JP7273641B2 - Conversion socket, erroneous insertion detection device and erroneous insertion detection method - Google Patents

Description

The present invention relates to a conversion socket, an erroneous insertion detection device, and an erroneous insertion detection method.

A multifunction machine is provided with a control unit for controlling the entire multifunction machine and for controlling each part. The control unit usually includes a CPU (Central Processing Unit) for performing arithmetic processing, a non-volatile memory for storing programs and data read and executed by the CPU, and a temporary storage for the program. volatile memory, and an input/output unit for interfacing with each unit of the MFP. These are interconnected by a bus within the control unit.

As the nonvolatile memory, for example, an IC memory 121 as shown in FIG. 1 is used.

The IC memory 121 has a total of three input terminals (A0 terminal to A2 terminal) to which addresses A0 to A2 are assigned, an input terminal (ground terminal (GND terminal)) to which ground GND is assigned, and serial data SDA. Input/output terminal assigned (serial data terminal (SDA terminal)), input terminal assigned serial clock SCL (serial clock (SCL terminal) terminal), input terminal assigned write protect WP (write protect terminal (WP terminal)) and an input terminal (power supply terminal (VCC terminal)) to which the power supply VCC is assigned.

The IC memory 121 has a predetermined package form, and can be inserted into and removed from a corresponding socket.

To write data to the IC memory 121, the IC memory 121 is plugged into a socket provided with a data writing device. As a result, the GND terminal, A0 to A2 terminals, SDA terminal, SCL terminal, WP terminal and VCC terminal provided in the IC memory are connected to the GND terminal, A0 to A2 terminals, SDA terminal, SCL terminal, WP terminal and VCC terminal provided in the socket. Each is connected to a VCC terminal.

A GND terminal and a WP terminal provided in a socket of the data writing device are connected to GND, a power supply is connected to the VCC terminal, a serial data line is connected to the SDA terminal, and a serial clock line is connected to the SCL terminal. ing.

A user of the data writing device sets the GND potential or the power supply potential to each terminal of the A0 terminal to the A2 terminal. Here, it is possible to supply a voltage of GND or a power supply voltage (corresponding to HIGH or LOW in logic level) to the A0 terminal to A2 terminal of the IC memory 121, respectively. The IC memory 121 is valid only when the combination of the voltage level of the A2 terminal and the address supplied to the SDA terminal of the IC memory 121 are matched. Therefore, for example, when writing data to the IC memory 121 to be enabled when the address is zero, the GND potential is set to the A0 terminal to the A2 terminal of the data writing device.

If the WP terminal is HIGH, writing is prohibited, and if the WP terminal is LOW, rewriting is possible. In this example in which the WP terminal is connected to GND, the WP terminal is LOW, and data can be written to the IC memory 121 .

When data is written by a data writing device to the IC memory 121 whose address is set to zero when used, the GND terminal and A0 to A2 terminals of the IC memory 121 are connected to GND, and the VCC terminal is connected to the power supply. . Also, the WP terminal is connected to GND. In this state, the clock signal supplied to the SCL terminal through the serial clock line and the address signal and serial data signal supplied to the SDA terminal through the serial data line generate the address 000B (B is binary) of the IC memory 121. ) is written with a predetermined number of 1-bit data. For example, if the number of clocks used for writing is N, N pieces of 1-bit data are written to address 000B. N is, for example, 256, 512, 1024, and the like.

The IC memory 121 to which data has been written is inserted into a socket provided on the electronic board of the control section of the multifunction machine.

GND is connected to the GND terminal and A0 to A2 terminals provided in the socket of the multifunction device, the power supply is connected to the VCC terminal, the serial data line is connected to the SDA terminal, and the serial clock line is connected to the SCL terminal. It is connected. Also, the WP terminal is set to the power supply voltage.

Therefore, the GND terminal and A0 to A2 terminals of the IC memory 121 are connected to GND, and the VCC terminal is connected to the power supply. The SDA terminal and SCL terminal of the IC memory 121 are connected to the serial data line and serial clock line, respectively. Also, the WP terminal of the IC memory 121 is set to the power supply voltage. Therefore, the IC memory 121 becomes write-inhibited. In other words, the IC memory 121 is used as a read-only memory.

