JP7286384B2 - Image Stabilizer and Electronics - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a blur correction device and an electronic device, and more particularly to a blur correction device that corrects camera shake during shooting.

2. Description of the Related Art In general, as one type of electronic equipment, an imaging apparatus is known that includes a blur correction device that corrects camera shake during shooting. Blurring correction performed by the blur correction device includes a method of driving an optical lens in a direction perpendicular to the optical axis and a method of driving an imaging element in a direction perpendicular to the optical axis. For example, there is an image pickup apparatus that performs shake correction by driving an image pickup element with a voice coil motor that includes a magnet and a coil (Patent Document 1).

By the way, in the voice coil motor, it is known that electromagnetic waves are generated from the coil and affect the imaging device. For this reason, as a general countermeasure, a structure that magnetically isolates the coil, which is a noise source, from other parts or a shield member is used.

For example, there is a camera in which a camera lens is provided with a motion compensation mechanism having a voice coil motor, and a shield member made of a magnetic material is arranged to shield electromagnetic waves (magnetic field) generated from the coil (Patent Document 2).

JP 2010-15107 A JP 2017-173757 A

However, when the coil is arranged near the imaging element as in the imaging apparatus described in Patent Document 1, the magnetic field generated by the coil reaches the imaging element and adversely affects the image as magnetic noise. Furthermore, as imaging devices become more sensitive, in addition to the coil, which is a noise source, the weak magnetic field from the solder joints of the coil terminals and the wiring pattern to which the coil is connected adversely affects images as magnetic noise. I give.

On the other hand, since the distance between the imaging element and the coil is narrow, it is difficult to dispose a shield member between the imaging element and the coil as described in Patent Document 2.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a blur correction device and an electronic device that can reduce the influence of a magnetic field on an imaging element while achieving miniaturization.

In order to achieve the above object, a blur correction device according to the present invention is used in an electronic device comprising an image pickup device that outputs an image signal corresponding to an optical image formed through an image pickup optical system. A blur correction device that corrects blurring occurring in an image indicated by the image signal by moving the imaging optical system in a direction orthogonal to the optical axis, wherein the imaging device is held and moved in the direction orthogonal to the optical axis. a metal movable member, a coil arranged on the movable member to which electric power is supplied, a mounting member on which the coil is mounted, and the coil and the mounting member arranged outside the outer circumference of the coil. and a permanent magnet disposed opposite the coil, the movable member being moved by the coil and the permanent magnet to locate the connection. is arranged at a position farther from the imaging device than the side of the coil closest to the imaging device.

According to the present invention, it is possible to reduce the influence of the magnetic field on the imaging element while achieving miniaturization.

It is a figure showing an example of an imaging device provided with a shake correction device by a 1st embodiment of the present invention. FIG. 2 is a diagram for explaining a blur correction unit shown in FIG. 1 (No. 1); FIG. 2 is a diagram for explaining the blur correction unit shown in FIG. 1 (No. 2); 3 is a view of the movable part shown in FIG. 2 as seen from the side of the lower fixing part; FIG. 5 is an enlarged view of the main part of the movable part shown in FIG. 4 and schematically shows a current flowing through a coil and a canceling current for generating a canceling magnetic field from the movable frame; FIG. FIG. 4 is a diagram schematically showing a magnetic field of a coil by enlarging a main part in the cross-sectional view shown in FIG. 3 ; FIG. 10 is a diagram showing an FPC, wiring patterns, and soldering portions in a motion compensation device used in a second embodiment of the present invention; FIG. 8 is a diagram for explaining the positional relationship of the soldering portions shown in FIG. 7;

An example of an imaging apparatus provided with a blur correction device according to an embodiment of the present invention will be described below with reference to the drawings.

[First embodiment]
FIG. 1 is a diagram showing an example of an imaging device equipped with a blur correction device according to a first embodiment of the present invention. FIG. 1(a) is a cutaway view of the imaging apparatus, and FIG. 1(b) is a diagram illustrating a control system of the imaging apparatus.

The illustrated imaging apparatus, for example, a digital camera (hereinafter simply referred to as a camera) includes a camera body 1 and a photographing lens unit (hereinafter simply referred to as a photographing lens) 2 . A photographing lens 2 is attached to the camera body 1 .

The photographing lens 2 includes a photographing optical system 3 composed of a plurality of lenses for taking in a subject image (optical image), a lens system control 12 for controlling the photographing lens 2, and a lens driving section 13 for driving the photographing optical system 3. are provided. The camera body 1 is provided with an imaging element 6 that forms an optical image through the photographing lens 2 . Further, the camera body 1 is provided with a rear display device 9 a , an EVF 9 b , a blur correction section 14 , a blur detection section 15 , a shutter mechanism 16 and a shutter drive section 17 . In addition, the camera body 1 is provided with a camera system control section 5, an image processing section 7, a memory 8, and an operation detection section 10, and the rear display device 9a and EVF 9b shown in FIG. ) are collectively shown as the display unit 9 .

The camera system control section 5 communicates with the lens system control section 12 via the electrical contact 11 , and power is supplied from the camera body 1 to the photographing lens 2 via the electrical contact 11 .

Under the control of the lens system control unit 12 , the lens driving unit 13 drives the focus lens, the diaphragm, and the like provided in the imaging optical system 3 . A shake detector 15 detects rotational shake of the camera including rotation around the optical axis 4 . For example, a vibrating gyroscope is used for the shake detection unit 15 . The blur correction unit 14 translates the imaging element 6 in a direction perpendicular to the optical axis 4 and rotates it around the optical axis 4 to correct blur as described later.

Under the control of the camera system control unit 5 , the shutter drive unit 17 drives the shutter mechanism 16 to run the shutter curtain and expose the imaging element 6 . An optical image is formed on the imaging device 6 via the imaging optical system 3, and the imaging device 6 outputs an image signal corresponding to the optical image by photoelectric conversion.

