JP7306809B2 - Carrier tape mount for chip-shaped electronic components and method for manufacturing chip-shaped electronic component carrier tape - Google Patents

Description

TECHNICAL FIELD The present invention relates to a carrier tape mount for chip-shaped electronic components and a method for manufacturing a carrier tape for chip-shaped electronic components. More specifically, manufacture of a carrier tape mount for chip-like electronic components and a carrier tape for chip-like electronic components that is less likely to cause chipping at the front end of a mold when forming a concave or perforated loading portion for loading chip-like electronic components. Regarding the method.

2. Description of the Related Art Conventionally, chip-shaped electronic components are automatically mounted on printed circuit boards in order to achieve automatic production of various electronic devices. In the step of automatically mounting chip-like electronic components, chip-like electronic components are supplied one by one to a printed wiring board using a chip component mounter or the like, and are automatically mounted on the printed wiring board. In this automatic mounting process, in order to facilitate handling of the chip-like electronic components, a tape-like packaging body is used in which individual chip-like electronic components are wrapped in a tape-like carrier.

In the taping package, concave or perforated loading portions (hereinafter sometimes simply referred to as “loading portions”) for loading chip-like electronic components are formed on a carrier tape mount at regular intervals, and the loading portions are After loading predetermined chip-shaped electronic components into the container, the container is sealed with a cover tape. The loading section is generally provided in a square shape and is sometimes called a press pocket or a cavity. The loading section is formed using a mold. (See Patent Documents 1 and 2, for example).

The taped package loaded with chip-shaped electronic components is conveyed in a reel shape, the cover tape is continuously peeled off by an automatic machine for mounting chip-shaped electronic components, and the chip-shaped electronic components are sequentially taken out from the carrier tape mount. automatically mounted at a predetermined position on the printed wiring board.

Carrier tape mounts are roughly classified into those made of plastic and those made of paper. Paper is desirable in terms of manufacturing cost, non-static property, ease of disposal after use, and the like. As a carrier tape mount made of paper, one made of single-layer or multi-layer paperboard is known (see, for example, Patent Documents 3 to 5).

In these paper-made carrier tape mounts, it is required that the shape of the loading portion is formed accurately. For this reason, it is required that the mold used to form the loading portion is less likely to wear out. When the mold wears, the charging part is likely to be defectively formed, so the mold needs to be polished or newly prepared, which causes problems such as remarkably deteriorating the operability and increasing the cost. In order to solve such problems, a carrier tape mount that suppresses mold wear has been disclosed (see, for example, Patent Document 6).

In forming the loading portion, it is required not only to suppress wear of the mold but also to prevent chipping of the mold. Here, chipping refers to a phenomenon in which the front end (cutting edge) of the mold is chipped finely. This phenomenon is not due to wear of the cutting edge, but is a phenomenon caused by a momentary impact during the forming process of the loading portion or a mechanical vibration directly transmitted to the cutting edge. When chipping occurs, there is a risk that fragments of the chipped mold will enter the electronic component as foreign matter. Also, unlike wear, a phenomenon that gradually progresses as the number of workpieces in the loading section increases, chipping is a phenomenon that may occur once a large impact is transmitted to the die. In order to prevent chipping, the toughness of the mold should be improved. There is a problem that the For this reason, toughness and wear resistance are normally balanced, but depending on the design of the mold, it may not be possible to satisfactorily prevent chipping.

Japanese Patent Application Laid-Open No. 2002-211507 JP-A-10-218281 Japanese Patent Application Laid-Open No. 09-188385 JP 2005-313946 A JP-A-2008-230651 JP 2006-143227 A

In view of these problems, the present invention provides a carrier tape mount for chip electronic components that is less likely to cause chipping at the front end of a mold when forming a recessed or perforated loading section for loading chip electronic components. is the subject.

Other objects and effects of the present invention will be easily understood by those skilled in the art by referring to the following description.

In order to solve the above-mentioned problems, the carrier tape mount for chip-like electronic components of the present invention is characterized by comprising a base paper containing pulp as a main component and not containing quartz having a maximum particle diameter of 30 μm or more in the base paper. do. By adopting such a configuration, it is possible to provide a carrier tape mount for chip-shaped electronic components that is less likely to cause chipping at the front end of the mold when forming the loading portion of the concave shape or the perforation for loading the chip-shaped electronic components. .

Further, in the present invention, the content ratio of quartz to the base paper may be less than 30 ppm by mass.

Further, the carrier tape mount for chip-shaped electronic components of the present invention may be used to form a concave loading portion for loading chip-shaped electronic components.

