JP7239239B2 - Multilayer ceramic capacitor and manufacturing method thereof - Google Patents

Description

The present invention relates to a multilayer ceramic capacitor and its manufacturing method.

Multi-Layered Ceramic Capacitors (MLCCs) are small in size, have high capacitance, and are easy to implement. Therefore, they are important for use in industries such as communications, computers, home appliances, and automobiles. It is a chip component, especially a core passive element used in various electric/electronic devices such as mobile phones, computers, digital TVs, and information communication devices.

Recently, along with the miniaturization and high performance of electronic devices, multilayer ceramic capacitors also tend to be miniaturized and have high capacity.

In order to ensure high reliability of the multi-layer ceramic capacitor, in order to absorb tensile stress generated in a mechanical or thermal environment and prevent cracks due to stress, Techniques for applying a conductive resin layer to external electrodes have been disclosed.

Such a conductive resin layer is formed using a paste containing Cu, glass frit, and thermoplastic resin, and electrically connects between the sintered electrode layer and the plating layer in the external electrode of the multilayer ceramic capacitor. It plays a role of physical and mechanical bonding, and protects the multilayer ceramic capacitor from mechanical and thermal stress due to process temperature generated during mounting on the circuit board and bending impact of the board.

However, when using a paste containing Cu, glass frit, and thermoplastic resin, the physical properties of the reliability items may change due to bending impact, thermal shock, moisture absorption such as moisture or chlorine water, depending on the basic physical properties of the material. There is

That is, when using a paste containing Cu, glass frit, and a thermoplastic resin, there is a possibility that residual stress exists inside the chip, and the bending impact is transmitted as it is to the ceramic body. There is a problem that the chemical resistance may be lowered by the

Korean Patent Publication No. 2015-0086343

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer ceramic capacitor having excellent moisture resistance reliability, low internal equivalent series resistance (ESR), and excellent resistance to mechanical stress, and a method for manufacturing the same. .

One aspect of the present invention includes a dielectric layer, a body including first and second internal electrodes, and an external electrode disposed on the body, wherein the external electrode is the first or second internal electrode. an intermediate layer disposed on the electrode layer and containing a first intermetallic compound; and an intermediate layer disposed on the intermediate layer and containing a plurality of metal particles, a second intermetallic compound, and a base resin. and a conductive resin layer.

According to another aspect of the present invention, a laminate is provided by laminating a plurality of green sheets on which internal electrodes are printed, and after firing the laminate to provide a main body, one end of the internal electrode is connected to an electrical outlet. forming an electrode layer to cover one surface of the main body, applying a low melting point paste on the electrode layer, drying the electrode layer, and then performing a hardening heat treatment to form an intermediate layer and a conductive resin layer; and a method of manufacturing a multilayer ceramic capacitor.

According to an embodiment of the present invention, an electrode layer, an intermediate layer, and a conductive resin layer are sequentially stacked to replace a sandblasting method and improve moisture resistance reliability. In addition, it has a low ESR and can improve resistance to mechanical stress such as bending strength and chemical resistance.

1 is a schematic perspective view of a multilayer ceramic capacitor according to an embodiment of the present invention; FIG. 2 is a cross-sectional view taken along line II' of FIG. 1; FIG. FIG. 3 is a cross-sectional view showing an enlarged area B of FIG. 2 ; 4 is a microscopic photograph of a cross-section around region B of a multilayer ceramic capacitor according to an embodiment of the present invention; FIG. 4 is a cross-sectional view showing a B region after firing the laminate; FIG. 6 is a cross-sectional view of removing a projecting portion of the laminate by sandblasting after firing in FIG. 5 ; FIG. 6 is a cross-sectional view after forming an electrode layer on the laminate by electroless plating after firing in FIG. 5 ; FIG. 3 is a schematic cross-sectional view of a multilayer ceramic capacitor according to another embodiment of the present invention; 5 is a graph showing measured capacitance and Df values for invention examples and comparative examples.

Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. However, embodiments of the invention may be embodied in various other forms, and the scope of the invention is not limited to the embodiments set forth below. Moreover, embodiments of the present invention are provided so that the present invention may be more fully understood by those of average skill in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements indicated by the same reference numerals on the drawings are the same. is an element of

In order to clearly explain the present invention, parts not related to the explanation are omitted in the drawings, and the thickness is enlarged to clearly express various layers and regions. The same reference numerals are used to describe the same components. Furthermore, throughout the specification, the term "comprising" an element means that the other element can be further included rather than omitting the other element, unless specifically stated to the contrary. means

FIG. 1 is a perspective view schematically showing a multilayer ceramic capacitor according to one embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II' of FIG.

1 and 2, a multilayer ceramic capacitor 100 according to an embodiment of the present invention includes a body 110 and first and second external electrodes 130 and 140. As shown in FIG.

The body 110 may include an active region as a portion that contributes to formation of capacitance of the capacitor, and upper and lower covers 112 and 113 as upper and lower margin portions formed on upper and lower portions of the active region, respectively.

In one embodiment of the present invention, the shape of the main body 110 is not particularly limited, but may be substantially hexahedral.

That is, the main body 110 does not have a perfect hexahedral shape, but has a substantially hexahedral shape due to the difference in thickness due to the arrangement of the internal electrodes and the polishing of the corners.

Defining the directions of a hexahedron to clearly describe the embodiments of the present invention, in the drawings, the X direction indicates the first direction or length direction, the Y direction indicates the second direction or width direction, and the Z direction can indicate the third direction, the thickness direction or the stacking direction.

Also, in the main body 110, both surfaces facing each other in the Z direction are defined as first and second surfaces 1 and 2, and both surfaces connected to the first and second surfaces 1 and 2 and facing each other in the X direction are defined as third surfaces. and fourth surfaces 3 and 4, which are connected to the first and second surfaces 1 and 2, are connected to the third and fourth surfaces 3 and 4, and are opposed to each other in the Y direction as the fifth and fourth surfaces. 6 planes 5 and 6 are defined. At this time, the first surface 1 can be a mounting surface.

The active region may have a structure in which a plurality of dielectric layers 111 and a plurality of first and second internal electrodes 121 and 122 are alternately stacked with the dielectric layers 111 interposed therebetween.

The dielectric layer 111 may include ceramic powder having a high dielectric constant, such as barium titanate (BaTiO ₃ )-based or strontium titanate (SrTiO ₃ )-based powder, but the present invention is not limited thereto. not something.

At this time, the thickness of the dielectric layer 111 can be arbitrarily changed according to the capacity design of the multilayer ceramic capacitor 100. Considering the size and capacity of the main body 110, the thickness of one layer after firing is 0. 0.1 to 10 μm, but the invention is not limited thereto.

The first and second internal electrodes 121 and 122 may be arranged to face each other with the dielectric layer 111 interposed therebetween.

The first and second internal electrodes 121 and 122 are a pair of electrodes having polarities different from each other. It can be formed so as to be alternately exposed on the third and fourth surfaces 3 and 4 of the main body 110 along the stacking direction of the dielectric layers 111 with the layer 111 interposed therebetween. They can be electrically isolated from each other by body layers 111 .

At this time, the internal electrodes 121 and 122 are separated from the third and fourth surfaces 3 and 4 of the main body by a certain distance due to the difference in contraction rate between the dielectric layers and the internal electrodes in the firing process after lamination. Although formed internally, they can be arranged so as to be alternately exposed.

The first and second internal electrodes 121 and 122 are connected to the first and second internal electrodes 121 and 122 via electrode layers 131 and 141 formed on the spaced apart portions and the third and fourth surfaces 3 and 4 of the main body. It can be electrically connected to the two external electrodes 130 and 140, respectively.

Therefore, when a voltage is applied to the first and second external electrodes 130 and 140, charges are accumulated between the first and second internal electrodes 121 and 122 facing each other. The capacitance of 100 is proportional to the area of the overlapping regions of the first and second internal electrodes 121 and 122 .

