JP7320932B2 - Deposition equipment and parts peeling equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a film forming apparatus for forming a film on an electronic component attached to a protective sheet, and a component peeling apparatus for peeling a film-formed electronic component from the protective sheet.

A large number of electronic components such as semiconductor devices are mounted on wireless communication devices typified by mobile phones. Electronic components are transported from processing equipment to processing equipment for various processes. A representative example of the treatment is the formation of an electromagnetic wave shielding film. The electromagnetic wave shield film suppresses the influence of electromagnetic waves inside and outside, such as leakage of electromagnetic waves to the outside, in order to prevent influence on communication characteristics. In general, an electronic component has an outer shape formed by a sealing resin, and in order to shield electromagnetic waves, a conductive electromagnetic wave shielding film is provided on the top surface and side surfaces of this sealing resin (see Patent Document 1). .

A plating method is known as a method of forming an electromagnetic wave shield film. However, since the plating method requires wet processes such as a pre-treatment process, a plating process, and a post-treatment process such as washing with water, it is inevitable that the manufacturing cost of electronic parts increases. Therefore, the sputtering method, which is a dry process, is attracting attention. In the sputtering method, an inert gas is introduced into a vacuum vessel in which a target is placed, and a DC voltage is applied. Then, the ions of the inert gas turned into plasma collide with the target of the film-forming material, and the particles knocked out from the target are deposited on the electronic component. This deposited layer becomes an electromagnetic wave shielding film.

A film forming apparatus that implements the sputtering method includes a cylindrical chamber whose interior is a vacuum chamber, a rotary table that is housed in the chamber and has a rotating shaft that is coaxial with the chamber, and a film forming position that is partitioned within the chamber. have An electronic component is placed on a rotary table, and the rotary table is rotated in a circumferential direction to bring the electronic component to a film forming position, thereby forming an electromagnetic wave shielding film. In this manner, the electronic components are rotated and conveyed even within the processing apparatus.

When the electronic parts are conveyed inside and outside the apparatus, the electronic parts are subjected to inertial force due to acceleration/deceleration, rotation, and the like, and there is a risk that the electronic parts may fall over or fall out of the film forming position. Therefore, the electronic component is attached to the adhesive film, and subjected to transportation and film formation of the electromagnetic wave shielding film (see Patent Document 2). Electronic components can be kept in proper positions by adhesive force against inertial force.

Conventionally, an electronic component attached to an adhesive film has been peeled off from the adhesive film using a push-up device (see Patent Document 3). As shown in FIG. 29, the push-up device has an axially movable pin body 8 . An adhesive film 9 to which an electronic component 60 is attached is set on the tip of the pin body 8 . The pin body 8 pushes up the adhesive film 9 from the surface opposite to the sticking surface of the electronic component 60 . The pin body 8 deforms the adhesive film 9 into a mountain shape with the electronic component 60 to be peeled off as the apex. Therefore, the adhesion area between the electronic component 60 and the adhesive film 9 is reduced, and the electronic component 60 is thereby separated from the adhesive film 9 .

International Publication No. 2013/035819 JP-A-6-97268 JP-A-1-321650

As shown in FIG. 30, a plurality of electronic components 60 are attached to the adhesive film 9 with gaps provided therebetween. From the viewpoint of production efficiency, the intervals between the electronic components 60 attached to the adhesive film 9 are narrow. Therefore, when one electronic component 60 is pushed up, the distortion of the adhesive film 9 spreads to the adhesion area of the adjacent electronic component 60 . Then, while the object to be peeled is being pushed up, a part of the adjacent electronic component 60 may be peeled off from the adhesive film 9 and a peeled portion 91 may be generated.

When the peeling of the object to be peeled off is completed, the pin body 8 retreats in the axial direction, so that the flexure of the adhesive film 9 is eliminated. As a result, the adhesive film 9 is reattached to the peeled portion 91 , and a reattached portion 92 of the adhesive film 9 is generated to the electronic component 60 . FIG. 31 is a photograph showing the state of the electrode 602 after the adhesive film 9 has reattached to the electronic component 60 and has been peeled off. As shown in FIG. 31 , when the adhesive film 9 reattaches, a residue 93 of the adhesive film 9 may be generated on the electrode 602 . The residue 93 of the adhesive film 9 may be burned and carbonized during reflow when the electronic component 60 is mounted, which may cause poor connection or the like.

SUMMARY OF THE INVENTION The present invention has been proposed to solve the above-described problems. It is an object of the present invention to provide a membrane device and a part stripping device.

In order to achieve the above objects, the present invention
A film forming apparatus for an electronic component in which an electrode exposed surface is attached to a region surrounded by the frame on the adhesive surface of a protective sheet to which a frame-shaped frame is attached,
a film-forming processing unit that forms a film of a film-forming material on the electronic component;
a peeling processing unit that peels off the electronic component from the protective sheet after the film formation by the film forming processing unit;
with
The peeling processing unit is
a mounting portion for supporting the electronic component attached to the protective sheet;
a chuck that grips an end of the protective sheet, moves relative to the mounting portion, and continuously peels the protective sheet toward the opposite end of the protective sheet;
a fixing part that fixes the position of the electronic component when the electronic component is peeled off from the protective sheet;
a guide portion projecting from the outside of the edge of the frame on the side of the electronic component toward the end portion of the protective sheet;
has
The chuck is positioned at the projecting end of the guide portion before gripping the edge of the protective sheet,
The guide part faces the chuck and guides the edge of the protective sheet to the chuck .

The guide portion may protrude from a guide portion insertion hole or a notch provided in the frame .

A sheet stopper that moves along the protective sheet together with the chuck and creates a starting point for peeling may be provided.

The sheet stopper is positioned in the vicinity of the projecting end of the guide portion when the guide portion protrudes, and clamps the edge of the protective sheet peeled off by the guide portion together with the guide portion to guide the sheet to the chuck. may

The sheet stopper may be a roller having an axis perpendicular to the moving direction of the sheet stopper.

The fixed portion may be a component stopper that follows the sheet stopper while maintaining a distance less than the length of the electronic component and suppresses the electronic component from floating.

The component stopper may be a cylindrical roller having an axis orthogonal to the direction of movement of the component stopper and capable of rotating about the axis.

The fixing portion may be provided on the mounting portion to fix the electronic component to the mounting surface.

In addition, in order to achieve the above object, the present invention
Component peeling for peeling off from the protective sheet the electronic component on which the electrode exposed surface is adhered to the area surrounded by the frame on the adhesive surface of the protective sheet to which the frame-shaped frame is adhered and the film-forming material is formed. a device,
a mounting portion for supporting the electronic component attached to the protective sheet;
a chuck that grips an end of the protective sheet, moves relative to the mounting portion, and continuously peels the protective sheet toward the opposite end of the protective sheet;
a fixing part that fixes the position of the electronic component when the electronic component is peeled off from the protective sheet;
a guide portion projecting from the outside of the edge of the frame on the side of the electronic component toward the end portion of the protective sheet;
has
The chuck is positioned at the projecting end of the guide portion before gripping the edge of the protective sheet,
The guide part faces the chuck and guides the edge of the protective sheet to the chuck .

ADVANTAGE OF THE INVENTION According to this invention, the electronic component which completed film-forming can be peeled off from a protective sheet, preventing a residue from being left on an electronic component.

It is a side view which shows the electronic component by which the film-forming process was carried out. It is a side view which shows the state of the electronic component which receives film-forming processing. FIG. 4 is an exploded perspective view showing the state of the electronic component when undergoing film formation processing; FIG. 4 is a transition diagram showing a film forming process flow for an electronic component; It is a block diagram which shows the structure of a film-forming apparatus. 4 is a schematic diagram showing the configuration of an embedding processing unit; FIG. FIG. 4 is a transition diagram schematically showing states in each step of the embedding processing section; FIG. 4 is an enlarged view between electronic components in an embedding processing unit; It is a schematic diagram which shows the structure of a plate mounting part. It is a transition diagram which showed typically the state in each process of a plate mounting part. It is a schematic diagram which shows the structure of a film-forming process part. It is a schematic diagram which shows the structure of a plate release part. FIG. 4 is a transition diagram schematically showing states in each step of the plate release unit; FIG. 11 is a schematic diagram showing another configuration of the plate releasing section; FIG. 10 is a schematic diagram showing still another configuration of the plate releasing section; It is a schematic diagram which shows the structure of a peeling process part. FIG. 10 is a view showing the upper surface of the component-embedded sheet in the peeling processing section; FIG. 4 is a transition diagram schematically showing states in each step of a peeling processing unit; It is a schematic diagram which shows the aspect which prevents the floating of an electronic component. It is the photograph which image|photographed the electrode after peeling an electronic component from a protective sheet by the peeling process part. FIG. 11 is a top view showing another aspect of the component-embedded sheet in the peeling processing section; FIG. 10 is a top view showing still another aspect of the component-embedded sheet in the peeling section; FIG. 10 is a top view showing still another aspect of the component-embedded sheet in the peeling section; It is a top view of the exfoliation treating part concerning other embodiments. FIG. 4 is a partially enlarged perspective view of a peeling processing section in which a chuck grips the edge of the protective sheet; FIG. 10 is a diagram for explaining recovery of the protective sheet; FIG. 4 is a cross-sectional view including a mounting table and an ejection table when the electronic component is transferred to the ejection tray; It is a block diagram which shows the other structure of a film-forming apparatus. It is a schematic diagram which shows the structure of the conventional push-up apparatus. FIG. 10 is a schematic diagram showing how an electronic component is pushed up in a conventional push-up device. It is a photograph which shows the state of the electrode after the adhesive film reattached to the electronic component and was peeled off.

(Electronic parts)
FIG. 1 is a side view showing an electronic component subjected to film formation. As shown in FIG. 1, an electromagnetic wave shielding film 605 is formed on the surface of the electronic component 60 . The electronic component 60 is a surface mount component such as a semiconductor chip, diode, transistor, capacitor or SAW filter. A semiconductor chip is an integrated circuit such as an IC or LSI in which a plurality of electronic elements are integrated. This electronic component has a substantially rectangular parallelepiped shape such as BGA, LGA, SOP, QFP, WLP, etc., and one surface is an electrode exposed surface 601 . The electrode exposed surface 601 is a surface where the electrode 602 is exposed, faces the mounting substrate, and is connected to the mounting substrate. The electrode 602 is an electrode called a ball bump or a solder ball bump, and is formed by mounting a spherical solder (solder ball) having a diameter of several tens of μm to several hundred μm on a pad electrode.

The electromagnetic wave shield film 605 shields electromagnetic waves. The electromagnetic wave shielding film 605 is made of a material such as Al, Ag, Ti, Nb, Pd, Pt, Zr, or the like. The electromagnetic shielding film 605 may be made of a magnetic material such as Ni, Fe, Cr, Co, or the like. Further, SUS, Ni, Ti, V, Ta, etc. may be formed as the underlying layer of the electromagnetic wave shielding film 605, and SUS, Au, etc. may be formed as the outermost protective layer.

The electromagnetic wave shielding film 605 is formed on the top surface 603 and side surfaces 604 of the electronic component 60 , that is, on the outer surface other than the electrode exposed surface 601 . The top surface 603 is the surface opposite to the electrode exposed surface 601 . The side surface 604 is an outer peripheral surface that connects the top surface 603 and the electrode exposed surface 601 and extends at an angle different from that of the top surface 603 and the electrode exposed surface 601 . In order to obtain the shielding effect of blocking electromagnetic waves, the electromagnetic wave shielding film 605 should be formed at least on the top surface 603 . A ground pin (not shown) is present on the side surface 604 . The formation of the electromagnetic wave shielding film 605 on the side surface 604 is also for grounding the electromagnetic wave shielding film 605 . Note that the electronic component 60 including the electromagnetic wave shielding film 605 may be referred to as the electronic component 60 when the electromagnetic wave shielding film 605 is formed. Further, the top surface 603 and the side surfaces 604 are simply referred to as the top surface 603 and the side surfaces 604 regardless of whether the electromagnetic wave shielding film 605 is formed or not. That is, the surface of the electromagnetic wave shielding film 605 formed on the top surface 603 of the electronic component 60 is also called the top surface 603 , and the surface of the electromagnetic wave shielding film 605 formed on the side surface 604 is also called the side surface 604 .

(during film formation)
FIG. 2 is a side view showing the state of the electronic component after undergoing the film forming process. Also, FIG. 3 is an exploded perspective view showing the state of the electronic component when undergoing the film forming process. As shown in FIGS. 2 and 3, the electronic component 60 has the electrodes 602 embedded in the protective sheet 61 in advance, and the electrode exposed surface 601 is in close contact with the protective sheet 61 . By embedding the electrode 602 in the protective sheet 61, particles of the electromagnetic wave shielding film 605 are prevented from reaching the electrode 602 during film formation. In addition, the close contact between the electrode exposed surface 601 and the protective sheet 61 eliminates the room for the particles of the electromagnetic wave shielding film 605 to enter between the electrode exposed surface 601 and the protective sheet 61, and the particles of the electromagnetic wave shielding film 605 can reach the electrode 602. diminishes sexuality.

The protective sheet 61 is made of heat-resistant synthetic resin such as PEN (polyethylene naphthalate) or PI (polyimide). One surface of the protective sheet 61 is an adhesive surface (adhesive layer) 611 having flexibility with which the electrode 602 bites and adhesiveness with which the electrode exposed surface 601 adheres. As the adhesive surface 611, various adhesive materials such as silicone-based and acrylic-based resins, urethane resins, and epoxy resins are used.

The adhesive surface 611 includes an outer frame region 613 that extends inward from the edge of the protective sheet 61 to a predetermined distance, a middle frame region 614 that extends inward from the inner periphery of the outer frame region 613 to a predetermined distance, and an inner side of the middle frame region 614 . is divided into a component arrangement area 615 of . The electronic component 60 is attached to the component arrangement area 615 . A frame-shaped frame 62 is attached to the outer frame region 613 . The middle frame area 614 is a range where the protective sheet 61 is bent, and neither the frame 62 nor the electronic component 60 is attached. A non-adhesive surface 612 is opposite to the adhesive surface 611 . Areas corresponding to the outer frame area 613, the middle frame area 614, and the component arrangement area 615 of the non-adhesive surface 612 are also simply referred to as the outer frame area 613, the middle frame area 614, and the component arrangement area 615, respectively.

