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JP7241564B2 - Exposure apparatus and article manufacturing method - Google Patents
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JP7241564B2 - Exposure apparatus and article manufacturing method - Google Patents

Exposure apparatus and article manufacturing method Download PDF

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JP7241564B2
JP7241564B2 JP2019030794A JP2019030794A JP7241564B2 JP 7241564 B2 JP7241564 B2 JP 7241564B2 JP 2019030794 A JP2019030794 A JP 2019030794A JP 2019030794 A JP2019030794 A JP 2019030794A JP 7241564 B2 JP7241564 B2 JP 7241564B2
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light shielding
light
shielding member
shutter
exposure apparatus
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JP2020134829A (en
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裕貴 佐野
浩司 仁平
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Canon Inc
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

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  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Developing Agents For Electrophotography (AREA)

Description

本発明は、露光装置、および物品の製造方法に関する。 The present invention relates to an exposure apparatus and an article manufacturing method.

半導体デバイスなどの製造工程(リソグラフィ工程)では、基板を露光する露光装置が用いられうる。露光装置では、例えば、光源からの光を遮断する遮光部材を有するシャッタが設けられ、当該シャッタを駆動して基板への光の照射と非照射とを切り換えることにより、基板の露光量を制御することができる。 2. Description of the Related Art An exposure apparatus that exposes a substrate may be used in a manufacturing process (lithography process) for semiconductor devices and the like. In an exposure apparatus, for example, a shutter having a light shielding member that blocks light from a light source is provided, and the exposure amount of the substrate is controlled by driving the shutter to switch between irradiation and non-irradiation of light to the substrate. be able to.

特許文献1には、エンコーダのミスカウントや空気圧の圧力低下などのシャッタの駆動誤差によるシャッタの半開きを検知する方法が開示されている。特許文献1に記載された方法では、シャッタ閉情報が入力されたときのカウンタ値(受光素子からの信号の電圧値)と、シャッタ開情報が入力されたときのカウンタ値との偏差を求め、その偏差を基準値と比較することによりシャッタの半開きを検知している。 Japanese Patent Application Laid-Open No. 2004-200000 discloses a method of detecting a half-open shutter due to a shutter drive error such as an encoder miscount or a decrease in air pressure. In the method described in Patent Document 1, a deviation between a counter value (voltage value of a signal from a light receiving element) when shutter closed information is input and a counter value when shutter open information is input is obtained, Half-opening of the shutter is detected by comparing the deviation with a reference value.

特開平6-53109号公報JP-A-6-53109

露光装置のシャッタでは、高エネルギの光が遮光部材に照射されることによって当該遮光部材が劣化し、その一部が欠損(破損)したり薄化したりといった異常が生じる場合がある。この場合、光源からの光の光路に遮光部材が配置されるようにシャッタを正常に駆動したとしても、欠損や薄化などの異常が生じた遮光部材の一部から光が漏れてしまう。このような漏れ光は、近年における回路バターンの微細化の要求において、基板の露光量を高精度に制御することを困難にしうる。したがって、露光装置では、遮光部材からの漏れ光を検出して、当該遮光部材の異常を精度よく検知することが望まれている。 In the shutter of the exposure apparatus, when the light shielding member is irradiated with high-energy light, the light shielding member deteriorates, and an abnormality such as partial loss (damage) or thinning of the light shielding member may occur. In this case, even if the shutter is normally driven so that the light shielding member is arranged in the optical path of the light from the light source, light leaks from a part of the light shielding member that has an abnormality such as a defect or thinning. Such leaked light can make it difficult to control the exposure amount of the substrate with high accuracy in the recent demand for finer circuit patterns. Therefore, in the exposure apparatus, it is desired to detect leakage light from the light shielding member and accurately detect an abnormality of the light shielding member.

しかしながら、欠損や薄化などの異常が生じた遮光部材からの漏れ光は、その断面積や光強度が非常に小さい。そのため、特許文献1のように、シャッタ閉情報の入力時とシャッタ開情報の入力時とでのカウンタ値の偏差を用いる方式では、当該漏れ光を検出することが困難になりうる。 However, the cross-sectional area and light intensity of leaked light from a light shielding member that has an abnormality such as a defect or thinning is very small. For this reason, it may be difficult to detect the leaked light in the method of using the deviation of the counter value between when the shutter closed information is input and when the shutter open information is input, as in Patent Document 1.

そこで、本発明は、遮光部材の異常を精度よく検知するために有利な露光装置を提供することを目的とする。 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an exposure apparatus that is advantageous for accurately detecting an abnormality in a light shielding member.

上記目的を達成するために、本発明の一側面としての露光装置は、基板を露光する露光装置であって、光源からの光を遮断する第1遮光部材を有するシャッタと、前記シャッタを通過した前記光を検出する検出部と、前記シャッタを駆動することにより前記基板の露光処理を制御する制御部と、を含み、前記制御部は、前記第1遮光部材が前記光の光路に配置された第1状態での前記検出部の検出結果と、前記第1遮光部材が前記光の光路に配置されずに前記検出部への前記光の入射が遮断された第2状態での前記検出部の検出結果とを比較することにより、前記第1遮光部材の異常を検知する、ことを特徴とする。 To achieve the above object, an exposure apparatus as one aspect of the present invention is an exposure apparatus for exposing a substrate, comprising a shutter having a first light shielding member for blocking light from a light source, and a light beam passing through the shutter. a detection unit that detects the light; and a control unit that controls exposure processing of the substrate by driving the shutter, wherein the control unit includes the first light shielding member arranged in the optical path of the light. A detection result of the detection unit in a first state, and a detection result of the detection unit in a second state in which the first light blocking member is not arranged in the optical path of the light and the light is blocked from entering the detection unit. An abnormality of the first light shielding member is detected by comparing the detection result.

本発明の更なる目的又はその他の側面は、以下、添付図面を参照して説明される好ましい実施形態によって明らかにされるであろう。 Further objects or other aspects of the present invention will be made clear by preferred embodiments described below with reference to the accompanying drawings.

本発明によれば、例えば、遮光部材の異常を精度よく検知するために有利な露光装置を提供することができる。 According to the present invention, for example, it is possible to provide an exposure apparatus that is advantageous for accurately detecting an abnormality in a light shielding member.

露光装置の構成例を示す概略図Schematic diagram showing a configuration example of an exposure apparatus シャッタの駆動状態と基板に照射される光の照度との関係を示す図FIG. 4 is a diagram showing the relationship between the driving state of the shutter and the illuminance of the light applied to the substrate; シャッタの駆動状態と検出部の検出結果との対応関係を示す図FIG. 5 is a diagram showing the correspondence relationship between the drive state of the shutter and the detection result of the detection unit; 第1遮光部材の異常の検知方法を示すフローチャートFlowchart showing a method for detecting an abnormality in the first light shielding member 各遮光部材31について光、路上に配置した回数と検出部の検出結果との対応関係を示す図A diagram showing the correspondence relationship between light, the number of times each light blocking member 31 is placed on the road, and the detection result of the detection unit. 第2遮光部材を有する露光装置を示す図A diagram showing an exposure apparatus having a second light shielding member 第4実施形態における基板の露光処理を示すフローチャート14 is a flowchart showing substrate exposure processing in the fourth embodiment; シャッタの回転駆動の一例を示す図A diagram showing an example of shutter rotation drive 各ショット領域の露光処理に用いられる遮光部材(変更前)を示す図A diagram showing a light shielding member (before change) used for exposure processing of each shot area. 各ショット領域の露光処理に用いられる遮光部材(変更後)を示す図A diagram showing a light shielding member (after change) used for exposure processing of each shot area. 第5実施形態における基板の露光処理を示すフローチャートFlowchart showing substrate exposure processing in the fifth embodiment 第6実施形態における基板の露光処理を示すフローチャートFlowchart showing substrate exposure processing in the sixth embodiment

以下、添付図面を参照して実施形態を詳しく説明する。尚、以下の実施形態は特許請求の範囲に係る発明を限定するものではない。実施形態には複数の特徴が記載されているが、これらの複数の特徴の全てが発明に必須のものとは限らず、また、複数の特徴は任意に組み合わせられてもよい。さらに、添付図面においては、同一若しくは同様の構成に同一の参照番号を付し、重複した説明は省略する。 Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention according to the scope of claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant description is omitted.

<第1実施形態>
本発明に係る第1実施形態について説明する。図1は、本実施形態の露光装置100の構成例を示す概略図である。露光装置100は、物品としての半導体素子、液晶表示素子、薄膜磁気ヘッドなどのデバイスの製造工程(リソグラフィ工程)に用いられるリソグラフィ装置であり、基板を露光することにより基板上にパターンを形成する。本実施形態の場合、露光装置100は、ステッパ方式またはスキャン方式により原版(マスク、レチクル)のパターン像を基板上に投影することで基板を露光し、原版のパターンを基板に転写する投影露光装置でありうる。しかしながら、それに限られず、露光装置100は、モールドと基板上のインプリント材とを接触させた状態で基板(インプリント材)を露光することでインプリント材を硬化させ、基板上にインプリント材のパターンを形成するインプリント装置であってもよい。
<First embodiment>
A first embodiment according to the present invention will be described. FIG. 1 is a schematic diagram showing a configuration example of an exposure apparatus 100 of this embodiment. The exposure apparatus 100 is a lithography apparatus used in the manufacturing process (lithography process) of devices such as semiconductor elements, liquid crystal display elements, and thin-film magnetic heads as articles, and forms a pattern on a substrate by exposing the substrate. In this embodiment, the exposure apparatus 100 is a projection exposure apparatus that exposes a substrate by projecting a pattern image of an original (mask or reticle) onto the substrate by a stepper method or a scanning method, and transfers the pattern of the original to the substrate. can be However, the exposure apparatus 100 is not limited to this, and the exposure apparatus 100 exposes the substrate (imprint material) while the mold and the imprint material on the substrate are in contact with each other, thereby curing the imprint material and depositing the imprint material on the substrate. may be an imprint apparatus that forms a pattern of

露光装置100は、光源部LSからの光で原版(不図示)を照明する照明光学系ILと、原版のパターンを基板に投影する投影光学系(不図示)と、検出部8と、電流ドライバ10と、周波数/電圧変換器11と、電圧/周波数変換器12とを有する。また、露光装置100は、サーボアンプ13と、乗算器14と、ポジションカウンタ15と、露光量カウンタ16と、制御部17とを有する。 The exposure apparatus 100 includes an illumination optical system IL that illuminates an original (not shown) with light from a light source unit LS, a projection optical system (not shown) that projects the pattern of the original onto a substrate, a detector 8, and a current driver. 10 , a frequency/voltage converter 11 and a voltage/frequency converter 12 . The exposure apparatus 100 also has a servo amplifier 13 , a multiplier 14 , a position counter 15 , an exposure amount counter 16 and a control section 17 .

