JP7323341B2 - processing equipment - Google Patents

Description

The present invention relates to processing equipment.

A processing apparatus for processing a workpiece includes, for example, holding means for holding the workpiece; machining means for machining the workpiece held by the holding means with a rotatably mounted machining tool; machining feed means for moving the means in the machining feed direction; cleaning means for cleaning the machined workpiece; carry-out means for carrying the workpiece from the holding means to the cleaning means; and carrying the workpiece to the holding means and a carrying-in means for carrying out (see Patent Literature 1).

In such a processing apparatus, the positions of moving members, such as conveying means, unloading means, and processing feeding means, are recognized so that they do not interfere with each other.

Therefore, immediately after the power is turned on, the processing apparatus performs an initial operation of moving the moving member to the origin position and recognizing the position of the moving member.

JP 2014-232757 A

For example, when the power is turned off for some reason during machining, the initial operation is performed after the power is turned on again. Here, after the power is turned on again, the operator confirms various setting screens. If the operator is inexperienced, he or she may forget to perform the initial operation after turning on the power and press the button for continuing machining. In this case, an alarm is generated regarding an erroneous procedure in which machining is continued without completing the initial operation. Therefore, after the alarm is cleared, the operator has to start the initial operation again, resulting in waste.

An object of the present invention is to make it easier for the operator to notice that an origin position recognition operation (initial operation) should be performed.

A processing apparatus (this processing apparatus) of the present invention includes holding means for holding a workpiece, processing means for processing the workpiece held by the holding means with a processing tool, and the processing means and the holding means. a processing feed means for relatively moving the workpiece in the processing feed direction of the processing tool, a cleaning means for cleaning the workpiece, a carry-out means for carrying the workpiece from the holding means to the cleaning means, and the holding means A processing apparatus comprising at least loading means for loading a workpiece into a machine, a touch panel, and control means, wherein the control means displays an origin position recognition operation start button on the touch panel, and the origin position recognition operation start button is displayed on the touch panel. When the operation start button is selected , each means is arranged at the origin position which is a position immediately before a series of processing for each workpiece is started , and each means is arranged at the origin position. The control means is configured to start an origin position recognition operation for recognizing that the origin position recognition operation is started on the touch panel immediately after the power of the processing apparatus is turned on. A processing apparatus characterized by highlighting a button to notify a worker that the necessary origin position recognition operation has not yet been performed .
The control means causes the origin position recognition operation start button on the touch panel to light up, blink, change the display color to a different color from other buttons, or enlarge the display range, May be highlighted.

In this processing apparatus, the origin position recognition operation start button is highlighted by being highlighted immediately after the power source of the processing apparatus is turned on when the origin position recognition operation should be performed. As a result, it is possible to easily and satisfactorily notify the operator that the necessary origin position recognition operation has not yet been performed.

It is a perspective view which shows the structure of a grinding apparatus. FIG. 7 is a diagram showing a display example of an origin position recognition operation start button on a touch panel;

A grinding apparatus 1 shown in FIG. 1 is an example of a processing apparatus, and fully automatically performs a series of processes including a loading process, a grinding process, a cleaning process, and an unloading process on a wafer W as a workpiece. is configured to

The wafer W shown in FIG. 1 is, for example, a circular semiconductor wafer. A device (not shown) is formed on the front surface Wa of the wafer W. As shown in FIG. The front surface Wa of the wafer W faces downward in FIG. 1 and is protected by a protective tape T adhered thereto. A back surface Wb of the wafer W is a surface to be processed by grinding.

The grinding device 1 includes a substantially rectangular first device base 11, a second device base 12 connected to the rear (+Y direction side) of the first device base 11, a column 13 extending upward, and a first A housing 14 covering the device base 11 and the second device base 12 is provided.

A first cassette stage 151 and a second cassette stage 152 are provided on the front side (-Y direction side) of the first device base 11 . On the first cassette stage 151, there is placed a first cassette 151a in which wafers W to be processed are accommodated. On the second cassette stage 152, a second cassette 152a in which wafers W after processing are accommodated is mounted.

The first cassette 151a and the second cassette 152a are provided with a plurality of shelves inside, and one wafer W is accommodated in each shelf.

