JP7300575B2 - Component mounting device and mounting board manufacturing method - Google Patents

Description

The present invention relates to a component mounting apparatus for manufacturing a mounting board having components mounted on the board, and a method for manufacturing the mounting board.

As a component mounting device for manufacturing a mounting board with components mounted on the board, after inserting the lead of the component with the lead into the insertion hole of the board held at the mounting position, the lead protruding from the back of the board is bent by the leg bending mechanism. There is known a device that prevents a component from coming off from a board by using a device (see, for example, Patent Document 1). The component mounting apparatus described in Patent Document 1 includes a supply conveyor, a positioning unit that holds a substrate whose mounting work position is set, and an unloading conveyor. The board is carried in to the position, the components are mounted thereon, and the board with the components mounted thereon is carried out to the downstream side by the conveyer of the positioning section and the unloading conveyor.

JP 2015-226037 A

However, in the prior art including Patent Document 1, there is a problem that the leg bending mechanism interferes with the conveyor of the positioning section, so that the component inserted in the side region near the edge of the board cannot be bent. There has been a problem in that the component inserted into the part area is bent and the board is reliably carried in and out of the mounting position.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting apparatus and a mounting board manufacturing method that can reliably replace a board at a mounting work position.

The component mounting apparatus of the present invention has a carry-in drive mechanism for driving a carry-in conveyor. A mounting area for receiving and mounting components on the board, and a carry-out driving mechanism for driving a carry-out conveyor, wherein the board carried out from the mounting area is sent to a device downstream in the board carrying direction by the carry-out conveyor. a carrying-out area for carrying out, a contacting member for contacting the rear end of the substrate and moving the substrate to the downstream side, a standby position set in the carrying-in area, and the waiting position for moving the contacting member up and down. a contact member drive mechanism for moving between a position and a delivery position set downstream, and a control unit for controlling the carry-in drive mechanism, the carry-out drive mechanism, and the contact member drive mechanism, Before returning the abutting member, which has moved the board on which components have been mounted in the mounting area to the unloading area, to the standby position and raises it, the controller controls the front end of the next board to be raised. The carrying-in drive mechanism is controlled so as not to reach the standby position.
Another component mounting apparatus of the present invention has a carry-in drive mechanism for driving a carry-in conveyor, a carry-in area for carrying in the board received from an apparatus on the upstream side in the board conveying direction by the carry-in conveyor, and a carry-in area from the carry-in area. A mounting area for receiving a board and mounting components on the board, and a carry-out driving mechanism for driving a carry-out conveyor, wherein the board carried out from the mounting area is carried by the carry-out conveyor to the downstream side in the board carrying direction. an unloading area for unloading to an apparatus, an abutment member that abuts on the rear end of the substrate to move the substrate to the downstream side, and a standby position that vertically raises and lowers the abutment member and is set in the loading area. a contact member drive mechanism for moving between the waiting position and the delivery position set downstream, and a control unit for controlling the carry-in drive mechanism, the carry-out drive mechanism, and the contact member drive mechanism. The control unit returns the contact member, which has moved the board on which components have been mounted in the mounting area to the unloading area, to the standby position and is in a raised state, and then moves the upstream device to the standby position. to unload the next board.
Another component mounting apparatus of the present invention has a carry-in drive mechanism for driving a carry-in conveyor, a carry-in area for carrying in the board received from an apparatus on the upstream side in the board conveying direction by the carry-in conveyor, and a carry-in area from the carry-in area. A mounting area for receiving a board and mounting components on the board, and a carry-out driving mechanism for driving a carry-out conveyor, wherein the board carried out from the mounting area is carried by the carry-out conveyor to the downstream side in the board carrying direction. an unloading area for unloading to an apparatus, an abutment member that abuts on the rear end of the substrate to move the substrate to the downstream side, and a standby position that vertically raises and lowers the abutment member and is set in the loading area. a contact member drive mechanism for moving between the waiting position and the delivery position set downstream, and a control unit for controlling the carry-in drive mechanism, the carry-out drive mechanism, and the contact member drive mechanism. The control unit controls the contact member drive mechanism so that the contact member moves in a lowered state at least in the mounting area.

A method for manufacturing a mounted board according to the present invention is a method for manufacturing a mounted board in which components are mounted on the board by a component mounting device, wherein the component mounting device receives from a device on the upstream side in the board conveying direction. a carrying-in area for carrying in the board by a carrying-in conveyor; a mounting area for receiving the board from the carrying-in area and mounting components thereon; An unloading area for unloading the substrate to an apparatus, and vertically ascends and descends, moves between a standby position set in the loading area and a delivery position set downstream from the standby position, and contacts the rear end of the substrate. an abutment member for moving the substrate to the downstream side by using a component mounting step of mounting a component on the substrate in the mounting area; a carry-out requesting step of requesting carry-out of the substrate from the above; moving the contact member waiting at the standby position to the delivery position; a carry-out area moving step of moving the substrate to the carry-out area by bringing the substrate into contact with the rear end thereof; a carrying-out step of carrying the substrate out of the device to the downstream side device by the carrying-out conveyor; a contact member return step of moving the contact member to the standby position and raising the contact member; a standby position loading step of moving the next substrate until the rear end passes the standby position; and lowering the abutment member to move it to the downstream side, and mounting the next substrate in the loading area. a mounting area moving step of moving to an area; and a contact member forwarding step of moving the contact member moved to the mounting area to the standby position.

According to the present invention, it is possible to reliably replace the board at the mounting position.

1 is a plan view showing the configuration of a component mounting apparatus according to an embodiment of the present invention; FIG. FIG. 1 is an explanatory diagram showing an example of an insertion component mounted on a substrate by a component mounting apparatus according to an embodiment of the present invention; 1(a) is a plan view and (b) is a side view showing the configuration of a board transfer mechanism provided in a component mounting apparatus according to an embodiment of the present invention. FIG. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. FIG. 4 is a diagram for explaining board transfer by the component mounting apparatus according to one embodiment of the present invention; FIG. 4 is a diagram for explaining board transfer by the component mounting apparatus according to one embodiment of the present invention; (a), (b), (c), (d), and (e) are explanatory diagrams of the manufacturing process of the mounting board in the component mounting apparatus according to the embodiment of the present invention. (a), (b), (c), (d), and (e) are explanatory diagrams of the manufacturing process of the mounting board in the component mounting apparatus according to the embodiment of the present invention. FIG. 2 is a flowchart of a method for manufacturing a mounting board in the component mounting apparatus according to one embodiment of the present invention; FIG. 2 is a flowchart of a method for unloading a board in a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a flowchart of a method for loading a substrate in a component mounting apparatus according to an embodiment of the present invention; FIG. 4 is a flowchart of another mounting board manufacturing method in the component mounting apparatus according to the embodiment of the present invention; FIG. 4 is a flow diagram of another substrate carrying-in method in the component mounting apparatus according to the embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, and the like described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting device and the board transfer mechanism. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 1 and a part described later, the two axial directions perpendicular to each other in the horizontal plane are the X direction of the substrate transfer direction (horizontal direction in FIG. 1) and the Y direction perpendicular to the substrate transfer direction (vertical direction in FIG. 1). is shown. In FIG. 3(b) and a part described later, the Z direction (vertical direction in FIG. 3(b)) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane.