The image processing unit 7 includes, for example, an A/D converter, a white balance adjustment circuit, a gamma correction circuit, and an interpolation calculation circuit. The image processing unit 7 performs predetermined image processing on the image signal output from the image sensor 6 to generate image data for recording. A color interpolation processing unit is provided in the image processing unit 7, and the color interpolation processing unit performs color interpolation (demosaicing) processing on image signals in Bayer array to generate color image data. The image processing unit 7 also compresses images (still images), moving images, audio, and the like using a predetermined method.

A focus evaluation amount and an exposure amount are obtained from the image data output from the image processing unit 7 . The camera system controller 5 drives and controls the photographic optical system 3 by means of the lens system controller 12 in accordance with the focus evaluation amount and the exposure amount. As a result, an optical image with an appropriate amount of light is formed on the imaging device 6 .

The camera system control section 5 controls the image processing section 7 to record the image data in the memory 8 . Furthermore, the camera system control section 5 displays an image corresponding to the image data on the display section 9 .

A camera system control unit 5 outputs a timing signal and the like for imaging. Furthermore, the camera system control unit 5 controls the camera according to user operations. For example, when the operation detection unit 10 detects that a shutter release button (not shown) has been pressed, the camera system control unit 5 drives the image sensor 6 and controls the image processing unit 7 to perform compression processing and the like.

Further, the camera system control unit 5 displays information related to shooting and the like on the display unit 9 . A touch panel is provided on the rear display device 9 a and the touch panel is connected to the operation detection section 10 . The camera system control section 5 controls the blur correction section 14 based on the detection result obtained by the blur detection section 15 .

2 and 3 are diagrams for explaining the blur correction unit shown in FIG. 1. FIG. FIG. 2(a) is a perspective view showing the configuration of the shake correction section, and FIG. 2(b) is an exploded perspective view showing the shake correction section. Also, FIG. 3(a) is a view of the blur correction unit as viewed from above, and FIG. 3(b) is a cross-sectional view taken along line AA shown in FIG. 3(a). Note that the photographing lens 2 is positioned in the positive direction of the Z-axis in the coordinate system shown in FIGS.

In FIG. 2 , the Z-axis direction is parallel to the optical axis 4 . The blur correction section 14 has a metallic movable section (movable member) 50 , an upper surface fixed section (fixed member) 60 and a lower surface fixed section (fixed member) 70 . The imaging element 6 is mounted on the movable portion (movable member) 50 .

The movable section 50 is movable in a direction perpendicular to (crossing) the optical axis of the imaging optical system, as will be described later. The movable portion 50 includes a movable frame 51, coils 53a to 53c, and magnetic sensors 54a to 54c.

As shown, the coils 53a-53c are connected to the FPC 55 by soldering portions (not shown in FIG. 2), which are located in movable frame recesses 57a-57c provided in the movable frame 51. be.

The upper fixed portion 60 is provided with an upper yoke 61 and permanent magnets 62a to 62f. The lower fixing portion 70 has a base plate (supporting member) 71, and the base plate 71 defines ball rolling surfaces 72a to 72c. Further, the lower fixing portion 70 is provided with main spacers 73a to 73c, sub-spacers 74a and 74b, and a lower yoke 75. As shown in FIG. Permanent magnets 76a to 76f are arranged on the lower yoke 75, and rolling balls 77a to 77c are positioned on the ball rolling surfaces 72a to 72c, respectively.

In the illustrated example, the upper yoke 61 and the magnets 62a to 62f and the lower yoke 75 and the magnets 76a to 76f form a magnetic circuit, which is a so-called closed magnetic circuit. The magnets 62a to 62f are adhered and fixed to the upper yoke 61 while being attracted to it. Similarly, the magnets 76a to 76f are adhered and fixed to the lower yoke 75 while being attracted to it. Each of these magnets is magnetized in the direction of the optical axis 4 . Adjacent magnets 62a and 62b, 62c and 62d, and 62e and 62f are magnetized in different directions. Similarly, magnets 76a and 76b, magnets 76c and 76d, and magnets 76e and 76f are magnetized in different directions.

In FIG. 3(b), S and N shown in magnets 62e, 62f, 76e, and 76f represent magnetization directions. That is, the magnetization directions of the adjacent magnets 62e and 62f are different from each other, and similarly, the magnetization directions of the adjacent magnets 76e and 76f are different from each other.

Magnets 62a and 76a, magnets 62b and 76b, magnets 62c and 76c, magnets 62d and 76d, magnets 62e and 76e, and magnets 62f and 76f, which are magnets arranged at positions facing each other, are magnetized in the same direction. be.

In FIG. 3(b), the magnetization directions of the magnets 62e and 76e, which are arranged to face each other, are the same. are in the same direction.

By defining the magnetization direction of the magnet in this way, a strong magnetic flux density is generated in the direction of the optical axis 4 between the upper yoke 61 and the lower yoke 75 .

Main spacers 73a to 73c and sub-spacers 74a and 74b are arranged between the upper yoke 61 and the lower yoke 75 to keep the upper yoke 61 and the lower yoke 75 at a predetermined distance. A movable portion 50 is arranged with a gap between the upper yoke 61 and the lower yoke 75 . Each of the main spacers 73a to 73c is provided with rubber on its cylindrical side surface, thereby forming a mechanical end of the movable part 50 (so-called stopper).

Holes are formed in the base plate 71 so as to avoid the magnets 76a to 76f, and the faces of the magnets protrude from these holes. The base plate 71 and the lower yoke 75 are fixed with screws (not shown), and the magnets 76a to 76f, which are larger than the base plate 71 in the thickness direction, are fixed so as to protrude from the base plate 71. .

