JP7307570B2 - Processing method of ceramic chip parts - Google Patents

Description

The present invention relates to a method of processing ceramic chip components in the manufacturing process of multilayer ceramic capacitors and the like.

2. Description of the Related Art Conventionally, in the manufacturing process of multilayer ceramic capacitors, there has been known a technique for aligning internal electrodes of chip components in a predetermined direction before external electrodes are formed.

For example, in Patent Literature 1, a chip component is housed in a recessed pocket larger than the plane dimension of the chip component, and a magnet is moved from the outside of a non-magnetic pallet provided with the pocket to change the direction of the internal electrode. A method for orienting and aligning chip components in orthogonal alignment with the bottom surface of the pocket is described. In this alignment method, the chip components are aligned by applying a magnetic force to the lead electrodes of the internal electrodes exposed at the ends of the chip components in the width direction, and by attracting and rolling the chip components inside the pockets.

JP-A-2003-7574

In the method described in Patent Literature 1, in the aligning process, the chip component may ride on the edge of the pocket or fly out of the pocket. Chip components in such a posture may hinder the process after alignment, and have caused a decrease in work efficiency.

SUMMARY OF THE INVENTION In view of the circumstances as described above, an object of the present invention is to provide a method of processing ceramic chip components that can improve working efficiency after alignment processing.

In order to achieve the above object, a method for processing a ceramic chip component according to one aspect of the present invention moves a magnet along the surface of a jig having a plurality of recesses formed in a first direction, thereby moving an internal electrode. aligning a plurality of ceramic chip components each having an exposed side and positioned within each recess of the jig.
After alignment, the defective posture of protruding from the opening of the recess in the first direction more than the ceramic component accommodated in the recess and having the side surface facing in the first direction, among the ceramic chip components, among the plurality of ceramic chip components. of ceramic chip components are removed.

In order to achieve the above object, a method for processing a ceramic chip component according to one aspect of the present invention moves a magnet along the surface of a jig having a plurality of recesses formed in a first direction, thereby moving an internal electrode. aligning a plurality of ceramic chip components each having an exposed side and positioned within each recess of the jig.
After alignment, a defect protruding in the first direction from the opening of the recess, from among the plurality of ceramic chip components, the ceramic chip component being housed in the recess and having an aligned posture with the side surface facing in the first direction. The ceramic chip component in position is removed.
In the step of removing the ceramic chip component with the bad posture, an attachment member to which the ceramic chip component can be attached is arranged in the first direction so that the ceramic chip component with the bad posture is attached and aligned. The ceramic chip component with the bad posture is removed by opposing the jig with a distance at which the ceramic chip component with the bad posture does not adhere.

In addition , it is possible to automate the work of removing the ceramic chip component with the bad posture by using the adhering member, so that the working efficiency of the removing process can be improved.

In this case, the plurality of recesses are arranged on the jig in rows in a second direction orthogonal to the first direction,
In the step of removing the ceramic chip component, the attachment member may be moved relative to the jig along the second direction.
As a result, the ceramic chip components in the plurality of recesses can be continuously removed, and the work efficiency in the removing process can be further enhanced.

Moreover, the ceramic chip component adhered to the adhering member may be recovered after the step of removing the ceramic chip component.
As a result, the ceramic chip component with the defective posture removed from the jig can be collected and disposed of.

Specifically, the attachment member has an adhesive surface to which the ceramic chip component can be attached,
The adhesive surface may face the opening in the first direction to remove the ceramic chip component in the bad posture.

Alternatively, the attachment member has an adsorption surface capable of adsorbing the ceramic chip component,
The suction surface may face the opening in the first direction to remove the ceramic chip component in the bad posture.

In this case, the attraction surface may attract the ceramic chip component with the bad posture by magnetic force.

Further, after the alignment and before the step of removing the ceramic chip component, the ceramic chip component with the bad posture is detected,
The detected ceramic chip component in the bad posture may be removed from the jig.
As a result, it is possible to detect in advance a ceramic chip component with a poor posture and remove it as necessary, thereby improving work efficiency.

Further, after the step of removing the ceramic chip component, it may be confirmed whether or not the ceramic chip component with the bad posture has been removed from the jig.
As a result, it is possible to reliably remove the ceramic chip component having a bad posture from the jig, and therefore, it is possible to more reliably improve the working efficiency after the alignment process.

Furthermore, the recess may have a depth larger in the first direction than a dimension in the first direction of the ceramic chip component in the aligned posture.
As a result, the aligned ceramic chip components do not protrude from the opening of the recess, and only the ceramic chip components having an improper posture protrude from the opening of the recess. Therefore, the ceramic chip component protruding from the opening can be treated as a defective posture, which facilitates the work of selectively removing only the defective posture.

As described above, according to the present invention, it is possible to provide a method for processing ceramic chip components that can improve work efficiency after alignment processing.

1 is a perspective view of a laminated ceramic capacitor according to a first embodiment of the invention; FIG. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line AA' in FIG. 1; 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line BB' of FIG. 1; FIG. 4 is a flow chart showing a method for manufacturing the laminated ceramic capacitor. It is a perspective view which shows the manufacturing process of the said laminated ceramic capacitor. It is a perspective view which shows the manufacturing process of the said laminated ceramic capacitor. It is a cross-sectional view showing a manufacturing process of the laminated ceramic capacitor. 4 is a flow chart showing an alignment processing method related to the manufacturing process of the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a side view showing a process of aligning the laminated ceramic capacitors; FIG. 4 is a side view showing a process of aligning the laminated ceramic capacitors; FIG. 4 is a side view showing a process of aligning the laminated ceramic capacitors; FIG. 8 is a cross-sectional view showing the process of aligning the multilayer ceramic capacitors according to the second embodiment of the present invention; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 10 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitors according to the third embodiment of the present invention; FIG. 10 is a cross-sectional view showing a process of aligning laminated ceramic capacitors according to a modification of the third embodiment of the present invention; FIG. 10 is a cross-sectional view showing a process of aligning multilayer ceramic capacitors according to a fourth embodiment of the present invention; FIG. 14 is a cross-sectional view showing the process of aligning the multilayer ceramic capacitors according to the fifth embodiment of the present invention; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; 4 is a flow chart showing an example of a method for aligning the laminated ceramic capacitors. FIG. 11 is a perspective view showing a multilayer ceramic capacitor according to a sixth embodiment of the invention; 4 is a flow chart showing a method for manufacturing the laminated ceramic capacitor. It is a perspective view which shows the manufacturing process of the said laminated ceramic capacitor. FIG. 4 is a cross-sectional view showing a process of aligning the multilayer ceramic capacitor; 4 is a flow chart showing a method for aligning multilayer ceramic capacitors according to another embodiment of the present invention; 6 is a flow chart showing a method for aligning laminated ceramic capacitors according to still another embodiment of the present invention; 6 is a flow chart showing a method for aligning laminated ceramic capacitors according to still another embodiment of the present invention; FIG. 5 is a cross-sectional view showing a process of aligning multilayer ceramic capacitors according to still another embodiment of the present invention;

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Structure of Multilayer Ceramic Capacitor 10]
1 to 3 are diagrams showing a multilayer ceramic capacitor 10 according to one embodiment of the present invention. FIG. 1 is a perspective view of a laminated ceramic capacitor 10. FIG. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line AA' in FIG. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line BB' of FIG.
Note that the drawing shows an x-axis, a y-axis, and a z-axis that are orthogonal to each other as appropriate. These three axes are coordinate axes indicating the postures of the laminated ceramic capacitor 10 and the later-described ceramic laminated chip 116 .

