JP7325819B2 - LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, AND LASER PROCESSING PROGRAM - Google Patents

Description

The present invention relates to a laser processing apparatus, a laser processing method, and a laser processing program. Specifically, the laser processing apparatus, laser processing method, and laser processing program are capable of efficiently collecting scattered matter generated during laser processing, improving productivity, and always obtaining a good processing state. It is related.

Optical films such as polarizing films (polarizing plates) and retardation films (retardation plates) are generally attached to optical display panels such as liquid crystal panels and organic EL panels. In general, these optical films are produced by unwinding a long film from a raw roll, cutting the unwound film into widths and lengths corresponding to the optical display panel, and attaching it to the glass substrate. ing.

On the other hand, in the above-described method, if the optical film is attached to the vicinity of the periphery of the cut single optical display panel, burrs generated when the optical film is cut may protrude from the glass substrate. When the optical film is attached in such a manner that it protrudes from the optical display panel, the protruding portion is likely to be used as a starting point for peeling off.

Therefore, for example, Patent Literature 1 discloses a manufacturing method for making it difficult for an optical film to peel off from an optical display panel. That is, the optical film is attached to the optical display panel so that a part protrudes, and the protruding portion is cut with a laser beam at a position overlapping the optical display panel, thereby removing the portion of the optical film protruding from the optical display panel. is to be removed.

However, in the laser processing method disclosed in Patent Document 1, dust-like or dust-like scattered matter is generated during the cutting process by the laser processing machine. Scattered matter scatters in all directions above the workpiece. For example, as the reflectance decreases due to adhesion to the optical mirror that propagates the laser beam, the laser output obtained by the processing head decreases and processing becomes unstable. In addition, problems such as deterioration of machining accuracy due to premature wear due to contamination of precision drive system parts such as ball screws for moving the machining head on the workpiece occur.

In order to collect such scattered matter, Patent Document 2 discloses a method of sucking with a dust collecting duct. Specifically, a plurality of shields are installed around the laser emitting device at predetermined intervals, and the scattered matter in the shielded space surrounded by the shields is collected by a dust collection duct to collect the scattered matter. It can improve efficiency.

As a dust collection method that does not use a dust collection duct, Patent Document 3 discloses a dust collection method that uses a film material. Specifically, the surface of the workpiece is coated with a coating material that does not easily absorb laser light and does not peel off even when irradiated with laser light. After that, the surface of the workpiece is irradiated with laser light through this film material. At this time, the scattered matter generated by the irradiation of the laser beam adheres to the film material, but the scattered matter adhering to the film material can be removed by peeling the film material from the workpiece after processing with the laser beam. is possible.

JP 2013-228439 A JP-A-9-271980 JP-A-2005-313196

However, the inventions according to Patent Documents 2 and 3 have the following problems.

Scattered objects cut by laser processing vary in size, from extremely small sizes (e.g. 3 mm or less in length) to relatively large sizes (e.g. 3 cm or more in length). be. At this time, extremely small scattered objects cannot be sucked by the dust collection duct due to their too light weight. There is concern that clogging may occur inside the dust collection duct.

In addition, in the invention according to Patent Document 3, it is necessary to separately prepare a coating material for adsorbing the scattered matter. Since the process is repeated, there is concern that the production efficiency will also decrease.

The present invention has been invented in view of the above points, and is capable of efficiently collecting scattered matter generated during laser processing, and improving productivity to always obtain a favorable processing state. The present invention relates to a laser processing apparatus, a laser processing method, and a laser processing program capable of

In order to achieve the above object, the laser processing apparatus of the present invention includes a processing table on which a plate-like work is placed, and an unnecessary area other than an effective area constituting the work to be processed along a predetermined contour line. and a laser device for irradiating a laser beam for cutting and separating from the workpiece, and a signal to the laser device that becomes a cutting trajectory in which the unnecessary region forms a small piece with a predetermined surface area when cutting and separating the unnecessary region from the work. and a dust collecting device for sucking small pieces cut from the workpiece by cutting and separating with the laser device with a predetermined air volume.

Here, by providing a processing table on which a plate-shaped work is placed, it is possible to place the work, which is the object to be processed, and cut it with a laser.