First, the configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of manufacturing a mounting board in which components are mounted on the board. A substrate transport mechanism 2 is installed in the X direction at the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side (the left side in FIG. 1) in the X direction, and positions and holds it at a mounting work position by the mounting head described below. Further, the substrate transport mechanism 2 carries out the substrate 3 on which the component mounting work is completed to the downstream side (right side in FIG. 1). A component supply unit 4 is installed on each side of the board transfer mechanism 2 .

In FIG. 1, a plurality of tape feeders 5 are mounted in parallel in the X direction on one component supply section 4 (lower side in FIG. 1). The tape feeder 5 pitch-feeds a carrier tape having pockets for storing components such as surface-mounted components in a direction (tape feed direction) from the outside of the component supply section 4 toward the substrate transport mechanism 2, thereby feeding the carrier tape. A component is supplied to a component pickup position where the mounting head picks up the component.

A plurality of insertion part feeders 6 and tray feeders 7 are mounted in parallel in the X direction on the other part supply unit 4 (upper side in FIG. 1). The insertion component feeder 6 pitch-feeds the component holding tape holding the insertion component in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport mechanism 2, thereby allowing the mounting head to feed the component holding the insertion component. Feed the insert into the holding position. The tray feeder 7 feeds a tray 8 that holds and aligns components such as insertion components and press-fit components to a component holding position where the mounting head holds the components. The component supply unit 4 may be equipped with a stick feeder that supplies components stored in a stick, or a ball feeder that supplies components while aligning them in a bowl.

Here, the structure of the insert part 20 will be described with reference to FIG. The insertion part 20 is provided with a plurality of leads 21 (here, two leads) that are inserted into an insertion hole 3v (see FIG. 3B) vertically penetrating the substrate 3 formed in the substrate 3. ing. The component holding tape 22 holds the plurality of insertion components 20 at regular intervals with the leads 21 interposed therebetween. The component holding tape 22 is formed with feed holes 22a that engage with the sprockets of the insert component feeder 6. As shown in FIG. The inserting part feeder 6 feeds the inserting part 20 to the part holding position with the lead 21 extending downward by pitch-feeding the part holding tape 22 by engaging the sprocket with the feed hole 22a.

In FIG. 1, a Y-axis table 9 having a linear driving mechanism is installed along the Y direction at both ends in the X direction on the upper surface of the base 1a. A beam 10 similarly provided with a linear driving mechanism is coupled to the Y-axis table 9 so as to be movable in the Y direction. A mounting head 11 is mounted on the beam 10 so as to be movable in the X direction. Attached to the lower end of the mounting head 11 are a suction nozzle that sucks and holds a component, and a component holder 11a (see FIG. 3B) that grips and holds the insertion component 20 with a pair of chucks 11b. . A plurality of suction nozzles and component holding portions 11 a are mounted on the mounting head 11 so as to correspond to the components to be mounted on the substrate 3 .

The Y-axis table 9 and the beam 10 constitute a mounting head moving mechanism 12 that moves the mounting head 11 in horizontal directions (X direction and Y direction). The mounting head moving mechanism 12 and the mounting head 11 take out the component (insertion component 20) supplied to the component supply unit 4, transfer it to the mounting position of the substrate 3 held by the substrate transport mechanism 2, and mount the component. Repeatedly perform a series of turns of work.

In FIG. 1, the beam 10 is equipped with a head camera 13 positioned on the lower surface side of the beam 10 and moving integrally with the mounting head 11 . As the mounting head 11 moves, the head camera 13 moves above the board 3 positioned at the mounting work position of the board transport mechanism 2, and picks up a board mark (not shown) provided on the board 3. The position of the substrate 3 is recognized.

A component recognition camera 14 is installed between one of the component supply units 4 and the board transfer mechanism 2 . When the mounting head 11 that has picked up the component from the component supply unit 4 is positioned above the component recognition camera 14, the component recognition camera 14 moves the component (insertion component 20) held by the suction nozzle or the component holding unit 11a downward. Take an image from In the operation of mounting the component on the board 3 by the mounting head 11, the mounting position is corrected in consideration of the recognition result of the board 3 by the head camera 13 and the recognition result of the component by the component recognition camera 14. FIG.

Next, the configuration of the substrate transfer mechanism 2 will be described with reference to FIGS. 3(a) and 3(b). FIG. 3(a) schematically shows a plan view of the substrate transport mechanism 2 viewed from above, and FIG. 3(b) schematically shows a side view of the substrate transport mechanism 2 viewed from the upstream side. In FIG. 3A, the board transfer mechanism 2 has a carry-in area 30, a mounting area 31, and a carry-out area 32 in order from the upstream side. The substrate transport mechanism 2 includes a pair of plate-like members 33 extending in the X direction including a carry-in area 30, a mounting area 31, and a carry-out area 32. As shown in FIG. Inside the pair of plate-like members 33 in the carry-in area 30, a pair of carry-in conveyors 30a driven by a carry-in drive mechanism 30b including a motor is installed. The carry-in conveyor 30a conveys the substrate 3 carried in from the apparatus on the upstream side to the downstream side.

3A, a pair of rails 31a are installed inside the pair of plate members 33 in the mounting area 31. As shown in FIG. The pair of rails 31a is moved vertically by a rail lifting mechanism 31b (see FIG. 4). At the upper end of the plate-shaped member 33 positioned in the mounting area 31, a pressing plate 34 is installed to protrude above the rail 31a.

In a state where the front end 3h of the substrate 3 moved on the rail 31a is positioned at the mounting work position P2 set in the mounting area 31, the rail lifting mechanism 31b is operated to raise the rail 31a ( As shown by arrow k8 in FIG. 8(e), the edge of the substrate 3 is pressed against the lower surface of the pressing plate 34 and held. When the rail elevating mechanism 31b is operated to lower the rail 31a (arrow j1 in FIG. 7B), the top surface of the rail 31a becomes the same height as the loading conveyor 30a and the unloading conveyor 32a, which will be described later. When the rail 31a is set at this height position, it becomes possible to transport the board 3 from the loading area 30 to the mounting area 31 and transport the board 3 from the mounting area 31 to the unloading area 32. FIG.

In FIG. 3B, the component holding portion 11a holding the insertion component 20 descends from above (arrow a), and the lead 21 is inserted into the insertion hole 3v formed in the board 3 held in the mounting area 31. The insert 20 is thereby mounted. Below the substrate 3 held in the mounting area 31, a lead processing mechanism 35 is installed which moves horizontally (X direction, Y direction) and vertically (Z direction) by a built-in moving mechanism (not shown). there is The lead processing mechanism 35 moves below the insertion component 20 mounted on the substrate 3, cuts the leads 21 of the insertion component 20 (component) mounted on the substrate 3 to a predetermined length, and cuts the leads 21 after cutting. It has a function of processing the leads 21 such as bending the leads 21 toward the lower surface of the substrate 3 to fix the insertion component 20 to the substrate 3 .

In FIG. 3A, inside the pair of plate members 33 in the carry-out area 32, a pair of carry-out conveyors 32a driven by a carry-out drive mechanism 32b including a motor is installed. The unloading conveyor 32a unloads the substrate 3 transported from the mounting area 31 to a device on the downstream side. The carrying-in conveyor 30a and the carrying-out conveyor 32a may be a belt conveyor that transports the substrate 3 with a belt made of rubber or the like, or a conveyor that transports the substrate 3 with a chain.