When the MFP is in operation, when N clock signals are supplied to the SCL terminal through the serial clock line, N 1-bit data written in the address 000B of the IC memory 121 are read out. and the SDA terminal of the socket to the serial data line. The 1-bit data output to the serial data line is written, for example, in a temporary storage memory provided on the electronic board.

JP-A-7-30018 JP-A-6-120379

By the way, a DIP (Dual Inline Package) as shown in FIG. 2 is used as a predetermined package for the IC memory 121, and the IC memory 121 may be inserted into a socket (DIP socket) corresponding to the DIP.

FIG. 3 shows a state in which the DIP type IC memory 121 is inserted into the DIP socket 123 in the correct direction.

Although the electronic board of the control unit of the multifunction device may be replaced for maintenance of the multifunction device, the IC memory 121 that can be inserted into and removed from the DIP socket 123 can be used continuously. The electronic board before replacement is replaced with the electronic board after replacement.

As shown in FIG. 3, there is no problem if the DIP type IC memory 121 is inserted into the DIP socket 123 provided on the board after replacement in the correct orientation. However, there is a possibility that the DIP type IC memory 121 may be inserted into the DIP socket 123 rotated 180 degrees due to an operator's mistake, as shown in FIG.

In this case, the GND terminal of the IC memory 121 is connected to the power supply, and the VCC terminal is connected to GND. The SDA terminal, SCL terminal, WP terminal and A2 terminal of the IC memory 121 are connected to GND, the A0 terminal is connected to the serial data line, and the A1 terminal is connected to the serial clock line. The A2 terminal is set to the power supply voltage.

Therefore, a reverse polarity power supply voltage is applied between the GND terminal and the VCC terminal of the IC memory 121, and the IC memory 121 may be destroyed.

In addition, in Patent Document 1, in order to prevent reverse insertion of the IC, only one side of the IC is provided with a notch, and a projection corresponding to this notch is provided at a correct position on the socket side to prevent reverse insertion. An IC and socket invention is disclosed that prevents

In the invention of Patent Document 1, a notch is required on the IC side, and an IC without a notch cannot be prevented from being reversely inserted.

In Patent Document 2, when there is a change in the arrangement of the PIN on the IC side, it is possible to freely change the wiring from the PIN by inserting it between the IC and the socket without changing the conductive pattern of the substrate. An invention of a conversion socket capable of

The invention of Patent Document 2 does not specifically address reverse insertion.

Accordingly, the present invention provides a conversion socket, an erroneous insertion detector, and an erroneous insertion detector that can prevent the IC memory from being destroyed even if the IC memory is inserted into the IC socket in the wrong direction. The purpose is to provide a method.

According to the invention,
a plurality of primary side terminals each connectable to a plurality of terminals provided in the base socket;
a plurality of secondary terminals each connectable to a plurality of terminals provided in the package type integrated circuit;
a plurality of wires that at least partially connect the plurality of primary side terminals and the plurality of secondary side terminals;
A conversion socket comprising:
The plurality of wirings are
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminal connected to the ground terminal of the packaged integrated circuit is connected to the first terminal of the base socket connected to the ground line. The secondary side connected to the connected primary side terminal and connected to the ground terminal of the packaged integrated circuit when the conversion socket is inserted into the base socket in a direction opposite to the correct direction. A conversion socket is provided, characterized in that it includes a ground terminal wire such that the terminal is connected to the primary terminal connected to the second terminal of the base socket which is connected to a ground wire.

Moreover, according to the present invention,
An erroneous insertion detection device for detecting erroneous insertion into a base socket of the conversion socket in which the package type integrated circuit is mounted,
If the conversion socket on which the packaged integrated circuit is mounted is inserted into the base socket, an attempt is made to read data stored in the packaged integrated circuit, and if the reading fails, the package An erroneous insertion detection device is provided, comprising means for determining that the conversion socket in which the integrated circuit is mounted is erroneously inserted into the base socket.