光源部LSは、基板を露光するための光(露光光)を射出する光源1(例えば紫外線ランプ)と、光源1からの光を集光して照明光学系ILに導く楕円ミラー2とを含む。また、照明光学系ILは、光源部LSからの光で原版を照明する時間(即ち、基板への光の照射時間)を制御するための機構を有する。当該機構は、例えば、シャッタ3と、レンズ4と、ハーフミラー5と、モータ6と、エンコーダ7とを含む。 The light source unit LS includes a light source 1 (for example, an ultraviolet lamp) that emits light (exposure light) for exposing a substrate, and an elliptical mirror 2 that collects the light from the light source 1 and guides it to the illumination optical system IL. . The illumination optical system IL also has a mechanism for controlling the time for illuminating the original with the light from the light source section LS (that is, the light irradiation time for the substrate). The mechanism includes a shutter 3, a lens 4, a half mirror 5, a motor 6, and an encoder 7, for example.

シャッタ3は、例えば、光源部LSからの光を遮断する複数の遮光部材31(羽根、遮光領域)を有する回転体として構成され、複数の遮光部材間の光通過領域32で光を通過させる。本実施形態のシャッタ3は、等間隔(等角度)で配置された3つの遮光部材31によって構成されているが、2つ又は4つ以上の遮光部材31で構成されてもよいし、1つの遮光部材31で構成されてもよい。モータ6は、シャッタ3を回転させるための駆動源である。エンコーダ7は、シャッタ3の回転位置を計測するための計測器である。シャッタ3を通過した光は、レンズ4を介してハーフミラー5に入射し、ハーフミラー5によって当該光の一部が検出部8に導かれる。図1に示す例では、シャッタ3を通過した光のうち、ハーフミラー5で反射された一部の光が検出部8に導かれる。検出部8は、ハーフミラー5から導かれた当該一部の光の強度を検出するフォトデテクタを含み、その出力は、基板に照射される光の照度(強度)、および基板の露光量を計測するために用いられうる。ここで、基板の露光量は、基板に照射される光の照度の時間積分によって定義されるものとする。 The shutter 3 is, for example, configured as a rotating body having a plurality of light blocking members 31 (blades, light blocking regions) that block light from the light source unit LS, and allows light to pass through light passing regions 32 between the plurality of light blocking members. The shutter 3 of the present embodiment is composed of three light shielding members 31 arranged at equal intervals (equal angles), but may be composed of two or four or more light shielding members 31, or may be composed of one light shielding member 31. It may be composed of the light shielding member 31 . A motor 6 is a drive source for rotating the shutter 3 . The encoder 7 is a measuring instrument for measuring the rotational position of the shutter 3 . Light passing through the shutter 3 is incident on the half mirror 5 via the lens 4 , and part of the light is guided to the detector 8 by the half mirror 5 . In the example shown in FIG. 1 , part of the light that has passed through the shutter 3 and is reflected by the half mirror 5 is guided to the detector 8 . The detection unit 8 includes a photodetector that detects the intensity of the part of the light guided from the half mirror 5, and its output measures the illuminance (intensity) of the light applied to the substrate and the exposure amount of the substrate. can be used to Here, the exposure amount of the substrate is defined by the time integral of the illuminance of the light with which the substrate is irradiated.

電流ドライバ10は、モータ6に電流を供給してモータ6を駆動する。周波数/電圧変換器(FVC;Frequency Voltage Converter)11は、エンコーダ7から出力される、シャッタの回転速度に比例したパルス列を電圧に変換する。電圧/周波数変換器(VFC;Voltage Frequency Converter)12は、検出部8から出力される、基板の露光量に比例したアナログ電圧をパルス列に変換する。 A current driver 10 supplies current to the motor 6 to drive the motor 6 . A frequency voltage converter (FVC) 11 converts a pulse train proportional to the rotation speed of the shutter output from the encoder 7 into a voltage. A voltage/frequency converter (VFC; Voltage Frequency Converter) 12 converts an analog voltage output from the detector 8 and proportional to the exposure amount of the substrate into a pulse train.

サーボアンプ13は、シャッタ3の実際の回転速度が2次指令値24(によって指示されるシャッタ3の回転速度)と一致するように、シャッタ3の実際の回転速度と2次指令値24との差分に比例する出力を電流ドライバ10に供給する。乗算器14は、シャッタ3の回転速度を指示する1次指令値21と、ゲインコントロールデータ20とに基づいて、2次指令値24を生成する。 The servo amplifier 13 adjusts the actual rotational speed of the shutter 3 and the secondary command value 24 so that the actual rotational speed of the shutter 3 coincides with the secondary command value 24 (the rotational speed of the shutter 3 indicated by). An output proportional to the difference is provided to current driver 10 . A multiplier 14 generates a secondary command value 24 based on a primary command value 21 that indicates the rotation speed of the shutter 3 and the gain control data 20 .

ポジションカウンタ15は、シャッタ3の回転位置を監視して位置データ22を出力する。露光量カウンタ16は、VFC12から出力されたパルスをカウントすることで、検出部8に入射する光の時間的積分量、即ち、基板の露光量を監視して露光量データ23を出力する。 A position counter 15 monitors the rotational position of the shutter 3 and outputs position data 22 . The exposure amount counter 16 counts the pulses output from the VFC 12 to monitor the temporally integrated amount of light incident on the detection unit 8 , that is, the exposure amount of the substrate, and outputs exposure amount data 23 .

制御部17は、CPUおよびメモリ(記憶部)を含み、露光装置100の各部を統括的に制御して、基板における複数のショット領域の各々に対する露光処理を制御する。例えば、制御部17は、露光処理において、基板の露光量が目標露光量になるように、シャッタ3を回転駆動することによって基板への光の照射と非照射とを制御する。具体的には、制御部17は、遮光部材31により光源部LSからの光を遮断している遮光状態から、光源部LSからの光が光通過領域32を通過している光通過状態へ、そして再び遮光状態に移行するように、シャッタ3の回転駆動を制御する。 The control unit 17 includes a CPU and a memory (storage unit), and comprehensively controls each unit of the exposure apparatus 100 to control exposure processing for each of a plurality of shot areas on the substrate. For example, in the exposure process, the control unit 17 controls irradiation and non-irradiation of light to the substrate by rotationally driving the shutter 3 so that the exposure amount of the substrate becomes the target exposure amount. Specifically, the control unit 17 shifts from the light shielding state in which the light from the light source unit LS is blocked by the light shielding member 31 to the light passing state in which the light from the light source unit LS passes through the light passing region 32. Then, the rotational drive of the shutter 3 is controlled so as to shift to the light shielding state again.

図2は、シャッタ3の駆動状態と基板に照射される光の照度との関係を示す図である。露光処理では、光源部LSからの光の光路上にシャッタ3の遮光部材31が配置されている遮光状態(図2の状態(1))からシャッタ3の回転が開始される。シャッタ3の回転が開始されると、シャッタ3の光通過領域32を光が徐々に通過し始め(図2の状態(2))、光の全体が光通過領域32を通過している光通過状態(図2の状態(3))でシャッタ3の回転が停止される。そして、基板の露光量が目標露光量になるように、シャッタ3の回転が再び開始される(図2の状態(4))。シャッタ3の回転が開始されると、遮光部材31により光が徐々に遮断され始め(図2の状態(5))、光路上に遮光部材31が配置されている遮光状態(図2の状態(6))でシャッタ3の回転が停止される。ここでは、露光処理において、遮光状態および光通過状態の各々でシャッタ3の回転を停止させたが、例えば、遮光状態から光通過状態を経て再び遮光状態に至る一連の動作を、シャッタ3の回転を停止させることなく連続して行ってもよい。 FIG. 2 is a diagram showing the relationship between the driving state of the shutter 3 and the illuminance of light applied to the substrate. In the exposure process, the rotation of the shutter 3 is started from the light shielding state (state (1) in FIG. 2) in which the light shielding member 31 of the shutter 3 is arranged on the optical path of the light from the light source unit LS. When the shutter 3 starts to rotate, light gradually begins to pass through the light passage area 32 of the shutter 3 (state (2) in FIG. 2), and the entire light passes through the light passage area 32. Rotation of the shutter 3 is stopped in the state (state (3) in FIG. 2). Then, the rotation of the shutter 3 is restarted so that the exposure amount of the substrate reaches the target exposure amount (state (4) in FIG. 2). When the shutter 3 starts to rotate, the light is gradually blocked by the light shielding member 31 (state (5) in FIG. 2), and the light shielding member 31 is placed on the optical path (state ( in FIG. 2)). At 6)), the rotation of the shutter 3 is stopped. Here, in the exposure process, the rotation of the shutter 3 is stopped in each of the light blocking state and the light passing state. may be performed continuously without stopping.

このように構成された露光装置100では、シャッタ3の遮光部材31に高エネルギの光が照射されることによって遮光部材31が劣化し、その一部が欠損(破損)したり薄化したりする場合がある。この場合、光源部LSからの光の光路全体に遮光部材31が配置されるようにシャッタ3を正常に駆動したとしても、欠損や薄化などの異常が生じた遮光部材31の一部から光が漏れてしまう。このような漏れ光は、その断面積や光強度が非常に小さいが、近年における回路パターンの微細化の要求においては、基板の露光量を高精度に制御することを困難にしうる。したがって、露光装置100では、シャッタの遮光部材31からの漏れ光を検出して、当該遮光部材31の異常を精度よく検知することが望まれている。 In the exposure apparatus 100 configured as described above, when the light shielding member 31 of the shutter 3 is irradiated with high-energy light, the light shielding member 31 is degraded, and part of the light shielding member 31 is lost (damaged) or thinned. There is In this case, even if the shutter 3 is normally driven so that the light shielding member 31 is arranged along the entire optical path of the light from the light source unit LS, the light will not be emitted from the part of the light shielding member 31 that is damaged, thinned, or otherwise damaged. leaks out. Although such leaked light has a very small cross-sectional area and light intensity, it may become difficult to control the exposure amount of the substrate with high accuracy in the recent demand for miniaturization of circuit patterns. Therefore, in the exposure apparatus 100, it is desired to detect leakage light from the light shielding member 31 of the shutter and to detect an abnormality of the light shielding member 31 with high accuracy.

