JP7337997B2 - Measuring device and component mounter - Google Patents

Description

This specification discloses a technology related to a measuring device and a mounter for measuring any one of the thickness dimension, the amount of deformation in the thickness direction, and the angle of inclination in the thickness direction of an object to be measured.

For example, among electronic components mounted on a circuit board, there is an electronic component with leads in which a plurality of leads are arranged along two or four sides of a component body. In such an electronic component with leads, if some of the leads are bent (deformed), when the leads of the electronic component are soldered to the pads of the circuit board, some of the leads will not fit to the pads of the circuit board. It may not be in close contact and may cause poor connection.

Therefore, a method for detecting lead bending is proposed in Patent Document 1 (Japanese Unexamined Patent Publication No. 1-260349). In this detection method, as shown in FIG. 8, a parallel laser beam 52 is emitted from a light projector 51 toward a light receiver 53, and a row of leads 54 of electronic components is positioned within the width of the parallel laser beam 52. As shown in FIG. Further, the positions of the light projector 51 and the light receiver 53 can be switched between an obliquely downward irradiation position in which the parallel laser beam 52 is irradiated onto the rows of leads 54 from obliquely downward and an obliquely upward irradiation position in which the parallel laser beams 52 are irradiated obliquely upward. Then, a row of leads 54 without bending of a standard sample part is positioned within the width of the parallel laser beam 52 in advance, and the parallel laser beam 52 is emitted from the projector 51 positioned at the obliquely downward irradiation position to the row of the leads 54. is irradiated obliquely from below, the part of the parallel laser beam 52 which is not blocked by the row of leads 54 is received by the light receiver 53, and the detected value of the amount of received light is stored in the storage device as a standard value. Keep Similarly, the amount of light received by the light receiver 53 is detected when the parallel laser beam 52 is irradiated onto the row of leads 54 obliquely from above from the projector 51 moved to the oblique upper irradiation position, and the detected value is the standard value. is stored in the storage device as After that, during production, the row of leads 54 of the electronic component to be inspected is positioned within the width of the parallel laser beam 52, and the same procedure as in the case of a standard sample component without bending of the leads 54 described above is performed. , the amount of light received by the light receiver 53 is detected at two positions, the obliquely downward irradiation position and the obliquely upward irradiation position, and the detected value of the amount of received light is compared with the standard value stored in the memory, and the difference between the two falls within the allowable error range. Whether or not the lead 54 is bent is determined by whether the lead 54 is inside or not.

JP-A-1-260349

It is conceivable to install the lead bending detection device of the above-mentioned Patent Document 1 in a component mounting machine and inspect the presence or absence of bending of the leads of electronic components supplied from the component supply device during production, but the following problems arise. There is

In the component mounter, an electronic component supplied from a component supply device during production is sucked by a suction nozzle, and the row of leads 54 of the electronic component is positioned within the width of the parallel laser beam 52 . During production, the row of the leads 54 of the electronic component sucked by the suction nozzle is not necessarily exactly horizontal, and may be slightly tilted. If tilted, the width of the portion of the parallel laser beam 52 blocked by the row of leads 54 will change, and the amount of light received by the light receiver 53 will change. Therefore, if the row of the leads 54 is inclined, even if the row of the leads 54 is not bent, the amount of light received by the light receiver 53 may be the same as that of the row of the leads 54 that are bent. As a result, the presence or absence of bending of the lead 54 may be erroneously determined, and there is a problem in the reliability of detecting the bending of the lead 54 .