Furthermore, according to the present invention,
An erroneous insertion detection method for detecting erroneous insertion into a base socket of the conversion socket in which the package type integrated circuit is mounted,
If the conversion socket on which the packaged integrated circuit is mounted is inserted into the base socket, an attempt is made to read data stored in the packaged integrated circuit, and if the reading fails, the package An erroneous insertion detection method is provided, characterized in that it is determined that the conversion socket in which the integrated circuit is mounted is erroneously inserted into the base socket.

According to the present invention, even if the IC memory is inserted into the IC socket in the wrong direction, it is possible to prevent the IC memory from being destroyed.

It is a figure which shows the pin assignment of IC memory, and an example of implementation. FIG. 4 is a diagram showing a DIP type IC memory and a DIP socket; FIG. 10 is a diagram showing the relationship between the signal lines and the terminals of the conventional DIP type IC memory when it is inserted into the DIP socket in the correct orientation; FIG. 10 is a diagram showing the relationship between the signal lines and the terminals of the IC memory when the DIP type IC memory according to the conventional example is inserted into the DIP socket in the wrong direction; 1 is a diagram showing a DIP-SOP conversion adapter and an SOP type IC memory mounted therein according to an embodiment of the present invention; FIG. FIG. 4 is a diagram showing the relationship between signal lines and terminals of the IC memory when the DIP-SOP conversion adapter mounted with the SOP type IC memory according to the embodiment of the present invention is inserted into the DIP socket in the correct orientation; FIG. 10 is a diagram showing the relationship between signal lines and terminals of the IC memory when the DIP-SOP conversion adapter mounted with the SOP type IC memory according to the embodiment of the present invention is inserted into the DIP socket in the wrong direction; 1 is a diagram showing a microcomputer mounted on an electronic board according to an embodiment of the present invention, a serial EEPROM which is an SOP type IC memory, and a display section to which the microcomputer is connected; FIG. FIG. 3 is a diagram showing a method of booting a system according to an embodiment of the invention; FIG. 11 is a conceptual cross-sectional view of a multi-function device according to a fourth embodiment of the invention; FIG. 11 is a functional block diagram of a multifunction machine according to a fourth embodiment of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

[First embodiment]
In the embodiment of the present invention, as shown in FIG. 5, the IC memory 131 is not of the DIP type but of the SOP (Small Outline Package) type. Then, the SOP type IC memory 131 is mounted on the DIP-SOP conversion adapter 133 . A PIN arrangement conversion adapter inserted between the DIP type IC memory and the DIP socket may be used instead of the DIP-SOP conversion adapter 133. In this case, the DIP type IC memory is used. Furthermore, the DIP socket may have a function of converting the PIN arrangement.

Then, the DIP-SOP conversion adapter 133 mounted with the SOP type IC memory 131 is inserted into the DIP socket 123 .

Referring to FIG. 5, in the DIP-SOP conversion adapter 133, terminals on the DIP socket 123 side (hereinafter referred to as "primary side terminals") and terminals on the SOP type IC memory 131 side (hereinafter referred to as "secondary side terminals") ) are connected as follows:

Primary side terminal Secondary side terminal A0 terminal A0 terminal A1 terminal A1 terminal, A2 terminal A2 terminal GND terminal GND terminal NC(No Connection)
SDA terminal SDA terminal SCL terminal SCL terminal WP terminal WP terminal VCC terminal VCC terminal Each terminal of the DIP socket 123 is connected to the signal line of the board on which the DIP socket 123 is mounted as follows.

Primary side terminal Signal line A0 terminal GND line A1 terminal GND line A2 terminal GND line GND terminal GND line SDA terminal SDA line SCL terminal SCL line WP terminal GND line VCC terminal VCC terminal may be connected.

Further, the secondary side terminals of the DIP-SOP conversion adapter 133 are connected to the terminals of the SOP type IC memory 131 as follows.