Thus, the carry-in area 30 has a carry-in drive mechanism 30b for driving the carry-in conveyor 30a, and carries in the board 3 received from the upstream device in the board transfer direction (X direction) by the carry-in conveyor 30a. The mounting area 31 receives the substrate 3 from the carry-in area 30 and mounts components (mounting components 20 ) on the substrate 3 . The carry-out area 32 has a carry-out drive mechanism 32b that drives a carry-out conveyor 32a, and the board 3 carried out from the mounting area 31 is carried out to a device on the downstream side in the board carrying direction by the carry-out conveyor 32a. Since the mounting area 31 of the substrate transport mechanism 2 of this embodiment does not have a conveyor mechanism for transporting the substrate 3, the lead processing mechanism 35 is moved to near the edge of the substrate 3 to process the leads 21 of the insertion part 20. can do.

In FIG. 3A, a first board detection sensor 36 is installed at the carry-in entrance S1 on the upstream side of the carry-in area 30. As shown in FIG. In the carry-in area 30, a second substrate detection sensor 37 is installed at an intermediate position S2 between the carry-in entrance S1 and a standby position P1, which will be described later. A third substrate detection sensor 38 is installed at the loading/unloading entrance S<b>3 on the upstream side of the unloading area 32 . A fourth board detection sensor 39 is installed at the carry-out exit S4 on the downstream side of the carry-out area 32 .

Each of the first substrate detection sensor 36, the second substrate detection sensor 37, the third substrate detection sensor 38, and the fourth substrate detection sensor 39 includes a light projecting portion that emits detection light and a detection portion that receives the detection light. The presence or absence of the substrate 3 is detected by the substrate 3 shielding the detection light. For detection signals from the first board detection sensor 36, the second board detection sensor 37, the third board detection sensor 38, and the fourth board detection sensor 39, refer to the controller 50 (FIG. 4) provided in the main body of the component mounting apparatus 1. is transmitted to

In FIGS. 3A and 3B, a contact member moving mechanism 40b for moving the contact member elevating mechanism 40a in the substrate transport direction (X direction) is installed on the outside of one plate member 33. ing. The contact member moving mechanism 40b reciprocates the contact member lifting mechanism 40a between a standby position P1 set in the carry-in area 30 and a transfer position P3 set downstream from the standby position P1. In the example of FIG. 3( a ), the delivery position P3 is set in the carry-out area 32 .

The contact member elevating mechanism 40a includes an arm 41 that extends in the Y direction to the inside of the rail 31a across the upper side of the pressing plate 34. As shown in FIG. One end of the arm 41 is supported by the contact member elevating mechanism 40a, and the contact member 42 extending downward is arranged at the other end. The contact member elevating mechanism 40a vertically swings the other end of the arm 41 with one end of the arm 41 as a rotation shaft (arrow b). As a result, the contact member 42 arranged at the other end of the arm 41 moves up and down (arrow k3 in FIG. 8(b), arrow k5 in FIG. 8(c)).

When the contact member 42 is in the raised position, the substrate 3 can pass under the contact member 42 (arrow k4 in FIG. 8(c)). When the contact member 42 is in the lowered position, the contact member 42 can contact the rear end 3e of the substrate 3 (FIG. 7(b)). When the contact member moving mechanism 40b moves the contact member elevating mechanism 40a (contact member 42) downstream while the contact member 42 is in contact with the rear end 3e of the substrate 3, the substrate 3 moves downstream. It can be moved (arrow k6 in FIG. 8(d), arrow j3 in FIG. 7(d), arrow j4 in FIG. 7(e)).

In this manner, the contact member elevating mechanism 40a and the contact member moving mechanism 40b move the contact member 42 up and down, and are set at the standby position P1 set in the carry-in area 30 and downstream of the standby position P1. An abutment member drive mechanism 40 is configured to move along the substrate transfer direction (X direction) between the delivery position P3. That is, when the abutment member 42 moves from the standby position P1 to the transfer position P3 while being lowered to the lowered position, the rear end 3e contacts the rear end 3e of the substrate 3 between the standby position P1 and the transfer position P3. to move the substrate 3 downstream.

It should be noted that the contact member moving mechanism 40b may reciprocate the contact member elevating mechanism 40a in the X direction. For example, the contact member moving mechanism 40b may be configured to reciprocate the contact member elevating mechanism 40a by a linear motor, or may be configured to reciprocate by driving a belt by a motor. It may be configured to drive and reciprocate. Further, the contact member moving mechanism 40b incorporates an encoder (not shown) to detect the X-direction position of the contact member elevating mechanism 40a (contact member 42).

3(a), the distance L1 between the loading entrance S1 and the intermediate position S2, the distance L2 between the intermediate position S2 and the standby position P1, and the distance between the standby position P1 and the mounting work position P2. The distance between them is L3, and the distance between the mounting work position P2 and the delivery position P3 is L4. Also, the size of the substrate 3 along the substrate transport direction is defined as length Lb.

Next, with reference to FIG. 4, the configuration of the control system of the component mounting apparatus 1 will be described in detail. A control device 50 provided in the component mounting apparatus 1 includes a substrate transport mechanism 2, a component supply unit 4, a mounting head 11, a mounting head moving mechanism 12, a head camera 13, a component recognition camera 14, a lead processing mechanism 35, a first substrate detection A sensor 36, a second board detection sensor 37, a third board detection sensor 38, and a fourth board detection sensor 39 are connected. The substrate transfer mechanism 2 includes a loading driving mechanism 30b, a rail lifting mechanism 31b, a loading driving mechanism 32b, and a contact member driving mechanism 40. As shown in FIG.

The control device 50 includes a transport control section 51 , an arrival time calculation section 52 , a return time calculation section 53 , a mounting control section 54 , a production data storage section 55 and a parts information storage section 56 . The transport control unit 51 has a communication processing unit 51a as an internal processing unit. The production data storage unit 55 is a storage device, and stores the size of the substrate 3 (length Lb, etc.), the name of the component to be mounted on the substrate 3, the mounting position (XY coordinates), etc. for each type of mounting substrate to be manufactured. is stored. The component information storage unit 56 is a storage device, and stores the component type (surface mount component, lead component 20), component size, etc. for each component name.

In FIG. 4, the communication processing unit 51a transmits an unloading request instruction requesting unloading of the substrate 3 to the upstream device, and receives the unloading request instruction transmitted by the downstream device. The transport control unit 51 controls the substrate transport mechanism 2 based on the detection results of the first substrate detection sensor 36, the second substrate detection sensor 37, the third substrate detection sensor 38, and the fourth substrate detection sensor 39, is received from an upstream device, transported, positioned and held at the mounting work position P2, and transported to a downstream device.

That is, the transport control unit 51 is a control unit that controls the carry-in drive mechanism 30b, the carry-out drive mechanism 32b, and the contact member drive mechanism 40 to carry the substrate 3 in the carry-in area 30, the mounting area 31, and the carry-out area 32. Further, the transport control unit 51 controls the rail elevating mechanism 31b to raise the rails 31a to clamp (hold) the board 3 while the board 3 is positioned at the mounting position P2, thereby clamping the board 3. The clamp is released by lowering the rail 31a from the clamped state.

