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JP7301783B2 - Composition analysis method for electronic/electrical equipment parts scrap, electronic/electrical equipment parts scrap processing method, electronic/electrical equipment parts scrap composition analysis device, and electronic/electrical equipment parts scrap processing equipment - Google Patents
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JP7301783B2 - Composition analysis method for electronic/electrical equipment parts scrap, electronic/electrical equipment parts scrap processing method, electronic/electrical equipment parts scrap composition analysis device, and electronic/electrical equipment parts scrap processing equipment - Google Patents

Composition analysis method for electronic/electrical equipment parts scrap, electronic/electrical equipment parts scrap processing method, electronic/electrical equipment parts scrap composition analysis device, and electronic/electrical equipment parts scrap processing equipment Download PDF

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JP7301783B2
JP7301783B2 JP2020066206A JP2020066206A JP7301783B2 JP 7301783 B2 JP7301783 B2 JP 7301783B2 JP 2020066206 A JP2020066206 A JP 2020066206A JP 2020066206 A JP2020066206 A JP 2020066206A JP 7301783 B2 JP7301783 B2 JP 7301783B2
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智也 後田
寿文 河村
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
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Description

本発明は、電子・電気機器部品屑の組成解析方法、電子・電気機器部品屑の処理方法、電子・電気機器部品屑の組成解析装置及び電子・電気機器部品屑の処理装置に関する。 The present invention relates to a method for analyzing the composition of electronic/electrical equipment parts scrap, a method for processing electronic/electrical equipment parts scrap, a composition analysis apparatus for electronic/electrical equipment parts scrap, and an electronic/electrical equipment parts scrap processing apparatus.

近年、資源保護の観点から、廃家電製品・PCや携帯電話等の電子・電気機器部品屑から、有価金属を回収することがますます盛んになってきている。また、電子・電気機器部品屑の処理量は近年増加する傾向にあり、その効率的な回収方法が検討され、提案されている。 In recent years, from the viewpoint of resource conservation, it has become increasingly popular to recover valuable metals from electronic and electrical device parts scraps such as waste home appliances, PCs, mobile phones, and the like. In recent years, the amount of electronic and electrical equipment parts scraps to be processed has been increasing, and efficient collection methods have been studied and proposed.

例えば、特開2015-123418号公報(特許文献1)では、銅を含む電気・電子機器部品屑を焼却後、所定のサイズ以下に粉砕し、粉砕した電気・電子機器部品屑を銅の溶錬炉で処理することが記載されている。 For example, in Japanese Patent Application Laid-Open No. 2015-123418 (Patent Document 1), after incinerating electrical and electronic device component scraps containing copper, they are pulverized to a predetermined size or less, and the pulverized electrical and electronic device component scraps are smelted with copper. Furnace processing is described.

しかしながら、電子・電気機器部品屑の処理量が増加することにより、電子・電気機器部品屑に含まれる物質の種類によってはその後の銅製錬工程での処理に好ましくない物質(製錬阻害物質)が従来よりも多量に投入されることとなる。このような銅製錬工程に装入される製錬阻害物質の量が多くなると、電子・電気機器部品屑の投入量を制限せざるを得なくなる状況が生じる。 However, due to the increase in the processing amount of electronic and electrical equipment parts scraps, some of the substances contained in the electronic and electrical equipment parts scraps are unfavorable substances (smelting inhibitors) for the subsequent copper smelting process. It will be put in more than before. If the amount of smelting inhibitors charged into such a copper smelting process increases, there arises a situation where the amount of electronic/electrical equipment parts scraps charged must be restricted.

例えば、電子・電気機器部品屑には、様々な形状及び種類の部品屑が含まれており、供給元の違い等によりその原料組成が変化する。銅製錬工程に投入される原料を適切に選別するために、現在は、電子・電気機器部品屑の原料組成を予め目視判定や化学分析によって評価し、その結果を選別処理の操業管理、運転条件の設定に反映させることが行われている。 For example, electronic and electrical equipment parts scraps include parts scraps of various shapes and types, and the raw material composition varies depending on the difference of the supplier. In order to properly sort out the raw materials that are put into the copper smelting process, currently, the raw material composition of electronic and electrical equipment parts scraps is evaluated in advance by visual judgment and chemical analysis, and the results are used in the operation management and operating conditions of the sorting process. are reflected in the settings of

しかしながら、目視により原料組成を判定する手法では、個人の経験や技能によって評価結果にバラつきがあり、定量的な評価もできていない。原料組成特定のための化学分析や手選別も時間を要する。 However, in the method of visually determining the raw material composition, evaluation results vary depending on individual experience and skills, and quantitative evaluation is not possible. Chemical analysis and manual sorting to identify raw material composition also take time.

特開2015-123418号公報JP 2015-123418 A

本発明者らは目視以外の原料組成把握のための方法として、画像認識技術の利用を検討し、種々の検討を行った。しかしながら、対象とする電子・電気機器部品屑は、種々の部品が混在する上、供給元の状況に応じて組成も大きく異なり、形状も様々であるため、画像認識による電子・電気機器部品屑の個体識別を精度良く行えない場合がある。 The present inventors examined the use of image recognition technology as a method for grasping raw material composition other than visual observation, and conducted various studies. However, the target electronic and electrical equipment parts scraps are mixed with various parts, and the composition varies greatly depending on the situation of the supplier, and the shape is also various. Individual identification may not be performed with high accuracy.

上記課題を鑑み、本開示は、画像認識精度を向上でき、個人の経験や技能に関係なく、電子・電気機器部品屑中の部品屑の組成を短時間で効率良く解析することが可能な電子・電気機器部品屑の組成解析方法、電子・電気機器部品屑の処理方法、電子・電気機器部品屑の組成解析装置及び電子・電気機器部品屑の処理装置を提供する。 In view of the above problems, the present disclosure is an electronic device that can improve image recognition accuracy and can efficiently analyze the composition of scrap parts in electronic and electrical equipment scraps in a short time regardless of individual experience and skills. Provide a method for analyzing the composition of electrical equipment parts scrap, a method for processing electronic/electrical equipment parts scrap, an apparatus for analyzing the composition of electronic/electrical equipment parts scrap, and a processing equipment for electronic/electrical equipment parts scrap.

本発明の実施の形態に係る電子・電気機器部品屑の組成解析方法は一実施態様において、複数の部品種を含む複数の電子・電気機器部品屑を含む原料を撮像した撮像画像の中から、機械学習システムを利用した画像認識処理を用いて、電子・電気機器部品屑を抽出し、組成解析を行うことを含み、機械学習システムの学習に用いられる学習データに、組成解析対象とする原料の情報が反映されている場合は、機械学習システムの確信度を第1の閾値に設定し、組成解析対象とする原料の情報が学習データに反映されていない場合は、第1の閾値よりも低い第2の閾値に設定して電子・電気機器部品屑を抽出することを含む電子・電気機器部品屑の組成解析方法である。 In one embodiment of the method for analyzing the composition of electronic/electrical device parts scrap according to the embodiment of the present invention, from among the captured images of raw materials containing a plurality of electronic/electrical device parts scraps including a plurality of component types, Using image recognition processing using a machine learning system, electronic and electrical equipment parts scraps are extracted and composition analysis is performed. If the information is reflected, the certainty of the machine learning system is set to the first threshold, and if the information of the raw material to be subjected to composition analysis is not reflected in the learning data, it is lower than the first threshold. A composition analysis method for electronic/electrical equipment parts scrap including extracting electronic/electrical equipment parts scrap by setting a second threshold value.

本発明の実施の形態に係る電子・電気機器部品屑の処理方法は一実施態様において、上記組成解析結果に基づいて、複数の部品種の中から特定の部品種を選別する選別工程を含むことを特徴とする電子・電気機器部品屑の処理方法である。 In one embodiment of the method for processing electronic and electrical equipment component scraps according to the embodiment of the present invention, a selection step of selecting a specific component type from among a plurality of component types based on the composition analysis result is included. This is a method for processing scrap electronic and electrical equipment parts.

