JP7240907B2 - Light-emitting device and method for manufacturing light-emitting device - Google Patents

Description

The present invention relates to a light-emitting device and a method for manufacturing a light-emitting device.

Light-emitting devices using light-emitting elements such as LED (light-emitting diode) elements are widely used for illumination and the like.

For example, there has been proposed a COB (Chip On Board) type light emitting device in which a light emitting element such as an LED (light emitting diode) element is mounted on a substrate such as a ceramic substrate or a metal substrate. According to such a light-emitting device, a light-emitting element that emits blue light is sealed with a resin containing a phosphor, and the light obtained by exciting the phosphor with the light from the light-emitting element is mixed with the blue light to achieve a desired application. You can get the light according to

A plurality of light emitting elements are arranged on a substrate so as to have, for example, a rectangular outline (see Patent Document 1, for example).

FIG. 1 is a diagram showing a conventional light emitting device.

The light emitting device 100 includes a substrate 111, a plurality of light emitting devices 120 arranged on the substrate 111, a frame 140 arranged on the substrate 111 so as to surround the plurality of light emitting elements 120, and a phosphor. A sealing layer 150 is arranged inside the frame 140 so as to seal the light emitting element 120 of the light emitting element 120 .

The plurality of light emitting elements 120 are arranged on the substrate 111 so as to have a rectangular outline 120a as a whole.

The frame 140 is also arranged to surround the plurality of light emitting elements 120 so as to have a rectangular outline like the plurality of light emitting elements 120 .

Since the light emitted by the plurality of light emitting elements 120 is emitted from the surface of the sealing layer 150, the surface of the sealing layer 150 surrounded by the frame 140 forms the light emitting region 100a.

Here, from the viewpoint of preventing unnecessary interference with light emitted from the light emitting element 120b, a predetermined distance between the light emitting element 120b located at the four vertices of the rectangular outline 120a and the frame 140 are separated by a distance R.

If it is difficult to separate the light emitting element 120b and the frame 140 by the predetermined distance R, there may be a case where the light emitting element is not placed at the vertex position of the rectangular contour 120a. .

JP 2011-228369 A

As an indicator of the performance of a light-emitting device, there is a light-emitting density obtained by dividing the number of light-emitting elements arranged in a light-emitting region by the area of the light-emitting region. If the light-emitting elements used are the same, the higher the light-emitting density, the higher the brightness of the light-emitting device.

In the light-emitting device shown in FIG. 1, the distance between the light-emitting elements 120b located at the four vertices of the rectangular outline 120a and the frame 140 is kept at a predetermined distance or more. limited by

In particular, if the light-emitting elements cannot be placed at the vertices of the rectangular outline 120a, the number of light-emitting elements placed in the light-emitting region is reduced, resulting in a decrease in light-emitting density.

Therefore, an object of this specification is to propose a light-emitting device that reduces the light-emitting region and improves the light-emitting density.

A light-emitting device disclosed in this specification includes a substrate, a plurality of light-emitting elements arranged on the substrate, a frame arranged on the substrate so as to surround the plurality of light-emitting elements, and a frame enclosing the plurality of light-emitting elements. and a sealing layer arranged inside the frame so as to stop the light emitting elements, and the shape tracing the outermost edges of the plurality of light emitting elements arranged on the substrate is a polygon having a quadrangle or more in a plan view. The inner edge of the frame forms a polygon that traces the outermost edges of a plurality of light emitting elements arranged on the substrate, and each vertex of the polygon has a It is characterized in that a protruding protrusion is arranged.

Further, in the light-emitting device, it is preferable that the projecting portion has a first portion and a second portion arranged outside the first portion and having a thickness smaller than that of the first portion.

In particular, the light emitting device comprises a second substrate arranged on the substrate, wherein the protrusion is arranged on the second substrate and the portion of the second substrate on which the first portion is arranged is recessed. is preferred.

Further, in the light-emitting device, it is preferable that the projecting portion is formed by arranging a long frame continuous body forming a frame so as to be wound from the inside to the outside.

In particular, in the light-emitting device, the continuous frame body is preferably wound without overlapping each other.

The method for manufacturing a light-emitting device disclosed in this specification is the first step of arranging a plurality of light-emitting elements on a substrate, and the shape obtained by tracing the outermost edges of the plurality of light-emitting elements arranged on the substrate is a plane. A first step of forming a polygon with four or more sides when viewed, and a second step of forming a frame on a substrate so as to surround a plurality of light emitting elements using an elongated frame continuum. , the inner edge of the frame has the same polygonal shape as the outermost edges of the plurality of light emitting elements arranged on the substrate, and each vertex of the polygon protrudes from the inside to the outside of the frame. A second step of forming a frame so as to have a protrusion, and a third step of forming a sealing layer inside the frame so as to seal a plurality of light emitting elements. do.

