JP7250964B2 - CIRCUIT-FORMING APPARATUS AND CIRCUIT-FORMING METHOD - Google Patents

Description

The present invention relates to a circuit forming apparatus and a circuit forming method for forming a circuit by curing an ultraviolet curable resin by irradiating the ultraviolet curable resin with ultraviolet rays.

As described in the following patent document, a technique has been developed for forming a modeled object by curing an ultraviolet curable resin by irradiating the ultraviolet curable resin with ultraviolet rays.

JP 2019-031046 A

An object of the present specification is to suitably cure an ultraviolet curable resin.

In order to solve the above problems, the present specification provides an ejection device for ejecting an ultraviolet curable resin, a flattening device for flattening the ultraviolet curable resin ejected by the ejection device, and an ultraviolet ray ejected by the ejection device. A first ultraviolet irradiation device for irradiating a curable resin with ultraviolet rays, and a second ultraviolet irradiation device for irradiating the ultraviolet curable resin discharged by the discharge device with ultraviolet rays, wherein the ultraviolet rays per unit area of the first ultraviolet irradiation device The intensity and the intensity of ultraviolet rays per unit area of the second ultraviolet irradiation device are different, and the ultraviolet curable resin discharged by the discharge device is irradiated with the second ultraviolet curable resin without planarizing the ultraviolet curable resin by the planarizing device. 1. A first ultraviolet irradiation step of irradiating ultraviolet rays by an ultraviolet irradiation device, and irradiating the ultraviolet curing resin flattened by the flattening device with ultraviolet rays by both the first ultraviolet irradiation device and the second ultraviolet irradiation device. and a second ultraviolet irradiation step to selectively perform a circuit forming apparatus. Further, the present specification includes a discharge device for discharging an ultraviolet curable resin, a first ultraviolet irradiation device for irradiating the ultraviolet curable resin discharged by the discharge device with ultraviolet rays, and a UV curable resin discharged by the discharge device. a second ultraviolet irradiation device for irradiating ultraviolet rays, wherein the intensity of ultraviolet rays per unit area of the first ultraviolet irradiation device is different from the intensity of ultraviolet rays per unit area of the second ultraviolet irradiation device; a first ultraviolet irradiation step of irradiating ultraviolet rays from the first ultraviolet irradiation device to the ultraviolet curable resin thus obtained; and a second ultraviolet irradiation step of irradiating ultraviolet rays by both of and can be selectively performed, and the ultraviolet curable resin irradiated with ultraviolet rays in the first ultraviolet irradiation step is further irradiated with the first ultraviolet irradiation device and A third ultraviolet irradiation step of irradiating ultraviolet rays by both the second ultraviolet irradiation device and the second ultraviolet irradiation device can be performed, and in the third ultraviolet irradiation step, irradiation is performed by both the first ultraviolet irradiation device and the second ultraviolet irradiation device. UV irradiation amount per unit area is larger than UV irradiation amount per unit area irradiated by both the first ultraviolet irradiation device and the second ultraviolet irradiation device in the second ultraviolet irradiation step. disclose.

Further, in order to solve the above problems, the present specification provides a discharging step of discharging an ultraviolet curable resin, a flattening step of flattening the discharged ultraviolet curable resin in the discharging step, and a discharge step in the discharging step. A first ultraviolet irradiation step of irradiating the ultraviolet curable resin with ultraviolet rays from a first ultraviolet irradiation device having a predetermined irradiation intensity per unit area; a second ultraviolet irradiation step of irradiating ultraviolet rays from both one ultraviolet irradiation device and a second ultraviolet irradiation device having an irradiation intensity per unit area higher than the predetermined intensity, wherein the first ultraviolet irradiation step and the second ultraviolet irradiation step are selectively performed, and the second ultraviolet irradiation step includes applying the first ultraviolet irradiation device and the second ultraviolet irradiation device to the ultraviolet curing resin planarized in the planarization step In the first ultraviolet irradiation step, the ultraviolet curable resin discharged in the discharging step is irradiated with the first ultraviolet curable resin without planarizing the ultraviolet curable resin in the planarizing step. Disclosed is a circuit forming method , which is a step of irradiating ultraviolet rays with an ultraviolet irradiation device . Further, in the present specification, a discharge step of discharging an ultraviolet curable resin, and ultraviolet rays are applied to the ultraviolet curable resin discharged in the discharge step by a first ultraviolet irradiation device having a predetermined irradiation intensity per unit area. a first ultraviolet irradiating step for irradiating, the first ultraviolet irradiating device for the ultraviolet curable resin discharged in the discharging step, and a second ultraviolet ray irradiating device whose irradiation intensity per unit area is higher than the predetermined intensity. and a second ultraviolet irradiation step of irradiating ultraviolet rays by both, wherein the first ultraviolet irradiation step and the second ultraviolet irradiation step are selectively performed, and the ultraviolet rays are irradiated in the first ultraviolet irradiation step further comprising a third ultraviolet irradiation step of irradiating the ultraviolet curing resin with ultraviolet rays from both the first ultraviolet irradiation device and the second ultraviolet irradiation device, wherein in the third ultraviolet irradiation step, the first ultraviolet irradiation device and the The amount of ultraviolet irradiation per unit area irradiated by both the second ultraviolet irradiation device is the unit irradiated by both the first ultraviolet irradiation device and the second ultraviolet irradiation device in the second ultraviolet irradiation step Disclosed is a method of forming circuits with more than UV dose per area.