本発明の実施の形態に係る電子・電気機器部品屑の組成解析装置は一実施態様において、複数の部品種を含む複数の電子・電気機器部品屑を含む原料を撮像した撮像画像の中から、機械学習システムを利用した画像認識処理を用いて、電子・電気機器部品屑を抽出し、組成解析を行う電子・電気機器部品屑の組成解析装置であって、機械学習システムの学習に用いられる学習データに、組成解析対象とする原料の情報が反映されている場合は、機械学習システムの確信度を第1の閾値に設定し、組成解析対象とする原料の情報が学習データに反映されていない場合は、第1の閾値よりも低い第2の閾値に設定して電子・電気機器部品屑を抽出する処理装置を備える電子・電気機器部品屑の組成解析装置である。 In one embodiment of the electronic/electrical device component scrap composition analysis apparatus according to the embodiment of the present invention, from the captured image of raw materials containing a plurality of electronic/electrical device component scraps including a plurality of component types, A composition analysis device for electronic/electrical equipment parts scraps that extracts electronic/electrical equipment parts scraps and performs composition analysis using image recognition processing using a machine learning system, which is used for learning of the machine learning system. If the data reflects the information of the raw material that is the target of composition analysis, set the confidence level of the machine learning system to the first threshold, and the information of the raw material that is the target of composition analysis is not reflected in the learning data. In the case, it is an electronic/electrical equipment parts waste composition analysis apparatus provided with a processing device for extracting electronic/electrical equipment parts scraps by setting a second threshold value lower than the first threshold value.

本発明の実施の形態に係る電子・電気機器部品屑の処理装置は一実施態様において、複数の部品種を含む複数の電子・電気機器部品屑を撮像する撮像装置と、撮像画像の中から、機械学習システムを利用した画像認識処理を用いて、電子・電気機器部品屑を抽出し、組成解析を行う電子・電気機器部品屑の組成解析装置であって、機械学習システムの学習に用いられる学習データに、組成解析対象とする原料の情報が反映されている場合は、機械学習システムの確信度を第1の閾値に設定し、組成解析対象とする原料の情報が学習データに反映されていない場合は、第1の閾値よりも低い第2の閾値に設定して電子・電気機器部品屑を抽出する処理装置を備える組成解析装置と、組成解析装置によって解析された組成解析結果に基づいて電子・電気機器部品屑から特定の部品屑を選別する選別機とを備える電子・電気機器部品屑の処理装置である。 In one embodiment of the electronic/electrical device parts waste processing apparatus according to the embodiment of the present invention, an imaging device that images a plurality of electronic/electrical device parts waste including a plurality of component types, and from the captured image, A composition analysis device for electronic/electrical equipment parts scraps that extracts electronic/electrical equipment parts scraps and performs composition analysis using image recognition processing using a machine learning system, which is used for learning of the machine learning system. If the data reflects the information of the raw material that is the target of composition analysis, set the confidence level of the machine learning system to the first threshold, and the information of the raw material that is the target of composition analysis is not reflected in the learning data. In the case, a composition analysis device equipped with a processing device that extracts electronic / electrical equipment parts scrap by setting a second threshold value lower than the first threshold value, and based on the composition analysis result analyzed by the composition analysis device - It is a processing apparatus for electronic/electrical equipment parts scraps, which is provided with a sorter for sorting out specific parts scraps from electric equipment parts scraps.

本開示によれば、画像認識精度を向上でき、個人の経験や技能に関係なく、電子・電気機器部品屑中の部品屑の組成を短時間で効率良く解析することが可能な電子・電気機器部品屑の組成解析方法、電子・電気機器部品屑の処理方法、電子・電気機器部品屑の組成解析装置及び電子・電気機器部品屑の処理装置が提供できる。 According to the present disclosure, an electronic/electrical device capable of improving image recognition accuracy and efficiently analyzing the composition of component scraps in electronic/electrical device component scraps in a short time regardless of individual experience and skills. It is possible to provide a component scrap composition analysis method, electronic/electrical equipment component scrap processing method, electronic/electrical equipment component scrap composition analysis apparatus, and electronic/electrical equipment component scrap processing apparatus.

本発明の実施の形態に係る電子・電気機器部品屑の処理装置を示すブロック図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows the processing apparatus of the electronic/electrical equipment components waste which concerns on embodiment of this invention. 図2(a)は、撮像画像中に存在する電子・電気機器部品屑(基板)に認識枠を付与した画像の例を表す写真であり、図2(b)は、認識枠を付与した電子・電気機器部品屑を部品種(基板・プラスチック)毎に並べた例を示す写真である。FIG. 2(a) is a photograph showing an example of an image in which a recognition frame is given to an electronic/electrical device component waste (substrate) present in a captured image, and FIG. 2(b) is an electronic・It is a photograph showing an example of arranging electric equipment parts scraps for each part type (substrate/plastic). 電子・電気機器部品屑の画像解析処理の一例を示すフローチャートである。It is a flow chart which shows an example of image analysis processing of electronic/electric equipment parts scrap. 撮像画像の中から電子・電気機器として基板とプラスチックとをそれぞれ抽出し、その面積を推測した結果と面積の実測値との比較の例を表す表である。FIG. 10 is a table showing an example of comparison between the results of estimating the areas of substrates and plastics respectively extracted as electronic/electric devices from the captured image and the measured values of the areas; FIG. 本発明の実施の形態に係る機械学習システムを用いて撮像画像の中から電子・電気機器部品屑を抽出した場合の実測値に対する認識結果の比較の例を表す表である。It is a table|surface showing the example of a comparison of the recognition result with respect to the measured value at the time of extracting electronic/electrical equipment component waste from a captured image using the machine-learning system which concerns on embodiment of this invention.

以下、図面を参照しながら本発明の実施の形態を説明する。以下に示す実施の形態は、この発明の技術的思想を具体化するための装置や方法を例示するものであってこの発明の技術的思想は構成部品の構造、配置等を下記のものに特定するものではない。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments shown below are examples of devices and methods for embodying the technical idea of the present invention. not something to do.

本発明の実施の形態に係る電子・電気機器部品屑の処理装置は、図1に示すように、複数の部品種を含む複数の電子・電気機器部品屑を含む原料を撮像した撮像画像を取得可能な撮像装置12と、機械学習システムを利用した画像認識処理を用いて、電子・電気機器部品屑を抽出し、組成解析を行う電子・電気機器部品屑の組成解析装置10と、組成解析装置10によって解析された組成解析結果に基づいて電子・電気機器部品屑から特定の部品屑を選別する選別機13とを備える。 As shown in FIG. 1, the electronic/electrical device parts scrap processing apparatus according to the embodiment of the present invention acquires a captured image of a raw material containing a plurality of electronic/electrical device parts scraps including a plurality of types of parts. A composition analysis apparatus 10 for extracting electronic/electrical equipment parts scraps and performing composition analysis using an imaging device 12 capable of capturing electronic/electrical equipment parts and image recognition processing using a machine learning system, and a composition analyzing apparatus A sorter 13 for sorting out specific parts scrap from the electronic/electrical equipment parts scrap based on the composition analysis result analyzed by 10 .

本実施形態における「電子・電気機器部品屑」とは、廃家電製品・PCや携帯電話等の電子・電気機器を破砕した屑であり、回収された後、適当な大きさには破砕されたものを指す。本実施形態では、電子・電気機器部品屑とするための破砕は、処理者自身が行ってもよいが、市中で破砕されたものを購入等したものでもよい。 "Electronic/electrical device parts scrap" in the present embodiment refers to scraps obtained by crushing electronic/electrical devices such as waste home appliances, PCs, mobile phones, etc. After being collected, they are crushed to an appropriate size. point to something In the present embodiment, the crushing to obtain electronic/electrical device parts scraps may be performed by the processor himself/herself, or the crushed parts purchased in the market may be used.

破砕方法として、特定の装置には限定されず、せん断方式でも衝撃方式でもよいが、できる限り、部品の形状を損なわない破砕が望ましい。従って、細かく粉砕することを目的とする粉砕機のカテゴリーに属する装置は含まれない。 The crushing method is not limited to a specific device, and may be a shearing method or an impact method. Therefore, it does not include equipment belonging to the category of grinders whose purpose is to grind finely.

