JP7300871B2 - Measuring device and method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a measuring apparatus and measuring method, and more particularly to a measuring apparatus and measuring method using two-beam interferometry.

A measuring device using the two-beam interferometry is disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-200316. This measuring apparatus (shape measuring apparatus) includes a light source 1, a collimator lens 2, a beam splitter 3, a reference plate 4, an imaging lens 5, a CCD camera 6, and the like, as shown in FIG.

That is, light (white light) emitted from the light source 1 is collimated by the collimator lens 2 and split into two directions by the beam splitter 3 . One of the split beams is applied to the measurement surface of the workpiece 7 to be measured, and the other split beam is applied to the reference surface of the reference plate 4 . The white light reflected from the irradiation on the measurement surface and the reference surface are combined by the beam splitter 3 , and the interference light at that time is captured by the CCD camera 6 via the imaging lens 5 .

JP 2011-89897 A

A larger field of view (lower magnification) is required when using a conventional white interference three-dimensional meter. However, increasing the field of view reduces horizontal resolution. To maintain horizontal resolution, the field of view must be moved. For this reason, in the case of measuring a field of view larger than that of the CCD camera (image sensor) 6 while maintaining the necessary horizontal resolution in such a three-dimensional meter using white light interference, the workpiece 7 or the optical system is moved to obtain a plurality of fields of view. I had to take a picture and glue it together.

When photographing a plurality of fields of view and pasting them together, it is necessary to move the fields of view in order to connect the fields of view, resulting in a long movement time. In addition, it is necessary to move heavy objects (workpieces and optical systems) in order to move the field of view, resulting in an increase in the size and complexity of the entire apparatus (equipment).

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a measuring apparatus and a measuring method capable of improving the horizontal resolution of an optical system and shortening the measuring time.

The measurement apparatus of the present invention splits the light from the light source into two directions, irradiates one of the split beams onto the part to be measured, and irradiates the other split beam onto the reference plate, and irradiates the part to be measured and the reference plate. A measurement apparatus using a two-beam interferometer having imaging means for synthesizing reflected reflected light and imaging interference light, wherein the imaging means has an aperture with a photoelectric conversion site having an area smaller than the area of one pixel. an image sensor having a pixel that is a pixel, and the opening area of the photoelectric conversion portion of the image sensor is set to 7% or more and 30% or less of the one pixel area, and the image sensor and the portion to be measured are moved by the position moving means. By relatively moving, the photoelectric conversion portion is shifted by less than one pixel.

According to the measuring device of the present invention, since the image sensor having the pixels in which the photoelectric conversion sites are open with an area smaller than the area of one pixel is used, the apparent pixel size of the image sensor is reduced and the horizontal resolution is improved. can be made Moreover, a portion (missing portion) that cannot be measured due to the reduction in pixel size can be compensated for by relative movement between the image sensor and the measured portion.

The aperture of the photoelectric conversion portion of the image sensor can be configured by providing a light shielding portion in the pixel. Here, the light-shielding portion can be composed of, for example, a paint (resin) containing a black pigment (carbon black), a vapor-deposited metal film, a metal plate (etching or machining), or the like. In this way, the light shielding portion can be provided in various simple configurations.

The aperture of the photoelectric conversion portion of the image sensor can be formed by the light receiving surface of the photodiode. It suffices to manufacture an image sensor having such a photodiode, and there is no need to provide a light shielding portion, resulting in excellent productivity.

The aperture area of the photoelectric conversion portion of the image sensor can be 7% or more and 30% or less of the area of one pixel. Such setting stabilizes production.

The shape of the opening of the photoelectric conversion portion may be substantially circular, substantially elliptical, substantially square, or substantially rectangular. Here, the term “substantially circular” is a concept that includes not only perfect circles but also shapes that are somewhat circular (such as slightly elliptical shapes and shapes having unevenness on the circumference). The substantially elliptical shape includes an actual ellipse and a shape close to an ellipse, and the shape close to an ellipse is meant to include things like compound circles and shapes made up of circles and straight lines. . A substantially square is a shape close to an actual square or a substantially square, and includes a substantially rectangular shape having rounded vertices or the like. A substantially rectangular shape means a shape close to an actual rectangle and a substantially rectangular shape, and also includes a substantially rectangular shape having rounded vertices or the like.

The position moving means can be composed of a piezoelectric actuator that moves the image sensor with respect to the site to be measured. Here, the piezoelectric actuator is an actuator to which the piezoelectric effect is applied. Therefore, it has high accuracy, high-speed response, high stop holding force, low power consumption, and no electromagnetic noise. It has advantages such as small size, high-density arrangement, and simple structure.