According to the present disclosure, it is possible to irradiate the ultraviolet curable resin with ultraviolet rays using any one of the two ultraviolet irradiation apparatuses having different ultraviolet intensities, so that the ultraviolet curable resin can be preferably cured. Become.

It is a figure which shows a circuit formation apparatus. FIG. 10 is a diagram showing a second modeling unit; 3 is a block diagram showing a control device of the circuit forming device; FIG. FIG. 3 is a cross-sectional view showing a circuit on which a resin laminate is formed; FIG. 4 is a cross-sectional view showing a circuit in which a smooth resin layer is formed on a resin laminate; FIG. 4 is a cross-sectional view showing a circuit in which metal wiring is formed on a smooth resin layer;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

A circuit forming apparatus 10 is shown in FIG. The circuit forming apparatus 10 includes a conveying device 20, a first shaping unit 22, a second shaping unit 24, and a control device (see FIG. 3) 26. The conveying device 20 , the first shaping unit 22 and the second shaping unit 24 are arranged on the base 28 of the circuit forming device 10 . The base 28 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 28 is the X-axis direction, the short side direction of the base 28 is the Y-axis direction, and both the X-axis direction and the Y-axis direction are perpendicular to each other. The direction will be referred to as the Z-axis direction for explanation.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32 . The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36 . The X-axis slide rail 34 is arranged on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 3) 38, and by driving the electromagnetic motor 38, the X-axis slider 36 moves to any position in the X-axis direction. Also, the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52 . The Y-axis slide rail 50 is arranged on the base 28 so as to extend in the Y-axis direction and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36 . A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 3) 56, and by driving the electromagnetic motor 56, the stage 52 moves to any position in the Y-axis direction. As a result, the stage 52 is moved to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32 .

The stage 52 has a base 60 , a holding device 62 , a lifting device (see FIG. 3) 64 and a cooling device 66 . The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface thereof. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Both edges of the substrate placed on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held. The lifting device 64 is arranged below the base 60 and lifts the base 60 up and down. Furthermore, the cooling device 66 is arranged inside the base 60 and cools the base 60 to an arbitrary temperature.

The first shaping unit 22 is a unit that shapes wiring on a substrate (see FIG. 4) 70 placed on the base 60 of the stage 52, and has a first printing section 72 and a drying section 74. ing. The first printing unit 72 has an inkjet head (see FIG. 3) 76 and linearly ejects metal ink onto the substrate 70 placed on the base 60 . The metal ink is a dispersion of fine metal particles in a solvent. In addition, the inkjet head 76 ejects the conductive material from a plurality of nozzles by, for example, a piezoelectric method using piezoelectric elements.

The drying section 74 has an infrared irradiation device (see FIG. 3) 78 . The infrared irradiation device 78 is a device for irradiating the metal ink discharged onto the substrate 70 with infrared rays, and the metal ink is dried by the irradiation of the infrared rays. At this time, the drying of the metal ink evaporates the solvent, and the metal fine particles come into contact with each other or agglomerate to form a metal wiring. Alternatively, the metal ink is baked by irradiation with infrared rays to form metal wiring. Baking metal ink means that the solvent is vaporized and the protective film of the metal fine particles, that is, the dispersing agent is decomposed, by applying energy, and the metal fine particles come into contact or fuse to become conductive. This is a phenomenon in which the rate increases.

