JP7267986B2 - Information processing apparatus, determination method, calculation method, program, lithography system, and article manufacturing method - Google Patents

Description

The present invention relates to an information processing apparatus, determination method, calculation method, program, lithography system, and article manufacturing method.

In the manufacture of articles such as semiconductor devices, MEMS, or flat panel displays, patterns formed on substrates have become finer, and there has been a growing demand for improvements in the resolution, overlay accuracy, productivity, etc. of lithography equipment. there is

In order to meet the demand for increased performance of lithographic apparatus, there is a need to eliminate anomalies that can lead to decreased performance of the lithographic apparatus.

Patent Literature 1 discloses a management method of a semiconductor manufacturing apparatus capable of automatically resolving an abnormality in the semiconductor manufacturing apparatus without the intervention of an engineer. A semiconductor manufacturing apparatus that causes a defect in a semiconductor integrated circuit is specified from among a plurality of semiconductor manufacturing apparatuses, and it is determined whether or not the internal state of the semiconductor manufacturing apparatus is normal. If the state deviates from the normal state, the input is controlled so that the internal state returns to the normal state.

JP 2011-54804 A

In Patent Document 1, principal component vectors are calculated by principal component analysis from EES (equipment engineering system) data, which are device parameters representing the internal state of a semiconductor manufacturing device. Then, in the principal component space to which the principal component vector belongs, it is determined whether or not the principal component vector belongs to the region representing the normal state. However, the region representing the normal state may differ depending on the processing conditions applied in the semiconductor manufacturing equipment. In other words, depending on the processing conditions applied in the semiconductor manufacturing apparatus when the EES data is acquired, the range of the region representing the normal state for determining whether the state is normal may change. Therefore, unless the area representing the normal state is determined in consideration of the processing conditions, it may be difficult to accurately determine whether the internal state of the semiconductor manufacturing apparatus is normal.

Accordingly, the present invention provides an information processing apparatus, a determination method, a calculation method, a program, a lithography system, and an information processing apparatus capable of accurately determining an abnormality occurring in a lithography apparatus and determining a maintenance method for resolving the abnormality. It aims at providing the manufacturing method of articles.

An information processing apparatus as one aspect of the present invention for solving the above-described problems provides a plurality of lithography processes performed under first process conditions that predetermine the conditions of lithography processes performed in a pattern forming lithography apparatus. and acquiring a first collected data associated with each of a plurality of lithographic processes performed under a second process condition that predefines a condition of the lithographic process, different from the first process conditions. 2 acquisition means for acquiring collected data; calculating a first allowable range based on accumulated data of the first collected data acquired by the acquisition means ; and calculating the second collected data acquired by the acquisition means. calculating means for calculating a second allowable range different from the first allowable range based on the accumulated data; If it is outside the first allowable range, it is determined that an abnormality has occurred in the third collected data, and the fourth collected data related to lithography processing performed under the second processing conditions is within the second allowable range. and determining means for determining that an abnormality has occurred in the fourth collected data when it is outside the range.

According to the present invention, an information processing apparatus, a determination method, a calculation method, a program, a lithography apparatus, capable of accurately determining an abnormality occurring in a lithography apparatus and determining a maintenance method for resolving the abnormality. A lithography system and method for manufacturing an article can be provided.

1 depicts a lithography system; FIG. It is the figure which showed the exposure apparatus. It is the figure which showed the hardware constitutions of the information processing apparatus. It is a figure which shows the structure of CPU of a diagnostic apparatus. 4 is a flow chart showing a method of determining an abnormality in an exposure device; FIG. 4 is a diagram showing lot data; FIG. 4 is a diagram showing accumulated data in which lot data is accumulated; FIG. 4 is a diagram showing reference data accumulated in accumulated data; FIG. 10 is a diagram showing synchronization accuracy data and an allowable range; FIG. 10 is a diagram showing synchronization accuracy data and a plurality of allowable ranges; FIG. 5 is a diagram showing an example of the relationship between detected abnormalities and maintenance methods; 4 is a flow chart illustrating a method of determining a maintenance method; FIG. 10 is a diagram showing history information; FIG. 10 is a diagram showing factors of synchronization accuracy abnormality; 1 is a flow chart illustrating a method of determining a maintenance strategy using factor analysis; FIG. 4 is a diagram showing a waveform of deviation of a wafer stage; FIG. 4 is a diagram showing the relationship between the cause of abnormality and the maintenance method; 1 illustrates a lithography system configured with multiple diagnostic devices and a centralized control device; FIG.

Preferred embodiments of the present invention will be described in detail below with reference to the drawings. In each figure, the same members are denoted by the same reference numerals, and overlapping descriptions are omitted.

In this example, a lithography system comprising a plurality of lithographic apparatus and diagnostic apparatus is described. FIG. 1 shows a lithography system. The lithography system 100 of this embodiment includes lithography apparatuses 200 to 203 that form patterns on wafers (substrates), and a diagnosis apparatus 300 that determines an abnormality in the lithography apparatus and determines a maintenance method for maintaining the lithography apparatus. have. Here, a maintenance method for maintaining the lithographic apparatus is a method that is performed to eliminate an abnormality in the lithographic apparatus. For example, if an anomaly related to a wafer stage positional error, described below, is determined, a maintenance method may be implemented to reduce vibration of the wafer stage to maintain the lithographic apparatus. Also, the lithography apparatus may include an exposure apparatus that irradiates a reticle (mask, master) on which a pattern is formed with light and projects the pattern onto a shot area on the wafer with the light from the reticle. In addition, the lithography apparatus, for example, brings an imprint material supplied onto a wafer into contact with a mold (original plate, mold), and applies energy for curing to the imprint material, thereby forming a composition having the shape of the mold transferred. It may include an imprinting device that forms an object. The lithographic apparatus can also include a writing apparatus that writes on a substrate with a charged particle beam (such as an electron beam or an ion beam) through a charged particle optical system to form a pattern on the substrate. In addition, the lithography apparatus includes, for example, a coating apparatus that applies a photosensitive medium or the like onto the surface of a substrate, a developing apparatus that develops a substrate on which a pattern has been transferred, and an apparatus such as an exposure apparatus in the manufacture of articles such as devices. It may also include a manufacturing apparatus that performs steps other than the step of carrying out. Also, although lithographic apparatuses 200 to 203 are configured in FIG. 1, the number of lithographic apparatuses is not limited to four.

