JP7317638B2 - Electroforming mold manufacturing method - Google Patents

Description

The present invention relates to an electroforming mold manufacturing method for forming, for example, a channel substrate.

Electroforming molds are used in molding resin members in order to impart fine and delicate structures to the resin members. As a technique for obtaining a fine and delicate structure, a suitable manufacturing method using an electroforming mold is known.

Such an electroforming mold is made by preparing an electroforming mold master made of stainless steel or resin, applying metal plating such as electroforming nickel to this master, and transferring the metal plating shape to the electroforming mold material. manufactured. (For example, see Patent Document 1.)

JP-A-2008-57004

A channel substrate is known as an example of a resin member manufactured using an electroforming mold. This flow path substrate has a flow path formed on the surface of the substrate for allowing an appropriate amount of test liquid to flow, and a small amount of test liquid such as blood is flowed through this flow path for bio/chemical analysis. . The shape of the flow path is required to have a fine and delicate structure, and at the same time, a flow path substrate having a complicated shape is required.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing an electroforming mold that can accurately give a structure to a resin member even if it is a fine and delicate structure or a complicated structure, in order to meet the above-mentioned demands. It is.

forming a recess in a first substrate and forming a first metal layer on the recess forming surface including the inner surface of the recess of the first substrate; feeding power to the first metal layer as a plating seed layer; forming a plated layer on the surface of the first substrate, removing the plated layer formed on the surface of the first substrate, and forming the recessed portion in the second substrate. and forming a first metal layer on the concave portion forming surface including the inner surface of the concave portion of the second substrate; supplying power to the first metal layer as a plating seed layer and plating the inside of the concave portion of the second substrate; filling and forming a plated layer on the surface of the second substrate; removing the plated layer formed on the surface of the second substrate; a step of arranging and joining the plated-filled recesses provided in the substrates of the above, and polishing one of the surfaces facing the joining surfaces of the first substrate and the second substrate, exposing a portion of the filled plating; forming a second metal layer on the surface of either the first substrate or the second substrate where the plating is partially exposed; Power is supplied to the second metal layer as a plating seed layer, and plating is grown on the surface of the substrate until it reaches a certain thickness to form a metal plating shape portion that communicates from the recesses of the first and second substrates to the surface of the substrate. and a step of removing only the first substrate and the second substrate to expose only the metal-plated shape portion.

The first substrate and the second substrate are silicon substrates, and the concave portion of the first substrate and the concave portion of the second substrate can be formed by an etching technique.

The concave portion of the first substrate and the concave portion of the second substrate can be formed in a substantially semicircular shape when viewed in cross section.

The first metal layer and the second metal layer are plating seed layers and can be composed of Au/Cr, Au/Ti, or Cr/Ti.

In the step of bonding the first substrate and the second substrate, they can be bonded via a metal bonding layer formed on a part of each substrate surface.

The metal bonding layer can be composed of Au or AuSn.

INDUSTRIAL APPLICABILITY According to the electroforming mold manufacturing method of the present invention, it is possible to provide an electroforming mold manufacturing method that can accurately give a structure to a resin member even if it has a fine and delicate structure or a complicated structure.

It is a figure which shows an example of a flow-path board|substrate, (a) is a top view. (b) is a cross-sectional view along AA. The figure for demonstrating the electroforming metal mold|die manufacturing method of one Embodiment of this invention. The figure for demonstrating the electroforming metal mold|die manufacturing method of one Embodiment of this invention.

FIG. 1 is a diagram showing an example of a flow path substrate, and (a) is a plan view. (b) is a cross-sectional view taken along the line AA. Reference numeral 1 denotes a channel substrate, and a channel 2 for flowing a test liquid or the like is formed on the substrate surface. The channel 2 is formed to have a concave cross-section and is arranged in a belt shape on the substrate surface. A small amount of test liquid is allowed to flow through the channel 2 for bio/chemical analysis.

The shape of the channel 2 is required to be fine and delicate depending on the test liquid to be analyzed. As shown in the cross-sectional view of FIG.
The flow path substrate 1 shown in FIG. 1 is manufactured from a resin member using an electroforming mold.
The electroforming mold manufacturing method of the present invention used for manufacturing the channel substrate 1 will be described below.

