JP7316650B2 - Joining method, joining device, jig used in joining device - Google Patents

Description

The present invention provides a bonding method for bonding a first main surface of a first object and a second main surface of a second object, for example, via a bonding layer having adhesiveness, and such a bonding method. and a jig that can be suitably used in the bonding apparatus.

2. Description of the Related Art In recent years, in the manufacturing process of electronic circuit boards, optical components, etc., there has been a demand for processing of smaller and finer parts and members. Examples of such processing include laminating flat members such as substrates and films together, or laminating a film or the like on an uneven substrate on which an electronic chip component is mounted so as to follow it. Alternatively, a process of transferring a transfer pattern having unevenness to a transfer agent can be mentioned.

Here, if air bubbles remain in the adhesive used in the lamination process, the resin used in the lamination process, or the transfer agent used in the transfer process, the reliability of the product is impaired and the yield is reduced. The problem arises that

In order to deal with such a problem, for example, in Patent Document 1 (Japanese Patent Application Laid-Open No. 2016-215532), a resin film in a B-stage state is formed on the base material 1 on which the light emitting element 21 serving as a convex portion is mounted. 2 is placed, it is housed in the sealed space 5, the sealed space 5 is made negative pressure, the resin film 2 is further heated, and it is compressed into the sealed space 5 in a state along the convex part. A technique has been proposed in which the resin film 2 is brought into close contact with the irregularities of the substrate 1 on which the light emitting element 21 is mounted by blowing air.
JP 2016-215532 A

However, in the conventional technology proposed in Patent Document 1 (Japanese Patent Application Laid-Open No. 2016-215532), the resin film 2 in the B-stage state is placed on the base material 1 on which the light-emitting element 21 serving as a convex portion is mounted, and is placed in the atmosphere. A step of placing the resin film 2 inside is included, and in this step, when viewed microscopically, the resin film 2 does not completely follow the irregularities on it. For this reason, there is a possibility that air bubbles will remain between the resin film 2 and the unevenness, and as a result, voids will be mixed in the product, reducing the reliability of the product, or reducing the manufacturing time. It is not possible to completely solve the problem of deteriorating the yield.

The present invention solves the above-described problems, and a bonding method according to the present invention includes bonding a first main surface of a first object and a second main surface of a second object through a bonding layer. 1. A bonding method for bonding, wherein the bonding layer is formed on the second main surface, and the first object and the second object are separated in a state in which the bonding layer and the first main surface are separated from each other. an exhausting step of evacuating the inside of the chamber to reduce the pressure in the chamber; and an air introduction step of introducing air into the chamber . After the contact step, the first object and the second object are brought into contact with each other. The pressing force is applied from the chamber in the pressing force applying step of applying the pressing force so as to bring the two closer to each other.

Moreover, the joining method according to the present invention is characterized by further comprising a compressed air introduction step of introducing compressed air into the chamber to pressurize the chamber.

Moreover, the bonding method according to the present invention is characterized in that a concave-convex structure portion is provided on the first back surface of the first object, which has a front-back relationship with the first main surface of the first object.

Also, the joining method according to the present invention is characterized in that a jig is attached to the periphery of the first object.

Further, a bonding apparatus according to the present invention is a bonding apparatus for bonding a first main surface of a first object and a second main surface of a second object via a bonding layer, The chamber has a bonding base on which is placed, the bonding base is open to the atmosphere, or the bonding base is airtightly accommodated, and the airtight chamber Therefore, an exhaust unit that exhausts air so that the entire interior of the chamber is in a uniform decompressed state, and the exhaust unit is in an operating state so that the entire interior of the chamber is in a uniform decompressed state . The first object and the second object having the bonding layer formed on the second main surface are separated from the first main surface and the bonding layer on the bonding base. , a support member that displaces the first main surface and the bonding layer to a state in which they are in contact with each other, and a pressing force that applies a pressing force so as to bring the first object and the second object closer to each other. and a section, wherein the chamber as the pressing force applying section applies a pressing force so as to bring the first object and the second object close to each other.

Moreover, the joining apparatus according to the present invention is characterized by having a compressed air introduction section for introducing compressed air into the airtight chamber.

A jig according to the present invention is a jig used in the above-described joining apparatus, and is characterized by being attached to the periphery of the first object and forming a frame shape.

The bonding method according to the present invention includes a contacting step of contacting the bonding layer and the first main surface in the decompressed chamber, and an air introduction step of introducing air into the chamber. According to such a bonding method according to the present invention, in principle, air bubbles do not remain between the bonding layer and the first main surface, so voids are not mixed in the product. This eliminates the risk of lowering product reliability and lowering yields during manufacturing.

Further, the bonding apparatus according to the present invention is arranged on the bonding base in the chamber so that the first main surface and the bonding layer are in contact with each other from the state in which the first main surface and the bonding layer are separated from each other. According to such a bonding apparatus according to the present invention, in principle, air bubbles can be prevented from remaining between the bonding layer and the first main surface. Therefore, voids are not mixed into the product, and the reliability of the product is not deteriorated, and the production yield is not deteriorated.

Further, according to the jig according to the present invention, by using it in the joining apparatus as described above, it is possible to easily manufacture a highly reliable product with a high production yield without voids being mixed. It becomes possible.