A multilayer ceramic capacitor 10 includes a ceramic element body 11 and two external electrodes 14 . The ceramic body 11 typically has two end faces oriented in the x-axis direction, two side surfaces oriented in the y-axis direction, and two main surfaces oriented in the z-axis direction. The ridges connecting the surfaces of the ceramic body 11 may be rounded.

The external electrodes 14 cover the end surfaces of the ceramic body 11 and face each other in the x-axis direction with the ceramic body 11 interposed therebetween. The external electrodes 14 extend from the end surfaces of the ceramic body 11 to the main surface and side surfaces. The shape of the external electrodes 14 is not limited to that shown in FIG.

The external electrode 14 is made of a good electrical conductor. Good electrical conductors forming the external electrodes 14 include, for example, copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). A metal or alloy as a main component can be mentioned.

The ceramic body 11 has a ceramic laminate (laminate) 16 and side margin portions 17 . The laminated body 16 has two end surfaces 16a facing in the x-axis direction, two side surfaces 16b facing in the y-axis direction, and two main surfaces 16c facing in the z-axis direction. The side margin portions 17 cover two side surfaces 16b of the laminate 16, respectively.

The laminate 16 has a capacitance forming portion 18 and cover portions 19 provided on both sides of the capacitance forming portion 18 in the z-axis direction. The capacitance forming portion 18 has internal electrodes 12 and 13 stacked in the z-axis direction via ceramic layers.

Each of the first internal electrode 12 and the second internal electrode 13 is formed in a sheet shape extending along the xy plane. The first internal electrode 12 extends in the x-axis direction to one end surface 16 a and is connected to one external electrode 14 . The second internal electrode 13 extends in the x-axis direction to the other end surface 16 a and is connected to the other external electrode 14 . As a result, when a voltage is applied between the two external electrodes 14, a voltage is applied to the ceramic layer between the first internal electrode 12 and the second internal electrode 13, causing the capacitance forming portion 18 to respond to the voltage. A charge is stored.

The internal electrodes 12 and 13 are made of a good electrical conductor. Nickel (Ni) is typically used as a good electrical conductor forming the internal electrodes 12 and 13. In addition, copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), A metal or alloy containing gold (Au) or the like as a main component can be used.

In the ceramic body 11, dielectric ceramics with a high dielectric constant are used in order to increase the capacitance of each ceramic layer between the internal electrodes 12,13. Dielectric ceramics with a high dielectric constant include, for example, perovskite structure materials containing barium (Ba) and titanium (Ti), represented by barium titanate (BaTiO ₃ ).

Note that the ceramic layer includes strontium titanate (SrTiO ₃ ), calcium titanate (CaTiO ₃ ), magnesium titanate (MgTiO ₃ ), calcium zirconate (CaZrO ₃ ), calcium zirconate titanate (Ca( Zr, Ti)O ₃ ) system, barium zirconate (BaZrO ₃ ) system, titanium oxide (TiO ₂ ) system, or the like may be used.

The cover portion 19 and the side margin portion 17 are made of insulating ceramics, but may contain the dielectric ceramics used in the ceramic body 11, for example. This suppresses internal stress that may occur between the cover portion 19 and the capacitance forming portion 18 .

Note that the configuration of the laminated ceramic capacitor 10 according to this embodiment is not limited to the configurations shown in FIGS. For example, the number of internal electrodes 12 and 13 can be appropriately determined according to the size and performance required of the multilayer ceramic capacitor 10 .

[Manufacturing Method of Multilayer Ceramic Capacitor 10]
FIG. 4 is a flow chart showing the manufacturing method of the multilayer ceramic capacitor 10. As shown in FIG. 5 to 7 are diagrams schematically showing the manufacturing process of the multilayer ceramic capacitor 10. FIG. Hereinafter, a method for manufacturing the laminated ceramic capacitor 10 will be described along FIG. 4 with reference to FIGS. 5 to 7 as appropriate.

(Step S11: Production of ceramic multilayer chip)
In step S11, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming portion 18 and the third ceramic sheet 103 for forming the cover portion 19 are laminated and cut, An unfired ceramic laminated chip (laminated chip) 116 is produced.

Ceramic sheets 101, 102, and 103 shown in FIG. 5 are configured as unfired dielectric green sheets containing dielectric ceramics as a main component. An unfired first internal electrode 112 corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101 . Unfired second internal electrodes 113 corresponding to the second internal electrodes 13 are formed on the second ceramic sheet 102 . No internal electrodes are formed on the third ceramic sheet 103 .

Each of the internal electrodes 112 and 113 has a plurality of strip-shaped electrode patterns that cross the cutting line Lx parallel to the x-axis direction and extend along the cutting line Ly parallel to the y-axis direction. These internal electrodes 112 and 113 are formed by applying a conductive paste to the ceramic sheets 101 and 102 by a printing method or the like.

The ceramic sheets 101 and 102 are alternately laminated in the z-axis direction as shown in FIG. A laminate of ceramic sheets 101 and 102 corresponds to the capacitance forming portion 18 . The ceramic sheets 103 are laminated on the upper and lower surfaces of the laminate of the ceramic sheets 101 and 102 in the z-axis direction. A stack of ceramic sheets 103 corresponds to the cover portion 19 .
Note that the number of laminated ceramic sheets 101, 102, 103 and the like can be appropriately adjusted.

Subsequently, the laminate of the ceramic sheets 101, 102, 103 is crimped from the z-axis direction and cut along the cutting lines Lx, Ly. Thus, the laminated chip 116 shown in FIG. 6 is produced.

The laminated chip 116 has a side surface 116b facing the y-axis direction and an end surface 116a facing the x-axis direction, from which the unfired internal electrodes 112 and 113 are exposed.