In addition, by providing a laser device that irradiates a laser beam for cutting and separating an unnecessary area other than the effective area that constitutes the workpiece from the workpiece along a predetermined contour line, the workpiece placed on the machining table can be separated from the workpiece. It is possible to discriminate an unnecessary region that does not constitute a , and cut and separate the unnecessary region to form a workpiece.

In addition, by providing a dust collector that sucks the unnecessary areas that are cut and separated into small pieces with a predetermined air volume, small pieces (scattered matter) generated during laser processing are sucked and the small pieces scatter around. can be prevented. As a result, for example, small pieces can be prevented from adhering to precision equipment that constitutes the laser device, and the processing accuracy of the laser can be kept constant.

Further, when the unnecessary region is cut and separated from the work, by providing a control device that outputs a signal to the laser device as a cutting trajectory for forming a small piece having a surface area of approximately 18 mm ² to 300 mm ² of the unnecessary region. Based on the signal, the laser can cut the unwanted area of the workpiece while subdividing it into small pieces of predetermined surface area. By subdividing the unnecessary area in this way, it is possible to efficiently perform suction by the dust collector.

Here, if the surface area of the unnecessary area to be cut is less than approximately 18 mm ² , the small pieces will be too finely divided, and even if they are sucked by the dust collector, they will not easily scatter while being adhered to the work or the like. Therefore, in order to suck all the small pieces by the dust collector, it is necessary to increase the suction air volume to a predetermined level, which increases the load on the dust collector.

On the other hand, when the surface area of the unnecessary area to be cut is larger than approximately 300 mm ² , the surface area of the small pieces becomes large, and the sucked small pieces remain in the dust collector or in the suction pipe connected to the dust collector. , there is a risk of clogging.

Further, when the air volume of the dust collector is 3.5 m ³ /min to 11.0 m ³ /min, the dust collector efficiently removes small pieces cut with a surface area in the range of 18 mm ² to 300 mm ² . can be recovered.

Here, if the air volume of the dust collector is less than 3.5 m ³ /min, the air volume is so weak that there is a possibility that, for example, small particles having a small surface area cannot be sucked. In addition, when the air volume of the dust collector is greater than 11.0 m ³ /min, in order to achieve such an air volume, it is necessary to increase the suction air volume or increase the diameter of the suction pipe connected to the dust collector. There is a risk that the load on the dust collector will increase.

In order to achieve the above object, the laser processing method of the present invention includes a discriminating step of discriminating an unnecessary region other than an effective region constituting a workpiece based on contour line information of the workpiece from a plate-like workpiece; a cutting step of forming a contour of the effective area by cutting the workpiece along a cutting trajectory in which the unnecessary area forms a small piece having a predetermined surface area; and a suction step of sucking with an air volume of .

Here, by providing a discrimination step of discriminating an unnecessary region other than the effective region that constitutes the workpiece based on the contour line information of the workpiece from the plate-like workpiece, the unnecessary region that does not constitute the workpiece is discriminated. can be done.

Further, by providing a cutting step for forming the outline of the effective area by cutting the workpiece along a cutting trajectory in which the unnecessary area forms small pieces having a predetermined surface area, the unnecessary area of the workpiece is subdivided into small pieces having a predetermined surface area. The workpiece can be formed by cutting while curing. By subdividing the unnecessary area in this way, it is possible to efficiently perform suction in the suction step described later.

Also, by providing a suction step for sucking the small pieces cut by the cutting step with a predetermined air volume, the small pieces generated during the cutting and separation work by the laser are sucked and prevented from being scattered around as scattered matter. As a result, it is possible to prevent small pieces from adhering to, for example, a precision instrument including a laser, and to keep the processing accuracy of the laser constant.

The cutting process includes a first cutting trajectory from a starting point, which is a predetermined position on the edge of the workpiece, to an intermediate point, which is a predetermined position on the contour, and an end point, which is a predetermined position on the contour from the intermediate point. When repeating the process of cutting the workpiece n times (n is an integer of 2 or more) based on the cutting trajectory consisting of the second cutting trajectory along the contour line to , the unnecessary area can be subdivided into uniform sizes.

At this time, the distance between the starting point of the n−1th time and the starting point of the nth time and the distance between the intermediate point of the n−1th time and the intermediate point of the nth time are equal, and the end point of the n−1th time and the nth time By setting the cutting trajectory so that the midpoints match, the workpiece can be cut along the shortest cutting path.