It is a figure explaining the concept of the joining method which concerns on embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the outline|summary of a structure of the joining apparatus 100 which concerns on 1st Embodiment of this invention. 1 is a perspective view of the lower chamber 112 side of the bonding apparatus 100 according to the first embodiment of the present invention; FIG. FIG. 2 is a diagram showing an extracted configuration of air passages in the channel plate 200; It is a figure explaining the process in the joining method which concerns on 1st Embodiment of this invention. 4A and 4B are diagrams illustrating attachment of the frame-shaped jig 50 to the first object 10; FIG. 4 is a diagram showing dimensions of an electronic chip component 17 mounted on a first rear surface 15 of a first object 10 and dimensions of a frame-shaped jig 50; FIG. It is a figure explaining the process in the joining method which concerns on 1st Embodiment of this invention. It is a figure explaining the process in the joining method which concerns on 1st Embodiment of this invention. It is a figure explaining the process in the joining method which concerns on 1st Embodiment of this invention. It is a figure explaining the process in the joining method which concerns on 1st Embodiment of this invention. It is a figure explaining the cutting process which is a post-process of a joining process. It is a figure which shows the product which consists of the 1st target object 10 and the 2nd target object 20 which were joined. FIG. 4 is a schematic diagram showing an overview of the configuration of a bonding apparatus 100 according to a second embodiment of the present invention; It is a figure explaining the process in the joining method based on 2nd Embodiment of this invention. It is a figure explaining the process in the joining method based on 2nd Embodiment of this invention. It is a figure explaining the process in the joining method based on 2nd Embodiment of this invention. It is a figure explaining the process in the joining method based on 2nd Embodiment of this invention. FIG. 10 is a diagram for explaining a step of removing the frame-shaped jig 50;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, terms used in this specification are defined with reference to FIG. FIG. 1 is a diagram for explaining the concept of a joining method according to an embodiment of the present invention.

The bonding method according to the present invention aims to bond the first object 10 and the second object 20 via, for example, the bonding layer 30 having adhesiveness or fluidity. Since the bonding layer 30 is interposed therebetween, the first object 10 and the second object 20 are not directly brought into contact with each other and fixed, but in this specification, the bonding layer 30 is used. Fixing the first object 10 and the second object 20 through each other is referred to as "bonding". Note that the fixed state between the first object 10 and the second object 20 need not be permanent.

In the present invention, in principle, the first object 10 and the second object 20 are assumed to have a substantially flat plate shape such as a substrate or a film. is not necessarily limited to such a shape. However, hereinafter, in the embodiments of this specification, the first target object 10 and the second target object 20 are assumed to have a substantially flat plate shape.

The first object 10 and the second object 20 do not necessarily have a substantially flat plate shape. must be included in However, such a surface does not have to be a smooth surface, and depending on the circumstances, it may be a surface having an uneven pattern or the like formed thereon.

Also, the first object 10 and the second object 20 may each have a curved surface as a surface used for joining. In this case, for example, if the first object 10 has a concave curved surface and the second object 20 has a convex curved surface, the concave curved surface and the convex curved surface are substantially the same. It is premised on having a curved surface. Such a curved surface does not have to be a smooth curved surface, and may be a curved surface on which an uneven pattern or the like is formed.

Alternatively, only one of the first object 10 and the second object 20 may have a curved surface as a surface used for joining. For example, the first object 10 may have a convex curved surface, and the second object 20 may be a film having flexibility and a substantially flat plate shape.

Such surfaces used in joining are referred to as first major surface 11 in first object 10 , while as second major surface 22 in second object 20 . Further, in the first target object 10 having a substantially flat plate shape, a surface having a front and back relationship with the first main surface 11 is defined as a first back surface 15 . Further, in the second target object 20 having a substantially flat plate shape, a surface having a front and back relationship with the second main surface 22 is defined as a second rear surface 25 .

Materials that can constitute the first object 10 and the second object 20 include, for example, synthetic resin materials, semiconductor materials, glass materials, metal materials, ceramic materials, or materials made of combinations thereof (printed wiring boards, etc.). can be mentioned. When the first object 10 and the second object 20 are made of a synthetic resin material and have flexibility, the first object 10 and the second object 20 can also be referred to as a "film". .

In the present invention, when joining the first object 10 and the second object 20 together, the joining layer 30 is formed in advance on the second main surface 22 of the second object 20 . Such a bonding layer 30 contains materials such as an adhesive, a molten resin material, and a transfer agent. It is considered to be in a sticky state. However, a step of solidifying the bonding layer 30 may be included during or after the bonding step according to the present invention.

Also, the bonding layer 30 does not necessarily have adhesiveness from the initial steps in the bonding method according to the present invention. For example, the bonding layer 30 may be made of a thermoplastic resin that develops plasticity when heat is applied during the process of the bonding method according to the present invention.

In addition, the joint processed goods obtained by joining the 1st target object 10 and the 2nd target object 20 may be called a product. A product obtained by bonding the first object 10 and the second object 20 can be a final product or an intermediate product until the final product is obtained. A part of the bonded workpiece obtained by bonding the second object 20 with the second object 20 may be the target.

Further, in the following embodiments, description will be given on the premise that the bonding layer 30 is formed in advance on the second main surface 22 of the second object 20, but the first main surface of the first object 10 is 11 may also be provided with a bonding layer.

In the following, an embodiment in which one of the first object 10 and the second object 20 is on the upper side and the other is on the lower side will be described.

Next, the bonding of the first object 10 and the second object 20 as described above will be described with reference to specific examples of the bonding apparatus. FIG. 2 is a schematic diagram showing an overview of the configuration of the bonding apparatus 100 according to the first embodiment of the present invention.

The bonding apparatus 100 has a bonding base 130 on which objects to be bonded, such as the first object 10 and the second object 20 described above, are set up and mounted. This joining base 130 is open to the atmosphere during setup or when the processed product is taken out. On the other hand, the bonding base 130 is made into an airtight space as needed during execution of the bonding process. For this reason, the bonding apparatus 100 according to the present invention has a chamber 110 that can accommodate the top surface of the bonding base 130 and that can be opened and closed to the atmosphere.

Chamber 110 may be constructed of stainless steel or the like. The chamber 110 is composed of a lower chamber 112 and an upper chamber 113 fitted with the lower chamber 112 . The lower chamber 112 is configured to include the bonding base 130 . Also, the lower chamber 112 is immovable with respect to the ground on which the bonding apparatus 100 is installed.

On the other hand, the upper chamber 113 is configured to move up and down with respect to the lower chamber 112 by means of an upper chamber elevating mechanism 120 . In this embodiment, the lower chamber 112 is stationary and the upper chamber 113 is raised and lowered. Alternatively, the upper chamber 113 may be stationary and the lower chamber 112 is raised and lowered. Both 113 and the lower chamber 112 can be configured to move up and down. These are not limited to this embodiment, but can be said in common to all the descriptions in this specification.

