JP7310182B2 - electronic components - Google Patents

Description

The present invention relates to an electronic component having a case in which chip components such as laminated ceramic capacitors are accommodated.

As electronic components such as multilayer ceramic capacitors, in addition to ordinary chip components that are directly surface-mounted on a substrate or the like as a single unit, as shown in Patent Document 1, for example, metal caps (metal terminals) are attached to a plurality of chip components. is known.

It has been reported that electronic components with metal terminals have the effect of relieving the deformation stress that chip components receive from substrates and protecting chip components from impacts after mounting. It is used in the field where the quality and the like are required.

However, with conventional electronic components, it is not easy to connect a plurality of chip components to metal terminals at the same time.

JP-A-11-102837

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic component in which a plurality of chip components can be extremely easily connected to conductive terminals such as metal terminals.

In order to achieve the above object, the electronic component according to the first aspect of the present invention comprises:
a plurality of chip components each having a first terminal electrode and a second terminal electrode formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the first terminal electrode; and an opening edge electrode formed continuously along the opening edge surface of the inner electrode portion. and a side electrode portion formed along the outer surface of the case continuously from the opening edge electrode portion.

When assembling the electronic component of the present invention, a plurality of chip components are simply accommodated in the accommodating portion through the opening provided only on one side of the case, and the inner electrode portions of the individual conductive terminals are connected to the first portion of the chip component. It can be connected to a one-terminal electrode. Also, by connecting the inner connecting portions of the individual conductive terminals to the terminal electrodes of the chip components, the chip components can be easily connected in parallel or in series.

Furthermore, in the electronic component of the present invention, since the chip component is housed inside the housing recess of the case, the chip component is protected by the case and the reliability of the electronic component is improved. In addition, since the opening edge electrode portion and the side electrode portion of the individual conductive terminal are pulled out of the case, there is no need to provide a through hole or the like in the wall surface forming the accommodation recess of the case. Therefore, the housing recess of the case can also be used as a filling space for resin.

Also, the opening edge electrode portion or the side electrode portion exposed to the outside of the case can be used as the electrode surface for mounting. In particular, by using the side electrode portion as an electrode surface for mounting, it is possible to improve the fixing strength of the electronic component to the circuit board (external circuit). Further, by forming a gap between the side electrode portion and the outer surface of the side wall of the case, it becomes easy to suppress resonance of the electronic component.

In addition, since the opening edge electrode portion and the side electrode portion of the individual conductive terminal are pulled out of the case, by stacking the cases of a plurality of electronic components, the individual conductive terminals of the plurality of electronic components can be arranged. They can also be connected to each other. Furthermore, by arranging the cases of a plurality of electronic components side by side, individual conductive terminals of different cases can be connected to each other. That is, the degree of freedom in mounting electronic components is also improved. Also, the electronic component of the present invention is relatively compact.

In the electronic component of the present invention, the individual conductive terminals have anti-opening electrode portions formed continuously from the side electrode portions and along the anti-opening surface of the case located on the side opposite to the opening edge surface. , and may further have With this configuration, the anti-opening electrode portion of the individual conductive terminal can be used as a mounting surface on a circuit board or the like. Also, by arranging a plurality of the electronic components of the present invention in an overlapping manner, it is easy to connect the individual conductive terminals to each other.

The inner electrode portion may include a curved portion that is pressed toward the first terminal electrode by a spring force. By configuring in this way, the inner electrode portion and the first terminal electrode are connected in a press-contact state, and there is no need to connect them with a connecting member such as solder or conductive adhesive. Since the terminal and the electrode can be connected without using solder, it becomes possible to use copper, a copper alloy, or the like as the terminal material, and the ESR (equivalent series resistance) can be reduced. In addition, since solder is not used, it is possible to reduce the risk of cracks occurring in the chip component due to differences in thermal expansion or the like.

A through hole may be formed along the width direction in the vicinity of the opening edge surface side of the inner electrode portion. By forming the through holes, when connecting the opening edge electrode portion or the side electrode portion to a circuit board or the like by soldering, the through holes can prevent the solder from rising toward the inner electrode portion. That is, so-called solder bridges can be effectively prevented.

An engaging piece protruding outward along the width direction may be formed in the vicinity of the opening edge surface side of the inner electrode portion, and the engaging convex portion with which the engaging piece engages may be formed in the It may be formed on the opening edge surface. By constructing in this way, by simply inserting the inner electrode portion of the individual conductive terminal into the inside of the case, the engaging piece engages with the engaging convex portion in a one-touch manner, positioning the terminal with respect to the case and ensuring firmness. Fixation can be easily performed.

The surface of the inner electrode portion may be subjected to solder adhesion prevention treatment. By configuring in this way, so-called solder bridges can be effectively prevented.

The accommodation recess may be provided with a partition wall for partitioning the adjacent chip components. Forming the partition wall facilitates mounting of the chip components and facilitates insulation between adjacent chip components.

In the electronic component of the present invention, the inner electrode is inserted along the inner wall of the housing recess of the case so as to connect the second terminal electrodes of the chip components adjacent to each other inside the housing recess. There may also be a common conductive terminal having portions. Such a configuration facilitates serial connection of the chip parts inside the case.

The common conductive terminal includes an opening edge electrode portion formed along the opening edge surface continuously to the inner electrode portion, and an opening edge electrode portion formed continuously along the outer side surface of the case. A side electrode portion may be further provided. Such a configuration facilitates connection of the common conductive terminal to a circuit board or the like.

Moreover, by connecting the common conductive terminal to a circuit board or the like, the mounting strength between the electronic component and the circuit board can be improved, and resonance can be prevented. Also, when the mounted common conductive terminal is connected to an external circuit pattern, two parallel capacitor circuits can be configured. On the other hand, when the mounted common conductive terminal is not connected to an external circuit pattern (in the case of a floating pattern), two series capacitor circuits can be configured.

The electronic component of the present invention may further comprise a non-opening side electrode section formed continuously with the side electrode section and along the non-opening surface of the case located on the side opposite to the opening edge surface. good. It is also possible to use the electrode portion on the side opposite to the opening as an electrode surface for mounting.

The inner electrode portion may include a curved portion that is pressed toward the second terminal electrode by a spring force. This facilitates connection between the common conductive terminal and the second terminal electrode without using solder or the like.

The accommodating recess may be provided with a partition wall for partitioning the adjacent chip components, and the partition wall may be formed with a communication groove for connecting the inner electrode portion of the common conductive terminal. may The common conductive terminal enables the second terminal electrodes of adjacent chip components to be connected through the communication groove.

In order to achieve the above object, the electronic component according to the second aspect of the present invention comprises:
a plurality of chip components having terminal electrodes formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
a pair of discrete conductive terminals arranged opposite each other;
The individual conductive terminals are
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the terminal electrode; and an opening edge electrode portion formed continuously with the inner electrode portion along the opening edge surface. and a side electrode portion formed along the outer side surface of the case continuously from the opening edge electrode portion,
Between each of the pair of individual conductive terminals, a plurality of the chip components are arranged with their end surfaces facing each other.

The electronic component of the present invention has a pair of individual conductive terminals arranged to face each other, and a plurality of chip components are arranged with their end surfaces facing each other between each of the pair of individual conductive terminals. be. Therefore, it is possible to arrange a plurality of chip components in series inside the housing recess, and by connecting the terminal electrodes of these chip components to each other, an electronic component composed of a plurality of chip components connected in series can be configured. be able to.

