JP7306797B2 - Electronic component holding device - Google Patents

Description

The present invention relates to a holding device for holding an electronic component with lead wires.

Among electronic components, there is a so-called “lead component” in which lead wires are connected to electrodes of an electronic component body. Such an electronic component is fixed to an electronic board by inserting lead wires into through holes provided in the electronic board and soldering them from the back surface of the electronic board. 2. Description of the Related Art Conventionally, there has been known an apparatus for automatically mounting electronic components on an electronic substrate by inserting lead wires into through holes of the electronic substrate.

Patent Document 1 discloses an electronic component assembling apparatus. This device includes a gripping claw that grips a terminal (lead wire) of an electronic component, a contact member that moves forward and backward with respect to the electronic component gripped by the gripping claw, and a contact member that moves and is gripped by the gripping claw. and an electronic component rocking prevention means for preventing rocking of the electronic component by bringing it into contact with the electronic component.

Patent Literature 2 discloses an electronic component insertion device. This device includes a component gripper that holds the body of the electronic component and a lead gripper that holds the lead wire of the electronic component held by the component gripper.

JP-A-2003-179394 JP 2017-216347 A

However, the electronic component assembling apparatus of Patent Document 1 has a configuration in which the lead wires of the electronic component are gripped by the gripping claws. For this reason, the posture of the gripped electronic component tends to become unstable. In addition, interference between other components already mounted on the board and the gripping claws is likely to occur, limiting the scope of application.

In addition, the electronic component insertion device of Patent Document 2 is configured such that a main body of an electronic component is held by a gripper on one arm of a dual-arm robot, and a lead is held by a gripper on the other arm. Coordination of both grippers to hold the electronic component complicates configuration and control.

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus capable of reliably holding an electronic component with lead wires with a simple structure.

To achieve the above object, an electronic component holding device according to one aspect of the present invention is a holding device for an electronic component with lead wires, comprising: a base; and a guide portion for supporting the lead wire of the electronic component held by the holding portion, wherein the holding portion extends the main body portion of the electronic component along the length of the lead wire supported by the guide portion. Hold at an angle to the direction.

According to the above configuration, the main body portion of the electronic component is held by the holding portion while being inclined with respect to the longitudinal direction of the lead wire supported by the guide portion. Since the point of contact between the guide portion and the lead wire (intermediate portion) serves as a fulcrum, the tip of the lead wire of the held electronic component is less likely to bend. This stabilizes the tip position of the lead wire. An electronic component can be stably held with a simple configuration.

The holding portion has a pair of gripping members configured to grip the body portion of the electronic component from both sides, and the contact surfaces of the gripping members contacting the side surfaces of the body portion of the electronic component are configured to grip the body portion of the electronic component. It may be inclined with respect to a plane perpendicular to the direction.

According to the above configuration, the holding section has a pair of gripping members configured to grip the main body of the electronic component from both sides, and the contact surfaces of the gripping members contacting the side surfaces of the main body of the electronic component are Since it is inclined with respect to a plane perpendicular to the gripping direction, force is applied laterally to the lead wire supported by the guide portion simply by driving the pair of gripping members in the gripping direction. Thereby, the body portion of the electronic component is held in a state inclined with respect to the longitudinal direction of the lead wire supported by the guide portion.

The guide portion may have a groove provided so as to fit the lead wire of the electronic component.

According to the above configuration, since the lead wire of the electronic component is fitted in the groove provided in the guide portion, the point of contact (fulcrum) between the guide portion and the intermediate portion of the lead wire is less likely to shift, and the leading end position of the lead wire is reduced. stabilizes.

The guide portion may be integrally formed at one end of the pair of gripping members.

According to the above configuration, since the guide portion is formed integrally with one end of the pair of gripping members, it is possible to stably hold the electronic component with a simple configuration.

The electronic component holding device may further comprise moving means for moving the base provided with the holding portion relative to a substrate provided with through holes into which the lead wires of the electronic component are inserted. good.

According to the above configuration, the lead wire of the electronic component can be inserted into the through hole provided in the substrate by relatively moving the base provided with the holding portion by the moving means with respect to the substrate. .