そこで、本実施形態の露光装置100(制御部17)は、光源部LSからの光の光路上にシャッタ3の第1遮光部材が配置されずに検出部8への光の入射が遮断された第2状態での検出部8の検出結果を得る。そして、シャッタ3の第1遮光部材が光路上に配置されるようにシャッタ3を駆動した第1状態での検出部8の検出結果と、第2状態での検出部8の検出結果とを比較することにより、当該第1遮光部材の異常を検知する。ここで、第1遮光部材とは、シャッタ3を構成する複数の遮光部材31のうち、異常を検知する対象の遮光部材のことである。即ち、シャッタ3を構成する複数の遮光部材31の各々について異常を検知する場合、複数の遮光部材31の各々が第1遮光部材として設定されうる。また、第2状態は、例えば、光源部LSからの光の光路上にシャッタ3の第1遮光部材を配置させずに、第1遮光部材とは異なる遮光部材を光源部LSと検出部8との間の光路上に配置することによって生成されうる。本実施形態の場合、第2状態は、シャッタ3を構成する複数の遮光部材31のうち、異常を検知する対象の遮光部材(第1遮光部材)とは異なる遮光部材が光源部LSからの光の光路上に配置されるようにシャッタ3を駆動することによって生成されうる。 Therefore, in the exposure apparatus 100 (control unit 17) of the present embodiment, the first light blocking member of the shutter 3 is not arranged on the optical path of the light from the light source unit LS, so that the light is blocked from entering the detection unit 8. A detection result of the detection unit 8 in the second state is obtained. Then, the detection result of the detection unit 8 in the first state in which the shutter 3 is driven so that the first light shielding member of the shutter 3 is arranged on the optical path is compared with the detection result of the detection unit 8 in the second state. By doing so, the abnormality of the first light shielding member is detected. Here, the first light shielding member is the light shielding member whose abnormality is to be detected, among the plurality of light shielding members 31 forming the shutter 3 . That is, when an abnormality is detected for each of the plurality of light shielding members 31 forming the shutter 3, each of the plurality of light shielding members 31 can be set as the first light shielding member. In the second state, for example, a light shielding member different from the first light shielding member is placed between the light source unit LS and the detection unit 8 without arranging the first light shielding member of the shutter 3 on the optical path of the light from the light source unit LS. can be generated by placing it on the optical path between In the case of the present embodiment, in the second state, among the plurality of light shielding members 31 constituting the shutter 3, a light shielding member different from the light shielding member (first light shielding member) whose abnormality is to be detected is used to detect the light from the light source unit LS. can be generated by driving the shutter 3 so that it is placed on the optical path of

本実施形態におけるシャッタ3の遮光部材31の異常を検知する方法について、図3~図4を参照しながら説明する。以下では、シャッタ3が遮光部材31A~31Cによって構成され、遮光部材31Cに異常(欠損、亀裂)が生じている例について説明する。 A method for detecting an abnormality of the light shielding member 31 of the shutter 3 in this embodiment will be described with reference to FIGS. 3 and 4. FIG. In the following, an example in which the shutter 3 is composed of the light shielding members 31A to 31C and the light shielding member 31C has an abnormality (defect or crack) will be described.

まず、露光処理におけるシャッタ3の駆動と検出部8で検出される光強度との対応関係について、図3を参照しながら説明する。図3は、シャッタ3の駆動状態と検出部8の検出結果(光強度)との対応関係を示す図である。図3の状態(1)は、シャッタ3の遮光部材31Aが光路上に配置されている状態を示している。制御部17は、この状態(1)において検出部8に光(光強度)の検出を行わせ、その検出結果(光強度A01)を得る。基板(ショット領域)の露光処理を開始する場合には、制御部17は、図3の状態(2)に示すように、シャッタ3の光通過領域32が光路上に配置されるようにシャッタ3を駆動する。そして、露光処理を終了する場合には、制御部17は、図3の状態(3)に示すように、シャッタ3の遮光部材31Bが光路上に配置されるようにシャッタ3を駆動する。制御部17は、この状態(3)において検出部8に光の検出を行わせ、その検出結果(光強度B01)を得る。 First, the correspondence relationship between the drive of the shutter 3 and the light intensity detected by the detector 8 in the exposure process will be described with reference to FIG. FIG. 3 is a diagram showing the correspondence relationship between the drive state of the shutter 3 and the detection result (light intensity) of the detector 8. As shown in FIG. State (1) in FIG. 3 shows a state in which the light blocking member 31A of the shutter 3 is arranged on the optical path. The control unit 17 causes the detection unit 8 to detect light (light intensity) in this state (1), and obtains the detection result (light intensity A01). When starting the exposure processing of the substrate (shot area), the control unit 17 moves the shutter 3 so that the light passing area 32 of the shutter 3 is arranged on the optical path, as shown in state (2) in FIG. to drive. Then, when ending the exposure process, the control unit 17 drives the shutter 3 so that the light blocking member 31B of the shutter 3 is arranged on the optical path as shown in state (3) in FIG. The control unit 17 causes the detection unit 8 to detect light in this state (3), and obtains the detection result (light intensity B01).

また、次のショット領域の露光処理を開始する場合には、制御部17は、図3の状態(4)に示すように、シャッタ3の光通過領域32が光路上に配置されるようにシャッタ3を駆動する。そして、露光処理を終了する場合には、制御部17は、図3の状態(5)に示すように、シャッタ3の遮光部材31Cが光路上に配置されるようにシャッタ3を駆動する。制御部17は、この状態(5)において検出部8に光の検出を行わせ、その検出結果(光強度C01)を得る。図3に示す例では、遮光部材31Cに異常が生じているため、状態(5)で得られた光強度C01は、状態(1)で得られた光強度A01、および、状態(3)で得られた光強度B01と比べて高くなる。 When starting exposure processing for the next shot area, the control unit 17 causes the shutter 3 to be positioned so that the light passing area 32 of the shutter 3 is positioned on the optical path, as shown in state (4) in FIG. drive 3; Then, when ending the exposure process, the control unit 17 drives the shutter 3 so that the light shielding member 31C of the shutter 3 is arranged on the optical path as shown in state (5) in FIG. The control unit 17 causes the detection unit 8 to detect light in this state (5), and obtains the detection result (light intensity C01). In the example shown in FIG. 3, since the light shielding member 31C has an abnormality, the light intensity C01 obtained in the state (5) is the light intensity A01 obtained in the state (1) and the light intensity A01 obtained in the state (3). It is higher than the obtained light intensity B01.

次に、遮光部材31C(第1遮光部材)の異常の検知方法について、図4を参照しながら説明する。図4は、第1遮光部材の異常の検知方法を示すフローチャートである。以下では、遮光部材31Cを第1遮光部材とし、当該遮光部材31Cの異常の検知を行う例について説明する。この例では、図3の状態(5)が第1状態に対応し、図3の状態(1)および(3)が第2状態に対応しうる。なお、以下に説明する異常の検知方法は、遮光部材31Cを第1遮光部材とする場合に限られず、遮光部材31A~31Bの各々を第1遮光部材とした場合にも同様に適用することができる。 Next, a method for detecting an abnormality of the light shielding member 31C (first light shielding member) will be described with reference to FIG. FIG. 4 is a flow chart showing a method of detecting abnormality of the first light shielding member. In the following, an example will be described in which the light shielding member 31C is used as the first light shielding member and an abnormality of the light shielding member 31C is detected. In this example, state (5) of FIG. 3 may correspond to the first state, and states (1) and (3) of FIG. 3 may correspond to the second state. The abnormality detection method described below is not limited to the case where the light shielding member 31C is used as the first light shielding member. can.

S11では、制御部17は、光源部LSからの光の光路上に遮光部材31C(第1遮光部材)が配置された第1状態であるか否かを判断する。遮光部材31Cが光路上に配置されていない場合にはS11を繰り返し、遮光部材31Cが光路上に配置された場合にはS12に進む。S12では、制御部17は、遮光部材31Cが光路上に配置された状態で検出部8に光(光強度)を検出させ、その検出結果(光強度C01)をメモリ(記憶部)に記憶する。 In S11, the controller 17 determines whether or not it is in the first state in which the light shielding member 31C (first light shielding member) is arranged on the optical path of the light from the light source unit LS. When the light shielding member 31C is not placed on the optical path, S11 is repeated, and when the light shielding member 31C is placed on the optical path, the process proceeds to S12. In S12, the control unit 17 causes the detection unit 8 to detect light (light intensity) while the light shielding member 31C is arranged on the optical path, and stores the detection result (light intensity C01) in the memory (storage unit). .

S13では、制御部17は、S12で得られた検出部8の検出結果と、他の遮光部材31A~31Bを光路上に配置した状態(第2状態)で得られた検出部8の検出結果とを比較し、それらの差分を求める。例えば、制御部17は、上述したように、遮光部材31A~31Bを光路上に配置したときに検出部8に光(光強度)を検出させ、その検出結果(光強度A01、光強度B01)をメモリに記憶している。制御部17は、その検出結果のうち最新のものを記憶部から読み出し、S12で得られた検出部8の検出結果との差分を求める。具体的には、制御部17は、遮光部材31Cを光路上に配置したときに検出部8で得られた光強度C01と、遮光部材31Aを光路上に配置したときに検出部8で得られた光強度A01との差分(|C01-A01|)を求める。同様に、制御部17は、遮光部材31Cを光路上に配置したときに検出部8で得られた光強度C01と、遮光部材31Bを光路上に配置したときに検出部8で得られた光強度B01との差分(|C01-B01|)を求める。 In S13, the control unit 17 combines the detection result of the detection unit 8 obtained in S12 and the detection result of the detection unit 8 obtained in the state (second state) in which the other light blocking members 31A and 31B are arranged on the optical path. and find the difference between them. For example, as described above, the control unit 17 causes the detection unit 8 to detect light (light intensity) when the light shielding members 31A to 31B are arranged on the optical path, and the detection results (light intensity A01, light intensity B01). is stored in memory. The control unit 17 reads out the latest one of the detection results from the storage unit, and obtains the difference from the detection result of the detection unit 8 obtained in S12. Specifically, the control unit 17 controls the light intensity C01 obtained by the detection unit 8 when the light shielding member 31C is arranged on the optical path and the light intensity C01 obtained by the detection unit 8 when the light shielding member 31A is arranged on the optical path. Then, the difference (|C01-A01|) from the light intensity A01 obtained is obtained. Similarly, the control unit 17 controls the light intensity C01 obtained by the detection unit 8 when the light shielding member 31C is arranged on the optical path and the light intensity C01 obtained by the detection unit 8 when the light shielding member 31B is arranged on the optical path. A difference (|C01-B01|) from the intensity B01 is obtained.