Preferably, an intermediate connector is provided for connecting the terminal electrodes of the adjacent chip components. With such a configuration, the terminal electrodes of adjacent chip components can be easily connected to each other through the intermediate connector.

FIG. 1 is a schematic perspective view of an electronic component according to one embodiment of the present invention. FIG. 2A is a schematic perspective view of the electronic component showing the inside with the case shown in FIG. 1 made transparent. FIG. 2B is a schematic perspective view of the case shown in FIG. 1 viewed from a different angle. FIG. 3 is a cross-sectional view of the electronic component taken along line III--III shown in FIG. FIG. 4 is a cross-sectional view of the electronic component taken along line IV--IV shown in FIG. 5A is a front view showing an example of a mounted state of the electronic component shown in FIG. 1. FIG. 5B is a side view showing another example of the mounted state of the electronic component shown in FIG. 1. FIG. 5C is a front view showing still another example of the mounted state of the electronic component shown in FIG. 1. FIG. FIG. 6A is a side view showing an example of a mounting state of electronic components according to another embodiment of the present invention. FIG. 6B is a side view showing another example of the mounting state of the electronic component according to the embodiment shown in FIG. 6A. FIG. 6C is a side view showing still another example of the mounted state of the electronic component according to the embodiment shown in FIG. 6A. FIG. 7 is a schematic perspective view of an electronic component according to still another embodiment of the invention. 8A is a schematic perspective view of the electronic component showing the inside with the case shown in FIG. 7 made transparent. FIG. 8B is a schematic perspective view of the case shown in FIG. 7 viewed from a different angle. 8C is a schematic perspective view of the metal terminal shown in FIG. 7. FIG. 8D is a schematic perspective view of the metal terminal shown in FIG. 8C viewed from a different angle. 9 is a cross-sectional view of the electronic component taken along line IX-IX shown in FIG. 7. FIG. 10 is a cross-sectional view of the electronic component taken along line XX shown in FIG. 7. FIG. 11 is a partially transparent side view showing an example of a mounting state of the electronic component shown in FIG. 7. FIG. FIG. 12 is a schematic perspective view of an electronic component according to another embodiment of the invention. 13A is a schematic perspective view of the metal terminal shown in FIG. 12. FIG. 13B is a schematic perspective view of the metal terminal shown in FIG. 13A viewed from a different angle. FIG. 13C is a schematic perspective view of the metal terminal shown in FIG. 13A viewed from a different angle. FIG. 14 is a schematic perspective view of an electronic component according to another embodiment of the invention. 15A is a schematic perspective view of the electronic component showing the inside with the case shown in FIG. 14 made transparent. FIG. 15B is a schematic perspective view of the case shown in FIG. 14 viewed from a different angle. 16 is a partially transparent side view showing an example of a mounting state of the electronic component shown in FIG. 14. FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described based on embodiments shown in the drawings.

First Embodiment As shown in FIGS. 1 and 2A, an electronic component 10 according to a first embodiment of the present invention includes two capacitor chips (chip components) 20a and 20b and a pair of individual metal terminals 30 and 40. , a common metal terminal 50 and an insulating case 60 . It should be noted that the individual metal terminals 30 and 40 and the common metal terminal 50 may be configured by conductive terminals made of a conductive material other than metal.

As shown in FIG. 2A, the capacitor chips 20a and 20b each have a substantially rectangular parallelepiped shape and have substantially the same shape and size. As shown in FIG. 3, each of the capacitor chips 20a and 20b has an element body in which an internal electrode layer 26 and a dielectric layer 28 are laminated along the Y-axis direction. First and second terminal electrodes 22 and 24 are formed on the first and second end faces 21 and 23 facing each other in the stacking direction, and are connected to any one of the internal electrode layers 26 adjacent in the stacking direction. There is.

The material of dielectric layer 28 in capacitor chips 20a and 20b is not particularly limited, and is composed of a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. Although the thickness of each dielectric layer 28 is not particularly limited, it is generally 1 μm to several hundred μm. In this embodiment, the thickness of each dielectric layer 28 is preferably between 1.0 and 5.0 μm.

The conductive material contained in the internal electrode layers 26 is not particularly limited, but if the constituent material of the dielectric layers 28 has resistance to reduction, a relatively inexpensive base metal can be used. Ni or Ni alloys are preferred as the base metal. The Ni alloy is preferably an alloy of one or more elements selected from Mn, Cr, Co and Al and Ni, and the Ni content in the alloy is preferably 95% by weight or more. Incidentally, Ni or Ni alloys may contain various minor components such as P in an amount of about 0.1% by weight or less. Alternatively, the internal electrode layers 26 may be formed using a commercially available electrode paste. The thickness of the internal electrode layer 26 may be appropriately determined depending on the application.

The materials of the first and second terminal electrodes 22 and 24 are not particularly limited either, and copper, copper alloys, nickel, nickel alloys, etc. are usually used, but silver, silver-palladium alloys, etc. can also be used. Although the thickness of the terminal electrodes 22 and 24 is not particularly limited, it is usually about 10 to 50 μm. At least one metal film selected from Ni, Cu, Sn and the like may be formed on the surfaces of the first and second terminal electrodes 22 and 24 .

The shape and size of the capacitor chips 20a and 20b may be appropriately determined according to the purpose and application. The capacitor chips 20a and 20b are, for example, 1.0 to 6.5 mm long (X-axis dimension shown in FIG. 2A)×0.5-5.5 mm wide (Z-axis dimension shown in FIG. 2A)×thickness (X-axis dimension shown in FIG. 2A). Z-axis dimension shown) is about 0.3 to 3.5 mm. Each of the plurality of capacitor chips 20a and 20b may have different sizes and shapes. In the drawings, the X-axis, Y-axis and Z-axis are perpendicular to each other.

As shown in FIGS. 1 and 2B, in the present embodiment, the insulating case 60 is configured by a rectangular parallelepiped housing, and has an outer wall 61 surrounding a plurality of housing recesses 62a and 62b opening upward in the Z axis. and bottom wall 63 . The storage recesses 62 a and 62 b adjacent in the Y-axis direction are mostly partitioned by a partition wall 64 , but are communicated with each other by a communication groove 65 provided in the partition wall 64 .

The communication groove 65 is formed along one inner wall surface in the X-axis direction of each of the housing recesses 62a and 62b. Through the communication groove 65, the inner electrode portion 52 of the common metal terminal 50 is mounted inside the housing recesses 62a and 62b along the inner wall surfaces so as to straddle the housing recesses 62a and 62b.

In this embodiment, the width of the communication groove 65 in the X-axis direction is a width that allows the inner electrode portion 52 of the common metal terminal 50 to be inserted and fixed. Further, the depth of the connecting groove 65 in the Z-axis direction is approximately the same as the depth of the housing recesses 62a and 62b in the Z-axis direction. In this embodiment, the common metal terminal 50 is composed only of the inner electrode portion 52 that is inserted into the accommodating recesses 62a and 62b through the communication groove 65, and the inner electrode portion 52 is composed of a rectangular flat plate. As shown in FIG. 2A, the inner electrode portion 52 is in contact with and electrically connected to the second terminal electrodes 24, 24 of both capacitor chips 20a, 20b.

As shown in FIG. 2B, in this embodiment, the opening surface of each of the housing recesses 62a and 62b of the insulating case 60 is only the upper surface in the Z-axis direction, and the outer wall 61 and the bottom wall 63 of each of the housing recesses 62a and 62b. is not formed with any holes, notches, grooves, or openings communicating with the outside of the case 60 . An opening edge surface 66 is provided on the upper surface of the outer wall 61 in the Z-axis direction in the insulating case 60 along the opening surfaces of the housing recesses 62 a and 62 b of the insulating case 60 . In this embodiment, the opening edge surface 66 is flush with the upper surface of the partition wall 64 in the Z-axis direction, but may be different.