電子・電気機器部品屑は、基板、筐体などに使われるプラスチック(合成樹脂類)、金属片、銅線屑、コンデンサー、ICチップ、その他、等の複数の部品種からなり、処理目的に応じて更に細かく分類することができる。以下に限定されるものではないが、本実施形態では、粒度50mm以下に破砕されている電子・電気機器部品屑を好適に処理することができる。粒度の下限は特に限定されないが、5mm以上、より典型的には10mm以上、更には15mm以上である。 Electronic and electrical equipment parts scrap consists of multiple types of parts such as plastics (synthetic resins) used for substrates, housings, etc., metal pieces, copper wire scraps, capacitors, IC chips, and others. can be classified in more detail. Although it is not limited to the following, in the present embodiment, it is possible to suitably process electronic and electrical equipment component scraps that have been crushed to a particle size of 50 mm or less. Although the lower limit of the particle size is not particularly limited, it is 5 mm or more, more typically 10 mm or more, and further 15 mm or more.

組成解析装置10は、本実施形態に係る組成解析アルゴリズムに従って撮像画像の画像解析処理を行う処理装置100と、各種処理に必要な情報を記憶する記憶装置110と、入力装置120と、表示装置130とを備える。組成解析装置10は、ネットワーク11を介して、処理装置100による処理結果を、ネットワーク11を介して接続されたサーバ15又は選別機14へ送信可能に構成されている。 The composition analysis apparatus 10 includes a processing device 100 that performs image analysis processing of captured images according to the composition analysis algorithm according to the present embodiment, a storage device 110 that stores information necessary for various processes, an input device 120, and a display device 130. and The composition analysis device 10 is configured to be able to transmit the results of processing by the processing device 100 via the network 11 to the server 15 or the sorter 14 connected via the network 11 .

処理装置100は、学習データを用いた機械学習システムを利用することにより、撮像画像に対して画像認識処理を行い、撮像画像中の電子・電気機器部品屑の組成解析を行う。機械学習には、ディープラーニング等を利用した画像認識のための種々の解析ソフトが利用可能である。記憶装置110には、処理装置100による処理に必要な情報が格納される。 The processing device 100 performs image recognition processing on the captured image by using a machine learning system using learning data, and performs composition analysis of the electronic/electrical device component waste in the captured image. For machine learning, various analysis software for image recognition using deep learning or the like can be used. The storage device 110 stores information necessary for processing by the processing device 100 .

例えば、記憶装置110には、電子・電気機器部品屑の画像情報から、複数の部品種、即ち、基板、プラスチック、金属片、銅線屑、コンデンサー、ICチップ、その他(コネクタ、フィルム状部品屑、被覆線屑等)の少なくとも2種類以上、好ましくは7種類以上、更には10種類以上に分類するための抽出データ、抽出された電子・電気機器部品屑に対して認識枠を付与するための認識枠データ、認識枠中の電子・電気機器部品屑の面積を計測又は推定するための部品種面積率データ、認識枠で囲まれた電子・電気機器部品屑の組成解析に必要な解析データ等を含む種々の組成解析情報等が格納される。 For example, in the storage device 110, from the image information of the electronic/electrical equipment parts scrap, a plurality of parts types, namely substrates, plastics, metal pieces, copper wire scraps, capacitors, IC chips, and others (connectors, film scraps) , coated wire scraps, etc.) at least 2 types, preferably 7 types or more, further 10 types or more, extraction data for giving a recognition frame to the extracted electronic / electrical equipment parts scrap Recognition frame data, component type area ratio data for measuring or estimating the area of electronic/electrical device parts scrap within the recognition frame, analysis data necessary for composition analysis of electronic/electrical device parts scrap enclosed by the recognition frame, etc. Various composition analysis information including .

抽出処理に利用される抽出情報としては、例えば、電子・電気機器部品屑の輪郭等の幾何形状を抽出するための形状情報、電子・電気機器部品屑の色彩を抽出するための色彩情報、電子・電気機器部品屑の周囲の背景画像の色彩、凹凸による影等の背景情報を抽出するための背景情報等、電子・電気機器部品屑の回転画像等を含む。 The extraction information used in the extraction process includes, for example, shape information for extracting geometric shapes such as outlines of electronic/electrical equipment parts scraps, color information for extracting colors of electronic/electrical equipment parts scraps, electronic・Includes background information for extracting background information such as the color of the background image around electrical equipment parts scraps, shadows due to unevenness, etc., and rotating images of electronic/electrical equipment parts scraps.

処理装置100は、記憶装置110に格納された学習データを用いた機械学習により、撮像画像の中から、複数の電子・電気機器部品屑を抽出し、これを複数の部品種毎に区別して分類する。学習データには過去の画像解析結果に基づく電子・電気機器部品屑の特徴を検出するための種々の情報が含まれており、入力装置120を介して新規データが入力され、機械学習システムの学習に用いられる学習データを更新(反映)することにより、電子・電気機器部品屑の認識精度を向上することが行われる。 The processing device 100 extracts a plurality of electronic/electrical device component scraps from the captured image by machine learning using the learning data stored in the storage device 110, and classifies them by distinguishing them by a plurality of component types. do. The learning data includes various information for detecting the characteristics of electronic and electrical equipment parts scraps based on past image analysis results. By updating (reflecting) the learning data used for , the recognition accuracy of the electronic/electrical equipment parts scrap is improved.

しかしながら、電子・電気機器部品屑は、原料として搬入される前に破砕処理が行われている場合が多く、定まった形を有さず、種々の部品を含み得るため、これらの全てを学習データに反映させることが困難な場合がある。例えば、新しい入手ルートからの電子・電気機器部品屑は、学習データに反映させることが困難であることが多い。機械学習システムの学習に用いられる学習データに組成解析対象とする原料の情報が反映されていない場合には、抽出処理を行ってもその精度が高くなくなり、誤認識率が急激に高くなる。具体的には、誤認識率が一定値を超える場合、例えば本実施形態では誤認識率が15%、更には10%を超える場合は、機械学習システムの学習に用いられる学習データに組成解析対象とする原料の情報が反映されていない場合として判断できる。 However, electronic and electrical equipment parts scraps are often crushed before being brought in as raw materials, do not have a fixed shape, and may contain various parts, so all of these are used as learning data It may be difficult to reflect For example, it is often difficult to reflect electronic and electrical equipment scraps from new acquisition routes in the learning data. If the learning data used for the learning of the machine learning system does not reflect the information of the raw material to be subjected to the composition analysis, the accuracy will not be high even if the extraction process is performed, and the recognition error rate will increase sharply. Specifically, when the misrecognition rate exceeds a certain value, for example, when the misrecognition rate exceeds 15% in the present embodiment, or further exceeds 10%, the learning data used for learning of the machine learning system is subjected to composition analysis. It can be judged as a case where the information of the raw material is not reflected.

選別処理対象とする新規の原料が搬送された場合に、処理装置100がその新規の原料の撮像画像の中から、電子・電気機器部品屑の抽出処理を行うに際し、機械学習システムの学習に用いられる学習データに、組成解析対象とする原料の情報が反映されている場合には、機械学習システムの確信度を第1の閾値に設定し、組成解析対象とする原料の情報が学習データに反映されていない場合は、第1の閾値よりも低い第2の閾値に設定する。 When a new raw material to be sorted is transported, the processing device 100 extracts electronic and electrical equipment parts scrap from the captured image of the new raw material. Used for learning of the machine learning system. When the information of the raw material to be subjected to composition analysis is reflected in the learning data obtained, the certainty of the machine learning system is set to the first threshold, and the information of the raw material to be subjected to composition analysis is reflected in the learning data. If not, set a second threshold that is lower than the first threshold.

組成解析対象とする原料の情報が学習データに反映されていない場合は、第1の閾値よりも低い第2の閾値に設定することにより、電子・電気機器部品屑の認識対象を広げることができるため、認識対象範囲を緩和することができる。その結果、新規の原料に対しても電子・電気機器部品屑の抽出率を向上させることができ、原料の組成解析の精度を向上させることができる。なお、本実施形態の確信度とは、図1の処理装置100が備える機械学習システムによる電子・電気機器部品屑の抽出結果の確からしさの度合いを示す。 If the information of raw materials to be subjected to composition analysis is not reflected in the learning data, by setting the second threshold lower than the first threshold, it is possible to expand the recognition target of electronic/electrical device parts scrap. Therefore, the recognition target range can be relaxed. As a result, it is possible to improve the extraction rate of electronic/electrical equipment parts scraps even for new raw materials, and to improve the accuracy of composition analysis of the raw materials. In addition, the degree of certainty in the present embodiment indicates the degree of certainty of the extraction result of the electronic/electrical device parts scrap by the machine learning system provided in the processing apparatus 100 of FIG. 1 .