In order to solve the above problems, a measuring device for measuring any one of the thickness dimension of an object to be measured, the amount of deformation in the thickness direction, and the angle of inclination in the thickness direction, is provided with a parallel light that is wider than the thickness dimension of the object to be measured. a light projecting unit that irradiates the object to be measured, a light receiving unit that receives a part of the parallel light emitted from the light projecting unit that is not blocked by the object to be measured, and a light receiving state of the light receiving unit a measurement control section for measuring the width of a portion of the parallel light that is blocked by the measurement target; a base section for fixing the light projecting section and the light receiving section in a predetermined positional relationship; and the base section. a tilting mechanism that changes the irradiation angle of the parallel light by tilting; The measurement control unit tilts the base unit using the tilting mechanism unit to increase or decrease the measured value of the width of the portion of the parallel light that is blocked by the measurement target while changing the irradiation angle of the parallel light. Observe that the measured value is the minimum value, and measure the thickness dimension or the amount of deformation in the thickness direction of the measurement object based on the minimum value of the measured value, or the measured value is the minimum A measuring device for measuring the tilt angle in the thickness direction of the measurement object based on the tilt angle of the base portion when the base portion is tilted, wherein the base portion is tiltably supported by a base via a shaft. , the tilting mechanism includes a motor provided on the base, a cam rotated by the motor, a cam follower provided on the side of the base with respect to the cam, and a second tilt mechanism rotating integrally with the motor. 1 gear and a second gear that meshes with the first gear and rotates integrally with the cam, wherein the motor, the cam, the cam follower, the first gear and the second gear are The light projecting part and the light receiving part are provided on the opposite side of the base part, and the first gear and the second gear are arranged side by side in the direction in which the light projecting part and the light receiving part are arranged. The rotation of the cam reciprocates the cam follower in the tilting direction of the base portion, thereby tilting the base portion reciprocally about the shaft .

With this configuration, while changing the irradiation angle of the parallel light emitted from the light projecting unit toward the measurement target, it is observed that the measured value of the width of the portion of the parallel light that is shielded from the measurement target increases or decreases. and find the minimum value of the measured values. At this time, even if the object to be measured is tilted, when the irradiation angle of the parallel light coincides with the inclination angle of the object to be measured, the measured value of the width of the portion of the parallel light that is blocked by the object to be measured is the smallest. Therefore, the thickness dimension or the amount of deformation in the thickness direction of the object to be measured is measured based on the minimum value of the measured values, or the inclination angle of the base portion when the measured value is the minimum is measured. By measuring the tilt angle of the object in the thickness direction, even if the object is tilted, the thickness dimension, the amount of deformation in the thickness direction, and the amount of deformation in the thickness direction can be obtained without being affected by the tilt. The tilt angle can be measured with high precision.

FIG. 1 is a perspective view of a measuring device showing one embodiment. FIG. 2 is a front view of the measuring device. FIG. 3 is a top view of the measuring device. FIG. 4 is a rear view of the main parts including the tilting mechanism. FIG. 5 is a diagram for explaining the light receiving state of the light receiving portion when the lead row is slightly inclined with respect to the irradiation direction of the parallel laser light. FIG. 6 is a diagram for explaining the light receiving state of the light receiving section when the irradiation angle of the parallel laser light coincides with the tilt angle of the lead row due to the tilting of the base section. FIG. 7 is a block diagram showing the configuration of the control system of a mounter equipped with a measuring device. FIG. 8 is a diagram for explaining the lead bending detection method of Patent Document 1. As shown in FIG.

An embodiment disclosed in this specification will be described below with reference to the drawings.

First, the configuration of the measuring device 10 will be described with reference to FIGS. 1 to 6. FIG.

A base 11 of the measuring device 10 is provided with a mounting frame 12 for mounting and fixing to a component mounter 40 (see FIG. 7). A plate-shaped base portion 13 is arranged on the base 11, and a light projecting portion 14 and a light receiving portion 15 are fixed on the upper surface of the base portion 13 in a predetermined positional relationship.

Although not shown, the light projection unit 14 converts laser light generated by a laser light source into a parallel laser light 16 having a predetermined width in the vertical direction using a special lens, and outputs the parallel laser light 16 in a direction parallel to the upper surface of the base unit 13. . An optical path bending member 17 such as a mirror or a prism that bends the optical path of the parallel laser beam 16 at right angles is arranged in the output direction of the parallel laser beam of the light projecting portion 14 . The vertical width of the parallel laser beam 16 is set to be wider than the thickness dimension (vertical dimension) of the object to be measured. In this embodiment, the object to be measured is a row of leads 42 of an electronic component (see FIGS. 5 and 6).

On the other hand, in front of the light-receiving surface of the light-receiving unit 15, an optical-path bending member 18 such as a mirror, a prism, or the like, which bends the optical path of the parallel laser beam 16 perpendicularly bent by the optical-path bending member 17 of the light-projecting unit 14 is arranged. , the parallel laser beam 16 bent at right angles by the optical path bending member 18 is received by the light receiving portion 15 . As a result, the optical path of the parallel laser beam 16 between the light projecting portion 14 and the light receiving portion 15 is bent in a .psi. The optical path of the parallel laser beam 16 passing between the light receiving portion 15 and the optical path bending member 18 is set to be parallel to the upper surface of the base portion 13 . An object to be measured is inserted into the parallel laser beam 16 between the two optical path bending members 17 and 18 to measure the thickness dimension of the object to be measured or the amount of deformation (amount of bending) in the thickness direction.

