JP7336176B2 - 検査治具 - Google Patents
検査治具 Download PDFInfo
- Publication number
- JP7336176B2 JP7336176B2 JP2017241391A JP2017241391A JP7336176B2 JP 7336176 B2 JP7336176 B2 JP 7336176B2 JP 2017241391 A JP2017241391 A JP 2017241391A JP 2017241391 A JP2017241391 A JP 2017241391A JP 7336176 B2 JP7336176 B2 JP 7336176B2
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- Japan
- Prior art keywords
- contactor
- flexible substrate
- contact
- inspection jig
- substrate
- Prior art date
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- 238000007689 inspection Methods 0.000 title claims description 27
- 239000000758 substrate Substances 0.000 claims description 61
- 239000000523 sample Substances 0.000 claims description 34
- 238000005259 measurement Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Sampling And Sample Adjustment (AREA)
- Eye Examination Apparatus (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
Description
リジッド基板と、
前記リジッド基板に接続されたフレキシブル基板と、
前記フレキシブル基板の一部を前記リジッド基板に対して突出した状態で支持する支持体と、
前記フレキシブル基板の前記リジッド基板に対して突出した突出部に設けられたコンタクタと、
前記支持体に支持され、一端が前記リジッド基板の接点部に接触し、他端が前記フレキシブル基板の前記突出部から突出するスプリングプローブと、を備える。
前記スプリングプローブは、非高周波信号用であってもよい。
前記フレキシブル基板の前記突出部と前記支持体との間に設けられ、前記フレキシブル基板の前記接点部が設けられた部分の裏面を押圧する弾性体を備えてもよい。
10 リジッド基板、11 スリット穴、12 高周波ライン(高周波用導電パターン)、13 コンタクトパッド、18 ネジ、19 ネジ、
20 フレキシブル基板、21 突出部、22 傾斜部、25 高周波ライン(高周波用導電パターン)、26 グランドライン(グランド用導電パターン)、28 電子部品、
30 コンタクタブロック(支持体)、35 凹部、
41 コンタクタ、42 スプリングプローブ、43 弾性体、45 コンタクトハウジング、
50 圧接ブロック、51 弾性体、
90 被測定ウェハ(検査対象物)、91 バンプ
Claims (5)
- リジッド基板と、
前記リジッド基板に接続されたフレキシブル基板と、
前記フレキシブル基板の一部を前記リジッド基板に対して突出した状態で支持する支持体と、
前記フレキシブル基板の前記リジッド基板に対して突出した突出部に設けられたコンタクタと、
前記支持体に支持され、一端が前記リジッド基板の接点部に接触し、他端が前記フレキシブル基板の前記突出部から突出するスプリングプローブと、
前記フレキシブル基板と前記支持体の間に設けられた弾性体と、
前記フレキシブル基板の前記突出部から傾斜した傾斜部に設けられた電子部品と、 を備え、
前記リジッド基板は、前記支持体を固定し、
前記弾性体は、前記コンタクタを押圧し、
前記突出部に対する前記スプリングプローブの前記他端の突出長が、前記突出部に対する前記コンタクタの突出長よりも長く、
前記支持体に凹部が形成され、
前記凹部は、前記フレキシブル基板における前記コンタクタが設けられた部分の裏面に臨み、
前記裏面を押圧する前記弾性体が前記凹部に設けられている、検査治具。 - 前記コンタクタは、高周波信号用であり、
前記スプリングプローブは、非高周波信号用である、請求項1に記載の検査治具。 - 前記コンタクタは、伸縮しない接点部である、請求項1又は2に記載の検査治具。
- 前記支持体は、前記リジッド基板の一方の面に固定される、請求項1から3のいずれか一項に記載の検査治具。
- 前記フレキシブル基板の前記突出部において、前記スプリングプローブの外側位置に前記コンタクタが配置されている、請求項1から4のいずれか一項に記載の検査治具。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017241391A JP7336176B2 (ja) | 2017-12-18 | 2017-12-18 | 検査治具 |
| US16/174,426 US10598694B2 (en) | 2017-12-18 | 2018-10-30 | Inspection jig |
| TW107138378A TWI782127B (zh) | 2017-12-18 | 2018-10-30 | 檢查輔助具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017241391A JP7336176B2 (ja) | 2017-12-18 | 2017-12-18 | 検査治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019109102A JP2019109102A (ja) | 2019-07-04 |
| JP7336176B2 true JP7336176B2 (ja) | 2023-08-31 |
Family
ID=66814374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017241391A Active JP7336176B2 (ja) | 2017-12-18 | 2017-12-18 | 検査治具 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10598694B2 (ja) |