Further, the present invention is characterized in that a concave or perforated loading portion for loading the chip-shaped electronic component is formed on the carrier tape mount for the chip-shaped electronic component by using a mold. A method for manufacturing a carrier tape. Furthermore, in the present invention, a raw material slurry containing pulp as a main component is prepared with industrial water passed through a filter with an opening of 150 μm, and the slurry is subjected to a liquid cyclone type under conditions where the rejection rate is 0.2% or more. The method for producing the carrier tape for chip-like electronic components is characterized in that the carrier tape is passed through a cleaner of No. 1 and paper is made to obtain a base paper.

According to the carrier tape mount for chip-shaped electronic components of the present invention, it is possible to suppress chipping at the front end of the mold when forming a recessed or perforated loading portion for loading chip-shaped electronic components, and as a result, chipping of the chipped electronic component can be prevented. It is possible to prevent mold fragments from entering the electronic component as foreign matter.

1 is an electron microscope photograph of an ashed product of a carrier tape mount for chip-shaped electronic components obtained in Example 1. FIG. Within the circle is quartz with the largest grain diameter identified by EDS analysis. 4 is an electron microscope photograph of an ashed product of the carrier tape mount for chip-shaped electronic components obtained in Comparative Example 1. FIG. Within the circle is quartz with the largest grain diameter identified by EDS analysis.

Next, the present invention will be described in detail with reference to embodiments, but the present invention should not be construed as being limited to these descriptions. Various modifications may be made to the embodiments as long as the effects of the present invention are achieved.

The carrier tape mount for chip-shaped electronic components of the present invention suppresses chipping of the mold during formation of the loading portion by eliminating quartz having a large particle size from the base paper as much as possible. In the present invention, quartz also includes fused quartz (quartz glass). Quartz is an inorganic substance with a relatively high hardness of 7 on the Mohs hardness scale. If the mold comes into contact with the quartz during the formation of the loading portion, a large impact is applied to the mold, resulting in chipping at the tip of the mold. As the diameter of the quartz present in the base paper increases, the chipping is more likely to occur. Therefore, in the present invention, the maximum particle diameter of quartz present in the base paper is set to less than 30 μm. Further, it is preferred that the maximum particle diameter of quartz present in the base paper is less than 25 μm, preferably less than 20 μm. Here, the maximum particle diameter refers to the maximum particle diameter. When quartz having a maximum particle diameter of 30 μm or more is contained, chipping tends to occur in the mold. Quartz having a maximum particle diameter of less than 30 μm is less likely to cause chipping, probably because even if it comes into contact with the mold, the impact on the tip of the mold is small or escapes easily. Titanium dioxide having a high Mohs hardness (rutile type: Mohs hardness 7 to 7.5, anatase type: Mohs hardness 5.5 to 6) is sometimes used as a filler for papermaking. If the thickness is 1 to 10 μm, the problem of chipping is less likely to occur. In addition, since talc (Mohs hardness 1) and calcium carbonate (Mohs hardness 3) have relatively low Mohs hardness, the problem of chipping is less likely to occur regardless of the particle size.

Here, the maximum particle diameter of quartz can be confirmed by the following procedure. First, a chip-shaped electronic component carrier tape mount (1 m ² ) was burned in an electric furnace at a temperature of 525° C. for about 3 hours to make ash, and then the ash was treated with 1N hydrochloric acid and filtered through a 0.45 μm filter. do. EDS (energy dispersive X-ray spectroscopy) analysis mapping was performed using a scanning electron microscope (JEOL JSM-IT300) to identify all quartz particles contained in the residue after filtration, and the photographed quartz Find the maximum major axis diameter of the particles. Therefore, "the maximum particle diameter of quartz present in the base paper is less than 30 µm" in the present invention is specified by confirming that quartz with a maximum particle diameter of 30 µm or more does not exist in 1 m ² of the base paper. Furthermore, "the maximum particle diameter of quartz present in the base paper is less than 30 µm" is specified by confirming that there is no quartz with a maximum particle diameter of 30 µm or more in at least 1 m ² or at least 10 m ² of the base paper. may be

In the carrier tape mount for chip-shaped electronic components of the present invention, it is preferable that the content ratio of quartz to the base paper is less than 30 ppm in mass ratio. Chipping can be further suppressed by setting the content ratio of quartz to less than 30 ppm by mass. If the content of quartz is 30 ppm or more, chipping may easily occur.