The openings (not shown) of the first cassette 151a and the second cassette 152a face the +Y direction. A robot 155 is arranged on the +Y direction side of these openings. The robot 155 has a holding surface for holding the wafer W thereon. The robot 155 loads the processed wafer W into the second cassette 152a. Further, the robot 155 takes out the wafer W before processing from the first cassette 151 a and places it on the temporary placement table 61 .

The temporary placement table 61 is for temporarily placing the wafer W, and is provided at a position adjacent to the robot 155 . A plurality of positioning means 63 are arranged on the temporary placement table 61 . The positioning means 63 is a positioning pin whose diameter is reduced, and by moving along the radial direction of the temporary placement table 61, the wafer W placed on the temporary placement table 61 with the rear surface Wb facing up is positioned at a predetermined position. position (centering).

A loading mechanism 31 is provided at a position adjacent to the temporary placement table 61 . The loading mechanism 31 is an example of loading means, and includes a suction pad having a suction surface for holding the back surface Wb of the wafer W by suction. The loading mechanism 31 sucks and holds the wafer W temporarily placed on the temporary placement table 61 by the suction pad, conveys it to the chuck table 30 , and places it on the table surface 300 .

The chuck table 30 is an example of holding means, and has a table surface 300 for sucking the wafer W thereon. The table surface 300 communicates with a suction source, and suction-holds the wafer W via the protective tape T. As shown in FIG. The chuck table 30 is rotatable about a central axis passing through the center of the table surface 300 and extending in the Z-axis direction while holding the wafer W on the table surface 300 .

The periphery of the chuck table 30 is surrounded by a cover 39 . A bellows cover 39a that expands and contracts in the Y-axis direction is connected to the cover 39. As shown in FIG. Y-axis direction moving means (not shown) is provided below the cover 39 and the bellows cover 39a. The chuck table 30 can be reciprocated in the Y-axis direction by this Y-axis direction moving means.

A column 13 is erected behind the second device base 12 (on the +Y direction side). A grinding means 7 for grinding the wafer W and a grinding feeding means 2 are provided on the front surface of the column 13 .
The grinding feed means 2 is an example of a processing feed means, and relatively moves the grinding means 7 and the chuck table 30 in the Z-axis direction, which is the grinding feed direction (processing feed direction) of the processing tool (grinding wheel 741). . That is, the grinding feed means 2 moves the grinding means 7 relative to the chuck table 30 in the Z-axis direction.

The grinding feed means 2 includes a pair of Z-axis guide rails 21 parallel to the Z-axis direction, a Z-axis moving table 23 sliding on the Z-axis guide rails 21, a Z-axis ball screw 20 parallel to the Z-axis guide rails 21, a Z It has an axis servomotor 22 and a holder 24 attached to the front (surface) of a Z-axis moving table 23 . A holder 24 holds the grinding means 7 .

The Z-axis moving table 23 is slidably installed on the Z-axis guide rail 21 . A nut portion (not shown) is fixed to the rear surface side (rear surface side) of the Z-axis moving table 23 . A Z-axis ball screw 20 is screwed into this nut portion. The Z-axis servomotor 22 is connected to one end of the Z-axis ball screw 20 .

In the grinding feed means 2 , the Z-axis servomotor 22 rotates the Z-axis ball screw 20 to move the Z-axis moving table 23 along the Z-axis guide rail 21 in the Z-axis direction. As a result, the holder 24 attached to the Z-axis moving table 23 and the grinding means 7 held by the holder 24 also move together with the Z-axis moving table 23 in the Z-axis direction.

The grinding means 7 is an example of a processing means, and includes a spindle housing 71 fixed to the holder 24, a spindle 70 rotatably held by the spindle housing 71, a motor 72 for rotating the spindle 70, and attached to the lower end of the spindle 70. and a grinding wheel 74 supported on the wheel mount 73 .

The spindle housing 71 is held by the holder 24 so as to extend in the Z-axis direction. The spindle 70 extends in the Z-axis direction perpendicular to the table surface 300 of the chuck table 30 and is rotatably supported by a spindle housing 71 .

A motor 72 is connected to the upper end side of the spindle 70 . The motor 72 causes the spindle 70 to rotate around a rotation axis extending in the Z-axis direction.
The wheel mount 73 is disc-shaped and fixed to the lower end (tip) of the spindle 70 . A wheel mount 73 supports a grinding wheel 74 .