The part to be measured may be at least one of a bonded wire, its joint, and a joint to be joined.

It is preferable that the light emitted from the light source is monochromatic light or multicolored light. A laser light source or an LED light source can be used as the monochromatic light source. In addition, multi-color light is light in which multiple kinds of monochromatic colors are mixed. Note that the light emitted from the light source may be white light. Here, white light is light in which light with a wavelength of 380 nm to 750 nm is mixed. Therefore, if the two-beam interferometry is used, the light of each color strengthens each other when the optical path length difference between the two optical paths is "integer multiple" of the wavelength, and weakens each other when it is "integer multiple + half wavelength". Then, the synthesis of the interference results of all colors of light is the result of white light interference. When the optical path difference is 0, the lights of all wavelengths reinforce each other, and the interference of white light is the brightest.

In the measuring method of the present invention, light is split into two directions, one of the split beams is applied to a site to be measured, and the other split light is applied to a reference plate, and the light is reflected from the site to be measured and the reference plate. A measurement method using a two-beam interferometry that synthesizes reflected light and images the interference light, and has an image in which the photoelectric conversion site is opened in a small area of 7% or more and 30% or less of the area of one pixel. By relatively moving the image sensor and the part to be measured, the photoelectric conversion part is shifted by less than one pixel, and the image sensor picks up an image of the part to be measured.

According to the measurement method of the present invention, an image sensor having an image in which the electrical conversion portion is opened with an area smaller than the area of one pixel is used, so the apparent pixel size of the image sensor is reduced and the horizontal resolution is improved. can be made Moreover, the part (missing part) that cannot be measured by reducing the pixel size can be compensated for by the relative movement between the image sensor and the part to be measured.

The image sensor and the site to be measured may be moved relative to each other either at a constant pitch or at an arbitrary irregular pitch. Only relative positional movement between the image sensor and the site to be measured in the X direction and/or the Y direction may be performed.

Relative positional movement of the image sensor and the site to be measured in the X direction and/or the Y direction and scanning in the Z direction of the image sensor orthogonal to the X direction and the Y direction are possible, and during scanning of the image sensor in the Z direction can be set to provide relative movement of the image sensor in the X and/or Y direction. In this case, for example, the scanning of the image sensor in the Z direction is divided into a plurality of times (multiple steps). It can be set to move relative to the measurement site.

The image sensor is capable of relative positional movement in the X direction and/or the Y direction between the image sensor and the site to be measured, and scanning in the Z direction of the image sensor perpendicular to the X and Y directions . After scanning in the Z direction, the image sensor and the site to be measured can be moved relative to each other in the X and/or Y directions. In this case, for example, after scanning the positive side of the image sensor in the Z direction, the relative positions of the image sensor and the part to be measured are moved, and then, after scanning the negative side of the easy sensor in the Z direction, the image sensor and the site to be measured can be set to move relative to each other.

The part to be measured in the above method is at least one of a bonded wire, its joint, and a part to be joined.

According to the present invention, horizontal resolution can be improved, and highly accurate measurement becomes possible. In addition, since the amount of movement for one time relative position movement is smaller than the pixel size, the time taken for one movement is short, and the throughput (amount that can be processed per unit time) can be improved. In particular, the moving mechanism can be simplified in the case of moving the sensor side.

1 is a simplified overview of a measuring device of the invention; FIG. It is a figure which shows the moving direction of an image sensor. FIG. 4 is a diagram showing the order of movement of photoelectric conversion portions of the image sensor; 1 is a simplified diagram showing various locations of photoelectric conversion sites of an image sensor; FIG. FIG. 2 is a simplified diagram showing directions of movement of an image sensor; FIG. 2 is a simplified diagram showing various shapes of photoelectric conversion sites of an image sensor; A CCD image sensor is shown, (a) is a simplified drawing before movement, and (b) is a simplified drawing after movement. 1 is a simplified diagram of a site to be measured; FIG. 1 is a simplified overall view of a conventional measuring device; FIG.

An embodiment of the present invention will be described below with reference to FIGS. 1 to 8. FIG.

FIG. 1 shows a measuring device according to the present invention, and this measuring device measures (detects) the shape, trajectory, dimensions, bonding quality, etc. of a site S to be measured as shown in FIG. , a portion S to be measured includes a bonding wire 51, a wire bonding portion 52, a portion to be bonded 53, and other measurement regions (not shown). In other words, the workpiece having the portion S to be measured is a substrate or the like to which the bonding wire 51 is connected.