The carrier tape mount for chip-shaped electronic components of the present invention is made of a base paper containing pulp as a main component. The raw material pulp used for the base paper is not particularly limited, but wood pulp can be preferably used. As wood pulp, chemical pulp such as softwood bleached kraft pulp (NBKP), softwood unbleached kraft pulp (NUKP), hardwood bleached kraft pulp (LBKP), hardwood unbleached kraft pulp (LUKP), groundwood pulp (GP) and thermo Examples include mechanical pulp such as mechanical pulp (TMP) and waste paper pulp such as deinked pulp. One or more selected from these raw material pulps can be used. Among these, it is particularly preferable to use NBKP and LBKP alone or in combination. For example, a pulp slurry containing 80 to 100% by mass or 90 to 100% by mass of LBKP can be used. Although it is possible to employ waste paper pulp in the present invention, waste paper pulp often contains foreign matter, which may lead to an increase in the inclusion of quartz into the base paper. Therefore, in the process of manufacturing waste paper pulp, it is preferable to remove foreign matter with a cleaner or the like at a high level.

Wood chips, which are raw materials for such pulp, contain various foreign substances, and sand in particular is generally mixed. In many cases, sand contains quartz, so in order to prevent quartz from being included in the base paper or to reduce the quartz content, foreign matter such as sand should be removed at the wood chip stage. is preferred. For example, foreign matter such as sand can be removed by a chip washing machine such as a chip washer or a sieve-type foreign matter removing system such as a trommel. In addition, during the pulp manufacturing process, the main purpose of washing the pulp after cooking is to remove chemical solutions and lignin residues remaining in the pulp, but at the same time, it suppresses the inclusion of quartz by removing foreign substances such as sand. can do. For example, foreign matter in the pulp can be removed using a known washing machine such as a filter washing machine, a press washing machine, a diffuser washing machine, a sand separator, and the like. The same applies to the pulp bleaching step, and it is preferable to remove foreign matter as much as possible here. A known washing machine can also be used here, for example, a pressure diffuser, a diffusion washer, a drum washer, a press washing machine and the like can be used. By using a plurality of these, foreign matter including quartz such as sand can be removed to a high degree. These washers preferably use clean water and increase the amount of wash water in order to remove quartz to a higher degree.

The raw material pulp is made into a pulp slurry having an appropriate beating degree using a disintegrator and a beating machine. In the present invention, the CFS is preferably 300 ml to 800 ml in terms of Canadian standard freeness (JIS P 8121: 1995 pulp freeness test method). CFS is more preferably 350-650 ml, and still more preferably CSF 380-550 ml.

A pulp slurry adjusted to an appropriate beating degree is used as a raw material slurry, and paper is made by a paper machine to form a base paper for a carrier tape mount. A known paper machine can be used as the paper machine. That is, the paper can be made using a fourdrinier paper machine, a cylinder paper machine, a hybrid former, a gap former, or the like. The structure of the base paper may be a single layer or multiple layers of two or more layers, for example, three layers. In the case of forming a multi-layered paper having two or more layers, starch may be applied between the layers for the purpose of improving the interlaminar strength.

Papermaking additives such as fillers, paper strength agents, sizing agents, retention aids, coloring dyes, and coloring pigments may be appropriately added to the raw material slurry as long as they do not impair the intended effects of the present invention. In addition, a surface strength agent can be applied to the surface of the base paper, if necessary. The method of coating the base paper is not limited, and coating can be performed using a coating machine such as a two-roll size press, a gate roll size press, and a metering size press. Among these, it is preferable to use a two-roll size press from the viewpoint of production efficiency, processability, improvement of surface strength, and improvement of paper layer strength. The coating amount of the surface paper strength enhancer is in the range of 0.5 to 5 g/m ² , preferably 1 to 3.5 g/m ² in terms of solid content per both sides of the base paper.

As for the path of contamination of quartz into the base paper, there are other conceivable sources other than the above-mentioned foreign substances mixed into chips and pulp, such as additives for papermaking. The papermaking additive preferably does not contain quartz. In particular, talc and calcium carbonate, which are used as fillers, have a relatively low Mohs hardness and little effect on chipping, but they may contain quartz as an impurity, so they should be used with caution. Therefore, in the present invention, the base paper preferably contains no filler. When the base paper contains no filler, that is, when no filler is added to the raw material slurry, the raw material slurry can be passed through a dust remover such as a liquid cyclone cleaner to remove the quartz. Removing inorganic components (those having a higher specific gravity than pulp) in the raw material slurry is effective in removing quartz having a relatively large particle size. Therefore, in the method of manufacturing the carrier tape for chip-shaped electronic components of the present invention, it is preferable to remove quartz having a large particle size from the raw material slurry by using a dust remover such as a liquid cyclone cleaner. It is preferable to remove foreign matter by increasing the reject rate of the cleaner (for example, 0.2% or more, further 0.2 to 0.5%, 0.2 to 0.6%, etc.).

