JP7292913B2 - Vacuum device, Conveyor, Alignment method - Google Patents

Description

The present invention relates to a carrier for fixing a substrate and a mask, and a vacuum apparatus having the carrier.

Conventionally, a technique has been widely used in which a substrate and a mask are arranged horizontally or vertically using a mechanical clamping device to form a thin film in the shape of an opening pattern formed in the mask on the surface of the substrate.

In addition, as the size of the substrate increases, the installation area of the apparatus becomes too large. Therefore, the technique of forming a thin film by arranging the substrate vertically and transporting it has become mainstream.

As a problem here, although it also occurs during horizontal transport, the probability of occurrence of the problem of misalignment after alignment increases, especially when transporting the vertically arranged substrate and mask while aligning them. , a clamping device for fixing the substrate and the mask to each other and maintaining the aligned state is essential.

However, if the thin film is formed while the clamping device is attached, the thin film is also deposited on the clamping device, causing dust to be generated in the vacuum atmosphere.

In addition, when the substrate and mask are clamped with a mechanical clamp, it is difficult to control the amount of change in vertical force over time. Dust generation becomes a problem when horizontal thermal stress (mainly caused by the temperature difference between deposition and transport) causes stress concentration at the clamp contact point. If this force is applied to the substrate, it may cause chipping or cracking of the substrate, and it is difficult to maintain the relative positions of the substrate and the mask after aligning them. It is rare.

JP-A-10-328959

The present invention has been created to solve the above-mentioned disadvantages of the prior art. To provide a technique for fixing a substrate and a mask at an arbitrary relative position without causing chipping or cracking of the substrate while relatively fixing the substrate.

In order to solve the above-mentioned problems, the present invention is provided with a vacuum chamber to be evacuated, a mask placement device provided with a mask frame on which a mask is placed, and a substrate frame on which a substrate is placed. a substrate arranging device, wherein the mask frame and the substrate frame are arranged in a state in which the mask arranged in the mask arranging device and the substrate arranged in the substrate arranging device face each other; A vacuum device fixed inside a vacuum chamber, comprising a suction portion and a suction portion for magnetically attracting the suction portion, wherein the mask frame and the substrate frame include: One of the frames is provided with the sucked portion, and the other frame is provided with the sucking portion. an attraction state in which the substrate frame and the mask frame are fixed by magnetically attracting an attraction portion; and an attraction state in which the force of magnetic attraction is weakened compared to the attraction state and the substrate frame and the mask frame. The attracting portion can be in either of a released state in which the body can be separated from the body, and the attracting portion includes a permanent magnet portion forming a magnetic field for magnetically attracting the attracting portion, and a magnetic core. When a release current of a predetermined magnitude is passed through the magnetic coil, the magnetic field that causes the attracting portion to magnetically attract the attracted portion is weakened, and the attracted state changes to the released state. and a transferred electromagnet.
According to the present invention, one end of the magnetic core is directed toward the attracted portion that is magnetically attracted in the attracted state, and a portion of the attracted portion is positioned on the other end side of the magnetic core, and a tip end of the magnetic core. A yoke portion directed in the same direction as one end of the magnetic core is provided, and the attracted portion includes a first attracted portion facing one end of the magnetic core and a second attracted portion facing the tip of the yoke portion. one of the N pole and S pole of the permanent magnet portion is directed to the other end of the magnetic core, and the other polarity of the permanent magnet portion is directed to the other end of the magnetic core. A magnetic pole is a vacuum device directed toward the bottom portion of the yoke portion.
In the present invention, the attracting portion is provided on the mask frame, and the mask placement device includes a first power receiving terminal electrically connected to one end of the magnetic coil and a power receiving terminal connected to the other end of the magnetic coil. and a second power receiving terminal electrically connected to each other, wherein a voltage applied between the first power receiving terminal and the second power receiving terminal causes a current to flow through the magnetic coil. be.
In the present invention, an attachment/detachment section in which the mask placement device is detachably arranged is provided in the vacuum chamber, and the attachment/detachment section includes a first power receiving terminal which can be brought into contact with and separated from the first power receiving terminal. and a second power supply terminal that can be brought into contact with and separated from the second power reception terminal, and the first power reception terminal and the first power supply terminal are electrically connected while they are in contact with each other. the second power receiving terminal and the second power supply terminal are electrically connected during contact, and the voltage applied between the first power supply terminal and the second power supply terminal is a vacuum device through which the release current flows.
In the present invention, the attraction part is provided on the substrate frame, and the substrate placement device includes a first power receiving terminal electrically connected to one end of the magnetic coil and a power receiving terminal connected to the other end of the magnetic coil. and a second power receiving terminal electrically connected to each other, wherein a voltage applied between the first power receiving terminal and the second power receiving terminal causes a current to flow through the magnetic coil. be.
In the present invention, an attachment/detachment section in which the substrate placement device is detachably arranged is provided in the vacuum chamber, and the attachment/detachment section includes a first power receiving terminal which can be brought into contact with and separated from the first power receiving terminal. and a second power supply terminal that can be brought into contact with and separated from the second power reception terminal, and the first power reception terminal and the first power supply terminal are electrically connected while they are in contact with each other. the second power receiving terminal and the second power supply terminal are electrically connected during contact, and the voltage applied between the first power supply terminal and the second power supply terminal is a vacuum device through which the release current flows.
In the present invention, one of the first power receiving terminal and the first power feeding terminal is provided with a first elastic portion, and the first power receiving terminal and the first power feeding terminal are connected to each other. The first elastic portion is deformed while the contacts are in contact with each other, and the second elastic portion is provided to either one of the second power receiving terminal and the second power feeding terminal, and the second The second elastic portion is deformed while the power receiving terminal and the second power feeding terminal are in contact with each other, and the restoring force of the first elastic portion causes the first power receiving terminal and the first power feeding terminal to mutually move. In the vacuum device, the second power receiving terminal and the second power feeding terminal are pressed against each other by the restoring force of the second elastic portion.
The present invention is a vacuum apparatus having a current control circuit for controlling the magnitude of the release current.
The present invention is a vacuum device in which, in the suction state, the suctioned portion and the suction portion face each other while being separated from each other.
The present invention includes a mask placement device provided with a mask frame on which a mask is placed, and a substrate placement device provided with a substrate frame on which a substrate is placed, and a mask is placed on the mask placement device. a transporting device in which the mask frame and the substrate frame are fixed in a state in which the mask placed on the substrate and the substrate placed in the substrate placement device are opposed to each other; and a suction portion that magnetically attracts the suction portion, wherein the suction portion is provided on one of the mask frame and the substrate frame, and the suction portion is provided on the other frame. A suction unit is provided, and the suction unit magnetically attracts the suctioned portion to fix the substrate frame and the mask frame when the mask placement device and the substrate placement device face each other. and a released state in which the force of the magnetic attraction is weakened compared to the attracted state so that the substrate frame and the mask frame can be separated from each other. The attraction part includes a permanent magnet part that forms a magnetic field for magnetically attracting the part to be attracted, and a magnetic coil wound around a magnetic core. and an electromagnet unit that weakens the magnetic field that causes the attracting unit to magnetically attract the attracting unit and shifts the attracting state to the releasing state when the attracting unit is engaged with the attracting unit.
According to the present invention, one end of the magnetic core is directed toward the attracted portion that is magnetically attracted in the attracted state, and a portion of the attracted portion is positioned on the other end side of the magnetic core, and a tip end of the magnetic core. A yoke portion directed in the same direction as one end of the magnetic core is provided, and the attracted portion includes a first attracted portion facing one end of the magnetic core and a second attracted portion facing the tip of the yoke portion. one of the N pole and S pole of the permanent magnet portion is directed to the other end of the magnetic core, and the other polarity of the permanent magnet portion is directed to the other end of the magnetic core. A magnetic pole is a carrying device directed toward the bottom portion of the yoke portion.
In the present invention, the attracting portion is provided on the mask frame, and the mask placement device includes a first power receiving terminal electrically connected to one end of the magnetic coil and a power receiving terminal connected to the other end of the magnetic coil. and an electrically connected second power receiving terminal, wherein a voltage applied between the first power receiving terminal and the second power receiving terminal causes current to flow through the magnetic coil. be.
The present invention includes a first power supply terminal which is provided in a vacuum chamber and which can be brought into contact with and separated from the first power reception terminal at an attachment/detachment portion in which the mask placement device is detachably arranged, and the second power reception terminal. A second power supply terminal that can be brought into contact with and separated from the two power reception terminals is provided, the first power reception terminal and the first power supply terminal are electrically connected during contact, and The two power receiving terminals and the second power supply terminal are electrically connected during contact, and the voltage applied between the first power supply terminal and the second power supply terminal causes the release current to flow. It is a transport device.
In the present invention, the attraction part is provided on the substrate frame, and the substrate placement device includes a first power receiving terminal electrically connected to one end of the magnetic coil and a power receiving terminal connected to the other end of the magnetic coil. and an electrically connected second power receiving terminal, wherein a voltage applied between the first power receiving terminal and the second power receiving terminal causes current to flow through the magnetic coil. be.
The present invention is provided in a vacuum chamber and provided in a moving device on which the substrate arranging device is detachably arranged; A second power supply terminal that can be brought into contact with and separated from the two power reception terminals is provided, the first power reception terminal and the first power supply terminal are electrically connected during contact, and The two power receiving terminals and the second power supply terminal are electrically connected during contact, and the release current flows due to the voltage applied between the first power supply terminal and the second power supply terminal. It is a transport device.
The present invention is a conveying device in which the part to be sucked and the part to be sucked face each other while being separated from each other in the sucked state.
According to the present invention, a mask arranging device having a mask frame on which a mask is arranged and a substrate arranging device having a substrate frame on which a substrate is arranged are moved relative to each other. A positioning step of performing alignment, and a magnetic field formed by a permanent magnet portion of an attracting portion provided in one of the mask frame and the substrate frame causes the other frame to move. a fixing step of fixing the mask frame and the substrate frame to each other by magnetically attracting a portion to be attracted provided in the mask and fixing the mask and the substrate relative to each other; a moving step of moving together the mask arranging device and the substrate arranging device in a state in which the substrate is relatively fixed, wherein in the alignment step, the magnetic attraction of the attracting portion In the alignment method, a release current is applied to the electromagnet section provided in the attracting section to weaken the force, and the release current is stopped in the fixing step.
The present invention is an alignment method for stopping the release current by gradually decreasing the current flowing through the electromagnet section.
According to the present invention, the temperature of the mask placement device is measured by obtaining and storing the relationship between the value of the current that weakens the force of the adsorption portion magnetically attracting the portion to be adsorbed and the temperature of the mask placement device. 2) an alignment method in which a current having a value corresponding to the measured temperature is passed through the electromagnet unit as the release current;