The light receiving unit 15 uses a one-dimensional image sensor element such as a CCD or CMOS as a light receiving element, and is configured to be able to measure both the width and the position of the portion of the parallel laser beam 16 that is blocked by the measurement target. You can Alternatively, the light receiving unit 15 collects the received parallel laser beam 16 with a lens and receives it with a light receiving element such as a photodiode. Utilizing the characteristic that the amount of light received by the light receiving element decreases, the amount of light received is detected, and the width of the portion of the parallel laser beam 16 that is shielded from the measurement target is measured from the detected amount of light received. can be configured to

A support substrate 21 is attached to the lower surface of the base portion 13 to which the light projecting portion 14 and the light receiving portion 15 are fixed via, for example, four angle adjusting portions 22 . Each angle adjusting portion 22 is configured by a bolt and a nut or the like, and an operator can adjust the angle of the base portion 13 with respect to the support substrate 21 by adjusting each angle adjusting portion 22 with a tool such as a wrench. there is The base portion 13 and the support substrate 21 are supported by the base 11 via a shaft 23 (see FIG. 4) so as to be vertically tiltable together.

As shown in FIG. 4, the measuring device 10 is provided with a tilting mechanism section 25 that changes the irradiation angle of the parallel laser beam 16 by tilting the base section 13 . The tilting mechanism 25 includes a motor 26 provided on the base 11 , a cam 27 such as an eccentric cam or an elliptical cam rotated by the motor 26 , and a cam follower 28 provided on the support substrate 21 of the base 13 . The rotation of the cam 27 causes the cam follower 28 to reciprocate in the vertical direction, which is the tilting direction of the base portion 13, thereby tilting the base portion 13 in the vertical direction reciprocally about the shaft 23 as a fulcrum. A rotation transmission system between the motor 26 and the cam 27 is constructed by meshing a first gear 30 fitted to the rotating shaft of the motor 26 and a second gear 31 rotating integrally with the cam 27. ing. As shown in FIG. 4, the shaft 23, the motor 26, the cam 27, the cam follower 28, the first gear 30 and the second gear 31 are arranged on the opposite side of the base portion 13 from the light projecting portion 14 and the light receiving portion 15. is provided in The motor 26 is a stepping motor, a servo motor, or the like having a rotation angle sensor such as an encoder for detecting a rotation angle. is vertically tilted one reciprocating motion from the angle before tilting, returned to the angle before tilting, and stopped.

The measurement device 10 is provided with a reference position portion 34 (see FIG. 1) whose image can be recognized from above at a portion where a constant positional relationship with the parallel laser beam 16 is maintained. In this embodiment, a predetermined position on the upper surface side of the optical path bending member 17 on the light projecting unit 14 side and the upper surface of the optical path bending member 18 on the light receiving unit 15 side, which are portions where a constant positional relationship with the parallel laser beam 16 is maintained, Reference position portions 34 are provided at two predetermined positions on the side so that the orientation of the parallel laser beam 16 between the two optical path bending members 17 and 18 in the XY direction (horizontal direction) can be specified.

A measurement control unit 35 (see FIG. 7) that controls the operation of the light receiving unit 15, the light receiving unit 15, and the motor 26 of the tilt mechanism unit 25 is composed of a microcomputer or the like. While changing the irradiation angle of the parallel laser beam 16 by tilting, the measured value of the width of the portion of the parallel laser beam 16 that is shielded from the object to be measured increases or decreases, and the minimum value of the measured value is obtained. , the thickness dimension or the amount of deformation in the thickness direction of the object to be measured is measured based on the minimum value of the measured values.

The measuring apparatus 10 configured as described above is detachably attached to a predetermined position of the component mounter 40 (see FIG. 7). The component mounter 40 is replaceably set with a component feeder 41 such as a tape feeder, a tray feeder, a stick feeder, etc. for feeding various electronic components to be mounted on a circuit board. Electronic components supplied from the component supply device 41 include electronic components with leads in which a plurality of leads 42 are arranged along two or four sides of a component body.