Secondary side terminal IC memory terminal A0 terminal A0 terminal A1 terminal A1 terminal A2 terminal A2 terminal GND terminal GND terminal SDA terminal SDA terminal SCL terminal SCL terminal WP terminal WP terminal VCC terminal VCC terminal Therefore, as shown in FIG. When the DIP-SOP conversion adapter 133 on which the IC memory 131 is mounted is inserted into the DIP socket 123 in the correct direction, each terminal of the SOP type IC memory 131 is connected to the signal line of the substrate on which the DIP socket 123 is mounted. It is connected as follows.

IC memory terminal Signal line A0 terminal GND line A1 terminal GND line A2 terminal GND line GND terminal GND line SDA terminal SDA line SCL terminal SCL line WP terminal GND line VCC terminal VCC line Therefore, giving N clock signals to the SCL line. , N pieces of 1-bit data stored in the address 000B of the SOP type IC memory 131 are read out and output to the SDA line.

Next, as shown in FIG. 7, when the DIP-SOP conversion adapter 133 on which the SOP type IC memory 131 is mounted is inserted into the DIP socket 123 in the opposite direction, each terminal of the SOP type IC memory 131 is , and the signal line of the board on which the DIP socket 123 is mounted, as follows.

IC memory terminal Signal line A0 terminal SDA line (output line)
A1 terminal SCL line (input line)
A2 terminal SCL line (input line)
GND terminal GND line SDA terminal GND line SCL terminal GND line WP terminal GND line VCC terminal GND line Therefore, it is possible to prevent the supply voltage of opposite polarity from being applied between the GND terminal and the VCC terminal of the SOP type IC memory 131 . Therefore, destruction of the SOP type IC memory 131 can be avoided.

Data stored in the SOP type IC memory 131 cannot be read.

In addition, since the A0 terminal of the IC memory 131 is connected to the SDA line, which is an output line, when the IC memory 131 is mounted, a potential higher than the GND potential is not applied to the A0 terminal by the SDA line. can be avoided.

The A1 terminal and A2 terminal of the IC memory 131 are connected to the SCL line, which is an input line. Therefore, the SCL line may apply a potential equal to or higher than the GND potential to the A1 terminal and the A2 terminal. However, if the SCL line is normally at the GND potential and the GND potential and the power supply potential are alternately switched only when data is read, there is not much of a problem.

FIG. 8 shows a microcomputer 201 mounted on the electronic board according to this embodiment, a serial EEPROM 203 which is an SOP type IC memory 131, and a display section 205 connected to the microcomputer 201. FIG.

Referring to FIG. 9, when the system is started (step S301), the microcomputer 201 checks whether data can be read from the serial EEPROM 203 (step S303).

If data can be read from the serial EEPROM 203 (YES in step S303), the system is started.

On the other hand, if the data cannot be read from the serial EEPROM 203 (NO in step S303), an error notification is output (step S307), and the activation is stopped (step S309). The output of the error notification is performed in such a way that a person can recognize it by the five senses through screen display, voice output, or the like.

Therefore, if the data stored in the SOP type IC memory 131 cannot be read, the DIP-SOP conversion adapter 133 having the SOP type IC memory 131 mounted thereon is inserted into the DIP socket 123 in the opposite direction. can be detected. When this is detected, the operator can reinsert the DIP-SOP conversion adapter 133 loaded with the SOP type IC memory 131 into the DIP socket 123 in the correct direction.

[Second embodiment]
In the first embodiment, a readable/writable nonvolatile memory is used as the IC memory, but in the second embodiment, a read only memory (ROM) is used instead.

[Third embodiment]
In the first embodiment, it is assumed that when the board is replaced, the IC memory 131 is replaced from the board before replacement to the board after replacement. In the third embodiment, it is assumed that the IC memory 131 is mounted on the substrate when manufacturing the product. The first embodiment can be applied as it is to the third embodiment.

[Fourth embodiment]
The fourth embodiment relates to the MFP 800 according to the first to third embodiments. 10 and 11 show the configuration of the MFP 800 and the like.

As shown in FIGS. 10 and 11, the MFP 800 includes a document reading device 820 that reads an image of a document, a MFP body (image forming unit body) 830 that forms an image on a sheet, a document reading device 820 and a MFP 830 that forms an image on a sheet. An operation panel section 843 for operating the machine main body 830 and an arithmetic processing section 841 for controlling the document reading device 820 and the multifunction machine main body 830 based on operations by the operation panel section 843 are provided.