Next, as an example of the lithography apparatuses 200 to 203, an exposure apparatus that exposes a wafer with light from a reticle on which a pattern is formed will be described. FIG. 2 shows an exposure apparatus as an example of a lithographic apparatus. The exposure apparatus 204 according to this embodiment will be described as a step-and-scan exposure apparatus (scanner) that performs exposure while synchronously driving the reticle stage and the wafer stage. Further, the exposure device 204 is not limited to a scanner, and may be a step-and-repeat type exposure device (stepper) that performs exposure while the wafer stage is stationary. In the example of FIG. 2, the exposure apparatus 204 has a light source 7, an illumination optical system 8, a reticle stage 2, a projection optical system 3, a wafer stage 6, a wafer chuck 5, and a controller 16. The exposure apparatus 204 also has a laser interferometer 9 , a laser interferometer 10 , a focus sensor 11 , a wafer transfer section 12 , a reticle transfer section 14 and an alignment scope 15 . In FIG. 2, the direction parallel to the optical axis of the projection optical system 3 is defined as the Z-axis direction, and the two directions perpendicular to each other in a plane perpendicular to the Z-axis direction are defined as the X-axis direction and the Y-axis direction.

Examples of the light source 7 include a high-pressure mercury lamp, ArF excimer laser, and KrF excimer laser. Further, the light source 7 is not necessarily inside the chamber of the exposure apparatus, and may be externally attached. Light emitted from a light source 7 illuminates a reticle 1 (original, mask) (not shown) through an illumination optical system 8 . A reticle 1 has a pattern to be transferred onto a wafer 4 (substrate) coated with a photosensitive material, and is mounted on a reticle stage 2 . The reticle stage 2 attracts and holds a reticle via a reticle chuck (not shown), and is movable by, for example, a linear motor (not shown).

The projection optical system 3 projects (exposes) the image of the pattern drawn on the reticle 1 onto the wafer 4 placed on the wafer chuck 5 . When projecting the image of the pattern onto the wafer 4 , the image is reversed and reduced at a projection magnification (for example, 1/4) through the projection optical system 3 and projected onto the wafer 4 . Assuming that an area onto which a pattern image is projected is a shot area, a plurality of shot areas are set on the wafer 4, and projection onto the shot areas is repeated in sequence.

The wafer stage 6 is movable in the X and Y directions by being driven by a linear motor (not shown). A wafer chuck 5 is mounted on the wafer stage 6 and holds the wafer 4 . The wafer stage 6 positions the wafer chuck 5 in the Z direction, .theta. direction, .omega.X direction, and .omega.Y direction. Thus, the wafer 4 held by the wafer chuck 5 is moved by driving the wafer stage 6 and the wafer chuck 5 .

A laser interferometer 9 measures the position of the reticle stage 2 in the Y direction and also measures the attitude of the reticle stage 2 . The laser interferometer 9 similarly includes a laser interferometer (not shown) for measuring the position of the reticle stage 2 in the X direction. The laser interferometer 10 also measures the Y-direction position of the wafer stage 6 on which the wafer 4 is mounted, and also measures the attitude of the wafer stage 6 . The laser interferometer 10 also includes a laser interferometer (not shown) that similarly measures the position of the wafer stage 6 in the X direction. The positions of the reticle stage 2 and the wafer stage 6 are controlled by a controller 16 described later based on the positions measured by the laser interferometers 9 and 10 .

The focus sensor 11 includes a light projecting system 11a for projecting light (a plurality of beams) onto the wafer 4, a light receiving system 11b for receiving reflected light from the wafer, and a controller 16 for detecting light from the light receiving system. and a detector (not shown) that outputs a detection signal. The light projecting system 11a and the light receiving system 11b are installed so as to sandwich the vicinity of the exit part of the projection optical system 3. The light projecting system 11a irradiates the wafer with obliquely incident light, and the light receiving system 11b receives the light reflected on the opposite side. take in. A control unit 16 , which will be described later, measures the position of the wafer 4 in the Z direction from the detection signal detected by the focus sensor 11 and controls the movement of the wafer 4 by the wafer stage 6 .

A wafer transfer unit 12 transfers the wafer 4 . The wafer transfer unit 12 transfers the wafer 4 from a wafer storage container (not shown) or the like that stores the wafer 4 to the wafer stage 6 . A wafer transfer section 12 transfers the wafer 4 from the wafer stage 6 to a wafer container or the like.

A reticle transport unit 14 transports the reticle 1 . The reticle transport unit 14 transports the reticle 1 to the reticle stage 2 from a reticle storage container (not shown) that stores the reticle 1 or the like. A reticle transport unit 14 transports the reticle 1 from the reticle stage 2 to a reticle storage container or the like.

The alignment scope 15 obtains digital image signals of marks formed on the wafer 4 in order to position (align) the wafer 4 held by the wafer chuck 5 . The alignment scope 15 includes an image sensor (not shown) that outputs a grayscale image signal corresponding to the brightness of the reflected light from the wafer 4, that is, the grayscale, and converts the grayscale image signal obtained from the image sensor into a digital image signal. An A/D converter (not shown) is provided. A control unit 16, which will be described later, detects the position of a mark formed on the wafer 4 using the acquired digital image signal, and controls the wafer stage 6 based on the detected position of the mark to position the wafer 4. conduct.

The control unit 16 controls the processing of exposing the wafer 4 by controlling the operation and adjustment of each unit of the exposure device 204 . The control unit 16 is, for example, a PLD (abbreviation of Programmable Logic Device) such as FPGA (abbreviation of Field Programmable Gate Array), ASIC (abbreviation of Application Specific Integrated Circuit), a computer in which a program is installed, or these It is an information processing device that can be configured by a combination of all or part of. Also, the control unit 16 may be composed of a plurality of information processing devices. Further, the control unit 16 may be configured integrally with other parts of the exposure apparatus 204 (within a common housing), or may be configured separately from other parts of the exposure apparatus 204 (within another housing). may be configured. Further, the control unit 16 performs control so that exposure processing (lithography processing) of the wafer 4 is performed by applying processing conditions obtained from a storage device or the like, which will be described later. The processing conditions applied to the exposure process may include, for example, transfer conditions that determine the speed, route, etc., when the wafer transfer unit 12 transfers the wafer 4 to the wafer stage 6 . Further, the processing conditions applied to the exposure processing may include, for example, positioning conditions that define the allowable error when the wafer 4 is positioned by the wafer stage 6 . Further, the processing conditions applied to the exposure processing may include, for example, measurement conditions that define the light irradiation time, irradiation timing, and the like for measurement by the focus sensor 11 . Further, the processing conditions applied to the exposure processing may include predetermined exposure conditions such as the identifier of the reticle 1 when exposing the wafer 4, the layout of shot areas on the wafer 4, and the illumination mode. Further, the processing conditions applied to the exposure processing may include, for example, environmental conditions that define the temperature and atmospheric pressure in the exposure apparatus 204, setup conditions including information such as the model of the exposure apparatus and software version.