The thickness of the first and second internal electrodes 121 and 122 may be determined according to the application, and may be, for example, 0.2-1.0 μm in consideration of the size and capacity of the ceramic body 110 . but the invention is not so limited.

Also, the conductive metal contained in the first and second internal electrodes 121 and 122 can be nickel (Ni), copper (Cu), palladium (Pd), or alloys thereof, and the present invention is not limited to

The upper and lower covers 112 and 113 may have the same material and structure as the dielectric layer 111 of the active region except that they do not include internal electrodes.

That is, the upper and lower covers 112 and 113 can be regarded as being formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active region in the Z direction. Basically, it can play a role in preventing the first and second internal electrodes 121 and 122 from being damaged by physical or chemical stress.

The first and second external electrodes 130, 140 are composed of electrode layers 131, 141, intermediate layers 132, 142, conductive resin layers 133, 143, first plating layers 134, 144, second plating layers 135, 145 and , respectively.

The first plating layers 134, 144 may be nickel plating layers, and the second plating layers 135, 145 may be tin plating layers.

The electrode layers 131 and 141 serve to mechanically connect the main body and the external electrodes, and further serve to electrically and mechanically connect the internal electrodes and the external electrodes.

As shown in FIG. 5, the internal electrodes 121 and 122 are separated from the third and fourth surfaces 3 and 4 of the main body by a certain distance due to the difference in contraction rate between the dielectric layers and the internal electrodes during the firing process after lamination. can be formed inside the body and arranged to be alternately exposed. If the internal electrodes 121 and 122 are spaced apart from the third and fourth surfaces 3 and 4 of the main body by a predetermined interval and are alternately exposed, the electrical connection between the internal electrodes and the external electrodes is degraded. There is

Conventionally, as shown in FIG. 6, such a problem has been solved by additionally performing a process of removing the protruding portion of the dielectric layer using a sandblasting method or the like.

However, in the present invention, as shown in FIG. 7, the electrode layers 131, 141 are formed on the spaced-apart portions and the third and fourth surfaces 3, 4 of the main body, so that the sandblasting method is not necessary. The step of removing the protruding portion of the dielectric layer using .

A method for forming the electrode layers 131 and 141 is not particularly limited as long as the electrode layers can be formed on the portions spaced apart by a predetermined interval and the third and fourth surfaces 3 and 4 of the main body. For example, the electrode layers 131 and 141 may be electroless plating layers or sputtering layers formed using an electroless plating method or a sputtering method capable of forming dense, highly corrosion-resistant electrode layers with a uniform thickness. can.

When the electroless plating method is used, the electrode layers 131 and 141 can be formed on the dielectric layer portion of the main body, and furthermore, the electrode layers 131 and 141 can be easily formed on the portions separated by the predetermined interval. , electrode layers 131 and 141 may be formed to cover one surface of the body.

More specifically, for example, when an electroless plating method is used, an electroless plating method using sodium borohydride and Ni or an electroless plating method using sodium hypophosphate and Ni can be used. However, if the P component is contained in a large amount, the formation of the first intermetallic compound forming the intermediate layers 132 and 142 may be delayed or interfered with. It is more preferable to use the method.

The electrode layers 131 and 141 contain Ni and B when electroless plating with sodium borohydride and Ni is used.

On the other hand, the thickness of the electrode layer is not particularly limited, but may be 0.5 to 5 μm.

At this time, the electrode layers 131 and 141 may be formed to extend from the third and fourth surfaces 3 and 4 of the body 110 to parts of the first and second surfaces 1 and 2 of the body 110, respectively. .

Also, the electrode layers 131 and 141 may be formed to extend from the third and fourth surfaces 3 and 4 of the main body 110 to portions of the fifth and sixth surfaces 5 and 6 of the main body, respectively.

As another embodiment, as shown in FIG. 8, the first and second external electrodes 130 and 140 of the multilayer ceramic capacitor 100' are formed by the electrode layers 131' and 141' of the main body 110. It can be formed only on the third and fourth surfaces 3 and 4, respectively, without extending on the surfaces 1 and 2. FIG.