Here, specific control by the transport control unit 51 will be described with reference to FIGS. 5 to 8. FIG. 5 and 6 show the positions of the front ends 3h and the rear ends 3e of the substrates 3a, 3b, and 3c transported by the substrate transport mechanism 2 and the positions of the contact members 42 (vertical axis) along time T (horizontal axis). is represented. FIG. 5 shows the process of conveying the next board 3b to the mounting position P2 after the component mounting work for the board 3a clamped at the mounting position P2 is completed. FIG. 6 shows the process of conveying the next board 3c to the mounting position P2 after the component mounting work on the board 3b clamped at the mounting work position P2 is completed.

First, the control for receiving the substrates 3b and 3c from the upstream device and transporting them to the standby position P1 will be described. 5 and 6, the transport control unit 51 detects that the front ends 3h of the substrates 3b and 3c carried out from the apparatus on the upstream side (arrow k2 in FIG. 8B) have reached the loading port S1. When the detection sensor 36 detects (arrow c1 in FIG. 5, arrow h1 in FIG. 6), the carry-in drive mechanism 30b is operated. As a result, the carry-in conveyor 30a travels to convey the substrates 3b and 3c downstream (arrow k4 in FIG. 8(c)).

Based on the length Lb of the substrates 3b and 3c stored in the production data storage unit 55, the transportation control unit 51 controls the rear ends 3e of the substrates 3b and 3c to pass through the standby position P1 and the transportation is stopped. (FIG. 8(c)) After a predetermined period of time from the operation of the carry-in drive mechanism 30b, the carry-in drive mechanism 30b is stopped (arrow d1 in FIG. 5, arrow i1 in FIG. 6).

The transport control unit 51 controls the contact member drive mechanism 40 to raise the contact member 42 from the standby position P1 to the raised position before the front ends 3h of the substrates 3b and 3c reach the standby position P1 (see FIG. 5). section e7 of FIG. 6, section g1 of FIG. 6, arrow k3 of FIG. 8(b)). As a result, the front ends 3h of the substrates 3b and 3c being transported can be prevented from colliding with the contact member . Hereinafter, the state in which the contact member 42 has returned to the standby position P1 and has risen to the raised position will be referred to as a "return completed state".

If the front ends 3h of the substrates 3b and 3c reach the standby position P1 before the return of the contact member 42 is completed, the transport control unit 51 controls the loading drive mechanism 30b so that the loading conveyor 30a moves the substrates 3b and 3c. Adjust so that the conveying speed for moving 3c to the downstream side becomes slow. In FIG. 5, after the return of the contact member 42 is completed (section e8), the front end 3h of the substrate 3b reaches the standby position P1 (arrow c2), so the transport speed of the substrate 3b is not adjusted. . On the other hand, in FIG. 6, when the transport speed of the substrate 3c is not adjusted, the front end 3h reaches the standby position P1 (arrow h2) before the abutting member 42 reaches the return completion state (section g2). The transport control unit 51 makes adjustments to slow down the transport speed.

Even if the transport speed is adjusted when the front end 3h of the substrate 3c reaches the loading port S1, a predetermined time after the front end 3h of the substrate 3c passes the loading port S1 (or a predetermined distance travels). after you finish). In FIG. 6, the front end 3h of the substrate 3c is transported between the loading entrance S1 and the standby position P1 (arrow h4) by slowing down the transport speed, so that the return of the contact member 42 is completed (section g2). The front end 3h has reached the standby position P1 (arrow h5).

When the substrates 3b and 3c carried out from the equipment on the upstream side are transferred to the carry-in conveyor 30a, the substrates 3b and 3c may be pushed by the equipment on the upstream side and slide on the carry-in conveyor 30a, or the substrates 3b and 3c may slide on the carry-in conveyor 30a. The transportation error is large because the sheet 3c cannot be received and the sheet idling. Therefore, the transport controller 51 may adjust (reduce) the transport speed after the second substrate detection sensor 37 detects that the front ends 3h of the substrates 3b and 3c have reached the intermediate position S2. The substrates 3b and 3c can be accurately stopped at the standby position P1 by adjusting the transportation speed based on the time T when the transportation of the substrates 3b and 3c reaches the intermediate position S2. Alternatively, the transport control unit 51 may control the carry-in drive mechanism 30b to temporarily stop transport instead of slowing down the transport speed.

Next, control for transporting the substrates 3b and 3c from the standby position P1 to the mounting work position P2 will be described. 5 and 6, the transport control unit 51 controls the contact member drive mechanism 40 in a state where the rear ends 3e of the substrates 3b and 3c have passed the standby position P1 to lower the contact member 42 to the lowered position. (section e9 in FIG. 5, section g3 in FIG. 6, arrow k5 in FIG. 8(c)). The transport control unit 51 controls the contact member driving mechanism 40 while the contact member 42 is in the lowered position, and moves the contact member 42 downstream from the standby position P1 (section e10 in FIG. 5, FIG. 6). section g4, arrow k6 in FIG. 8(d)). As a result, the rear end 3e is pushed by the contact member 42 and the substrates 3b and 3c move downstream.

Based on the length Lb of the substrates 3b and 3c stored in the production data storage unit 55, the transport control unit 51 controls the front ends 3h of the substrates 3b and 3c to stop at the mounting position P2 (arrow c3 in FIG. 5). , arrow h6 in FIG. 6), and the contact member driving mechanism 40 is controlled to stop the contact member 42 at a predetermined position (arrow e11 in FIG. 5, arrow g5 in FIG. 6). That is, the contact member 42 moves downstream from the standby position P1 by a distance (L3-Lb) obtained by subtracting the length Lb of the substrates 3b and 3c from the distance L3 between the standby position P1 and the mounting work position P2. It stops at the position (FIG. 8(d)). As a result, the substrates 3b and 3c are positioned at the mounting work position P2.

5 and 6, when the substrates 3b and 3c are positioned at the mounting position P2, the transport control unit 51 controls the contact member drive mechanism 40 to move (forward) the contact member 42 to the standby position P1. ) (section e12 in FIG. 5, section g6 in FIG. 6, arrow k7 in FIG. 8(e)). When the contact member 42 returns to the standby position P1, the transport control unit 51 controls the rail lifting mechanism 31b to raise the rail 31a to clamp (hold) the substrates 3b and 3c (section e13 in FIG. 5, FIG. 6, arrow k8 in FIG. 8(e)).

Next, a description will be given of the control for carrying out the board 3a on which the component mounting work has been completed to the outside of the apparatus. In FIG. 5, when the component mounting work (FIG. 7A) on the board 3a is completed, the transport control unit 51 controls the rail lifting mechanism 31b to lower the rail 31a and release the clamp of the board 3a ( Section e1, arrow j1 in FIG. 7(b)).

When the substrate 3a is released from the clamp, the transport control unit 51 controls the contact member driving mechanism 40 to move the contact member 42 downstream (section e2, arrow j2 in FIG. 7(c)). The transport control unit 51 controls the contact member drive mechanism 40 so that after the contact member 42 contacts the rear end 3e of the substrate 3a (arrow e3), the contact member 42 is further moved downstream to move the substrate. 3a is moved downstream from the mounting position P2 (arrow f1) (section e4, arrow j3 in FIG. 7(d)).

In FIG. 5, when the third substrate detection sensor 38 detects that the front end 3h of the substrate 3a moving downstream has reached the loading/unloading port S3 (arrow f2, FIG. 7(d)), the transport control unit 51 , actuates the unloading drive mechanism 32b. The transport control unit 51 controls the contact member driving mechanism 40 to move the contact member 42 to the delivery position P3 after the front end 3h of the substrate 3a reaches the loading/unloading port S3 (arrow f2) (arrow e5, Arrow j4) in FIG. 7(e). That is, the contact member 42 is moved downstream from the standby position P1 by a distance (L3+L4) obtained by adding the distance L4 between the mounting work position P2 and the delivery position P3 to the distance L3 between the standby position P1 and the mounting work position P2. (Fig. 7(e)).