FIG. 3 is a diagram showing the hardware configuration of the information processing apparatus. Each hardware configuration of the information processing apparatus functions according to a program. In the example of FIG. 3, the CPU 301 is a processing device that performs control operations according to a program and controls each component connected to the bus 308 . A ROM 302 is a data read-only memory, and stores programs and data. A RAM 303 is a memory for reading and writing data, and is used for storing programs and data. The RAM 303 is used for temporary storage of data such as results of calculations by the CPU 301 . Storage device 304 is also used for storing programs and data. The storage device 304 is also used as an operating system (OS) program of the information processing apparatus and a temporary storage area for data. The storage device 304 is slower in data input/output than the RAM 303, but can store a large amount of data. The storage device 304 is desirably a non-volatile storage device that can be stored as permanent data so that the stored data can be referenced over a long period of time. The storage device 304 is mainly composed of a magnetic storage device (HDD), but may be a device that loads external media such as a CD, DVD, or memory card to read and write data. The input device 305 is a device for inputting characters and data to the information processing device, and corresponds to various keyboards and mice. A display device 306 is a device for displaying information necessary for operating the information processing device, processing results, and the like, and corresponds to a CRT, a liquid crystal monitor, or the like. The communication device 307 is used when connecting to a network and performing data communication using a communication protocol such as TCP/IP and communicating with other information processing devices. Further, the information processing apparatus may include a GPU (abbreviation for Graphics Processor Unit) (not shown) in order to enable high-speed arithmetic processing.

Next, diagnostic device 300 will be described. The diagnostic device 300 is an information processing device and includes, for example, the configuration shown in the example of FIG. The diagnostic apparatus 300 is connected to communicate data with a plurality of exposure apparatuses 204 via a communication device 307 . FIG. 4 is a diagram showing the configuration of the CPU of the diagnostic device 300. As shown in FIG. The CPU of diagnostic device 300 includes acquisition section 401 , accumulation section 402 , abnormality determination section 403 , maintenance section 404 , and output section 405 .

Next, a method by which the diagnosis apparatus 300 determines an abnormality in the exposure apparatus will be described. FIG. 5 is a flow chart showing a method for judging an abnormality in the exposure apparatus. First, at step 501 , the acquisition unit 401 acquires lot data from the exposure apparatus 204 . In addition to the lot data, the acquisition unit 401 also acquires information specifying the exposure apparatus (for example, an ID indicating the exposure apparatus) and information specifying the processing conditions applied when the lot data was acquired (for example, the processing conditions). (ID shown).

Here, lot data will be explained. FIG. 6 is a diagram showing an example of lot data. When exposing the wafers 4 using the exposure apparatus 204, each lot is treated as a unit containing a plurality of wafers 4 (for example, 25 wafers 4). Also, when exposure is performed on a plurality of wafers 4 belonging to the same lot, the same processing conditions are applied. A layout of a plurality of shot areas (for example, 100 shot areas) is predetermined as areas to be exposed on the wafer, and the exposure device 204 repeatedly exposes the plurality of shot areas on the wafer. Also, in the example of FIG. 6, the number of wafers belonging to the lot is 25 and the number of shot areas on the wafer is 100, but the numbers are not limited to these.

Lot data is a collection of data (collected data hereinafter) collected when a plurality of wafers belonging to such a lot are exposed under the same processing conditions. The lot data has a hierarchical structure, and collected data collected when a plurality of shot areas of a wafer are exposed is stored classified for each wafer or each shot area. Further, in the example of FIG. 6, synchronization accuracy data and illuminance data are classified and stored for each shot area, and stage deviation data and alignment measurement data are classified and stored for each wafer. Here, the synchronization accuracy data refers to the relative accuracy of the reticle stage 2 and the wafer stage 6 during the period in which the reticle stage 2 and the wafer stage 6 are synchronously driven, for example, in the Y-axis direction to expose the target shot area. This is data indicating the positional error. Synchronization accuracy data is obtained by the control unit 16 based on later-described stage deviation data regarding the reticle stage 2 and the wafer stage 6 collected during the period when the reticle stage 2 and the wafer stage 6 are driven synchronously. . If the synchronization accuracy data becomes large, it affects the overlay performance and image performance. Therefore, by monitoring the synchronization accuracy data, an abnormality of the exposure apparatus 204 can be determined. Also, the illuminance data is a value indicating the intensity of light with which the shot area is irradiated during the period in which the shot area is exposed. The illuminance data is obtained by the control unit 16 based on the result of measurement by a light intensity sensor (not shown) arranged in the illumination optical system 8 and measuring the intensity of light during the exposure period of the shot area, for example. Further, the stage deviation data is a value indicating the deviation between the target position and the measured position in the control of at least one of the reticle stage 2 and wafer stage 6 during the wafer exposure period. The stage deviation data is obtained by the controller 16 based on the measurement results of the laser interferometers 9 and 10 . Further, the alignment measurement data includes waveform data of the digital image signal obtained by imaging the marks formed on the target wafer 4 and evaluation of the digital image signal (symmetry of the waveform data, contrast of the digital image signal). may include data indicating Alignment measurement data is obtained by the controller 16 based on the measurement results of the alignment scope 15 . Collected data is not limited to synchronization accuracy data, illuminance data, stage deviation data, and alignment measurement data. Also, the collected data may be, for example, time-series data, and may include at least one of the maximum value, minimum value, average value, median value, and standard deviation obtained from the time-series data. Collected data may also include information indicating principal component vectors obtained by principal component analysis. Also, lot data is collected from each unit, device, etc. of the exposure apparatus 204 by the control unit 16 of the exposure apparatus 204 and output to the diagnosis apparatus 300 via the communication apparatus 307 . Here, the control unit 16 may output one lot data to the diagnostic device 300 , or may collectively output a plurality of lot data to the diagnostic device 300 . Further, the control unit 16 may store lot data in the storage device 304 and output the lot data stored in the storage device 304 . The control unit 16 may also output information specifying the exposure apparatus and information specifying the processing conditions applied when the lot data was collected together with the lot data.

Now, return to the description of FIG. In step 502 , the accumulation unit 402 accumulates the lot data acquired by the acquisition unit 401 into accumulation data (first information), and stores it in the storage device 304 of the diagnostic device 300 . Further, the storage unit 402 acquires the information specifying the exposure apparatus and the information specifying the processing conditions from the acquisition unit 401, classifies the lot data for each exposure apparatus and for each processing condition, and stores them. That is, the accumulation unit 402 accumulates the acquired lot data in the data of the exposure apparatus, the same exposure apparatus as the processing conditions, and the processing conditions of the lot data acquired by the acquisition unit 401 .

Accumulated data obtained by accumulating lot data obtained from a plurality of exposure apparatuses 204 will now be described. FIG. 7 is a diagram showing an example of accumulated data in which lot data is accumulated. Accumulated data has a hierarchical structure, and lot data acquired from a plurality of exposure apparatuses are classified and accumulated for each exposure apparatus and for each processing condition. Further, when exposure is performed on a plurality of lots under the same processing conditions in a given exposure apparatus, a plurality of lot data can be accumulated under the same processing conditions. The accumulated data also accumulates reference data (second information) including statistical values relating to a plurality of lot data accumulated for the same processing conditions. In addition, in the example of FIG. 7, the number of exposure apparatuses is 4 and the number of processing conditions is 10, but the numbers are not limited to these.