A magnetic force is generated in the absence of energization, and the substrate and the mask are maintained in close contact with each other. Therefore, electric power is not required when fixing the substrate and the mask. When the substrate frame is magnetically attracted to the mask frame, there is no possibility that the substrate will drop even if the current is stopped.

Since the current flowing through the electromagnet portion can be gradually decreased, a rapidly changing force is not applied to the substrate and the mask, and chipping and cracking of the substrate do not occur.

Also, since the current flowing through the electromagnet can be controlled, the value of the release current can be changed according to the temperature.

Since there is no need to provide a clamping portion, no thin film is formed on the clamping portion and no dust is generated.

A diagram for explaining a film forming apparatus provided with a vacuum apparatus of the present invention. Internal schematic diagram (1) for explaining the interior and alignment operation of the vacuum apparatus of the present invention Internal schematic diagram (2) for explaining the interior and alignment operation of the vacuum device of the present invention Internal schematic diagram (3) for explaining the interior and alignment operation of the vacuum device of the present invention Internal schematic diagram (4) for explaining the interior and alignment operation of the vacuum device of the present invention Diagram for explaining a vacuum processing apparatus (a): AA cross-sectional view of the board placement device (b): Front view thereof (a): AA sectional view of the board placement device in which the board is placed (b): Front view thereof (a): Front view of the mask placement device (b): Its BB cutaway cross-sectional view Enlarged cross-sectional view of the suction part and its vicinity Enlarged cross-sectional view of a chucking portion magnetically chucking a substrate frame and its vicinity Enlarged cross-sectional view of the separated power supply unit, power reception unit, and their vicinity Enlarged cross-sectional view of power supply unit and power reception unit with terminals connected and their vicinity Enlarged cross-sectional view of the power supply unit, the power reception unit, and their vicinity in a state where the substrate frame is magnetically attracted. Enlarged cross-sectional view of the power supply unit and the power reception unit separated from each other with the substrate frame magnetically attracted, and the vicinity thereof FIG. 4 is a diagram for explaining an example in which a suction device is provided in the substrate placement device; Block diagram showing an example of the connection between the power supply circuit and the coil Graph for explaining changes over time in the current flowing through the electromagnet (a): Front view of the suction part (b): Front view of the first and second suction parts

Reference numeral 2 in FIG. 1 denotes a film forming apparatus, which includes a loading device 75a, a vacuum device 12 as an example of the present invention, a processing device 13, and an unloading device 75b.

The loading device 75a, the vacuum device 12, the processing device 13, and the unloading device 75b are connected in this order by vacuum valves 76 to 78, respectively. , 13 and 75b can be controlled.

Each device 75a, 12, 13, 75b is connected to an evacuation device 70 to 73, respectively. , 13 and 75b are individually evacuated to form a vacuum atmosphere inside each device 75a, 12, 13 and 75b.

<Vacuum device>
FIG. 2 is a schematic diagram showing the inside of the vacuum device 12. As shown in FIG. The vacuum device 12 has a vacuum chamber 21 . Inside the vacuum chamber 21, an attachment/detachment section 25 is provided in which a mask placement device, which will be described later, is placed.

Reference numeral 30 in FIGS. 9(a) and 9(b) denotes a mask placement device, and the mask placement device 30 includes a mask frame 31 and a mask window 34 provided in the center of the mask frame 31. and FIG. 9(a) is a front view of the mask placement device 30, and FIG. 9(b) is a sectional view taken along the line BB.

A mask 15 is arranged inside the mask frame 31, and the mask 15 is fixed to the mask frame 31 by welding or the like.
In the mask arranging device 30, the mask 15 does not drop off from the mask arranging device 30 even in a substantially vertical standing position by means of a holding device (not shown).

The mask 15 and the mask frame 31 may be arranged vertically or horizontally together, or the mask 15 and the mask frame 31 may be tilted at a small angle.