While the front end 3h of the substrate 3a moves downstream from the loading/unloading port S3 (section f3), the substrate 3a is transferred onto the running unloading conveyor 32a. After the rear end 3e of the substrate 3a has passed the delivery position P3 (arrows e5 and f4), the unloading conveyor 32a conveys the substrate 3a downstream (arrow j5 in FIG. 8A). When the fourth substrate detection sensor 39 detects that the front end 3h of the substrate 3a moving downstream has reached the unloading port S4 (arrow f5, FIG. 8A), the transport control unit 51 controls the unloading drive mechanism. 32b is paused.

When the communication processing unit 51a receives the unloading request instruction from the downstream device, the transport control unit 51 reactivates the unloading drive mechanism 32b (arrow f6) to transfer the substrate 3a in the unloading area 32 to the downstream device. (section f7, arrow j6 in FIG. 8(b)). When the front end 3h of the substrate 3b reaches the carry-out exit S4 after the communication processing unit 51a receives the carry-out request instruction from the device on the downstream side (FIG. 6), the transport control unit 51 causes the carry-out drive mechanism 32b to The substrate 3b is unloaded to a device on the downstream side without being temporarily stopped.

In FIG. 5, the transport control unit 51 controls the contact member drive mechanism 40 to move the contact member 42 (arrow e5) that has moved to the delivery position P3 to the standby position P1 (section e6, FIG. 8A). arrow k1). If the substrate 3 is transferred to the unloading conveyor 32a before the contact member 42 reaches the transfer position P3, the contact member 42 may be returned to the standby position P1 without being moved to the transfer position P3.

For example, as shown in FIG. 6, the transport control unit 51, based on the length Lb of the substrate 3a stored in the production data storage unit 55, moves the contact member until half of the substrate 3b is transferred to the carry-out conveyor 32a. After moving 42 (arrow g8), it may be returned to standby position P1 (section g9). As a result, the time T (arrow g10) at which the contact member 42 moves to the standby position P1 can be shortened. That is, the delivery position P3 does not necessarily have to be set in the carry-out area 32, and may be set in the mounting area 31 according to the length Lb of the substrate 3. FIG.

Further, the transport control unit 51 (control unit) controls the contact member drive mechanism 40 so that the contact member 42 moves in a state where the contact member 42 is lowered to the lowered position at least in the mounting area 31 . As a result, the arm 41 and the contact member 42 can be prevented from interfering (colliding) with the suction nozzle mounted on the lower end of the mounting head 11 and the component holding portion 11a.

4, the arrival time calculator 52 calculates the arrival time when the front ends 3h of the next substrates 3b and 3c unloaded from the upstream device reach the standby position P1 (arrow c2 in FIG. 5 and arrow h2 in FIG. 6). Calculate Ta1 and Ta2. More specifically, the arrival time calculation unit 52 calculates the time from the time T when the first board detection sensor 36 detects that the front ends 3h of the boards 3b and 3c have reached the carry-in entrance S1 (arrow c1 in FIG. 5, (arrow h1)), the arrival times Ta1 and Ta2 are calculated by dividing the distance (L1+L2) between the loading entrance S1 and the standby position P1 by the transport speed of the loading conveyor 30a.

The arrival time calculator 52 calculates the distance L2 between the intermediate position S2 and the standby position P1 from the time T when the second board detection sensor 37 detects that the front ends 3h of the boards 3b and 3c have reached the intermediate position S2. may be calculated as the arrival times Ta1 and Ta2. By calculating the arrival times Ta1 and Ta2 at the intermediate position S2 where the conveyance of the substrates 3b and 3c by the carry-in conveyor 30a is stable, the prediction accuracy of the arrival times Ta1 and Ta2 can be improved.

In this way, the arrival time calculation unit 52 determines that the sensor (first board detection sensor 36, second board detection sensor 37) that detects the board 3 installed upstream of the standby position P1 in the carry-in area 30 is the next board. Arrival times Ta1 and Ta2 are calculated based on the time T when 3b and 3c are detected.

4, the return time calculator 53 returns the contact member 42 from the delivery position P3 (arrow e5 in FIG. 5) to the standby position P1 (section e6 in FIG. 5) and rises to the raised position (section e7 in FIG. 5). , the feedback times Tr1 and Tr2 at which the state (return completion state) of section g1) in FIG. 6 is calculated. More specifically, the return time calculator 53 calculates the distance (L3+L4) between the delivery position P3 and the standby position P1 from the time T when the contact member 42 reaches the delivery position P3. Return times Tr1 and Tr2 are calculated by dividing by the return speed for moving the contact member 42 to the upstream side.

Further, when the contact member 42 moving downstream returns toward the standby position P1 (moves upstream) before reaching the delivery position P3, the return time calculation unit 53 sets the moving direction to Return times Tr1 and Tr2 are calculated based on the distance from the reverse position (arrow g8 in FIG. 6) to the standby position P1. That is, the return time calculator 53 calculates the return times Tr1 and Tr2 based on the position of the contact member .

After the unloading request command is transmitted from the communication processing unit 51a to the upstream device, the timing at which the next substrates 3b and 3c are unloaded from the upstream device changes according to the processing status of the upstream device. For example, the time T at which the substrate 3b is unloaded from the upstream device after the unloading request command is transmitted (FIG. 5) is later than the time T at which the substrate 3c is unloaded (FIG. 6). In the example of FIG. 5, the arrival time Ta1 of the substrate 3b is later than the return time Tr1 (Tr1<Ta1). Therefore, when the front end 3h of the substrate 3b reaches the standby position P1, the contact member 42 is already in the raised position (return completion state), and the front end 3h of the substrate 3b does not collide with the contact member 42, and the substrate 3b is moved. is conveyed downstream from the standby position P1.

On the other hand, in the example of FIG. 6, the arrival time Ta2 of the substrate 3c is earlier than the return time Tr2 (Ta2<Tr2). Therefore, if the transport speed of the substrate 3c is not adjusted, the contact member 42 does not return to the standby position P1 when the front end 3h of the substrate 3c reaches the standby position P1, or if it returns to the standby position P1, it rises. Not in position (not in return complete state). If the substrate 3c is transported downstream from the standby position P1 in this state, the front end 3h of the substrate 3b collides with the contact member 42 (arrow h3 in FIG. 6).

Therefore, when the arrival time Ta2 is earlier than the return time Tr2, the transport control unit 51 (control unit) controls the loading drive mechanism 30b for loading the next substrate 3c to decelerate or temporarily stop. In the example of FIG. 6, the transport control unit 51 slows down the transport speed (decelerates the transport driving mechanism 30b) when the front end 3h of the substrate 3c is between the loading entrance S1 and the standby position P1 (arrow h4). Control is performed so that the front end 3h reaches the standby position P1 (arrow h5) at an arrival time Ta3 later than the return time Tr2.

That is, the transport control unit 51 (control unit) moves the abutting member 42 that has moved the substrate 3a on which components have been mounted in the mounting area 31 to the carry-out area 32 from the delivery position P3 (arrow e5 in FIG. 5) to the standby position. Before returning to P1 and rising (return completion state) (section e7 in FIG. 5, section g1 in FIG. 6), the front ends 3h of the next boards 3b and 3c do not reach the waiting position P1. It controls mechanism 30b.