Also, an example of reference data will be described. FIG. 8 is a diagram showing an example of reference data accumulated in accumulated data. The reference data may include the maximum value, minimum value, average value, median value, standard deviation, and allowable range of each collected data included in the lot data. Here, the allowable range is for judging whether the collected data is abnormal, and when the collected data is out of the allowable range, it is judged to be abnormal. Reference data may also include other statistics such as mode, coefficient of variation, and variance. Also, the data included in the reference data may be time-series data. Also, the reference data may be configured for each wafer and for each shot area in the same manner as the lot data.

Now, return to the description of FIG. In step 503, the abnormality determination unit 403 determines abnormality using the lot data accumulated by the accumulation unit 402 and the reference data. Here, an example of judging abnormality using synchronization accuracy data among a plurality of data included in lot data will be described. FIG. 9 is a diagram showing an example of synchronization accuracy data and an allowable range. FIG. 9 shows synchronization accuracy data E ₁ (black circles) under processing condition 1 and synchronization accuracy data E ₂ (black triangles) under processing condition 2 . Also, m ₁ and m ₂ are the median values of the synchronization accuracy data E ₁ and the synchronization accuracy data E ₂ , respectively. For example, processing conditions 1 and 2 have different layouts of shot areas on the wafer 4, which are included in the exposure conditions, resulting in different synchronization accuracy data. For example, the layout under processing condition 1 has 100 shot areas, and the layout under processing condition 2 has 50 shot areas. In this case, the paths, speeds, accelerations, etc. of the reticle stage 2 and the wafer stage 6 that are driven during exposure are different because the sizes of the shot areas are different. When processing condition 1 is applied for exposure, the number of repetitions of acceleration/deceleration of the reticle stage 2 and wafer stage 6 is increased, and the interval of repetition of acceleration/deceleration of the reticle stage 2 and wafer stage 6 is shortened. Therefore, when exposure is performed by applying the processing condition 1, the deviation of the reticle stage 2 and the wafer stage 6 becomes large. Since the synchronization accuracy data is obtained from the stage deviation data as described above, the median value _m1 of the synchronization accuracy data _E1 tends to be larger than the median value _m2 of the synchronization accuracy data _E2 . Therefore, as shown in FIG. 9, the synchronization accuracy data differs between the processing conditions 1 and 2. FIG. Median values m ₁ and m ₂ are values included in the reference data for the same exposure apparatus and the same processing conditions. Also, when the plurality of lot data accumulated in the accumulated data are updated, the median values m ₁ and m ₂ can be updated. In the synchronization accuracy data shown in FIG. 9, when the allowable range of the synchronization accuracy data is set to r ₁ or more and r ₄ or less, the synchronization accuracy data E _1-1 and E _2-1 are determined to be abnormal, but the synchronization accuracy Data E _1-2 and E _2-2 are determined to be normal. However, looking at the synchronization accuracy data for each processing condition, the synchronization accuracy data E _1-2 and E _2-2 are far from the median values m ₁ and m ₂ , respectively, and should be judged as abnormal synchronization accuracy data. is. Therefore, the abnormality determination unit 403 sets the allowable range of the synchronization accuracy data _E1 to _r1 or more and _r2 or less, and sets the allowable range of the synchronization accuracy data _E2 to _r3 or more and _{r4 or} less. _-2 and E _2-2 can be determined as abnormal. In other words, the abnormality determination unit 403 can appropriately determine an abnormality by defining an allowable range for each processing condition. Also, r ₁ , r ₂ , r ₃ , and r ₄ that define the allowable range may be predetermined. Also, r ₁ , r ₂ , r ₃ , and r ₄ that define the allowable range may be determined based on the difference to the median values m ₁ and m ₂ . Specifically, r ₁ =m ₁ −a, r ₂ =m ₁ +b, r ₃ =m ₂ −c, r ₄ =m ₂ +d (where a, b, c, and d are predetermined positive values Yes.) Also, r ₁ , r ₂ , r ₃ , and r ₄ defining the allowable ranges may be determined based on ratios to median values m ₁ and m ₂ . Specifically, r ₁ =em ₁ , r ₂ =fm ₁ , r ₃ =gm ₂ , r ₄ =hm ₂ (e, f, g, h are predetermined positive values, 0<e< 1, f>1, 0<g<1, h>1.). Also, r ₁ , r ₂ , r ₃ , and r ₄ that define the allowable range may be calculated based on accumulated data. For example, r ₁ , r ₂ , r ₃ , and r ₄ that define the allowable range may be determined based on the standard deviation calculated from the data determined to be normal among the lot data of the accumulated data. Specifically, r ₁ =m ₁ −σ ₁ ,r ₂ =m ₁ +σ ₁ ,r ₃ =m ₂ −σ ₂ ,r ₄ =m ₂ +σ ₂ (σ ₁ and σ ₂ are standard deviations. ). Also, although the allowable range is determined based on the median values m ₁ and m ₂ , other statistical values such as the maximum value, the minimum value, and the average value may be used as the standard. The reference data is the same exposure apparatus as the exposure apparatus from which the lot data was acquired, and the reference data has the same processing conditions. , the same processing conditions may be used. Also, although the synchronization accuracy data has been described here, if the lot data includes a plurality of pieces of collected data, abnormality is determined for each piece of collected data.

Now, return to the description of FIG. In step 504 , if the result of determination in step 503 is that it is determined to be abnormal, the process proceeds to step 505 , and if it is not determined to be abnormal, the process proceeds to step 506 . In step 505 , the abnormality determination unit 403 stores information specifying the exposure apparatus 204 from which the lot data determined to be abnormal has been acquired in the storage device 304 of the diagnosis apparatus 300 . In addition to the information specifying the exposure apparatus 204, the abnormality determination unit 403 transmits related data such as processing conditions for lot data determined to be abnormal and collected data determined to be abnormal (synchronization accuracy data, for example) to the diagnostic apparatus. 300 in storage device 304 .

Next, in step 506, the accumulation unit 402 updates the reference data based on the lot data already accumulated and the newly accumulated lot data. For example, if the data to be updated is a statistical value, the statistical value is calculated based on a plurality of already accumulated lot data and newly accumulated lot data to update the reference data. Also, if there are a plurality of pieces of collected data for which abnormality should be determined, steps 501 to 506 are repeated by the number of pieces of collected data.