In addition, when the first cutting trajectory and the second cutting trajectory in the cutting step are each linear, and the angle formed by the first cutting trajectory and the second cutting trajectory is in the range of approximately 110 to 150 degrees, can suppress the thermal effect of the laser, which is the cutting device, and improve the finish of the workpiece.

That is, when the angle formed by the first cutting trajectory and the second cutting trajectory is an acute angle, when the laser changes direction from the first cutting trajectory to the second cutting trajectory via the intermediate point, The workpiece surface rises due to the heat effect of the laser on the cut cross section near the midpoint, which causes burrs. Since the burrs generated by such processing affect the finished molding of the workpiece, they must be removed manually in the post-process.

In this regard, by setting the angle formed by the first cutting trajectory and the second cutting trajectory to be an obtuse angle, specifically approximately 110 to 150 degrees as described above, and more preferably 130 degrees, the movement of the laser along the cutting trajectory can be minimized. It becomes smooth, and it is possible to suppress the generation of burrs at the intermediate point.

In order to achieve the above object, the laser processing program of the present invention includes a determining step of determining an unnecessary area other than an effective area constituting a workpiece based on contour line information of the workpiece from a plate-like workpiece; and a cutting step of cutting the workpiece along a cutting trajectory such that the unwanted area forms a piece of predetermined surface area to outline the useful area.

The cutting step includes a step of determining a predetermined position on the edge of the workpiece as a starting point, a step of determining a predetermined position on the contour line as an intermediate point, and a predetermined position on the contour line different from the intermediate point. as the end point, cutting the workpiece based on a first cutting trajectory from the starting point to the intermediate point, and cutting the workpiece based on a second cutting trajectory along the contour line from the intermediate point to the endpoint The step is one cutting flow, and the cutting flow is repeated n times (n is an integer of 2 or more), the distance between the n-1th start point and the n-th start point, and the n-1th intermediate point and n The computer is instructed so that the distances between intermediate points of the n-1th time are equal and the end point of the n-1th time coincides with the intermediate point of the nth time.

Here, a step of determining a predetermined position on the edge of the workpiece as a starting point, a step of determining a predetermined position on the contour line as an intermediate point, and a step of determining a predetermined position on the contour line different from the intermediate point as an end point. can determine the cutting trajectory from the laser cutting start point to the end point.

Further, the step of cutting the work based on the first cutting trajectory from the starting point to the intermediate point and the step of cutting the work based on the second cutting trajectory from the intermediate point to the end point are set as one cutting step, By repeating the cutting step, the unnecessary area of the workpiece to be cut and separated can be subdivided into uniform sizes.

Furthermore, the distance between the n-1th start point and the n-th start point and the distance between the n-1th intermediate point and the n-th intermediate point are equal, and the n-1th end point and the n-th intermediate point are equal. If the computer is instructed to match the points, the workpiece can be cut at the shortest distance as the cutting path.

A laser processing apparatus, a laser processing method, and a laser processing program according to the present invention can efficiently collect scattered matter generated during laser processing, improve productivity, and always obtain a good processing state. is possible.

1 is an overall schematic diagram of a laser processing apparatus according to an embodiment of the present invention; FIG. It is a schematic diagram which shows the cutting locus|trajectory of the workpiece|work cut by the laser processing apparatus which concerns on embodiment of this invention. 1 is a flowchart of a laser processing method according to an embodiment of the present invention; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings for understanding of the present invention.

First, a laser processing apparatus 1 according to an embodiment of the present invention will be described with reference to FIG. A laser processing apparatus 1 mainly includes a laser oscillator 2 , a pulse generator 3 , a controller 4 , a light collector 5 , an XY stage 6 , and a dust collector 7 .

The laser oscillation device 2 is a device that oscillates laser light having a predetermined pulse waveform. A target pulse waveform is set by the control device 4 for oscillation of the laser light, and a pulse waveform composed of a predetermined pulse waveform and an output is generated by the pulse generator 3 . When the laser oscillation device 2 receives a predetermined timing signal transmitted from the pulse generator 3, laser light having a target pulse waveform is oscillated. The laser oscillation device 2 has an optical resonator (not shown) filled with carbon dioxide gas, and is configured to amplify light in this optical resonator by stimulated emission in the carbon dioxide gas to oscillate laser light. .