Further, in the method for manufacturing a light-emitting device, in the second step, from the side of the second vertex of the inner edge adjacent to the first vertex of the inner edge where the one protrusion is arranged, the protrusion extends toward the first vertex. The frame continuous body is wound from the inside to the outside at the first vertex, and then arranged so as to extend toward the third vertex of the inner edge adjacent to the first vertex to form a protrusion. preferably.

In particular, in the method for manufacturing a light-emitting device, at the first vertex, the frame continuum is wound from the inside to the outside and intersected, and then arranged so as to extend toward the third vertex, forming a protrusion. is preferably formed.

Further, the method for manufacturing a light-emitting device includes, between the first step and the second step, a fourth step of disposing a second substrate having a recess in a portion where the protrusion is formed, on the substrate; In the step, at the first vertex, the frame continuum is wound from the inside to the outside so that the frames intersect each other on the recess, and then arranged so as to extend toward the third vertex, Preferably, the protrusion is formed on the second substrate.

Further, in the method for manufacturing a light-emitting device, the frame continuous body is wound from the inside to the outside at the first vertex without overlapping the frames, and then arranged so as to extend toward the third vertex. It is preferable to form the protruding portion by

The light-emitting device disclosed herein described above reduces the light-emitting area to improve the light-emitting density.

It is a figure which shows the light-emitting device of a conventional example. (A) is a plan view of one embodiment of a light-emitting device disclosed in this specification, (B) is a cross-sectional view taken along the line AA' of (A), and (C) is B of (A). -B' line sectional drawing. (A) is a diagram for explaining the light emitting region of the light emitting device shown in FIG. 2, and (B) is a diagram for explaining the light emitting region of the conventional light emitting device shown in FIG. FIG. 10 is a diagram showing a main part of Modification 1 of one embodiment of the light emitting device disclosed in this specification; (A) is a plan view showing Modification 2 of one embodiment of the light-emitting device disclosed in this specification, (B) is a cross-sectional view taken along the line AA′ of (A), and (C) is a It is a BB' cross-sectional view of (A). FIG. 10 is a diagram showing a main part of Modification 3 of one embodiment of the light-emitting device disclosed in this specification. 1 is a diagram (part 1) for explaining steps of an embodiment of a method for manufacturing a light-emitting device disclosed in this specification; FIG. FIG. 2 is a diagram (part 2) illustrating steps of an embodiment of a method for manufacturing a light-emitting device disclosed in this specification; FIG. 3 is a diagram (part 3) explaining steps of an embodiment of a method for manufacturing a light-emitting device disclosed in this specification; FIG. 4 is a diagram (part 4) for explaining steps of an embodiment of a method for manufacturing a light-emitting device disclosed in this specification; FIG. 5 is a diagram (No. 5) explaining steps of an embodiment of a method for manufacturing a light-emitting device disclosed in the present specification;

A preferred embodiment of the light-emitting device disclosed in this specification will be described below with reference to the drawings. However, the technical scope of the present invention is not limited to those embodiments, but extends to the invention described in the claims and equivalents thereof.

FIG. 2A is a plan view of an embodiment of the light-emitting device disclosed in this specification, FIG. 2B is a cross-sectional view taken along the line AA′ of FIG. C) is a cross-sectional view taken along line BB' of FIG. 2(A). In FIG. 2A, illustration of the sealing layer is omitted. In FIG. 2B, wires that are not included in the AA' cross section are also shown in order to show the connection relationship between the light emitting elements and the wires.

The light-emitting device 1 includes a mounting substrate 11 (substrate), a circuit board 12 (second substrate), a plurality of light-emitting elements 20 , a frame 40 and a sealing layer 50 . In addition, matters specifying the invention described in the scope of claims are indicated in parentheses attached to the mounting board 11 and the circuit board 12 (the same shall apply hereinafter).

The mounting board 11 is, for example, a rectangular board made of aluminum. The mounting substrate 11 preferably has a flat surface. The circuit board 12 , the plurality of light emitting elements 20 , the frame 40 , and the sealing layer 50 are arranged and supported on the flat surface of the mounting board 11 .

As an example, the circuit board 12 has the same outline as the mounting board 11 and is arranged on the mounting board 11 . The circuit board 12 has a rectangular opening 12a in its central portion. The back surface of the circuit board 12 is attached and fixed onto the mounting board 11 by an adhesive member such as an adhesive sheet. A pair of wiring patterns 13A and 13B are arranged on the surface of the circuit board 12 so as to surround the opening 12a. A pair of connection electrodes 17A and 17B for connecting the light-emitting device 1 to an external power source (not shown) are arranged at two diagonal corners on the surface of the circuit board 12 . One connection electrode 17A is an anode and the other connection electrode 17B is a cathode. The light emitting element 20 emits light by applying a DC voltage from an external power supply to the pair of connection electrodes 17A and 17B. The circuit board 12 and the pair of wiring patterns 13A and 13B are covered and protected by a solder resist 14 that is an insulating film. The pair of connection electrodes 17A and 17B are formed by exposing the wiring patterns 13A and 13b formed on the upper surface of the mounting substrate 11 that are not covered with the solder resist 14, for example.

