JP7263170B2 - imaging device, imaging system - Google Patents

Description

The present invention relates to an imaging device having a characteristic housing and an imaging system having the imaging device.

With the growing needs for safety and security, the number of surveillance cameras installed via networks is increasing. In addition, industrial cameras are installed in factories for monitoring from the viewpoint of improving factory productivity and quality and safety management.

While the performance of image pickup devices for surveillance and industrial use has improved remarkably, the power consumption of the image pickup devices has also increased and the amount of heat generated has increased, making heat dissipation a technical issue.

Japanese Patent Laid-Open No. 2004-100003 describes a configuration in which heat radiation fins made up of a plurality of grooves are provided on the outer wall surface of the bottom surface of a housing in order to improve the heat radiation performance of a surveillance camera.

JP 2011-124784 A

In the image pickup apparatus disclosed in Patent Document 1, the radiation fins are provided only on the bottom surface of the housing, so the radiation performance is insufficient. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an imaging apparatus and an image processing apparatus with improved heat dissipation compared to the configuration described in Japanese Patent Application Laid-Open No. 2002-200313.

An imaging device according to the present invention is an imaging device having a housing and an imaging element provided in the housing, wherein the first side surface, the second side surface, the top surface, and the bottom surface of the housing are made of metal. At least the first side surface and the top surface have a groove region composed of a plurality of grooves, and a first corner composed of the first side surface and the top surface. WHEREIN: It is characterized by having a 1st flat surface and a 1st curved part.

According to the present invention, it is possible to provide an image pickup apparatus and an image processing apparatus with improved heat dissipation compared to the configuration described in Patent Document 1.

1 is a perspective view of an imaging device; FIG. It is the front view of an imaging device, a rear view, and a right view. It is a sectional view of an imaging device. 1A and 1B are a block diagram and a perspective view of an imaging system; FIG. It is a partially enlarged view of a cross-sectional view of the imaging device.

(First embodiment)
1 to 3 are diagrams showing an imaging device 1000 having an imaging element 100 and a housing 300. FIG. Explanation is given below.

FIG. 1A is a perspective view of an imaging device 1000, and FIG. 1B is a perspective view of the imaging device 1000 provided with an interchangeable lens 400. FIG.

2A to 2C respectively show a front view, a rear view, and a right side view of the imaging device 1000. FIG.

3(A) is a cross-sectional view taken along line AA of FIG. 2(C), and FIG. 3(B) is a cross-sectional view taken along line BB of FIG. 2(C).

(image sensor)
As shown in FIGS. 1A and 2A, an imaging device 1000 is provided with an imaging device 100 . The imaging device 100 converts incident light into electrical signals, and is, for example, a CCD or CMOS sensor.

(Case)
As shown in FIG. 1, the housing 300 is configured as a substantially rectangular parallelepiped. Here, a Z direction (first direction), an X direction (second direction) perpendicular to the Z direction, and a Y direction (third direction) perpendicular to the X and Z directions are defined. The length of the housing 300 in the Z direction is longer than the lengths in the X and Y directions. Therefore, the Z direction of the housing 300 is sometimes called the major axis direction, and the X direction or the Y direction of the housing 300 is sometimes called the minor axis direction.

The housing 300 has a first housing portion 310, a second housing portion 320, and a third housing portion 330, which are combined. As for the length in the Z direction, the second housing portion 320 is the longest, the first housing portion 310 is the second longest, and the third housing portion 330 is the shortest. Considering that the second housing portion 320 is the main portion, it can be said that the first housing portion 310 and the third housing portion 330 serve as lids.

The imaging device 100 is housed in the first housing portion 310 . A signal processing circuit that processes signals output from the imaging device 100 is housed in the second housing portion 320 . For example, the signal processing circuit is a circuit such as a serializer that serializes the parallel bus signal output from the imaging device 100 . In addition, illumination (not shown) for illuminating the imaging area of the imaging element 100 may be provided outside the housing 300, but the second housing portion 320 includes a lighting for controlling the illumination provided outside. It is also possible to provide a control circuit.