The movable part 50 is configured by fixing the above elements to the movable frame 51 . The movable frame 51 is made of non-magnetic aluminum die-cast, and the imaging element 6 and the FPC 55 are mounted on the movable frame 51 . Furthermore, coils 53a to 53c are mounted on the surface of the FPC 55, which is a mounting member, on the side of the bottom fixing portion 70 (in the negative direction of the Z axis), and the FPC 55 supplies electric power required to drive the coils 53a to 53c.

The FPC 55 is connected to the outside through a connector (not shown). The movable frame 51 has a thickness such that at least a portion of the movable frame 51 has a surface facing a surface defined by the outer circumferences of the coils 53a to 53c. Here, the movable frame 51 has such a thickness as to face the entire surface defined by the outer peripheries of the coils 53a to 53c.

FIG. 4 is a view of the movable portion shown in FIG. 2 as viewed from the side of the lower fixing portion.

Soldering portions (connecting portions) 56 a and 56 d are connecting portions for connecting the coil 53 a and the FPC 55 . Similarly, the soldering portions 56b and 56e are connecting portions connecting the coil 53b and the FPC 55, and the soldering portions 56c and 56f are connecting portions connecting the coil 53c and the FPC 55. FIG. In addition, in the illustrated example, the position of the imaging device 6 is indicated by a dashed line.

Each of the coils 53a to 53c has a winding start terminal and a winding end terminal, and for convenience of work, one end of the wiring end of the winding is positioned on the hollow portion side and the other is positioned on the outside of the outer periphery of the coil. In the illustrated example, the space in the hollow portions of the coils 53a to 53c is limited in order to reduce the size of the coils 53a to 53c. Therefore, soldering portions 56a to 56c connecting the FPC 55 and one end of each of the coils 53a to 53c are arranged outside the outer periphery of the coils 53a to 53c. Furthermore, the other ends of the coils 53a to 53c are connected to the FPC 55 located on the hollow side (inside the inner periphery) by means of 56d to 56f.

Gaps are defined between the movable frame 51 and the coils 53a to 53c. In addition to these gaps, movable frame recesses (clearances) 57a to 57c are formed in the movable frame 51 for providing soldering portions 56a to 56c adjacent to the coils 53a to 53c. These movable frame concave portions 57a to 57c are arranged farther than the outer peripheral side closest to the imaging device 6 in the coils 53a to 53c. More preferably, the movable frame recesses 57a-57c are arranged farther than the centers of the hollow portions of the coils 53a-53c.

Arranging the movable frame concave portions 57a to 57c farther from the imaging element 6 than the centers of the hollow portions of the coils 53a to 53c will be described by taking the coil 53a as an example.

First, a straight line 97 is drawn that is orthogonal to a straight line 96 that connects the part of the imaging device 6 closest to the coil 53a and the center of the winding axis of the coil 53a and that passes through the winding axis of the coil 53a. Then, the straight line 97 is projected from the optical axis side to divide the coil 53a into two regions. In this case, the movable frame concave portion 57a is arranged in the region opposite to the imaging element 6. FIG.

More preferably, it should be arranged farther from the imaging device 6 than the outer periphery of the coil 53a. As shown in FIG. 4, the movable frame concave portion 57a is positioned farther than the outer periphery of the coil 53a when viewed from the imaging element 6. As shown in FIG. In order to provide the soldering portion 56a in the movable frame concave portion 57a, the soldering portion 56a is also positioned farther from the imaging device 6 than the coil 53a when viewed from the imaging device 6. FIG. So far, the movable frame concave portion 57a and the soldering portion 56a have been described with the coil 53a as an example. Parts 56b and 56c are arranged. The influence of the position of the movable frame concave portion 57a and the magnetic field will be described later.

The axial direction of the hollow portion of the coils 53a to 53c is substantially parallel to the optical axis 4, and the coils 53a to 53c are arranged substantially on the same plane as the imaging device 6. FIG. Furthermore, magnetic sensors 54a-54c are mounted in the hollow portions of the coils 53a-53c.

For example, the example shown in FIG. 3B shows an example in which the magnetic sensor 54c is arranged in the hollow portion of the coil 53c. The magnetic sensors 54a to 54c detect the position when the movable part 50 moves in a direction substantially orthogonal to the optical axis 4 using the magnetic circuit described above. Hall elements, for example, are used as the magnetic sensors 54a to 54c. The magnetic sensors 54a to 54c are also mounted on the FPC 55 and connected to the outside through connectors (not shown).

When the coils 53a to 53c are energized (applied), a force according to Fleming's left-hand rule is generated and the movable part 50 is moved. Feedback control is performed using the detection results of the magnetic sensors 54a to 54c. In other words, if the currents flowing through the coils 53a to 53c are controlled using the results of detection by the magnetic sensors 54a to 54c, the currents flowing through the coils 53a to 53c are controlled in the translational direction in the direction perpendicular to the optical axis 4 and in the rotational direction around the axis substantially parallel to the optical axis 4. The movable part 50 can be driven.

For example, by controlling the current in the coil 53c, the movable part 50 translates in the direction parallel to the X-axis. Further, by controlling the currents of the coils 53a and 53b, the movable portion 50 can be translated in a direction parallel to the Y-axis or rotated around an axis parallel to the optical axis 4. FIG.

The camera system control unit 5 performs so-called PWM control for controlling the duty ratio of the pulse width in the drive voltage in order to control the drive voltage when currents flow through the coils 53a to 53c. In PWM control, the voltage is controlled by controlling the duty ratio of the high-frequency AC signal. At this time, the coils 53a to 53c are superimposed with a low-frequency DC current generated by a drive voltage corresponding to PWM control and a high-frequency AC current having a small amplitude corresponding to the drive frequency of PWM control.

Thus, a magnetic field is formed by the coils 53a to 53c by applying current to the coils 53a to 53c. Magnetic noise is generated in the image signal output from the imaging element 6 by the magnetic field. In particular, the magnetic field generated by the change in the high-frequency current corresponding to the driving frequency of PWM control affects the image signal output from the imaging device 6 .