The second modeling unit 24 is a unit that models a resin layer on the substrate 70 placed on the base 60 of the stage 52, and has a second printing section 84 and a curing section 86. . The second printing unit 84 has an inkjet head (see FIG. 3) 88 and ejects ultraviolet curable resin onto the substrate 70 placed on the base 60 . The inkjet head 88 may be, for example, a piezo system using piezoelectric elements, or a thermal system in which resin is heated to generate bubbles and ejected from nozzles.

The curing section 86 has a flattening device (see FIG. 3) 90, a first ultraviolet irradiation device (see FIG. 3) 92, and a second ultraviolet irradiation device (see FIG. 3) 94. The flattening device 90 flattens the upper surface of the ultraviolet curable resin ejected onto the substrate 70 by the inkjet head 88. For example, the surface of the ultraviolet curable resin is smoothed and the surplus resin is removed by a roller or the like. By scraping off with a blade, the thickness of the UV curable resin is made uniform.

The first ultraviolet irradiation device 92 has an LED as a light source, and irradiates the ultraviolet curing resin discharged onto the substrate 70 with ultraviolet rays. The ultraviolet intensity (ultraviolet illuminance) per unit area of the first ultraviolet irradiation device 92 is set to 100 to 2000 mW/cm2. The second ultraviolet irradiation device 94 has a mercury lamp as a light source, and irradiates the ultraviolet curing resin discharged onto the substrate 70 with ultraviolet rays. The ultraviolet intensity (ultraviolet illuminance) per unit area of the second ultraviolet irradiation device 94 is set to 2000 to 5000 mW/cm2.

In the second molding unit 24, as shown in FIG. 2, the inkjet head 88, the flattening device 90, the first ultraviolet irradiation device 92, and the second ultraviolet irradiation device 94 are arranged in this order in the X direction. there is In other words, when the stage 52 is conveyed in the X direction by the operation of the conveying device 20, the ink jet head 88, the flattening device 90, the first ultraviolet irradiation device 92, and the second ultraviolet irradiation device 94, Conveyed in descending order.

The control device 26 also includes a controller 120 and a plurality of drive circuits 122, as shown in FIG. The plurality of drive circuits 122 includes the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the cooling device 66, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, and the first ultraviolet irradiation device 92. , is connected to the second ultraviolet irradiation device 94 . The controller 120 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 122 . Accordingly, the controller 120 controls the operations of the conveying device 20 , the first modeling unit 22 , and the second modeling unit 24 .

In the circuit forming apparatus 10, a circuit pattern is formed on the substrate 70 with the configuration described above. That is, an insulating layer is formed on the substrate 70 with an ultraviolet curable resin, and metal wiring is formed on the insulating layer with a metal ink. Specifically, the substrate 70 is set on the base 60 of the stage 52 , and the stage 52 is moved below the second modeling unit 24 . Then, in the second modeling unit 24, the resin laminate 130 is formed on the substrate 70, as shown in FIG. The resin laminate 130 is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the discharged ultraviolet curable resin with ultraviolet rays by the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94. be done.

Specifically, in the second printing section 84 of the second modeling unit 24 , the inkjet head 88 ejects the ultraviolet curable resin onto the upper surface of the substrate 70 in the form of a thin film. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curable resin becomes uniform. Then, both the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94 irradiate the thin film-like ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 132 is formed on the substrate 70 .

At this time, the ultraviolet curable resin is irradiated with ultraviolet rays of an integrated irradiation amount per unit area (hereinafter referred to as "required irradiation amount for curing") necessary for curing the liquid ultraviolet curable resin into a solid resin. It is irradiated by the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94 . Here, the irradiation dose necessary for curing is, for example, the irradiation dose recommended by the manufacturer of the UV curable resin, and is the UV irradiation dose necessary for curing the UV curable resin in appearance. Specifically, for example, ultraviolet rays of 100 to 2000 mJ/cm2 are irradiated onto the ultraviolet curable resin by two irradiation devices, the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94, as the necessary irradiation dose for curing. . As a result, the thin film-like ultraviolet curable resin is cured into a solid state, and a thin film-like resin layer 132 is formed. In this way, the ultraviolet curing resin is irradiated with ultraviolet rays by the two irradiation devices, the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94, so that the irradiation time of the ultraviolet rays is shortened, and the tact time is shortened. be. The dose required for curing is the integrated dose per unit area of UVA (320 to 390 nm) irradiation. Further, various irradiation doses described below are also integrated irradiation doses per unit area by UVA (320 to 390 nm) irradiation.