The first housing portion 310, the second housing portion 320, and the third housing portion 330 are made of metal. For example, metals include metals selected from aluminum, iron, copper, and the like. Among these, it is preferable to select aluminum from the viewpoint of light weight, cost, strength, workability, and heat dissipation.

As shown in FIG. 2B, on the rear surface of the imaging device 1000, an interface unit 510 having a terminal for outputting information from the imaging device 1000 to an external device and a terminal for outputting a signal for controlling the external device. (indicated by the dotted line) is provided. Although two terminals are illustrated in FIG. 2B, the configuration is not limited to that illustrated. That is, one terminal may be provided in interface section 510 .

(Groove area)
As shown in FIGS. 1 to 3, groove regions 210 and 220 each having a plurality of grooves are formed on the upper surface, right side (first side), and left side (second side) of the second housing portion 320 . , 230 are provided (groove region 230 see FIG. 3). Since the heat transfer area can be improved by providing the groove region, the heat dissipation of the imaging device 1000 can be improved. The third housing portion 330 is similarly provided with a groove region to improve heat dissipation. Since the second housing portion 320 is the longest, especially with respect to the Z direction, it is efficient to provide the groove area in the second housing portion 320 . In the above description, the right side is the first side and the left side is the second side, but the right side may be the second side and the left side may be the first side.

A plurality of grooves are provided so as to extend in the long axis direction (Z direction) of the housing 300 . When manufacturing the second housing portion 320 by extrusion, if a mold having a groove region is used, a plurality of grooves extending in the longitudinal direction can be easily formed in the second housing portion 320. There is an advantage.

In FIG. 1A, groove regions are provided throughout the second housing portion 320 and the third housing portion 330 in the longitudinal direction (Z direction) of the housing 300 . However, in order to improve heat dissipation, the groove area may be further expanded in the Z direction. That is, the first housing portion 310 may also be provided with groove regions. For example, if the length of the housing 300 in the Z direction is L, the groove region may be provided over the entire length L.

Moreover, from the viewpoint of improving heat dissipation as much as possible, it is preferable to expand the groove region not only in the Z direction but also in the X direction and the Y direction.

For example, in FIG. 1A, if the height of the housing 300 in the X direction is H, the groove area is provided on the right side surface over a length range of 0.6H or more. It is also possible to provide the groove region over a longer range of lengths. For example, the groove region may be provided over a length range of 0.7H or more. Also, although not shown, a groove region is similarly provided on the left side over a range of length of 0.6H or more in the X direction.

Furthermore, in FIG. 1A, the groove region is provided on the upper surface over a length range of 0.6 W or more, where W is the width of the housing 300 in the Y direction. Of course, it is also possible to provide the groove region over a longer range of lengths. For example, it is possible to provide a trench region over a length of 0.7W or more.

1 to 3, the housing 300 is provided with groove regions on three surfaces, namely, the top surface, the right side surface, and the left side surface. can be improved.

1 to 3 show an example in which no groove area is provided on the bottom surface of the housing 300 in consideration of installing the imaging device 1000 on a member. However, from the viewpoint of improving heat dissipation, a groove region may be provided on the lower surface of the housing 300 as well.

(flat surface: cut off part)
As described above, from the viewpoint of improving heat dissipation as much as possible, it is preferable to expand the groove region not only in the Z direction but also in the X direction and the Y direction. According to this way of thinking, the groove region is formed up to the first corner formed by the upper surface and the right side and the second corner formed by the upper surface and the left side.