As shown in FIGS. 1 and 2A, the first individual metal terminal 30 has an inner electrode portion 32 inserted along the other inner wall in the X-axis direction of one housing recess 62 a of the insulating case 60 . As shown in FIG. 3, the inner electrode portion 32 is in contact with and electrically connected to the first terminal electrode 22 of one capacitor chip 20a in the Y-axis direction. An opening edge electrode portion 34 is formed along the opening edge surface 66 so as to be continuous with the inner electrode portion 32 .

A side electrode portion 36 is integrally formed with the opening edge electrode portion 34 along the outer surface (outer wall) of the outer wall 61 of the insulating case 60 so as to be continuous with the opening edge electrode portion 34 . In this embodiment, the side electrode portion 36 is formed so as to extend in the Z-axis direction along the outer side surface of the outer wall 61 . As shown in FIG. 4, the side electrode portion 36 need not be in contact with the outer wall surface of the outer wall 61, and may be arranged in parallel with the outer wall surface of the outer wall 61 with a predetermined gap. Further, the opening edge electrode portion 34 is preferably in contact with the opening edge surface 66 of the outer wall, but there may be some gap.

As shown in FIGS. 1 and 2A, the second individual metal terminal 40 has an inner electrode portion 42 inserted along the other inner wall in the X-axis direction of the other accommodating recess 62b of the insulating case 60. As shown in FIG. As shown in FIG. 3, the inner electrode portion 42 is in contact with and electrically connected to the first terminal electrode 22 of the other capacitor chip 20b in the Y-axis direction. An opening edge electrode portion 44 is formed along the opening edge surface 66 so as to be continuous with the inner electrode portion 42 .

A side electrode portion 46 is formed integrally with the opening edge electrode portion 44 along the outer surface of the outer wall 61 of the insulating case 60 so as to be continuous with the opening edge electrode portion 44 . In this embodiment, the side electrode portion 46 is formed to extend in the Z-axis direction along the outer side surface of the outer wall 61 .

Note that the side electrode portion 46 does not have to be in contact with the outer wall surface of the outer wall 61 like the side electrode portion 36, and may be arranged in parallel with the outer wall surface of the outer wall 61 with a predetermined gap. Further, the opening edge electrode portion 44 is preferably in contact with the opening edge surface 66 of the outer wall, but there may be some gap. The first individual metal terminal 30 and the second individual metal terminal 40 are attached to the insulating case 60 at a predetermined distance in the Y-axis direction (corresponding to the thickness of the partition wall 64 in the Y-axis direction) and are insulated. be.

In this embodiment, the lengths of the housing recesses 62a and 62b in the X-axis direction are such that the terminal electrodes 22 and 24 of the capacitor chips 20a and 20b are in a state where the terminals 30, 40 and 50 are attached to the insulating case 60. It is determined to be in pressure contact with the inner electrode portions 32 , 42 , 52 . An elastic sheet is interposed between the inner electrode portions 32, 42, 52 of the respective terminals 30, 40, 50 and the inner wall surfaces of the accommodating recesses 62a, 62b so that the deformation of the elastic sheet causes each capacitor chip to move. The terminal electrodes 22, 24 of 20a, 20b may be pressed against the inner electrode portions 32, 42, 52.

Further, the width of each of the housing recesses 62a and 62b in the Y-axis direction is determined so that the capacitor chips 20a and 20b can enter the respective housing recesses 62a and 62b. The depth of each of the housing recesses 62a and 62b in the Z-axis direction is such that when the capacitor chips 20a and 20b are housed inside the housing recesses 62a and 62b, the upper ends of the chips 20a and 20b in the Z-axis direction are open. It is determined so as not to protrude upward from the edge surface 66 in the Z-axis direction. However, the upper ends in the Z-axis direction of the chips 20a and 20b may protrude slightly upward in the Z-axis direction from the opening edge surface 66. FIG. The insulating case 60 is composed of an insulator such as ceramic, glass, or synthetic resin, and the insulator may be composed of a flame-retardant material.

In this embodiment, the capacitor chips 20a and 20b can be easily accommodated in the accommodation recesses 62a and 62b. By housing the capacitor chips 20a and 20b in the housing recesses 62a and 62b in this manner, the capacitor chips 20a and 20b can be effectively protected from impact and the like.

In this embodiment, as shown in FIG. 2A, the common metal terminal 50 connects the second terminal electrodes 24, 24 of the different capacitor chips 20a, 20b at positions facing the metal terminals 30, 40. FIG. The first discrete metal terminal 30 and the second discrete metal terminal 40 are connected to the first discrete metal terminals 22, 22 of different capacitor chips 20a, 20b, respectively. As a result, between the first individual metal terminal 30 and the second individual metal terminal 40, the capacitor chips 20a and 20b are connected in series.

The first individual metal terminal 30 and the second individual metal terminal 40 have the same configuration, and are each formed by bending a conductive plate piece (for example, a metal plate) into a substantially C shape. . Although the thickness of the metal plate is not particularly limited, it is preferably about 0.01 to 2.0 mm. The thickness of the metal plate forming the common metal terminal 50 is also approximately the same as that of the first individual metal terminal 30 and the second individual metal terminal 40 .

A method for manufacturing the electronic component 10 will be described below.

Each of the capacitor chips 20a and 20b is manufactured by a general manufacturing method for laminated ceramic capacitors.

In manufacturing the first individual metal terminal 30, first, a flat metal plate material is prepared. The material of the metal plate material is not particularly limited as long as it is a metal material having conductivity, and for example, iron, nickel, copper, silver, or an alloy containing these can be used. Next, by machining the metal plate material, an intermediate member having the shapes of the inner electrode portion 32, the opening edge electrode portion 34, and the side electrode portion 36 is obtained.

Next, the first individual metal terminal 30 is obtained by forming a metal film by plating on the surface of the intermediate member formed by machining. Materials used for plating are not particularly limited, but examples thereof include Ni, Sn, and Cu. In the manufacture of the first individual metal terminals 30, a plurality of the first individual metal terminals 30 may be formed in a state of being connected to each other from a strip-like continuous metal plate material. The manufacturing method of the second individual metal terminals 40 is also the same as that of the first individual metal terminals 30 .

In the method of manufacturing the common metal terminal 50, an intermediate member having the shape of the common metal terminal 50 is obtained by machining the aforementioned metal plate material, and a metal film is formed by plating on this intermediate member. Insulating case 60 can be manufactured, for example, by injection molding.

The first individual metal terminal 30 , the second individual metal terminal 40 and the common metal terminal 50 obtained as described above are attached to the insulating case 60 . The metal terminals 30 and 40 are formed by inserting the inner electrode portions 32 and 42 of the insulating case 60 along the inner wall surfaces formed on one side of the housing recesses 62a and 62b of the insulating case 60 in the X-axis direction. 60 can be installed. Further, the common metal terminal 50 can be attached to the insulating case 60 by inserting the inner electrode portion 52 along the communication groove 65 and along the inner wall surfaces of the housing recesses 62a and 62b.

Finally, the electronic component 10 shown in FIG. 1 can be manufactured simply by inserting the capacitor chips 20a and 20b into the respective housing recesses 62a and 62b from above the openings.