The mask 15 is a thin metal plate having through holes of a predetermined pattern. The surface of the mask 15 and the surface of the mask frame 31 are located on the same plane. , and the back surface of the mask 15 is exposed at the bottom surface of the mask window 34 .

Next, reference numeral 42 in FIGS. 7(a) and 7(b) denotes a substrate placement device, which has a substrate frame 41 and a substrate window 44 provided in the substrate frame 41. As shown in FIG. The substrate window portion 44 is a through hole, and a substrate holding portion 43 consisting of a protrusion or a ridge for placing a substrate to be vacuum-processed is provided around the window portion 44 . 7(a) and 8(a) are cross-sectional views taken along line AA of FIGS. 7(b) and 8(b). 8A and 8B show a state in which the substrate 16 is placed on the substrate holding portion 43, and the front and back surfaces of the substrate 16 are exposed.

FIG. 3 shows a state in which the mask placement device 30 with the mask 15 placed thereon is placed in the attachment/detachment section 25 in a substantially vertical standing posture.

As shown in FIGS. 9(a) and 9(b), a plurality of bottomed arrangement holes 38 ₁ to 38 ₄ are provided on the surface of the mask frame 31, and each arrangement hole 38 ₁ to Each of the adsorption units 32 ₁ to 32 ₄ is arranged in 38 ₄ . A temperature measuring device 40 for determining the release current value, which will be described later, is provided in each of the attracting portions 32 ₁ to 32 ₄ , detects the temperature of the attracting portions 32 ₁ to 32 ₄ , and controls the detected signal. The temperature of the adsorption portions 32 ₁ to 32 ₄ can be measured by the temperature measuring device 40 and the control device 26 by outputting to the device 26 .

FIG _{. 10} is _a drawing corresponding to a sectional view cut along the line BB in FIG _. Regarding 32 ₄ , the description will be representative of one adsorption unit 32 ₁ .

The attracting portion 32 ₁ has a permanent magnet portion 17 , an electromagnet portion 14 and a yoke portion 35 .

The electromagnet section 14 has a columnar magnetic core 36 and a tubular magnetic coil 18 , and the magnetic core 36 is inserted through the magnetic coil 18 . The magnetic coil 18 is a winding wound around a magnetic core 36 .

The magnetic coil 18 and the magnetic core 36 are arranged such that their central axes are perpendicular to the surface of the mask 15 arranged on the mask frame 31, and one end of the magnetic coil 18 and the magnetic core The one end of 36 is directed toward the substrate frame 41 of the substrate arranging device 42 arranged to face the mask arranging device 30 in a state positioned closer to the bottom surface of the arranging hole 38 ₁ than the opening ₃₃ of the arranging hole 38 1 . ing.

An enlarged portion 37 having a larger diameter than the magnetic core 36 is provided at the other end of the magnetic core 36 . Here, the enlarged portion 37 is plate-shaped, and the other end of the magnetic core 36 is formed integrally with the enlarged portion 37, but the enlarged portion 37 and the magnetic core 36 may be formed separately.

When the enlarged portion 37 is positioned at the center, the surface on which the permanent magnet portion 17 is arranged is arranged on the surface opposite to the surface on which the mask 15 is arranged.

Assuming that the enlarged portion 37 side is the surface of the permanent magnet portion 17, a portion of the yoke portion 35 is arranged between the rear surface side of the permanent magnet portion 17 and the bottom surface of the arrangement hole ₃₈₁ .

The yoke portion 35 has a cylindrical shape with a bottom or a U-shape, and the bottom portion 35a is arranged between the back side of the permanent magnet portion 17 and the bottom surface of the arrangement hole 38 ₁ , and is arranged perpendicular to the bottom portion 35a. The side surface portion 35b is arranged between the side surface of the magnetic coil 18 and the side surface of the placement hole 38 ₁ .

Here, the yoke portion 35 has a cylindrical shape with a bottom.

One end of the magnetic core 36 and the tip of the yoke portion 35 are positioned closer to the bottom surface portion 35a than the opening 33 of the placement hole 38 ₁ and are directed toward the opening 33 of the placement hole 38 ₁ . The tip of the yoke portion 35 and the tip of the magnetic core 36 are oriented in the same direction.

The magnetic core 36, the enlarged portion 37, and the yoke portion 35 are made of a soft magnetic material having a high magnetic permeability and a small coercive force. It is in contact with the bottom surface portion 35 a of the yoke portion 35 .

Of the two magnetic poles of the permanent magnet portion 17 , when the magnetic pole directed toward the enlarged portion 37 is the N pole, the magnetic lines of force emitted from the N pole are directed to the inside of the enlarged portion 37 and the magnetic core 36 . It passes through the inside, is released from the tip of the magnetic core 36 to the outside of the attracting portion 32 ₁ , enters the yoke portion 35 from the tip of the yoke portion 35 , and returns to the S pole of the permanent magnet portion 17 .

Of the two magnetic poles of the permanent magnet portion 17, the magnetic poles are arranged in the opposite order when the one directed toward the bottom portion 35a is the N pole.

In either case, the permanent magnet portion 17 forms an attraction magnetic field between the tip of the magnetic core 36 and the tip of the yoke portion 35 to attract the ferromagnetic material.

The suction portions 32 ₁ to 32 ₄ are arranged at the four corners of the mask frame 31, and the size of the mask 15 is such that the four sides of the mask 15 are positioned inside the suction portions 32 ₁ to 32 ₄ . there is

A power receiving portion 8 is provided at the lower end of the mask frame 31 in a vertical posture, and a power feeding portion 9 is provided at the attaching/detaching portion 25 as shown in FIG.

FIG. 12 shows a state before the mask placement device 30 in the vertical posture with the mask 15 placed thereon is placed on the attachment/detachment section 25, and the power receiving section 8 and the power feeding section 9 are separated from each other.

Power receiving recesses 51a and 51b, which are bottomed holes, are formed in the power receiving portion 8, and first and second power receiving terminals 19a and 19b are arranged on the bottom surfaces of the power receiving recesses 51a and 51b. Here, two power receiving recesses 51a and 51b are provided, the first power receiving terminal 19a is arranged on the bottom surface of one power receiving recess 51a, and the second power receiving terminal 19b is placed on the bottom surface of the other power receiving recess 51b. However, both the first and second power receiving terminals 19a and 19b may be placed in one power receiving recess.

However, it is desirable to provide a plurality of concave portions when the effect of short-circuit prevention by film deposition is exhibited, that is, when the effect of increasing the creepage distance is exhibited. Also, the first and second power receiving terminals 19a and 19b may be arranged at locations other than the power receiving recesses 51a and 51b.

The power supply portion 9 is provided with a power supply recess 52 that is a bottomed hole, and the power supply recess 52 is provided with first and second power supply terminals 29a and 29b.

The first and second power supply terminals 29a and 29b are bar-shaped and attached to first and second elastic parts 47a and 47b provided on the bottom surface of the power supply recess 52, respectively. , 29b protrude from the feeding recess 52 .

The first and second elastic parts 47a and 47b are made of an elastic material that can be deformed and restored, and spiral springs are used here, but the material is not limited to this.

The first and second power receiving terminals 19 a and 19 b are metal films or thin metal plates fixed on the mask frame 31 .