S14では、制御部17は、S13で得られた差分が閾値以上であるか否かを判断する。閾値は、例えば、検出部8の検出結果に生じるノイズ成分および遮光部材31の個体差などを分離することができる値に設定されるとよく、実験やシミュレーションなどによって決定されうる。S13で得られた差分が閾値未満である場合には、遮光部材31Cに異常がないとしてS15に進む。S15では、制御部17は、遮光部材31C(第1遮光部材)の異常検知を終了するか否かを判断する。例えば、制御部17は、基板における複数のショット領域の各々に対して露光処理が終了した場合に遮光部材31Cの異常の検知を終了すると判断してもよい。遮光部材31Cの異常検知を引き続き行う場合にはS11に戻る。 In S14, the control unit 17 determines whether or not the difference obtained in S13 is greater than or equal to the threshold. The threshold is preferably set to a value capable of separating noise components occurring in the detection result of the detection unit 8 and individual differences of the light shielding member 31, and can be determined by experiments, simulations, or the like. If the difference obtained in S13 is less than the threshold, it is determined that there is no abnormality in the light blocking member 31C, and the process proceeds to S15. In S15, the control unit 17 determines whether or not to terminate the abnormality detection of the light shielding member 31C (first light shielding member). For example, the control unit 17 may determine that detection of the abnormality of the light shielding member 31C is finished when exposure processing is finished for each of a plurality of shot areas on the substrate. If the abnormality detection of the light blocking member 31C is to be continued, the process returns to S11.

一方、S14の工程において、S13で得られた差分が閾値以上である場合には、遮光部材31Cの異常を検知したとしてS16に進む。S16では、制御部17は、遮光部材31Cの異常を検知した旨を報知する。遮光部材31Cの異常を検知した旨の報知方法としては、露光装置100に設けられた表示部(ディスプレイ)に当該旨を表示する方法であってもよいし、ユーザのコンピュータに当該旨を送信する方法であってもよい。また、制御部17は、遮光部材31Cの異常を検知した旨に加えて又は代わりに、シャッタ3の交換を促す情報を報知してもよい。 On the other hand, in the process of S14, when the difference obtained in S13 is equal to or greater than the threshold value, it is assumed that an abnormality of the light blocking member 31C is detected, and the process proceeds to S16. In S16, the controller 17 notifies that an abnormality of the light blocking member 31C has been detected. As a method of notifying that the abnormality of the light shielding member 31C has been detected, a method of displaying the fact on a display unit (display) provided in the exposure apparatus 100 may be used, or a method of transmitting the fact to the user's computer may be used. It can be a method. In addition to or instead of detecting the abnormality of the light shielding member 31C, the control unit 17 may notify information prompting replacement of the shutter 3. FIG.

上述したように、本実施形態の露光装置100は、シャッタ3を構成する複数の遮光部材31の各々を光路上に配置した状態での検出部8の検出結果を比較することにより、各遮光部材31の異常を検知する。例えば、遮光部材31Cを光路上に配置した第1状態での検出部8の検出結果と、他の遮光部材31A、31Bを光路上に配置した第2状態での検出部8の検出結果とを比較することにより、遮光部材31Cの異常を検知することができる。つまり、本実施形態によれば、遮光部材からの微小な漏れ光を検出して、当該遮光部材の異常を精度よく検知することができる。 As described above, the exposure apparatus 100 of the present embodiment compares the detection results of the detection unit 8 when each of the plurality of light shielding members 31 constituting the shutter 3 is arranged on the optical path, so that each light shielding member 31 abnormalities are detected. For example, the detection result of the detection unit 8 in the first state in which the light shielding member 31C is arranged on the optical path and the detection result of the detection unit 8 in the second state in which the other light shielding members 31A and 31B are arranged on the optical path. Abnormality of the light shielding member 31C can be detected by the comparison. In other words, according to the present embodiment, it is possible to detect an abnormality of the light shielding member with high accuracy by detecting minute light leakage from the light shielding member.

<第2実施形態>
本発明に係る第2実施形態について説明する。本実施形態では、第1遮光部材を光路上に配置した第1状態での検出部8の検出結果の経時変化と、検出部8への光の入射を遮断した第2状態での検出部8の検出結果の経時変化とを比較することにより、第1遮光部材の異常を検知する。本実施形態は、第1実施形態を基本的に引き継ぐものであり、露光装置の構成および用語の定義など第1実施形態と同様のものについては、ここでの説明を省略する。
<Second embodiment>
A second embodiment according to the present invention will be described. In this embodiment, the change over time of the detection result of the detection unit 8 in the first state in which the first light shielding member is arranged on the optical path, and the detection unit 8 in the second state in which the incidence of light to the detection unit 8 is blocked. The abnormality of the first light shielding member is detected by comparing the detection result of (1) with the change over time. The present embodiment basically inherits the first embodiment, and descriptions of the same elements as the first embodiment, such as the configuration of the exposure apparatus and definitions of terms, will be omitted here.

本実施形態におけるシャッタ3の遮光部材31の異常を検知する方法について説明する。本実施形態における遮光部材31の異常の検知方法は、図4に示すフローチャートに従って行われうるが、S13の工程が第1実施形態と異なる。以下では、第1実施形態と異なるS13の工程について説明する。 A method for detecting an abnormality of the light blocking member 31 of the shutter 3 in this embodiment will be described. The method of detecting an abnormality of the light shielding member 31 in this embodiment can be performed according to the flowchart shown in FIG. 4, but the step of S13 is different from that in the first embodiment. The step of S13, which is different from the first embodiment, will be described below.

本実施形態におけるS13では、制御部17は、第1状態で得られた検出部8の検出結果の経時変化と、第2状態で得られた検出部8の検出結果の経時変化とを比較し、それらの差分を求める。具体的には、制御部17は、遮光部材31Cを光路上に配置した第1状態で得られた検出部8の検出結果の経時変化と、他の遮光部材31A~31Bを光路上に配置した第2状態で得られた検出部8の検出結果の経時変化とを比較し、それらの差分を求める。本工程について、図5を参照しながら説明する。図5は、シャッタ3を構成する複数の遮光部材31の各々について、光源部LSからの光の光路上に配置した回数(即ち、遮光回数)と検出部8の検出結果(光強度)との対応関係を示す図である。図5では、シャッタ3を構成する複数の遮光部材31A~31Cの各々のついて11回の遮光が行われ、各遮光時に検出部8で検出された光強度が示されている。 In S13 in the present embodiment, the control unit 17 compares the change over time of the detection result of the detection unit 8 obtained in the first state with the change over time of the detection result of the detection unit 8 obtained in the second state. , find the difference between them. Specifically, the control unit 17 changes over time the detection result of the detection unit 8 obtained in the first state in which the light shielding member 31C is arranged on the optical path, and the other light shielding members 31A to 31B are arranged in the optical path. The change over time of the detection result of the detection unit 8 obtained in the second state is compared with the change over time, and the difference between them is obtained. This step will be described with reference to FIG. FIG. 5 shows the number of times each of the plurality of light shielding members 31 constituting the shutter 3 is arranged on the optical path of the light from the light source unit LS (that is, the number of light shielding times) and the detection result (light intensity) of the detection unit 8. It is a figure which shows correspondence. In FIG. 5, each of the plurality of light shielding members 31A to 31C forming the shutter 3 is shielded 11 times, and the light intensity detected by the detector 8 during each light shielding is shown.

例えば、制御部17は、遮光部材31Cについて、今回(11回目)の遮光時に検出部8で検出された光強度C11と前回(10回目)の遮光時に検出部8で検出された光強度C10との変化ΔC(=C11-C10)を求める。また、制御部17は、遮光部材31A~31Bの各々について、今回(11回目)と前回(10回目)とでの光強度の変化ΔA(=A11-A10)、ΔB(=B11-B10)を経時変化として求める。そして、制御部17は、遮光部材同士で、求めた変化の差分を求める。具体的には、制御部17は、遮光部材31Cについての変化ΔCと、遮光部材31Aについての変化ΔAとの差分(|ΔC-ΔA|)を求める。同様に、制御部17は、遮光部材31Cについての変化ΔCと、遮光部材31Bについての変化ΔBとの差分(|ΔC-ΔB|)を求める。 For example, with respect to the light shielding member 31C, the control unit 17 determines the light intensity C11 detected by the detection unit 8 at the current (11th) light shielding and the light intensity C10 detected by the detection unit 8 at the previous (10th) light shielding. change ΔC (=C11-C10). In addition, the control unit 17 calculates changes ΔA (=A11−A10) and ΔB (=B11−B10) in light intensity between this time (11th time) and the previous time (10th time) for each of the light shielding members 31A to 31B. Obtained as change over time. Then, the control unit 17 obtains the difference between the obtained changes between the light shielding members. Specifically, the control unit 17 obtains the difference (|ΔC−ΔA|) between the change ΔC for the light shielding member 31C and the change ΔA for the light shielding member 31A. Similarly, the control unit 17 obtains the difference (|ΔC−ΔB|) between the change ΔC for the light shielding member 31C and the change ΔB for the light shielding member 31B.

このように、本実施形態では、シャッタ3を構成する複数の遮光部材31の各々について、遮光時における検出部8の検出結果の経時変化を比較することにより、各遮光部材31の異常を検知する。本実施形態によっても、第1実施形態と同様に、遮光部材からの微小な漏れ光を検出して、当該遮光部材の異常を精度よく検知することができる。 As described above, in the present embodiment, for each of the plurality of light shielding members 31 constituting the shutter 3, the abnormality of each light shielding member 31 is detected by comparing the change over time of the detection result of the detection unit 8 when the light is shielded. . According to the present embodiment, similarly to the first embodiment, it is possible to detect an abnormality of the light shielding member with high accuracy by detecting minute light leakage from the light shielding member.