Subsequently, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the resin layer 132 formed by irradiating ultraviolet rays. Then, the thin film of ultraviolet curable resin is flattened by the flattening device 90, and the first ultraviolet ray irradiating device 92 and the second ultraviolet ray irradiating device 94 irradiate the thin film of ultraviolet curable resin with ultraviolet rays. , the thin film resin layer 132 is laminated on the thin film resin layer 132 . In this way, the resin layered body 130 is formed by repeating the ejection of the ultraviolet curable resin onto the thin resin layer 132 and the irradiation of the ultraviolet rays to laminate a plurality of resin layers 132 .

However, fine irregularities 134 are formed on the surface of the resin layered body 130 due to, for example, the difference in the amount of the ultraviolet curable resin discharged from the nozzles of the inkjet head 88, the size of droplets of the ultraviolet curable resin, and the like. be done. The height of the unevenness 134 may be ±10 μm, for example, which is extremely small compared to the size of the roller of the flattening device 90. Therefore, even if the surface of the resin layer 132 is flattened by the roller, it may be fine. It is difficult to eliminate such irregularities 134 . Further, when metal wiring is formed with metal ink on the surface of the resin layered body 130 on which the unevenness 134 remains, there is a possibility that the thickness of the formed metal wiring may vary. Alternatively, the electrical conductivity of the metal wiring may be lowered because the metal wiring is not completely baked (the metal fine particles do not contact or fuse together) in the thick portion. Therefore, a smooth resin layer (hereinafter referred to as "smooth resin layer") is formed on the resin layered body 130 in order to smooth the surface of the resin layer on which the metal wiring is formed. In the following description, the surface on which unevenness 134 of about ±10 μm is formed is described as a flattened surface, and the surface on which surface unevenness is ±1 μm or less (it can be hypothesized that the original unevenness 134 has disappeared). surface) may be described as a smoothed smooth surface.

Specifically, in the second printing section 84 of the second modeling unit 24, as shown in FIG. At this time, the ultraviolet curable resin 136 discharged onto the surface of the resin layered body 130 spreads over the surface of the resin layered body 130 so as to fill the irregularities 134 . Then, the ultraviolet curable resin 136 discharged onto the surface of the resin layered body 130 is irradiated with ultraviolet rays. is irradiated with ultraviolet rays so as to harden it into a gel state instead of hardening it into a solid state. For this reason, the irradiation dose is less than the irradiation dose necessary for curing, and the cumulative irradiation dose per unit area necessary for curing the liquid ultraviolet curable resin into a gel resin (hereinafter referred to as the “necessary gelling irradiation dose”) described) is irradiated to the UV curable resin 136 . The irradiation dose required for gelation is, for example, 10 to 100 mJ/cm2, which is a relatively small irradiation dose. 92 alone irradiates the ultraviolet curing resin 136 with ultraviolet light in an amount necessary for gelation. As a result, the ultraviolet curable resin 136 is hardened in a gel state, and the droplets of the ultraviolet curable resin 136 are aggregated to exhibit a leveling effect. Here, the leveling effect is a phenomenon in which the surface area of a liquid becomes as small as possible due to surface tension. As a result, the thin film of the ultraviolet curable resin 136 discharged onto the surface of the resin layered body 130 changes to a flat (more uniform) film thickness over time, although it depends on the viscosity of the liquid. The irradiation of the ultraviolet rays increases the viscosity of the ultraviolet curable resin 136. At this time, the surface tension of the ultraviolet curable resin 136 decreases due to the leveling effect, and the surface of the ultraviolet curable resin 136 becomes a surface with reduced unevenness. , or a smooth surface 138, that is, a surface without irregularities.