A laser beam in the infrared region is oscillated from the laser oscillation device 2 using carbon dioxide so that the laser beam can be easily absorbed by the optical film (hereinafter referred to as "work") which is the object to be processed. In order to stably oscillate the laser light, the laser oscillation device 2 is always in a state of oscillating the laser light.

Here, it is not always necessary to use a carbon dioxide gas laser as the laser oscillation device 2 . Solid-state lasers such as YAG lasers, YVO lasers, fiber lasers, and other types of lasers may be used, but as described above, when an optical film is assumed as a workpiece, a carbon dioxide gas laser is suitable from the viewpoint of energy absorption.

Also, the number of laser oscillation devices 2 is not necessarily limited to one, and a plurality of devices may be installed.

The light collecting device 5 is installed on the optical axis of the laser light transmitted from the laser oscillation device 2 and is a device for guiding the laser light to the workpiece on the XY stage 6 . The condensing device 5 has a well-known configuration, and is mainly composed of a galvanometer scanner 51 and an Fθ lens 52 .

The laser beam transmitted from the laser oscillation device 2 is reflected by a reflecting mirror (not shown), and adjusted by a beam expander (not shown) so that the irradiation diameter matches the mirror of the galvanometer scanner 51 . Further, by adjusting the refractive index of the laser light with this beam expander, the focal length of the laser light can be adjusted.

The galvanometer scanner 51 includes a mirror (not shown), a rotating shaft attached to the mirror, and a controller for controlling the rotating shaft. The galvanometer scanner 51 makes it possible to freely deflect the laser light incident on the mirror in one-dimensional directions. That is, by combining two galvanometer scanners 51, it is possible to deflect the laser light to a predetermined processing point on the processing area occupying a certain area on the XY plane in two-dimensional directions, that is, on the XY stage 6. .

The laser light deflected by the galvanometer scanner 51 is focused by the Fθ lens 52 . The F.theta. lens 52 has a well-known structure and has an image height Y proportional to the incident angle .theta. By using the F.theta. lens 52, the laser light can be focused so that the focal points of the laser light deflected by the galvanometer scanner 51 are distributed on a plane.

Here, the condensing device 5 is not necessarily limited to the above configuration. The combination, arrangement, etc. of each device constituting the light collecting device 5 can be changed as appropriate. For example, in the embodiment of the present invention, the XY stage 6 moves in the X-axis direction or the Y-axis direction and is positioned at an arbitrary position. A gantry type that moves in the direction or Y-axis direction may be used, and instead of the XY stage 6, a continuous sheet-like roll as a work is rewound in one direction, and a laser beam is irradiated at a fixed point to reduce the flow. It may be a roll slitter machine that cuts in the direction.

The dust collection device 7 is a device for collecting scattered matter generated when a laser beam is applied to a workpiece placed on the XY stage 6, and is located above the XY stage 6 and near the Fθ lens. A recovery box 71 arranged vertically below 52 and having a substantially rectangular shape in plan view and having an open end facing vertically downward, a dust collector 72 for generating an airflow by rotation of a fan, and one end on the four sides of the recovery box 71. , and the other end is connected to a dust collector 72 , and is mainly composed of a suction pipe 73 that guides scattered matter from the collection box 71 to the dust collector 72 .

Here, the collection box 71 does not necessarily have to be substantially rectangular in plan view. The shape of the recovery box 71 can be appropriately selected according to the intended use.

Also, the recovery box 71 does not necessarily have to be positioned above the XY stage 6 . For example, it may be positioned below the XY stage 6 .

Further, it is not always necessary to arrange four suction pipes 73 on each of the four sides of the collection box 71 . The number of suction pipes 73 arranged is not particularly limited.

The outline of the laser processing apparatus 1 according to the embodiment of the present invention has been described above. Next, a laser processing method using the laser processing apparatus 1 will be described. Note that the laser processing apparatus 1 according to the embodiment of the present invention can be used to form workpieces of various shapes for workpieces of various shapes. A description will be given of an application in which a rectangular workpiece is formed from a rectangular workpiece by a size smaller than the workpiece.