At this time, the bending strength and ESR of the multilayer ceramic capacitor 100' can be further improved.

The intermediate layers 132 and 142 include a first intermetallic compound and serve to improve moisture resistance reliability and electrical connectivity. Also, the intermediate layers 132 and 142 may be arranged to cover the electrode layers 131 and 141 . The intermediate layers 132, 142 may consist of a first intermetallic compound.

Conventionally, external electrodes are formed by applying and firing a conductive paste on the third and fourth surfaces 3 and 4 after the protruding portions of the dielectric layer are removed. The metal particles contained in the metal particles and the metal particles contained in the conductive paste interdiffuse to form an intermetallic compound at the contact point between the conductive paste and the internal electrode, thereby ensuring electrical connectivity. As shown in FIG. 5, if the dielectric layer has a protruding shape due to the difference in contraction rate between the dielectric layer and the internal electrode during the firing process after lamination, the conductive paste and the internal electrode are difficult to come into contact with each other. Since it becomes difficult to form an intercalation compound, a step of removing the protruding portion of the dielectric layer using a sandblasting method or the like has been conventionally required.

However, in the present invention, since the electrode layers 131 and 141 are formed and the external electrodes 130 and 140 are formed by applying and firing a low-melting paste on the electrode layers 131 and 141, the dielectric material is formed by sandblasting or the like. A step of removing the protruding portion of the layer is not required. In addition, the metal particles contained in the electrode layers 131 and 141 and the low-melting-point metal particles contained in the paste are interdiffused to form a first intermetallic compound, and the electrode layers 131 and 141 and the conductive resin layer 133 are formed. , 143, the first intermetallic compound is formed in a layer shape, thereby improving moisture resistance reliability and electrical connectivity.

At this time, the first intermetallic compound may be Ni ₃ Sn ₄ . That is, Ni ₃ Sn ₄ may be formed by combining Ni, which is the metal particles contained in the electrode layers 131 and 141, and Sn, which is the low melting point metal particles contained in the paste.

FIG. 3 is a cross-sectional view showing an enlarged area B of FIG.

Although the B area shows a part of the first external electrode 130 in an enlarged manner, the first external electrode 130 is electrically connected to the first internal electrode 121, and the second external electrode 130 is connected to the second internal electrode. The configurations of the first external electrode 130 and the second external electrode 140 are similar, with the only difference being that they are connected to 122 . Although the following description will be based on the first external electrode 130, it is assumed that this includes the description of the second external electrode 140 as well.

The conductive resin layer 133 is arranged on the intermediate layer 132 and includes a plurality of metal particles 133a, a second intermetallic compound 133b, and a base resin 133c. The conductive resin layer serves to electrically and mechanically connect the intermediate layer and the first plating layer, and absorbs the tensile stress generated in the mechanical or thermal environment when mounting the multilayer ceramic capacitor on the substrate. By doing so, it is possible to prevent the occurrence of cracks and play a role of protecting the multilayer ceramic capacitor from the bending impact of the substrate. The second intermetallic compound 133b may be arranged to surround at least a portion of the plurality of metal particles 133a.

The metal particles 133a may contain one or more of Ag and Cu, more preferably Ag.

The second intermetallic compound 133b surrounds and connects the plurality of metal particles 133a in a molten state, thereby minimizing the internal stress of the body 110 and improving the high temperature load and humidity load resistance characteristics. be able to

At this time, the second intermetallic compound 133b may include a metal having a melting point lower than the curing temperature of the base resin 133c.

That is, since the second intermetallic compound 133b contains a metal having a melting point lower than the curing temperature of the base resin 133c, the metal having a melting point lower than the curing temperature of the base resin 133c melts during the drying and curing processes. , forms a second intermetallic compound 133b with a portion of the metal particles, thereby surrounding the metal particles 133a. At this time, the second intermetallic compound 133b may preferably include a low melting point metal of 300° C. or less.