In addition to using the document reading device 820 alone for image reading and using the MFP main body 830 alone for image formation, these can be linked to copy images. Moreover, the multi-function device 800 may include a storage device and a facsimile device (not shown). The storage device can store images read by the document reading device 820 and images received by the facsimile device. The facsimile device can transmit images read by the document reading device 820 and images stored in a storage device, and can receive images from the outside. Furthermore, the multi-function device 800 may include an interface for connecting with a personal computer via a network. A personal computer connected to the multifunction device 800 can use the functions of the multifunction device for data that it can manage.

The document reader 820 includes an automatic document feeder SPF (Single Pass Feeder) 824 that automatically feeds a document, and a reader main body 822 that reads an image of the document. In addition to the components shown in FIG. 11, document reading device 820 also includes components shown in FIG. 10, although FIG. 11 is not shown. Further, as shown in FIG. 10, the reading device main body 822 is provided with a document platen 826 .

The multifunction machine main body 830 includes a sheet feeding unit 10 that feeds sheets, a manual feeding unit 20 that can manually feed sheets, and a sheet fed by the sheet feeding unit 10 or the manual feeding unit 20. and an image forming unit 30 for forming an image.

The sheet feeding portion 10 includes a sheet stacking portion 11 for stacking sheets, and a separation feeding portion 12 for separating and feeding the sheets stacked on the sheet stacking portion 11 one by one. The sheet stacking unit 11 includes a middle plate 14 that rotates around a rotation shaft 13. The middle plate 14 rotates and lifts the sheet upward when feeding the sheet. The separation feeding unit 12 includes a pickup roller 15 that feeds the sheet lifted by the intermediate plate 14, and a separation roller pair 16 that separates the sheets fed by the pickup roller 15 one by one. .

The manual feeding section 20 includes a manual feeding tray 21 on which sheets can be stacked, and a separation feeding section 22 for separating and feeding the sheets stacked on the manual feeding tray 21 one by one. The manual feed tray 21 is rotatably supported by the main body 830 of the multi-function machine, and when manually feeding, it is fixed at a predetermined angle so that sheets can be stacked. The separation feeding unit 22 includes a pickup roller 23 that feeds the sheets stacked on the manual feed tray 21, and a separation roller 24 and a separation pad 25 that separate the sheets fed by the pickup roller 23 one by one. I have.

The image forming unit 30 includes four process cartridges 31Y to 31K for forming yellow (Y), magenta (M), cyan (C), and black (K) images, and photosensitive drums 740Y to 740K, which will be described later. a transfer unit (transfer means) 33 for transferring the toner images formed on the surfaces of the photosensitive drums 740Y to 740K onto a sheet; and a fixing unit 34 for fixing the transferred toner images onto the sheet. and have. The letters (Y, M, C, K) attached to the end of the symbols indicate respective colors (yellow, magenta, cyan, black).

Each of the four process cartridges 31Y to 31K is detachable from the multifunction machine main body 830 and is replaceable. Since the four process cartridges 31Y to 31K have the same configuration except that the colors of the images formed are different, only the configuration of the process cartridge 31Y for forming an image of yellow (Y) will be described, and the process cartridge 31M will be described. Description of ∼31K is omitted.

The process cartridge 31Y includes a photoreceptor drum 740Y as an image carrier, a charger 741Y that charges the photoreceptor drum 740Y, a developing device 742Y that develops an electrostatic latent image formed on the photoreceptor drum 740Y, and a photosensitive drum 740Y. and a drum cleaner 743Y for removing toner remaining on the surface of the body drum 740Y. The developing device 742Y includes a developing device body (not shown in detail) that develops the photosensitive drum 740Y, and a toner cartridge (not shown in detail) that supplies toner to the developing device body. The toner cartridge is configured to be detachable from the developing device main body, and can be removed from the developing device main body and replaced when the contained toner runs out.