FIG. 2 shows the cutting trajectory of the laser beam when the unnecessary area A1 is cut from the workpiece to obtain the final product consisting of the effective area A2 by using the laser processing apparatus 1 according to the embodiment of the present invention. It is the general view and the principal part enlarged view which were shown typically.

As shown in FIG. 2, the laser processing apparatus 1 according to the embodiment of the present invention is different from the conventional method of irradiating the laser beam along the contour line BL of the workpiece. A linear first cutting trajectory L1 connecting S1 to an intermediate point C1, which is a predetermined position on the contour line BL of the workpiece, and a contour from the intermediate point C1 to an end point E1, which is a predetermined position on the contour line BL. The cutting path consisting of the second linear cutting path L2 along the line BL is defined as one cutting step.

The direction is changed at a predetermined angle from the first cutting trajectory L1 to the second cutting trajectory L2 via the intermediate point C1. The angle is preferably in the range of approximately 110 degrees to 150 degrees.

Here, the angle formed by the first cutting trajectory L1 and the second cutting trajectory L2 does not necessarily have to be in the range of approximately 110 degrees to 150 degrees. However, when the angle formed by the first cutting path L1 and the second cutting path L2 is within the above range, there is no significant effect on the number of processing steps, and bulges on the work surface caused by laser processing can be suppressed. can be done.

For example, when the angle formed by the first cutting path L1 and the second cutting path L2 is an acute angle of less than approximately 90 degrees, the thermal effect of the laser beam near the intermediate point becomes excessive, and the laser beam near the intermediate point The swell caused by the irradiation of is likely to occur. Since the bulge becomes a burr and affects the molding of the workpiece, it will be necessary to remove the burr in a post-process.

On the other hand, when the angle formed by the first cutting path L1 and the second cutting path L2 becomes large, the scanning distance of the laser beam becomes long, which causes a problem of an increase in the number of processing man-hours. Therefore, as a result of examination by the inventors, when the angle formed by the first cutting path L1 and the second cutting path L2 is in the range of approximately 110 degrees to 150 degrees, the number of processing man-hours does not increase significantly. It was confirmed that the work can be cut without being affected by heat.

Further, the input heat amount per unit volume of the laser light in the embodiment of the present invention is set within a range of approximately 1.1 J/mm ³ to 4.5 J/mm ³ .

Here, the input heat amount of the laser light does not necessarily have to be limited to the range described above. However, as a result of investigation by the inventors, it has been confirmed that when laser light irradiation is performed with the amount of input heat within the above range, adhesion of sublimate is small and good processing quality is achieved.

When the first cutting process is completed along the cutting track, the process moves to the second cutting process. In the second cutting step, cutting is also performed along the same cutting track as that in the first cutting step. Specifically, a position moved along the edge of the work by a predetermined distance from the starting point S1 of the first cutting process is set as the starting point S2 of the second cutting process, and the first cutting process is started. The end point E1 is determined by the intermediate point C2 of the cutting trajectory in the second cutting process, and the end point E2, which is a predetermined position on the contour line BL from the intermediate point C2, is determined. The distance between the start point S1 and the start point S2 and the distance between the intermediate point C1 and the end point E1 are approximately the same length.

After that, as in the first cutting process, the unnecessary area A1 is cut with a laser beam along a cutting trajectory connecting the starting point S2, the middle point C2, and the end point E2. At this time, in the second cutting process, the small piece P of the unnecessary area A1 is cut off, and a new contour line is formed following the contour line of the workpiece formed in the first cutting process. By sequentially repeating this process n times (where n is an integer equal to or greater than 2) until all contour lines of the workpiece are formed, the unnecessary area A1 that does not constitute the workpiece is cut off as small pieces P of uniform size. be

Here, the length of the cutting track for cutting the unnecessary area A1 into small pieces does not necessarily have to be the same in all the cutting steps. For example, it is possible to set the cutting trajectory such that the n-th cutting trajectory and the (n+1)-th cutting trajectory have different lengths. However, as will be described later, the air volume of the dust collector 72 differs depending on the surface area of the scattered matter to be broken into small pieces. It is preferable that the trajectory be the same in all the cutting steps from the th time to the nth time.