The center-to-center distance between the first and second power supply terminals 29a and 29b is the same as the center-to-center distance between the first and second power receiving terminals 19a and 19b, and the power receiving section 8 and the power feeding section 9 face each other. Sometimes, the first and second power supply terminals 29a and 29b are arranged to face the first and second power reception terminals 19a and 19b, and the power reception section 8 and the power supply section 9 face each other while being separated from each other. When the power reception unit 8 and the power supply unit 9 are relatively close to each other due to the mask placement device 30 and the attachment/detachment unit 25 moving relatively close to each other in this state, the tips of the first and second power supply terminals 29a and 29b approaches the first and second power receiving terminals 19a and 19b.

Lids 61a and 61b are provided at the openings of the power receiving recesses 51a and 51b, respectively. The ends of the power supply terminals 29a and 29b are brought into contact with the lid portions 61a and 61b, respectively.

Further, when the mask frame 31 is moved in a direction in which the power receiving portion 8 approaches the power feeding portion 9, the tips of the first and second power feeding terminals 29a and 29b bend the lid portions 61a and 61b, and the power receiving recesses 51a and 51b are bent. , and then the tips of the first and second power supply terminals 29a and 29b are brought into contact with the first and second power reception terminals 19a and 19b, respectively. In this state, the first and second power supply terminals 29a and 29b and the first and second power reception terminals 19a and 19b are electrically connected.

Further, when the power receiving portion 8 and the power feeding portion 9 are moved in a direction relatively approaching each other, as shown in FIG. The first and second power supply terminals 29a and 29b are pressed in contact with the power receiving terminals 19a and 19b, and the first and second elastic portions 47a and 47b are deformed so as to be shortened.

The first and second elastic portions 47a and 47b have a restoring force to return to the original shape when the deforming force is removed. When the first and second elastic portions 47a and 47b are deformed, the tips of the first and second power supply terminals 29a and 29b are pressed against the first and second power reception terminals 19a and 19b by the restoring force of the deformation. , the electrical conductivity is maintained by maintaining contact between the tips of the first and second power supply terminals 29a and 29b and the first and second power receiving terminals 19a and 19b.

Here, the tips of the first and second power supply terminals 29a and 29b and the surfaces of the first and second power reception terminals 19a and 19b are made of a conductive material such as metal. The ends of the power supply terminals 29 a and 29 b are electrically connected to the power supply circuit 20 arranged outside the vacuum chamber 21 .

One of the first and second power receiving terminals 19a and 19b is electrically connected to one end of the winding, which is the magnetic coil 18, and the other is electrically connected to the other end of the winding. When the tips of the second power supply terminals 29a and 29b are pressed against the first and second power receiving terminals 19a and 19b, both ends of the magnetic coil 18 are connected to the first and second power receiving terminals 19a and 19b and the second power receiving terminals 19a and 19b. It is connected to the power supply circuit 20 via the tips of the first and second power supply terminals 29a and 29b.

In the above example, the first and second power supply terminals 29a and 29b are rod-shaped, the root side is provided on the first and second elastic parts 47a and 47b, and the tip side is provided on the first and second power receiving terminals 19a and 47b. 19b, but the first and second power receiving terminals are rod-shaped, and their base sides are provided respectively on the elastic portions fixed to the mask frame 31, and the tip side is a film-like or thin-plate-like second power receiving terminal. You may make it contact|abut on the 1st, 2nd electric power feeding terminal.

Also, the first and second elastic portions 47a and 47b may be provided on electrodes having a shape other than a rod shape. , and the second elastic portion may be provided on either one of the second power supply terminal 29b and the second power receiving terminal 19b.

The power supply circuit 20 has a power supply device 48 and a power supply circuit 49 .

One of the first power supply terminal 29 a and the second power supply terminal 29 b is electrically connected to the power supply device 48 , and the other is electrically connected to the energization circuit 49 . Here, the first power supply terminal 29a is connected to the voltage output terminal of the power supply 48, and the second power supply terminal 29b is connected to the energizing circuit 49. As shown in FIG.

<Conducting circuit>
The configuration of the energization circuit 49 will be described with reference to FIG.

The detection resistor 63 and the current control circuit 65 are connected in series to form a series connection circuit 68. One end of the series connection circuit 68 is connected to the second power supply terminal 29b, and the other end is connected to the ground potential of the power supply device 48. It is connected to a point that has the same potential as the terminal of .

The current control circuit 65 is a switch circuit that conducts and cuts off, and the power supply is turned on while the first and second power supply terminals 29a and 29b are electrically connected to the first and second power reception terminals 19a and 19b, respectively. When a magnetizing voltage of a predetermined value is output from the output voltage terminal of the device 48 and the current control circuit 65 changes from interruption to conduction in this state, current flows through the magnetic coil 18 in the electromagnet section 14 and the current control circuit 65. flow.

In order to output a temperature signal detected by the temperature measuring device 40 to the control device 26 , first and second input terminals connected to the control device 26 are provided in the detachable portion 25 and connected to the temperature measuring device 40 . When the mask placement device 30 is provided with first and second output terminals, the first input terminal and the first output terminal are brought into contact, and the second input terminal and the second output terminal are brought into contact. Secondly, the measurement signals output by the temperature measuring device 40 can be transmitted from the first and second output terminals to the first and second input terminals and received by the control device 26 .

The current control circuit 65 is connected to the main control circuit 60 and the current flowing through the current control circuit 65 is controlled by the main control circuit 60 . The main control circuit 60 is connected to the control device 26 and is controlled by the control device 26 .

Here, when a current flows through the magnetic coil 18, magnetic poles are induced at both ends of the magnetic coil 18, forming a coil magnetic field.

An attraction magnetic field of constant strength is formed between the tip of the magnetic core 36 and the tip of the yoke portion 35 by the permanent magnet portion 17 . The magnetic field may increase the magnetic force by increasing the strength of the magnetic field formed between the attracting portions 32 ₁ to 32 ₄ and the attracted portions 23 ₁ to 23 ₄ which are magnetically attracted by the attracting portions 32 ₁ to 32 ₄ . , and the magnetic force may be reduced by weakening the magnetic field strength.

The relationship between the direction and value of the current flowing through the magnetic coil 18 and the magnetic force between the attracting portions 32 ₁ to 32 ₄ and the attracting portions 23 ₁ to 23 ₄ is determined in advance, and the attracting portions 32 ₁ to 32 ₄ are obtained. and the attracting portions 23 ₁ to 23 _{4 ,} the direction and the current value of which is as small as possible is called a release current _. and the attracted portions 23 ₁ to 23 ₄ are weakened and become close to zero, and the attracting portions 32 ₁ to 32 ₄ do not attract the attracted portions 23 ₁ to 23 ₄ . The sucked portions 23 ₁ to 23 ₄ will be described later.

<Alignment>
A substrate arranging device 42 in which the substrate 16 is arranged is arranged in advance inside the carrying-in device 75a. The interior of the vacuum chamber 21 of the device 12 is connected, and the substrate placement device 42 is carried into the interior of the vacuum chamber 21 of the vacuum device 12 through the vacuum valve 76 .

A mounting portion 22 is provided on the ceiling inside the vacuum chamber 21, and the mounting portion 22 is provided with a moving device 24 capable of holding a substrate placement device 42 and moving it in a desired direction. The substrate arranging device 42 carried into the vacuum chamber 21 is detachably held by the moving device 24 , and the substrate arranging device 42 and the mask arranging device 30 are relatively moved by the moving device 24 .

FIG. 8 shows a substrate arranging device 42 in which the substrate 16 is held by substrate holding portions 43 such as projections provided on the substrate frame 41 and the substrate 16 and the substrate frame 41 are vertical. .