The light emitting element 20 is a blue semiconductor light emitting element (hereinafter also referred to as a blue LED element) formed in a rectangular shape. A plurality of light emitting elements 20 are arranged on the mounting substrate 11 in the opening 12a. The light emitting element 20 is preferably arranged so that its upper surface is parallel to the surface of the mounting substrate 11 . As the light emitting element 20, for example, an InGaN-based compound semiconductor having an emission wavelength range of 440 to 455 nm can be used.

A shape obtained by tracing the outermost edges of the plurality of light emitting elements 20 arranged on the mounting substrate 11 is a polygon having four or more sides in a plan view. In this specification, the shape along the outermost edges of the plurality of light emitting elements 20 arranged on the mounting substrate 11 is hereinafter also referred to as the outline 20a of the plurality of light emitting elements 20 . In the example shown in FIG. 2A, nine light emitting elements 20 are arranged in three rows and three columns, forming a rectangular outline 20a as a whole. Note that the plurality of light emitting elements 20 may have a polygonal contour of at least four, and is not limited to a quadrangle as shown in FIG. 2(A).

A pair of device electrodes (not shown) are arranged on the upper surface of the light emitting device 20 . Device electrodes of adjacent light emitting devices 20 are electrically connected by wires 30 . The first element electrode of the light emitting element 20 located on the outer peripheral side of the opening 12a is electrically connected to the wiring pattern 13A or 13B of the circuit board 12 by the wire 30, and the second element electrode is electrically connected by the wire 30. , are electrically connected to the element electrodes of the adjacent light emitting elements 20 . A plurality of light emitting elements 20 are connected in series between a pair of connection electrodes 17A and 17B, and are supplied with direct current via a pair of wiring patterns 13A and 13B and wires 30 .

The frame 40 is formed of an elongated frame continuum 41 and is arranged along the periphery of the opening 12 a so as to surround the plurality of light emitting elements 20 . The inner edge 43 of the frame 40 has the same rectangular shape (contour 20 a ) that traces the outermost edges of the plurality of light emitting elements 20 arranged on the mounting substrate 11 .

Since the light emitted by the plurality of light emitting elements 20 is emitted from the surface 50a of the sealing layer 50, the surface 50a of the sealing layer 50 surrounded by the frame 40 forms the light emitting region 1a.

The frame body 40 is arranged at vertexes 40a, 40b, 40c, and 40d of a rectangular inner edge 43 of the frame body 40, from the inside (light emitting region 1a side) where the plurality of light emitting elements 20 are arranged to the outside (opposite to the light emitting region 1a side). side) are provided. In this specification, the inside of the frame 40 means the side of the frame 40 on the side of the light emitting region 1a, and the outside of the frame 40 means the side of the frame 40 opposite to the side of the light emitting region 1a. .

The cross-sectional shape of the frame 40 excluding the projections 42a, 42b, 42c, and 42d has substantially the same height in the direction in which the frame continuum 41 extends. In addition, as shown in FIG. 2B, the cross-sectional shape of the frame 40 excluding the projecting portions 42a, 42b, 42c, and 42d is such that the center is high in the direction perpendicular to the direction in which the frame continuum 41 extends, and the periphery is high. Low and convex upwards.

In addition, as shown in FIG. 2C, the cross-sectional shape of the frame 40 at the projecting portions 42a, 42b, 42c, and 42d is such that the first portion P1 is arranged inside and the first portion P1 is arranged outside the first portion P1. and a second portion P2 having a thickness smaller than that of the first portion P1. This is because the elongated frame continuum 41 is wound from the inside to the outside at the apexes 40a, 40b, 40c, and 40d, and then crosses so as to overlap, and the protrusions 42a, 42b, 42c, and 42d are formed. This is due to the formation (see FIG. 10A). This will be further described later in the description of the manufacturing method of the light emitting device.

The frame body 40 uses a long frame continuum 41 to form the vertexes 40a, 40b, 40c, and 40d of the inner edge 43 so as to have protrusions 42a, 42b, 42c, and 42d, thereby forming a rectangular shape. The light-emitting element 20b located at the vertex of the outline 20a and the vertices 40a, 40b, 40c, and 40d of the inner edge 43 of the frame 40 are separated by a predetermined distance R, and the light-emitting region 1a is not reduced. there is

The inner angles of the vertices 40a, 40b, 40c, and 40d of the inner edge 43 of the frame 40 are preferably about 90 degrees from the viewpoint of reducing the area of the light emitting region 1a. This is because the adjacent vertices 40a, 40b, 40c, and 40d of the frame continuum 41 can be connected at shorter distances.