The exposure device 32 includes a light source (not shown) that emits laser light, a plurality of mirrors (not shown) that guide the laser light to the photosensitive drums 740Y to 740K, and the like. The transfer unit 33 includes an intermediate transfer belt 35 that carries the toner images formed on the photoreceptor drums 740Y to 740K, and a primary transfer roller that primarily transfers the toner images formed on the photoreceptor drums 740Y to 740K onto the intermediate transfer belt 35. 36Y to 36K, a secondary transfer roller 37 that secondarily transfers the toner image transferred on the intermediate transfer belt 35 onto a sheet, and a belt cleaner 38 that removes toner remaining on the intermediate transfer belt 35 . The intermediate transfer belt 35 is stretched over a driving roller 39a and a driven roller 39b, and pressed against the photosensitive drums 740Y-740K by the primary transfer rollers 36Y-36K. The secondary transfer roller 37 nips (holds) the intermediate transfer belt 35 with the driving roller 39a, and transfers the toner image carried by the intermediate transfer belt 35 to the sheet at the nip portion N. FIG. The fixing section 34 includes a heating roller 34a that heats the sheet, and a pressure roller 34b that presses against the heating roller 34a.

The operation panel section 843 includes a display section 845 that displays predetermined information, and an input section 847 that allows the user to input instructions to the document reading device 820 and the multifunction machine main body 830 . In this embodiment, the operation panel section 843 is arranged on the front side of the reading device main body 822 . The front side corresponds to the front side of the paper surface of FIG. 10, and the back side corresponds to the back side of FIG.

As shown in FIG. 11, the arithmetic processing unit 841 includes a CPU 841a for driving and controlling the sheet feeding unit 10, the manual feeding unit 20, the image forming unit 30, and the document reading device 820, and various programs for operating the CPU 841a. and a memory 841b that stores various information used by the CPU 841a. The arithmetic processing unit 841 integrates and controls the operations of the sheet feeding unit 10, the manual feeding unit 20, the image forming unit 30, and the document reading device 820 based on the operation of the operation panel unit 843 by the user. The sheet is imaged.

The IC socket and IC memory according to the first to third embodiments can be introduced into the arithmetic processing unit 841 . The IC memory stores, for example, a program to be read and executed by the CPU 841a, or stores data read by the CPU 841a when executing the program.

Next, an image forming operation (image forming control by the arithmetic processing unit 841) by the multifunction machine 800 configured as described above will be described. In this embodiment, the image forming section 30 forms an image of the read document fed by the automatic document feeding section 824 and read by the reading device main body 822 on the sheet fed by the sheet feeding section 10. An image forming operation will be described as an example.

When the user inputs an image forming start signal to the input unit 847 of the operation panel unit 843, the read document placed on the automatic document feeder 824 by the user is automatically directed to the document reading position. The document is fed, and the image is read by the reading device main body 822 at the document reading position.

When the image of the document is read by the reading device main body 822, the exposure device 32 irradiates a plurality of laser beams corresponding to each of the photosensitive drums 740Y to 740K based on the image information of the read document. At this time, the photoreceptor drums 740Y to 740K are pre-charged by chargers 741Y to 741K, respectively. An image is formed. After that, the electrostatic latent images formed on the photoreceptor drums 740Y to 740K are developed by developing devices 742Y to 742K, respectively, and yellow (Y), magenta (M), and cyan (C) images are formed on the photoreceptor drums 740Y to 740K. ) and black (K) toner images are formed. The toner images of respective colors formed on the photosensitive drums 740Y to 740K are superimposedly transferred onto the intermediate transfer belt 35 by the primary transfer rollers 36Y to 36K, and the superimposedly transferred toner images (full-color toner images) are transferred to the intermediate transfer belt. It is conveyed to the nip portion N while being carried by 35 .

In parallel with the image forming operation described above, the sheets stacked on the sheet stacking section 11 are separated one by one by the separation feeding section 12 and fed to the sheet conveying path 26 by the pickup roller 15 . Then, the skew is corrected by the registration roller pair 27 upstream of the nip portion N in the sheet conveying direction, and the sheet is conveyed to the nip portion N at a predetermined conveying timing. A full-color toner image carried by the intermediate transfer belt 35 is transferred to the sheet conveyed to the nip portion N by the secondary transfer roller 37 .