As shown in FIG. 3B, the imaging element 6 arranged on the movable frame 51 includes a substrate portion 6a serving as a base, a chip portion 6b including a light receiving portion, a glass portion 6c, and wiring layers of the substrate portion 6a. has a substrate 6d to which is connected. The chip portion 6b has a silicon layer, and the light receiving portion collects light through the imaging optical system 3 and performs photoelectric conversion. A circuit portion for receiving an output signal from the light receiving portion is arranged inside the chip portion 6b. The circuit section is constructed across the chip section 6b, the base material section 6a, and the substrate 6d. Also, this circuit section includes a transfer circuit for the output signal of the light receiving section, an amplifier circuit, a conversion circuit to a digital signal, a power source necessary for each operation described above, reference voltage wiring, and the like.

The land portion provided on the chip portion 6b is connected to a wiring layer provided on the substrate portion 6a by wire bonding (not shown), and the wiring layer is further connected to the substrate 6d. The imaging element 6 is arranged on substantially the same plane as the plane on which the coil 53c is arranged. By arranging the coils 53a to 53c and the imaging element 6 in this manner, the vibration correction section 14 can be made thinner. Note that the imaging element 6 described in FIG. 3B is not limited to the configuration described above, and may have any configuration as long as it can output the received light as an output signal to the circuit section. Therefore, for example, the chip portion 6b may be directly connected to the substrate 6d by wire bonding or the like without having the base portion 6a.

On the other hand, if the imaging device 6 and the coils 53a to 53c are arranged on the movable part 50 and positioned substantially on the same plane, the following problem arises.

When the movable frame concave portions 57a to 57c, in which the effect of canceling the magnetic field by the movable frame 51 is remarkably reduced, are arranged close to the imaging element 6, the magnetic field passes through the movable frame concave portions 57a to 57c to the tip portion 6b of the imaging element 6. reach. As a result, the image obtained by the imaging device 6 is adversely affected as magnetic noise.

For example, there is a method in which the photographing lens 2 is provided with a vibration correcting section having a coil, and a vibration reduction lens provided in the photographing lens is driven in a direction perpendicular to the optical axis to correct blur. In this case, since the distance from the coil to the imaging element is long, the influence of the magnetic field on the imaging element is small.

On the other hand, when the image pickup device 6 is moved by the blur correction unit 14 as described above, the magnetic fields of the coils 53a to 53c often affect the image pickup device 6 depending on the shape of the movable frame 51, and magnetic noise adversely affects the image pickup device 6. increases.

Therefore, in the first embodiment, the movable frame concave portions 57a to 57c are formed as described above to reduce the influence of the magnetic field of the coils 53a to 53c on the imaging device 6 while reducing the thickness of the blur correction unit 14. do.

FIG. 5 is an enlarged view of the main portion of the movable portion shown in FIG. 4 and schematically shows a current flowing through the coil and a canceling current for generating a canceling magnetic field from the movable frame.

In FIG. 5, dashed arrows 101 and 102 indicate the current flowing through the coil 53c when the imaging element 6 is driven. Dashed arrows 103 and 104 indicate canceling currents flowing through the movable frame 51 . When currents indicated by dashed arrows 101 and 102 flow through coil 53c, a magnetic field is generated in coil 53c.

The movable frame 51 is arranged close to the coil 53c so as to surround it. Therefore, the magnetic field of the coil 53 c is coupled to the movable frame 51 , and currents flow in the movable frame 51 as indicated by broken line arrows 103 and 104 in directions opposite to those indicated by broken line arrows 101 and 102 . Since a current flows through the movable frame 51 in the opposite direction to the current flowing through the coil 53c, a magnetic field is generated from the movable frame 51 in a direction that cancels the magnetic field of the coil 53c.

At this time, compared to the distance between the current paths indicated by dashed arrows 101 and 103, the current path indicated by dashed arrow 104 is separated from the current path indicated by dashed arrow 102 due to the presence of movable frame concave portion 57c. Therefore, the coupling between the currents indicated by dashed arrows 102 and 104 is weaker than that of the currents indicated by dashed arrows 101 and 103, and there are localized portions where the magnetic field cancellation effect is low. In the movable frame 51, the magnetic field of the coil 53c increases at a portion where the canceling effect is locally low.

In FIG. 5, the case where the current flows in one direction in the coil 53c has been described, but since PWM control is used in actual driving, an AC component is included and the current may change in the opposite direction. As a result, although there is a current that follows a path opposite to that of the dashed arrows 101 to 104 shown in FIG.

FIG. 6 is a diagram schematically showing the magnetic field of the coil by enlarging the main part in the cross-sectional view shown in FIG.

In FIG. 6, a solid line arrow 81, broken line arrows 82a to 82e, and solid line arrows 83a to 83e indicate magnetic fields generated by the coil 53c. Note that the magnetic field generated by the coil 53c is more densely generated than the magnetic field shown in FIG.

The magnetic field generated on the upper surface side of the hollow portion of the coil 53c is generated as indicated by the solid-line arrow 81, branches and merges as indicated by the dashed-line arrows 82a to 82e and the solid-line arrows 83a to 83e, and forms the magnetic field of the hollow portion of the coil 53c. reach the underside. As described above, the movable frame 51 is made of highly conductive aluminum die-cast, has a predetermined thickness, and has a surface facing the outer diameter side surface of the coil 53c.

Therefore, the movable frame 51 suppresses radiation of the magnetic field generated by the coil 53c into space. Furthermore, due to the skin effect, the magnetic field hardly passes through the movable frame 51 and avoids the movable frame 51 as indicated by dashed line arrows 82a, 82b and 82c and solid line arrows 83a, 83b and 83c.

A dashed arrow 82 d indicates a magnetic field that is positioned closer to the imaging element 6 than the coil 53 c and passes through the gap 91 between the outer diameter of the coil 53 c and the movable frame 51 . A solid arrow 83d indicates the magnetic field passing through the movable frame recess 57c. The magnetic fields indicated by broken-line arrows 82a and 82b branch from the magnetic field indicated by solid-line arrow 81 and merge at gap 91 to form a magnetic field indicated by broken-line arrow 82d.