Although the details of the upper chamber elevating mechanism 120 are not described, any configuration may be used as long as the upper chamber 113 can be elevated by hydraulic pressure, a motor, or the like. In the chamber 110, parts such as the place where the lower chamber 112 and the upper chamber 113 are fitted, or the gap between the supporting member 135 and the lower chamber 112 that move up and down, are sliding parts that move while contacting each other. Sealing members such as O-rings are preferably provided as necessary in order to maintain airtightness at certain locations, but they are omitted from the drawings in this specification.

An air passage 140 is provided on the upper chamber 113 side, and the air passage 140 is connected to an exhaust section 150 such as a decompression pump and a compressed air supply section 155 such as a compressor. A pressure gauge 191 is provided in the air passage 140 so that the pressure inside the chamber 110 can be monitored. After the lower chamber 112 and the upper chamber 113 are fitted to make the inside of the chamber 110 airtight, the exhaust part 150 is operated to make the space inside the chamber 110 have a pressure lower than the atmospheric pressure. On the other hand, when the chamber 110 is in an airtight state, the pressure in the chamber 110 can be made higher than the atmospheric pressure by operating the compressed air supply unit 155 .

When the lower chamber 112 and the upper chamber 113 are fitted together and the inside of the chamber 110 is in an airtight state, if the pressure inside the chamber 110 is set to be lower than the atmospheric pressure, a force acts to move the upper chamber 113 downward. In the bonding apparatus 100 according to the present invention, the upper chamber 113 can be stopped at a desired height by a regulating means such as a stopper (not shown) or a positioning means. When the upper chamber elevating mechanism 120 is composed of a hydraulic cylinder, in order to stop the upper chamber 113 at a desired height, a physical stopper or the like is provided to stop the flow of oil in the hydraulic circuit of the hydraulic cylinder. You can also choose not to.

Similarly, when the pressure inside the chamber 110 is higher than the atmospheric pressure when the inside of the chamber 110 is in an airtight state, a force acts to move the upper chamber 113 upward. Such an operation is regulated by a regulating means such as a stopper (not shown) so that the upper chamber 113 can be stopped at a desired height.

Further, the air passage 140 used for changing the atmospheric pressure in the chamber 110 in which the lower chamber 112 and the upper chamber 113 are fitted is provided on the upper chamber 113 side. Setting is not essential. Such a ventilation path may be provided on the lower chamber 112 side, and the exhaust section and the compressed air supply section may be connected to the ventilation path on the lower chamber 112 side. Furthermore, the air passage, the exhaust section for changing and adjusting the air pressure in the airtight chamber 110 , and the compressed air supply section may be used for both the upper chamber 113 and the lower chamber 112 .

In the chamber 110 , a lower temperature control plate 117 is provided so as to contact the lower chamber 112 and an upper temperature control plate 118 is provided so as to contact the upper chamber 113 . The lower temperature control plate 117 and the upper temperature control plate 118 are connected to a temperature controller (not shown) so that they can be maintained at desired temperatures. By controlling the temperatures of the lower temperature adjustment plate 117 and the upper temperature adjustment plate 118, the melting and solidification of the bonding layer 30 can be appropriately controlled. Also, by maintaining the temperature of the lower temperature control plate 117 and the upper temperature control plate 118 at a constant temperature higher than room temperature, it is possible to produce products with stable quality.

Next, the bonding base 130 on which the first object 10 and the second object 20, which are workpieces, are placed will be described in more detail. FIG. 3 is a perspective view of the lower chamber 112 side of the bonding apparatus 100 according to the first embodiment of the present invention.

Four support members 135 are provided on the top surface of the bonding base 130 on the lower chamber 112 side so as to move up and down with respect to the top surface. Each support member 135 can be moved up and down by a support member lifting mechanism 133 comprising a motor, a hydraulic cylinder, an air cylinder, a spring, or the like.

In this embodiment, either the first object 10 or the second object 20 is supported during setup, and when the pressure inside the chamber 110 reaches a desired level, the support member elevating mechanism 133 It is assumed that the first object 10 or the second object 20 is lowered by . The number of support members 135 is not limited to four as long as such an operation is possible.

In addition, a channel plate 200 made of, for example, stainless steel is arranged in a region inside the four support members 135 protruding from the top surface of the joining base 130 . FIG. 4 is a diagram showing the configuration of the air passages in the flow path plate 200. As shown in FIG.

The channel plate 200 is a substantially flat plate-like member, and has a bottom surface 210 as a main surface and a top surface 220 that is opposite to the bottom surface 210 . The top surface 220 is provided with a top surface groove 222 having a rectangular shape in plan view, and an O-ring 230 is arranged in this top surface groove 222 as a sealing member.

Further, the channel plate 200 is provided with a through hole 224 that allows the top surface 220 and the bottom surface 210 to communicate with each other. The bottom surface 210 is provided with a cross-shaped bottom groove 214 in a plan view, and the bottom groove 214 is spatially communicated with the through hole 224 . With such a configuration, in the channel plate 200 , channels are formed by the through holes 224 and the bottom grooves 214 .

In the example shown in FIG. 3, the four support members 135 are arranged at the four corners of the channel plate 200. layout. In short, as long as the four support members 135 are configured to move up and down with respect to the top surface of the joining base 130, their layout and mechanism are not particularly limited. In addition, in the present embodiment, the shape of the bottom surface groove 214 of the channel plate 200 is cross-shaped in plan view, but the shape of the bottom surface groove 214 is not limited to this.

An example of a bonding method using the bonding apparatus 100 configured as described above will be described. FIG. 5 is a diagram illustrating steps in the bonding method according to the first embodiment of the present invention. In the following description of this specification, block diagrams of the elevating mechanism section, the exhaust section, the compressed air supply section, etc. are omitted in each "drawing explaining the steps in the joining method". Also, it is assumed that the lower temperature adjustment plate 117 and the upper temperature adjustment plate 118 are set to generate heat at appropriate temperatures based on the selected material of the bonding layer 30 .

In the bonding method according to the first embodiment, it is assumed that the first object 10 is a film-like printed circuit board, and that a plurality of electronic chip components 17 are mounted on the first rear surface 15 . An example of bonding a film, which is the second object 20 to which an adhesive is applied as the bonding layer 30, to the first object 10 will be described.