The sheet onto which the toner image has been transferred is heated and pressurized by the fixing unit 34 to melt and fix the toner image, and the sheet is discharged outside the apparatus by the discharge roller pair 18 . Sheets discharged outside the apparatus are stacked on the discharged sheet stacking unit 19 .

When images are formed on both sides of the sheet (the first side and the second side), before the sheet with the image formed on the first side is discharged outside the apparatus, the discharge roller pair 18 is rotated in the reverse direction. Then, the sheet is conveyed to the double-sided conveying path 17 and then conveyed to the image forming section 30 again via the double-sided conveying path 17 . Then, similarly to the first side, an image is formed on the second side and discharged to the outside of the apparatus. Sheets discharged outside the apparatus are stacked on the discharged sheet stacking unit 19 .

The invention can be embodied in various other forms without departing from its spirit or essential characteristics. Therefore, each embodiment mentioned above is only an illustration, and should not be interpreted restrictively. The scope of the present invention is indicated by the claims and is not restricted by the text of the specification. Furthermore, all modifications and changes within the equivalent scope of claims are within the scope of the present invention.

INDUSTRIAL APPLICABILITY The present invention can be used for mounting ICs.

121 DIP type IC
123 DIP socket 131 SOP type IC
133 DIP-SOP conversion adapter

Claims (11)