Further, in step 503, the abnormality determination unit 403 can set a plurality of allowable ranges and determine abnormality classified into gradual levels. FIG. 10 is a diagram showing an example of synchronization accuracy data and a plurality of allowable ranges. In FIG. 10, a plurality of allowable ranges are set using r ₃₁ , r ₃₂ , r ₄₁ , and r ₄₂ that define the allowable range for the synchronization accuracy data E ₁ under the processing condition 1 . The abnormality determination unit 403 determines that the synchronization accuracy data E _1n (marked with a black circle) within the allowable range of r ₃₂ to r ₄₁ is normal. Further, the abnormality determination unit 403 determines that the synchronization accuracy data E _1e (marked with a black triangle) within the allowable range of r ₃₂ to r ₃₂ and the allowable range of r ₄₁ to r ₄₂ are mildly abnormal. In addition, the abnormality determination unit 403 determines that the synchronization accuracy data E _1e (marked with a cross) in the range of r ₃₁ or less and r ₄₂ or more are severely abnormal. Thereby, the abnormality determination unit 403 can determine an abnormality classified into a stepwise level. For example, r ₃₁ , r ₃₂ , r ₄₁ , and r ₄₂ that define the allowable range may be predetermined in the same way as the values that define the allowable range in FIG. 7, or may be calculated. For example, r ₃₁ , r ₃₂ , r ₄₁ , and r ₄₂ that define the allowable range may be determined based on the standard deviation calculated from the data determined to be normal among the lot data of the accumulated data. For example, r ₃₁ = m ₁ - iσ ₁ , r ₃₂ = m ₁ - jσ ₁ , r ₄₁ = m ₁ + jσ ₁ , r ₄₂ = m ₁ + iσ ₁ (σ ₁ is standard deviation, i, j are positive values , i>j.).

Next, a method for determining a maintenance method for maintaining the exposure apparatus 204 from which lot data determined to be abnormal by the diagnostic apparatus 300 is acquired will be described. The maintenance unit 404 determines a maintenance method for maintaining the exposure apparatus 204 from which lot data determined to be abnormal by the abnormality determination unit 403 is obtained. Here, the relationship between the abnormality determined in the collected data and the maintenance method will be described. FIG. 11 is a diagram showing the relationship between determined abnormalities and maintenance methods. For example, for synchronization accuracy anomalies determined in synchronization accuracy data, filter adjustment, control parameter adjustment may be selected as maintenance methods. Filter adjustment is a maintenance method for reducing vibration of the wafer stage 6 or reticle stage 2, and adjusts a filter that removes vibration of a certain frequency component from the command value for controlling the wafer stage 6 or reticle stage 2. It is a conservation method to Control parameter adjustment is a maintenance method for adjusting control parameters relating to the drive characteristics of the wafer stage 6 or reticle stage 2 in the control unit 16 .

In addition, slit adjustment or optical axis adjustment can be selected as a storage method for the illuminance abnormality determined in the illuminance data. Slit adjustment is a maintenance method for adjusting the slit formed in the illumination optical system 8 so that the shot area on the wafer 4 is uniformly irradiated with the exposure light. The optical axis adjustment is a maintenance method for adjusting the telecentricity of the illumination optical system 8 inside and outside the optical axis.

Also, sample shot search, alignment illumination system optimization, and template update can be selected as maintenance methods for alignment measurement abnormalities determined in alignment measurement data. The sample shot search is a maintenance method in which the controller 16 drives the wafer stage 6 and observes it with the alignment scope 15 to search for another alignment mark at the designated alternative position on the wafer 4 and align it. Alignment illumination system optimization is a maintenance method for adjusting the alignment illumination system so as to increase the detection accuracy of alignment marks. Template update is a maintenance method in which the control unit 16 automatically updates the template so as to improve the degree of correlation when detecting alignment marks by template matching.

FIG. 12 is a flow chart illustrating a method of determining a maintenance strategy. In step 1201, the maintenance unit 404 searches history information (third information) for a maintenance method corresponding to collected data determined to be abnormal. Here, history information will be described. FIG. 13 is a diagram showing an example of history information. The history information includes the type of abnormality determined based on the collected data, the date and time when the collected data determined to be abnormal was collected, the exposure apparatus from which the collected data determined to be abnormal was collected, and the collected data. Processing Condition 1, which was applied at the time, may be included. The history information may also include the maintenance method executed to resolve the abnormality, and the execution result (success or failure) indicating whether the maintenance method was executed to resolve the abnormality. In other words, in the history information, maintenance methods that have been executed for abnormalities that occurred in the exposure apparatus in the past and information on the execution results thereof are recorded together with information such as the exposure apparatus and processing conditions. Also, the history information is acquired by the acquiring unit 401 of the diagnostic device 300 and accumulated by the accumulating unit 402 in the same manner as the lot data.

Returning to the description of FIG. In step 1201, the maintenance unit 404 searches the history information under the search condition of the data for which the result is a success among the maintenance methods executed under the same abnormality, the same exposure apparatus, and the same processing conditions. Search for conservation methods. For example, as shown in FIG. 13, it is assumed that a synchronization accuracy abnormality occurs while exposure processing is being performed with processing condition 1 applied in the exposure apparatus 1 . In this case, the maintenance unit 404 determines from the history information that the abnormality is synchronization accuracy abnormality, the exposure apparatus is exposure apparatus 1, the processing condition is processing condition 1, and the execution result of executing the maintenance method is successful. Search for a maintenance method with a search condition of certain data. In the example of FIG. 13, the data at the top is the data that meets the search criteria, and filter adjustment is searched as the maintenance method. Here, if there are multiple data that meet the search conditions, the maintenance method that is included in the data with the newest time may be prioritized as the maintenance method that satisfies the search conditions. It is also possible to give priority to maintenance methods with a large number of maintenance methods and set them as maintenance methods that match the search conditions. Also, here, the same data for all of the abnormality, the exposure apparatus, and the processing conditions are set as the search conditions, but at least one data of the abnormality, the exposure apparatus, and the processing conditions may be set as the search conditions.

At step 1202, the maintenance unit 404 determines whether there is a maintenance method that meets the search conditions. If it is determined that there is a maintenance method that meets the search conditions, the process proceeds to step 1203 . In step 1203, the maintenance unit 404 determines the searched maintenance method as the maintenance method for the exposure apparatus from which the collected data determined to be abnormal has been collected. Also, if it is determined in step 1202 that there is no maintenance method that satisfies the search conditions, the process proceeds to step 1204 .

At step 1204, the maintenance unit 404 searches for a maintenance method corresponding to the determined abnormality in the information indicating the relationship between the predetermined abnormality and the maintenance method. For example, if the relationship shown in FIG. 11 is predetermined, filter adjustment and control parameter adjustment are retrieved as maintenance methods for dealing with synchronization accuracy abnormality. If a plurality of maintenance methods are retrieved, a preset default maintenance method may be selected. For example, if the default maintenance method is set to control parameter adjustment, control parameter control is selected as the maintenance method. Also, a maintenance method that has been executed more frequently in the history information may be selected. For example, in the example of FIG. 12, filter adjustment, which is the maintenance method executed most often for synchronization accuracy failure, is selected as the maintenance method. At step 1205, the maintenance unit 404 determines whether there is a maintenance method that meets the search conditions. If it is determined that there is a maintenance method that meets the search conditions, the process proceeds to step 1206 . In step 1206, the maintenance unit 404 determines the searched maintenance method as the maintenance method for the exposure apparatus from which the collected data determined to be abnormal has been collected. Also, in step 1205, if there is no maintenance method that satisfies the search conditions, the process is terminated.