When the arrival time Ta2 is earlier than the return time Tr2, the transport control unit 51 temporarily suspends the carry-in driving mechanism 30b when the second substrate detection sensor 37 detects that the front end 3h of the substrate 3c has reached the intermediate position S2. You may make it stop. As a result, the arrival time Ta2 can be delayed. Further, when the arrival time Ta2 is earlier than the return time Tr2, the transport control unit 51 may control the contact member drive mechanism 40 to increase the return speed of the contact member 42. FIG. As a result, the feedback time Tr2 can be advanced.

Further, when the arrival time Ta2 is earlier than the return time Tr2, the transport control unit 51 controls the contact member driving mechanism 40 when the substrate 3b is transferred to the unloading conveyor 32a (arrow g8 in FIG. 6). The contact member 42 may be returned to the standby position P1 without being moved to the delivery position P3 (arrow g10 in FIG. 6). As a result, the feedback time Tr2 can be advanced.

4, the mounting control unit 54 controls the component supply unit 4, the mounting head 11, the mounting head moving mechanism 12, the head camera 13, the component recognition camera 14, and the lead processing mechanism 35 to clamp (hold) the mounting area 31. ) is executed to mount components on the board 3 . When mounting the insertion component 20 on the board 3 , the mounting control unit 54 controls the lead processing mechanism 35 to move the lead processing mechanism 35 below the mounting position of the insertion component 20 . are processed.

As described above, the component mounting apparatus 1 has a carry-in area 30 in which the board 3 received from an upstream device is carried in by the carry-in conveyor 30a, and a mounting area 31 in which the board 3 is received from the carry-in area 30 and components are mounted. a carry-out area 32 for carrying out the board 3 carried out from the mounting area 31 to a downstream device by a carry-out conveyor 32a; , a contact member drive mechanism 40 for vertically moving the contact member 42 between a standby position P1 set in the carry-in area 30 and a delivery position P3 set downstream; and a carry-in drive mechanism 30b. , and a transport control unit 51 (control unit) that controls the carry-out drive mechanism 32 b and the contact member drive mechanism 40 . As a result, the board 3 at the mounting work position P2 can be reliably replaced.

Next, along the flow of FIGS. 9 to 11, a mounting board manufacturing method for manufacturing a mounting board having components mounted on the board 3 by the component mounting apparatus 1 will be described with reference to FIGS. In the mounting area 31, it is assumed that the elevated rail 31a presses and clamps the substrate 3a positioned at the mounting work position P2 against the pressing plate 34 (FIG. 7(a)).

In FIG. 9, the mounting control unit 54 causes the mounting head 11 to mount a component (insertion component 20) on the substrate 3a in the mounting area 31 (ST1: component mounting step) (FIG. 7A). If there is a substrate 3b to be mounted next (Yes in ST2), the communication processing unit 51a transmits an unloading request instruction for the next substrate 3b to the upstream device (ST3: unloading request step). That is, after the component mounting step (ST1) is completed, the device on the upstream side is requested to carry out the next board 3b (ST3).

Next, the transport control unit 51 lowers the rail 31a (section e1 in FIG. 5, arrow j1 in FIG. 7B) to release the clamp of the substrate 3a (ST4: clamp release step). Next, the transport control unit 51 moves the contact member 42 at the lowered position of the standby position P1 to the transfer position P3, and transports the substrate 3a in the mounting area 31 to the device on the downstream side through the transport area 32 (ST5: board unloading process).

In FIG. 9, the transport control unit 51 then moves the contact member 42 that has moved to the delivery position P3 (arrow e5 in FIG. 5, arrow j4 in FIG. 7(e)) to the standby position P1 (section e6, arrow k1 in FIG. 8(a)), and is raised to the raised position (ST6: contact member return step) (section e7 in FIG. 5, arrow k3 in FIG. 8(b)). As a result, the contact member 42 is brought into the return completion state. In this way, the communication processing unit 51a included in the transport control unit 51 (control unit) controls the contact member 42 that moves the substrate 3a to the carry-out area 32 after the components have been mounted on the substrate 3a in the mounting area 31. is returned to the standby position P1, the device on the upstream side is requested to carry out the next substrate 3b.

Next, the transport control unit 51 receives the board 3b carried out from the upstream device and carries it through the carry-in area 30 to the mounting work position P2 of the mounting area 31 (ST7: board carrying-in step). Next, the transport control unit 51 moves (forwards) the contact member 42 that has moved to the mounting area 31 (arrow e11 in FIG. 5, k6 in FIG. 8(d)) to the standby position P1 (ST8: forward contact member process) (section e12 in FIG. 5, arrow k7 in FIG. 8(e)).

Next, the transport control unit 51 raises the rail 31a to clamp the substrate 3b positioned at the mounting work position P2 (ST9: substrate clamping step). This completes the preparation for mounting the components on the next substrate 3b. As described above, the method for manufacturing a mounting board according to the present embodiment can reliably replace the board 3a at the mounting position P2 with the next board 3b.

In FIG. 9, when there is no substrate 3 to be mounted next after the component mounting step (ST1) (No in ST2), the unloading request step (ST3) is skipped, and the clamp releasing step (ST4) and the board unloading step are performed. (ST5), the contact member return step (ST6) is executed. As a result, the last board 3a on which components have been mounted is carried out to a device on the downstream side, and the manufacturing of mounted boards in the component mounting apparatus 1 is completed.

Next, along the flow of FIG. 10, the details of the substrate unloading step (ST5) will be described with reference to FIGS. In FIG. 10, when the substrate 3a is released from the clamp (ST4), the transport control unit 51 moves the contact member 42 waiting at the standby position P1 to the transfer position P3 (from the section e2 to the section e2 in FIG. 5). e4, from arrow j2 in FIG. 7(c) to arrow j4 in FIG. 7(e)). During this movement, the contact member 42 contacts the rear end 3e of the substrate 3a in the mounting area 31 (arrow e3 in FIG. 5), and moves the substrate 3a to the unloading area 32 (ST11: unloading area moving step).

When the third substrate detection sensor 38 detects that the front end 3h of the substrate 3a has reached the loading/unloading port S3 in the process of moving the substrate 3a downstream (Yes in ST12) (arrow f2 in FIG. 5, FIG. 7(d)) ), the transport control unit 51 operates the unloading conveyor 32a (ST13: unloading conveyor operating step). After that, the board 3a moving with the rear end 3e pushed by the abutting member 42 (arrow j4 in FIG. 7(e)) is placed on the running unloading conveyor 32a. Next, the transport control section 51 stops the movement of the contact member 42 at the delivery position P3 (ST14) (arrow e5 in FIG. 5, FIG. 7(e)).

In FIG. 10, when the fourth substrate detection sensor 39 detects that the front end 3h of the substrate 3a (arrow j5 in FIG. 8A), which is then conveyed downstream by the unloading conveyor 32a, reaches the unloading port S4 ( Yes in ST15) (arrow f5 in FIG. 5, FIG. 8A), the transport control unit 51 temporarily stops the unloading conveyor 32a (ST16: unloading conveyor temporary stop step).