As shown in FIG. 2A, the protrusions 42a, 42b, 42c, and 42d are connected to the two linear frame continuum 41 portions. The angle θ between the outer portion of the projecting portion 42a and the outer portion of the linear frame continuum 41 is an obtuse angle (larger than 90 degrees and smaller than 180 degrees). It is preferable to form the frame 40 so that the inner angles of the vertices 40a, 40b, 40c, and 40d of are about 90 degrees.

When the inner edge 43 of the frame 40 is rectangular, the inner angles of the vertices 40a, 40b, 40c, 40d of the inner edge 43 of the frame 40 are preferably about 90 degrees, as described above. From the viewpoint of obtaining a large light emitting region, it is preferable that the inner angles of the vertices of the inner edge 43 of the frame 40 match the angles of the inner angles of the vertices of the polygon formed by the outline 20a.

The frame 40 is preferably made of white molding resin. For example, the frame continuum 41 is formed using silicon resin or epoxy resin in which fine particles such as titanium oxide are dispersed.

The sealing layer 50 is a member in which a phosphor is contained in translucent resin, and is arranged inside the frame 40 in order to seal the plurality of light emitting elements 20 . As shown in FIGS. 2B and 2C, in the light-emitting device 1, the surface 50a of the sealing layer 50 is positioned lower than the top of the frame 40 and on the side surface of the frame 40. . The phosphor is a particulate phosphor material such as YAG (yttrium aluminum garnet) that absorbs the blue light emitted by the light emitting element 20 and converts the wavelength into yellow light. White light is obtained by mixing with yellow light. The encapsulation layer 50 may be formed, for example, by containing a phosphor in resin such as epoxy resin or silicon resin. The encapsulating layer 50 may have a phosphor that absorbs blue light and converts the wavelength to light of another color. When the light emitting element 20 is a white semiconductor light emitting element (for example, a phosphor material is localized only in the vicinity of the light emitting element 20), the sealing layer 50 contains a phosphor. It doesn't have to be.

Light emitted from the light emitting element 20 toward the frame 40 is reflected on the inner side of the frame 40 , that is, the surface on the side of the light emitting element 20 , and emitted upward from the light emitting device 1 .

The fact that the light emitting region 1a of the light emitting device 1 is smaller than that of the conventional light emitting device shown in FIG. 1 will be described below with reference to FIGS. 3(A) and 3(B).

3A is a diagram for explaining the light emitting region of the light emitting device shown in FIG. 2, and FIG. 3B is a diagram for explaining the light emitting region of the conventional light emitting device shown in FIG.

In FIG. 3A, illustration of components other than the main components including the frame 40 and the plurality of light emitting elements 20 of the light emitting device 1 is omitted.

The light-emitting region 1a defined by being surrounded by the inner edge 43 of the frame 40 has a rectangular shape with a vertical length of L1 and a horizontal length of L2. In the example shown in FIG. 3A, the light emitting area 1a is shown as square, but may be rectangular.

Between the light emitting elements 20b located at the four vertices of the rectangular outline 20a formed by the plurality of light emitting elements 20 and the corresponding vertices 40a, 40b, 40c, and 40d of the inner edge 43 of the frame 40, there is space from the light emitting elements 20b. They are separated by a predetermined distance R from the viewpoint of preventing unnecessary interference with emitted light.

The area S1 of the light emitting region 1a of the light emitting device 1 shown in FIG. 3A is represented by the following formula (1).
S1=L1×L2 (1)

Similarly to FIG. 3A, FIG. 3B also omits illustration of components other than the main components including the frame 140 and the plurality of light emitting elements 120 of the light emitting device 100 .

The light emitting device 100 has nine light emitting elements 120 . The nine light emitting elements 120 are arranged in three rows and three columns, and have a rectangular outline 120a as a whole.

An inner edge 143 of the frame 140 has a rectangular outline similar to the outline 120a formed by the plurality of light emitting elements 120 . The surface of the sealing layer (not shown) surrounded by the frame 140 forms the light emitting region 100a.

A rectangular inner edge 143 of the frame 140 has four vertices 140a, 140b, 140c, 140d.

The shapes and dimensions of the plurality of light emitting elements 120 and the rectangular outline 120a in the light emitting device 100 are the same as those of the light emitting element 20 and the outline 20a of the light emitting device 1 shown in FIG.

In the light emitting device 100 as well, the light emitted from the light emitting element 120b is separated from the light emitting element 120b located at the vertex of the rectangular contour 120a and the corresponding vertices 140a, 140b, 140c, and 140d of the inner edge 143 of the frame 140. From the viewpoint of preventing unnecessary interference, they are separated by a predetermined distance R as in the case of the light emitting device 1 .

The regions between the light-emitting elements 120b located at the four vertices of the rectangular outline 120a and the corresponding vertices 140a, 140b, 140c, and 140d of the inner edge 143 of the frame 140 are fan-shaped with a radius R of a quarter circle. have

In FIG. 3B, the light-emitting region 1a of the light-emitting device 1 shown in FIG. 3A is indicated by chain lines. The light-emitting region 1a is arranged so as to inscribe the light-emitting region 100a at four vertexes 140a, 140b, 140c, and 140d. A light emitting region 100 a of the light emitting device 100 is larger than a light emitting region 1 a of the light emitting device 1 .