However, when the imaging device 1000 is considered as a product, the housing 300 needs to be labeled with a trademark, product number, certification mark such as ISO. Therefore, in the present embodiment, first flat surfaces 250 (first cut-off portions) are provided at the first corners of the second housing portion 320 and the third housing portion 330 . By attaching a trademark or the like to the first flat surface 250, it is possible to improve the visibility of the mark while ensuring heat dissipation. If a flat surface is formed on the upper surface and the mark is attached, it can only be visually recognized from the upper surface. Moreover, when a flat surface is formed on each side surface and a mark is attached, it can only be visually recognized from each side surface. On the other hand, in the present embodiment, since the mark is attached by forming a flat surface (cutoff portion) at the corner, the mark can be visually recognized from at least two directions. In particular, when the imaging device 1000 is used as an industrial camera and the imaging device 1000 is incorporated into another device, it is assumed that there are few openings for viewing the imaging device 1000 . In this way, even when the number of openings is small, the mark can be visually recognized from various directions because the flat surfaces are formed at the corners.

FIG. 5 is an enlarged view of FIG. 3(B). An imaginary line 540 that includes the first flat surface 250 is configured to intersect an imaginary line 530 that includes the right side (first side) and an imaginary line 520 that includes the top surface. As described above, the first flat surface 250 is provided to improve the visibility of the mark, and should be flat enough to achieve this purpose.

Further, as shown in FIG. 3B, a second flat surface 251 (second cutoff portion 251) can be provided at a second corner formed by the upper surface and the left side surface. This makes it possible to arrange marks necessary for the imaging device 1000 with high visibility, such as attaching a trademark of a house mark to the first flat surface 250 and attaching a trademark of a product to the second flat surface 251 . Also, both the first flat surface 250 and the second flat surface 251 may be branded with the Housemark.

Furthermore, as shown in FIG. 3B, a third flat surface 252 (third cutoff portion 252) is provided at a third corner formed by the right side and the bottom, and a third flat surface 252 (third cutoff portion 252) is formed by the left side and the bottom. A fourth flat surface 253 (fourth cut-off portion 253) can be provided at the fourth corner. The third flat surface 252 and the fourth flat surface 253 are less visible than the first flat surface 250 and the second flat surface 251 . Therefore, a product number or certification mark can be displayed on the third flat surface 252 or the fourth flat surface 253 so that it can be referred to as needed. Further, when the trademark of the house mark is attached to both the first flat surface 250 and the second flat surface 251, the third flat surface 252 or the fourth flat surface 253 is attached with the trademark of the product. You may

In addition, even when no mark is provided on the flat surface, by providing the flat surface at the corner, it can be used as a handle for carrying the imaging device 1000 by a person, or for fixing the imaging device 1000. There is also the advantage of becoming a point.

(curving part)
As shown in FIG. 1 , the first planar surface 250 is not provided over the second housing portion 320 . Specifically, the first flat surface 250 is provided on approximately 80% of the second housing portion 320 in the Z direction. On the other hand, in the remaining approximately 20%, a first curved portion 240 having a convex portion outside the first flat surface 250 is provided at the first corner.

If the first flat surface 250 is provided over the entire region in the Z direction, as described above, the visibility of the mark will be improved, but the proportion of the flat surface will increase. Therefore, in a manufacturing site such as a clean room, dust and the like accumulate on a flat surface, possibly affecting product quality. Therefore, by providing a curved portion at each corner, it is possible to suppress the accumulation of dust and the like on the flat surface.

Also, by providing the curved portion, there is an advantage that the impact when the imaging device 1000 is dropped on the floor can be reduced.

(inside the housing)
By the way, in FIG. 2(C), FIG. 3(A) shows an AA cross section passing through the first curved portion 240, which passes through the first flat surface 250 and the third flat surface 252. FIG. 3B shows a BB cross section.

In FIG. 3B, since the first to fourth flat surfaces 250 to 253 are provided, the thickness of the metal portion forming the housing is insufficient. Therefore, as indicated by reference numeral 720, it has a metal portion protruding inward. As a result, even if a flat surface is provided, the strength of the housing can be ensured.