The component mounter 40 includes a conveyor 43 that conveys a circuit board and a holding unit (not shown) such as a suction nozzle or chuck that picks up and holds electronic components supplied by a component supply device 41. A head (not shown), a mounting head moving device 44 that moves the mounting head in the XY directions (front, back, left, and right) and the Z direction (up and down), and an electronic component picked up and held by the holding portion are imaged from below. and a mark imaging camera 46 for imaging the reference position mark of the circuit board from above. The component imaging camera 45 is fixed upward at a predetermined position of the component mounter 40 . The mark imaging camera 46 is attached downward on the mounting head side, and is moved integrally with the mounting head by the mounting head moving device 44 . The position of the measuring device 10 in the component mounter 40 is set so that the parallel laser beam 16 of the measuring device 10 is positioned within the movable range of the holding portion of the mounting head.

The control unit 47 of the component mounter 40 is composed of one or more computers, and controls the operation of each function of the component mounter 40 described above. When the electronic component supplied from the component supply device 41 is an electronic component with leads, the control unit 47 of the component mounter 40 picks up the electronic component with the holding portion of the mounting head and transfers it to the measuring device 10 side. In addition to moving, the reference position portion 34 of the measuring device 10 is imaged by the mark imaging camera 46 and the image is recognized. Measure the position of the parallel laser beam 16 between the leads, move the mounting head above the parallel laser beam 16 based on the measured value, and measure the lead of the electronic component held by the holding portion of the mounting head. 42 are held within the width of the parallel laser beam 16 and held at a constant angle (i.e., even if the base portion 13 of the measuring device 10 tilts, the rows of the leads 42 are held at a constant angle so as not to tilt). state), a measurement execution command signal is transmitted from the control unit 47 of the mounter 40 to the measurement control unit 35 of the measuring apparatus 10, and the thickness dimension or the amount of deformation in the thickness direction of the lead 42 is measured as follows. do.

When the measurement execution command signal is received from the control unit 47 of the component mounter 40, the measurement control unit 35 of the measuring apparatus 10 outputs the parallel laser beam 16 from the light projecting unit 14 and activates the motor 26 of the tilting mechanism unit 25. Then, the cam 27 is rotated once, and the base portion 13 is vertically tilted one reciprocating motion from the angle before tilting with the shaft 23 as a fulcrum. to return to the angle before tilting and stop. 5 and 6, the measurement control unit 35 acquires the light reception signal of the light receiving unit 15 while changing the irradiation angle of the parallel laser beam 16, and detects the row of the leads 42 in the parallel laser beam 16. Observe the increase or decrease in the measured value of the width of the light-shielded portion, obtain the minimum value of the measured value, and measure the thickness dimension or the amount of deformation in the thickness direction of the lead 42 based on the minimum value of the measured value. do.

For example, even if the row of leads 42 does not bend, as shown in FIG. 16, the width of the portion shielded by the row of the leads 42 increases according to the inclination angle of the row of the leads 42. However, as shown in FIG. When the angle coincides with the inclination angle of the row of leads 42, the width of the portion of the parallel laser beam 16 blocked by the row of leads 42 is minimized. Therefore, the measurement control unit 35 tilts the parallel laser beam 16 one reciprocating motion in the vertical direction from the angle before tilting, and the measured value of the width of the portion of the parallel laser beam 16 blocked by the row of the leads 42 increases or decreases. The thickness of the lead 42 (or the amount of deformation in the thickness direction) of the lead 42 is measured based on the minimum value of the measured value, and the measured value is the thickness of the lead 42. If the dimensions are within the allowable error range, the row of the leads 42 is determined to be normal (the thickness dimension of the leads 42 is within the allowable error range and the leads 42 are not bent). If the thickness is out of the allowable error range, it is determined that the row of the leads 42 is abnormal (the leads 42 are bent or the thickness of the leads 42 is inappropriate). The determination result of normality/abnormality of the row of leads 42 is transmitted from the measurement control section 35 to the control section 47 of the component mounter 40 .