In the electronic component 10 according to the present embodiment, when the electronic component 10 is assembled, the plurality of capacitor chips 20a and 20b are housed inside the housing recesses 62a and 62b through the opening provided only on one side of the insulating case 60. only. Also, by attaching the inner connecting portion 52 of the common metal terminal 50 along the inner wall of the insulating case 60, the capacitor chips 20a and 20b can be easily connected in series.

It should be noted that parallel connection of the capacitor chips 20a and 20b can also be achieved by attaching the same individual metal terminals 30 and 40 to both inner wall surfaces of the housing recesses 62a and 62b in the X-axis direction without using the common metal terminal 50. be possible.

Furthermore, in the electronic component 10 of the present embodiment, the opening edge electrode portions 34 and 44 and the side electrode portions 36 and 46 of the individual metal terminals 30 and 40 are pulled out of the insulating case 60 . Therefore, it is not necessary to provide through holes or the like in the inner wall surfaces of the housing recesses 62 a and 62 b of the case 60 . Therefore, even if the housing recesses 62a and 62b of the case 60 housing the capacitor chips 20a and 20b are filled with molten resin, it is possible to effectively prevent the resin from protruding from the through holes or the like. That is, in the present embodiment, each of the accommodation recesses 62a and 62b can also be used as a resin filling space.

In the electronic component 10 of the present embodiment, as shown in FIGS. 5A and 5B, the side electrode portions 36 and 46 of the individual metal terminals 30 and 40 exposed to the outside of the insulating case 60 are replaced with electrodes for mounting. Can be used as a surface. In particular, by using the side electrode portions 36 and 46 as electrode surfaces for mounting, the strength of fixing the electronic component 10 to the individual circuit patterns 72 and 72 of the circuit board (external circuit) 70 can be improved.

The individual circuit patterns 72, 72 of the circuit board (external circuit) 70 and the side electrode portions 36, 46 of the electronic component 10 can be connected by, for example, solder 80. may Examples of connecting members other than the solder 80 include conductive adhesives, anisotropic conductive tapes, and the like. Further, by forming a gap between the side electrode portions 36 and 46 and the outer surface of the side wall of the case 60, resonance of the electronic component 10 can be easily suppressed.

As shown in FIGS. 5A and 5B, in order to connect the individual circuit patterns 72, 72 of the circuit board (external circuit) 70 and the side electrode portions 36, 46 of the electronic component 10, The surface is placed approximately perpendicular to the X-axis.

In this embodiment, as shown in FIG. 5C, by arranging the insulating cases 60 of a plurality of electronic components 10 side by side, the individual metal terminals 30 and 40 of the different insulating cases 60 are connected to the common circuit pattern of the circuit board 70. They can also be interconnected at 74 . In this case, a total of four capacitor chips 20a, 20b, 20a, 20b can be connected in series. That is, the degree of freedom in mounting the electronic component 10 is also improved. Also, the electronic component 10 of the present embodiment is relatively compact. In addition, instead of connecting with the common circuit pattern 74 of the circuit board 70, connecting the first individual metal terminals 30 and the second individual metal terminals 40 with an external conductor or the like also makes it possible to construct a capacitor that forms four series circuits. .

In this embodiment, as shown in FIG. 1, the accommodating recesses 62a and 62b are provided with partition walls 64 that partition the adjacent capacitor chips 20a and 20b, so that the capacitor chips 20a and 20b can be easily attached. In addition, it becomes easy to insulate the adjacent capacitor chips 20a and 20b. Further, since the partition wall 64 is formed with the communication groove 65, the inner electrode portion 52 of the common metal terminal 50 can be easily inserted into the housing recesses 62a and 62b.

Further, in this embodiment, as shown in FIG. 5B, it is preferable that at least the surfaces of the inner electrode portions 32, 42 of the individual metal terminals 30, 40 are subjected to solder adhesion prevention treatment. With this configuration, the solder 80 can be prevented from entering the vicinity of the terminal electrodes 22 of the capacitor chips 20a and 20b, effectively preventing so-called solder bridges.

The surfaces of the side electrode portions 36 and 46 are not subjected to solder adhesion prevention treatment, but are rather subjected to surface treatment (including film formation) to facilitate adhesion of solder 80 . Regarding the surfaces of the opening edge electrode portions 34 and 44, it depends on the case. Solder adhesion prevention treatment is not required. Examples of the solder adhesion prevention treatment include peeling treatment of a tin-plated film or the like to which the solder 80 easily adheres.

Further, in the electronic component 10 according to the present embodiment, the metal terminals 30, 40, 50 and the capacitor chips 20a, 20b can be connected without using solder. Therefore, it becomes possible to use copper, a copper alloy, or the like as the material of the metal terminal, and the ESR (equivalent series resistance) can be reduced. Moreover, since solder is not used, it is possible to reduce the risk of cracks occurring in the capacitor chip due to differences in thermal expansion.

In addition, the opening edge electrode portions 34 and 44 may be mounted on the individual circuit pattern 72 or the common circuit pattern 74 . In this case, since the opening surface of the case 60 is arranged on the mounting surface side, the case 60 can serve as a protective cover.

Second Embodiment An electronic component 10a according to the embodiment shown in FIGS. 6A to 6C has the same configuration as the electronic component 10 according to the first embodiment except for the following points, and has the same effects. Play. In FIGS. 6A to 6C, members common to each member in the electronic component 10 of the first embodiment are denoted by common reference numerals, and description thereof is partially omitted.

In the electronic component 10a of the present embodiment, the individual metal terminals 30a and 40a are continuous with the side electrode portions 36 and 46 and along the anti-opening surface (bottom surface) 68 of the insulating case 60 located on the opposite side of the opening edge surface 66. It further includes anti-aperture electrode portions 38, 48 formed in the same manner.

As for the common metal terminal 50a, an opening edge electrode portion 54 is formed continuously with the inner electrode portion 52 along the opening edge surface 66, and an outer surface of the insulating case 60 is continuously formed with the opening edge electrode portion 54. and a side electrode portion 56 formed along. In addition, the common metal terminal 50a further has a counter-opening side electrode portion 58 which is continuous with the side electrode portion 56 and is formed along a counter-opening surface 68 of the case located on the side opposite to the opening edge surface 66. .

In the electronic component 10a of the present embodiment, as shown in FIG. 6A, it is also possible to use the electrode portions 38, 48, 58 opposite to the opening side as electrode surfaces for mounting. That is, the electrodes 38, 48, 58 opposite to the opening can be connected to the individual circuit patterns 72, 72a of the circuit board 70 via the solder 80, respectively. The individual circuit pattern 72a to which the common metal terminal 50a is connected may be a floating pattern that is not connected to other circuit patterns.

As shown in FIG. 6A, when the individual circuit pattern 72a to which the common metal terminal 50a is connected is connected to another circuit pattern, two capacitors forming a parallel circuit can be configured. On the other hand, if the individual circuit pattern 72a to which the common metal terminal 50a is connected is a floating pattern that is not connected to other circuit patterns, two capacitors forming a series circuit can be configured. Further, by connecting the anti-opening electrode portions 38, 48 of the individual metal terminals 30a, 40a and the anti-opening electrode portion 58 of the common metal terminal 50a to the individual circuit patterns 72, 72a, the electronic component 10a and the circuit board 70 are connected. and mounting strength can be improved. Resonance can also be prevented.