As shown in FIG. 1, the measurement apparatus includes a light source 11 which is monochromatic light or multi-colored light, a collimator lens 12, a beam splitter 13, a reference plate 14, an imaging lens 15, and a CCD constituting imaging means 10. A camera 16 such as a camera or a CMOS camera is provided. As the light source 11, when the light is monochromatic light, a purple, blue, green, red, or the like LED light source or laser light source can be applied. In addition, multi-color light is light in which a plurality of kinds of monochromatic colors are mixed. Note that the light emitted from the light source may be white light. When using white light, other white light sources such as xenon lamps, halogen lamps, mercury lamps, and white LEDs can be employed. Further, the light may be visible light or light other than visible light.

Light emitted from the light source 11 is collimated by the collimator lens 12 and split into two directions by the beam splitter 13 . One of the split beams is applied to the measurement surface of the workpiece W, which is the site to be measured S, and the other split beam is applied to the reference surface of the reference plate 14 . The light reflected from the irradiation of the measurement surface and the reference surface is combined by the beam splitter 13 , and the interference light at that time is picked up by the CCD camera 16 via the imaging lens 15 . That is, this measuring apparatus employs a two-beam interference method.

A camera 16 such as a CCD camera or a CMOS camera has an image sensor 18 as shown in FIGS. 2(a) to 2(d). A pixel 20 of the image sensor 18 is composed of a photoelectric conversion portion 22 composed of a photodiode (PD) 21 that performs photoelectric conversion, and a portion other than the photodiode (non-photoelectric conversion portion) 23 such as a circuit. The CCD camera 16 has a plurality of such image sensors 18 as shown in FIGS. 6(a) and 6(b).

That is, the image sensor 18 has pixels 20 in which the photoelectric conversion sites 22 are opened with an area smaller than the area of one pixel. In this case, the opening area of the photoelectric conversion portion 22 can be 7% to 30% of the area of one pixel. For example, if the pixels 20 are divided into 9 pixels of 3 rows and 3 columns, the aperture area will be about 11% of one image, and if the pixels 20 are divided into 4 pixels of 2 rows and 2 columns, the aperture area will be about 25% of one image. . If the pixels are finely divided, the aperture area becomes small and dark (the light receiving efficiency is low). Thus, setting the opening area of the electrical conversion portion 22 to 7% to 30% of the area of one pixel stabilizes the production.

The photoelectric conversion portion 22 can be arranged at various positions as shown in FIGS. 2(a) to 2(d). 3(a) to 3(d) show projection views of the image sensor 18 on the side of the site S to be measured. Therefore, in the projection plane 18A, when one pixel 20 is divided into four equal parts (one row and one column) and the photoelectric conversion sites 22 are arranged at the positions shown in FIG. a) corresponds to section 20a of "1" and is arranged at the position shown in FIG. When arranged at the position shown in (c), the photoelectric conversion portion 22 corresponds to section 20a of "1" in FIG. 3(c), and when arranged at the position shown in FIG. 22 is located in section 20a of "1" in FIG. 3(d).

Therefore, the opening area of the photoelectric conversion portion 22 shown in FIG. 2 is set to about 25% of one pixel 20 of the image sensor . The image sensor 18 is movable in mutually orthogonal X and Y directions via a moving means 25 . In this case, the moving means 25 relatively moves the image sensor 18 and the site S to be measured, and the amount of pixels is less than 1 pixel and is the fractional amount excluding the integer part of the amount of movement expressed in units of pixels. It is a thing to shift. That is, when the amount of relative movement in the X or Y direction is 1.5 pix, the shift amount is (1.5-1) pix=0.5 pix. Also, if the amount of relative movement in the X or Y direction is 5.2 pix, the amount of shift is (5.2-5) pix = 0.2 pix.

In the case shown in FIG. 2(a), the photoelectric conversion portion 22 moves from "1" to "2" to "3" to "4" in FIG. 3(a) and is shown in FIG. 3B, the photoelectric conversion portion 22 moves in the order of "1"→"2"→"3"→"4" in FIG. 22 moves from "1" to "2" to "3" to "4" in FIG. 3(c), and in the case shown in FIG. d) Move from "1"→"2"→"3"→"4". This allows the photoelectric conversion portion 22 to cover the entire pixel 20 .