In addition, there is industrial water as another mixing route of quartz. A trace amount of quartz may be mixed in industrial water, and there is a possibility that quartz precipitated in industrial water tanks, pipes, etc. may be mixed. Therefore, it is preferable to clean the industrial water by using known washing machines such as sand separators and filters. When cleaning with a filter, it is preferable to use a filter with an opening of 150 μm or less, for example, an opening of 40 to 150 μm. In addition, it is of course desirable to use clean water instead of industrial water containing quartz in the washing of chips and pulp described above. However, considering the economic aspect, it is preferable to use industrial water from which foreign matter has been removed by a filter.

In the present invention, the dried base paper may be smoothed if necessary. The smoothing method is not particularly limited, and machine calendar, soft calendar, super calendar, etc. can be used.

The thickness of the base paper is preferably 50 to 1200 μm, more preferably 200 to 1000 μm, although it varies depending on the size of the chip-shaped electronic component to be loaded. Also, the basis weight is preferably 200 to 1200 g/m ² , more preferably 250 to 1100 g/m ² .

In the carrier tape mount for chip-shaped electronic components of the present invention, loading portions for loading chip-shaped electronic components are formed at regular intervals. It is used as a carrier tape for chip-shaped electronic parts. The loading portion may be either a bottomed recess formed by embossing or a through hole formed by punching. When a through-hole is used, a bottom tape is attached to one surface of the carrier tape mount to close one of the through-holes to form a loading portion.

The carrier tape mount for chip-shaped electronic components of the present invention is more likely to exhibit its effects when used to form a concave loading portion for loading chip-shaped electronic components. In other words, a method such as the embossing described above is conceivable for forming the concave loading portion, but unlike the case of forming a through hole, this method requires a large pressure on the die during punching. Become. When forming through-holes, the mold penetrates the base paper, so the pressure applied to the base paper at the time of penetration can be released relatively easily. is difficult to escape, and the pressure applied to the mold increases. Therefore, chipping caused by contact between the quartz and the mold is more likely to occur when a concave loading portion is formed than when a through hole is formed. According to the carrier tape mount for the mold, the problem of mold chipping can be suppressed even when a concave loading portion is formed.

EXAMPLES Next, the present invention will be described in more detail with reference to Examples, but the present invention is, of course, not limited to these. In addition, "parts" and "%" in the examples indicate "mass parts" and "mass%" in terms of solid content, respectively, unless otherwise specified.

<Example 1>
After washing with a filter washer, a pulp slurry consisting of 100 parts of LBKP adjusted to 430 ml of Canadian Standard Freeness (CSF) was added with 0.5 parts of aluminum sulfate and cationic starch (trade name: Neotac #110M / Nihon Shokuhin Kako Co., Ltd.) and 0.4 part of a rosin emulsion sizing agent (trade name: CC-1404/manufactured by Seiko PMC Co., Ltd.) were added, and industrial water was added to obtain a raw material slurry. The obtained raw material slurry is passed through a liquid cyclone type cleaner under the condition that the rejection rate is 0.3%, and a three-layer wet paper consisting of a surface layer, an intermediate layer and a back layer is made by a cylinder paper machine to make paper. Then, the base paper was obtained. Thereafter, a 4% sizing solution of carboxyl group-modified polyvinyl alcohol (Gohsenex T-350/manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) was applied to both sides of the base paper by a two-roll size press so as to be 3 g/m ² on both sides. After drying with a drier, the desired carrier tape mount for chip-shaped electronic components was obtained. The basis weight of each layer was 80 g/m ² for the surface layer, 240 g/m ² for the middle layer, and 80 g/m ² for the back layer. The basis weight of the entire carrier tape mount was 403 g/m ² and the thickness was 411 μm. The industrial water used for preparing the raw material slurry was passed through a filter with an opening of 100 μm to remove foreign matters.

<Example 2>
A carrier tape mount for chip-like electronic components was obtained in the same manner as in Example 1, except that the conditions were changed so that the rejection rate of the liquid cyclone cleaner was 0.5%.

<Example 3>
A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 2, except that industrial water used for preparing the raw material slurry was passed through a filter with an opening of 50 μm to remove foreign matter.