In portions other than the four vertices 140a, 140b, 140c, and 140d of the inner edge 143 of the frame 140, the light-emitting region 1a and the frame 141 of the light-emitting region 100a are separated by a predetermined length L3. Here, L3<R.

The area S2 of the light emitting region 100a is represented by the following formula (2).
S2=(L1+2×L3)×(L2+2×L3)−4×(R ² −πR ² /4) (2)

A difference ΔS between the area S2 of the light emitting region 100a of the light emitting device 100 and the area S1 of the light emitting region 1a of the light emitting device 1 is represented by the following formula (3).

ΔS=2(L1L3+L2L3)−R ² (4−π) (3)

Since ΔS>0, the area S1 of the light emitting region 1a of the light emitting device 1 is smaller than the area S2 of the light emitting region 100a of the light emitting device 100 by ΔS.

Since the number of light-emitting elements 20 included in light-emitting device 1 is the same as the number of light-emitting elements 120 included in light-emitting device 100 , light-emitting device 1 has a higher light emission density than light-emitting device 100 .

In the light emitting device 1, the frame body 40 uses the elongated frame continuous body 41, and the apexes 40a, 40b, 40c, and 40d of the inner edge 43 are formed so as to have protrusions 42a, 42b, 42c, and 42d. As a result, the inside of the frame continuum 41 is formed to have angles of approximately 90 degrees at the vertices 40a, 40b, 40c, and 40d, like the vertices of the outline 20a.

As a result, in the light emitting device 1, the light emitting element 20b located at the vertex of the rectangular outline 20a and the vertices 40a, 40b, 40c, and 40d of the inner edge 43 of the frame 40 are separated by a predetermined distance R, Compared to the light emitting device 100, it is possible to reduce the light emitting area.

According to the light-emitting device 1 of this embodiment described above, the light-emitting region 1a can be reduced to improve the light-emitting density.

Modifications 1 to 3 of the light emitting device of the present specification described above will now be described with reference to FIGS. 4 to 6. FIG.

FIG. 4 is a diagram showing a main part of Modification 1 of one embodiment of the light emitting device disclosed in this specification.

In the light emitting device 1 of Modification 1, the shapes of the projecting portions 42a, 42b, 42c, and 42d are different from those of the above-described embodiment (see FIG. 2(C)).

FIG. 4 is a diagram corresponding to FIG. 2(C).

In the light-emitting device 1 of Modification 1, the circuit board 12 has recesses 12b in portions where the projections 42a, 42b, 42c, and 42d are arranged. The recessed portion 12b is recessed toward the mounting substrate 11 side more than other portions.

A portion of the wiring pattern 13B (or wiring pattern 13A) arranged in the recess 12b also has a recessed shape corresponding to the shape of the recess 12b of the circuit board 12 .

The first portion P1 of the protrusion 42a is arranged in the portion of the recess 12b. It is preferable that the depth to which the recess 12b is recessed from the other portions of the circuit board 12 matches the difference between the thickness of the first portion P1 and the second portion P2 of the projecting portion 42a. The upper surface of the projecting portion 42a has substantially the same height from the inside to the outside. As a result, the height of the light emitting device 1 can be lowered, and the storage volume of the light emitting device 1 can be reduced when the light emitting device 1 is incorporated in a lighting device and used.

Note that the recess 12b may be formed by removing a part of the circuit board 12 . In this case, the depth of recess 12b matches the thickness of circuit board 12 .

The above description of the projecting portion 42a also applies appropriately to the other projecting portions 42b, 42c, and 42d.

FIG. 5A is a plan view showing Modification 2 of one embodiment of the light-emitting device disclosed in this specification, and FIG. 5B is a cross-sectional view taken along the line AA′ of FIG. 5(C) is a cross-sectional view taken along line BB' of FIG. 5(A).

In the light emitting device 1 of Modification 2, the shapes of the projecting portions 42a, 42b, 42c, and 42d are different from those in the above-described embodiment.

In the light emitting device 1 of Modified Example 2, similarly to the embodiment described above, the projecting portions 42 a, 42 b, 42 c, and 42 d are formed by the elongated frame continuous body 41 forming the frame 40 .

In the frame 40, projections 42a, 42b, 42c, and 42d are formed at the vertices 40a, 40b, 40c, and 40d of the inner edge 43 so that the frames do not overlap from the inside to the outside.

The frame continuum 41 extends from the vertex 40b side of the inner edge 43 toward the vertex 40a, bends at the vertex 40a in a direction from the inside to the outside, winds at the tip portion toward the vertex 40d side, and turns inside again. After being folded back and extended, the frames are arranged so as to extend toward the vertex 40d without overlapping each other to form the projecting portion 42a.