電子・電気機器部品屑の抽出処理の場合、確信度は高く設定すると電子・電気機器部品屑の抽出のための認識率を高めることができる一方で、抽出個数が少なくなるため、原料の組成判断のための抽出処理としては適切とはいえない。一方、認識率を低く設定しすぎることで誤認識が多くなることから、原料の組成判断のための抽出処理としては適切とはいえない。本実施形態では、第1の閾値を0.2~0.5とすることが好ましく、より好ましくは、0.25~0.4とする。第2の閾値は0.01~0.1とすることが好ましく、より好ましくは0.02~0.09とする。その結果、新規原料に対しても撮像画像から、目視による実測値に比べて70%以上の電子・電気機部品屑を抽出することができ、これにより組成解析の精度を高めることができる。 In the case of extraction processing of electronic and electrical equipment parts scraps, if the certainty is set high, the recognition rate for extracting electronic / electrical equipment parts scraps can be increased, but the number of extractions decreases, so it is difficult to judge the composition of raw materials. It is not suitable as an extraction process for On the other hand, if the recognition rate is set too low, erroneous recognition increases, so it is not suitable as an extraction process for judging the composition of raw materials. In this embodiment, the first threshold is preferably 0.2 to 0.5, more preferably 0.25 to 0.4. The second threshold is preferably 0.01 to 0.1, more preferably 0.02 to 0.09. As a result, it is possible to extract 70% or more of the electronic/electric component scraps from the photographed image of the new raw material compared to the actual value by visual inspection, thereby improving the accuracy of the composition analysis.

処理装置100は、確信度の第1及び第2の閾値の設定値に従って抽出された電子・電気機器部品屑に対し、認識枠を付与する。認識枠は、電子・電気機器部品屑の輪郭を縁取った最小枠としてもよいし、電子・電気機器部品屑及び電子・電気機器部品屑の周囲の背景の画像を含む認識枠を付与してもよい。 The processing device 100 provides a recognition frame to the electronic/electrical equipment parts scrap extracted according to the set values of the first and second thresholds of the certainty. The recognition frame may be a minimum frame that outlines the outline of the electronic/electrical equipment parts scrap, or a recognition frame that includes the electronic/electrical equipment parts scrap and the background image around the electronic/electrical equipment parts scrap. good too.

電子・電気機器部品屑の周囲の背景の画像を含む認識枠を付与する場合には、電子・電気機器部品屑の輪郭と外接する外接図形を認識枠として付与することが好ましい。外接図形の形状は、外接矩形、外接円形、外接多角形など任意の形状を有していてもよい。 When providing a recognition frame including a background image around electronic/electrical device parts scrap, it is preferable to provide a circumscribing figure that circumscribes the outline of the electronic/electrical device parts scrap as a recognition frame. The shape of the circumscribing graphic may be any shape such as a circumscribing rectangle, a circumscribing circle, or a circumscribing polygon.

認識枠は、操作者が複数の部品屑を見分けやすいように、部品種毎に異なる特性(色彩、線の濃淡、線の種類(太さ、点線/実線など))を有して付与されることが望ましい。図2(a)は撮像画像から電子・電気機器部品屑として基板を抽出した場合の例を表す写真である。図2(b)の紙面上部が基板、紙面下部がプラスチックの抽出物の例を示す。 Recognition frames are given with different characteristics (color, line shade, line type (thickness, dotted line/solid line, etc.)) for each part type so that the operator can easily distinguish between multiple pieces of scrap parts. is desirable. FIG. 2(a) is a photograph showing an example of a case where substrates are extracted from a captured image as electronic/electrical equipment component scraps. FIG. 2(b) shows an example of a substrate in the upper part of the paper and a plastic extract in the lower part of the paper.

処理装置100は、更に、付与された認識枠内に存在する電子・電気機器部品屑の面積を計測又は推測する。電子・電気機器部品屑の面積の計測は、撮像画像に基づいて面積を計測することが可能な面積計測ツールを用いることができる。電子・電気機器部品屑の面積を機械学習システムを用いて推定する場合には、処理装置100が、記憶装置110に記憶された、認識枠に対する電子・電気機器部品屑の面積率の情報を少なくとも有する部品種面積率データを用いて、複数の部品種毎に、認識枠が付された電子・電気機器部品屑の合計面積を推測する。部品種面積率データとしては、電子・電気機器部品屑の輪郭の形状情報、認識枠の面積、認識枠内に占める電子・電気機器部品屑の面積及び背景の面積、認識枠に対する電子・電気機器部品屑の面積率の情報、位置情報等の種々の情報を含むことができる。 The processing device 100 further measures or estimates the area of the electronic/electrical device component waste present within the given recognition frame. An area measurement tool capable of measuring the area based on the captured image can be used to measure the area of the electronic/electrical device parts scrap. When estimating the area of electronic/electrical equipment parts scrap using a machine learning system, the processing device 100 stores at least information on the area ratio of the electronic/electrical equipment parts scrap with respect to the recognition frame, Using the part type area ratio data, the total area of the electronic/electrical equipment parts scrap with recognition frames is estimated for each of a plurality of part types. The part type area ratio data includes the outline shape information of the electronic/electrical equipment parts scrap, the area of the recognition frame, the area of the electronic/electrical equipment parts scrap within the recognition frame and the area of the background, and the electronic/electrical equipment relative to the recognition frame. Various information such as information on the area ratio of scrap parts and position information can be included.

処理装置100は、更に、部品種毎の電子・電気機器部品屑の合計面積の推測結果と予め定められた複数の部品種毎の単位面積当たりの想定重量とを乗算し、複数の部品種に含まれる電子・電気機器部品屑の重量を解析することで、複数の部品種の重量比率をそれぞれ解析し、これにより、撮像画像内に存在する電子・電気機器部品屑の組成を解析する。 The processing device 100 further multiplies the result of estimating the total area of the electronic and electrical equipment parts scrap for each part type by the presumed weight per unit area for each of a plurality of predetermined part types, and divides the plurality of part types into By analyzing the weight of the included electronic/electrical device parts scrap, the weight ratio of a plurality of component types is analyzed, thereby analyzing the composition of the electronic/electrical device parts scrap present in the captured image.

複数の部品種の単位面積当たりの想定重量は、操業結果に応じて予め操作者により入力装置120等を介して設定しておくことができる。以下に限定されるものではないが、例えば、電子・電気機器部品屑を基板、プラスチック、その他部品の3種類に分類する場合、基板屑の想定重量を例えば2.0g/cm2、プラスチックの想定重量を1.5g/cm2、その他の部品を1.0g/cm2と設定することができる。 The assumed weight per unit area of a plurality of component types can be set in advance by the operator via the input device 120 or the like according to the operation results. Although not limited to the following, for example, when electronic and electrical equipment parts scraps are classified into three types of substrates, plastics, and other parts, the assumed weight of substrate scraps is assumed to be 2.0 g/cm 2 , and the assumed weight of plastics is 2.0 g/cm 2 . The weight can be set at 1.5 g/cm 2 and the other parts at 1.0 g/cm 2 .

なお、処理装置100は、上記で説明した面積の情報の他に、抽出した部品種毎にその部品種を構成する部品の個数(個)、上記の面積の推測結果と個数とから算出される平均粒径、夫々の部品種を構成する元素の重量比などのその他物理的特性についても解析し、表示装置130等に出力することもできる。 In addition to the information on the area described above, the processing unit 100 calculates the number of parts constituting the part type for each extracted part type, the result of estimating the area, and the number of parts. It is also possible to analyze other physical properties such as the average particle diameter and the weight ratio of elements constituting each part type and output them to the display device 130 or the like.

処理装置100は、更に、複数の部品種の重量比率の解析結果に基づいて、複数の部品種を選別するための選別機の運転条件の情報を生成することが好ましい。選別機としては、ピッキング、カラーソーター、メタルソーター、渦電流選別機、風力選別機、篩別機などの種々の選別機がある。例えば、風数の部品種の解析結果から、処理装置100が、例えば基板とプラスチックとを選別するカラーソーターの運転条件を生成し、生成した運転条件を記憶装置110へ格納する。記憶装置110へ格納された運転条件は、選別機13、14へ出力されて、選別機13、14が、出力された運転条件に応じて選別処理を行うことができる。 Preferably, the processing device 100 further generates information on operating conditions of a sorter for sorting out a plurality of component types based on the analysis results of the weight ratios of the plurality of component types. As the sorting machine, there are various sorting machines such as picking, color sorter, metal sorter, eddy current sorter, wind sorter, and sieving machine. For example, the processor 100 generates operating conditions for a color sorter that sorts substrates and plastics, for example, based on the analysis result of the component type of wind speed, and stores the generated operating conditions in the storage device 110 . The operating conditions stored in the storage device 110 are output to the sorting machines 13 and 14, and the sorting machines 13 and 14 can perform sorting processing according to the output operating conditions.