An electroforming mold manufacturing method according to one embodiment of the present invention will be described in detail with reference to FIGS. 2 and 3. FIG.
FIG. 2 is a diagram for explaining an electroforming mold manufacturing method according to an embodiment of the present invention, and (a) to (g) show the manufacturing of a first substrate forming a mother substrate for manufacturing an electroforming mold. The process is shown step by step.

First, as shown in (a), the first substrate 3 is prepared. The first substrate 3 is, for example, a silicon substrate having a size of φ4 inches and serves as a mother substrate for producing an electroforming mold.

2(b) to (d) show the steps of forming the recess 3a in the first substrate 3. FIG. Reference numeral 4 in FIG. 2B denotes a resist mask. This resist mask 4 has an opening 4a and is appropriately formed by photolithographic etching of a resist film formed on the first substrate 3. As shown in FIG.

As shown in FIG. 2C, after the resist mask 4 is formed, the silicon substrate used for the first substrate 3 is etched using the resist mask 4 as an etching mask to form the concave portions 3a. In this embodiment, for example, isotropic etching using SF6 gas is employed. Thereby, as shown in FIG.2(c), the recessed part which comprises cross-sectional view semicircle shape is obtained.

Subsequently, all of the resist mask 4 remaining on the surface of the first substrate 3 is removed, leaving the recesses 3a formed as shown in FIG. 2(d). Although not shown, the concave portion 3a formed here is arranged on the substrate surface in a shape corresponding to the flow path shown in FIG. 1 in plan view.

Subsequently, as shown in FIG. 2( e ), the first metal layer 5 is formed on the recess forming surface including the inner surface of the recess 3 a of the first substrate 3 . For the first metal layer 5, for example, a material such as Au/Cr, Au/Ti, or Cr/Ti can be appropriately selected and used, and can be formed by a method such as vapor deposition or sputtering.

Subsequently, as shown in FIG. 2(f), the first metal layer 5 formed on the first substrate 3 is used as a plating seed layer, power is supplied to the seed layer, and the plating is grown by an electrolytic plating method. As a result, the inside of the concave portion 3a is filled with plating. Furthermore, the plated layer 5a is formed by plating growth from the recessed portion 3a to the surface of the first substrate 3 so as to completely fill the recessed portion 3a.

Thereafter, the plated layer 5a formed on the surface of the first substrate 3 is polished and removed until the surface portion of the first substrate 3 is exposed. By doing so, the plated layer 5a is left only in the concave portion 3a.

Subsequently, as shown in FIG. 2G, a metal bonding layer 6 is formed on the surface of the first substrate 3 filled with the plated layer 5a. This metal bonding layer 6 is selected from materials such as Au or AuSn, for example. Through the steps up to this point, the first substrate 3 is completed.

Subsequently, a second substrate is formed in the same manner as the first substrate 3 formed in the above process. Although not particularly illustrated, the second substrate is formed in the same manner as the first substrate in terms of the size of the substrate, the shape of the recess formed on the substrate surface, and the formation position on the substrate surface.

FIG. 3 is a diagram for explaining the electroforming mold manufacturing method of one embodiment of the present invention, (a) to (e) are electroforming molds manufactured using the first substrate and the second substrate as mother substrates. It is the figure which showed the manufacturing process of this for every process.

FIG. 3(a) shows a step of bonding the first substrate 3 and the second substrate 7 formed in the above step. In this figure, the configuration is such that the first substrate 3 is arranged on the lower side and the second substrate 7 is arranged above the first substrate 3 . The positional relationship of bonding is such that the plated layer 5a filled in the concave portion 3a of the first substrate 3 and the plated layer 5a filled in the concave portion 7a of the second substrate 7 face each other. Since the plated layer 5a filled in each of the recesses 3a and 7a has a substantially semicircular cross-sectional shape, the two parts are combined with a substantially circular cross-sectional shape in the bonded state.

A metal bonding layer 6 is formed on the first substrate 3 and the second substrate 7 . Bonding of the substrates is performed by applying heat and pressure at about 300° C. through the metal bonding layer 6 formed on each substrate. This metal bonding layer 6 is appropriately selected from materials such as Au and AuSn, for example.

In the above process, metal bonding is used as an example of bonding means for bonding the first substrate 3 and the second substrate 7, but bonding means using an adhesive may also be employed. In that case, since the metal bonding layer 6 of the second substrate 7 is not required, the metal bonding layer forming step is unnecessary.