In the projecting portion 42a, a gap is formed between the frame continuous bodies 41 that are folded back and face each other.

As shown in FIG. 5(C), the shape of the upper surface of the projecting portion 42a has substantially the same height from the inside to the outside. As a result, the height of the light emitting device 1 can be lowered, and the storage volume of the light emitting device 1 can be reduced when the light emitting device 1 is incorporated in a lighting device and used.

The above description of the projecting portion 42a also applies appropriately to the other projecting portions 42b, 42c, and 42d.

FIG. 6 is a diagram showing a main part of Modification 3 of one embodiment of the light emitting device disclosed in this specification.

In the light-emitting device 1 of Modification 3, the shape of the frame 40 is different from that of the above-described embodiment.

In FIG. 6, illustration of components other than the main components including the frame 40 of the light emitting device 1 and the contours 20a of the plurality of light emitting elements 20 is omitted.

In the light-emitting device 1 of Modification 3, the plurality of light-emitting elements 20 are arranged on the mounting substrate 11 so as to have an octagonal outline 20a as a whole. In this specification, the contour 20a is a shape traced so as to be inscribed in the outermost edges of the plurality of light emitting elements 20 arranged on the mounting substrate 11, as shown in FIG.

An inner edge 43 of the frame 40 has an octagonal contour 20a similar to the contour 20a formed by the plurality of light emitting elements 20 .

The frame body 40 has vertices 40a, 40b, 40c, 40d, 40e, 40f, 40g, and 40h of an octagonal inner edge 43 in the frame body 40. 42a, 42b, 42c, 42d, 42e, 42f, 43g, and 43h projecting toward the side).

Note that the outline 20a formed by the plurality of light emitting elements 20 is not limited to a quadrangle or an octagon. The contour 20a formed by the plurality of light emitting elements 20 may be a pentagon, a heptagon, or a nine or more polygon. The inner edge 43 of the frame 40 preferably has a shape corresponding to the outline 20a formed by the plurality of light emitting elements 20 .

According to the light-emitting device of the present invention, the inner edge of the frame having a contour corresponding to the contours of the plurality of light-emitting elements has a protrusion at its vertex, thereby reducing the light-emitting region and improving the light-emitting density. . In other words, in order to reduce the light emitting area, the frame should have vertices and a protrusion should be provided for each apex. As a result, for example, when wiring patterns and electrodes can be directly formed on a substrate for mounting, it becomes unnecessary to use a circuit substrate (second substrate).

Next, an embodiment of a method for manufacturing the light emitting device 1 disclosed in this specification will be described below with reference to FIGS. 7 to 11. FIG.

First, as shown in FIGS. 7A to 7C, the mounting board 11 and the circuit board 12 having the opening 12A are bonded. A pair of wiring patterns 13A and 13B are formed in advance on the circuit board 12 using a technique such as a printing method, and a pattern of solder resist 14 is formed on the pair of wiring patterns 13A and 13B. ing. A pair of connection electrodes 17A and 17B are formed by wiring patterns 13A and 13B in portions not covered with the solder resist 14 . The solder resist 14 also has a rectangular opening 14a so that the opening 12a of the circuit board 12 and the pair of wiring patterns 13A and 13B are partially exposed. 7(A) is a plan view corresponding to FIG. 2(A), FIG. 7(B) is a cross-sectional view taken along line AA' of FIG. 7(A), and FIG. 7(C) is a cross-sectional view of FIG. It is a BB' cross-sectional view of (A). This explanation is appropriately applied to other drawings in the following steps.

Next, as shown in FIGS. 8A to 8C, a plurality of light emitting elements 20 are adhered by die bonding onto the mounting board 11 exposed from the opening 12a of the circuit board 12. Next, as shown in FIG.

Next, as shown in FIGS. 9(A) to 9(C), adjacent light emitting elements 20 are electrically connected to each other by wires 30, and the light emitting elements 20 located on the outer peripheral side of the opening 12a are removed. , are connected to the wiring patterns 13A or 13B using wires 30. FIG. In one example, wire 30 is connected to light emitting element 20 by ultrasonic welding. In this embodiment, three columns in which three light emitting elements 20 are connected in series are connected in parallel between a pair of wiring patterns 13A and 13B.

Next, as shown in FIGS. 10(A) to 10(C), a frame 40 is placed on the circuit board 12 and the pair of wiring patterns 13A and 13B along the periphery of the opening 12a. It is formed so as to surround the element 20 . The frame 40 is formed along the inner side of the opening 14A of the solder resist 14 to cover the contacts between the wires 30 and the wiring patterns 13A or 13B.

As the material of the frame 40, for example, resin such as silicon resin or epoxy resin in which fine particles such as titanium oxide are dispersed can be used.

As a method of forming the frame 40, for example, a technique of applying a liquid resin along the inside of the opening 14A of the solder resist 14 with a dispenser and then curing the same can be used. The cured resin forms an elongated frame continuum 41 .