On the other hand, in FIG. 3A, since the first to fourth flat surfaces 250 to 253 are not provided, it is not necessary to provide a metal portion protruding toward the inside of the housing. As a result, compared to FIG. 3B, it is possible to secure a sufficient space inside the housing of FIG. 3A.

Here, as shown in FIG. 1A, the imaging device 100 is installed from the front surface of the housing 300 and arranged in the front portion. When arranging a large-sized imaging device 100 in order to acquire a high-quality image, it is desirable to make the space in the front part of the housing 300 larger than the space in the rear part of the housing 300 . Therefore, in this embodiment, the first to fourth flat surfaces 250 to 253 are provided in the rear portion of the second housing portion 320, and the first curved portion 240 is provided in the front portion of the second housing portion 320. are provided.

Also in the first housing portion 310, each corner is provided with a second curved portion 260. As shown in FIG. By providing the second curved portion 260, accumulation of dust and the like can be suppressed. In addition, it is possible to secure an internal space in the front part of the housing. Furthermore, when a fitting member such as a screw is inserted from the front of the housing to fix the first and second housing portions 310 and 320, the fitting member is inserted between the second curved portion 260 and the first curved portion 260. It becomes possible to provide so as to pass through the portion 240 . Further, it is preferable that the curvatures of the first curved portion 240 and the second curved portion 260 are approximately the same. If the curvatures are significantly different, one of the first curved portion 240 or the second curved portion 260 may protrude relative to each other to form a protrusion that may cause unintended injury or damage to other members. Because it is possible.

Further, as shown in FIG. 3 , the chip substrate 500 is housed in the second housing portion 320 and supported by a support member 900 . The chip substrate 500 is, for example, a substrate on which a signal processing circuit for processing signals from the imaging element 100 is mounted, or a substrate on which a circuit for controlling an external device (eg, LED lighting) is mounted. In addition, the support member 900 extends in the longitudinal direction of the second housing portion 320, and includes the first support member provided below the chip substrate 500 and the support member provided above the chip substrate 500. It consists of a second support member that holds the That is, the extending direction of the support member 900 is the same as the extending direction of the plurality of grooves formed on the surface of the housing.

Since the support member 900 is made of metal having the same composition as the metal forming the second housing portion 320, the heat from the chip substrate 500 can be efficiently radiated.

Also, as described above, the groove regions 210, 220, 230 provided to extend in the longitudinal direction of the housing 300 can be manufactured by extrusion. Therefore, the support member 900 extending in the longitudinal direction can be formed in the same step as the step of forming the groove regions 210 , 220 , 230 . This makes it possible to simplify the manufacturing process.

Furthermore, in the form shown in FIG. 3, the chip substrate 500 can be simply installed along the groove formed by the first support member and the second support member, and fixing with screws or the like is unnecessary. As a result, man-hours for positioning and fixing the chip substrate 500 and the housing can be reduced, and productivity can be improved.

In addition, although the support member for supporting one chip substrate has been described above, it is also possible to arrange a plurality of chip substrates by providing a plurality of support members.

(interchangeable lens)
FIG. 2B shows an imaging device 1000 with an interchangeable lens 400 attached. An appropriate lens may be used as the interchangeable lens 400 depending on the subject. If the height H of the housing 300 or less is set for the interchangeable lens 400, it is possible to reduce the possibility of the interchangeable lens 400 being hit and damaged during installation.

(Second embodiment)
In this embodiment, an imaging system including the imaging device described in the above embodiments will be described.

(Block Diagram)
FIG. 4A is a block diagram for explaining the imaging system.

Signal processing device 3000 has input interface section 1010 , signal processing section 1020 and output interface section 1030 . The imaging system also has an imaging device 1000 and a signal processing device 3000 . The imaging system may optionally include a display device 4000 .