The moving means 25 can use, for example, a ball screw mechanism, a linear guide mechanism, or a cylinder mechanism. can use things.

A workpiece W having a portion S to be measured is placed on a stage 26 , and the stage 26 can be reciprocated in the Z-direction by a Z-direction moving means 27 . That is, the moving means 25 can reciprocate the stage 26 in a direction (vertical direction) perpendicular to the movement of the camera 16 in the X and Y directions (on the horizontal plane). Like the moving means 25, the Z-direction moving means 27 can also use, for example, a ball screw mechanism, a linear guide mechanism, or a cylinder mechanism. , a servo motor, or a stepping motor can be used. In the case where the site to be measured has an uneven portion beyond interference, the measurement can be made possible by moving the site S to be measured in the Z direction.

By the way, this measuring apparatus is equipped with a Z-direction scanning means 28 as shown in FIG. The Z-direction scanning means 28 can be configured by a scanning circuit provided in the camera 6, which is an image sensor. Thus, by having the Z-direction scanning means 28, the image of the site to be measured S can be acquired while scanning the focal position of the camera from top to bottom in the Z direction, or can be scanned from bottom to top in the Z direction. An image of the site to be measured S can be obtained while the measurement is being performed. The Z-direction scanning means 28 can be composed of the Z-direction moving means 27, and the Z-direction moving means 27 can be omitted.

Each means 25, 27 and 28 is controlled by a control means 30 as shown in FIG. The control means 30 is, for example, a microcomputer in which a CPU (Central Processing Unit) as a center and a ROM (Read Only Memory), a RAM (Random Access Memory), etc. are interconnected via a bus. Further, storage means (not shown) is connected to the control means 30 . Each of the storage means includes an HDD (Hard Disc Drive), a DVD (Digital Versatile Disk) drive, a CD-R (Compact Disc-Recordable) drive, an EEPROM (Electronically Erasable and Programmable Read Only Memory), or the like. The ROM stores programs and data executed by the CPU.

Next, a method for measuring the measured portion S of the workpiece W using the measuring apparatus shown in FIG. 1 will be described. In this case, measurement is performed by combining movement of the image sensor 18 in the X and Y directions and scanning in the Z direction (Z scan). For example, the first method is to perform movement in the X and Y directions during Z scanning, and the second method is to perform movement in the X and Y directions for each reciprocating motion of Z scanning.

Specifically, when the Z scan is performed from top to bottom, the scan is divided into a plurality of stages, and after or during the scan for one step, (even if the movement in the Z direction stops, Even if the movement is not stopped, the movement in the X and Y directions is performed, and after one step of scanning, the movement in the X and Y directions is performed. This is done until all Z scans are completed. Also, in the first method, the Z scan may be from bottom to top.

The second method is to scan from bottom to top, then move in the X and Y directions for one pitch, then scan from top to bottom and move in the X and Y directions for one pitch, then scan from top to bottom. Make sure that the entire pixel 20 is covered. Alternatively, after scanning from top to bottom, movement in the X and Y directions and one pitch may be performed, and then scanning from bottom to top may be performed and movement in the X and Y directions and one pitch may be performed. Movement in each of the X and Y directions (movement of one pitch) in the first and second methods is, as shown in FIGS. "2"→"3" or "3"→"4".

FIG. 4 shows a case where one pixel 20 of the image sensor 18 is divided into 3 rows and 3 columns as shown in FIG. 5(a) to 5(d) show projection views of the image sensor 18 on the side of the site S to be measured. 4(a), the photoelectric conversion portion 22 corresponds to the section 20a of "1" in FIG. 5(a), and in FIG. 4(b), the photoelectric conversion portion 22 corresponds to "2" in FIG. , in FIG. 4(c) the photoelectric conversion portion 22 corresponds to the section 20a of "3" in FIG. 5(b), and in FIG. 4(d) the photoelectric conversion portion 22 Corresponding to section 20a of "4" in FIG. 5(b), in FIG. 4(e), the photoelectric conversion part 22 corresponds to section 20a of "5" in FIG. 5(b), and FIG. 5B, the photoelectric conversion portion 22 corresponds to the section 20a of "6" in FIG. 5B, and in FIG. Correspondingly, in FIG. 4(h), the photoelectric conversion portion 22 corresponds to the section 20a of "8" in FIG. 5(b), and in FIG. 4(i), the photoelectric conversion portion 22 corresponds to FIG. corresponds to the "9" section 20a of

5(a) to 5(f) show the order of movement in the X and Y directions when the photoelectric conversion portion 22 corresponds to the position shown in FIG. 4(a). They move respectively from "1"→"2"→"3"→"4"→"5"→"6"→"7"→"8"→"9". 4(b) to 4(f), the order of movement in the X and Y directions can be arbitrarily set within a range in which the entire section 20a can be moved. is omitted.