The output unit 405 outputs the maintenance method determined by the maintenance unit 404 to the lithographic apparatus from which the collected data determined to be abnormal has been collected. Outputs instructions (commands). A lithographic apparatus that has received the command performs a maintenance method according to the command. Also, if it is determined in step 1205 that no maintenance method exists, the output unit 405 may output a command to output an error or warning to the lithographic apparatus from which the collected data determined to be abnormal was collected. good. If it is determined in step 1205 that there is no maintenance method, the output unit 405 outputs a command to output a manual maintenance procedure to the lithographic apparatus from which the collected data determined to be abnormal was collected. can be

As described above, in the present embodiment, an abnormality occurring in the lithographic apparatus can be accurately determined by determining an abnormality based on data accumulated for each processing condition applied to the lithographic apparatus. Further, by determining a maintenance method for the determined abnormality based on history information including information on the storage method executed and the execution result thereof, a maintenance method capable of resolving the abnormality can be executed.

In this embodiment, an example in which a maintenance method is determined using an abnormality factor analysis will be described. Matters not mentioned here can follow the first embodiment.

A factor analysis of an abnormality determined by the abnormality determination unit 403 will be described. Here, an abnormality in synchronization accuracy will be described as an example of the detected abnormality. FIG. 14 is a diagram showing the relationship between anomalies and causes of the anomalies. Factors of synchronization accuracy abnormality are first classified into wafer stage 6 factors and reticle stage 2 factors. Factors of the wafer stage 6 include, for example, an initial position error, oscillation, adhesion of foreign matter, and the like. The initial positional error means that the error of the initial position of the wafer stage 6 at the start of exposure for each shot area exceeds the allowable range. Oscillation means that the wafer stage 6 vibrates. Also, the adherence of foreign matter means that foreign matter adheres to the substrate or the wafer chuck 5 . The same is true for the factor of reticle stage 2 .

Next, a maintenance method for maintaining the factors identified by the factor analysis will be described. FIG. 15 is a flow chart showing a method of determining a maintenance method using factor analysis. At step 1501, the maintenance unit 404 acquires collected data determined to be abnormal. Here, the judged abnormality is synchronization accuracy abnormality, and the collected data to be acquired is stage deviation data.

Here, stage deviation data when the exposure device 204 is a scanner will be described. FIG. 16 is a diagram showing an example of the deviation waveform of the wafer stage 6. As shown in FIG. In the graph of FIG. 16, the vertical axis represents deviation and the horizontal axis represents time. Also, the graph of FIG. 16 shows the waveform of the deviation during the period in which the exposure processing is sequentially performed on a plurality of shot areas on the wafer 4 . In FIG. 16, sections separated by dotted lines indicate a period (A) during which the shot area is exposed and a period (B) during which the shot area is not exposed. Since scanning exposure is performed in the period A, the wafer stage 6 is driven to move at a constant speed. In period B, the wafer stage 6 is accelerated to move the exposure area to the next shot area. FIG. 16(a) is a graph when the control of the wafer stage 6 is normal, and is a graph when no abnormality has occurred in the synchronization accuracy. FIG. 16(b) is a graph when synchronization accuracy abnormality occurs due to initial position abnormality. It is characteristic that a large deviation occurs at the start of the period A when the initial position error is the factor. Further, FIG. 16(c) is a graph when synchronization accuracy abnormality occurs due to oscillation. When oscillation is the factor, it is characterized by the waveform of the deviation oscillating with a large amplitude over the entire period. FIG. 16(d) is a graph in the case where a foreign substance adheres to the wafer chuck 5, and is a graph in the case where synchronization accuracy abnormality occurs due to the foreign substance adherence. When the substrate is the factor, it is characterized by irregular and large changes in the waveform of the deviation. As described above, the deviation waveform of the wafer stage 6 has characteristics due to the cause of the synchronization accuracy abnormality, and the diagnosis apparatus 300 can estimate the cause of the synchronization accuracy abnormality from the characteristics of the deviation waveform of the wafer stage 6 .

Returning to the description of FIG. 15 here. At step 1502, the maintenance unit 404 analyzes the collected data and estimates the cause of the abnormality that has occurred. As a method for estimating the cause of abnormality, known techniques such as factor estimation by correlation coefficient and factor estimation by frequency analysis can be used. Also, a decision tree, a random forest, a support vector machine, or a neural network may be used using the information of collected collected data. At step 1503, the maintenance unit 404 searches for a maintenance method corresponding to the estimated cause in the information (fourth information) on the relationship between the cause of the abnormality and the maintenance method.

Here, the relationship between the cause of the abnormality and the maintenance method will be described. FIG. 17 is a diagram showing the relationship between the cause of abnormality and the maintenance method. If the factor of the initial position error is estimated in step 1502, control parameter adjustment corresponds as a maintenance method. In addition, when the factor of oscillation is estimated, filter adjustment is taken as a maintenance method. In addition, when the factor of adhesion of foreign matter is removed, chuck cleaning is used as a maintenance method. The relationship between the cause of abnormality and the maintenance method shown in FIG. 17 is an example, and the relationship between the cause of abnormality and the maintenance method is not limited to the example shown in FIG.

Returning to the description of FIG. 15 here. At step 1504, the maintenance unit 404 determines whether there is a maintenance method corresponding to the estimated factor. If the maintenance method exists, the process proceeds to step 1505, and if the maintenance method does not exist, the process ends. In step 1505, the maintenance unit 404 determines the retrieved maintenance method as the maintenance method for the exposure apparatus from which the collected data determined to be abnormal has been collected.

Also, although the wafer stage 6 has been described here, the maintenance method can be similarly determined for the reticle stage 2 as well. Further, the maintenance method determination method in the present embodiment can be implemented in place of the maintenance method determination method in the first embodiment, or can be implemented in combination with the maintenance method determination method in the first embodiment. In that case, the maintenance methods determined by the two determination methods may be prioritized to determine the maintenance method, or a plurality of maintenance methods may be output to the exposure apparatus 204 and selected by the exposure apparatus 204. You can do it.

As described above, by estimating the cause of the abnormality of the lithographic apparatus and determining the maintenance method, it is possible to determine the maintenance method that can eliminate the abnormality.

Next, a lithography system according to this embodiment will be described. Matters not mentioned here can conform to the first and second embodiments.