A signal output from the imaging device 1000 is input to the input interface unit 1010 through wiring (signal line). FIG. 4A shows an example in which signals output from two imaging devices 1000 are input. A signal input to the input interface section 1010 is processed by the signal processing section 1020 . Further, the result processed by the signal processing unit 1020 is output to the display device 4000 and displayed.

The input interface unit 1010 can use an interface conforming to various standards or a unique interface. For example, the former includes USB, HDMI (registered trademark), GbE, and the like. Also, the output from the imaging device 1000 does not necessarily have to be input to the signal processing unit 1020 via wiring, and the signal of the imaging device 1000 may be input to the signal processing unit 1020 wirelessly. For example, Wi-Fi and LTE can be used.

Output interface section 1030 can also use various interfaces, whether wired or wireless.

The signal processing unit 1020 processes the image signal from the imaging device 1000 . For example, examples of image processing used in machine vision include pattern matching, blob analysis, edge measurement, spatial filtering, and the like.

The signal processing unit 1020 may be configured to be externally accessible using a web application or API (Application Programming Interface). Therefore, if the imaging system according to this embodiment is introduced into a factory, it becomes possible to easily manage each process even in a remote location.

The display device 4000 displays an image acquired by the imaging device 1000, a signal processing result of the signal processing unit 1020, and the like. For example, when applied to an industrial camera system, it is possible to indicate the result of the visual inspection process in the factory.

In FIG. 4A, the signal processing device 3000 is configured to receive signals from two imaging devices 1000 . By using a plurality of imaging devices 1000, it is possible to shoot from a plurality of directions and to shoot a wider area. It is also possible to compare the signals from each imaging device 1000, the image of the subject, and the like to obtain the phase difference and measure the distance to the subject. Further, although FIG. 4A illustrates an example in which two imaging devices 1000 are input to the signal processing device 3000 , one imaging device 1000 may be configured to be input to the signal processing device 3000 . Alternatively, signals from three or more imaging devices 1000 may be configured to be input to the signal processing device 3000 .

(Casing of signal processing device)
FIG. 4B is a perspective view of the imaging device 1000 and the signal processing device 3000 shown in FIG. 4A. Wiring connecting the imaging device 1000 and the signal processing device 3000 is not shown. One imaging device 1000 and one signal processing device 3000 are connected by one wiring.

Here, the housing of the signal processing device 3000 has the same shape as the housing of the imaging device 1000 . That is, it is composed of a first housing portion 810 , a second housing portion 820 and a third housing portion 830 . In addition, a plurality of grooves are formed in the Z direction on the upper surface, right side (first side), and left side (second side, not shown) of the second housing portion 820 and the third housing portion 830. Extending groove regions 610, 620, 630 are provided, respectively. This makes it possible to improve heat dissipation.

A first flat surface 650 is provided at a first corner formed by the right side surface and the top surface. Since the first flat surface 650 is configured as a flat surface, it is possible to attach marks such as trademarks and product numbers. Although not shown, each of the second corner composed of the top and left side, the third corner composed of the right side and bottom, and the fourth corner composed of the left side and bottom , may form a flat surface and be labeled as above.

Further, instead of forming the entire first corner with the first flat surface 650, a portion of the first corner is provided with the first curved portion 640. FIG. As a result, even when the housing of the signal processing device 3000 is installed in a factory, accumulation of dust can be avoided. Further, although not shown, curved portions can also be provided at the second corner, the third corner, and the fourth corner.

In addition, a plurality of chip substrates having an input interface 1010, a signal processing section 1020, and an output interface 1030 are housed inside the housing of the signal processing device 3000. FIG. Therefore, a support member for supporting the plurality of chip substrates can be provided inside the housing of the signal processing device 3000 as well. The support member is made of metal having the same composition as the metal forming the housing of the signal processing device 3000, and is a member extending in the Z direction. The support member can be manufactured by extrusion. Therefore, the support member inside the housing can be manufactured in the same process as the process for forming the groove region outside the housing. In addition, the chip substrate can be simply installed along the groove formed by the first support member and the second support member, eliminating the need for fixing with screws or the like. As a result, man-hours for positioning and fixing the chip substrate and the housing can be reduced, and productivity can be improved.