(Step S12: alignment processing)
In step S12, the stacked chips 116 are aligned so that the side surfaces 116b face a certain direction (for example, the vertical direction). Furthermore, in this step, the stacked chips 116 with bad postures after alignment are removed, leaving only the stacked chips 116 with a fixed posture. A detailed description of this step will be given later.

(Step S13: Side Margin Formation)
In step S13, an unsintered side margin portion 117 is formed on the side surface 116b of the laminated chip 116 facing a certain direction.

In this step, as shown in FIG. 7A, for example, the side surface 116b of the stacked chip 116 facing vertically upward is supported by a supporting member C such as a tape. As a result, the other side surface 116b is opened.

Then, as shown in FIG. 7B, an unfired side margin portion 117 is formed on the opened side surface 116b. The side margin portion 117 is formed by, for example, attaching a ceramic green sheet to the side surface 116b, applying ceramic paste to the side surface 116b, or the like.

A side margin portion 117 can be similarly formed on the other side surface 116b. Thus, an unfired ceramic body 11 is produced.

(Step S14: Firing)
In step S14, the ceramic body 11 of the laminated ceramic capacitor 10 shown in FIGS. 1 to 3 is produced by firing the unfired ceramic body 11 obtained in step S13. The sintering temperature in step S14 can be determined based on the sintering temperature of the unsintered ceramic body 11 . Also, the firing can be performed, for example, in a reducing atmosphere or in a low oxygen partial pressure atmosphere.

(Step S15: External electrode formation)
In step S15, external electrodes 14 are formed on both ends in the x-axis direction of the ceramic body 11 obtained in step S14. As an example, first, a conductive paste is applied to both ends of the ceramic body 11 in the x-axis direction, and the conductive paste is baked to form a base film. Next, one or a plurality of plating films are formed by immersing the ceramic body 11 on which the base film is formed in a plating solution and performing electrolytic plating.
Thereby, the laminated ceramic capacitor 10 as shown in FIGS. 1 to 3 is formed.

Part of the processing in step S15 may be performed before step S14. For example, before step S14, an unfired electrode material is applied to both end surfaces of the unfired ceramic body 11 in the x-axis direction, and in step S14, the unfired ceramic body 11 is fired and at the same time the unfired electrodes are coated. The underlying layer of the external electrode 14 may be formed by baking the material. Alternatively, an unfired electrode material may be applied to the ceramic body 11 from which the binder has been removed, and these may be fired at the same time.

Details of the alignment processing in step S12 will be described below. Note that the laminated chip 116 is configured as the ceramic chip component of the present embodiment. The ceramic chip component of the present invention is defined as one in which flat internal electrodes and ceramic layers are alternately laminated in the z-axis direction.

[Method for Aligning Ceramic Laminated Chips]
FIG. 8 is a flow chart showing a method of aligning the stacked chips 116. As shown in FIG. 9 to 20 are cross-sectional views schematically showing the process of aligning the laminated chips 116. FIG.
It should be noted that X-axis, Y-axis, and Z-axis that are orthogonal to each other are shown as appropriate in the following figures. The X-axis direction and the Y-axis direction indicate the plane direction of the jig 100 described later, and the Z-axis direction indicates the thickness direction of the jig 100 . Furthermore, the following figures also show the x-axis, y-axis, and z-axis indicating the attitude of the layered chip 116 as necessary.

(Step S21: Placing the ceramic chip component on the jig)
In step S21, the laminated chip 116 is arranged in each recess 110 of the jig 100 having a plurality of recesses 110. As shown in FIG.

First, as shown in FIG. 9, a jig 100 having recesses 110 capable of accommodating stacked chips 116 is prepared. The jig 100 is made of, for example, a non-magnetic material such as metal or non-metal.

The jig 100 has an outer surface 100a and an upper surface 100b facing in the Z-axis direction, and is configured in a flat plate shape extending in the XY plane as a whole. Typically, the jig 100 is arranged so that the Z-axis direction faces the vertical direction. The outer surface 100a is configured as an outer bottom surface of the jig 100 facing downward along the Z axis.

The jig 100 has a plurality of recesses 110 each formed in the Z-axis direction. The plurality of recesses 110 are arranged in rows in the X-axis direction, for example, but may also be arranged in rows in the Y-axis direction. The number of recesses 110 in jig 100 is not limited to the illustrated example.

10 is a partially enlarged view of FIG. 9. FIG. As shown in FIG. 10, each recess 110 is configured as a pocket in which an opening 110a is formed in the upper surface 100b and each laminated chip 116 can be placed. The recess 110 is configured to have a size that allows the stacked chip 116 placed in the recess 110 to rotate.

The concave portion 110 has a depth dimension d1 in the Z-axis direction that is greater than the width dimension w of the laminated chip 116 in the y-axis direction. The width dimension w is the dimension of the largest portion of the dimensions along the y-axis direction of the laminated chip 116 . In this configuration, when the side surfaces 116b are aligned in the Z-axis direction, the entire laminated chip 116 is arranged below the upper surface 100b in the Z-axis direction, and the laminated chip 116 is completely accommodated in the recess 110. be.

The depth dimension d1 of the recess 110 is the dimension along the Z-axis direction from the top surface 100b surrounding the periphery of the recess 110 to the bottom surface of the recess 110 . The depth dimension d1 when the upper surface 100b is a curved surface is the above-described dimension at the highest position in the Z-axis direction of the upper surface 100b around the recess 110 .

As shown in FIG. 9, the laminated chips 116 are randomly thrown onto the jig 100 and arranged one by one in the recess 110 .

(Step S22: alignment)
In step S22, the laminated chips 116 are aligned by applying a magnetic field to the laminated chips 116. FIG.

As shown in FIG. 11, in this step, a plurality of unsintered laminated chips 116 in jig 100 are aligned using magnet 120 so that side surface 116b faces the Z-axis direction. For example, the magnet 120 is moved along the outer surface 100a of the jig 100 in a certain direction (for example, the X-axis direction). Thereby, a magnetic field acts on the internal electrodes 112 and 113 of each laminated chip 116, and the internal electrodes 112 and 113 are magnetized. Then, a magnetic force acts on the internal electrodes 112 and 113 , and the exposed side surface 116 b of the internal electrodes 112 and 113 receives a moment in the direction of rotation toward the magnet 120 . Note that the laminated chip 116 whose side surface 116b faces the Z-axis direction before the alignment is maintained as it is.

As shown in FIG. 12, after this step, many stacked chips 116 are accommodated in the recesses 110 and aligned with the side surfaces 116b facing in the Z-axis direction. This posture is called an "aligned posture". In the aligned posture, the x-axis direction, which is the longitudinal direction of the stacked chips 116, is parallel to the horizontal direction (XY plane), and the y-axis direction is parallel to the Z-axis direction.