The protective sheet 61 is adhered to the cooling plate 63 via the adhesive sheet 64 . The cooling plate 63 is made of metal such as SUS, ceramics, resin, or other materials with high thermal conductivity. The cooling plate 63 is a heat radiation path that releases the heat of the electronic components and suppresses excessive heat accumulation. The adhesive sheet 64 has adhesiveness on both sides, increases adhesion between the protective sheet 61 and the cooling plate 63 , and secures a heat transfer area to the cooling plate 63 .

A height H1 from the surface of the component array area 615 to the upper end surface of the frame 62 is higher than a height H2 from the surface of the component array area 615 to the top surface 603 of the electronic component 60 (see FIG. 4). For convenience, the height H1 may be referred to as the thickness H1, but it has the same meaning. In short, if a flat plate is placed on the frame 62, the top surface 603 of the electronic component 60 does not reach the flat plate.

A guide portion insertion hole 621 is provided through one end portion of the frame 62 . The guide portion insertion hole 621 has a long oval, rectangular, circular, or other opening along the edge of the frame 62, and extends through the surface of the frame 62 attached to the protective sheet 61 and the opposite exposed surface. is penetrating. That is, for example, when a rod member is inserted into the guide insertion hole 621 and the end of the protective sheet 61 is pushed (see FIG. 18), one end of the protective sheet 61 is separated from the frame 62 .

A pusher insertion hole 631 is formed in the cooling plate 63 and the adhesive sheet 64 . The pusher insertion hole 631 does not align with the guide section insertion hole 621 and is penetrated at a position closed by the frame 62 . A plurality of pusher insertion holes 631 are provided so that the entire frame 62 is lifted in parallel when a rod-shaped member, for example, is inserted into the pusher insertion hole 631 and the tip of the rod-shaped member pushes up the frame 62 . For example, if the frame 62 is a rectangular frame, the pusher insertion holes 631 are positioned at the four corners or at the center of each side. From the viewpoint of maintaining the parallelism of the frame 62, the rod-like member preferably has a rectangular tip end face, that is, a thin plate shape or an L-shaped cross section. may have. The pusher insertion hole 631 correspondingly has a rectangular shape, an L shape, or a circular shape.

Further, in the cooling plate 63 and the adhesive sheet 64, a large number of fine air holes 632 are formed in the range where the component arrangement area 615 of the protective sheet 61 is adhered. This air hole 632 has, for example, a microcylindrical shape or a slit shape. The air holes 632 are provided in order to uniformly apply a negative pressure or a positive pressure to at least the component arrangement region 615 of the protective sheet 61 stuck to the cooling plate 63 through the air holes 632 .

(Deposition process flow)
In the film forming process, the electronic component 60 is separated into individual pieces on which the electromagnetic wave shielding film 605 is formed through a component mounting process, a component embedding process, a plate mounting process, a film forming process, a plate removing process, and a component peeling process. is obtained.

FIG. 4 is a diagram showing a film forming process flow for an electronic component. As shown in FIG. 4, in the component placement step, the components are arranged in a state in which the electrode exposed surface 601 of the electronic component 60 faces the component unplaced sheet 65 in which the frame 62 is adhered to the protective sheet 61 . Electronic components 60 are arranged in region 615 . A state in which the frame 62 is attached to the protective sheet 61 and the electronic components 60 are arranged, but the electrodes 602 are not yet embedded is called a component-mounted sheet 66 .

In the component embedding step, the electrode 602 is embedded in the protective sheet 61 of the component-mounted sheet 66 and the electrode exposed surface 601 is brought into close contact with the protective sheet 61 . Regardless of whether the electromagnetic wave shielding film 605 is formed or not, the state in which the electrode 602 is embedded in the protective sheet 61 is referred to as a component-embedded sheet 67 . In the plate mounting step, the component-embedded sheet 67 is adhered to the cooling plate 63 via the adhesive sheet 64 . A state in which the cooling plate 63 is mounted is called a component mounting plate 68 .

In the film forming process, particles of the electromagnetic wave shielding film 605 are deposited from the top surface 603 side of the electronic component 60 to form the electromagnetic wave shielding film 605 on the electronic component 60 . At this time, the electrodes 602 of the electronic component 60 are buried in the protective sheet 61, and the exposed electrode surface 601 is in close contact with the protective sheet 61, so that the particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrodes 602. be.

In the plate releasing process, the cooling plate 63 is removed and the form of the component-embedded sheet 67 is restored. Then, in the component peeling step, the electronic components 60 and the frame 62 are peeled off from the protective sheet 61 to separate the protective sheet 61 from the individual electronic components 60 and frames 62 . Thus, the film forming process is completed.

(Deposition device)
FIG. 5 shows a film forming apparatus that performs the component embedding process, the plate mounting process, the film forming process, the plate releasing process, and the component peeling process in the film forming process flow described above. As shown in FIG. 5 , the film forming apparatus 7 includes an embedding processing section 1 , a plate mounting section 2 , a film forming processing section 3 , a plate releasing section 4 and a peeling processing section 5 . Each section is connected by a conveying section 73, necessary members are introduced in each process, and members processed in each process are discharged. The transport unit 73 is, for example, a conveyor, and may be a transport table that is movable along a linear track with a ball screw or the like.

In addition, the film forming apparatus 7 includes a CPU for controlling the operation timing of each component included in the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate releasing unit 4, and the peeling processing unit 5, a ROM, A control unit 74 such as a computer or microcomputer having a RAM and a signal transmission circuit is accommodated. Furthermore, an air pressure circuit 75 for supplying positive pressure and negative pressure to the embedding processing section 1, the plate mounting section 2, the film forming processing section 3, the plate releasing section 4 and the peeling processing section 5 is accommodated. The control unit 74 also controls an electromagnetic valve in the pneumatic circuit 75 to switch between generation of negative pressure, release of negative pressure, generation of positive pressure, and release of positive pressure.

(embedding processing unit)
The embedding processing unit 1 that performs the component embedding process will be described. FIG. 6 is a schematic diagram showing the configuration of the embedding processing unit 1. As shown in FIG. A component-mounted sheet 66 is input to the embedding processing section 1 . The embedding processing unit 1 pulls the protective sheet 61 toward the electronic component 60 while restraining the electronic component 60 and presses the protective sheet 61 against the electronic component 60 . As a result, the embedding processing section 1 causes the electrodes 602 of the electronic component 60 to bite into the protective sheet 61 , and further brings the electrode exposed surface 601 into close contact with the protective sheet 61 .

As shown in FIG. 6 , the embedding processing section 1 includes a ceiling section 11 and a mounting table 12 . Both the ceiling part 11 and the mounting table 12 are blocks having internal spaces 111 and 121 . The ceiling portion 11 and the mounting table 12 are arranged to face each other, and have flat surfaces 112 and 122 parallel to each other on the opposite sides. Both flat surfaces 112 and 122 have the same size and shape as the component-mounted sheet 66 or are wider than the component-mounted sheet 66 . The mounting table 12 is stationary. On the other hand, the ceiling portion 11 can be raised and lowered with respect to the mounting table 12 . The ceiling portion 11 approaches the mounting table 12 at least by a distance corresponding to the thickness H1 of the frame 62 of the component-mounted sheet 66 .

A component-mounted sheet 66 is placed on the mounting table 12 . A flat surface 122 of the mounting table 12 serves as a mounting surface for the component-mounted sheet 66 . This flat surface 122 consists of an adhesive non-slip member. A large number of air holes 123 communicating with the internal space 121 are provided through the flat surface 122 of the mounting table 12 . The penetrating range of the air holes 123 is the same size and shape as the inside of the frame 62 of the component-mounted sheet 66 , or at least the same size and shape as the component arrangement area 615 . The penetrating position of the air hole 123 is the position facing the inner region of the frame 62 or the component arrangement region 615 when the component-mounted sheet 66 is placed on the mounting table 12 .

An air pressure supply hole 124 is further provided through the internal space 121 of the mounting table 12 at a location different from the flat surface 122 . The air pressure supply hole 124 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, a positive pressure supply pipe and the like (not shown). Therefore, positive pressure or negative pressure is selectively generated in the air hole 123 through the air pressure supply hole 124 and the internal space 121 .

Further, the flat surface 122 of the mounting table 12 is provided with a pusher insertion hole 125 penetrating the mounting table 12 . The pusher insertion hole 125 is provided outside the penetration range of the air hole 123 . Specifically, the insertion position of the pusher insertion hole 125 is a position where the frame 62 avoids the guide section insertion hole 621 of the frame 62 and is closed by the frame 62 when the component-mounted sheet 66 is placed thereon. The pusher 13 is inserted through the pusher insertion hole 125 . The pusher 13 can protrude from the flat surface 122 of the mounting table 12 . The pushers 13 are installed with sufficient rigidity, number, and arrangement intervals to separate the component-mounted sheet 66 from the mounting table 12 and lift and support it in parallel when protruding from the pusher insertion hole 125 . For example, if the frame 62 has a rectangular outer shape, rods are arranged corresponding to each corner of the frame 62 .

Next, a large number of air holes 113 communicating with the internal space 111 are also provided through the flat surface 112 of the ceiling portion 11 . The penetrating range of the air holes 113 is the same size and shape as the inside of the frame 62 of the component-mounted sheet 66 , or at least the same size and shape as the component arrangement area 615 , and extends over the entire component arrangement area 615 . The penetrating position of the air hole 113 is the position facing the inner region of the frame 62 or the component arrangement region 615 when the component-mounted sheet 66 is placed on the mounting table 12 .

An air pressure supply hole 114 is provided through the interior space 111 of the ceiling portion 11 at a location different from the flat surface 112 . The air pressure supply hole 114 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe and the like (not shown). Therefore, a negative pressure is generated in the air hole 113 through the air pressure supply hole 114 and the internal space 111 .

Further, on the flat surface 112 of the ceiling portion 11 , an O-ring 115 is installed along the frame 62 of the component-mounted sheet 66 placed on the mounting table 12 to surround the penetrating range of the air hole 113 .

FIG. 7 shows the flow of operation of such an embedding processing unit 1. As shown in FIG. FIG. 7 is a transition diagram schematically showing states in each step of the embedding processing section 1. As shown in FIG. First, as shown in (a) of FIG. The ceiling portion 11 is sufficiently spaced from the mounting table 12 , and the tip of the pusher 13 protrudes from the flat surface 122 of the mounting table 12 . When the component-mounted sheet 66 is loaded, the frame 62 of the component-mounted sheet 66 is aligned with the pusher 13 and the component-mounted sheet 66 is supported by the pusher 13 .

Next, as shown in FIG. 7B, the pusher 13 is retracted into the pusher insertion hole 125. Then, as shown in FIG. As a result, the component-mounted sheet 66 descends onto the flat surface 122 of the mounting table 12 . Also, the ceiling part 11 is moved toward the mounting table 12 . Then, the frame 62 of the component-mounted sheet 66 is sandwiched between the flat surface 112 of the ceiling portion 11 and the flat surface 122 of the mounting table 12 . A height H1 from the surface of the component array area 615 to the upper end surface of the frame 62 is higher than a height H2 from the surface of the component array area 615 to the top surface 603 of the electronic component 60 . Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 112 of the ceiling portion 11 . Therefore, a component arrangement area 615 on which the electronic components 60 are mounted is confined in the sealed space 14 surrounded by the flat surface 112 of the ceiling portion 11, the protective sheet 61 and the frame 62 and sealed with the O-ring 115. FIG.

When the component arrangement area 615 is confined in the sealed space 14, a negative pressure is generated in the air holes 123 of the mounting table 12 to suck the protective sheet 61 onto the flat surface 122, as shown in FIG. 7(c). Subsequently, as shown in (d) of FIG. 7, a negative pressure is also generated in the air holes 113 of the ceiling portion 11 to reduce the pressure in the closed space 14 in which the component arrangement area 615 is confined. That is, both the air holes 113 and 123 of the ceiling portion 11 and the mounting table 12 function as decompression portions. As for the degree of pressure reduction, it is desirable that both air holes 113 and 123 exert the same pressure and be close to a vacuum. The reason why the air holes 123 of the mounting table 12 generate the negative pressure first is that the protective sheet 61 is sucked to the mounting table 12 , and the air pressure above the protective sheet 61 is generated during the pressure reduction process of the closed space 14 . becomes excessively large relative to the atmospheric pressure on the lower side, and the electronic component 60 is prevented from rushing vigorously into the flat surface 112 of the ceiling portion 11 .

When the pressure reduction is completed, as shown in FIG. 7E, while maintaining the negative pressure on the ceiling portion 11 side, the air hole 123 on the mounting table 12 side is gradually changed from negative pressure to positive pressure, and the mounting table is closed. Twelve air holes 123 are converted to positive pressure. The electronic component 60 and the protective sheet 61 are gently sucked up by the flat surface 112 of the ceiling portion 11 and pushed up. The electronic component 60 is pressed against the flat surface 112 of the ceiling portion 11 and stopped. On the other hand, since the adhesive surface 611 of the protective sheet 61 has flexibility, the protective sheet 61 is further attracted to the flat surface 112 even after the electronic component 60 is restrained, and is further pushed up toward the flat surface 112 .

Then, the electrodes 602 of the electronic component 60 are buried in the protective sheet 61 , more specifically, the adhesive surface 611 of the protective sheet 61 , and the electrode exposed surface 601 of the electronic component 60 is brought into close contact with the protective sheet 61 . At this time, the flat surface 112 of the ceiling portion 11 includes the component arrangement area 615 and makes the component arrangement area 615 follow the flat surface. In other words, the component arrangement area 615 is never curved. Therefore, insufficient embedding of the electrodes 602 or insufficient adhesion of the electrode exposed surface 601 at the end of the component array region 615 can be prevented.

The contact process between the exposed electrode surface 601 and the protective sheet 61 is performed under a reduced pressure environment, and there is no or very little air in the closed space. Therefore, the possibility of air bubbles entering between the electrode exposed surface 601 and the protective sheet 61 is low.

Further, FIG. 8 is an enlarged view between electronic components 60 in the embedding processing unit 1. As shown in FIG. As shown in FIG. 8, the positive pressure generated on the mounting table 12 evenly pushes up at least the component array region 615 of the protective sheet 61 . Then, the flexible protective sheet 61 is further pushed toward the flat surface 112 of the ceiling portion 11 without being blocked by the electronic components 60 at each gap between the adjacent electronic components 60 . As a result, the adhesive surface 611 of the protective sheet 61 protrudes up to the lower side surface of the electronic component 60 , and the protective sheet 61 also adheres to the lower side surface of the electronic component 60 . Therefore, it is possible to more reliably prevent particles of the electromagnetic wave shielding film 605 from entering between the electrode exposed surface 601 and the protective sheet 61 .