The moving means may be a robot arm movable with respect to the base.

According to the above configuration, the work of mounting the electronic component onto the substrate can be realized by the robot.

ADVANTAGE OF THE INVENTION This invention has the structure demonstrated above, and can hold|maintain the electronic component with a lead wire reliably with a simple structure.

FIG. 1 is a side view showing an electronic component holding device according to one embodiment of the present invention. 2 is a cross-sectional view of the electronic component holding device of FIG. 1. FIG. FIG. 3 is a perspective view showing an example of the operation of the electronic component holding device. FIG. 4 is a perspective view showing another example of the operation of the electronic component holding device. FIG. 5 is a front view showing an example of a dual-arm robot that constitutes the electronic component holding device. 6 is a perspective view showing an example of the configuration of the left and right arms of the dual-arm robot of FIG. 5. FIG.

Preferred embodiments are described below with reference to the drawings. In the following description, the same reference numerals are given to the same or corresponding elements throughout all the drawings, and duplicate descriptions thereof will be omitted. Also, the drawings schematically show each component for easy understanding.

FIG. 1 is a side view showing an electronic component holding device 10 according to one embodiment of the present invention. As shown in FIG. 1, the electronic component holding device 10 is a holding device for an electronic component 40 with lead wires. An electronic component with lead wires (hereinafter, also simply referred to as an “electronic component”) 40 is a radial lead type electronic component that includes a body portion 41 and lead wires 42 that are connected to the body portion 41 in the radial direction. Here, the electronic component 40 is an aluminum electrolytic capacitor, and two lead wires 42 are connected to a body portion 41 .

The electronic component holding device 10 includes a base portion 20 , a holding portion 21 provided on the base portion 20 , a guide portion 22 provided on the holding portion 21 , and a control device 14 .

The base portion 20 extends in the Y-axis direction and includes an actuator (not shown) for driving the holding portion 21 therein.

Holding portion 21 is configured to hold body portion 41 of electronic component 40 . The holding portion 21 has a pair of gripping members 23 configured to grip the body portion 41 of the electronic component 40 from both sides. The pair of gripping members 23 are driven by the actuator of the base 20 so as to approach or separate from each other in the Y-axis direction (hereinafter also referred to as "gripping direction"). The gripping member 23 has a contact surface 23 a that contacts the upper side surface of the body portion 41 of the electronic component 40 and a contact surface 23 b that contacts the lower side surface of the body portion 41 of the electronic component 40 . All of the four contact surfaces 23a and 23b are inclined with respect to a plane (XZ plane) perpendicular to the gripping direction (Y-axis direction) of the gripping member 23. As shown in FIG. FIG. 2A is a cross-sectional view of the holding portion 21 (pair of gripping members 23) of FIG. 1 taken along line AA. As shown in FIG. 2A, the body portion 41 of the electronic component 40 has a substantially cylindrical shape, and both upper side surfaces of the body portion 41 are in contact with the contact surfaces 23a of the pair of gripping members 23. maintained in state.

Guide portion 22 supports lead wires 42 of electronic component 40 held by holding portion 21 . The guide portion 22 is formed integrally with one end of the pair of gripping members 23 (see FIG. 1). FIG. 2B is a cross-sectional view of the guide portion 22 of FIG. 1 taken along line BB. As shown in FIG. 2B, the guide portion 22 is provided with two grooves 22a so that the two lead wires 42 (middle portion) of the electronic component 40 are fitted.

The control device 14 controls the operation of the actuator that drives the holding portion 21 . In addition, in this embodiment, the electronic component holding device 10 further has a moving means 13 capable of moving the base portion 20 relative to the substrate (not shown). The moving means 13 is, for example, a robot arm configured to be movable with respect to a base, and the base 20 is attached to the tip of the robot arm. Controller 14 is configured to also control the movement of the robotic arm. As a result, the electronic component holding apparatus 10 of the present embodiment can mount the electronic component 40 on the substrate (not shown) by transferring the electronic component 40 while holding it and mounting it on the substrate (not shown).