The measurement control unit 35 transmits the measured value of the width of the portion of the parallel laser beam 16 that is blocked by the row of the leads 42 to the control unit 47 of the component mounter 40 . obtains the minimum value of the measured values, measures the thickness dimension (or the amount of deformation in the thickness direction) of the lead 42 based on the minimum value of the measured values, and the measured value is the allowable error of the thickness dimension of the lead 42 The normality/abnormality of the row of leads 42 may be determined based on whether or not they are within the range. Alternatively, the measurement control unit 35 performs processing up to obtaining the minimum value of the measured values, and the measurement control unit 35 transmits the minimum value of the measured values to the control unit 47 of the component mounter 40 to control the component mounter 40. Based on whether or not the measured value of the thickness dimension (or the amount of deformation in the thickness direction) of the lead 42 obtained from the minimum value of the measured values in the section 47 falls within the allowable error range of the thickness dimension of the lead 42, the lead 42 The normality/abnormality of the column may be determined.

For each row of leads 42 on each side of the electronic component, normality/abnormality of the row of leads 42 is determined by the method described above. As a result, when the controller 47 of the component mounter 40 determines that there is an abnormality in the row of the leads 42 on any side of the electronic component, the controller 47 moves the mounting head above a predetermined disposal site to dispose of the electronic component. Dispose of the parts at the predetermined disposal site.

On the other hand, when the control unit 47 of the component mounter 40 determines that all the rows of the leads 42 of the electronic component are normal, it moves the mounting head above the component imaging camera 45 to move the mounting head. By capturing an image of the electronic component held by the holding portion with the component imaging camera 45 and recognizing the image, the amount of deviation of the position and angle of the electronic component is measured, and the mounting head is moved above the circuit board. Then, the lead 42 of the electronic component is soldered to the land of the circuit board after correcting the deviation amount of the position and angle of the electronic component.

According to the present embodiment described above, the tilting mechanism 25 of the measuring apparatus 10 changes the irradiation angle of the parallel laser beam 16 while the light receiving signal of the light receiving unit 15 is taken in and the row of the leads 42 of the parallel laser beam 16 is detected. Observe that the measured value of the width of the light-shielded portion increases or decreases, obtain the minimum value of the measured value, and based on the minimum value of the measured value, the thickness dimension (or the amount of deformation in the thickness direction) of the lead 42 Therefore, even if the row of the leads 42 is tilted with respect to the optical axis of the parallel laser beam 16, the thickness dimension or the amount of deformation in the thickness direction of the leads 42 can be measured without being affected by the tilt. Accurate measurement is possible.

In this embodiment, the array of leads 42 of the electronic component is measured, but a predetermined portion of the body of the electronic component may be measured.

Also, in this embodiment, the measuring device 10 is attached to the component mounter 40 and used, but it may be used for devices other than the component mounter 40. FIG. Therefore, the object to be measured is not limited to a predetermined portion of the electronic component, and an article other than the electronic component may be the object to be measured.

The irradiation direction of the parallel laser beam 16 of the measuring device 10 is not limited to the substantially horizontal direction, and may be a direction other than the substantially horizontal direction such as the vertical direction. In general, the thickness direction of the object to be measured is the width direction of the parallel laser light (perpendicular to the irradiation direction).

In addition, the inclination angle of the base portion 13 (parallel laser The angle of inclination in the thickness direction of the object to be measured may be measured based on the irradiation angle of the light 16). At this time, the tilt angle of the base portion 13 (irradiation angle of the parallel laser beam 16) is measured based on the output signal of a rotation angle sensor such as an encoder that detects the rotation angle of the motor 26 of the tilting mechanism portion 25. Alternatively, a sensor for detecting the inclination angle of the base portion 13 may be provided.

In this embodiment, the optical path of the parallel laser beam 16 between the light projecting portion 14 and the light receiving portion 15 is bent in a .psi.-shape by the two optical path bending members 17 and 18. 18 may be omitted, and the light projecting portion 14 and the light receiving portion 15 may be opposed to each other so that the optical path of the parallel laser light between the light projecting portion 14 and the light receiving portion 15 is a straight line.

In addition, the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the invention, such as by changing the configuration of the tilting mechanism 25, or by using a type of parallel light other than laser light. Needless to say, it can be changed and implemented.