When the electrodes 602 of the electronic component 60 are embedded in the protective sheet 61, and when the electrode exposed surface 601 and the lower side surface of the electronic component 60 are in close contact with the protective sheet 61, the pusher 13 is pushed as shown in FIG. 7(f). It is moved in the axial direction along the insertion hole 125 to appear again from the flat surface 122 of the mounting table 12 . At the same time, the ceiling part 11 is separated from the mounting table 12 at the same speed as the advancing speed of the pusher 13 . Finally, as shown in (g) of FIG. 7, the pusher 13 is stopped and the ceiling portion 11 is separated from the mounting table 12, thereby releasing the pinching of the component-embedded sheet 67. As shown in FIG. This completes the embedding of the electronic component 60 in the protective sheet 61 by the embedding processor 1 .

The negative pressure on the ceiling portion 11 side and the positive pressure on the mounting table 12 side are set as shown in FIG. It may be released before the ceiling part 11 is lifted. Regarding the negative pressure on the side of the ceiling part 11, if the negative pressure is released immediately before the ceiling part 11 is lifted in FIG. It is preferable because it can be held

In this manner, the ceiling portion 11 and the mounting table 12 sandwich the frame 62 from both sides, thereby forming a fixed portion that sandwiches the component-mounted sheet 66 therebetween. Also, the ceiling portion 11 , the protective sheet 61 and the frame 62 define the closed space 14 that encloses the component arrangement area 615 . The O-ring 115 enhances the airtightness of the sealed space 14 by sealing. Furthermore, the air hole 113 of the ceiling part 11 serves as a decompression part for decompressing the closed space 14 .

A flat surface 122 of the mounting table 12 serves as a mounting surface for the component-mounted sheet 66 . The air hole 123 opened in the flat surface 122 of the mounting table 12 generates a negative pressure prior to depressurization of the closed space 14 to prevent the electronic component 60 from rushing into the flat surface 112 of the ceiling section 11. Preventing means, together with the negative pressure of the ceiling part 11 , presses the component arrangement area 615 against the flat surface 112 of the ceiling part 11 by a positive pressure to bury the electrode 602 of the electronic component 60 .

In addition, the flat surface 112 of the ceiling portion 11 serves as flattening means for flattening the component arrangement area 615 and enhancing the embedding effect of the electrodes 602 and the adhesion effect of the electrode exposed surface 601 . The air holes 113 opened in the flat surface 112 of the ceiling portion 11 press the component arrangement area 615 against the flat surface 112 of the ceiling portion 11 by the negative pressure together with the positive pressure of the mounting table 12 , so that the electrodes 602 of the electronic components 60 are pressed. In combination with the positive pressure of the mounting table 12, the protective sheet 61 is sucked up into the gap between the electronic components 60 and adheres to the lower side surfaces of the electronic components 60 as well.

In this manner, the embedding processing unit 1 embeds the electrodes 602 of the electronic components 60 in the adhesive surface 611 of the protective sheet 61, and includes a decompression unit that decompresses the space containing the electronic components 60 and the component arrangement area 615. I made it to have. After depressurization, the electronic component 60 and the protective sheet 61 are pressed against each other. As a result, air bubbles do not enter between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61, resulting in insufficient adhesion, and a gap is generated between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61. The risk is reduced, and a situation in which particles of the electromagnetic wave shielding film 605 adhere to the electrode 602 can be avoided.

Further, the embedding processing section 1 is provided with the flat surface 112 of the ceiling section 11 . The flat surface 112 is positioned opposite to the protective sheet 61 with the electronic component 60 interposed therebetween, and faces the electronic component 60 . Then, the pressure in the space between the mounting table 12 and the protective sheet 61, i.e., the space on the opposite side of the flat surface 112 with the protective sheet 61 interposed therebetween, is relatively increased from the space between the protective sheet 61 and the flat surface 112. made big. As a result, the electronic component 60 and the protective sheet 61 are directed toward the flat surface 112, and the flat surface 112 is used as a latch to press the electronic component 60 and the protective sheet 61 against each other. Therefore, the component arrangement area 615 of the protective sheet 61 is flattened, and the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 are pressed against each other in parallel. Therefore, there is no more room for air bubbles to enter.

In addition, the embedding processing unit 1 has a mounting surface (flat surface 122 ) positioned opposite to the flat surface 112 with the mounting table 12 , that is, the protective sheet 61 interposed therebetween. An air hole 123 is formed in the mounting table 12 so as to open to the mounting surface and generate a negative pressure to separate the protective sheet 61 from the flat surface 112 while the closed space 14 is being decompressed. As a result, it is possible to prevent the electronic component 60 from being damaged due to the electronic component rushing toward the flat surface 112 while the sealed space 14 is being decompressed.

Although the air hole 113 of the ceiling part 11 and the air hole 123 of the mounting table 12 against which the electronic component 60 and the protective sheet 61 are pressed are used as a decompression part, a third air hole is separately formed in the closed space 14, A negative pressure may be generated in the third air hole to reduce the pressure.

In addition, the air holes 123 on the mounting table 12 side generate positive pressure after the pressure in the closed space 14 is reduced, and the protective sheet 61 is further pressed against the electronic components 60 restrained by the flat surface 112 . As a result, the protective sheet 61 and the adhesive surface 611 rise in the gaps between the electronic components 60 , and the lower side surfaces of the electronic components 60 can also be covered with the protective sheet 61 . Therefore, it is possible to reliably prevent a gap from being generated between the electrode exposed surface 601 and the protective sheet 61 . In addition, even in the case of an electronic component such as an SOP or QFP having thin plate-shaped electrodes on the lower side surfaces, the electrodes 602 can be covered with the protective sheet 61 to prevent the particles of the electromagnetic wave shielding film 605 from adhering. A membrane device 7 can be applied.

A known mechanism can be applied to the operating mechanism of the ceiling portion 11 and the operating mechanism of the pusher 13, and the present invention is not limited to the mechanism of the mechanism.

For example, the ceiling portion 11 is connected to a ball screw whose axis extends from the ceiling portion 11 toward the mounting table 12 and a rail guide extending from the ceiling portion 11 toward the mounting table 12 . The ceiling portion 11 moves toward the mounting table along the rails in the rotating direction of the screw shaft. The ball screw and the rail guide extend so that the ceiling portion 11 approaches the mounting table 12 to the distance of the thickness H1 of the frame 62 of the component-mounted sheet 66 .

The pusher 13 has a cam follower at its rear end. The cam follower follows the peripheral surface of the oval cam. The cam is axially supported by a rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam, pushes up the pusher 13, and the tip of the pusher 13 protrudes from the insertion hole.

Furthermore, as a method for fixing the sheet 66 on which components have been placed, the frame 62 is sandwiched between the ceiling portion 11 and the mounting table 12, and the closed space 14 is defined by the ceiling portion 11, the protective sheet 61, and the frame 62. Although both the positive pressure and the negative pressure are selectively generated in the air hole 123 of the mounting table 12, the present invention is not limited to this. For example, one or both of the ceiling portion 11 and the mounting table 12 may be cup-shaped, and the component-mounted sheet 66 may be accommodated in the internal space defined by the ceiling portion 11 and the mounting table 12 . Block bodies that sandwich the frame 62 from both sides may be provided, and the component-mounted sheet 66 may be sandwiched between the block bodies. In this case, the height of the frame 62 does not matter. Both through-holes for generating negative pressure and through-holes for generating positive pressure may be formed in the flat surface 122 of the mounting table 12 .

(Plate mounting part)
Next, the plate mounting section 2 that performs the plate mounting process will be described. FIG. 9 is a schematic diagram showing the configuration of the plate mounting portion 2. As shown in FIG. A component-embedded sheet 67 prepared by the embedding processing section 1 and a cooling plate 63 to which an adhesive sheet 64 is attached in advance are put into the plate mounting section 2 . The plate mounting unit 2 presses the component-embedded sheet 67 against the restrained cooling plate 63 and pulls the component-embedded sheet 67 to the cooling plate 63 , thereby pressing the component-embedded sheet 67 through the adhesive sheet 64 . is brought into close contact with the cooling plate 63 .

As shown in FIG. 9 , the plate mounting section 2 has a ceiling section 21 and a mounting table 22 . The ceiling portion 21 and the mounting table 22 are arranged to face each other. The mounting table 22 is stationary. On the other hand, the ceiling part 21 can be raised and lowered with respect to the mounting table 22 . The ceiling portion 21 approaches the mounting table 22 at least by a distance corresponding to the thickness H1 of the frame 62 of the component-embedded sheet 67 .

The ceiling part 21 is a block having an internal space 211 and has a flat surface 212 on the surface facing the mounting table 22 . The mounting table 22 has a bottomed cup shape. An opening 221 of the mounting table 22 faces the ceiling portion 21 . A flat surface 212 of the ceiling portion 21 has the same size and shape as the component-embedded sheet 67 or is wider than the component-embedded sheet 67 . On the other hand, the opening 221 of the mounting table 22 has an area including the part arrangement area 615 or more and the middle frame area 614 or less. The edge 222 around the opening 221 of the mounting table 22 has a width equal to or greater than the width of the frame 62 .

In this mounting table 22 , the edge 222 supports the cooling plate 63 and the opening 221 is closed by the cooling plate 63 . The surface of the cooling plate 63 opposite to the surface to which the adhesive sheet 64 is attached contacts the edge portion 222 . Further, the component-embedded sheet 67 is placed on the cooling plate 63 so as to face the adhesive sheet 64 . An air pressure supply hole 223 is provided through the bottom of the mounting table 22 . The air pressure supply hole 223 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe and the like (not shown). Therefore, a negative pressure is generated in the air holes 632 of the cooling plate 63 placed so as to block the openings 221 .

Furthermore, a pusher insertion hole 224 is provided through the edge portion 222 of the mounting table 22 so as to penetrate the mounting table 22 . The insertion position of the pusher insertion hole 224 coincides with the pusher insertion hole 631 of the cooling plate 63 . It is a position that is occluded by The pusher 23 is inserted through the pusher insertion hole 224 . The pusher 23 can be retracted through the mounting table 22 , the cooling plate 63 and the adhesive sheet 64 .

The pushers 23 are installed in such a degree of rigidity, number and position that they can support the component-embedded sheet 67 apart from the cooling plate 63 in parallel while projecting from the cooling plate 63 . For example, if the frame 62 has a rectangular outer shape, the rods are arranged corresponding to each corner of the frame 62 . The pusher insertion holes 224 are also provided corresponding to the number and positional relationship of the pushers 23 .

Next, a large number of air holes 213 communicating with the internal space 211 are provided through the flat surface 212 of the ceiling portion 21 . The penetration range of the air hole 213 is the same size and shape as the inside of the frame 62 of the component-embedded sheet 67 , or at least the same size and shape as the component arrangement area 615 . The penetrating position of the air hole 213 is the position where the component arrangement area 615 covers the component-embedded sheet 67 when placed on the mounting table 22 (see FIG. 10(a)).

An air pressure supply hole 214 is provided through the interior space 211 of the ceiling portion 21 at a location different from the flat surface 212 . The air pressure supply hole 214 is connected to an air pressure circuit 75 including a compressor, a positive pressure supply pipe, a negative pressure supply pipe, etc. (not shown). Therefore, positive pressure and negative pressure are selectively generated in the air hole 213 through the air pressure supply hole 214 and the internal space 211 .

Further, on the flat surface 212 of the ceiling portion 21 , an O-ring 215 is installed along the frame 62 of the component-embedded sheet 67 placed on the mounting table 22 to surround the penetrating range of the air hole 213 .

FIG. 10 shows the operation flow of such a plate mounting section 2. As shown in FIG. 10A and 10B are transition diagrams schematically showing states in each step of the plate mounting portion 2. FIG. First, as shown in (a) of FIG. 10, the ceiling part 21 is separated from the mounting table 22 first. A cooling plate 63 is mounted in advance on the mounting table 22 . Further, the pusher 23 is protruded toward the ceiling portion 21 through the cooling plate 63 and the adhesive sheet 64 . In this state, the frame 62 of the component-embedded sheet 67 is aligned with the pusher 23 and the component-embedded sheet 67 is supported by the pusher 23 . Then, the ceiling part 21 is lowered toward the pusher 23, and the frame 62 of the component-embedded sheet 67 is sandwiched between the ceiling part 21 and the pusher 23. - 特許庁

At this time, height H1 from the surface of component array area 615 to the upper surface of frame 62 is higher than height H2 from the surface of component array area 615 to top surface 603 of electronic component 60 . Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 212 of the ceiling portion 21 . Therefore, at least the component arrangement area 615 is confined in the sealed space 24a defined by the ceiling portion 21, the protective sheet 61 and the frame 62 and sealed with the O-ring 215. As shown in FIG.

When the component arrangement area 615 is confined in the sealed space 24a, a negative pressure is generated on the flat surface 212 of the ceiling section 21. As shown in FIG. Electronic component 60 is attached to flat surface 212 . The component-embedded sheet 67 is distorted in the middle frame region 614 , and the entire component arrangement region 615 is attracted to the flat surface 212 while remaining flat. Therefore, the component arrangement area 615 does not bend, and the embedded electrodes 602 do not separate from the protective sheet 61 . In order to prevent the electronic component 60 from vigorously rushing toward the flat surface 212 of the ceiling portion 21 , it is preferable to gradually lower the pressure to generate a negative pressure.

Next, as shown in FIG. 10(b), the pusher 23 and the ceiling portion 21 are lowered toward the mounting table 22 at a constant speed. Then, the area of the frame 62 of the component-embedded sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63 . Furthermore, by moving the ceiling part 21 toward the mounting table 22 , the area of the frame 62 is attached to the adhesive sheet 64 . At this stage, the negative pressure of the ceiling portion 21 is maintained, and the component-embedded sheet 67 is attracted to the flat surface 212 of the ceiling portion 21, so that the component arrangement area 615 is not in contact with the adhesive sheet 64. be.

Here, if no negative pressure is generated in the ceiling portion 21, the component-embedded sheet 67 will come into contact with the adhesive sheet 64 in the presence of air. Then, air bubbles may enter between the component-embedded sheet 67 and the adhesive sheet 64 . When air bubbles enter, the heat transfer area to the cooling plate 63 is reduced, and the heat dissipation effect of the electronic component 60 during film formation is reduced. However, in the plate mounting portion 2, the part-embedded sheet 67 is lifted in the direction away from the adhesive sheet 64 in an environment where air exists, so that air bubbles are prevented from entering.