A wiring circuit for realizing electrical connection with the electronic chip component 17 is formed on the first main surface 11 . The height of the wiring circuit is not high with respect to the height of the electronic chip component 17 . Although there is a possibility that the unevenness based on the wiring circuit does not line up with the bonding layer 30 at the time of bonding, according to the present invention, in principle, bubbles caused by the wiring circuit do not remain. . Note that the description of the wiring circuit is omitted below.

Supposing that the first object 10 and the second object 20 set as described above, in which a plurality of electronic chip components 17 are mounted on the first rear surface 15, are to be joined by physical pressing, It is also necessary to apply a pressing force to the electronic chip component 17 by pressing means. If such a pressing force is applied to the electronic chip component 17, there is a problem that the risk of the electronic chip component 17 being damaged during bonding increases. According to the bonding method according to the present invention, the force for bonding the first object 10 and the second object 20 is due to the differential pressure, so the above risk does not exist.

In addition, the first back surface 15 on which the electronic chip component 17 is mounted will be referred to as a "convex-concave structure portion" as a whole. It should be noted that the surface of the first object 10 that can form the “uneven structure” is not limited to the electronic chip component 17 . Also, the term "unevenness structure portion" is used as a general concept indicating the first rear surface 15 on which the electronic chip component 17 is mounted.

FIG. 5 shows a state in which the bonding base 130 is open to the atmosphere while the upper chamber 113 is raised. In this state, the first object 10 and the second object 20 are set up on the bonding base 130 as shown in FIG.

Here, since the frame-shaped jigs 50 and 50' are applied to the first object 10 and the second object 20, the configuration of such jigs will be described. In the following example, the frame-shaped jig 50 attached to the first object 10 is taken as an example, but the frame-shaped jig 50' attached to the second object 20 also has a similar configuration (with different dimensions). are doing.

6A and 6B are diagrams for explaining attachment of the frame-shaped jig 50 to the first object 10. FIG. 6A shows the frame-shaped jig 50 before being attached to the first object 10, and FIG. 6B shows the frame-shaped jig 50 attached to the first rear surface 15 of the first object 10. state. When attaching the frame-shaped jig 50 to the first back surface 15 of the first target object 10, an adhesive or the like having an appropriate adhesive force that does not require excessive force when removing can be used.

In the joining step, the frame-shaped jig 50 attached to the first object 10 is a frame-shaped (frame-shaped) member having a configuration like a flat plate with a central portion hollowed out and having only a peripheral edge. It can be made of steel or the like.

Such a frame-shaped jig 50 has a pair of main surfaces 53 that are in a front and back relationship. Further, the frame-shaped jig 50 has outer peripheral surfaces 56 on four sides on the outer peripheral side edges, and inner peripheral surfaces 54 on four side surfaces on the inner side between the pair of main surfaces 53 . One main surface 53 of the pair of main surfaces 53 is coated with the adhesive having the adhesive strength described above and attached to the first rear surface 15 of the first object 10 .

FIG. 7 is a diagram showing the dimensions of the electronic chip component 17 mounted on the first rear surface 15 of the first object 10 and the dimensions of the frame-shaped jig 50, and is a schematic cross section of the state shown in FIG. 6(B). is. In this embodiment, the distance T ₂ between the pair of main surfaces 53 of the frame-shaped jig 50 (the thickness of the frame-shaped jig 50) is the distance between the main surfaces of the electronic chip component 17 (the thickness of the electronic chip component 17). height) is set longer than _T1 . With such a configuration, even when the first object 10 is placed on the top surface 220 of the channel plate 200 , the electronic chip component 17 does not come into contact with the top surface 220 .

In this embodiment, the thickness T ₂ of the frame-shaped jig 50 is made larger than the height T ₁ of the electronic chip component 17 so that the electronic chip component 17 does not come into contact with the top surface 220 . However, in order to prevent the electronic chip component 17 from coming into contact with the top surface 220, instead of using the frame-shaped jig 50, a frame-shaped projection having the same dimensions as the frame-shaped jig 50 is provided as a channel. It can also be provided on the plate 200 side.

In this embodiment, the frame-shaped jig 50 is attached to the first rear surface 15 of the first object 10 . There may be a case where it is attached to the main surface 11 side. Also, the frame-shaped jig can be attached to both the first main surface 11 side and the first rear surface 15 side of the first object 10 . Further, in the present embodiment, the case where the frame-shaped jig 50 is attached to the first object 10 has been described. There may be cases where the first object 10 is simply placed. Further, in the present embodiment, the first object 10 has a rectangular shape in plan view, so the frame-shaped jig 50 has a frame shape (frame shape). The frame-shaped jig 50 can also be made into a doughnut-shaped one having only a peripheral edge.

Further, in the present embodiment, the jig attached to the first object 10 is the frame-shaped jig 50 having a frame shape. However, the jig attached to the first object 10 does not necessarily have a frame shape that continuously surrounds the periphery of the first object 10 . Moreover, in the present invention, depending on the shape of the first object 10 and the second object 20 to be joined, there are cases where it is not necessary to use a jig.

Using the frame-shaped jig 50 as described above, the first object 10 is placed and set on the joining base 130 , more specifically, on the channel plate 200 . Here, when the main surface 53 of the frame-shaped jig 50 is placed on the top surface 220 of the channel plate 200, the main surface 53 of the frame-shaped jig 50 presses the entire circumference of the O-ring 230, The main surface 53 of the frame-shaped jig 50 and the top surface 220 of the channel plate 200 are in close contact (see FIG. 5).

As shown in FIG. 5, even if the first object 10 is set on the flow path plate 200 on the bonding base 130, the space immediately below the first rear surface 15 on which the electronic chip component 17 is mounted and the first object The space above the first main surface 11 of the object 10 is a space communicating with each other because the bottom surface groove 214 and the through hole 224 are formed in the channel plate 200 .

Next, a set of second objects 20 will be described. An adhesive is applied as a bonding layer 30 to the second main surface 22 of the second object 20 . At a location corresponding to the periphery of the second object 20, the frame-shaped jig 50' is adhered using the adhesive force of the adhesive (bonding layer 30).