For example, Sn with a melting point of 213-220° C. can be included. During the drying and curing processes, Sn melts, and the melted Sn soaks metal particles with a high melting point such as Ag or Cu by capillary action, reacts with some of the Ag or Cu metal particles, A second intermetallic compound 133b such _{as Ag3Sn} , _Cu6Sn5 , or _Cu3Sn is formed. Ag or Cu not participating in the reaction remains in the form of metal particles 133a as shown in FIG.

The base resin 133c may include a thermosetting resin having electrical insulation.

At this time, the thermosetting resin may be, for example, an epoxy resin, but the present invention is not limited thereto.

The base resin 133c serves to mechanically bond the intermediate layer 132 and the first plating layer 134 together.

When a conductive resin layer is formed using a conventional paste containing Cu, glass frit, and a thermoplastic resin, the glass frit component forms an alloy between the Cu particles and the Ni internal electrode, and acts as a binder for sealing. play a role in That is, when the melting temperature of the glass frit component, the sintering temperature of Cu, and the alloy formation temperature of Cu and Ni are substantially the same, the copper particles are sintered and densified, and the alloy formation of Cu and Ni causes Connection with the internal electrode progresses to metallic bonding, and the glass frit component fills the empty space. However, since the forming temperature is 700 to 900° C. and residual stress remains, there is a possibility that radial cracks or the like may occur. There is also a problem that the chemical resistance to the plating solution may deteriorate depending on the glass frit component.

In contrast, in the present invention, a low-melting paste containing a metal having a melting point lower than the curing temperature of the base resin 133c is used, and the conductive resin layer is formed by epoxy curing. Since the volume is reduced by the formation of the second intermetallic compound, the generation of residual stress can be more effectively suppressed than the Cu—Ni alloy, which expands in volume.

Further, in the process of forming the conductive resin layer, an intermediate layer is formed between the electrode layer and the conductive resin layer by forming a layer of the first intermetallic compound, thereby improving moisture resistance reliability and electrical connectivity. will improve.

FIG. 9 shows electrode layers 131 and 141 and an intermediate layer 132 according to a comparative example in which a conductive resin layer is formed using a conventional paste containing Cu, glass frit, and a thermoplastic resin, and an embodiment of the present invention. , 142 and conductive resin layers 133, 143. FIG. As a result, it can be seen that the invention example has a lower Df value and a lower energy loss than the comparative example.

Hereinafter, a method for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention will be described in detail, but the present invention is not limited to this, and the above-described method of manufacturing a multilayer ceramic capacitor according to the present embodiment will be explained in detail. A description that overlaps with the multilayer ceramic capacitor of 1 is omitted.

As a method for manufacturing a multilayer ceramic capacitor according to the present embodiment, first, a slurry containing powder such as barium titanate (BaTiO ₃ ) is coated on a carrier film and dried to obtain a plurality of A ceramic green sheet is provided.

The ceramic green sheet is produced by mixing ceramic powder, a binder and a solvent to prepare a slurry, and forming the slurry into a sheet having a thickness of several μm by a doctor blade method or the like.

Next, internal electrodes are formed on the green sheets by applying a conductive paste for internal electrodes containing a conductive metal such as nickel powder by a screen printing method or the like.

After that, a laminate is provided by laminating a plurality of green sheets on which internal electrodes are printed. At this time, a cover can be formed by laminating a plurality of green sheets in which internal electrodes are not printed on the upper and lower surfaces of the laminate.

Next, after firing the laminate to provide a body, electrode layers are formed on the third and fourth surfaces of the body so as to be electrically connected to the first and second internal electrodes, respectively. do.

The body includes dielectric layers, internal electrodes, and a cover. Here, the dielectric layer is formed by firing a green sheet having internal electrodes printed thereon, and the cover is formed by firing a green sheet having no internal electrodes printed thereon.

The internal electrodes may be formed as first and second internal electrodes having different polarities.

As described above, according to the present invention, the step of removing the protruding dielectric layers due to the difference in contraction rate between the dielectric layers and the internal electrodes by sandblasting or the like is not required. An electrode layer can be formed.