In addition, since the design of the housing of the signal processing device 3000 and the design of the housing of the imaging device 1000 are similar, it can be easily determined that they are combined to form one system. There are also benefits.

(others)
In the above description, the right side is the first side and the left side is the second side, but the left side may be the first side and the right side may be the second side. In this case, the corner formed by the left side surface and the upper surface is the first corner. Also, the corner formed by the right side surface and the upper surface is the second corner.

REFERENCE SIGNS LIST 100 image sensor 210, 220, 230 groove region 240, 260 curved portion 250 flat surface (cutoff portion)
300 housing 310 first housing portion 320 second housing portion 400 interchangeable lens 510 interface section 1000 imaging device 3000 signal processing device

Claims (17)

An imaging device having a housing and an imaging device provided in the housing,
The housing has a first housing, a second housing, and a third housing,
The first side surface, the second side surface, the top surface, and the bottom surface of the housing are made of metal,
At least one of the first side surface and the top surface has a groove region composed of a plurality of grooves,
A first corner formed by the first side surface and the top surface includes a first flat surface and a first curved portion ,
the first flat surface is provided on the second housing portion and the third housing portion;
The image pickup apparatus , wherein the first bending portion is provided in the first housing portion and the second housing portion . the housing is a substantially rectangular parallelepiped having a long axis in a first direction;
2. The imaging device according to claim 1, wherein said plurality of grooves extend in said first direction. The groove region is arranged over a second direction orthogonal to the first direction,
The groove region is provided on the first side surface over a length range of 0.6H or more, where H is the length of the housing in the second direction. 3. The imaging device according to claim 2. The groove region is arranged in a third direction orthogonal to the first direction and the second direction,
6. The groove region is provided on the upper surface over a length range of 0.6 W or more, where W is the length of the housing in the third direction. 4. The imaging device according to 3. 5. A virtual line containing the first flat surface intersects a virtual line containing the first side surface and a virtual line containing the upper surface. imaging device. Having the imaging element in the front part of the housing,
6. The imaging apparatus according to claim 5, wherein said first curved portion is provided closer to said front portion than said first flat surface. 7. The imaging device according to claim 1, further comprising a second flat surface at a second corner formed by the second side surface and the top surface. 8. The imaging device according to claim 7, wherein the second corner has a second curved portion. having a third flat surface at a third corner formed by the first side surface and the bottom surface;
9. The imaging device according to claim 1, further comprising a fourth flat surface at a fourth corner formed by the second side surface and the bottom surface. A support member for supporting the chip is provided inside the housing,
10. The imaging apparatus according to any one of claims 1 to 9, wherein the support member is made of the metal. 11. The imaging device according to claim 10, wherein the support member extends in the same direction as the direction in which the plurality of grooves extend. 12. The imaging device according to any one of claims 1 to 11, wherein the metal is aluminum. 13. The imaging apparatus according to any one of claims 1 to 12, wherein the housing is formed by extrusion molding. The imaging device according to any one of claims 1 to 13;
and a signal processing device that processes a signal from the imaging device. the housing of the signal processing device is a substantially rectangular parallelepiped having a first side surface, a second side surface, a top surface, and a bottom surface, and having a long axis in a first direction;
The first side surface, the second side surface, the top surface, and the bottom surface are made of metal,
The first side surface, the second side surface, and the upper surface have a groove region composed of a plurality of grooves, and the plurality of grooves extend in the first direction. 15. The imaging system of claim 14. 16. The imaging system according to claim 15, wherein the housing of the signal processing device has a flat surface at a first corner formed by the first side surface and the top surface. 17. The imaging system according to claim 16, wherein the housing of the signal processing device has a first curved portion at the first corner.

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