If the magnetic field reaching the chip portion 6b of the imaging device 6 is strong, such as the magnetic field indicated by the dashed arrow 82b, the imaging device 6 is affected by magnetic noise. Also, if the magnetic field branched from the magnetic field indicated by the dashed arrow 82b and detouring the movable frame 51 and reaching the tip portion 6b of the imaging device 6 is strong, as in the magnetic field indicated by the dashed arrow 82c, the imaging device 6 is similarly affected. The effect of magnetic noise occurs.

As shown in FIG. 6, since the soldering portion 56c is provided, the movable frame concave portion 57c is wider than the gap 91. As shown in FIG. As a result, the magnetic field canceling effect of the movable frame 51 is reduced at the portion (place) where the movable frame concave portion 57c is located. Therefore, the magnetic fields indicated by solid line arrows 83a to 83e are stronger than the magnetic fields indicated by broken line arrows 82a to 82e.

In the illustrated example, the movable frame concave portion 57c is arranged farther from the imaging element 6 than the outer circumference of the coil 53c. Therefore, it is possible to reduce the influence on the imaging device 6 of the magnetic field that increases due to the presence of the movable frame concave portion 57c.

In FIG. 6, the generation of the magnetic field when the current flows in one direction in the coil 53c has been described, but in actual driving, PWM control is used, and since an AC component is included, the change in the current in the opposite direction There is As a result, the magnetic field is generated as a vector in the opposite direction, and follows paths opposite to the magnetic fields indicated by the solid line arrow 81, the broken line arrows 82a to 82e, and the solid line arrows 83a to 83e. effect can be similarly obtained.

Although the relationship between the magnetic field generated by the coil 53c and the movable frame recess 57c has been described here, the coils 53a and 53b and the movable frame recesses 57a and 57b also have the same effect, and reach the imaging element 6. Magnetic fields can be reduced.

In this way, by arranging the movable frame concave portions 57a to 57c farther from the imaging element 6 than the outer circumferences of the coils 53a to 53c, the blur correction section 14 is made smaller and the influence of the magnetic field on the imaging element 6 is reduced. be able to.

In the above example, the movable frame concave portions 57a to 57c are arranged farther from the imaging element 6 than the outer circumferences of the coils 53a to 53c. On the other hand, if the movable frame concave portions 57a to 57c are arranged farther from the imaging device 6 than the closest side facing the imaging device 6 at least on the outer periphery of the coils 53a to 53c, the effect of reducing the magnetic field can be obtained. The closest side facing the imaging device 6 on the outer circumference of the coil 53a is, for example, the side indicated by the dashed line 98 shown in FIG.

More preferably, the movable frame concave portions 57a to 57c are preferably arranged farther from the imaging element 6 than the centers of the hollow portions of the coils 53a to 53c. With such a configuration, most of the magnetic field passing through the movable frame concave portions 57a to 57c forms a magnetic path farther from the imaging device 6 than the center of the hollow portion of the coils 53a to 53c. Therefore, the magnetic field reaching the imaging device 6 can be further reduced.

Furthermore, in the above example, the movable frame concave portions 57a to 57c are arranged farther from the imaging device 6 than the outer diameters of the coils 53a to 53c. As a result, it is possible to reduce the influence of the magnetic field generated by the movable frame concave portions 57a to 57c on electronic components such as magnetic sensors arranged in the hollow portions of adjacent coils. The coils arranged adjacent to each other refer to the coils 53a and 53b, for example.

Further, in the above example, the magnetic field of the coils 53a to 53c can be reduced by the movable frame 51, and the influence of the magnetic field increased due to the presence of the movable frame concave portions 57a to 57c on the imaging element 6 can be reduced. In order to maintain the effect of reducing the magnetic field by the movable frame 51 and reduce the influence of the magnetic field by the concave portions 57a to 57c of the movable frame, the gap between the adjacent coils 53a to 53c and the movable frame 51 should be defined as follows. is desirable.

For example, the gaps between the coils 53a to 53c and the movable frame 51 are made shorter than the gaps between the coils 53a to 53c and the movable frame 51 in the movable frame concave portions 57a to 57c. Specifically, in order to increase the effect of canceling the magnetic field by the movable frame 51 while considering manufacturing variations of the coils 53a to 53c, it is preferable to set the gap between the movable frame 51 and the coils 53a to 53c to 1 mm or less.

At this time, the size of the movable frame recesses 57a to 57c is preferably at least 2 mm or more from the outer circumference of the coils 53a to 53c in order to prevent contact between the soldering portions 56a to 56c and the movable frame 51.

As a result, the magnetic fields generated by the coils 53a to 53c can be further reduced by the magnetic field canceling effect of the movable frame 51. FIG.

In the above example, the arrangement of the movable frame recesses 57a to 57c has been described, but it is not necessary to apply to all of the movable frame recesses 57a to 57c. may be applied to

As described above, in the first embodiment of the present invention, it is possible to reduce the size of the blur correction unit and reduce the influence of the magnetic field on the imaging device.

[Second embodiment]
Next, a camera equipped with a blur correction device according to a second embodiment of the present invention will be described. The configuration of the camera according to the second embodiment is the same as that of the camera shown in FIG. 1, and the blur correction device is also basically the same as the blur correction device described with reference to FIGS.

In the second embodiment, wiring patterns 55a to 55f provided on the FPC 55 are connected to soldering portions 56a to 56f, as will be described later. The soldering portions 56a to 56c are arranged in movable frame concave portions 57a to 57c provided outside the outer peripheries of the coils 53a to 53c. Also, the soldering portions 56d to 56f are arranged in the hollow portions of the coils 53a to 53c.