Referring also to FIG. 10, the width dimension w of the laminated chip 116 in the aligned posture is the dimension of the laminated chip 116 in the Z-axis direction, which is smaller than the depth dimension d1 of the concave portion 110 . Therefore, in the present embodiment, the aligned posture is a posture in which the stacked chip 116 does not protrude from the opening 110a.

On the other hand, some of the stacked chips 116 may adopt a posture other than the aligned posture after this step. For example, the third stacked chip 116 from the left in FIG. 12 has an oblique posture in which the y-axis direction forms an acute angle with the XY plane. 12, the end surface 116a of the second stacked chip 116 from the right faces the Z-axis direction, and the x-axis direction, which is the longitudinal direction, is parallel to the Z-axis direction. Furthermore, although not shown in FIG. 12, there is a possibility that the entire laminated chip 116 rides on the upper surface 100b.

Such a posture other than the aligned posture of the stacked chips 116 is called a "bad posture". The stacked chip 116 in the bad posture assumes a posture protruding from the opening 110a in the Z-axis direction.

If there is a laminated chip 116 with a bad posture on the jig 100, the efficiency of transferring the laminated chip 116 from the jig 100 to the support member C in the side margin forming step of step S13 is lowered. Further, even if the defective laminated chip 116 is transferred to the support member C, it is difficult to collectively form the side margin portions 117 because the side surfaces 116b are not oriented in the same direction.

Therefore, in the present embodiment, the lamination chip 116 having a defective posture is removed by performing the following steps.

(Step S23: Detection of bad posture ceramic chip component)
In step S23, the laminated chip 116 in the bad posture is detected. In the present embodiment, the defective orientation of the stacked chip 116 is detected using the detection device D capable of detecting the defective orientation.

As shown in FIG. 13, the detection device D may include, for example, an imaging device D11 capable of imaging an image, and an information processing device D12 connected to the imaging device D11. The imaging device D11 captures an image of the recess 110 in which the layered chip 116 is arranged. The information processing device D12 analyzes the captured image and detects the laminated chip 116 in a posture protruding from the opening 110a.

The image pickup method of the image pickup device D11 is not limited, and for example, an image may be picked up from the Z-axis direction, or an image may be picked up from another direction. The image analysis method by the information processing device D12 is not limited, either. You may determine a bad posture based on.

Alternatively, as shown in FIG. 14, the detection device D may be configured as a sensor device D2 capable of detecting the laminated chip 116 in a bad posture based on irradiation and reception of electromagnetic waves. As an example, the sensor device D2 is a reflective laser sensor device D2 capable of emitting and receiving the laser light L. As shown in FIG.

For example, the laser sensor device D2 irradiates a laser beam L in a direction parallel to the XY plane from a position slightly spaced from the upper surface 100b of the jig 100 in the Z-axis direction. When the laminated chip 116 protrudes from the opening 110a in the Z-axis direction, the laser beam L is reflected by the projected portion of the laminated chip 116, and the laser sensor device D2 receives the reflected light. On the other hand, when the laminated chip 116 does not protrude beyond the opening 110a, the laser sensor device D2 does not receive the reflected light. As described above, the laser sensor device D2 can easily detect the laminated chip 116 in a bad posture based on whether reflected light is received or not.

The laser sensor device D2 is not limited to a reflective type, and may be a transmissive laser sensor device D2 having an irradiation section and a light receiving section. Alternatively, the sensor device D2 may be an infrared sensor or an ultrasonic sensor capable of detecting the laminated chip 116 in a bad posture.

The detection device D is configured to be able to detect the stacked chip 116 in the bad posture with respect to all the concave portions 110 in the jig 100 . In this case, the detection device D may be configured to be relatively movable with respect to the jig 100 . For example, jig 100 may be placed on a drive table that is movable in the XY plane. Alternatively, the detection device D may be configured to be movable by a drive device. Further, the detection device D has a plurality of imaging devices D11 or sensor devices D2 arranged at different positions, and is configured to be able to perform detection processing on all the concave portions 110 in the jig 100 by means of these devices. may

In this step, if a bad posture layered chip 116 is detected, the bad posture layered chip 116 can be removed in the next step S24.

(Step S24: Removal of badly oriented ceramic laminated chip)
In step S24, the laminated chip 116 in the bad posture is removed. In this embodiment, the laminated chip 116 is removed by placing an attachment member E to which the laminated chip 116 can be attached facing the opening 110a in the Z-axis direction.

As shown in FIG. 15, in this embodiment, the adhering member E is configured as an adhesive roller E1 having an adhesive surface E11, a roller body E12, and a drive section (not shown). The adhesive surface E11 is, for example, the surface of an adhesive layer containing an adhesive material. The roller main body E12 has, for example, a rotation axis in a direction perpendicular to the Z-axis direction (for example, the Y-axis direction). The drive section rotates the roller main body E12 around the rotation axis.

In this step, for example, as shown in FIG. 15, the adhesive surface E11 of the adhesive roller E1 faces the opening 110a with a distance d2 in the Z-axis direction. The distance d2 is the distance in the Z-axis direction between the most protruding portion of the upper surface 100b and the adhesive surface E11. The distance is such that it does not adhere to the member E. Specifically, the distance d2 may be greater than 0.0 mm and less than or equal to the projected amount assumed in the case of a bad posture, for example, 0.05 mm or more.

As shown in FIG. 15, the roller main body E12 is configured to be movable relative to the jig 100 in the X-axis direction. The roller main body E22 may be configured to be movable in the X-axis direction by a drive section. Alternatively, jig 100 may be placed on a drive table that is movable in the XY plane.

The adhesive roller E1 rotates, for example, around the Y axis and moves along the X axis while maintaining the distance d2 between the adhesive surface E11 and the opening 110a. Since the side surface 116b of the laminated chip 116 in the aligned posture is positioned below the opening 110a in the Z-axis direction, it does not come into contact with the adhesive surface E11. Therefore, the adhesive roller E1 does not adhere the laminated chip 116 in the aligned posture.

The adhesive roller E1 moves in the X-axis direction to above the opening 110a where the laminated chip 116 in the bad posture is detected. Since the laminated chip 116 in the bad posture protrudes in the Z-axis direction from the opening 110a, the laminated chip 116 contacts the adhesive surface E11, and the laminated chip 116 adheres to the adhesive surface E11.

Thereby, as shown in FIG. 16, the laminated chip 116 adhering to the adhesive surface E11 is removed from the jig 100. Then, as shown in FIG.

As shown in FIG. 17, the adhesive roller E1 moves along the X-axis direction while continuously rotating around the Y-axis. . As described above, in the present embodiment, the removing process can be continuously performed on the plurality of concave portions 110 on the jig 100, and the working efficiency of the removing process can be improved.