When the frame 62 is in close contact with the adhesive sheet 64, the protective sheet 61, the cooling plate 63, and the frame 62 demarcate, and the non-adhesive surface 612 of the protective sheet 61 and the adhesive sheet 64 side of the cooling plate 63 are enclosed in the closed space 24b. be done. When the closed space 24b is formed, as shown in FIG. 10(c), negative pressure is also generated in the mounting table 22 while maintaining the negative pressure in the ceiling portion 21. As shown in FIG. The sealed space 24b between the cooling plate 63 on which the adhesive sheet 64 is placed and the protective sheet 61 is depressurized through the air holes 632 of the cooling plate 63 and the air holes 632 of the adhesive sheet 64 . At this time, the negative pressure generated in the mounting table 22 is a negative pressure slightly closer to the atmospheric pressure than the negative pressure generated in the ceiling portion 21, and is of a magnitude that can maintain the adsorption of the electronic component 60 to the ceiling portion 21. good.

When the pressure reduction of the sealed space 24b between the cooling plate 63 on which the adhesive sheet 64 is placed and the protective sheet 61 is completed, as shown in (d) of FIG. The negative pressure in the portion 21 is gradually changed to positive pressure. The component-embedded sheet 67 is gently sucked and pushed down toward the adhesive sheet 64 , and the component-embedded sheet 67 is pressed against the adhesive sheet 64 attached to the cooling plate 63 . The component-embedded sheet 67 is attached to the cooling plate 63 via the adhesive sheet 64 .

Finally, as shown in (e) of FIG. 10, by moving the ceiling portion 21 away from the mounting table 22, the component-embedded sheet 67, the adhesive sheet 64, and the cooling plate 63 are superimposed on each other. Release the pinch. As a result, the production of the component mounting plate 68 comprising the electronic component 60, the protective sheet 61, the adhesive sheet 64 and the cooling plate 63 is completed. The positive pressure generated in the ceiling portion 21 and the negative pressure generated in the mounting table 22 may be released while the ceiling portion 21 is being separated from the mounting table 22 .

That is, the ceiling portion 21, the pusher 23, and the mounting table 22 serve as driving portions for bringing the component-embedded sheet 67 and the cooling plate 63 closer together. The ceiling portion 21 and the mounting table 22 serve as a fixing portion that sandwiches the component-embedded sheet 67 and the cooling plate 63, and also serves as a pressing portion that presses the frame 62 and the cooling plate 63 to bring them into close contact with each other. Further, the air pressure supply hole 223 of the mounting table 22 serves as a decompression section for decompressing the sealed space 24b between the component-embedded sheet 67 and the cooling plate 63. As shown in FIG. Also, the air hole 213 of the ceiling portion 21 serves as a decompression portion that decompresses the sealed space 24 a between the flat surface 212 of the ceiling portion 21 and the component-embedded sheet 67 .

The flat surface 212 of the ceiling portion 21 generates negative pressure between the component-embedded sheet 67 and the cooling plate 63 prior to reducing the pressure between the component-embedded sheet 67 and the cooling plate 63 . Separating means for preventing the entry of air bubbles and suction means for pressing the component-embedded sheet 67 against the cooling plate 63 by positive pressure in combination with suction by the negative pressure of the mounting table 22 . The mounting table 22 serves as a suction means for bringing the component-embedded sheet 67 into close contact with the cooling plate 63 by a negative pressure together with the pressing by the positive pressure of the ceiling portion 21 .

In this manner, the plate mounting section 2 attaches the protective sheet 61 in which the electrodes 602 of the electronic component 60 are embedded to the cooling plate 63 . The plate mounting section 2 has a decompression section that decompresses the space between the component arrangement area 615 and the cooling plate 63 . After decompression by the decompression unit, the protective sheet 61 and the cooling plate 63 are pressed against each other. As a result, air bubbles do not enter between the protective sheet 61 and the cooling plate 63, and a sufficient heat transfer area to the cooling plate 63 can be secured.

Further, the plate mounting portion 2 sucks up the protective sheet 61 by negative pressure on the flat surface 212 of the ceiling portion 21 , i.e., on the side opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween, thereby separating the cooling plate 63 and the protective sheet 61 . It is designed to have air holes 213 that are spaced apart. The air hole 213 maintains the negative pressure until the decompression between the component-embedded sheet 67 and the cooling plate 63 by the decompression unit is completed. As a result, it is possible to prevent the protective sheet 61 and the cooling plate 63 from sticking to each other in a state in which decompression is not completed, further reducing the risk of air bubbles entering between the protective sheet 61 and the cooling plate 63, thereby reducing the pressure on the cooling plate. A sufficient heat transfer area to 63 can be secured.

The air hole 213 opened in the flat surface 212 of the ceiling portion 21 is closed before the pusher 23 descends and the ceiling portion 21 comes into contact with the mounting table 22 via the frame 62 of the component-embedded sheet 67, that is, before the component is mounted. Negative pressure is generated before the embedded sheet 67 and the cooling plate 63 approach each other, at the latest before the space between the cooling plate 63 provided with the adhesive sheet 64 and the protective sheet 61 is defined. . This prevents the protective sheet 61 from accidentally sticking to the cooling plate 63 before the pusher 23 on which the protective sheet 61 (component-embedded sheet 67) is set starts to descend.

Further, the plate mounting portion 2 has the flat surface 212 of the ceiling portion 21 . This flat surface 212 is located opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween, and faces the electronic component 60 . An air hole 213 for separating the cooling plate 63 and the protective sheet 61 until the pressure reduction between the component-embedded sheet 67 and the cooling plate 63 is completed is opened to the flat surface 212 . As a result, the protective sheet 61 does not bend due to the pressure difference between the front and back surfaces of the protective sheet 61 during decompression, and the protective sheet 61 can follow the protective sheet 61 flatly. It is possible to prevent the situation of peeling off from 61 .

The air holes 213 on the ceiling 21 side are designed to press the protective sheet 61 toward the cooling plate 63 after the pressure between the component-embedded sheet 67 and the cooling plate 63 is decompressed, and then the pressure is changed from generating negative pressure to generating positive pressure. made it That is, the air hole 213 also serves as a separation of the protective sheet 61 from the cooling plate 63 , a decompression section, and a means for pressing the protective sheet 61 and the cooling plate 63 together. However, separate air holes may function as separation, depressurization, and contact means.

For example, as in this embodiment, the cooling plate 63 is provided with the air holes 632 . The plate mounting part 2 has a mounting table 22 on which the cooling plate 63 is mounted and which generates negative pressure. Then, the protective sheet 61 may be drawn to the cooling plate 63 through the mounting table 22 on which the cooling plate 63 is placed and the air holes 632 of the cooling plate 63 .

It should be noted that the operation mechanism of the ceiling portion 21 and the operation mechanism of the pusher 23 may employ known mechanisms, and the present invention is not limited to the mechanisms of the mechanisms.

For example, the ceiling portion 21 is connected to a ball screw having an axis extending from the ceiling portion 21 toward the mounting table 22 and a rail guide extending from the ceiling portion 21 toward the mounting table 22 . In this case, the ceiling portion 21 moves toward the mounting table 22 along the rails in the rotational direction of the screw shaft. The ball screw and the rail guide extend so that the ceiling part 21 approaches the mounting table 22 to the distance of the thickness H1 of the frame 62 of the component-mounted sheet 66 .

The pusher 23 has a cam follower at its rear end. The cam follower follows the peripheral surface of the oval cam. The cam is axially supported by a rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam and the pusher 13 is pushed up.

Further, as a method of defining the sealed space 24a and the sealed space 24b, the component-embedded sheet 67 and the cooling plate 63 are not used as defining means, but are defined by the ceiling portion 21 and the mounting table 22. may For example, one or both of the ceiling portion 21 and the mounting table 22 may be cup-shaped, and one space defined by the ceiling portion 21 and the mounting table 22 may be formed so as to include the component-embedded sheet 67 and the cooling plate 63. Further, the front and back sides of the component-embedded sheet 67 may be partitioned by the ceiling portion 21 and the mounting table 22 . However, in this case, it is desirable that the ceiling portion 21 has side walls extending toward the mounting table 22 while surrounding the flat surface 212 in which the air holes 213 are opened. This side wall is in close contact with the flat surface of the mounting table 22 to define one sealed space. The O-ring 215 is installed on the end face of the side wall.

(Deposition processing section)
Next, the film-forming processing part 3 which takes charge of the film-forming process is demonstrated. FIG. 11 is a schematic diagram showing the configuration of the film forming processing section 3. As shown in FIG. The film forming section 3 forms an electromagnetic wave shielding film 605 on each electronic component 60 on the component mounting plate 68 by sputtering. As shown in FIG. 11, the film forming processing section 3 has a chamber 31 and a load lock chamber 32 . The chamber 31 is a cylindrical vacuum chamber whose diameter is larger in the radial direction than in the axial direction. The interior of the chamber 31 is partitioned into a plurality of fan-shaped partitions by partitions 33 extending along the radial direction. A processing position 311 and a film forming position 312 are assigned to some fan-shaped sections.

The partition 33 extends from the ceiling surface of the chamber 31 toward the bottom surface, but does not reach the bottom surface. A rotary table 34 is installed in the space on the bottom side without the partition 33 . The rotary table 34 has a disk shape coaxial with the chamber 31 and rotates in the circumferential direction. The component mounting plate 68 introduced into the chamber 31 from the load-lock chamber 32 is placed on the rotary table 34 and travels around the processing position 311 and the film forming position 312 while rotating along a circular track.

In order to maintain the position of the component mounting plate 68 with respect to the turntable 34, the turntable 34 holds the component mounting plate 68 such as grooves, holes, protrusions, jigs, holders, mechanical chucks, or adhesive chucks. A retaining means is provided.

A surface treatment section 35 is installed at the treatment position 311 . A process gas such as argon gas is introduced into the surface treatment section 35, and a high frequency voltage is applied to convert the process gas into plasma to generate electrons, ions, radicals, and the like. For example, the surface-treated portion 35 is a cylindrical electrode that opens toward the rotary table 34, and is applied with a high-frequency voltage from an RF power source.

A target 361 constituting a sputtering source 36 is installed at the film forming position 312, and a sputtering gas, which is an inert gas such as argon gas, is introduced. The sputtering source 36 applies power to the target 361 to turn the sputtering gas into plasma, and causes the generated ions or the like to collide with the target to eject particles. The target 361 is made of the material of the electromagnetic wave shielding film 605 . That is, the particles of the electromagnetic wave shielding film 605 are ejected from the target 361 , and the ejected particles of the electromagnetic shielding film 605 are deposited on the electronic component 60 on the rotary table 34 .

For example, two film forming positions 312 are provided. The target material for each film forming position 312 may be the same material, or different materials may be used to form the laminated electromagnetic wave shielding film 605 . A known power supply such as a DC power supply, a DC pulse power supply, an RF power supply, or the like can be applied as the power supply for applying power to the sputtering source 36 of each film forming position 312 . A power source for applying power to the sputtering sources 36 may be provided for each sputtering source 36, or a common power source may be used by switching with a switch.

In such a film-forming processing unit 3, the surface of the electronic component 60 is cleaned and roughened by etching or ashing at the processing position 311, and the adhesion of the electromagnetic wave shielding film 605 to the electronic component 60 is improved. Also, by depositing the particles of the target 361 on the electronic component 60 at the film forming position 312 , the electromagnetic wave shielding film 605 is formed on the electronic component 60 . Since the electrode 602 is embedded in the protective sheet 61 and the exposed electrode surface 601 is in close contact with the protective sheet 61, the particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602, and the exposed electrode surface 601 and the protective sheet are prevented from adhering. 61, particles of the electromagnetic wave shielding film 605 are prevented from entering. Furthermore, the heat of the electronic component 60 is transferred to the cooling plate 63, and excessive heat accumulation in the electronic component 60 is suppressed.

In addition, although this film-forming process part 3 forms a film on the electronic component 60 using a sputtering method, the film-forming method is not restricted to this. For example, the film-forming processing unit 3 may form the electromagnetic wave shielding film 605 on the electronic component 60 by vapor deposition, spray coating, application, or the like.

(Plate release part)
Next, the plate releasing section 4 that performs the plate releasing process will be described. FIG. 12 is a schematic diagram showing the configuration of the plate releasing section 4. As shown in FIG. After the electromagnetic wave shielding film 605 is formed, the component mounting plate 68 is put into the plate release portion 4 . As the first step for obtaining the individual electronic components 60 , the plate releasing section 4 peels off the component-embedded sheet 67 from the cooling plate 63 .

As shown in FIG. 12 , the plate releasing section 4 includes a ceiling section 41 and a mounting table 42 . The ceiling part 41 and the mounting table 42 are arranged to face each other. The mounting table 42 is stationary. On the other hand, the ceiling part 41 can be raised and lowered with respect to the mounting table 42 . The ceiling portion 41 approaches the mounting table 42 at least by a distance corresponding to the thickness H1 of the frame 62 of the component mounting plate 68 .

The ceiling part 41 is a block having an internal space 411 and has a flat surface 412 on the surface facing the mounting table 42 . The mounting table 42 has a bottomed cup shape, and the opening 421 faces the ceiling portion 41 . A flat surface 412 of the ceiling portion 41 has the same shape as the component mounting plate 68 or is wider than the component mounting plate 68 . On the other hand, the opening 421 of the mounting table 42 has an area including the part arrangement area 615 or more and the middle frame area 614 or less. The edge 422 around the opening 421 of the mounting table 42 has a width equal to or greater than the width of the frame 62 .

In this mounting table 42 , the edge 422 supports the component mounting plate 68 and the opening 421 is closed by the component mounting plate 68 . The cooling plate 63 side contacts the edge 422 . An air pressure supply hole 423 is provided through the bottom of the mounting table 42 . The air pressure supply hole 423 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe and the like (not shown). Therefore, a positive pressure is generated in the air hole 632 of the component mounting plate 68 placed so as to block the opening 421 .

Furthermore, a pusher insertion hole 424 is provided through the edge portion 422 of the mounting table 42 . The insertion position of the pusher insertion hole 424 coincides with the pusher insertion hole 631 of the cooling plate 63. On the other hand, when the component mounting plate 68 is mounted, the guide section insertion hole 621 of the frame 62 is avoided and is closed by the frame 62. position. The pusher 43 is inserted through the pusher insertion hole 424 . The pusher 43 moves in the axial direction so that the tip thereof can protrude to a position higher than the frame 62 of the component mounting plate 68 placed on the mounting table 42 .