<Comparative Example 1>
Except that the conditions were changed so that the rejection rate of the liquid cyclone type cleaner was 0.1%, and the industrial water used for preparing the raw material slurry was passed through a filter with an opening of 200 μm to remove foreign matter. A carrier tape mount for chip-shaped electronic components was obtained in the same manner as in Example 1.

Table 1 shows the production conditions and evaluation results of the carrier tape mounts for chip-shaped electronic components obtained in each of the examples and comparative examples. In addition, evaluation of Table 1 was performed by the following method. In addition, the higher the rejection rate of cleaners, the greater the amount of foreign matter discharged to the outside of the system. For filters that pass industrial water, the smaller the aperture, the higher the foreign matter removal rate. means.

<Ashing of carrier tape mount for chip-shaped electronic components>
According to the method of JIS P 8251:2003, a chip-shaped electronic component carrier tape mount (1 m×1 m) was burned in an electric furnace at a temperature of 525° C. for about 3 hours to obtain an ash.

<Maximum particle diameter of quartz>
The resulting ash was treated with 1 N hydrochloric acid and filtered through a 0.45 μm filter. Next, this ash was subjected to EDS analysis mapping using a scanning electron microscope (JSM-IT300 manufactured by JEOL Ltd.) to determine the maximum major axis diameter of particles in which only Si and O were detected.

<Content ratio of quartz>
Using an X-ray diffractometer (MiniFLEX600 manufactured by Rigaku Corporation), the amount of quartz in the ash was measured by the calibration curve method, and the mass ratio to the carrier tape mount for chip-shaped electronic components was determined.

<Chipping evaluation>
The carrier tape mount for chip-shaped electronic components is slit into a tape shape with a width of 8 mm, and in accordance with JIS C 0806-3, a press pocket type loading unit molding machine (TWA-6507: manufactured by Tokyo Weld Co., Ltd.) is used to reduce the width. 2,400,000 shots of a concave loading portion of 0.7 mm in the direction of flow×0.4 mm in the direction of flow were molded at intervals of 2 mm. After molding, the state of chipping (presence or absence of chipping) at the tip of the mold of the press pocket type loading unit molding machine was observed with an electron microscope and evaluated. The evaluation criteria are as follows.
(double-circle): There is almost no defect|loss, it is favorable and is a pass.
○: Defects are observed to some extent, but are good and pass.
x: A relatively large defect was observed, and the sample was disqualified.

As shown in Table 1, none of the carrier tape mounts for chip-shaped electronic components obtained in Examples 1 to 3 had a large defect at the front end of the mold, and passed the chipping evaluation. On the other hand, the carrier tape mount for chip-shaped electronic components obtained in Comparative Example 1 has a relatively large defect at the tip of the mold, and there is a possibility that fragments of the defected mold may be mixed in as foreign matter. It passed.

Electron micrographs of the ashed matter of the carrier tape mount for chip-shaped electronic components obtained in Example 1 and Comparative Example 1 are confirmed. FIG. 1 is an electron microscope photograph of the ashed material in Example 1. Quartz with a maximum particle diameter exceeding 30 μm was not observed. On the other hand, FIG. 2 is an electron microscope photograph of the ashed material in Comparative Example 1, and quartz having a maximum particle diameter exceeding 30 μm was confirmed. It was confirmed that the problem of chipping occurs when the base paper contains quartz having a large particle size as can be confirmed in FIG.

Claims (6)

A chip-like electronic device comprising a base paper containing pulp as a main component, wherein the content ratio of quartz to the base paper is less than 30 ppm in mass ratio, and the base paper does not contain quartz having a maximum particle diameter of 30 μm or more. Carrier tape mount for parts. 2. The carrier tape mount for chip-like electronic components according to claim 1, wherein the maximum particle diameter of quartz present in the base paper is 15 [mu]m or more and less than 30 [mu]m. 3. The carrier tape mount for chip-shaped electronic components according to claim 1 or 2 , which is used to form a concave loading portion for loading chip-shaped electronic components. 3. A carrier tape for chip-shaped electronic components according to claim 1 or 2 , wherein a concave or perforated loading portion for loading the chip-shaped electronic components is formed using a mold. A method for manufacturing a carrier tape. 3. The base paper according to claim 1 or 2, wherein the raw material slurry containing pulp as a main component is passed through a liquid cyclone type cleaner under the condition that the rejection rate is 0.2% or more, and paper is made to obtain the base paper. A method for manufacturing a carrier tape mount for chip-shaped electronic components. 6. The method for producing a carrier tape mount for chip-shaped electronic components according to claim 5 , wherein the raw material slurry is prepared with industrial water passed through a filter with a mesh size of 150 [mu]m.

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