In this manner, the ultraviolet curable resin 136 is discharged onto the resin layered body 130 and gelled, so that the surface of the ultraviolet curable resin 136 becomes a smooth surface 138 . Thereby, if it is the smooth surface 138, a metal wiring can be formed appropriately. However, since metal wiring cannot be formed on the gel-like UV-curing resin 136, it is necessary to further irradiate the gel-like UV-curing resin 136 with UV rays to cure the UV-curing resin 136. be. At this time, similarly to the resin layered body 130, the gel-like UV-curing resin 136 can be cured into a solid state by irradiating the gel-like UV-curing resin 136 with UV rays of a necessary curing dose. However, even if the ultraviolet curable resin is cured in appearance, the resin component may be gasified or eluted from the cured ultraviolet curable resin. In such a case, if the metal wiring is formed on the resin with the metal ink, the elution of the resin component into the metal ink and the gas of the resin component hinder the drying and baking of the metal ink. There is a possibility that metal wiring cannot be formed.

Therefore, for the gel-like UV curable resin 136, the UV curable resin is completely cured without elution of the resin component from the cured resin and generation of gas, etc., at an irradiation dose larger than the necessary curing dose. The UV curable resin 136 is irradiated with the ultraviolet ray of the integrated irradiation amount per unit area (hereinafter referred to as “complete curing necessary irradiation amount”) necessary for the curing. The irradiation amount required for complete curing is an irradiation amount derived from experiments. That is, the presence or absence of the elution of resin components and the generation of gas or the like is measured using a composition analyzer for an ultraviolet curable resin that has been experimentally cured by irradiation with ultraviolet rays. At this time, by increasing the irradiation dose of ultraviolet rays in stages from the irradiation dose necessary for curing, the irradiation dose of ultraviolet rays in a range in which elution and gasification of the resin component do not occur, that is, the irradiation dose necessary for complete curing can be derived.

The irradiation amount required for complete curing is, for example, 3000 to 10000 mJ/cm2, which is a very large amount. For this reason, the gel-like UV curable resin 136 is irradiated with ultraviolet light in an amount necessary for complete curing by the two irradiation devices, the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94 . In addition, in order to completely cure the ultraviolet curable resin, it is necessary to irradiate the ultraviolet curable resin with not only the irradiation amount of ultraviolet rays but also ultraviolet rays of a wide range of wavelengths. For this reason as well, two irradiation devices, the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94, irradiate the gel-like ultraviolet curing resin 136 with ultraviolet rays. In particular, since a mercury lamp irradiates ultraviolet rays with a wide range of wavelengths, it is preferable to use the second ultraviolet irradiation device 94 having a mercury lamp as a light source to completely cure the ultraviolet curable resin.

In this way, when the gel-like UV curable resin 136 is irradiated with UV rays of the irradiation amount required for complete curing by the two irradiation devices, the first UV irradiation device 92 and the second UV irradiation device 94, resin lamination is performed. The ultraviolet curing resin 136 discharged onto the surface of the body 130 is completely cured to form a smooth resin layer 140 . The completely cured UV curable resin 136 , that is, the smooth resin layer 140 has a smooth surface 138 . Therefore, the stage 52 moves below the first modeling unit 22 to form metal wiring on the smooth surface 138 . Then, in the first printing unit 72, as shown in FIG. 6, the inkjet head 76 linearly ejects the metal ink 150 onto the upper surface of the smooth resin layer 140 according to the circuit pattern. Next, in the drying section 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates the metal ink 150 with infrared rays. As a result, the metal ink 150 is dried or baked, and the metal wiring 152 is formed on the smooth surface 138 of the smooth resin layer 140 .

As described above, in the circuit forming apparatus 10, when the resin laminate 130 is formed, the two irradiation devices, the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94, are used to irradiate ultraviolet rays of the irradiation amount necessary for curing. is irradiated. Further, when the ultraviolet curable resin 136 discharged onto the resin layered body 130 is hardened into a gel, only the first ultraviolet irradiation device 92 irradiates the ultraviolet ray of the amount required for gelation. Further, when the ultraviolet curable resin 136 cured in gel form is completely cured to form the smooth resin layer 140, two irradiation devices, the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94, are used. , UV rays are emitted in an amount necessary for complete curing. In other words, in the circuit forming apparatus 10, the two irradiation devices, the first ultraviolet irradiation device 92 alone and the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94, correspond to the cumulative irradiation amount of ultraviolet rays. is selectively performed. As a result, it becomes possible to shorten the irradiation time of ultraviolet rays and appropriately irradiate a relatively small amount of ultraviolet rays.