In this example, the vacuum device 12 is an alignment device, and the vacuum device 12 is provided with imaging devices 27a and 27b.
Alignment marks are provided on the substrate 16 and the mask 15, respectively, and these alignment marks are imaged by imaging devices 27a and 27b so that the alignment marks of the substrate 16 and the alignment marks of the mask 15 have a predetermined positional relationship. Thus, alignment can be performed by relatively moving the substrate 16 and the mask 15 .

When the substrate 16 and the mask 15 are relatively moved, the substrate frame 41 on which the substrate 16 is arranged and the mask frame 31 on which the mask 15 is provided are moved relative to each other.

The substrate frame 41 is provided with portions to be attracted 23 ₁ to 23 ₄ . When the substrate frame 41 and the mask frame 31 are arranged to face each other, the attracting portions 32 ₁ to 32 ₄ and the attracted portions 23 ₁ to 23 ₄ are arranged to face each other. The tip of the yoke portion 35 and the tip of the magnetic core 36 of each of the attracting portions 32 ₁ to 32 ₄ face the attracted portions 23 ₁ to 23 ₄ .

_{The attracted} portions 23 ₁ to 23 ₄ are made of a material that _{is magnetically} attracted by magnetic force. , the attracted portions 23 ₁ to 23 ₄ are magnetically attracted to the attracted portions 32 ₁ to 32 ₄ by the magnetic force of the attracted portions 32 ₁ to 32 ₄ , and the substrate frame 41 and the mask frame 31 are magnetically attracted to each other. come into contact with. In this state, the substrate frame 41 and the mask frame 31 are attracted to each other by magnetic force, and the frictional force between the substrate frame 41 and the mask frame 31 causes the substrate frame to move. The body 41 and the mask frame 31 cannot be moved relative to each other.

Therefore, when performing alignment, first, before the substrate frame 41 and the mask frame 31 are brought close to each other, release currents are applied to the respective attracting portions 32 ₁ to 32 ₄ to weaken the magnetic attraction force. In the released state, the substrate arranging device 42 is brought close to the mask arranging device 30 by the moving device 24, and the substrate arranging device 42 and the mask arranging device 30 are separated from the mask 15 and the substrate 16 as shown in FIG. placed in close proximity to each other.

Since the magnetic attraction force is weakened in the released state, the attracted portions 23 ₁ to 23 ₄ are not magnetically attracted to the attracted portions 32 ₁ to 32 ₄ . The moving device 24 relatively moves the substrate arranging device 42 and the mask arranging device 30 so that the marks have a predetermined positional relationship.

Here, the mask placement device 30 is stationary and the substrate placement device 42 is moved by the moving device 24, but it may be the other way around, or both may be moved.

In this way, in the released state in which the releasing current is supplied to the attracting portions 32 ₁ to 32 ₄ to weaken the magnetic attraction force, the substrate arranging device 42 and the mask arranging device 30 are arranged close to each other in a non-contact state. By relatively moving the substrate arranging device 42 and the mask arranging device 30 while they are arranged close to each other, the substrate 16 and the mask 15 can be aligned.

After the alignment is performed, the substrate arranging device 42 and the mask arranging device 30 are moved toward each other in the released state, and the substrate frame 41 and the mask frame 31 are brought into contact with each other.

After the substrate frame 41 and the mask frame 31 are brought into contact with each other, when the release current flowing through the magnetic coil 18 is stopped, the magnetic field formed by the magnetic coil 18 disappears, and the permanent magnet portion 17 becomes the magnetic core. Due to the magnetic field formed between the tip of 36 and the tip of yoke portion 35, the attracting portions 32 ₁ to 32 ₄ are brought into an attracted state in which the attracted portions 23 ₁ to 23 ₄ are magnetically attracted.

In the attracted state, the substrate frame 41 and the mask frame 31 are in contact with each other, and the substrate frame 41 and the mask frame 31 are brought into a state in which they cannot move relatively due to the frictional force. The substrate arranging device 42 and the mask arranging device 30, which are fixed and fixed to each other, are moved together by a transfer robot or the like.

<Shapes of the sucking part and the sucked part>
The shapes of the attracting portions 32 ₁ to 32 ₄ and the shapes of the attracted portions 23 ₁ to 23 ₄ will be described.

FIG. 19(a) is a front view of the attraction portions 32 ₁ to 32 ₄ , showing the tip of the cylindrical magnetic core 36 arranged inside the arrangement holes 38 ₁ to 38 ₄ and the cylindrical yoke portion. 35 tips are shown. As shown in FIG. 4B, the chucked portions 23 ₁ to 23 ₄ of the substrate frame 41 include a circular first chucked portion 39 ₁ facing the tip of the magnetic core 36, a yoke Each has a ring-shaped second sucked portion 39 ₂ that faces the tip of the portion 35 .

Of the substrate frame 41 on which the substrate 16 is arranged, at least the first and second attracted portions 39 ₁ and 39 ₂ are made of a ferromagnetic material. When the strength of the magnetic field formed between the tip of the portion 35 and the tip of the portion 35 is small, even if the first and second attracted portions 39 ₁ and 39 ₂ are close to the attracting portions 32 ₁ to 32 ₄ , the first The first and second attracted portions 39 ₁ and 39 ₂ are not magnetically attracted to the attracted portions 32 ₁ to 32 ₄ , but when the substrate frame 41 approaches the mask frame 31 while the release current is stopped, The first and second attracted portions 39 1 and 39 ₂ enter the magnetic field formed between the tip of the yoke portion 35 and the tip of the magnetic core ₃₆ , and the first and second attracted portions 39 ₁ , 39 ₂ are magnetically attracted to the attracting portions 32 ₁ to 32 ₄ .

The tip of the magnetic core 36 and the tip of the yoke portion 35 are positioned near the openings between the openings and bottom surfaces of the arrangement holes 38 ₁ to 38 ₄ , and the attracting portions 32 ₁ to 32 ₄ and the attracted portions When the substrate frame 41 and the mask frame 31 are brought into contact with the substrate frame 41 and the mask frame 31 facing each other 23 ₁ to 23 ₄ , the tip of the magnetic core 36 and the first attracted portion 39 ₁ approach each other in a non-contact state. In addition, the tip of the yoke portion 35 and the second sucked portion ₃₉₂ also face each other closely in a non-contact state.

The distance between the tip of the magnetic core 36 and the first attracted portion 39 ₁ and the tip of the yoke portion 35 and the second attracted portion 39 when the substrate frame 41 and the mask frame 31 are in contact with each other ₂ is preferably non-contact within a range of 0.1 mm or less.

However, the present invention also includes the case where the substrate frame 41 and the mask frame 31 face each other through a mask.

11 and 14 show the state in which the first and second attracted portions 39 ₁ and 39 ₂ of the substrate frame 41 are magnetically attracted to the attracting portions 32 ₁ to 32 ₄ .

When the substrate 16 is arranged on the substrate frame 41 , the substrate 16 is prevented from moving with respect to the substrate frame 41 by a substrate holding device such as the substrate holding part 43 (FIGS. 7 and 8). In addition, when the mask 15 is placed on the mask frame 31 by the mask holding device, the mask 15 is prevented from moving with respect to the mask frame 31 .