As for the method of forming the electrode layers, the space apart from the third and fourth surfaces of the main body formed by the difference in contraction rate between the dielectric layer and the internal electrodes, and the electrode layers on the third and fourth surfaces of the main body. It is not particularly limited as long as it can be formed. For example, the electrode layer can be formed using an electroless plating method or a sputtering method, which can form a dense, highly corrosion-resistant electrode layer with a uniform thickness.

More specifically, for example, when an electroless plating method is used, an electroless plating method using sodium borohydride and Ni or an electroless plating method using sodium hypophosphate and Ni can be used. However, if the P component is contained in a large amount, the formation of the first intermetallic compound forming the intermediate layer may be delayed or interfered with, so an electroless plating method using sodium borohydride and Ni is used. is more preferable.

Next, after coating and drying a low-melting paste on the electrode layer, a hardening heat treatment is performed to form an intermediate layer and a conductive resin layer.

A low melting point paste can include metal particles, a thermosetting resin, and a low melting point metal having a lower melting point than the thermosetting resin. For example, the paste can be produced by mixing Ag powder, Sn-based solder powder, and thermosetting resin, and then dispersing the mixture using a 3-roll mill. The Sn-based _solder powder may contain one or more selected from _Sn , _{Sn96.5Ag3.0Cu0.5} , _Sn42Bi58 , and _Sn72Bi28 , and _may contain _Ag contained in the Ag powder. may have a particle size of 0.5 to 3 μm, but the present invention is not limited thereto.

Further, the intermediate layer and the conductive resin layer can be formed by applying the low-melting paste to the outside of the electrode layer, drying and curing the paste.

As an example, the thermosetting resin may include an epoxy resin, but the present invention is not limited thereto. Since the amount is small, it may be a resin that is liquid at room temperature.

The method may further include forming a first plating layer and a second plating layer on the conductive resin layer.

For example, a nickel plating layer, which is the first plating layer, may be formed on the conductive resin layer, and a tin plating layer, which is the second plating layer, may be formed on the nickel plating layer.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and variations can be made without departing from the technical idea of the present invention described in the claims. is possible, it will be clear to those of ordinary skill in the art.

100, 100' laminated ceramic capacitor 110 body 111 dielectric layer 121, 122 first and second internal electrodes 130, 140 first and second external electrodes 131, 131', 141, 141' electrode layers 132, 142 intermediate layer 133 , 143 conductive resin layer 134, 144 first plating layer 135, 145 second plating layer 133a metal particles 133b second intermetallic compound 133c base resin

Claims (24)