The irradiation position of the laser beam along the cutting trajectory may be moved by moving the laser oscillation device 2 along the cutting trajectory while the XY stage 6 is fixed, or by moving the laser oscillation device 2 along the cutting trajectory. , the XY stage 6 may be moved along the cutting track.

In addition, if the processing is performed near the suction port of the suction pipe 73 connected to the collection box 71, the collection efficiency of scattered matter increases. Therefore, the cutting trajectory of the laser beam is set so as to pass near the suction port of the suction pipe 73 .

The small pieces P cut and separated from the work are collected in a collection box 71 by the airflow from the dust collector 72 as scattered matter, and collected into the dust collector 72 through the suction pipe 73 . Table 1 shows the relationship between the size of the finely divided small pieces and the air volume of the dust collector 72 .

Here, the piece length in Table 1 represents the length of the first cutting track L1, and the piece width represents the length of the second cutting track. Further, the necessary wind speed is the wind speed of the airflow generated from the dust collector 72 required to collect all of the finely divided small pieces P. As shown in FIG. Note that the work is generally a resin film and has a thin thickness of about 0.01 mm to 0.5 mm, so only the surface area is taken into consideration as the size of the small piece P.

[Table 1]

As shown in Table 1, as the surface area of the small piece P increases, the required air volume decreases. Therefore, since the load on the fan of the dust collector 72 is reduced, it is preferable that the surface area of the small pieces P is as large as possible from an economical point of view. On the other hand, as a result of examination by the inventors, when the surface area of the small pieces P exceeds approximately 300 mm ² , when a certain amount of small pieces P are sucked, the small pieces P stay in the suction pipe 73 or the dust collector 72 There is concern that clogging will occur and the suction function will deteriorate. Therefore, in order to stably suck small pieces over a long period of time, it is preferable that the surface area of the small pieces is subdivided into sizes of approximately 18 mm ² to approximately 300 mm ² .

Next, a laser processing method according to an embodiment of the present invention will be described with reference to FIG.

[STEP 1: Determination of area]
First, the control device 4 discriminates an unnecessary area A1 to be cut and separated from the workpiece and an effective area A2 constituting the workpiece, based on the contour shape of the workpiece stored in advance.

Here, for example, a line scan camera may be used to scan the entire workpiece to determine the unnecessary area A1 and the valid area A2.

[STEP 2: Determination of surface area to be broken into small pieces]
After determining the unnecessary area A1 in STEP 1, the surface area of the unnecessary area A1 to be cut into small pieces is determined.

[STEP 3: Determination of cutting trajectory]
A cutting trajectory for cutting the unnecessary area A1 determined based on the results of STEP1 and STEP2 is determined. As for the cutting trajectory, for example, based on the surface area of the small pieces of the unnecessary area A1 determined in STEP 2, a cutting trajectory that makes the surface areas of the small pieces uniform is automatically calculated. Below is a calculation flow for determining the cutting trajectory.

First, a predetermined position on the edge of the workpiece (one of the four corners in the case of a rectangular workpiece) is determined as the starting point S. As shown in FIG.

After the starting point S is determined, a predetermined position on the contour line BL of the workpiece (if the contour line BL is rectangular, one of the four corners located at the shortest distance from the starting point) is set. Determine the midpoint C. A virtual cutting line connecting the starting point S and the intermediate point C is the first cutting trajectory L1.

Next, a predetermined position on the outline BL which is a predetermined distance away from the intermediate point C is determined as the end point E. A virtual cutting line connecting the intermediate point C and the end point E is the second cutting trajectory L2. As described above, the first cutting trajectory L1 and the second cutting trajectory L2 are collectively called a cutting trajectory.

After determining the cutting trajectory for cutting in one cutting process with the starting point S as the base point, the cutting trajectory for the entire unnecessary area A1 is determined while shifting the cutting trajectory by a predetermined distance along the contour line BL of the workpiece. do.

Here, the cutting trajectory does not necessarily have to be determined based on the above-described calculation flow, and can be changed as appropriate.

[STEP 4: Cut unnecessary area]
After the cutting trajectory for the entire cutting process in the unnecessary area A1 is determined in STEP 3, the laser oscillation device 2 starts cutting along the determined cutting trajectory.