Next, when the communication processing unit 51a receives an unloading request instruction from the device on the downstream side (Yes in ST17), the transport control unit 51 restarts the unloading conveyor 32a (arrow f6 in FIG. 5) to move the substrate 3a out of the device. (ST18: step of carrying out outside the apparatus) (section f7 in FIG. 5, arrow j6 in FIG. 8B). That is, in the step of unloading outside the apparatus (ST18), the substrate 3a moved to the unloading area 32 is unloaded to the downstream apparatus by the unloading conveyor 32a. This completes the series of substrate unloading steps (ST5).

Next, along the flow of FIG. 11, the details of the substrate loading step (ST7) will be described with reference to FIGS. In FIG. 11, first, the return time calculation unit 53 returns the contact member 42 to the standby position P1 in the contact member returning step (ST6), and is in a state of being raised to the raised position (section e8 in FIG. 5, 8(b)) Calculate the return time Tr1 (ST21: return time calculation step). On the other hand, when the first substrate detection sensor 36 detects that the front end 3h of the substrate 3b carried out from the device on the upstream side (arrow k2 in FIG. 8(b)) has reached the carry-in entrance S1 (Yes in ST22) (FIG. 5 (arrow c1, FIG. 8(b)), the transport control unit 51 operates the carry-in conveyor 30a (ST23: carry-in conveyor operating step).

In FIG. 11, when the carry-in conveyor 30a operates, the arrival time calculator 52 detects the board 3b installed upstream of the standby position P1 in the carry-in area 30 (the first board detection sensor 36, the second board detection sensor 36). The arrival time Ta1 is calculated based on the time T when the sensor 37) detects the next substrate 3b (ST24: arrival time calculation step). Next, the transport control section 51 determines whether or not the arrival time Ta1 is earlier than the return time Tr1 (ST25).

In the example of FIG. 5, the arrival time Ta1 of the substrate 3b is later than the return time Tr1 (No in ST25), and the front end 3h of the substrate 3b does not collide with the contact member 42. The front end 3h is moved so as to pass the standby position P1 (arrow k4 in FIG. 8(c)).

On the other hand, in the example of FIG. 6, the arrival time Ta2 of the substrate 3c is earlier than the return time Tr2 (Yes in ST25), and if the carry-in conveyor 30a is operated as it is, the front end 3h of the substrate 3c collides with the contact member 42 (FIG. 6). arrow h3). Therefore, when the arrival time Ta2 is earlier than the return time Tr2 (Yes in ST25), the transport control unit 51 decelerates or temporarily stops the carry-in conveyor 30a for carrying in the next substrate 3c, and the arrival time Ta3 is earlier than the return time Tr2. The timing is adjusted so that it becomes later (ST26: timing adjustment step).

In FIG. 11, after the front ends 3h of the boards 3b and 3c pass the standby position P1, when the rear ends 3e of the boards 3b pass the standby position P1 (Yes in ST27) (arrow d1 in FIG. 5, arrow i1 in FIG. 6) , FIG. 8(c)), the transport control unit 51 stops the carry-in conveyor 30a (ST28: carry-in conveyor stop step). In this way, from the return time calculation step (ST21) to the carry-in conveyor stop step (ST28), the next substrates 3b and 3c unloaded by the upstream device are received, and the carry-in conveyor 30a follows the next substrates 3b and 3c. This is a standby position carry-in step in which the next substrates 3b and 3c are moved until the edge 3e passes the standby position P1.

An arrival time calculation step (ST24) for calculating arrival times Ta1 and Ta2 at which the front ends 3h of the next substrates 3b and 3c reach the standby position P1 in the standby position loading step and a return time calculation step (ST24) for calculating return times Tr1 and Tr2 When the step (ST21) is executed and the arrival time Ta2 is earlier than the return time Tr2, the carry-in conveyor 30a for carrying in the next substrate 3c is decelerated or temporarily stopped in the waiting position carry-in step. That is, in the standby position loading step, the loading conveyor 30a is run so that the front end 3h of the next substrate 3c does not reach the standby position P1 before the contact member return step (ST6) ends.

In FIG. 11, when the carry-in conveyor 30a stops (ST28), the transport control unit 51 lowers the contact member 42 to the lowered position (section e9 in FIG. 5, section g3 in FIG. 6, arrow in FIG. 8C). k5), the contact member 42 is moved downstream (section e10 in FIG. 5, section g4 in FIG. 6, arrow k6 in FIG. 3e is pushed by the contact member 42 and moved to the mounting area 31 (ST29: mounting area moving step) (arrow e11 in FIG. 5, arrow g5 in FIG. 6). The transport control unit 51 stops the substrates 3b and 3c at the position where the front end 3h of the substrate 3b becomes the mounting work position P2. This completes the series of substrate loading steps (ST7).

Next, another mounting board manufacturing method for manufacturing a mounting board using the component mounting apparatus 1 will be described along the flow of FIGS. 12 and 13 . 9 to 11, the manufacturing method of the mounting board shown in FIGS. 9 to 11 is such that, after the abutting member return step (ST6), a request instruction for carrying out the next board 3b is transmitted to the device on the upstream side. different from In the following, the same steps as in the manufacturing method of the mounting substrate shown in FIGS. 9 to 11 are denoted by the same reference numerals, and redundant explanations are omitted.

In FIG. 12, after the component mounting step (ST1), the clamp releasing step (ST4), the substrate unloading step (ST5), and the contact member return step (ST6) are performed without performing the unloading request step (ST3). . If there is a board 3b to be mounted next (Yes in ST31), the communication processing unit 51a transmits an unloading request instruction for the next board 3b to the upstream device (ST32: another unloading request step). That is, the transport control unit 51 (communication processing unit 51a) returns the contact member 42 that has moved the board 3a on which components have been mounted in the mounting area 31 to the carry-out area 32 from the delivery position P3 to the standby position P1 and raises it. After reaching the state (return completion state), the device on the upstream side is requested to carry out the next substrate 3b. That is, another unloading request step (ST32) is started after the contact member return step (ST6) is completed.

Next, the transport control unit 51 receives the board 3b carried out from the upstream device from the carry-in area 30 and carries it through the carry-in area 30 to the mounting work position P2 of the mounting area 31 (ST33: another board carry-in step). Next, the abutment member forwarding process (ST8) and the board clamping process (ST9) are carried out to complete the preparation for the component mounting work on the next board 3b. If there is no substrate 3 to be mounted next after the contact member returning step (ST6) (No in ST31), the manufacturing of mounting substrates in the component mounting apparatus 1 is completed.

Next, the details of another substrate loading step (ST33) will be described along the flow of FIG. The other substrate loading step (ST33) differs from the substrate loading step (ST7) shown in FIG. 11 in that arrival times Ta1, Ta2, Ta3 and return times Tr1, Tr2 are not calculated. That is, when the first substrate detection sensor 36 detects that the front end 3h of the substrate 3b carried out from the device on the upstream side has reached the carry-in entrance S1 (Yes in ST22), the carry-in conveyor operation step (ST23) is executed. .

Next, after the front end 3h of the board 3b passes the standby position P1, when the rear end 3e of the board 3b passes the standby position P1 (Yes in ST27), the step of stopping the loading conveyor (ST28) and the step of moving the mounting area (ST29) are performed. executed. As a result, the front end 3h of the board 3b is positioned at the mounting work position P2, and a series of other board loading steps (ST33) are completed. As described above, in another mounting board manufacturing method, the board 3a at the mounting work position P2 can be reliably replaced with the next board 3b without calculating the arrival times Ta1, Ta2, Ta3 and the return times Tr1, Tr2. can.