| JP (1) | JP7336176B2 (ja) |
| TW (1) | TWI782127B (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI845707B (zh) * | 2019-08-15 | 2024-06-21 | 旺矽科技股份有限公司 | 可同時用於高頻及中低頻訊號測試之探針頭 |
| TWI728531B (zh) * | 2019-10-30 | 2021-05-21 | 巨擘科技股份有限公司 | 探針卡裝置 |
| CN113533805B (zh) * | 2020-04-20 | 2024-01-23 | 台湾中华精测科技股份有限公司 | 分隔式薄膜探针卡及其弹性模块 |
| TWI719895B (zh) * | 2020-05-11 | 2021-02-21 | 中華精測科技股份有限公司 | 陣列式薄膜探針卡及其測試模組 |
| CN113640555B (zh) * | 2020-05-11 | 2023-11-10 | 台湾中华精测科技股份有限公司 | 阵列式薄膜探针卡及其测试模块 |
| CN113777369B (zh) * | 2020-06-10 | 2023-12-19 | 台湾中华精测科技股份有限公司 | 悬臂式薄膜探针卡 |
| JP7590820B2 (ja) * | 2020-06-17 | 2024-11-27 | 株式会社ヨコオ | プローブカード |
| WO2023008227A1 (ja) * | 2021-07-28 | 2023-02-02 | 株式会社ヨコオ | プローブカード |
| JP7795316B2 (ja) * | 2021-09-27 | 2026-01-07 | 株式会社ヨコオ | コンタクトユニット及び検査治具 |
| KR102551965B1 (ko) * | 2022-12-02 | 2023-07-06 | 주식회사 피엠티 | 다단구조 접촉팁이 형성된 프로브 시트 및 그 제조 방법 |
| TWI868842B (zh) * | 2023-08-04 | 2025-01-01 | 漢民測試系統股份有限公司 | 可調式承載裝置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004150927A (ja) | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | プロービング装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4906920A (en) * | 1988-10-11 | 1990-03-06 | Hewlett-Packard Company | Self-leveling membrane probe |
| JP2533431Y2 (ja) * | 1990-10-03 | 1997-04-23 | 株式会社アドバンテスト | Icウエーハ試験用プローブ |
| US5395253A (en) * | 1993-04-29 | 1995-03-07 | Hughes Aircraft Company | Membrane connector with stretch induced micro scrub |
| JP2995134B2 (ja) * | 1993-09-24 | 1999-12-27 | 東京エレクトロン株式会社 | プローブ装置 |
| JP3028067B2 (ja) * | 1997-01-16 | 2000-04-04 | 日本電気株式会社 | 多ピン高周波プローブ |
| JP4390983B2 (ja) * | 2000-07-14 | 2009-12-24 | 山一電機株式会社 | コンタクトプローブ及びその製造方法 |
| JP2003084047A (ja) * | 2001-06-29 | 2003-03-19 | Sony Corp | 半導体装置の測定用治具 |
| JP4465995B2 (ja) * | 2003-07-02 | 2010-05-26 | 株式会社日立製作所 | プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法 |
| US9244099B2 (en) * | 2011-05-09 | 2016-01-26 | Cascade Microtech, Inc. | Probe head assemblies, components thereof, test systems including the same, and methods of operating the same |
| TWI479158B (zh) * | 2013-01-28 | 2015-04-01 | Mpi Corp | 晶圓測試探針卡 |
| US9709599B2 (en) * | 2014-01-09 | 2017-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Membrane probe card |
| JP6525831B2 (ja) * | 2015-09-15 | 2019-06-05 | 株式会社ヨコオ | コンタクトユニット及び検査治具 |
-
2017
- 2017-12-18 JP JP2017241391A patent/JP7336176B2/ja active Active
-
2018
- 2018-10-30 US US16/174,426 patent/US10598694B2/en active Active
- 2018-10-30 TW TW107138378A patent/TWI782127B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004150927A (ja) | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | プロービング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019109102A (ja) | 2019-07-04 |
| US20190187178A1 (en) | 2019-06-20 |
| US10598694B2 (en) | 2020-03-24 |
| TW201928362A (zh) | 2019-07-16 |
| TWI782127B (zh) | 2022-11-01 |
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