[STEP 5: Collection of small pieces]
The small pieces separated by cutting the unnecessary area A1 in STEP 4 are scattered by the air current from the dust collector 72 and collected in the collection box 71 and collected by the dust collector 72 through the suction pipe 73 .

As described above, the laser processing apparatus, the laser processing method, and the laser processing program according to the present invention can efficiently collect scattered objects generated during laser processing, improve productivity, and always maintain a favorable processing state. It is something that can be obtained.

REFERENCE SIGNS LIST 1 laser processing device 2 laser oscillation device 3 pulse generator 4 control device 5 light collecting device 51 galvanometer scanner 52 Fθ lens 6 XY stage 7 dust collecting and collecting device 71 collection box 72 dust collector 73 suction pipe A1 unnecessary area A2 effective area BL outline L1 first cutting track L2 second cutting track P piece

Claims (10)

a processing table on which a plate-shaped work is placed;
A laser device that irradiates a laser beam for cutting and separating an unnecessary area other than an effective area constituting a workpiece from the workpiece along a predetermined contour line;
a control device for outputting to the laser device a signal that, when cutting and separating the unnecessary area from the workpiece, provides a cutting trajectory in which the unnecessary area forms a small piece having a predetermined surface area;
A laser processing apparatus, comprising: a dust collector that sucks small pieces cut from the workpiece by cutting and separation by the laser apparatus with a predetermined air volume. 2. The laser processing apparatus according to claim 1, wherein the small piece has a surface area of approximately 18 mm ² to 300 mm ² . 3. The laser processing apparatus according to claim 1, wherein the dust collector has an air volume of 3.5 m ³ /min to 11.0 m ³ /min. The input heat quantity per unit volume of the laser light irradiated by the laser device is approximately 1.1 J.
/mm ³ to 4.5 J/mm ³ . The laser processing apparatus according to any one of claims 1 to 3. a discriminating step of discriminating an unnecessary area other than the effective area constituting the workpiece from the plate-shaped workpiece based on the contour line information of the workpiece;
a cutting step of repeatedly cutting the workpiece along a cutting trajectory in which the unwanted areas form small pieces of a predetermined surface area to form contours of the useful areas;
a suction step of sucking the small piece of the unnecessary region cut in the cutting step with a predetermined air volume;
A laser processing method. The cutting step includes
A first cutting trajectory from a starting point, which is a predetermined position on the edge of the workpiece, to an intermediate point, which is a predetermined position on the contour, and from the intermediate point to an end point, which is a predetermined position on the contour. Repeating the step of cutting the workpiece n times (where n is an integer equal to or greater than 2) based on a cutting trajectory consisting of a second cutting trajectory along the contour,
The distance between the starting point of the n-1th time and the starting point of the nth time, and the distance between the middle point of the n-1th time and the middle point of the nth time are equal, and the end point of the n-1th time and the middle point of the nth time are equal 6. The laser processing method of claim 5, which matches. The first cutting trajectory and the second cutting trajectory in the cutting step are each linear,
7. The laser processing method according to claim 6, wherein the angle formed by said first cutting trajectory and said second cutting trajectory is in the range of approximately 110 to 150 degrees. The suction step includes
The laser processing method according to any one of claims 5 to 7, wherein the scattered matter generated from the work is sucked with an air flow rate of 3.5 m ³ /min to 11.0 m ³ /min. a determination step of determining an unnecessary area other than the effective area that constitutes the workpiece based on the contour line information of the workpiece from the plate-like workpiece;
cutting the workpiece along a cutting trajectory such that the unwanted area forms a piece of predetermined surface area to form a contour of the useful area. The cutting step includes:
determining a predetermined position on the edge of the workpiece as a starting point;
determining a predetermined position on the contour as an intermediate point;
determining a predetermined position on the contour line that is different from the midpoint as an end point;
cutting the workpiece based on a first cutting trajectory from the starting point to an intermediate point;
The step of cutting the workpiece based on the second cutting trajectory along the contour line from the intermediate point to the end point is regarded as one cutting flow, and the cutting flow is repeated n times (n is an integer of 2 or more). repetition,
The distance between the starting point of the n-1th time and the starting point of the nth time, and the distance between the middle point of the n-1th time and the middle point of the nth time are equal, and the end point of the n-1th time and the middle point of the nth time are equal 10. The laser processing program according to claim 9.

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