a plurality of primary side terminals each connectable to a plurality of terminals provided in the base socket;
a plurality of secondary terminals each connectable to a plurality of terminals provided in the package type integrated circuit;
a plurality of wires that at least partially connect the plurality of primary side terminals and the plurality of secondary side terminals;
A conversion socket comprising:
The plurality of wirings are
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminal connected to the ground terminal of the packaged integrated circuit is connected to the first terminal of the base socket connected to the ground line. The secondary side connected to the connected primary side terminal and connected to the ground terminal of the packaged integrated circuit when the conversion socket is inserted into the base socket in a direction opposite to the correct direction. a ground terminal wiring whose terminal is connected to the primary side terminal connected to the second terminal of the base socket connected to the ground line ;
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminals connected to the power terminals of the packaged integrated circuit are connected to the power terminals of the base socket connected to the power line. When the conversion socket is inserted into the base socket in a direction opposite to the correct direction, the secondary side terminal connected to the power supply terminal of the packaged integrated circuit is connected to the primary side terminal connected to the ground terminal of the base socket connected to the ground line;
A translation socket containing
If the conversion socket on which the packaged integrated circuit is mounted is inserted into the base socket in a direction opposite to the correct orientation, the data stored in the packaged integrated circuit cannot be read . A conversion socket characterized in that it is possible to prevent a power supply voltage of opposite polarity from being applied between the ground terminal of the package type integrated circuit and the power supply terminal of the package type integrated circuit. The conversion socket according to claim 1,
A conversion socket, wherein the first terminal of the base socket connected to the ground line is an address terminal of the base socket connected to the ground line. The conversion socket according to claim 1 or 2,
A conversion socket, wherein the second terminal of the base socket connected to the ground line is a write protect terminal of the base socket connected to the ground line. The conversion socket according to any one of claims 1 to 3 ,
The plurality of wirings are
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminal connected to the write protect terminal of the package type integrated circuit is the write protect terminal of the base socket connected to the ground line. When the conversion socket is inserted into the base socket in a direction opposite to the correct direction, the secondary side to which the write protect terminal of the package type integrated circuit is connected A conversion socket further comprising a wire for a write protect terminal such that a secondary terminal is connected to the primary terminal connected to an address terminal of a base socket connected to a ground line. The conversion socket according to any one of claims 1 to 4 ,
The plurality of wirings are
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminals connected to the address terminals of the package type integrated circuit are connected to the address terminals of the base socket connected to the ground line. When the conversion socket is inserted into the base socket in a direction opposite to the correct direction, the secondary side terminals connected to the address terminals of the packaged integrated circuit is connected to the serial data terminal of the base socket connected to the serial data line, the serial clock line of the base socket connected to the serial clock line, or the write protect terminal of the base socket connected to the write protect line. A conversion socket further comprising an address terminal wire connected to the terminal. The conversion socket according to any one of claims 1 to 5 ,
The plurality of wirings are
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminal connected to the serial data terminal of the package type integrated circuit is connected to the serial data line of the base socket connected to the serial data line. When the conversion socket is inserted into the base socket in a direction opposite to the correct direction, the serial data terminal of the package type integrated circuit is connected to the primary side terminal connected to the terminal. A conversion socket further comprising serial data terminal wiring such that secondary terminals are connected to said primary terminals connected to address terminals of a base socket connected to address lines. The conversion socket according to any one of claims 1 to 6 ,
The plurality of wirings are
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminal connected to the serial clock terminal of the packaged integrated circuit is the serial clock of the base socket connected to the serial clock line. When the conversion socket is inserted into the base socket in a direction opposite to the correct direction, the serial clock terminal of the package type integrated circuit is connected to the primary side terminal connected to the terminal. A conversion socket further comprising serial clock terminal wiring such that secondary terminals are connected to said primary terminals connected to address terminals of a base socket connected to address lines. a plurality of primary side terminals each connectable to a plurality of terminals provided in the base socket;
a plurality of secondary terminals each connectable to a plurality of terminals provided in the package type integrated circuit;
a plurality of wires that at least partially connect the plurality of primary side terminals and the plurality of secondary side terminals;
In a conversion socket with
The plurality of wirings are
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminal connected to the ground terminal of the packaged integrated circuit is connected to the first terminal of the base socket connected to the ground line. connected to the connected primary side terminal,
When the conversion socket is inserted into the base socket in a direction opposite to the correct direction, the secondary terminal connected to the ground terminal of the package type integrated circuit is connected to the ground line in the base socket. including a ground terminal wiring connected to the primary side terminal connected to the second terminal of
An erroneous insertion detection device for detecting erroneous insertion into a base socket of the conversion socket in which the package type integrated circuit is mounted,
when the conversion socket on which the packaged integrated circuit is mounted is inserted into the base socket, attempting to read data stored in the packaged integrated circuit;
An erroneous insertion detection device, comprising means for determining that said conversion socket in which said package type integrated circuit is mounted is erroneously inserted into said base socket if said reading fails. The incorrect insertion detection device according to claim 8 ,
The erroneous insertion detection device further comprises means for outputting a notification when it is determined that the conversion socket on which the package type integrated circuit is mounted is erroneously inserted into the base socket. a plurality of primary side terminals each connectable to a plurality of terminals provided in the base socket;
a plurality of secondary terminals each connectable to a plurality of terminals provided in the package type integrated circuit;
a plurality of wires that at least partially connect the plurality of primary side terminals and the plurality of secondary side terminals;
In a conversion socket with
The plurality of wirings are
When the conversion socket is inserted into the base socket in the correct direction, the secondary terminal connected to the ground terminal of the packaged integrated circuit is connected to the first terminal of the base socket connected to the ground line. connected to the connected primary side terminal,
When the conversion socket is inserted into the base socket in a direction opposite to the correct direction, the secondary terminal connected to the ground terminal of the package type integrated circuit is connected to the ground line in the base socket. including a ground terminal wiring connected to the primary side terminal connected to the second terminal of
An erroneous insertion detection method for detecting erroneous insertion into a base socket of the conversion socket on which the package type integrated circuit is mounted, comprising:
when the conversion socket on which the packaged integrated circuit is mounted is inserted into the base socket, attempting to read data stored in the packaged integrated circuit;
If the reading fails, it is determined that the conversion socket in which the package type integrated circuit is mounted is erroneously inserted into the base socket. The erroneous insertion detection method according to claim 10 ,
An erroneous insertion detection method, comprising outputting a notification when it is determined that said conversion socket on which said package type integrated circuit is mounted is erroneously inserted into said base socket.

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