Four support members 135 protruding from the bonding base 130 support the frame-shaped jig 50', and the bonding layer 30 is formed on the second main surface 22 of the second object 20. is set. Here, according to the present invention, the bonding layer 30 on the side of the second object 20 and the first main surface 11 of the first object 10 are placed on the bonding base 130 while being separated from each other. is important in the joining method according to

After the first object 10 and the second object 20 are set on the bonding base 130 as described above, the upper chamber 113 is lowered to fit with the lower chamber 112 as shown in FIG. Then, the space above the bonding base 130 is made airtight within the chamber 110 . Next, the exhaust unit 150 (not shown in FIG. 8) is operated to reduce the pressure in the space inside the chamber 110 to be lower than the atmospheric pressure, thereby reducing the pressure in the chamber 110 . Here, the pressure gauge 191 is monitored, and the upper chamber 113 is regulated by a stopper or the like until the inside of the chamber 110 reaches a desired pressure (the pressure that becomes d).

When the pressure inside the chamber 110 reaches a desired level, the support member elevating mechanism 133 (not shown in FIG. 8) is then operated to lower the four support members 135 simultaneously. is lowered so as to approach the first object 10 . Finally, the support member 135 is lowered until the bonding layer 30 formed on the second main surface 22 of the second object 20 and the first main surface 11 of the first object 10 come into contact with each other. .

Assuming that the pressure in the chamber 110 is equal to or less than the desired threshold pressure and the degree of vacuum is sufficiently high, a minute gap between the bonding layer 30 on the side of the second object 20 and the first main surface 11 of the first object 10 is formed. Even if a space is formed, it does not mean that air exists in the minute space. Therefore, theoretically, when the pressure inside the chamber 110 is returned to a pressure higher than the desired pressure (threshold pressure), the minute space disappears due to the pressure from the surroundings.

As described above, in the bonding method according to the present invention, in principle, air bubbles based on the microspaces do not remain between the bonding layer 30 and the first main surface 11, so voids are mixed in the product. This eliminates the possibility of lowering the reliability of the product or lowering the yield in manufacturing.

In the process shown in FIG. 9, a stopper (not shown) that restricts the upper chamber 113 is released, and the upper chamber 113 is lowered to the extent that the upper chamber 113 presses the second rear surface 25 of the second object 20. Let Here, such a pressing force is in a range that does not destroy the second object 20 and the like, and is such that the second object 20 and the first object 10 are brought close to each other and the intervening bonding layer 30 is crushed. is assumed. In practice, the upper chamber 113 may or may not come into contact with the second rear surface 25 of the second object 20 . Here, in the step shown in FIG. 9, it is preferable to provide restricting means such as a stopper for restricting the lowering upper chamber 113 and positioning means.

As shown in FIG. 9, the upper chamber 113 contacts and pushes the second rear surface 25 of the second object 20 to bring the second object 20 and the first object 10 closer to each other ("pressing force applying step"). ”) is important in the present invention for efficiently manufacturing a bonded workpiece of the first object 10 and the second object 20 . By this step, the second object 20 and the first object 10 are slightly brought closer to each other, and the intervening bonding layer 30 is crushed to ensure that the second object 20 and the first object 10 are in close contact with each other to some extent. can be done.

In this embodiment, the pressing force applying step is performed by bringing the upper chamber 113 into contact with the second rear surface 25 of the second object 20. However, in order to carry out the pressing force applying step, A dedicated configuration other than the upper chamber 113 may be provided.

Although the pressing force applying step is not essential in the bonding method according to the present invention, it can be expected that the production efficiency will be improved by including such a step.

Further, in the present embodiment, in the pressing force application step, the upper chamber 113 contacts the entire surface of the second back surface 25 of the second object 20 and applies the pressing force thereto. On the other hand, in the pressing force application step, it is also possible to apply the pressing force only to the peripheral edge of the second back surface 25 of the second object 20 . Here, even if such a pressing force application step is performed, it is essential in this embodiment to have a configuration in which the electronic chip component 17 does not come into contact with the top surface 220 .

It should be noted that pressing the upper chamber 113 in contact with the entire surface of the second back surface 25 of the second object 20 as the pressing force applying step as in the present embodiment means that the pressure distribution in plan view is In other words, in the same pressing force application step, a large pressure distribution is formed on the peripheral edges of the first object 10 and the second object 20 sandwiching the bonding layer 30 .

As the force for lowering the upper chamber 113, the pressure difference caused by the pressure inside the chamber 110 being lower than the atmospheric pressure may be used. (not shown) may be used.

Further, in the above description, the support member elevating mechanism 133 is operated to actively lower the support member 135, thereby separating the bonding layer 30 formed on the second target 20 and the first target 10 from each other. Although the first main surface 11 is brought into contact with the first main surface 11, the present invention moves the bonding layer 30 and the first main surface 11 by lowering the second object 20 by the operation of the support member elevating mechanism 133. It is not limited to bringing them into contact with each other.

When the restricting means such as the stopper is released, the pressure inside the chamber 110 is lower than the atmospheric pressure, so the upper chamber 113 descends. Alternatively, the support member 135 may be pushed into the bonding base 130 to bring the bonding layer 30 on the side of the second object 20 and the first main surface 11 of the first object 10 into contact with each other. good. At this time, it is preferable that an upward biasing force is appropriately applied to the support member 135 . A synthetic resin, a spring, an air cylinder, or the like having elasticity can be used for such an urging force.

Now, in the process shown in FIG. 10, compressed air is supplied into the chamber 110 from the air passage 140 by the compressed air supply section 155 (not shown in FIG. 10). When the compressed air is supplied into the chamber 110, the upper chamber 113 rises, but it is preferable to restrict it with a stopper (not shown) or the like so that the fitting state with the lower chamber 112 is not released.

As shown in FIG. 10, the chamber 110 in an airtight state is filled with compressed air. Even if a minute space is formed between the bonding layer 30 and the first main surface 11 of the first object 10, air does not substantially exist in the minute space. The minute space is crushed by the force of the differential pressure and disappears.