On the other hand, in the conventional circuit forming apparatus, an ultraviolet irradiation device having an LED as a light source was not provided, and only an ultraviolet irradiation device having a mercury lamp as a light source was provided. Since the mercury lamp has a relatively high ultraviolet intensity, it is possible to irradiate a large amount of ultraviolet rays with an accumulated ultraviolet irradiation amount, but it is difficult to irradiate a small amount of ultraviolet rays with an accumulated ultraviolet irradiation amount. In particular, the mercury lamp can change the intensity of the ultraviolet rays from the maximum ultraviolet intensity to about half the maximum ultraviolet intensity. For example, if the intensity is 3000 mW/cm 2 , it is possible to change the intensity of ultraviolet rays within the range of about 3000 mW/cm 2 to 1500 mW/cm 2 . However, even if the ultraviolet intensity of the second ultraviolet irradiation device 94 is lowered to 1500 mW/cm 2 , it is difficult for the second ultraviolet irradiation device 94 to irradiate the necessary amount of ultraviolet rays for gelation (10 to 100 mJ/cm 2 ). On the other hand, if a mercury lamp with a low maximum ultraviolet intensity is used, it is possible to irradiate the necessary amount of ultraviolet rays for gelling. When irradiating with UV rays, the irradiation time becomes longer. As described above, the conventional circuit forming apparatus in which only the ultraviolet irradiation device having the mercury lamp as the light source is provided has various problems.

Therefore, it is conceivable to dispose only an ultraviolet irradiation device having an LED as a light source in the circuit forming device. Compared with mercury lamps, LEDs are extremely advantageous in terms of cost, installation space, life, and the like. Specifically, for example, the price of a mercury lamp is several million yen, while the price of an LED is several hundred thousand yen. In addition, most of the mercury lamps are relatively large, while most of the LEDs are relatively small. Also, the lifetime of LEDs is longer than that of mercury lamps. Furthermore, the LED can change the intensity of ultraviolet rays to any intensity from the maximum ultraviolet intensity to 1/10 or less of the maximum ultraviolet intensity. Therefore, for example, if the maximum ultraviolet intensity of the first ultraviolet irradiation device 92 is 1000 mW/cm2, it is possible to change the ultraviolet intensity within the range of 1000 mW/cm2 to 100 mW/cm2. It is possible to irradiate ultraviolet rays with the required irradiation dose (10 to 100 mJ/cm 2 ). Moreover, since the LED does not emit infrared light, it is possible to suppress temperature rise due to irradiation of ultraviolet light. In this way, there are many advantages to irradiating the ultraviolet curing resin with ultraviolet rays using LEDs. However, in order to completely cure the UV curable resin, as described above, it is necessary to irradiate the UV curable resin with not only the amount of UV irradiation but also UV rays with a wide range of wavelengths. cannot be irradiated with ultraviolet light with a wavelength of . For this reason, it is not possible to completely cure the UV curable resin by irradiating the UV light only from the LED.

In this way, when the LED and mercury lamp are used independently, there are advantages peculiar to each light source, but there are also many disadvantages. Therefore, in the circuit forming device 10, irradiation of ultraviolet rays by only the LEDs and irradiation of ultraviolet rays by both the LEDs and the mercury lamp are selectively performed according to the cumulative irradiation amount of the ultraviolet rays. This makes it possible to take advantage of the advantages unique to the light sources of the LED and the mercury lamp, while eliminating the disadvantages.

Furthermore, in the circuit forming apparatus 10, as shown in FIG. arranged side by side. That is, the first ultraviolet irradiation device 92 is arranged closer to the inkjet head 88 than the second ultraviolet irradiation device 94 is. When the ultraviolet curable resin 136 ejected onto the resin laminate 130 is cured into a gel, the ultraviolet curable resin ejected from the inkjet head 88 is irradiated with ultraviolet rays only by the first ultraviolet irradiation device 92. . Therefore, the moving distance of the stage 52 is reduced when the ultraviolet curable resin 136 is hardened into a gel state, and the tact time can be shortened.