A lithography system according to this embodiment includes a plurality of diagnostic apparatuses and a centralized control apparatus. FIG. 18 shows an example of a lithography system configured with multiple diagnostic devices and a centralized control device. The lithographic system 101 of this embodiment includes lithographic apparatus 210-217, a first diagnostic apparatus 310 and a second diagnostic apparatus 311 for determining an abnormality in the lithographic apparatus and determining a maintenance method for maintaining the lithographic apparatus; and a centralized control device 312 . Also, the lithographic apparatuses 210 - 213 are connected to a first diagnostic apparatus 310 and the lithographic apparatuses 214 - 217 are connected to a second diagnostic apparatus 311 . The first diagnostic device 310 and the second diagnostic device 311 are connected to a centralized control device 312 . Also, although lithographic apparatuses 210 to 207 are configured in FIG. 18, the number of lithographic apparatuses is not limited to eight. Also, although the first diagnostic device 310 and the second diagnostic device 311 are configured in FIG. 18, the number of diagnostic devices is not limited to two.

The first diagnostic device 310, the second diagnostic device 311, and the central control device 312 are the information processing devices described in the first embodiment. The centralized control device 312 acquires lot data of the lithography apparatuses 210 to 217 via the first diagnostic device 310 and the second diagnostic device 311 and stores them in the storage device 304 as accumulated data. Also, the centralized control device 312 similarly acquires history information and stores it in the storage device 304 . Based on accumulated data and history information, the centralized control device 312 stores reference data, data that defines the allowable range of collected data, data that indicates the correspondence between anomalies and maintenance methods, and data that indicates the correspondence between causes of anomalies and maintenance methods. get. The central control device 312 outputs information such as the acquired reference data to the first diagnostic device 310 and the second diagnostic device 311 . A first diagnostic device 310 and a second diagnostic device 311 determine an abnormality of the lithographic apparatus and determine a maintenance method based on information such as reference data acquired from the centralized control device 312 . Each of the first diagnostic apparatus 310 and the second diagnostic apparatus 311 uses information such as lot data acquired from a lithographic apparatus connected to another diagnostic apparatus, reference data acquired based on history information, and the like. can be done.

The centralized control device 312 may periodically output information such as reference data to the first diagnostic device 310 and the second diagnostic device 311, and may receive requests from the first diagnostic device 310 and the second diagnostic device 311. may be output according to

As described above, an abnormality occurring in the lithographic apparatus can be accurately determined, and a maintenance method capable of resolving the abnormality can be executed.

(Product manufacturing method)
The method for manufacturing an article according to the present embodiment is suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.). Such a manufacturing method includes a step of exposing a substrate coated with a photosensitive agent (forming a pattern on the substrate) and a step of developing the exposed substrate (processing the substrate) using an exposure apparatus. Moreover, such a manufacturing method includes a step of contacting an imprint material supplied on a substrate and a mold using an imprint apparatus to form a composition having the shape of the mold transferred. Such manufacturing methods may also include other well-known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous in at least one of performance, quality, productivity and production cost of the article as compared with conventional methods.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof. Although an exposure apparatus has been described as an example of a lithographic apparatus, it is not so limited.

An example of the lithographic apparatus may be an imprinting apparatus that brings an imprinting material supplied onto a substrate into contact with a mold to form a composition having the shape of the mold transferred. Further, as an example of a lithography apparatus, an apparatus such as a drawing apparatus that forms a pattern on a substrate by drawing on a substrate with a charged particle beam (such as an electron beam or an ion beam) through a charged particle optical system may be used. . In addition, in manufacturing articles such as devices, such as a coating device that applies a photosensitive medium onto the surface of a substrate and a developing device that develops a substrate on which a pattern has been transferred, a process performed by an apparatus such as an imprinting apparatus as described above. It may also include manufacturing equipment that performs processes other than the above.

In addition, Examples 1 to 3 can be implemented not only independently, but also in combination with Examples 1 to 3.

Claims (24)