The pusher 43 separates the component-embedded sheet 67 from the cooling plate 63 against the adhesive force of the adhesive sheet 64, separates the component-embedded sheet 67 from the cooling plate 63, and moves the component-embedded sheet 67 parallel. It is installed with sufficient rigidity, number and positional relationship so that it can be lifted and supported. For example, if the frame 62 has a rectangular outer shape, the rods are arranged corresponding to each corner of the frame 62 . The pusher insertion holes 424 are also provided corresponding to the number and positional relationship of the pushers 43 .

A pair of clamping blocks 44 are arranged on both sides of the mounting table 42 . The sandwiching block 44 sandwiches only the cooling plate 63 among the component mounting plates 68 placed on the mounting table 42 . That is, the pair of holding blocks 44 are arranged at the same height as the cooling plate 63 mounted on the mounting table 42 and have the same thickness as the cooling plate 63 . The clamping blocks 44 can move toward and away from each other with the cooling plate 63 as the center. However, the holding block 44 is immovable in the direction in which the ceiling portion 41 and the mounting table 42 are arranged side by side.

Next, a large number of air holes 413 communicating with the internal space 411 are provided through the flat surface 412 of the ceiling portion 41 . The penetration range of the air holes 413 is the same size and shape as the inner side of the frame 62 of the protective sheet 61 , or at least the same size and shape as the component arrangement area 615 . The penetrating position of the air hole 413 is the position where the component arrangement area 615 covers when the component mounting plate 68 is placed on the mounting table 42 .

An air pressure supply hole 414 is provided through the interior space 411 of the ceiling portion 41 at a location different from the flat surface 412 . The air pressure supply hole 414 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe and the like (not shown). Therefore, a negative pressure is generated in the air hole 413 through the air pressure supply hole 414 and the internal space 411 .

Further, on the flat surface 412 of the ceiling portion 41 , an O-ring 415 is installed along the frame 62 of the component mounting plate 68 placed on the mounting table 42 to surround the penetrating range of the air hole 413 .

FIG. 13 shows the operation flow of such a plate release unit 4. As shown in FIG. 13A and 13B are transition diagrams schematically showing the states of the plate releasing unit 4 in each step. First, as shown in (a) of FIG. 13 , the ceiling part 41 is separated from the mounting table 42 and the pusher 43 is buried in the pusher insertion hole 424 of the mounting table 42 . Then, the component mounting plate 68 is mounted on the mounting table 42 . When the component mounting plate 68 is placed, the holding block 44 fixes the cooling plate 63 .

Next, as shown in FIG. 13B, the ceiling portion 41 is lowered toward the mounting table 42, and the flat surface 412 of the ceiling portion 41 is brought into contact with the frame 62 of the component mounting plate 68. Then, as shown in FIG. At this time, height H1 from the surface of component array area 615 to the upper surface of frame 62 is higher than height H2 from the surface of component array area 615 to top surface 603 of electronic component 60 . Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 412 of the ceiling portion 41 . Therefore, at least the component arrangement area 615 is confined in the closed space 45 defined by the ceiling portion 41 , the protective sheet 61 and the frame 62 and sealed with the O-ring 415 .

When the component arrangement area 615 is confined in the sealed space 45, a negative pressure is generated in the ceiling portion 41 and a positive pressure is generated in the mounting table 42, as shown in FIG. 13(c). As a result, a component arrangement area 615 inside the frame 62 is subjected to a force to be sucked up by the flat surface 412 of the ceiling portion 41 and a force to be pushed up in a direction away from the mounting table 42 and toward the flat surface 412 of the ceiling portion 41 . Due to this suction force and push-up force, a force sufficient to separate the component array region 615 from the cooling plate 63 acts on the component array region 615 , and the component array region 615 is separated from the cooling plate 63 .

When the component array area 615 is peeled off, the protective sheet 61 is flat without distortion, so the momentum of the component array area 615 toward the flat surface 412 of the ceiling portion 41 is small, and the electronic components 60 are peeled off from the protective sheet 61 or A situation in which the electronic component 60 protrudes from the protective sheet 61 is prevented. Even if the component arrangement area 615 were to be peeled off forcefully, the flat surface 412 of the ceiling portion 41 would be there and the electronic components 60 would be restrained by the flat surface 412. The risk of falling off the seat 61 is reduced.

In order to further enhance the effect of reducing the risk of the electronic component 60 peeling off from the protective sheet 61 or coming off, the top surface 603 of the electronic component 60 and the flat surface 603 of the electronic component 60 are separated from each other before the protective sheet 61 is peeled off from the cooling plate 63 . 412 is preferably as small as possible. Therefore, the distance between the top surface 603 of the electronic component 60 and the flat surface 412 should be set to the minimum necessary distance for peeling off the protective sheet 61 from the cooling plate 63 . Further, the air holes 632 to which the positive pressure acts on the plurality of air holes 632 of the cooling plate 63 gradually increase, for example, from one end of the cooling plate 63 to the other end. A plurality of systems for generating positive pressure may be provided by partitioning the space within the opening 421 of the mounting table 42 into a plurality of sections so that the number of air holes 632 to which the pressure acts increases. By doing so, it is possible to prevent the component arrangement region 615 from peeling off from the cooling plate 63 at once, and it is possible to suppress the electronic components 60 from rushing toward the flat surface 412 of the ceiling portion 41 .

When the component array area 615 is peeled off, the electronic components 60 come into contact with the flat surface 412 of the ceiling portion 41, the protective sheet 61 bends only in the middle frame area 614, and at least the component array area 615 remains flat. In other words, if the flat surface 412 of the ceiling portion 41 were not present, the protective sheet 61 would bend in the presence of air. As a result, the electronic components 60 may be peeled off from the protective sheet 61, but since the component arrangement area 615 maintains a flat state, the electronic components 60 are prevented from being peeled off.

When the component arrangement area 615 is separated from the cooling plate 63, as shown in FIG. It is brought into contact with the frame 62 through the hole 631 . Then, the pusher 43 is advanced further, and at the same time the ceiling part 41 is separated from the mounting table 42 at the same speed as the pusher 43 . Since the cooling plate 63 is gripped by the clamping block 44 and remains stationary, the outer frame region 613 to which the frame 62 is attached is also peeled off from the cooling plate 63 , and the entire protective sheet 61 is peeled off from the cooling plate 63 . At this time, the positive pressure of the mounting table 42 and the negative pressure of the ceiling portion 41 are maintained. Therefore, the situation where the component arrangement area 615 hangs down toward the cooling plate 63 due to its own weight and adheres again is suppressed.

Finally, as shown in (e) of FIG. 13, the pusher 43 is stopped and the ceiling part 41 is moved further away from the mounting table 42, thereby releasing the clamping of the component-embedded sheet 67 and cooling it. The peeling of the protective sheet 61 from the plate 63 is completed. The positive pressure on the mounting table 42 and the negative pressure on the ceiling portion 41 may be released during this period.

That is, the ceiling portion 41 serves as a fixing portion that presses down the frame 62 located outside the component arrangement area 615 . The air pressure supply hole 423 of the mounting table 42 serves as a positive pressure generating hole, pressurizes the component arrangement area 615 through the air hole 632 of the cooling plate 63, and separates the component arrangement area 615 from the cooling plate 63 before the frame 62. It is pressurizing means. The air holes 413 of the ceiling portion 41 serve as negative pressure generating holes, attracting the component arrangement area 615 and assisting separation from the cooling plate 63 .

In addition, the flat surface 412 of the ceiling portion 41 serves as a restraining means for suppressing the peeling or falling off of the electronic components 61 from the protective sheet 61 when the component arrangement area 615 is peeled off. It serves as flattening means for preventing the part 60 from being peeled off from the protective sheet 61 . The pusher 43 serves as pushing-up means for peeling the frame 62 from the cooling plate 63 after the component arrangement area 615 is peeled off.

In this way, the plate release unit 4 removes the cooling plate 63 after the film formation process. The plate release portion 4 is provided with a positive pressure generation hole, for example, the air pressure supply hole 423 of the mounting table 42, and a fixing portion, for example, the ceiling portion 41. As shown in FIG. The positive pressure generating holes face the cooling plate 63 and are provided in a range including the component arrangement area 615 to generate positive pressure. While the positive pressure generating hole is pressurizing the component arrangement area 615, the fixing part holds down a portion of the protective sheet 61 outside the component arrangement area 615, such as the frame 62, so that the component arrangement area 615 is cooled. After leaving the plate 63, the pressing is released.

As a result, since the protective sheet 61 maintains flatness when the component array area 615 is peeled off, it is possible to prevent the component array area 615 from popping up due to the recoil of the protective sheet 61 returning to the flat state. Therefore, the electronic component 60 is prevented from being peeled off from the protective sheet 61 and falling off.

Further, the plate release portion 4 has a flat surface 412 of the ceiling portion 41 separated from the protective sheet 61 on the side of the ceiling portion 41 , that is, opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween. This flat surface 412 is designed to hold down the bulge of the component array area 615 while the component array area 615 is being pressed. As a result, the component arrangement area 615 is flattened, and the electronic component 60 can be prevented from peeling off. In addition, even if the component arrangement area 615 jumps up, the flat surface 412 stops the electronic components 60, so that the electronic components 60 can be further prevented from coming off the protective sheet 61.例文帳に追加

Further, the plate release portion 4 has a negative pressure generating hole for generating negative pressure so as to face the protective sheet 61 . As an example, air holes 413 for generating negative pressure are provided in the flat surface 412 of the ceiling portion 41 . The air holes 413 pressurize the component arrangement area 615 by the air holes 632 and attract the protective sheet 61 . Therefore, the protection sheet 61 can be peeled off from the cooling plate 63 by assisting the application of pressure to the component array region 615, and peeling errors are less likely to occur.

Moreover, the plate releasing part 4 is provided with a pusher 43 . After the component arrangement area 615 is separated from the cooling plate 63 , the pusher 43 advances inside the cooling plate 63 and pushes up the pressed portion of the frame 62 or the like in a direction away from the cooling plate 63 . As a result, the entire protective sheet 61 can be peeled off after the component array region 615 is peeled off. Incidentally, the fixed portion, for example, the ceiling portion 41, may be separated from the protective sheet 61 as the pusher 43 advances when the pressing is released.

Incidentally, the operation mechanism of the ceiling portion 41, the operation mechanism of the clamping block 44, and the operation mechanism of the pusher 43 may adopt known mechanisms, and the present invention is not limited to the mechanism of the mechanism.

For example, the ceiling portion 41 is connected to a ball screw having an axis extending from the ceiling portion 41 toward the mounting table 42 and a rail guide extending from the ceiling portion 41 toward the mounting table 42 . In this case, the ceiling part 41 moves toward the mounting table 42 along the rails in the rotational direction of the screw shaft. The ball screw and the rail guide extend so that the ceiling part 41 approaches the mounting table 42 to the distance of the thickness H1 of the frame 62 of the component-mounted sheet 66 .

In addition, on the outer side of the clamping block 44 , the peripheral surfaces of the egg-shaped cams are individually brought into contact with the pair of clamping blocks 44 . The cam is axially supported by a rotary motor and is rotatable in the circumferential direction. When the rotating motor is driven, the cam rotates, and the bulging portion of the cam hits the clamping block 44 , the clamping block 44 is pushed toward the cooling plate 63 and clamps the cooling plate 63 .

The pusher 43 has a cam follower at its rear end. The cam follower follows the peripheral surface of the oval cam. The cam is axially supported by a rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam and the pusher 43 is pushed up.

Further, the plate release unit 4 causes the mounting table 42 to generate positive pressure to separate the protective sheet 61 from the cooling plate 63 . The flat surface 412 of the ceiling portion 41 has an additional function of flattening the protective sheet 61 that has been peeled off. It is an additional function. Therefore, as shown in FIG. 14, the ceiling portion 41 may have a rectangular tubular shape with the opening edge abutting against the frame 62, and the flat surface 412 may be omitted. Further, as shown in FIG. 15 , the air holes 413 may be omitted from the flat surface 412 of the ceiling portion 41 .

(Peeling treatment part)
Finally, the peeling processing unit 5 that performs the component peeling process will be described. FIG. 16 is a schematic diagram showing the configuration of the peeling processing section 5. As shown in FIG. The component-embedded sheet 67 from which the cooling plate 63 has been removed is fed to the peeling processing unit 5 through the plate releasing unit 4 , and the individual electronic components 60 are peeled off from the protective sheet 61 as the final step. Note that the peeling processing unit 5 may also be referred to as a peeling processing device when separated from the film forming device 7 .

As shown in FIG. 16, the peeling processing unit 5 includes a mounting table 51 on which a component-embedded sheet 67 is mounted, a chuck 52 that grips the protective sheet 61 and moves continuously, and a Equipped with a guide portion 53 that hooks the end to create a trigger for the chuck 52 to grip the protective sheet 61, a sheet stopper 54 that creates a peeling starting point for the protective sheet, and a component stopper 55 that prevents the electronic component 60 from floating. ing.

The mounting table 51 has a flat surface 511 on which the component-embedded sheet 67 is mounted. The component-embedded sheet 67 is placed with the electronic component 60 facing the flat surface 511, the top surface 603 of the electronic component 60 in contact with the mounting surface, and the protective sheet 61 facing upward. The flat surface 511 is made of a non-slip member with adhesive strength, and the stationary property of the electronic component 60 is improved. In addition, the outer peripheral area of the flat surface 511 extends from the height H1 from the surface of the component arrangement area 615 to the end face of the frame 62 to the top surface 603 of the electronic component 60 from the surface of the component arrangement area 615 so that the frame 62 can enter. The electronic component 60 is placed on the flat surface 511 while the protective sheet 61 remains flat.

This mounting table 51 is a block having an internal space 512 . A large number of air holes 513 are formed through the flat surface 511 of the mounting table 51 in a region facing the component arrangement region 615 . The air hole 513 communicates with the internal space 512 of the mounting table 51 . An air pressure supply hole 514 is provided through the internal space 512 of the mounting table 51 at a location different from the flat surface 511 . The air pressure supply hole 514 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe and the like (not shown). Therefore, a negative pressure is generated in the air hole 513 through the air pressure supply hole 514 and the internal space 512 . The edge of the mounting table 51 is provided with a guide portion insertion hole 515 that matches the guide portion insertion hole 621 of the frame 62 when the component-embedded sheet 67 is placed thereon.