FIG. 3(b) is a step of polishing the surface of one of the bonded substrates to expose a portion of the filled plating.
In this figure, the substrate surface of the second substrate 7 arranged on the upper side is polished to expose a part of the plated layer 5a.

Subsequently, as shown in FIG. 3(c), a second metal film 8 is formed on the polished substrate surface. The second metal film 8 can be formed by appropriately selecting materials such as Au/Cr, Au/Ti, or Cr/Ti, and can be formed by a method such as vapor deposition or sputtering.

Subsequently, using the second metal layer 8 as a plating seed layer, the plating is grown as shown in FIG. This plating is formed on the surface of the second substrate 7 with a certain thickness. In addition, as a result, the recess is joined with the metal plating filling the recess, forming the metal plating shape portion 9 as shown in the figure.

FIG. 3(e) is a diagram showing a process of exposing the metal-plated shape portion formed in the previous process to form an electroforming mold.
Since the first substrate 3 and the second substrate 7 are composed of silicon substrates, they are all dissolved and removed using an etching solution. Also, the remaining metal layer used as the plating seed layer and the metal layer used for bonding are also removed by dissolution using an appropriate dissolving solution. By doing so, only the metal plated shape portion 9 can be exposed.
The metal-plated shape portion 9 left in this way is completed as an electroforming mold for manufacturing the channel substrate as illustrated in FIG.
By using the completed utility pole mold, it is possible to easily form the flow path substrate having the substantially circular flow path illustrated in FIG.

1 channel substrate 2 channel 3 first substrate 3a recess 4 resist mask 4a opening 5a plating layer 5 first metal layer 6 metal bonding layer 7 second substrate 7a recess 8 second metal layer 9 metal plating shape

Claims (6)

forming a recess in a first substrate, and forming a first metal layer on the surface of the first substrate on which the recess is formed, the recess forming surface including the inner surface of the recess and a surface excluding the inner surface of the recess; ,
supplying power to the first metal layer as a plating seed layer, filling the recesses of the first substrate with plating, and forming a plating layer on the surface of the first substrate;
removing a plated layer formed on the surface of the first substrate;
forming a recess in a second substrate, and forming a first metal layer on the surface of the second substrate on which the recess is formed, the recess forming surface including the inner surface of the recess and a surface excluding the inner surface of the recess; ,
a step of supplying power to the first metal layer as a plating seed layer, filling the recesses of the second substrate with plating, and forming a plating layer on the surface of the second substrate;
removing the plated layer formed on the surface of the second substrate;
a step of bonding the first substrate and the second substrate by arranging the recesses filled with plating provided in each substrate so as to face each other;
a polishing step of polishing one of the surfaces of the first substrate and the second substrate facing the bonding surface to expose a portion of the plating filled in the recess;
forming a second metal layer on the polished surface of the first substrate or the second substrate polished in the polishing step;
Power is supplied to the second metal layer as a plating seed layer, and plating is grown on the polished surface until it reaches a certain thickness to form a metal-plated shape portion that communicates from the concave portion of the first substrate and the second substrate to the surface portion of the substrate. forming;
removing only the first substrate and the second substrate to expose only the metal plating shape;
An electroforming mold manufacturing method characterized by having The electroformed gold according to claim 1, wherein the first substrate and the second substrate are silicon substrates, and the concave portion of the first substrate and the concave portion of the second substrate are formed by etching. mold manufacturing method. 3. The electroforming mold manufacturing method according to claim 1, wherein the concave portion of the first substrate and the concave portion of the second substrate are formed in a substantially semicircular shape when viewed in cross section. The electroformed gold according to claim 1, 2 or 3, wherein the first metal layer and the second metal layer are plating seed layers and are made of Au/Cr, Au/Ti, or Cr/Ti. mold manufacturing method. A step of forming a bonding metal layer for bonding the first substrate and the second substrate on the surface of each of the first substrate and the second substrate and the surface of the plating filling portion filling the recess. with
The step of bonding the first substrate and the second substrate includes bonding the first substrate and the second substrate via the bonding metal layer of each of the first substrate and the second substrate. The electroforming mold manufacturing method according to claim 1, 2, 3 or 4. 6. The electroforming mold manufacturing method according to claim 5 , wherein the bonding metal layer is made of Au or AuSn.

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