In this example, the first and second sucked portions 39 ₁ and 39 ₂ of the substrate frame 41 on which the substrate 16 is arranged are the sucked portions 32 ₁ to 32 of the mask frame 31 on which the mask 15 is arranged. ₄ and the substrate frame 41 and the mask frame 31 are fixed to each other, the substrate 16 and the mask 15 do not move relative to each other. Numeral 28 indicates a transporting device comprising a mask placing device 30 and a substrate placing device 42 and carrying the mask 15 and the substrate 16 .

When the release current is stopped and the mask arranging device 30 and the substrate arranging device 42 move together in the suction state, the substrate 16 and the mask 15 are kept aligned.

Therefore, even if no current flows through the magnetic coil 18, the first and second attracted portions 39 ₁ and 39 ₂ are magnetically attracted by the attracting portions 32 ₁ to 32 ₄ , as shown in FIG. Even if the mask placement device 30 is separated from the attaching/detaching portion 25 and the first and second power supply terminals 29a and 29b and the first and second power receiving terminals 19a and 19b are moved away from each other, the substrate 16 and the mask 15 do not move. are maintained in alignment even when current is not supplied.

When the mask placement device 30 is separated from the attaching/detaching portion 25, the first and second power supply terminals 29a and 29b are separated from the first and second power receiving terminals 19a and 19b, and the elastic members 47a and 47b are in the original state. to restore the shape of

Alternatively, in the case of a configuration in which the substrate 16 is movable with respect to the substrate frame 41, the substrate 16 may be sandwiched when the substrate frame 41 and the mask frame 31 are fixed to each other. As a result, the substrate frame ₄₁ and the mask 15 sandwich _the substrate 16 and are fixed to each other, stopping the release current. Even if the mask arranging device 30 and the substrate arranging device 42 move together in this state, the aligned state of the substrate 16 and the mask 15 is maintained.

In the case of the configuration in which the mask 15 is movable with respect to the mask frame 31, the mask 15 is similarly sandwiched when the mask frame 31 and the substrate frame 41 are fixed to each other. Also good.

Although the elastic members 47a and 47b are formed of spiral springs here, leaf springs, rubber, or the like can also be used.

<Vacuum treatment>
The mask arranging device 30 and the substrate arranging device 42 separated from the attaching/detaching part 25 pass through the vacuum valve 77 and are moved from the inside of the vacuum chamber 21 to the inside of the processing apparatus 13 .

The substrate 16 and the mask 15 are aligned, and even if the mask placement device 30 is separated from the power supply device 48, the substrate frame 41 is magnetically attracted to the mask frame 31, and the mask placement device 30 is held. The mask arranging device 30 and the substrate arranging device 42, which are separated from the attaching/detaching part 25 and fixed to each other, can be moved together.

FIG. 6 shows the inside of the processing device 13 . This processing apparatus 13 is a sputtering apparatus and has a vacuum chamber 79 . A sputtering target 58 provided on a backing plate 57 is placed in the vacuum chamber 79 , a sputtering power source 56 is connected to the backing plate 57 , and a gas supply device 74 is connected to the vacuum chamber 79 .

With the substrate arranging device 42 and the mask arranging device 30 fixed to each other by magnetic attraction, the mask arranging device 30 side is directed toward the sputtering target 58, and the gas supply device 74 is operated while the vacuum chamber 79 of the processing device 13 is being evacuated. When a sputtering gas is supplied from the source 56 and a sputtering voltage is applied to the backing plate 57 by the sputtering power supply 56, plasma is formed in the vicinity of the surface of the sputtering target 58, and the sputtering target 58 is sputtered.

By sputtering, the sputtered particles fly out from the surface of the sputtering target 58 , the sputtered particles fly in the direction where the substrate 16 and the mask 15 are located, and the sputtered particles passing through the openings provided in the mask 15 reach the surface of the substrate 16 . and grow a thin film having the same surface shape as the opening.

After such vacuum processing is performed and a thin film having a predetermined film thickness is formed on the surface of the substrate 16, the substrate arranging device 42 and the mask arranging device 30 pass through the vacuum valve 78 in the next stage, and the unloading device 75b. are transported together inside the

A voltage is applied between the first and second power receiving terminals 19a and 19b in the unloading device 75b, and a release current is caused to flow through the magnetic coil 18. As shown in FIG. That is, a release current is supplied to the magnetic coil 18 by the voltage supplied from the power supply device 48, the magnetic attraction force of the attraction portions 32 ₁ to 32 ₄ is weakened, and the substrate arranging device 42 and the mask arranging device 30 are separated. be.

The separated mask arranging device 30 is returned to the inside of the vacuum chamber 21 of the vacuum device 12 through the conveying path in which the vacuum atmosphere is maintained, while the separated substrate arranging device 42 is taken out into the atmosphere and then is moved to the process of

<Control of release current>
Next, control of the release current will be described.

In addition to the current control circuit 65, the voltage measurement circuit 66 and the current measurement circuit 67 are also connected to the main control circuit 60. Each of the circuits 65 to 67 is controlled by the main control circuit 60, and the main control circuit 60 is It is supposed to be controlled.

The current flowing through the magnetic coil 18 is controlled by the main control circuit 60 so as to have the magnitude shown in the graph of FIG. As a result, the current flowing through the magnetic coil 18 starts to gradually increase from the state where the current value is zero (time t ₀ ).

The current flowing through the magnetic coil 18 flows through the detection resistor 63, and the voltage generated across the detection resistor 63 is measured by the current measurement circuit 67. When the measured value is output to the main control circuit 60, the main control circuit 60 calculates the current flowing through the detection resistor 63, and gradually increases the current flowing through the current control circuit 65 at a constant rate from the calculation result.

When the current flowing through the magnetic coil 18 reaches the release current value Ix of a predetermined magnitude (time t ₁ ), the current continues to flow while maintaining the release current value Ix as follows.

When the current of the release current value Ix flows through the magnetic coil 18, the magnetic attraction force of the attraction portions 32 ₁ to 32 ₄ is weakened, and the mask frame 31 is no longer magnetically attracted. The current of the release current value Ix is the release current.

A diode element 11 is arranged in the energization circuit 49 or the power supply device 48, the cathode electrode of the diode element 11 is electrically connected to the first power supply terminal 29a, and the anode electrode is connected to the detection resistor 63 and the current control circuit 65. is electrically connected to the portion to which is electrically connected.

While the current control circuit 65 is turned on and current is supplied from the power supply 48 to the magnetic coil 18, the diode element 11 is reverse-biased and current does not flow through the diode element 11. FIG.

The main control circuit 60 is set with an upper limit current value larger than the release current value Ix and a lower limit current value smaller than the release current value Ix. When the current measurement circuit 67 detects that the current gradually increases and becomes larger than the upper limit current value, the main control circuit 60 changes the current control circuit 65 from conduction to interruption.

When the current control circuit 65 switches from conduction to interruption, the current supplied from the power supply 48 to the magnetic coil 18 stops, an induced electromotive force is generated in the magnetic coil 18, the diode element 11 is forward biased, and the induced electromotive force current flows through the diode element 11 , the magnetic coil 18 and the detection resistor 63 .

The current flowing due to the induced electromotive force gradually decreases, and when the current measurement circuit 67 detects that the current value has become smaller than the lower limit current value, the main control circuit 60 switches the current control circuit 65 from cutoff to on, Current supply from the power supply 48 to the magnetic coil 18 is resumed.

In this way, the current flowing through the magnetic coil 18 varies between the upper limit current value and the lower limit current value. A release current having the magnitude of the release current value Ix is continuously supplied as a constant current.