処理装置100は、電子・機器部品屑の撮像画像から抽出された電子・電気機器部品屑のそれぞれの位置情報を取得してもよい。そして、特定の電子・電気機器部品屑の位置を抽出してこれを選別するための特定の選別機13、14に対し、位置情報を出力するように構成されてもよい。例えば、基板と金属片はメタルソーター等の特定の選別機13、14では分離できないが、画像情報で個別に位置情報が得られれば、ピッキング機能を備える選別機13、14によってこれらを選別することができるようになる。 The processing device 100 may acquire the position information of each of the electronic/electrical equipment component scraps extracted from the captured image of the electronic/equipment component scraps. Then, the position information may be output to specific sorters 13 and 14 for extracting the positions of specific electronic/electrical equipment component scraps and sorting them out. For example, substrates and metal pieces cannot be separated by specific sorters 13 and 14 such as metal sorters, but if individual position information can be obtained from image information, they can be sorted by sorters 13 and 14 having a picking function. will be able to

処理装置100は、抽出処理及び推測処理に必要な学習データを機械学習により更に学習することができる。例えば、処理装置100は、基板、プラスチック、金属片、銅線屑などの複数の部品種毎の特徴、例えば本実施形態では、各部品種毎の色彩、形状、認識枠と部品屑の面積率の関係等の情報に関し、数百枚~数万枚のデータの入力に基づいてその特徴を学習し、抽出処理及び推測処理の精度を向上させるように学習することができる。 The processing device 100 can further learn learning data necessary for the extraction processing and the estimation processing by machine learning. For example, the processing apparatus 100 can determine the characteristics of each of a plurality of component types such as substrates, plastics, metal pieces, and copper wire scraps. With respect to information such as relationships, it is possible to learn the characteristics based on the input of hundreds to tens of thousands of data, and learn so as to improve the accuracy of extraction processing and estimation processing.

また、電子・電気機器部品屑の誤認識等が生じた場合に、或いは電子・電気機器部品屑の抽出漏れが生じた場合には、誤認識又は抽出漏れが生じた電子・電気機器部品屑の特性を処理装置100の機械学習システムが更に学習するように構成されることが好ましい。例えば、処理装置100は、電子・電気機器部品屑の抽出処理によって抽出されなかった電子・電気機器部品屑の輪郭の情報、抽出処理で抽出されなかった電子・電気機器部品屑と背景の画像とを含む新たな認識枠の情報、その認識枠に対する電子・電気機器部品屑の面積率の情報等の入力に応じた機械学習等により新たな学習モデルを作製することができる。 In addition, in the event of misrecognition of electronic/electrical equipment parts scrap, etc., or in the event of failure to extract electronic/electrical equipment parts scrap, Preferably, the characteristics are configured to be further learned by the machine learning system of processing device 100 . For example, the processing device 100 may include information on the outline of electronic/electrical device parts scrap not extracted by the electronic/electrical equipment parts scrap extraction process, electronic/electrical equipment parts scrap not extracted by the extraction process, and background images. A new learning model can be created by machine learning or the like according to the input of information on a new recognition frame including , information on the area ratio of electronic/electrical equipment parts scrap to the recognition frame, and the like.

本発明の実施の形態に係る電子・電気機器部品屑の組成解析装置によれば、撮像画像の画像処理によって、電子・電気機器部品屑の部品種毎の重量比率を数値化して評価することができる。これにより、原料の組成にとって、原料に対して物理選別を行うべきか、キルン炉等による焼却処理を行うか等の選別条件の選択をより効率的に行うことができる。撮像画像の認識結果に基づいて、例えば、原料中のプラスチック比率が多い場合には、プラスチックの重量比率に基づいて購入条件を見直すことや、キルン炉の熱負荷等を調整することも可能となる。 According to the apparatus for analyzing the composition of electronic/electrical device parts scrap according to the embodiment of the present invention, it is possible to quantify and evaluate the weight ratio for each part type of electronic/electrical device parts scrap by image processing of the captured image. can. This makes it possible to more efficiently select sorting conditions such as whether the raw material should be physically sorted or incinerated in a kiln or the like for the composition of the raw material. Based on the recognition result of the captured image, for example, if the raw material contains a large amount of plastic, it is possible to review the purchase conditions based on the weight ratio of plastic and adjust the heat load of the kiln furnace. .

図1に示す電子・電気機器部品屑の処理装置を用いた電子・電気機器部品屑の処理方法の一例について、図3のフローチャートを用いて説明する。まず、ステップS100において、撮像画像が取得される。撮像画像は入力装置120或いはネットワーク11を介して入力された撮像画像でもよいし、撮像装置12による撮像結果を用いてもよい。ステップS101において、撮像画像に含まれる、組成解析対象とする原料の情報が、機械学習システムの学習に用いられる学習データに既に反映されているか否かが判断される。判断は入力装置120を介して操作者が手動で行っても良いし、処理装置100が記憶装置110のデータを参照して自動的に行っても良い。 An example of a method for processing electronic/electrical device component scraps using the electronic/electrical device component scrap processing apparatus shown in FIG. 1 will be described with reference to the flowchart of FIG. First, in step S100, a captured image is obtained. The captured image may be a captured image input via the input device 120 or the network 11, or a captured image by the imaging device 12 may be used. In step S101, it is determined whether or not the information of the raw material to be subjected to composition analysis, which is included in the captured image, has already been reflected in learning data used for learning of the machine learning system. The determination may be made manually by the operator via the input device 120 , or may be made automatically by the processing device 100 referring to the data in the storage device 110 .

撮像画像に撮像された組成解析対象とする原料の情報が、機械学習システムの学習に用いられる学習データに反映されている場合は、ステップS102に進み、機械学習システムの確信度が第1の閾値に設定される。組成解析対象とする原料の情報が学習データに反映されていない場合は、ステップS103へ進み、第1の閾値よりも低い第2の閾値に設定され、ステップS104へ進む。 When the information of the raw material to be subjected to composition analysis captured in the captured image is reflected in the learning data used for learning of the machine learning system, the process proceeds to step S102, and the certainty of the machine learning system reaches the first threshold. is set to If the information of the raw material to be subjected to the composition analysis is not reflected in the learning data, the process proceeds to step S103, where a second threshold lower than the first threshold is set, and the process proceeds to step S104.

ステップS104~ステップS107において、機械学習システムを利用した画像認識処理が行われる。処理装置100は、設定された機械学習システムの確信度に基づいて、撮像画像内に存在する電子・電気機器部品屑を、部品種毎(例えば、基板、プラスチック、金属片、銅線屑、コンデンサー、ICチップ、その他の部品種の7分類)に分類して、抽出する。分類結果は、表示装置130等によって表示されることができる。 In steps S104 to S107, image recognition processing using a machine learning system is performed. Based on the set certainty of the machine learning system, the processing device 100 classifies electronic and electrical equipment scraps present in the captured image by component type (for example, substrates, plastics, metal pieces, copper wire scraps, capacitors , IC chips, and other component types) and extracted. The classification result can be displayed by the display device 130 or the like.