In forming the frame 40, for example, the projecting portion 42a arranged at the vertex 40a of the inner edge 43 is formed as follows.

As indicated by the arrow in FIG. 10A, a liquid resin is applied onto the substrate so as to extend from the vertex 40b side of the inner edge 43 adjacent to the vertex 40a on which the projecting portion 40a is arranged toward the vertex 40a. apply. Next, at the vertex 40a, the liquid resin is applied on the substrate so as to extend from the inside to the outside, and the liquid resin is wound to the vertex 40b side and applied on the substrate so as to extend by folding back inward again. do. Next, after applying the liquid resin so as to overlap and cross over the already applied resin, the liquid resin is applied so as to extend toward the vertex 40d of the inner edge 43 adjacent to the vertex 40a where the protruding portion 40a is arranged. apply. The liquid resin is similarly applied to the locations where the other protrusions 42b, 42c, and 42d are to be formed. Next, by curing the applied resin, the frame 40 having the projecting portions 42a, 42b, 42c, and 42d is formed.

In addition, since the apex 40a, the apex 40b and the apex 40d of the inner edge 43 are formed by curing the liquid resin, the apex 40a, the apex 40b and the apex 40d of the inner edge 43 are not yet formed at the time when the projecting portion 42a is formed. not formed. In the above description, "applying the liquid resin onto the substrate so as to extend from the side of the vertex 40b of the inner edge 43 adjacent to the vertex 40a of the inner edge 43 where the protrusion 40a is arranged toward the vertex 40a" means " The liquid resin is applied onto the substrate so as to extend from the vertex 40b side of the inner edge 43 adjacent to the vertex 40a of the inner edge 43 where the protrusion 40a is arranged toward the position where the vertex 40a will be formed in the future. . Further, "apply liquid resin so as to extend toward the vertex 40d of the inner edge 43 adjacent to the vertex 40a where the protruding portion 40a is arranged" means "the future inner edge adjacent to the vertex 40a where the protruding portion 40a is arranged." It means to apply a liquid resin so as to extend toward the position where the vertex 40d of 43 is formed. This also applies to other similar explanations as appropriate.

As shown in FIG. 10(C), at the vertex 40a of the inner edge 43, the intersecting portion of the liquid resin is cured to form the first portion P1, and the non-intersecting portion forms the second portion P2. .

In the example shown in FIG. 10A, the protrusions 42a, 42b, 42c, and 42d do not have gaps, but depending on how the liquid resin is applied onto the substrate, the liquid resin may be applied from the inside to the outside. A gap may be formed between the resin that is applied from the outside and the resin that is applied from the outside to the inside.

Next, as shown in FIGS. 2A to 2C, the inside of the frame 40 is filled with a resin containing a phosphor, and a sealing layer is formed so as to seal the plurality of light emitting elements 20. 50 are formed. Thereby, the light-emitting device 1 shown in FIG. 2 is obtained.

Next, manufacturing methods of modified example 1 and modified example 2 of the method for manufacturing the light emitting device described above will be described below.

First, Modified Example 1 of the manufacturing method of the light emitting device will be described below.

Modification 1 of the method for manufacturing a light-emitting device is a method for manufacturing a light-emitting device having protrusions shown in FIG.

In Modified Example 1, in the process shown in FIG. 7, as shown in FIG. 4, the circuit board 12 having the recesses 12b in the portions where the first portions P1 of the protrusions 42a, 42b, 42c, and 42d are arranged is mounted on the mounting board. 11. A portion of the wiring pattern 13B (or wiring pattern 13A) arranged in the recess 12b also has a recessed shape corresponding to the shape of the recess 12b of the circuit board 12 .

The steps shown in FIGS. 8 and 9 are the same as in the embodiment of the method for manufacturing the light emitting device described above.

Next, in the process shown in FIG. 10, as indicated by the arrow in FIG. 10A, the inner edge 43 on which the projecting portion 40a is arranged extends from the side of the vertex 40b adjacent to the vertex 40a toward the vertex 40a. A liquid resin is applied onto the substrate. Next, at the vertex 40a, the liquid resin is applied to the portion recessed by the recess 12b and then applied onto the substrate so as to extend from the inside to the outside. Next, the liquid resin is wound toward the vertex 40b and then applied to the substrate so as to fold back and extend inward. Next, after applying liquid resin so as to overlap and cross over the already applied resin in the recessed portion 12b, the resin is applied so as to extend toward the vertex 40d adjacent to the vertex 40a where the protruding portion 40a is arranged. Apply liquid resin to The liquid resin is similarly applied to the locations where the other protrusions 42b, 42c, and 42d are to be formed. Next, by curing the applied resin, the frame 40 having the projecting portions 42a, 42b, 42c, and 42d is formed.