comprising a dielectric layer, a body including first and second internal electrodes, and an external electrode disposed on the body;
The external electrodes are
an electrode layer in contact with the first or second internal electrode;
an intermediate layer disposed on the electrode layer and containing a first intermetallic compound;
a conductive resin layer disposed on the intermediate layer and containing a plurality of metal particles, a second intermetallic compound, and a base resin;
the first or second internal electrode is formed inside the main body apart from one surface of the main body;
the electrode layer is formed on a portion away from one surface of the body and on one surface of the body and is connected to the internal electrode ;
A multilayer ceramic capacitor , wherein the second intermetallic compound is discontinuously in contact with the intermediate layer . 2. The multilayer ceramic capacitor of claim 1, wherein the electrode layer is arranged to cover one surface of the body. 3. The multilayer ceramic capacitor according to claim 1, wherein said electrode layer is an electroless plated layer. 3. The multilayer ceramic capacitor according to claim 1, wherein said electrode layer is a sputtering layer. 4. The multilayer ceramic capacitor according to claim 1, wherein said electrode layer contains Ni and B. 6. The multilayer ceramic capacitor according to claim 1, wherein said intermediate layer is arranged to cover said electrode layer. 7. The multilayer ceramic capacitor according to claim 1, wherein said intermediate layer is formed by layering said first intermetallic compound. 8. The multilayer ceramic capacitor according to claim 1, wherein said first intermetallic compound contains Ni and Sn. The multilayer ceramic capacitor according to any one of claims 1 to ₈ , wherein the first intermetallic compound is _Ni3Sn4 . The plurality of metal particles contain one or more of Ag and Cu,
The multilayer ceramic capacitor according to any one of claims 1 to 9, wherein the second intermetallic compound includes at least _one of _Ag3Sn , _Cu6Sn5 , and _Cu3Sn . The multilayer ceramic capacitor according to any one of claims 1 to 10, further comprising a first plated layer and a second plated layer disposed on the conductive resin layer. The body has first and second surfaces facing each other, connected to the first and second surfaces, third and fourth surfaces facing each other, connected to the first and second surfaces, and connected to third and fourth surfaces. including fifth and sixth surfaces connected to the surface and facing each other;
the internal electrodes are formed inside the body at a predetermined distance from the third and fourth surfaces of the body and arranged to be exposed alternately;
12. The multilayer ceramic according to any one of claims 1 to 11, wherein the electrode layers are formed on the spaced-apart portions and the third and fourth surfaces of the body and are connected with the internal electrodes. Capacitor. 13. The multilayer ceramic capacitor of claim 12, wherein the electrode layer is formed to extend from the third and fourth surfaces of the body to a portion of the first and second surfaces. The multilayer ceramic capacitor according to any one of claims 1 to 13, wherein said second intermetallic compound surrounds at least part of said plurality of metal particles. 15. The multilayer ceramic capacitor according to any one of claims 1 to 14, wherein said electrode layer is arranged so as to be in direct contact with said first or second internal electrode. Laminating a plurality of green sheets on which internal electrodes are printed to form a laminate;
forming an electrode layer electrically connected to one end of the internal electrode and covering one surface of the body after firing the laminate to form the body;
forming an intermediate layer and a conductive resin layer by applying and drying a low-melting-point paste containing a low-melting-point metal of 300° C. or less on the electrode layer, followed by curing heat treatment;
the internal electrode is formed inside the body apart from one surface of the body;
the electrode layer is formed on a portion away from one surface of the body and on one surface of the body and is connected to the internal electrode ;
A method of manufacturing a multilayer ceramic capacitor, wherein the conductive resin layer includes a plurality of metal particles, a second intermetallic compound, and a base resin, and the second intermetallic compound is discontinuously in contact with the intermediate layer. 17. The method of claim 16, wherein forming the electrode layer is performed by electroless plating using sodium borohydride and Ni. 17. The method of claim 16, wherein forming the electrode layer is performed by a sputtering method. 19. The method of manufacturing a multilayer ceramic capacitor according to claim 16, wherein said paste contains Ag powder, Sn-based solder powder, and epoxy resin. 20. The method of claim 16, further comprising forming first and second plating layers on the conductive resin layer. a body including a dielectric layer and an internal electrode; an electrode layer in contact with the internal electrode; and an external electrode disposed on the body;
the internal electrode is formed inside the body apart from one surface of the body;
the electrode layer is formed on a portion away from one surface of the body and on one surface of the body and is connected to the internal electrode;
The external electrodes are
an intermediate layer comprising a first intermetallic compound;
a conductive resin layer disposed on the intermediate layer and containing a plurality of metal particles, a second intermetallic compound, and a base resin;
The first intermetallic compound contains the metal contained in the second intermetallic compound, the second intermetallic compound contains the metal contained in the plurality of metal particles,
The electronic component , wherein the second intermetallic compound is discontinuously in contact with the intermediate layer . 22. The electronic component according to claim 21, wherein said second intermetallic compound surrounds at least a portion of said plurality of metal particles. 23. The electronic component according to claim 21 or 22, wherein said intermediate layer is arranged on said electrode layer. The first intermetallic compound contains Ni and Sn,
The plurality of metal particles contain one or more of Ag and Cu,
The electronic component according to any one of claims 21 to 23, wherein said second intermetallic compound contains at least one _{of Ag3Sn} , _Cu6Sn5 , and _Cu3Sn .

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