ステップS105において、処理装置100は、撮像画像から抽出され複数の電子・電気機器部品屑に対し、複数の部品種毎に、電子・電気機器部品屑の周囲の背景の画像を含む認識枠を付与する。ステップS106において、処理装置100は、認識枠に対する電子・電気機器部品屑の面積率の情報を有する部品種面積率データに基づいて、複数の部品種毎に、認識枠が付された前記電子・電気機器部品屑の面積(合計面積)を推測する。ステップS107において、処理装置100は、面積の推測結果と、複数の部品種の単位面積当たりの想定重量を乗算して複数の部品種の重量比率をそれぞれ解析することにより、撮像画像内の電子・電気機器部品屑の組成を解析する。例えば、画像内の部品種毎の合計面積に、単位面積当たりの重量を乗算すると、部品屑の総重量を概ね算出することができる。各部品種毎の部品屑の総重量をそれぞれ対比することで、撮像画像内に含まれる電子・電気機器部品屑の組成が解析できる。解析結果は、ステップS109において出力される。 In step S105, the processing device 100 assigns a recognition frame including a background image around the electronic/electrical device parts scrap for each of the plurality of component types to the plurality of electronic/electrical device component scraps extracted from the captured image. do. In step S106, the processing device 100, based on the component type area ratio data having the information of the area ratio of the electronic/electrical equipment parts scrap to the recognition frame, for each of the plurality of component types, the electronic/electrical device to which the recognition frame is attached. Estimate the area (total area) of electrical equipment parts scrap. In step S107, the processing device 100 multiplies the area estimation result by the assumed weight per unit area of the plurality of component types, and analyzes the weight ratios of the plurality of component types, thereby obtaining the electronic and electronic components in the captured image. Analyze the composition of electrical equipment parts scrap. For example, by multiplying the total area of each part type in the image by the weight per unit area, the total weight of scrap parts can be roughly calculated. By comparing the total weight of the parts scrap for each part type, the composition of the electronic/electrical equipment parts scrap contained in the captured image can be analyzed. The analysis result is output in step S109.

本発明の実施の形態に係る電子・電気機器部品屑の組成解析方法及び組成解析装置によれば、画像解析によって、撮像画像中に存在する電子・電気機器部品屑の部品種毎の重量比率を求めることができる。これにより、原料組成を、個人の経験や技能に関係なく迅速に推測することができる。その結果、操作者が、原料の購入条件や原料の選別方法の判断をより早期に行うことができるようになるため、工場全体をより効率的に運用できる。 According to the composition analysis method and composition analysis apparatus for electronic/electrical device parts scrap according to the embodiment of the present invention, the weight ratio of each component type of electronic/electrical device parts scrap present in the captured image is determined by image analysis. can ask. This allows the raw material composition to be rapidly deduced regardless of individual experience and skill. As a result, the operator can make decisions on raw material purchase conditions and raw material selection methods at an early stage, so that the entire factory can be operated more efficiently.

電子・電気機器部品屑の周囲の背景画像は、撮像先の条件により異なる場合があり、場合によっては、機械学習システムが電子・電気機器部品屑を適切に抽出できない場合がある。本実施形態では、機械学習システムが、背景の情報と、電子・電気機器部品屑の縁取り画像を組み合わせた画像を合成した新たな認識枠の情報を含む、電子・電気機器部品屑の抽出処理のための学習データを新たに学習することにより、撮像画像中の種々の条件に対応したより柔軟な組成解析装置を得ることができる。また、本システムを用いた場合にも誤認識率が高い場合には、学習データに反映されていない原料に含まれる電子・電気機器部品屑の輪郭、色彩、認識枠に対する面積率、及び背景の少なくともいずれかの情報を、機械学習システムに学習させることで電子・電気機器部品屑の認識精度を高めることができる。 The background image around the electronic/electrical equipment parts scrap may differ depending on the conditions of the imaging destination, and in some cases, the machine learning system may not be able to appropriately extract the electronic/electrical equipment parts scrap. In the present embodiment, the machine learning system includes background information and information of a new recognition frame obtained by synthesizing an image obtained by combining the edged image of the electronic/electrical equipment parts scrap, including the information of the electronic/electrical equipment parts scrap extraction process. By newly learning learning data for , it is possible to obtain a more flexible composition analysis apparatus that can cope with various conditions in the captured image. In addition, if the misrecognition rate is high even when using this system, the contours, colors, area ratios to the recognition frame, and background of electronic and electrical equipment parts scraps contained in raw materials that are not reflected in the learning data By having the machine learning system learn at least one of the information, it is possible to improve the recognition accuracy of the electronic/electrical device parts scrap.

図4は、本発明の実施の形態に係る解析方法に従って、撮像画像の中から電子・電気機器として基板とプラスチックとをそれぞれ抽出し、その面積を推測した結果と実測値との比較の例を表す表である。本発明の実施の形態に係る電子・電気機器部品屑の組成解析方法によれば、基板については5.0%未満の測定誤差で、プラスチックについては10%未満の測定誤差で適切な評価ができており、二種類の部品を含む場合には、認識率90%以上を達成することができた。そのため、原料の組成を数値的に大まかに把握する上では、本手法により十分な効果が得られているといえる。 FIG. 4 shows an example of comparison between the result of estimating the area of a board and a plastic as an electronic/electrical device, respectively, extracted from a captured image according to the analysis method according to the embodiment of the present invention and the measured value. It is a table representing According to the method for analyzing the composition of electronic and electrical equipment component scraps according to the embodiment of the present invention, appropriate evaluation can be made with a measurement error of less than 5.0% for substrates and with a measurement error of less than 10% for plastics. A recognition rate of 90% or higher was achieved when two types of parts were included. Therefore, it can be said that this method is sufficiently effective in numerically grasping the composition of raw materials.

図5は、本発明の実施の形態に係る機械学習システムを用いて撮像画像の中から電子・電気機器部品屑を抽出した場合の実測値に対する認識結果の比較の例を表す表である。実施例10は、機械学習システムの学習に用いられる学習データにその特徴を反映させた場合の抽出個数の実測値と認識(抽出)個数、誤認識個数、認識率及び誤認識率を示し、この場合の確信度を0.3とした。実施例2及び比較例2は、学習データにその原料情報が反映されていない場合の例を示す。実施例2の確信度を0.07とし、比較例2の確信度を0.3とした。実施例2と比較例1の結果からわかるように、確信度を低くすることにより機械学習システムによる誤認識個数は若干増加するが、確信度を低くした方が、認識率は良好な結果が得られている。原料の組成を数値的に大まかに把握する上では、本手法により十分な効果が得られているといえる。 FIG. 5 is a table showing an example of comparison of recognition results with actual measurement values when electronic/electrical device component waste is extracted from captured images using the machine learning system according to the embodiment of the present invention. Example 10 shows the measured value of the extracted number, the recognized (extracted) number, the number of misrecognitions, the recognition rate, and the misrecognition rate when the characteristics are reflected in the learning data used for learning of the machine learning system. Confidence in case was set to 0.3. Example 2 and Comparative Example 2 show examples in which the raw material information is not reflected in the learning data. The certainty factor of Example 2 was set to 0.07, and the certainty factor of Comparative Example 2 was set to 0.3. As can be seen from the results of Example 2 and Comparative Example 1, lowering the confidence factor slightly increases the number of misrecognitions by the machine learning system, but lowering the confidence factor results in a better recognition rate. It is It can be said that this method is sufficiently effective in numerically grasping the composition of raw materials.

本発明は上記の実施の形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。即ち、本発明は各実施形態に限定されるものではなく、その要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、各実施形態に開示されている複数の構成要素の適宜な組み合わせにより、種々の発明を形成できる。例えば、実施形態に示される全構成要素からいくつかの構成要素を削除してもよい。更に、異なる実施形態の構成要素を適宜組み合わせてもよい。 Although the present invention has been described by the above embodiments, the statements and drawings forming part of this disclosure should not be understood to limit the present invention. That is, the present invention is not limited to each embodiment, and can be embodied by modifying the constituent elements without departing from the spirit of the present invention. Moreover, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in each embodiment. For example, some components may be deleted from all components shown in the embodiments. Furthermore, components of different embodiments may be combined as appropriate.

例えば、処理装置100が、撮像画像の中から複数の部品種毎の平均の面積、個数、平均粒径、重量比などを数値化して解析することにより、従来のように、手選別で電子・電気機器部品屑の原料組成を評価するよりも著しく迅速にその原料組成を数値化して把握することができる。 For example, the processing device 100 quantifies and analyzes the average area, number, average particle diameter, weight ratio, etc. of each of a plurality of component types from the captured image, thereby enabling manual sorting by electronic and The raw material composition can be quantified and grasped remarkably faster than evaluating the raw material composition of electrical equipment parts scrap.

更に、処理装置100が解析した原料解析結果に基づいて、複数の部品種の中から特定の部品種を選別する選別機の運転条件の情報、例えば、原料を選別処理するための選別機の選択と、選別条件、選別順序等の操業条件を決定し、その操業条件に基づいて選別処理を行うことができる。 Furthermore, based on the raw material analysis result analyzed by the processing device 100, information on the operating conditions of a sorter that sorts out a specific part type from among a plurality of component types, for example, selection of a sorter for sorting raw materials Then, operating conditions such as sorting conditions and sorting order can be determined, and sorting processing can be performed based on the operating conditions.

