in the side wall. 3. The capacitor of claim 2 formed in a wall forming a . 4. The capacitor according to claim 3, wherein said projecting portion is elongated in the longitudinal direction (Y) of said opening. In a direction orthogonal to the opening direction (X) of the capacitor case, when the side of the opening on which the protrusion is formed is defined as the upper side (Z1), the protrusion is located on the upper side with respect to the opening. A capacitor according to any one of claims 1 to 4, which is offset to . A power conversion device (10) comprising the capacitor according to any one of claims 1 to 5 and a semiconductor module (5) incorporating a semiconductor element (501) connected to the capacitor,
The capacitor has a bus bar (4) with one end connected to the capacitor element and the other end pulled out from the resin surface to the outside of the sealing resin and connected to the semiconductor module,
The power conversion device, wherein the semiconductor module is arranged on a side of the capacitor case from which the projecting portion projects with respect to the capacitor case. A power conversion device (10) comprising the capacitor according to any one of claims 1 to 5 and a device case (6) housing the capacitor,
one end of the capacitor is connected to the capacitor element and the other end is drawn out from the resin surface to the outside of the sealing resin,
The device case has a case body (61) having an opening (610) and a cover (62) covering the opening of the case body,
The power conversion device, wherein the projecting portion is formed on a wall portion of the side wall facing the cover.

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