In addition, as the roller main body E12 moves while rotating, different portions of the adhesive surface E11 face each other for each concave portion 110. As shown in FIG. As a result, the removal process can be performed on the plurality of concave portions 110 while the adhesive surface E11 maintains its adhesiveness, and the work efficiency can be further improved.

(Step S25: Collecting badly oriented ceramic multilayer chips)
In step S25, the laminated chip 116 is recovered from the adhesive surface E11 to which the laminated chip 116 adheres.
In this embodiment, the laminated chip 116 attached to the adhesive surface E11 is attached to the adhesive tape F with higher adhesiveness. Thereby, the laminated chip 116 on the adhesive surface E11 can be recovered.

The adhesive tape F is fed and guided by a roller device G, for example, as shown in FIG. The roller device G includes a supply roller G1 for supplying the adhesive tape F, a guide roller G2 for guiding the supplied adhesive tape F, a take-up roller G3 for winding the adhesive tape F, and a roller (not shown) for rotating these rollers. a drive unit; The guide roller G2 faces the adhesive roller E1 with a gap equal to or less than the width dimension w of the laminated chip 116 in the y-axis direction.

As shown in FIG. 19, the adhesive roller E1 rotates around the rotation axis, and the laminated chip 116 faces the adhesive tape F on the roller device G on the adhesive surface E11. As a result, the adhesive tape F with higher adhesiveness adheres to the laminated chip 116 on the adhesive roller E1, and as shown in FIG. 20, the laminated chip 116 can be removed from the adhesive roller E1.

In this way, the laminated chip 116 with the bad posture is collected by the adhesive tape F. FIG. The laminated chip 116 adhering to the adhesive tape F can be easily discarded together with the adhesive tape F.

This step may be performed after the removal process of step S24 is completed, or may be performed for the adhesive roller E1 that is undergoing the removal process. By performing the recovery process on the adhesive roller E1 that has been subjected to the removal process, the work time for the entire alignment process can be shortened, and the efficiency of the alignment process can be improved.

(Step S26: Confirmation of removal of ceramic chip component with poor posture)
In step S26, it is confirmed whether or not the defective laminated chip 116 has been removed from the jig 100 after the removal process in step S24. In the present embodiment, as in step S<b>23 , the removal of the improperly oriented laminated chip 116 is confirmed by performing the process of detecting the improperly oriented laminated chip 116 .

The detection device D used in the detection process of step S23 can be used for confirmation in this step. The detection device D may be the imaging device D1 or the sensor device D2. The detection process by the detection device D can be performed in the same manner as the detection process in step S23.

Note that if a bad posture laminated chip 116 is detected in this step, the process returns to the removal step of step S24, and the detected bad posture laminated chip 116 is removed. As a result, the improperly oriented laminated chip 116 can be reliably removed from the jig 100 .

By the steps described above, the laminated chip 116 having a defective posture is removed from the jig 100 after alignment. As a result, it is possible to prevent the stacked chip 116 in the bad posture from affecting the side margin forming process in step S13. Therefore, it is possible to improve the work efficiency in the side margin forming process after alignment.

Further, in the present embodiment, the adhesive member E such as the adhesive roller E1 can be used to automatically remove the laminated chip 116 having a bad posture. As a result, the working time can be shortened, and the working efficiency of the removing process can be improved.

More specifically, in this embodiment, by bringing the adhering member E such as the adhesive roller E1 close to the opening 110a, the badly oriented laminated chip 116 protruding from the opening 110a in the Z-axis direction is removed. As a result, it becomes easy to selectively remove only the laminated chip 116 in the bad orientation without damaging the jig 100 or the laminated chip 116 in the aligned orientation. Therefore, it is possible to prevent a decrease in yield due to damage or erroneous removal of the stacked chips 116 in the aligned posture.

Furthermore, since the adhesive roller E<b>1 is configured to be movable along the arrangement direction of the recesses 110 , it is possible to continuously remove the plurality of recesses 110 . As a result, the working time of the removing process in step S24 can be further shortened, and the working efficiency can be improved.

Further, in the present embodiment, only the laminated chip 116 in the defective orientation within the jig 100 can be removed, and the laminated chip 116 in the aligned orientation in the same jig 100 can be used in subsequent processes. As a result, it is possible to prevent the discarding of all the laminated chips 116 in the jig 100 in which a defective posture is partially detected, thereby preventing a decrease in yield.

<Second embodiment>
In the removal step of step S24, as the adhesive member E, a plate-like adhesive plate E2 may be used instead of the adhesive roller E1.
In each of the following embodiments, mainly different parts from the above-described embodiment will be described, and the same reference numerals will be assigned to the same configurations, and description thereof will be omitted.

In step S24 of the present embodiment, the laminated chip 116 in the bad posture is removed.
As shown in FIG. 21, the adhesive plate E2 has an adhesive layer E20 having an adhesive surface E21, a plate body E22, and a driving section (not shown). The adhesive surface E21 is configured, for example, as the surface of the adhesive layer E20 containing an adhesive material. The plate body E22 is configured as a flat plate extending in the XY plane, for example.

The adhesive plate E2 is moved downward in the Z-axis direction by a drive unit (not shown). As a result, as shown in FIG. 22, the adhesive plate E2 is disposed with the adhesive surface E21 orthogonal to the Z-axis direction and separated from the opening 110a by a distance d2 in the Z-axis direction. As a result, the poorly oriented laminated chip 116 protruding from the opening 110a adheres to the adhesive surface E21.

The adhesive surface E<b>21 has a size that covers the openings 110 a of the plurality of recesses 110 , for example, the size that covers the openings 110 a of all the recesses 110 in the jig 100 . This makes it possible to collectively remove a plurality of stacked chips 116 in the jig 100 having bad postures.

Subsequently, as shown in FIG. 23, the adhesive plate E2 is moved upward in the Z-axis direction with the laminated chip 116 having the bad posture attached thereto. As a result, the defective laminated chip 116 is selectively removed from the jig 100 .

Furthermore, as shown in FIG. 24, in the recovery step of step S25, the scraper H scrapes the laminated chip 116 from the adhesive surface E21, thereby recovering the laminated chip 116 from the adhesive surface E21. The scraper H moves in the XY plane along the adhesive surface E21. As a result, as shown in FIG. 25, the scraper H separates the laminated chip 116 from the adhesive surface E21, and the laminated chip 116 is peeled off from the adhesive surface E21.

In this step, the container J may be placed facing the adhesive surface E21. As a result, the layered chip 116 peeled off from the adhesive surface E21 is housed in the container J and can be easily discarded.