While the release current is flowing, the mask frame 31 and the substrate frame 41 are brought close to each other, the substrate 16 and the mask 15 are moved relative to each other for alignment, and the mask frame 31 and the substrate are aligned. The contact frame 41 is brought into contact therewith. The mask frame 31 and the substrate frame 41 may be in contact with each other with the mask 15 interposed therebetween.

When a signal such as the end of alignment is input to the main control circuit 60, the main control circuit 60 starts to gradually decrease the value of the current flowing through the magnetic coil 18 (time t ₂ ) in order to start magnetic attraction. Return to the zero state (time t ₃ ).

During or at the end of the gradual decrease, a magnetic field is generated between the tip of the magnetic core 36 and the tip of the yoke portion 35 to generate a magnetic attraction force to the extent that the substrate frame 41 is magnetically attracted to the mask frame 31 . The mask frame 31 and the substrate frame 41 are fixed to each other. At the same time, the substrate 16 and the mask 15 are also fixed to each other.

Since the current flowing through the magnetic coil 18 gradually decreases, the magnetic attractive force gradually increases and no sudden change in force occurs, so that the substrate 16 does not crack or chip (especially when vertical stress is directly applied to the substrate 16). effective).

The second power supply terminal 29b is connected to a voltage measuring circuit 66, which measures the voltage at one end of the magnetic coil 18 and monitors whether it is normal or abnormal.

In this manner, a rapid current change at the start of adsorption and the start of release of adsorption is prevented. It is possible to prevent troubles such as the generation of dust due to changes over time.

If the release current is too small, the magnetic field of the permanent magnet portion 17 cannot be sufficiently reduced to the extent that the attracted portions 39 ₁ and 39 ₂ are not magnetically attracted. In that case, the remaining magnetic force of the permanent magnet portion 17 causes the attracting portions 32 ₁ to 32 ₄ to magnetically attract the attracted portions 39 ₁ and 39 ₂ .

On the other hand, if the release current is too large, a magnetic field larger than the magnetic field that eliminates the magnetic attraction force of the permanent magnet portion 17 is formed by the electromagnet portion 14, causing the attracting portions 32 ₁ to 32 ₄ to move the attracting portions 39 ₁ and 39 ₂ . magnetically attracted.

In order to eliminate the magnetic force of the permanent magnet portion 17 that attracts the attracted portions 39 ₁ and 39 ₂ , an appropriate current value should be applied to the electromagnet portion 14 .

The value of the release current that minimizes the force with which the attracting portions 32 ₁ to 32 ₄ magnetically attract the attracting portions 39 ₁ and 39 ₂ is also affected by temperature, such as temperature changes in the equivalent resistance value of the magnetic coil 18. Since the circuit 49 can change the value of the current flowing through the magnetic coil 18, the optimum release current value is measured in advance in a plurality of temperature atmospheres, and the relationship between the temperature and the optimum release current value is obtained. It is stored in the main control circuit 60, and the temperature of the adsorption parts 32 ₁ to 32 ₄ in the mask placement device 30 is measured by the temperature measuring device 40 when aligning. A release current having a current value corresponding to the measured temperature may be applied based on the value of the release current.

In the above example, the suction portions 32 ₁ to 32 ₄ are provided on the mask frame 31, and the suction portions 23 ₁ to 23 ₄ are provided on the substrate frame 41. However, as shown in FIG. , arranging holes 38 ₁ to 38 ₄ and the sucking portions 32 ₁ to 32 ₄ in the arranging holes 38 ₁ to 38 ₄ are provided in the substrate frame 41, and the sucked portions 23 ₁ to 23 ₄ are provided in the mask frame 31. The mask frame 31 and the substrate frame 41 may be in contact with each other while the suction portions 32 ₁ to 32 ₄ and the suction portions 23 ₁ to 23 ₄ face each other without contact.

In this case, the power supply unit 9 should be provided not on the attachment/detachment unit 25 but on the moving device 24 with which the substrate frame 41 contacts, and the power receiving unit 8 should be provided on the substrate frame 41 instead of the mask frame 31 .

In the above example, the permanent magnet portion 17 is provided separately from the magnetic core 36, but if the magnetic core 36 is made of a permanent magnet, the magnetic core 36 can be arranged inside the magnetic coil 18 as the permanent magnet portion 17. can be done.

8 Power receiving unit 9 Power feeding unit 12 Vacuum device 14 Electromagnet unit 15 Mask 16 Substrate 17 Permanent magnet unit 18 Magnetic coil 19a First power receiving terminal 19b Second power receiving terminal 21 Vacuum chambers 23 ₁ to 23 ₄ Adsorbed portion 24 Moving device 25 Detachable portion 29a First power feeding terminal 29b Second power feeding terminal 30 Mask Placement device 31 Mask frame 32 ₁ to 32 ₄ Attracting portion 35 Yoke portion 35 a Bottom portion 35 b Side portion 36 Magnetic core 39 ₁ First attracted portion 39 ₂ ……Second attracted portion 41 ……Board frame 42 ……Board placement device 47a ……First elastic portion 47b ……Second elastic portion 49 ……Conducting circuit 65 ……Current control circuit

Claims (18)