<第3実施形態>
本発明に係る第3実施形態について説明する。第1~第2実施形態では、検出部8への光の入射を遮断した第2状態を、シャッタ3を構成する複数の遮光部材31のうち、第1遮光部材とは異なる遮光部材を用いて生成する方法について説明した。本実施形態では、シャッタ3から離間して設けられて光源部LSからの光を遮断する第2遮光部材を用いて当該第2状態を生成する方法について説明する。ここで、本実施形態は、第1~第2実施形態を基本的に引き継ぐものであり、露光装置の基本構成および用語の定義など第1~第2実施形態と同様のものについては、ここでの説明を省略する。
<Third Embodiment>
A third embodiment according to the present invention will be described. In the first and second embodiments, the second state in which light is blocked from entering the detection unit 8 is obtained by using a light shielding member different from the first light shielding member among the plurality of light shielding members 31 constituting the shutter 3. I explained how to generate it. In this embodiment, a method of generating the second state using a second light blocking member that is provided apart from the shutter 3 and blocks light from the light source section LS will be described. Here, the present embodiment basically inherits the first and second embodiments, and the basic configuration of the exposure apparatus and definitions of terms, etc., which are the same as those of the first and second embodiments, will be described here. is omitted.

図6は、本実施形態の露光装置の構成を示す図である。本実施形態では、光源部LSと検出部8との間の光路上に挿入可能な第2遮光部材50が設けられる。第2遮光部材50は、例えば、光源部LSからの光を遮断する部材であり、図6に示す例では、不図示の駆動機構によって光源部LSとシャッタ3との間の光路上に挿入される。制御部17は、第2遮光部材50を光路上に挿入することにより、検出部8への光の入射を遮断した第2状態を生成し、その第2状態における検出部8の検出結果(光強度)を事前に取得してメモリ(記憶部)に記憶しておく。 FIG. 6 is a diagram showing the configuration of the exposure apparatus of this embodiment. In this embodiment, a second light blocking member 50 that can be inserted into the optical path between the light source unit LS and the detection unit 8 is provided. The second light shielding member 50 is, for example, a member that blocks light from the light source unit LS, and in the example shown in FIG. be. The control unit 17 inserts the second light shielding member 50 into the optical path to generate a second state in which light is blocked from entering the detection unit 8, and displays the detection result (light strength) is acquired in advance and stored in a memory (storage unit).

本実施形態におけるシャッタ3の遮光部材31の異常を検知する方法について説明する。本実施形態における遮光部材31の異常の検知方法は、第2遮光部材50を光路上から外した状態において、図4に示すフローチャートに従って行われうるが、S13の工程が第1実施形態と異なる。本実施形態におけるS13では、制御部17は、S12で得られた検出部8の検出結果と、第2遮光部材50を光路上に挿入した状態(第2状態)で事前に得られた検出部8の検出結果とを比較し、それらの差分を求める。 A method for detecting an abnormality of the light blocking member 31 of the shutter 3 in this embodiment will be described. The method of detecting an abnormality of the light shielding member 31 in this embodiment can be performed according to the flowchart shown in FIG. In S13 in the present embodiment, the control unit 17 combines the detection result of the detection unit 8 obtained in S12 with the detection unit obtained in advance with the second light shielding member 50 inserted into the optical path (second state). 8 and the difference between them is calculated.

このように、本実施形態では、シャッタ3の第1遮光部材を光路上に配置した第1状態での検出部8の検出結果と、第2遮光部材50を光路上に挿入した第2状態での検出部8の検出結果とを比較することにより、第1遮光部材の異常を検知する。第1遮光部材としては、シャッタ3を構成する複数の遮光部材31の各々が適用されうる。本実施形態によっても、第1~第2実施形態と同様に、遮光部材からの微小な漏れ光を検出して、当該遮光部材の異常を精度よく検知することができる。 As described above, in this embodiment, the detection result of the detection unit 8 in the first state in which the first light shielding member of the shutter 3 is arranged on the optical path and the detection result in the second state in which the second light shielding member 50 is inserted on the optical path The abnormality of the first light shielding member is detected by comparing the detection result of the detection unit 8 with the detection result of the first light shielding member. As the first light shielding member, each of the plurality of light shielding members 31 forming the shutter 3 can be applied. Also according to the present embodiment, as in the first and second embodiments, it is possible to detect an abnormality of the light shielding member with high accuracy by detecting minute light leakage from the light shielding member.

ここで、本実施形態では、第2遮光部材50を光路上に挿入することにより、検出部8への光の入射を遮断した第2状態を生成したが、それに限られるものではない。例えば、第2遮光部材50を用いずに、光源部LS(光源1)を消灯することにより第2状態を生成してもよい。この場合においても、制御部17は、第2状態における検出部8の検出結果(光強度)を事前に取得してメモリ(記憶部)に記憶しておくとよい。 Here, in the present embodiment, by inserting the second light shielding member 50 into the optical path, the second state in which light is blocked from entering the detection unit 8 is generated, but the present invention is not limited to this. For example, without using the second light shielding member 50, the second state may be generated by turning off the light source unit LS (light source 1). Also in this case, the control unit 17 preferably obtains in advance the detection result (light intensity) of the detection unit 8 in the second state and stores it in the memory (storage unit).

<第4実施形態>
本発明に係る第4実施形態について説明する。本実施形態では、第1遮光部材の異常を検知した場合におけるシャッタ3の駆動の制御方法について説明する。本実施形態は、第1~第3実施形態を基本的に引き継ぐものであり、露光装置の構成および用語の定義など第1~第3実施形態と同様のものについては、ここでの説明を省略する。
<Fourth Embodiment>
A fourth embodiment according to the present invention will be described. In the present embodiment, a method of controlling driving of the shutter 3 when an abnormality of the first light shielding member is detected will be described. This embodiment basically inherits the first to third embodiments, and descriptions of the same elements as those in the first to third embodiments, such as the configuration of the exposure apparatus and definitions of terms, are omitted here. do.

本実施形態の露光装置(制御部17)は、複数の遮光部材31のうち第1遮光部材(例えば遮光部材31C)の異常を検知した場合、第1遮光部材を除く残りの遮光部材(例えば遮光部材31A、31B)を用いて遮光を行うようにシャッタ3の駆動を制御する。つまり、本実施形態の露光装置は、シャッタ3を構成する複数の遮光部材31のうち異常を有する遮光部材が検知された場合、当該異常を有する遮光部材を用いずに、残りの遮光部材を用いて基板の露光処理を継続する。以下に、本実施形態における基板の露光処理について、図7を参照しながら説明する。図7は、本実施形態における基板の露光処理を示すフローチャートである。 When an abnormality is detected in the first light shielding member (for example, the light shielding member 31C) among the plurality of light shielding members 31, the exposure apparatus (control unit 17) of the present embodiment detects the light shielding members other than the first light shielding member (for example, the light shielding member 31C). The driving of the shutter 3 is controlled so as to block light using the members 31A and 31B). In other words, when an abnormal light shielding member is detected among the plurality of light shielding members 31 forming the shutter 3, the exposure apparatus of the present embodiment does not use the abnormal light shielding member and uses the remaining light shielding members. to continue exposure processing of the substrate. The exposure processing of the substrate in this embodiment will be described below with reference to FIG. FIG. 7 is a flowchart showing substrate exposure processing in this embodiment.

S21では、制御部17は、シャッタ3を構成する複数の遮光部材31のうち、異常が検知された遮光部材31があるか否かを判断する。以下では、異常が検知された遮光部材31を「異常遮光部材」と呼ぶことがある。異常遮光部材がある場合にはS22に進み、異常遮光部材がない場合にはS24に進む。S22では、制御部17は、次の遮光に用いられる予定の遮光部材31(次の遮光部材31)が異常遮光部材であるか否かを判断する。次の遮光部材31が異常遮光部材である場合にはS23に進み、次の遮光部材31が異常遮光部材でない場合にはS24に進む。 In S<b>21 , the control unit 17 determines whether or not there is a light shielding member 31 for which an abnormality has been detected among the plurality of light shielding members 31 forming the shutter 3 . Hereinafter, the light shielding member 31 for which an abnormality has been detected may be referred to as an "abnormal light shielding member". If there is an abnormal light shielding member, the process proceeds to S22, and if there is no abnormal light shielding member, the process proceeds to S24. In S22, the control unit 17 determines whether or not the light shielding member 31 scheduled to be used for the next light shielding (the next light shielding member 31) is an abnormal light shielding member. If the next light shielding member 31 is an abnormal light shielding member, the process proceeds to S23, and if the next light shielding member 31 is not an abnormal light shielding member, the process proceeds to S24.

S23では、制御部17は、シャッタ3の回転方向の設定を変更する。例えば、制御部17は、シャッタ3の回転方向の設定を、これまでの回転方向とは逆の回転方向に変更する。この工程により、シャッタ3を構成する複数の遮光部材31のうち、異常遮光部材を用いずに、異常遮光部材を除く残りの遮光部材を用いて基板の露光処理を継続することができる。 In S<b>23 , the control unit 17 changes the setting of the rotation direction of the shutter 3 . For example, the control unit 17 changes the rotation direction setting of the shutter 3 to a rotation direction opposite to the previous rotation direction. By this process, the exposure processing of the substrate can be continued using the remaining light shielding members excluding the abnormal light shielding members without using the abnormal light shielding members among the plurality of light shielding members 31 constituting the shutter 3 .

S24では、制御部17は、基板における複数のショット領域のうち、露光を行う対象のショット領域(対象ショット領域)に対して露光処理を行う。具体的には、制御部17は、シャッタ3を回転駆動して光源部LSからの光を光通過領域32で通過させ、その後、基板の露光量が目標露光量になるように、シャッタ3を回転駆動して光源部LSからの光を遮光部材31で遮断する。このとき、S23でシャッタ3の回転方向の設定が変更されている場合には、制御部17は、変更後の回転方向でシャッタ3の回転駆動を行うことにより光源部LSからの光の通過と遮断とを制御する。 In S24, the control unit 17 performs exposure processing on a target shot area (target shot area) to be exposed among the plurality of shot areas on the substrate. Specifically, the control unit 17 rotates the shutter 3 to allow the light from the light source unit LS to pass through the light passage area 32, and then rotates the shutter 3 so that the exposure amount of the substrate reaches the target exposure amount. The light from the light source section LS is blocked by the light blocking member 31 which is rotationally driven. At this time, if the setting of the rotation direction of the shutter 3 has been changed in S23, the control unit 17 rotates the shutter 3 in the changed rotation direction so that the light from the light source unit LS does not pass through. block and control.