As shown in FIG. 4, the first portion P1 is formed by curing the resin applied to the recessed portion of the circuit board 12, and the non-intersecting portion forms the second portion P2.

The subsequent steps are performed in the same manner as in the embodiment of the manufacturing method of the light emitting device described above, and the light emitting device shown in FIG. 4 is obtained.

Next, Modified Example 2 of the manufacturing method of the light emitting device will be described below.

Modification 2 of the method for manufacturing a light-emitting device is a method for manufacturing a light-emitting device having protrusions shown in FIG.

The steps shown in FIGS. 7 to 9 are the same as in the embodiment of the method for manufacturing the light emitting device described above.

Next, in the process shown in FIG. 11, as indicated by the arrow in FIG. 11A, the inner edge 43 on which the projecting portion 40a is arranged extends from the side of the vertex 40b adjacent to the vertex 40a toward the vertex 40a. A liquid resin is applied onto the substrate. Next, at the vertex 40a, the liquid resin is applied onto the substrate so as to extend from the inside to the outside. do. Next, the liquid resin is applied so as not to overlap with the resin that has already been applied, and the liquid resin is applied so as to extend toward the vertex 40d adjacent to the vertex 40a where the projecting portion 40a is arranged. The liquid resin is similarly applied to the locations where the other protrusions 42b, 42c, and 42d are to be formed. Next, by curing the applied resin, the frame 40 having the projecting portions 42a, 42b, 42c, and 42d is formed.

The subsequent steps are performed in the same manner as in the embodiment of the manufacturing method of the light emitting device described above, and the light emitting device shown in FIG. 5 is obtained.

In the present invention, the light-emitting device and the method for manufacturing the light-emitting device of the above-described embodiments can be modified as appropriate without departing from the gist of the present invention.

For example, in the above-described embodiments, the protruding portion was not arranged on the solder resist, but part of the protruding portion may be arranged on the solder resist.

Reference Signs List 1 light emitting device 1a, 100a light emitting region 11 mounting substrate (substrate)
12 circuit board (second board)
12a opening 12b recess 13A, 13B wiring pattern 14 solder resist 17A, 17B connection electrode 20 light emitting element 20a contour 30 wire 40, 140 frame 40a, 40b, 40c, 40d, 40e, 40f, 40g, 40h vertex 140a, 140b, 140c, 140d vertex 41 frame continuum 42a, 42b, 42c, 42d, 42e, 42f, 42g, 42h protrusion 43 inner edge P1 first part P2 second part 50 sealing layer 50a surface of sealing layer

Claims (4)

a substrate;
a plurality of light emitting elements arranged on the substrate;
a frame arranged on the substrate so as to surround the plurality of light emitting elements;
a sealing layer arranged inside the frame so as to seal the plurality of light emitting elements;
with
a shape obtained by tracing the outermost edges of the plurality of light emitting elements arranged on the substrate is a polygon having four or more sides in a plan view;
The inner edge of the frame forms a polygon having the same shape as the outermost edges of the plurality of light emitting elements arranged on the substrate, and each vertex of the polygon has a A protruding part protruding toward is arranged,
The protrusion is
a first part;
and a second portion arranged outside the first portion and thinner than the first portion. comprising a second substrate disposed on the substrate;
the protrusion is disposed on the second substrate;
2. The light emitting device of claim 1 , wherein the portion of the second substrate on which the first portion is arranged is recessed. In a first step of arranging a plurality of light emitting elements on a substrate, a shape obtained by tracing the outermost edges of the plurality of light emitting elements arranged on the substrate is a polygon having a quadrilateral or more in a plan view. a first step;
A second step of forming a frame so as to surround the plurality of light emitting elements on the substrate using an elongated frame continuum, wherein an inner edge of the frame is arranged on the substrate. The frame has the same polygon as a shape tracing the outermost edges of the plurality of light emitting elements, and has a protrusion projecting outward from the inside of the frame at each vertex of the polygon. a second step of forming a body;
a third step of forming a sealing layer inside the frame so as to seal the plurality of light emitting elements ;
In the second step,
The frame continuum extending from the side of the second vertex of the inner edge adjacent to the first vertex of the inner edge where one of the protrusions is arranged toward the first vertex is positioned at the first vertex. wherein, after being wound from the inner side toward the outer side, the protruding portion is arranged so as to extend toward a third vertex of the inner edge adjacent to the first vertex, and
At the first vertex, the frame continuum is wound from the inner side toward the outer side and crossed, and then arranged so as to extend toward the third vertex to form the protruding portion. A method of manufacturing a light-emitting device, characterized by : Between the first step and the second step, a fourth step of placing a second substrate having a recess in a portion where the protrusion is formed on the substrate,
In the second step, at the first vertex, the frame continuous body is wound from the inner side toward the outer side to cross the frame continuous bodies on the recess, and then the third 4. The method of manufacturing a light-emitting device according to claim 3 , wherein the protrusion is formed on the second substrate so as to extend toward a vertex.

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