Further, as shown in FIG. 6B, a plurality of electronic components 10a of the present embodiment may be stacked and arranged in the Z-axis direction and connected. In this case, the opposite opening side electrode portions 38, 48, 58 of the metal terminals 30a, 40a, 50a of the electronic component 10a stacked on the upper side are connected to the metal terminals 30a, 40a, 58 of the electronic component 10a placed on the lower side. It is preferably connected to the aperture edge electrode portions 34, 44, 54 of 50a. A method for connection is not particularly limited, and a method using a conductive adhesive, laser welding, soldering, or the like can be considered.

As shown in FIG. 6B, when the individual circuit pattern 72 to which the common metal terminal 50a is connected is connected to another circuit pattern, the four capacitors can form four parallel circuits. On the other hand, if the individual circuit pattern 72a to which the common metal terminal 50a is connected is a floating pattern that is not connected to other circuit patterns, the four capacitors can be configured as 2-series and 2-parallel circuits.

Furthermore, in the electronic component 10a of the present embodiment shown in FIG. 6C, the opening surface of the insulating case 60 faces downward in the Z-axis direction, and the opening edge electrode portions 34, 44, 54 of the metal terminals 30a, 40a, 50a , may be connected to the circuit pattern 72 of the circuit board 70 by soldering or the like. With the electronic component 10a of the present embodiment, it is possible to increase variations in mounting on a circuit board or the like. Moreover, since the opening surface of the case 60 is arranged on the mounting surface side, the case 60 can serve as a protective cover. Further, by connecting the opening electrode portions 34, 44 of the individual metal terminals 30a, 40a and the opening edge electrode portion 54 of the common metal terminal 50a to the individual circuit patterns 72, 72a, the electronic component 10a and the circuit board 70 are connected. Mounting strength can be improved. Resonance can also be prevented.

Third Embodiment An electronic component 10b according to the embodiment shown in FIGS. 7 to 11 has the same configuration as the electronic component 10 or 10a of the above-described embodiment except for the following points, and has the same effects. play. In FIGS. 7 to 11, members common to the members in the electronic component 10 or 10a of the above-described embodiment are denoted by common reference numerals, and description thereof is partially omitted.

In the electronic component 10b of this embodiment, the insulating case 60a has a plurality of housing recesses 62a and 62b separated by a partition wall 64, as shown in FIG. 8B. The groove depth of the communication groove 65 in the Z-axis direction is formed shallower than the groove depth of the communication groove 65 of the above-described embodiment, and the bottom wall 63 is formed separately for each of the plurality of accommodation recesses 62a and 62b. I have Engagement protrusions 67 are formed at the corners of the opening surfaces of the accommodation recesses 62a and 62b located on the opposite side of the communication groove 65 in the X-axis direction.

As shown in FIG. 8C, the common metal terminal 50b has a pair of inner electrode portions 52. As shown in FIG. These are separated by a slit 53 extending in the Z-axis direction and connected by a connecting piece 525 and an opening edge electrode portion 54 . A side electrode portion 56 is continuously formed on the opening edge electrode portion 54 . Each inner electrode portion 52 is inserted into the inner wall surface of the housing grooves 62a and 62b shown in FIG. 8B in the X-axis direction on the side where the communication groove 65 is formed. It engages with the communication groove 65 .

In this embodiment, as shown in FIG. 8D, the individual metal terminal 30b (40b) is inserted along one inner wall in the X-axis direction of the housing recess 62a (62b) of the insulating case 60a shown in FIG. 8B. It has an inner electrode portion 32 (42) that is In this embodiment, an elongated through hole 322 (422) is formed along the width direction (Y-axis direction) in the vicinity of the opening edge electrode portion 34 (44) of the inner electrode portion 32 (42).

By forming the through holes 322 (422), the opening edge electrode portions 34 (36) can be connected to the circuit board 70 or the like with solder 80 or the like, as shown in FIG. can be prevented by the through holes 322 (422). That is, so-called solder bridges can be effectively prevented.

Further, in the present embodiment, engaging pieces 324 (424) protruding outward along the width direction (Y-axis direction) are provided on both sides near the opening edge electrode portion 34 (44) of the inner electrode portion 32 (42). may be formed in These engaging pieces 324 (424) are engaged with engaging protrusions 67 formed on both sides in the Y-axis direction of one inner wall surface in the X-axis direction of the housing recess 62a (62b) of the insulating case 60a shown in FIG. 8B. , respectively. The engaging projection 67 is preferably formed so as to be flush with the opening edge surface 66 .

Only by inserting the inner electrode portions 32, 42 of the individual metal terminals 30b, 40b shown in FIG. 8D into the insulating case 60a shown in FIG. Together, the terminals 30b and 40b can be easily positioned and firmly fixed to the insulating case 60a.

In this embodiment, as shown in FIG. 8D, the inner electrode portions 32, 42 are provided with curved portions 320 (420) that are pressed toward the capacitor chips 20a, 20b shown in FIG. 9 by spring force. It should be noted that FIG. 10 shows the curved portion 320 that is pressed toward the capacitor chip 20a by spring force. With this configuration, the inner electrode portion 32 (42) and the first terminal electrode 22 are connected in a press-contact state, and the inner electrode portion 52 of the common metal terminal 50b and the second terminal electrode 24 are in a press-contact state. connected with Therefore, there is no need to connect them with a connection member such as solder or conductive adhesive.

Since the metal terminals 30b, 40b, 50b and the terminal electrodes 22, 24 can be connected to the terminal electrodes 22, 24 without using solder, it is possible to use copper, a copper alloy, or the like as a material for the terminals 30b, 40b, 50b. (equivalent series resistance) can be reduced. Moreover, since solder is not used, it is possible to reduce the risk of cracks occurring in the capacitor chips 20a and 20b due to differences in thermal expansion and the like.

In this embodiment, for example, as shown in FIG. 11, the opening electrode portions 34, 44 of the individual metal terminals 30b, 40b and the opening edge electrode portion 54 of the common metal terminal 50b are connected to the individual circuit patterns 72, 72a. , the mounting strength between the electronic component 10b and the circuit board 70 can be improved. Resonance can also be prevented.

Also, when the mounted common metal terminal 50b is connected to another circuit pattern, two parallel capacitor circuits can be configured. On the other hand, when the mounted common metal terminal 50b is not connected to other circuit patterns (in the case of a floating pattern), two series capacitor circuits can be configured. Furthermore, since the opening surface of the case 60 is arranged on the mounting surface side, the case 60 can serve as a protective cover.

Fourth Embodiment An electronic component 10c according to the embodiment shown in FIGS. It works and works. In FIGS. 12 to 13C, members common to the electronic components 10, 10a, or 10b of the above-described embodiments are denoted by common reference numerals, and descriptions thereof are partially omitted.

In the electronic component 10c of this embodiment, the insulating case 60b has a plurality of housing recesses 62a to 62c separated by a plurality of partition walls 64, as shown in FIG. 13C. Communication grooves 65 are alternately formed in each partition wall 64 along the X-axis direction. The groove depth of each communication groove 65 in the Z-axis direction is equivalent to the groove depth of the communication groove 65 of the third embodiment. The bottom wall 63 of each of the housing recesses 62a-62c is formed separately for each of the plurality of housing recesses 62a-62c. In this embodiment, on one side of the insulating case 60b in the X-axis direction, engaging projections 67 are formed at the corners of the opening surfaces of the accommodation recesses 62a to 62c, except for the position where the communication groove 65 is located. formed.