S25では、制御部17は、シャッタ3を構成する複数の遮光部材31のうち、光源部LSからの光の光路上に現在配置されている遮光部材の異常を検知する。具体的には、光路上に現在配置されている遮光部材を第1遮光部材とすると、制御部17は、第1遮光部材が光路上に配置されている第1状態で検出部8に光(光強度)を検出させる。そして、制御部17は、第1状態での検出部8の検出結果と、検出部8への光の入射を遮断した第2状態での検出部8の検出結果とを比較することにより、当該第1遮光部材の異常を検知する。本工程における第1遮光部材の異常の検知は、例えば、図4に示すフローチャートに従って行われうる。 In S<b>25 , the control unit 17 detects an abnormality of the light shielding member currently arranged on the optical path of the light from the light source unit LS among the plurality of light shielding members 31 forming the shutter 3 . Specifically, assuming that the light shielding member currently arranged on the optical path is the first light shielding member, the control unit 17 causes the detection unit 8 to emit light ( light intensity) is detected. Then, the control unit 17 compares the detection result of the detection unit 8 in the first state with the detection result of the detection unit 8 in the second state in which the incidence of light to the detection unit 8 is blocked, thereby An abnormality of the first light shielding member is detected. The detection of abnormality of the first light shielding member in this step can be performed according to the flowchart shown in FIG. 4, for example.

S26では、制御部17は、基板における複数のショット領域の全てに対して露光処理を行ったか否かを判定する。露光処理を行っていないショット領域がある場合にはS21に戻り、露光処理を行っていないショット領域を対象ショット領域に設定して露光処理を行う。一方、全てのショット領域に対して露光処理を行った場合には終了する。 In S26, the control unit 17 determines whether or not exposure processing has been performed on all of the plurality of shot areas on the substrate. If there is a shot area that has not been subjected to exposure processing, the process returns to S21, sets the shot area that has not been subjected to exposure processing as the target shot area, and performs exposure processing. On the other hand, if exposure processing has been performed for all shot areas, the process ends.

次に、本実施形態におけるシャッタ3の回転駆動の一例について、図8を参照しながら説明する。図8は、シャッタ3の回転駆動の一例を示す図である。図8では、シャッタ3を構成する複数の遮光部材31のうち、遮光部材31Cに欠損(亀裂)が生じ、遮光部材31Cが異常遮光部材として特定された例を示している。 Next, an example of rotational driving of the shutter 3 in this embodiment will be described with reference to FIG. FIG. 8 is a diagram showing an example of rotational driving of the shutter 3. As shown in FIG. FIG. 8 shows an example in which the light shielding member 31C among the plurality of light shielding members 31 forming the shutter 3 is damaged (cracked) and identified as an abnormal light shielding member.

状態(1)では、S25の工程により、遮光部材31Cに異常(亀裂)が生じていると判断される(即ち、遮光部材31Cが異常遮光部材であると特定される)。また、遮光部材31Cの次に遮光で用いられる予定の遮光部材31Aは異常遮光部材ではないため、S22の工程では「No」と判断されてS24に進み、状態(2)→(3)に示すように、これまでの回転方向でシャッタ3を回転駆動して露光処理を行う。また、遮光部材31Aの次に遮光で用いられる予定の遮光部材Bも異常遮光部材ではないため、S22の工程では「No」と判断されてS24に進み、状態(4)→(5)に示すように、これまでの回転方向でシャッタ3を回転駆動して露光処理を行う。 In the state (1), it is determined in the process of S25 that the light shielding member 31C is abnormal (cracked) (that is, the light shielding member 31C is identified as an abnormal light shielding member). Further, since the light shielding member 31A, which is scheduled to be used for light shielding after the light shielding member 31C, is not an abnormal light shielding member, it is determined as "No" in the process of S22, and the process proceeds to S24 to show the state (2)→(3). , the exposure process is performed by driving the shutter 3 to rotate in the rotation direction thus far. In addition, since the light shielding member B, which is scheduled to be used for light shielding after the light shielding member 31A, is not an abnormal light shielding member, it is judged as "No" in the step of S22, and the process proceeds to S24 to show the state (4)→(5). , the exposure process is performed by driving the shutter 3 to rotate in the rotation direction thus far.

一方、遮光部材31Bの次に遮光で用いられる予定の遮光部材31Cは異常遮光部材として特定されているため、S22の工程では「Yes」と判断されてS23に進み、シャッタ3の回転方向が逆向きに設定される。そして、状態(6)→(3)に示すように、逆向きに設定された回転方向でシャッタ3を回転駆動して露光処理を行い、露光処理の終了時には遮光部材31Aで遮光する。また、変更後のシャッタ3の回転方向では、異常遮光部材として特定された遮光部材31Cが、遮光部材Aの次に遮光で用いられる予定となる。そのため、S22の工程では「Yes」と判断されてS23に進み、シャッタ3の回転方向が再び逆向きに設定される(即ち、シャッタ3の回転方向が元に戻される)。そして、状態(4)→(5)に示すように、再び逆向きに設定された回転方向でシャッタ3を回転駆動して露光処理を行い、露光処理の終了時には遮光部材31Bで遮光する。 On the other hand, the light shielding member 31C, which is scheduled to be used for light shielding after the light shielding member 31B, is specified as an abnormal light shielding member. Orientation is set. Then, as shown in states (6)→(3), the shutter 3 is rotationally driven in the reverse set rotation direction to perform the exposure process, and the light shielding member 31A shields the light at the end of the exposure process. Further, in the rotation direction of the shutter 3 after the change, the light shielding member 31C specified as the abnormal light shielding member is scheduled to be used next to the light shielding member A for light shielding. Therefore, in the process of S22, it is judged as "Yes", and the process proceeds to S23, and the rotational direction of the shutter 3 is set to be reversed again (that is, the rotational direction of the shutter 3 is returned to its original direction). Then, as shown in states (4)→(5), the shutter 3 is rotationally driven again in the opposite rotational direction to perform the exposure process, and the light shielding member 31B shields the light when the exposure process ends.

このように、本実施形態では、遮光部材31Cが異常遮光部材として特定された場合、遮光部材31A、31Bを交互に用いて遮光を行うようにシャッタ3の回転駆動を制御する。これにより、遮光部材31Cを除く残りの遮光部材31A、31Bを用いて露光処理を継続することができるため、基板の露光量を高精度に制御することができるとともに、スループットの点でも有利になりうる。 As described above, in the present embodiment, when the light shielding member 31C is identified as an abnormal light shielding member, the rotational driving of the shutter 3 is controlled so that the light shielding members 31A and 31B are alternately used to shield light. As a result, the exposure process can be continued using the remaining light shielding members 31A and 31B except for the light shielding member 31C, so that the exposure amount of the substrate can be controlled with high precision, which is advantageous in terms of throughput. sell.

<第5実施形態>
本発明に係る第5実施形態について説明する。本実施形態では、第1遮光部材の異常を検知した場合におけるシャッタ3の駆動の制御方法について説明する。本実施形態は、第1~第4実施形態を基本的に引き継ぐものであり、露光装置の構成および用語の定義など第1~第4実施形態と同様のものについては、ここでの説明を省略する。
<Fifth Embodiment>
A fifth embodiment according to the present invention will be described. In the present embodiment, a method of controlling driving of the shutter 3 when an abnormality of the first light shielding member is detected will be described. This embodiment basically inherits the first to fourth embodiments, and descriptions of the same elements as those in the first to fourth embodiments, such as the configuration of the exposure apparatus and definitions of terms, are omitted here. do.

シャッタ3の遮光部材31に異常が検知されても、露光処理で設定される目標露光量によっては、当該遮光部材31からの漏れ光による露光処理への影響が小さい場合がある。例えば、露光処理で設定される目標露光量が、漏れ光で増加されうる露光量に対して非常に大きい場合には、露光処理での遮光に用いられる遮光部材として、異常を有する遮光部材を用いることができる。しかしながら、上述したように、基板の露光量は、基板に照射される光の照度の時間積分によって定義される。つまり、異常を有する遮光部材で遮光している時間が長いほど、漏れ光による露光エネルギが蓄積されうる(即ち、漏れ光による露光量の増加が大きくなりうる)。この場合、露光処理で過露光が生じ、基板上にパターンを精度よく形成することが困難になりうる。 Even if an abnormality is detected in the light shielding member 31 of the shutter 3, the influence of light leaking from the light shielding member 31 on the exposure process may be small depending on the target exposure amount set in the exposure process. For example, if the target exposure amount set in the exposure process is much larger than the exposure amount that can be increased by leaked light, an abnormal light shielding member is used as the light shielding member used for shielding light in the exposure process. be able to. However, as described above, the exposure amount of the substrate is defined by the time integral of the illuminance of the light with which the substrate is irradiated. That is, the longer the light shielding member having an abnormality blocks the light, the more the exposure energy due to the leaked light can be accumulated (that is, the greater the increase in the exposure amount due to the leaked light). In this case, overexposure may occur in the exposure process, making it difficult to accurately form a pattern on the substrate.

特に、基板における複数のショット領域のうち、最後に露光処理を行うショット領域(以下、最後のショット領域)においては、露光処理の終了後に漏れ光に曝されている時間が他のショット領域と比べて長くなりうるため、上述した過露光が顕著になりうる。例えば、最後のショット領域では、露光処理の後に、基板の搬入および搬出、露光パターンの変更のための原版の交換などの準備が行われうる。そのため、露光処理が行われた位置から最後のショット領域を移動させるまでに時間を要し、露光処理の後に漏れ光に曝されている時間が他のショット領域と比べて長くなりうる。 In particular, among a plurality of shot areas on the substrate, the shot area that is subjected to the last exposure process (hereinafter referred to as the last shot area) has a longer exposure time to the leaked light after the exposure process than the other shot areas. can be long, so the overexposure mentioned above can be significant. For example, in the last shot area, after the exposure process, preparations such as loading and unloading of the substrate and exchange of the original for changing the exposure pattern can be performed. Therefore, it takes time to move the last shot area from the position where the exposure process was performed, and the time of exposure to leaked light after the exposure process can be longer than other shot areas.