In this embodiment, in the process shown in FIG. 10, compressed air is introduced into the airtight chamber 110 by the compressed air supply unit 155 (not shown in FIG. 10), and However, depending on the selection of the material used for the bonding layer 30, or the inside of the chamber 110 before the first object 10 and the second object 20 are brought into contact with each other, Depending on the degree of vacuum, introducing only air into the chamber 110 in the process shown in FIG. 10 can sufficiently eliminate the minute space. In this case, there is no need to use the compressed air supply unit 155, so the device can be configured simply and inexpensively.

In the process shown in FIG. 11, the introduction of compressed air by the compressed air supply unit 155 (not shown in FIG. 11) is stopped, and the pressure in the chamber 110 is returned to atmospheric pressure by operating a valve (not shown) or the like, and the upper chamber The elevating mechanism 120 (not shown in FIG. 11) is operated to raise the upper chamber 113 . As a result, the first object 10 and the second object 20 that have been joined on the joining base 130 can be removed from the joining apparatus 100 .

For example, as shown in FIG. 12, the first object 10 and the second object 20 that have been joined and taken out of the joining apparatus 100 are subjected to a cutting process, together with frame-shaped jigs 50 and 50', so that the peripheral edges are cut. It can be cut off to obtain the desired bonded work piece shown in FIG. The frame-shaped jigs 50 and 50' attached to the first target object 10 and the second target object 20 which are cut off by the cutting process are appropriately reused.

In the present embodiment, an example in which the periphery is cut off together with the frame-shaped jigs 50 and 50' by the cutting process has been described. Alternatively, only one of the attached frame-like jigs 50, 50' may be removed and other post-processing may be performed.

As described above, the bonding method according to the present invention includes a contacting step of contacting the bonding layer 30 and the first main surface 11 in the chamber 110 in a decompressed state, and introducing air into the chamber 110. In principle, according to the bonding method according to the present invention, air bubbles do not remain between the bonding layer 30 and the first main surface 11. , voids will not be mixed in the product, and the reliability of the product will not be lowered, and the yield at the time of manufacture will not be deteriorated.

In addition, the bonding apparatus 100 according to the present invention is configured such that the first main surface 11 and the bonding layer 30 are separated from the first main surface 11 and the bonding layer 30 on the bonding base 130 in the chamber 110 . In principle, the bonding layer 30 and the first principal surface 11 can be displaced to a state in which they are in contact with each other. Since air bubbles can be prevented from remaining between and, voids will not be mixed in the product, and the reliability of the product will not be lowered, and the yield at the time of manufacture will not be deteriorated.

In addition, according to the jigs 50 and 50' according to the present invention, by using the above-described bonding apparatus 100, voids are not mixed, and highly reliable products with high yields in manufacturing can be easily manufactured. It becomes possible to manufacture to

Next, another embodiment of the present invention will be described. FIG. 14 is a schematic diagram showing the outline of the configuration of the bonding apparatus 100 according to the second embodiment of the present invention. It should be noted that the configurations denoted by the same reference numerals as those of the bonding apparatus 100 according to the first embodiment are the same as those described above, and thus descriptions thereof will be omitted.

The joining apparatus 100 according to the second embodiment differs from the joining apparatus 100 according to the first embodiment in that the channel plate 200 is not provided on the joining base 130 .

In the bonding apparatus 100 according to the first embodiment, a plurality of electronic chip components 17 are provided on the first rear surface 15 of the first object 10, and the electronic chip components 17 are arranged so as not to contact the mounting surface. A frame-shaped jig 50 was attached to the . A groove or the like is formed to communicate the space immediately below the electronic chip component 17 surrounded by the inner peripheral surface 54 of the frame-shaped jig 50 with the space on the first main surface 11 side of the first object 10 . A channel plate 200 was provided.

On the other hand, in the bonding apparatus 100 according to the second embodiment, since the second back surface 25 of the second object 20, which is a smooth surface, is placed on the bonding base 130, The channel plate 200 used in the embodiment is not used. The object placed on the bonding base 130 may be the second object 20 as in the second embodiment, or the first object 10 as in the first embodiment. may

In addition, in the present embodiment, the first object 10 and the second object 20 have the same shape in plan view, and the first object 10 and the second object 20 are arranged so that they just overlap each other. spliced. Therefore, when setting the first object 10 and the second object 20 on the bonding base 130, positioning is performed so that the first object 10 and the second object 20 overlap in plan view. There is a need to do.

For this reason, a plurality of positioning pins 129 capable of regulating the second object 20 and positioning the second object 20 are planted on the top surface of the bonding base 130 .

Alignment pins 136 are erected on the top surface of each support member 135 . On the other hand, the frame-shaped jig 50 attached to the first object 10 is provided with through holes 57 into which the positioning pins 136 are fitted. When the positioning pins 136 provided on the four supporting members 135 are fitted into the through holes 57 provided at the four corners of the frame-shaped jig 50, the positioning of the first object 10 is just completed. It's becoming

Since the first target object 10 and the second target object 20 have the same shape in plan view, the frame-shaped jig 50 is attached to the first target object 10. Although the tool 50 is placed on the top surface of the support member 135, if the first target object 10 has an area that includes the second target object 20 in plan view, a frame-shaped jig It is also possible not to use 50.

An example of a bonding method using the bonding apparatus according to the second embodiment configured as described above will be described. In the bonding method according to the second embodiment, it is assumed that the first object 10 is a substrate made of a semiconductor material, and that a minute concave-convex pattern 18 is formed on the first rear surface 15 side thereof. Further, it is assumed that the second object 20 is also a substrate formed of a semiconductor material, and that an adhesive is applied as a bonding layer 30 to the second main surface 22 side of the second object 20 .

In this specification, the first rear surface 15 on which the concave-convex pattern 18 is formed may be regarded as a generic term "concavo-convex structure portion" as a whole.

In this embodiment, since the fine uneven pattern 18 is formed on the first back surface 15 side, when the first object 10 and the second object 20 are to be joined by physical pressing, It will be necessary to apply a pressing force to the concave-convex pattern 18 as well. If such a pressing force is applied to the concave-convex pattern 18, the concave-convex pattern 18 may be damaged during bonding. According to the bonding method according to the present invention, the force for bonding the first object 10 and the second object 20 is due to the pressure difference, so the uneven pattern 18 may be damaged. no.