As shown in FIG. 12, in this embodiment, two common metal terminals 50c and 50d and two individual metal terminals 30c and 40c are attached to the insulating case 60b. One common metal terminal 50c has a pair of inner electrode portions 52, as shown in FIG. 13B. These are separated by a slit 53 extending in the Z-axis direction and connected by a connecting piece 525 and an opening edge electrode portion 54 . A side electrode portion 56 is continuously formed on the opening edge electrode portion 54 . Each inner electrode portion 52 is inserted into the inner wall surface of the housing grooves 62b and 62c shown in FIG. 13C in the X-axis direction on the side where the communication groove 65 is formed. It engages with the communication groove 65 .

The other common metal terminal 50d has a pair of inner electrode portions 52, as shown in FIG. 13A. These are separated by a slit 53 extending in the Z-axis direction and connected by a connecting piece 525 and an opening edge electrode portion 54 .

A side electrode portion 56 is continuously formed on the opening edge electrode portion 54 . Each inner electrode portion 52 is inserted into the inner wall surface of the housing grooves 62b and 62c shown in FIG. 13C in the X-axis direction on the side where the communication groove 65 is formed. It engages with the communication groove 65 .

In the present embodiment, as shown in FIG. 13A, in the vicinity of the opening edge electrode portion 54 in each inner electrode portion 52, on the opposite side of the slit 53 in the Y-axis direction, along the width direction (Y-axis direction). Engagement pieces 524 protruding outward are formed on both sides. These engaging pieces 524 are capable of engaging with the engaging projections 67 formed in the housing recesses 62a and 62b of the insulating case 60b shown in FIG. 13C. The engaging projection 67 is preferably formed so as to be flush with the opening edge surface 66 .

Only by inserting the inner electrode portions 52, 52 of the common metal terminal 50d shown in FIG. 13A into the insulating case 60b shown in FIG. , the terminal 50d can be easily positioned and firmly fixed to the insulating case 60b.

In this embodiment, as shown in FIG. 13A, the inner electrode portions 32, 52 are provided with curved portions 320, 520 that are pressed toward the capacitor chips 20a, 20b shown in FIG. 12 by spring force. With this configuration, the inner electrode portions 32, 52 and one terminal electrodes of the capacitor chips 20a, 20b are connected in a press-contact state. At the same time, the other terminal electrodes of the capacitor chips 20a and 20b are connected to the inner electrode portion of the individual metal terminal 40c or one inner electrode portion of the common metal terminal 50c in a press-contact state. Therefore, there is no need to connect them with a connection member such as solder or conductive adhesive.

In this embodiment, as shown in FIG. 13A, one of the individual metal terminals 30c is an inner electrode portion inserted along one inner wall in the X-axis direction of the housing recess 62c of the insulating case 60b shown in FIG. 13C. 32. The other individual metal terminal 40c shown in FIG. 13B has an inner electrode portion 42 inserted along the other inner wall in the X-axis direction of the housing recess 62a of the insulating case 60b shown in FIG. 13C.

In this embodiment, elongated through holes 322, 422 are formed along the width direction (Y-axis direction) in the vicinity of the opening edge electrode portions 34, 44 of the inner electrode portions 32, 42 of the individual terminal electrodes 30c, 40c, respectively. formed.

By forming the through holes 322, 422, when the opening edge electrode portions 34, 44 are connected to a circuit board or the like by soldering, the through holes 322, 422 prevent solder from rising in the direction of the inner electrode portions 32, 42. can be prevented. That is, so-called solder bridges can be effectively prevented.

In the present embodiment, engaging pieces 324 projecting outward along the width direction (Y-axis direction) are formed on both sides near the opening edge electrode portion 34 of the inner electrode portion 32 of one of the individual metal terminals 30c. I have These engaging pieces 324 can be engaged with engaging projections 67 formed on both sides in the Y-axis direction of one inner wall surface in the X-axis direction of the housing recess 62c of the insulating case 60b shown in FIG. 13C. It has become. The engaging projection 67 is preferably formed so as to be flush with the opening edge surface 66 .

Only by inserting the inner electrode portion 32 of the individual metal terminal 30c shown in FIG. 13A into the insulating case 60b shown in FIG. Positioning and strong fixing of the terminal 30c with respect to can be easily performed.

In this embodiment, as shown in FIG. 13A, the inner electrode portion 32 has a curved portion 320 that is pressed toward the capacitor chip 20c shown in FIG. 12 by a spring force. With this configuration, the inner electrode portion 32 and one terminal electrode of the capacitor chip 20c shown in FIG. The electrodes are connected in a press-contact state. Therefore, there is no need to connect them with a connection member such as solder or conductive adhesive.

In this embodiment, the metal terminals 30c, 40c, 50c, 50d and the capacitor chips 20a to 20c can be connected in series without using solder. Therefore, it becomes possible to use copper, a copper alloy, or the like as the material of the terminals 30c, 40c, 50c, and 50d, and the ESR (equivalent series resistance) can be reduced. Moreover, since solder is not used, the possibility of cracks occurring in the capacitor chips 20a to 20c due to differences in thermal expansion or the like can be reduced.

In this embodiment, electronic component 10c has individual metal terminals 30c, 40c and common metal terminals 50c, 50d, so that three or more capacitor chips can be formed by connecting at least individual metal terminals 30c, 40c to a circuit board. 20a-20c can be easily connected in series. By connecting three or more capacitor chips 20a to 20c in series, the withstand voltage of electronic component 10 can be increased, and the safety of electronic equipment in which electronic component 10 is mounted can be improved.

Fifth Embodiment An electronic component 10d according to the embodiment shown in FIGS. Similar effects are obtained. In FIGS. 14 to 16, members common to the electronic components 10, 10a, 10b, or 10c of the above-described embodiments are denoted by common reference numerals, and descriptions thereof are partially omitted.

As shown in FIG. 14, an electronic component 10d of this embodiment includes capacitor chips 20a and 20b shown in FIG. 1 and the like, individual metal terminals 30b and 40b shown in FIG. have

As shown in FIG. 15B, the insulating case 60d is a rectangular parallelepiped housing elongated in the X-axis direction. The insulating case 60d has an outer wall 61d, a housing recess 62d, a bottom wall 63d, an opening edge surface 66d, and an engaging groove 69 in addition to the engaging projection 67 shown in FIG. 8B. The outer wall 61d, the bottom wall 63d and the opening edge surface 66d are elongated in the X-axis direction than the outer wall 61, the bottom wall 63 and the opening edge surface 66 shown in FIG. 2B, respectively.

As shown in FIGS. 15A and 15B, the outer wall 61d is provided with individual metal terminals 30b, 40b. In this embodiment, the pair of individual metal terminals 30b and 40b are arranged to face each other in the X-axis direction (longitudinal direction of the insulating case 60d).

The first individual metal terminal 30b is attached to a wall surface parallel to the YZ plane located on one end side of the outer wall 61d in the X-axis direction. The second individual metal terminal 40b is attached to a wall surface parallel to the YZ plane located on the other end side of the outer wall 61d in the X-axis direction. As shown in FIG. 16, the inner electrode portions 32, 42 of the individual metal terminals 30b, 40b are provided with curved portions 320, 420, but the curved portions 320, 420 are not essential and may be omitted.

As shown in FIG. 15B, in the present embodiment, the insulating case 60d is not provided with the partition portion 64 shown in FIG. 2B. Therefore, unlike the insulating case 60 shown in FIG. The number of 62d is only one. By inserting an intermediate connector 90, which will be described later, into the accommodation recess 62d, two accommodation spaces arranged along the X-axis direction are formed inside the accommodation recess 62d.