By the way, in the above embodiment, the shape of the opening of the photoelectric conversion portion 22 is substantially square, but it may be of another shape as shown in FIG. That is, it is substantially rectangular in FIG. 6(a), substantially circular in FIG. 6(b), substantially oval in FIG. 6(c), and substantially hexagonal in FIG. 6(d). Here, the term “substantially circular” is a concept that includes not only perfect circles but also shapes that are somewhat circular (such as slightly elliptical shapes and shapes having unevenness on the circumference). The substantially elliptical shape includes an actual ellipse and a shape close to an ellipse, and the shape close to an ellipse is meant to include things like compound circles and shapes made up of circles and straight lines. . A substantially square is a shape close to an actual square or a substantially square, and includes a substantially rectangular shape having rounded vertices or the like. A substantially rectangular shape means a shape close to an actual rectangle and a substantially rectangular shape, and also includes a substantially rectangular shape having rounded vertices or the like. A substantially hexagon is a shape close to an actual regular hexagon and a substantially hexagon, and includes a substantial hexagon having rounded vertices, etc.

It is preferable to set the photoelectric conversion portion 22 in each of the above-described embodiments to have an opening with an area smaller than the area of 20 pixels. Further, even if each photoelectric conversion portion 22 is composed of the entire PD 21, as shown in FIG. The photoelectric conversion portion 22 may be provided by reducing the area. The opening area of the photoelectric conversion portion 22 is preferably 7% or more and 30% or less of the area of one pixel.

When the light shielding portion 24 is provided, it can be composed of, for example, a paint (resin) containing a black pigment (carbon black), a deposited metal film, a metal plate (etching or machining), or the like. As described above, the light shielding portion 24 can be provided in various simple configurations.

Since the image sensor 18 has pixels with open photoelectric conversion sites smaller than the area of 20 pixels, the apparent pixel size of the image sensor 18 is reduced and the horizontal resolution can be improved. Moreover, a portion (missing portion) that cannot be measured due to the reduction in pixel size can be compensated for by relative movement between the image sensor 18 and the measured portion.

That is, in the present invention, the horizontal resolution can be improved, and highly accurate measurement becomes possible. In addition, since the amount of movement for one time of relative position movement is smaller than the pixel size, the time for one movement is short, and the throughput (amount that can be processed per unit time) can be improved. In particular, the moving mechanism can be simplified in the case of moving the sensor side.

In addition, since it is possible to move the image sensor 18 and the site S to be measured relative to each other in the X and/or Y directions and scan the image sensor 18 in the Z direction perpendicular to the X and Y directions, the pixels of the camera It is possible to obtain height data for each area, obtain brightness in accordance with the reflectance of the site S to be measured, and obtain a luminance image. Therefore, various shapes and dimensions can be measured.

In this embodiment, 3D data of the bonding wire 51, the wire bonding portion 52, the wire bonded portion 53, and others included in the measurement area can be obtained. Therefore, from this 3D data, the shape, trajectory, dimensions, bonding quality, etc. can be observed.

By the way, although one image sensor 18 has been described, as shown in FIG. 7, a plurality of image sensors 18 may be provided. In this case, a line sensor in which a plurality of image sensors 18 are arranged in a line is constructed. In the state of FIG. 7A, the range of H1 corresponding to the photoelectric conversion portion 22 can be observed (measured), and the range between adjacent H1 and H1 cannot be observed. Therefore, by moving the plurality of image sensors in the direction of the arrow by one pitch (a moving amount corresponding to the photoelectric conversion portion corresponding to the range between H1 and H1), as shown in FIG. can form an observable (measurable) range of H2. Therefore, omission of observation is eliminated.

When a plurality of image sensors 18 are provided, the plurality of image sensors 18 are not limited to being arranged side by side in a row as shown in FIG. may

Also, in the above embodiment, scanning in the Z direction was performed, but as another embodiment, such scanning in the Z direction may not be performed.

The present invention is not limited to the above-described embodiment, and various modifications are possible. Regarding the movement, it is not necessary to move at a constant pitch depending on the shape of the portion S to be measured of the workpiece. That is, when the section 20a is defined as shown in FIG. 5, it may be moved from "1" to "3" or the like in FIG. 5(a). Further, in the above embodiment, the movement is in the X direction or the Y direction, but it may be moved in a direction inclined with respect to the X direction and the Y direction.