According to this embodiment, it is possible to remove a plurality of stacked chips 116 with bad postures in a short period of time, and it is possible to improve the work efficiency in the removal process of step S24. In addition, the recovery step of step S25 can be performed with simple equipment, and cost reduction can be realized.

<Third Embodiment>
When using a plate-shaped adhesion device E in step S24, for example, a suction plate E3 having a suction surface may be used.

As shown in FIG. 26, the attraction plate E3 has a magnet E30 having an attraction surface E31, a plate body E32, and a drive section (not shown). The attracting surface E31 is configured as a surface of the magnet E30, and is configured so that the laminated chip 116 can be attached by the magnetic force of the magnet E30. The plate body E32 is configured as a flat plate extending in the XY plane, for example.

Like the adhesive plate E2, the suction plate E3 moves downward in the Z-axis direction, and is disposed with the suction surface E31 orthogonal to the Z-axis direction and separated from the opening 110a by a distance d3 in the Z-axis direction. The distance d3 is set to such a distance that the laminated chip 116 in the bad posture adheres to the attracting surface E31 by magnetic force and the laminated chip 116 in the aligned posture does not adhere to the attracting surface E31.

As a result, the defective laminated chip 116 selectively adheres to the suction surface E31 and is removed from the jig 100 . Therefore, the work efficiency in the removal process of step S24 can be improved.

Also in this embodiment, the scraper H can be used to collect the laminated chip 116 from the attraction surface E21, as in step S25 of the second embodiment. As a result, the recovery process can be performed with simple equipment, and cost reduction can be achieved.

As a modification of the attraction plate E3, as shown in FIG. 27, the magnet E30 is arranged inside the plate main body E32, and the magnetic force from the magnet E30 reaches the outside through the attraction surface E31. may be With such a configuration as well, it is possible to selectively attach the laminated chip 116 in the bad posture to the attraction surface E31.

<Fourth Embodiment>
The adsorption plate used in step S24 may be configured to adsorb the layered chip 116 by generating a negative pressure, for example.

For example, as shown in FIG. 28, the suction plate E4 has a suction surface E41 having a plurality of suction holes E40, a flat plate body E42 extending in the XY plane, and a suction mechanism (not shown). The suction mechanism is connected to, for example, a vacuum pump or the like, and is configured to be able to adjust the space E410 in the plate body E42 communicating with the suction holes E40 to a predetermined degree of vacuum. Thereby, the suction plate E4 can generate a negative pressure in the suction holes E40.

Like the adhesive plate E2, the suction plate E4 moves downward in the Z-axis direction, and is arranged with the suction surface E41 perpendicular to the Z-axis direction and separated from the opening 110a by a distance d4 in the Z-axis direction. The distance d4 is set to such a distance that the laminated chip 116 in the bad posture adheres to the suction surface E41 due to the negative pressure and the laminated chip 116 in the aligned posture does not adhere to the suction surface E41.

Also by this, the laminated chip 116 in the bad posture selectively adheres to the suction surface E41 and is removed from the jig 100. FIG. Therefore, the work efficiency in the removal process of step S24 can be improved.

Further, in the recovery process of step S25, the suction force of the suction surface E41 is reduced by canceling the suction by the suction mechanism, and the stacked chips 116 spaced apart from the suction surface E41 are collected. As a result, the collection process of step S25 can be easily performed in a short time, and the work efficiency in the alignment process can be improved.

Furthermore, as a modified example of this embodiment, a suction pad or a suction nozzle may be used instead of the suction plate E4. In this case as well, a negative pressure is generated on the attracting surface, and the badly positioned laminated chip 116 that has approached the attracting surface by a predetermined distance or less can be attracted to the attracting surface.

<Fifth Embodiment>
In step S24, a long adhesive tape having an adhesive surface may be used to remove the lamination chip 116 having a poor posture.

As shown in FIG. 29, the adhesive tape E5 as the adhering member E has an adhesive surface E51 and a base material (not shown) made of resin, paper, or the like. The adhesive surface E51 is configured as the surface of the adhesive layer formed on the base material. The adhesive tape E5 is supported by a roller device K.

As shown in FIG. 29, the roller device K includes a supply roller K1 that supplies the adhesive tape E5, a guide roller K2 that guides the supplied adhesive tape E5, and a winding roller K3 that winds the adhesive tape E5. and a drive unit (not shown) that rotates the rollers.

In step S24 of the present embodiment, the guide roller K2 places the adhesive surface E51 of the adhesive tape E5 in a state separated from the opening 110a by a distance d2 in the Z-axis direction. The distance d2 in this embodiment can be set in the same manner as the distance d2 in the first embodiment.

Then, as shown in FIG. 30, the adhesive tape E5 guided by the guide roller K2 moves relative to the jig 100 in the X-axis direction. In this embodiment, for example, the jig 100 is configured to be movable within the XY plane by a driving table or the like.

The take-up roller K3 winds up the adhesive tape E5 in synchronization with the relative movement of the adhesive tape E5. As a result, the adhesive tape E5 is supplied onto the guide roller K2, and a new portion of the adhesive tape E5 faces the jig 100 at all times.

As shown in FIG. 30, the adhesive tape E5 selectively attaches the stacked chip 116 with the bad posture while moving in the X-axis direction. As a result, the defective laminated chip 116 is removed from the jig 100, as shown in FIG.

In this embodiment, since the adhesive tape E5 is configured to be long, the replacement frequency of the adhesive tape E5 can be reduced, and the working efficiency can be improved. Further, a new portion of the adhesive surface E11 can be supplied to each concave portion 110 by the roller device K, and the removing process can be performed while maintaining the adhesiveness of the adhesive surface E11. Therefore, it is possible to continuously and reliably remove a plurality of stacked chips 116 having bad postures.

Further, by discarding the adhesive tape E5 to which the laminated chip 116 is adhered, it becomes possible to discard the laminated chip 116 in the bad posture. Therefore, as shown in FIG. 32, in the alignment process of the present embodiment, it is possible to omit the step of recovering the laminated chips 116 from the adhesive tape E5 in step S25. As a result, the number of alignment processing steps can be reduced, and the manufacturing efficiency of the laminated ceramic capacitor 10 can be improved.

<Sixth embodiment>
The ceramic chip component of the present invention is not limited to laminated chip 116 . For example, the present invention can be applied to a ceramic body in a three-terminal type multilayer ceramic capacitor.

[Structure of Multilayer Ceramic Capacitor]
FIG. 33 is a perspective view showing a multilayer ceramic capacitor 20 according to the sixth embodiment of the invention. The laminated ceramic capacitor 20 is configured as a three-terminal type laminated ceramic capacitor.

The laminated ceramic capacitor 20 is a three-terminal type laminated ceramic capacitor that includes a ceramic element body 21 , two end surface external electrodes 24 , and two side surface external electrodes 25 .