FIG. 7 is a diagram showing an FPC, wiring patterns, and a soldering portion in a blur correction device (blur correction section) used in the second embodiment of the present invention. FIG. 7A is a diagram showing an example in which another soldering portion is arranged closer to one soldering portion than the center point of the coil. FIG. 7(b) is a diagram showing an example in which another soldering portion is arranged farther than the center point a2 of the coil with respect to one soldering portion. In FIG. 7, the positions of the coils 53a to 53c are indicated by dashed lines.

In FIG. 7A, the soldering portion 56d is arranged closer to the soldering portion 56a than the center point a1 of the coil 53a. Further, the soldering portion 56e is arranged closer to the soldering portion 56b than the center point b1 of the coil 53b, and the soldering portion 56f is arranged closer to the soldering portion 56c than the center point c1 of the coil 53c. It is

In FIG. 7B, the soldering portion 56d is arranged farther than the center point a2 of the coil 53a with respect to the soldering portion 56a. Further, the soldering portion 56e is arranged farther than the center point b2 of the coil 53b with respect to the soldering portion 56b, and the soldering portion 56f is arranged farther than the center point c2 of the coil 53c with respect to the soldering portion 56c. It is

As shown in FIG. 7(a), when current flows through the coils 53a to 53c, the current flows from one soldered portion to the other soldered portion. Therefore, the directions of currents flowing from the coil 53a to the wiring patterns 55a and 55d connected to the soldering portions 56a and 56d are opposite to each other. As a result, the magnetic fields generated by the wiring patterns 55a and 55d are directed in opposite directions and cancel each other.

In the second embodiment, the soldering portion 56d is arranged closer to the soldering portion 56a than the center point a1 of the coil 53a. As a result, wiring patterns 55a and 55d can be arranged close to each other. Therefore, the magnetic field generated by the wiring patterns 55a and 55d and reaching the chip portion 6b of the imaging device 6 can be reduced.

The soldered portions 56b and 56e and the soldered portions 56c and 56f also have opposite current directions. Therefore, by similarly arranging the soldered portions close to each other, the magnetic field generated by the wiring pattern and reaching the chip portion 6b of the imaging device 6 can be reduced.

In the example shown in FIG. 7B as well, the magnetic fields generated by the wiring patterns are in opposite directions, so that the magnetic fields cancel each other. On the other hand, since the soldering portion 56d is arranged farther than the center point a1 of the coil 53a with respect to the soldering portion 56a, there is a section where the wiring patterns 55a and 55d cannot be wired adjacent to each other. In this section, the magnetic field canceling effect between the wiring patterns 55a and 55d cannot be obtained, and it becomes difficult to effectively reduce the magnetic field generated by the wiring patterns 55a and 55d.

It should be noted that the directions of the currents in the wiring patterns are similarly reversed in the soldered portions 56b and 56e and the soldered portions 56c and 56f.

Thus, in the second embodiment, the movable frame concave portions 57a to 57c are arranged farther from the imaging element 6 than the outer circumferences of the coils 53a to 53c, as described in the first embodiment. This reduces the magnetic field reaching the imaging device 6 .

Next, solder joints 56a and 56d, solder joints 56b and 56e, and solder joints 56c and 56f are positioned closer than the center points of coils 53a, 53b, and 53c, respectively. As a result, it is possible to reduce the influence of the magnetic field on the imaging device 6 due to the soldered portion and the wiring pattern.

8 is a diagram for explaining the positional relationship of the soldering portions shown in FIG. 7. FIG. FIG. 8A is a diagram showing an example in which the soldered portion is positioned closer to the center of the hollow portion of the coil than the wiring of the coil straddling the magnet. FIG. 8(b) is a diagram showing an example in which the soldered portion is positioned close to the wiring of the coil straddling the magnet.

Here, for convenience of explanation, the desired positional relationship of the soldered portions will be described using the coil 121, the soldered portions 122a and 122b, and the permanent magnets 133 and 134. FIG.

The coil 121 has a wiring portion 121a facing the permanent magnet 133 and a wiring portion 121b facing the magnet 134 on its long side. The wiring portion 121a is the wiring closest to the imaging element (not shown) facing the imaging element, and the wiring portion 121b is the wiring furthest from the imaging element facing the imaging element. The soldering portion 122 a is positioned in the hollow portion of the coil 121 , and the soldering portion 122 b is positioned outside the outer circumference of the coil 121 .

FIG. 8A shows a state in which the soldered portion 122a is positioned closer to the center 95 of the hollow portion than the wiring of the coil 121 straddling the magnets 133 and 134 when viewed from the front side of the paper. FIG. 8(b) shows a state in which the soldered portion 122a is positioned close to the wiring of the coil 121 straddling the magnets 133 and 134 when viewed from the front side of the paper.

Here, the arrangement of the soldering portion 122b in the state shown in FIG. 8(a) will be described using the straight line 99a. A straight line 99a is a line passing through the soldering portion 122a and orthogonal to the wiring portion 121b. The soldering portion 122b is located farther from the imaging element than the wiring portion 121b, and is within 25% of the inner diameter side wiring length L of the wiring portion 121b starting from the straight line 99a in the direction along the wiring direction of the wiring portion 121b. (within 25%).

With such an arrangement, the soldering portions 122a and 122b can be arranged close to each other, and the wiring patterns (not shown) connected to the soldering portions 122a and 122b can also be brought close to each other. As a result, the magnetic field generated by the wiring pattern connected to the soldering portions 122a and 122b can be reduced while reducing the magnetic field reaching the imaging device, which is increased by the movable frame concave portion, by arranging the soldering portion 122b.