FIG. 14 shows a state in which the bonding base 130 is open to the atmosphere while the upper chamber 113 is raised. In this state, the first object 10 and the second object 20 are set up on the bonding base 130 as shown in FIG.

The second object 20 having the bonding layer 30 formed on the second main surface 22 is regulated by a plurality of alignment pins 129 implanted on the top surface of the bonding base 130, The setting is completed by being placed on the top surface.

A frame-shaped jig 50 is attached to the first object 10 on the first rear surface 15 side with an adhesive having an appropriate adhesive force that does not require excessive force when removing. The thickness of the frame-shaped jig 50 is set to be larger than the height of the maximum convex portion in the concave-convex pattern 18 of the first object 10 . As a result, the concave-convex pattern 18 does not come into contact with the upper chamber 113 in the step of applying the pressing force.

Through holes 57 are provided at the four corners of the frame-shaped jig 50 , and by fitting the positioning pins 136 of the four support members 135 into these through holes 57 , the first object 10 can be set. is completed.

In this embodiment, the thickness of the frame jig 50 is set larger than the height of the uneven pattern 18 so that the uneven pattern 18 does not come into contact with the upper chamber 113 . However, instead of using the frame-shaped jig 50 , a frame-shaped projection having the same dimensions as the frame-shaped jig 50 is provided on the upper chamber 113 side so that the uneven pattern 18 does not come into contact with the upper chamber 113 . You can also

In this embodiment, the bonding layer 30 on the side of the second object 20 and the first main surface 11 of the first object 10 are placed on the bonding base 130 in a separated state. It is also important in the joining method related to the form.

After the first object 10 and the second object 20 are set on the bonding base 130 as described above, the upper chamber 113 is lowered to fit with the lower chamber 112 as shown in FIG. Then, the space above the bonding base 130 is made airtight within the chamber 110 . Next, the exhaust unit 150 (not shown in FIG. 15) is operated to reduce the pressure in the space inside the chamber 110 to be lower than the atmospheric pressure, thereby reducing the pressure in the chamber 110 . Here, the pressure gauge 191 is monitored, and the upper chamber 113 is regulated by a stopper (not shown) or the like until the inside of the chamber 110 reaches a desired pressure (threshold pressure).

When the pressure inside the chamber 110 reaches a desired level, the support member elevating mechanism 133 (not shown in FIG. 15) is operated to simultaneously lower the four support members 135, thereby lowering the second object 20. is lowered so as to approach the first object 10 . Finally, the support member 135 is lowered until the bonding layer 30 formed on the second main surface 22 of the second object 20 and the first main surface 11 of the first object 10 come into contact with each other. .

Assuming that the pressure in the chamber 110 is equal to or less than the desired threshold pressure and the degree of vacuum is sufficiently high, a minute gap between the bonding layer 30 on the side of the second object 20 and the first main surface 11 of the first object 10 is formed. Even if a space is formed, it does not mean that air exists in the minute space. Therefore, theoretically, when the pressure inside the chamber 110 is returned to a pressure higher than the desired pressure (threshold pressure), the minute space disappears due to the pressure from the surroundings.

As described above, in the bonding method according to the present invention, in principle, air bubbles based on the microspaces do not remain between the bonding layer 30 and the first main surface 11, so voids are mixed in the product. This eliminates the possibility of lowering the reliability of the product or lowering the yield in manufacturing.

In the process shown in FIG. 16, a stopper (not shown) that has restricted the upper chamber 113 is released, and the upper chamber 113 presses the frame-shaped jig 50 attached to the first object 10 . , the upper chamber 113 is lowered. Here, such a pressing force is within a range that does not destroy the first object 10, the frame-shaped jig 50, etc. A pressing force that crushes the layer 30 is assumed. In practice, the upper chamber 113 may or may not come into contact with the frame-shaped jig 50 attached to the first object 10 . Here, in the step shown in FIG. 16, it is preferable to provide restricting means such as a stopper for restricting the upper chamber 113 coming down.

As shown in FIG. 16, the upper chamber 113 is in contact with the frame-shaped jig 50 attached to the first object 10 and pushed in to bring the first object 10 and the second object 20 close to each other. (also referred to as a “pressing force application step”) is important in the present invention in order to efficiently manufacture a bonded workpiece of the first object 10 and the second object 20 . By this process, the first object 10 and the second object 20 are slightly brought close to each other, the intervening bonding layer 30 is crushed, and the first object 10 and the second object 20 are in close contact to some extent. be able to.

In the present embodiment, the pressing force application step is performed by the upper chamber 113 coming into contact with the frame-shaped jig 50. A dedicated configuration may be provided.

Although the pressing force applying step is not essential in the bonding method according to the present invention, it can be expected that the production efficiency will be improved by including such a step.

Further, in the present embodiment, in the pressing force application step, the upper chamber 113 contacts only the peripheral edge portion of the second rear surface 25 of the second object 20 via the frame-shaped jig 50 and applies the pressing force thereto. I have to. Here, even if such a pressing force application step is performed, it is important in the present embodiment to have a configuration in which the uneven pattern 18 does not come into contact with the upper chamber 113 .

As the force for lowering the upper chamber 113, the pressure difference caused by the pressure inside the chamber 110 being lower than the atmospheric pressure may be used. (not shown) may be used.

Further, in the above description, the support member elevating mechanism 133 is operated to actively lower the support member 135, thereby separating the bonding layer 30 formed on the second target 20 and the first target 10 from each other. Although the first main surface 11 is brought into contact with the first main surface 11, the present invention moves the bonding layer 30 and the first main surface 11 by lowering the second object 20 by the operation of the support member elevating mechanism 133. It is not limited to bringing them into contact with each other.

When the restricting means such as the stopper is released, the pressure inside the chamber 110 is lower than the atmospheric pressure, so the upper chamber 113 descends. While pushing down the first object 10 by pressing the supporting member 135 into the bonding base 130, the bonding layer 30 on the side of the second object 20 and the first main surface 11 of the first object 10 are joined together. may be brought into contact with each other. At this time, it is preferable that an upward biasing force is appropriately applied to the support member 135 . A synthetic resin, a spring, an air cylinder, or the like having elasticity can be used for such an urging force.