The ceramic body 21 has two end surfaces 21a facing in the X-axis direction, two side surfaces 21b facing in the Y-axis direction, and two main surfaces 21c facing in the Z-axis direction. The ceramic body 21 has a longitudinal side, for example, in the X-axis direction. Although the ridge connecting each surface of the ceramic body 21 is chamfered, it is not limited to this. In FIG. 33, the structure of the ceramic body 21 covered with the external electrodes 24 and 25 is indicated by broken lines.

The end surface external electrodes 24 are formed so as to face each other in the X-axis direction and cover the end surface 21 a of the ceramic body 21 . The side external electrodes 25 face each other in the Y-axis direction and are provided on the side surfaces 21b of the ceramic body 21, respectively. In the multilayer ceramic capacitor 20, for example, the end surface external electrodes 24 are configured as through electrodes, and the side surface external electrodes 25 are configured as ground electrodes.

The ceramic body 21 has a first internal electrode 22 connected to the end surface external electrode 24 and a second internal electrode 23 connected to the side surface external electrode 25 . The internal electrodes 22 and 23 are alternately laminated with a ceramic layer interposed therebetween in the Z-axis direction.

[Manufacturing method of multilayer ceramic capacitor]
FIG. 34 is a flow chart showing a method of manufacturing the laminated ceramic capacitor 20. As shown in FIG. 35 and 36 are diagrams schematically showing the manufacturing process of the laminated ceramic capacitor 20. FIG. A method of manufacturing the laminated ceramic capacitor 20 will be described below along FIG. 34 and with appropriate reference to FIGS.

(Step S31: Preparation of ceramic body)
In step S31, by laminating the first ceramic sheet 201 and the second ceramic sheet 202 on which the unfired internal electrodes 122 and 123 are formed and the third ceramic sheet 203 on which no internal electrodes are formed, A sintered ceramic body 121 is produced. Furthermore, the ceramic body 21 is produced by firing the unfired ceramic body 121 .

As shown in FIG. 35, the unfired first internal electrodes 122 are configured to extend over the entire length of the first ceramic sheet 201 in the x-axis direction. The unfired second internal electrode 123 is formed in the central portion of the second ceramic sheet 202, and is partly drawn out in the y-axis direction.

The first ceramic sheets 201 and the second ceramic sheets 202 are alternately laminated in the z-axis direction, and laminated bodies of the third ceramic sheets 203 are arranged on both sides in the z-axis direction. Thus, an unfired ceramic body 121 is produced.

Although FIG. 35 shows a perspective view corresponding to one ceramic element body 121, in reality, similar to the first embodiment, a large laminated sheet is produced and cut along a predetermined cutting line. The ceramic element body 121 is separated into individual pieces by being cut by pressing.

Then, the singulated unfired ceramic body 121 is fired. Thus, the ceramic body 21 shown in FIG. 33 is produced.

(Step S32: Alignment processing of ceramic bodies)
In step S32, the alignment processing of the ceramic body 21 is performed in the same manner as the alignment processing of the layered chips 116 in step S12 in the first embodiment. As a result, the side surfaces 21b are aligned in a fixed direction, and it becomes easy to form the side external electrodes 25 on the side surfaces 21b in a later step.

The process of aligning the ceramic bodies 21 of this embodiment includes steps S21 to S26 similar to those of the first embodiment, for example. That is, in step S21, the ceramic body 21 is arranged in each recess 110 of the jig 100 having a plurality of recesses 110. As shown in FIG. In step S22, the ceramic bodies 21 are aligned by applying a magnetic field to the ceramic bodies 21. As shown in FIG. In step S23, the ceramic body 21 in the bad posture is detected. In step S<b>24 , the ceramic body 21 in the bad posture is removed from the jig 100 . In step S25, the removed ceramic body 21 having a bad posture is recovered. In step S26, it is confirmed whether or not the ceramic body 21 in the bad posture has been removed from the jig 100 or not.

FIG. 36 is a schematic cross-sectional view showing an aspect of removing the ceramic element body 21 having a poor posture using the adhesive roller E1 as the adhesive member E in step S24 of the present embodiment. Also in the present embodiment, the posture of the ceramic body 21 accommodated in the recess 110 with the side surface 21b directed in the Z-axis direction is referred to as the "aligned posture". A posture other than the alignment posture, that is, a posture of the ceramic body 21 protruding in the Z-axis direction from the opening 110a is defined as a “bad posture”. The distance d2 between the adhesion member E and the opening 110a of the jig 100 can be set to be larger than 0.0 mm and equal to or less than the amount of protrusion assumed in the case of a bad posture, as in the first embodiment.

Through the steps described above, the ceramic body 21 having a bad posture, the side surface 21b of which does not face the Z-axis direction, or the ceramic body 21 which has run over the upper surface 100b of the jig 100, is removed from the jig 100. FIG.

(Step S33: Formation of Side External Electrodes)
In step S33, side surface external electrodes 25 are formed on the side surface 21b of the ceramic element body 21 after alignment processing. The side surface external electrodes 25 are formed, for example, by applying a conductive paste to the side surface 21b and baking the conductive paste. The application of the conductive paste is performed by, for example, a printing method. Baking of the conductive paste can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

In this step, for example, the ceramic bodies 21 aligned by the jig 100 are transferred to another jig, tape, or the like while maintaining the orientation after alignment. Here, if there is a ceramic body 21 with a poor posture, it is difficult to transfer the ceramic body 21 with a poor posture to a jig or tape configured on the premise of supporting the ceramic body 21 in the aligned posture. Work efficiency decreases. Moreover, even if the transfer is possible, it becomes difficult to apply the conductive paste to the designed position by the same processing as the ceramic body 21 in the aligned posture, which also leads to a decrease in production efficiency.

In this embodiment, since the ceramic element body 21 in the bad posture is removed from the jig 100 in advance, only the ceramic element body 21 in the aligned posture is transferred to the jig or tape, and the step of forming the side surface external electrode 25 is performed. can be done efficiently.

(Step S34: Formation of end surface external electrodes)
In step S34, end surface external electrodes 24 are formed on the end surface 21a of the ceramic body 21. As shown in FIG. The end surface external electrodes 24 are formed, for example, by applying a conductive paste to the end surface 21a and baking the conductive paste. The application of the conductive paste is performed by, for example, a dipping method, a printing method, or the like. Baking of the conductive paste can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

As described above, the multilayer ceramic capacitor 20 shown in FIG. 33 is manufactured.