3, the controller 120 has a discharge section 200, a flattening section 202, a first ultraviolet irradiation section 204, a second ultraviolet irradiation section 206, and a third ultraviolet irradiation section 208. As shown in FIG. The ejection part 200 is a functional part for ejecting the ultraviolet curing resin from the inkjet head 88 . The planarization unit 202 is a functional unit for planarizing the UV curable resin discharged by the inkjet head 88 by the planarization device 90 . The first ultraviolet ray irradiation unit 204 is a functional unit for irradiating only the first ultraviolet ray irradiation device 92 with the ultraviolet ray necessary for gelation. The second ultraviolet ray irradiation unit 206 is a functional unit for irradiating ultraviolet rays in an amount necessary for curing from both the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94 . The third ultraviolet ray irradiation unit 208 is a functional unit for irradiating ultraviolet rays of an irradiation amount necessary for complete curing from both the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94 .

Incidentally, in the above embodiments, the circuit forming apparatus 10 is an example of the circuit forming apparatus. The inkjet head 88 is an example of an ejection device. The first ultraviolet irradiation device 92 is an example of a first ultraviolet irradiation device. The second ultraviolet irradiation device 94 is an example of a second ultraviolet irradiation device. Further, the process executed by the ejection section 200 is an example of the ejection process. The process performed by the planarization unit 202 is an example of a planarization process. The process executed by the first ultraviolet irradiation section 204 is an example of the first ultraviolet irradiation process. The process executed by the second ultraviolet irradiation unit 206 is an example of the second ultraviolet irradiation process. The process executed by the third ultraviolet irradiation section 208 is an example of the third ultraviolet irradiation process.

Moreover, the present invention is not limited to the above embodiments, and can be implemented in various modes with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, two irradiation devices having two types of light sources, a first ultraviolet irradiation device 92 having an LED as a light source and a second ultraviolet irradiation device 94 having a mercury lamp as a light source, are employed. However, two illuminators with the same type of light source may be employed. That is, a first ultraviolet irradiation device having an LED as a light source and a second ultraviolet irradiation device having an LED as a light source may be employed, and a first ultraviolet irradiation device having a mercury lamp as a light source and a mercury lamp as a light source may be employed. However, if two irradiation devices with the same type of light source are employed, the UV intensity of the two UV irradiation devices should be different.

Also, in the above embodiments, LEDs and mercury lamps are used as the light sources of the ultraviolet irradiation device, but light sources other than LEDs and mercury lamps may be used.

Further, in the above embodiment, the circuit forming apparatus 10 having two ultraviolet irradiation devices, the first ultraviolet irradiation device 92 and the second ultraviolet irradiation device 94, is employed, but three or more ultraviolet irradiation devices are used. A circuit forming device may be employed.

10: Circuit forming device 88: Ink jet head (ejection device) 92: First ultraviolet irradiation device 94: Second ultraviolet irradiation device 200: Ejection part (ejection process) 202: Flattening part (flattening process) 204: First ultraviolet light Irradiation unit (first ultraviolet irradiation step) 206: Second ultraviolet irradiation unit (second ultraviolet irradiation step) 208: Third ultraviolet irradiation unit (third ultraviolet irradiation step)

Claims (7)