The grinding wheel 74 is formed to have approximately the same diameter as the wheel mount 73 . The grinding wheel 74 includes an annular wheel base (annular base) 740 made of a metal material such as stainless steel. A plurality of annularly arranged grinding wheels 741 are fixed to the lower surface of the wheel base 740 over the entire circumference. The grinding wheel 741 is an example of a processing tool, and grinds the back surface Wb of the wafer W held on the chuck table 30 .

A thickness measuring device 38 is arranged at a position adjacent to the chuck table 30 . The thickness measuring instrument 38 can measure the thickness of the wafer W during grinding, for example, in a contact manner.

The wafer W after grinding is unloaded by the unloading mechanism 36 . The unloading mechanism 36 is an example of unloading means, and includes a suction pad having a suction surface for holding the rear surface Wb of the wafer W by suction. The unloading mechanism 36 sucks and holds the rear surface Wb of the wafer W after the grinding process placed on the chuck table 30 by a suction pad, unloads the wafer W from the chuck table 30, and places it on the spinner table of the single-wafer type spinner cleaning unit 26. 27.

The spinner cleaning unit 26 is an example of cleaning means, and includes a spinner table 27 that holds the wafer W and various nozzles (not shown) that inject cleaning water and dry air toward the spinner table 27 .

In the spinner cleaning unit 26 , the spinner table 27 holding the wafer W is lowered into the first equipment base 11 . Then, in the first apparatus base 11, cleaning water is sprayed toward the back surface Wb of the wafer W, and the back surface Wb is spinner-cleaned. After that, dry air is blown onto the wafer W to dry the wafer W. As shown in FIG.

Wafers W cleaned by the spinner cleaning unit 26 are carried into the second cassette 152 a by the robot 155 .

A touch panel 40 is installed on the -Y side of the housing 14 . The touch panel 40 displays various information such as the processing status of the grinding device 1 and the processing conditions related to the processing of the wafer W by the grinding device 1 . The touch panel 40 is also used for inputting various information such as processing conditions. Thus, the touch panel 40 functions as display means (display screen) for displaying various types of information, and also functions as input means for inputting information.

The grinding machine 1 also includes a control means 3 for controlling each member of the grinding machine 1 inside the housing 14 . The control means 3 controls each member of the grinding apparatus 1 described above to process the wafer W as desired by the operator.

Furthermore, the control means 3 carries out the origin position recognition operation according to the operator's instruction. The origin position recognition operation will be described below.

The robot 155 in the grinding apparatus 1, the positioning means 63 of the temporary placement table 61, the loading mechanism 31, the chuck table 30, the grinding means 7, the grinding feeding means 2, the spinner washing unit 26, the thickness measuring device 38, the carrying out mechanism 36, etc. Each member moves from its origin position when the wafer W is processed.

Here, the origin position is a position (including attitude) in a preset initial state in each member (movable portion of each member). For example, the origin position is the position of each member immediately before a series of processes on the wafer W is started.

The origin position is, for example, the position on the XY plane (horizontal plane) and the position in the Z-axis direction (height position) of the robot 155, the loading mechanism 31, and the loading mechanism 36, and the XY plane of the positioning means 63 on the temporary placement table 61. position of the chuck table 30 in the Y-axis direction; height position of the Z-axis moving table 23 in the grinding feeding means 2 (height position of the grinding means 7 (grinding wheel 741)); position, the height position and the rotational angular position of the spinner table 27 of the spinner cleaning unit 26, and the rotational angular position of the chuck table 30 are set.

The origin position recognition operation is an operation of arranging each member of the grinding apparatus 1 at its respective origin position and recognizing that each member is arranged at the origin position. The control means 3 implements this origin position recognition operation according to an operator's instruction via the touch panel 40 .

FIG. 2 shows a display example on the touch panel 40. As shown in FIG. As shown in this figure, the touch panel 40 displays, for example, a message group M including a plurality of messages to the operator and a button group B including a plurality of buttons. In this embodiment, the control unit 3 displays an origin position recognition operation start button 51 as one of the buttons included in the button group B on the touch panel 40 .

When the operator selects (touches) the origin position recognition operation start button 51 displayed on the touch panel 40, the control means 3 starts the origin position recognition operation described above.