In the present embodiment, in the process of aligning the ceramic element bodies 21, the ceramic element bodies 21 with poor postures are removed, and the working efficiency of the process of forming the side surface external electrodes in step S33 can be improved. Furthermore, by removing the ceramic element body 21 with the bad posture using the adhesion member E, the removing process can be performed automatically and efficiently.

Furthermore, the process described in the second to fifth embodiments may be applied to the alignment process in step S32 in this embodiment. This also makes it possible to remove the ceramic element body 21 having a bad posture, and to improve the working efficiency of the process of forming the side surface external electrodes 25 in step S34.

The "ceramic chip component" to be aligned is not limited to the fired ceramic body 21, and may be the unfired ceramic body 121. FIG. In this case, after the unfired ceramic body 121 is formed, the alignment process in step S33 is performed, and after the conductive paste for forming the external electrodes 24 and 25 is applied, the ceramic body 121 is fired and the external electrodes 24 are formed. , 25 are baked simultaneously. As a result of this, the unfired ceramic element bodies 121 are aligned with the side surfaces 21b directed in the Z-axis direction by the alignment processing in step S33. can increase

[Other embodiments]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

For example, as shown in FIG. 37, the step S24 of removing the badly oriented ceramic chip components may be performed after the alignment step of the step S22 without performing the step of detecting the badly oriented ceramic chip components of the step S23. . In this way as well, by comprehensively performing the removal process on the concave portions 110 in the jig 100 , it is possible to remove ceramic chip components in the jig 100 that have a poor posture.

In addition, as shown in FIG. 38, the step S26 for confirming the removal of the ceramic chip component may not be performed. Furthermore, as shown in FIG. 39, both the detection step of step S23 and the removal confirmation step of step S26 may be omitted. Furthermore, if possible, the detection step of step S23, the removal confirmation step of step S26, and the recovery step of step S25 may be omitted.

In the above embodiment, when the side surfaces of the ceramic chip component are arranged in the concave portion 110, the side surfaces do not protrude from the upper surface 100b, but the present invention is not limited to this. For example, as shown in FIG. 40, the recess 110 may have a depth d1 that is smaller in the Z-axis direction than the width w of the ceramic chip components in the aligned posture. The stacked chip 116 in the aligned posture protrudes from the opening 110a in the Z-axis direction by a protrusion amount d5, for example. In this case, the stacked chip 116 in the bad posture protrudes from the opening 110a more than the protrusion amount d5 in the aligned posture.

In the above configuration, the adhering member E used in the removing step is opposed to the opening 110a in the Z-axis direction with a distance that is larger than the protrusion amount d5 in the aligned posture and smaller than the protrusion amount assumed in the case of the bad posture. By doing so, the laminated chip 116 in the bad posture is attached. As a result, the attachment member E can selectively attach only the stacked chip 116 having a bad posture.

Also, the shape of the jig 100 is not limited to the illustrated example. good.

For example, in the above embodiments, ceramic chip components related to two-terminal type and three-terminal type laminated ceramic capacitors have been described, but the present invention is applicable to multi-terminal type laminated ceramic capacitors having a plurality of external electrodes formed on the side surfaces. It can also be applied to

DESCRIPTION OF SYMBOLS 10, 20... Laminated ceramic capacitor 11, 21... Ceramic element body (ceramic chip component)
21b... Side surface of ceramic body 12, 13, 112, 113, 122, 123... Internal electrode 116... Unfired laminated chip (ceramic chip component)
116b...Side surface of unfired laminated chip 100...Jig 110...Recess 110a...Opening 120...Magnet E...Adhering member

Claims (10)

By moving the magnet along the surface of a jig having a plurality of recesses formed in a first direction, a plurality of ceramic ceramics having side surfaces where internal electrodes are exposed and respectively arranged in the respective recesses of the jig. Align the chip parts,
After aligning, the ceramic chip component, among the plurality of ceramic chip components, protrudes from the opening of the recess in the first direction more than the ceramic chip component that is housed in the recess and is in an aligned posture with the side surface facing in the first direction. removing the ceramic chip component with a bad posture;
In the step of removing the ceramic chip component with the bad posture, the attachment member to which the ceramic chip component can be attached is attached in the first direction to the ceramic chip component with the bad posture, and removing the ceramic chip component in the defective posture by placing the ceramic chip component in the alignment posture against the jig with a distance that prevents the ceramic chip component from adhering to the jig. A method for processing a ceramic chip component according to claim 1 , comprising:
the plurality of recesses are arranged on the jig in rows in a second direction orthogonal to the first direction;
The method of processing a ceramic chip component, wherein the step of removing the ceramic chip component includes moving the attachment member relative to the jig along the second direction. A method for processing a ceramic chip component according to claim 1 or 2 ,
A method of processing a ceramic chip component, wherein the ceramic chip component adhering to the adhering member is recovered after the step of removing the ceramic chip component. A method for processing a ceramic chip component according to any one of claims 1 to 3 ,
The attachment member has an adhesive surface capable of adhering the ceramic chip component,
A method of processing a ceramic chip component, wherein the adhesive surface is opposed to the opening in the first direction and the ceramic chip component having the bad posture is removed. A method for processing a ceramic chip component according to any one of claims 1 to 3 ,
The attachment member has an adsorption surface capable of adsorbing the ceramic chip component,
A method of processing a ceramic chip component, wherein the suction surface is opposed to the opening in the first direction to remove the ceramic chip component in the bad posture. A method for processing a ceramic chip component according to claim 5 , comprising:
The method of processing a ceramic chip component, wherein the attracting surface attracts the ceramic chip component with the bad posture by magnetic force. A method for processing a ceramic chip component according to any one of claims 1 to 6 ,
detecting the ceramic chip component in the bad posture after the alignment and before the step of removing the ceramic chip component;
A method of processing a ceramic chip component, wherein the detected ceramic chip component in the bad posture is removed from the jig . A method for processing a ceramic chip component according to any one of claims 1 to 7 ,
After the step of removing the ceramic chip component, it is confirmed whether or not the ceramic chip component in the bad posture has been removed from the jig. A method for processing a ceramic chip component according to any one of claims 1 to 8 ,
The recess has a depth in the first direction larger than the dimension in the first direction of the ceramic chip component in the aligned posture. By moving the magnet along the surface of a jig having a plurality of recesses formed in a first direction, a plurality of ceramic ceramics having side surfaces where internal electrodes are exposed and respectively arranged in the respective recesses of the jig. Align the chip parts,
After aligning, the ceramic chip component, among the plurality of ceramic chip components, protrudes from the opening of the recess in the first direction more than the ceramic chip component that is housed in the recess and is in an aligned posture with the side surface facing in the first direction. removing the ceramic chip component with a bad posture;
The recess has a depth in the first direction larger than the dimension in the first direction of the ceramic chip component in the aligned posture.

Images