そこで、本実施形態の露光装置(制御部17)は、最後のショット領域に対する露光処理の終了時に用いられる遮光部材が、シャッタ3を構成する複数の遮光部材31のうち異常遮光部材を除く残りの遮光部材になるように、シャッタの回転駆動を制御する。例えば、図9に示すように、基板における複数のショット領域110~116のうち、最後のショット領域116に対する露光処理の終了時に使用される予定の遮光部材が、異常遮光部材として特定された遮光部材31Cである場合を想定する。この場合、制御部17は、図10に示す例のように、最後のショット領域116に対する露光処理の終了時に使用される遮光部材が、遮光部材31Cとは異なる遮光部材31B(遮光部材31Aであってもよい)になるように、シャッタ3の回転駆動を制御する。以下に、本実施形態における基板の露光処理について、図11を参照しながら説明する。図11は、本実施形態における基板の露光処理を示すフローチャートである。 Therefore, in the exposure apparatus (control unit 17) of the present embodiment, the light shielding members used at the end of the exposure processing for the last shot area are the remaining light shielding members 31 of the plurality of light shielding members 31 constituting the shutter 3, excluding the abnormal light shielding member. Rotational drive of the shutter is controlled so as to act as a light shielding member. For example, as shown in FIG. 9, among the plurality of shot regions 110 to 116 on the substrate, the light shielding member scheduled to be used when the exposure processing for the last shot region 116 ends is the light shielding member specified as the abnormal light shielding member. 31C. In this case, as in the example shown in FIG. 10, the control unit 17 determines that the light shielding member 31B (or the light shielding member 31A) different from the light shielding member 31C is used when the exposure processing for the last shot region 116 is completed. ), the rotational drive of the shutter 3 is controlled. The exposure processing of the substrate in this embodiment will be described below with reference to FIG. FIG. 11 is a flowchart showing substrate exposure processing in this embodiment.

S31では、制御部17は、シャッタ3を構成する複数の遮光部材31のうち、異常が検知された遮光部材31(異常遮光部材)があるか否かを判断する。異常遮光部材がある場合にはS32に進み、異常遮光部材がない場合にはS35に進む。S32では、制御部17は、次に露光処理を行うショット領域(次のショット領域)が最後のショット領域か否かを判断する。次のショット領域が最後のショット領域である場合にはS33に進み、次のショット領域が最後のショット領域でない場合にはS35に進む。S33では、制御部17は、最後のショット領域に対する露光処理の終了時に使用される予定の遮光部材31(最後に使用予定の遮光部材31)が異常遮光部材であるか否かを判断する。最後に使用予定の遮光部材31が異常遮光部材である場合にはS34に進み、最後に使用予定の遮光部材31が異常遮光部材でない場合にはS35に進む。 In S<b>31 , the control unit 17 determines whether or not there is a light shielding member 31 for which an abnormality has been detected (abnormal light shielding member) among the plurality of light shielding members 31 forming the shutter 3 . If there is an abnormal light shielding member, the process proceeds to S32, and if there is no abnormal light shielding member, the process proceeds to S35. In S32, the control unit 17 determines whether the shot area (next shot area) to be exposed next is the last shot area. If the next shot area is the last shot area, the process proceeds to S33, and if the next shot area is not the last shot area, the process proceeds to S35. In S33, the control unit 17 determines whether or not the light shielding member 31 scheduled to be used at the end of the exposure process for the last shot area (light shielding member 31 scheduled to be used last) is an abnormal light shielding member. When the last light shielding member 31 to be used is an abnormal light shielding member, the process proceeds to S34, and when the last light shielding member 31 to be used is not an abnormal light shielding member, the process proceeds to S35.

S34では、制御部17は、シャッタ3の回転方向の設定を変更する。例えば、制御部17は、シャッタ3の回転方向の設定を、これまでの回転方向とは逆の回転方向に変更する。この工程により、最後のショット領域の終了時に、異常遮光部材を除く残りの遮光部材を用いて遮光が行われるように、シャッタ3の回転駆動を制御することができる。 In S<b>34 , the control unit 17 changes the setting of the rotation direction of the shutter 3 . For example, the control unit 17 changes the rotation direction setting of the shutter 3 to a rotation direction opposite to the previous rotation direction. By this process, the rotational drive of the shutter 3 can be controlled so that the remaining light shielding members excluding the abnormal light shielding member are used for light shielding at the end of the last shot area.

S35~S37は、図7に示すフローチャートのS24~S26と同様の工程である。具体的には、S35では、制御部17は、基板における複数のショット領域のうち、露光を行う対象のショット領域(対象ショット領域)に対して露光処理を行う。S36では、制御部17は、シャッタ3を構成する複数の遮光部材31のうち、光源部LSからの光の光路上に現在配置されている遮光部材の異常を検知する。本工程における第1遮光部材の異常の検知は、例えば、図4に示すフローチャートに従って行われうる。また、S37では、制御部17は、基板における複数のショット領域の全てに対して露光処理を行ったか否かを判定する。露光処理を行っていないショット領域がある場合にはS31に戻り、露光処理を行っていないショット領域を対象ショット領域に設定して露光処理を行う。一方、全てのショット領域に対して露光処理を行った場合には終了する。 S35 to S37 are the same steps as S24 to S26 in the flow chart shown in FIG. Specifically, in S<b>35 , the control unit 17 performs exposure processing on a shot area to be exposed (target shot area) among the plurality of shot areas on the substrate. In S<b>36 , the control unit 17 detects an abnormality of the light shielding member currently arranged on the optical path of the light from the light source unit LS among the plurality of light shielding members 31 forming the shutter 3 . The detection of abnormality of the first light shielding member in this step can be performed according to the flowchart shown in FIG. 4, for example. Further, in S37, the control unit 17 determines whether or not exposure processing has been performed on all of the plurality of shot areas on the substrate. If there is a shot area that has not been subjected to exposure processing, the process returns to S31, sets the shot area that has not been subjected to exposure processing as the target shot area, and performs exposure processing. On the other hand, if exposure processing has been performed for all shot areas, the process ends.

このように、本実施形態では、最後のショット領域に対する露光処理の終了時に用いられる遮光部材が、異常遮光部材を除く残りの遮光部材になるように、シャッタ3の回転駆動を制御する。これにより、最後のショット領域において、異常遮光部材からの漏れ光の影響を低減し、露光量を高精度に制御することができる。 As described above, in the present embodiment, the rotational drive of the shutter 3 is controlled so that the remaining light shielding members excluding the abnormal light shielding member are used when the exposure processing for the last shot area is completed. As a result, in the last shot area, the influence of leaked light from the abnormal light shielding member can be reduced, and the exposure amount can be controlled with high accuracy.

<第6実施形態>
本発明に係る第6実施形態について説明する。上述した第5実施形態では、最後のショット領域に対する露光処理を行う直前において、最後に使用予定の遮光部材が異常遮光部材か否かを判断し、その判断結果に応じてシャッタ3の回転駆動を制御する例について説明した。しかしながら、それに限られず、最後に使用予定の遮光部材が異常遮光部材となることが事前に把握されうる場合には、当該把握した時点においてシャッタ3の回転駆動を制御してもよい。本実施形態では、最後に使用予定の遮光部材が異常遮光部材となることが事前に把握された場合にシャッタ3の回転駆動を制御する例について、図12を参照しながら説明する。図12は、本実施形態における基板の露光処理を示すフローチャートである。
<Sixth embodiment>
A sixth embodiment according to the present invention will be described. In the above-described fifth embodiment, it is determined whether or not the last light shielding member to be used is an abnormal light shielding member immediately before the exposure processing for the last shot area is performed, and the rotation of the shutter 3 is driven according to the determination result. An example of controlling has been described. However, the present invention is not limited to this, and when it can be grasped in advance that the light shielding member to be used last will be an abnormal light shielding member, the rotational driving of the shutter 3 may be controlled at the time of the grasping. In the present embodiment, an example of controlling the rotational drive of the shutter 3 when it is determined in advance that the light shielding member to be used last will be the abnormal light shielding member will be described with reference to FIG. 12 . FIG. 12 is a flowchart showing substrate exposure processing in this embodiment.

S41では、制御部17は、シャッタ3を構成する複数の遮光部材31のうち、異常が検知された遮光部材31(異常遮光部材)があるか否かを判断する。異常遮光部材がある場合にはS42に進み、異常遮光部材がない場合にはS44に進む。S42では、制御部17は、このままのシャッタ3の回転駆動で各ショット領域に対する露光処理を進めていった場合、最後に使用予定の遮光部材31が異常遮光部材になるか否かを判断する。最後に使用予定の遮光部材31が異常遮光部材になる場合にはS43に進み、最後に使用予定の遮光部材31が異常遮光部材にならない場合にはS44に進む。 In S<b>41 , the control unit 17 determines whether or not there is a light shielding member 31 for which an abnormality has been detected (abnormal light shielding member) among the plurality of light shielding members 31 forming the shutter 3 . If there is an abnormal light shielding member, the process proceeds to S42, and if there is no abnormal light shielding member, the process proceeds to S44. In S42, the control unit 17 determines whether or not the light shielding member 31 to be used last becomes an abnormal light shielding member when the exposure processing for each shot area is continued while the shutter 3 is rotationally driven. When the last light shielding member 31 to be used becomes an abnormal light shielding member, the process proceeds to S43, and when the last light shielding member 31 to be used does not become an abnormal light shielding member, the process proceeds to S44.

S43では、制御部17は、シャッタ3の回転方向の設定を変更する。例えば、制御部17は、シャッタ3の回転方向の設定を、これまでの回転方向とは逆の回転方向に変更する。この工程により、最後のショット領域の終了時に、異常遮光部材を除く残りの遮光部材を用いて遮光が行われるように、シャッタ3の回転駆動を制御することができる。 In S<b>43 , the control unit 17 changes the setting of the rotation direction of the shutter 3 . For example, the control unit 17 changes the rotation direction setting of the shutter 3 to a rotation direction opposite to the previous rotation direction. By this process, the rotational drive of the shutter 3 can be controlled so that the remaining light shielding members excluding the abnormal light shielding member are used for light shielding at the end of the last shot area.