Now, in the process shown in FIG. 17, compressed air is supplied into the chamber 110 from the air passage 140 by the compressed air supply section 155 (not shown in FIG. 17). When the compressed air is supplied into the chamber 110, the upper chamber 113 rises.

As shown in FIG. 17, the chamber 110 in an airtight state is filled with compressed air. Even if a minute space is formed between the bonding layer 30 and the first main surface 11 of the first object 10, air does not substantially exist in the minute space. The minute space is crushed by the force of the differential pressure and disappears.

In this embodiment, in the process shown in FIG. 17, compressed air is introduced into the airtight chamber 110 by the compressed air supply unit 155 (not shown in FIG. 17), and However, depending on the selection of the material used for the bonding layer 30, or the inside of the chamber 110 before the first object 10 and the second object 20 are brought into contact with each other, Depending on the degree of vacuum, introducing only air into the chamber 110 in the process shown in FIG. 10 can sufficiently eliminate the minute space. In this case, there is no need to use the compressed air supply unit 155, so the device can be configured simply and inexpensively.

In the process shown in FIG. 18, the introduction of compressed air by the compressed air supply unit 155 (not shown in FIG. 18) is stopped, and the pressure in the chamber 110 is returned to atmospheric pressure by operating a valve (not shown) or the like, and the upper chamber The elevating mechanism 120 (not shown in FIG. 18) is operated to raise the upper chamber 113 . As a result, the first object 10 and the second object 20 that have been joined on the joining base 130 can be removed from the joining apparatus 100 .

For example, as shown in FIG. 19, the frame-shaped jig 50 is removed from the first object 10 and the second object 20 which are taken out from the joining apparatus 100 and then a desired jointed product is obtained. can be obtained. The removed frame-shaped jig 50 is reused as appropriate.

The bonding method according to another embodiment of the present invention as described above includes a contacting step of contacting the bonding layer 30 and the first main surface 11 in the chamber 110 in a decompressed state; and an atmosphere introducing step of introducing the atmosphere into 110. According to the bonding method according to another embodiment of the present invention, in principle, the bonding layer 30 and the first main surface 11 Since air bubbles do not remain between and, voids will not be mixed in the product, and the reliability of the product will not be lowered, and the yield at the time of manufacture will not be deteriorated.

In addition, the bonding apparatus 100 according to another embodiment of the present invention moves the first main surface 11 from the state in which the first main surface 11 and the bonding layer 30 are separated from each other on the bonding base 130 in the chamber 110 . The bonding device 100 according to another embodiment of the present invention has a support member 135 capable of displacing the bonding layer 30 and the bonding layer 30 to abutting state. Since it is possible to prevent air bubbles from remaining between the bonding layer 30 and the first main surface 11, voids will not be mixed in the product, reducing the reliability of the product and reducing the yield during manufacturing. Never make it worse.

In addition, according to the jig 50 according to another embodiment of the present invention, by using the above-described bonding apparatus 100, voids are not mixed, and the product is highly reliable and has a good yield at the time of manufacture. can be manufactured easily.

Reference Signs List 10 First object 11 First main surface 15 First back surface 17 Electronic chip component 18 Concavo-convex pattern 20 Second object 22 Second Principal surface 25 Second back surface 30 Bonding layers 50, 50′ Frame-shaped jig 53 Principal surface 54 Inner peripheral surface 56 Outer peripheral surface 57 Through Hole 100 Joining device 110 Chamber 112 Lower chamber 113 Upper chamber 117 Lower temperature control plate 118 Upper temperature control plate 120 Upper chamber elevating mechanism 129 Positioning pin 130 Joining base 133 Supporting member elevating mechanism 135 Supporting member 136 Positioning pin 140 Air passage 150 Exhaust part 155 Compressed air supply unit 191 Pressure gauge 200 Channel plate 210 Bottom surface 214 Bottom surface groove 220 Top surface 222 Top surface groove 224 Through hole 230・・・O-ring

Claims (7)

A bonding method for bonding a first principal surface of a first object and a second principal surface of a second object via a bonding layer,
The bonding layer is formed on the second main surface, and the first object and the second object are placed in a chamber while the bonding layer and the first main surface are separated from each other. a placing step;
an exhaust step of evacuating the inside of the chamber to reduce the pressure;
a contacting step of contacting the bonding layer and the first main surface in the chamber in which the entire interior of the chamber is in a uniform decompressed state;
an air introduction step of introducing air into the chamber;
After the abutting step, performing a pressing force applying step of applying a pressing force so as to bring the first object and the second object closer to each other,
The bonding method, wherein in the pressing force applying step, the pressing force is applied from the chamber. 2. The joining method according to claim 1, further comprising a step of introducing compressed air into said chamber to pressurize it. 3. The joining method according to claim 1, wherein an uneven structure portion is provided on the first rear surface of the first object, which is opposite to the first principal surface of the first object. 4. The joining method according to claim 3, wherein a jig is attached to the periphery of said first object. A bonding apparatus for bonding a first main surface of a first object and a second main surface of a second object via a bonding layer,
a chamber having a bonding base on which an object to be bonded is placed, the bonding base being open to the atmosphere, or housing the bonding base in an airtight state;
an exhaust unit that exhausts air from the airtight chamber so that the entire interior of the chamber is uniformly decompressed;
The first object and the bonding layer on the second main surface are placed on the bonding base while the exhaust unit is in an operating state so that the entire interior of the chamber is in a uniform decompressed state. a support member that displaces the second object on which is formed from a state in which the first main surface and the bonding layer are separated to a state in which the first main surface and the bonding layer are in contact with each other; ,
a pressing force applying unit that applies a pressing force so as to bring the first object and the second object close to each other;
The bonding apparatus, wherein the chamber as the pressing force applying unit applies a pressing force so as to bring the first object and the second object closer to each other. 6. The joining apparatus according to claim 5, further comprising a compressed air introducing section for introducing compressed air into said chamber which is kept airtight. A jig used in the joining apparatus according to claim 5 or 6,
A jig that is attached to the periphery of the first object and has a frame shape.

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