The shape of the housing recess 62d is elongated in the X-axis direction corresponding to the overall shape of the insulating case 60d. As shown in FIGS. 15A and 16, the capacitor chips 20a and 20b are accommodated inside the accommodation recess 62d.

In this embodiment, the capacitor chips 20a and 20b are arranged between the first individual metal terminal 30b and the second individual metal terminal 40b with their end surfaces 21 and 23 facing each other. That is, the capacitor chips 20a and 20b are arranged in series along the X-axis direction inside the housing recess 62d.

The size of the accommodation recess 62d is such that it can accommodate the capacitor chips 20a and 20b arranged in series. The width of the housing recess 62d in the X-axis direction (longitudinal direction) is greater than the sum of the widths of the capacitor chips 20a and 20b in the X-axis direction, and the terminals 30b and 40b and the intermediate connector 50 are attached to the insulating case 60d. The terminal electrodes 22 and 24 of the capacitor chips 20a and 20b are determined to be pressed against the inner electrode portions 32 and 42 and the intermediate connector 50 in this state.

Engagement protrusions 67 are formed at respective corners (four corners) of the opening surface of the housing recess 62d. Engagement pieces 324 and 424 of individual metal terminals 30b and 40b shown in FIG.

As shown in FIG. 15B, two engagement grooves 69 extending in the Z-axis direction are formed in the inner wall surface (inner side surface) of the outer wall 61d. Each engagement groove 69 is formed inside a wall surface (elongated wall surface in the X-axis direction) of the outer wall 61d that is parallel to the XZ plane, and is positioned midway in the longitudinal direction of the wall surface (approximately in the X-axis direction). center).

The engaging groove 69 is formed continuously from the upper end to the lower end of the outer wall 61d, and the width in the X-axis direction and the depth in the Y-axis direction of the engaging groove 69 can be fixed by inserting the intermediate connector 90. It is about the width. For example, the width of the engaging groove 69 in the X-axis direction is about the same as the plate thickness of the intermediate connector 90 or larger.

As shown in FIGS. 15A and 16, the intermediate connector 90 is formed of a conductive rectangular flat plate and placed between each of the pair of individual metal terminals 30b and 40b. An intermediate connector 90 and a pair of individual metal terminals 30b, 40b are arranged along the X-axis direction, and capacitor chips 20a, 20b are arranged on both sides of the intermediate connector 90 in the X-axis direction.

The intermediate connector 90 connects the terminal electrodes 24, 24 of the adjacent (arranged in series) capacitor chips 20a, 20b. That is, in this embodiment, the terminal electrodes 24, 24 of the capacitor chips 20a, 20b are indirectly connected through the intermediate connector 90. FIG. The intermediate connector 90 is inserted through each engagement groove 69 into the housing recess 62d.

The intermediate connector 90 has a first connection surface 91 facing one side in the X-axis direction and a second connection surface 92 facing the other side in the X-axis direction. The connection surfaces 91 and 92 are surfaces facing the side electrode portions 36 and 46 of the individual metal terminals 30b and 40b. The second terminal electrode 24 of the capacitor chip 20 a is connected to the first connection surface 91 , and the second terminal electrode 24 of the capacitor chip 20 b is connected to the second connection surface 92 . Each capacitor chip 20 a , 20 b is electrically connected via an intermediate connector 90 .

The area of the intermediate connector 90 (connection surfaces 91, 92) is larger than the area of the terminal electrodes 22, 24 of the capacitor chips 20a, 20b, but is not particularly limited. As long as the electrical connection between each of the capacitor chips 20a and 20b can be ensured, it may be smaller than the illustrated example, and the shape of the intermediate connector 90 may be square, circular, triangular, or other shapes, for example. may be

The capacitor chip 20a is arranged in the space between the first individual metal terminal 30b and the intermediate connector 90, and receives the spring force from the curved portion 320 of the first individual metal terminal 30b. and the intermediate connector 90 .

The capacitor chip 20b is arranged in the space between the second individual metal terminal 40b and the intermediate connector 90, and receives the spring force from the curved portion 420 of the second individual metal terminal 40b. and the intermediate connector 90 .

As shown in FIG. 16, the electronic component 10d is mounted on individual circuit patterns 72, 72 of a circuit board (external circuit) 70 in a state in which the state shown in FIG. 14 is turned upside down. That is, the mounting surface of the electronic component 10d is the opening surface side of the housing recess 62d shown in FIG. 15B. The electronic component 10d connects the individual metal terminals 30, 40 (opening edge electrode portions 34, 44 and side electrode portions 36, 46) and the individual circuit patterns 72, 72 with solder 80 or a conductive adhesive. It is mounted on a circuit board (external circuit) 70 .

Solder fillets are formed between the side electrode portions 36, 46 and the individual circuit patterns 72, 72, so that the electronic component 10d can be firmly fixed to the circuit board (external circuit) 70. FIG.

As shown in FIG. 16, the electronic component 10d of the present embodiment has a pair of individual conductive terminals 30b, 40b arranged facing each other, and between each of the pair of individual conductive terminals 30b, 40b. , two capacitor chips 20a and 20b are arranged with their end surfaces 24 and 24 facing each other. Therefore, it is possible to arrange two capacitor chips 20a and 20b in series inside the housing recess 62d. An electronic component 10d composed of the capacitor chips 20a and 20b can be configured.

In addition, since the electronic component 10 d is elongated in the X-axis direction, the electronic component 10 d can be mounted in a narrow (thin) space on the circuit board (external circuit) 70 .

Further, in this embodiment, the terminal electrodes 24, 24 of the adjacent capacitor chips 20a, 20b can be easily connected via the intermediate connector 90. FIG.

It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention.

For example, in each of the above-described embodiments, a capacitor chip was used as an example of a chip component, but chip components other than a capacitor chip may be used.

Further, in each of the above-described embodiments, the number of capacitor chips included in the electronic component 10 is not limited to two or three, and the number is not limited as long as it is plural.

In this case, in the fifth embodiment, the number of intermediate connectors 90 is appropriately determined according to the number of capacitor chips included in the electronic component 10d. For example, when the number of capacitor chips is three, the number of intermediate connectors 90 is two, and each of the three capacitor chips is connected in series via each of these two intermediate connectors 90. be.

Furthermore, in the above embodiment, only the inner electrode portions 32, 42, 52 inserted into the inner wall surfaces on one side of the housing recesses 62a to 62c in the X-axis direction are provided with the curved portions 320, 420, 520. , but not limited to. For example, the curved portions 320, 420, 520 may be formed in both of the inner electrode portions 32, 42, 52 inserted into the inner wall surfaces on both sides of the housing recesses 62a to 62c in the X-axis direction.

In addition, in each of the above-described embodiments, the partition wall 64 constitutes a part of the insulating cases 60, 60a, 60b. may be provided at positions corresponding to the partition walls 64 of the insulating cases 60, 60a, 60b. That is, the insulating partition wall may be configured separately from the insulating case.

In the fifth embodiment, the intermediate connector 90 is not essential. For example, the intermediate connector 90 may be omitted and the terminal electrodes 24, 24 of the capacitor chips 20a, 20b may be directly connected inside the housing recess 62d. Alternatively, a conductive adhesive or the like may be used to connect the terminal electrodes 24, 24 of the capacitor chips 20a, 20b.