S44~S46は、図7に示すフローチャートのS24~S26と同様の工程である。具体的には、S44では、制御部17は、基板における複数のショット領域のうち、露光を行う対象のショット領域(対象ショット領域)に対して露光処理を行う。S45では、制御部17は、シャッタ3を構成する複数の遮光部材31のうち、光源部LSからの光の光路上に現在配置されている遮光部材の異常を検知する。本工程における第1遮光部材の異常の検知は、例えば、図4に示すフローチャートに従って行われうる。また、S46では、制御部17は、基板における複数のショット領域の全てに対して露光処理を行ったか否かを判定する。露光処理を行っていないショット領域がある場合にはS41に戻り、露光処理を行っていないショット領域を対象ショット領域に設定して露光処理を行う。一方、全てのショット領域に対して露光処理を行った場合には終了する。 S44 to S46 are the same steps as S24 to S26 in the flow chart shown in FIG. Specifically, in S<b>44 , the control unit 17 performs exposure processing on a shot area to be exposed (target shot area) among the plurality of shot areas on the substrate. In S<b>45 , the control unit 17 detects an abnormality of the light shielding member currently arranged on the optical path of the light from the light source unit LS among the plurality of light shielding members 31 forming the shutter 3 . The detection of abnormality of the first light shielding member in this step can be performed according to the flowchart shown in FIG. 4, for example. Also, in S46, the control unit 17 determines whether or not the exposure processing has been performed on all of the plurality of shot areas on the substrate. If there is a shot area that has not been subjected to exposure processing, the process returns to S41, sets the shot area that has not been subjected to exposure processing as the target shot area, and performs exposure processing. On the other hand, if exposure processing has been performed for all shot areas, the process ends.

このように、本実施形態では、最後のショット領域に対する露光処理の終了時に用いられる遮光部材が、異常遮光部材を除く残りの遮光部材になるように、シャッタ3の回転駆動を制御する。これにより、第5実施形態と同様に、最後のショット領域において、異常遮光部材からの漏れ光の影響を低減し、露光量を高精度に制御することができる。 As described above, in the present embodiment, the rotational drive of the shutter 3 is controlled so that the remaining light shielding members excluding the abnormal light shielding member are used when the exposure processing for the last shot area is completed. As a result, similarly to the fifth embodiment, in the last shot area, the influence of leaked light from the abnormal light shielding member can be reduced, and the exposure amount can be controlled with high precision.

<物品の製造方法の実施形態>
本発明の実施形態にかかる物品の製造方法は、例えば、半導体デバイス等のマイクロデバイスや微細構造を有する素子等の物品を製造するのに好適である。本実施形態の物品の製造方法は、基板に塗布された感光剤に上記の露光装置を用いて潜像パターンを形成する工程(基板を露光する工程)と、かかる工程で潜像パターンが形成された基板を現像(加工)する工程とを含む。更に、かかる製造方法は、他の周知の工程(酸化、成膜、蒸着、ドーピング、平坦化、エッチング、レジスト剥離、ダイシング、ボンディング、パッケージング等)を含む。本実施形態の物品の製造方法は、従来の方法に比べて、物品の性能・品質・生産性・生産コストの少なくとも1つにおいて有利である。
<Embodiment of method for manufacturing article>
The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the exposure apparatus (the step of exposing the substrate), and a step of forming the latent image pattern in this step. and developing (processing) the substrate. In addition, such manufacturing methods include other well-known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of article performance, quality, productivity, and production cost compared to conventional methods.

発明は上記実施形態に制限されるものではなく、発明の精神及び範囲から離脱することなく、様々な変更及び変形が可能である。従って、発明の範囲を公にするために請求項を添付する。 The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to make public the scope of the invention.

1:光源、3:シャッタ、31:遮光部材、32:光通過領域、8:検出部、17:制御部、50:第2遮光部材、100:露光装置 1: light source, 3: shutter, 31: light shielding member, 32: light passing area, 8: detection unit, 17: control unit, 50: second light shielding member, 100: exposure device

Claims (10)

基板を露光する露光装置であって、
光源からの光を遮断する第1遮光部材を有するシャッタと、
前記シャッタを通過した前記光を検出する検出部と、
前記シャッタを駆動することにより前記基板の露光処理を制御する制御部と、
を含み、
前記制御部は、前記第1遮光部材が前記光の光路に配置された第1状態での前記検出部の検出結果と、前記第1遮光部材が前記光の光路に配置されずに前記検出部への前記光の入射が遮断された第2状態での前記検出部の検出結果とを比較することにより、前記第1遮光部材の異常を検知する、ことを特徴とする露光装置。
An exposure apparatus for exposing a substrate,
a shutter having a first light blocking member that blocks light from a light source;
a detection unit that detects the light that has passed through the shutter;
a control unit that controls exposure processing of the substrate by driving the shutter;
including
The control unit controls the detection result of the detection unit in a first state in which the first light shielding member is arranged in the optical path of the light, and the detection unit in the state in which the first light shielding member is not arranged in the optical path of the light. and detecting an abnormality of the first light shielding member by comparing the detection result of the detection unit in a second state in which the light is blocked from entering the exposure apparatus.
前記シャッタは、前記第1遮光部材を含む複数の遮光部材を有し、前記複数の遮光部材間の光通過領域で前記光を通過させるように構成され、
前記制御部は、前記第2状態において、前記複数の遮光部材のうち前記第1遮光部材とは異なる遮光部材が前記光の光路に配置されるように前記シャッタの駆動を制御する、ことを特徴とする請求項1に記載の露光装置。
The shutter has a plurality of light shielding members including the first light shielding member, and is configured to allow the light to pass through a light passage region between the plurality of light shielding members,
The control unit controls driving of the shutter so that, in the second state, a light shielding member different from the first light shielding member among the plurality of light shielding members is arranged in the optical path of the light. 2. The exposure apparatus according to claim 1, wherein:
前記制御部は、前記第1状態における前記検出部の検出結果の経時変化と、前記第2状態における前記検出部の検出結果の経時変化とを比較することにより、前記第1遮光部材の異常を検知する、ことを特徴とする請求項2に記載の露光装置。 The control unit detects an abnormality of the first light shielding member by comparing the change over time of the detection result of the detection unit in the first state with the change over time of the detection result of the detection unit in the second state. 3. The exposure apparatus according to claim 2, wherein the detection is performed. 前記シャッタから離間して設けられて前記光を遮断する第2遮光部材を更に含み、
前記制御部は、前記第2状態において、前記光源と前記検出部との間の光路に前記第2遮光部材を挿入する、ことを特徴とする請求項に記載の露光装置。
further comprising a second light shielding member spaced apart from the shutter and shielding the light;
2. An exposure apparatus according to claim 1 , wherein said control section inserts said second light blocking member into an optical path between said light source and said detection section in said second state.
前記制御部は、前記第2状態において、前記光源を消灯する、ことを特徴とする請求項に記載の露光装置。 2. The exposure apparatus according to claim 1 , wherein said control section turns off said light source in said second state. 前記シャッタは、前記第1遮光部材を含む複数の遮光部材を有し、前記複数の遮光部材間の光通過領域で前記光を通過させるように構成され、
前記制御部は、前記第1遮光部材の異常を検知した場合、前記複数の遮光部材のうち前記第1遮光部材を除く残りの遮光部材を用いて前記光の遮断を行うように前記シャッタの駆動を制御する、ことを特徴とする請求項1乃至5のいずれか1項に記載の露光装置。
The shutter has a plurality of light shielding members including the first light shielding member, and is configured to allow the light to pass through a light passage region between the plurality of light shielding members,
The controller drives the shutter so as to block the light using the remaining light shielding members of the plurality of light shielding members excluding the first light shielding member when an abnormality of the first light shielding member is detected. 6. The exposure apparatus according to any one of claims 1 to 5, wherein the exposure apparatus controls
前記シャッタは、前記第1遮光部材を含む複数の遮光部材を有し、前記複数の遮光部材間の光通過領域で光を通過させるように構成され、
前記基板は、前記露光処理がそれぞれ行われる複数のショット領域を含み、
前記制御部は、前記第1遮光部材の異常を検知した場合、前記複数のショット領域のうち最後のショット領域に対する前記露光処理の終了時に用いられる遮光部材が、前記複数の遮光部材のうち前記第1遮光部材を除く残りの遮光部材になるように、前記シャッタの駆動を制御する、ことを特徴とする請求項1乃至6のいずれか1項に記載の露光装置。
The shutter has a plurality of light shielding members including the first light shielding member, and is configured to allow light to pass through a light passage region between the plurality of light shielding members,
the substrate includes a plurality of shot areas where the exposure processing is performed, respectively;
When the controller detects an abnormality of the first light shielding member, the light shielding member used at the end of the exposure process for the last shot area among the plurality of shot areas is the first light shielding member among the plurality of light shielding members. 7. The exposure apparatus according to any one of claims 1 to 6, wherein driving of said shutter is controlled so that the remaining light shielding members except for one light shielding member.
前記シャッタは、回転することにより、各遮光部材での前記光の遮断と前記光通過領域での前記光の通過とを切り換えるように構成され、
前記制御部は、前記第1遮光部材の異常を検知した場合における前記シャッタの駆動の制御として、前記シャッタの回転方向を変更する、ことを特徴とする請求項6又は7に記載の露光装置。
The shutter is configured to switch between blocking of the light by each light shielding member and passage of the light by the light passing region by rotating,
8. The exposure apparatus according to claim 6, wherein the control section changes the rotation direction of the shutter as the drive control of the shutter when an abnormality of the first light shielding member is detected.
前記制御部は、前記第1遮光部材の異常を検知した場合、その旨を報知する、ことを特徴とする請求項1乃至8のいずれか1項に記載の露光装置。 9. The exposure apparatus according to any one of claims 1 to 8, wherein when detecting an abnormality of the first light shielding member, the control section notifies the abnormality. 請求項1乃至9のいずれか1項に記載の露光装置を用いて基板を露光する露光工程と、
前記露光工程で露光された前記基板を加工する加工工程と、を含み、
前記加工工程で加工された前記基板から物品を製造することを特徴とする物品の製造方法。
an exposure step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 9;
and a processing step of processing the substrate exposed in the exposure step,
A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step.
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