例えば、電子・電気機器部品屑に対して風力選別機を用いて風力選別を行って軽量物と重量物とに選別することにより、選別後の処理物中の基板とプラスチックの重量比率を上げるための処理を行うことができる。この場合、選別機13、14による処理においては、機械学習システムが解析した原料解析結果に基づいて、複数の部品種の平均粒径に応じて、風力選別機の風量を調整することができる。風量は例えば5~20m/s、より好ましくは5~12m/s、更には5~10m/s程度とすることができる。風力選別は原料解析結果に応じて2回以上繰り返して行うことができる。 For example, to increase the weight ratio of substrates and plastics in the processed materials after sorting by sorting electronic and electrical equipment parts scraps into light and heavy items by wind sorting using a wind sorter. can be processed. In this case, in the processing by the sorters 13 and 14, the air volume of the wind sorter can be adjusted according to the average grain size of a plurality of component types based on the raw material analysis results analyzed by the machine learning system. The air volume can be, for example, about 5 to 20 m/s, more preferably about 5 to 12 m/s, furthermore about 5 to 10 m/s. Wind sorting can be repeated two or more times depending on the raw material analysis results.

或いは、上記の風力選別を実施する前に、ピッキング装置を用いたピッキング処理を行うことにより、塊状の銅線屑を取り除くピッキング処理を行うことができる。このピッキング処理に際しては、記憶装置110に記憶された銅線屑の位置情報を選別機13としてのピッキング装置に出力し、ピッキング装置がその出力結果に応じて銅線屑を取り除くことができる。この銅線屑は、例えば有価金属回収工程へ送ることができる。 Alternatively, by performing a picking process using a picking device before carrying out the above wind sorting, it is possible to perform a picking process for removing clumps of copper wire scraps. In this picking process, the position information of the scrap copper wire stored in the storage device 110 is output to the picking device as the sorter 13, and the picking device can remove the scrap copper wire according to the output result. This copper wire scrap can be sent, for example, to a valuable metal recovery process.

風力選別を二回以上繰り返す場合は、第1回目の風力選別と第2回目の風力選別との間に篩別機を用いた選別処理を行うことができる。この場合、選別機13としては篩別機が採用され、原料解析結果で得られる複数の部品種の平均粒径に基づいて、特性の部品種を選別するための篩別機の篩目の寸法を変更することができる。 When the wind sorting is repeated two or more times, a sorting process using a sieving machine can be performed between the first wind sorting and the second wind sorting. In this case, a sieving machine is adopted as the sorting machine 13, and the size of the sieve mesh of the sieving machine for sorting out the characteristic part type based on the average particle size of a plurality of part types obtained from the raw material analysis result can be changed.

上記で説明した手法の他にも、磁力選別工程、渦電流選別工程、及び金属物と非金属物とを光学的に選別する光学式選別工程に用いられる選別機13に対してそれぞれ本発明の実施の形態に係る組成解析装置による組成解析結果を活用することで、搬送中の電子・電気機器部品屑を連続的に撮影しながら、その画像データをリアルタイムに解析し、原料組成を解析することができる。 In addition to the methods described above, the present invention is applied to the sorting machine 13 used in the magnetic sorting process, the eddy current sorting process, and the optical sorting process for optically sorting metallic objects and non-metallic objects. By utilizing the composition analysis results obtained by the composition analysis apparatus according to the embodiment, the raw material composition can be analyzed by analyzing the image data in real time while continuously photographing electronic and electrical device parts scraps being transported. can be done.

従来、電子・電気機器部品屑の原料組成は、手選別によって評価し、その結果を選別処理の操業管理、運転条件の設定に反映させることが行われていたが、しかしながら、手選別により原料組成を把握する手法では、迅速な処理を行うことができなかった。 Conventionally, the raw material composition of electronic and electrical equipment parts scrap was evaluated by manual sorting, and the results were reflected in the operation management of the sorting process and the setting of operating conditions. In the method of grasping , it was not possible to perform rapid processing.

本発明の実施の形態によれば、時々刻々とその組成が変化する電子・電気機器部品屑の中からその中の部品屑の組成を画像解析と所定の分類データに基づく分離によって、瞬時に判別し数値化することができるため、大量の電子・電気機器部品屑をより適切な条件で迅速に選別を行うことができる。 According to the embodiment of the present invention, the composition of electronic/electrical device parts whose composition changes from moment to moment is instantaneously determined by image analysis and separation based on predetermined classification data. Since it can be quantified, it is possible to quickly sort a large amount of electronic and electrical equipment parts scrap under more appropriate conditions.

更に、選別機13、14による処理前後の部品屑の原料組成を画像解析することで、部品屑の変化量に基づいて、選別機13、14の選別効率(成績)を評価することができる。電子・電気機器部品屑の原料組成を判別するとともにその位置情報を抽出し、ピッキング装置やカラーソーター、メタルソーターなどの選別機13、14と連動させることで、部品種の個別分離が容易になる。また、表示装置130に解析結果として各原料種毎に色の異なる枠を付けて表示させることで操作者が認識しやすくなるため、組成解析装置の誤検知も認識しやすくなる。 Furthermore, by image analysis of the raw material composition of scrap parts before and after processing by the sorters 13 and 14, the sorting efficiency (performance) of the sorters 13 and 14 can be evaluated based on the amount of change in the scrap parts. By identifying the raw material composition of electronic and electrical equipment parts scraps and extracting their position information, and by interlocking with sorting machines 13 and 14 such as picking devices, color sorters, and metal sorters, it becomes easy to separate individual parts types. . In addition, since the analysis results are displayed on the display device 130 with a frame of a different color for each raw material type, the operator can easily recognize the analysis results, so that erroneous detection by the composition analysis apparatus can be easily recognized.

10…組成解析装置
11…ネットワーク
12…撮像装置
13、14…選別機
15…サーバ
100…制御装置
110…記憶装置
120…入力装置
130…表示装置
DESCRIPTION OF SYMBOLS 10... Composition-analysis apparatus 11... Network 12... Imaging apparatus 13, 14... Sorting machine 15... Server 100... Control apparatus 110... Storage device 120... Input device 130... Display device

Claims (7)