The chuck 52 is a pair of blocks with gripping surfaces facing each other. A pair of blocks can be connected and separated. The chuck 52 is supported by a moving device that is horizontally and vertically movable, and moves along the protective sheet 61 placed on the flat surface 511 of the mounting table 51 at an attack angle of 45 degrees with respect to the flat surface 511 . move continuously. That is, the chuck 52 separates from the mounting table 51 while vertically moving along the flat surface 511 of the mounting table 51 . Continuous movement means moving preferably at a constant speed without stopping on the way. The movement range of the chuck 52 is from the end of the protective sheet 61 where the gripping trigger is created to the opposite end of the end. The longitudinal movement direction of the chuck 52 is the direction from the end of the protective sheet 61 where the gripping trigger is created to the opposite end of the end. For example, as shown in FIG. 17, it is the direction from the end of the protective sheet 61 on the guide portion insertion hole 621 side of the frame 62 to the opposite end of the end.

The sheet stopper 54 is a roller that has a cylindrical shape with a long axis that crosses one side of the protective sheet 61 and that can rotate about its axis. This transverse direction is the direction perpendicular to the direction of movement of the chuck 52 (see FIG. 17). The sheet stopper 54 can be made of metal such as stainless steel. Further, the diameter of the sheet stopper 54 can be set to 5 mm to 10-odd mm when the length across the protective sheet 61 is about 200 mm to 300 mm. In this embodiment, a cylindrical body made of stainless steel and having a diameter of 6 mm is used.

The sheet stopper 54 maintains a constant height with respect to the flat surface 511 of the mounting table 51, maintains a position right below the chuck 52, and extends the protective sheet 61 mounted on the mounting table 51 along the direction perpendicular to the long axis. to move across. The installation height of the sheet stopper 54 matches the total height of the electronic component 60 excluding the electrode 602 and the protective sheet 61 . That is, the sheet stopper 54 runs while pressing the non-adhesive surface 612 of the protective sheet 61 . The degree of pressing should be such that the electrode 602 is not damaged, rubbed, or crushed. The movement range of the sheet stopper 54 is from the edge of the guide portion insertion hole 621 of the frame 62 to the opposite end of the protective sheet 61 just before the guide portion 53 .

The component stopper 55 is a roller that has a cylindrical shape with a long axis that traverses at least the entire component arrangement region 615 of the protective sheet 61 and that can rotate about its axis. The component stopper 55 can be made of metal such as stainless steel. The diameter of the component stopper 55 may be determined in consideration of the diameter of the sheet stopper 54 and the size of the electronic component 60. However, if the diameter is set to be smaller than the diameter of the sheet stopper 54, it can be arranged closer to the sheet stopper 54. becomes possible. In this embodiment, a cylindrical body made of stainless steel and having the same diameter as the sheet stopper 54 is used.

The component stopper 55 is arranged so as to be able to approach and separate from the sheet stopper 54 . While the chuck 52 and the sheet stopper 54 are moving across the mounting table 51 , the component stopper 55 follows the sheet stopper 54 while maintaining a constant distance. The constant distance is less than the length of the electronic component 60 attached to the protective sheet 61 (the length in the movement direction of the component stopper 55). When the chuck 52 and the sheet stopper 54 are positioned at the end of the mounting table 51 , the component stopper 55 is positioned opposite the sheet stopper 54 across the guide insertion hole 621 .

The guide portion 53 is arranged at a position coaxial with the guide portion insertion hole 621 of the frame 62 . The guide portion 53 is arranged in the guide portion insertion hole 515 and its tip faces the guide portion insertion hole 621 of the frame 62 . This guide part 53 is movable in the axial direction, protrudes toward the edge of the protective sheet 61 , pushes the edge of the protective sheet 61 up toward the chuck 52 , and moves the frame 62 until the edge of the protective sheet 61 reaches the chuck 52 . advances through the guide portion insertion hole 621 of the . This guide part 53 peels off one side of the protective sheet 61 by pushing up. Therefore, the guide portion insertion hole 621 has a pin shape and is provided at a plurality of locations along one side of the protective sheet 61 .

For example, as shown in FIG. 17 , the penetrating positions of the guide portion insertion holes 621 are set at equal intervals across the center of one side of the frame 62 . The guide portion 53 is installed corresponding to the guide portion insertion hole 621, and the guide portion 53 is formed in the shape of a round bar. Then, the chuck 52 and the sheet stopper 54 are longitudinally moved in a direction perpendicular to one side of the frame 62 to separate the electronic component 60 from the protective sheet 61 .

FIG. 18 shows the operation flow of such a peeling processing unit 5. As shown in FIG. 18A and 18B are transition diagrams schematically showing states in each step of the peeling processing section 5. FIG. First, as shown in FIG. 18A, the component-embedded sheet 67 is placed on the mounting table 51 while the top surface 603 of the electronic component 60 is in contact with the flat surface 511 . That is, between the plate releasing section 4 and the peeling processing section 5, a reversing device is provided for vertically reversing the component-embedded sheet 67 separated from the cooling plate 63 by the plate releasing section 4. The finished sheet 67 is mounted on the mounting table 51 in an inverted state. A negative pressure is generated in the air hole 513 of the mounting table 51 to hold the electronic component 60 on the flat surface 511 . The sheet stopper 54 is moved to the edge of the guide portion insertion hole 621 of the frame 62 , and the chuck 52 is positioned directly above the guide portion insertion hole 621 of the frame 62 . The part stopper 55 is opened with respect to the sheet stopper 54 and positioned outside the guide portion insertion hole 621 of the frame 62 .

As shown in FIG. 18(b), the guide portion 53 is moved upward in the axial direction. The guide portion 53 moves through the guide portion insertion hole 621 of the frame 62 and reaches the end of the protective sheet 61 attached to the frame 62 . The guide portion 53 advances further and projects the edge of the protective sheet 61 away from the frame 62 . As a result, the edge of the protective sheet 61 begins to be peeled off by the guide portion 53 . As the guide portion 53 advances further, the edge of the protective sheet 61 is guided toward the chuck 52 while being sandwiched between the guide portion 53 and the sheet stopper 54 . It should be noted that the chuck 52 may also move toward the edge of the protective sheet 61 to pick up the edge of the protective sheet 61 while the guiding portion 53 is guiding the edge of the protective sheet 61 .

As shown in (c) of FIG. 18 , when the edge of the protective sheet 61 reaches the chuck 52 , the pair of blocks are closed and the chuck 52 grips the edge of the protective sheet 61 . When the chuck 52 grips the edge of the protective sheet 61, as shown in FIG. The stopper 55 and the sheet stopper 54 are moved closer to each other to a distance less than the length of the electronic component 60 .

As shown in (e) of FIG. 18 , the chuck 52 is pulled up while moving the chuck 52 and the sheet stopper 54 along the protective sheet 61 . Since the edge of the protective sheet 61 is gripped by the chuck 52 and the sheet stopper 54 is running on the protective sheet 61, the protective sheet 61 is lifted up by the chuck 52 with the sheet stopper 54 as a base point, and is moved with the sheet stopper 54 as a base point. The electronic component 60 is peeled off from the protective sheet 61 . When peeling the peeled protective sheet 61 while maintaining the vertical state, for example, the speed components of the horizontal movement and the vertical movement of the chuck 52 may be kept the same. If both speed components are the same, peeling can be performed continuously without stopping as long as it does not stop even if the moving speed changes.

At this time, as shown in FIG. 19, peeling of the electronic component 60 from the protective sheet 61 progresses, and only the end portion of the electronic component 60 is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51 . Then, the electronic component 60 tries to float so as to lift the peeling start end 60a. However, the component stopper 55 follows the sheet stopper 54 . This component stopper 55 presses the side of the separation start end 60a that is about to float. Therefore, the electronic component 60 is prevented from floating, and the gap 94 between the electrode 602 separated from the protective sheet 61 and the protective sheet 61 continues to exist. It is maintained on surface 511 . Further, since the sheet stopper 54 is a roller that can rotate about its axis, it rotates when the electronic component 60 is pressed down, and the friction with the electronic component 60 is suppressed.

Also, the sheet stopper 54 moves while pressing the non-adhesive surface 611 of the protective sheet 61 . Therefore, until the peeling of the electronic component 60 starts and only the end portion of the electronic component 60 being peeled is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51, the sheet stopper 54 is also electronically controlled. This prevents the component 60 from following the peeled protective sheet 61 . However, from the viewpoint of exerting the function of creating the starting point for peeling by the sheet stopper 54 , it is not essential that the sheet stopper 54 presses the non-adhesive surface 612 of the protective sheet 61 while traveling. That is, the sheet stopper 54 may be moved to a position slightly separated from the protective sheet 61 .

Then, as shown in FIG. 18(f), when the chuck 52 and the sheet stopper 54 completely traverse the component arrangement region 615 of the protective sheet 61, all the electronic components 60 are separated from the protective sheet 61 and placed on the mounting table. 51 on the flat surface 511 . By recovering the electronic component 60, the formation of the electromagnetic wave shielding film 605 in the film forming apparatus 7 is completed. The angle of attack at which the chuck 52 separates from the mounting table 51 while traversing the flat surface 511 of the mounting table 51 is not limited to 45 degrees. The protective sheet 61 may be removed by fixing the position of the chuck 52 and continuously moving the mounting table 51, or both the chuck 52 and the mounting table 51 may be movable. good. That is, the chuck 52 and the mounting table 51 should be relatively moved.

FIG. 20 is a photograph of the electrode 602 taken after the electronic component 60 has been peeled off from the protective sheet 61 by the peeling processor 5 . According to the peeling processing unit 5, the protective sheet 61 is always kept flat by the sheet stopper 54, and once the protective sheet 61 is peeled off, the protective sheet 61 returns to the electronic component 60 and re-adheres. can be prevented. Further, the position of the electronic component 60 is fixed by the component stopper 55 and the air hole 513 of the mounting table 51, and it is possible to prevent the electronic component 60 from catching up with the protective sheet 61 and re-adhering. As a result, as shown in FIG. 20, no residue of the protective sheet 61 was found on the electrodes 602 of the electronic component 60 .

In this manner, the peeling processing section 5 peels the electronic component 60 from the protective sheet 61 after the film formation by the film forming processing section 3 . The peeling processing section 5 includes a mounting table 51 , a chuck 52 , and a fixing section for fixing the position of the electronic component 60 . The mounting table 51 supports the electronic component 60 attached to the protective sheet 61 . The chuck 52 grips the end of the protective sheet 61, moves relative to the mounting table 51, and continuously peels the protective sheet 61 toward the opposite end of the end. The fixing portion fixes the position of the electronic component 60 when the electronic component 60 is peeled off from the protective sheet 61 . As a result, the electronic component 60 and the protective sheet 61 are prevented from re-attaching to each other after being once peeled off, and the generation of the residue 93 of the protective sheet 61 on the electronic component 60 can be suppressed.

The fixed portion is, for example, the component stopper 55 or the flat surface 511 of the mounting table 51 through which the air holes 513 are provided. The component stopper 55 follows the sheet stopper 54 while maintaining a distance less than the length of the electronic component 60 to prevent the electronic component 60 from floating. The mounting table 51 sucks the electronic component 60 to prevent it from floating. However, as long as the mounting table 51 has a function as a fixing portion, it is not necessary to employ suction by the air holes 513 . For example, the mounting table 51 may be an adhesive chuck, an electrostatic chuck, or a mechanical chuck as long as the electronic component 60 can be fixed.

Further, a guide portion 53 protruding toward the end portion of the protective sheet 61 is provided. The chuck 52 is positioned at the projecting end of the guide portion 53 before gripping the edge of the protective sheet 61 . The guide portion 53 faces the chuck 52 and guides the edge of the protective sheet 61 to the chuck 52 . As a result, it is possible to create an opportunity for the chuck 52 to hold the electronic component 60 and the protective sheet 61, thereby reducing the possibility that the electronic component 60 and the protective sheet 61 are separated.

Also, a sheet stopper 54 is provided which moves along the protective sheet 61 together with the chuck 52 and forms a starting point for peeling. The sheet stopper 54 is positioned in the vicinity of the projecting end of the guide portion 53 , pinches the edge of the protective sheet 61 peeled off by the guide portion 53 together with the guide portion 53 , and guides it to the chuck 52 . As a result, the chuck 52 can more reliably grip the edge of the protective sheet 61 and reduce the possibility of mis-separation of the electronic component 60 and the protective sheet 61 .

Note that the sheet stopper 54 has been described as an example of a cylindrical body having an axis perpendicular to the moving direction of the sheet stopper 54, but it may be a plate-shaped body or a block body as long as it can travel while pressing the protective sheet 61. good. Also, the component stopper 55 has been described as an example of a cylindrical body having an axis orthogonal to the movement direction of the component stopper 55, but it may be a plate-like body, a block body, or a brush. When the component stopper 55 is a cylindrical body, it is a roller that can rotate about its axis, so that it rotates when pressing the electronic component 60 , and friction with the electronic component 60 is suppressed.

The operating mechanism of the chuck 52, the operating mechanism of the sheet stopper 54, the operating mechanism of the component stopper 55, and the operating mechanism of the guide portion 53 may employ known mechanisms, and the present invention is not limited to the mechanisms of the mechanisms. do not have.

For example, the chuck 52 can employ the following operating mechanism. That is, both blocks are supported by the base, and one block is positionally immovable with respect to the base. The other block is movable with respect to the one block. An egg-shaped cam abuts on the outside of the movable block. When the cam is rotated and the block reaches the major diameter range, the movable block is pushed by the cam and approaches the stationary block. Further, a compression spring is provided between the pair of blocks and biases the pair of blocks in a direction to widen the distance between the blocks. When the cam is rotated and the block reaches the short diameter range, the movable block is separated from the stationary block by the biasing force of the compression spring.

Also, for example, a ball screw and rail extending at an angle of 45 degrees with respect to the flat surface 511 of the mounting table 51 are arranged, and the base of the chuck 52 is fixed to the slider of the ball screw and grips the rail. . When the screw shaft of the ball screw is rotated by the motor, the chuck 52 moves along the rail from one end to the other end of the mounting table 51 .

Furthermore, with respect to the component stopper 55, a tension spring is interposed between the bases that support the component stopper 55 and the sheet stopper 54, and while urging the component stopper 55 and the sheet stopper 54 in a direction to approach each other, the component stopper 55 and the sheet stopper 54 are pulled apart. is arranged between the bases supporting the , and when the long diameter range of the cam is in contact with the base, the part stopper 55 and the sheet stopper 54 are biased in the direction of separating them against the biasing force of the tension spring. do.

Further, the guide portion 53 has a cam follower at the rear end portion. The cam follower follows the peripheral surface of the oval cam. The cam is axially supported by a rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulging portion of the cam and the guide portion 53 is pushed up.