Next, referring to FIG. 8(b), a straight line 99b is a line passing through the soldering portion 122a and orthogonal to the wiring portion 121b, like the straight line 99a shown in FIG. 8(a). The soldering portion 122b is located farther from the imaging element than the wiring portion 121a, and is within 25% of the inner diameter side wiring length L of the wiring portion 121b starting from the straight line 99b in the direction along the wiring direction of the wiring portion 121b. placed in

In FIG. 8B, a soldering portion 122b is provided at a position opposite to the imaging device (not shown) when viewed from the wiring portion 121b. By the way, it is desirable that the distance between the soldering portions 122a and 122b is short, so the soldering portion may be provided at a position along the wiring of the coil 121 straddling the magnets 133 and 134, such as the soldering portion 122c.

With such an arrangement, the soldering portions 122a and 122b can be arranged close to each other, and the wiring patterns (not shown) connected to the soldering portions 122a and 122b can also be brought close to each other. As a result, by arranging the soldering portion 122b, it is possible to reduce the magnetic field generated by the wiring pattern connected to the soldering portions 122a and 122b while reducing the magnetic field reaching the imaging device, which increases due to the recessed portion of the movable frame. .

As described above, also in the second embodiment of the present invention, it is possible to reduce the size of the blur correction unit and reduce the influence of the magnetic field on the imaging device.

[Third embodiment]
Next, a camera provided with a blur correction device (blur correction section) according to a third embodiment of the present invention will be described. The configuration of the camera according to the third embodiment is the same as that of the camera shown in FIG. 1, and the blur correction device is also basically the same as the blur correction device described with reference to FIGS.

The blur correction section used in the camera according to the third embodiment differs from the blur correction section described in the first embodiment in the following points.

The blur correction unit according to the third embodiment is arranged on the surface opposite to the surface on which the coils 53a to 53c are mounted on the FPC 55, and when projected from the direction of the optical axis 4, the metal parts that cover the concave portions 57a to 57c of the movable frame A shielding member (not shown) made of As a result, the shielding member is arranged on the path of the magnetic field concentrating on the movable frame concave portions 57a to 57c. Then, when the magnetic field reaches the shielding member, an eddy current flows through the shielding member, generating a magnetic field that cancels the magnetic field that has reached the shielding member. As a result, the magnetic field reaching the tip portion 6b, which increases due to the movable frame recesses 57a to 57c, can be reduced.

Although the shielding member is made of metal in the third embodiment, it is more preferable to use a non-magnetic metal. Forming the shielding member from a non-magnetic metal makes it possible to more effectively generate a canceling magnetic field due to eddy currents.

Furthermore, the canceling magnetic field generated by the shielding member is generated by the flow of eddy currents. Therefore, it is desirable to use a thick member with high conductivity, such as aluminum or copper, for the shielding member.

Further, in order to reinforce the FPC 55 and prevent bending, the backing member provided on the FPC 55 may be made of metal, and the backing member may be used as a shielding member to cover the movable frame concave portions 57a to 57c.

Further, a magnetic metal body that is attached to the FPC 55 and assists in holding the movable portion 50 by an attraction force with a magnet may be used as a shielding member to cover the movable frame concave portions 57a to 57c.

Thus, also in the third embodiment of the present invention, it is possible to reduce the size of the blur correction unit and reduce the influence of the magnetic field on the imaging device.

[Fourth embodiment]
Next, a camera provided with a blur correction device (blur correction section) according to a fourth embodiment of the present invention will be described. The configuration of the camera according to the fourth embodiment is the same as that of the camera shown in FIG. 1, and the blur correction device is basically the same as the blur correction device described with reference to FIGS.

The blur correction section used in the camera according to the fourth embodiment differs from the blur correction section described in the first embodiment in the following points.

The vibration corrector according to the fourth embodiment includes a thermistor component (not shown) mounted on the FPC 55 in the hollow portions of the coils 53a to 53c. Furthermore, in the blur correction unit according to the fourth embodiment, the soldering portions 56a to 56c provided in the movable frame concave portions 57a to 57c are provided in the hollow portions of the coils 53a to 53c, respectively.

In the fourth embodiment, the sizes of the coils 53a to 53c are increased in comparison with the first embodiment in order to increase the drive capability of the blur correction section 14. FIG. Here, the drive capability refers to, for example, the drive force obtained with respect to the movable range of the movable frame 51 and the current flowing through the coils 53a to 53c.

In order to increase the movable range of the movable frame 51, even if the coils 53a to 53c move within the movable range, the static magnetic fields of the magnets arranged in the upper surface fixed portion 60 and the lower surface fixed portion 70 reach the coils 53a to 53c. need to be able to Therefore, it is necessary to increase the size of the coils 53a to 53c.

Also, in order to increase the driving force obtained with respect to the current, it is necessary to lengthen the wiring of the coils 53a to 53c facing the magnets. For this purpose, it is necessary to increase the size of the coils 53a to 53c.

As described above, if the size of the coils 53a to 53c is increased in order to increase the drive capability, the areas of the hollow portions of the coils 53a to 53c are increased. Therefore, in the fourth embodiment, the soldering portions 56a-56c are arranged in the hollow portions of the coils 53a-53c.

This eliminates the need for the movable frame recesses 57a to 57c. As a result, it is possible to enhance the function of the blur correction unit 14, enhance the effect of canceling the magnetic field by the movable frame 51, and reduce the magnetic field due to the presence of the concave portion of the movable frame.

Although the soldered portions 56a to 56c are arranged in the hollow portions of the coils 53a to 53c, in this case, it is desirable that the soldered portions connected to the same coil are arranged adjacent to each other. For example, it is desirable to arrange the soldering portions 53a and 53d connected to the coil 53a adjacently.

Magnetic sensors (magnetic detectors) and thermistor parts (for example, temperature elements) are arranged in the hollow portions of the coils 53a to 53c, and heat generated in the coils is measured by the thermistor parts. In this case, it is desirable to arrange the magnetic sensor and thermistor components outside the adjacent soldered portions. Thereby, the magnetic field from the wiring pattern portion connected to the coil and the soldering portion can be further reduced.