Next, the operation of the electronic component holding device 10 will be described. Prior to the operation of the electronic component holding device 10, the lead wire 42 of each electronic component 40 is cut to a predetermined length by an electronic component supply device (not shown). Standby with the main body 41 up and the lead wires 42 down.

First, the control device 14 controls the operation of the base portion 20 (actuator) to keep the pair of gripping members 23 of the holding portion 21 separated from each other. Then, the control device 14 controls the operation of the moving means 13 to move the base portion 20 to the vicinity directly above the body portion 41 of the electronic component 40 so that the body portion 41 of the electronic component 40 is positioned between the pair of gripping members 23 . move up to

Next, as shown in FIG. 1, the control device 14 drives the pair of gripping members 23 of the holding portion 21 in the gripping direction (Y-axis direction) to bring them close to each other. As a result, the contact surfaces 23a and 23b of the pair of gripping members 23 contact both side surfaces of the body portion 41 of the electronic component 40 (see FIG. 2A). Since the abutment surfaces 23a and 23b are inclined with respect to the plane (XZ plane) perpendicular to the gripping direction (Y-axis direction), the guide portion 22 can be opened simply by driving the pair of gripping members 23 in the gripping direction. A force is applied laterally (Y-axis positive direction) to the lead wire 42 supported by . Thereby, the body portion 41 of the electronic component 40 is held in a state inclined with respect to the longitudinal direction of the lead wires 42 supported by the guide portion 22 . The point of contact between the guide portion 22 and the intermediate portion of the lead wire 42 serves as a fulcrum, making it difficult for the tip of the lead wire 42 of the held electronic component 40 to bend. As a result, the tip position of the lead wire 42 is stabilized. Further, in order to increase the stability of the tip position of the lead wire 42, as shown in FIG. 2B, the guide portion 22 is provided with a groove 22a. As a result, the contact point (fulcrum) between the guide portion 22 and the intermediate portion of the lead wire 42 is less likely to shift. The electronic component 40 can be stably held with a simple configuration.

As shown in FIG. 3, the electronic component holding device 10 of the present embodiment holds and transfers the electronic component 40, and mounts the electronic component 40 on the substrate 100 by mounting it on the mounting position of the substrate 100. FIG. The controller 14 controls the operation of the robot arm (13) to move the base 20 attached to the tip of the robot arm (13) relative to the substrate 100. FIG. The main body of the electronic component 40 is held by the pair of gripping members 23, and the two lead wires 42 are stably supported by the guide portion 22, so that the tips of the lead wires 42 can be inserted into the through holes 100a on the substrate 100. (Mounting position) is easy to position. In addition, since the lead wire 42 is only supported by the guide portion 22 instead of the pair of holding members 23, interference with other adjacent components (not shown) mounted on the substrate 100 during insertion is less likely to occur. Easier to insert.

In the electronic component holding device 10 of the present embodiment, the contact surfaces 23a and 23b of the gripping member 23 that contact the side surfaces of the body portion 41 of the electronic component 40 are inclined with respect to the plane perpendicular to the gripping direction. However, the contact surfaces 23a and 23b do not have to be inclined. For example, after the body portion 41 is held by the pair of gripping members 23 , the body portion 41 and/or the lead wire 42 may be tilted by driving the pair of gripping members 23 and/or the guide portion 22 . Thereby, the body portion 41 of the electronic component 40 is held in a state inclined with respect to the longitudinal direction of the lead wires 42 supported by the guide portion 22 .

Although the electronic component 40 of the present embodiment is an aluminum electrolytic capacitor, it is not limited to this as long as it is an electronic component with lead wires (radial lead type electronic component). 4A and 4B are diagrams showing another example of the operation of the electronic component holding device 10. FIG. As shown in FIG. 4, the electronic component 40 is a bypass capacitor. Even in such a case, the electronic component 40 can be reliably held in the same manner as in the present embodiment.