In addition, the penetrating positions of the guide portion insertion holes 621 were set at equal intervals across the center of one side of the frame 62 . This makes it easy to peel off the entire side of the protective sheet 61 . The guide portion 53 is installed corresponding to the guide portion insertion hole 621, and the guide portion 53 is formed in the shape of a round bar. Then, the chuck 52 and the sheet stopper 54 are vertically traversed in a direction perpendicular to one side of the frame 62 to separate the electronic component 60 from the protective sheet 61 . The peeling processing part 5 is not limited to this, and various shapes of guide part insertion holes and guide parts can be adopted, and various peeling directions can be adopted.

For example, as shown in FIG. 21, it is possible to employ a guide portion 53 having a cross section such as a rectangular shape with rounded corners along one side of the frame 62, an elliptical shape, or a rectangular shape at the tip. According to the guide portion 53 , the area where the protective sheet 61 is protruded is widened, so that the protective sheet 61 can be easily turned over and the edge of the protective sheet 61 can easily reach the chuck 52 . Further, as shown in FIG. 22, instead of the guide portion insertion hole 621, a notch 622 including an arrangement area of the guide portion 53 may be formed in the frame 62. As shown in FIG. Further, as shown in FIG. 23, the guide portion insertion hole 621 is arranged at the corner portion of the frame 62, and the chuck 52 and the sheet stopper 54 are moved diagonally with the corner portion of the frame 62 as the separation starting point, The protective sheet 61 may be peeled along the diagonal line.

(Peeling treatment part according to another embodiment)
A peeling processing unit 5 according to another embodiment will be described with reference to FIGS. 24 to 27. FIG. The same reference numerals are assigned to the same configurations and the same functions as those of the above-described embodiment, and detailed description thereof will be omitted, and only portions different from the above-described embodiment will be described.

FIG. 24 is a plan view of a peeling processing section 5 according to another embodiment. As shown in FIG. 24 , the peeling processing section 5 of the present embodiment includes a base 80 , a sheet supply table 81 , a stage 82 , a mounting table 51 , a chuck 52 , a guide section 53 and a discharge table 83 . , and the horizontal movement of the mounting table 51, the protective sheet 61 is peeled off. The base 80 has a horizontal upper surface, and the members 81 to 83 are arranged in parallel with the region R on the base 80 .

The sheet supply table 81 is a rectangular plate having a mounting surface on which the component-embedded sheet 67 is mounted, and is configured to be vacuum chuckable. This component-embedded sheet 67 is a component-embedded sheet 67 in which a notch 622 is provided in the frame 62 as shown in FIG.

The sheet supply table 81 is rotatable. Here, the sheet supply table 81 is connected to a rotating mechanism 81a having a rotating shaft 811a parallel to one side thereof, and rotates 180 degrees around the rotating shaft 811a. That is, the sheet supply table 81 is turned upside down symmetrically about the rotation axis 811a.

The stage 82 is a plate-like body on which the mounting table 51 is mounted, and is provided at a position facing the inverted sheet supply table 81 . The stage 82 is configured to slide in a direction parallel to the rotating shaft 811a. Here, the stage 82 is connected to a drive section 821, and linearly moves along a pair of guides 822 provided parallel to the rotation shaft 811a using the drive section 821 as a drive source.

The mounting table 51 is mounted on the stage 82 and chucked by a vacuum chuck. The mounting table 51 is positionally fixed on the stage 82 because the stage 82 moves in that state. The mounting table 51 has a configuration similar to that of the mounting table 51 of the above embodiment, but is partially different. The different configurations are mainly described below. That is, one end of the mounting table 51 is shaped like a comb, and the comb-like portion protrudes from the stage 82 when placed on the stage 82 . Here, the one end portion of the mounting table 51 is the end portion located on the side opposite to the side where the chuck 52 is located in the state shown in FIG. The air pressure supply hole 514 is provided on the side surface of the mounting table 51 (see FIG. 27).

Moreover, the mounting table 51 is configured to be rotatable. Here, the mounting table 51 is rotatably and slidably connected to a rotating mechanism 83a having a rotating shaft 833a parallel to the rotating shaft 811a. Specifically, the mounting table 51 is provided with a bearing, and the rotating shaft 833a is inserted through the bearing. The mounting table 51 rotates 180° around the rotation axis 833a and is turned upside down symmetrically with respect to the rotation axis 833a. Further, the mounting table 51 linearly moves together with the stage 82 along the rotation shaft 833a. In other words, the rotation mechanism 83a has a driving portion for rotating the mounting table 51, but does not have a driving portion for linearly moving the mounting table 51. The linear movement of the mounting table 51 is guided by the rotating shaft 833a. Only.

The ejection table 83 is a plate-like body for ejecting electronic components separated from the protective sheet 61 of the component-embedded sheet 67 . A discharge tray 831 for collecting the electronic components 60 separated from the protective sheet 61 of the component-embedded sheet 67 is placed on the discharge table 83, and the discharge table 83 is configured so that the discharge tray 831 can be vacuum-chucked. It is The discharge table 83 is formed one size larger than the discharge tray 831 . A cylindrical member 83 b is provided in the outer peripheral area of the discharge table 83 , that is, in the area between the outer edge of the discharge tray 831 and the outer edge of the discharge table 83 . Here, the cylindrical members 83b are erected at the four corners of the discharge table 83. As shown in FIG. The cylindrical member 83b has stretchability and sealability, and is configured to be able to be depressurized through the interior of the cylinder. That is, through holes are provided at the four corners of the ejection table 83, and a cylindrical member 83b is provided so that the through holes communicate with the inside of the cylinder. Specifically, the tubular member 83b is formed in a bellows shape (see FIG. 27). Further, the cylindrical member 83b is formed longer than the thickness of the discharge tray 831, and the tip surface of the discharge tray 831 is positioned higher than the upper surface of the discharge tray 831 when the discharge tray 831 is placed on the discharge table 83. FIG.

The discharge table 83 is configured to be rotatable and provided at a position facing the mounting table 51 on the stage 82 . Here, the discharge table 83 is connected to a rotating mechanism 83a, rotates 180° around the rotating shaft 833a, and is turned upside down symmetrically about the rotating shaft 833a. Note that the rotation mechanism 83a rotates the mounting table 51 and the ejection table 83, and each of them is configured to be rotatable by 180°. Further, the rotating mechanism 83a guides the mounting table 51 so that it can move linearly, but the discharge table 83 only rotates. The rotating mechanism 83a for rotating the mounting table 51 and the discharging table 83 is not limited to a single one, and may be provided separately.

These sheet supply table 81 and discharge table 83 are arranged along a direction orthogonal to the moving direction of the stage 82 while sandwiching the guide 822 of the stage 82 . Here, a rectangular area where the sheet supply table 81 and the discharge table 83 are arranged, that is, a rectangular area indicated by broken lines in FIG. The supply of the component-embedded sheet 67 from the sheet supply table 81 to the mounting table 51 and the discharge of the electronic component 60 from the mounting table 51 to the discharge table 83, which will be described later, are performed within this area R.

The base 80 is provided with an opening 80a. This opening 80a is provided at a position outside the area R within the movement area of the stage 82. As shown in FIG. Here, it penetrates through the central portion of the base 80 .

The chuck 52 is provided above the opening 80 a and moves up and down in the vertical direction, that is, vertically with respect to the base 80 . That is, the chuck 52 is provided with an elevating mechanism 521 .

FIG. 25 is a partially enlarged perspective view of the peeling processing section 5 in which the chuck 52 grips the edge of the protective sheet 61. FIG. The chuck 52 includes a pair of plate-like bodies 52a and 52b, and one end of the protective sheet 61 is sandwiched between the pair of plate-like bodies 52a and 52b. That is, the facing surfaces on the tip side of the pair of plate-like bodies 52 a and 52 b serve as grip surfaces for gripping the protective sheet 61 . Further, the plate-like body 52b positioned on the region R side has a comb-like tip. A pair of plate-like bodies 52a and 52b are arranged perpendicularly to the base 80, one of the plate-like bodies 52a is fixed so as to maintain its state, and the other plate-like body 52b is a pair of scissors. By rotating around the fulcrum as shown, it comes into contact with and separates from one plate-like body 52a.

The guide portion 53 is provided below the opening 80a, and advances and retreats obliquely with respect to the base 80 through the opening 80a so as to approach the gripping surface of one plate-like body 52a as it rises. The forward/backward movement of the guide portion 53 is performed by a drive mechanism (not shown). The guide portion 53 is a plate-like body having a comb-shaped tip, and is arranged with the tip directed obliquely upward with respect to the base 80 . The guide portion 53 has a tip portion formed so as to face the gripping surface of the plate-like body 52a in parallel with or lightly touch the grip surface of the plate-like body 52a when the guide portion 53 reaches the upward end in the oblique advancing/retreating direction. As the guide portion 53 advances obliquely upward through the opening 80a, the comb-shaped projections enter the recesses of the comb-shaped portion provided at one end of the mounting table 51, and the plate-shaped body 52b is moved upward. It enters into the recesses of the comb-like portion of the .

As shown in FIG. 24 , the lifting mechanism 521 is connected to a rotating mechanism 84 having a rotating shaft perpendicular to the base 80 . The rotating mechanism 84 is provided with a rotating arm 85 used for ejecting the protective sheet 61 peeled off by the chuck 52 . A suction cup 85 a is provided at the tip of the rotating arm 85 . The rotating arm 85 is reciprocally rotated by the rotating mechanism 84 between the recovery position shown in the figure and the adsorption position of the protective sheet 61 which is horizontally rotated 180° from this position. At this suction position, the suction cup 85a faces and chucks the protective sheet 61 from which the electronic component 60 has been peeled off. In addition, a plate-like body 86 is provided in a fixed position so as to face the suction cup 85a positioned at the suction position.

The operation of the peeling processing unit 5 having the configuration as described above will be described. First, the component-embedded sheet 67 is placed on the sheet supply table 81 with the electronic component 60 facing up and the protective sheet 61 facing down, and vacuum-chucked on the sheet supply table 81 . Further, the mounting table 51 is mounted on the stage 82 in the area R so that one end of the comb shape protrudes from the stage 82 .

In this vacuum-chucked state, the sheet supply table 81 is rotated by the rotation mechanism 81a. By this rotation, the component-embedded sheet 67 is sandwiched between the sheet supply table 81 and the mounting table 51 . At this time, the electronic component 60 is rotated and sandwiched so as not to give an impact. By this rotation and clamping, one end of the protective sheet 61 , that is, the notch 622 of the frame 62 in the component-embedded sheet 67 is positioned above the comb-shaped one end of the mounting table 51 .

After sandwiching the component-embedded sheet 67, the vacuum chuck of the sheet supply table 81 is released, and the sheet supply table 81 is rotated by the rotating mechanism 81a so as to return to its original position. Also, a negative pressure is generated in the air holes 513 of the mounting table 51 to suck the electronic component 60 of the component-embedded sheet 67 onto the flat surface 511 . This adsorption should be performed before the sheet supply table 81 is returned to its original position.

Next, the stage 82 on which the mounting table 51 is placed is linearly moved along the guide 822 to the side where the opening 80a is provided by the driving section 821, and one comb-shaped end of the mounting table 51 is positioned above the opening 80a. Stop. At this time, as shown in FIG. 25, the comb-like portion of the mounting table 51 and the chuck 52 face each other vertically.

In this state, first, the chuck 52 is lowered by the lifting mechanism. Further, as in the above embodiment, the sheet stopper 54 moves directly below the chuck 52 and lightly presses the non-adhesive surface 612 of the protective sheet 61 directly below the chuck 52 (state shown in FIG. 25).

After that, the guide portion 53 obliquely rises. When the guide portion 53 is raised, the component stopper 55 is retracted to a position where it does not contact the guide portion 53, as in the above embodiment. As the guide portion 53 advances obliquely upward through the opening 80a, as shown in FIG. . A notch 622 of the frame 62 of the component-embedded sheet 67 is positioned above one comb-shaped end of the mounting table 51, and thus one end of the protective sheet 61 is positioned. Therefore, one end of the protective sheet 61 is peeled off from the frame 62 by the leading end of the guide portion 53 that advances obliquely upward, and the protective sheet 61 is rolled up with the sheet stopper 54 as a base point.

At this time, the ends of the pair of plate-like bodies 52a and 52b of the chuck 52 are open, and one end of the rolled-up protective sheet 61 is positioned between the grip surface of the plate-like body 52a and the tip of the guide portion 53. Grasped. After that, the other plate-like body 52b is closed. That is, since the comb-shaped convex portion provided at the tip of the plate-like body 52b corresponds to the comb-shaped concave portion provided at the tip of the guide portion 53, the convex portion corresponds to the comb-shaped portion. The protection sheet 61 is gripped by entering the recess and sandwiching one end of the protection sheet 61 between the tips of the plate-like bodies 52a and 52b.

When the protective sheet 61 is gripped by the chuck 52 , the guide portion 53 descends obliquely and retreats below the base 80 . Also, the component stopper 55 moves from the position where contact with the guide portion 53 is avoided to the position where the distance between the sheet stopper 54 and the certain electronic component 60 is less than the length.

Next, the protective sheet 61 is peeled off. That is, the chuck 52 grips one end of the protective sheet 61 and is lifted by the lifting mechanism 521 , and the stage 82 on which the mounting table 51 is placed moves toward the region R along the guide 822 . At this time, the lifting of the chuck 52 and the movement of the stage 82 are performed at the same speed and at a constant speed without stopping halfway. Further, the operation at this time is performed in the same manner as the operation shown in (d) to (f) of FIG. 18 and FIG.

When the peeling of the protective sheet 61 is completed, the protective sheet 61 and the plate-like body 86 face each other. As shown in FIG. 26, the rotary arm 85 is rotated to the suction position by the rotary mechanism 84, the protective sheet 61 is sandwiched between the suction cup 85a at the tip of the rotary arm 85 and the plate-like body 86, and the protective sheet 61 is held by the suction cup 85a. do. The surface of the plate-like body 86 facing the protective sheet 61 is provided with unevenness so that the adhesive surface 611 of the protective sheet 61 does not stick to the plate-like body 86 . After the protective sheet 61 is held by the suction cups 85a, the gripping by the chuck 52 is released.

After holding the protective sheet 61, the rotating arm 85 is reversely rotated to return to the original position, that is, the recovery position. A recovery box (not shown) is provided below the recovery position. By releasing the holding of the protective sheet 61, the protective sheet 61 is dropped into the recovery box and the protective sheet 61 is recovered.