obtaining first collected data associated with each of a plurality of lithographic processes performed under a first process condition that predetermines conditions of a lithographic process performed in a pattern forming lithographic apparatus; an acquiring means for acquiring second collected data associated with each of a plurality of lithographic processes performed under second processing conditions that predetermine the conditions of the lithographic processes;
calculating a first allowable range based on the accumulated data of the first collected data obtained by the obtaining means , and calculating the first allowable range based on the accumulated data of the second collected data obtained by the obtaining means; a calculation means for calculating a second allowable range different from the allowable range;
determining that an abnormality has occurred in the third collected data when third collected data related to lithography processing performed under the first processing condition is outside the first allowable range; determining means for determining that an abnormality has occurred in the fourth collected data when the fourth collected data related to the lithographic processing performed under the second processing condition is outside the second allowable range;
An information processing device comprising: determining means for determining a maintenance method for maintaining the lithographic apparatus when the determining means determines that the third collected data or the fourth collected data is abnormal; 1. The information processing device according to 1. When the determining means determines that the third collected data or the fourth collected data is abnormal,
a type of the anomaly, a processing condition applied to a lithographic process performed when the third collected data or the fourth collected data was collected, and a maintenance method performed to maintain the lithographic apparatus; 3. The information processing apparatus according to claim 2, wherein the maintenance method is determined based on the execution result corresponding to the maintenance method. When the determining means determines that the third collected data or the fourth collected data is abnormal,
determining the maintenance method based on a cause of an abnormality occurring in the third collected data or the fourth collected data and a maintenance method corresponding to the cause of the abnormality and executed to maintain the lithographic apparatus; 3. The information processing apparatus according to claim 2, wherein the determination is made. 5. An information processing apparatus according to claim 2, further comprising output means for outputting a command for executing said maintenance method determined by said determination means. updating the first allowable range based on the third collected data when the third collected data is obtained, and updating the second allowable range based on the fourth collected data when the fourth collected data is obtained; 6. The information processing apparatus according to any one of claims 1 to 5, further comprising updating means for updating the range. The first collected data, the second collected data, the third collected data, and the fourth collected data include synchronization accuracy data indicating relative positional errors of a plurality of stages provided in the lithographic apparatus. 7. The information processing apparatus according to any one of claims 1 to 6, characterized by: The first collected data, the second collected data, the third collected data, and the fourth collected data include illuminance data indicating the illuminance of light emitted by an optical system provided in the lithographic apparatus. The information processing apparatus according to any one of claims 1 to 7, wherein: The first collected data, the second collected data, the third collected data, and the fourth collected data are stage deviation data indicating a deviation between a target position and a measurement position in controlling a stage provided in the lithography apparatus. 9. The information processing apparatus according to any one of claims 1 to 8, comprising: The first collected data, the second collected data, the third collected data, and the fourth collected data include alignment measurement data related to image signals obtained by imaging marks on the substrate forming the pattern. 10. The information processing apparatus according to any one of claims 1 to 9. 11. The first allowable range is calculated based on statistical values relating to the first collected data, and the second allowable range is calculated based on statistical values relating to the first collected data. The information processing device according to any one of . The first acceptable range is calculated based on the mean and standard deviation for the first collected data, or the median and standard deviation for the first collected data, and the second acceptable range is the mean for the second collected data 12. The information processing apparatus according to claim 11, which is calculated based on a value and standard deviation, or a median value and standard deviation of the second collected data. The first allowable range is calculated based on one of the difference from the average value of the first collected data, the difference from the median value of the first collected data, the ratio to the average value, and the ratio to the median value. , the second allowable range is calculated based on one of the difference from the average value of the second collected data, the difference from the median value of the second collected data, the ratio to the average value, and the ratio to the median value 12. The information processing apparatus according to claim 11, wherein: 14. Any one of claims 1 to 13, wherein the first allowable range and the second allowable range include a plurality of allowable ranges, and abnormalities classified into stepwise levels are determined. The information processing device described. 15. The first processing condition and the second processing condition include at least one of a transport condition, a positioning condition, a measurement condition, an exposure condition, and a setup condition. The information processing device according to . The obtaining means obtains the first collected data and the second collected data from a plurality of lithographic apparatuses, and the calculating means calculates the first tolerance and the second tolerance for each of the plurality of lithographic apparatuses. 16. The information processing apparatus according to any one of claims 1 to 15, wherein a is obtained. obtaining first collected data associated with each of a plurality of lithographic processes performed under a first process condition that predetermines conditions of a lithographic process performed in a pattern forming lithographic apparatus; an acquiring means for acquiring second collected data associated with each of a plurality of lithographic processes performed under second processing conditions that predetermine the conditions of the lithographic processes;
The first collected data obtained by the obtaining means defines a first allowable range for determining that an abnormality has occurred in third collected data related to lithography processing performed under the first processing conditions. is calculated based on the accumulated data , and it is determined that there is an abnormality in the fourth collected data related to the lithographic processing performed under the second processing condition, different from the first allowable range. a calculating means for calculating a second allowable range for performing based on data in which the second collected data acquired by the acquiring means is accumulated ;
An information processing device comprising: obtaining first collected data associated with each of a plurality of lithographic processes performed under a first process condition that predetermines conditions of a lithographic process performed in a pattern forming lithographic apparatus; an acquiring step of acquiring second collected data associated with each of a plurality of lithographic processes performed under second process conditions that predetermine the conditions of the lithographic processes;
calculating a first allowable range based on the accumulated data of the first collected data obtained in the obtaining step ; and calculating the first allowable range based on the accumulated second collected data obtained in the obtaining step a calculating step of calculating a second allowable range different from the allowable range;
determining that an abnormality has occurred in the third collected data when third collected data related to lithography processing performed under the first processing condition is outside the first allowable range; a determination step of determining that an abnormality has occurred in the fourth collected data when the fourth collected data related to the lithographic processing performed under the second processing condition is outside the second allowable range;
A determination method characterized by having obtaining first collected data associated with each of a plurality of lithographic processes performed under a first process condition that predetermines conditions of a lithographic process performed in a pattern forming lithographic apparatus; an acquiring step of acquiring second collected data associated with each of a plurality of lithographic processes performed under second process conditions that predetermine the conditions of the lithographic processes;
calculating a first allowable range based on the accumulated data of the first collected data obtained in the obtaining step ; and calculating the first allowable range based on the accumulated second collected data obtained in the obtaining step a calculating step of calculating a second allowable range different from the allowable range;
determining that an abnormality has occurred in the third collected data when third collected data related to lithography processing performed under the first processing condition is outside the first allowable range; a determination step of determining that an abnormality has occurred in the fourth collected data when the fourth collected data related to the lithographic processing performed under the second processing condition is outside the second allowable range;
A program characterized by causing a computer to execute a determination method having an information processing apparatus according to any one of claims 1 to 17;
A lithography system, comprising: a lithography apparatus for forming a pattern on a substrate. a forming step of forming a pattern on a substrate;
a manufacturing step of manufacturing an article from the substrate on which the pattern has been formed in the forming step;
The forming step includes
obtaining first collected data associated with each of a plurality of lithographic processes performed under a first process condition that predetermines conditions of a lithographic process performed in a pattern forming lithographic apparatus; an acquiring step of acquiring second collected data associated with each of a plurality of lithographic processes performed under second process conditions that predetermine the conditions of the lithographic processes;
calculating a first allowable range obtained based on the accumulated data of the first collected data obtained in the obtaining step, and based on the accumulated data of the second collected data obtained in the obtaining step; a calculating step of calculating a second allowable range different from the first allowable range;
determining that an abnormality has occurred in the third collected data when third collected data related to lithography processing performed under the first processing condition is outside the first allowable range; a determining step of determining that an abnormality has occurred in the fourth collected data when the fourth collected data related to the lithographic processing performed under the second processing condition is outside the second allowable range; A method for manufacturing an article, characterized by comprising: obtaining first collected data associated with each of a plurality of lithographic processes performed under a first process condition that predetermines conditions of a lithographic process performed in a pattern forming lithographic apparatus; an acquiring step of acquiring second collected data associated with each of a plurality of lithographic processes performed under second process conditions that predetermine the conditions of the lithographic processes;
The first collected data obtained in the obtaining step defines a first allowable range for determining that an abnormality has occurred in third collected data related to lithography processing performed under the first processing conditions. is calculated based on the accumulated data , and it is determined that there is an abnormality in the fourth collected data related to the lithographic processing performed under the second processing condition, different from the first allowable range. a calculating step of calculating a second allowable range for performing based on the accumulated data of the second collected data obtained in the obtaining step ;
A calculation method characterized by having obtaining first collected data associated with each of a plurality of lithographic processes performed under a first process condition that predetermines conditions of a lithographic process performed in a pattern forming lithographic apparatus; an acquiring step of acquiring second collected data associated with each of a plurality of lithographic processes performed under second process conditions that predetermine the conditions of the lithographic processes;
The first collected data obtained in the obtaining step defines a first allowable range for determining that an abnormality has occurred in third collected data related to lithography processing performed under the first processing conditions. is calculated based on the accumulated data , and it is determined that there is an abnormality in the fourth collected data related to the lithographic processing performed under the second processing condition, different from the first allowable range. a calculating step of calculating a second allowable range for performing based on the accumulated data of the second collected data obtained in the obtaining step ;
A program characterized by causing a computer to execute a calculation method having a forming step of forming a pattern on a substrate;
a manufacturing step of manufacturing an article from the substrate on which the pattern has been formed in the forming step;
The forming step includes
obtaining first collected data associated with each of a plurality of lithographic processes performed under a first process condition that predetermines conditions of a lithographic process performed in a pattern forming lithographic apparatus; an acquiring step of acquiring second collected data associated with each of a plurality of lithographic processes performed under second process conditions that predetermine the conditions of the lithographic processes;
The first collected data obtained in the obtaining step defines a first allowable range for determining that an abnormality has occurred in third collected data related to lithography processing performed under the first processing conditions. is calculated based on the accumulated data , and it is determined that there is an abnormality in the fourth collected data related to the lithographic processing performed under the second processing condition, different from the first allowable range. a calculating step of calculating a second allowable range for performing based on the accumulated data of the second collected data obtained in the obtaining step ;
A method for manufacturing an article, comprising:

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