In addition, although the electronic component holding apparatus 10 of the present embodiment is composed of a single-arm robot, it may be composed of a double-arm robot. FIG. 5 is a front view showing an example of a dual-arm robot that constitutes the electronic component holding apparatus 10. As shown in FIG. A dual-arm robot (10) comprises a base 12 and a pair of robot arms (hereinafter sometimes simply referred to as "arms") 13, 13 configured to be movable with respect to the base 12. . Hereinafter, the direction in which the pair of arms (13, 13) are extended will be referred to as the lateral direction, the direction parallel to the axis of the base shaft will be referred to as the vertical direction, and the direction orthogonal to the lateral and vertical directions will be referred to as the front-rear direction. Various units of the robot such as the control device 14 are housed in the base 12 . Each arm ( 13 ) has an arm portion 15 and a wrist portion 17 . The arm (13) is configured as a horizontal articulated arm here, but may be configured as a vertical articulated arm. The left and right arms (13, 13) may have substantially the same structure. Also, the left and right arms (13, 13) can operate independently or in relation to each other. A mechanical interface 17a is set at the tip of the wrist portion 17, and is configured to be attachable with an end effector (not shown here).

FIG. 6 is a perspective view showing an example of the configuration of the left and right arms of the dual-arm robot (10) of FIG. An end effector 18 is attached to the tip (mechanical interface 17a) of each wrist portion 17 of the left and right arms (13, 13). Here, the left and right end effectors 18 have the same configuration. Each end effector 18 has a rotating mechanism, and eight holders 21 are attached at equal intervals (45 degrees) in the radial direction from the center of the rotating mechanism. The end effector 18 is configured such that the intervals between the lead wires 42 of the electronic components 40 can be adjusted to equal intervals while the electronic components 40 are held by the holding portions 21 and rotated by the rotating mechanism. Since the holding portion 21 has a simple structure and simple operation, a large number of holding portions 21 can be attached to each end effector 18 .

Although the electronic component holding apparatus 10 of the present embodiment is configured by a single-arm robot or a double-arm robot, the base portion 20 provided with the holding portion 21 is moved relative to the substrate 100 so that the holding portion 21 is moved. Any other device may be used as long as it has a configuration capable of positioning the electronic component 40 (lead wire 42) held by the substrate 100 with respect to the mounting position (through hole) of the substrate 100. FIG.

From the above description many modifications and other embodiments of the invention will be apparent to those skilled in the art. Accordingly, the above description is to be construed as illustrative only and is provided for the purpose of teaching those skilled in the art the best mode of carrying out the invention. Substantial details of construction and/or function may be changed without departing from the spirit of the invention.

INDUSTRIAL APPLICABILITY The present invention is useful as a food packaging device.

10 electronic component holding device 11 robot 12 base 13 arm (moving means)
17 wrist portion 18 end effector 20 base portion 21 holding portion 22 guide portion 22a guide groove 23 gripping members 23a, 23b contact surface 40 electronic component 41 body portion 42 lead wire 100 substrate 100a through hole

Claims (5)

A holding device for an electronic component with lead wires,
a base;
a holding portion that is provided on the base portion and holds a body portion of the electronic component;
a guide portion that supports the lead wire of the electronic component held by the holding portion;
with
the holding portion holds the main body portion of the electronic component in a state inclined with respect to the longitudinal direction of the lead wire supported by the guide portion;
The holding part has a pair of holding members configured to hold the main body of the electronic component from both sides,
The electronic component holding device, wherein the guide portion is formed integrally with the gripping member at one end of the pair of gripping members. 2. The electronic component holding device according to claim 1, wherein a contact surface of said gripping member that contacts a side surface of said body of said electronic component is inclined with respect to a plane perpendicular to the gripping direction. 3. The electronic component holding device according to claim 1, wherein said guide portion has a groove provided so as to fit a lead wire of said electronic component. 4. The apparatus according to any one of claims 1 to 3, further comprising moving means for moving said base provided with said holding portion relative to a substrate provided with through holes into which lead wires of said electronic component are inserted. The electronic component holding device according to the item. 5. The electronic component holding device according to claim 4, wherein said moving means is a robot arm movable with respect to the base.

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