After the peeling of the protective sheet 61 is completed, the mounting table 51 sucks and holds the electronic component 60 peeled from the protective sheet 61 and supports the frame 62 . Further, the mounting table 51 is positioned within the region R due to the movement of the stage 82 . The discharge table 83 is rotated around a rotating shaft 833 a by a rotating mechanism 83 a to face the mounting table 51 while vacuum-chucking the discharge tray 831 placed thereon.

Here, since the cylindrical members 83b are erected at the four corners of the discharge table 83, as shown in FIG. , and the discharge tray 831, the frame 62, and the electronic component 60 face each other. At this time, the place on which the frame 62 is placed is dug down on the mounting table 51, and as shown in the figure, the upper surface of the frame 62 and the upper surface of the electronic component 60 (electrode exposed surface 601) are approximately the same height. It is.

In this state, the pressure inside the cylindrical member 83b is reduced. When the pressure inside the bellows-shaped tubular member 83 b is reduced, the tubular member 83 b contracts and the discharge table 83 approaches the mounting table 51 . As a result, the discharge tray 831 contacts the frame 62 and the electronic component 60 on the mounting table 51 . In other words, the frame 62 and the electronic component 60 are sandwiched between the discharge tray 831 and the mounting table 51 and fixed in position.

After that, the discharge table 83 is rotated by 180° around the rotation shaft 833a by the rotation mechanism 83a, and returns to its original position. At this time, the mounting table 51 is vacuum-chucked by the cylindrical member 83b because the pressure inside the cylindrical member 83b is maintained. Therefore, the rotation mechanism 83 a rotates the mounting table 51 together with the rotation of the ejection table 83 . During this rotation, the frame 62 and the electronic component 60 are sandwiched between the discharge tray 831 and the mounting table 51, so positional deviation of the electronic component 60 due to the rotation mechanism 83a can be suppressed.

After this rotation, the vacuum chuck of the mounting table 51 is released and a positive pressure is applied. This makes it easier to transfer the electronic component 60 to the discharge tray 831 . In addition, the surface of the discharge tray 831 has adhesiveness, which can suppress the displacement of the electronic components 60 during transfer. Then, the decompression of the cylindrical member 83b is stopped. After that, the mounting table 51 is rotated by 180° by the rotating mechanism 83 a and returned to the stage 82 . At this time, the frame 62 remains on the discharge tray 831 together with the electronic component 60 because it is only supported by the mounting table 52 . Then, the vacuum chuck of the discharge tray 831 by the discharge table 83 is released, and the discharge tray 831 on which the electronic component 60 and the frame 62 are placed is transported by a transport mechanism (not shown). This completes one peeling operation. The empty discharge tray 831 is conveyed by a conveying mechanism (not shown), placed on the discharging table 83 and vacuum-chucked, and the component-embedded sheet 67 is placed on the sheet supply table 81 by a conveying mechanism (not shown). The next peeling operation is started by the placement.

As described above, in the peeling processing unit 5 of the present embodiment, the tip of one side (the plate-like body 52b) of the chuck 52, the tip of the guide part 53, and one end of the mounting table 52 are comb-shaped. The guide portion 53 is lifted obliquely, and its tip is passed through the comb-shaped recess at one end of the mounting table 51 to peel the protective sheet 61 from the frame 62 and roll it up. It was sandwiched with the other (plate-like body 52a). Then, one side of the chuck 52 is closed from this state. Thereby, the protective sheet 61 can be more reliably gripped by the chuck 52 .

That is, in the shape of the guide portion 53 of the peeling processing portion 5 of the above-described embodiment, the push-up position of the guide portion 53 is restricted so that the guide portion 53 and the chuck 52 do not interfere with each other. For this reason, depending on the softness of the protective sheet 61 , there is a risk that the pushed-up edge of the protective sheet 61 may be bent so as to cover the tip of the guide portion 53 . In this state, the chuck 52 may fail to grip the protective sheet 61 . On the other hand, in the stripping processing unit 5 of another embodiment in which one of the guide part 53 and the chuck 52 and one end of the mounting table 52 are comb-shaped, the guide part 53 can be raised closer to the chuck 52 . . In addition, since the guide portion 53 moves diagonally with respect to the other side of the chuck 52 as the guide portion 53 rises obliquely, the guide portion 53 with the protective sheet 61 rolled up grips the other side of the chuck 52 . The protective sheet 61 can be pressed and sandwiched while being brought closer to the surface. Furthermore, since one of the chucks 52 is comb-shaped, even if one of the chucks 52 closes, it passes through the comb-shaped portion of the guide portion 53 and grips the protective sheet 61 without contact with the guide portion 53 . can be done.

In addition, by providing the sheet supply table 81 and the discharge table 83, it is possible to automate the carrying-in of the component-embedded sheet 67 and the carrying-out of the electronic component 60, thereby improving workability. Further, in a post-process, for example, the electronic component 60 is mounted on the substrate of the smart phone. For this reason, it is preferable to transport the electronic component 60 to the post-process with the top surface 603 on which the electromagnetic wave shielding film 605 is formed facing upward so that the mounting apparatus in the post-process can easily hold the electronic component 60 . Since the mounting apparatus requires high positioning accuracy, the electronic components 60 on the discharge tray 831 also require high positioning accuracy. Therefore, it is desirable that the electronic components 60 are not displaced from the positions where the electronic components 60 are arranged on the component non-mounted sheet 65 as much as possible.

Therefore, a tubular member 83 b having stretchability and sealability is provided on the discharge table 83 so as not to cause misalignment when the electronic component 60 is transferred to the discharge tray 831 . In addition, by making the surface of the discharge tray 831 sticky, positional deviation of the electronic components 60 during transfer is suppressed, and positional deviation of the electronic components 60 is suppressed when transported to the post-process.

In addition, since the chuck 52 is provided with the rotating arm 85 and the rotating mechanism 84 separately from the chuck 52, the chuck 52 can be driven rather than moving to the installation location of the collection box after the chuck 52 peels off the protective sheet 61. The structure of the part can be simplified.

The peeling processing unit 5 is provided with a detection unit that detects a pulling force when the chuck 52 peels off the protective sheet 61 , and when the pulling force exceeds a predetermined value, the electronic component 60 is peeled off from the protective sheet 61 . The operation of the peeling processing unit 5 may be stopped by judging that it is not. Thereby, the yield can be improved.

(Other embodiments)
The present invention is not limited to the above embodiments, and includes the following aspects. That is, as shown in FIG. 28, the film forming apparatus 7 may further include a transfer section 71 that carries out the component mounting process. The transfer unit 71 performs a component placement process, and transfers the electronic components 60 from the tray on which the electronic components 60 before the film forming process are placed to the component non-mounted sheet 65 . For example, the tray and the component-unmounted sheet 65 are arranged side by side, and the transfer unit 71 may be a robot that can move vertically and horizontally within a range that includes the tray and the component-unmounted sheet 65 . For example, a vacuum chuck is provided at the tip of the arm of the robot. The transfer unit 71 generates a negative pressure on the tray to hold the electronic component 60, releases the negative pressure on the component-unmounted sheet 65 by breaking the vacuum or opening the atmosphere, and removes the electronic component 60 from the component-unmounted sheet. Arrange them on the placement sheet 65 .

In addition, although the film forming apparatus 7 is provided with the embedding processing section 1, the plate mounting section 2, the film forming processing section 3, the plate releasing section 4, and the peeling processing section 5, each of these sections is configured as an independent device. , may be systematized. That is, the embedding processing section 1 may be an independent embedding processing apparatus, the plate mounting section 2 may be an independent plate mounting apparatus, and the film forming processing section 3 may be an independent film forming processing apparatus. Alternatively, the plate releasing unit 4 may be an independent plate releasing device, and the stripping processing unit 5 may be an independent component stripping device.

In the above embodiment, the height H1 from the surface of the component arrangement area 615 to the top surface of the frame 62 is higher than the height H2 from the surface of the component arrangement area 615 to the top surface of the electronic component 60. However, it is not limited to this, and may be lower than the height H2. In this case, the areas of the flat surfaces 112, 212, 412 of the ceiling parts 11, 21, 41 facing the component arrangement area 615 are recessed by an amount that allows for the difference between the height H1 and the height H2, It is sufficient that the closed spaces 14, 24a, 45 can be formed.

Further, it has been described that the frame 62 is also peeled off from the protective sheet 61 when the electronic component 60 is peeled off from the protective sheet 61 of the component-embedded sheet 67 in the peeling processing section 5 , but the present invention is limited to this. Instead, the electronic component 60 and the frame 62 may be separated from the protective sheet 61 in separate steps. The point is that the peeling processing section 5 and the component peeling device have at least the function of peeling the electronic component 60 from the protective sheet 61 .

Further, although the frame 62 of the component-embedded sheet 67 is supported by the mounting table 51, the present invention is not limited to this. Alternatively, a means for supplying positive pressure or a separating means such as a peeling pin may be provided to separate the frame 62 from the mounting table 51 .

Although the embodiment of the present invention and the modification of each part have been described above, the embodiment and the modification of each part are presented as an example and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims.

1 Embedding processing part 11 Ceiling part 111 Internal space 112 Flat surface 113 Air hole 114 Air pressure supply hole 115 O-ring 12 Mounting table 121 Internal space 122 Flat surface 123 Air hole 124 Air pressure supply hole 125 Pusher insertion hole 13 Pusher 14 Sealed space 2 Plate mounting portion 21 Ceiling portion 211 Internal space 212 Flat surface 213 Air hole 214 Air pressure supply hole 215 O-ring 22 Mounting table 221 Opening 222 Edge 223 Air pressure supply hole 224 Pusher insertion hole 23 Pusher 24a Sealed space 24b Sealed space 3 Film formation process Section 31 Chamber 311 Processing Position 312 Film Forming Position 32 Load Lock Chamber 33 Partition Section 34 Rotating Table 35 Surface Processing Section 36 Sputtering Source 361 Target 4 Plate Release Section 41 Ceiling Section 411 Internal Space 412 Flat Surface 413 Air Hole 414 Air Pressure Supply Hole 415 O-ring 42 Mounting table 421 Opening 422 Edge 423 Air pressure supply hole 424 Pusher insertion hole 43 Pusher 44 Clamping block 45 Closed space 5 Separation processing unit 51 Mounting table 511 Flat surface 512 Internal space 513 Air hole 514 Air pressure supply hole 515 Guide part insertion Hole 52 Chuck 52a, 52b Plate-like body 521 Lifting mechanism 53 Guide part 54 Sheet stopper 55 Component stopper 60 Electronic component 60a Peeling start end 601 Electrode exposed surface 602 Electrode 603 Top surface 604 Side surface 605 Electromagnetic wave shield film 61 Protective sheet 611 Adhesive surface 612 Non-adhesive surface 613 Outer frame region 614 Middle frame region 615 Component arrangement region 62 Frame 621 Guide part insertion hole 622 Notch 63 Cooling plate 631 Pusher insertion hole 632 Air hole 64 Adhesive sheet 65 Component unmounted sheet 66 Component mounted sheet 67 component-embedded sheet 68 component mounting plate 7 film forming device 71 transfer unit 73 transport unit 74 control unit 75 pneumatic circuit 80 base 80a opening 81 sheet supply table 81a rotating mechanism 811a rotating shaft 82 stage 821 driving unit 822 guide 83 Ejection table 831 Ejection tray 83a Rotating mechanism 833a Rotating shaft 83b Cylindrical member 84 Rotating mechanism 85 Rotating arm 85a Suction cup 86 Plate-like body

Claims (9)

A film forming apparatus for an electronic component in which an electrode exposed surface is attached to a region surrounded by the frame on the adhesive surface of a protective sheet to which a frame-shaped frame is attached,
a film-forming processing unit that forms a film of a film-forming material on the electronic component;
a peeling processing unit that peels off the electronic component from the protective sheet after the film formation by the film forming processing unit;
with
The peeling processing unit is
a mounting portion for supporting the electronic component attached to the protective sheet;
a chuck that grips an end of the protective sheet, moves relative to the mounting portion, and continuously peels the protective sheet toward the opposite end of the protective sheet;
a fixing part that fixes the position of the electronic component when the electronic component is peeled off from the protective sheet;
a guide portion projecting from the outside of the edge of the frame on the side of the electronic component toward the end portion of the protective sheet;
has
The chuck is positioned at the projecting end of the guide portion before gripping the edge of the protective sheet,
The film forming apparatus, wherein the guide section faces the chuck and guides the edge of the protective sheet to the chuck. 2. The film forming apparatus according to claim 1, wherein the guide portion protrudes from a guide portion insertion hole or a notch provided in the frame. providing a sheet stopper that moves along the protective sheet together with the chuck and creates a starting point for peeling;
The film forming apparatus according to claim 1, characterized by: The sheet stopper is positioned near the projecting end of the guide portion when the guide portion protrudes, and holds an end portion of the protective sheet peeled off by the guide portion together with the guide portion to guide it to the chuck;
4. The film forming apparatus according to claim 3, characterized by: the sheet stopper is a roller having an axis perpendicular to the moving direction of the sheet stopper;
5. The film forming apparatus according to claim 3 or 4, characterized by: wherein the fixing portion is a component stopper that follows the sheet stopper while keeping a distance of less than the length of the electronic component, and suppresses the lifting of the electronic component;
6. The film forming apparatus according to any one of claims 3 to 5, characterized by: The component stopper is a cylindrical roller having an axis perpendicular to the movement direction of the component stopper, and is axially rotatable;
7. The film forming apparatus according to claim 6, characterized by: The fixing portion is provided on the mounting portion and fixes the electronic component to the mounting portion ;
4. The film forming apparatus according to any one of claims 1 to 3, characterized by: Component peeling for peeling off from the protective sheet the electronic component on which the electrode exposed surface is adhered to the area surrounded by the frame on the adhesive surface of the protective sheet to which the frame-shaped frame is adhered and the film-forming material is formed. a device,
a mounting portion for supporting the electronic component attached to the protective sheet;
a chuck that grips an end of the protective sheet, moves relative to the mounting portion, and continuously peels the protective sheet toward the opposite end of the protective sheet;
a fixing part that fixes the position of the electronic component when the electronic component is peeled off from the protective sheet;
a guide portion projecting from the outside of the edge of the frame on the side of the electronic component toward the end portion of the protective sheet;
has
The chuck is positioned at the projecting end of the guide portion before gripping the edge of the protective sheet,
The component peeling apparatus, wherein the guide section faces the chuck and guides the edge of the protective sheet to the chuck.

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