複数の部品種を含む複数の電子・電気機器部品屑を含む原料を撮像した撮像画像の中から、機械学習システムを利用した画像認識処理を用いて、前記電子・電気機器部品屑を抽出し、組成解析を行うことを含み、
前記機械学習システムの学習に用いられる学習データに、組成解析対象とする原料の情報が反映されている場合は、前記機械学習システムの確信度を第1の閾値に設定し、組成解析対象とする原料の情報が前記学習データに反映されていない場合は、第1の閾値よりも低い第2の閾値に設定して前記電子・電気機器部品屑を抽出すること
を含み、
前記電子・電気機器部品屑を抽出し、組成解析を行うことが、
設定された前記確信度に基づいて抽出された前記電子・電気機器部品屑に対し、前記電子・電気機器部品屑及び前記電子・電気機器部品屑の周囲の背景の画像を含む認識枠を付与し、
記憶装置に記憶された前記認識枠に対する前記電子・電気機器部品屑の面積率の情報を少なくとも有する部品種面積率データに基づいて、前記複数の部品種毎に、前記認識枠が付された前記電子・電気機器部品屑の合計面積を推測し、
前記合計面積の推測結果と前記複数の部品種毎の単位面積当たりの想定重量とを乗算し、前記複数の部品種毎の前記電子・電気機器部品屑の重量比率をそれぞれ解析することにより、前記撮像画像内の前記電子・電気機器部品屑の組成解析を行うこと
を含むことを特徴とする電子・電気機器部品屑の組成解析方法。
Using image recognition processing using a machine learning system from among captured images of raw materials containing a plurality of electronic/electrical equipment parts scraps including a plurality of component types, extracting the electronic/electrical equipment parts scraps, performing a compositional analysis;
When the learning data used for learning of the machine learning system reflects the information of the raw material to be subjected to composition analysis, the certainty of the machine learning system is set to the first threshold, and the composition is to be analyzed. If the raw material information is not reflected in the learning data, extracting the electronic / electrical equipment parts scrap by setting a second threshold lower than the first threshold ,
Extracting the electronic and electrical equipment parts scrap and performing composition analysis,
A recognition frame including an image of the electronic/electrical device parts scrap and the background image around the electronic/electrical device parts scrap is given to the electronic/electrical device parts scrap extracted based on the set certainty. ,
Based on the component type area ratio data having at least the information of the area ratio of the electronic/electrical device parts scrap to the recognition frame stored in the storage device, the recognition frame is attached to each of the plurality of component types. Estimate the total area of electronic and electrical equipment parts scrap,
By multiplying the estimation result of the total area by the assumed weight per unit area for each of the plurality of component types, and analyzing the weight ratio of the electronic/electrical device parts scrap for each of the plurality of component types, the Performing a composition analysis of the electronic/electrical device parts scrap in the captured image
A composition analysis method for electronic and electrical equipment parts scraps , comprising :
前記第1の閾値を0.2~0.5とし、前記第2の閾値を0.01~0.1とすることを含む請求項1に記載の電子・電気機器部品屑の組成解析方法。 2. The method for analyzing the composition of electronic and electrical equipment component scraps according to claim 1, comprising setting the first threshold to 0.2 to 0.5 and setting the second threshold to 0.01 to 0.1. 前記学習データに反映されていない原料に含まれる前記電子・電気機器部品屑の輪郭、色彩、前記認識枠に対する前記面積率、及び前記背景の少なくともいずれかの情報を、前記機械学習システムに学習させることを含む請求項1又は2に記載の電子・電気機器部品屑の組成解析方法。 Make the machine learning system learn at least one of the outline, color, area ratio with respect to the recognition frame, and background of the electronic/electrical device parts scrap contained in the raw material that is not reflected in the learning data. 3. The composition analysis method for electronic/electrical equipment parts scrap according to claim 1 or 2, comprising: 前記複数の部品種が、基板及びプラスチックを少なくとも含む請求項1~3のいずれか1項に記載の電子・電気機器部品屑の組成解析方法。 4. The method for analyzing the composition of electronic/electrical device scraps according to claim 1, wherein the plurality of component types include at least substrates and plastics. 請求項1~のいずれか1項に記載の組成解析結果に基づいて、前記複数の部品種の中から特定の部品種を選別する選別工程を含むことを特徴とする電子・電気機器部品屑の処理方法。 Based on the composition analysis result according to any one of claims 1 to 4 , electronic and electrical equipment parts scrap characterized by including a sorting step of selecting a specific part type from among the plurality of parts types How to handle. 複数の部品種を含む複数の電子・電気機器部品屑を含む原料を撮像した撮像画像の中から、機械学習システムを利用した画像認識処理を用いて、前記電子・電気機器部品屑を抽出し、組成解析を行う電子・電気機器部品屑の組成解析装置であって、
設定された確信度に基づいて抽出された前記電子・電気機器部品屑に対し、前記電子・電気機器部品屑及び前記電子・電気機器部品屑の周囲の背景の画像を含む認識枠を付与し、
記憶装置に記憶された前記認識枠に対する前記電子・電気機器部品屑の面積率の情報を少なくとも有する部品種面積率データに基づいて、前記複数の部品種毎に、前記認識枠が付された前記電子・電気機器部品屑の合計面積を推測し、
前記合計面積の推測結果と前記複数の部品種毎の単位面積当たりの想定重量とを乗算し、前記複数の部品種毎の前記電子・電気機器部品屑の重量比率をそれぞれ解析することにより、前記撮像画像内の前記電子・電気機器部品屑の組成解析を行い、
前記機械学習システムの学習に用いられる学習データに、組成解析対象とする原料の情報が反映されている場合は、前記機械学習システムの前記確信度を第1の閾値に設定し、組成解析対象とする原料の情報が前記学習データに反映されていない場合は、第1の閾値よりも低い第2の閾値に設定して前記電子・電気機器部品屑を抽出する処理装置
を備えることを特徴とする電子・電気機器部品屑の組成解析装置。
Using image recognition processing using a machine learning system from among captured images of raw materials containing a plurality of electronic/electrical equipment parts scraps including a plurality of component types, extracting the electronic/electrical equipment parts scraps, A composition analysis device for electronic and electrical equipment parts scrap for composition analysis,
Giving a recognition frame including an image of the electronic/electrical device parts and the background surrounding the electronic/electrical device parts to the electronic/electrical device parts scrap extracted based on the set certainty,
Based on the component type area ratio data having at least the information of the area ratio of the electronic/electrical device parts scrap to the recognition frame stored in the storage device, the recognition frame is attached to each of the plurality of component types. Estimate the total area of electronic and electrical equipment parts scrap,
By multiplying the estimation result of the total area by the assumed weight per unit area for each of the plurality of component types, and analyzing the weight ratio of the electronic/electrical device parts scrap for each of the plurality of component types, the Perform composition analysis of the electronic and electrical equipment parts scrap in the captured image,
When the learning data used for learning of the machine learning system reflects the information of the raw material to be subjected to composition analysis, the certainty of the machine learning system is set to the first threshold, and the composition analysis target A processing device for extracting the electronic/electrical equipment parts scrap by setting a second threshold value lower than the first threshold value when the raw material information is not reflected in the learning data. Composition analysis equipment for electronic and electrical equipment parts scraps.
複数の部品種を含む複数の電子・電気機器部品屑を撮像する撮像装置と、
撮像画像の中から、機械学習システムを利用した画像認識処理を用いて、前記電子・電気機器部品屑を抽出し、組成解析を行う電子・電気機器部品屑の組成解析装置であって、
設定された確信度に基づいて抽出された前記電子・電気機器部品屑に対し、前記電子・電気機器部品屑及び前記電子・電気機器部品屑の周囲の背景の画像を含む認識枠を付与し、
記憶装置に記憶された前記認識枠に対する前記電子・電気機器部品屑の面積率の情報を少なくとも有する部品種面積率データに基づいて、前記複数の部品種毎に、前記認識枠が付された前記電子・電気機器部品屑の合計面積を推測し、
前記合計面積の推測結果と前記複数の部品種毎の単位面積当たりの想定重量とを乗算し、前記複数の部品種毎の前記電子・電気機器部品屑の重量比率をそれぞれ解析することにより、前記撮像画像内の前記電子・電気機器部品屑の組成解析を行い、
前記機械学習システムの学習に用いられる学習データに、組成解析対象とする原料の情報が反映されている場合は、前記機械学習システムの前記確信度を第1の閾値に設定し、組成解析対象とする原料の情報が前記学習データに反映されていない場合は、第1の閾値よりも低い第2の閾値に設定して前記電子・電気機器部品屑を抽出する処理装置を備える前記組成解析装置と、
前記組成解析装置によって解析された組成解析結果に基づいて前記電子・電気機器部品屑から特定の部品屑を選別する選別機と
を備える電子・電気機器部品屑の処理装置。
an imaging device for imaging a plurality of electronic/electrical device component scraps including a plurality of component types;
A composition analysis apparatus for electronic/electrical equipment parts scraps that extracts the electronic/electrical equipment parts scraps from captured images using image recognition processing using a machine learning system and performs composition analysis,
Giving a recognition frame including an image of the electronic/electrical device parts and the background surrounding the electronic/electrical device parts to the electronic/electrical device parts scrap extracted based on the set certainty,
Based on the component type area ratio data having at least the information of the area ratio of the electronic/electrical device parts scrap to the recognition frame stored in the storage device, the recognition frame is attached to each of the plurality of component types. Estimate the total area of electronic and electrical equipment parts scrap,
By multiplying the estimation result of the total area by the assumed weight per unit area for each of the plurality of component types, and analyzing the weight ratio of the electronic/electrical device parts scrap for each of the plurality of component types, the Perform composition analysis of the electronic and electrical equipment parts scrap in the captured image,
When the learning data used for learning of the machine learning system reflects the information of the raw material to be subjected to composition analysis, the certainty of the machine learning system is set to the first threshold, and the composition analysis target When the information of the raw material to be used is not reflected in the learning data, the composition analysis device equipped with a processing device that extracts the electronic / electrical equipment parts scrap by setting a second threshold lower than the first threshold ,
A processing apparatus for electronic/electrical equipment parts scraps, comprising: a sorter for sorting out specific parts scraps from the electronic/electrical equipment parts scraps based on the composition analysis result analyzed by the composition analysis device.
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