an evacuated vacuum chamber;
a mask placement device provided with a mask frame on which the mask is placed;
a board placement device provided with a board frame on which a board is placed;
has
a vacuum in which the mask frame and the substrate frame are fixed inside the vacuum chamber while the mask arranged in the mask arrangement device and the substrate arranged in the substrate arrangement device face each other; a device,
An attracting part, an attracting part that magnetically attracts the attracting part, a temperature measuring device that detects the temperature of the attracting part, and a current control circuit ,
one of the mask frame and the substrate frame is provided with the suction portion, and the other frame is provided with the suction portion;
The attracting part has an attracting state in which the attracting part is magnetically attracted to fix the substrate frame and the mask frame when the mask arranging device and the substrate arranging device face each other; a released state in which the force of magnetic attraction is weakened compared to the attracted state so that the substrate frame and the mask frame can be separated,
The attracting portion includes a permanent magnet portion that forms a magnetic field that magnetically attracts the attracted portion;
A magnetic coil is wound around the magnetic core, and when a releasing current of a predetermined magnitude is passed through the magnetic coil, the magnetic field that causes the attracting portion to magnetically attract the attracted portion is weakened, and the attracted state is changed to the released state. an electromagnet portion that is transitioned to a state ;
The current control circuit controls the magnitude of the release current based on the temperature detected by the temperature measuring device.
vacuum device. one end of the magnetic core is directed to the attracted portion that is magnetically attracted in the attracted state;
The attracting portion is provided with a yoke portion partly positioned on the other end side of the magnetic core and having a tip directed in the same direction as one end of the magnetic core,
The attracted portion has a first attracted portion facing one end of the magnetic core and a second attracted portion facing the tip of the yoke portion,
One of the N pole and S pole of the permanent magnet portion is directed to the other end of the magnetic core, and the other magnetic pole of the permanent magnet portion is directed to the bottom portion of the yoke portion. The vacuum apparatus of claim 1, directed. The suction portion is provided on the mask frame,
The mask placement device is provided with a first power receiving terminal electrically connected to one end of the magnetic coil and a second power receiving terminal electrically connected to the other end of the magnetic coil,
3. The vacuum apparatus according to claim 1, wherein a voltage applied between said first power receiving terminal and said second power receiving terminal causes a current to flow through said magnetic coil. A detachable part in which the mask arranging device is detachably arranged is provided in the vacuum chamber,
The detachable portion includes a first power supply terminal that can be brought into contact with and separated from the first power reception terminal, and a second power supply terminal that can be brought into contact with and separated from the second power reception terminal. and
The first power receiving terminal and the first power feeding terminal are electrically connected during contact,
The second power receiving terminal and the second power feeding terminal are electrically connected during contact,
4. The vacuum apparatus according to claim 3, wherein the release current flows due to a voltage applied between the first power supply terminal and the second power supply terminal. The suction part is provided on the substrate frame,
The substrate placement device is provided with a first power receiving terminal electrically connected to one end of the magnetic coil and a second power receiving terminal electrically connected to the other end of the magnetic coil,
3. The vacuum apparatus according to claim 1, wherein a voltage applied between said first power receiving terminal and said second power receiving terminal causes a current to flow through said magnetic coil. a detachable portion in which the substrate arranging device is detachably disposed is provided in the vacuum chamber;
The detachable portion includes a first power supply terminal that can be brought into contact with and separated from the first power reception terminal, and a second power supply terminal that can be brought into contact with and separated from the second power reception terminal. and
The first power receiving terminal and the first power feeding terminal are electrically connected during contact,
The second power receiving terminal and the second power feeding terminal are electrically connected during contact,
6. The vacuum apparatus according to claim 5, wherein the release current flows due to a voltage applied between the first power supply terminal and the second power supply terminal. A first elastic portion is provided on one electrode of the first power receiving terminal and the first power feeding terminal, and while the first power receiving terminal and the first power feeding terminal are in contact with each other, the first elastic portion is deformed,
A second elastic portion is provided on one electrode of the second power receiving terminal and the second power feeding terminal, and while the second power receiving terminal and the second power feeding terminal are in contact with each other, the second elastic portion is deformed,
The first power receiving terminal and the first power feeding terminal are pressed against each other by the restoring force of the first elastic portion, and the second power receiving terminal and the second power feeding terminal are pressed by the restoring force of the second elastic portion. 7. Vacuum apparatus according to claim 4 or claim 6, wherein the power supply terminals are pressed against each other. 8. The vacuum device according to any one of claims 1 to 7 , wherein in the suction state, the suctioned portion and the suction portion face each other while being separated from each other. a mask placement device provided with a mask frame on which the mask is placed;
a board placement device provided with a board frame on which a board is placed;
has
A carrier device in which the mask frame and the substrate frame are fixed in a state in which the mask arranged in the mask arrangement device and the substrate arranged in the substrate arrangement device face each other,
An attracting part, an attracting part that magnetically attracts the attracting part, a temperature measuring device that detects the temperature of the attracting part, and a current control circuit ,
one of the mask frame and the substrate frame is provided with the suction portion, and the other frame is provided with the suction portion;
The attracting part has an attracting state in which the attracting part is magnetically attracted to fix the substrate frame and the mask frame when the mask arranging device and the substrate arranging device face each other; a released state in which the force of magnetic attraction is weakened compared to the attracted state so that the substrate frame and the mask frame can be separated,
The attracting portion includes a permanent magnet portion that forms a magnetic field that magnetically attracts the attracted portion;
A magnetic coil is wound around the magnetic core, and when a releasing current of a predetermined magnitude is passed through the magnetic coil, the magnetic field that causes the attracting portion to magnetically attract the attracted portion is weakened, and the attracted state is changed to the released state. an electromagnet portion that is transitioned to a state ;
The current control circuit controls the magnitude of the release current based on the temperature detected by the temperature measuring device.
Conveyor. one end of the magnetic core is directed to the attracted portion that is magnetically attracted in the attracted state;
The attracting portion is provided with a yoke portion partly positioned on the other end side of the magnetic core and having a tip directed in the same direction as one end of the magnetic core,
The attracted portion has a first attracted portion facing one end of the magnetic core and a second attracted portion facing the tip of the yoke portion,
One of the N pole and S pole of the permanent magnet portion is directed to the other end of the magnetic core, and the other magnetic pole of the permanent magnet portion is directed to the bottom portion of the yoke portion. A conveying device according to claim 9 oriented. The suction portion is provided on the mask frame,
The mask placement device is provided with a first power receiving terminal electrically connected to one end of the magnetic coil and a second power receiving terminal electrically connected to the other end of the magnetic coil,
11. A transporting apparatus according to claim 9 or 10 , wherein a voltage applied between said first power receiving terminal and said second power receiving terminal causes current to flow through said magnetic coil. A first power supply terminal that can be brought into contact with and separated from the first power reception terminal, and the second power reception terminal, which is provided in a vacuum chamber and can be attached to and detached from the mask placement device. A second power supply terminal that can be contacted and separated from is provided,
The first power receiving terminal and the first power feeding terminal are electrically connected during contact,
The second power receiving terminal and the second power feeding terminal are electrically connected during contact,
12. The transporting apparatus according to claim 11 , wherein the voltage applied between the first power supply terminal and the second power supply terminal causes the release current to flow. The suction part is provided on the substrate frame,
The substrate placement device is provided with a first power receiving terminal electrically connected to one end of the magnetic coil and a second power receiving terminal electrically connected to the other end of the magnetic coil,
11. A transporting apparatus according to claim 9 or 10 , wherein a voltage applied between said first power receiving terminal and said second power receiving terminal causes current to flow through said magnetic coil. A first power supply terminal capable of contacting and separating from the first power receiving terminal, and the second power receiving terminal are provided in a vacuum chamber and are disposed on a moving device on which the substrate placement device is detachably arranged. A second power supply terminal that can be contacted and separated from is provided,
The first power receiving terminal and the first power feeding terminal are electrically connected during contact,
The second power receiving terminal and the second power feeding terminal are electrically connected during contact,
14. The transporting apparatus according to claim 13 , wherein the voltage applied between the first power supply terminal and the second power supply terminal causes the release current to flow. 15. The conveying device according to claim 9 , wherein in the suction state, the suctioned portion and the suction portion face each other while being separated from each other. A position for aligning the mask and the substrate by relatively moving a mask placement device having a mask frame on which a mask is placed and a substrate placement device having a substrate frame on which a substrate is placed. a matching process;
By the magnetic field formed by the permanent magnet portion of the attracting portion provided on one of the mask frame and the substrate frame, the attracting portion provided on the other frame is moved. a fixing step of fixing the mask frame and the substrate frame to each other by magnetic attraction to relatively fix the mask and the substrate;
a moving step of moving the mask placement device and the substrate placement device together while the mask and the substrate are relatively fixed, the alignment method comprising:
In the alignment step, the temperature of the attracting portion is measured by a temperature measuring device, and the magnetic attracting force of the attracting portion is applied to the electromagnet portion provided in the attracting portion by applying a release current corresponding to the temperature of the attracting portion. drain and weaken,
The alignment method of stopping the release current in the fixing step. 17. The alignment method according to claim 16 , wherein the current flowing through the electromagnet portion is gradually decreased to stop the release current. Obtaining and storing a relationship between a value of a current that weakens the force of the attracting part magnetically attracting the part to be attracted and the temperature of the mask placement device;
18. The alignment method according to claim 16 , wherein the temperature of said mask placement device is measured, and a current having a value corresponding to the measured temperature is passed through said electromagnet unit as said release current.

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