As described above, thermistor components mounted on the FPC 55 are arranged in the hollow portions of the coils 53a to 53c. This makes it possible to sense changes in ambient temperature when currents flow through the coils 53a to 53c, and to stop driving when, for example, an abnormal temperature rise occurs.

Thus, in the fourth embodiment, the soldering portions 56a-56c are arranged in the hollow portions of the coils 53a-53c. This eliminates the need for the movable frame recesses 57a to 57c. Furthermore, thermistor components mounted on the FPC 55 are arranged in the hollow portions of the coils 53a to 53c. As a result, the influence of the magnetic field on the imaging device 6 can be reduced, and the functions of the blur correction section 14 can be enhanced.

In the above example, the thermistor parts are arranged in the hollow portions of the coils 53a to 53c, but the number of thermistor parts may be increased as long as the required number of thermistor parts is improved. For example, a thermistor component may be provided only in the hollow portion of the coil 53a.

Further, in place of the thermistor parts, other parts for improving functions or parts necessary for noise reduction may be arranged in the hollow portions of the coils 53a to 53c. For example, a magnetic sensor may be added to improve the position detection accuracy when the movable portion 50 moves.

Also, although the soldering portions 56a to 56c are provided in the hollow portions of the coils 53a to 53c, it is not necessary to apply the soldering portions to all the coils, and the soldering portions are applied to the coils that are particularly close to the imaging element 6. You may make it

Furthermore, the thermistor parts may be arranged outside the outer circumferences of the coils 53a to 53c. For example, the movable frame 51 may be partially recessed outside the outer periphery of the coils 53a to 53c so that the thermistor components can be placed therein. At this time, the concave portion of the movable frame 51 is made to have a predetermined constant thickness in the direction of the optical axis 4 .

As a result, the hollow spaces of the coils 53a to 53c are widened, making it easier to dispose the soldering portions in the hollow portions of the coils. Since the concave portion of the movable frame 51 has a predetermined thickness in the direction of the optical axis 4, it is possible to prevent the magnetic fields of the coils 53a to 53c from reaching the imaging device 6 through the concave portion of the movable frame 51. can.

It should be noted that other electronic components such as components that contribute to improving the functions of the imaging device 6 and the blur correction section 14 may be arranged in the concave portion of the movable frame 51 .

As described above, also in the fourth embodiment of the present invention, it is possible to reduce the size of the blur correction unit and reduce the influence of the magnetic field on the imaging device.

5 camera system control unit 6 imaging element 14 blur correction unit (blur correction device)
50 Movable part 51 Movable frame 53a-53c Coil 56a-56c Soldering part 57a-57c Movable frame concave part

Claims (13)

It is used in an electronic device having an image pickup device that outputs an image signal corresponding to an optical image formed through an image pickup optical system, and the image pickup device is moved in a direction perpendicular to the optical axis of the image pickup optical system to obtain the image. A blur correction device that corrects blurring occurring in an image indicated by a signal,
a metallic movable member that holds the imaging device and is movable in a direction orthogonal to the optical axis;
a coil arranged on the movable member and supplied with electric power;
a mounting member on which the coil is mounted; a connecting portion arranged outside an outer circumference of the coil and connecting the coil and the mounting member;
a permanent magnet arranged to face the coil,
moving the movable member by the coil and the permanent magnet;
A blur correction device according to claim 1, wherein a gap provided in said movable member for arranging said connection part is arranged at a position farther from said imaging element than a side of said coil closest to said imaging element. a support member that movably supports the movable member on a fixed member provided in the electronic device;
2. A motion compensation device according to claim 1, wherein said permanent magnet is arranged on said fixed member. The imaging element includes a plurality of circuit units,
A first straight line that is orthogonal to a straight line that connects the circuit portion closest to the coil and the center of the winding axis of the coil and that is orthogonal to the winding axis of the coil and passes through the winding axis of the coil is defined by the imaging optical system. 3. The method according to claim 1, wherein when the coil is divided into two regions by projecting from the optical axis side, the gap is arranged in a region different from the region where the imaging device is arranged. A deblurring device as described. 2. A gap between the winding portion of the coil and the movable member adjacent to the winding portion is shorter than a length of the winding portion and the movable member in the gap portion. 4. The blur correction device according to any one of items 1 to 3. 5. The blur correction device according to claim 4, wherein the length of said gap is 1 mm or less, and the length of said winding portion and said movable member in said gap is 2 mm or more. The connection portion includes a first connection portion arranged outside an outer circumference of the coil and connected to one end of the coil, and a second connection portion arranged inside an inner circumference of the coil and connected to the other end of the coil. having a connection of
In the direction along the long side of the coil, the first connecting portion is within 25% of the length of the long side starting from a second straight line that is orthogonal to the long side and passes through the second connecting portion. 6. The blur correction device according to any one of claims 1 to 5, characterized in that it is arranged. Having a metallic shielding member arranged on the surface of the mounting member opposite to the surface on which the coil is mounted and arranged so as to cover at least the gap when projected from the optical axis side of the imaging optical system. The blur correction device according to any one of claims 1 to 6, characterized by: 8. The blur correction device according to claim 1, wherein predetermined electronic components are arranged inside the inner periphery of said coil. 9. A motion compensation device according to claim 8, wherein said predetermined electronic component is a temperature element for measuring heat generated by said coil. 9. The blur correction device according to claim 8, wherein said predetermined electronic component is a magnetic detection section for detecting a magnetic field generated by said coil. a concave portion is formed in the movable member outside the outer circumference of the coil;
9. The blur correction device according to claim 8, wherein an electronic component different from the predetermined electronic component is arranged in the recess. a blur correction device according to any one of claims 1 to 11;
a control means for controlling power applied to the coil according to an image signal output from the imaging element;
An electronic device comprising: 13. The electronic equipment according to claim 12, wherein said electronic equipment is an imaging apparatus having image processing means for performing predetermined image processing on an image signal output from said imaging device to generate image data.

Images