a discharge device for discharging an ultraviolet curable resin;
a flattening device for flattening the ultraviolet curable resin ejected by the ejection device;
a first ultraviolet irradiation device for irradiating the ultraviolet curing resin discharged by the discharge device with ultraviolet rays;
a second ultraviolet irradiation device for irradiating the ultraviolet curable resin discharged by the discharge device with ultraviolet rays,
The ultraviolet intensity per unit area of the first ultraviolet irradiation device and the ultraviolet intensity per unit area of the second ultraviolet irradiation device are different,
a first ultraviolet irradiation step of irradiating the ultraviolet curable resin discharged by the discharge device with ultraviolet rays by the first ultraviolet irradiation device without planarizing the ultraviolet curable resin by the planarization device; A circuit forming apparatus capable of selectively executing a second ultraviolet irradiation step of irradiating the flattened ultraviolet curing resin with ultraviolet rays from both the first ultraviolet irradiation device and the second ultraviolet irradiation device. a discharge device for discharging an ultraviolet curable resin;
a first ultraviolet irradiation device for irradiating the ultraviolet curing resin discharged by the discharge device with ultraviolet rays;
a second ultraviolet irradiation device for irradiating the ultraviolet curable resin discharged by the discharge device with ultraviolet rays;
with
The ultraviolet intensity per unit area of the first ultraviolet irradiation device and the ultraviolet intensity per unit area of the second ultraviolet irradiation device are different,
a first ultraviolet irradiation step of irradiating the ultraviolet curable resin discharged by the discharge device with ultraviolet rays from the first ultraviolet irradiation device; A second ultraviolet irradiation step of irradiating ultraviolet rays by both the second ultraviolet irradiation device and a second ultraviolet irradiation step can be selectively performed,
It is possible to perform a third ultraviolet irradiation step of further irradiating the ultraviolet curing resin irradiated with ultraviolet rays in the first ultraviolet irradiation step with ultraviolet rays from both the first ultraviolet irradiation device and the second ultraviolet irradiation device. ,
In the third ultraviolet irradiation step, the amount of ultraviolet irradiation per unit area irradiated by both the first ultraviolet irradiation device and the second ultraviolet irradiation device is the same as that of the first ultraviolet irradiation device in the second ultraviolet irradiation step. A circuit forming device that is larger than the amount of ultraviolet irradiation per unit area irradiated by both the second ultraviolet irradiation device and the second ultraviolet irradiation device. The first ultraviolet irradiation device is a device having an LED as a light source,
3. The circuit forming apparatus according to claim 1 , wherein the second ultraviolet irradiation device has a mercury lamp as a light source. A discharge step of discharging an ultraviolet curable resin;
A planarization step of planarizing the ultraviolet curable resin ejected in the ejection step;
a first ultraviolet irradiation step of irradiating the ultraviolet curable resin discharged in the discharging step with ultraviolet rays from a first ultraviolet irradiation device having a predetermined irradiation intensity per unit area;
The ultraviolet curable resin discharged in the discharge step is irradiated with ultraviolet rays by both the first ultraviolet irradiation device and the second ultraviolet irradiation device having an irradiation intensity per unit area higher than the predetermined intensity. 2 UV irradiation step and
The first ultraviolet irradiation step and the second ultraviolet irradiation step are selectively performed ,
The second ultraviolet irradiation step includes
A step of irradiating the ultraviolet curable resin flattened in the flattening step with ultraviolet rays from both the first ultraviolet irradiation device and the second ultraviolet irradiation device,
The first ultraviolet irradiation step includes
A circuit forming method, wherein the ultraviolet curable resin ejected in the ejecting step is irradiated with ultraviolet rays by the first ultraviolet irradiation device without flattening the ultraviolet curable resin in the flattening step. The circuit forming method includes:
A third ultraviolet irradiation step of further irradiating the ultraviolet curing resin irradiated with ultraviolet rays in the first ultraviolet irradiation step with ultraviolet rays from both the first ultraviolet irradiation device and the second ultraviolet irradiation device. Item 5. The circuit forming method according to item 4. In the third ultraviolet irradiation step, the amount of ultraviolet irradiation per unit area irradiated by both the first ultraviolet irradiation device and the second ultraviolet irradiation device is the same as that of the first ultraviolet irradiation device in the second ultraviolet irradiation step. 6. The method of forming a circuit according to claim 5, wherein the amount of ultraviolet irradiation per unit area is larger than that of the second ultraviolet irradiation device. A discharge step of discharging an ultraviolet curable resin;
a first ultraviolet irradiation step of irradiating the ultraviolet curable resin discharged in the discharging step with ultraviolet rays from a first ultraviolet irradiation device having a predetermined irradiation intensity per unit area;
The ultraviolet curable resin discharged in the discharge step is irradiated with ultraviolet rays by both the first ultraviolet irradiation device and the second ultraviolet irradiation device having an irradiation intensity per unit area higher than the predetermined intensity. 2 UV irradiation process and
including
The first ultraviolet irradiation step and the second ultraviolet irradiation step are selectively performed,
A third ultraviolet irradiation step of further irradiating the ultraviolet curable resin irradiated with ultraviolet rays in the first ultraviolet irradiation step with ultraviolet rays from both the first ultraviolet irradiation device and the second ultraviolet irradiation device,
In the third ultraviolet irradiation step, the amount of ultraviolet irradiation per unit area irradiated by both the first ultraviolet irradiation device and the second ultraviolet irradiation device is the same as that of the first ultraviolet irradiation device in the second ultraviolet irradiation step. A method for forming a circuit in which the amount of ultraviolet irradiation per unit area is greater than that irradiated by both the second ultraviolet irradiation device and the second ultraviolet irradiation device.

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