DESCRIPTION OF SYMBOLS 10... Measuring apparatus 11... Base 13... Base part 14... Light-projecting part 15... Light-receiving part 16... Parallel laser beam (parallel light) 17, 18... Optical path bending member 21... Support substrate 22 ... Angle adjusting section 23 ... Shaft 25 ... Tilting mechanism section 26 ... Motor 27 ... Cam 28 ... Cam follower 34 ... Reference position section 35 ... Measurement control section 40 ... Component mounter 41 ... Component supply device , 42... Lead (measurement object), 44... Mounting head moving device, 46... Mark imaging camera, 47... Control section of component mounter

Claims (8)

In a measuring device that measures any of the thickness dimension of the object to be measured, the amount of deformation in the thickness direction, and the angle of inclination in the thickness direction,
a light projecting unit that irradiates the object to be measured with parallel light wider than the thickness dimension of the object to be measured;
a light-receiving unit that receives a portion of the parallel light emitted from the light-projecting unit that is not shielded by the measurement object;
a measurement control unit that measures the width of a portion of the parallel light that is blocked by the measurement target based on the light receiving state of the light receiving unit;
a base portion fixing the light projecting portion and the light receiving portion in a predetermined positional relationship;
a tilting mechanism that changes an irradiation angle of the parallel light by tilting the base;
a holding unit that holds the object to be measured in a fixed posture at a position where the thickness of the object to be measured falls within the width of the parallel light;
The measurement control unit tilts the base unit using the tilting mechanism unit to increase or decrease the measured value of the width of the portion of the parallel light that is blocked by the measurement object while changing the irradiation angle of the parallel light. Observe that the measured value is the minimum value, and measure the thickness dimension or the amount of deformation in the thickness direction of the measurement object based on the minimum value of the measured value, or the measured value is the minimum A measuring device that measures the tilt angle in the thickness direction of the measurement object based on the tilt angle of the base portion when the
the base portion is tiltably supported by a base through a shaft;
The tilting mechanism includes a motor provided on the base, a cam rotated by the motor, a cam follower provided on the side of the base with respect to the cam, and a first tilt mechanism rotating integrally with the motor. and a second gear that meshes with the first gear and rotates integrally with the cam,
the motor, the cam, the cam follower, the first gear and the second gear are provided on the opposite side of the base portion from the light projecting portion and the light receiving portion;
the first gear and the second gear are arranged side by side in a direction in which the light projecting section and the light receiving section are arranged;
The measuring device according to claim 1, wherein the rotation of the cam causes the cam follower to reciprocate in the tilting direction of the base, thereby tilting the base in a reciprocating manner about the shaft. the shaft is provided on the opposite side of the base portion from the light projecting portion and the light receiving portion ;
When viewed from the side of the base portion on which the light projecting portion and the light receiving portion are arranged, the motor, the cam, the cam follower, the first gear, the second gear, and the shaft The measuring device according to claim 1 , arranged so as to fit within the width from the light section to the light receiving section . a first optical path bending member that bends the optical path of the parallel light at right angles is disposed in the output direction of the parallel light from the light projecting unit;
3. A second optical path bending member is arranged in front of the light receiving surface of the light receiving unit to perpendicularly bend the optical path of the parallel light that has been bent at right angles by the first optical path bending member. The measuring device according to . 4. The measurement control unit according to any one of claims 1 to 3, wherein when obtaining the minimum value of the measured values, the base unit is tilted one reciprocating motion from an angle before tilting, returned to the angle before tilting, and then stopped. Measurement device as described. 5. The measuring device according to any one of claims 1 to 4 , further comprising an angle adjuster for adjusting an angle of said base before tilting. A component mounter equipped with the measuring device according to any one of claims 1 to 5 ,
The holding part is a suction nozzle or chuck attached to the mounting head,
The measuring device is mounted so that the irradiation direction of the parallel light is the horizontal direction and the width direction of the parallel light is the vertical direction before the base portion is tilted,
The object to be measured is a predetermined portion of the electronic component held by the suction nozzle or the chuck,
The measurement control unit moves the mounting head above the parallel light by the moving device to fit a predetermined portion of the electronic component held by the suction nozzle or the chuck within the width of the parallel light. By tilting the base portion by the tilting mechanism portion while holding the electronic component at an angle, any one of the thickness dimension, the amount of deformation in the thickness direction, and the angle of inclination in the thickness direction of the predetermined portion of the electronic component is measured. Component mounting machine. 7. The component mounter according to claim 6 , wherein said object to be measured is a lead row of said electronic component. When it is determined that the measurement value of the predetermined portion of the electronic component measured by the measurement control unit is out of the allowable error range, the mounting head is moved above a predetermined disposal site to remove the electronic component. 8. The mounter according to claim 6 or 7 , which disposes at a predetermined disposal site.

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