10, 10a to 10d Electronic components 20a to 20c Capacitor chips 21, 23 End faces 22, 24 Terminal electrodes 26 Internal electrode layers 28 Dielectric layers 30, 30a to 30c First individual metal terminals (individual conductive terminal)
32... Inside electrode part 320... Curved part 322... Through hole 324... Engagement piece 34... Opening edge electrode part 36... Side electrode part 38... Anti-opening electrode parts 40, 40a to 40c... Second individual metal terminal (individual conductive terminal)
42... Inner electrode part 420... Curved part 422... Through hole 424... Engagement piece 44... Opening edge electrode part 46... Side electrode part 48... Anti-opening electrode parts 50, 50a to 50d... Common metal terminal (common conductive terminal)
52... Inner electrode part 520... Curved part 524... Engaging piece 525... Connecting piece 53... Slit 54... Opening edge electrode part 56... Side electrode part 58... Anti-opening electrode part 60, 60a, 60b, 60d... Insulating case 61, 61d... Outer wall 62a, 62b, 62d... Receiving recess 63, 63d... Bottom wall 64... Partition wall 65... Communication groove 66, 66d... Opening edge surface 67... Engagement convex part 68... Anti-opening surface (bottom surface)
DESCRIPTION OF SYMBOLS 70... Circuit board 72, 72a... Individual circuit pattern 74... Common circuit pattern 80... Solder 90... Intermediate connector 91... First connection surface 92... Second connection surface

Claims (18)

a plurality of chip components each having a first terminal electrode and a second terminal electrode formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the first terminal electrode; and an opening edge electrode formed continuously along the opening edge surface of the inner electrode portion. and a side electrode portion formed along the outer surface of the case continuously from the opening edge electrode portion;
A common conductive terminal having an inner electrode portion inserted along an inner wall of the housing recess of the case so as to connect the second terminal electrodes of the chip components adjacent to each other inside the housing recess. and
The housing recess is provided with a partition wall for partitioning the adjacent chip components,
An electronic component, wherein a communication groove extending from the opening surface toward the bottom of the housing recess and connecting the inner electrode portions of the common conductive terminals crosses the partition wall. 2. The individual conductive terminal according to claim 1, further comprising an anti-opening electrode portion formed continuously from the side electrode portion and along the anti-opening surface of the case located on the side opposite to the opening edge surface. Electronic components as described. 3. The electronic component according to claim 1, wherein the inner electrode portion has a curved portion that is pressed against the first terminal electrode by a spring force. The electronic component according to any one of claims 1 to 3, wherein a through hole is formed along the width direction in the vicinity of the opening edge side of the inner electrode portion. An engaging piece projecting outward along the width direction is formed in the vicinity of the opening edge surface side of the inner electrode portion,
5. The electronic component according to any one of claims 1 to 4, wherein an engaging projection with which said engaging piece engages is formed on said opening edge surface. The electronic component according to any one of claims 1 to 5, wherein the surface of the inner electrode portion is subjected to solder adhesion prevention treatment. 7. The electronic component according to any one of claims 1 to 6, wherein said housing recess is provided with a partition wall for partitioning said adjacent chip components. The common conductive terminal includes an opening edge electrode portion formed along the opening edge surface continuously to the inner electrode portion, and an opening edge electrode portion formed continuously along the outer side surface of the case. The electronic component according to any one of claims 1 to 7 , further comprising a side electrode portion. 9. The electronic component according to claim 8 , further comprising a counter-opening side electrode portion continuous with said side electrode portion and formed along a counter-opening surface of said case located on a side opposite to said opening edge surface. The electronic component according to any one of claims 1 to 9 , wherein the inner electrode portion has a curved portion that is pressed toward the second terminal electrode by a spring force. The electronic component according to any one of claims 1 to 10 , wherein the housing recess is filled with resin. a plurality of chip components having terminal electrodes formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
a pair of discrete conductive terminals arranged opposite each other;
an intermediate connector that connects the terminal electrodes of the adjacent chip components ;
The individual conductive terminals are
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the terminal electrode; and an opening edge electrode portion formed continuously with the inner electrode portion along the opening edge surface. and a side electrode portion formed along the outer side surface of the case continuously from the opening edge electrode portion,
between each of the pair of individual conductive terminals, a plurality of the chip components are arranged with their end surfaces facing each other;
The intermediate connector is an electronic component engaged with the inner wall formed along the outer edge of the housing recess . a plurality of chip components each having a first terminal electrode and a second terminal electrode formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the first terminal electrode; and an opening edge electrode formed continuously along the opening edge surface of the inner electrode portion. and a side electrode portion formed along the outer surface of the case continuously from the opening edge electrode portion, and
An electronic component, wherein a through hole is formed along the width direction in the vicinity of the opening edge surface side of the inner electrode portion. a plurality of chip components each having a first terminal electrode and a second terminal electrode formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the first terminal electrode; and an opening edge electrode formed continuously along the opening edge surface of the inner electrode portion. and a side electrode portion formed along the outer surface of the case continuously from the opening edge electrode portion, and
An engaging piece projecting outward along the width direction is formed in the vicinity of the opening edge surface side of the inner electrode portion,
An electronic component, wherein an engaging protrusion with which the engaging piece engages is formed on the opening edge surface. a plurality of chip components each having a first terminal electrode and a second terminal electrode formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the first terminal electrode; and an opening edge electrode formed continuously along the opening edge surface of the inner electrode portion. and a side electrode portion formed along the outer surface of the case continuously from the opening edge electrode portion, and
An electronic component, wherein a surface of the inner electrode portion is subjected to solder adhesion prevention treatment. a plurality of chip components each having a first terminal electrode and a second terminal electrode formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the first terminal electrode; and an opening edge electrode formed continuously along the opening edge surface of the inner electrode portion. a plurality of individual conductive terminals, each of which has a portion and a side electrode portion formed along the outer surface of the case continuously from the opening edge electrode portion;
A common conductive terminal having an inner electrode portion inserted along an inner wall of the housing recess of the case so as to connect the second terminal electrodes of the chip components adjacent to each other inside the housing recess. and
By mounting the plurality of opening edge electrode portions or the plurality of side electrode portions so as to face an object to be mounted, the plurality of chip components are connected via the plurality of individual conductive terminals and the common conductive terminal. Electronic components that are connected together in series. a plurality of chip components each having a first terminal electrode and a second terminal electrode formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the first terminal electrode; and an opening edge electrode formed continuously along the opening edge surface of the inner electrode portion. a discrete conductive terminal comprising:
an inner electrode portion inserted along an inner wall of the housing recess of the case so as to connect the second terminal electrodes of the chip components adjacent to each other inside the housing recess; a common conductive terminal having an opening edge electrode portion formed along the opening edge surface continuously from the opening edge surface;
An electronic component on which the opening edge electrode portion of the individual conductive terminal and the opening edge electrode portion of the common conductive terminal are mounted. a plurality of chip components each having a first terminal electrode and a second terminal electrode formed on both end faces;
a case having therein a housing recess for housing the chip component and having an opening edge surface along the opening surface of the housing recess;
an inner electrode portion inserted along the inner wall of the housing recess of the case and connected to the first terminal electrode; and an opening edge electrode formed continuously along the opening edge surface of the inner electrode portion. a plurality of individual conductive terminals, each of which has a portion and a side electrode portion formed along the outer surface of the case continuously from the opening edge electrode portion;
an inner electrode portion inserted along an inner wall of the housing recess of the case so as to connect the second terminal electrodes of the chip components adjacent to each other inside the housing recess; a common conductive terminal having an opening edge electrode portion formed along the opening edge surface continuously from the opening edge surface;
The electronic component, wherein the plurality of side electrode portions are arranged on the same outer side surface of the case.

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