Note that the origin position recognition operation is necessary, for example, when the grinding machine 1 is temporarily stopped due to an error or the like and the power of the grinding machine 1 is turned off and then turned on again.
That is, when the grinding apparatus 1 is temporarily stopped and the power is turned off, the positions of the members of the grinding apparatus 1 may be maintained as they were at the time of the temporary stop. Therefore, when the power is turned on again after that, in order to restart the processing of the wafer W, each member is arranged at the origin position and the origin position of each member is recognized by the origin position recognition operation.

Therefore, in the present embodiment, immediately after the power of the grinding apparatus 1 is turned on, the control means 3 highlights the origin position recognition operation start button 51 on the touch panel 40 . For example, as shown in FIG. 2, the control means 3 lights the origin position recognition operation start button 51 on the touch panel 40 . That is, the control means 3 makes the display brightness of the origin position recognition operation start button 51 higher than that of the normal display and that of the other buttons.

As described above, in the grinding apparatus 1, the origin position recognition operation start button 51 is emphasized to be conspicuous when the origin position recognition operation should be performed. As a result, the operator can be easily and satisfactorily urged to perform the operation of recognizing the origin position. That is, it is possible to easily and satisfactorily notify the operator that the necessary origin position recognition operation has not yet been performed.

Note that the control means 3 may always display the origin position recognition operation start button 51 on the touch panel 40, or may display it at any timing including immediately after the power is turned on. However, the control means 3 and the grinding apparatus 1 do not display the origin position recognition operation start button 51 at the timing when the origin position recognition operation should be avoided (for example, during processing of the wafer W), or the operator The origin position recognition operation start button 51 may not be selected, that is, even if the origin position recognition operation start button 51 is touched, the origin position recognition operation may not be started.

Further, as the highlighting of the origin position recognition operation start button 51 on the touch panel 40, the origin position recognition operation start button 51 is blinked in addition to lighting (lighting) the origin position recognition operation start button 51. Examples include changing the display color of the recognition operation start button 51 to a color that stands out from other buttons, increasing the display range of the origin position recognition operation start button 51, and the like.

Further, in the origin position recognition operation, the control means 3 may repeat the origin position recognition operation a predetermined number of times until all the members are arranged at the origin position and the origin position is recognized. Then, when some members are not arranged at the origin position, or when the origin position is not recognized, the control means 3 may display that fact on the touch panel 40 .

Moreover, in this embodiment, the grinding apparatus 1 which grinds the wafer W is illustrated as a processing apparatus which processes a to-be-processed object. Alternatively, the processing device may be, for example, a cutting device that cuts the workpiece, a laser processing device that processes the workpiece with a laser beam, a cutting tool that cuts the workpiece with a cutting tool, or a cleaning device that cleans the workpiece. It may also be a cleaning device for drying and drying, an expanding device for dividing the workpiece into chips, or a tape mounter for attaching tape to the workpiece.

1: Grinding device, W: Wafer,
2: Grinding feeding means,
3: control means,
26: Spinner cleaning unit, 27: Spinner table,
30: chuck table,
31: Carry-in mechanism, 36: Carry-out mechanism,
61: temporary placement table, 63: alignment means,
7: grinding means, 74: grinding wheel, 741: grinding wheel,
40: touch panel, B: button group, 51: origin position recognition operation start button

Claims (2)

holding means for holding a work piece; processing means for processing the work piece held by the holding means with a processing tool; A processing feeding means for moving, a cleaning means for cleaning the workpiece, a carrying-out means for carrying the workpiece from the holding means to the cleaning means, a carrying-in means for carrying the workpiece into the holding means, and a touch panel. And a processing apparatus comprising at least a control means,
The control means displays an origin position recognition operation start button on the touch panel, and when the origin position recognition operation start button is selected , each means starts a series of processes for each workpiece. and to start an origin position recognition operation for recognizing that each means is arranged at the origin position,
By highlighting the origin position recognition operation start button on the touch panel immediately after the processing apparatus is powered on, the control means instructs the operator that the necessary origin position recognition operation is still being performed. A processing device characterized by notifying that it is not . The control means causes the origin position recognition operation start button on the touch panel to light up, blink, change the display color to a different color from other buttons, or enlarge the display range, to highlight
The processing apparatus according to claim 1.

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