As the two-beam interferometer used in the measuring apparatus according to the present invention, the Michelson interferometer is used in the above embodiment, but the Mirau interferometer may be used.

By the way, in the present measuring apparatus and measuring method, a field of view larger than that of the sensor 18 (an optical system with an optical magnification of 1 or less) is optimal for obtaining the unique effects of the present invention. However, it may be one that observes the same field of view as the sensor 18 or one that observes a smaller field of view than the sensor 18 .

10 Imaging Means 11 Light Source 14 Reference Plate 16 Camera 18 Image Sensor 20 Pixel 21 Photoelectric Conversion Site 25 Moving Means 27 Z-Direction Moving Means 28 Z-Direction Scanning Means 51 Bonding Wire 52 Wire Bonding Section 53 Bonding Section S Section to be Measured

Claims (15)

The light from the light source is split into two directions, one of the split beams is applied to the part to be measured, and the other split beam is applied to the reference plate, and the reflected light reflected from the part to be measured and the reference plate is synthesized. A measurement apparatus using a two-beam interferometer having imaging means for imaging the interference light by
The imaging means includes an image sensor having a pixel in which a photoelectric conversion site is opened with an area smaller than one pixel area, and the opening area of the photoelectric conversion site of the image sensor is 7% or more and 30% of the one pixel area. A measuring apparatus characterized by moving the image sensor and the portion to be measured relative to each other by position moving means to shift the photoelectric conversion portion by less than one pixel. 2. The measuring device according to claim 1, wherein the aperture of the photoelectric conversion portion of the image sensor is formed by providing a light shielding portion in the pixel. 2. The measuring device according to claim 1, wherein the aperture of the photoelectric conversion portion of the image sensor is formed by the light receiving surface of the photodiode. 2. The measuring device according to claim 1, wherein the entire one pixel is covered by shifting the photoelectric conversion portion. The measurement according to any one of claims 1 to 4, wherein the aperture shape of the photoelectric conversion portion of the image sensor is any one of substantially circular, substantially elliptical, substantially square, and substantially rectangular. Device. 6. The measuring apparatus according to any one of claims 1 to 5, wherein the position moving means is composed of a piezoelectric actuator for moving the image sensor with respect to the site to be measured. 7. The measuring device according to any one of claims 1 to 6, wherein the light emitted from the light source is monochromatic or multicolored. 8. The measuring apparatus according to any one of claims 1 to 7, wherein the portion to be measured is at least one of a bonded wire, a bonding portion thereof, and a bonded portion to be bonded. Light is split into two directions, one of the split beams is applied to the site to be measured, and the other split light is applied to the reference plate, and the reflected light reflected from the measurement site and the reference plate is combined and combined. A measurement method using a two-beam interferometry for imaging interference light,
An image sensor having an image in which a photoelectric conversion portion is opened in a small area of 7% or more and 30% or less of one pixel area and a portion to be measured are relatively moved so that the photoelectric conversion is performed by less than one pixel. A measurement method characterized in that an image of an object to be measured is captured by an image sensor while the part is shifted. 10. The measuring method according to claim 9, wherein the relative movement between the image sensor and the site to be measured is set at a constant pitch. 10. The measuring method according to claim 9, wherein the relative movement between the image sensor and the site to be measured is set to an arbitrary unfixed pitch. 11. The measuring method according to any one of claims 9 to 10, wherein only relative positional movement between the image sensor and the site to be measured is performed in the X direction and/or the Y direction. Relative positional movement between the image sensor and the site to be measured in the X and/or Y directions and scanning in the Z direction of the image sensor orthogonal to the X and Y directions are possible, and during scanning of the image sensor in the Z direction 11. The measuring method according to any one of claims 9 to 10, wherein the image sensor is moved relative to each other in the X direction and/or the Y direction. Relative positional movement between the image sensor and the site to be measured in the X and/or Y directions and scanning in the Z direction of the image sensor perpendicular to the X and Y directions are possible, and scanning in the Z direction of the image sensor is possible. The measuring method according to any one of claims 9 to 10, characterized in that the image sensor is subsequently moved in the X direction and/or the Y direction. 15. The measuring method according to any one of claims 9 to 14, wherein the portion to be measured is at least one of a bonded wire, its joint, and a joint to be joined.

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