INDUSTRIAL APPLICABILITY The component mounting apparatus and the method for manufacturing a mounting board according to the present invention have the effect of reliably replacing the board at the mounting position, and are useful in the field of mounting components on the board.

1 component mounting device 3, 3a board 3b, 3c next board (board)
3e rear end 3h front end 20 insert part (part)
21 lead 30 carry-in area 30a carry-in conveyor 30b carry-in drive mechanism 31 mounting area 32 carry-out area 32a carry-out conveyor 32b carry-out drive mechanism 35 lead processing mechanism 36 first substrate detection sensor (sensor)
37 Second substrate detection sensor (sensor)
40 contact member drive mechanism 42 contact member P1 standby position P3 delivery position

Claims (15)

a carry-in area having a carry-in drive mechanism for driving a carry-in conveyor, wherein the carry-in conveyor carries in a board received from an apparatus on the upstream side in the board carrying direction;
a mounting area for receiving the substrate from the carrying-in area and mounting components on the substrate;
a carry-out area having a carry-out drive mechanism for driving a carry-out conveyor, wherein the board carried out from the mounting area is carried out by the carry-out conveyor to a device on the downstream side in the substrate carrying direction;
a contact member that contacts the rear end of the substrate and moves the substrate downstream;
a contact member drive mechanism that vertically moves the contact member and moves it between a standby position set in the carry-in area and a delivery position set downstream from the standby position;
A control unit that controls the carry-in drive mechanism, the carry-out drive mechanism, and the contact member drive mechanism,
The control unit
The front end of the next substrate does not reach the standby position before the abutting member that has moved the substrate on which components have been mounted in the mounting area to the unloading area is returned to the standby position and raised. A component mounting device that controls the loading drive mechanism so as to: The control unit
During the period from the end of mounting the component to the board in the mounting area until the contact member that moved the board to the carry-out area is returned to the standby position, the apparatus on the upstream side waits until the next board is loaded. 2. The component mounting apparatus according to claim 1, which requests unloading. an arrival time calculation unit that calculates an arrival time at which the front end of the next substrate reaches the standby position;
a return time calculation unit that calculates a return time at which the contact member returns to the standby position and rises,
3. The component mounting apparatus according to claim 1, wherein, when said arrival time is earlier than said return time, said control unit controls said carrying-in drive mechanism for carrying in said next board so as to decelerate or temporarily stop. . A sensor that detects the substrate on the upstream side of the standby position in the carry-in area,
4. The component mounting apparatus according to claim 3, wherein said arrival time calculator calculates said arrival time based on the time when said sensor detects said next board. 5. The component mounting apparatus according to claim 3, wherein said return time calculator calculates said return time based on the position of said contact member. a carry-in area having a carry-in drive mechanism for driving a carry-in conveyor, wherein the carry-in conveyor carries in a board received from an apparatus on the upstream side in the board carrying direction;
a mounting area for receiving the substrate from the carrying-in area and mounting components on the substrate;
a carry-out area having a carry-out drive mechanism for driving a carry-out conveyor, wherein the board carried out from the mounting area is carried out by the carry-out conveyor to a device on the downstream side in the substrate carrying direction;
a contact member that contacts the rear end of the substrate and moves the substrate downstream;
a contact member drive mechanism that vertically moves the contact member and moves it between a standby position set in the carry-in area and a delivery position set downstream from the standby position;
A control unit that controls the carry-in drive mechanism, the carry-out drive mechanism, and the contact member drive mechanism,
The control unit
After the abutting member that has moved the board on which components have been mounted in the mounting area to the unloading area is returned to the standby position and is in an elevated state, unloading of the next board is made to the upstream device. Required, component placement equipment. a carry-in area having a carry-in drive mechanism for driving a carry-in conveyor, wherein the carry-in conveyor carries in a board received from an apparatus on the upstream side in the board carrying direction;
a mounting area for receiving the substrate from the carrying-in area and mounting components on the substrate;
a carry-out area having a carry-out drive mechanism for driving a carry-out conveyor, wherein the board carried out from the mounting area is carried out by the carry-out conveyor to a device on the downstream side in the substrate carrying direction;
a contact member that contacts the rear end of the substrate and moves the substrate downstream;
a contact member drive mechanism that vertically moves the contact member and moves it between a standby position set in the carry-in area and a delivery position set downstream from the standby position;
A control unit that controls the carry-in drive mechanism, the carry-out drive mechanism, and the contact member drive mechanism,
The control unit
A component mounting apparatus that controls the contact member drive mechanism so that the contact member moves in a lowered state at least in the mounting area. 8. The component mounting apparatus according to claim 1 , wherein said mounting area is provided with a lead processing mechanism for processing leads of components mounted on said board. A mounting board manufacturing method for manufacturing a mounting board in which components are mounted on the board by a component mounting apparatus,
The component mounting apparatus includes a loading area for loading a board received from a device on the upstream side in the board transport direction by a loading conveyor, a mounting area for receiving the board from the loading area and mounting a component thereon, and a loading area for loading the board from the loading area. a carry-out area for carrying out the board to a device on the downstream side in the board conveying direction by a carry-out conveyor; a contact member that moves between a delivery position and contacts the rear end of the substrate to move the substrate to the downstream side;
a component mounting step of mounting a component on a substrate in the mounting area;
a carry-out request step of requesting the upstream device to carry out the next substrate after the component mounting step is completed;
The abutment member waiting at the standby position is moved to the delivery position, and during the movement, the abutment member is brought into contact with the rear end of the substrate in the mounting area to carry out the substrate. an unloading area moving step of moving to an area;
a device-external carrying-out step of carrying out the substrate to the device on the downstream side by the carrying-out conveyor;
a contact member return step of moving the contact member that has moved to the delivery position to the standby position and raising the contact member;
a standby position loading step of receiving the next substrate unloaded by the upstream device and moving the next substrate by the loading conveyor until the rear end of the next substrate passes the standby position;
a mounting area moving step of lowering the abutting member and moving it to the downstream side to move the next substrate in the carry-in area to the mounting area;
and a contact member forwarding step of moving the contact member moved to the mounting area to the standby position. 10. The mounting board according to claim 9, wherein in said waiting position carrying-in step, said carrying-in conveyor is run so that the front end of said next board does not reach said waiting position before said contact member returning step ends. Production method. an arrival time calculation step of calculating an arrival time at which the front end of the next substrate reaches the standby position in the standby position carry-in step;
a return time calculation step of calculating a return time at which the contact member returns to the standby position and rises in the contact member return step;
11. The method of manufacturing a mounted board according to claim 10, wherein, when the arrival time is earlier than the return time, the carrying-in conveyor for carrying in the next board is decelerated or temporarily stopped in the standby position carrying-in step. The component mounting device includes a sensor that detects the board on the upstream side of the standby position in the carry-in area,
12. The method of manufacturing a mounting board according to claim 11, wherein in said arrival time calculating step, said arrival time is calculated based on the time when said sensor detects said next board. 13. The method of manufacturing a mounted substrate according to claim 11, wherein in said return time calculating step, said return time is calculated based on the position of said contact member. 10. The method of manufacturing a mounting board according to claim 9, wherein said unloading request step is started after said contact member return step is finished. 15. The method of manufacturing a mounting board according to claim 9, wherein said contact member moves in a lowered state at least in said mounting area.

Images